ATE383404T1 - Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode - Google Patents
Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diodeInfo
- Publication number
- ATE383404T1 ATE383404T1 AT03725638T AT03725638T ATE383404T1 AT E383404 T1 ATE383404 T1 AT E383404T1 AT 03725638 T AT03725638 T AT 03725638T AT 03725638 T AT03725638 T AT 03725638T AT E383404 T1 ATE383404 T1 AT E383404T1
- Authority
- AT
- Austria
- Prior art keywords
- curing product
- curable composition
- curing
- emitting diode
- light emitting
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000003054 catalyst Substances 0.000 abstract 2
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 238000006459 hydrosilylation reaction Methods 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 abstract 1
- 150000003377 silicon compounds Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/42—Introducing metal atoms or metal-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002125947 | 2002-04-26 | ||
JP2002133412 | 2002-05-09 | ||
JP2002135022 | 2002-05-10 | ||
JP2002225189 | 2002-08-01 | ||
JP2003026649 | 2003-02-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE383404T1 true ATE383404T1 (de) | 2008-01-15 |
Family
ID=29273849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03725638T ATE383404T1 (de) | 2002-04-26 | 2003-04-23 | Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode |
Country Status (9)
Country | Link |
---|---|
US (1) | US7371462B2 (de) |
EP (1) | EP1505121B1 (de) |
KR (1) | KR100969175B1 (de) |
CN (1) | CN100338141C (de) |
AT (1) | ATE383404T1 (de) |
CA (1) | CA2483510A1 (de) |
DE (1) | DE60318570T2 (de) |
TW (1) | TW200307726A (de) |
WO (1) | WO2003091338A1 (de) |
Families Citing this family (45)
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KR100806553B1 (ko) * | 2000-12-27 | 2008-02-27 | 카네카 코포레이션 | 경화제, 경화성 조성물, 광학 소재용 조성물, 광학 소재, 이의 제조 방법 및 이를 사용하여 만들어진 액정표시장치 및 led |
MY151065A (en) * | 2003-02-25 | 2014-03-31 | Kaneka Corp | Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
JP4009581B2 (ja) * | 2003-11-18 | 2007-11-14 | オリンパス株式会社 | カプセル型医療システム |
DE102005009066A1 (de) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement |
DE102005036520A1 (de) * | 2005-04-26 | 2006-11-09 | Osram Opto Semiconductors Gmbh | Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung |
JP2007091960A (ja) * | 2005-09-30 | 2007-04-12 | Nitto Denko Corp | 光半導体素子封止用樹脂組成物およびそれを用いて得られる光半導体装置 |
US8465175B2 (en) | 2005-11-29 | 2013-06-18 | GE Lighting Solutions, LLC | LED lighting assemblies with thermal overmolding |
EP1967540B1 (de) * | 2005-12-26 | 2013-04-03 | Kaneka Corporation | Härtbare zusammensetzung |
CN100448905C (zh) * | 2006-03-17 | 2009-01-07 | 中国科学院广州化学研究所 | 含有8-羟基喹啉金属配合物的高聚物分子杂化发光材料及其制备方法 |
US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
WO2007135707A1 (ja) | 2006-05-18 | 2007-11-29 | Nichia Corporation | 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 |
US8084765B2 (en) * | 2007-05-07 | 2011-12-27 | Xerox Corporation | Electronic device having a dielectric layer |
US9024455B2 (en) * | 2010-05-26 | 2015-05-05 | Hitachi Chemical Company, Ltd. | Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device |
WO2009060958A1 (ja) * | 2007-11-09 | 2009-05-14 | Kaneka Corporation | 環状ポリオルガノシロキサンの製造方法、硬化剤、硬化性組成物およびその硬化物 |
CN101896537B (zh) * | 2007-12-10 | 2012-10-24 | 株式会社钟化 | 具有碱显影性的固化性组合物、使用该组合物的绝缘性薄膜以及薄膜晶体管 |
CN101538367B (zh) * | 2008-01-28 | 2013-09-04 | 信越化学工业株式会社 | 二缩水甘油基异氰尿酸基改性有机聚硅氧烷以及含有该有机聚硅氧烷的组成物 |
GB0805495D0 (en) * | 2008-03-26 | 2008-04-30 | Sun Chemical Bv | An ink jet-printable composition and a masking process |
JP5471180B2 (ja) * | 2008-09-11 | 2014-04-16 | 信越化学工業株式会社 | シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置 |
CN102171268B (zh) * | 2008-10-02 | 2016-05-18 | 株式会社钟化 | 光固化性组合物以及固化物 |
EP2196503B1 (de) * | 2008-12-12 | 2015-02-18 | Nitto Denko Corporation | Wärmehärtende Silikonharzzusammensetzung, Silikonharz, Silikonharzfolie und Verwendung dafür |
TWI579995B (zh) * | 2009-08-19 | 2017-04-21 | Xintex Inc | 晶片封裝體及其製造方法 |
JP2011057755A (ja) * | 2009-09-07 | 2011-03-24 | Shin-Etsu Chemical Co Ltd | シリコーン組成物及びその硬化物 |
JP5340191B2 (ja) * | 2010-02-02 | 2013-11-13 | 日東電工株式会社 | 光半導体装置 |
JP5380325B2 (ja) * | 2010-02-18 | 2014-01-08 | 日東電工株式会社 | 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置 |
US8785507B2 (en) | 2010-03-09 | 2014-07-22 | University Of Virginia Patent Foundation | Viscoelastic silicon rubber compositions |
JP5603344B2 (ja) * | 2010-03-23 | 2014-10-08 | 東海ゴム工業株式会社 | 導電性架橋体、およびその製造方法、並びにそれを用いたトランスデューサ、フレキシブル配線板、電磁波シールド |
JP5844252B2 (ja) * | 2010-04-02 | 2016-01-13 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
JP6109569B2 (ja) * | 2010-05-07 | 2017-04-05 | 住友ベークライト株式会社 | 回路基板用エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板用積層基材、プリント配線板、及び半導体装置 |
CN102453327A (zh) * | 2010-10-27 | 2012-05-16 | 3M新设资产公司 | 具有高折射率的聚硅氧树脂组合物 |
JP2012191062A (ja) * | 2011-03-11 | 2012-10-04 | Toshiba Corp | 半導体装置 |
WO2012124724A1 (ja) * | 2011-03-16 | 2012-09-20 | ソニーケミカル&インフォメーションデバイス株式会社 | 光反射性異方性導電接着剤及び発光装置 |
US9550864B2 (en) | 2011-08-10 | 2017-01-24 | University Of Virginia Patent Foundation | Viscoelastic silicon rubber compositions |
JP5912600B2 (ja) * | 2011-09-16 | 2016-04-27 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
US9484123B2 (en) | 2011-09-16 | 2016-11-01 | Prc-Desoto International, Inc. | Conductive sealant compositions |
JP2013159671A (ja) * | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
US20150041846A1 (en) * | 2012-03-28 | 2015-02-12 | Daicel Corporation | Curable epoxy resin composition |
JP5958107B2 (ja) | 2012-06-15 | 2016-07-27 | デクセリアルズ株式会社 | 光反射性異方性導電接着剤及び発光装置 |
CN102942895B (zh) * | 2012-11-15 | 2016-03-02 | 烟台德邦科技有限公司 | 一种导热电子灌封胶及其制备方法 |
CN105593265B (zh) * | 2013-09-27 | 2019-01-04 | Rimtec株式会社 | 降冰片烯类交联聚合物及其制造方法 |
JP6384046B2 (ja) * | 2013-12-06 | 2018-09-05 | デクセリアルズ株式会社 | 光反射性異方性導電接着剤及び発光装置 |
WO2015106438A1 (en) * | 2014-01-17 | 2015-07-23 | Henkel (China) Company Limited | Curable composition for optical semiconductor devices |
WO2019133947A1 (en) * | 2017-12-30 | 2019-07-04 | Saint-Gobain Performance Plastics Corporation | Heterochain polymer composition |
CN109810669B (zh) * | 2018-12-28 | 2021-07-16 | 广州市高士实业有限公司 | 一种聚硅树脂及其制备方法和应用 |
CN112979961B (zh) * | 2019-12-17 | 2022-11-04 | 中蓝晨光化工研究设计院有限公司 | 一种大分子类硅橡胶增粘剂的制备方法 |
CN112266571A (zh) * | 2020-10-26 | 2021-01-26 | 东莞市鑫聚光电科技股份有限公司 | 一种pdlc调光膜 |
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-
2003
- 2003-04-23 CN CNB03809388XA patent/CN100338141C/zh not_active Expired - Lifetime
- 2003-04-23 WO PCT/JP2003/005142 patent/WO2003091338A1/ja active IP Right Grant
- 2003-04-23 US US10/512,135 patent/US7371462B2/en not_active Expired - Lifetime
- 2003-04-23 AT AT03725638T patent/ATE383404T1/de not_active IP Right Cessation
- 2003-04-23 KR KR1020047017264A patent/KR100969175B1/ko active IP Right Grant
- 2003-04-23 EP EP20030725638 patent/EP1505121B1/de not_active Expired - Lifetime
- 2003-04-23 CA CA 2483510 patent/CA2483510A1/en not_active Abandoned
- 2003-04-23 DE DE2003618570 patent/DE60318570T2/de not_active Expired - Lifetime
- 2003-04-25 TW TW92109718A patent/TW200307726A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2003091338A1 (en) | 2003-11-06 |
EP1505121A1 (de) | 2005-02-09 |
CA2483510A1 (en) | 2003-11-06 |
CN1649964A (zh) | 2005-08-03 |
DE60318570D1 (de) | 2008-02-21 |
EP1505121B1 (de) | 2008-01-09 |
CN100338141C (zh) | 2007-09-19 |
KR20050007343A (ko) | 2005-01-17 |
TW200307726A (en) | 2003-12-16 |
US7371462B2 (en) | 2008-05-13 |
EP1505121A4 (de) | 2006-04-12 |
US20050209400A1 (en) | 2005-09-22 |
DE60318570T2 (de) | 2009-01-08 |
KR100969175B1 (ko) | 2010-07-14 |
TWI336345B (de) | 2011-01-21 |
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