ATE375003T1 - Apparat und methode zur abtrennung einer halbleiterscheibe von einem träger - Google Patents
Apparat und methode zur abtrennung einer halbleiterscheibe von einem trägerInfo
- Publication number
- ATE375003T1 ATE375003T1 AT04021396T AT04021396T ATE375003T1 AT E375003 T1 ATE375003 T1 AT E375003T1 AT 04021396 T AT04021396 T AT 04021396T AT 04021396 T AT04021396 T AT 04021396T AT E375003 T1 ATE375003 T1 AT E375003T1
- Authority
- AT
- Austria
- Prior art keywords
- separating
- adhesive sheet
- semiconductor wafer
- faced adhesive
- support
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 239000000853 adhesive Substances 0.000 abstract 9
- 230000001070 adhesive effect Effects 0.000 abstract 9
- 230000003313 weakening effect Effects 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003347059A JP4130167B2 (ja) | 2003-10-06 | 2003-10-06 | 半導体ウエハの剥離方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE375003T1 true ATE375003T1 (de) | 2007-10-15 |
Family
ID=34309180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04021396T ATE375003T1 (de) | 2003-10-06 | 2004-09-09 | Apparat und methode zur abtrennung einer halbleiterscheibe von einem träger |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7384811B2 (de) |
| EP (2) | EP1523030B1 (de) |
| JP (1) | JP4130167B2 (de) |
| KR (1) | KR101165094B1 (de) |
| CN (1) | CN100466189C (de) |
| AT (1) | ATE375003T1 (de) |
| DE (1) | DE602004009259T2 (de) |
| TW (1) | TWI286352B (de) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI271815B (en) * | 2004-11-30 | 2007-01-21 | Sanyo Electric Co | Method for processing stuck object and electrostatic sticking method |
| JP4401322B2 (ja) * | 2005-04-18 | 2010-01-20 | 日東電工株式会社 | 支持板分離装置およびこれを用いた支持板分離方法 |
| JP4885483B2 (ja) * | 2005-06-06 | 2012-02-29 | リンテック株式会社 | 転写装置とその方法、剥離装置とその方法、貼付装置とその方法 |
| JP4746003B2 (ja) * | 2007-05-07 | 2011-08-10 | リンテック株式会社 | 移載装置及び移載方法 |
| JP4826593B2 (ja) * | 2008-03-11 | 2011-11-30 | Ｔｄｋ株式会社 | 電子部品の製造方法 |
| JP4844578B2 (ja) * | 2008-03-11 | 2011-12-28 | Ｔｄｋ株式会社 | 電子部品の製造方法 |
| DE102008041250A1 (de) | 2008-08-13 | 2010-02-25 | Ers Electronic Gmbh | Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern |
| JP5203856B2 (ja) * | 2008-08-28 | 2013-06-05 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| CN102460677A (zh) * | 2009-04-16 | 2012-05-16 | 休斯微技术股份有限公司 | 用于临时晶片接合和剥离的改进装置 |
| US8950459B2 (en) | 2009-04-16 | 2015-02-10 | Suss Microtec Lithography Gmbh | Debonding temporarily bonded semiconductor wafers |
| NO20093232A1 (no) * | 2009-10-28 | 2011-04-29 | Dynatec Engineering As | Anordning for waferhandtering |
| US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
| US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
| JP2012109538A (ja) * | 2010-10-29 | 2012-06-07 | Tokyo Ohka Kogyo Co Ltd | 積層体、およびその積層体の分離方法 |
| JP5802106B2 (ja) | 2010-11-15 | 2015-10-28 | 東京応化工業株式会社 | 積層体、および分離方法 |
| CN102543662B (zh) * | 2010-12-30 | 2016-02-03 | 上海微电子装备有限公司 | 热盘及应用其的硅片加热*** |
| JP5323867B2 (ja) * | 2011-01-19 | 2013-10-23 | 東京エレクトロン株式会社 | 基板反転装置、基板反転方法、剥離システム、プログラム及びコンピュータ記憶媒体 |
| WO2012140987A1 (ja) * | 2011-04-12 | 2012-10-18 | 東京エレクトロン株式会社 | 剥離装置、剥離システム及び剥離方法 |
| JP5149977B2 (ja) * | 2011-04-15 | 2013-02-20 | リンテック株式会社 | 半導体ウエハの処理方法 |
| JP2013004845A (ja) * | 2011-06-20 | 2013-01-07 | Tokyo Electron Ltd | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
| JP5685554B2 (ja) * | 2012-01-17 | 2015-03-18 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法および剥離プログラム |
| JP2014044974A (ja) * | 2012-08-24 | 2014-03-13 | Tokyo Electron Ltd | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
| KR102211380B1 (ko) * | 2012-11-30 | 2021-02-03 | 가부시키가이샤 니콘 | 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치 |
| KR102046534B1 (ko) | 2013-01-25 | 2019-11-19 | 삼성전자주식회사 | 기판 가공 방법 |
| US9349645B2 (en) * | 2013-10-16 | 2016-05-24 | Nxp B.V. | Apparatus, device and method for wafer dicing |
| EP3161862B1 (de) | 2014-06-27 | 2018-01-31 | Thallner, Erich, Dipl.-Ing. | Verfahren zum lösen eines ersten substrats |
| CN104760400B (zh) * | 2015-04-03 | 2017-01-18 | 合肥京东方光电科技有限公司 | 拆解装置 |
| KR102313768B1 (ko) * | 2015-05-06 | 2021-10-18 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 양면 테이프 및 이를 이용한 발광소자 제조방법 |
| US20170140971A1 (en) * | 2015-11-14 | 2017-05-18 | Nachiket R. Raravikar | Adhesive with tunable adhesion for handling ultra-thin wafer |
| CN106920759B (zh) * | 2015-12-28 | 2020-04-24 | 上海新微技术研发中心有限公司 | 一种芯片保护壳去除方法及装置 |
| JP6427131B2 (ja) | 2016-03-18 | 2018-11-21 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP7234109B2 (ja) * | 2016-11-15 | 2023-03-07 | コーニング インコーポレイテッド | 基板を加工する方法 |
| CN111095489B (zh) * | 2017-09-12 | 2023-11-28 | 日本碍子株式会社 | 芯片部件的制造方法 |
| KR102505213B1 (ko) * | 2017-12-08 | 2023-03-03 | 삼성전자주식회사 | 분리용 전자 장치 및 이의 공정 방법 |
| KR20210141155A (ko) * | 2020-05-15 | 2021-11-23 | 삼성전자주식회사 | 기판 디본딩 장치 |
| DE102020003736A1 (de) | 2020-06-22 | 2021-12-23 | Mycon Gmbh | Vorrichtung und Verfahren zum bauteilschonenden Trennen von Klebverbindungen |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60216567A (ja) * | 1985-03-11 | 1985-10-30 | Hitachi Ltd | ウエハの切削装置 |
| JPH0369112A (ja) * | 1989-08-08 | 1991-03-25 | Fujitsu Ltd | ホットプレートオーブン |
| US5169196A (en) * | 1991-06-17 | 1992-12-08 | Safabakhsh Ali R | Non-contact pick-up head |
| KR0129119B1 (ko) * | 1992-11-27 | 1998-04-07 | 모리시다 요이찌 | 반도체칩의 제거방법 및 제거장치 |
| KR0144164B1 (ko) * | 1995-05-12 | 1998-07-01 | 문정환 | 엘오씨 반도체 패키지 및 반도체 장치를 패키징하는 방법 |
| SG67458A1 (en) * | 1996-12-18 | 1999-09-21 | Canon Kk | Process for producing semiconductor article |
| US6017776A (en) * | 1997-04-29 | 2000-01-25 | Micron Technology, Inc. | Method of attaching a leadframe to singulated semiconductor dice |
| KR100278137B1 (ko) * | 1997-09-04 | 2001-01-15 | 가나이 쓰도무 | 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법 |
| JP2000036501A (ja) * | 1998-05-12 | 2000-02-02 | Sharp Corp | ダイボンド装置 |
| JP3816253B2 (ja) * | 1999-01-19 | 2006-08-30 | 富士通株式会社 | 半導体装置の製造方法 |
| JP4275254B2 (ja) * | 1999-06-17 | 2009-06-10 | リンテック株式会社 | 両面粘着シートに固定された物品の剥離方法および剥離装置 |
| JP3597754B2 (ja) * | 2000-04-24 | 2004-12-08 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| JP4456234B2 (ja) * | 2000-07-04 | 2010-04-28 | パナソニック株式会社 | バンプ形成方法 |
| US6319754B1 (en) * | 2000-07-10 | 2001-11-20 | Advanced Semiconductor Engineering, Inc. | Wafer-dicing process |
| JP3906962B2 (ja) * | 2000-08-31 | 2007-04-18 | リンテック株式会社 | 半導体装置の製造方法 |
| DE10048881A1 (de) * | 2000-09-29 | 2002-03-07 | Infineon Technologies Ag | Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers |
| JP3748375B2 (ja) * | 2000-11-24 | 2006-02-22 | シャープ株式会社 | 半導体チップのピックアップ装置 |
| JP2002237515A (ja) * | 2001-02-07 | 2002-08-23 | Mitsubishi Gas Chem Co Inc | 薄葉化半導体基板の剥離装置および剥離法 |
| JP4482243B2 (ja) * | 2001-03-13 | 2010-06-16 | 株式会社新川 | ダイのピックアップ方法及びピックアップ装置 |
| JP3800977B2 (ja) * | 2001-04-11 | 2006-07-26 | 株式会社日立製作所 | Ｚｎ−Ａｌ系はんだを用いた製品 |
| DE10128923A1 (de) * | 2001-06-15 | 2003-01-23 | Philips Corp Intellectual Pty | Verfahren zum Umsetzen eines im wesentlichen scheibenförmigen Werkstücks und Vorrichtung zur Durchführung dieses Verfahrens |
| JP4266106B2 (ja) * | 2001-09-27 | 2009-05-20 | 株式会社東芝 | 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法 |
| US7332819B2 (en) * | 2002-01-09 | 2008-02-19 | Micron Technology, Inc. | Stacked die in die BGA package |
| DE10212420A1 (de) * | 2002-03-21 | 2003-10-16 | Erich Thallner | Einrichtung zur Aufnahme eines Wafers |
| US6861321B2 (en) * | 2002-04-05 | 2005-03-01 | Asm America, Inc. | Method of loading a wafer onto a wafer holder to reduce thermal shock |
| JP3831287B2 (ja) * | 2002-04-08 | 2006-10-11 | 株式会社日立製作所 | 半導体装置の製造方法 |
| JP3704113B2 (ja) * | 2002-09-26 | 2005-10-05 | 住友大阪セメント株式会社 | ボンディングステージ及び電子部品実装装置 |
| KR100480628B1 (ko) * | 2002-11-11 | 2005-03-31 | 삼성전자주식회사 | 에어 블로잉을 이용한 칩 픽업 방법 및 장치 |
| US20050056946A1 (en) * | 2003-09-16 | 2005-03-17 | Cookson Electronics, Inc. | Electrical circuit assembly with improved shock resistance |
-
2003
- 2003-10-06 JP JP2003347059A patent/JP4130167B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-09 DE DE602004009259T patent/DE602004009259T2/de not_active Expired - Fee Related
- 2004-09-09 EP EP04021396A patent/EP1523030B1/de not_active Expired - Fee Related
- 2004-09-09 EP EP07004502A patent/EP1793415A1/de not_active Withdrawn
- 2004-09-09 AT AT04021396T patent/ATE375003T1/de not_active IP Right Cessation
- 2004-09-13 US US10/938,645 patent/US7384811B2/en not_active Expired - Fee Related
- 2004-09-20 TW TW093128372A patent/TWI286352B/zh not_active IP Right Cessation
- 2004-09-30 CN CNB2004100834438A patent/CN100466189C/zh not_active Expired - Fee Related
- 2004-10-01 KR KR1020040078197A patent/KR101165094B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1523030A3 (de) | 2005-08-31 |
| EP1523030A2 (de) | 2005-04-13 |
| KR101165094B1 (ko) | 2012-07-12 |
| CN1606134A (zh) | 2005-04-13 |
| CN100466189C (zh) | 2009-03-04 |
| TWI286352B (en) | 2007-09-01 |
| DE602004009259T2 (de) | 2008-07-10 |
| EP1793415A1 (de) | 2007-06-06 |
| EP1523030B1 (de) | 2007-10-03 |
| KR20050033440A (ko) | 2005-04-12 |
| US7384811B2 (en) | 2008-06-10 |
| US20050074952A1 (en) | 2005-04-07 |
| JP4130167B2 (ja) | 2008-08-06 |
| DE602004009259D1 (de) | 2007-11-15 |
| JP2005116678A (ja) | 2005-04-28 |
| TW200520083A (en) | 2005-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 1523030 Country of ref document: EP |
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| REN | Ceased due to non-payment of the annual fee |