ATE146304T1 - DEVICE AND METHOD FOR DEPOSING A FINE METAL LINE ON A SUBSTRATE - Google Patents
DEVICE AND METHOD FOR DEPOSING A FINE METAL LINE ON A SUBSTRATEInfo
- Publication number
- ATE146304T1 ATE146304T1 AT93480106T AT93480106T ATE146304T1 AT E146304 T1 ATE146304 T1 AT E146304T1 AT 93480106 T AT93480106 T AT 93480106T AT 93480106 T AT93480106 T AT 93480106T AT E146304 T1 ATE146304 T1 AT E146304T1
- Authority
- AT
- Austria
- Prior art keywords
- tip
- pen
- heater
- substrate
- forming
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 229910001111 Fine metal Inorganic materials 0.000 title 1
- 239000000463 material Substances 0.000 abstract 5
- 238000003466 welding Methods 0.000 abstract 4
- 239000011344 liquid material Substances 0.000 abstract 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract 2
- 229910052721 tungsten Inorganic materials 0.000 abstract 2
- 239000010937 tungsten Substances 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0615—Solder feeding devices forming part of a soldering iron
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
- G03F1/74—Repair or correction of mask defects by charged particle beam [CPB], e.g. focused ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
- Y10S977/855—Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure
- Y10S977/857—Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure including coating
Abstract
This invention is concerned with the method and apparatus for forming a desired pattern of a material of either the conductive or non conductive type on a great variety of substrates. It is based on the use of a pen which essentially consists of a refractory tip wetted with the material in the molten state. The pen (10) first consists of a pointed tungsten tip (11) attached, e.g. by micro welding, to the top of a V-shaped tungsten heater (12), forming an assembly (14). The tip and the heater top portion are roughened at the vicinity of the welding point (13). In turn, the extremities of the V-shaped heater are welded to the pins (16, 16') of a 3-lead TO-5 package base (15). The pen (10) is incorporated in an apparatus adapted to the direct writing technique. To that end, the pen is attached to a supporting device capable of movements in the X, Y and Z directions, while the substrate is placed on an X-Y stage for adequate X, Y and Z relative movements therebetween. The two pins of the pen are connected to a power supply to resistively heat the heater. When the welding point of the tip/heater assembly reaches the melting point temperature of the material to be deposited, it is dipped in a crucible containing the said material in the molten state. The welding point nucleates a minute drop of the liquid material thus forming a reservoir. A thin film of the liquid material flows from the reservoir and wets the whole tip surface. Finally, the wetted tip is gently brought into contact with the substrate and deposition of the material can take place, as soon as the substrate is adequately moved, to produce the said desired pattern. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP93480106A EP0637057B1 (en) | 1993-07-30 | 1993-07-30 | Method and apparatus for depositing metal fine lines on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE146304T1 true ATE146304T1 (en) | 1996-12-15 |
Family
ID=8214842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT93480106T ATE146304T1 (en) | 1993-07-30 | 1993-07-30 | DEVICE AND METHOD FOR DEPOSING A FINE METAL LINE ON A SUBSTRATE |
Country Status (5)
Country | Link |
---|---|
US (2) | US5973295A (en) |
EP (1) | EP0637057B1 (en) |
JP (1) | JP2692781B2 (en) |
AT (1) | ATE146304T1 (en) |
DE (1) | DE69306565T2 (en) |
Families Citing this family (30)
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DE19608824A1 (en) * | 1996-03-07 | 1997-09-18 | Inst Mikrotechnik Mainz Gmbh | Process for the production of micro heat exchangers |
US6827979B2 (en) * | 1999-01-07 | 2004-12-07 | Northwestern University | Methods utilizing scanning probe microscope tips and products therefor or produced thereby |
NL1011081C2 (en) * | 1999-01-20 | 2000-07-21 | Stichting Energie | Method and device for applying a metallization pattern to a substrate for a photovoltaic cell. |
US6305000B1 (en) | 1999-06-15 | 2001-10-16 | International Business Machines Corporation | Placement of conductive stripes in electronic circuits to satisfy metal density requirements |
DE19931110A1 (en) * | 1999-07-06 | 2001-01-25 | Ekra Eduard Kraft Gmbh | Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder |
US6949756B2 (en) * | 2000-01-21 | 2005-09-27 | Fei Company | Shaped and low density focused ion beams |
JP4364420B2 (en) * | 2000-10-31 | 2009-11-18 | エスアイアイ・ナノテクノロジー株式会社 | Method for forming vertical edge submicron through holes |
US6977386B2 (en) * | 2001-01-19 | 2005-12-20 | Fei Company | Angular aperture shaped beam system and method |
US6905736B1 (en) * | 2001-02-28 | 2005-06-14 | University Of Central Florida | Fabrication of nano-scale temperature sensors and heaters |
US20030000921A1 (en) * | 2001-06-29 | 2003-01-02 | Ted Liang | Mask repair with electron beam-induced chemical etching |
JP2003115650A (en) | 2001-10-03 | 2003-04-18 | Yazaki Corp | Manufacturing method and manufacturing device for circuit body |
US7091412B2 (en) * | 2002-03-04 | 2006-08-15 | Nanoset, Llc | Magnetically shielded assembly |
US6916573B2 (en) * | 2002-07-24 | 2005-07-12 | General Motors Corporation | PEM fuel cell stack without gas diffusion media |
US20040060816A1 (en) * | 2002-09-30 | 2004-04-01 | The Regents Of The University Of California | Method of connecting individual conducting layers of a nanolaminate structure |
US20040238202A1 (en) * | 2003-06-02 | 2004-12-02 | Ohmcraft Inc. | Method of making an inductor with written wire and an inductor made therefrom |
US7329361B2 (en) * | 2003-10-29 | 2008-02-12 | International Business Machines Corporation | Method and apparatus for fabricating or altering microstructures using local chemical alterations |
JP5067835B2 (en) * | 2006-11-24 | 2012-11-07 | 国立大学法人群馬大学 | Method for manufacturing magnetic recording medium |
EP1942710B1 (en) * | 2007-01-04 | 2011-05-11 | Oticon A/S | Method of generating an electrical component of an electrical circuitry on a substrate |
TWI330506B (en) * | 2007-01-15 | 2010-09-11 | Chimei Innolux Corp | Method and apparatus for repairing metal line |
AU2009309436B2 (en) * | 2008-10-30 | 2013-05-09 | Bae Systems Plc | Improvements relating to additive manufacturing processes |
US8617668B2 (en) * | 2009-09-23 | 2013-12-31 | Fei Company | Method of using nitrogen based compounds to reduce contamination in beam-induced thin film deposition |
GB201003614D0 (en) * | 2010-03-04 | 2010-04-21 | Airbus Operations Ltd | Water drain tool |
US20110223317A1 (en) * | 2010-03-12 | 2011-09-15 | United Technologies Corporation | Direct thermal stabilization for coating application |
US20110223354A1 (en) * | 2010-03-12 | 2011-09-15 | United Technologies Corporation | High pressure pre-oxidation for deposition of thermal barrier coating |
US20110318503A1 (en) * | 2010-06-29 | 2011-12-29 | Christian Adams | Plasma enhanced materials deposition system |
WO2015042022A1 (en) * | 2013-09-20 | 2015-03-26 | Applied Materials, Inc. | Method and apparatus for direct formation of nanometer scaled features |
US20150307385A1 (en) | 2014-04-25 | 2015-10-29 | Massachusetts Institute Of Technology | Methods and apparatus for additive manufacturing of glass |
TWI524040B (en) * | 2014-10-03 | 2016-03-01 | Handheld electronic cigarette lighter tools | |
US10546719B2 (en) | 2017-06-02 | 2020-01-28 | Fei Company | Face-on, gas-assisted etching for plan-view lamellae preparation |
DE102017118471A1 (en) * | 2017-08-14 | 2019-02-14 | Universität Greifswald | Method for producing ultrathin to thin layers on substrates |
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JPH04288953A (en) * | 1991-03-18 | 1992-10-14 | Alps Electric Co Ltd | Manufacture of fe basis soft magnetic alloy strip |
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FR2678632B1 (en) * | 1991-07-03 | 1994-09-02 | Pharmascience Lab | PROCESS FOR THE PREPARATION OF THE UNSAPONIFIABLE LAWYER FOR IMPROVING ITS CONTENT IN ONE OF ITS FRACTIONS SAID H |
US5159171A (en) * | 1991-09-03 | 1992-10-27 | Motorola, Inc. | Method and apparatus for solder laser printing |
US5520715A (en) * | 1994-07-11 | 1996-05-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Directional electrostatic accretion process employing acoustic droplet formation |
-
1993
- 1993-07-30 AT AT93480106T patent/ATE146304T1/en not_active IP Right Cessation
- 1993-07-30 EP EP93480106A patent/EP0637057B1/en not_active Expired - Lifetime
- 1993-07-30 DE DE69306565T patent/DE69306565T2/en not_active Expired - Fee Related
-
1994
- 1994-06-17 US US08/261,645 patent/US5973295A/en not_active Expired - Fee Related
- 1994-07-06 JP JP6154488A patent/JP2692781B2/en not_active Expired - Fee Related
-
1995
- 1995-05-24 US US08/448,689 patent/US5741557A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5973295A (en) | 1999-10-26 |
EP0637057B1 (en) | 1996-12-11 |
EP0637057A1 (en) | 1995-02-01 |
JP2692781B2 (en) | 1997-12-17 |
DE69306565T2 (en) | 1997-06-12 |
DE69306565D1 (en) | 1997-01-23 |
JPH07235515A (en) | 1995-09-05 |
US5741557A (en) | 1998-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |