WO2024122148A1 - Computer system, test item presentation method, and test item presentation program - Google Patents

Computer system, test item presentation method, and test item presentation program Download PDF

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WO2024122148A1
WO2024122148A1 PCT/JP2023/033326 JP2023033326W WO2024122148A1 WO 2024122148 A1 WO2024122148 A1 WO 2024122148A1 JP 2023033326 W JP2023033326 W JP 2023033326W WO 2024122148 A1 WO2024122148 A1 WO 2024122148A1
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components
information
computer system
connection model
processors
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PCT/JP2023/033326
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French (fr)
Japanese (ja)
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清人 松島
祐市 桜井
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株式会社日立製作所
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Publication of WO2024122148A1 publication Critical patent/WO2024122148A1/en

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  • the present invention relates to a computer system, a test item presentation method, and a test item presentation program.
  • the present invention claims priority to Japanese Patent Application No. 2022-194782 filed on December 6, 2022, and Japanese Patent Application No. 2023-110040 filed on July 4, 2023, and for designated countries where incorporation by reference to literature is permitted, the contents of those applications are incorporated by reference into this application.
  • EMC Electromagnetic Compatibility
  • EMC standards are standards that products must comply with. EMC standards regulate the effects of electromagnetic waves emitted from a product on other devices, and regulate product performance degradation and malfunctions caused by electromagnetic waves emitted from other devices. Before a product is shipped to the market, EMC testing is carried out to check whether the product meets the EMC standards (Patent Document 1). EMC testing is not only carried out on new products that are completely different from the old product, but also on upgraded products in which only some of the multiple components (parts) of the old product have been redesigned.
  • the present invention was made in consideration of these circumstances, and aims to make it possible to present test items for EMC tests that need to be re-performed due to changes in the design of components.
  • a computer system is a computer system having one or more processors and one or more memory resources,
  • the one or more processors refer to determination information for determining whether multiple components that make up a product are electromagnetically connected to each other, generate a connection model for multiple frequencies that indicates the electromagnetic connection relationships between the multiple components, estimate an impact range that is affected by the component whose design has been changed in the connection model for each frequency, and present EMC test items associated with the components included in the impact range.
  • the present invention makes it possible to present EMC test items that need to be re-performed due to component design changes.
  • FIG. 1 is a diagram illustrating an example of a configuration of a computer system according to the first embodiment.
  • FIG. 2 is a schematic diagram showing an example of a data structure of design information according to the first embodiment.
  • FIG. 3 is a schematic diagram illustrating an example of a data structure of request information according to the first embodiment.
  • FIG. 4 is a schematic diagram illustrating an example of a data structure of the analysis information according to the first embodiment.
  • FIG. 5 is a schematic diagram showing an example of a data structure of past trouble information according to the first embodiment.
  • FIG. 6 is a schematic diagram showing an example of a data structure of the determination information according to the first embodiment.
  • FIG. 7 is a schematic diagram illustrating an example of a data structure of linkage information according to the first embodiment.
  • FIG. 1 is a diagram illustrating an example of a configuration of a computer system according to the first embodiment.
  • FIG. 2 is a schematic diagram showing an example of a data structure of design information according to the first embodiment.
  • FIG. 8 is a functional block diagram of a computer system according to the first embodiment.
  • FIG. 9 is a schematic diagram for explaining an example of a function of the link unit according to the first embodiment.
  • FIG. 10A is a schematic diagram illustrating an example of a graph showing the mechanical connection relationships of each component in the first embodiment.
  • FIG. 10B is a schematic diagram illustrating an example of a connection model generated by the connection model generating unit according to the first embodiment.
  • FIG. 11A is a schematic diagram illustrating an example of a connection model used by an estimation unit to estimate an influence range in the first embodiment.
  • FIG. 11B is a schematic diagram illustrating an example of a method for estimating an affected range in the first embodiment.
  • FIG. 12 is an example of a flowchart of a method for generating a connection model in the first embodiment.
  • FIG. 13A is a schematic diagram showing an example of a graph in which all nodes are connected in the first embodiment.
  • FIG. 13B is a schematic diagram showing an example in which the probability after summation is written on some edges of the graph in FIG. 13A.
  • FIG. 13C is a schematic diagram showing an example of a connection model output by the connection model generating unit based on the graphs of FIGS. 13A and 13B.
  • FIG. 14A is a schematic diagram showing an example of a “low frequency” connection model in the first embodiment.
  • FIG. 14B is a schematic diagram showing an example of a “high frequency” connection model in the first embodiment.
  • FIG. 14A is a schematic diagram showing an example of a “low frequency” connection model in the first embodiment.
  • FIG. 14B is a schematic diagram showing an example of a “high frequency” connection model in the first embodiment.
  • FIG. 15 is an example of a flowchart of the test item presenting method according to the first embodiment.
  • FIG. 16A is a schematic diagram of an example of a screen display of a start screen displayed on a UI device in the first embodiment.
  • FIG. 16B is a schematic diagram of an example of a screen display of a presentation screen displayed on a UI device in the first embodiment.
  • FIG. 17 is a schematic diagram showing an example of a data structure of propagation path information to which the computer system refers in the second embodiment.
  • FIG. 18 is a schematic diagram illustrating an example of a “propagation route” of the propagation route information according to the second embodiment.
  • FIG. 19 is a functional block diagram of a computer system according to the second embodiment.
  • FIG. 20 is a schematic diagram (part 1) illustrating an example of the function of the route estimation unit according to the second embodiment.
  • FIG. 21 is a schematic diagram (part 2) illustrating an example of the function of the route estimation unit according to the second embodiment.
  • FIG. 22 is a schematic diagram (part 3) illustrating an example of the function of the route estimation unit according to the second embodiment.
  • FIG. 23 is an example of a flowchart of a test item presenting method according to the second embodiment.
  • FIG. 24 is a functional block diagram of a computer system according to the third embodiment.
  • FIG. 25 is a functional block diagram of a computer system according to the fourth embodiment.
  • FIG. 1 is a diagram illustrating an example of a configuration of a computer system according to the first embodiment.
  • a processor in order to generate, transmit, receive data, and perform various other processes, a processor reads a test item presentation program stored in a memory resource, and the processor executes processes according to the test item presentation program.
  • computer system 100 is, for example, a personal computer, a tablet terminal (computer), a smartphone, a server computer, a blade server, a cloud server, or other computer, and is a system that includes at least one of these computers.
  • computer system 100 also includes a system that includes, for example, a cloud server and a display computer (for example, a tablet terminal or smartphone).
  • Another example of computer system 100 is a controller that controls or manages some kind of device, including a processor and memory resources.
  • the computer system 100 has one or more processors 101, one or more memory resources 104, one or more UI devices 102, and one or more NI (Network Interface) devices 103.
  • the computer system 100 may include components other than these.
  • the processor 101, the UI (User Interface) device 102, the NI device 103, and the memory resource 104 are connected to each other via a bus 112.
  • the processor 101 is an arithmetic device that reads various programs stored in the memory resource 104 and executes the processing corresponding to each program.
  • Examples of the processor 101 include a microprocessor, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an FPGA (Field Programmable Gate Array), a quantum processor, or other semiconductor devices capable of performing calculations.
  • the memory resource 104 is a storage device that stores the test item presentation program 105, design information 106, requirement information 107, analysis information 108, past trouble information 109, judgment information 110, and linkage information 111, and is, for example, a non-volatile memory and/or a volatile memory.
  • volatile memory are RAM (Random Access Memory) and ROM (Read Only Memory).
  • non-volatile memory may be rewritable storage media such as flash memory, hard disks, or SSDs (Solid State Drives), as well as USB (Universal Serial Bus) memories, memory cards, and hard disks.
  • RAMs such as MRAM (Magnetoresistive RAM), PRAM (Phase change RAM), and ReRAM (Resistive RAM) may also be considered as non-volatile memory.
  • the processor 101 may provide a service of distributing the test item presentation program 105 stored in the memory resource 104 to other computers.
  • the UI device 102 is an input device that inputs instructions from a user (which may be an operator) to the computer system 100, and an output device that outputs information generated by the computer system 100.
  • input devices include pointing devices such as a keyboard, a touch panel, and a mouse, as well as voice input devices such as a microphone.
  • output devices include a display, a printer, and a voice synthesizer. Unless otherwise specified below, input and output of information between the computer system 100 and the user is performed via the UI device 102.
  • the UI device 102 may be only an input device, or only an output device.
  • the NI device 103 is a communication device that communicates information with external devices.
  • the NI device 103 communicates information with external devices via a specific communication network, such as the Internet or a LAN (Local Area Network). Unless otherwise specified below, information communication between the computer system 100 (or the processor 101) and external devices is performed via the NI device 103.
  • the computer system 100 executes the test item presentation program 105 to present EMC test items for the upgraded product, as described below.
  • the processor 101 refers to the design information 106, the requirement information 107, the analysis information 108, the past trouble information 109, the judgment information 110, and the linkage information 111.
  • These pieces of information 106 to 111 may be outside the computer system 100 as long as they are accessible to the processor 101.
  • the pieces of information 106 to 111 may be stored in cloud storage that the processor 101 can access via a communication network such as the Internet or a LAN.
  • the pieces of information 106 to 111 may be data structures such as files and databases as long as they can store data. Details of the pieces of information 106 to 111 are described below.
  • FIG. 2 is a schematic diagram showing an example of the data structure of design information 106.
  • Design information 106 is information about the design of a product such as an upgrade product, and is a collection of existing information such as model information created by MBSE (Model-Based System Engineering) and CAD (Computer Aided Design) information.
  • Figure 2 illustrates only the information that indicates the design mechanical connection relationships between the components that make up the product.
  • component 106a is associated in design information 106 with connection destination information 106b that indicates the destination component that is mechanically connected to that component.
  • connection destination information 106b indicates the destination component that is mechanically connected to that component.
  • “Power supply A” and “Cable B” are associated, and therefore the product is designed so that "Power supply A” and “Cable B" are mechanically connected.
  • Design information 106 indicates components that are explicitly mechanically connected at the time of design via wiring, etc., and does not indicate electromagnetic connection relationships that were not intended at the time of design. Furthermore, connection destination component information may be omitted from design information 106. In this case, design information 106 is information that indicates only the components included in the product.
  • design information 106 may include design rules.
  • design rules include the distance between two cables.
  • size, length, shape, etc. of the components may be included in the design information 106.
  • FIG. 3 is a schematic diagram showing an example of the data structure of the request information 107.
  • Requirement information 107 is information that indicates the performance required of a product.
  • requirement information 107 is information that associates higher-level requirements with lower-level requirements.
  • Higher-level requirements are requirements that express the performance required of a product in a higher-level concept, and include a "requirement name” and a “requirement content.”
  • the "requirement name” is the name given to the requirement, and the “requirement content” indicates the specific content of the requirement. This is also true for lower-level requirements, which are described below.
  • the "requirement content" of the higher-level requirement "Immunity performance requirement” is "Do not malfunction even when exposed to LTE equipment,” indicating that the product will not malfunction due to electromagnetic waves emitted by external LTE (Long Term Evolution) equipment.
  • Lower-level requirements are information that subdivides the requirements that are required of a product in order to satisfy higher-level requirements.
  • the higher-level requirement "Immunity performance requirement” is subdivided into “710MHz radiation immunity performance” and “745MHz radiation immunity performance.”
  • FIG. 4 is a schematic diagram showing an example of the data structure of the analysis information 108.
  • Analysis information 108 is information that associates "design rules" with “risks” by actually analyzing past products.
  • “design rule” in which two cables run parallel with a distance of d or less, there is a “risk” that these cables will electromagnetically couple with each other at frequencies higher than 1 MHz.
  • the “number” is a number that uniquely identifies the associated "design rule” and "risk.”
  • FIG. 5 is a schematic diagram showing an example of the data structure of past trouble information 109.
  • Past trouble information 109 is information that indicates troubles that have actually occurred in products in the past.
  • past trouble information 109 is information that associates each of the following: "number,” “frequency,” “noise source,” “propagation path,” and "damaged component.”
  • “Number” is a number that uniquely identifies a past trouble case. "Frequency” is the frequency at which the trouble occurred. "Noise source” is the component contained in the product that caused the trouble. "Propagation path” is the path connecting the electromagnetically connected components when the trouble occurred. In this example, the electromagnetically connected components are indicated by letters such as “A,” “B,” and “C,” and hyphens indicate that these components are electromagnetically connected. “Victim component” is the component that malfunctioned due to the "noise source” component.
  • FIG. 6 is a schematic diagram showing an example of the data structure of the judgment information 110.
  • the judgment information 110 is information that stores judgment conditions used by the processor 101 to judge whether components are electromagnetically connected to each other based on the design information 106, analysis information 108, and past trouble information 109.
  • a degree of certainty indicating the likelihood that the components are electromagnetically connected to each other is associated with the judgment condition in advance and stored in the judgment information 110.
  • the degree of certainty is a numerical value between 0 and 1 inclusive. An accuracy of 0 indicates that there is no possibility that the components are electromagnetically connected to each other. An accuracy of 1 indicates that the components are definitely electromagnetically connected to each other.
  • the judgment information 110 is created in advance by the user and stored in the memory resource 104.
  • the judgment information 110 has a target component 110a, a judgment condition 110b based on the design information 106, a judgment condition 110c based on the analysis information 108, and a judgment condition 110d based on the past trouble information 109. Note that it is not necessary to include both of the judgment conditions 110c and 110d in the judgment information 110, but rather it is sufficient that at least one of these conditions is included in the judgment information 110.
  • Target component 110a indicates a pair of components that are to be determined to be electromagnetically connected.
  • the judgment condition 110b based on the design information 106 is a condition for judging whether or not the components of the target component 110a are electromagnetically connected based on the design information 106. For example, if the design information 106 indicates that the two components of the target component 110a are mechanically connected, it is “connected,” and if they are not connected to each other, it is “not connected.” Note that if there is no connection destination information 106b in the design information 106, it is also "not connected.”
  • the design information 106 for designing a product indicates that the components are mechanically connected to each other, the components are reliably connected to each other electromagnetically, and so the degree of certainty is the highest, "1.” On the other hand, if the design information 106 indicates that the components are not mechanically connected to each other, the components are unlikely to be electromagnetically connected to each other, and so the degree of certainty is the lowest, "0.”
  • the determination condition 110c based on the analysis information 108 is a condition for determining whether the components of the target component 110a are electromagnetically connected to each other based on the analysis information 108.
  • the judgment condition 110c multiple judgment conditions are defined for multiple frequencies. For example, consider the case where the two components of the target component 110a are "cables.” In this case, if the frequency is in the range of "XX to ⁇ Hz" and “Condition A” is satisfied, and if the analysis information 108 indicates that a risk occurs, the probability that the "cables” will be electromagnetically connected is “0.1.” Also, if the frequency is in the same range of "XX to ⁇ Hz" as above and “Condition B” is satisfied, and if the analysis information 108 indicates that a risk occurs, the probability that the "cables” will be electromagnetically connected is "0.2.” “Condition A” and “Condition B” are, for example, the length and spacing of each cable.
  • the judgment condition 110d based on the past trouble information 109 is a condition for judging whether the components of the target component 110a are electromagnetically connected to each other based on the past trouble information 109.
  • judgment condition 110d similar to the judgment condition 110c, multiple judgment conditions are set for multiple frequencies.
  • FIG. 7 is a schematic diagram showing an example of the data structure of the linkage information 111.
  • the linkage information 111 is information that associates the "requirement name" in the lower-level requirements of the requirement information 107 (see FIG. 3) with the "component” that affects that requirement. For example, if “Cable B” affects the requirement name “710 MHz immunity performance,” then “Cable B” and “710 MHz immunity performance” are associated as shown in FIG. 7.
  • the linkage information 111 may be created by the user and stored in advance in the memory resource 104, or it may be created by the processor 101 and stored in the memory resource 104 as described below.
  • FIG. 8 is a functional block diagram of computer system 100.
  • the computer system 100 includes, as functional units, a collaboration unit 801, a detection unit 802, an extraction unit 803, a connection model generation unit 804, an estimation unit 805, and a presentation unit 806. These functional units are realized by the processor 101 and the memory resource 104 working together to execute the test item presentation program 105.
  • the linking unit 801 generates linking information 111 by linking the design information 106 and the requirement information 107.
  • FIG. 9 is a schematic diagram for explaining an example of the function of the linking unit 801.
  • the linking unit 801 generates information indicating each component and its connection relationship based on the design information 106. Below, this information is represented diagrammatically as a block diagram 901. Note that if the connection destination information 106b does not exist in the design information 106, the linking unit 801 may identify only the components.
  • the linking unit 801 identifies the sub-requirements that are affected by each component in the block diagram 901. For example, the user creates a table in advance based on the past design information 106, the test results, and the requirement information 107, in which the required sub-requirements are associated with each combination of components and their installation conditions (frequency and length).
  • the linking unit 801 can identify the corresponding sub-requirements by referring to the table for the target component and its installation conditions. For example, if the sub-requirement "710 MHz radiation immunity performance" corresponds to the combination of the target component "cable B" and the installation condition "cable B alone" in the table, the sub-requirement for the combination is "710 MHz radiation immunity performance".
  • the linking unit 801 may identify the sub-requirements using machine learning, not limited to the rule-based processing described above. For example, a learning model that outputs the required sub-requirements when a combination of a component and its installation conditions (frequency and length) is input is created in advance by machine learning. The linking unit 801 can acquire the sub-requirements by inputting the target component and its installation conditions into the learning model.
  • the detection unit 802 detects components whose design has changed based on the design information 106.
  • the user stores the design information 106 of the old product and its upgraded product in the memory resource 104 in advance, and the detection unit 802 detects components whose design has changed based on the difference between the design information 106. For example, if "Power Supply A” was connected to “Cable A” in the old product, but is now connected to "Cable B” in the upgraded product, the detection unit 802 detects "Power Supply A” as a component whose design has changed. Also, if "Sensor A” did not exist in the old product, but “Sensor A” exists in the upgraded product, the detection unit 802 detects "Sensor A” as a component whose design has changed.
  • the extraction unit 803 extracts the mechanical connection relationships of each component based on the design information 106, and generates information indicating the connection relationships. Below, the information indicating the connection relationships is shown diagrammatically in the form of a graph.
  • FIG. 10A is a schematic diagram showing an example of a graph indicating the mechanical connection relationships of each component.
  • This graph 1001 is an undirected graph in which components are represented as nodes N. Edges E between nodes N indicate that the components represented by each node N are mechanically connected to each other.
  • the extraction unit 803 generates nodes N corresponding to the components stored in the components 106a and the connection destination information 106b of the design information 106. The extraction unit 803 then generates edges E between the nodes N that are shown to be mechanically connected in the design information 106.
  • nodes N in graph 1001 are "Power supply A,” “Cable A,” “Sensor A,” “Cable B,” “Sensor B,” “Cable C,” etc.
  • edge E is generated between “Power supply A” and “Cable B.”
  • edge E is generated between “Cable A” and “Sensor B”
  • edge E is generated between "Sensor A” and “Cable C.”
  • connection model generation unit 804 references the determination information 110 to generate a connection model that indicates the electromagnetic connection relationships between multiple components, and stores the model in the memory resource 104.
  • FIG. 10B is a schematic diagram showing an example of a connection model generated by the connection model generation unit 804.
  • connection model 1002 is an undirected graph in which an edge F is added to the graph 1001 (see FIG. 10A).
  • the edge F is an edge that connects nodes N that may be electromagnetically connected, and the existence or nonexistence of the edge is not clear from the design information 106 alone.
  • the method of generating the connection model 1002 will be described in detail later.
  • the estimation unit 805 estimates the extent of the influence of the component whose design has been changed in the connection model 1002. The estimation method is explained below.
  • FIG. 11A is a schematic diagram showing an example of a connection model 1002 used by the estimation unit 805 to estimate the range of influence. Using this connection model 1002, the estimation unit 805 estimates the range of influence G as shown in FIG. 11B.
  • FIG. 11B is a schematic diagram showing an example of a method for estimating the extent of influence.
  • the estimation unit 805 estimates all nodes N that can reach the node N whose design has been changed by tracing edges E or F as the extent of influence G.
  • Components corresponding to nodes included in the extent of influence G are components that are electromagnetically connected to the component whose design has been changed. Therefore, it can be estimated that components corresponding to nodes included in the extent of influence G are affected by the component whose design has been changed.
  • the presentation unit 806 presents, on the UI device 102 (see FIG. 1), EMC test items associated with the components of node N included in the impact range G (see FIG. 11B) based on the linkage information 111 (see FIG. 7).
  • the presentation unit 806 For example, for each node N included in the impact range G (see FIG. 11B), the presentation unit 806 identifies the "requirement name" associated with that node N in the linkage information 111 (see FIG. 7). The presentation unit 806 then presents, as an EMC test item, a test item that satisfies the requirement of the identified "requirement name.” For example, if the "requirement name" identified by the presentation unit 806 is "710 MHz radiation immunity performance," the presentation unit 806 presents, as an EMC test item, a "710 MHz radiation immunity performance test” that tests whether this requirement is satisfied.
  • connection model generation unit 804 generates the connection model 1002.
  • Figure 12 is an example of a flowchart for a method for generating a connection model.
  • connection model generation unit 804 generates a connection model 1002 for each of the multiple frequencies by repeatedly executing this flowchart for each of the multiple frequencies.
  • a connection model generation unit 804 generates a connection model 1002 for two frequencies, a "low frequency” and a "high frequency.”
  • a "low frequency” is a frequency that is equal to or lower than an upper limit frequency (100 MHz), such as between 1 MHz and 100 MHz.
  • a “high frequency” is a frequency that is higher than the upper limit frequency (100 MHz) of the "low frequency,” for example, a frequency in the range of 100 MHz to 1 GHz.
  • connection model generation unit 804 determines whether a connection model 1002 of a similar product similar to the present product is already present in the memory resource 104 (step S1201). For example, the connection model generation unit 804 identifies, among the connection models 1002 of past products, those similar to the graph 1001 extracted by the extraction unit 803 as the connection model 1002 of a similar product.
  • the algorithm for determining similarity is not particularly limited, but for example, the connection model generation unit 804 may determine that a connection model that includes both all components that make up the present product and their mechanical connection relationships is similar.
  • the connection model generation unit 804 may also determine that a connection model of a product with the same product name but different model number is similar.
  • NO no connection model 1002 of a similar product
  • connection model generation unit 804 creates a graph in which all components 106a in the design information 106 (see FIG. 2) are nodes and all nodes are connected.
  • FIG. 13A is a schematic diagram showing an example of a graph 1301 in which all nodes are connected in this way. If there is no connection model 1002 for similar products, the connection model generation unit 804 performs the following steps S1203 to S1209 on this graph 1301.
  • step S1201 YES
  • the connection model generation unit 804 acquires the connection model 1002 of similar products from the memory resource 104, skips step S1203 below, and performs steps S1204 to S1209 for the connection model 1002.
  • connection model generation unit 804 repeats the following process for each pair of nodes N in the graph 1301 or the similar product connection model 1002. For ease of explanation, the following describes an example in which the process is performed on the graph 1301.
  • connection model generation unit 804 refers to the judgment condition 110b in the judgment information 110 (see FIG. 6) and identifies the probability P indicated by the judgment condition 110b for a certain pair of nodes N (step S1203).
  • connection model generation unit 804 refers to the information indicating the mechanical connection relationship of each component generated by the extraction unit 803 to determine whether the pair of nodes N to be processed in step S1203 is mechanically connected. If they are mechanically connected, the connection model generation unit 804 identifies the target component 110a corresponding to the pair in the determination information 110, and obtains a probability of "1" from the "connected" determination condition 110b corresponding to the target component 110a. If the pair of nodes to be processed in step S1203 is not mechanically connected, the connection model generation unit 804 obtains a probability of "0" from the "not connected” determination condition 110b corresponding to the target component 110a.
  • step S1203 is skipped.
  • An accuracy P has already been assigned to each edge of the similar product connection model 1002. Therefore, when skipping step S1203, the connection model generation unit 804 does not refer to the judgment condition 110b, but instead directly uses the accuracy P assigned to an edge of the similar product connection model 1002 that represents a mechanical connection between components as the accuracy P of that edge. In this way, skipping step S1203 can improve the processing speed.
  • connection model generation unit 804 refers to the judgment condition 110c in the judgment information 110 (see FIG. 6) and sums the probability P indicated by the judgment condition 110c for a pair of nodes N (step S1204).
  • connection model generation unit 804 identifies the target component 110a in the judgment information 110 that corresponds to the pair of nodes that are the subject of processing in step S1204. Furthermore, the connection model generation unit 804 identifies the size, length, shape, etc. of the identified target component 110a from the design information 106, and determines whether they satisfy "Condition A”, "Condition B”, ... of the judgment condition 110c. If it is determined that they are satisfied, the connection model generation unit 804 identifies the probability P corresponding to the frequency included in the frequency range during execution of the flowchart in FIG. 12, from among "Frequency XXX to ⁇ Hz", “Frequency ⁇ to ⁇ Hz", and "Frequency ⁇ to ⁇ Hz" in the judgment information 110.
  • connection model generation unit 804 calculates the sum of multiple probabilities P corresponding to each of the multiple conditions. Note that if the judgment information 110 does not include the judgment condition 110c, step S1204 may be skipped.
  • connection model generation unit 804 refers to the judgment condition 110d in the judgment information 110 (see FIG. 6) and sums the probability P indicated by the judgment condition 110d for a certain pair of nodes N (step S1205).
  • connection model generation unit 804 identifies the target component 110a in the judgment information 110 that corresponds to the pair of nodes that are the target of processing in step S1205. Furthermore, the connection model generation unit 804 identifies the size, length, shape, etc. of the identified target component 110a from the design information 106, and determines whether they satisfy the "condition P", "condition Q”, ... of the judgment condition 110d. If it is determined that they are satisfied, the connection model generation unit 804 identifies the accuracy P corresponding to the frequency included in the frequency range during execution of the flowchart in FIG. 12, from among "frequency XXX to ⁇ Hz", "frequency ⁇ to ⁇ Hz", and "frequency ⁇ to ⁇ Hz" in the judgment information 110.
  • connection model generation unit 804 calculates the sum of multiple probabilities P corresponding to each of the multiple conditions. Note that if the judgment information 110 does not include the judgment condition 110d, step S1205 may be skipped.
  • connection model generation unit 804 sums up the probabilities P calculated in steps S1203 to S1205 (step S1206).
  • FIG. 13B is a schematic diagram showing an example in which the probability P after summation is written on some edges of the graph 1301 in FIG. 13A.
  • connection model generation unit 804 determines whether the summed probability P is equal to 0 or is equal to or greater than a predetermined value Th (step S1207). If the probability P is equal to 0, it can be determined that the two components are not electromagnetically connected, but if the probability P is slightly greater than 0, it is difficult to say with certainty that the components are not electromagnetically connected.
  • the predetermined value Th is a value for determining whether the components are likely to be electromagnetically connected when the probability P is slightly greater than 0, and is set in advance by the user.
  • the probability P is equal to or greater than the predetermined value Th, there is even a slight possibility that the two components are electromagnetically connected, and if the probability P is less than the predetermined value Th, there is no possibility that the two components are electromagnetically connected.
  • step S1207 If it is determined in step S1207 that the likelihood P is equal to 0, the process proceeds to step S1208. If the likelihood P is equal to 0, the two components are not electromagnetically connected. Therefore, in step S1207, the connection model generation unit 804 deletes the edges between the nodes corresponding to these components in the graph 1301 (see FIG. 13B).
  • step S1207 determines whether the probability P is equal to or greater than the predetermined value Th. If the probability P is equal to or greater than the predetermined value Th, there is a slight possibility that the two components are electromagnetically connected. Therefore, in step S1209, the connection model generation unit 804 does not delete the edge between the nodes corresponding to these components in the graph 1301, but associates the edge with the probability P and stores it in the memory resource 104.
  • step S1211 After repeating steps S1203 to S1209 for all node pairs, the process proceeds to step S1211. Note that for node pairs that are clearly mechanically connected from the design information 106, steps S1203 to S1209 may be skipped, and the connection model generation unit 804 may set the accuracy P of the node pair to "1". In this case, the judgment condition 110b in the judgment information 110 is unnecessary. Similarly, if it is determined that there is a connection model 1002 of a similar product (step S1201: YES), the connection model generation unit 804 may skip steps S1203 to S1209 for the node pairs that are mechanically connected in the connection model 1002 of a similar product, and set the accuracy P of the node pair to "1". This can improve the processing speed.
  • step S1211 the connection model generation unit 804 outputs the connection model.
  • FIG. 13C is a schematic diagram showing an example of a connection model 1002 output by the connection model generation unit 804 based on the graphs 1301 in FIGS. 13A and 13B.
  • connection model 1002 is a graph in which edges with a probability P less than a predetermined value Th are removed from the graph 1301 in FIG. 13B.
  • edge E in the connection model 1002 is an edge between nodes N that are mechanically connected.
  • Edge F is an edge between nodes N that may be electromagnetically connected.
  • connection model generation unit 804 can generate a connection model 1002 in which components are connected to each other via edges whose accuracy P is equal to or greater than a predetermined value Th.
  • This connection model 1002 is a model in which components are connected to each other even if there is a slight possibility that they are electromagnetically connected. Therefore, based on this connection model 1002, the estimation unit 805 can estimate the range of influence G (see FIG. 11B) that may be affected even slightly by the design change.
  • judgment conditions 110c based on the analysis information 108 and judgment conditions 110d based on the past trouble information 109 as described above, it is possible to judge whether the components are electromagnetically connected to each other by using the analysis results and trouble information for past products.
  • connection model generation unit 804 does not delete edges (step S1208) or store the accuracy (step S1209) for node pairs whose accuracy P is greater than 0 and less than the predetermined value Th.
  • Node pairs whose accuracy P is greater than 0 and less than the predetermined value Th correspond to component pairs whose electromagnetic connection is unclear. Therefore, the presentation unit 806 may present paths connecting such components as paths whose electromagnetic connection is unclear. This allows the user to understand paths whose electromagnetic connection is unclear.
  • connection model generation unit 804 repeats the above steps S1201 to S1211 for each of the "low frequency” and “high frequency” frequencies. As a result, the connection model generation unit 804 outputs the connection model 1002 for each of the "low frequency” and "high frequency” frequencies in step S1211.
  • FIG. 14A is a schematic diagram showing an example of a "low frequency” connection model 1002
  • FIG. 14B is a schematic diagram showing an example of a "high frequency” connection model 1002. Since the components that are electromagnetically connected are different between "high frequency” and "low frequency”, the positions and number of edges in the connection model 1002 are also different.
  • FIG. 15 is an example of a flowchart of a test item presentation method according to this embodiment.
  • FIG. 16A is a schematic diagram of an example of a screen display of a start screen displayed on the UI device 102
  • FIG. 16B is a schematic diagram of an example of a screen display of a presentation screen displayed on the UI device 102.
  • a check item judgment button 1603 and an object 1604 are displayed on a start screen 1601.
  • Object 1604 shows the silhouette of the product that is the subject of the EMC test, and in this case, the silhouette of a car is displayed as object 1604.
  • the processor 101 executes the flowchart in FIG. 16 as follows.
  • the linking unit 801 links the design information 106 and the request information 107 to generate the linking information 111 shown in FIG. 7 (step S1501). As described above, the user may also generate the linking information 111.
  • connection model generation unit 804 generates a connection model 1002 for each frequency (step S1502).
  • the connection model generation unit 804 executes the flowchart in FIG. 12 to generate the connection models 1002 for "low frequency” and "high frequency” as shown in FIG. 14A and FIG. 14B.
  • the detection unit 802 detects components whose design has been changed based on the design information 106 (step S1503).
  • the estimation unit 805 estimates the range of influence G affected by the component whose design has been changed for each of the connection models 1002 for each frequency (step S1504). For example, as shown in FIG. 11B, the estimation unit 805 estimates the range of influence G to be a range including all nodes N that can be reached by tracing edge E or edge F to the node N whose design has been changed.
  • the presentation unit 806 presents the EMC test items that are recommended to be performed to the UI device 102 (step S1505).
  • the EMC test items are not tests for all components that make up the product, but test items that need to be re-performed due to the design change detected in step S1503.
  • the presentation unit 806 identifies all nodes N included in the range of influence G of the "low frequency” connection model 1002.
  • the presentation unit 806 identifies the "requirement name" associated with the component corresponding to the identified node N from the linkage information 111 (see FIG. 7).
  • the presentation unit 806 then presents test items that satisfy the requirements of the identified "requirement name” as EMC test items.
  • the presentation unit 806 presents the EMC test items required for all frequencies, both "low frequency” and "high frequency”.
  • the presentation unit 806 may present EMC test items for each frequency, such as "low frequency” and "high frequency.”
  • the presentation unit 806 can present, as EMC test items, test items that satisfy the requirements of the "requirement name" associated with node N included in the impact range G.
  • presentation unit 806 presents EMC test items in list 1608. Presentation unit 806 also presents "number,” “priority,” and “route information” that identify the EMC test item in list 1608. In this example, presentation unit 806 presents EMC test items required for all frequencies, “low frequency” and “high frequency,” in list 1608. Alternatively, presentation unit 806 may present EMC test items required for each frequency by presenting list 1608 for each frequency.
  • Priority refers to the degree of necessity for implementation, with “A” having the highest priority and the greatest necessity for implementation. "B” and “C” have decreasing priorities.
  • the priority is set by the presentation unit 806 according to the probability P associated with the edge of the connection model 1002. As an example, the presentation unit 806 reads out the probability P stored in the memory resource 104 in step S1209 of FIG. 12 for each edge of the connection model 1002. In this example, the connection model 1002 is generated for each frequency, so the presentation unit 806 reads out the probability P for each frequency.
  • the presentation unit 806 determines the priority of the EMC test item corresponding to the "requirement name" according to the certainty P. Note that, when a node corresponding to a certain component is connected to multiple edges, the presentation unit 806 determines the priority of the EMC test item according to the highest certainty P among the certainty P of the multiple edges.
  • the correspondence between the accuracy P and the priority is determined in advance by the user. For example, when 0.2 ⁇ P ⁇ 0.5, the priority is set to "C”, when 0.5 ⁇ P ⁇ 0.8, the priority is set to "B”, and when 0.8 ⁇ P, the priority is set to "A".
  • the reason why the priority is set higher as the accuracy P increases is that the greater the accuracy P, the more likely it is that the components corresponding to the nodes on both ends of the edge are electromagnetically connected, and it is believed that these components will be significantly affected by design changes.
  • the presentation unit 806 determines the priority of the EMC test items according to such correspondence.
  • the priority for the same EMC test item may differ depending on the connection model 1002.
  • the presentation unit 806 adopts the highest priority as the priority for the EMC test item.
  • Ring information is information that indicates the route between components that are the subject of an EMC test item. Note that when a connection model 1002 is generated for each frequency as in this embodiment, the "route information" for the same EMC test item may differ depending on the connection model 1002. In that case, the presentation unit 806 presents the union of the "route information" of each connection model 1002.
  • the estimation unit 805 estimates the impact range G of the design change on the components that make up the product for each frequency (step S1504). Then, the presentation unit 806 presents EMC test items associated with the components included in the impact range G (step S1505). These EMC test items are not test items for all components that make up the product, but test items for the components included in the impact range G. Therefore, for example, for an upgrade of an old product, the user does not need to perform EMC testing on all of its components, and only needs to perform EMC testing on the presented EMC test items, which reduces the cost and time required for EMC testing.
  • connection model generation unit 804 generates a connection model 1002 for each frequency.
  • the connection model 1002 is a model that the estimation unit 805 uses to estimate the range of influence G. Therefore, the presentation unit 806 can present EMC test items that take into account the range of influence G for each frequency.
  • the past trouble information 109 described in the first embodiment is utilized to present EMC test items to the user.
  • FIG. 17 is a schematic diagram showing an example of the data structure of the propagation path information referenced by the computer system 100 in this embodiment.
  • the propagation path information 1701 is information that associates a "propagation path" with a "number of times a problem has occurred” by adding the "number of times a problem has occurred” to the past problem information 109.
  • a "propagation path” is a path that connects components that are electromagnetically connected when a problem occurs, and is a path along which noise propagates when a problem occurs.
  • the "number of times a problem has occurred” is the number of times a problem has occurred in the past on the associated "propagation path”.
  • the propagation path information 1701 is created in advance by the user and stored in the memory resource 104. In this example, the first component of the "propagation path" indicates the "noise source", and the last component of the "propagation path” indicates the "damaged component".
  • FIG. 18 is a schematic diagram that visualizes an example of the "propagation path" of the propagation path information 1701.
  • the "propagation path” is visualized by overlaying it on the connection model 1002 generated according to the first embodiment.
  • the edges shown by solid lines in FIG. 18 correspond to the "propagation path”.
  • the edges shown by dashed lines indicate edges that are edges of the connection model 1002 but do not exist on the "propagation path”.
  • FIG. 19 is a functional block diagram of a computer system according to this embodiment. Note that in FIG. 19, elements that are the same as those described in the first embodiment are given the same reference numerals, and their description will be omitted below.
  • the computer system 100 includes a route estimation unit 811 and a priority calculation unit 812.
  • Figs. 20 to 22 are schematic diagrams showing an example of the function of the route estimation unit 811.
  • the path estimation unit 811 refers to the design information 106 to identify all components that make up the upgraded product. Then, the path estimation unit 811 generates a fully connected graph 2001 in which each component is connected to all other components. Node N in the fully connected graph 2001 corresponds to each component that makes up the product.
  • the path estimation unit 811 refers to the propagation path information 1701 to estimate a similar path 2101 that is similar to the "propagation path" in the propagation path information 1701 from among the paths in the full connection graph 2001.
  • the path estimation unit 811 estimates a graph, among the subgraphs of the fully connected graph 2001, that matches a "propagation path" associated with a certain "number” in the propagation path information 1701 as a similar path 2101 that is similar to that "propagation path.”
  • the path estimation unit 811 may identify a subgraph that matches a "propagation path” for each "number” in the propagation path information 1701, and estimate a subgraph that is a combination of all the subgraphs as a similar path 2101 that is similar to all the "propagation paths" in the propagation path information 1701.
  • the path estimation unit 811 may estimate the similar path 2101 based on the connection model 1002 generated by the connection model generation unit 804, rather than estimating the similar path 2101 based on the all-connected graph 2001 in this manner.
  • the path estimation unit 811 may estimate a subgraph of either the "low frequency" connection model 1002 (FIG. 14A) or the “high frequency” connection model 1002 (FIG. 14B) that matches a "propagation path” associated with a certain "number" in the propagation path information 1701, as the similar path 2101 similar to that "propagation path”.
  • the path estimation unit 811 may identify a subgraph that matches the "propagation path" from each of the subgraphs of the "low frequency” and “high frequency” connection models 1002, and estimate a graph obtained by combining these subgraphs as the similar path 2101. Even when using the connection model 1002 in this manner, a subgraph that matches the "propagation route” for each "number" in the propagation route information 1701 may be identified, and a subgraph obtained by combining all the subgraphs may be estimated as a similar route 2101 that is similar to all the "propagation routes" in the propagation route information 1701.
  • the path estimation unit 811 identifies a set 2201 of nodes N that are not included in the similar path 2101, among the nodes N in the fully connected graph 2001. Note that when the similar path 2101 is estimated based on the connection model 1002 as described above, the path estimation unit 811 identifies, as the set 2201, a set of nodes N that are not included in the similar path 2101, among the nodes N in the connection model 1002.
  • the priority calculation unit 812 calculates the priority of an EMC test item based on the "number of times a problem occurred" in the propagation path information 1701. For example, the priority calculation unit 812 increases the priority of an EMC test item associated with a component included in a "propagation path" in the propagation path information 1701 the more the "number of times a problem occurred" associated with that "propagation path" is.
  • FIG. 23 is an example of a flowchart of the test item presentation method according to this embodiment. Note that in FIG. 23, the same steps as those described in the first embodiment are given the same reference numerals, and their description will be omitted below.
  • the path estimation unit 811 estimates a similar path 2101 that is similar to the "propagation path" in the propagation path information 1701 (step S2101). For example, the path estimation unit 811 estimates a subgraph that matches the "propagation path” among the subgraphs of the all-connected graph 2001 or the connection model 1002 as the similar path 2101. The path estimation unit 811 also identifies a set 2201 ( FIG. 22 ) of components that are not included in the similar path 2101 among the components included in the all-connected graph 2001 or the connection model 1002.
  • the priority calculation unit 812 increases the priority of the EMC test item associated with the component included in the "propagation path" of the propagation path information 1701 (step S2102). For example, the priority calculation unit 812 sets the priority of the EMC test item so that the higher the "number of trouble occurrences" associated with the "propagation path," the higher the priority.
  • the presentation unit 806 presents to the UI device 102 EMC test items associated with the components included in the similar path 2101 (step S1505). For example, the presentation unit 806 identifies the "requirement name" associated with the components included in the similar path 2101 from the linkage information 111 (see FIG. 7). Then, the presentation unit 806 presents test items that satisfy the requirements of the identified "requirement name" as EMC test items.
  • the presentation unit 806 may present EMC test items for each frequency, such as "low frequency” and "high frequency.”
  • the presentation unit 806 presents the EMC test items in descending order of priority calculated by the priority calculation unit 812. This allows the user to understand which of the multiple EMC test items is most important.
  • the presentation unit 806 may present EMC test items associated with components belonging to the set 2201 ( FIG. 22 ) as test items that do not require testing, or may present them with a lower priority compared to EMC test items associated with components included in the similar path 2101.
  • a similar path 2101 similar to the "propagation path" in the propagation path information 1701 is estimated, and EMC test items associated with components included in the similar path 2101 are presented.
  • the "propagation path" in the propagation path information 1701 is the path along which noise propagates when a problem actually occurs in a past product, and there is a high possibility that noise will also propagate through the similar path 2101 that is similar to that path. Therefore, by presenting the user with EMC test items associated with components included in the similar path 2101, the user can focus testing on components that are likely to cause problems due to noise.
  • connections are added to the connection model 1002 based on the distance between components.
  • FIG. 24 is a functional block diagram of a computer system according to this embodiment. Note that in FIG. 24, elements that are the same as those described in the first or second embodiment are given the same reference numerals, and their description will be omitted below.
  • the computer system 100 includes a structure extraction unit 813 in addition to the route estimation unit 811 and priority calculation unit 812 described in the second embodiment.
  • the design information 106 includes outfitting information.
  • the outfitting information is, for example, 3D-CAD (Computer Aided Design) information, and is information that indicates the position of each component inside the product.
  • 3D-CAD Computer Aided Design
  • the structure extraction unit 813 identifies components that may be electromagnetically connected based on the position of each component in the equipment information. For example, the structure extraction unit 813 identifies components that may be capacitively coupled or that may be coupled by electromagnetic induction. As one example, the structure extraction unit 813 calculates the distance between each component based on the position indicated in the equipment information, and identifies components whose distance is within a threshold as components that may be electromagnetically connected. The structure extraction unit 813 may also identify components that may be electromagnetically connected using a machine learning model that outputs components that may be electromagnetically connected when each component and its position are input.
  • the path estimation unit 811 adds the paths connecting the components identified by the structure extraction unit 813 to the similar paths 2101.
  • the higher the likelihood that components identified by the structure extraction unit 813 will be electromagnetically connected the higher the priority of the EMC test items associated with these components will be assigned by the priority calculation unit 812.
  • Components that are likely to be electromagnetically connected are prone to noise propagation and should preferably be tested with priority, so by assigning higher priorities in this way, the user can determine which EMC test items should be tested with priority.
  • components that may be electromagnetically connected are identified based on the positions indicated by the equipment information, and paths connecting these components are added to the similar paths 2101.
  • the equipment information can be used to generate the similar paths 2101, and EMC test items associated with components that may be electromagnetically connected can be presented to the user.
  • the design information 106 is generated using a trained model generated by machine learning or the like.
  • FIG. 25 is a functional block diagram of a computer system according to this embodiment. Note that in FIG. 25, elements that are the same as those described in the first to third embodiments are given the same reference numerals, and their description will be omitted below.
  • the computer system 100 includes a design information generation unit 822.
  • the design information generation unit 822 generates design information 106 based on circuit design information 821 and a circuit pattern learned model 823 that the user has stored in advance in the memory resource 104.
  • Circuit design information 821 is information equivalent to a circuit diagram of the product, and includes the layout of each component and the wiring that connects them.
  • the circuit pattern learned model 823 is a model that outputs design information 106 that indicates the connection relationships between each component when circuit design information 821 is input.
  • the circuit pattern learned model 823 is generated by machine learning such as a neural network that uses multiple different circuit design information 821 as learning data and correct design information 106 as teacher data.
  • the extraction unit 803 extracts the mechanical connection relationships of each component based on the design information 106 generated by the design information generation unit 822, as in the first embodiment, and generates information indicating the connection relationships (e.g., graph 1001).
  • the connection model generation unit 804 generates a connection model 1002 based on the graph 1001 and the determination information 110, as in the first embodiment.
  • the design information generating unit 822 generates the design information 106 from the circuit design information 821, even if the user does not create the design information 106. Since the circuit design information 821 is information equivalent to a circuit diagram, it is often available to the user when developing a product. Therefore, the circuit design information 821 available to the user can be utilized, and the user can be saved the trouble of generating the design information 106.
  • the present invention is not limited to the above-described embodiments, and includes various modified examples.
  • the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to having all of the components described. It is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. It is possible to add, delete, or replace part of the configuration of each embodiment with other configurations.
  • the above configurations, functions, processing units, processing means, etc. may be realized in hardware, in part or in whole, by designing them in an integrated circuit such as an FPGA.
  • the above configurations, functions, etc. may be realized in software by a processor interpreting and executing a program that realizes each function.
  • Information such as the program that realizes each function, the decision table, and files can be placed in memory, a storage device such as an HDD or SSD, or a recording medium such as an IC (Integrated Circuit) card, an SD (Secure Digital) card, or a DVD (Digital Versatile Disc).
  • the control lines and information lines shown are those considered necessary for explanation, and do not necessarily show all control lines and information lines in the product. In reality, it can be assumed that almost all configurations are interconnected.
  • the computer system 100 may be realized by a user (operator) performing some or all of the functions and processing realized by the test item presentation program 105.
  • the computer system 100 does not have a UI device 102, and instead leaves the output processing to the user and some of the input processing from the user to a processor system (called an external processor system) such as a smartphone or tablet terminal outside the system.
  • a processor system called an external processor system
  • the computer system 100 (or the processor 101, the test item presentation program 105) may do the following to execute the processing described above and other parts of the program.
  • data required for outputting to the user is sent to the external processor system via the NI device 103.
  • Examples of such data include the data to be output itself, data for generating output data in another processor system, but it may also be a program or web data describing the process of performing user output in the external processor system.
  • data indicating user input or operations is received from an external processor system via the NI device 103.
  • the meaning of outputting data to the user may include the computer system 100 itself outputting the data, as well as having another entity other than the computer system 100 output the data (using it).
  • the meaning of receiving input or operations from the user may include the computer system 100 indirectly receiving the data, as well as directly outputting or receiving the data to the user using the UI device 102 of the computer system 100.
  • 100...Computer system 101...Processor, 102...UI device, 103...NI device, 104...Memory resource, 105...Test item presentation program, 106...Design information, 106a...Component, 106b...Connection information, 107...Requirement information, 108...Analysis information, 109...Past trouble information, 110...Judgment information, 110a...Target component, 110b to 110d...Judgment conditions, 111...Interaction information, 112...Bus, 801...Interaction unit, 802...Detection unit, 803...Extraction unit, 804...Connection model model generation unit, 805...estimation unit, 806...presentation unit, 811...path estimation unit, 812...priority calculation unit, 813...structure extraction unit, 821...circuit design information, 822...design information generation unit, 823...circuit pattern learned model, 901...block diagram, 1001, 1301...graph, 1002...connection model, 1601..

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Abstract

The present invention makes it possible to present test items of an EMC test for which re-execution is needed due to a design change of components.　This computer system has one or more processors and one or more memory resources. The one or more processors: refer to determination information for determining whether or not a plurality of components constituting a product are electromagnetically connected to each other and generate connection models indicating electromagnetic connection relationships between the plurality of components for a plurality of frequencies; infer, for each of the plurality of frequencies, an influence range on which the components having undergone a design change have influence in the connection models; and present EMC test items associated with the components included in the influence range.

Description

コンピュータシステム、試験項目提示方法、及び試験項目提示プログラムCOMPUTER SYSTEM, TEST ITEM PRESENTATION METHOD, AND TEST ITEM PRESENTATION PROGRAM
　本発明は、コンピュータシステム、試験項目提示方法、及び試験項目提示プログラムに関する。本発明は2022年12月6日に出願された日本国特許の出願番号2022-194782及び2023年7月4日に出願された日本国特許の出願番号2023-110040の優先権を主張し、文献の参照による織り込みが認められる指定国については、その出願に記載された内容は参照により本出願に織り込まれる。 The present invention relates to a computer system, a test item presentation method, and a test item presentation program. The present invention claims priority to Japanese Patent Application No. 2022-194782 filed on December 6, 2022, and Japanese Patent Application No. 2023-110040 filed on July 4, 2023, and for designated countries where incorporation by reference to literature is permitted, the contents of those applications are incorporated by reference into this application.
　製品が準拠すべき規格としてEMC(Electromagnetic Compatibility)規格がある。EMC規格は、製品から放出された電磁波が他の機器に影響を及ぼすのを規制したり、他の機器から放出された電磁波によって製品の性能低下や誤作動を規制したりするための規格である。製品を市場に出荷する前には製品がEMC規格を満たしているかを確認するためのEMC試験が行われる（特許文献１）。EMC試験は、旧製品とは全く異なる新規な製品だけでなく、旧製品の複数のコンポーネント（部品）のうちの一部のみを設計変更したアップグレード品に対しても行われる。 EMC (Electromagnetic Compatibility) standards are standards that products must comply with. EMC standards regulate the effects of electromagnetic waves emitted from a product on other devices, and regulate product performance degradation and malfunctions caused by electromagnetic waves emitted from other devices. Before a product is shipped to the market, EMC testing is carried out to check whether the product meets the EMC standards (Patent Document 1). EMC testing is not only carried out on new products that are completely different from the old product, but also on upgraded products in which only some of the multiple components (parts) of the old product have been redesigned.
特開２０１３－１８６６８３号公報JP 2013-186683 A
　しかしながら、旧製品に対しては既にEMC試験が実施されているにも関わらず、その一部のコンポーネントのみを設計変更したアップグレード品に対して旧製品と同じ試験項目のEMC試験を実施するのは時間的にもコスト的にも無駄である。 However, even though EMC testing has already been conducted on the old product, it would be a waste of time and money to conduct EMC testing on the same test items as the old product on an upgraded product in which only some of the components have been redesigned.
　本発明は、このような状況に鑑みてなされたものであり、コンポーネントの設計変更によって再実施が必要となったEMC試験の試験項目を提示できるようにすることを目的とする。 The present invention was made in consideration of these circumstances, and aims to make it possible to present test items for EMC tests that need to be re-performed due to changes in the design of components.
　上記課題を解決するため、本発明の一態様に係るコンピュータシステムは、１以上のプロセッサと、１以上のメモリリソースと、を有するコンピュータシステムであって、
　前記１以上のプロセッサは、製品を構成する複数のコンポーネント同士が電磁的に接続されているかを判定する判定情報を参照して、複数の前記コンポーネント同士の電磁的な接続関係を示す接続モデルを複数の周波数について生成し、前記接続モデルにおいて、設計変更がされた前記コンポーネントの影響を受ける影響範囲を前記周波数ごとに推定し、前記影響範囲に含まれる前記コンポーネントに関連付けられたEMC試験項目を提示する。 In order to solve the above problem, a computer system according to one aspect of the present invention is a computer system having one or more processors and one or more memory resources,
The one or more processors refer to determination information for determining whether multiple components that make up a product are electromagnetically connected to each other, generate a connection model for multiple frequencies that indicates the electromagnetic connection relationships between the multiple components, estimate an impact range that is affected by the component whose design has been changed in the connection model for each frequency, and present EMC test items associated with the components included in the impact range.
　本発明によれば、コンポーネントの設計変更によって再実施が必要となったEMC試験の試験項目を提示できる。 The present invention makes it possible to present EMC test items that need to be re-performed due to component design changes.
　上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。 　Problems, configurations and advantages other than those mentioned above will become clear from the description of the embodiments below.
図１は、第１実施形態に係るコンピュータシステムの一例の構成図である。FIG. 1 is a diagram illustrating an example of a configuration of a computer system according to the first embodiment. 図２は、第１実施形態に係る設計情報のデータ構造の一例を示す模式図である。FIG. 2 is a schematic diagram showing an example of a data structure of design information according to the first embodiment. 図３は、第１実施形態に係る要求情報のデータ構造の一例を示す模式図である。FIG. 3 is a schematic diagram illustrating an example of a data structure of request information according to the first embodiment. 図４は、第１実施形態に係る解析情報のデータ構造の一例を示す模式図である。FIG. 4 is a schematic diagram illustrating an example of a data structure of the analysis information according to the first embodiment. 図５は、第１実施形態に係る過去トラブル情報のデータ構造の一例を示す模式図である。FIG. 5 is a schematic diagram showing an example of a data structure of past trouble information according to the first embodiment. 図６は、第１実施形態に係る判定情報のデータ構造の一例を示す模式図である。FIG. 6 is a schematic diagram showing an example of a data structure of the determination information according to the first embodiment. 図７は、第１実施形態に係る連携情報のデータ構造の一例を示す模式図である。FIG. 7 is a schematic diagram illustrating an example of a data structure of linkage information according to the first embodiment. 図８は、第１実施形態に係るコンピュータシステムの機能ブロック図である。FIG. 8 is a functional block diagram of a computer system according to the first embodiment. 図９は、第１実施形態に係る連携部の機能の一例を説明するための模式図である。FIG. 9 is a schematic diagram for explaining an example of a function of the link unit according to the first embodiment. 図１０Ａは、第１実施形態における各コンポーネントの機械的な接続関係を示すグラフの一例を示す模式図である。FIG. 10A is a schematic diagram illustrating an example of a graph showing the mechanical connection relationships of each component in the first embodiment. 図１０Ｂは、第１実施形態に係る接続モデル生成部が生成した接続モデルの一例を示す模式図である。FIG. 10B is a schematic diagram illustrating an example of a connection model generated by the connection model generating unit according to the first embodiment. 図１１Ａは、第１実施形態における影響範囲を推定するために推定部が使用する接続モデルの一例を示す模式図である。FIG. 11A is a schematic diagram illustrating an example of a connection model used by an estimation unit to estimate an influence range in the first embodiment. 図１１Ｂは、第１実施形態における影響範囲の推定方法の一例を示す模式図である。FIG. 11B is a schematic diagram illustrating an example of a method for estimating an affected range in the first embodiment. 図１２は、第１実施形態における接続モデルの生成方法のフローチャートの一例である。FIG. 12 is an example of a flowchart of a method for generating a connection model in the first embodiment. 図１３Ａは、第１実施形態において全てのノードを接続したグラフの一例を示す模式図である。FIG. 13A is a schematic diagram showing an example of a graph in which all nodes are connected in the first embodiment. 図１３Ｂは、図１３Ａのグラフの一部のエッジに合計後の確度を併記した一例を示す模式図である。FIG. 13B is a schematic diagram showing an example in which the probability after summation is written on some edges of the graph in FIG. 13A. 図１３Ｃは、図１３Ａ及び図１３Ｂのグラフに基づいて接続モデル生成部が出力した接続モデルの一例を示す模式図である。FIG. 13C is a schematic diagram showing an example of a connection model output by the connection model generating unit based on the graphs of FIGS. 13A and 13B. 図１４Ａは、第１実施形態における「低周波」の接続モデルの一例を示す模式図である。FIG. 14A is a schematic diagram showing an example of a “low frequency” connection model in the first embodiment. 図１４Ｂは、第１実施形態における「高周波」の接続モデルの一例を示す模式図である。FIG. 14B is a schematic diagram showing an example of a “high frequency” connection model in the first embodiment. 図１５は、第１実施形態に係る試験項目提示方法のフローチャートの一例である。FIG. 15 is an example of a flowchart of the test item presenting method according to the first embodiment. 図１６Ａは、第１実施形態においてUIデバイスに表示される開始画面の画面表示例の模式図である。FIG. 16A is a schematic diagram of an example of a screen display of a start screen displayed on a UI device in the first embodiment. 図１６Ｂは、第１実施形態においてUIデバイスに表示される提示画面の画面表示例の模式図である。FIG. 16B is a schematic diagram of an example of a screen display of a presentation screen displayed on a UI device in the first embodiment. 図１７は、第２実施形態でコンピュータシステムが参照する伝搬経路情報のデータ構造の一例を示す模式図である。FIG. 17 is a schematic diagram showing an example of a data structure of propagation path information to which the computer system refers in the second embodiment. 図１８は、第２実施形態に係る伝搬経路情報の「伝搬経路」の一例を可視化した模式図である。FIG. 18 is a schematic diagram illustrating an example of a “propagation route” of the propagation route information according to the second embodiment. 図１９は、第２実施形態に係るコンピュータシステムの機能ブロック図である。FIG. 19 is a functional block diagram of a computer system according to the second embodiment. 図２０は、第２実施形態に係る経路推定部の機能の一例を示す模式図（その１）である。FIG. 20 is a schematic diagram (part 1) illustrating an example of the function of the route estimation unit according to the second embodiment. 図２１は、第２実施形態に係る経路推定部の機能の一例を示す模式図（その２）である。FIG. 21 is a schematic diagram (part 2) illustrating an example of the function of the route estimation unit according to the second embodiment. 図２２は、第２実施形態に係る経路推定部の機能の一例を示す模式図（その３）である。FIG. 22 is a schematic diagram (part 3) illustrating an example of the function of the route estimation unit according to the second embodiment. 図２３は、第２実施形態に係る試験項目提示方法のフローチャートの一例である。FIG. 23 is an example of a flowchart of a test item presenting method according to the second embodiment. 図２４は、第３実施形態に係るコンピュータシステムの機能ブロック図である。FIG. 24 is a functional block diagram of a computer system according to the third embodiment. 図２５は、第４実施形態に係るコンピュータシステムの機能ブロック図である。FIG. 25 is a functional block diagram of a computer system according to the fourth embodiment.
　以下、本発明に係る一実施形態を図面に基づいて説明する。なお、実施形態を説明するための全図において、同一の部材には原則として同一の符号を付し、その繰り返しの説明は適宜省略する。また、以下の実施形態において、その構成要素（要素ステップ等も含む）は、特に明示した場合及び原理的に明らかに必須であると考えられる場合等を除き、必ずしも必須のものではないことは言うまでもない。また、「Ａからなる」、「Ａよりなる」、「Ａを有する」、「Ａを含む」と言うときは、特にその要素のみである旨明示した場合等を除き、それ以外の要素を排除するものでないことは言うまでもない。同様に、以下の実施形態において、構成要素等の形状、位置関係等に言及するときは、特に明示した場合及び原理的に明らかにそうでないと考えられる場合等を除き、実質的にその形状等に近似または類似するもの等を含む。 Below, an embodiment of the present invention will be described with reference to the drawings. In all drawings used to describe the embodiment, the same components are generally given the same reference numerals, and repeated description will be omitted where appropriate. In the following embodiment, the components (including element steps, etc.) are not necessarily essential, unless otherwise specified or considered to be clearly essential in principle. In addition, when it is said that "consists of A," "is made of A," "has A," or "includes A," it goes without saying that other elements are not excluded, unless otherwise specified to indicate that only that element is included. Similarly, in the following embodiment, when referring to the shape, positional relationship, etc. of components, etc., it includes those that are substantially similar or similar to that shape, etc., unless otherwise specified or considered to be clearly not essential in principle.
　＜第１実施形態＞
　図１は、第１実施形態に係るコンピュータシステムの一例の構成図である。 First Embodiment
FIG. 1 is a diagram illustrating an example of a configuration of a computer system according to the first embodiment.
　コンピュータシステム１００は、データの生成、送信、受信及びこれら以外の各種処理を行うため、メモリリソースに格納された試験項目提示プログラムを、プロセッサが読み込むことで、プロセッサが試験項目提示プログラムに応じた処理を実行する。なお、コンピュータシステム１００は、例えばパーソナルコンピュータ、タブレット端末（コンピュータ）、スマートフォン、サーバ計算機、ブレードサーバ、及びクラウドサーバ等の計算機であり、少なくともこれら計算機を１つ以上含むシステムである。すなわち、コンピュータシステム１００は、例えばクラウドサーバと、表示用の計算機（例えば、タブレット端末またはスマートフォン）と、を含むシステムも包含する。また、プロセッサとメモリリソースを含む、何かしらの装置を制御又は管理するコントローラもコンピュータシステム１００の一例である。 In computer system 100, in order to generate, transmit, receive data, and perform various other processes, a processor reads a test item presentation program stored in a memory resource, and the processor executes processes according to the test item presentation program. Note that computer system 100 is, for example, a personal computer, a tablet terminal (computer), a smartphone, a server computer, a blade server, a cloud server, or other computer, and is a system that includes at least one of these computers. In other words, computer system 100 also includes a system that includes, for example, a cloud server and a display computer (for example, a tablet terminal or smartphone). Another example of computer system 100 is a controller that controls or manages some kind of device, including a processor and memory resources.
　具体的には、コンピュータシステム１００は、図１に示すように、１以上のプロセッサ１０１と、１以上のメモリリソース１０４と、１以上のUIデバイス１０２と、１以上のNI(Network Interface)デバイス１０３とを有している。なお、コンピュータシステム１００は、これら以外の構成物を含んでもよい。また、プロセッサ１０１、UI(User Interface)デバイス１０２、NIデバイス１０３、及びメモリリソース１０４はバス１１２を介して相互に接続される。 Specifically, as shown in FIG. 1, the computer system 100 has one or more processors 101, one or more memory resources 104, one or more UI devices 102, and one or more NI (Network Interface) devices 103. Note that the computer system 100 may include components other than these. In addition, the processor 101, the UI (User Interface) device 102, the NI device 103, and the memory resource 104 are connected to each other via a bus 112.
　プロセッサ１０１は、メモリリソース１０４に格納されている各種プログラムを読み込んで、各プログラムに対応する処理を実行する演算装置である。なお、プロセッサ１０１は、マイクロプロセッサ、CPU(Central Processing Unit)、GPU(Graphics Processing Unit)、FPGA(Field Programmable Gate Array)、量子プロセッサ、あるいはその他の演算できる半導体デバイスが例である。 The processor 101 is an arithmetic device that reads various programs stored in the memory resource 104 and executes the processing corresponding to each program. Examples of the processor 101 include a microprocessor, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an FPGA (Field Programmable Gate Array), a quantum processor, or other semiconductor devices capable of performing calculations.
　メモリリソース１０４は、試験項目提示プログラム１０５、設計情報１０６、要求情報１０７、解析情報１０８、過去トラブル情報１０９、判定情報１１０、及び連携情報１１１を記憶する記憶装置であり、不揮発メモリ又は/及び揮発メモリが例である。揮発メモリの例は、RAM(Random Access Memory)やROM(Read Only Memory)である。不揮発メモリの例は、フラッシュメモリ、ハードディスクあるいはSSD(Solid State Drive)等の書き換え可能な記憶媒体であってもよく、USB(Universal Serial Bus)メモリ、メモリカードおよびハードディスクなどであっても良い。また、MRAM(Magnetoresistive RAM)、PRAM(Phase change RAM)、ReRAM(Resistive RAMといったRAMを不揮発メモリと見なしてもよい。なお、プロセッサ１０１は、メモリリソース１０４に格納されている試験項目提示プログラム１０５を他のコンピュータに配信するサービスを行ってもよい。 The memory resource 104 is a storage device that stores the test item presentation program 105, design information 106, requirement information 107, analysis information 108, past trouble information 109, judgment information 110, and linkage information 111, and is, for example, a non-volatile memory and/or a volatile memory. Examples of volatile memory are RAM (Random Access Memory) and ROM (Read Only Memory). Examples of non-volatile memory may be rewritable storage media such as flash memory, hard disks, or SSDs (Solid State Drives), as well as USB (Universal Serial Bus) memories, memory cards, and hard disks. In addition, RAMs such as MRAM (Magnetoresistive RAM), PRAM (Phase change RAM), and ReRAM (Resistive RAM) may also be considered as non-volatile memory. The processor 101 may provide a service of distributing the test item presentation program 105 stored in the memory resource 104 to other computers.
　UIデバイス１０２は、ユーザ（オペレーターでもよい）の指示をコンピュータシステム１００に入力する入力デバイス、及びコンピュータシステム１００で生成した情報等を出力する出力デバイスである。入力デバイスには、例えばキーボード、タッチパネル、マウスなどのポインティングデバイスやマイクロフォンのような音声入力デバイスなどがある。また、出力デバイスには、例えばディスプレイ、プリンタ、及び音声合成装置等がある。なお、以下で特に言及しない場合は、コンピュータシステム１００とユーザとの間の情報の入出力は、UIデバイス１０２を介して実行される。なお、UIデバイス１０２は、入力デバイスのみでもよく、出力デバイスのみでもよい。 The UI device 102 is an input device that inputs instructions from a user (which may be an operator) to the computer system 100, and an output device that outputs information generated by the computer system 100. Examples of input devices include pointing devices such as a keyboard, a touch panel, and a mouse, as well as voice input devices such as a microphone. Examples of output devices include a display, a printer, and a voice synthesizer. Unless otherwise specified below, input and output of information between the computer system 100 and the user is performed via the UI device 102. The UI device 102 may be only an input device, or only an output device.
　NIデバイス１０３は、外部装置との間で情報通信を行う通信装置である。NIデバイス１０３は、例えばインターネットやLAN(Local Area Network)等の所定の通信ネットワーク網を介して外部装置と情報通信を行う。なお、以下で特に言及しない場合は、コンピュータシステム１００（又はプロセッサ１０１）と外部装置との情報通信は、NIデバイス１０３を介して実行される。 The NI device 103 is a communication device that communicates information with external devices. The NI device 103 communicates information with external devices via a specific communication network, such as the Internet or a LAN (Local Area Network). Unless otherwise specified below, information communication between the computer system 100 (or the processor 101) and external devices is performed via the NI device 103.
　このコンピュータシステム１００は、試験項目提示プログラム１０５を実行することにより、後述のようにアップグレード品に対するEMC試験項目を提示する。EMC試験項目の提示にあたり、プロセッサ１０１は、設計情報１０６、要求情報１０７、解析情報１０８、過去トラブル情報１０９、判定情報１１０、及び連携情報１１１を参照する。これらの情報１０６～１１１は、プロセッサ１０１がアクセスできるのであればコンピュータシステム１００の外部にあってもよい。例えば、インターネットやLAN等の通信ネットワークを介してプロセッサ１０１がアクセス可能なクラウド上のストレージに各情報１０６～１１１を格納してもよい。更に、各情報１０６～１１１は、データを格納できるのであれば、ファイルやデータベース等のデータ構造であってもよい。以下に、各情報１０６～１１１の詳細について説明する。 The computer system 100 executes the test item presentation program 105 to present EMC test items for the upgraded product, as described below. When presenting the EMC test items, the processor 101 refers to the design information 106, the requirement information 107, the analysis information 108, the past trouble information 109, the judgment information 110, and the linkage information 111. These pieces of information 106 to 111 may be outside the computer system 100 as long as they are accessible to the processor 101. For example, the pieces of information 106 to 111 may be stored in cloud storage that the processor 101 can access via a communication network such as the Internet or a LAN. Furthermore, the pieces of information 106 to 111 may be data structures such as files and databases as long as they can store data. Details of the pieces of information 106 to 111 are described below.
　図２は、設計情報１０６のデータ構造の一例を示す模式図である。 FIG. 2 is a schematic diagram showing an example of the data structure of design information 106.
　設計情報１０６は、アップグレード品等の製品の設計に関する情報であり、例えばMBSE(Model-Based System Engineering)により作成されたモデル情報やCAD(Computer Aided Design)情報等の既存の情報の集合である。図２では、これらの情報のうち、製品を構成する各コンポーネント同士の設計上の機械的な接続関係を示す情報のみを図示している。ここでは、コンポーネント１０６ａと、そのコンポーネントに機械的に接続された接続先のコンポーネントを示す接続先情報１０６ｂとを設計情報１０６において関連付ける。図２の例では、「電源A」と「ケーブルB」とが関連付けられているため、「電源A」と「ケーブルB」とが機械的に接続されるように製品が設計されている。 Design information 106 is information about the design of a product such as an upgrade product, and is a collection of existing information such as model information created by MBSE (Model-Based System Engineering) and CAD (Computer Aided Design) information. Of this information, Figure 2 illustrates only the information that indicates the design mechanical connection relationships between the components that make up the product. Here, component 106a is associated in design information 106 with connection destination information 106b that indicates the destination component that is mechanically connected to that component. In the example of Figure 2, "Power supply A" and "Cable B" are associated, and therefore the product is designed so that "Power supply A" and "Cable B" are mechanically connected.
　設計情報１０６は、配線等を介して設計時に明示的に機械的に接続されたコンポーネントを示しており、設計時に意図していない電磁的な接続関係は示していない。また、設計情報１０６から接続先コンポーネント情報を省いてもよい。この場合は、設計情報１０６は、製品に含まれるコンポーネントのみを示す情報である。 Design information 106 indicates components that are explicitly mechanically connected at the time of design via wiring, etc., and does not indicate electromagnetic connection relationships that were not intended at the time of design. Furthermore, connection destination component information may be omitted from design information 106. In this case, design information 106 is information that indicates only the components included in the product.
　更に、設計情報１０６に設計ルールを含めてもよい。設計ルールとしては、例えば、二つのケーブルの間隔等がある。また、コンポーネントの大きさ、長さ、及び形状等を設計情報１０６に含めてもよい。 Furthermore, the design information 106 may include design rules. For example, design rules include the distance between two cables. Furthermore, the size, length, shape, etc. of the components may be included in the design information 106.
　図３は、要求情報１０７のデータ構造の一例を示す模式図である。 FIG. 3 is a schematic diagram showing an example of the data structure of the request information 107.
　要求情報１０７は、製品に要求される性能を示す情報である。この例では、上位要求と下位要求とを関連づけた情報が要求情報１０７である。 Requirement information 107 is information that indicates the performance required of a product. In this example, requirement information 107 is information that associates higher-level requirements with lower-level requirements.
　上位要求は、製品に要求される性能を上位概念で示した要求であって、「要求事項名」と「要求内容」とを含む。「要求事項名」は要求に付された名前であり、「要求内容」がその要求の具体的な内容を示す。これについては後述の下位要求でも同様である。この例では、上位要求の「Immunity性能要求」の「要求内容」が「LTE機器によっても誤動作しないこと」となっているが、これは外部のLTE(Long Term Evolution)機器が放射する電磁波によって製品が誤動作しないという内容を示す。 　Higher-level requirements are requirements that express the performance required of a product in a higher-level concept, and include a "requirement name" and a "requirement content." The "requirement name" is the name given to the requirement, and the "requirement content" indicates the specific content of the requirement. This is also true for lower-level requirements, which are described below. In this example, the "requirement content" of the higher-level requirement "Immunity performance requirement" is "Do not malfunction even when exposed to LTE equipment," indicating that the product will not malfunction due to electromagnetic waves emitted by external LTE (Long Term Evolution) equipment.
　下位要求は、上位要求を満たすために製品に要求される要求事項を細分化した情報である。この例では、上位要求の「Immunity性能要求」が「710MHz放射イミュニティ性能」と「745MHz放射イミュニティ性能」とに細分化されている。 Lower-level requirements are information that subdivides the requirements that are required of a product in order to satisfy higher-level requirements. In this example, the higher-level requirement "Immunity performance requirement" is subdivided into "710MHz radiation immunity performance" and "745MHz radiation immunity performance."
　図４は、解析情報１０８のデータ構造の一例を示す模式図である。 FIG. 4 is a schematic diagram showing an example of the data structure of the analysis information 108.
　解析情報１０８は、過去の製品を実際に解析することにより、「設計ルール」と「リスク」とを関連付けた情報である。図４の例では、二つのケーブルが間隔d以下で並走するという「設計ルール」の場合、1MHzよりも高い周波数でこれらのケーブル同士が電磁的に結合する「リスク」があることを示している。なお、「番号」は、互いに関連付けられた「設計ルール」と「リスク」とを一意に識別する番号である。 Analysis information 108 is information that associates "design rules" with "risks" by actually analyzing past products. In the example of Figure 4, in the case of a "design rule" in which two cables run parallel with a distance of d or less, there is a "risk" that these cables will electromagnetically couple with each other at frequencies higher than 1 MHz. The "number" is a number that uniquely identifies the associated "design rule" and "risk."
　図５は、過去トラブル情報１０９のデータ構造の一例を示す模式図である。 FIG. 5 is a schematic diagram showing an example of the data structure of past trouble information 109.
　過去トラブル情報１０９は、過去の製品に実際に発生したトラブルを示す情報である。この例では、「番号」、「周波数」、「ノイズ源」、「伝搬経路」、及び「被害コンポーネント」の各々を関連付けた情報が過去トラブル情報１０９である。 Past trouble information 109 is information that indicates troubles that have actually occurred in products in the past. In this example, past trouble information 109 is information that associates each of the following: "number," "frequency," "noise source," "propagation path," and "damaged component."
　「番号」は、過去のトラブル事例を一意に識別する番号である。「周波数」は、トラブルが起きた周波数である。「ノイズ源」は、製品に含まれるコンポーネントのうち、トラブルの原因となったコンポーネントである。「伝搬経路」は、トラブル発生時に電磁的に接続されたコンポーネントを繋いだ経路である。この例では、「A」、「B」、「C」等のアルファベットで電磁的に接続されたコンポーネントを示し、ハイフンでこれらのコンポーネントが電磁的に接続されたことを示す。「被害コンポーネント」は、「ノイズ源」のコンポーネントが原因で誤動作をしたコンポーネントである。 "Number" is a number that uniquely identifies a past trouble case. "Frequency" is the frequency at which the trouble occurred. "Noise source" is the component contained in the product that caused the trouble. "Propagation path" is the path connecting the electromagnetically connected components when the trouble occurred. In this example, the electromagnetically connected components are indicated by letters such as "A," "B," and "C," and hyphens indicate that these components are electromagnetically connected. "Victim component" is the component that malfunctioned due to the "noise source" component.
　図５の例では、「番号」が「1」のトラブルにおいて、インバータが原因で周波数が1MHz～10MHzの周波数で伝搬経路A-B-C-Dが発生し、それにより圧力センサが誤動作したことを示す。 In the example in Figure 5, in the trouble numbered "1," the inverter caused a propagation path A-B-C-D at frequencies between 1 MHz and 10 MHz, which caused the pressure sensor to malfunction.
　図６は、判定情報１１０のデータ構造の一例を示す模式図である。 FIG. 6 is a schematic diagram showing an example of the data structure of the judgment information 110.
　判定情報１１０は、プロセッサ１０１が、設計情報１０６、解析情報１０８、及び過去トラブル情報１０９に基づいて、コンポーネント同士が電磁的に接続されているかを判定するための判定条件を格納した情報である。この例では、コンポーネント同士が電磁的に接続されている可能性の高さを示す確度を予め判定条件と関連付けて判定情報１１０に格納する。確度は0以上1以下の数値である。確度が0の場合、コンポーネント同士が電磁的に接続されている可能性がないことを示す。確度が1の場合、コンポーネント同士が電磁的に確実に接続されていることを示す。判定情報１１０は、予めユーザが作成してメモリリソース１０４に格納する。 The judgment information 110 is information that stores judgment conditions used by the processor 101 to judge whether components are electromagnetically connected to each other based on the design information 106, analysis information 108, and past trouble information 109. In this example, a degree of certainty indicating the likelihood that the components are electromagnetically connected to each other is associated with the judgment condition in advance and stored in the judgment information 110. The degree of certainty is a numerical value between 0 and 1 inclusive. An accuracy of 0 indicates that there is no possibility that the components are electromagnetically connected to each other. An accuracy of 1 indicates that the components are definitely electromagnetically connected to each other. The judgment information 110 is created in advance by the user and stored in the memory resource 104.
　一例として、判定情報１１０は、対象コンポーネント１１０ａ、設計情報１０６に基づく判定条件１１０ｂ、解析情報１０８に基づく判定条件１１０ｃ、及び過去トラブル情報１０９に基づく判定条件１１０ｄを有する。なお、判定条件１１０ｃ、１１０ｄについては、これらの両方を判定情報１１０に含めるのではなく、これらの少なくとも一方が判定情報１１０に含まれていればよい。 As an example, the judgment information 110 has a target component 110a, a judgment condition 110b based on the design information 106, a judgment condition 110c based on the analysis information 108, and a judgment condition 110d based on the past trouble information 109. Note that it is not necessary to include both of the judgment conditions 110c and 110d in the judgment information 110, but rather it is sufficient that at least one of these conditions is included in the judgment information 110.
　対象コンポーネント１１０ａは、電磁的に接続されているかを判定する対象となるコンポーネントの対を示す。 Target component 110a indicates a pair of components that are to be determined to be electromagnetically connected.
　設計情報１０６（図２参照）に基づく判定条件１１０ｂは、対象コンポーネント１１０ａのコンポーネント同士が電磁的に接続されているか否かを設計情報１０６に基づいて判定する条件である。例えば、対象コンポーネント１１０ａの二つのコンポーネントが設計情報１０６において機械的に接続されていることが示されている場合は「接続あり」であり、それらが相互に接続されていない場合は「接続なし」である。なお、設計情報１０６に接続先情報１０６ｂが存在しない場合も「接続なし」である。 The judgment condition 110b based on the design information 106 (see FIG. 2) is a condition for judging whether or not the components of the target component 110a are electromagnetically connected based on the design information 106. For example, if the design information 106 indicates that the two components of the target component 110a are mechanically connected, it is "connected," and if they are not connected to each other, it is "not connected." Note that if there is no connection destination information 106b in the design information 106, it is also "not connected."
　製品を設計するための設計情報１０６においてコンポーネント同士が機械的に接続されていることが示されている場合は、コンポーネント同士が電磁的に確実に接続されているため、確度は最も高い「1」である。一方、設計情報１０６においてコンポーネント同士が機械的に接続されていないことが示されている場合は、コンポーネント同士が電磁的に接続されている可能性は低いため、確度は最も低い「0」である。 If the design information 106 for designing a product indicates that the components are mechanically connected to each other, the components are reliably connected to each other electromagnetically, and so the degree of certainty is the highest, "1." On the other hand, if the design information 106 indicates that the components are not mechanically connected to each other, the components are unlikely to be electromagnetically connected to each other, and so the degree of certainty is the lowest, "0."
　解析情報１０８に基づく判定条件１１０ｃは、対象コンポーネント１１０ａのコンポーネント同士が電磁的に接続されているか否かを解析情報１０８に基づいて判定する条件である。 The determination condition 110c based on the analysis information 108 is a condition for determining whether the components of the target component 110a are electromagnetically connected to each other based on the analysis information 108.
　判定条件１１０ｃにおいては、複数の周波数ごとに複数の判定条件が定められる。例えば、対象コンポーネント１１０ａの二つのコンポーネントが「ケーブル」の場合を考える。このとき、周波数が「〇〇～△△Hz」の範囲にあり、かつ「条件A」が満たされるときに、解析情報１０８においてリスクが生じることが示されている場合、「ケーブル」同士が電磁的に接続される確度は「0.1」である。また、周波数が上記と同一の「〇〇～△△Hz」の範囲にあり、かつ「条件B」が満たされるときに、解析情報１０８においてリスクが生じることが示されている場合、「ケーブル」同士が電磁的に接続される確度は「0.2」である。「条件A」や「条件B」は、例えば各ケーブルの長さや間隔等である。同一の周波数範囲で「条件A」や「条件B」等の複数の条件が存在するのは、解析情報１０８（図４）において同一の周波数範囲で異なるリスクが存在する可能性を考慮してのことである。また、「0.1」や「0.2」等の確度の値は、各コンポーネント同士が電磁的に接続される可能性の高さを考慮してユーザが事前に決定する。 In the judgment condition 110c, multiple judgment conditions are defined for multiple frequencies. For example, consider the case where the two components of the target component 110a are "cables." In this case, if the frequency is in the range of "XX to △△ Hz" and "Condition A" is satisfied, and if the analysis information 108 indicates that a risk occurs, the probability that the "cables" will be electromagnetically connected is "0.1." Also, if the frequency is in the same range of "XX to △△ Hz" as above and "Condition B" is satisfied, and if the analysis information 108 indicates that a risk occurs, the probability that the "cables" will be electromagnetically connected is "0.2." "Condition A" and "Condition B" are, for example, the length and spacing of each cable. The reason why multiple conditions such as "Condition A" and "Condition B" exist in the same frequency range is because the analysis information 108 (Figure 4) considers the possibility that different risks exist in the same frequency range. Also, the value of the probability such as "0.1" and "0.2" is determined in advance by the user in consideration of the high probability that each component will be electromagnetically connected.
　一例として、図４の解析情報１０８のように二つのケーブルが間隔d以下で並走すると1MHzよりも高い周波数でこれらのケーブル同士が電磁的に結合するリスクがある場合を想定する。この場合、判定条件１１０ｃにおける周波数領域「〇〇～△△Hz」と1MHzよりも高い周波数領域とが重複し、かつ「条件A」が「二つのケーブルが間隔d以下で並走する」という条件の場合、二つのケーブル同士が電磁的に接続される確度は「0.1」である。 As an example, consider a case where, as in analysis information 108 in Figure 4, if two cables run parallel to each other with a distance of d or less, there is a risk that these cables will electromagnetically couple to each other at frequencies higher than 1 MHz. In this case, if the frequency range "XXX to △△ Hz" in judgment condition 110c overlaps with a frequency range higher than 1 MHz, and "Condition A" is "two cables run parallel to each other with a distance of d or less," the probability that the two cables will be electromagnetically connected to each other is "0.1."
　過去トラブル情報１０９に基づく判定条件１１０ｄは、対象コンポーネント１１０ａのコンポーネント同士が電磁的に接続されているか否かを過去トラブル情報１０９に基づいて判定する条件である。 The judgment condition 110d based on the past trouble information 109 is a condition for judging whether the components of the target component 110a are electromagnetically connected to each other based on the past trouble information 109.
　判定条件１１０ｄにおいても、判定条件１１０ｃと同様に、複数の周波数ごとに複数の判定条件が定められる。 In the judgment condition 110d, similar to the judgment condition 110c, multiple judgment conditions are set for multiple frequencies.
　一例として、図５の過去トラブル情報１０９のようにインバータが原因で周波数が1MHz～10MHzのときに圧力センサが誤動作したトラブルがあった場合を想定する。また、そのトラブルが、「条件P」が満たされるときに生じた場合を想定する。「条件P」は、圧力センサやインバータ等のコンポーネントの大きさ、長さ、及び形状等である。「条件Q」やその他の条件についても同様である。この場合、対象コンポーネント１１０ａが「インバータ」と「圧力センサ」のときの「周波数〇〇～△△Hz」が1MHz～10MHzと重複しており、かつ「条件P」満たされる場合の確度は「0.1」である。なお、判定条件１１０ｃと同様に、確度の値は、各コンポーネント同士が電磁的に接続される可能性の高さを考慮してユーザが事前に決定する。 As an example, let us assume that there is a problem in which the inverter causes the pressure sensor to malfunction when the frequency is between 1 MHz and 10 MHz, as shown in the past trouble information 109 in FIG. 5. Let us also assume that this trouble occurs when "Condition P" is satisfied. "Condition P" refers to the size, length, and shape of components such as the pressure sensor and inverter. The same applies to "Condition Q" and other conditions. In this case, when the target components 110a are the "inverter" and "pressure sensor", the "frequency XX to △△ Hz" overlaps with 1 MHz to 10 MHz, and "Condition P" is satisfied, the accuracy is "0.1". As with the judgment condition 110c, the accuracy value is determined in advance by the user, taking into account the likelihood that the components are electromagnetically connected to each other.
　図７は、連携情報１１１のデータ構造の一例を示す模式図である。 FIG. 7 is a schematic diagram showing an example of the data structure of the linkage information 111.
　連携情報１１１は、要求情報１０７（図３参照）の下位要求における「要求事項名」と、その要求事項に影響を与える「コンポーネント」とを関連付けた情報である。例えば、「ケーブルB」が要求事項名の「710MHzイミュニティ性能」に影響を及ぼす場合は、図７のように「ケーブルB」と「710MHzイミュニティ性能」とが関連付けられる。 The linkage information 111 is information that associates the "requirement name" in the lower-level requirements of the requirement information 107 (see FIG. 3) with the "component" that affects that requirement. For example, if "Cable B" affects the requirement name "710 MHz immunity performance," then "Cable B" and "710 MHz immunity performance" are associated as shown in FIG. 7.
　連携情報１１１は、ユーザが作成して予めメモリリソース１０４に格納してもよいし、後述のようにプロセッサ１０１が作成してメモリリソース１０４に格納してもよい。 The linkage information 111 may be created by the user and stored in advance in the memory resource 104, or it may be created by the processor 101 and stored in the memory resource 104 as described below.
　図８は、コンピュータシステム１００の機能ブロック図である。 FIG. 8 is a functional block diagram of computer system 100.
　図８に示すように、コンピュータシステム１００は、連携部８０１、検知部８０２、抽出部８０３、接続モデル生成部８０４、推定部８０５、及び提示部８０６を機能部として備える。これらの機能部は、プロセッサ１０１とメモリリソース１０４とが協働して試験項目提示プログラム１０５を実行することで実現される。 As shown in FIG. 8, the computer system 100 includes, as functional units, a collaboration unit 801, a detection unit 802, an extraction unit 803, a connection model generation unit 804, an estimation unit 805, and a presentation unit 806. These functional units are realized by the processor 101 and the memory resource 104 working together to execute the test item presentation program 105.
　連携部８０１は、設計情報１０６と要求情報１０７とを連携させることで連携情報１１１を生成する。 The linking unit 801 generates linking information 111 by linking the design information 106 and the requirement information 107.
　図９は、連携部８０１の機能の一例を説明するための模式図である。 FIG. 9 is a schematic diagram for explaining an example of the function of the linking unit 801.
　まず、連携部８０１は、設計情報１０６に基づいて、各コンポーネントとその接続関係とを示す情報を生成する。以下では、その情報をブロック図９０１として模式的に表す。なお、設計情報１０６に接続先情報１０６ｂが存在しない場合は、連携部８０１は、コンポーネントのみを特定してもよい。 First, the linking unit 801 generates information indicating each component and its connection relationship based on the design information 106. Below, this information is represented diagrammatically as a block diagram 901. Note that if the connection destination information 106b does not exist in the design information 106, the linking unit 801 may identify only the components.
　次に、連携部８０１は、ブロック図９０１のコンポーネントごとに、そのコンポーネントが影響を与える下位要求事項を特定する。例えば、ユーザが、過去の設計情報１０６、試験結果、及び要求情報１０７に基づき、コンポーネントとその設置条件（周波数や長さ）の組み合わせごとに、要求される下位要求事項を対応付けたテーブルを予め作成しておく。連携部８０１は、対象コンポーネントとその設置条件に関して当該テーブルを参照することにより、対応する下位要求事項を特定することができる。例えば、対象コンポーネント「ケーブルB」と設置条件「ケーブルB単体」との組み合わせに対し、下位要求事項「710MHz放射イミュニティ性能」がテーブルにおいて対応している場合、当該組み合わせに対する下位要求事項は「710MHz放射イミュニティ性能」である。なお、上記のようなルールベースの処理に限らず、機械学習を用いて連携部８０１が下位要求事項を特定してもよい。例えば、コンポーネントとその設置条件（周波数や長さ）の組み合わせを入力すると、要求される下位要求事項を出力する学習モデルを予め機械学習により作成しておく。連携部８０１は、対象コンポーネントとその設置条件を当該学習モデルに入力することで下位要求事項を取得することができる。 Next, the linking unit 801 identifies the sub-requirements that are affected by each component in the block diagram 901. For example, the user creates a table in advance based on the past design information 106, the test results, and the requirement information 107, in which the required sub-requirements are associated with each combination of components and their installation conditions (frequency and length). The linking unit 801 can identify the corresponding sub-requirements by referring to the table for the target component and its installation conditions. For example, if the sub-requirement "710 MHz radiation immunity performance" corresponds to the combination of the target component "cable B" and the installation condition "cable B alone" in the table, the sub-requirement for the combination is "710 MHz radiation immunity performance". Note that the linking unit 801 may identify the sub-requirements using machine learning, not limited to the rule-based processing described above. For example, a learning model that outputs the required sub-requirements when a combination of a component and its installation conditions (frequency and length) is input is created in advance by machine learning. The linking unit 801 can acquire the sub-requirements by inputting the target component and its installation conditions into the learning model.
　再び図８を参照する。検知部８０２は、設計情報１０６に基づいて、設計変更があったコンポーネントを検知する。例えば、旧製品とそのアップグレード品の各々の設計情報１０６をユーザが予めメモリリソース１０４に格納しておき、検知部８０２が、それらの設計情報１０６の差分に基づいて設計変更があったコンポーネントを検知する。例えば、旧製品では「電源A」の接続先が「ケーブルA」であった場合に、バージョンアップ品では「電源A」の接続先が「ケーブルB」となったときは、検知部８０２は、設計変更があったコンポーネントとして「電源A」を検知する。また、旧製品では「センサA」がなかった場合に、バージョンアップ品では「センサA」が存在するときは、検知部８０２は、設計変更があったコンポーネントとして「センサA」を検知する。 Referring again to FIG. 8, the detection unit 802 detects components whose design has changed based on the design information 106. For example, the user stores the design information 106 of the old product and its upgraded product in the memory resource 104 in advance, and the detection unit 802 detects components whose design has changed based on the difference between the design information 106. For example, if "Power Supply A" was connected to "Cable A" in the old product, but is now connected to "Cable B" in the upgraded product, the detection unit 802 detects "Power Supply A" as a component whose design has changed. Also, if "Sensor A" did not exist in the old product, but "Sensor A" exists in the upgraded product, the detection unit 802 detects "Sensor A" as a component whose design has changed.
　抽出部８０３は、設計情報１０６に基づいて各コンポーネントの機械的な接続関係を抽出し、その接続関係を示す情報を生成する。以下では、接続関係を示す情報をグラフで模式的に示す。 The extraction unit 803 extracts the mechanical connection relationships of each component based on the design information 106, and generates information indicating the connection relationships. Below, the information indicating the connection relationships is shown diagrammatically in the form of a graph.
　図１０Ａは、各コンポーネントの機械的な接続関係を示すグラフの一例を示す模式図である。このグラフ１００１は、コンポーネントをノードNとする無向グラフである。ノードN間のエッジEは、各ノードNが示すコンポーネント同士が機械的に接続されていることを示す。 FIG. 10A is a schematic diagram showing an example of a graph indicating the mechanical connection relationships of each component. This graph 1001 is an undirected graph in which components are represented as nodes N. Edges E between nodes N indicate that the components represented by each node N are mechanically connected to each other.
　例えば、抽出部８０３は、設計情報１０６のコンポーネント１０６ａと接続先情報１０６ｂの各々に格納されているコンポーネントに対応したノードNを生成する。そして、抽出部８０３は、これらのノードNのうちで、設計情報１０６において機械的に接続されていることが示されているノードN間にエッジEを生成する。 For example, the extraction unit 803 generates nodes N corresponding to the components stored in the components 106a and the connection destination information 106b of the design information 106. The extraction unit 803 then generates edges E between the nodes N that are shown to be mechanically connected in the design information 106.
　例えば、図２の設計情報１０６の場合は、グラフ１００１のノードNは「電源A」、「ケーブルA」、「センサA」、「ケーブルB」、「センサB」、「ケーブルC」等である。また、「電源A」と「ケーブルB」との間にエッジEが生成される。同様に、「ケーブルA」と「センサB」との間にもエッジEが生成され、「センサA」と「ケーブルC」との間にもエッジEが生成される。 For example, in the case of design information 106 in FIG. 2, nodes N in graph 1001 are "Power supply A," "Cable A," "Sensor A," "Cable B," "Sensor B," "Cable C," etc. Furthermore, edge E is generated between "Power supply A" and "Cable B." Similarly, edge E is generated between "Cable A" and "Sensor B," and edge E is generated between "Sensor A" and "Cable C."
　再び図８を参照する。接続モデル生成部８０４は、判定情報１１０を参照して、複数のコンポーネント同士の電磁的な接続関係を示す接続モデルを生成してそれをメモリリソース１０４に格納する。 Referring again to FIG. 8, the connection model generation unit 804 references the determination information 110 to generate a connection model that indicates the electromagnetic connection relationships between multiple components, and stores the model in the memory resource 104.
　図１０Ｂは、接続モデル生成部８０４が生成した接続モデルの一例を示す模式図である。 FIG. 10B is a schematic diagram showing an example of a connection model generated by the connection model generation unit 804.
　接続モデル１００２は、グラフ１００１（図１０Ａ参照）にエッジFを追加した無向グラフである。エッジFは、電磁的に接続されている可能性があるノードN同士を接続するエッジであり、設計情報１０６のみではその存否が明らかとはならないエッジである。接続モデル１００２の生成方法の詳細については後述する。 The connection model 1002 is an undirected graph in which an edge F is added to the graph 1001 (see FIG. 10A). The edge F is an edge that connects nodes N that may be electromagnetically connected, and the existence or nonexistence of the edge is not clear from the design information 106 alone. The method of generating the connection model 1002 will be described in detail later.
　再び図８を参照する。推定部８０５は、接続モデル１００２において、設計変更がされたコンポーネントの影響を受ける影響範囲を推定する。その推定方法について以下に説明する。 Referring again to FIG. 8, the estimation unit 805 estimates the extent of the influence of the component whose design has been changed in the connection model 1002. The estimation method is explained below.
　図１１Ａは、影響範囲を推定するために推定部８０５が使用する接続モデル１００２の一例を示す模式図である。この接続モデル１００２を使用して、推定部８０５は、図１１Ｂのように影響範囲Gを推定する。 FIG. 11A is a schematic diagram showing an example of a connection model 1002 used by the estimation unit 805 to estimate the range of influence. Using this connection model 1002, the estimation unit 805 estimates the range of influence G as shown in FIG. 11B.
　図１１Ｂは、影響範囲の推定方法の一例を示す模式図である。あるノードNのコンポーネントが設計変更された場合、推定部８０５は、エッジE又はエッジFを辿って設計変更されたノードNに到達可能な全てのノードNを影響範囲Gとして推定する。影響範囲Gに含まれるノードに対応するコンポーネントは、設計変更されたコンポーネントと電磁的に接続されているコンポーネントである。よって、影響範囲Gに含まれるノードに対応するコンポーネントは、設計変更されたコンポーネントの影響を受けると推定することができる。 FIG. 11B is a schematic diagram showing an example of a method for estimating the extent of influence. When the design of a component at a certain node N is changed, the estimation unit 805 estimates all nodes N that can reach the node N whose design has been changed by tracing edges E or F as the extent of influence G. Components corresponding to nodes included in the extent of influence G are components that are electromagnetically connected to the component whose design has been changed. Therefore, it can be estimated that components corresponding to nodes included in the extent of influence G are affected by the component whose design has been changed.
　再び図８を参照する。提示部８０６は、連携情報１１１（図７参照）に基づいて、影響範囲G（図１１Ｂ参照）に含まれるノードNのコンポーネントに関連付けられたEMC試験項目をUIデバイス１０２（図１参照）に提示する。 Referring again to FIG. 8, the presentation unit 806 presents, on the UI device 102 (see FIG. 1), EMC test items associated with the components of node N included in the impact range G (see FIG. 11B) based on the linkage information 111 (see FIG. 7).
　例えば、提示部８０６は、影響範囲G（図１１Ｂ参照）に含まれるノードNごとに、そのノードNと連携情報１１１（図７参照）において関連付けられている「要求事項名」を特定する。そして、提示部８０６は、特定した「要求事項名」の要求事項を満たすかの試験項目をEMC試験項目として提示する。例えば、提示部８０６が特定した「要求事項名」が「710MHz放射イミュニティ性能」の場合、提示部８０６は、この要求事項を満たすかを試験する「710MHz放射イミュニティ性能試験」をEMC試験項目として提示する。 For example, for each node N included in the impact range G (see FIG. 11B), the presentation unit 806 identifies the "requirement name" associated with that node N in the linkage information 111 (see FIG. 7). The presentation unit 806 then presents, as an EMC test item, a test item that satisfies the requirement of the identified "requirement name." For example, if the "requirement name" identified by the presentation unit 806 is "710 MHz radiation immunity performance," the presentation unit 806 presents, as an EMC test item, a "710 MHz radiation immunity performance test" that tests whether this requirement is satisfied.
　以上が機能ブロックの説明であるが、機能ブロックは図８に示す通りに区切られてなくてもよい。すなわち、１つのプログラムが複数のプログラムの役割を兼ねてもよい。また、その逆であってもよい。すなわち、１以上のプログラムが図８の各機能の処理を行えれば良い。 The above is an explanation of the functional blocks, but the functional blocks do not have to be divided as shown in Figure 8. In other words, one program may perform the functions of multiple programs. The opposite is also possible. In other words, it is sufficient if one or more programs can process each function in Figure 8.
　次に、接続モデル生成部８０４が接続モデル１００２を生成する方法について説明する。 Next, we will explain how the connection model generation unit 804 generates the connection model 1002.
　図１２は、接続モデルの生成方法のフローチャートの一例である。 Figure 12 is an example of a flowchart for a method for generating a connection model.
　この例では、接続モデル生成部８０４は、複数の周波数ごとにこのフローチャートを繰り返して実行することで、複数の周波数ごとに接続モデル１００２を生成する。以下では説明を簡単にするために「低周波」と「高周波」の二つの周波数について接続モデル生成部８０４が接続モデル１００２を生成する場合を例にして説明する。「低周波」は、1MHz～100MHz等のような上限周波数（100MHz）以下の周波数である。「高周波」は、「低周波」の上限周波数（100MHz）よりも高い周波数であって、例えば100MHz～1GHzの範囲にある周波数である。 In this example, the connection model generation unit 804 generates a connection model 1002 for each of the multiple frequencies by repeatedly executing this flowchart for each of the multiple frequencies. For simplicity's sake, the following description will be given taking as an example a case in which the connection model generation unit 804 generates a connection model 1002 for two frequencies, a "low frequency" and a "high frequency." A "low frequency" is a frequency that is equal to or lower than an upper limit frequency (100 MHz), such as between 1 MHz and 100 MHz. A "high frequency" is a frequency that is higher than the upper limit frequency (100 MHz) of the "low frequency," for example, a frequency in the range of 100 MHz to 1 GHz.
　まず、接続モデル生成部８０４は、本製品に類似した類似製品の接続モデル１００２がメモリリソース１０４に既にあるかを判定する（ステップＳ１２０１）。例えば、接続モデル生成部８０４は、過去の製品の接続モデル１００２のうち、抽出部８０３が抽出したグラフ１００１に類似したものを、類似製品の接続モデル１００２として特定する。類否判定のアルゴリズムは特に限定されないが、例えば、接続モデル生成部８０４は、本製品を構成する全てコンポーネントとそれらの機械的な接続関係の両方が含まれる接続モデルを類似と判定すればよい。また、接続モデル生成部８０４は、製品名が同一で型番が異なる製品の接続モデルを類似と判定してもよい。ここで、類似製品の接続モデル１００２がない（ＮＯ）と判定された場合にはステップＳ１２０２に移る。 First, the connection model generation unit 804 determines whether a connection model 1002 of a similar product similar to the present product is already present in the memory resource 104 (step S1201). For example, the connection model generation unit 804 identifies, among the connection models 1002 of past products, those similar to the graph 1001 extracted by the extraction unit 803 as the connection model 1002 of a similar product. The algorithm for determining similarity is not particularly limited, but for example, the connection model generation unit 804 may determine that a connection model that includes both all components that make up the present product and their mechanical connection relationships is similar. The connection model generation unit 804 may also determine that a connection model of a product with the same product name but different model number is similar. Here, if it is determined that there is no connection model 1002 of a similar product (NO), the process proceeds to step S1202.
　ステップＳ１２０２では、接続モデル生成部８０４は、設計情報１０６（図２参照）における全てのコンポーネント１０６ａをノードとするグラフであって、全てのノードを接続したグラフを作成する。 In step S1202, the connection model generation unit 804 creates a graph in which all components 106a in the design information 106 (see FIG. 2) are nodes and all nodes are connected.
　図１３Ａは、このように全てのノードを接続したグラフ１３０１の一例を示す模式図である。類似製品の接続モデル１００２がない場合は、接続モデル生成部８０４は、このグラフ１３０１に対して以下のステップＳ１２０３～Ｓ１２０９を行う。 FIG. 13A is a schematic diagram showing an example of a graph 1301 in which all nodes are connected in this way. If there is no connection model 1002 for similar products, the connection model generation unit 804 performs the following steps S1203 to S1209 on this graph 1301.
　一方、類似製品の接続モデル１００２があると判定された場合（ステップＳ１２０１：ＹＥＳ）はステップＳ１２１０に移る。ステップＳ１２１０では、接続モデル生成部８０４は、類似製品の接続モデル１００２をメモリリソース１０４から取得し、その接続モデル１００２に対し、以下のステップＳ１２０３をスキップしてステップＳ１２０４～Ｓ１２０９を行う。 On the other hand, if it is determined that a connection model 1002 of similar products exists (step S1201: YES), the process proceeds to step S1210. In step S1210, the connection model generation unit 804 acquires the connection model 1002 of similar products from the memory resource 104, skips step S1203 below, and performs steps S1204 to S1209 for the connection model 1002.
　ステップＳ１２０２又はステップＳ１２１０を終えた後は、接続モデル生成部８０４は、グラフ１３０１又は類似製品の接続モデル１００２のノードNの対ごとに以下の処理を繰り返す。以下では、説明を簡単にするために、グラフ１３０１に対して処理を行う場合を例示する。 After completing step S1202 or step S1210, the connection model generation unit 804 repeats the following process for each pair of nodes N in the graph 1301 or the similar product connection model 1002. For ease of explanation, the following describes an example in which the process is performed on the graph 1301.
　まず、接続モデル生成部８０４は、判定情報１１０（図６参照）の判定条件１１０ｂを参照し、当該判定条件１１０ｂが示す確度PをあるノードNの対について特定する（ステップＳ１２０３）。 First, the connection model generation unit 804 refers to the judgment condition 110b in the judgment information 110 (see FIG. 6) and identifies the probability P indicated by the judgment condition 110b for a certain pair of nodes N (step S1203).
　例えば、接続モデル生成部８０４は、抽出部８０３が生成した各コンポーネントの機械的な接続関係を示す情報を参照して、ステップＳ１２０３の処理対象となるノードNの対が機械的に接続されているかを判定する。機械的に接続されている場合は、接続モデル生成部８０４は、判定情報１１０において当該対に対応する対象コンポーネント１１０ａを特定し、その対象コンポーネント１１０ａに対応した判定条件１１０ｂの「接続あり」から確度「1」を取得する。また、接続モデル生成部８０４は、ステップＳ１２０３の処理の対象となるノードの対が機械的に接続されていない場合は、対象コンポーネント１１０ａに対応した判定条件１１０ｂの「接続なし」から確度「0」を取得する。 For example, the connection model generation unit 804 refers to the information indicating the mechanical connection relationship of each component generated by the extraction unit 803 to determine whether the pair of nodes N to be processed in step S1203 is mechanically connected. If they are mechanically connected, the connection model generation unit 804 identifies the target component 110a corresponding to the pair in the determination information 110, and obtains a probability of "1" from the "connected" determination condition 110b corresponding to the target component 110a. If the pair of nodes to be processed in step S1203 is not mechanically connected, the connection model generation unit 804 obtains a probability of "0" from the "not connected" determination condition 110b corresponding to the target component 110a.
　なお、設計情報１０６は、設計時に機械的に接続されているコンポーネントを示す情報であるため、「低周波」と「高周波」のいずれにおいても確度Pの値は変わらない。また、前述のように類似製品の接続モデル１００２があると判定された場合（ステップＳ１２０１：ＹＥＳ）はステップＳ１２０３をスキップする。類似製品の接続モデル１００２の各エッジには既に確度Pが付与されている。そのため、ステップＳ１２０３をスキップする場合は、接続モデル生成部８０４は、判定条件１１０ｂを参照せずに、類似製品の接続モデル１００２のエッジのうちでコンポーネント同士の機械的な接続を表すエッジに付与された確度Pを、当該エッジの確度Pとしてそのまま流用する。このようにステップＳ１２０３をスキップすることで処理速度を向上することができる。 Note that the design information 106 is information indicating components that are mechanically connected at the time of design, so the value of the accuracy P does not change for either "low frequency" or "high frequency." Also, as described above, if it is determined that a similar product connection model 1002 exists (step S1201: YES), step S1203 is skipped. An accuracy P has already been assigned to each edge of the similar product connection model 1002. Therefore, when skipping step S1203, the connection model generation unit 804 does not refer to the judgment condition 110b, but instead directly uses the accuracy P assigned to an edge of the similar product connection model 1002 that represents a mechanical connection between components as the accuracy P of that edge. In this way, skipping step S1203 can improve the processing speed.
　次に、接続モデル生成部８０４は、判定情報１１０（図６参照）の判定条件１１０ｃを参照し、当該判定条件１１０ｃが示す確度PをあるノードNの対について合計する（ステップＳ１２０４）。 Next, the connection model generation unit 804 refers to the judgment condition 110c in the judgment information 110 (see FIG. 6) and sums the probability P indicated by the judgment condition 110c for a pair of nodes N (step S1204).
　例えば、接続モデル生成部８０４は、判定情報１１０において、ステップＳ１２０４の処理対象のノードの対に対応した対象コンポーネント１１０ａを特定する。更に、接続モデル生成部８０４は、特定した対象コンポーネント１１０ａの大きさ、長さ、及び形状等を設計情報１０６から特定し、それらが判定条件１１０ｃの「条件A」、「条件B」、…を満たすかを判定する。満たすと判定した場合、接続モデル生成部８０４は、判定情報１１０における「周波数〇〇～△△Hz」、「周波数△△～◇◇Hz」、「周波数◇◇～■■Hz」のうち、図１２のフローチャートを実行中の周波数の範囲に含まれる周波数に対応した確度Pを特定する。 For example, the connection model generation unit 804 identifies the target component 110a in the judgment information 110 that corresponds to the pair of nodes that are the subject of processing in step S1204. Furthermore, the connection model generation unit 804 identifies the size, length, shape, etc. of the identified target component 110a from the design information 106, and determines whether they satisfy "Condition A", "Condition B", ... of the judgment condition 110c. If it is determined that they are satisfied, the connection model generation unit 804 identifies the probability P corresponding to the frequency included in the frequency range during execution of the flowchart in FIG. 12, from among "Frequency XXX to △△ Hz", "Frequency △△ to ◇◇ Hz", and "Frequency ◇◇ to ■■ Hz" in the judgment information 110.
　また、判定条件１１０ｃにおいて複数の条件が満たされる場合、接続モデル生成部８０４は、複数の条件の各々に対応した複数の確度Pの合計を求める。なお、判定情報１１０に判定条件１１０ｃを含めない場合はステップＳ１２０４をスキップしてもよい。 If multiple conditions are satisfied in the judgment condition 110c, the connection model generation unit 804 calculates the sum of multiple probabilities P corresponding to each of the multiple conditions. Note that if the judgment information 110 does not include the judgment condition 110c, step S1204 may be skipped.
　次に、接続モデル生成部８０４は、判定情報１１０（図６参照）の判定条件１１０ｄを参照し、当該判定条件１１０ｄが示す確度PをあるノードNの対について合計する（ステップＳ１２０５）。 Next, the connection model generation unit 804 refers to the judgment condition 110d in the judgment information 110 (see FIG. 6) and sums the probability P indicated by the judgment condition 110d for a certain pair of nodes N (step S1205).
　例えば、接続モデル生成部８０４は、判定情報１１０において、ステップＳ１２０５の処理対象のノードの対に対応した対象コンポーネント１１０ａを特定する。更に、接続モデル生成部８０４は、特定した対象コンポーネント１１０ａの大きさ、長さ、及び形状等を設計情報１０６から特定し、それらが判定条件１１０ｄの「条件P」、「条件Q」、…を満たすかを判定する。満たすと判定した場合、接続モデル生成部８０４は、判定情報１１０における「周波数〇〇～△△Hz」、「周波数△△～◇◇Hz」、「周波数◇◇～■■Hz」のうち、図１２のフローチャートを実行中の周波数の範囲に含まれる周波数に対応した確度Pを特定する。 For example, the connection model generation unit 804 identifies the target component 110a in the judgment information 110 that corresponds to the pair of nodes that are the target of processing in step S1205. Furthermore, the connection model generation unit 804 identifies the size, length, shape, etc. of the identified target component 110a from the design information 106, and determines whether they satisfy the "condition P", "condition Q", ... of the judgment condition 110d. If it is determined that they are satisfied, the connection model generation unit 804 identifies the accuracy P corresponding to the frequency included in the frequency range during execution of the flowchart in FIG. 12, from among "frequency XXX to △△ Hz", "frequency △△ to ◇◇ Hz", and "frequency ◇◇ to ■■ Hz" in the judgment information 110.
　また、判定条件１１０ｄにおいて複数の条件が満たされる場合、接続モデル生成部８０４は、複数の条件の各々に対応した複数の確度Pの合計を求める。なお、判定情報１１０に判定条件１１０ｄを含めない場合はステップＳ１２０５をスキップしてもよい。 If multiple conditions are satisfied in the judgment condition 110d, the connection model generation unit 804 calculates the sum of multiple probabilities P corresponding to each of the multiple conditions. Note that if the judgment information 110 does not include the judgment condition 110d, step S1205 may be skipped.
　次に、接続モデル生成部８０４は、ステップＳ１２０３～Ｓ１２０５で求めた確度Pを合計する（ステップＳ１２０６）。 Next, the connection model generation unit 804 sums up the probabilities P calculated in steps S1203 to S1205 (step S1206).
　図１３Ｂは、図１３Ａのグラフ１３０１の一部のエッジに合計後の確度Pを併記した一例を示す模式図である。 FIG. 13B is a schematic diagram showing an example in which the probability P after summation is written on some edges of the graph 1301 in FIG. 13A.
　再び図１２を参照する。次いで、接続モデル生成部８０４は、合計した確度Pが0に等しいか、又は所定値Th以上であるかを判定する（ステップＳ１２０７）。確度Pが0に等しい場合は二つのコンポーネント同士が電磁的に接続されていないと判定できるが、確度Pが0よりも僅かに大きい場合はコンポーネント同士が電磁的に接続されていないと言い切るのは難しい。所定値Thは、このように確度Pが0よりも僅かに大きい場合にコンポーネント同士が電磁的に接続されている可能性があるかを判定するための値であり、ユーザによって事前に設定される。例えば、確度Pが所定値Th以上であれば二つのコンポーネント同士が電磁的に接続されている可能性が僅かでもあり、確度Pが所定値Th未満であれば二つのコンポーネント同士が電磁的に接続されている可能性がないということになる。 Referring again to FIG. 12. Next, the connection model generation unit 804 determines whether the summed probability P is equal to 0 or is equal to or greater than a predetermined value Th (step S1207). If the probability P is equal to 0, it can be determined that the two components are not electromagnetically connected, but if the probability P is slightly greater than 0, it is difficult to say with certainty that the components are not electromagnetically connected. The predetermined value Th is a value for determining whether the components are likely to be electromagnetically connected when the probability P is slightly greater than 0, and is set in advance by the user. For example, if the probability P is equal to or greater than the predetermined value Th, there is even a slight possibility that the two components are electromagnetically connected, and if the probability P is less than the predetermined value Th, there is no possibility that the two components are electromagnetically connected.
　ステップＳ１２０７において確度Pが0に等しいと判定された場合はステップＳ１２０８に移る。確度Pが0に等しい場合は二つのコンポーネント同士は電磁的には接続されていない。よって、ステップＳ１２０７では、接続モデル生成部８０４が、グラフ１３０１（図１３Ｂ参照）におけるこれらのコンポーネントに対応したノード間のエッジを削除する。 If it is determined in step S1207 that the likelihood P is equal to 0, the process proceeds to step S1208. If the likelihood P is equal to 0, the two components are not electromagnetically connected. Therefore, in step S1207, the connection model generation unit 804 deletes the edges between the nodes corresponding to these components in the graph 1301 (see FIG. 13B).
　一方、ステップＳ１２０７において確度Pが所定値Th以上であると判定された場合はステップＳ１２０９に移る。確度Pが所定値Th以上の場合は、二つのコンポーネントが電磁的に接続されている可能性が僅かでもある。よって、ステップＳ１２０９では、接続モデル生成部８０４は、グラフ１３０１におけるこれらのコンポーネントに対応したノード間のエッジを削除せずに、そのエッジと確度Pとを関連付けてメモリリソース１０４に格納する。 On the other hand, if it is determined in step S1207 that the probability P is equal to or greater than the predetermined value Th, the process proceeds to step S1209. If the probability P is equal to or greater than the predetermined value Th, there is a slight possibility that the two components are electromagnetically connected. Therefore, in step S1209, the connection model generation unit 804 does not delete the edge between the nodes corresponding to these components in the graph 1301, but associates the edge with the probability P and stores it in the memory resource 104.
　上記したステップＳ１２０３～Ｓ１２０９を全てのノードの対に対して繰り返し行った後はステップＳ１２１１に移る。なお、設計情報１０６から機械的に接続されていることが明らかなノードの対に対してはステップＳ１２０３～Ｓ１２０９をスキップし、接続モデル生成部８０４がそのノードの対の確度Pを「1」に設定してもよい。この場合は、判定情報１１０における判定条件１１０ｂは不要となる。同様に、類似製品の接続モデル１００２があると判定された場合（ステップＳ１２０１：ＹＥＳ）も、接続モデル生成部８０４は、類似製品の接続モデル１００２において機械的に接続されているノードの対に対してステップＳ１２０３～Ｓ１２０９をスキップし、そのノードの対の確度Pを「1」に設定してもよい。これにより、処理速度の向上を図ることができる。 After repeating steps S1203 to S1209 for all node pairs, the process proceeds to step S1211. Note that for node pairs that are clearly mechanically connected from the design information 106, steps S1203 to S1209 may be skipped, and the connection model generation unit 804 may set the accuracy P of the node pair to "1". In this case, the judgment condition 110b in the judgment information 110 is unnecessary. Similarly, if it is determined that there is a connection model 1002 of a similar product (step S1201: YES), the connection model generation unit 804 may skip steps S1203 to S1209 for the node pairs that are mechanically connected in the connection model 1002 of a similar product, and set the accuracy P of the node pair to "1". This can improve the processing speed.
　ステップＳ１２１１では、接続モデル生成部８０４が接続モデルを出力する。 In step S1211, the connection model generation unit 804 outputs the connection model.
　図１３Ｃは、図１３Ａ及び図１３Ｂのグラフ１３０１に基づいて接続モデル生成部８０４が出力した接続モデル１００２の一例を示す模式図である。 FIG. 13C is a schematic diagram showing an example of a connection model 1002 output by the connection model generation unit 804 based on the graphs 1301 in FIGS. 13A and 13B.
　図１３Ｃに示すように、接続モデル１００２は、図１３Ｂのグラフ１３０１から確度Pが所定値Th未満のエッジを削除したグラフである。 As shown in FIG. 13C, the connection model 1002 is a graph in which edges with a probability P less than a predetermined value Th are removed from the graph 1301 in FIG. 13B.
　図１０Ｂと同様に、接続モデル１００２におけるエッジEは、機械的に接続されているノードN間のエッジである。また、エッジFは、電磁的に接続されている可能性があるノードN間のエッジである。 As in FIG. 10B, edge E in the connection model 1002 is an edge between nodes N that are mechanically connected. Edge F is an edge between nodes N that may be electromagnetically connected.
　判定情報１１０を利用すると、このように確度Pが所定値Th以上のエッジで各コンポーネント同士が接続された接続モデル１００２を接続モデル生成部８０４が生成できる。その接続モデル１００２は、電磁的に接続されている可能性が僅かでもあるコンポーネント同士を接続したモデルである。よって、その接続モデル１００２に基づいて、推定部８０５が、設計変更の影響を僅かでも受ける可能性のある影響範囲G（図１１Ｂ参照）を推定できる。 By using the judgment information 110, the connection model generation unit 804 can generate a connection model 1002 in which components are connected to each other via edges whose accuracy P is equal to or greater than a predetermined value Th. This connection model 1002 is a model in which components are connected to each other even if there is a slight possibility that they are electromagnetically connected. Therefore, based on this connection model 1002, the estimation unit 805 can estimate the range of influence G (see FIG. 11B) that may be affected even slightly by the design change.
　しかも、前述のように解析情報１０８に基づく判定条件１１０ｃや過去トラブル情報１０９に基づく判定条件１１０ｄを判定情報１１０に含めることで、過去の製品に対する解析結果やトラブル情報を利用して各コンポーネント同士が電磁的に接続されているかを判定できる。 Moreover, by including in the judgment information 110 judgment conditions 110c based on the analysis information 108 and judgment conditions 110d based on the past trouble information 109 as described above, it is possible to judge whether the components are electromagnetically connected to each other by using the analysis results and trouble information for past products.
　また、この例では、接続モデル生成部８０４は、確度Pが0よりも大きくかつ所定値Th未満のノードの対に対しては、エッジの削除（ステップＳ１２０８）と確度の格納（ステップＳ１２０９）のいずれも行わない。確度Pが0よりも大きくかつ所定値Th未満のノードの対は、電磁的に接続されているかが不明なコンポーネントの対に相当する。そこで、提示部８０６は、そのようなコンポーネント同士を繋ぐ経路を、電磁的に接続されているかが不明な経路として提示してもよい。これにより、ユーザが、電磁的に接続されているかが不明な経路を把握することができる。 In addition, in this example, the connection model generation unit 804 does not delete edges (step S1208) or store the accuracy (step S1209) for node pairs whose accuracy P is greater than 0 and less than the predetermined value Th. Node pairs whose accuracy P is greater than 0 and less than the predetermined value Th correspond to component pairs whose electromagnetic connection is unclear. Therefore, the presentation unit 806 may present paths connecting such components as paths whose electromagnetic connection is unclear. This allows the user to understand paths whose electromagnetic connection is unclear.
　この後は、接続モデル生成部８０４が、上記したステップＳ１２０１～Ｓ１２１１を「低周波」と「高周波」の周波数ごとに繰り返す。これにより、接続モデル生成部８０４は、ステップＳ１２１１において「低周波」と「高周波」の各周波数について接続モデル１００２を出力することになる。 Then, the connection model generation unit 804 repeats the above steps S1201 to S1211 for each of the "low frequency" and "high frequency" frequencies. As a result, the connection model generation unit 804 outputs the connection model 1002 for each of the "low frequency" and "high frequency" frequencies in step S1211.
　図１４Ａは「低周波」の接続モデル１００２の一例を示す模式図であり、図１４Ｂは「高周波」の接続モデル１００２の一例を示す模式図である。「高周波」と「低周波」とでは、電磁的に接続されるコンポーネントが異なるため、接続モデル１００２におけるエッジの位置や本数も異なる。 FIG. 14A is a schematic diagram showing an example of a "low frequency" connection model 1002, and FIG. 14B is a schematic diagram showing an example of a "high frequency" connection model 1002. Since the components that are electromagnetically connected are different between "high frequency" and "low frequency", the positions and number of edges in the connection model 1002 are also different.
　次に、本実施形態に係る試験項目提示方法について説明する。 Next, we will explain the test item presentation method according to this embodiment.
　図１５は、本実施形態に係る試験項目提示方法のフローチャートの一例である。また、図１６Ａは、UIデバイス１０２に表示される開始画面の画面表示例の模式図であり、図１６Ｂは、UIデバイス１０２に表示される提示画面の画面表示例の模式図である。 FIG. 15 is an example of a flowchart of a test item presentation method according to this embodiment. Also, FIG. 16A is a schematic diagram of an example of a screen display of a start screen displayed on the UI device 102, and FIG. 16B is a schematic diagram of an example of a screen display of a presentation screen displayed on the UI device 102.
　この例では、図１６Ａに示すように、開始画面１６０１に確認項目判定ボタン１６０３とオブジェクト１６０４とが表示される。オブジェクト１６０４は、EMC試験の対象となる製品のシルエットを示しており、ここでは自動車のシルエットがオブジェクト１６０４として表示される。 In this example, as shown in FIG. 16A, a check item judgment button 1603 and an object 1604 are displayed on a start screen 1601. Object 1604 shows the silhouette of the product that is the subject of the EMC test, and in this case, the silhouette of a car is displayed as object 1604.
　そして、ユーザが確認項目判定ボタン１６０３を押下すると、以下のようにプロセッサ１０１が図１６のフローチャートを実行する。 When the user presses the confirmation item determination button 1603, the processor 101 executes the flowchart in FIG. 16 as follows.
　まず、連携部８０１が、設計情報１０６と要求情報１０７とを連携させることにより、図７に示した連携情報１１１を生成する（ステップＳ１５０１）。前述のように、ユーザが連携情報１１１を生成してもよい。 First, the linking unit 801 links the design information 106 and the request information 107 to generate the linking information 111 shown in FIG. 7 (step S1501). As described above, the user may also generate the linking information 111.
　次に、接続モデル生成部８０４が、周波数ごとに接続モデル１００２を生成する（ステップＳ１５０２）。例えば、接続モデル生成部８０４は、図１２のフローチャートを実行することにより、図１４Ａ及び図１４Ｂのように「低周波」と「高周波」のそれぞれの接続モデル１００２を生成する。 Next, the connection model generation unit 804 generates a connection model 1002 for each frequency (step S1502). For example, the connection model generation unit 804 executes the flowchart in FIG. 12 to generate the connection models 1002 for "low frequency" and "high frequency" as shown in FIG. 14A and FIG. 14B.
　次いで、検知部８０２が、設計情報１０６に基づいて、設計変更があったコンポーネントを検知する（ステップＳ１５０３）。 Then, the detection unit 802 detects components whose design has been changed based on the design information 106 (step S1503).
　次に、推定部８０５が、設計変更がされたコンポーネントの影響を受ける影響範囲Gを各周波数の接続モデル１００２の各々において推定する（ステップＳ１５０４）。例えば、推定部８０５は、図１１Ｂに示したように、エッジE又はエッジFを辿って設計変更されたノードNに到達可能な全てのノードNを含む範囲を影響範囲Gとして推定する。 Next, the estimation unit 805 estimates the range of influence G affected by the component whose design has been changed for each of the connection models 1002 for each frequency (step S1504). For example, as shown in FIG. 11B, the estimation unit 805 estimates the range of influence G to be a range including all nodes N that can be reached by tracing edge E or edge F to the node N whose design has been changed.
　続いて、提示部８０６が、実施することが推奨されるEMC試験項目をUIデバイス１０２に提示する（ステップＳ１５０５）。そのEMC試験項目は、製品を構成する全てのコンポーネントに対する試験ではなく、ステップＳ１５０３で検知された設計変更に伴って再実施が必要となった試験項目である。 Then, the presentation unit 806 presents the EMC test items that are recommended to be performed to the UI device 102 (step S1505). The EMC test items are not tests for all components that make up the product, but test items that need to be re-performed due to the design change detected in step S1503.
　例えば、提示部８０６は、「低周波」の接続モデル１００２の影響範囲Gに含まれる全てのノードNを特定する。そして、提示部８０６は、特定したノードNに対応するコンポーネントに関連付けられている「要求事項名」を連携情報１１１（図７参照）から特定する。そして、提示部８０６は、特定した「要求事項名」の要求事項を満たすかの試験項目をEMC試験項目として提示する。これと同じ処理を「高周波」の接続モデル１００２に対しても行うことで、提示部８０６は、「低周波」と「高周波」の全ての周波数で必要なEMC試験項目を提示する。 For example, the presentation unit 806 identifies all nodes N included in the range of influence G of the "low frequency" connection model 1002. The presentation unit 806 then identifies the "requirement name" associated with the component corresponding to the identified node N from the linkage information 111 (see FIG. 7). The presentation unit 806 then presents test items that satisfy the requirements of the identified "requirement name" as EMC test items. By performing the same process on the "high frequency" connection model 1002, the presentation unit 806 presents the EMC test items required for all frequencies, both "low frequency" and "high frequency".
　これに代えて、提示部８０６は、「低周波」や「高周波」などの周波数ごとにEMC試験項目を提示してもよい。 Instead, the presentation unit 806 may present EMC test items for each frequency, such as "low frequency" and "high frequency."
　このように予め連携情報１１１（図７参照）において「コンポーネント」と「要求事項」とを関連付けることで、提示部８０６が、影響範囲Gに含まれるノードNに関連付けられた「要求事項名」の要求事項を満たすかの試験項目をEMC試験項目として提示できる。 By associating "components" with "requirements" in advance in this way in the linkage information 111 (see FIG. 7), the presentation unit 806 can present, as EMC test items, test items that satisfy the requirements of the "requirement name" associated with node N included in the impact range G.
　図１６Ｂの提示画面１６０７においては、提示部８０６は、リスト１６０８にEMC試験項目を提示する。提示部８０６は、そのリスト１６０８にEMC試験項目を識別する「番号」、「優先度」、及び「経路情報」も提示する。この例では、提示部８０６は、「低周波」と「高周波」の全ての周波数で必要なEMC試験項目をリスト１６０８に提示する。これに代えて、提示部８０６は、周波数ごとにリスト１６０８を提示することにより、周波数ごとに必要なEMC試験項目を提示してもよい。 In presentation screen 1607 of FIG. 16B, presentation unit 806 presents EMC test items in list 1608. Presentation unit 806 also presents "number," "priority," and "route information" that identify the EMC test item in list 1608. In this example, presentation unit 806 presents EMC test items required for all frequencies, "low frequency" and "high frequency," in list 1608. Alternatively, presentation unit 806 may present EMC test items required for each frequency by presenting list 1608 for each frequency.
　「優先度」は、実施すべき必要性の高さであって、「A」が最も優先度が高く実施すべき必要性が高い。そして、「B」、「C」の順に優先度が低くなる。優先度は、接続モデル１００２のエッジに対応付けられた確度Pに応じて提示部８０６が設定する。一例として、提示部８０６は、図１２のステップＳ１２０９でメモリリソース１０４に格納された確度Pを接続モデル１００２のエッジごとに読み出す。この例では周波数ごとに接続モデル１００２を生成するため、提示部８０６は確度Pを周波数ごとに読み出す。 "Priority" refers to the degree of necessity for implementation, with "A" having the highest priority and the greatest necessity for implementation. "B" and "C" have decreasing priorities. The priority is set by the presentation unit 806 according to the probability P associated with the edge of the connection model 1002. As an example, the presentation unit 806 reads out the probability P stored in the memory resource 104 in step S1209 of FIG. 12 for each edge of the connection model 1002. In this example, the connection model 1002 is generated for each frequency, so the presentation unit 806 reads out the probability P for each frequency.
　そして、提示部８０６は、接続モデル１００２においてあるコンポーネントに対応するノードが確度Pのエッジに接続されており、そのコンポーネントが連携情報１１１（図７参照）においてある「要求事項名」に関連付けられているとき、その「要求事項名」に対応するEMC試験項目の優先度を確度Pに応じて定める。なお、あるコンポーネントに対応するノードが複数のエッジに接続されている場合、提示部８０６は、複数のエッジの確度Pのうちで最も大きな確度Pに応じてEMC試験項目の優先度を定める。 Then, when a node corresponding to a certain component in the connection model 1002 is connected to an edge with a certainty P, and the component is associated with a certain "requirement name" in the linkage information 111 (see FIG. 7), the presentation unit 806 determines the priority of the EMC test item corresponding to the "requirement name" according to the certainty P. Note that, when a node corresponding to a certain component is connected to multiple edges, the presentation unit 806 determines the priority of the EMC test item according to the highest certainty P among the certainty P of the multiple edges.
　確度Pと優先度との対応関係はユーザによって予め定められる。例えば、0.2≦P＜0.5のときは優先度「C」、0.5≦P＜0.8のときは優先度「B」、0.8≦Pのときは優先度「A」等と定める。確度Pが大きいほど優先度を高くしたのは、確度Pが大きいほどエッジの両端のノードに対応するコンポーネント同士が電磁的に接続されている可能性が高く、そのコンポーネントが設計変更の影響を大きく受けると考えられるためである。このような対応関係に従い、提示部８０６は、EMC試験項目の優先度を定める。 The correspondence between the accuracy P and the priority is determined in advance by the user. For example, when 0.2≦P<0.5, the priority is set to "C", when 0.5≦P<0.8, the priority is set to "B", and when 0.8≦P, the priority is set to "A". The reason why the priority is set higher as the accuracy P increases is that the greater the accuracy P, the more likely it is that the components corresponding to the nodes on both ends of the edge are electromagnetically connected, and it is believed that these components will be significantly affected by design changes. The presentation unit 806 determines the priority of the EMC test items according to such correspondence.
　これにより、ユーザは、複数のEMC試験項目のうちで実施すべき優先度が高いものを特定することができ、優先度が高いEMC試験項目に関する試験を他の試験よりも優先して行うことができる。 This allows the user to identify the EMC test items that should be performed with the highest priority among multiple EMC test items, and allows tests related to the high-priority EMC test items to be performed before other tests.
　また、本実施形態のように周波数ごとに接続モデル１００２を生成する場合、同一のEMC試験項目に対する優先度が接続モデル１００２によって異なる場合がある。その場合、提示部８０６は、最も高い優先度をEMC試験項目に対する優先度として採用する。 Furthermore, when a connection model 1002 is generated for each frequency as in this embodiment, the priority for the same EMC test item may differ depending on the connection model 1002. In that case, the presentation unit 806 adopts the highest priority as the priority for the EMC test item.
　「経路情報」は、EMC試験項目の対象となるコンポーネント間の経路を示す情報である。なお、本実施形態のように周波数ごとに接続モデル１００２を生成する場合、同一のEMC試験項目の「経路情報」が接続モデル１００２によって異なる場合がある。その場合、提示部８０６は、各接続モデル１００２の「経路情報」の和集合を提示する。 "Route information" is information that indicates the route between components that are the subject of an EMC test item. Note that when a connection model 1002 is generated for each frequency as in this embodiment, the "route information" for the same EMC test item may differ depending on the connection model 1002. In that case, the presentation unit 806 presents the union of the "route information" of each connection model 1002.
　以上により、本実施形態に係る試験項目提示方法の基本的な処理を終える。 This completes the basic processing of the test item presentation method according to this embodiment.
　上記した本実施形態によれば、推定部８０５が、製品を構成するコンポーネントに対する設計変更が及ぶ影響範囲Gを周波数ごとに推定する（ステップＳ１５０４）。そして、提示部８０６が、その影響範囲Gに含まれるコンポーネントに関連付けられたEMC試験項目を提示する（ステップＳ１５０５）。そのEMC試験項目は、製品を構成する全てのコンポーネントに対する試験項目ではなく、影響範囲Gに含まれるコンポーネントに対する試験項目である。よって、ユーザは、例えば旧製品のアップグレード品に対し、その全てのコンポーネントに対してEMC試験を行う必要がなく、提示されたEMC試験項目についてのEMC試験のみを行えばよく、EMC試験に要するコストと時間を削減することができる。 In this embodiment described above, the estimation unit 805 estimates the impact range G of the design change on the components that make up the product for each frequency (step S1504). Then, the presentation unit 806 presents EMC test items associated with the components included in the impact range G (step S1505). These EMC test items are not test items for all components that make up the product, but test items for the components included in the impact range G. Therefore, for example, for an upgrade of an old product, the user does not need to perform EMC testing on all of its components, and only needs to perform EMC testing on the presented EMC test items, which reduces the cost and time required for EMC testing.
　しかも、本実施形態では、図１４Ａ及び図１４Ｂに示したように、接続モデル生成部８０４が周波数ごとに接続モデル１００２を生成する。接続モデル１００２は、推定部８０５が影響範囲Gを推定するのに使用するモデルである。そのため、周波数ごとの影響範囲Gを加味したEMC試験項目を提示部８０６が提示することができる。 In addition, in this embodiment, as shown in Figs. 14A and 14B, the connection model generation unit 804 generates a connection model 1002 for each frequency. The connection model 1002 is a model that the estimation unit 805 uses to estimate the range of influence G. Therefore, the presentation unit 806 can present EMC test items that take into account the range of influence G for each frequency.
　＜第２実施形態＞
　本実施形態では、第１実施形態で説明した過去トラブル情報１０９を活用して、EMC試験項目をユーザに提示する。 Second Embodiment
In this embodiment, the past trouble information 109 described in the first embodiment is utilized to present EMC test items to the user.
　図１７は、本実施形態でコンピュータシステム１００が参照する伝搬経路情報のデータ構造の一例を示す模式図である。 FIG. 17 is a schematic diagram showing an example of the data structure of the propagation path information referenced by the computer system 100 in this embodiment.
　伝搬経路情報１７０１は、過去トラブル情報１０９に「トラブル発生回数」を追加することにより、「伝搬経路」と「トラブル発生回数」とを関連付けた情報である。「伝搬経路」は、前述のようにトラブル発生時に電磁的に接続されたコンポーネントを繋いだ経路であり、トラブル発生時にノイズが伝搬する経路である。「トラブル発生回数」は、これに関連付けられた「伝搬経路」で過去にトラブルが発生した回数である。一例として、伝搬経路情報１７０１は、ユーザが予め作成してメモリリソース１０４に格納する。この例では、「伝搬経路」の先頭のコンポーネントが「ノイズ源」を示し、「伝搬経路」の最後のコンポーネントが「被害コンポーネント」を表すものとする。 The propagation path information 1701 is information that associates a "propagation path" with a "number of times a problem has occurred" by adding the "number of times a problem has occurred" to the past problem information 109. As described above, a "propagation path" is a path that connects components that are electromagnetically connected when a problem occurs, and is a path along which noise propagates when a problem occurs. The "number of times a problem has occurred" is the number of times a problem has occurred in the past on the associated "propagation path". As an example, the propagation path information 1701 is created in advance by the user and stored in the memory resource 104. In this example, the first component of the "propagation path" indicates the "noise source", and the last component of the "propagation path" indicates the "damaged component".
　図１８は、伝搬経路情報１７０１の「伝搬経路」の一例を可視化した模式図である。図１８では、第１実施形態に従って生成した接続モデル１００２に「伝搬経路」を重ねることで可視化を行っている。図１８において実線で示すエッジが「伝搬経路」に相当する。破線で示すエッジは、接続モデル１００２のエッジであるものの、「伝搬経路」上には存在しないエッジを示す。 FIG. 18 is a schematic diagram that visualizes an example of the "propagation path" of the propagation path information 1701. In FIG. 18, the "propagation path" is visualized by overlaying it on the connection model 1002 generated according to the first embodiment. The edges shown by solid lines in FIG. 18 correspond to the "propagation path". The edges shown by dashed lines indicate edges that are edges of the connection model 1002 but do not exist on the "propagation path".
　図１９は、本実施形態に係るコンピュータシステムの機能ブロック図である。なお、図１９において、第１実施形態で説明した要素と同じ要素には同一の符号を付し、以下ではその説明を省略する。 FIG. 19 is a functional block diagram of a computer system according to this embodiment. Note that in FIG. 19, elements that are the same as those described in the first embodiment are given the same reference numerals, and their description will be omitted below.
　図１９に示すように、コンピュータシステム１００は、経路推定部８１１と優先度計算部８１２とを備える。 As shown in FIG. 19, the computer system 100 includes a route estimation unit 811 and a priority calculation unit 812.
　経路推定部８１１の機能について、図２０～図２２を参照して説明する。図２０～図２２は、経路推定部８１１の機能の一例を示す模式図である。 The function of the route estimation unit 811 will be described with reference to Figs. 20 to 22. Figs. 20 to 22 are schematic diagrams showing an example of the function of the route estimation unit 811.
　まず、図２０に示すように、経路推定部８１１は、設計情報１０６を参照して、アップグレード後の製品を構成する全てのコンポーネントを特定する。そして、経路推定部８１１は、各コンポーネントが自分以外の全てのコンポーネントと接続された全結合グラフ２００１を生成する。全結合グラフ２００１におけるノードNは、製品を構成する各々のコンポーネントに相当する。 First, as shown in FIG. 20, the path estimation unit 811 refers to the design information 106 to identify all components that make up the upgraded product. Then, the path estimation unit 811 generates a fully connected graph 2001 in which each component is connected to all other components. Node N in the fully connected graph 2001 corresponds to each component that makes up the product.
　次に、図２１に示すように、経路推定部８１１は、設計変更があったコンポーネントを検知部８０２が検知したときに、伝搬経路情報１７０１を参照することにより、全結合グラフ２００１における各経路のうちで、伝搬経路情報１７０１の「伝搬経路」に類似した類似経路２１０１を推定する。 Next, as shown in FIG. 21, when the detection unit 802 detects a component whose design has been changed, the path estimation unit 811 refers to the propagation path information 1701 to estimate a similar path 2101 that is similar to the "propagation path" in the propagation path information 1701 from among the paths in the full connection graph 2001.
　例えば、経路推定部８１１は、全結合グラフ２００１の部分グラフのうちで、伝搬経路情報１７０１のある「番号」に関連付けられた「伝搬経路」に一致するグラフを、その「伝搬経路」に類似した類似経路２１０１として推定する。経路推定部８１１は、伝搬経路情報１７０１の「番号」ごとに「伝搬経路」に一致する部分グラフを特定し、全ての部分グラフを合成した部分グラフを伝搬経路情報１７０１の全ての「伝搬経路」に類似する類似経路２１０１として推定してもよい。 For example, the path estimation unit 811 estimates a graph, among the subgraphs of the fully connected graph 2001, that matches a "propagation path" associated with a certain "number" in the propagation path information 1701 as a similar path 2101 that is similar to that "propagation path." The path estimation unit 811 may identify a subgraph that matches a "propagation path" for each "number" in the propagation path information 1701, and estimate a subgraph that is a combination of all the subgraphs as a similar path 2101 that is similar to all the "propagation paths" in the propagation path information 1701.
　また、経路推定部８１１は、このように全結合グラフ２００１に基づいて類似経路２１０１を推定するのではなく、接続モデル生成部８０４が生成した接続モデル１００２に基づいて類似経路２１０１を推定してもよい。例えば、経路推定部８１１は、「低周波」の接続モデル１００２（図１４Ａ）と「高周波」の接続モデル１００２（図１４Ｂ）のいずれか一方の部分グラフのうち、伝搬経路情報１７０１のある「番号」に関連付けられた「伝搬経路」に一致する部分グラフを、その「伝搬経路」に類似した類似経路２１０１として推定してもよい。更に、経路推定部８１１は、「低周波」と「高周波」の接続モデル１００２の各々の部分グラフから「伝搬経路」に一致する部分グラフを特定し、これらの部分グラフを合成したグラフを類似経路２１０１として推定してもよい。このように接続モデル１００２を用いる場合も、伝搬経路情報１７０１の「番号」ごとに「伝搬経路」に一致する部分グラフを特定し、全ての部分グラフを合成した部分グラフを伝搬経路情報１７０１の全ての「伝搬経路」に類似する類似経路２１０１として推定してもよい。 In addition, the path estimation unit 811 may estimate the similar path 2101 based on the connection model 1002 generated by the connection model generation unit 804, rather than estimating the similar path 2101 based on the all-connected graph 2001 in this manner. For example, the path estimation unit 811 may estimate a subgraph of either the "low frequency" connection model 1002 (FIG. 14A) or the "high frequency" connection model 1002 (FIG. 14B) that matches a "propagation path" associated with a certain "number" in the propagation path information 1701, as the similar path 2101 similar to that "propagation path". Furthermore, the path estimation unit 811 may identify a subgraph that matches the "propagation path" from each of the subgraphs of the "low frequency" and "high frequency" connection models 1002, and estimate a graph obtained by combining these subgraphs as the similar path 2101. Even when using the connection model 1002 in this manner, a subgraph that matches the "propagation route" for each "number" in the propagation route information 1701 may be identified, and a subgraph obtained by combining all the subgraphs may be estimated as a similar route 2101 that is similar to all the "propagation routes" in the propagation route information 1701.
　次いで、図２２に示すように、経路推定部８１１は、全結合グラフ２００１のノードNのうち、類似経路２１０１に含まれないノードNの集合２２０１を特定する。なお、上記のように接続モデル１００２に基づいて類似経路２１０１を推定した場合は、経路推定部８１１は、接続モデル１００２のノードNのうち、類似経路２１０１に含まれないノードNの集合を集合２２０１として特定する。 Next, as shown in FIG. 22, the path estimation unit 811 identifies a set 2201 of nodes N that are not included in the similar path 2101, among the nodes N in the fully connected graph 2001. Note that when the similar path 2101 is estimated based on the connection model 1002 as described above, the path estimation unit 811 identifies, as the set 2201, a set of nodes N that are not included in the similar path 2101, among the nodes N in the connection model 1002.
　再び図１９を参照する。優先度計算部８１２は、伝搬経路情報１７０１の「トラブル発生回数」に基づいて、EMC試験項目の優先度を計算する。例えば、優先度計算部８１２は、伝搬経路情報１７０１の「伝搬経路」に含まれるコンポーネントに関連付けられたEMC試験項目の優先度を、当該「伝搬経路」に関連付けられた「トラブル発生回数」が多いほど高くする。 Referring again to FIG. 19, the priority calculation unit 812 calculates the priority of an EMC test item based on the "number of times a problem occurred" in the propagation path information 1701. For example, the priority calculation unit 812 increases the priority of an EMC test item associated with a component included in a "propagation path" in the propagation path information 1701 the more the "number of times a problem occurred" associated with that "propagation path" is.
　次に、本実施形態に係る試験項目提示方法について説明する。 Next, we will explain the test item presentation method according to this embodiment.
　図２３は、本実施形態に係る試験項目提示方法のフローチャートの一例である。なお、図２３において、第１実施形態で説明したのと同じステップには同じ符号を付し、以下ではその説明を省略する。 FIG. 23 is an example of a flowchart of the test item presentation method according to this embodiment. Note that in FIG. 23, the same steps as those described in the first embodiment are given the same reference numerals, and their description will be omitted below.
　まず、第１実施形態に従ってステップＳ１５０１、Ｓ１５０２、Ｓ１５０３を実行した後、経路推定部８１１は、伝搬経路情報１７０１の「伝搬経路」に類似した類似経路２１０１を推定する（ステップＳ２１０１）。例えば、経路推定部８１１は、全結合グラフ２００１又は接続モデル１００２の部分グラフのうち、「伝搬経路」に一致する部分グラフを類似経路２１０１として推定する。また、経路推定部８１１は、全結合グラフ２００１や接続モデル１００２に含まれるコンポーネントのうちで、類似経路２１０１に含まれないコンポーネントの集合２２０１（図２２）も特定する。 First, after executing steps S1501, S1502, and S1503 according to the first embodiment, the path estimation unit 811 estimates a similar path 2101 that is similar to the "propagation path" in the propagation path information 1701 (step S2101). For example, the path estimation unit 811 estimates a subgraph that matches the "propagation path" among the subgraphs of the all-connected graph 2001 or the connection model 1002 as the similar path 2101. The path estimation unit 811 also identifies a set 2201 ( FIG. 22 ) of components that are not included in the similar path 2101 among the components included in the all-connected graph 2001 or the connection model 1002.
　次に、優先度計算部８１２は、伝搬経路情報１７０１の「伝搬経路」に含まれるコンポーネントに関連付けられたEMC試験項目の優先度を高くする（ステップＳ２１０２）。例えば、優先度計算部８１２は、「伝搬経路」に関連付けられた「トラブル発生回数」が多いほど優先度が高くなるように、EMC試験項目の優先度を設定する。 Next, the priority calculation unit 812 increases the priority of the EMC test item associated with the component included in the "propagation path" of the propagation path information 1701 (step S2102). For example, the priority calculation unit 812 sets the priority of the EMC test item so that the higher the "number of trouble occurrences" associated with the "propagation path," the higher the priority.
　続いて、提示部８０６は、類似経路２１０１に含まれるコンポーネントに関連付けられたEMC試験項目をUIデバイス１０２に提示する（ステップＳ１５０５）。例えば、提示部８０６は、類似経路２１０１に含まれるコンポーネントに関連付けられている「要求事項名」を連携情報１１１（図７参照）から特定する。そして、提示部８０６は、特定した「要求事項名」の要求事項を満たすかの試験項目をEMC試験項目として提示する。 Then, the presentation unit 806 presents to the UI device 102 EMC test items associated with the components included in the similar path 2101 (step S1505). For example, the presentation unit 806 identifies the "requirement name" associated with the components included in the similar path 2101 from the linkage information 111 (see FIG. 7). Then, the presentation unit 806 presents test items that satisfy the requirements of the identified "requirement name" as EMC test items.
　なお、経路推定部８１１が「低周波」と「高周波」のそれぞれの接続モデル１００２に基づいて類似経路２１０１を推定した場合、提示部８０６は、「低周波」や「高周波」などの周波数ごとにEMC試験項目を提示してもよい。 If the path estimation unit 811 estimates the similar path 2101 based on the connection models 1002 for "low frequency" and "high frequency," the presentation unit 806 may present EMC test items for each frequency, such as "low frequency" and "high frequency."
　更に、提示部８０６は、優先度計算部８１２が計算した優先度が高い順にEMC試験項目を提示する。これにより、ユーザは、複数のEMC試験項目のうちでどの項目が重要なのかを把握することができる。 Furthermore, the presentation unit 806 presents the EMC test items in descending order of priority calculated by the priority calculation unit 812. This allows the user to understand which of the multiple EMC test items is most important.
　また、提示部８０６は、集合２２０１（図２２）に属するコンポーネントに関連付けられたEMC試験項目を、試験が不要な試験項目として提示してもよいし、類似経路２１０１に含まれるコンポーネントに関連付けられたEMC試験項目と比較して優先度を低くして提示してもよい。 The presentation unit 806 may present EMC test items associated with components belonging to the set 2201 ( FIG. 22 ) as test items that do not require testing, or may present them with a lower priority compared to EMC test items associated with components included in the similar path 2101.
　以上により、本実施形態に係る試験項目提示方法の基本的な処理を終える。 This completes the basic processing of the test item presentation method according to this embodiment.
　上記した本実施形態によれば、伝搬経路情報１７０１の「伝搬経路」に類似した類似経路２１０１を推定し、その類似経路２１０１に含まれるコンポーネントに関連付けられたEMC試験項目を提示する。伝搬経路情報１７０１の「伝搬経路」は、過去の製品で実際にトラブルが発生したときにノイズが伝搬する経路であり、その経路に類似した類似経路２１０１でもノイズが伝搬する可能性が高い。そのため、類似経路２１０１に含まれるコンポーネントに関連付けられたEMC試験項目をユーザに提示することで、ノイズに起因してトラブルが生じやすいコンポーネントに対してユーザが重点的に試験をすることができる。 According to the present embodiment described above, a similar path 2101 similar to the "propagation path" in the propagation path information 1701 is estimated, and EMC test items associated with components included in the similar path 2101 are presented. The "propagation path" in the propagation path information 1701 is the path along which noise propagates when a problem actually occurs in a past product, and there is a high possibility that noise will also propagate through the similar path 2101 that is similar to that path. Therefore, by presenting the user with EMC test items associated with components included in the similar path 2101, the user can focus testing on components that are likely to cause problems due to noise.
　＜第３実施形態＞
　本実施形態では、コンポーネント同士の距離に基づき、接続モデル１００２に経路を追加する。 Third Embodiment
In this embodiment, paths are added to the connection model 1002 based on the distance between components.
　図２４は、本実施形態に係るコンピュータシステムの機能ブロック図である。なお、図２４において、第１実施形態又は第２実施形態で説明した要素と同じ要素には同一の符号を付し、以下ではその説明を省略する。 FIG. 24 is a functional block diagram of a computer system according to this embodiment. Note that in FIG. 24, elements that are the same as those described in the first or second embodiment are given the same reference numerals, and their description will be omitted below.
　図２４に示すように、コンピュータシステム１００は、第２実施形態で説明した経路推定部８１１と優先度計算部８１２に加えて構造抽出部８１３を備える。 As shown in FIG. 24, the computer system 100 includes a structure extraction unit 813 in addition to the route estimation unit 811 and priority calculation unit 812 described in the second embodiment.
　また、本実施形態では、設計情報１０６に艤装情報が含まれているものとする。艤装情報は、例えば3D-CAD(Computer Aided Design)情報であって、製品の内部における各々のコンポーネントの位置を示す情報である。 In addition, in this embodiment, it is assumed that the design information 106 includes outfitting information. The outfitting information is, for example, 3D-CAD (Computer Aided Design) information, and is information that indicates the position of each component inside the product.
　構造抽出部８１３は、その艤装情報における各コンポーネントの位置に基づいて、電磁的に接続される可能性のあるコンポーネントを特定する。例えば、構造抽出部８１３は、容量結合する可能性があるコンポーネントや、電磁誘導により結合する可能性のあるコンポーネントを特定する。一例として、構造抽出部８１３は、艤装情報が示す位置に基づいて各コンポーネント同士の間隔を算出し、その間隔が閾値以内となるコンポーネントを電磁的に接続される可能性のあるコンポーネントとして特定する。また、構造抽出部８１３は、各コンポーネント及びその位置を入力としたときに電磁的に接続される可能性のあるコンポーネントを出力する機械学習モデルを利用して、電磁的に接続される可能性があるコンポーネントを特定してもよい。 The structure extraction unit 813 identifies components that may be electromagnetically connected based on the position of each component in the equipment information. For example, the structure extraction unit 813 identifies components that may be capacitively coupled or that may be coupled by electromagnetic induction. As one example, the structure extraction unit 813 calculates the distance between each component based on the position indicated in the equipment information, and identifies components whose distance is within a threshold as components that may be electromagnetically connected. The structure extraction unit 813 may also identify components that may be electromagnetically connected using a machine learning model that outputs components that may be electromagnetically connected when each component and its position are input.
　そして、経路推定部８１１は、構造抽出部８１３が特定したコンポーネント同士を接続する経路を類似経路２１０１に追加する。 Then, the path estimation unit 811 adds the paths connecting the components identified by the structure extraction unit 813 to the similar paths 2101.
　また、優先度計算部８１２は、構造抽出部８１３が特定したコンポーネント同士が電磁的に接続される可能性が高いほど、これらのコンポーネントに関連付けられたEMC試験項目の優先度を高くする。一例として、構造抽出部８１３は、各コンポーネント同士の間隔が狭いほど、これらのコンポーネントに関連付けられたEMC試験項目の優先度を高くする。電磁的に接続される可能性が高いコンポーネントはノイズが伝搬し易く重点的に試験を行うのが好ましいため、このように優先度を高くすることで重点的に行うべきEMC試験項目をユーザが把握することができる。 Furthermore, the higher the likelihood that components identified by the structure extraction unit 813 will be electromagnetically connected, the higher the priority of the EMC test items associated with these components will be assigned by the priority calculation unit 812. As an example, the closer the spacing between components is, the higher the priority of the EMC test items associated with these components will be assigned by the structure extraction unit 813. Components that are likely to be electromagnetically connected are prone to noise propagation and should preferably be tested with priority, so by assigning higher priorities in this way, the user can determine which EMC test items should be tested with priority.
　以上説明した本実施形態によれば、艤装情報が示す位置に基づいて電磁的に接続される可能性のあるコンポーネントを特定し、これらのコンポーネント同士を接続する経路を類似経路２１０１に追加する。これにより、例えばケーブルや筐体等のコンポーネント同士が物理的に触れていなくても電磁的には接続される可能性がある場合に、これらのコンポーネントを接続する経路が類似経路２１０１に追加される。そのため、艤装情報を活かして類似経路２１０１を生成できると共に、電磁的に接続される可能性のあるコンポーネントに関連付けられたEMC試験項目をユーザに提示することができる。 According to the present embodiment described above, components that may be electromagnetically connected are identified based on the positions indicated by the equipment information, and paths connecting these components are added to the similar paths 2101. As a result, when components such as cables or housings are not physically touching each other but may be electromagnetically connected, paths connecting these components are added to the similar paths 2101. Therefore, the equipment information can be used to generate the similar paths 2101, and EMC test items associated with components that may be electromagnetically connected can be presented to the user.
　＜第４実施形態＞
　本実施形態では、機械学習等で生成した学習済モデルを使用して設計情報１０６を生成する。 Fourth Embodiment
In this embodiment, the design information 106 is generated using a trained model generated by machine learning or the like.
　図２５は、本実施形態に係るコンピュータシステムの機能ブロック図である。なお、図２５において、第１～第３実施形態で説明した要素と同じ要素には同一の符号を付し、以下ではその説明を省略する。 FIG. 25 is a functional block diagram of a computer system according to this embodiment. Note that in FIG. 25, elements that are the same as those described in the first to third embodiments are given the same reference numerals, and their description will be omitted below.
　図２５に示すように、コンピュータシステム１００は設計情報生成部８２２を備える。設計情報生成部８２２は、ユーザが予めメモリリソース１０４に格納した回路設計情報８２１と回路パターン学習済モデル８２３とに基づいて設計情報１０６を生成する。 As shown in FIG. 25, the computer system 100 includes a design information generation unit 822. The design information generation unit 822 generates design information 106 based on circuit design information 821 and a circuit pattern learned model 823 that the user has stored in advance in the memory resource 104.
　回路設計情報８２１は、製品の回路図に相当する情報であり、各コンポーネントとそれらを接続する配線の配置が含まれる。 Circuit design information 821 is information equivalent to a circuit diagram of the product, and includes the layout of each component and the wiring that connects them.
　回路パターン学習済モデル８２３は、回路設計情報８２１を入力したときに各コンポーネント同士の接続関係を示す設計情報１０６を出力するモデルである。例えば、複数の相異なる回路設計情報８２１を学習データとし、正解の設計情報１０６を教師データとするニューラルネットワーク等の機械学習により回路パターン学習済モデル８２３が生成される。 The circuit pattern learned model 823 is a model that outputs design information 106 that indicates the connection relationships between each component when circuit design information 821 is input. For example, the circuit pattern learned model 823 is generated by machine learning such as a neural network that uses multiple different circuit design information 821 as learning data and correct design information 106 as teacher data.
　そして、抽出部８０３は、設計情報生成部８２２が生成した設計情報１０６に基づいて、第１実施形態のように各コンポーネントの機械的な接続関係を抽出し、その接続関係を示す情報（例えばグラフ１００１）を生成する。そして、接続モデル生成部８０４は、そのグラフ１００１と判定情報１１０に基づき、第１実施形態のように接続モデル１００２を生成する。 Then, the extraction unit 803 extracts the mechanical connection relationships of each component based on the design information 106 generated by the design information generation unit 822, as in the first embodiment, and generates information indicating the connection relationships (e.g., graph 1001).Then, the connection model generation unit 804 generates a connection model 1002 based on the graph 1001 and the determination information 110, as in the first embodiment.
　以上説明した本実施形態によれば、ユーザが設計情報１０６を作成しなくても、設計情報生成部８２２が回路設計情報８２１から設計情報１０６を生成する。回路設計情報８２１は回路図に相当する情報であるため、製品を開発する際にはユーザの手元にあることが多い。そのため、ユーザの手元にある回路設計情報８２１を活用することができ、ユーザが設計情報１０６を生成する手間を省くことができる。 According to the present embodiment described above, the design information generating unit 822 generates the design information 106 from the circuit design information 821, even if the user does not create the design information 106. Since the circuit design information 821 is information equivalent to a circuit diagram, it is often available to the user when developing a product. Therefore, the circuit design information 821 available to the user can be utilized, and the user can be saved the trouble of generating the design information 106.
　本明細書に記載された効果はあくまで例示であって限定されるものではなく、他の効果があってもよい。 The effects described in this specification are merely examples and are not limiting, and other effects may also exist.
　本発明は、上記した実施形態に限定されるものではなく、様々な変形例が含まれる。例えば、上記した各実施形態は、本発明を分かりやすく説明するために詳細に説明したものであり、本発明が、必ずしも説明した全ての構成要素を備えるものに限定されるものではない。ある実施形態の構成の一部を、他の実施形態の構成に置き換えることが可能であり、ある実施形態の構成に、他の実施形態の構成を加えることも可能である。各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 The present invention is not limited to the above-described embodiments, and includes various modified examples. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to having all of the components described. It is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. It is possible to add, delete, or replace part of the configuration of each embodiment with other configurations.
　上記の各構成、機能、処理部、処理手段等は、それらの一部または全部を、例えばFPGA等の集積回路で設計する等によりハードウェアで実現してもよい。上記の各構成、機能等は、プロセッサがそれぞれの機能を実現するプログラムを解釈し、実行することによりソフトウェアで実現されてもよい。各機能を実現するプログラム、判定テーブル、ファイル等の情報は、メモリや、HDD、SSD等の記憶装置、または、IC(Integrated Circuit)カード、SD(Secure Digital)カード、DVD(Digital Versatile Disc)等の記録媒体に置くことができる。制御線や情報線は説明上必要と考えられるものを示しており、製品上必ずしも全ての制御線や情報線を示しているとは限らない。実際には殆ど全ての構成が相互に接続されていると考えてもよい。 The above configurations, functions, processing units, processing means, etc. may be realized in hardware, in part or in whole, by designing them in an integrated circuit such as an FPGA. The above configurations, functions, etc. may be realized in software by a processor interpreting and executing a program that realizes each function. Information such as the program that realizes each function, the decision table, and files can be placed in memory, a storage device such as an HDD or SSD, or a recording medium such as an IC (Integrated Circuit) card, an SD (Secure Digital) card, or a DVD (Digital Versatile Disc). The control lines and information lines shown are those considered necessary for explanation, and do not necessarily show all control lines and information lines in the product. In reality, it can be assumed that almost all configurations are interconnected.
　本コンピュータシステム１００は、試験項目提示プログラム１０５により実現される機能や処理の一部または全部をユーザ（オペレータ）が実施することで実現してもよい。 The computer system 100 may be realized by a user (operator) performing some or all of the functions and processing realized by the test item presentation program 105.
　なお、コンピュータシステム１００がUIデバイス１０２を持たず、代わりにシステム外部のスマートフォンやタブレット端末等のプロセッサシステム（外部プロセッサシステムと呼ぶ）に、ユーザへの出力処理や、ユーザからの入力処理の一部を任せる場合がある。このような場合、コンピュータシステム１００（又はプロセッサ１０１、試験項目提示プログラム１０５）は、以上に説明の通りの処理やプログラムの他の部分を実行するために、以下を行ってもよい。 In some cases, the computer system 100 does not have a UI device 102, and instead leaves the output processing to the user and some of the input processing from the user to a processor system (called an external processor system) such as a smartphone or tablet terminal outside the system. In such cases, the computer system 100 (or the processor 101, the test item presentation program 105) may do the following to execute the processing described above and other parts of the program.
　＊以上に説明のUIデバイス１０２を用いたユーザへの出力の代わりとして、NIデバイス１０３を介して外部プロセッサシステムに、ユーザへの出力に必要なデータの送信をする。当該データの例としては、出力するデータそのもの、出力データを別プロセッサシステムで生成するためのデータが考えられるが、外部プロセッサシステムでユーザ出力を行う処理が記述されたプログラムやWebデータであってもよい。 *As an alternative to outputting to the user using the UI device 102 described above, data required for outputting to the user is sent to the external processor system via the NI device 103. Examples of such data include the data to be output itself, data for generating output data in another processor system, but it may also be a program or web data describing the process of performing user output in the external processor system.
　＊以上に説明のUIデバイス１０２を用いたユーザからの入力又は操作受信の代わりとして、NIデバイス１０３を介して外部プロセッサシステムから、ユーザ入力又は操作を示すデータを受信する。別な視点では、ユーザへのデータ出力の意味は、コンピュータシステム１００自身が行うことも含む以外に、コンピュータシステム１００以外の別の存在に当該データ出力をさせる（使役）ことを含めてもよい。また、ユーザからの入力又は操作受信の意味は、コンピュータシステム１００のUIデバイス１０２でユーザへ直接出力や受信をする以外に、コンピュータシステム１００が間接的に当該受信をすることを含めてもよい。 *Instead of receiving input or operations from the user using the UI device 102 described above, data indicating user input or operations is received from an external processor system via the NI device 103. From another perspective, the meaning of outputting data to the user may include the computer system 100 itself outputting the data, as well as having another entity other than the computer system 100 output the data (using it). Furthermore, the meaning of receiving input or operations from the user may include the computer system 100 indirectly receiving the data, as well as directly outputting or receiving the data to the user using the UI device 102 of the computer system 100.
１００…コンピュータシステム、１０１…プロセッサ、１０２…UIデバイス、１０３…NIデバイス、１０４…メモリリソース、１０５…試験項目提示プログラム、１０６…設計情報、１０６ａ…コンポーネント、１０６ｂ…接続先情報、１０７…要求情報、１０８…解析情報、１０９…過去トラブル情報、１１０…判定情報、１１０ａ…対象コンポーネント、１１０ｂ～１１０ｄ…判定条件、１１１…連携情報、１１２…バス、８０１…連携部、８０２…検知部、８０３…抽出部、８０４…接続モデル生成部、８０５…推定部、８０６…提示部、８１１…経路推定部、８１２…優先度計算部、８１３…構造抽出部、８２１…回路設計情報、８２２…設計情報生成部、８２３…回路パターン学習済モデル、９０１…ブロック図、１００１、１３０１…グラフ、１００２…接続モデル、１６０１…開始画面、１６０３…確認項目判定ボタン、１６０４…オブジェクト、１６０７…提示画面、１６０８…リスト、１７０１…伝搬経路情報、２００１…全結合グラフ、２１０１…類似経路、２２０１…集合。 100...Computer system, 101...Processor, 102...UI device, 103...NI device, 104...Memory resource, 105...Test item presentation program, 106...Design information, 106a...Component, 106b...Connection information, 107...Requirement information, 108...Analysis information, 109...Past trouble information, 110...Judgment information, 110a...Target component, 110b to 110d...Judgment conditions, 111...Interaction information, 112...Bus, 801...Interaction unit, 802...Detection unit, 803...Extraction unit, 804...Connection model model generation unit, 805...estimation unit, 806...presentation unit, 811...path estimation unit, 812...priority calculation unit, 813...structure extraction unit, 821...circuit design information, 822...design information generation unit, 823...circuit pattern learned model, 901...block diagram, 1001, 1301...graph, 1002...connection model, 1601...start screen, 1603...check item judgment button, 1604...object, 1607...presentation screen, 1608...list, 1701...propagation path information, 2001...all connected graphs, 2101...similar paths, 2201...set.

Claims (15)

  1. 　１以上のプロセッサと、１以上のメモリリソースと、を有するコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　製品を構成する複数のコンポーネント同士が電磁的に接続されているかを判定する判定情報を参照して、複数の前記コンポーネント同士の電磁的な接続関係を示す接続モデルを複数の周波数について生成し、
    　前記接続モデルにおいて、設計変更がされた前記コンポーネントの影響を受ける影響範囲を前記周波数ごとに推定し、
    　前記影響範囲に含まれる前記コンポーネントに関連付けられたEMC試験項目を提示する、
    コンピュータシステム。     1. A computer system having one or more processors and one or more memory resources, comprising:
    The one or more processors:
    generating a connection model for a plurality of frequencies that indicates an electromagnetic connection relationship between the plurality of components constituting the product by referring to determination information that determines whether the plurality of components are electromagnetically connected to each other;
    Estimating an influence range of the connection model that is influenced by the component whose design has been changed for each frequency;
    presenting EMC test cases associated with said components within said scope of impact;
    Computer system.
  2. 　請求項１に記載のコンピュータシステムであって、
    　前記判定情報は、前記コンポーネント同士が電磁的に接続されている確度を前記コンポーネントの対ごとに関連付けた情報であり、
    　前記１以上のプロセッサは、
    　前記判定情報に基づいて、所定値以上の前記確度を有する前記コンポーネント同士を接続したモデルを前記接続モデルとして生成する、
    コンピュータシステム。     2. The computer system of claim 1,
    the determination information is information in which a degree of certainty that the components are electromagnetically connected to each other is associated with each pair of the components;
    The one or more processors:
    generating, as the connection model, a model in which the components having the accuracy equal to or greater than a predetermined value are connected to each other based on the determination information;
    Computer system.
  3. 　請求項２に記載のコンピュータシステムであって、
    　前記判定情報は、前記コンポーネントが満たす条件と前記確度とを関連付けた判定条件のうち、過去の製品を解析した解析情報に基づく判定条件、及び過去の製品のトラブル情報に基づく判定条件の少なくとも一方を含み、
    　前記１以上のプロセッサは、
    　前記コンポーネントが満たす判定条件に対応する確度を取得する、
    コンピュータシステム。     3. The computer system of claim 2,
    the determination information includes at least one of a determination condition based on analysis information obtained by analyzing a past product and a determination condition based on trouble information of a past product, among the determination conditions that associate a condition satisfied by the component with the certainty;
    The one or more processors:
    obtaining a probability corresponding to the determination condition satisfied by the component;
    Computer system.
  4. 　請求項２に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　前記確度が0よりも大きくかつ前記所定値未満の前記コンポーネント同士を繋ぐ経路を、電磁的に接続されているかが不明な経路として提示する、
    コンピュータシステム。     3. The computer system of claim 2,
    The one or more processors:
    presenting a path connecting the components, the path having a degree of certainty greater than 0 and less than the predetermined value, as a path whose electromagnetic connection is unclear;
    Computer system.
  5. 　請求項２に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　前記確度が大きいコンポーネントに関連した前記EMC試験項目ほど実施すべき優先度を高くして提示する、
    コンピュータシステム。     3. The computer system of claim 2,
    The one or more processors:
    The EMC test items related to the components having a higher accuracy are presented with a higher priority to be performed.
    Computer system.
  6. 　請求項１に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　前記製品に対する要求事項と前記コンポーネントとの関連付けを行い、
    　前記影響範囲に含まれる前記コンポーネントに関連付けられた前記要求事項を満たすかの試験項目を前記EMC試験項目として提示する、
    コンピュータシステム。     2. The computer system of claim 1,
    The one or more processors:
    Correlating requirements for said product with said components;
    Presenting test items for determining whether the requirements associated with the components included in the scope of influence are satisfied as the EMC test items;
    Computer system.
  7. 　請求項１に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　設計変更がされた前記コンポーネントと、当該コンポーネントと電磁的に接続されている前記コンポーネントとを前記影響範囲として推定する、
    コンピュータシステム。     2. The computer system of claim 1,
    The one or more processors:
    The component whose design has been changed and the components electromagnetically connected to the component whose design has been changed are estimated as the affected range.
    Computer system.
  8. 　請求項１に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　伝搬経路を示す伝搬経路情報を参照して、前記接続モデルにおいて前記伝搬経路に類似した類似経路を推定し、ここで、前記伝搬経路は、電磁的に接続される各々の前記コンポーネント間をノイズが伝搬する経路であり、
    　前記類似経路に含まれる前記コンポーネントに関連付けられたEMC試験項目を提示する、
    コンピュータシステム。     2. The computer system of claim 1,
    The one or more processors:
    by referring to propagation path information indicating a propagation path, estimating a similar path in the connection model that is similar to the propagation path, wherein the propagation path is a path along which noise propagates between each of the components that are electromagnetically connected;
    presenting EMC test items associated with the components included in the similar path;
    Computer system.
  9. 　請求項８に記載のコンピュータシステムであって、
    　前記伝搬経路情報は、前記伝搬経路と、前記伝搬経路においてトラブルが発生したトラブル発生回数とを関連付けた情報であり、
    　前記１以上のプロセッサは、
    　前記伝搬経路に含まれる前記コンポーネントに関連付けられた前記EMC試験項目の優先度を、当該伝搬経路に関連付けられた前記トラブル発生回数が多いほど高くし、
    　前記優先度が高い順に前記EMC試験項目を提示する、
    コンピュータシステム。     9. The computer system of claim 8,
    The propagation path information is information in which the propagation path is associated with a number of occurrences of a trouble occurring in the propagation path,
    The one or more processors:
    The priority of the EMC test item associated with the component included in the propagation path is set higher as the number of occurrences of the trouble associated with the propagation path increases;
    Present the EMC test items in order of priority;
    Computer system.
  10. 　請求項８に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　各々の前記コンポーネントの位置を示す設計情報を参照して電磁的に接続される可能性がある前記コンポーネントを特定し、特定された前記コンポーネント同士を接続する経路を前記類似経路に追加する、
    コンピュータシステム。     9. The computer system of claim 8,
    The one or more processors:
    Identifying the components that may be electromagnetically connected with each other by referring to design information indicating the position of each of the components, and adding paths connecting the identified components to the similar paths;
    Computer system.
  11. 　請求項１０に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、前記コンポーネント同士が電磁的に接続される可能性が高いほど、当該コンポーネントに関連付けられた前記EMC試験項目の優先度を高くする、
    コンピュータシステム。     11. The computer system of claim 10,
    the one or more processors assign a higher priority to the EMC test item associated with the components as the components are more likely to be electromagnetically connected to each other;
    Computer system.
  12. 　請求項１に記載のコンピュータシステムであって、
    　前記１以上のプロセッサは、
    　前記コンポーネントを含む回路設計情報に基づき、前記コンポーネント同士の接続関係を示す設計情報を推定し、
    　前記設計情報と前記判定情報とに基づいて前記接続モデルを生成する、
    コンピュータシステム。     2. The computer system of claim 1,
    The one or more processors:
    Inferring design information indicating a connection relationship between the components based on circuit design information including the components;
    generating the connection model based on the design information and the determination information;
    Computer system.
  13. 　１以上のプロセッサと、１以上のメモリリソースと、を有するコンピュータシステムが実行する試験項目提示方法であって、
    　製品を構成する複数のコンポーネント同士が電磁的に接続されているかを判定する判定情報を参照して、複数の前記コンポーネント同士の電磁的な接続関係を示す接続モデルを複数の周波数について生成するステップと、
    　前記接続モデルにおいて、設計変更がされた前記コンポーネントの影響を受ける影響範囲を前記周波数ごとに推定するステップと、
    　前記影響範囲に含まれる前記コンポーネントに関連付けられたEMC試験項目を提示するステップと、
    を含む試験項目提示方法。     1. A method for test item presentation executed by a computer system having one or more processors and one or more memory resources, comprising:
    generating a connection model for a plurality of frequencies that indicates an electromagnetic connection relationship between a plurality of components constituting a product by referring to determination information that determines whether the plurality of components are electromagnetically connected to each other;
    estimating an influence range of the connection model that is influenced by the component whose design has been changed for each frequency;
    presenting EMC test items associated with the components included in the scope of influence;
    A test item presentation method including:
  14. 　請求項１３に記載の試験項目提示方法であって、
    　前記判定情報は、前記コンポーネント同士が電磁的に接続されている確度を前記コンポーネントの対ごとに関連付けた情報であり、
    　前記接続モデルを生成するステップにおいて、前記判定情報に基づいて、所定値以上の前記確度を有する前記コンポーネント同士を接続したモデルを前記接続モデルとして生成する、
    試験項目提示方法。     The test item presentation method according to claim 13,
    the determination information is information in which a degree of certainty that the components are electromagnetically connected to each other is associated with each pair of the components;
    In the step of generating the connection model, a model in which the components having the accuracy equal to or greater than a predetermined value are connected to each other is generated as the connection model based on the determination information.
    How test items are presented.
  15. 　請求項１３又は請求項１４に記載の試験項目提示方法をコンピュータシステムに実行させる
    試験項目提示プログラム。     A test item presenting program for causing a computer system to execute the test item presenting method according to claim 13 or 14.
PCT/JP2023/033326 2022-12-06 2023-09-13 Computer system, test item presentation method, and test item presentation program WO2024122148A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005071230A (en) * 2003-08-27 2005-03-17 Ricoh Co Ltd Product design support server, method, and program
JP2005322211A (en) * 2004-04-08 2005-11-17 Hitachi Ltd Design support system
WO2020095362A1 (en) * 2018-11-06 2020-05-14 三菱電機株式会社 Design assistance device, design assistance method, and machine learning device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005071230A (en) * 2003-08-27 2005-03-17 Ricoh Co Ltd Product design support server, method, and program
JP2005322211A (en) * 2004-04-08 2005-11-17 Hitachi Ltd Design support system
WO2020095362A1 (en) * 2018-11-06 2020-05-14 三菱電機株式会社 Design assistance device, design assistance method, and machine learning device

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