Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67063—Apparatus for fluid treatment for etching
  • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
  • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Weting (AREA)
• ing And Chemical Polishing (AREA)

Priority Applications (11)

Applications Claiming Priority (1)

Publications (2)

Family

ID=3672349

Family Applications (2)

Family Applications After (1)

Country Status (10)

Families Citing this family (19)

Family Cites Families (4)

• 2002
  • 2002-03-06 AT AT0034802A patent/AT411335B/de not_active IP Right Cessation
• 2003
  • 2003-02-12 TW TW092102882A patent/TW587292B/zh not_active IP Right Cessation
  • 2003-02-17 WO PCT/EP2003/001568 patent/WO2003075324A1/en active Application Filing
  • 2003-02-17 DE DE60336713T patent/DE60336713D1/de not_active Expired - Lifetime
  • 2003-02-17 KR KR1020047013228A patent/KR100675266B1/ko not_active IP Right Cessation
  • 2003-02-17 US US10/506,473 patent/US7279116B2/en not_active Expired - Fee Related
  • 2003-02-17 JP JP2003573683A patent/JP4537714B2/ja not_active Expired - Fee Related
  • 2003-02-17 EP EP03702646A patent/EP1483778B1/de not_active Expired - Lifetime
  • 2003-02-17 CN CNB038051613A patent/CN100347810C/zh not_active Expired - Fee Related
  • 2003-02-17 AU AU2003205771A patent/AU2003205771A1/en not_active Abandoned
  • 2003-02-17 AT AT03702646T patent/ATE505811T1/de not_active IP Right Cessation

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