ATA205078A - Verfahren zur herstellung eines mit einer duennkupferschicht ausgestatteten traegermateriales zum herstellen von gedruckten schaltungen - Google Patents
Verfahren zur herstellung eines mit einer duennkupferschicht ausgestatteten traegermateriales zum herstellen von gedruckten schaltungenInfo
- Publication number
- ATA205078A ATA205078A AT0205078A AT205078A ATA205078A AT A205078 A ATA205078 A AT A205078A AT 0205078 A AT0205078 A AT 0205078A AT 205078 A AT205078 A AT 205078A AT A205078 A ATA205078 A AT A205078A
- Authority
- AT
- Austria
- Prior art keywords
- producing
- support material
- copper layer
- thin copper
- printed circuits
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2713391A DE2713391C3 (de) | 1977-03-23 | 1977-03-23 | Verfahren zum Herstellen eines Trägermaterials für gedruckte Schaltungen |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA205078A true ATA205078A (de) | 1985-04-15 |
AT379279B AT379279B (de) | 1985-12-10 |
Family
ID=6004742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT0205078A AT379279B (de) | 1977-03-23 | 1978-03-22 | Verfahren zur herstellung eines mit einer duennkupferschicht ausgestatteten traegermateriales zum herstellen von gedruckten schaltungen |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS53147265A (de) |
AT (1) | AT379279B (de) |
AU (1) | AU516016B2 (de) |
CA (1) | CA1099031A (de) |
DE (1) | DE2713391C3 (de) |
FR (1) | FR2385192A1 (de) |
GB (1) | GB1588998A (de) |
IT (1) | IT7848565A0 (de) |
NL (1) | NL180163C (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0117258B1 (de) * | 1983-02-23 | 1987-05-20 | Ibm Deutschland Gmbh | Verfahren zur Herstellung von haftfesten Metallschichten auf Kunststoffsubstraten |
JPS59227188A (ja) * | 1983-06-07 | 1984-12-20 | 松下電器産業株式会社 | プリント基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2997521A (en) * | 1960-04-11 | 1961-08-22 | Sanders Associates Inc | Insulated electric circuit assembly |
US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
-
1977
- 1977-03-23 DE DE2713391A patent/DE2713391C3/de not_active Expired
-
1978
- 1978-03-17 CA CA299,132A patent/CA1099031A/en not_active Expired
- 1978-03-20 GB GB10853/78A patent/GB1588998A/en not_active Expired
- 1978-03-22 NL NLAANVRAGE7803106,A patent/NL180163C/xx not_active IP Right Cessation
- 1978-03-22 AT AT0205078A patent/AT379279B/de not_active IP Right Cessation
- 1978-03-23 JP JP3401678A patent/JPS53147265A/ja active Pending
- 1978-03-23 FR FR7808487A patent/FR2385192A1/fr active Granted
- 1978-03-23 IT IT7848565A patent/IT7848565A0/it unknown
- 1978-04-03 AU AU34697/78A patent/AU516016B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL7803106A (nl) | 1978-09-26 |
FR2385192A1 (fr) | 1978-10-20 |
FR2385192B1 (de) | 1980-10-17 |
DE2713391C3 (de) | 1980-03-06 |
AU3469778A (en) | 1979-10-11 |
AT379279B (de) | 1985-12-10 |
NL180163B (nl) | 1986-08-01 |
AU516016B2 (en) | 1981-05-14 |
IT7848565A0 (it) | 1978-03-23 |
DE2713391A1 (de) | 1978-09-28 |
DE2713391B2 (de) | 1979-06-28 |
NL180163C (nl) | 1987-01-02 |
JPS53147265A (en) | 1978-12-21 |
CA1099031A (en) | 1981-04-07 |
GB1588998A (en) | 1981-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee | ||
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |