ATE301525T1 - Mit geschlossenem regelkreis kontrollsystem der lötenwellenhöhe - Google Patents

Mit geschlossenem regelkreis kontrollsystem der lötenwellenhöhe

Info

Publication number
ATE301525T1
ATE301525T1 AT00936504T AT00936504T ATE301525T1 AT E301525 T1 ATE301525 T1 AT E301525T1 AT 00936504 T AT00936504 T AT 00936504T AT 00936504 T AT00936504 T AT 00936504T AT E301525 T1 ATE301525 T1 AT E301525T1
Authority
AT
Austria
Prior art keywords
micro
solder
wave height
controller
printed circuit
Prior art date
Application number
AT00936504T
Other languages
English (en)
Inventor
Gerald L Leap
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Application granted granted Critical
Publication of ATE301525T1 publication Critical patent/ATE301525T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Radiation-Therapy Devices (AREA)
AT00936504T 1999-06-02 2000-06-02 Mit geschlossenem regelkreis kontrollsystem der lötenwellenhöhe ATE301525T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13718299P 1999-06-02 1999-06-02
PCT/US2000/040028 WO2000073009A1 (en) 1999-06-02 2000-06-02 Closed loop solder wave height control system

Publications (1)

Publication Number Publication Date
ATE301525T1 true ATE301525T1 (de) 2005-08-15

Family

ID=22476160

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00936504T ATE301525T1 (de) 1999-06-02 2000-06-02 Mit geschlossenem regelkreis kontrollsystem der lötenwellenhöhe

Country Status (9)

Country Link
US (2) US6415972B1 (de)
EP (1) EP1189721B1 (de)
AT (1) ATE301525T1 (de)
AU (1) AU5180900A (de)
CA (1) CA2375664C (de)
DE (1) DE60021887T2 (de)
MY (2) MY124967A (de)
TW (1) TWI247562B (de)
WO (1) WO2000073009A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213738B2 (en) * 2002-09-30 2007-05-08 Speedline Technologies, Inc. Selective wave solder system
US20060186183A1 (en) * 2005-02-18 2006-08-24 Speedline Technologies, Inc. Wave solder nozzle
US7560371B2 (en) * 2006-08-29 2009-07-14 Micron Technology, Inc. Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
US20080302861A1 (en) * 2007-06-11 2008-12-11 Szymanowski Richard A Method and apparatus for wave soldering an electronic substrate
CN101700593B (zh) * 2009-11-25 2011-08-24 深圳市诺斯达科技有限公司 波峰焊接机及其机械爪
CN102564285A (zh) * 2010-12-10 2012-07-11 西安中科麦特电子技术设备有限公司 波峰焊机导轨宽度测试装置
CN103433590B (zh) * 2013-09-12 2015-11-18 海宁市美裕晟电子有限公司 一种波峰焊机
US20150128856A1 (en) * 2013-11-14 2015-05-14 Illinois Tool Works Inc. Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus
US9370838B2 (en) 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
WO2016133560A1 (en) * 2015-02-16 2016-08-25 Therabron Therapeutics, Inc. Recombinant human cc10 protein for treatment of influenza and ebola
US10029326B2 (en) 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
DE102017115534B4 (de) * 2017-07-11 2020-02-27 Ersa Gmbh Lötanlage zum selektiven Wellenlöten mit einer Vorrichtung und einem Verfahren zur Überwachung eines Zustands eines Sprühstrahls.
JP6508299B1 (ja) * 2017-11-29 2019-05-08 千住金属工業株式会社 噴流はんだ高さ確認治具及びその取り扱い方法
US10780516B2 (en) 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
DE102018129201A1 (de) 2018-11-20 2020-05-20 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Messen der Höhe einer Lötwelle
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3848864A (en) * 1972-11-21 1974-11-19 Itt Fingers employing inserts to support work pieces in a flow solder machine
US4447001A (en) 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
US4563643A (en) * 1982-07-30 1986-01-07 Westinghouse Electric Corp. Eddy current proximity sensor for use in a hostile turbine environment
US4666077A (en) 1983-02-28 1987-05-19 Electrovert Solder pot for wave soldering machine
US4632291A (en) 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
US5611475A (en) 1986-07-11 1997-03-18 Sun Industrial Coatings Private Ltd. Soldering apparatus
US4890781A (en) * 1988-08-04 1990-01-02 Texas Instruments Incorporated Automated flow solder machine
US5567398A (en) 1990-04-03 1996-10-22 The Standard Oil Company Endothermic reaction apparatus and method
US5292055A (en) * 1991-12-06 1994-03-08 Electrovert Ltd. Gas shrouded wave improvement
IL100838A (en) 1992-01-31 1995-06-29 Sasson Shay Solder wave parameters analyzer
US5572119A (en) * 1994-10-28 1996-11-05 Barber-Colman Company Eddy current position sensor including an insulating base having conductive surfaces for electrically connecting a coil to the lead wires
US5533663A (en) * 1994-11-21 1996-07-09 At&T Corp. Solder wave measurement device
US5538175A (en) * 1994-11-21 1996-07-23 At&T Corp. Adjustment of a solder wave process in real-time
DE19506763A1 (de) * 1995-02-27 1996-08-29 Linde Ag Verfahren zum Löten bestückter Leiterplatten und dergleichen
NL9500425A (nl) * 1995-03-03 1996-10-01 Soltec Bv Inrichting voor het meten van de hoogte van een soldeergolf.
DE19535688A1 (de) 1995-09-26 1997-03-27 Philips Patentverwaltung Wellenlötmaschine und Verfahren zur Einstellung und automatischen Kontrolle der Höhe einer Lötwelle
FR2748410B1 (fr) * 1996-05-07 1998-06-05 Air Liquide Procede et machine de brasage ou etamage a la vague
US5889200A (en) 1996-08-30 1999-03-30 The University Of Dayton Tandem technique for fluid monitoring
US5794837A (en) 1996-11-25 1998-08-18 Delco Electronics Corporation Directional flow control device for a wave soldering apparatus
JP3592486B2 (ja) * 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
JP3306468B2 (ja) * 1997-10-30 2002-07-24 セレスティカ・ジャパン・イーエムエス株式会社 自動ハンダ付け機構及びその機構を用いる装置並びにそのハンダ付け方法
JP4238400B2 (ja) * 1998-01-14 2009-03-18 株式会社デンソー 噴流半田付け方法及びその装置
US5967398A (en) * 1998-02-26 1999-10-19 Fritz & Hill Corporation Breakaway mounting device for use with printed circuit board flow solder machines
US5979740A (en) * 1998-03-04 1999-11-09 Rooks; Bobby J. Solder wave height set-up gauge

Also Published As

Publication number Publication date
DE60021887T2 (de) 2006-06-01
EP1189721A1 (de) 2002-03-27
WO2000073009A1 (en) 2000-12-07
US6415972B1 (en) 2002-07-09
DE60021887D1 (de) 2005-09-15
MY127389A (en) 2006-11-30
CA2375664A1 (en) 2000-12-07
AU5180900A (en) 2000-12-18
US6726083B2 (en) 2004-04-27
TWI247562B (en) 2006-01-11
EP1189721B1 (de) 2005-08-10
MY124967A (en) 2006-07-31
US20030057257A1 (en) 2003-03-27
CA2375664C (en) 2008-02-19

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties