ATE512573T1 - Kühlvorrichtung, system und zugehöriges verfahren - Google Patents
Kühlvorrichtung, system und zugehöriges verfahrenInfo
- Publication number
- ATE512573T1 ATE512573T1 AT05851466T AT05851466T ATE512573T1 AT E512573 T1 ATE512573 T1 AT E512573T1 AT 05851466 T AT05851466 T AT 05851466T AT 05851466 T AT05851466 T AT 05851466T AT E512573 T1 ATE512573 T1 AT E512573T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit board
- printed circuit
- cooling apparatus
- cooling device
- associated method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/030,704 US7345877B2 (en) | 2005-01-06 | 2005-01-06 | Cooling apparatus, system, and associated method |
PCT/US2005/040595 WO2006073553A2 (en) | 2005-01-06 | 2005-11-09 | Cooling apparatus, system, and associated method |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE512573T1 true ATE512573T1 (de) | 2011-06-15 |
Family
ID=36589078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05851466T ATE512573T1 (de) | 2005-01-06 | 2005-11-09 | Kühlvorrichtung, system und zugehöriges verfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US7345877B2 (de) |
EP (1) | EP1834515B2 (de) |
JP (1) | JP4881879B2 (de) |
CN (1) | CN101095386B (de) |
AT (1) | ATE512573T1 (de) |
WO (1) | WO2006073553A2 (de) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7983042B2 (en) * | 2004-06-15 | 2011-07-19 | Raytheon Company | Thermal management system and method for thin membrane type antennas |
DE102006041788B4 (de) * | 2006-09-06 | 2012-06-14 | Airbus Operations Gmbh | Luftfahrzeug-Elektronikkühleinrichtung für ein Luftfahrzeug mit einem Flüssigkeitskühlsystem |
CN100572908C (zh) * | 2006-11-17 | 2009-12-23 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US20080115911A1 (en) * | 2006-11-22 | 2008-05-22 | Tyco Electronics Corporation | Heat dissipation system for solarlok photovoltaic interconnection system |
TWI316174B (en) * | 2006-11-29 | 2009-10-21 | Asustek Comp Inc | Heat-sink backing plate module, circuit board, and electronic apparatus having the same |
CN200994225Y (zh) * | 2006-12-29 | 2007-12-19 | 帛汉股份有限公司 | 电路基板结构 |
US7460367B2 (en) * | 2007-03-05 | 2008-12-02 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
DE102007045733B3 (de) * | 2007-09-25 | 2009-02-05 | Qimonda Ag | Speichermodul, Hauptplatine, Computersystem und Wärmeübertragungssystem |
US8919426B2 (en) * | 2007-10-22 | 2014-12-30 | The Peregrine Falcon Corporation | Micro-channel pulsating heat pipe |
US7843693B2 (en) * | 2007-11-02 | 2010-11-30 | The Boeing Company | Method and system for removing heat |
US8223494B2 (en) * | 2007-12-31 | 2012-07-17 | General Electric Company | Conduction cooled circuit board assembly |
US7626820B1 (en) * | 2008-05-15 | 2009-12-01 | Sun Microsystems, Inc. | Thermal transfer technique using heat pipes with integral rack rails |
US9500416B2 (en) * | 2008-05-31 | 2016-11-22 | The Boeing Company | Thermal management device and method for making the same |
JP5404261B2 (ja) * | 2009-04-16 | 2014-01-29 | モレックス インコーポレイテド | 冷却装置、電子基板、電子機器 |
US8059409B2 (en) * | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
US7911796B2 (en) * | 2009-06-19 | 2011-03-22 | General Electric Company | Avionics chassis |
US8222541B2 (en) * | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
JPWO2010147199A1 (ja) * | 2009-06-19 | 2012-12-06 | 株式会社安川電機 | 配線基板および電力変換装置 |
US9036351B2 (en) * | 2009-06-22 | 2015-05-19 | Xyber Technologies, Llc | Passive cooling system and method for electronics devices |
US8582298B2 (en) | 2009-06-22 | 2013-11-12 | Xyber Technologies | Passive cooling enclosure system and method for electronics devices |
US8522569B2 (en) | 2009-10-27 | 2013-09-03 | Industrial Idea Partners, Inc. | Utilization of data center waste heat for heat driven engine |
FR2956280A1 (fr) * | 2010-02-09 | 2011-08-12 | Kontron Modular Computers Sa | Dispositif auxiliaire d'evacuation par conduction de la chaleur produite par une carte electronique |
CN101852378A (zh) * | 2010-07-02 | 2010-10-06 | 上海交通大学 | Led隧道照明灯 |
CN102316699B (zh) * | 2010-07-07 | 2015-10-14 | 富泰华工业(深圳)有限公司 | 冷却方法、使用该冷却设备方法的电路板维修装置及设备 |
CN101936676A (zh) * | 2010-09-13 | 2011-01-05 | 天津大学 | 多通道并联回路型脉动热管 |
TWI422318B (zh) * | 2010-10-29 | 2014-01-01 | Ind Tech Res Inst | 數據機房 |
TW201221034A (en) * | 2010-11-05 | 2012-05-16 | Inventec Corp | Cooling system of server and cooling method thereof |
FR2969379B1 (fr) * | 2010-12-17 | 2013-02-15 | Thales Sa | Refroidissement d'un equipement electronique |
JP5722710B2 (ja) * | 2011-06-16 | 2015-05-27 | 株式会社アドバンテスト | 基板組立体及び電子部品試験装置 |
US10006720B2 (en) | 2011-08-01 | 2018-06-26 | Teledyne Scientific & Imaging, Llc | System for using active and passive cooling for high power thermal management |
US9155230B2 (en) * | 2011-11-28 | 2015-10-06 | Asetek Danmark A/S | Cooling system for a server |
US9921003B2 (en) * | 2012-01-19 | 2018-03-20 | Lockheed Martin Corporation | Wickless heat pipe and thermal ground plane |
US8913391B2 (en) * | 2012-01-30 | 2014-12-16 | Alcatel Lucent | Board-level heat transfer apparatus for communication platforms |
US9132645B2 (en) * | 2012-11-29 | 2015-09-15 | Palo Alto Research Center Incorporated | Pulsating heat pipe spreader for ink jet printer |
WO2014085993A1 (en) * | 2012-12-05 | 2014-06-12 | Telefonaktiebolaget L M Ericsson (Publ) | System and method for regulating temperature of electronic component |
US11006548B2 (en) * | 2013-02-01 | 2021-05-11 | Smart Embedded Computing, Inc. | Method and device to provide uniform cooling in rugged environments |
FR3007122B1 (fr) * | 2013-06-18 | 2017-09-08 | Commissariat Energie Atomique | Refroidissement de composants electroniques et/ou electriques par caloduc pulse et element de conduction thermique |
EP2858464A1 (de) * | 2013-10-03 | 2015-04-08 | ABB Oy | Elektrische Vorrichtung |
US9826662B2 (en) * | 2013-12-12 | 2017-11-21 | General Electric Company | Reusable phase-change thermal interface structures |
US9333599B2 (en) * | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
JP6394331B2 (ja) * | 2013-12-27 | 2018-09-26 | 富士通株式会社 | 冷却部品及び電子機器 |
SG11201700077TA (en) * | 2014-07-08 | 2017-02-27 | Adc Technologies Inc | Robust redundant-capable leak-resistant cooled enclosure wall |
US9827697B2 (en) * | 2014-08-29 | 2017-11-28 | The Boeing Company | Systems and methods for curing complex fiber-reinforced composite structures |
CN104244683A (zh) * | 2014-10-09 | 2014-12-24 | 中国航空工业集团公司洛阳电光设备研究所 | 电子机箱 |
US10220725B2 (en) * | 2015-05-13 | 2019-03-05 | Ge Global Sourcing Llc | System and method for passively cooling an enclosure |
EP3144625B1 (de) * | 2015-09-21 | 2018-07-04 | ABB Schweiz AG | Kühlanordnung und verfahren zu deren herstellung |
DK3147621T3 (da) * | 2015-09-24 | 2019-10-21 | Abb Schweiz Ag | Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger |
US10383261B2 (en) * | 2015-10-20 | 2019-08-13 | Ge Global Sourcing Llc | Heat transfer chassis and method for forming the same |
US10136557B2 (en) * | 2015-12-04 | 2018-11-20 | General Electric Company | Thermal management systems and methods for heat generating electronics |
US9750160B2 (en) | 2016-01-20 | 2017-08-29 | Raytheon Company | Multi-level oscillating heat pipe implementation in an electronic circuit card module |
CN106028745B (zh) * | 2016-06-16 | 2019-04-30 | 北京纳源丰科技发展有限公司 | 一种基于二级热管的服务器机柜的散热结构 |
IT201600129385A1 (it) * | 2016-12-21 | 2018-06-21 | Leonardo Spa | Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici. |
EP3361847B1 (de) * | 2017-02-14 | 2021-03-31 | ABB Schweiz AG | Wärmetauscher |
US10178800B2 (en) * | 2017-03-30 | 2019-01-08 | Honeywell International Inc. | Support structure for electronics having fluid passageway for convective heat transfer |
EP3407693B1 (de) * | 2017-05-22 | 2022-11-09 | Pfannenberg GmbH | Wärmetauscher zur kühlung eines elektronischen gehäuses |
DE102017222148A1 (de) * | 2017-12-07 | 2019-06-13 | Siemens Mobility GmbH | Lüfterloses Kühlsystem |
US10527365B1 (en) * | 2018-07-09 | 2020-01-07 | International Business Machines Corporation | Disconnect assembly for active cooling of packaged electronics |
US10921869B2 (en) * | 2019-06-27 | 2021-02-16 | Intel Corporation | Chassis embedded heat pipe |
WO2021032229A1 (de) * | 2019-08-19 | 2021-02-25 | Lea Kelbsch | Gehäuse für wärme abgebende bauteile |
WO2021031699A1 (zh) * | 2019-08-20 | 2021-02-25 | 大连海事大学 | 一种液态金属高温脉动热管及测试方法 |
US11112840B2 (en) * | 2019-08-22 | 2021-09-07 | Abaco Systems, Inc. | Electronics chassis with oscillating heat pipe (OHP) |
US11160184B2 (en) * | 2019-10-08 | 2021-10-26 | Hamilton Sundstrand Corporation | Vehicle circuit card assembly |
EP4070631B1 (de) | 2019-12-05 | 2023-04-26 | Wieland Provides S.r.l. | Kühlsystem für elektronische systeme, insbesondere für datenzentren |
IT201900023076A1 (it) * | 2019-12-05 | 2021-06-05 | Provides Metalmeccanica S R L | Sistema di raffreddamento per data center |
US11765871B2 (en) | 2020-03-26 | 2023-09-19 | Ge Aviation Systems Llc | Aircraft and method for thermal management |
US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
EP4001820B1 (de) * | 2020-11-20 | 2024-05-29 | Nokia Technologies Oy | Oszillierendes wärmerohr |
DE102021213315A1 (de) | 2021-11-26 | 2023-06-01 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kühlvorrichtung |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3651865A (en) * | 1970-08-21 | 1972-03-28 | Us Air Force | Cooled electronic equipment mounting plate |
JPS58180692A (ja) * | 1982-04-10 | 1983-10-22 | 高橋 勝昭 | パルプ材の脱リグニン方法 |
JPH063354B2 (ja) * | 1987-06-23 | 1994-01-12 | アクトロニクス株式会社 | ル−プ型細管ヒ−トパイプ |
US4924041A (en) * | 1989-04-26 | 1990-05-08 | General Electric Company | Universal circuit breaker interlock arrangement |
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
US6104611A (en) * | 1995-10-05 | 2000-08-15 | Nortel Networks Corporation | Packaging system for thermally controlling the temperature of electronic equipment |
JPH10160367A (ja) * | 1996-12-02 | 1998-06-19 | Hitachi Ltd | 平板状ヒートパイプ及びそれを用いた電子装置 |
JPH10209660A (ja) * | 1997-01-20 | 1998-08-07 | Nippon Telegr & Teleph Corp <Ntt> | 電子装置 |
CA2199239A1 (en) * | 1997-03-05 | 1998-09-05 | Trevor Zapach | Electronic unit |
JPH11168163A (ja) * | 1997-12-04 | 1999-06-22 | Nippon Telegr & Teleph Corp <Ntt> | 電子回路パッケージ冷却装置 |
EP0946085A1 (de) * | 1998-03-24 | 1999-09-29 | Lucent Technologies Inc. | Elektronisches Gerät mit Umweltschutz-Aussengehäuse |
US6055157A (en) * | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
US6008987A (en) * | 1998-04-21 | 1999-12-28 | Nortel Networks Corporation | Electronic circuitry |
US6490159B1 (en) * | 2000-09-06 | 2002-12-03 | Visteon Global Tech., Inc. | Electrical circuit board and method for making the same |
US6796372B2 (en) | 2001-06-12 | 2004-09-28 | Liebert Corporation | Single or dual buss thermal transfer system |
US6657121B2 (en) * | 2001-06-27 | 2003-12-02 | Thermal Corp. | Thermal management system and method for electronics system |
US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
US6674643B2 (en) * | 2001-08-09 | 2004-01-06 | International Business Machines Corporation | Thermal connector for transferring heat between removable printed circuit boards |
US6672373B2 (en) * | 2001-08-27 | 2004-01-06 | Idalex Technologies, Inc. | Method of action of the pulsating heat pipe, its construction and the devices on its base |
JP3896840B2 (ja) * | 2001-12-13 | 2007-03-22 | ソニー株式会社 | 冷却装置、電子機器装置及び冷却装置の製造方法 |
US6643132B2 (en) * | 2002-01-04 | 2003-11-04 | Intel Corporation | Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system |
JP4123017B2 (ja) | 2002-04-02 | 2008-07-23 | 三菱電機株式会社 | 熱輸送素子および熱輸送素子を用いた半導体装置および熱輸送素子を用いた大気圏外移動体 |
JP2003329379A (ja) * | 2002-05-10 | 2003-11-19 | Furukawa Electric Co Ltd:The | ヒートパイプ回路基板 |
US6804117B2 (en) * | 2002-08-14 | 2004-10-12 | Thermal Corp. | Thermal bus for electronics systems |
US20050174735A1 (en) * | 2003-08-26 | 2005-08-11 | Nagui Mankaruse | High performance cooling systems |
JP4408224B2 (ja) * | 2004-01-29 | 2010-02-03 | 富士通株式会社 | 放熱機能を有する筐体 |
CN100349285C (zh) | 2004-04-12 | 2007-11-14 | 中南大学 | 用于电子器件冷却的循环流动型脉动热管 |
US7193850B2 (en) * | 2004-08-31 | 2007-03-20 | Hamilton Sundstrand Corporation | Integrated heat removal and vibration damping for avionic equipment |
-
2005
- 2005-01-06 US US11/030,704 patent/US7345877B2/en active Active
- 2005-11-09 AT AT05851466T patent/ATE512573T1/de not_active IP Right Cessation
- 2005-11-09 WO PCT/US2005/040595 patent/WO2006073553A2/en active Application Filing
- 2005-11-09 JP JP2007550364A patent/JP4881879B2/ja active Active
- 2005-11-09 CN CN2005800458470A patent/CN101095386B/zh active Active
- 2005-11-09 EP EP05851466.2A patent/EP1834515B2/de active Active
Also Published As
Publication number | Publication date |
---|---|
WO2006073553A2 (en) | 2006-07-13 |
US7345877B2 (en) | 2008-03-18 |
EP1834515B1 (de) | 2011-06-08 |
JP4881879B2 (ja) | 2012-02-22 |
CN101095386A (zh) | 2007-12-26 |
US20060146496A1 (en) | 2006-07-06 |
JP2008527709A (ja) | 2008-07-24 |
EP1834515A2 (de) | 2007-09-19 |
WO2006073553A3 (en) | 2007-03-01 |
CN101095386B (zh) | 2012-06-13 |
EP1834515B2 (de) | 2019-09-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |