AR087137A1 - Procedimiento y dispositivo de polarizacion de un electrodo dbd - Google Patents
Procedimiento y dispositivo de polarizacion de un electrodo dbdInfo
- Publication number
- AR087137A1 AR087137A1 ARP100104353A ARP100104353A AR087137A1 AR 087137 A1 AR087137 A1 AR 087137A1 AR P100104353 A ARP100104353 A AR P100104353A AR P100104353 A ARP100104353 A AR P100104353A AR 087137 A1 AR087137 A1 AR 087137A1
- Authority
- AR
- Argentina
- Prior art keywords
- tht
- transformer
- dbd
- dbd electrode
- polarization procedure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2242/00—Auxiliary systems
- H05H2242/20—Power circuits
- H05H2242/22—DC, AC or pulsed generators
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Dispositivo de tratamiento de superficie para descarga de barrera dieléctrica (DBD) que comprende un transformador THT/HF en la que la fuente de corriente continua (DC) se intercala en el circuito secundario del transformador THT/HF, de forma tal que las especies químicas se forman de iones eléctricamente positivos o negativos producidos en el plasma son selectivamente atraídas por un substrato blanco y rechazados por los electrodos de carga correspondiente.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09176940 | 2009-11-24 | ||
EP10153448A EP2326151A1 (fr) | 2009-11-24 | 2010-02-12 | Procédé et dispositif de polarisation d'une électrode DBD |
Publications (1)
Publication Number | Publication Date |
---|---|
AR087137A1 true AR087137A1 (es) | 2014-02-26 |
Family
ID=42983804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP100104353A AR087137A1 (es) | 2009-11-24 | 2010-11-24 | Procedimiento y dispositivo de polarizacion de un electrodo dbd |
Country Status (10)
Country | Link |
---|---|
US (1) | US9401265B2 (es) |
EP (2) | EP2326151A1 (es) |
JP (1) | JP5850847B2 (es) |
CN (1) | CN102668721B (es) |
AR (1) | AR087137A1 (es) |
BR (1) | BR112012012496B1 (es) |
EA (1) | EA023480B1 (es) |
PL (1) | PL2505041T3 (es) |
SI (1) | SI2505041T1 (es) |
WO (1) | WO2011064217A1 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10276352B2 (en) * | 2012-12-21 | 2019-04-30 | AGC Inc. | Pair of electrodes for DBD plasma process |
KR102257134B1 (ko) | 2017-06-27 | 2021-05-26 | 캐논 아네르바 가부시키가이샤 | 플라스마 처리 장치 |
PL3648554T3 (pl) | 2017-06-27 | 2021-11-22 | Canon Anelva Corporation | Urządzenie do przetwarzania plazmowego |
KR20220031132A (ko) * | 2017-06-27 | 2022-03-11 | 캐논 아네르바 가부시키가이샤 | 플라스마 처리 장치 |
WO2019003309A1 (ja) | 2017-06-27 | 2019-01-03 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
CZ307842B6 (cs) * | 2018-05-02 | 2019-06-12 | Fyzikální Ústav Av Čr, V. V. I. | Způsob generování nízkoteplotního plazmatu, způsob povlakování vnitřního povrchu dutých elektricky vodivých nebo feromagnetických trubic a zařízení pro provádění těchto způsobů |
EP3817517A4 (en) | 2018-06-26 | 2022-03-16 | Canon Anelva Corporation | PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, PROGRAM, AND MEMORY MEDIA |
TWI728569B (zh) * | 2019-11-25 | 2021-05-21 | 馗鼎奈米科技股份有限公司 | 放電極化設備 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3619352A1 (de) | 1986-06-09 | 1987-12-10 | Philips Patentverwaltung | Eintaktdurchflusswandler |
JP3577601B2 (ja) * | 1993-09-20 | 2004-10-13 | 株式会社ダイオー | 大気圧グロ−放電プラズマ処理法 |
JPH07155529A (ja) * | 1993-12-01 | 1995-06-20 | Takuma Co Ltd | ガス処理装置とそれの運転方法 |
DE19537212A1 (de) * | 1994-10-06 | 1996-04-11 | Leybold Ag | Vorrichtung zum Beschichten von Substraten im Vakuum |
US5573597A (en) * | 1995-06-07 | 1996-11-12 | Sony Corporation | Plasma processing system with reduced particle contamination |
JPH08337497A (ja) * | 1995-06-09 | 1996-12-24 | Iwatani Internatl Corp | ダイヤモンド薄膜の気相合成法 |
WO1997013266A2 (en) | 1995-06-19 | 1997-04-10 | The University Of Tennessee Research Corporation | Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith |
CN1161820C (zh) * | 1998-07-31 | 2004-08-11 | 佳能株式会社 | 半导体层制造方法和制造设备、光生伏打电池的制造方法 |
FR2782837B1 (fr) * | 1998-08-28 | 2000-09-29 | Air Liquide | Procede et dispositif de traitement de surface par plasma a pression atmospherique |
TWI225499B (en) * | 1999-04-15 | 2004-12-21 | Konishiroku Photo Ind | Protective film for polarizing plate |
EP1073091A3 (en) * | 1999-07-27 | 2004-10-06 | Matsushita Electric Works, Ltd. | Electrode for plasma generation, plasma treatment apparatus using the electrode, and plasma treatment with the apparatus |
US6827870B1 (en) * | 1999-10-12 | 2004-12-07 | Wisconsin Alumni Research Foundation | Method and apparatus for etching and deposition using micro-plasmas |
IES20010113A2 (en) | 2000-02-11 | 2001-09-19 | Anthony Herbert | An atmospheric pressure plasma system |
JP2003003268A (ja) * | 2001-06-19 | 2003-01-08 | Konica Corp | 大気圧プラズマ処理装置、大気圧プラズマ処理方法、基材、光学フィルム、及び画像表示素子 |
CN1266988C (zh) * | 2002-11-26 | 2006-07-26 | 广东杰特科技发展有限公司 | 发生随机性流光放电等离子体的工业装置及其应用 |
US7988816B2 (en) * | 2004-06-21 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus and method |
WO2007024134A1 (en) * | 2005-08-26 | 2007-03-01 | Fujifilm Manufacturing Europe B.V. | Method and arrangement for generating and controlling a discharge plasma |
US7589470B2 (en) * | 2006-01-31 | 2009-09-15 | Dublin City University | Method and apparatus for producing plasma |
JP2009525381A (ja) * | 2006-02-02 | 2009-07-09 | フジフィルム マニュファクチャリング ユーロプ ビー.ブイ. | プラズマによる表面処理方法及び表面処理装置 |
KR20080024885A (ko) * | 2006-09-15 | 2008-03-19 | 이택기 | 플라즈마 반응기의 파라미터 계산 방법 |
CN201017845Y (zh) * | 2007-03-14 | 2008-02-06 | 万京林 | 差分馈电介质阻挡放电低温等离子体装置 |
EP2145978A1 (fr) * | 2008-07-16 | 2010-01-20 | AGC Flat Glass Europe SA | Procédé et installation pour le dépôt de couches sur un substrat |
EP2145701A1 (fr) * | 2008-07-16 | 2010-01-20 | AGC Flat Glass Europe SA | Procédé et installation pour la préparation de surface par décharge à barrière diélectrique |
EP2180768A1 (en) * | 2008-10-23 | 2010-04-28 | TNO Nederlandse Organisatie voor Toegepast Wetenschappelijk Onderzoek | Apparatus and method for treating an object |
-
2010
- 2010-02-12 EP EP10153448A patent/EP2326151A1/fr not_active Withdrawn
- 2010-11-23 WO PCT/EP2010/068049 patent/WO2011064217A1/fr active Application Filing
- 2010-11-23 EA EA201290431A patent/EA023480B1/ru not_active IP Right Cessation
- 2010-11-23 CN CN201080053108.7A patent/CN102668721B/zh not_active Expired - Fee Related
- 2010-11-23 US US13/511,163 patent/US9401265B2/en active Active
- 2010-11-23 BR BR112012012496-0A patent/BR112012012496B1/pt not_active IP Right Cessation
- 2010-11-23 SI SI201030469T patent/SI2505041T1/sl unknown
- 2010-11-23 PL PL10784500T patent/PL2505041T3/pl unknown
- 2010-11-23 JP JP2012540404A patent/JP5850847B2/ja not_active Expired - Fee Related
- 2010-11-23 EP EP10784500.0A patent/EP2505041B8/fr active Active
- 2010-11-24 AR ARP100104353A patent/AR087137A1/es not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CN102668721B (zh) | 2015-04-29 |
US20120258260A1 (en) | 2012-10-11 |
BR112012012496A2 (pt) | 2016-04-12 |
EP2505041A1 (fr) | 2012-10-03 |
JP2013511816A (ja) | 2013-04-04 |
WO2011064217A1 (fr) | 2011-06-03 |
EA201290431A1 (ru) | 2013-04-30 |
EP2505041B8 (fr) | 2014-04-23 |
PL2505041T3 (pl) | 2014-07-31 |
CN102668721A (zh) | 2012-09-12 |
WO2011064217A8 (fr) | 2011-09-01 |
BR112012012496B1 (pt) | 2020-11-17 |
US9401265B2 (en) | 2016-07-26 |
JP5850847B2 (ja) | 2016-02-03 |
EP2326151A1 (fr) | 2011-05-25 |
EP2505041B1 (fr) | 2013-09-18 |
EA023480B1 (ru) | 2016-06-30 |
SI2505041T1 (sl) | 2014-03-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant, registration | ||
FD | Application declared void or lapsed, e.g., due to non-payment of fee |