ATE102397T1 - Integriertes bearbeitungssystem mit vielfachkammer. - Google Patents

Integriertes bearbeitungssystem mit vielfachkammer.

Info

Publication number
ATE102397T1
ATE102397T1 AT87311194T AT87311194T ATE102397T1 AT E102397 T1 ATE102397 T1 AT E102397T1 AT 87311194 T AT87311194 T AT 87311194T AT 87311194 T AT87311194 T AT 87311194T AT E102397 T1 ATE102397 T1 AT E102397T1
Authority
AT
Austria
Prior art keywords
load lock
elevator
internal
load
process chambers
Prior art date
Application number
AT87311194T
Other languages
English (en)
Inventor
Dan Maydan
Sasson Somekh
David Nin-Kou Wang
David Cheng
Masato Toshima
Isaac Harari
Peter D Hoppe
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE102397T1 publication Critical patent/ATE102397T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Threshing Machine Elements (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
AT87311194T 1986-12-19 1987-12-18 Integriertes bearbeitungssystem mit vielfachkammer. ATE102397T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94480386A 1986-12-19 1986-12-19
EP87311194A EP0272141B1 (de) 1986-12-19 1987-12-18 Integriertes Bearbeitungssystem mit Vielfachkammer

Publications (1)

Publication Number Publication Date
ATE102397T1 true ATE102397T1 (de) 1994-03-15

Family

ID=25482099

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87311194T ATE102397T1 (de) 1986-12-19 1987-12-18 Integriertes bearbeitungssystem mit vielfachkammer.

Country Status (4)

Country Link
EP (1) EP0272141B1 (de)
JP (1) JPS63252439A (de)
AT (1) ATE102397T1 (de)
DE (1) DE3789212T2 (de)

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US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
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US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
US5000113A (en) * 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
JP2545591B2 (ja) * 1988-09-30 1996-10-23 国際電気株式会社 ウェーハ処理装置
US4952299A (en) * 1988-10-31 1990-08-28 Eaton Corporation Wafer handling apparatus
US5019233A (en) * 1988-10-31 1991-05-28 Eaton Corporation Sputtering system
EP0367423A3 (de) * 1988-10-31 1991-01-09 Eaton Corporation Vakuumablagerungsvorrichtung
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
JP2528708B2 (ja) * 1989-03-14 1996-08-28 富士通株式会社 半導体製造装置
JPH0793348B2 (ja) * 1989-05-19 1995-10-09 アプライド マテリアルズ インコーポレーテッド 多重チャンバ真空式処理装置及び多重チャンバ真空式半導体ウェーハ処理装置
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
JP2803170B2 (ja) * 1989-06-07 1998-09-24 日本電気株式会社 半導体ウェハー搬送装置
EP0408216A3 (en) * 1989-07-11 1991-09-18 Hitachi, Ltd. Method for processing wafers and producing semiconductor devices and apparatus for producing the same
JP3466607B2 (ja) * 1989-09-13 2003-11-17 ソニー株式会社 スパッタリング装置
US5447409A (en) * 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
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US5478780A (en) * 1990-03-30 1995-12-26 Siemens Aktiengesellschaft Method and apparatus for producing conductive layers or structures for VLSI circuits
EP0448763A1 (de) * 1990-03-30 1991-10-02 Siemens Aktiengesellschaft Verfahren und Vorrichtung zur Herstellung von leitenden Schichten oder Strukturen für höchstintegrierte Schaltungen
EP0452888B1 (de) * 1990-04-16 1996-08-21 Applied Materials, Inc. Verfahren zum Herstellen einer Titansilizidschicht auf einer Halbleiterschicht
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EP0608633B1 (de) 1993-01-28 1999-03-03 Applied Materials, Inc. Verfahren zur CVD-Beschichtung einer Mehrschichtstruktur in einer einzigen Kammer
EP0624896B1 (de) * 1993-05-13 1999-09-22 Applied Materials, Inc. Kontrolle der Kontamination in einem Plasma durch Ausgestaltung des Plasmaschildes unter Verwendung von Materialien mit verschiedenen RF-Impedanzen
EP0634786B1 (de) * 1993-07-15 1997-03-05 Applied Materials, Inc. Verbesserte Suszeptor Ausführung
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US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US6267423B1 (en) 1995-12-08 2001-07-31 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US5820692A (en) * 1996-01-16 1998-10-13 Fsi Interntional Vacuum compatible water vapor and rinse process module
JP3769802B2 (ja) * 1996-02-09 2006-04-26 株式会社日立製作所 半導体装置の製造方法
JPH09323276A (ja) * 1996-06-03 1997-12-16 Toyota Autom Loom Works Ltd 搬送装置及びロボットアーム
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Also Published As

Publication number Publication date
EP0272141A3 (en) 1989-10-11
JPH0322057B2 (de) 1991-03-26
DE3789212T2 (de) 1994-06-01
EP0272141A2 (de) 1988-06-22
JPS63252439A (ja) 1988-10-19
DE3789212D1 (de) 1994-04-07
EP0272141B1 (de) 1994-03-02

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties