ATE301525T1 - Mit geschlossenem regelkreis kontrollsystem der lötenwellenhöhe - Google Patents
Mit geschlossenem regelkreis kontrollsystem der lötenwellenhöheInfo
- Publication number
- ATE301525T1 ATE301525T1 AT00936504T AT00936504T ATE301525T1 AT E301525 T1 ATE301525 T1 AT E301525T1 AT 00936504 T AT00936504 T AT 00936504T AT 00936504 T AT00936504 T AT 00936504T AT E301525 T1 ATE301525 T1 AT E301525T1
- Authority
- AT
- Austria
- Prior art keywords
- micro
- solder
- wave height
- controller
- printed circuit
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 8
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
- Radiation-Therapy Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13718299P | 1999-06-02 | 1999-06-02 | |
PCT/US2000/040028 WO2000073009A1 (en) | 1999-06-02 | 2000-06-02 | Closed loop solder wave height control system |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE301525T1 true ATE301525T1 (de) | 2005-08-15 |
Family
ID=22476160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00936504T ATE301525T1 (de) | 1999-06-02 | 2000-06-02 | Mit geschlossenem regelkreis kontrollsystem der lötenwellenhöhe |
Country Status (9)
Country | Link |
---|---|
US (2) | US6415972B1 (de) |
EP (1) | EP1189721B1 (de) |
AT (1) | ATE301525T1 (de) |
AU (1) | AU5180900A (de) |
CA (1) | CA2375664C (de) |
DE (1) | DE60021887T2 (de) |
MY (2) | MY124967A (de) |
TW (1) | TWI247562B (de) |
WO (1) | WO2000073009A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7213738B2 (en) * | 2002-09-30 | 2007-05-08 | Speedline Technologies, Inc. | Selective wave solder system |
US20060186183A1 (en) * | 2005-02-18 | 2006-08-24 | Speedline Technologies, Inc. | Wave solder nozzle |
US7560371B2 (en) * | 2006-08-29 | 2009-07-14 | Micron Technology, Inc. | Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum |
US20080302861A1 (en) * | 2007-06-11 | 2008-12-11 | Szymanowski Richard A | Method and apparatus for wave soldering an electronic substrate |
CN101700593B (zh) * | 2009-11-25 | 2011-08-24 | 深圳市诺斯达科技有限公司 | 波峰焊接机及其机械爪 |
CN102564285A (zh) * | 2010-12-10 | 2012-07-11 | 西安中科麦特电子技术设备有限公司 | 波峰焊机导轨宽度测试装置 |
CN103433590B (zh) * | 2013-09-12 | 2015-11-18 | 海宁市美裕晟电子有限公司 | 一种波峰焊机 |
US20150128856A1 (en) * | 2013-11-14 | 2015-05-14 | Illinois Tool Works Inc. | Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus |
US9370838B2 (en) | 2014-08-21 | 2016-06-21 | Illinois Tool Works Inc. | Wave soldering nozzle system and method of wave soldering |
WO2016133560A1 (en) * | 2015-02-16 | 2016-08-25 | Therabron Therapeutics, Inc. | Recombinant human cc10 protein for treatment of influenza and ebola |
US10029326B2 (en) | 2016-10-26 | 2018-07-24 | Illinois Tool Works Inc. | Wave soldering nozzle having automatic adjustable throat width |
DE102017115534B4 (de) * | 2017-07-11 | 2020-02-27 | Ersa Gmbh | Lötanlage zum selektiven Wellenlöten mit einer Vorrichtung und einem Verfahren zur Überwachung eines Zustands eines Sprühstrahls. |
JP6508299B1 (ja) * | 2017-11-29 | 2019-05-08 | 千住金属工業株式会社 | 噴流はんだ高さ確認治具及びその取り扱い方法 |
US10780516B2 (en) | 2018-06-14 | 2020-09-22 | Illinois Tool Works Inc. | Wave solder nozzle with automated adjustable sliding plate to vary solder wave width |
DE102018129201A1 (de) | 2018-11-20 | 2020-05-20 | Seho Systemtechnik Gmbh | Verfahren und Vorrichtung zum Messen der Höhe einer Lötwelle |
US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3848864A (en) * | 1972-11-21 | 1974-11-19 | Itt | Fingers employing inserts to support work pieces in a flow solder machine |
US4447001A (en) | 1980-12-11 | 1984-05-08 | Banner/Technical Devices Company, Inc. | Adjustably dimensioned uniformly distributed solder wave apparatus |
US4563643A (en) * | 1982-07-30 | 1986-01-07 | Westinghouse Electric Corp. | Eddy current proximity sensor for use in a hostile turbine environment |
US4666077A (en) | 1983-02-28 | 1987-05-19 | Electrovert | Solder pot for wave soldering machine |
US4632291A (en) | 1983-02-28 | 1986-12-30 | Electrovert Ltd. | Automatic wave soldering machine |
US5611475A (en) | 1986-07-11 | 1997-03-18 | Sun Industrial Coatings Private Ltd. | Soldering apparatus |
US4890781A (en) * | 1988-08-04 | 1990-01-02 | Texas Instruments Incorporated | Automated flow solder machine |
US5567398A (en) | 1990-04-03 | 1996-10-22 | The Standard Oil Company | Endothermic reaction apparatus and method |
US5292055A (en) * | 1991-12-06 | 1994-03-08 | Electrovert Ltd. | Gas shrouded wave improvement |
IL100838A (en) | 1992-01-31 | 1995-06-29 | Sasson Shay | Solder wave parameters analyzer |
US5572119A (en) * | 1994-10-28 | 1996-11-05 | Barber-Colman Company | Eddy current position sensor including an insulating base having conductive surfaces for electrically connecting a coil to the lead wires |
US5533663A (en) * | 1994-11-21 | 1996-07-09 | At&T Corp. | Solder wave measurement device |
US5538175A (en) * | 1994-11-21 | 1996-07-23 | At&T Corp. | Adjustment of a solder wave process in real-time |
DE19506763A1 (de) * | 1995-02-27 | 1996-08-29 | Linde Ag | Verfahren zum Löten bestückter Leiterplatten und dergleichen |
NL9500425A (nl) * | 1995-03-03 | 1996-10-01 | Soltec Bv | Inrichting voor het meten van de hoogte van een soldeergolf. |
DE19535688A1 (de) | 1995-09-26 | 1997-03-27 | Philips Patentverwaltung | Wellenlötmaschine und Verfahren zur Einstellung und automatischen Kontrolle der Höhe einer Lötwelle |
FR2748410B1 (fr) * | 1996-05-07 | 1998-06-05 | Air Liquide | Procede et machine de brasage ou etamage a la vague |
US5889200A (en) | 1996-08-30 | 1999-03-30 | The University Of Dayton | Tandem technique for fluid monitoring |
US5794837A (en) | 1996-11-25 | 1998-08-18 | Delco Electronics Corporation | Directional flow control device for a wave soldering apparatus |
JP3592486B2 (ja) * | 1997-06-18 | 2004-11-24 | 株式会社東芝 | ハンダ付け装置 |
JP3306468B2 (ja) * | 1997-10-30 | 2002-07-24 | セレスティカ・ジャパン・イーエムエス株式会社 | 自動ハンダ付け機構及びその機構を用いる装置並びにそのハンダ付け方法 |
JP4238400B2 (ja) * | 1998-01-14 | 2009-03-18 | 株式会社デンソー | 噴流半田付け方法及びその装置 |
US5967398A (en) * | 1998-02-26 | 1999-10-19 | Fritz & Hill Corporation | Breakaway mounting device for use with printed circuit board flow solder machines |
US5979740A (en) * | 1998-03-04 | 1999-11-09 | Rooks; Bobby J. | Solder wave height set-up gauge |
-
2000
- 2000-06-02 MY MYPI20002491 patent/MY124967A/en unknown
- 2000-06-02 EP EP00936504A patent/EP1189721B1/de not_active Expired - Lifetime
- 2000-06-02 US US09/585,934 patent/US6415972B1/en not_active Expired - Lifetime
- 2000-06-02 AT AT00936504T patent/ATE301525T1/de not_active IP Right Cessation
- 2000-06-02 AU AU51809/00A patent/AU5180900A/en not_active Abandoned
- 2000-06-02 CA CA002375664A patent/CA2375664C/en not_active Expired - Lifetime
- 2000-06-02 MY MYPI20050023A patent/MY127389A/en unknown
- 2000-06-02 WO PCT/US2000/040028 patent/WO2000073009A1/en active IP Right Grant
- 2000-06-02 DE DE60021887T patent/DE60021887T2/de not_active Expired - Lifetime
- 2000-06-02 TW TW089110822A patent/TWI247562B/zh not_active IP Right Cessation
-
2002
- 2002-07-08 US US10/190,900 patent/US6726083B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60021887T2 (de) | 2006-06-01 |
EP1189721A1 (de) | 2002-03-27 |
WO2000073009A1 (en) | 2000-12-07 |
US6415972B1 (en) | 2002-07-09 |
DE60021887D1 (de) | 2005-09-15 |
MY127389A (en) | 2006-11-30 |
CA2375664A1 (en) | 2000-12-07 |
AU5180900A (en) | 2000-12-18 |
US6726083B2 (en) | 2004-04-27 |
TWI247562B (en) | 2006-01-11 |
EP1189721B1 (de) | 2005-08-10 |
MY124967A (en) | 2006-07-31 |
US20030057257A1 (en) | 2003-03-27 |
CA2375664C (en) | 2008-02-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |