ATE486492T1 - Abschirmungs- und wärmeableitungsvorrichtung - Google Patents
Abschirmungs- und wärmeableitungsvorrichtungInfo
- Publication number
- ATE486492T1 ATE486492T1 AT08715155T AT08715155T ATE486492T1 AT E486492 T1 ATE486492 T1 AT E486492T1 AT 08715155 T AT08715155 T AT 08715155T AT 08715155 T AT08715155 T AT 08715155T AT E486492 T1 ATE486492 T1 AT E486492T1
- Authority
- AT
- Austria
- Prior art keywords
- shielding
- heat sink
- heat
- conductive
- conductive surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cookers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200720143737.4U CN201104378Y (zh) | 2007-04-04 | 2007-04-04 | 屏蔽和散热装置 |
PCT/CN2008/070419 WO2008122220A1 (en) | 2007-04-04 | 2008-03-05 | Shielding and heat-dissipating device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE486492T1 true ATE486492T1 (de) | 2010-11-15 |
Family
ID=39830485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08715155T ATE486492T1 (de) | 2007-04-04 | 2008-03-05 | Abschirmungs- und wärmeableitungsvorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7692927B2 (de) |
EP (1) | EP2031952B1 (de) |
CN (1) | CN201104378Y (de) |
AT (1) | ATE486492T1 (de) |
DE (2) | DE602008003166D1 (de) |
WO (1) | WO2008122220A1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201104378Y (zh) | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
JP4842346B2 (ja) * | 2009-04-21 | 2011-12-21 | シャープ株式会社 | 電子部品モジュールおよびその製造方法 |
CN101873784B (zh) * | 2009-04-27 | 2012-08-08 | 台达电子工业股份有限公司 | 电子元件的散热模块及其组装方法 |
DE102010008553B4 (de) | 2010-02-19 | 2011-09-22 | Continental Automotive Gmbh | Vorrichtung zur Abschirmung eines Elektronikmoduls |
CN103621194A (zh) | 2011-06-29 | 2014-03-05 | 三菱电机株式会社 | 电子设备 |
US8760868B2 (en) * | 2011-08-30 | 2014-06-24 | Apple Inc. | Electronic device enclosures and heatsink structures with thermal management features |
WO2013061409A1 (ja) * | 2011-10-25 | 2013-05-02 | 富士通株式会社 | 水冷装置、水冷装置を有する電子機器、及び水冷方法 |
DE102012107668A1 (de) * | 2012-08-21 | 2014-03-20 | Epcos Ag | Bauelementanordnung |
US9439333B2 (en) | 2013-01-15 | 2016-09-06 | Genesis Technology Usa, Inc. | Heat-dissipating EMI/RFI shield |
US9398700B2 (en) * | 2013-06-21 | 2016-07-19 | Invensas Corporation | Method of forming a reliable microelectronic assembly |
KR102172314B1 (ko) | 2013-11-12 | 2020-10-30 | 삼성전자주식회사 | 반도체 장치 |
US10103087B2 (en) | 2014-03-18 | 2018-10-16 | Huawei Device (Dongguan) Co., Ltd. | Heat dissipation assembly and electronic device |
CN105338783B (zh) * | 2014-07-01 | 2018-08-31 | 联想(北京)有限公司 | 一种电子设备以及用于电子设备的散热装置 |
EP3200226B1 (de) | 2014-10-17 | 2021-12-29 | Huawei Technologies Co., Ltd. | Wärmeableitabschirmstruktur und übertragungsprodukt |
CN105764302B (zh) * | 2014-12-18 | 2019-12-13 | 中兴通讯股份有限公司 | 一种导热垫、散热器和散热组件 |
JP6330690B2 (ja) * | 2015-02-19 | 2018-05-30 | 株式会社オートネットワーク技術研究所 | 基板ユニット |
CN204721769U (zh) * | 2015-05-14 | 2015-10-21 | 中兴通讯股份有限公司 | 移动通信终端 |
US10104806B2 (en) * | 2015-09-04 | 2018-10-16 | Toshiba Memory Corporation | Semiconductor storage device |
KR102473586B1 (ko) * | 2015-10-27 | 2022-12-05 | 삼성전자주식회사 | 방열장치를 포함하는 디스플레이 기기 및 전자 기기 |
CN106686962B (zh) * | 2015-11-09 | 2023-08-29 | 天津莱尔德电子材料有限公司 | 可用作bls盖的导电多孔材料 |
CN106876347B (zh) * | 2015-12-11 | 2019-05-21 | 青岛海尔多媒体有限公司 | 一种外设模块及外设模块连接装置 |
US9913361B2 (en) * | 2016-01-06 | 2018-03-06 | International Business Machines Corporation | Integrated circuit device assembly |
US10672683B2 (en) | 2016-01-28 | 2020-06-02 | Hewlett Packard Enterprise Development Lp | Heat transfer adapter plate |
CN107105596A (zh) * | 2016-02-23 | 2017-08-29 | 中兴通讯股份有限公司 | 散热组件 |
CN205389320U (zh) * | 2016-03-23 | 2016-07-20 | 乐视控股(北京)有限公司 | 一种散热屏蔽装置 |
US10763218B2 (en) * | 2016-03-24 | 2020-09-01 | Intel Corporation | Electrical devices and methods for forming electrical devices |
CN106304819A (zh) * | 2016-08-23 | 2017-01-04 | 昆山市中迪新材料技术有限公司 | 一种具有散热功能的屏蔽器件及其制备方法 |
CN106413369A (zh) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | 一种屏蔽罩及电路板 |
JP6096977B1 (ja) * | 2016-11-11 | 2017-03-15 | シナノケンシ株式会社 | 電動ポンプ |
CN106850883B (zh) * | 2016-12-20 | 2020-03-24 | Oppo广东移动通信有限公司 | 支架组件、功能模组及移动终端 |
US20180199453A1 (en) * | 2017-01-10 | 2018-07-12 | Whisker Labs, Inc. | Electronics enclosure |
CN107172872B (zh) * | 2017-06-26 | 2024-02-13 | 上海传英信息技术有限公司 | 电子终端的散热装置与电子终端 |
WO2019000162A1 (en) * | 2017-06-26 | 2019-01-03 | Thomson Licensing | ELECTROMAGNETIC SHIELDING OF ELECTRONIC DEVICE |
US10649503B2 (en) * | 2017-06-29 | 2020-05-12 | Qualcomm Incorporated | Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion |
CN109561641B (zh) * | 2017-09-27 | 2021-03-02 | 北京小米移动软件有限公司 | 屏蔽罩、印制电路板及电子设备 |
US10999957B2 (en) | 2018-02-12 | 2021-05-04 | Samsung Electro-Mechanics Co., Ltd. | Communication module and mounting structure thereof |
US10674646B1 (en) * | 2019-10-25 | 2020-06-02 | Aliner Industries Inc. | EMI shield with increased heat dissipating effect |
CN113498296A (zh) * | 2020-03-20 | 2021-10-12 | 上海禾赛科技有限公司 | 具有导热装置的电路结构及其散热方法与制作方法 |
CN117178357A (zh) * | 2021-03-08 | 2023-12-05 | 特斯拉公司 | 减少静电放电和/或电磁干扰影响的部件的冷却片上*** |
CN115023099B (zh) * | 2021-11-10 | 2023-11-21 | 荣耀终端有限公司 | 电子设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5357404A (en) * | 1991-11-18 | 1994-10-18 | The Whitaker Corporation | EMI shield, and assembly using same |
US5241453A (en) * | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
US6507101B1 (en) * | 1999-03-26 | 2003-01-14 | Hewlett-Packard Company | Lossy RF shield for integrated circuits |
US6229702B1 (en) * | 1999-06-02 | 2001-05-08 | Advanced Semiconductor Engineering, Inc. | Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability |
US6377474B1 (en) * | 2000-01-13 | 2002-04-23 | International Business Corporation | Electrical grounding schemes for socketed processor and heatsink assembly |
US6577504B1 (en) * | 2000-08-30 | 2003-06-10 | Intel Corporation | Integrated heat sink for different size components with EMI suppression features |
US20040052064A1 (en) * | 2001-11-15 | 2004-03-18 | Oliver Michael J. | Electromagnetic shielding and cooling device for printed circuit board |
TW511885U (en) * | 2002-01-30 | 2002-11-21 | Hon Hai Prec Ind Co Ltd | Assembly of heat dissipation apparatus |
WO2003077377A1 (en) * | 2002-03-06 | 2003-09-18 | Tyco Electronics Corporation | Receptacle assembly having shielded interface with pluggable electronic module |
US6744640B2 (en) * | 2002-04-10 | 2004-06-01 | Gore Enterprise Holdings, Inc. | Board-level EMI shield with enhanced thermal dissipation |
US7245896B2 (en) * | 2002-06-24 | 2007-07-17 | Lg Electronics Inc. | Apparatus for improving reception sensitivity of public wave receiver by reducing noise externally-emitted in the public wave receiver |
US6992894B1 (en) * | 2003-03-17 | 2006-01-31 | Unisys Corporation | Method and apparatus for EMI shielding |
JP4469563B2 (ja) * | 2003-06-05 | 2010-05-26 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器、電磁波放射抑制部材 |
US6858796B1 (en) * | 2003-09-29 | 2005-02-22 | Sun Microsystems, Inc. | Grounding mechanism retention feature |
JP3641632B1 (ja) * | 2003-10-06 | 2005-04-27 | Fcm株式会社 | 導電性シート、それを用いた製品およびその製造方法 |
US7327577B2 (en) * | 2005-11-03 | 2008-02-05 | International Business Machines Corporation | Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
CN201104378Y (zh) | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
-
2007
- 2007-04-04 CN CN200720143737.4U patent/CN201104378Y/zh not_active Expired - Lifetime
-
2008
- 2008-03-05 WO PCT/CN2008/070419 patent/WO2008122220A1/zh active Application Filing
- 2008-03-05 EP EP08715155A patent/EP2031952B1/de active Active
- 2008-03-05 AT AT08715155T patent/ATE486492T1/de not_active IP Right Cessation
- 2008-03-05 DE DE602008003166T patent/DE602008003166D1/de active Active
- 2008-03-05 DE DE202008017728U patent/DE202008017728U1/de not_active Expired - Lifetime
- 2008-10-10 US US12/249,541 patent/US7692927B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE602008003166D1 (de) | 2010-12-09 |
EP2031952A4 (de) | 2009-06-17 |
WO2008122220A1 (en) | 2008-10-16 |
EP2031952A1 (de) | 2009-03-04 |
US20090040731A1 (en) | 2009-02-12 |
US7692927B2 (en) | 2010-04-06 |
DE202008017728U1 (de) | 2010-05-12 |
CN201104378Y (zh) | 2008-08-20 |
EP2031952B1 (de) | 2010-10-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |