AT520469A3 - Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter - Google Patents
Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter Download PDFInfo
- Publication number
- AT520469A3 AT520469A3 ATA50820/2018A AT508202018A AT520469A3 AT 520469 A3 AT520469 A3 AT 520469A3 AT 508202018 A AT508202018 A AT 508202018A AT 520469 A3 AT520469 A3 AT 520469A3
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- wafer carrier
- carrier device
- plate
- wafer holding
- Prior art date
Links
- 238000005192 partition Methods 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Ein Waferhaltesystem weist eine Waferhaltevorrichtung (16) und einen Trennrahmen (14) auf, wobei die Waferhaltevorrichtung (16) eine untere Platte (26) und eine obere Platte (28) aufweist. Die obere Platte (28) umfasst eine Auflagefläche (34) zum Halten des Wafers (12), und die untere Platte (26) hat einen maximalen Durchmesser (db), der größer als der maximale Durchmesser (dt) der oberen Platte (28) ist, sodass die untere Platte (26) eine Aufnahme (32) für den Trennrahmen (14) umfasst. Der Trennrahmen (14) hat eine plattenartige Form, die eine zentrale Öffnung (20) bildet, wobei der minimale Durchmesser (dh) der zentralen Öffnung (20) größer als der maximale Durchmesser (dt) der oberen Platte (28) ist, sodass der Trennrahmen (14) bis unterhalb der Oberseite des Wafers (12) und/oder der Auflagefläche (34) sinkt. Ferner sind eine Waferhaltevorrichtung (16), ein Waferhaltesystem (18) und ein Maskenausrichter vorgesehen.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2019623A NL2019623B1 (en) | 2017-09-25 | 2017-09-25 | Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner |
Publications (3)
Publication Number | Publication Date |
---|---|
AT520469A2 AT520469A2 (de) | 2019-04-15 |
AT520469A3 true AT520469A3 (de) | 2021-04-15 |
AT520469B1 AT520469B1 (de) | 2021-11-15 |
Family
ID=60628131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA50820/2018A AT520469B1 (de) | 2017-09-25 | 2018-09-25 | Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter |
Country Status (9)
Country | Link |
---|---|
US (1) | US10937681B2 (de) |
JP (1) | JP2019062201A (de) |
KR (1) | KR20190035570A (de) |
CN (1) | CN109560033A (de) |
AT (1) | AT520469B1 (de) |
DE (1) | DE102018122449A1 (de) |
NL (1) | NL2019623B1 (de) |
SG (1) | SG10201808377WA (de) |
TW (1) | TW201916245A (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2019623B1 (en) * | 2017-09-25 | 2019-04-01 | Suss Microtec Lithography Gmbh | Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner |
JP7064749B2 (ja) * | 2018-02-22 | 2022-05-11 | アスリートFa株式会社 | ボール搭載装置 |
KR102608899B1 (ko) * | 2019-04-11 | 2023-11-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 광학 디바이스들을 위한 다중-깊이 막 |
JP7344695B2 (ja) * | 2019-07-23 | 2023-09-14 | 株式会社ディスコ | チップの製造方法 |
CN110928147B (zh) * | 2019-12-19 | 2022-04-08 | 中航电测仪器股份有限公司 | 一种间隙光刻机构及其光刻方法 |
CN112117230A (zh) * | 2020-10-19 | 2020-12-22 | 北京航空航天大学杭州创新研究院 | 高密度图案化加工的衬底-掩模板原位保持装置 |
US20220331917A1 (en) * | 2021-04-16 | 2022-10-20 | UTAC Headquarters Pte. Ltd. | Wafer adaptor for adapting different sized wafers |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060203222A1 (en) * | 2005-03-11 | 2006-09-14 | Naoki Ohmiya | Wafer holding mechanism |
US20070035717A1 (en) * | 2005-08-12 | 2007-02-15 | Wei Wu | Contact lithography apparatus, system and method |
US20090249604A1 (en) * | 2006-08-08 | 2009-10-08 | Tokyo Ohka Kogyo Co., Ltd. | Method and apparatus for releasing support plate and wafer chips from each other |
US20140109941A1 (en) * | 2011-06-15 | 2014-04-24 | Tokyo Ohka Kogyo Co., Ltd. | Retention device and retention method |
JP2015088565A (ja) * | 2013-10-29 | 2015-05-07 | 東京応化工業株式会社 | 保持装置および保持方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3003656B2 (ja) * | 1997-12-24 | 2000-01-31 | 日本電気株式会社 | 微細金属球の搭載治具 |
JP2008021929A (ja) * | 2006-07-14 | 2008-01-31 | Tokyo Ohka Kogyo Co Ltd | サポートプレート、搬送装置、剥離装置及び剥離方法 |
JP5497587B2 (ja) * | 2010-03-23 | 2014-05-21 | 株式会社日立ハイテクノロジーズ | マイクロ流路チップ及びマイクロアレイチップ |
US8802545B2 (en) * | 2011-03-14 | 2014-08-12 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
US9117801B2 (en) * | 2013-05-15 | 2015-08-25 | Infineon Technologies Ag | Semiconductor devices having a glass substrate, and method for manufacturing thereof |
US9828276B2 (en) * | 2013-06-26 | 2017-11-28 | Corning Incorporated | Glass ribbon breaking devices and methods of producing glass sheets |
NL2019623B1 (en) * | 2017-09-25 | 2019-04-01 | Suss Microtec Lithography Gmbh | Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner |
-
2017
- 2017-09-25 NL NL2019623A patent/NL2019623B1/en not_active IP Right Cessation
-
2018
- 2018-09-13 DE DE102018122449.4A patent/DE102018122449A1/de not_active Withdrawn
- 2018-09-20 TW TW107133158A patent/TW201916245A/zh unknown
- 2018-09-21 KR KR1020180113779A patent/KR20190035570A/ko unknown
- 2018-09-21 JP JP2018177738A patent/JP2019062201A/ja active Pending
- 2018-09-25 SG SG10201808377WA patent/SG10201808377WA/en unknown
- 2018-09-25 AT ATA50820/2018A patent/AT520469B1/de not_active IP Right Cessation
- 2018-09-25 CN CN201811116259.7A patent/CN109560033A/zh active Pending
- 2018-09-25 US US16/141,720 patent/US10937681B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060203222A1 (en) * | 2005-03-11 | 2006-09-14 | Naoki Ohmiya | Wafer holding mechanism |
US20070035717A1 (en) * | 2005-08-12 | 2007-02-15 | Wei Wu | Contact lithography apparatus, system and method |
US20090249604A1 (en) * | 2006-08-08 | 2009-10-08 | Tokyo Ohka Kogyo Co., Ltd. | Method and apparatus for releasing support plate and wafer chips from each other |
US20140109941A1 (en) * | 2011-06-15 | 2014-04-24 | Tokyo Ohka Kogyo Co., Ltd. | Retention device and retention method |
JP2015088565A (ja) * | 2013-10-29 | 2015-05-07 | 東京応化工業株式会社 | 保持装置および保持方法 |
Also Published As
Publication number | Publication date |
---|---|
AT520469B1 (de) | 2021-11-15 |
KR20190035570A (ko) | 2019-04-03 |
SG10201808377WA (en) | 2019-04-29 |
CN109560033A (zh) | 2019-04-02 |
JP2019062201A (ja) | 2019-04-18 |
TW201916245A (zh) | 2019-04-16 |
NL2019623B1 (en) | 2019-04-01 |
DE102018122449A1 (de) | 2019-03-28 |
US20190096733A1 (en) | 2019-03-28 |
US10937681B2 (en) | 2021-03-02 |
AT520469A2 (de) | 2019-04-15 |
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Effective date: 20230925 |