ATE242064T1 - Vorrichtung zum laden von halbleiterscheiben - Google Patents

Vorrichtung zum laden von halbleiterscheiben

Info

Publication number
ATE242064T1
ATE242064T1 AT99906813T AT99906813T ATE242064T1 AT E242064 T1 ATE242064 T1 AT E242064T1 AT 99906813 T AT99906813 T AT 99906813T AT 99906813 T AT99906813 T AT 99906813T AT E242064 T1 ATE242064 T1 AT E242064T1
Authority
AT
Austria
Prior art keywords
wafer
present
load station
descend
nozzles
Prior art date
Application number
AT99906813T
Other languages
English (en)
Inventor
Michael R Vogtmann
Terry L Lentz
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE242064T1 publication Critical patent/ATE242064T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/006—Arrangements for observing, indicating or measuring on machine tools for indicating the presence of a work or tool in its holder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT99906813T 1998-02-14 1999-02-09 Vorrichtung zum laden von halbleiterscheiben ATE242064T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7512998P 1998-02-14 1998-02-14
PCT/US1999/002699 WO1999041022A1 (en) 1998-02-14 1999-02-09 Accurate positioning of a wafer

Publications (1)

Publication Number Publication Date
ATE242064T1 true ATE242064T1 (de) 2003-06-15

Family

ID=22123745

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99906813T ATE242064T1 (de) 1998-02-14 1999-02-09 Vorrichtung zum laden von halbleiterscheiben

Country Status (7)

Country Link
US (7) US6131589A (de)
EP (1) EP1084001B1 (de)
JP (1) JP2002503044A (de)
KR (1) KR100545680B1 (de)
AT (1) ATE242064T1 (de)
DE (1) DE69908591T2 (de)
WO (1) WO1999041022A1 (de)

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US7044832B2 (en) 2003-11-17 2006-05-16 Applied Materials Load cup for chemical mechanical polishing
US7648622B2 (en) * 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US20060066333A1 (en) * 2004-09-30 2006-03-30 Jian-Huei Feng System and method for aligning wafers
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DE102004057215B4 (de) * 2004-11-26 2008-12-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer Sondenkarte unter Verwendung eines temperierten Fluidstrahls
US20070169700A1 (en) * 2006-01-26 2007-07-26 Gert-Jan Sniders Sensing system and method for determining the alignment of a substrate holder in a batch reactor
JP2007234882A (ja) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板取り扱い方法
KR100739100B1 (ko) * 2006-03-08 2007-07-12 주식회사 디엠에스 기판이송장치
JP5033354B2 (ja) * 2006-05-29 2012-09-26 不二越機械工業株式会社 ワークセンタリング装置
US8057601B2 (en) 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
US8057602B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
JP2009111024A (ja) * 2007-10-26 2009-05-21 Applied Materials Inc 化学機械研磨装置の基板支持部材、および化学機械研磨装置
KR101489963B1 (ko) * 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
US8273178B2 (en) * 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US8454408B2 (en) 2008-11-26 2013-06-04 Applied Materials, Inc. Load cup substrate sensing
CN103293862B (zh) * 2012-02-22 2015-04-15 上海微电子装备有限公司 硅片边缘保护装置
JP6027454B2 (ja) * 2013-02-05 2016-11-16 株式会社荏原製作所 研磨装置
JP6145334B2 (ja) * 2013-06-28 2017-06-07 株式会社荏原製作所 基板処理装置
US10269557B2 (en) * 2015-10-20 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus of processing semiconductor substrate
US10373858B2 (en) 2016-04-06 2019-08-06 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal
CN206692727U (zh) * 2017-04-28 2017-12-01 京东方科技集团股份有限公司 一种基板承载组件及磁控溅射装置
US10792736B1 (en) * 2018-05-26 2020-10-06 Kitagawa-Northtech, Inc. Lightweight intelligent top-tooling apparatus
CN110103119A (zh) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 一种抛光装卸部件模块
JP7052771B2 (ja) * 2019-04-15 2022-04-12 株式会社Sumco 片面研磨装置へのウェーハ装填装置
CN110860502B (zh) * 2019-12-25 2021-07-16 徐州双裕电子技术有限公司 一种自动清灰传感器

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Also Published As

Publication number Publication date
US6131589A (en) 2000-10-17
US6267642B1 (en) 2001-07-31
WO1999041022A1 (en) 1999-08-19
DE69908591T2 (de) 2004-04-29
JP2002503044A (ja) 2002-01-29
KR20010040804A (ko) 2001-05-15
US6796881B1 (en) 2004-09-28
EP1084001B1 (de) 2003-06-04
EP1084001A4 (de) 2001-04-18
US6102057A (en) 2000-08-15
US6405740B1 (en) 2002-06-18
DE69908591D1 (de) 2003-07-10
US6283827B1 (en) 2001-09-04
KR100545680B1 (ko) 2006-01-24
EP1084001A1 (de) 2001-03-21
US6505635B1 (en) 2003-01-14

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