ATE518249T1 - Abstimmbares halbleiterbauelement - Google Patents
Abstimmbares halbleiterbauelementInfo
- Publication number
- ATE518249T1 ATE518249T1 AT04822011T AT04822011T ATE518249T1 AT E518249 T1 ATE518249 T1 AT E518249T1 AT 04822011 T AT04822011 T AT 04822011T AT 04822011 T AT04822011 T AT 04822011T AT E518249 T1 ATE518249 T1 AT E518249T1
- Authority
- AT
- Austria
- Prior art keywords
- collector
- sub
- discontinuous
- active area
- performance characteristics
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66363—Thyristors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0821—Collector regions of bipolar transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66242—Heterojunction transistors [HBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
- H01L29/7378—Vertical transistors comprising lattice mismatched active layers, e.g. SiGe strained layer transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
- H01L29/93—Variable capacitance diodes, e.g. varactors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2004/012321 WO2005114738A1 (en) | 2004-04-22 | 2004-04-22 | Tuneable semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE518249T1 true ATE518249T1 (de) | 2011-08-15 |
Family
ID=35428622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04822011T ATE518249T1 (de) | 2004-04-22 | 2004-04-22 | Abstimmbares halbleiterbauelement |
Country Status (7)
Country | Link |
---|---|
US (1) | US7709930B2 (de) |
EP (1) | EP1745515B1 (de) |
JP (1) | JP4979573B2 (de) |
KR (1) | KR100951241B1 (de) |
CN (1) | CN1943034B (de) |
AT (1) | ATE518249T1 (de) |
WO (1) | WO2005114738A1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7550787B2 (en) * | 2005-05-31 | 2009-06-23 | International Business Machines Corporation | Varied impurity profile region formation for varying breakdown voltage of devices |
US7888745B2 (en) * | 2006-06-21 | 2011-02-15 | International Business Machines Corporation | Bipolar transistor with dual shallow trench isolation and low base resistance |
US7390720B2 (en) | 2006-10-05 | 2008-06-24 | International Business Machines Corporation | Local collector implant structure for heterojunction bipolar transistors and method of forming the same |
US7927958B1 (en) * | 2007-05-15 | 2011-04-19 | National Semiconductor Corporation | System and method for providing a self aligned bipolar transistor using a silicon nitride ring |
US8796809B2 (en) * | 2008-09-08 | 2014-08-05 | Cree, Inc. | Varactor diode with doped voltage blocking layer |
CN101819994A (zh) * | 2010-04-29 | 2010-09-01 | 上海宏力半导体制造有限公司 | SiGe异质结双极型晶体管及其制备方法 |
CN101916725B (zh) * | 2010-07-23 | 2015-03-18 | 上海华虹宏力半导体制造有限公司 | 一种双极型晶体管的制作方法 |
CN102412274B (zh) * | 2011-01-13 | 2014-02-26 | 上海华虹宏力半导体制造有限公司 | 锗硅hbt工艺中垂直寄生型pnp器件及制造方法 |
US8415763B2 (en) | 2011-03-31 | 2013-04-09 | International Business Machines Corporation | Tunable semiconductor device |
CN102412275B (zh) * | 2011-09-22 | 2013-06-12 | 上海华虹Nec电子有限公司 | 锗硅BiCMOS工艺中纵向PNP器件及制作方法 |
US8377754B1 (en) * | 2011-10-10 | 2013-02-19 | International Business Machines Corporation | Stress enhanced junction engineering for latchup SCR |
CN102412279B (zh) * | 2011-10-24 | 2014-08-13 | 上海华虹宏力半导体制造有限公司 | 锗硅bicmos工艺中垂直寄生型pnp三极管及制造方法 |
CN102412284B (zh) * | 2011-10-24 | 2014-10-08 | 上海华虹宏力半导体制造有限公司 | 锗硅hbt工艺中垂直寄生型pnp三极管及其制造方法 |
CN103094329B (zh) * | 2011-11-08 | 2016-02-10 | 上海华虹宏力半导体制造有限公司 | 具有深赝埋层的锗硅hbt器件及其制造方法 |
CN102412287B (zh) * | 2011-11-08 | 2013-07-24 | 上海华虹Nec电子有限公司 | 锗硅hbt器件及其制造方法 |
US9059138B2 (en) | 2012-01-25 | 2015-06-16 | International Business Machines Corporation | Heterojunction bipolar transistor with reduced sub-collector length, method of manufacture and design structure |
US8786051B2 (en) | 2012-02-21 | 2014-07-22 | International Business Machines Corporation | Transistor having a monocrystalline center section and a polycrystalline outer section, and narrow in-substrate collector region for reduced base-collector junction capacitance |
EP2725615B1 (de) | 2012-10-29 | 2019-01-23 | IMEC vzw | Halbleiterbauelement mit einer Diode und mit einem Bipolartransistor und Verfahren zur Herstellung einer solchen Vorrichtung |
US8796149B1 (en) * | 2013-02-18 | 2014-08-05 | International Business Machines Corporation | Collector-up bipolar junction transistors in BiCMOS technology |
US9496250B2 (en) * | 2014-12-08 | 2016-11-15 | Globalfoundries Inc. | Tunable scaling of current gain in bipolar junction transistors |
WO2016178837A1 (en) * | 2015-05-07 | 2016-11-10 | Finscale Inc. | Semiconductor devices made of vertical planar elements and methods of their fabrication |
US11069797B2 (en) | 2016-05-25 | 2021-07-20 | Ideal Power Inc. | Ruggedized symmetrically bidirectional bipolar power transistor |
US10319716B2 (en) | 2017-05-05 | 2019-06-11 | Newport Fab, Llc | Substrate isolation for low-loss radio frequency (RF) circuits |
US10290631B2 (en) | 2017-05-05 | 2019-05-14 | Newport Fab, Llc | Linearity and lateral isolation in a BiCMOS process through counter-doping of epitaxial silicon region |
CN109103241A (zh) * | 2018-08-23 | 2018-12-28 | 盛世瑶兰(深圳)科技有限公司 | 碳化硅肖特基器件及其制备方法 |
WO2023188867A1 (ja) * | 2022-03-30 | 2023-10-05 | ローム株式会社 | 半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3573573A (en) * | 1968-12-23 | 1971-04-06 | Ibm | Memory cell with buried load impedances |
JPS51150984A (en) * | 1975-06-19 | 1976-12-24 | Matsushita Electric Ind Co Ltd | Dielectric isolation method |
FR2471023A1 (fr) * | 1979-12-07 | 1981-06-12 | Ibm France | Reseau matriciel d'elements semi-conducteurs |
JP3046320B2 (ja) | 1990-04-18 | 2000-05-29 | 富士通株式会社 | 半導体装置 |
US5084750A (en) * | 1991-02-20 | 1992-01-28 | Raytheon Company | Push-pull heterojunction bipolar transistor |
US5376823A (en) * | 1991-03-15 | 1994-12-27 | Fujitsu Limited | Lateral bipolar transistor and method of producing the same |
JPH05102175A (ja) * | 1991-10-07 | 1993-04-23 | Sharp Corp | 半導体装置の製造方法 |
JP3323544B2 (ja) * | 1992-08-21 | 2002-09-09 | 株式会社日立製作所 | 半導体装置 |
EP0590804B1 (de) | 1992-09-03 | 1997-02-05 | STMicroelectronics, Inc. | Vertikal isolierter, monolithischer Hochleistungsbipolartransistor mit Topkollektor |
WO1997017726A1 (en) * | 1995-11-07 | 1997-05-15 | National Semiconductor Corporation | Low collector resistance bipolar transistor compatible with high voltage integrated circuits |
JPH09275154A (ja) * | 1996-04-03 | 1997-10-21 | Toshiba Corp | 半導体装置及びその製造方法 |
SE519975C2 (sv) * | 1999-06-23 | 2003-05-06 | Ericsson Telefon Ab L M | Halvledarstruktur för högspänningshalvledarkomponenter |
US6878976B2 (en) * | 2002-03-13 | 2005-04-12 | International Business Machines Corporation | Carbon-modulated breakdown voltage SiGe transistor for low voltage trigger ESD applications |
JP2004000723A (ja) * | 2003-07-25 | 2004-01-08 | Toyomaru Industry Co Ltd | 遊技機および遊技機用ネットワークシステム |
US7119401B2 (en) * | 2004-01-07 | 2006-10-10 | International Business Machines Corporation | Tunable semiconductor diodes |
US6956266B1 (en) * | 2004-09-09 | 2005-10-18 | International Business Machines Corporation | Structure and method for latchup suppression utilizing trench and masked sub-collector implantation |
-
2004
- 2004-04-22 CN CN2004800428042A patent/CN1943034B/zh not_active Expired - Fee Related
- 2004-04-22 WO PCT/US2004/012321 patent/WO2005114738A1/en active Application Filing
- 2004-04-22 US US11/568,156 patent/US7709930B2/en not_active Expired - Fee Related
- 2004-04-22 KR KR1020067021251A patent/KR100951241B1/ko not_active IP Right Cessation
- 2004-04-22 AT AT04822011T patent/ATE518249T1/de not_active IP Right Cessation
- 2004-04-22 JP JP2007509436A patent/JP4979573B2/ja not_active Expired - Fee Related
- 2004-04-22 EP EP04822011A patent/EP1745515B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2007534173A (ja) | 2007-11-22 |
KR100951241B1 (ko) | 2010-04-05 |
US20070215978A1 (en) | 2007-09-20 |
WO2005114738A1 (en) | 2005-12-01 |
CN1943034B (zh) | 2011-11-16 |
CN1943034A (zh) | 2007-04-04 |
EP1745515A1 (de) | 2007-01-24 |
JP4979573B2 (ja) | 2012-07-18 |
KR20070004035A (ko) | 2007-01-05 |
EP1745515B1 (de) | 2011-07-27 |
US7709930B2 (en) | 2010-05-04 |
EP1745515A4 (de) | 2009-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |