ATE438155T1 - Smartcard mit transparentem rand und herstellungsverfahren hierfür - Google Patents

Smartcard mit transparentem rand und herstellungsverfahren hierfür

Info

Publication number
ATE438155T1
ATE438155T1 AT05108761T AT05108761T ATE438155T1 AT E438155 T1 ATE438155 T1 AT E438155T1 AT 05108761 T AT05108761 T AT 05108761T AT 05108761 T AT05108761 T AT 05108761T AT E438155 T1 ATE438155 T1 AT E438155T1
Authority
AT
Austria
Prior art keywords
section
smart card
smartcard
production process
compensation
Prior art date
Application number
AT05108761T
Other languages
English (en)
Inventor
Maila Korhonen
Mika Holmberg
Jari Herlin
Original Assignee
Gemalto Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto Oy filed Critical Gemalto Oy
Application granted granted Critical
Publication of ATE438155T1 publication Critical patent/ATE438155T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • External Artificial Organs (AREA)
AT05108761T 2005-09-22 2005-09-22 Smartcard mit transparentem rand und herstellungsverfahren hierfür ATE438155T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05108761A EP1770608B1 (de) 2005-09-22 2005-09-22 Smartcard mit transparentem Rand und Herstellungsverfahren hierfür

Publications (1)

Publication Number Publication Date
ATE438155T1 true ATE438155T1 (de) 2009-08-15

Family

ID=35613848

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05108761T ATE438155T1 (de) 2005-09-22 2005-09-22 Smartcard mit transparentem rand und herstellungsverfahren hierfür

Country Status (5)

Country Link
US (1) US7905404B2 (de)
EP (1) EP1770608B1 (de)
AT (1) ATE438155T1 (de)
DE (1) DE602005015718D1 (de)
WO (1) WO2007034039A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2964487B1 (fr) * 2010-09-02 2013-07-12 Oberthur Technologies Carte a microcircuit comprenant un moyen lumineux
EP2426627B1 (de) * 2010-09-02 2016-10-12 Oberthur Technologies Leuchtmodul für Mikroschaltungsvorrichtung
FR3118515B1 (fr) 2020-12-31 2023-12-01 Imprimerie Nat Carte à puce à bord transparent augmenté
DE102022001506A1 (de) 2022-04-29 2023-11-02 Giesecke+Devrient ePayments GmbH Kartenförmiger Datenträger und Verfahren zu dessen Herstellung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186886A (ja) * 1984-10-04 1986-05-02 Toshiba Corp Icカ−ド
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
FR2778475B1 (fr) * 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
DE19939347C1 (de) * 1999-08-19 2001-02-15 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
JP2001084347A (ja) 1999-09-16 2001-03-30 Toshiba Corp カード型記憶装置及びその製造方法
GB0024070D0 (en) * 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
WO2003044733A1 (fr) 2001-11-23 2003-05-30 Nagraid Sa Methode de fabrication d'un module comprenant au moins un composant electronique
EP1467834A4 (de) * 2001-12-24 2005-04-06 Digimarc Id Systems Llc Lasergeätzte sicherheitsmerkmale zur identifikation von dokumenten und herstellungsverfahren dafür
JP2003303327A (ja) 2002-04-11 2003-10-24 Toppan Forms Co Ltd 非接触型icカード
DE10304824A1 (de) * 2003-01-31 2004-08-12 Varta Microbattery Gmbh Dünne elektronische Chipkarte
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7777317B2 (en) * 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method

Also Published As

Publication number Publication date
DE602005015718D1 (de) 2009-09-10
EP1770608B1 (de) 2009-07-29
WO2007034039A1 (en) 2007-03-29
EP1770608A1 (de) 2007-04-04
US20090065589A1 (en) 2009-03-12
US7905404B2 (en) 2011-03-15

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties