ATE400673T1 - Herstellung eines hochdichten dicken keramikfilms durch siebdruck - Google Patents

Herstellung eines hochdichten dicken keramikfilms durch siebdruck

Info

Publication number
ATE400673T1
ATE400673T1 AT01915880T AT01915880T ATE400673T1 AT E400673 T1 ATE400673 T1 AT E400673T1 AT 01915880 T AT01915880 T AT 01915880T AT 01915880 T AT01915880 T AT 01915880T AT E400673 T1 ATE400673 T1 AT E400673T1
Authority
AT
Austria
Prior art keywords
film
sol
high density
screen printing
producing
Prior art date
Application number
AT01915880T
Other languages
English (en)
Inventor
Tae-Song Kim
Yong-Bum Kim
Hyung-Jin Jung
Original Assignee
Korea Inst Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Inst Sci & Tech filed Critical Korea Inst Sci & Tech
Application granted granted Critical
Publication of ATE400673T1 publication Critical patent/ATE400673T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1254—Sol or sol-gel processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Glass Compositions (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT01915880T 2000-05-13 2001-03-16 Herstellung eines hochdichten dicken keramikfilms durch siebdruck ATE400673T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2000-0025622A KR100369118B1 (ko) 2000-05-13 2000-05-13 스크린 프린팅에 의한 고밀도 세라믹 후막 제조방법

Publications (1)

Publication Number Publication Date
ATE400673T1 true ATE400673T1 (de) 2008-07-15

Family

ID=19668551

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01915880T ATE400673T1 (de) 2000-05-13 2001-03-16 Herstellung eines hochdichten dicken keramikfilms durch siebdruck

Country Status (7)

Country Link
US (1) US6749798B2 (de)
EP (1) EP1285102B1 (de)
JP (1) JP3917426B2 (de)
KR (1) KR100369118B1 (de)
AT (1) ATE400673T1 (de)
DE (1) DE60134737D1 (de)
WO (1) WO2001088222A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100449894B1 (ko) * 2002-01-31 2004-09-22 한국과학기술원 상이한 분말크기분포를 이용한 고 유전상수 및 저오차특성을 가지는 내장형 캐패시터 필름조성물 및 그제조방법
SG115500A1 (en) * 2002-10-09 2005-10-28 Inst Materials Research & Eng Method to produce a reliable piezoelectric thick film on a substrate
DE10350788B3 (de) * 2003-10-29 2005-02-03 Fachhochschule Kiel Verfahren zur Herstellung einer Keramikschicht und Siebdruckpaste
FR2871942B1 (fr) * 2004-06-17 2006-08-04 Commissariat Energie Atomique Procede de preparation de materiaux piezoelectriques
CN1298674C (zh) * 2005-04-06 2007-02-07 清华大学 一种压电陶瓷膜的制备方法
JP4940389B2 (ja) * 2007-01-19 2012-05-30 国立大学法人 名古屋工業大学 無鉛圧電磁器複合体及びこれを用いた圧電素子
FI129896B (en) * 2021-09-01 2022-10-31 Oulun Yliopisto Impregnation of ceramic composite material

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728465C2 (de) * 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
US5603983A (en) * 1986-03-24 1997-02-18 Ensci Inc Process for the production of conductive and magnetic transitin metal oxide coated three dimensional substrates
DK193287A (da) * 1986-04-16 1987-10-17 Alcan Int Ltd Sammensat membran
JPH01112785A (ja) * 1987-10-27 1989-05-01 Meidensha Corp 複合圧電体膜の製造方法
JPH03283583A (ja) * 1990-03-30 1991-12-13 Mazda Motor Corp 圧電体厚膜の製造方法
JPH04215414A (ja) * 1990-12-14 1992-08-06 Taiyo Yuden Co Ltd 積層セラミック電子部品の製造方法
US5432015A (en) * 1992-05-08 1995-07-11 Westaim Technologies, Inc. Electroluminescent laminate with thick film dielectric
JP2747881B2 (ja) * 1994-01-20 1998-05-06 大日本塗料株式会社 浴室用立体模様塗板の製造方法
US5457598A (en) * 1994-04-08 1995-10-10 Radford; Kenneth C. High capacitance thin film capacitor
JPH0896624A (ja) * 1994-09-28 1996-04-12 Murata Mfg Co Ltd 厚膜ペースト
JP3723998B2 (ja) * 1994-12-07 2005-12-07 株式会社村田製作所 厚膜Ｃｕ回路基板の製造方法
EP0913359A4 (de) * 1996-07-17 1999-10-20 Citizen Watch Co Ltd Ferroelektrisches element und herstellungsverfahren dafür
US5997795A (en) * 1997-05-29 1999-12-07 Rutgers, The State University Processes for forming photonic bandgap structures

Also Published As

Publication number Publication date
WO2001088222A1 (en) 2001-11-22
EP1285102A1 (de) 2003-02-26
DE60134737D1 (de) 2008-08-21
JP3917426B2 (ja) 2007-05-23
US6749798B2 (en) 2004-06-15
EP1285102A4 (de) 2006-05-10
JP2003533596A (ja) 2003-11-11
KR100369118B1 (ko) 2003-01-24
EP1285102B1 (de) 2008-07-09
US20020171182A1 (en) 2002-11-21
KR20010104157A (ko) 2001-11-24

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