ATE343825T1 - Herstellungsverfahren eines bandes - Google Patents

Herstellungsverfahren eines bandes

Info

Publication number
ATE343825T1
ATE343825T1 AT03735897T AT03735897T ATE343825T1 AT E343825 T1 ATE343825 T1 AT E343825T1 AT 03735897 T AT03735897 T AT 03735897T AT 03735897 T AT03735897 T AT 03735897T AT E343825 T1 ATE343825 T1 AT E343825T1
Authority
AT
Austria
Prior art keywords
tape
glued
glue
state
solid state
Prior art date
Application number
AT03735897T
Other languages
English (en)
Inventor
Jean-Noel Audoux
Guillaume Ligneau
Yves Reignoux
Original Assignee
Axalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axalto Sa filed Critical Axalto Sa
Application granted granted Critical
Publication of ATE343825T1 publication Critical patent/ATE343825T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Decoration Of Textiles (AREA)
  • Transplanting Machines (AREA)
  • Ropes Or Cables (AREA)
  • Magnetic Heads (AREA)
  • Materials For Medical Uses (AREA)
AT03735897T 2002-06-19 2003-06-17 Herstellungsverfahren eines bandes ATE343825T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02291536A EP1376462A1 (de) 2002-06-19 2002-06-19 Verfahren zur Herstellung eines Bandes

Publications (1)

Publication Number Publication Date
ATE343825T1 true ATE343825T1 (de) 2006-11-15

Family

ID=29716944

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03735897T ATE343825T1 (de) 2002-06-19 2003-06-17 Herstellungsverfahren eines bandes

Country Status (8)

Country Link
US (1) US20060163366A1 (de)
EP (2) EP1376462A1 (de)
JP (1) JP2005530019A (de)
CN (1) CN1662928A (de)
AT (1) ATE343825T1 (de)
AU (1) AU2003236986A1 (de)
DE (1) DE60309321T2 (de)
WO (1) WO2004001663A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1615166A1 (de) * 2004-07-07 2006-01-11 Axalto S.A. Trägerband für Chipmodule und Herstellungsverfahren für Chipkarten
US8430264B2 (en) 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
US8205766B2 (en) 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
FR2980015B1 (fr) * 2011-09-08 2013-11-22 Sansystems Dispositif electronique a puce et procede de fabrication par bobines

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
CA2083772A1 (en) * 1991-12-04 1993-06-05 Nancy J. Mccullough Reel for applying topical substances to base products
US5904953A (en) * 1997-02-19 1999-05-18 Abb Power T&D Company Inc Insulated metallic strip and method for producing same
BR9804917A (pt) * 1997-05-19 2000-01-25 Hitachi Maxell Ltda Módulo de circuito integrado flexìvel e processos para produzir um módulo de circuito integrado flexìvel e um portador de informação.
JP4588139B2 (ja) * 1999-08-31 2010-11-24 リンテック株式会社 Ｉｃカードの製造方法
JP3542080B2 (ja) * 2001-03-30 2004-07-14 リンテック株式会社 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
US20030132528A1 (en) * 2001-12-28 2003-07-17 Jimmy Liang Method and apparatus for flip chip device assembly by radiant heating

Also Published As

Publication number Publication date
DE60309321D1 (de) 2006-12-07
JP2005530019A (ja) 2005-10-06
CN1662928A (zh) 2005-08-31
WO2004001663A1 (en) 2003-12-31
EP1376462A1 (de) 2004-01-02
DE60309321T2 (de) 2007-05-31
EP1514234A1 (de) 2005-03-16
EP1514234B1 (de) 2006-10-25
US20060163366A1 (en) 2006-07-27
AU2003236986A1 (en) 2004-01-06

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