ATE222523T1 - Verfahren und vorrichtung zum überwachen der dicke mit einem mehrwellenlängen-spektrometer in einem chemisch-mechanischen polierverfahren - Google Patents
Verfahren und vorrichtung zum überwachen der dicke mit einem mehrwellenlängen-spektrometer in einem chemisch-mechanischen polierverfahrenInfo
- Publication number
- ATE222523T1 ATE222523T1 AT98304212T AT98304212T ATE222523T1 AT E222523 T1 ATE222523 T1 AT E222523T1 AT 98304212 T AT98304212 T AT 98304212T AT 98304212 T AT98304212 T AT 98304212T AT E222523 T1 ATE222523 T1 AT E222523T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- removal rate
- monitoring
- mechanical polishing
- film thickness
- Prior art date
Links
- 238000012544 monitoring process Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 238000007517 polishing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
- 238000005498 polishing Methods 0.000 abstract 2
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/863,644 US6111634A (en) | 1997-05-28 | 1997-05-28 | Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE222523T1 true ATE222523T1 (de) | 2002-09-15 |
Family
ID=25341477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT98304212T ATE222523T1 (de) | 1997-05-28 | 1998-05-28 | Verfahren und vorrichtung zum überwachen der dicke mit einem mehrwellenlängen-spektrometer in einem chemisch-mechanischen polierverfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US6111634A (de) |
EP (1) | EP0881040B1 (de) |
JP (1) | JPH1177525A (de) |
KR (1) | KR100510919B1 (de) |
AT (1) | ATE222523T1 (de) |
DE (1) | DE69807287T2 (de) |
TW (1) | TW455937B (de) |
Families Citing this family (108)
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-
1997
- 1997-05-28 US US08/863,644 patent/US6111634A/en not_active Expired - Lifetime
-
1998
- 1998-05-28 JP JP18677698A patent/JPH1177525A/ja active Pending
- 1998-05-28 EP EP98304212A patent/EP0881040B1/de not_active Expired - Lifetime
- 1998-05-28 KR KR10-1998-0020320A patent/KR100510919B1/ko not_active IP Right Cessation
- 1998-05-28 AT AT98304212T patent/ATE222523T1/de not_active IP Right Cessation
- 1998-05-28 DE DE69807287T patent/DE69807287T2/de not_active Expired - Fee Related
- 1998-11-24 TW TW087108350A patent/TW455937B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0881040B1 (de) | 2002-08-21 |
TW455937B (en) | 2001-09-21 |
EP0881040A3 (de) | 1999-08-11 |
EP0881040A2 (de) | 1998-12-02 |
DE69807287D1 (de) | 2002-09-26 |
US6111634A (en) | 2000-08-29 |
JPH1177525A (ja) | 1999-03-23 |
KR19980087551A (ko) | 1998-12-05 |
DE69807287T2 (de) | 2003-03-20 |
KR100510919B1 (ko) | 2005-11-22 |
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