ATE426828T1 - Verfahren zur herstellung eines umlenkspiegels in optischen wellenleiterbauelementen - Google Patents

Verfahren zur herstellung eines umlenkspiegels in optischen wellenleiterbauelementen

Info

Publication number
ATE426828T1
ATE426828T1 AT05716482T AT05716482T ATE426828T1 AT E426828 T1 ATE426828 T1 AT E426828T1 AT 05716482 T AT05716482 T AT 05716482T AT 05716482 T AT05716482 T AT 05716482T AT E426828 T1 ATE426828 T1 AT E426828T1
Authority
AT
Austria
Prior art keywords
photoresist layer
photoresist
exposed
radiation
substrate
Prior art date
Application number
AT05716482T
Other languages
English (en)
Inventor
Alessandro Nottola
Umberto Colombo
Giorgio Mutinati
Stefano Sardo
Original Assignee
Pgt Photonics Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pgt Photonics Spa filed Critical Pgt Photonics Spa
Application granted granted Critical
Publication of ATE426828T1 publication Critical patent/ATE426828T1/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12104—Mirror; Reflectors or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Optical Integrated Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Elements Other Than Lenses (AREA)
AT05716482T 2005-03-31 2005-03-31 Verfahren zur herstellung eines umlenkspiegels in optischen wellenleiterbauelementen ATE426828T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/003391 WO2006102917A1 (en) 2005-03-31 2005-03-31 Method to fabricate a redirecting mirror in optical waveguide devices

Publications (1)

Publication Number Publication Date
ATE426828T1 true ATE426828T1 (de) 2009-04-15

Family

ID=34963290

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05716482T ATE426828T1 (de) 2005-03-31 2005-03-31 Verfahren zur herstellung eines umlenkspiegels in optischen wellenleiterbauelementen

Country Status (5)

Country Link
US (2) US7871760B2 (de)
EP (1) EP1866688B1 (de)
AT (1) ATE426828T1 (de)
DE (1) DE602005013582D1 (de)
WO (1) WO2006102917A1 (de)

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US7974508B2 (en) 2009-02-03 2011-07-05 Nitto Denko Corporation Multi-layer structure and method for manufacturing the same
EP2367034A1 (de) 2010-03-16 2011-09-21 Telefonaktiebolaget L M Ericsson (Publ) Planare Wellenleiterschaltung mit einem 90 Grad optischen Hybriden und optischer Empfänger
US9977188B2 (en) 2011-08-30 2018-05-22 Skorpios Technologies, Inc. Integrated photonics mode expander
DK2798389T3 (en) 2011-12-27 2017-09-11 Neophotonics Corp CLUTCH SYSTEM FOR INTEGRATED CIRCUIT WITH WAVE CONTROLLER AND METHOD OF PRODUCING THEREOF
US8968987B2 (en) 2012-01-11 2015-03-03 International Business Machines Corporation Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist
US9618712B2 (en) * 2012-02-23 2017-04-11 Taiwan Semiconductor Manufacturing Company, Ltd. Optical bench on substrate and method of making the same
DE102012106236A1 (de) * 2012-07-11 2014-01-16 Endress + Hauser Gmbh + Co. Kg Verfahren zum Fügen von Keramikkörpern mittels eines Aktivhartlots, Baugruppe mit mindestens zwei miteinander gefügten Keramikkörpern, insbesondere Druckmesszelle
JP6248612B2 (ja) * 2013-12-24 2017-12-20 日立化成株式会社 マーカー付き光導波路
US9664855B2 (en) 2014-03-07 2017-05-30 Skorpios Technologies, Inc. Wide shoulder, high order mode filter for thick-silicon waveguides
US9658401B2 (en) 2014-05-27 2017-05-23 Skorpios Technologies, Inc. Waveguide mode expander having an amorphous-silicon shoulder
US9245544B1 (en) * 2014-07-25 2016-01-26 Sae Magnetics (H.K.) Ltd. Surface forming method for electronic component
US12062629B2 (en) * 2014-09-11 2024-08-13 Taiwan Semiconductor Manufacturing Company Limited Multiband QAM interface for slab waveguide
US10816738B2 (en) 2014-10-24 2020-10-27 Hewlett Packard Enterprise Development Lp Turning mirror optical couplers
US9829631B2 (en) 2015-04-20 2017-11-28 Skorpios Technologies, Inc. Vertical output couplers for photonic devices
JP6836602B2 (ja) * 2016-02-01 2021-03-03 アーヴィン オートモーティブ プロダクツ、エルエルシー 自動車用照明バイザー・ミラー
US10605984B2 (en) 2016-12-01 2020-03-31 Waymo Llc Array of waveguide diffusers for light detection using an aperture
US10698088B2 (en) * 2017-08-01 2020-06-30 Waymo Llc LIDAR receiver using a waveguide and an aperture
US10649148B2 (en) 2017-10-25 2020-05-12 Skorpios Technologies, Inc. Multistage spot size converter in silicon photonics
US11644618B2 (en) 2018-06-22 2023-05-09 Apple Inc. Discrete optical unit on a substrate of an integrated photonics chip
US10823912B1 (en) * 2018-09-27 2020-11-03 Apple Inc. Silicon photonics using off-cut wafer having top-side vertical outcoupler from etched cavity
TWI745770B (zh) 2018-11-07 2021-11-11 美商應用材料股份有限公司 使用灰調微影術及傾斜蝕刻的深度調節傾斜光柵
US11360263B2 (en) 2019-01-31 2022-06-14 Skorpios Technologies. Inc. Self-aligned spot size converter
GB201903708D0 (en) * 2019-03-19 2019-05-01 Wave Optics Ltd Improved angular uniformity waveguide for augmented or virtual reality
US10818606B1 (en) * 2019-04-02 2020-10-27 Vanguard International Semiconductor Corporation Alignment mark patterns and wafer structures comprising the same
US11525958B1 (en) 2019-09-09 2022-12-13 Apple Inc. Off-cut wafer with a supported outcoupler
KR20230070498A (ko) 2020-10-23 2023-05-23 애플 인크. 행잉 커넥터를 갖는 빠른-축 시준기

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JPS62267740A (ja) * 1986-05-15 1987-11-20 Fujitsu Ltd レジストの露光方法
US4904036A (en) 1988-03-03 1990-02-27 American Telephone And Telegraph Company, At&T Bell Laboratories Subassemblies for optoelectronic hybrid integrated circuits
US5135605A (en) 1991-04-29 1992-08-04 At&T Bell Laboratories Methods for making mirrors
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Also Published As

Publication number Publication date
EP1866688B1 (de) 2009-03-25
DE602005013582D1 (de) 2009-05-07
US8236481B2 (en) 2012-08-07
EP1866688A1 (de) 2007-12-19
US7871760B2 (en) 2011-01-18
WO2006102917A1 (en) 2006-10-05
US20090020499A1 (en) 2009-01-22
US20110136063A1 (en) 2011-06-09

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