AT520469A3 - Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter - Google Patents

Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter Download PDF

Info

Publication number
AT520469A3
AT520469A3 ATA50820/2018A AT508202018A AT520469A3 AT 520469 A3 AT520469 A3 AT 520469A3 AT 508202018 A AT508202018 A AT 508202018A AT 520469 A3 AT520469 A3 AT 520469A3
Authority
AT
Austria
Prior art keywords
wafer
wafer carrier
carrier device
plate
wafer holding
Prior art date
Application number
ATA50820/2018A
Other languages
English (en)
Other versions
AT520469B1 (de
AT520469A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT520469A2 publication Critical patent/AT520469A2/de
Publication of AT520469A3 publication Critical patent/AT520469A3/de
Application granted granted Critical
Publication of AT520469B1 publication Critical patent/AT520469B1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Ein Waferhaltesystem weist eine Waferhaltevorrichtung (16) und einen Trennrahmen (14) auf, wobei die Waferhaltevorrichtung (16) eine untere Platte (26) und eine obere Platte (28) aufweist. Die obere Platte (28) umfasst eine Auflagefläche (34) zum Halten des Wafers (12), und die untere Platte (26) hat einen maximalen Durchmesser (db), der größer als der maximale Durchmesser (dt) der oberen Platte (28) ist, sodass die untere Platte (26) eine Aufnahme (32) für den Trennrahmen (14) umfasst. Der Trennrahmen (14) hat eine plattenartige Form, die eine zentrale Öffnung (20) bildet, wobei der minimale Durchmesser (dh) der zentralen Öffnung (20) größer als der maximale Durchmesser (dt) der oberen Platte (28) ist, sodass der Trennrahmen (14) bis unterhalb der Oberseite des Wafers (12) und/oder der Auflagefläche (34) sinkt. Ferner sind eine Waferhaltevorrichtung (16), ein Waferhaltesystem (18) und ein Maskenausrichter vorgesehen.
ATA50820/2018A 2017-09-25 2018-09-25 Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter AT520469B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2019623A NL2019623B1 (en) 2017-09-25 2017-09-25 Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner

Publications (3)

Publication Number Publication Date
AT520469A2 AT520469A2 (de) 2019-04-15
AT520469A3 true AT520469A3 (de) 2021-04-15
AT520469B1 AT520469B1 (de) 2021-11-15

Family

ID=60628131

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50820/2018A AT520469B1 (de) 2017-09-25 2018-09-25 Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter

Country Status (9)

Country Link
US (1) US10937681B2 (de)
JP (1) JP2019062201A (de)
KR (1) KR20190035570A (de)
CN (1) CN109560033A (de)
AT (1) AT520469B1 (de)
DE (1) DE102018122449A1 (de)
NL (1) NL2019623B1 (de)
SG (1) SG10201808377WA (de)
TW (1) TW201916245A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2019623B1 (en) * 2017-09-25 2019-04-01 Suss Microtec Lithography Gmbh Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner
JP7064749B2 (ja) * 2018-02-22 2022-05-11 アスリートＦａ株式会社 ボール搭載装置
KR102608899B1 (ko) * 2019-04-11 2023-11-30 어플라이드 머티어리얼스, 인코포레이티드 광학 디바이스들을 위한 다중-깊이 막
JP7344695B2 (ja) * 2019-07-23 2023-09-14 株式会社ディスコ チップの製造方法
CN110928147B (zh) * 2019-12-19 2022-04-08 中航电测仪器股份有限公司 一种间隙光刻机构及其光刻方法
CN112117230A (zh) * 2020-10-19 2020-12-22 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置
US20220331917A1 (en) * 2021-04-16 2022-10-20 UTAC Headquarters Pte. Ltd. Wafer adaptor for adapting different sized wafers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060203222A1 (en) * 2005-03-11 2006-09-14 Naoki Ohmiya Wafer holding mechanism
US20070035717A1 (en) * 2005-08-12 2007-02-15 Wei Wu Contact lithography apparatus, system and method
US20090249604A1 (en) * 2006-08-08 2009-10-08 Tokyo Ohka Kogyo Co., Ltd. Method and apparatus for releasing support plate and wafer chips from each other
US20140109941A1 (en) * 2011-06-15 2014-04-24 Tokyo Ohka Kogyo Co., Ltd. Retention device and retention method
JP2015088565A (ja) * 2013-10-29 2015-05-07 東京応化工業株式会社 保持装置および保持方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3003656B2 (ja) * 1997-12-24 2000-01-31 日本電気株式会社 微細金属球の搭載治具
JP2008021929A (ja) * 2006-07-14 2008-01-31 Tokyo Ohka Kogyo Co Ltd サポートプレート、搬送装置、剥離装置及び剥離方法
JP5497587B2 (ja) * 2010-03-23 2014-05-21 株式会社日立ハイテクノロジーズ マイクロ流路チップ及びマイクロアレイチップ
US8802545B2 (en) * 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9117801B2 (en) * 2013-05-15 2015-08-25 Infineon Technologies Ag Semiconductor devices having a glass substrate, and method for manufacturing thereof
US9828276B2 (en) * 2013-06-26 2017-11-28 Corning Incorporated Glass ribbon breaking devices and methods of producing glass sheets
NL2019623B1 (en) * 2017-09-25 2019-04-01 Suss Microtec Lithography Gmbh Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060203222A1 (en) * 2005-03-11 2006-09-14 Naoki Ohmiya Wafer holding mechanism
US20070035717A1 (en) * 2005-08-12 2007-02-15 Wei Wu Contact lithography apparatus, system and method
US20090249604A1 (en) * 2006-08-08 2009-10-08 Tokyo Ohka Kogyo Co., Ltd. Method and apparatus for releasing support plate and wafer chips from each other
US20140109941A1 (en) * 2011-06-15 2014-04-24 Tokyo Ohka Kogyo Co., Ltd. Retention device and retention method
JP2015088565A (ja) * 2013-10-29 2015-05-07 東京応化工業株式会社 保持装置および保持方法

Also Published As

Publication number Publication date
AT520469B1 (de) 2021-11-15
KR20190035570A (ko) 2019-04-03
SG10201808377WA (en) 2019-04-29
CN109560033A (zh) 2019-04-02
JP2019062201A (ja) 2019-04-18
TW201916245A (zh) 2019-04-16
NL2019623B1 (en) 2019-04-01
DE102018122449A1 (de) 2019-03-28
US20190096733A1 (en) 2019-03-28
US10937681B2 (en) 2021-03-02
AT520469A2 (de) 2019-04-15

Similar Documents

Publication Publication Date Title
AT520469A3 (de) Waferträgersystem, Waferträgervorrichtung, System mit einem Wafer und einer Waferträgervorrichtung sowie Maskenausrichter
SG10201802345XA (en) Sieving Devices For Pupae Separation
MX358596B (es) Tamiz de separador vibratorio.
AT518580A3 (de) Waferbearbeitungsverfahren
SG10201903242QA (en) Methods for singulating semiconductor wafer
MX2016012182A (es) Plantilla formadora de cuspides.
MY171178A (en) Method of reducing residual contamination in singulated semiconductor die
GB2563757A (en) Integrated security inspection system
SG10201911591QA (en) Vertical semiconductor device and fabrication method thereof
MX2020012724A (es) Conjunto de soporte para huevos y dispositivo y procesamiento asociados.
AT519840A5 (de) Vorrichtung und Verfahren zum Lösen eines ersten Substrats
SG10201911724QA (en) Vertical semiconductor device and method for fabricating the vertical semiconductor device
SG10201802241PA (en) Filter, filter device, and method of use
MX2018002072A (es) Pedestal de alojamiento utilitario.
EP2587200A3 (de) Einlegeboden
MY196500A (en) Transfer Jig And Surface Treatment Apparatus Using Same
PH12016501263A1 (en) Method for testing semiconductor wafers using temporary sacrificial bond pads
EP2690040A3 (de) Vorrichtung zum Abtrennen von einzelnen flachen, biegbaren Gegenständen von der Unterseite eines Stapels solcher Gegenstände
MY188860A (en) Substrate for mounting semiconductor element, semiconductor device and optical semiconductor device, and method for manufacturing same
MY191328A (en) Screen assembly for a vibrating screening machine
MX2019000780A (es) Formador de cuerpos de latas modular.
WO2019071042A8 (en) Carousel for 2x3 and 1x3 slides
AT515435A3 (de) Wafer-Haltesystem
PL405047A1 (pl) Zespół do oddzielania i sposób oddzielania wybranych obiektów wadliwych z grupy obiektów stosowanych w przemyśle tytoniowym
MY175846A (en) Method of dividing wafer into dies

Legal Events

Date Code Title Description
MM01 Lapse because of not paying annual fees

Effective date: 20230925