WO2024127720A1 - Antenna module and communication device equipped with same - Google Patents

Antenna module and communication device equipped with same Download PDF

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Publication number
WO2024127720A1
WO2024127720A1 PCT/JP2023/030488 JP2023030488W WO2024127720A1 WO 2024127720 A1 WO2024127720 A1 WO 2024127720A1 JP 2023030488 W JP2023030488 W JP 2023030488W WO 2024127720 A1 WO2024127720 A1 WO 2024127720A1
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Prior art keywords
dielectric block
antenna module
substrate
dielectric
power supply
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PCT/JP2023/030488
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French (fr)
Japanese (ja)
Inventor
薫 須藤
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株式会社村田製作所
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Publication of WO2024127720A1 publication Critical patent/WO2024127720A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/10—Dielectric resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • This disclosure relates to an antenna module and a communication device equipped with the same, and more specifically to a configuration for adjusting the radiation direction of a dielectric resonator antenna.
  • Patent Document 1 JP 2000-209020 A discloses a dielectric resonator antenna (DRA) that radiates radio waves by supplying a high-frequency signal to a rectangular parallelepiped (dielectric block) made of dielectric material placed on a flat substrate.
  • DPA dielectric resonator antenna
  • a supplied high-frequency signal (electric field) resonates within the dielectric block, causing radio waves to be emitted in the opposite direction to the ground electrode placed on the substrate, i.e., in the normal direction of the substrate.
  • the frequency characteristics of the radio waves radiated from the dielectric resonator antenna are determined by the shape, dimensions and dielectric constant of the dielectric block.
  • there is only one supply path for the high-frequency signal to the dielectric block so radio waves are radiated from the dielectric block in only one specific polarization direction.
  • Antenna devices such as those described above may be used in mobile communication devices such as mobile phones or smartphones.
  • mobile communication devices in order to ensure reliable communication with other devices such as base stations or routers, multiple antennas are arranged within the device, and a configuration is used that allows radio waves to be emitted in different directions.
  • the present disclosure has been made to solve these problems, and its purpose is to provide a dielectric resonator antenna that can radiate radio waves in a direction different from the normal direction of the substrate.
  • the antenna module comprises a substrate, a dielectric block, a flat-plate shaped first ground electrode, and a power supply wiring.
  • the dielectric block has a first surface and a second surface that intersect with each other, and is disposed facing the mounting surface of the substrate on the first surface.
  • the first ground electrode intersects with the substrate and is disposed facing the second surface of the dielectric block.
  • the power supply wiring is disposed on the substrate and transmits a high frequency signal to the dielectric block. When viewed in a plan view from the normal direction of the substrate, the end of the power supply wiring is disposed in a position that overlaps with the dielectric block.
  • the antenna module disclosed herein has a flat ground electrode in a direction intersecting with the substrate, and the dielectric block is arranged opposite the mounting surface of the substrate so that a surface other than the surface facing the substrate faces the ground electrode.
  • FIG. 1 is a block diagram of a communication device to which an antenna module according to a first embodiment is applied;
  • FIG. 2 is a perspective view of the antenna module of FIG. 1 .
  • FIG. 2 is a side perspective view of the antenna module of FIG. 1 .
  • 11A and 11B are diagrams for explaining modified examples 1 and 2 of the arrangement of power supply wiring in a dielectric block.
  • 13A and 13B are diagrams for explaining modified examples 3 and 4 of the coupling state between the dielectric block and the power supply line.
  • FIG. 13 is a side perspective view of an antenna module according to a fifth modified example.
  • FIG. 13 is a side perspective view of an antenna module according to a sixth modified example.
  • FIG. 11 is a block diagram of a communication device to which an antenna module according to a second embodiment is applied.
  • FIG. 9 is a perspective view of the antenna module of FIG. 8 .
  • FIG. 9 is a side perspective view of the antenna module of FIG. 8 .
  • FIG. 13 is a side perspective view of an antenna module according to a seventh modified example.
  • FIG. 23 is a side perspective view of an antenna module according to an eighth modified example.
  • FIG. 11 is a partial side perspective view of a communication device according to a third embodiment.
  • 14 is a partial plan view of the communication device of FIG. 13 as viewed from the positive direction of the X-axis.
  • the communication device 10 is, for example, a mobile terminal such as a mobile phone, a smartphone, or a tablet, or a personal computer equipped with a communication function.
  • An example of the frequency band of radio waves used in the antenna module 100 according to the present embodiment is a millimeter wave band radio wave having a center frequency of, for example, 28 GHz, 39 GHz, or 60 GHz, but radio waves of other frequency bands are also applicable.
  • the communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit.
  • the antenna module 100 includes an RFIC 110, which is an example of a power supply device, and an antenna device 120.
  • the communication device 10 upconverts an intermediate frequency signal transmitted from the BBIC 200 to the antenna module 100 to a high frequency signal and radiates the high frequency signal from the antenna device 120, and downconverts a high frequency signal received by the antenna device 120 to an intermediate frequency signal and processes the signal in the BBIC 200.
  • the antenna device 120 includes a flat dielectric substrate 130 having a substantially rectangular shape, and a plurality of dielectric blocks 121 arranged on the dielectric substrate 130.
  • a flat dielectric substrate 130 having a substantially rectangular shape
  • a plurality of dielectric blocks 121 arranged on the dielectric substrate 130.
  • FIG. 1 an example of an array configuration in which four dielectric blocks 121 are arranged in a row on the dielectric substrate 130 is shown, but the number of dielectric blocks 121 is not limited to this.
  • a single dielectric block 121 may be arranged on the dielectric substrate 130, or a configuration in which a plurality of dielectric blocks 121 other than four are arranged may be used.
  • an array configuration in which the dielectric blocks 121 are arranged two-dimensionally may be used.
  • the dielectric blocks 121 are arranged in a one-dimensional array configuration, it is desirable to set the center-to-center distance between adjacent dielectric blocks to approximately ⁇ /2, assuming that the wavelength in free space of the radio wave radiated from the dielectric block 121 is ⁇ .
  • the dielectric block 121 has a substantially rectangular parallelepiped shape.
  • a high-frequency signal in a predetermined frequency band is supplied to the dielectric block 121, an electric field resonates inside the dielectric block 121, and radio waves corresponding to the resonant frequency are radiated from the dielectric block 121 to the outside.
  • the antenna module 100 is a dielectric resonator antenna (DRA).
  • the resonant frequency of the resonance occurring in the dielectric block 121 is determined by the shape and dimensions of the dielectric block 121 and the dielectric constant of the dielectric that constitutes the block.
  • the dielectric constant of the dielectric block 121 is set higher than the dielectric constant of the dielectric substrate 130.
  • the relative dielectric constant of the dielectric block 121 is, for example, 10 or more, and preferably 15 to 20.
  • the antenna module 100 of the first embodiment high-frequency signals are supplied to each dielectric block 121 via two power supply wirings.
  • the polarization direction of the radiated radio waves differs depending on the power supply position of the high-frequency signal to the dielectric block 121.
  • the antenna module 100 is a so-called dual-polarized type antenna module capable of radiating radio waves in two different polarization directions.
  • the RFIC 110 includes two power feed circuits 110A and 110B.
  • the power feed circuit 110A is a circuit for supplying a high-frequency signal for a first polarization direction.
  • the power feed circuit 110B is a circuit for supplying a high-frequency signal for a second polarization direction. Note that since the internal configuration of the power feed circuit 110B is similar, in order to facilitate explanation, in FIG. 1, only the detailed configuration of the power feed circuit 110A is shown, and the configuration of the power feed circuit 110B is omitted. Below, the function of the power feed circuit 110A will be explained as a representative.
  • the power supply circuit 110A includes switches 111A-111D, 113A-113D, and 117, power amplifiers 112AT-112DT, low-noise amplifiers 112AR-112DR, attenuators 114A-114D, phase shifters 115A-115D, a signal combiner/distributor 116, a mixer 118, and an amplifier circuit 119.
  • switches 111A-111D and 113A-113D are switched to the power amplifiers 112AT-112DT side, and switch 117 is connected to the transmitting amplifier of amplifier circuit 119.
  • switches 111A-111D and 113A-113D are switched to the low-noise amplifiers 112AR-112DR side, and switch 117 is connected to the receiving amplifier of amplifier circuit 119.
  • the intermediate frequency signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118.
  • the up-converted high frequency signal, the transmission signal is split into four by the signal combiner/distributor 116, passes through the corresponding signal paths, and is fed to different dielectric blocks 121.
  • the signal combiner/distributor 116 passes through the corresponding signal paths, and is fed to different dielectric blocks 121.
  • the attenuators 114A-114D adjust the strength of the transmission signal.
  • the received signal which is a high-frequency signal received by each dielectric block 121, is transmitted to the power supply circuit 110A of the RFIC 110 and is combined in the signal combiner/distributor 116 via four different signal paths.
  • the combined received signal is down-converted to an intermediate frequency signal by the mixer 118, and further amplified by the amplifier circuit 119 before being transmitted to the BBIC 200.
  • the RFIC 110 is formed, for example, as a one-chip integrated circuit component including the above circuit configuration. Alternatively, it may be formed as an individual integrated circuit component for each power supply circuit. Furthermore, for the devices corresponding to each dielectric block (switch, power amplifier, low-noise amplifier, attenuator, phase shifter), it may be formed as a one-chip integrated circuit component for each corresponding dielectric block.
  • Fig. 2 is a perspective view of the antenna module 100 according to the first embodiment.
  • Fig. 3 is a side view of the antenna module 100 when viewed from the Y-axis direction in Fig. 2.
  • the normal direction of the flat plate-shaped dielectric substrate 130 is the Z-axis direction
  • the direction along the short side of the dielectric substrate 130 is the X-axis direction
  • the direction along the long side of the dielectric substrate 130 is the X-axis direction.
  • the positive direction of the Z-axis may be referred to as the upper side
  • the negative direction may be referred to as the lower side.
  • the antenna module 100 further includes ground electrodes GND1 and GND2 and power supply wiring 140 and 145.
  • the dielectric substrate 130 may be, for example, a low temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating multiple resin layers made of resins such as epoxy and polyimide, a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by laminating multiple resin layers made of fluorine-based resin, a multilayer resin substrate formed by laminating multiple resin layers made of PET (Polyethylene Terephthalate), or a ceramic multilayer substrate other than LTCC.
  • LCP liquid crystal polymer
  • PET Polyethylene Terephthalate
  • the dielectric substrate 130 does not necessarily have to have a multilayer structure and may be a single-layer substrate.
  • the dielectric substrate 130 has an upper surface 131 and a lower surface 132.
  • a ground electrode GND2 is disposed over the entire surface of the dielectric substrate 130.
  • a flat ground electrode GND1 is disposed on the end side of the dielectric substrate 130 in the positive direction of the X-axis in a direction intersecting the dielectric substrate 130.
  • the ground electrode GND1 extends from the upper surface 131 of the dielectric substrate 130 in the positive direction of the Z-axis and has a flat shape disposed so as to be parallel to the YZ plane.
  • Each of the ground electrodes GND1 and GND2 is electrically connected to a ground terminal on a mounting substrate (not shown).
  • the ground electrodes GND1 and GND2 may be connected to each other.
  • the dielectric blocks 121 are arranged on the dielectric substrate 130 at a distance from each other along the Y-axis direction, further toward the end in the positive direction of the X-axis than the ground electrode GND1.
  • the dielectric blocks 121 are arranged so that the lower surface 122 of the approximately rectangular parallelepiped faces the upper surface 131 of the dielectric substrate 130 and protrudes further in the X-axis direction from the end surface in the positive direction of the X-axis of the dielectric substrate 130.
  • the surface 123 of the dielectric block 121 in the negative direction of the X-axis is arranged to face the main surface of the ground electrode GND1.
  • the surface 123 of the dielectric block 121 has an approximately square shape.
  • the dielectric block 121 may be in contact with the ground electrode GND1 or may be spaced apart from it.
  • a SiP (System In Package) module 105 is disposed on the upper surface 131 of the dielectric substrate 130.
  • the SiP module 105 is a control device that incorporates an RFIC 110, as well as a circuit in which a power module IC for a power supply and a power inductor (not shown) are mounted on the substrate.
  • the circuit is sealed with resin 106, and is mounted on the dielectric substrate 130 by a connecting member such as a solder bump 160. Note that the SiP module 105 is omitted in FIG. 2.
  • power supply wiring 140, 145 for transmitting high frequency signals from the RFIC 110 to the dielectric block 121 is arranged on the upper surface 131 of the dielectric substrate 130.
  • the power supply wiring 140 includes a wiring electrode 141 connected to the solder bumps 160 that connect the SiP module 105 to the dielectric substrate 130 and to the dielectric block 121, and a stub 142 branching off from the wiring electrode 141.
  • the wiring electrode 141 extends in the X-axis direction on the upper surface 131 of the dielectric substrate 130, passes through an opening OP1 in the ground electrode GND1, and is connected to the end of the lower surface 122 of the dielectric block 121 in the negative direction of the Y-axis.
  • the stub 142 branches off in the negative direction of the Y-axis from midway through the wiring electrode 141 on the dielectric substrate 130.
  • the power supply wiring 145 includes a wiring electrode 146 connected to the solder bump 160 and the dielectric block 121, and a stub 147 branching off from the wiring electrode 146.
  • the wiring electrode 146 extends in the X-axis direction on the upper surface 131 of the dielectric substrate 130, passes through an opening OP2 in the ground electrode GND1, and is connected to the end of the lower surface 122 of the dielectric block 121 in the positive direction of the Y-axis.
  • the stub 147 branches off in the positive direction of the Y-axis from midway along the wiring electrode 146 on the dielectric substrate 130.
  • the wiring electrodes 141 and 146 are spaced apart from each other in a direction parallel to the surface 123 of the dielectric block 121 (the Y-axis direction).
  • the wiring electrodes 141 and 146 are arranged opposite the ground electrode GND2 of the dielectric substrate 130, and function as strip lines.
  • the power supply wiring 140, 145 is arranged on the upper surface 131 of the dielectric substrate 130, but the power supply wiring 140, 145 may be arranged on an inner layer of the dielectric substrate 130.
  • radio waves polarized in the direction of the arrow AR1 in FIG. 2 i.e., one diagonal direction of the substantially square end face 123
  • radio waves polarized in the positive direction of the X-axis the direction of the arrow AR3 in FIG. 3
  • radio waves polarized in the direction of the arrow AR2 in FIG. 2 in FIG. 2 i.e., the other diagonal direction of the substantially square end face 123, are radiated in the positive direction of the X-axis.
  • the antenna module 100 is a dual-polarized type antenna module.
  • the surface 123 of the dielectric block 121 is approximately square, so that the polarization directions of the two radiated radio waves are perpendicular to each other.
  • the dielectric block 121 opposite the main surface of the ground electrode GND1 that is arranged crosswise to the dielectric substrate 130, it is possible to radiate radio waves in a direction different from the normal direction of the dielectric substrate 130. Furthermore, by supplying high-frequency signals to different positions on the surface of the dielectric block 121 that faces the ground electrode GND1, it is possible to make a dual-polarized type antenna module. Note that by making the polarization directions of the two radio waves radiated from the dielectric block 121 orthogonal to each other, it is possible to improve the cross-polarization discrimination ratio (XPD).
  • XPD cross-polarization discrimination ratio
  • the ground electrode GND1 for the dielectric block 121 is arranged so as to be perpendicular to the dielectric substrate 130, i.e., so that the angle between the ground electrode GND1 and the dielectric substrate 130 is 90°; however, the angle between the ground electrode GND1 and the dielectric substrate 130 does not necessarily have to be 90°.
  • ground electrode GND1" and “ground electrode GND2" in embodiment 1 correspond to the “first ground electrode” and “second ground electrode” in this disclosure, respectively.
  • the “wiring electrode 141" and “wiring electrode 146" in embodiment 1 correspond to the “first wiring” and “second wiring” in this disclosure, respectively.
  • the “lower surface 122" and “surface 123" of the dielectric block 121 in embodiment 1 correspond to the “first surface” and “second surface” in this disclosure, respectively.
  • Fig. 4 is a diagram for explaining the first and second modifications of the arrangement of the power feed wirings 140 and 145 in the dielectric block 121.
  • the power supply wiring 145 is connected to the end of the lower surface 122 of the dielectric block 121 in the positive direction of the Y axis, and the power supply wiring 140 is connected to the end of the lower surface 122 of the dielectric block 121 in the negative direction of the Y axis.
  • connection portions of the power supply wirings 140A, 145A with the dielectric block 121 in the antenna module 100A of the first modification have a substantially L-shaped cross section when viewed in a plan view from the X-axis direction. That is, the power supply wiring 140A extends from the bottom surface 122 to the side surface 125 at the end of the bottom surface 122 of the dielectric block 121 in the negative direction of the Y-axis.
  • the power supply wiring 145A extends from the bottom surface 122 to the side surface 124 at the end of the bottom surface 122 of the dielectric block 121 in the positive direction of the Y-axis.
  • the power supply wiring 140B, 145B in the antenna module 100B of the second modification has a cross-sectional shape similar to that of the power supply wiring 140, 145 in the first embodiment, but is connected to the dielectric block 121 at a position slightly offset inward from the end of the lower surface 122 in the Y-axis direction.
  • Fig. 5 is a diagram for explaining the third and fourth modified examples of the state of coupling between the dielectric block 121 and the power supply lines 140 and 145.
  • the antenna module 100 of the first embodiment a configuration in which the dielectric block 121 and the power supply wirings 140 and 145 are directly connected has been described.
  • the antenna module 100C of the third modification (the left diagram of FIG. 5)
  • a small gap is provided between the lower surface 122 of the dielectric block 121 and the power supply wirings 140 and 145, and the dielectric block 121 and the power supply wirings 140 and 145 are in a non-contact state. If the attenuation of the high-frequency signal due to this gap is less than a predetermined amount, the high-frequency signal can be transmitted to the dielectric block 121 even in a non-contact state, and radio waves can be emitted from the dielectric block 121.
  • the impedance can be adjusted by adjusting the gap amount between the dielectric block 121 and the power supply wirings 140 and 145. If the free space wavelength of the radio waves emitted from the dielectric block 121 is ⁇ , the gap amount between the dielectric block 121 and the power supply wirings 140 and 145 is set to within ⁇ /10.
  • the gap may be an air space, or another dielectric such as a resist may be disposed in the gap.
  • the power supply wiring 140 is connected to a flat plate electrode 150 arranged on the lower surface 122 of the dielectric block 121 via a solder bump 155.
  • the power supply wiring 145 is also connected to a flat plate electrode arranged on the dielectric block 121 via a solder bump in a similar manner.
  • the connection strength between the power supply wiring 140, 145 and the dielectric block 121 can be increased.
  • the dielectric substrate 130A in the antenna module 100E has a dimension in the X-axis direction that is longer than the dielectric substrate 130 in the antenna module 100.
  • the dielectric block 121 is positioned so that the end of the dielectric block 121 in the positive direction along the X-axis is substantially in the same position as the end of the dielectric substrate 130 in the positive direction along the X-axis.
  • the ground electrode GND2 arranged on the dielectric substrate 130A is arranged only up to the position where the power supply wiring 140, 145 is arranged. In other words, the ground electrode GND2 is not arranged near the end of the dielectric substrate 130A in the positive direction of the X-axis. Therefore, when viewed in a plan view from the normal direction of the dielectric substrate 130A, at least a part of the area where the dielectric substrate 130A and the dielectric block 121 overlap does not overlap with the ground electrode GND2.
  • the electric field leaking out from the dielectric block 121 may cause the area of the dielectric substrate 130A where there is no ground electrode GND2 to resonate, which may improve the gain.
  • connection between the dielectric block 121 and the dielectric substrate 130A can be stabilized by supporting the dielectric block 121 with resin or double-sided tape placed between the dielectric block 121 and the dielectric substrate 130A.
  • FIG. 7 is a side perspective view of an antenna module 100F of the sixth modification.
  • the SiP module 105 in the antenna module 100 of the first embodiment is replaced with a SiP module 105A, and further the ground electrode GND1 is removed.
  • the description of the elements that overlap with Fig. 3 will not be repeated.
  • a conductive shielding member 107 configured to block electromagnetic waves is disposed around the outer periphery of the SiP module 105A in the antenna module 100F.
  • the shielding member 107 is formed from a metal member such as copper, aluminum, or iron, and is electrically connected to a ground potential. This shielding member 107 prevents electromagnetic waves generated in the internal circuitry of the SiP module 105A from leaking to the outside, thereby suppressing the effects on external devices.
  • the shielding member 107 also prevents electromagnetic noise from entering the internal circuitry of the SiP module 105A from the outside.
  • the dielectric block 121 is arranged so that the surface 123 in the negative direction of the X axis faces the shielding member 107 on the side of the SiP module 105A. This configuration can reduce the ground electrode GND1, lowering manufacturing costs and contributing to the miniaturization of the antenna module.
  • the "shield member 107" in variant example 6 corresponds to the "conductive member" in this disclosure.
  • FIG. 8 is a block diagram of a communication device to which an antenna module 100G according to embodiment 2 is applied.
  • the RFIC 110 in the antenna module 100 of FIG. 1 is replaced with an RFIC 110X, and a flat radiating element 127 is added to the dielectric substrate 130.
  • FIG. 8 shows an example in which four radiating elements 127 are arranged on the dielectric substrate 130.
  • the radiating element 127 has a substantially square shape when viewed in a plan view from the normal direction of the dielectric substrate 130.
  • the radiating element 127 has two feed points SP1 and SP2 arranged at positions offset in different directions from the center of the element, and a high-frequency signal is supplied to each of the feed points SP1 and SP2.
  • the RFIC 110X further includes feed circuits 110C and 110D in addition to the feed circuits 110A and 110B.
  • the feed circuits 110A and 110B are circuits for supplying a high-frequency signal to the dielectric block 121, similar to the antenna module 100 of the first embodiment.
  • the feed circuit 110C is a circuit for supplying a high-frequency signal to the feed point SP1 of the radiating element 127.
  • the feed circuit 110D is a circuit for supplying a high-frequency signal to the feed point SP2 of the radiating element 127.
  • the internal configurations of the feed circuits 110B to 110D are the same as the feed circuit 110A, and FIG. 8 shows the detailed configuration only for the feed circuit 110A.
  • Fig. 9 is a perspective view of the antenna module 100G of Fig. 8
  • Fig. 110 is a side perspective view of the antenna module 100G as viewed from the opposite direction of the Y axis. Note that the SiP module 105 is omitted in Fig. 9.
  • dielectric blocks 121 are arranged spaced apart from one another along the Y-axis direction on the end side in the positive direction of the X-axis of a dielectric substrate 130. If the wavelength of the radio wave radiated from the dielectric block 121 is ⁇ 1 , adjacent dielectric blocks 121 are arranged at a pitch of ⁇ 1 /2.
  • radiating elements 127 are arranged spaced apart from one another along the Y-axis direction on the lower surface 132 side of the dielectric substrate 130. If the wavelength of the radio waves radiated from the radiating elements 127 is ⁇ 2 , adjacent radiating elements 127 are arranged at a pitch of ⁇ 2 /2.
  • the frequency band of the radio waves radiated from the radiating elements 127 may be the same as or different from the frequency band of the radio waves radiated from the dielectric block 121.
  • the radiating element 127 is disposed on the bottom surface 132 side of the ground electrode GND2 disposed on the dielectric substrate 130, facing the ground electrode GND2.
  • the radiating element 127 may be disposed so as to be exposed on the bottom surface 122 of the dielectric substrate 130, as shown in FIG. 10, or may be disposed on an inner layer between the ground electrode GND2 and the bottom surface 132.
  • a high-frequency signal is transmitted from RFIC 110A to radiating element 127 via power supply wiring 151, 152.
  • Power supply wiring 151 passes from solder bump 160 through ground electrode GND2 and is connected to power supply point SP1 of radiating element 127.
  • Power supply wiring 152 passes from solder bump 160 through ground electrode GND2 and is connected to power supply point SP2 of radiating element 127.
  • Feed point SP1 is located at a position offset in the Y-axis direction from the center of radiating element 127.
  • feed point SP1 When a high-frequency signal is supplied to feed point SP1, radio waves polarized in the Y-axis direction are radiated in the negative direction of the Z-axis (the direction of arrow AR4 in Figure 10).
  • Feed point SP2 is located at a position offset in the negative direction of the X-axis from the center of radiating element 127.
  • radio waves polarized in the X-axis direction are radiated in the negative direction of the Z-axis.
  • dielectric block 121 is similar to that of the antenna module 100 in embodiment 1, so its description will not be repeated.
  • Fig. 11 is a side perspective view of an antenna module 100H of Modification 7.
  • the antenna module 100H has a configuration in which a flat patch antenna is provided on the dielectric substrate 130 in the configuration of Modification 6 described in Fig. 7.
  • Fig. 11 the description of elements that overlap with Fig. 7 will not be repeated.
  • a flat radiating element 127 is disposed on the lower surface 132 of the dielectric substrate 130. High-frequency signals are supplied from the RFIC 110 to the power supply points SP1 and SP2 of the radiating element 127 via the power supply wirings 151 and 152, respectively.
  • the antenna module 100H By configuring the antenna module 100H, it is possible to eliminate the ground electrode GND1, thereby reducing manufacturing costs and miniaturizing the antenna module, and it is also possible to radiate radio waves in two different directions.
  • (Variation 8) 12 is a side perspective view of an antenna module 100I according to Modification 8.
  • the antenna module 100I is an example in which the antenna module 100H shown in FIG.
  • the dimensions in the X-axis direction of dielectric substrate 130 and SiP module 105A are smaller than those in antenna module 100H.
  • Radiating element 127 is disposed close to the end of dielectric substrate 130 in the positive direction of the X-axis. In other words, when viewed in a plan view from the normal direction of dielectric substrate 130, at least a portion of radiating element 127 overlaps dielectric block 121.
  • antenna module 100I By using a configuration like antenna module 100I, it is possible to further reduce the size of the antenna module.
  • FIG. 13 is a partial side perspective view of a communication device 10 according to embodiment 3.
  • the antenna module 100 described in FIG. 3 of embodiment 1 will be used for explanation.
  • FIG. 14 is a partial plan view of the communication device in FIG. 13 as viewed from the positive direction of the X-axis. Note that in the following explanation, the explanation of each element of the antenna module 100 that overlaps with FIG. 3 will not be repeated.
  • the communication device 10 includes a housing 20 for housing internal equipment including the antenna module 100.
  • the housing 20 includes a first portion 21 formed of a material that contains metal, and a second portion 22 formed of a dielectric material that does not contain metal, such as a resin.
  • the second portion 22 is disposed inside a through hole 23 formed in the first metal portion 21.
  • the antenna module 100 is arranged so that the entire surface 126 of the dielectric block 121 opposite surface 123, i.e., the radio wave radiation surface (the surface in the positive direction of the X-axis), is in contact with the second portion 22 of the housing 20.
  • the entire surface 126 of the dielectric block 121 overlaps with the second portion 22.
  • the dielectric block 121 It is desirable to bring the dielectric block 121 into close contact with the second portion 22 of the housing 20. If there is a space between the dielectric block 121 and the second portion 22, the dielectric constant of the radiation path of the radio waves will change due to the air layer in the space, and reflections will occur at the boundary between the dielectric block 121 and the air layer, and at the boundary between the air layer and the second portion 22 of the housing 20, which can cause deterioration of the antenna gain. Therefore, by bringing the dielectric block 121 into close contact with the second portion 22, it is possible to reduce the reflection of radio waves and suppress deterioration of the antenna gain.
  • the difference between the dielectric constant of the dielectric block 121 and the dielectric constant of the second portion 22 is preferable to make the difference between the dielectric constant of the dielectric block 121 and the dielectric constant of the second portion 22 as small as possible.
  • first portion 21 was made of a material that contained metal, but as long as the strength of the housing 20 can be ensured, the entire housing 20 may be made of a material that does not contain metal.
  • An antenna module includes a substrate, a dielectric block, a flat-plate shaped first ground electrode, and a power feed wiring.
  • the dielectric block has a first surface and a second surface that intersect with each other, and is disposed on the first surface facing a mounting surface of the substrate.
  • the first ground electrode intersects with the substrate and is disposed facing the second surface of the dielectric block.
  • the power feed wiring is disposed on the substrate and transmits a high frequency signal to the dielectric block. When viewed in a plan view from the normal direction of the substrate, an end of the power feed wiring is disposed in a position that overlaps with the dielectric block.
  • the power supply wiring includes a first wiring and a second wiring.
  • the first wiring and the second wiring are arranged spaced apart from each other in a first direction parallel to the second surface.
  • the second surface of the dielectric block has a substantially square shape.
  • the first surface of the dielectric block has a first end and a second end that face each other in the first direction.
  • the first wiring is disposed at the first end, and the second wiring is disposed at the second end.
  • the antenna module described in any one of paragraphs 1 to 3 further includes a second ground electrode and a flat radiating element.
  • the second ground electrode is disposed on the substrate opposite the power supply wiring.
  • the radiating element is disposed on the substrate opposite the second ground electrode.
  • the power supply wiring is arranged in contact with the dielectric block.
  • the dielectric block is disposed at a distance from the first ground electrode.
  • the power supply wiring is arranged at a distance from the dielectric block. If the free space wavelength of the radio wave radiated from the dielectric block is ⁇ , the distance between the power supply wiring and the dielectric block is within ⁇ /10.
  • the dielectric block is arranged in contact with the first ground electrode.
  • the antenna module described in any one of Items 1 to 8 further includes a second ground electrode disposed on the substrate opposite the power supply wiring. When viewed in a plan view from the normal direction of the substrate, at least a portion of the area where the substrate and the dielectric block overlap does not overlap with the second ground electrode.
  • the dielectric constant of the dielectric block is greater than the dielectric constant of the substrate.
  • the dielectric constant of the dielectric block is 10 or more.
  • the antenna module described in any one of paragraphs 1 to 3 further includes a power supply device.
  • the power supply device is disposed on the main surface of the substrate on which the dielectric block is mounted, and is configured to supply a high-frequency signal to the dielectric block.
  • the power supply device is surrounded by a conductive member. A part of the conductive member is used as a first ground electrode.
  • the antenna module described in clause 12 further includes a second ground electrode and a flat radiating element.
  • the second ground electrode is disposed on the substrate opposite the power supply wiring.
  • the radiating element is disposed on the substrate opposite the second ground electrode.
  • the antenna module described in clause 4 further includes a power supply circuit disposed on the substrate and configured to supply a high-frequency signal to the dielectric block and the radiating element.
  • a communication device is equipped with an antenna module as described in any one of the preceding paragraphs 1 to 15.
  • the communication device described in clause 16 further includes a housing that houses the antenna module.
  • the housing includes a specific portion that is at least partially formed of a material that does not contain metal. When viewed in a plan view from the normal direction of the radio wave radiation surface of the dielectric block, the entire radiation surface overlaps with the specific portion.
  • 10 communication device 20 housing, 21 first part, 22 second part, 23 through hole, 100, 100A to 100I antenna module, 105, 105A SiP module, 106 resin, 107 shielding member, 110, 100X RFIC, 110A to 110D power supply circuit, 111A to 111D, 113A to 113D, 117 switch, 112AR to 112DR low noise amplifier, 112AT to 112DT power amplifier, 114A to 114D attenuator, 115A to 115D phase shifter, 116 signal combiner/distributor, 11 8 mixer, 119 amplifier circuit, 120 antenna device, 121 dielectric block, 122, 132 bottom surface, 123, 126 top surface, 124, 125 side surface, 127 radiating element, 130, 130A dielectric substrate, 131 top surface, 140, 140A, 140B, 145, 145A, 145B, 151, 152 power supply wiring, 141, 146 wiring electrode, 142, 147 stub, 150 flat plate electrode,

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Abstract

This antenna module (100) comprises a dielectric board (130), dielectric blocks (121), a tabular ground electrode (GND1), and electric power supply wiring (140, 145). The dielectric blocks (121) have mutually perpendicular surfaces (122, 123) and are positioned so that the surfaces (122) face a mounting surface of the dielectric board (130). The ground electrode (GND1) is positioned so as to be perpendicular to the dielectric board (130) and to face the surfaces (123) of the dielectric blocks (121). The electric power supply wiring (140, 145) is positioned on the dielectric board (130) and transmits high-frequency signals to the dielectric blocks (121). When seen in plan view from the direction normal to the dielectric board (130), end portions of the electric power supply wiring (140, 145) are positioned at positions that overlap the dielectric blocks (121).

Description

アンテナモジュールおよびそれを搭載した通信装置Antenna module and communication device equipped with same
　本開示は、アンテナモジュールおよびそれを搭載した通信装置に関し、より特定的には、誘電体共振器アンテナの放射方向を調整する構成に関する。 This disclosure relates to an antenna module and a communication device equipped with the same, and more specifically to a configuration for adjusting the radiation direction of a dielectric resonator antenna.
　特開２０００－２０９０２０号公報（特許文献１）には、平板形状の基板上に配置された誘電体材料の直方体（誘電体ブロック）に高周波信号を供給して電波を放射させる、誘電体共振器アンテナ（ＤＲＡ：Dielectric　Resonator　Antenna）が開示されている。 JP 2000-209020 A (Patent Document 1) discloses a dielectric resonator antenna (DRA) that radiates radio waves by supplying a high-frequency signal to a rectangular parallelepiped (dielectric block) made of dielectric material placed on a flat substrate.
　特許文献１に開示された誘電体共振器アンテナにおいては、供給された高周波信号（電界）が、誘電体ブロック内で共振することによって、基板に配置された接地電極とは反対方向、すなわち基板の法線方向に電波が放射される。誘電体共振器アンテナから放射される電波の周波数特性は、誘電体ブロックの形状、寸法および誘電率によって定まる。また、特許文献１の誘電体共振器アンテナにおいては、誘電体ブロックへの高周波信号の供給経路は１つであるので、誘電体ブロックからは、特定の１つの偏波方向にのみ電波が放射される。 In the dielectric resonator antenna disclosed in Patent Document 1, a supplied high-frequency signal (electric field) resonates within the dielectric block, causing radio waves to be emitted in the opposite direction to the ground electrode placed on the substrate, i.e., in the normal direction of the substrate. The frequency characteristics of the radio waves radiated from the dielectric resonator antenna are determined by the shape, dimensions and dielectric constant of the dielectric block. Furthermore, in the dielectric resonator antenna of Patent Document 1, there is only one supply path for the high-frequency signal to the dielectric block, so radio waves are radiated from the dielectric block in only one specific polarization direction.
特開２０００－２０９０２０号公報JP 2000-209020 A
　上述のようなアンテナ装置は、携帯電話あるいはスマートフォンに代表されるモバイル通信装置に用いられる場合がある。モバイル通信装置においては、基地局またはルータなどの他の機器との確実な通信を実現するために、装置内に複数のアンテナを配置し、異なる放射方向に電波を放射することが可能な構成が用いられている。 Antenna devices such as those described above may be used in mobile communication devices such as mobile phones or smartphones. In mobile communication devices, in order to ensure reliable communication with other devices such as base stations or routers, multiple antennas are arranged within the device, and a configuration is used that allows radio waves to be emitted in different directions.
　このような通信装置に特許文献１に開示された誘電体共振器アンテナを適用する場合、誘電体ブロックが配置される基板の法線方向にしか電波を放射することができない。 If the dielectric resonator antenna disclosed in Patent Document 1 is applied to such a communication device, radio waves can only be emitted in the normal direction of the substrate on which the dielectric block is placed.
　本開示は、このような課題を解決するためになされたものであって、その目的は、基板の法線方向とは異なる方向に電波を放射可能な誘電体共振器アンテナを提供することである。 The present disclosure has been made to solve these problems, and its purpose is to provide a dielectric resonator antenna that can radiate radio waves in a direction different from the normal direction of the substrate.
　本開示に係るアンテナモジュールは、基板と、誘電体ブロックと、平板形状の第１接地電極と、給電配線とを備える。誘電体ブロックは、互いに交差する第１面および第２面を有し、第１面において基板の実装面に対向して配置されている。第１接地電極は、基板に対して交差するとともに、誘電体ブロックの第２面に対向して配置されている。給電配線は、基板に配置され、誘電体ブロックに高周波信号を伝達する。基板の法線方向から平面視した場合に、給電配線の端部は、誘電体ブロックと重なる位置に配置されている。 The antenna module according to the present disclosure comprises a substrate, a dielectric block, a flat-plate shaped first ground electrode, and a power supply wiring. The dielectric block has a first surface and a second surface that intersect with each other, and is disposed facing the mounting surface of the substrate on the first surface. The first ground electrode intersects with the substrate and is disposed facing the second surface of the dielectric block. The power supply wiring is disposed on the substrate and transmits a high frequency signal to the dielectric block. When viewed in a plan view from the normal direction of the substrate, the end of the power supply wiring is disposed in a position that overlaps with the dielectric block.
　本開示のアンテナモジュールによれば、基板と交差する方向に平板形状の接地電極を有しており、基板の実装面に対向して配置された誘電体ブロックにおいて、基板に対向する面とは異なる面が当該接地電極に対向するように配置されている。このように誘電体ブロックを配置することによって、誘電体ブロックに高周波信号を供給すると、当該接地電極の法線方向に電波を放射することができる。したがって、誘電体ブロックが配置された基板の法線方向とは異なる方向に電波を放射することができる。 The antenna module disclosed herein has a flat ground electrode in a direction intersecting with the substrate, and the dielectric block is arranged opposite the mounting surface of the substrate so that a surface other than the surface facing the substrate faces the ground electrode. By arranging the dielectric block in this manner, when a high-frequency signal is supplied to the dielectric block, radio waves can be radiated in the normal direction of the ground electrode. Therefore, radio waves can be radiated in a direction different from the normal direction of the substrate on which the dielectric block is arranged.
実施の形態１に係るアンテナモジュールが適用される通信装置のブロック図である。1 is a block diagram of a communication device to which an antenna module according to a first embodiment is applied; 図１のアンテナモジュールの斜視図である。FIG. 2 is a perspective view of the antenna module of FIG. 1 . 図１のアンテナモジュールの側面透視図である。FIG. 2 is a side perspective view of the antenna module of FIG. 1 . 誘電体ブロックにおける給電配線の配置の変形例１，２を説明するための図である。11A and 11B are diagrams for explaining modified examples 1 and 2 of the arrangement of power supply wiring in a dielectric block. 誘電体ブロックと給電配線との結合状態の変形例３，４を説明するための図である。13A and 13B are diagrams for explaining modified examples 3 and 4 of the coupling state between the dielectric block and the power supply line. 変形例５のアンテナモジュールの側面透視図である。FIG. 13 is a side perspective view of an antenna module according to a fifth modified example. 変形例６のアンテナモジュールの側面透視図である。FIG. 13 is a side perspective view of an antenna module according to a sixth modified example. 実施の形態２に係るアンテナモジュールが適用される通信装置のブロック図である。FIG. 11 is a block diagram of a communication device to which an antenna module according to a second embodiment is applied. 図８のアンテナモジュールの斜視図である。FIG. 9 is a perspective view of the antenna module of FIG. 8 . 図８のアンテナモジュールの側面透視図である。FIG. 9 is a side perspective view of the antenna module of FIG. 8 . 変形例７のアンテナモジュールの側面透視図である。FIG. 13 is a side perspective view of an antenna module according to a seventh modified example. 変形例８のアンテナモジュールの側面透視図である。FIG. 23 is a side perspective view of an antenna module according to an eighth modified example. 実施の形態３に係る通信装置の部分的な側面透視図である。FIG. 11 is a partial side perspective view of a communication device according to a third embodiment. 図１３の通信装置をＸ軸の正方向から見たときの部分平面図である。14 is a partial plan view of the communication device of FIG. 13 as viewed from the positive direction of the X-axis.
　以下、本開示の実施の形態について、図面を参照しながら詳細に説明する。なお、図中同一または相当部分には同一符号を付してその説明は繰り返さない。 Below, the embodiments of the present disclosure will be described in detail with reference to the drawings. Note that the same or corresponding parts in the drawings will be given the same reference numerals and their description will not be repeated.
　［実施の形態１］
　（通信装置の基本構成）
　図１は、本実施の形態に係るアンテナモジュール１００が適用される通信装置１０のブロック図である。通信装置１０は、たとえば、携帯電話、スマートフォンあるいはタブレットなどの携帯端末や、通信機能を備えたパーソナルコンピュータなどである。本実施の形態に係るアンテナモジュール１００に用いられる電波の周波数帯域の一例は、たとえば２８ＧＨｚ、３９ＧＨｚおよび６０ＧＨｚなどを中心周波数とするミリ波帯の電波であるが、上記以外の周波数帯域の電波についても適用可能である。 [First embodiment]
(Basic configuration of communication device)
1 is a block diagram of a communication device 10 to which an antenna module 100 according to the present embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, a smartphone, or a tablet, or a personal computer equipped with a communication function. An example of the frequency band of radio waves used in the antenna module 100 according to the present embodiment is a millimeter wave band radio wave having a center frequency of, for example, 28 GHz, 39 GHz, or 60 GHz, but radio waves of other frequency bands are also applicable.
　図１を参照して、通信装置１０は、アンテナモジュール１００と、ベースバンド信号処理回路を構成するＢＢＩＣ２００とを備える。アンテナモジュール１００は、給電装置の一例であるＲＦＩＣ１１０と、アンテナ装置１２０とを備える。通信装置１０は、ＢＢＩＣ２００からアンテナモジュール１００へ伝達された中間周波数信号を高周波信号にアップコンバートしてアンテナ装置１２０から放射するとともに、アンテナ装置１２０で受信した高周波信号を中間周波数信号にダウンコンバートしてＢＢＩＣ２００にて信号を処理する。 Referring to FIG. 1, the communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110, which is an example of a power supply device, and an antenna device 120. The communication device 10 upconverts an intermediate frequency signal transmitted from the BBIC 200 to the antenna module 100 to a high frequency signal and radiates the high frequency signal from the antenna device 120, and downconverts a high frequency signal received by the antenna device 120 to an intermediate frequency signal and processes the signal in the BBIC 200.
　アンテナ装置１２０は、略矩形形状を有する平板形状の誘電体基板１３０と、当該誘電体基板１３０に配置された複数の誘電体ブロック１２１を含む。図１においては、誘電体基板１３０に、４つの誘電体ブロック１２１が一列に配置されたアレイ構成の例が記載されているが、誘電体ブロック１２１の数はこれに限らない。誘電体基板１３０に単独の誘電体ブロック１２１が配置されていてもよいし、４つ以外の複数の誘電体ブロック１２１が配置された構成であってもよい。また、誘電体ブロック１２１が二次元的に配列されたアレイ構成であってもよい。誘電体ブロック１２１が一次元アレイ構成に配置される場合、誘電体ブロック１２１から放射される電波の自由空間内波長をλとすると、隣接する誘電体ブロック同士の中心間距離は略λ／２に設定されることが望ましい。 The antenna device 120 includes a flat dielectric substrate 130 having a substantially rectangular shape, and a plurality of dielectric blocks 121 arranged on the dielectric substrate 130. In FIG. 1, an example of an array configuration in which four dielectric blocks 121 are arranged in a row on the dielectric substrate 130 is shown, but the number of dielectric blocks 121 is not limited to this. A single dielectric block 121 may be arranged on the dielectric substrate 130, or a configuration in which a plurality of dielectric blocks 121 other than four are arranged may be used. In addition, an array configuration in which the dielectric blocks 121 are arranged two-dimensionally may be used. When the dielectric blocks 121 are arranged in a one-dimensional array configuration, it is desirable to set the center-to-center distance between adjacent dielectric blocks to approximately λ/2, assuming that the wavelength in free space of the radio wave radiated from the dielectric block 121 is λ.
　誘電体ブロック１２１は、略直方体の形状を有している。誘電体ブロック１２１に所定の周波数帯域の高周波信号が供給されると、誘電体ブロック１２１の内部で電界が共振し、当該共振周波数に対応した電波が誘電体ブロック１２１から外部に放射される。すなわち、アンテナモジュール１００は、誘電体共振器アンテナ（ＤＲＡ）である。誘電体ブロック１２１において生じる共振の共振周波数は、誘電体ブロック１２１の形状、寸法およびブロックを構成する誘電体の誘電率によって定まる。誘電体ブロック１２１の誘電率は、誘電体基板１３０の誘電率よりも高く設定されている。誘電体ブロック１２１の比誘電率は、たとえば１０以上であり、好ましくは１５～２０である。誘電体ブロック１２１の誘電率を誘電体基板１３０の誘電率よりも高く設定することによって、誘電体ブロック１２１内で共振する電界の波長を短くできるので、誘電体ブロック１２１のサイズを小さくすることができる。 The dielectric block 121 has a substantially rectangular parallelepiped shape. When a high-frequency signal in a predetermined frequency band is supplied to the dielectric block 121, an electric field resonates inside the dielectric block 121, and radio waves corresponding to the resonant frequency are radiated from the dielectric block 121 to the outside. In other words, the antenna module 100 is a dielectric resonator antenna (DRA). The resonant frequency of the resonance occurring in the dielectric block 121 is determined by the shape and dimensions of the dielectric block 121 and the dielectric constant of the dielectric that constitutes the block. The dielectric constant of the dielectric block 121 is set higher than the dielectric constant of the dielectric substrate 130. The relative dielectric constant of the dielectric block 121 is, for example, 10 or more, and preferably 15 to 20. By setting the dielectric constant of the dielectric block 121 higher than the dielectric constant of the dielectric substrate 130, the wavelength of the electric field that resonates in the dielectric block 121 can be shortened, and the size of the dielectric block 121 can be reduced.
　実施の形態１のアンテナモジュール１００においては、各誘電体ブロック１２１には、２本の給電配線により高周波信号が供給される。図２等で後述するように、誘電体ブロック１２１への高周波信号の給電位置によって、放射される電波の偏波方向が異なる。すなわち、アンテナモジュール１００は、２つの異なる偏波方向に電波を放射可能な、いわゆるデュアル偏波タイプのアンテナモジュールである。 In the antenna module 100 of the first embodiment, high-frequency signals are supplied to each dielectric block 121 via two power supply wirings. As will be described later with reference to FIG. 2 etc., the polarization direction of the radiated radio waves differs depending on the power supply position of the high-frequency signal to the dielectric block 121. In other words, the antenna module 100 is a so-called dual-polarized type antenna module capable of radiating radio waves in two different polarization directions.
　ＲＦＩＣ１１０は、２つの給電回路１１０Ａ，１１０Ｂを含む。給電回路１１０Ａは、第１偏波方向用の高周波信号を供給するための回路である。給電回路１１０Ｂは、第２偏波方向用の高周波信号を供給するための回路である。なお、給電回路１１０Ｂの内部構成は同様であるため、図１においては、説明を容易にするために、給電回路１１０Ａについてのみ詳細構成が記載されており、給電回路１１０Ｂの構成は省略されている。以下では、代表として給電回路１１０Ａの機能について説明する。 The RFIC 110 includes two power feed circuits 110A and 110B. The power feed circuit 110A is a circuit for supplying a high-frequency signal for a first polarization direction. The power feed circuit 110B is a circuit for supplying a high-frequency signal for a second polarization direction. Note that since the internal configuration of the power feed circuit 110B is similar, in order to facilitate explanation, in FIG. 1, only the detailed configuration of the power feed circuit 110A is shown, and the configuration of the power feed circuit 110B is omitted. Below, the function of the power feed circuit 110A will be explained as a representative.
　給電回路１１０Ａは、スイッチ１１１Ａ～１１１Ｄ，１１３Ａ～１１３Ｄ，１１７と、パワーアンプ１１２ＡＴ～１１２ＤＴと、ローノイズアンプ１１２ＡＲ～１１２ＤＲと、減衰器１１４Ａ～１１４Ｄと、移相器１１５Ａ～１１５Ｄと、信号合成／分配器１１６と、ミキサ１１８と、増幅回路１１９とを備える。 The power supply circuit 110A includes switches 111A-111D, 113A-113D, and 117, power amplifiers 112AT-112DT, low-noise amplifiers 112AR-112DR, attenuators 114A-114D, phase shifters 115A-115D, a signal combiner/distributor 116, a mixer 118, and an amplifier circuit 119.
　高周波信号を送信する場合には、スイッチ１１１Ａ～１１１Ｄ，１１３Ａ～１１３Ｄがパワーアンプ１１２ＡＴ～１１２ＤＴ側へ切換えられるとともに、スイッチ１１７が増幅回路１１９の送信側アンプに接続される。高周波信号を受信する場合には、スイッチ１１１Ａ～１１１Ｄ，１１３Ａ～１１３Ｄがローノイズアンプ１１２ＡＲ～１１２ＤＲ側へ切換えられるとともに、スイッチ１１７が増幅回路１１９の受信側アンプに接続される。 When transmitting a high-frequency signal, switches 111A-111D and 113A-113D are switched to the power amplifiers 112AT-112DT side, and switch 117 is connected to the transmitting amplifier of amplifier circuit 119. When receiving a high-frequency signal, switches 111A-111D and 113A-113D are switched to the low-noise amplifiers 112AR-112DR side, and switch 117 is connected to the receiving amplifier of amplifier circuit 119.
　ＢＢＩＣ２００から伝達された中間周波数信号は、増幅回路１１９で増幅され、ミキサ１１８でアップコンバートされる。アップコンバートされた高周波信号である送信信号は、信号合成／分配器１１６で４分波され、対応する信号経路を通過して、それぞれ異なる誘電体ブロック１２１に給電される。各信号経路に配置された移相器１１５Ａ～１１５Ｄの移相度が個別に調整されることにより、誘電体ブロック１２１から出力される電波の指向性を調整することができる。また、減衰器１１４Ａ～１１４Ｄは送信信号の強度を調整する。 The intermediate frequency signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118. The up-converted high frequency signal, the transmission signal, is split into four by the signal combiner/distributor 116, passes through the corresponding signal paths, and is fed to different dielectric blocks 121. By individually adjusting the phase shift of the phase shifters 115A-115D arranged on each signal path, the directivity of the radio waves output from the dielectric block 121 can be adjusted. In addition, the attenuators 114A-114D adjust the strength of the transmission signal.
　各誘電体ブロック１２１で受信された高周波信号である受信信号はＲＦＩＣ１１０の給電回路１１０Ａに伝達され、異なる４つの信号経路を経由して信号合成／分配器１１６において合波される。合波された受信信号はミキサ１１８で中間周波数信号へダウンコンバートされ、さらに増幅回路１１９で増幅されてＢＢＩＣ２００へ伝達される。 The received signal, which is a high-frequency signal received by each dielectric block 121, is transmitted to the power supply circuit 110A of the RFIC 110 and is combined in the signal combiner/distributor 116 via four different signal paths. The combined received signal is down-converted to an intermediate frequency signal by the mixer 118, and further amplified by the amplifier circuit 119 before being transmitted to the BBIC 200.
　ＲＦＩＣ１１０は、例えば、上記回路構成を含む１チップの集積回路部品として形成される。あるいは、各給電回路ごとに個別の集積回路部品として形成されてもよい。さらに、各誘電体ブロックに対応する機器（スイッチ、パワーアンプ、ローノイズアンプ、減衰器、移相器）について、対応する誘電体ブロック毎に１チップの集積回路部品として形成されてもよい。 The RFIC 110 is formed, for example, as a one-chip integrated circuit component including the above circuit configuration. Alternatively, it may be formed as an individual integrated circuit component for each power supply circuit. Furthermore, for the devices corresponding to each dielectric block (switch, power amplifier, low-noise amplifier, attenuator, phase shifter), it may be formed as a one-chip integrated circuit component for each corresponding dielectric block.
　（アンテナモジュールの構造）
　次に、図２および図３を用いて、実施の形態１におけるアンテナモジュール１００の構成の詳細を説明する。図２は、実施の形態１に係るアンテナモジュール１００の斜視図である。図３は、図２におけるＹ軸方向からアンテナモジュール１００を見たときの側面透過図である。なお、以降の説明おいて、平板形状の誘電体基板１３０の法線方向をＺ軸方向とし、誘電体基板１３０の短辺に沿った方向をＸ軸方向とし、誘電体基板１３０の長辺に沿った方向をＸ軸方向とする。各図においてＺ軸の正方向を上方側、負方向を下方側と称する場合がある。 (Antenna module structure)
Next, the configuration of the antenna module 100 in the first embodiment will be described in detail with reference to Fig. 2 and Fig. 3. Fig. 2 is a perspective view of the antenna module 100 according to the first embodiment. Fig. 3 is a side view of the antenna module 100 when viewed from the Y-axis direction in Fig. 2. In the following description, the normal direction of the flat plate-shaped dielectric substrate 130 is the Z-axis direction, the direction along the short side of the dielectric substrate 130 is the X-axis direction, and the direction along the long side of the dielectric substrate 130 is the X-axis direction. In each figure, the positive direction of the Z-axis may be referred to as the upper side, and the negative direction may be referred to as the lower side.
　アンテナモジュール１００は、ＲＦＩＣ１１０、誘電体ブロック１２１および誘電体基板１３０に加えて、接地電極ＧＮＤ１，ＧＮＤ２および給電配線１４０，１４５をさらに備える。 In addition to the RFIC 110, the dielectric block 121, and the dielectric substrate 130, the antenna module 100 further includes ground electrodes GND1 and GND2 and power supply wiring 140 and 145.
　誘電体基板１３０は、たとえば、低温同時焼成セラミックス（ＬＴＣＣ：Low　Temperature　Co-fired　Ceramics）多層基板、エポキシ、ポリイミドなどの樹脂から構成される樹脂層を複数積層して形成された多層樹脂基板、より低い誘電率を有する液晶ポリマー（Liquid　Crystal　Polymer：ＬＣＰ）から構成される樹脂層を複数積層して形成された多層樹脂基板、フッ素系樹脂から構成される樹脂層を複数積層して形成された多層樹脂基板、ＰＥＴ（Polyethylene　Terephthalate）材から構成される樹脂層を複数積層して形成された多層樹脂基板、あるいは、ＬＴＣＣ以外のセラミックス多層基板である。なお、誘電体基板１３０は必ずしも多層構造でなくてもよく、単層の基板であってもよい。 The dielectric substrate 130 may be, for example, a low temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating multiple resin layers made of resins such as epoxy and polyimide, a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by laminating multiple resin layers made of fluorine-based resin, a multilayer resin substrate formed by laminating multiple resin layers made of PET (Polyethylene Terephthalate), or a ceramic multilayer substrate other than LTCC. Note that the dielectric substrate 130 does not necessarily have to have a multilayer structure and may be a single-layer substrate.
　誘電体基板１３０は、上面１３１および下面１３２を有している。誘電体基板１３０の内部の層には、誘電体基板１３０の全面にわたって接地電極ＧＮＤ２が配置されている。また、誘電体基板１３０のＸ軸の正方向の端部側に、誘電体基板１３０に交差する方向に、平板形状の接地電極ＧＮＤ１が配置されている。アンテナモジュール１００の例においては、接地電極ＧＮＤ１は、誘電体基板１３０の上面１３１からＺ軸正方向に延在し、ＹＺ平面に平行になるように配置された平板形状を有している。なお、接地電極ＧＮＤ１および接地電極ＧＮＤ２の各々は、図示しない実装基板における接地端子に電気的に接続されている。接地電極ＧＮＤ１および接地電極ＧＮＤ２は、互いに接続されていてもよい。 The dielectric substrate 130 has an upper surface 131 and a lower surface 132. In an inner layer of the dielectric substrate 130, a ground electrode GND2 is disposed over the entire surface of the dielectric substrate 130. A flat ground electrode GND1 is disposed on the end side of the dielectric substrate 130 in the positive direction of the X-axis in a direction intersecting the dielectric substrate 130. In the example of the antenna module 100, the ground electrode GND1 extends from the upper surface 131 of the dielectric substrate 130 in the positive direction of the Z-axis and has a flat shape disposed so as to be parallel to the YZ plane. Each of the ground electrodes GND1 and GND2 is electrically connected to a ground terminal on a mounting substrate (not shown). The ground electrodes GND1 and GND2 may be connected to each other.
　誘電体ブロック１２１は、接地電極ＧＮＤ１よりもさらにＸ軸の正方向の端部側の誘電体基板１３０上に、Ｙ軸方向に沿って互いに離間して配置されている。誘電体ブロック１２１は、略直方体の下面１２２が誘電体基板１３０の上面１３１に面しており、誘電体基板１３０のＸ軸の正方向の端面からさらにＸ軸方向に突出するように配置されている。誘電体ブロック１２１のＸ軸の負方向の面１２３は、接地電極ＧＮＤ１の主面に対向するように配置されている。誘電体ブロック１２１の面１２３は、略正方形の形状を有している。なお、誘電体ブロック１２１は、接地電極ＧＮＤ１に接していてもよいし、離間していてもよい。 The dielectric blocks 121 are arranged on the dielectric substrate 130 at a distance from each other along the Y-axis direction, further toward the end in the positive direction of the X-axis than the ground electrode GND1. The dielectric blocks 121 are arranged so that the lower surface 122 of the approximately rectangular parallelepiped faces the upper surface 131 of the dielectric substrate 130 and protrudes further in the X-axis direction from the end surface in the positive direction of the X-axis of the dielectric substrate 130. The surface 123 of the dielectric block 121 in the negative direction of the X-axis is arranged to face the main surface of the ground electrode GND1. The surface 123 of the dielectric block 121 has an approximately square shape. The dielectric block 121 may be in contact with the ground electrode GND1 or may be spaced apart from it.
　誘電体基板１３０の上面１３１には、ＳｉＰ（System　In　Package）モジュール１０５が配置されている。ＳｉＰモジュール１０５は、ＲＦＩＣ１１０、ならびに、図示しない電源用のパワーモジュールＩＣおよびパワーインダクタなどが基板上に実装された回路を内蔵した制御装置である。当該回路は、図３に示されるように、樹脂１０６により封止されており、はんだバンプ１６０のような接続部材によって誘電体基板１３０に実装される。なお、図２においては、ＳｉＰモジュール１０５は省略されている。 A SiP (System In Package) module 105 is disposed on the upper surface 131 of the dielectric substrate 130. The SiP module 105 is a control device that incorporates an RFIC 110, as well as a circuit in which a power module IC for a power supply and a power inductor (not shown) are mounted on the substrate. As shown in FIG. 3, the circuit is sealed with resin 106, and is mounted on the dielectric substrate 130 by a connecting member such as a solder bump 160. Note that the SiP module 105 is omitted in FIG. 2.
　また、誘電体基板１３０の上面１３１には、ＲＦＩＣ１１０から誘電体ブロック１２１に高周波信号を伝達するための給電配線１４０，１４５が配置されている。 Furthermore, power supply wiring 140, 145 for transmitting high frequency signals from the RFIC 110 to the dielectric block 121 is arranged on the upper surface 131 of the dielectric substrate 130.
　給電配線１４０は、ＳｉＰモジュール１０５を誘電体基板１３０に接続するはんだバンプ１６０と誘電体ブロック１２１とに接続された配線電極１４１と、当該配線電極１４１から分岐したスタブ１４２とを含む。配線電極１４１は、誘電体基板１３０の上面１３１をＸ軸方向に延伸し、接地電極ＧＮＤ１の開口部ＯＰ１を貫通して、誘電体ブロック１２１の下面１２２におけるＹ軸の負方向の端部に接続される。スタブ１４２は、誘電体基板１３０において、配線電極１４１の途中からＹ軸の負方向へと分岐している。 The power supply wiring 140 includes a wiring electrode 141 connected to the solder bumps 160 that connect the SiP module 105 to the dielectric substrate 130 and to the dielectric block 121, and a stub 142 branching off from the wiring electrode 141. The wiring electrode 141 extends in the X-axis direction on the upper surface 131 of the dielectric substrate 130, passes through an opening OP1 in the ground electrode GND1, and is connected to the end of the lower surface 122 of the dielectric block 121 in the negative direction of the Y-axis. The stub 142 branches off in the negative direction of the Y-axis from midway through the wiring electrode 141 on the dielectric substrate 130.
　同様に、給電配線１４５は、はんだバンプ１６０と誘電体ブロック１２１とに接続された配線電極１４６と、当該配線電極１４６から分岐したスタブ１４７とを含む。配線電極１４６、誘電体基板１３０の上面１３１をＸ軸方向に延伸し、接地電極ＧＮＤ１の開口部ＯＰ２を貫通して、誘電体ブロック１２１の下面１２２におけるＹ軸の正方向の端部に接続される。スタブ１４７は、誘電体基板１３０において、配線電極１４６の途中からＹ軸の正方向へと分岐している。 Similarly, the power supply wiring 145 includes a wiring electrode 146 connected to the solder bump 160 and the dielectric block 121, and a stub 147 branching off from the wiring electrode 146. The wiring electrode 146 extends in the X-axis direction on the upper surface 131 of the dielectric substrate 130, passes through an opening OP2 in the ground electrode GND1, and is connected to the end of the lower surface 122 of the dielectric block 121 in the positive direction of the Y-axis. The stub 147 branches off in the positive direction of the Y-axis from midway along the wiring electrode 146 on the dielectric substrate 130.
　配線電極１４１および配線電極１４６は、誘電体ブロック１２１の面１２３に平行な方向（Ｙ軸方向）に互いに離間して配置されている。配線電極１４１および配線電極１４６は、誘電体基板１３０の接地電極ＧＮＤ２に対向して配置されており、ストリップ線路として機能する。 The wiring electrodes 141 and 146 are spaced apart from each other in a direction parallel to the surface 123 of the dielectric block 121 (the Y-axis direction). The wiring electrodes 141 and 146 are arranged opposite the ground electrode GND2 of the dielectric substrate 130, and function as strip lines.
　スタブ１４２，１４７は、誘電体ブロック１２１とのインピーダンス整合のために設けられる。なお、スタブ１４２，１４７は必須構成ではなく、誘電体ブロック１２１とのインピーダンスマッチングが実現できれば、スタブ１４２，１４７はなくてもよい。 The stubs 142 and 147 are provided for impedance matching with the dielectric block 121. Note that the stubs 142 and 147 are not essential components, and if impedance matching with the dielectric block 121 can be achieved, the stubs 142 and 147 can be omitted.
　なお、実施の形態１のアンテナモジュール１００においては、給電配線１４０，１４５が誘電体基板１３０の上面１３１に配置される例が示されているが、給電配線１４０，１４５は、誘電体基板１３０の内層に配置されていてもよい。 In the antenna module 100 of the first embodiment, an example is shown in which the power supply wiring 140, 145 is arranged on the upper surface 131 of the dielectric substrate 130, but the power supply wiring 140, 145 may be arranged on an inner layer of the dielectric substrate 130.
　このような構成のアンテナモジュール１００において、給電配線１４０に高周波信号を供給すると、図２における矢印ＡＲ１の方向、すなわち、略正方形の端面１２３の一方の対角線方向を偏波方向とする電波が、Ｘ軸の正方向（図３の矢印ＡＲ３の方向）に放射される。また、給電配線１４５に高周波信号を供給すると、図２における矢印ＡＲ２の方向、すなわち、略正方形の端面１２３の他方の対角線方向を偏波方向とする電波が、Ｘ軸の正方向に放射される。 In an antenna module 100 configured as described above, when a high-frequency signal is supplied to the power supply wiring 140, radio waves polarized in the direction of the arrow AR1 in FIG. 2, i.e., one diagonal direction of the substantially square end face 123, are radiated in the positive direction of the X-axis (the direction of the arrow AR3 in FIG. 3). When a high-frequency signal is supplied to the power supply wiring 145, radio waves polarized in the direction of the arrow AR2 in FIG. 2, i.e., the other diagonal direction of the substantially square end face 123, are radiated in the positive direction of the X-axis.
　このように、誘電体ブロック１２１の断面において、互いに異なる位置に高周波信号を供給することによって、互いに異なる偏波方向を有する２つの電波を放射することができる。すなわち、アンテナモジュール１００は、デュアル偏波タイプのアンテナモジュールである。アンテナモジュール１００においては、誘電体ブロック１２１の面１２３が略正方形であるため、放射される２つの電波の偏波方向は互いに直交する。 In this way, by supplying high-frequency signals to different positions on the cross section of the dielectric block 121, two radio waves having different polarization directions can be radiated. In other words, the antenna module 100 is a dual-polarized type antenna module. In the antenna module 100, the surface 123 of the dielectric block 121 is approximately square, so that the polarization directions of the two radiated radio waves are perpendicular to each other.
　以上のように、実施の形態１のアンテナモジュール１００においては、誘電体基板１３０に対して交差して配置される接地電極ＧＮＤ１の主面に対向して誘電体ブロック１２１を配置することによって、誘電体基板１３０の法線方向とは異なる方向に電波を放射することができる。さらに、誘電体ブロック１２１における接地電極ＧＮＤ１に対向する面において、互いに異なる位置に高周波信号を供給することによって、デュアル偏波タイプのアンテナモジュールとすることができる。なお、誘電体ブロック１２１から放射される２つの電波の偏波方向を互いに直交させることで、交差偏波識別度（ＸＰＤ：Cross-Polarization　Discrimination　ratio）を改善することができる。 As described above, in the antenna module 100 of the first embodiment, by arranging the dielectric block 121 opposite the main surface of the ground electrode GND1 that is arranged crosswise to the dielectric substrate 130, it is possible to radiate radio waves in a direction different from the normal direction of the dielectric substrate 130. Furthermore, by supplying high-frequency signals to different positions on the surface of the dielectric block 121 that faces the ground electrode GND1, it is possible to make a dual-polarized type antenna module. Note that by making the polarization directions of the two radio waves radiated from the dielectric block 121 orthogonal to each other, it is possible to improve the cross-polarization discrimination ratio (XPD).
　なお、アンテナモジュール１００の例においては、誘電体ブロック１２１用の接地電極ＧＮＤ１は、誘電体基板１３０に対して直交、すなわち接地電極ＧＮＤ１と誘電体基板１３０とのなす角が９０°となるように配置されていたが、接地電極ＧＮＤ１と誘電体基板１３０とのなす角は、必ずしも９０°でなくてもよい。 In the example of the antenna module 100, the ground electrode GND1 for the dielectric block 121 is arranged so as to be perpendicular to the dielectric substrate 130, i.e., so that the angle between the ground electrode GND1 and the dielectric substrate 130 is 90°; however, the angle between the ground electrode GND1 and the dielectric substrate 130 does not necessarily have to be 90°.
　実施の形態１における「接地電極ＧＮＤ１」および「接地電極ＧＮＤ２」は、本開示における「第１接地電極」および「第２接地電極」にそれぞれ対応する。実施の形態１における「配線電極１４１」および「配線電極１４６」は、本開示における「第１配線」および「第２配線」にそれぞれ対応する。実施の形態１における誘電体ブロック１２１の「下面１２２」および「面１２３」は、本開示における「第１面」および「第２面」にそれぞれ対応する。 The "ground electrode GND1" and "ground electrode GND2" in embodiment 1 correspond to the "first ground electrode" and "second ground electrode" in this disclosure, respectively. The "wiring electrode 141" and "wiring electrode 146" in embodiment 1 correspond to the "first wiring" and "second wiring" in this disclosure, respectively. The "lower surface 122" and "surface 123" of the dielectric block 121 in embodiment 1 correspond to the "first surface" and "second surface" in this disclosure, respectively.
　（変形例１，２）
　変形例１，２においては、誘電体ブロック１２１における給電位置のバリエーションについて説明する。図４は、誘電体ブロック１２１における給電配線１４０，１４５の配置の変形例１，２を説明するための図である。 (Modifications 1 and 2)
In the first and second modifications, a description will be given of variations in the power feed position in the dielectric block 121. Fig. 4 is a diagram for explaining the first and second modifications of the arrangement of the power feed wirings 140 and 145 in the dielectric block 121.
　実施の形態１で説明したように、誘電体ブロック１２１における接地電極ＧＮＤ１に対向する面１２３に平行な方向に離間して給電配線１４０，１４５を配置することによって、互いに異なる偏波方向の２つの電波を誘電体ブロック１２１から放射することができる。実施の形態１のアンテナモジュール１００においては、誘電体ブロック１２１の下面１２２におけるＹ軸の正方向の端部に給電配線１４５が接続され、Ｙ軸の負方向の端部に給電配線１４０が接続されていた。 As explained in the first embodiment, by arranging the power supply wirings 140, 145 at a distance in a direction parallel to the surface 123 of the dielectric block 121 facing the ground electrode GND1, two radio waves with different polarization directions can be radiated from the dielectric block 121. In the antenna module 100 of the first embodiment, the power supply wiring 145 is connected to the end of the lower surface 122 of the dielectric block 121 in the positive direction of the Y axis, and the power supply wiring 140 is connected to the end of the lower surface 122 of the dielectric block 121 in the negative direction of the Y axis.
　変形例１のアンテナモジュール１００Ａにおける給電配線１４０Ａ，１４５Ａの各々の誘電体ブロック１２１との接続部分は、Ｘ軸方向から平面視した場合に断面が略Ｌ字形状となっている。すなわち、給電配線１４０Ａは、誘電体ブロック１２１の下面１２２のＹ軸の負方向の端部において、下面１２２から側面１２５にわたって延在している。また、給電配線１４５Ａは、誘電体ブロック１２１の下面１２２のＹ軸の正方向の端部において、下面１２２から側面１２４にわたって延在している。変形例１のような構成とすることによって、誘電体ブロック１２１の対角線方向の電界の対称性が安定するため、２つの電波の偏波特性を向上させることができる。 The connection portions of the power supply wirings 140A, 145A with the dielectric block 121 in the antenna module 100A of the first modification have a substantially L-shaped cross section when viewed in a plan view from the X-axis direction. That is, the power supply wiring 140A extends from the bottom surface 122 to the side surface 125 at the end of the bottom surface 122 of the dielectric block 121 in the negative direction of the Y-axis. The power supply wiring 145A extends from the bottom surface 122 to the side surface 124 at the end of the bottom surface 122 of the dielectric block 121 in the positive direction of the Y-axis. By adopting a configuration like that of the first modification, the symmetry of the electric field in the diagonal direction of the dielectric block 121 is stabilized, thereby improving the polarization characteristics of the two radio waves.
　変形例２のアンテナモジュール１００Ｂにおける給電配線１４０Ｂ，１４５Ｂは、実施の形態１における給電配線１４０，１４５と同様の断面形状となっているが、下面１２２におけるＹ軸方向の端部から若干内側にオフセットした位置において、誘電体ブロック１２１に接続されている。 The power supply wiring 140B, 145B in the antenna module 100B of the second modification has a cross-sectional shape similar to that of the power supply wiring 140, 145 in the first embodiment, but is connected to the dielectric block 121 at a position slightly offset inward from the end of the lower surface 122 in the Y-axis direction.
　変形例１，２のような給電位置に高周波信号を供給した場合にも、互いに偏波方向が異なる２つの電波を放射することができる。 Even when a high-frequency signal is supplied to the power supply position as in variants 1 and 2, two radio waves with different polarization directions can be emitted.
　（変形例３，４）
　変形例３，４においては、誘電体ブロック１２１と給電配線１４０，１４５との結合状態のバリエーションについて説明する。図５は、誘電体ブロック１２１と給電配線１４０，１４５との結合状態の変形例３，４を説明するための図である。 (Modifications 3 and 4)
In the third and fourth modified examples, a description will be given of variations in the state of coupling between the dielectric block 121 and the power supply lines 140 and 145. Fig. 5 is a diagram for explaining the third and fourth modified examples of the state of coupling between the dielectric block 121 and the power supply lines 140 and 145.
　実施の形態１のアンテナモジュール１００においては、誘電体ブロック１２１と給電配線１４０，１４５とが直接接続された構成について説明した。変形例３のアンテナモジュール１００Ｃ（図５の左図）においては、誘電体ブロック１２１の下面１２２と給電配線１４０，１４５との間に僅かなギャップが設けられており、誘電体ブロック１２１と給電配線１４０，１４５とが非接触状態となっている。このギャップによる高周波信号の減衰が所定量よりも少ない場合には、非接触状態であっても、誘電体ブロック１２１に高周波信号を伝達することができ、誘電体ブロック１２１から電波を放射することができる。また、誘電体ブロック１２１と給電配線１４０，１４５との間のギャップ量を調整することによって、インピーダンスを調整することもできる。なお、誘電体ブロック１２１から放射される電波の自由空間内波長をλとすると、誘電体ブロック１２１と給電配線１４０，１４５との間のギャップ量はλ／１０以内に設定される。 In the antenna module 100 of the first embodiment, a configuration in which the dielectric block 121 and the power supply wirings 140 and 145 are directly connected has been described. In the antenna module 100C of the third modification (the left diagram of FIG. 5), a small gap is provided between the lower surface 122 of the dielectric block 121 and the power supply wirings 140 and 145, and the dielectric block 121 and the power supply wirings 140 and 145 are in a non-contact state. If the attenuation of the high-frequency signal due to this gap is less than a predetermined amount, the high-frequency signal can be transmitted to the dielectric block 121 even in a non-contact state, and radio waves can be emitted from the dielectric block 121. In addition, the impedance can be adjusted by adjusting the gap amount between the dielectric block 121 and the power supply wirings 140 and 145. If the free space wavelength of the radio waves emitted from the dielectric block 121 is λ, the gap amount between the dielectric block 121 and the power supply wirings 140 and 145 is set to within λ/10.
　なお、上記のギャップの部分は空気層であってもよいし、レジストなどの他の誘電体がギャップ内に配置された構成であってもよい。 The gap may be an air space, or another dielectric such as a resist may be disposed in the gap.
　変形例４のアンテナモジュール１００Ｄ（図５の右図）においては、給電配線１４０は、誘電体ブロック１２１の下面１２２に配置された平板電極１５０と、はんだバンプ１５５を介して接続されている。なお、図示されていないが、給電配線１４５についても同様に、誘電体ブロック１２１に配置された平板電極とはんだバンプを介して接続される。 In the antenna module 100D of the fourth modified example (the right diagram in FIG. 5), the power supply wiring 140 is connected to a flat plate electrode 150 arranged on the lower surface 122 of the dielectric block 121 via a solder bump 155. Although not shown, the power supply wiring 145 is also connected to a flat plate electrode arranged on the dielectric block 121 via a solder bump in a similar manner.
　アンテナモジュール１００Ｄのように、給電配線１４０，１４５と誘電体ブロック１２１とをはんだバンプによって接続する構成とすることによって、給電配線１４０，１４５と誘電体ブロック１２１との接続強度を高めることができる。 By configuring the power supply wiring 140, 145 and the dielectric block 121 to be connected by solder bumps, as in the antenna module 100D, the connection strength between the power supply wiring 140, 145 and the dielectric block 121 can be increased.
　（変形例５）
　変形例５においては、誘電体基板と誘電体ブロックとの配置のバリエーションについて説明する。図６は、変形例５のアンテナモジュール１００Ｅの側面透視図である。アンテナモジュール１００Ｅにおいては、図３で示した実施の形態１のアンテナモジュール１００における誘電体基板１３０が、誘電体基板１３０Ａに置き換わった構成となっている。アンテナモジュール１００Ｅのその他の構成はアンテナモジュール１００と同様であり、図３と重複する要素の説明は繰り返さない。 (Variation 5)
In the fifth modification, variations in the arrangement of the dielectric substrate and the dielectric block will be described. Fig. 6 is a side perspective view of an antenna module 100E of the fifth modification. In the antenna module 100E, the dielectric substrate 130 in the antenna module 100 of the first embodiment shown in Fig. 3 is replaced with a dielectric substrate 130A. The other configuration of the antenna module 100E is similar to that of the antenna module 100, and the description of the elements overlapping with Fig. 3 will not be repeated.
　図６を参照して、アンテナモジュール１００Ｅにおける誘電体基板１３０Ａは、アンテナモジュール１００の誘電体基板１３０よりもＸ軸方向の寸法が長い。これにより、誘電体ブロック１２１は、誘電体ブロック１２１のＸ軸の正方向の端部が、誘電体基板１３０のＸ軸の正方向の端部とほぼ同じ位置になるように配置されている。 Referring to FIG. 6, the dielectric substrate 130A in the antenna module 100E has a dimension in the X-axis direction that is longer than the dielectric substrate 130 in the antenna module 100. As a result, the dielectric block 121 is positioned so that the end of the dielectric block 121 in the positive direction along the X-axis is substantially in the same position as the end of the dielectric substrate 130 in the positive direction along the X-axis.
　一方で、誘電体基板１３０Ａに配置される接地電極ＧＮＤ２は、給電配線１４０，１４５が配置される位置辺りまでしか配置されていない。言い換えれば、誘電体基板１３０ＡのＸ軸の正方向の端部付近には、接地電極ＧＮＤ２は配置されていない。そのため、誘電体基板１３０Ａの法線方向から平面視した場合に、誘電体基板１３０Ａと誘電体ブロック１２１とが重なる領域の少なくとも一部は、接地電極ＧＮＤ２とは重なっていない。 On the other hand, the ground electrode GND2 arranged on the dielectric substrate 130A is arranged only up to the position where the power supply wiring 140, 145 is arranged. In other words, the ground electrode GND2 is not arranged near the end of the dielectric substrate 130A in the positive direction of the X-axis. Therefore, when viewed in a plan view from the normal direction of the dielectric substrate 130A, at least a part of the area where the dielectric substrate 130A and the dielectric block 121 overlap does not overlap with the ground electrode GND2.
　このような構成とすることによって、誘電体ブロック１２１から漏れ出た電界によって、誘電体基板１３０Ａにおける接地電極ＧＮＤ２のない領域が共振し、利得を向上できる場合がある。あるいは、利得を維持した状態で誘電体ブロック１２１を小型化することによって、アンテナモジュールを小型化することも可能である。 By configuring in this way, the electric field leaking out from the dielectric block 121 may cause the area of the dielectric substrate 130A where there is no ground electrode GND2 to resonate, which may improve the gain. Alternatively, it is possible to miniaturize the antenna module by miniaturizing the dielectric block 121 while maintaining the gain.
　また、誘電体ブロック１２１と誘電体基板１３０Ａとの間に樹脂あるいは両面テープを配置して誘電体ブロック１２１を支持することによって、誘電体ブロック１２１と誘電体基板１３０Ａとの接続状態を安定化することもできる。 In addition, the connection between the dielectric block 121 and the dielectric substrate 130A can be stabilized by supporting the dielectric block 121 with resin or double-sided tape placed between the dielectric block 121 and the dielectric substrate 130A.
　（変形例６）
　変形例６においては、誘電体ブロック用の接地電極として、ＳｉＰモジュールの金属製パッケージを利用する構成について説明する。図７は、変形例６のアンテナモジュール１００Ｆの側面透視図である。アンテナモジュール１００Ｆにおいては、実施の形態１のアンテナモジュール１００におけるＳｉＰモジュール１０５がＳｉＰモジュール１０５Ａに置き換えられ、さらに接地電極ＧＮＤ１が除かれた構成となっている。図７において、図３と重複する要素の説明は繰り返さない。 (Variation 6)
In the sixth modification, a configuration will be described in which a metal package of a SiP module is used as a ground electrode for a dielectric block. Fig. 7 is a side perspective view of an antenna module 100F of the sixth modification. In the antenna module 100F, the SiP module 105 in the antenna module 100 of the first embodiment is replaced with a SiP module 105A, and further the ground electrode GND1 is removed. In Fig. 7, the description of the elements that overlap with Fig. 3 will not be repeated.
　図７を参照して、アンテナモジュール１００ＦにおけるＳｉＰモジュール１０５Ａの外周には、電磁波を遮断するように構成された、導電性のシールド部材１０７が配置されている。シールド部材１０７は、たとえば、銅、アルミ、鉄などの金属部材によって形成されており、接地電位に電気的に接続されている。このシールド部材１０７によって、ＳｉＰモジュール１０５Ａの内部の回路で生じる電磁波が外部に漏洩することを防いで、外部機器への影響を抑制することができる。また、シールド部材１０７は、外部からＳｉＰモジュール１０５Ａの内部の回路へ電磁ノイズが混入することも防止できる。 Referring to FIG. 7, a conductive shielding member 107 configured to block electromagnetic waves is disposed around the outer periphery of the SiP module 105A in the antenna module 100F. The shielding member 107 is formed from a metal member such as copper, aluminum, or iron, and is electrically connected to a ground potential. This shielding member 107 prevents electromagnetic waves generated in the internal circuitry of the SiP module 105A from leaking to the outside, thereby suppressing the effects on external devices. The shielding member 107 also prevents electromagnetic noise from entering the internal circuitry of the SiP module 105A from the outside.
　さらに、誘電体ブロック１２１は、Ｘの軸負方向の面１２３が、ＳｉＰモジュール１０５Ａの側面のシールド部材１０７に対向して配置されている。このような構成とすることによって、接地電極ＧＮＤ１を削減して製造コストを低減できるとともに、アンテナモジュールの小型化に寄与することができる。 Furthermore, the dielectric block 121 is arranged so that the surface 123 in the negative direction of the X axis faces the shielding member 107 on the side of the SiP module 105A. This configuration can reduce the ground electrode GND1, lowering manufacturing costs and contributing to the miniaturization of the antenna module.
　変形例６における「シールド部材１０７」は、本開示における「導電部材」に対応する。 The "shield member 107" in variant example 6 corresponds to the "conductive member" in this disclosure.
　［実施の形態２］
　（通信装置の基本構成）
　実施の形態２においては、電波の放射素子として、誘電体ブロックに加えて平板形状のパッチアンテナを備え、異なる方向に電波を放射可能な構成について説明する。 [Embodiment 2]
(Basic configuration of communication device)
In the second embodiment, a configuration will be described in which a flat patch antenna is provided as a radio wave radiating element in addition to a dielectric block, and radio waves can be radiated in different directions.
　図８は、実施の形態２に係るアンテナモジュール１００Ｇが適用される通信装置のブロック図である。図８のアンテナモジュール１００Ｇにおいては、図１のアンテナモジュール１００におけるＲＦＩＣ１１０がＲＦＩＣ１１０Ｘに置き換えられるとともに、平板形状の放射素子１２７が誘電体基板１３０に追加された構成となっている。なお、図８においては、誘電体基板１３０に４つの放射素子１２７が配置された例について示されている。 FIG. 8 is a block diagram of a communication device to which an antenna module 100G according to embodiment 2 is applied. In the antenna module 100G of FIG. 8, the RFIC 110 in the antenna module 100 of FIG. 1 is replaced with an RFIC 110X, and a flat radiating element 127 is added to the dielectric substrate 130. Note that FIG. 8 shows an example in which four radiating elements 127 are arranged on the dielectric substrate 130.
　図８を参照して、放射素子１２７は、誘電体基板１３０の法線方向から平面視した場合に略正方形の形状を有している。放射素子１２７には、素子の中心から互いに異なる方向にオフセットした位置に配置された２つの給電点ＳＰ１，ＳＰ２が配置されており、当該給電点ＳＰ１，ＳＰ２の各々に高周波信号が供給されている。 Referring to FIG. 8, the radiating element 127 has a substantially square shape when viewed in a plan view from the normal direction of the dielectric substrate 130. The radiating element 127 has two feed points SP1 and SP2 arranged at positions offset in different directions from the center of the element, and a high-frequency signal is supplied to each of the feed points SP1 and SP2.
　ＲＦＩＣ１１０Ｘは、給電回路１１０Ａ，１１０Ｂに加えて、給電回路１１０Ｃ，１１０Ｄをさらに含んでいる。給電回路１１０Ａ、０１１０Ｂは、実施の形態１のアンテナモジュール１００と同様に、誘電体ブロック１２１に高周波信号を供給するための回路である。給電回路１１０Ｃは、放射素子１２７の給電点ＳＰ１に高周波信号を供給するための回路である。また、給電回路１１０Ｄは、放射素子１２７の給電点ＳＰ２に高周波信号を供給するための回路である。なお、給電回路１１０Ｂ～１１０Ｄの内部構成は給電回路１１０Ａと同様であり、図８においては、給電回路１１０Ａについてのみ詳細構成が記載されている。 The RFIC 110X further includes feed circuits 110C and 110D in addition to the feed circuits 110A and 110B. The feed circuits 110A and 110B are circuits for supplying a high-frequency signal to the dielectric block 121, similar to the antenna module 100 of the first embodiment. The feed circuit 110C is a circuit for supplying a high-frequency signal to the feed point SP1 of the radiating element 127. The feed circuit 110D is a circuit for supplying a high-frequency signal to the feed point SP2 of the radiating element 127. The internal configurations of the feed circuits 110B to 110D are the same as the feed circuit 110A, and FIG. 8 shows the detailed configuration only for the feed circuit 110A.
　（アンテナモジュールの構造）
　次に、図９および図１０を用いて、アンテナモジュール１００Ｇの詳細について説明する。図９は、図８のアンテナモジュール１００Ｇの斜視図であり、図１１０は、アンテナモジュール１００ＧをＹ軸の不方向から見たときの側面透視図である。なお、図９においては、ＳｉＰモジュール１０５は省略されている。 (Antenna module structure)
Next, the antenna module 100G will be described in detail with reference to Fig. 9 and Fig. 10. Fig. 9 is a perspective view of the antenna module 100G of Fig. 8, and Fig. 110 is a side perspective view of the antenna module 100G as viewed from the opposite direction of the Y axis. Note that the SiP module 105 is omitted in Fig. 9.
　図９および図１０を参照して、アンテナモジュール１００Ｇにおいては、誘電体基板１３０のＸ軸の正方向の端部側に、４つの誘電体ブロック１２１がＹ軸方向に沿って互いに離間して配置されている。誘電体ブロック１２１から放射される電波の波長をλ１とすると、隣接する誘電体ブロック１２１は、λ１／２のピッチで配置される。 9 and 10, in the antenna module 100G, four dielectric blocks 121 are arranged spaced apart from one another along the Y-axis direction on the end side in the positive direction of the X-axis of a dielectric substrate 130. If the wavelength of the radio wave radiated from the dielectric block 121 is λ1 , adjacent dielectric blocks 121 are arranged at a pitch of λ1 /2.
　また、誘電体基板１３０の下面１３２側に、４つの放射素子１２７がＹ軸方向に沿って互いに離間して配置されている。放射素子１２７から放射される電波の波長をλ２とすると、隣接する放射素子１２７は、λ２／２のピッチで配置される。なお、放射素子１２７から放射される電波の周波数帯域は、誘電体ブロック１２１から放射される電波の周波数帯域と同じであってもよいし、異なっていてもよい。 Furthermore, four radiating elements 127 are arranged spaced apart from one another along the Y-axis direction on the lower surface 132 side of the dielectric substrate 130. If the wavelength of the radio waves radiated from the radiating elements 127 is λ2 , adjacent radiating elements 127 are arranged at a pitch of λ2 /2. The frequency band of the radio waves radiated from the radiating elements 127 may be the same as or different from the frequency band of the radio waves radiated from the dielectric block 121.
　放射素子１２７は、誘電体基板１３０に配置された接地電極ＧＮＤ２よりも下面１３２側に、接地電極ＧＮＤ２に対向して配置されている。なお、放射素子１２７は、図１０のように、誘電体基板１３０の下面１２２に露出するように配置されていてもよいし、接地電極ＧＮＤ２と下面１３２との間の内層に配置されていてもよい。 The radiating element 127 is disposed on the bottom surface 132 side of the ground electrode GND2 disposed on the dielectric substrate 130, facing the ground electrode GND2. The radiating element 127 may be disposed so as to be exposed on the bottom surface 122 of the dielectric substrate 130, as shown in FIG. 10, or may be disposed on an inner layer between the ground electrode GND2 and the bottom surface 132.
　放射素子１２７には、給電配線１５１，１５２によって、ＲＦＩＣ１１０Ａから高周波信号が伝達される。給電配線１５１は、はんだバンプ１６０から接地電極ＧＮＤ２を貫通して、放射素子１２７の給電点ＳＰ１に接続される。また、給電配線１５２は、はんだバンプ１６０から接地電極ＧＮＤ２を貫通して、放射素子１２７の給電点ＳＰ２に接続される。 A high-frequency signal is transmitted from RFIC 110A to radiating element 127 via power supply wiring 151, 152. Power supply wiring 151 passes from solder bump 160 through ground electrode GND2 and is connected to power supply point SP1 of radiating element 127. Power supply wiring 152 passes from solder bump 160 through ground electrode GND2 and is connected to power supply point SP2 of radiating element 127.
　給電点ＳＰ１は、放射素子１２７の中心からＹ軸方向にオフセットした位置に配置されている。給電点ＳＰ１に高周波信号が供給されることによって、Ｙ軸方向を偏波方向とする電波が、Ｚ軸の負方向（図１０の矢印ＡＲ４の方向）に放射される。給電点ＳＰ２は、放射素子１２７の中心からＸ軸の負方向にオフセットした位置に配置されている。給電点ＳＰ２に高周波信号が供給されることによって、Ｘ軸方向を偏波方向とする電波がＺ軸の負方向に放射される。 Feed point SP1 is located at a position offset in the Y-axis direction from the center of radiating element 127. When a high-frequency signal is supplied to feed point SP1, radio waves polarized in the Y-axis direction are radiated in the negative direction of the Z-axis (the direction of arrow AR4 in Figure 10). Feed point SP2 is located at a position offset in the negative direction of the X-axis from the center of radiating element 127. When a high-frequency signal is supplied to feed point SP2, radio waves polarized in the X-axis direction are radiated in the negative direction of the Z-axis.
　なお、誘電体ブロック１２１の構成については、実施の形態１のアンテナモジュール１００と同様であるため、その説明は繰り返さない。 Note that the configuration of the dielectric block 121 is similar to that of the antenna module 100 in embodiment 1, so its description will not be repeated.
　このように、誘電体ブロックに加えて、誘電体基板にパッチアンテナを備えることによって、異なる２方向に電波を放射することが可能となる。 In this way, by providing a patch antenna on the dielectric substrate in addition to the dielectric block, it is possible to radiate radio waves in two different directions.
　（変形例７）
　図１１は、変形例７のアンテナモジュール１００Ｈの側面透視図である。アンテナモジュール１００Ｈは、図７で説明した変形例６の構成における誘電体基板１３０に、平板形状のパッチアンテナが設けられた構成となっている。図１１において、図７と重複する要素の説明は繰り返さない。 (Variation 7)
Fig. 11 is a side perspective view of an antenna module 100H of Modification 7. The antenna module 100H has a configuration in which a flat patch antenna is provided on the dielectric substrate 130 in the configuration of Modification 6 described in Fig. 7. In Fig. 11, the description of elements that overlap with Fig. 7 will not be repeated.
　図１１を参照して、アンテナモジュール１００Ｈにおいては、実施の形態２のアンテナモジュール１００Ｇと同様に、誘電体基板１３０の下面１３２に平板形状の放射素子１２７が配置されている。そして、給電配線１５１，１５２を介して、ＲＦＩＣ１１０から放射素子１２７の給電点ＳＰ１，ＳＰ２に、高周波信号がそれぞれ供給されている。 Referring to FIG. 11, in the antenna module 100H, similar to the antenna module 100G of the second embodiment, a flat radiating element 127 is disposed on the lower surface 132 of the dielectric substrate 130. High-frequency signals are supplied from the RFIC 110 to the power supply points SP1 and SP2 of the radiating element 127 via the power supply wirings 151 and 152, respectively.
　アンテナモジュール１００Ｈの構成とすることによって、接地電極ＧＮＤ１を削減して製造コストの削減およびアンテナモジュールの小型化を実現するとともに、異なる２方向に電波を放射することが可能となる。 By configuring the antenna module 100H, it is possible to eliminate the ground electrode GND1, thereby reducing manufacturing costs and miniaturizing the antenna module, and it is also possible to radiate radio waves in two different directions.
　（変形例８）
　図１２は、変形例８のアンテナモジュール１００Ｉの側面透視図である。アンテナモジュール１００Ｉは、図１１で示したアンテナモジュール１００Ｈをさらに小型化した場合の例である。 (Variation 8)
12 is a side perspective view of an antenna module 100I according to Modification 8. The antenna module 100I is an example in which the antenna module 100H shown in FIG.
　具体的には、アンテナモジュール１００Ｉにおいては、アンテナモジュール１００Ｈに比べて誘電体基板１３０およびＳｉＰモジュール１０５ＡのＸ軸方向の寸法が小さくされている。そして、放射素子１２７が誘電体基板１３０のＸ軸の正方向の端部に近接して配置されている。言い換えれば、誘電体基板１３０の法線方向から平面視した場合に、放射素子１２７の少なくとも一部が、誘電体ブロック１２１と重なっている。 Specifically, in antenna module 100I, the dimensions in the X-axis direction of dielectric substrate 130 and SiP module 105A are smaller than those in antenna module 100H. Radiating element 127 is disposed close to the end of dielectric substrate 130 in the positive direction of the X-axis. In other words, when viewed in a plan view from the normal direction of dielectric substrate 130, at least a portion of radiating element 127 overlaps dielectric block 121.
　アンテナモジュール１００Ｉのような構成とすることによって、アンテナモジュールのさらなる小型化を実現することができる。 By using a configuration like antenna module 100I, it is possible to further reduce the size of the antenna module.
　［実施の形態３］
　実施の形態３においては、通信装置におけるアンテナモジュールの配置の一例について説明する。 [Embodiment 3]
In the third embodiment, an example of the arrangement of antenna modules in a communication device will be described.
　図１３は、実施の形態３に係る通信装置１０の部分的な側面透視図である。図１３においては、実施の形態１の図３で説明したアンテナモジュール１００を用いて説明する。また、図１４は、図１３の通信装置をＸ軸の正方向から見たときの部分平面図である。なお、以降の説明において、図３と重複するアンテナモジュール１００の各要素の説明は繰り返さない。 FIG. 13 is a partial side perspective view of a communication device 10 according to embodiment 3. In FIG. 13, the antenna module 100 described in FIG. 3 of embodiment 1 will be used for explanation. Also, FIG. 14 is a partial plan view of the communication device in FIG. 13 as viewed from the positive direction of the X-axis. Note that in the following explanation, the explanation of each element of the antenna module 100 that overlaps with FIG. 3 will not be repeated.
　通信装置１０は、アンテナモジュール１００を含む内部の機器を収容するための筐体２０を備えている。筐体２０は、金属を含む材料で形成された第１部分２１と、金属を含まない樹脂などの誘電体で形成された第２部分２２とを含む。第２部分２２は、金属の第１部分２１に形成された貫通孔２３の内部に配置されている。 The communication device 10 includes a housing 20 for housing internal equipment including the antenna module 100. The housing 20 includes a first portion 21 formed of a material that contains metal, and a second portion 22 formed of a dielectric material that does not contain metal, such as a resin. The second portion 22 is disposed inside a through hole 23 formed in the first metal portion 21.
　アンテナモジュール１００は、誘電体ブロック１２１における面１２３と対向する面１２６、すなわち電波の放射面（Ｘ軸の正方向の面）の全体が、筐体２０の第２部分２２に接するように配置されている。そして、図１４のように、通信装置１０をＸ軸の正方向から平面視した場合に、誘電体ブロック１２１の面１２６の全体が第２部分２２と重なっている。 The antenna module 100 is arranged so that the entire surface 126 of the dielectric block 121 opposite surface 123, i.e., the radio wave radiation surface (the surface in the positive direction of the X-axis), is in contact with the second portion 22 of the housing 20. When the communication device 10 is viewed in a plan view from the positive direction of the X-axis as shown in FIG. 14, the entire surface 126 of the dielectric block 121 overlaps with the second portion 22.
　このように、誘電体ブロック１２１から放射される電波の放射方向の筐体部分に、金属を含まない材料を配置することによって、放射された電波が筐体２０によって遮断あるいは部分的に干渉することが防止できる。したがって、アンテナモジュール１００のアンテナゲインの劣化を抑制することができる。 In this way, by arranging a material that does not contain metal in the housing portion in the direction of radiation of the radio waves radiated from the dielectric block 121, it is possible to prevent the radiated radio waves from being blocked or partially interfered with by the housing 20. Therefore, it is possible to suppress deterioration of the antenna gain of the antenna module 100.
　なお、誘電体ブロック１２１は、筐体２０の第２部分２２に密着させることが望ましい。誘電体ブロック１２１と第２部分２２との間に空間がある場合、当該空間の空気層によって、電波の放射経路の誘電率が変化するため、誘電体ブロック１２１と空気層との境界面、および、空気層と筐体２０の第２部分２２との境界面において反射が生じ、アンテナゲインの劣化の要因となり得る。そのため、誘電体ブロック１２１と第２部分２２とを密着させることで電波の反射を低減し、アンテナゲインの劣化を抑制することができる。 It is desirable to bring the dielectric block 121 into close contact with the second portion 22 of the housing 20. If there is a space between the dielectric block 121 and the second portion 22, the dielectric constant of the radiation path of the radio waves will change due to the air layer in the space, and reflections will occur at the boundary between the dielectric block 121 and the air layer, and at the boundary between the air layer and the second portion 22 of the housing 20, which can cause deterioration of the antenna gain. Therefore, by bringing the dielectric block 121 into close contact with the second portion 22, it is possible to reduce the reflection of radio waves and suppress deterioration of the antenna gain.
　また、誘電率の違いによる反射防止の観点から、誘電体ブロック１２１の誘電率と、第２部分２２の誘電率との差をできるだけ小さくすることが好ましい。 In addition, from the viewpoint of preventing reflections due to differences in dielectric constant, it is preferable to make the difference between the dielectric constant of the dielectric block 121 and the dielectric constant of the second portion 22 as small as possible.
　なお、上記の説明では、筐体２０の一部（第１部分２１）が金属を含む材料で形成される例について説明したが、筐体２０の強度が確保できれば、筐体２０の全体が金属を含まない材料で形成されていてもよい。 In the above description, an example was described in which a portion of the housing 20 (first portion 21) was made of a material that contained metal, but as long as the strength of the housing 20 can be ensured, the entire housing 20 may be made of a material that does not contain metal.
　実施の形態３における「第２部分２２」は、本開示における「特定部分」に対応する。
　［態様］
　（第１項）一態様に係るアンテナモジュールは、基板と、誘電体ブロックと、平板形状の第１接地電極と、給電配線とを備える。誘電体ブロックは、互いに交差する第１面および第２面を有し、第１面において基板の実装面に対向して配置されている。第１接地電極は、基板に対して交差するとともに、誘電体ブロックの第２面に対向して配置されている。給電配線は、基板に配置され、誘電体ブロックに高周波信号を伝達する。基板の法線方向から平面視した場合に、給電配線の端部は、誘電体ブロックと重なる位置に配置されている。 The "second portion 22" in the third embodiment corresponds to the "specific portion" in the present disclosure.
[Aspects]
(Item 1) An antenna module according to one embodiment includes a substrate, a dielectric block, a flat-plate shaped first ground electrode, and a power feed wiring. The dielectric block has a first surface and a second surface that intersect with each other, and is disposed on the first surface facing a mounting surface of the substrate. The first ground electrode intersects with the substrate and is disposed facing the second surface of the dielectric block. The power feed wiring is disposed on the substrate and transmits a high frequency signal to the dielectric block. When viewed in a plan view from the normal direction of the substrate, an end of the power feed wiring is disposed in a position that overlaps with the dielectric block.
　（第２項）第１項に記載のアンテナモジュールにおいて、給電配線は、第１配線および第２配線を含む。第１配線および第２配線は、第２面に平行な第１方向に互いに離間して配置されている。 (2) In the antenna module described in 1, the power supply wiring includes a first wiring and a second wiring. The first wiring and the second wiring are arranged spaced apart from each other in a first direction parallel to the second surface.
　（第３項）第２項に記載のアンテナモジュールにおいて、誘電体ブロックの第２面は、略正方形の形状を有している。誘電体ブロックの第１面は、第１方向において互いに対向する第１端部および第２端部を有している。第１配線は第１端部に配置されており、第２配線は第２端部に配置されている。 (3) In the antenna module described in 2, the second surface of the dielectric block has a substantially square shape. The first surface of the dielectric block has a first end and a second end that face each other in the first direction. The first wiring is disposed at the first end, and the second wiring is disposed at the second end.
　（第４項）第１項～第３項のいずれか１項に記載のアンテナモジュールは、第２接地電極と、平板形状の放射素子とをさらに備える。第２接地電極は、基板において、給電配線に対向して配置されている。放射素子は、基板において、第２接地電極に対向して配置されている。 (4) The antenna module described in any one of paragraphs 1 to 3 further includes a second ground electrode and a flat radiating element. The second ground electrode is disposed on the substrate opposite the power supply wiring. The radiating element is disposed on the substrate opposite the second ground electrode.
　（第５項）第１項～第４項のいずれか１項に記載のアンテナモジュールにおいて、給電配線は、誘電体ブロックに接触して配置されている。 (5) In the antenna module described in any one of paragraphs 1 to 4, the power supply wiring is arranged in contact with the dielectric block.
　（第６項）第５項のいずれか１項に記載のアンテナモジュールにおいて、誘電体ブロックは、第１接地電極から離間して配置されている。 (6) In the antenna module described in any one of paragraphs 5, the dielectric block is disposed at a distance from the first ground electrode.
　（第７項）第１項～第４項のいずれか１項に記載のアンテナモジュールにおいて、給電配線は、誘電体ブロックから離間して配置されている。誘電体ブロックから放射される電波の自由空間内波長をλとすると、給電配線と誘電体ブロックとの間の距離はλ／１０以内である。 (7) In the antenna module described in any one of paragraphs 1 to 4, the power supply wiring is arranged at a distance from the dielectric block. If the free space wavelength of the radio wave radiated from the dielectric block is λ, the distance between the power supply wiring and the dielectric block is within λ/10.
　（第８項）第７項に記載のアンテナモジュールにおいて、誘電体ブロックは、第１接地電極に接触して配置されている。 (8) In the antenna module described in 7, the dielectric block is arranged in contact with the first ground electrode.
　（第９項）第１項～第８項のいずれか１項に記載のアンテナモジュールは、基板において、給電配線に対向して配置された第２接地電極をさらに備える。基板の法線方向から平面視した場合に、基板と誘電体ブロックとが重なる領域の少なくとも一部が第２接地電極とは重なっていない。 (Item 9) The antenna module described in any one of Items 1 to 8 further includes a second ground electrode disposed on the substrate opposite the power supply wiring. When viewed in a plan view from the normal direction of the substrate, at least a portion of the area where the substrate and the dielectric block overlap does not overlap with the second ground electrode.
　（第１０項）第１項～第９項のいずれか１項に記載のアンテナモジュールにおいて、誘電体ブロックの比誘電率は、基板の比誘電率よりも大きい。 (10) In the antenna module described in any one of paragraphs 1 to 9, the dielectric constant of the dielectric block is greater than the dielectric constant of the substrate.
　（第１１項）第１０項に記載のアンテナモジュールにおいて、誘電体ブロックの比誘電率は１０以上である。 (11) In the antenna module described in 10, the dielectric constant of the dielectric block is 10 or more.
　（第１２項）第１項～第３項のいずれか１項に記載のアンテナモジュールは、給電装置をさらに備える。給電装置は、基板において誘電体ブロックが実装される主面に配置され、誘電体ブロックに高周波信号を供給するように構成されている。給電装置の周囲は導電部材で覆われている。導電部材の一部が第１接地電極として使用される。 (12) The antenna module described in any one of paragraphs 1 to 3 further includes a power supply device. The power supply device is disposed on the main surface of the substrate on which the dielectric block is mounted, and is configured to supply a high-frequency signal to the dielectric block. The power supply device is surrounded by a conductive member. A part of the conductive member is used as a first ground electrode.
　（第１３項）第１２項に記載のアンテナモジュールは、第２接地電極と、平板形状の放射素子とをさらに備える。第２接地電極は、基板において、給電配線に対向して配置されている。放射素子は、基板において、第２接地電極に対向して配置されている。 (Clause 13) The antenna module described in clause 12 further includes a second ground electrode and a flat radiating element. The second ground electrode is disposed on the substrate opposite the power supply wiring. The radiating element is disposed on the substrate opposite the second ground electrode.
　（第１４項）第１３項に記載のアンテナモジュールにおいて、基板の法線方向から平面視した場合に、放射素子の少なくとも一部が誘電体ブロックと重なっている。 (14) In the antenna module described in 13, when viewed in a plan view from the normal direction of the substrate, at least a portion of the radiating element overlaps with the dielectric block.
　（第１５項）第４項に記載のアンテナモジュールは、基板上に配置され、誘電体ブロックおよび放射素子に高周波信号を供給するように構成された給電回路をさらに備える。 (Clause 15) The antenna module described in clause 4 further includes a power supply circuit disposed on the substrate and configured to supply a high-frequency signal to the dielectric block and the radiating element.
　（第１６項）一態様に係る通信装置は、第１項～第１５項のいずれか１項に記載のアンテナモジュールを搭載している。 (16) A communication device according to one embodiment is equipped with an antenna module as described in any one of the preceding paragraphs 1 to 15.
　（第１７項）第１６項に記載の通信装置は、アンテナモジュールを収容する筐体をさらに備える。筐体は、少なくとも一部に金属を含まない材料で形成された特定部分を含む。誘電体ブロックにおける電波の放射面の法線方向から平面視した場合に、放射面の全体が特定部分と重なっている。 (Clause 17) The communication device described in clause 16 further includes a housing that houses the antenna module. The housing includes a specific portion that is at least partially formed of a material that does not contain metal. When viewed in a plan view from the normal direction of the radio wave radiation surface of the dielectric block, the entire radiation surface overlaps with the specific portion.
　（第１８項）第１７項に記載の通信装置において、放射面は、特定部分と接している。
　今回開示された実施の形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施の形態の説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 (Item 18) In the communication device described in item 17, the radiation surface is in contact with the specific portion.
The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the embodiments described above, and is intended to include all modifications within the meaning and scope of the claims.
　１０　通信装置、２０　筐体、２１　第１部分、２２　第２部分、２３　貫通孔、１００，１００Ａ～１００Ｉ　アンテナモジュール、１０５，１０５Ａ　ＳｉＰモジュール、１０６　樹脂、１０７　シールド部材、１１０，１００Ｘ　ＲＦＩＣ、１１０Ａ～１１０Ｄ　給電回路、１１１Ａ～１１１Ｄ，１１３Ａ～１１３Ｄ，１１７　スイッチ、１１２ＡＲ～１１２ＤＲ　ローノイズアンプ、１１２ＡＴ～１１２ＤＴ　パワーアンプ、１１４Ａ～１１４Ｄ　減衰器、１１５Ａ～１１５Ｄ　移相器、１１６　信号合成／分配器、１１８　ミキサ、１１９　増幅回路、１２０　アンテナ装置、１２１　誘電体ブロック、１２２，１３２　下面、１２３，１２６　面、１２４，１２５　側面、１２７　放射素子、１３０，１３０Ａ　誘電体基板、１３１　上面、１４０，１４０Ａ，１４０Ｂ，１４５，１４５Ａ，１４５Ｂ，１５１，１５２　給電配線、１４１，１４６　配線電極、１４２，１４７　スタブ、１５０　平板電極、１５５，１６０　はんだバンプ、２００　ＢＢＩＣ、ＧＮＤ１，ＧＮＤ２　接地電極、ＯＰ１，ＯＰ２　開口部、ＳＰ１，ＳＰ２　給電点。 10 communication device, 20 housing, 21 first part, 22 second part, 23 through hole, 100, 100A to 100I antenna module, 105, 105A SiP module, 106 resin, 107 shielding member, 110, 100X RFIC, 110A to 110D power supply circuit, 111A to 111D, 113A to 113D, 117 switch, 112AR to 112DR low noise amplifier, 112AT to 112DT power amplifier, 114A to 114D attenuator, 115A to 115D phase shifter, 116 signal combiner/distributor, 11 8 mixer, 119 amplifier circuit, 120 antenna device, 121 dielectric block, 122, 132 bottom surface, 123, 126 top surface, 124, 125 side surface, 127 radiating element, 130, 130A dielectric substrate, 131 top surface, 140, 140A, 140B, 145, 145A, 145B, 151, 152 power supply wiring, 141, 146 wiring electrode, 142, 147 stub, 150 flat plate electrode, 155, 160 solder bump, 200 BBIC, GND1, GND2 ground electrode, OP1, OP2 opening, SP1, SP2 power supply point.

Claims (18)

  1. 　基板と、
    　互いに交差する第１面および第２面を有し、前記第１面において前記基板の実装面に対向して配置された誘電体ブロックと、
    　前記基板に対して交差するとともに、前記誘電体ブロックの前記第２面に対向して配置された平板形状の第１接地電極と、
    　前記基板に配置され、前記誘電体ブロックに高周波信号を伝達する給電配線とを備え、
    　前記基板の法線方向から平面視した場合に、前記給電配線の端部は、前記誘電体ブロックと重なる位置に配置されている、アンテナモジュール。     A substrate;
    a dielectric block having a first surface and a second surface intersecting each other, the first surface being disposed facing a mounting surface of the substrate;
    a first ground electrode having a flat plate shape arranged to intersect with the substrate and to face the second surface of the dielectric block;
    a power supply wiring disposed on the substrate and configured to transmit a high-frequency signal to the dielectric block;
    an end of the power supply wiring is disposed at a position overlapping with the dielectric block when viewed in a plan view from a normal direction of the substrate;
  2. 　前記給電配線は、第１配線および第２配線を含み、
    　前記第１配線および前記第２配線は、前記第２面に平行な第１方向に互いに離間して配置されている、請求項１に記載のアンテナモジュール。     the power supply wiring includes a first wiring and a second wiring,
    The antenna module according to claim 1 , wherein the first wiring and the second wiring are arranged spaced apart from each other in a first direction parallel to the second surface.
  3. 　前記誘電体ブロックの前記第２面は略正方形の形状を有しており、
    　前記誘電体ブロックの前記第１面は、前記第１方向において互いに対向する第１端部および第２端部を有しており、
    　前記第１配線は、前記第１端部に配置され、
    　前記第２配線は、前記第２端部に配置されている、請求項２に記載のアンテナモジュール。     the second surface of the dielectric block has a substantially square shape,
    the first surface of the dielectric block has a first end and a second end opposed to each other in the first direction,
    The first wiring is disposed at the first end,
    The antenna module according to claim 2 , wherein the second wiring is disposed at the second end portion.
  4. 　前記基板において、前記給電配線に対向して配置された第２接地電極と、
    　前記基板において、前記第２接地電極に対向して配置された平板形状の放射素子とをさらに備える、請求項１～３のいずれか１項に記載のアンテナモジュール。     a second ground electrode disposed on the substrate so as to face the power supply wiring;
    The antenna module according to claim 1, further comprising a flat-plate shaped radiating element disposed on the substrate so as to face the second ground electrode.
  5. 　前記給電配線は、前記誘電体ブロックに接触して配置されている、請求項１～４のいずれか１項に記載のアンテナモジュール。 An antenna module according to any one of claims 1 to 4, wherein the power supply wiring is arranged in contact with the dielectric block.
  6. 　前記誘電体ブロックは、前記第１接地電極から離間して配置されている、請求項５に記載のアンテナモジュール。 The antenna module of claim 5, wherein the dielectric block is disposed at a distance from the first ground electrode.
  7. 　前記給電配線は、前記誘電体ブロックから離間して配置されており、
    　前記誘電体ブロックから放射される電波の自由空間内波長をλとすると、前記給電配線と前記誘電体ブロックとの間の距離はλ／１０以内である、請求項１～４のいずれか１項に記載のアンテナモジュール。     the power supply wiring is disposed at a distance from the dielectric block,
    5. The antenna module according to claim 1, wherein, when the wavelength in free space of the radio wave radiated from the dielectric block is λ, the distance between the power supply wiring and the dielectric block is within λ/10.
  8. 　前記誘電体ブロックは、前記第１接地電極に接触して配置されている、請求項７に記載のアンテナモジュール。 The antenna module according to claim 7, wherein the dielectric block is disposed in contact with the first ground electrode.
  9. 　前記基板において、前記給電配線に対向して配置された第２接地電極をさらに備え、
    　前記基板の法線方向から平面視した場合に、前記基板と前記誘電体ブロックとが重なる領域の少なくとも一部が前記第２接地電極とは重なっていない、請求項１～８のいずれか１項に記載のアンテナモジュール。     The substrate further includes a second ground electrode disposed opposite the power supply wiring,
    The antenna module according to any one of claims 1 to 8, wherein, when viewed in a plane from a normal direction of the substrate, at least a portion of an overlapping area between the substrate and the dielectric block does not overlap with the second ground electrode.
  10. 　前記誘電体ブロックの比誘電率は、前記基板の比誘電率よりも大きい、請求項１～９のいずれか１項に記載のアンテナモジュール。 An antenna module according to any one of claims 1 to 9, wherein the dielectric constant of the dielectric block is greater than the dielectric constant of the substrate.
  11. 　前記誘電体ブロックの比誘電率は１０以上である、請求項１０に記載のアンテナモジュール。 The antenna module according to claim 10, wherein the dielectric constant of the dielectric block is 10 or more.
  12. 　前記基板において前記誘電体ブロックが実装される主面に配置され、前記誘電体ブロックに高周波信号を供給するように構成された給電装置をさらに備え、
    　前記給電装置の周囲は導電部材で覆われており、
    　前記導電部材の一部が前記第１接地電極として使用される、請求項１～３のいずれか１項に記載のアンテナモジュール。     a power supply device arranged on a main surface of the substrate on which the dielectric block is mounted and configured to supply a high-frequency signal to the dielectric block,
    The power supply device is surrounded by a conductive member,
    The antenna module according to claim 1, wherein a portion of the conductive member is used as the first ground electrode.
  13. 　前記基板において、前記給電配線に対向して配置された第２接地電極と、
    　前記基板において、前記第２接地電極に対向して配置された平板形状の放射素子とをさらに備える、請求項１２に記載のアンテナモジュール。     a second ground electrode disposed on the substrate so as to face the power supply wiring;
    The antenna module according to claim 12 , further comprising: a flat-plate shaped radiating element disposed on the substrate so as to face the second ground electrode.
  14. 　前記基板の法線方向から平面視した場合に、前記放射素子の少なくとも一部が、前記誘電体ブロックと重なっている、請求項１３に記載のアンテナモジュール。 The antenna module according to claim 13, wherein at least a portion of the radiating element overlaps with the dielectric block when viewed in a plan view from the normal direction of the substrate.
  15. 　前記基板上に配置され、前記誘電体ブロックおよび前記放射素子に高周波信号を供給するように構成された給電回路をさらに備える、請求項４に記載のアンテナモジュール。 The antenna module of claim 4, further comprising a power supply circuit disposed on the substrate and configured to supply a high-frequency signal to the dielectric block and the radiating element.
  16. 　請求項１～１５のいずれか１項に記載のアンテナモジュールを搭載した、通信装置。 A communication device equipped with an antenna module according to any one of claims 1 to 15.
  17. 　前記アンテナモジュールを収容する筐体をさらに備え、
    　前記筐体は、少なくとも一部に金属を含まない材料で形成された特定部分を含み、
    　前記誘電体ブロックにおける電波の放射面の法線方向から平面視した場合に、前記放射面の全体が前記特定部分と重なっている、請求項１６に記載の通信装置。     Further comprising a housing for accommodating the antenna module,
    the housing includes a specific portion formed at least in part of a material that does not contain metal;
    The communication device according to claim 16 , wherein, when viewed in a plan view from a normal direction of a radiation surface of the dielectric block for radio waves, the entire radiation surface overlaps with the specific portion.
  18. 　前記放射面は、前記特定部分と接している、請求項１７に記載の通信装置。 The communication device according to claim 17, wherein the radiation surface is in contact with the specific portion.
PCT/JP2023/030488 2022-12-16 2023-08-24 Antenna module and communication device equipped with same WO2024127720A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234616A (en) * 2002-02-06 2003-08-22 Sharp Corp Radiator
JP2010245893A (en) * 2009-04-07 2010-10-28 Murata Mfg Co Ltd Mounting structure of antenna
WO2015089643A1 (en) * 2013-12-20 2015-06-25 Tayfeh Aligodarz Mohammadreza Dielectric resonator antenna arrays
WO2020170722A1 (en) * 2019-02-20 2020-08-27 株式会社村田製作所 Antenna module, communication device on which antenna module is mounted, and method for manufacturing antenna module
JP2022020566A (en) * 2020-07-02 2022-02-01 アップル インコーポレイテッド Dielectric resonator antenna modules

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234616A (en) * 2002-02-06 2003-08-22 Sharp Corp Radiator
JP2010245893A (en) * 2009-04-07 2010-10-28 Murata Mfg Co Ltd Mounting structure of antenna
WO2015089643A1 (en) * 2013-12-20 2015-06-25 Tayfeh Aligodarz Mohammadreza Dielectric resonator antenna arrays
WO2020170722A1 (en) * 2019-02-20 2020-08-27 株式会社村田製作所 Antenna module, communication device on which antenna module is mounted, and method for manufacturing antenna module
JP2022020566A (en) * 2020-07-02 2022-02-01 アップル インコーポレイテッド Dielectric resonator antenna modules

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