ATE343825T1 - Herstellungsverfahren eines bandes - Google Patents
Herstellungsverfahren eines bandesInfo
- Publication number
- ATE343825T1 ATE343825T1 AT03735897T AT03735897T ATE343825T1 AT E343825 T1 ATE343825 T1 AT E343825T1 AT 03735897 T AT03735897 T AT 03735897T AT 03735897 T AT03735897 T AT 03735897T AT E343825 T1 ATE343825 T1 AT E343825T1
- Authority
- AT
- Austria
- Prior art keywords
- tape
- glued
- glue
- state
- solid state
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Decoration Of Textiles (AREA)
- Transplanting Machines (AREA)
- Ropes Or Cables (AREA)
- Magnetic Heads (AREA)
- Materials For Medical Uses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02291536A EP1376462A1 (de) | 2002-06-19 | 2002-06-19 | Verfahren zur Herstellung eines Bandes |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE343825T1 true ATE343825T1 (de) | 2006-11-15 |
Family
ID=29716944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03735897T ATE343825T1 (de) | 2002-06-19 | 2003-06-17 | Herstellungsverfahren eines bandes |
Country Status (8)
Country | Link |
---|---|
US (1) | US20060163366A1 (de) |
EP (2) | EP1376462A1 (de) |
JP (1) | JP2005530019A (de) |
CN (1) | CN1662928A (de) |
AT (1) | ATE343825T1 (de) |
AU (1) | AU2003236986A1 (de) |
DE (1) | DE60309321T2 (de) |
WO (1) | WO2004001663A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1615166A1 (de) * | 2004-07-07 | 2006-01-11 | Axalto S.A. | Trägerband für Chipmodule und Herstellungsverfahren für Chipkarten |
US8430264B2 (en) | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
US8205766B2 (en) | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
FR2980015B1 (fr) * | 2011-09-08 | 2013-11-22 | Sansystems | Dispositif electronique a puce et procede de fabrication par bobines |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
FR2620586A1 (fr) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits |
CA2083772A1 (en) * | 1991-12-04 | 1993-06-05 | Nancy J. Mccullough | Reel for applying topical substances to base products |
US5904953A (en) * | 1997-02-19 | 1999-05-18 | Abb Power T&D Company Inc | Insulated metallic strip and method for producing same |
BR9804917A (pt) * | 1997-05-19 | 2000-01-25 | Hitachi Maxell Ltda | Módulo de circuito integrado flexìvel e processos para produzir um módulo de circuito integrado flexìvel e um portador de informação. |
JP4588139B2 (ja) * | 1999-08-31 | 2010-11-24 | リンテック株式会社 | Icカードの製造方法 |
JP3542080B2 (ja) * | 2001-03-30 | 2004-07-14 | リンテック株式会社 | 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体 |
US20030132528A1 (en) * | 2001-12-28 | 2003-07-17 | Jimmy Liang | Method and apparatus for flip chip device assembly by radiant heating |
-
2002
- 2002-06-19 EP EP02291536A patent/EP1376462A1/de not_active Withdrawn
-
2003
- 2003-06-17 DE DE60309321T patent/DE60309321T2/de not_active Expired - Fee Related
- 2003-06-17 US US10/517,879 patent/US20060163366A1/en not_active Abandoned
- 2003-06-17 CN CN03814414.XA patent/CN1662928A/zh active Pending
- 2003-06-17 EP EP03735897A patent/EP1514234B1/de not_active Expired - Lifetime
- 2003-06-17 JP JP2004515163A patent/JP2005530019A/ja active Pending
- 2003-06-17 AT AT03735897T patent/ATE343825T1/de not_active IP Right Cessation
- 2003-06-17 AU AU2003236986A patent/AU2003236986A1/en not_active Abandoned
- 2003-06-17 WO PCT/IB2003/002654 patent/WO2004001663A1/en active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
DE60309321D1 (de) | 2006-12-07 |
JP2005530019A (ja) | 2005-10-06 |
CN1662928A (zh) | 2005-08-31 |
WO2004001663A1 (en) | 2003-12-31 |
EP1376462A1 (de) | 2004-01-02 |
DE60309321T2 (de) | 2007-05-31 |
EP1514234A1 (de) | 2005-03-16 |
EP1514234B1 (de) | 2006-10-25 |
US20060163366A1 (en) | 2006-07-27 |
AU2003236986A1 (en) | 2004-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
Ref document number: 1514234 Country of ref document: EP |
|
REN | Ceased due to non-payment of the annual fee |