ATE414911T1 - Verfahren zur durchführung des einbrennens elektronischer vorrichtungen auf nicht vereinzelte halbleiterscheiben - Google Patents

Verfahren zur durchführung des einbrennens elektronischer vorrichtungen auf nicht vereinzelte halbleiterscheiben

Info

Publication number
ATE414911T1
ATE414911T1 AT02752818T AT02752818T ATE414911T1 AT E414911 T1 ATE414911 T1 AT E414911T1 AT 02752818 T AT02752818 T AT 02752818T AT 02752818 T AT02752818 T AT 02752818T AT E414911 T1 ATE414911 T1 AT E414911T1
Authority
AT
Austria
Prior art keywords
trenches
methods
electrical contacts
carrying
electronic devices
Prior art date
Application number
AT02752818T
Other languages
English (en)
Inventor
Michael Haji-Sheikh
James Biard
Robert Hawkins
Simon Rabinovich
James Guenter
Original Assignee
Finisar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Finisar Corp filed Critical Finisar Corp
Application granted granted Critical
Publication of ATE414911T1 publication Critical patent/ATE414911T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
    • G01R31/275—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements for testing individual semiconductor components within integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/0014—Measuring characteristics or properties thereof
    • H01S5/0021—Degradation or life time measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Element Separation (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT02752818T 2001-08-13 2002-08-12 Verfahren zur durchführung des einbrennens elektronischer vorrichtungen auf nicht vereinzelte halbleiterscheiben ATE414911T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31191601P 2001-08-13 2001-08-13

Publications (1)

Publication Number Publication Date
ATE414911T1 true ATE414911T1 (de) 2008-12-15

Family

ID=23209047

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02752818T ATE414911T1 (de) 2001-08-13 2002-08-12 Verfahren zur durchführung des einbrennens elektronischer vorrichtungen auf nicht vereinzelte halbleiterscheiben

Country Status (10)

Country Link
US (3) US7190184B2 (de)
EP (5) EP1417500B1 (de)
JP (5) JP2005500690A (de)
KR (5) KR20040030104A (de)
CN (5) CN1568429A (de)
AT (1) ATE414911T1 (de)
AU (5) AU2002356039A1 (de)
CA (5) CA2457680A1 (de)
DE (1) DE60229954D1 (de)
WO (5) WO2003017353A2 (de)

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Also Published As

Publication number Publication date
EP1417501A2 (de) 2004-05-12
AU2002323125A1 (en) 2003-03-03
CA2457675A1 (en) 2003-02-27
US20070117242A1 (en) 2007-05-24
WO2003017353A3 (en) 2003-07-24
WO2003017325A3 (en) 2004-01-08
JP2005510044A (ja) 2005-04-14
CA2457685A1 (en) 2003-02-27
JP2005500688A (ja) 2005-01-06
AU2002356039A1 (en) 2003-03-03
EP1417499A2 (de) 2004-05-12
KR20040030104A (ko) 2004-04-08
CN100533165C (zh) 2009-08-26
JP2005500686A (ja) 2005-01-06
KR20040030103A (ko) 2004-04-08
JP5009487B2 (ja) 2012-08-22
CA2457690A1 (en) 2003-02-27
CN1568539A (zh) 2005-01-19
US20100264511A1 (en) 2010-10-21
KR20040030106A (ko) 2004-04-08
CN1568429A (zh) 2005-01-19
WO2003017325A2 (en) 2003-02-27
KR100780059B1 (ko) 2007-11-29
JP2005500691A (ja) 2005-01-06
AU2002323126A1 (en) 2003-03-03
WO2003017353A2 (en) 2003-02-27
EP1417501B1 (de) 2017-05-31
CA2457691A1 (en) 2003-02-27
CN1568433A (zh) 2005-01-19
CN1568431A (zh) 2005-01-19
JP2005500690A (ja) 2005-01-06
CN1568432A (zh) 2005-01-19
US20050024076A1 (en) 2005-02-03
WO2003017352A3 (en) 2003-05-30
WO2003017335A2 (en) 2003-02-27
WO2003017326A2 (en) 2003-02-27
US8129253B2 (en) 2012-03-06
AU2002331074A1 (en) 2003-03-03
EP1417500B1 (de) 2008-11-19
EP1421396A2 (de) 2004-05-26
EP1417500A2 (de) 2004-05-12
CA2457680A1 (en) 2003-02-27
WO2003017352A2 (en) 2003-02-27
WO2003017335A3 (en) 2003-12-18
WO2003017326A3 (en) 2003-05-15
JP5009488B2 (ja) 2012-08-22
EP1423872A2 (de) 2004-06-02
DE60229954D1 (de) 2009-01-02
KR20040030107A (ko) 2004-04-08
KR20040030105A (ko) 2004-04-08
US7190184B2 (en) 2007-03-13
US7662650B2 (en) 2010-02-16
AU2002331069A1 (en) 2003-03-03

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