WO2024116900A1 - Rendering device - Google Patents

Rendering device Download PDF

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Publication number
WO2024116900A1
WO2024116900A1 PCT/JP2023/041448 JP2023041448W WO2024116900A1 WO 2024116900 A1 WO2024116900 A1 WO 2024116900A1 JP 2023041448 W JP2023041448 W JP 2023041448W WO 2024116900 A1 WO2024116900 A1 WO 2024116900A1
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WO
WIPO (PCT)
Prior art keywords
substrate
air
exposure
support rollers
exposure heads
Prior art date
Application number
PCT/JP2023/041448
Other languages
French (fr)
Japanese (ja)
Inventor
雅史 菅原
Original Assignee
インスペック株式会社
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Filing date
Publication date
Application filed by インスペック株式会社 filed Critical インスペック株式会社
Publication of WO2024116900A1 publication Critical patent/WO2024116900A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00Advancing webs
    • B65H20/10Advancing webs by a feed band against which web is held by fluid pressure, e.g. suction or air blast
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to a drawing device that draws wiring patterns on a flexible substrate.
  • Non-Patent Document 1 discloses a technique that performs alignment measurement, overlay exposure, and workpiece replacement in parallel in order to process the film while it is being transported continuously using a roll-to-roll method without stopping the film transport.
  • Double-sided sequential exposure One method for forming wiring patterns on both sides of a substrate is to pass the exposure beam through the irradiation area of the substrate in sequence on the front and back sides (hereafter referred to as double-sided sequential exposure).
  • double-sided sequential exposure is inefficient, as it takes approximately twice as long to process as single-sided exposure.
  • the substrate cannot be supported by a stage as in the case of single-sided exposure or double-sided sequential exposure, and so the substrate may bend when passing through the beam irradiation area, which may reduce the accuracy of the drawn pattern.
  • the present invention has been made in consideration of the above, and aims to provide a drawing device that can efficiently and accurately form wiring patterns on both sides of a long sheet-like substrate.
  • a drawing device includes a plurality of first exposure heads arranged to irradiate an exposure beam onto a first main surface of a long sheet-like substrate within a predetermined range within a transport path of the substrate and positioned apart from one another in the longitudinal direction of the substrate, a plurality of second exposure heads arranged to irradiate an exposure beam onto a second main surface of the substrate, which is the surface opposite to the first main surface, within the predetermined range and positioned apart from one another in the longitudinal direction of the substrate, and a holding means configured to hold the substrate such that the substrate is curved in the thickness direction of the substrate within at least a portion of the predetermined range.
  • the plurality of first exposure heads and the plurality of second exposure heads are arranged at positions facing each other, and a set of exposure heads consisting of the first and second exposure heads arranged at positions facing each other is configured to irradiate the exposure beam from both sides toward the same area in the longitudinal direction of the substrate, and the holding means has two sets of air stages arranged upstream and downstream of the plurality of areas irradiated by the beams emitted from the plurality of sets of exposure heads, and each set of air stages includes a first air stage arranged on the first main surface side of the substrate and having a first air ejection surface curved in the longitudinal direction of the substrate, and a second air stage arranged on the second main surface side of the substrate, facing the first air ejection surface, and having a second air ejection surface spaced apart from the first air ejection surface at a uniform interval, and may be configured to hold the substrate in a non-contact manner by blowing air onto the first and second main surfaces of the substrate.
  • the holding means may further have a set of air stages arranged between two regions irradiated by beams emitted from adjacent sets of exposure heads, the set of air stages including a third air stage arranged on the first main surface side of the substrate and having a planar third air ejection surface, and a fourth air stage arranged on the second main surface side of the substrate and facing the third air ejection surface and having a fourth air ejection surface spaced at a uniform distance from the third air ejection surface, and may be configured to hold the substrate in a non-contact, planar state by blowing air onto the first and second main surfaces of the substrate.
  • the holding means further has a set of air stages arranged between two regions irradiated by beams emitted from adjacent sets of exposure heads, and the set of air stages includes a third air stage arranged on the first main surface side of the substrate and having a third air ejection surface that is curved in the opposite direction to the first air ejection surface in the longitudinal direction of the substrate, and a fourth air stage arranged on the second main surface side of the substrate, facing the third air ejection surface, and having a fourth air ejection surface spaced apart from the third air ejection surface by a uniform distance, and may be configured to hold the substrate in a curved state in the longitudinal direction of the substrate without contact by blowing air onto the first and second main surfaces of the substrate.
  • the substrate is transported horizontally as it passes through the area irradiated by the beam
  • the holding means may further include a third air stage that is disposed between the two areas irradiated by the beams emitted from adjacent sets of exposure heads and below the substrate, has a planar air ejection surface, and is configured to hold the substrate flat without contact by blowing air onto the substrate from below.
  • the plurality of first exposure heads and the plurality of second exposure heads are respectively arranged at positions facing each other, and a set of exposure heads consisting of the first and second exposure heads arranged at positions facing each other is configured to irradiate exposure beams from both sides toward the same area in the longitudinal direction of the substrate, and the holding means is provided on one main surface side at the upstream and downstream sides of the area irradiated by the beams emitted from each set of exposure heads, and is configured to support the substrate so as to be transportable, and a holding means is provided on the upstream side of the area irradiated by the beams emitted from the exposure head set located at the most upstream side among the plurality of sets of exposure heads,
  • the exposure head may further include a first auxiliary roller provided further upstream of the support roller and on the other main surface side of the substrate, and a second auxiliary roller provided further downstream of the support roller provided downstream of the area irradiated by the beam emitted from the exposure head located most
  • the holding means further has a third auxiliary roller provided between the two areas irradiated by the beams emitted from the adjacent sets of exposure heads and on the other main surface side of the substrate, and the third auxiliary roller may be arranged so that the area of the outer circumferential surface of the third auxiliary roller that contacts the substrate is flush with the plane, or so that the outer circumferential surface of the third auxiliary roller extends beyond the plane toward the rotation axis of the two support rollers.
  • the substrate is transported horizontally when passing through the area irradiated by the beam
  • the two support rollers are provided below the substrate
  • the holding means may further include a plurality of bearings that contact the outer peripheral surfaces of each of the two support rollers to rotatably support each support roller, and may further include a plurality of bearings that are distributed at a plurality of locations in the direction of the rotation axis of each support roller.
  • the holding means includes a plurality of first support rollers arranged on the second main surface side of the plurality of areas irradiated by the beams emitted from the plurality of first exposure heads, respectively, and configured to support the substrate in a transportable manner, and a plurality of second support rollers arranged on the first main surface side of the plurality of areas irradiated by the beams emitted from the plurality of second exposure heads, respectively, and configured to support the substrate in a transportable manner, and the plurality of first and second support rollers may be arranged such that the area of the outer circumferential surface of the plurality of first and second support rollers over which the substrate is spanned is zigzag.
  • the holding means includes a plurality of first support rollers arranged on the second main surface side of a plurality of areas irradiated by beams emitted from the plurality of first exposure heads, respectively, and configured to support the substrate in a transportable manner, a plurality of second support rollers arranged on the first main surface side of a plurality of areas irradiated by beams emitted from the plurality of second exposure heads, respectively, and configured to support the substrate in a transportable manner, and a plurality of second support rollers arranged further upstream of the most upstream support roller of the plurality of first and second support rollers, and further upstream of the upstream support roller with respect to the substrate.
  • the first and second support rollers are arranged so that the regions of the outer circumferential surfaces of the first and second support rollers that contact the substrate are flush with each other, and the first auxiliary roller is arranged so that the outer circumferential surface of the first auxiliary roller extends beyond the plane toward the rotation axis of the upstream support roller, and the second auxiliary roller is arranged so that the outer circumferential surface of the second auxiliary roller extends beyond the plane toward the rotation axis of the downstream support roller.
  • the substrate is transported horizontally when passing through the area irradiated by the beam
  • the plurality of first support rollers are provided below the substrate
  • the holding means may further include a plurality of bearings that contact the outer peripheral surface of each of the plurality of first support rollers to rotatably support each of the first support rollers, and are provided at multiple locations distributed in the direction of the rotation axis of each of the first support rollers.
  • a holding means is provided that is configured to hold a long sheet-shaped substrate so that the substrate is curved in the thickness direction of the substrate in at least a portion of a predetermined range within the transport path of the substrate, so that the substrate is prevented from bending during transport without being supported by a stage. Therefore, by simultaneously irradiating both sides of the substrate with an exposure beam, it is possible to form a wiring pattern efficiently and accurately.
  • FIG. 1 is a schematic diagram showing a schematic configuration of a drawing apparatus according to a first embodiment of the present invention.
  • FIG. 2 is an enlarged schematic view of an exposed portion shown in FIG. 1 .
  • 3 is a schematic diagram showing a schematic internal configuration of the exposure head shown in FIG. 2 .
  • 3 is a schematic diagram for explaining an irradiation area on a substrate by beams emitted from a plurality of exposure heads.
  • FIG. FIG. 11 is a schematic diagram showing an exposure unit of a drawing apparatus according to a second embodiment of the present invention.
  • 6 is a schematic diagram of a portion of the lower support roller shown in FIG. 5 as viewed from below.
  • FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a third embodiment of the present invention.
  • FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a third embodiment of the present invention.
  • FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a fourth embodiment of the present invention. 9 is an enlarged schematic view showing a substrate being transported on the air stage shown in FIG. 8 .
  • FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a fifth embodiment of the present invention.
  • FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a sixth embodiment of the present invention.
  • FIG. 1 is a schematic diagram showing a schematic configuration of a drawing apparatus according to a first embodiment of the present invention.
  • the drawing apparatus 1 includes a transport system 3 that transports a long sheet-like substrate 2, an exposure unit 4 that irradiates the substrate 2 with an exposure beam L, and a control device 5 that controls the operations of the transport system 3 and the exposure unit 4.
  • the drawing apparatus 1 is a so-called direct exposure type drawing apparatus that scans the substrate 2 with the beam L to directly draw a wiring pattern on the substrate 2.
  • the two main surfaces of the substrate 2 will be referred to as the front surface 2a and the back surface 2b for convenience, but there is no particular difference in the appearance or characteristics of the front surface 2a and the back surface 2b, or in the processing of the front surface 2a and the back surface 2b.
  • the substrate 2 to be processed is a flexible printed circuit (FPC).
  • the FPC is a flexible substrate in which a metal foil such as copper is bonded to a base film made of insulating resin such as polyimide.
  • the substrate 2 is an FPC formed in a strip shape, for example several meters to several tens of meters, and is unwound from a rolled state on the unwinding reel 31, transported by the transport system 3, a pattern is formed by the exposure unit 4, and then wound up on the take-up reel 32.
  • This transport method in which a strip-shaped workpiece is unwound from a roll, subjected to a specified process, and wound up on a roll is called the roll-to-roll method.
  • the transport system 3 is provided with a rotating shaft 31a that rotatably supports the unwinding reel 31, a rotating shaft 32a that rotatably supports the take-up reel 32, a number of guide rollers 33 that guide the substrate 2 between the unwinding reel 31 and the take-up reel 32, and two tension pulleys 34.
  • the unwinding reel 31 side is referred to as the upstream side
  • the take-up reel 32 side is referred to as the downstream side.
  • the tension pulleys 34 are installed on the upstream and downstream sides of the exposure section 4, below the exposure section 4, so as to be movable in the vertical direction.
  • each tension pulley 34 is rotatably supported on a rotating shaft 34a which is movable in the vertical direction.
  • Each rotating shaft 34a is connected to a tension adjustment mechanism which biases the rotating shaft 34a downward. By biasing the tension pulley 34 downward via the rotating shaft 34a by this tension adjustment mechanism, it is possible to pass the exposure section 4 while applying a predetermined tension to the substrate 2.
  • Each guide roller 33 is rotatably supported by a rotating shaft 33a.
  • the guide rollers 33 are arranged at various points along the transport path where the transport direction of the substrate 2 changes, as the substrate 2 is unwound from the unwinding reel 31, passes through the exposure section 4 via the upstream tension pulley 34, and is wound onto the take-up reel 32 via the downstream tension pulley 34, to guide the substrate 2.
  • the size of the guide rollers 33 provided along the transport path does not necessarily have to be the same, and can be determined appropriately depending on the angle of the transport path and the arrangement space at the point where the transport direction of the substrate 2 changes.
  • An alignment camera 37 may be installed near the roller 33 upstream of the exposure unit 4.
  • an alignment camera 38 may be installed near the roller 33(1).
  • a dust removal device 39 using an air blower or roller system may be installed on the transport path of the substrate 2 upstream of the exposure unit 4.
  • the transport means for transporting the substrate 2 is not limited to the configuration of the transport system 3 shown in FIG. 1, as long as a pattern can be drawn on the substrate 2 while transporting it by a roll-to-roll method.
  • the substrate 2 in the exposure section 4 shown in FIG. 1, the substrate 2 is transported from the top to the bottom of the figure, and multiple guide rollers 33 are arranged according to this mode.
  • the substrate 2 may be transported horizontally in the exposure section 4, in which case the guide rollers 33 may be arranged according to the mode in which the substrate 2 is transported.
  • the transport system 3 is usually provided with an edge position control (EPC) device that detects the end position of the substrate 2 and finely moves the unwinding device or the winding device to prevent the substrate from meandering during transport.
  • EPC edge position control
  • the control device 5 is a device that comprehensively controls the operation of each part of the drawing device 1, and can be configured with a computer equipped with an arithmetic processing device such as a CPU (Central Processing Unit) and storage devices such as semiconductor memory and disk drives.
  • the control device 5 is connected via an interface to devices such as the exposure heads 41-44, an encoder that detects the amount of rotation of the take-up reel 32, and a substrate transport drive device that drives the transport system 3, and transfers data and issues instructions to these devices, comprehensively controlling the operation of the drawing device 1, thereby causing the pattern to be drawn on the substrate 2.
  • FIG. 2 is an enlarged schematic diagram of the exposure unit 4 shown in FIG. 1.
  • the exposure unit 4 is provided in an exposure processing area R, which is a predetermined range within the transport path of the substrate 2.
  • the area between the two guide rollers 33(1) and 33(2) is the exposure processing area R.
  • the exposure unit 4 includes a plurality of exposure heads 41-44 (four in FIG. 2) arranged to irradiate the substrate 2 with an exposure beam L in the exposure processing area R, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R.
  • the holding means has a plurality of support rollers 45-48 (four in FIG. 2).
  • the holding means may further include an auxiliary roller 49.
  • FIG 3 is a schematic diagram showing the general internal configuration of each of the exposure heads 41 to 44.
  • each of the exposure heads 41 to 44 includes a laser light source 411 that outputs laser light, a beam shaping optical system 412, a reflecting mirror 413, a polygon mirror 414, and an imaging optical system 415.
  • the polygon mirror 414 is provided with a drive device that rotates the polygon mirror 414 around a rotation axis 414a.
  • the beam shaping optical system 412 includes optical elements such as a collimator lens, a cylindrical lens, a filter for adjusting the amount of light, and a polarizing filter, and shapes the laser light output from the laser light source 411 into a beam L having a spot-shaped beam shape.
  • the reflecting mirror 413 reflects the beam L shaped by the beam shaping optical system 412 toward the polygon mirror 414.
  • the polygon mirror 414 rotates around the rotation axis 414a, and reflects the beam L incident from the direction of the reflecting mirror 413 in multiple directions in a plane perpendicular to the rotation axis 414a.
  • the imaging optical system 415 includes optical elements such as an f ⁇ lens or a telecentric f ⁇ lens, and forms an image of the beam L reflected by the polygon mirror 414 on the substrate 2.
  • the rotation of the polygon mirror 414 can be controlled to one-dimensionally scan a predetermined scanning range SR on the substrate 2 with the beam L emitted from the exposure heads 41 to 44.
  • the configuration of the exposure heads 41 to 44 is not limited to the configuration exemplified in FIG. 3, as long as the beam L can be focused on the substrate 2 and the beam L can scan the substrate 2 one-dimensionally in the width direction (direction perpendicular to the transport direction).
  • the emission direction of the beam L may be changed by disposing a reflecting mirror between the polygon mirror 414 and the imaging optical system 415.
  • the size of the drawing device 1 can be made compact by arranging the housings of the exposure heads 41-44 horizontally and transporting the substrate 2 vertically in the exposure processing area R, as shown in FIG. 1.
  • two exposure heads 41, 43 are provided on the front surface 2a side of the substrate.
  • the exposure heads 41, 43 are arranged at positions spaced apart from each other in the longitudinal direction of the substrate 2, and irradiate the front surface 2a of the substrate 2 with an exposure beam L.
  • Two other exposure heads 42, 44 are provided on the back surface 2b side of the substrate 2.
  • the exposure heads 42, 44 are arranged at positions spaced apart from each other in the longitudinal direction of the substrate 2, and irradiate the back surface 2b of the substrate 2 with an exposure beam L.
  • the exposure heads 41, 43 on the front surface 2a side and the exposure heads 42, 44 on the back surface 2b side are arranged alternately.
  • FIG. 4 is a schematic diagram for explaining the areas on a substrate irradiated by beams emitted from multiple exposure heads 41-44.
  • FIG. 4(a) shows areas (irradiation areas) SA1-SA4 irradiated by beams L emitted from exposure heads 41-44
  • FIG. 4(b) shows areas (drawing areas) PA1-PA4 in which a wiring pattern is formed by being irradiated with beams L.
  • the width of the irradiation areas SA1-SA4 of the beam L emitted from the exposure heads 41-44 is set according to the number of exposure heads 41-44 arranged on one side of the substrate 2.
  • the width of the irradiation areas SA1-SA4 is approximately 1/2 the width W of the substrate 2.
  • the irradiation areas SA1, SA2 of the beam L emitted from the exposure heads 41, 43 on the front surface 2a side are set so as not to overlap in the width direction of the substrate 2. Therefore, by scanning the respective irradiation areas SA1, SA3 with the beam L emitted from the exposure heads 41, 43 while the substrate 2 is being transported, a wiring pattern is drawn in areas PA1, PA3 as shown in FIG. 4(b). The same is true on the back surface 2b side of the substrate 2.
  • two support rollers 45, 47 are arranged on the back surface 2b side of two irradiation areas irradiated with beams L emitted from two exposure heads 41, 43 on the front surface 2a side, respectively, and support the substrate 2 so that it can be transported.
  • support rollers 46, 48 are arranged on the front surface 2a side of two irradiation areas irradiated with beams L emitted from multiple exposure heads 42, 44 on the back surface 2b side, respectively, and support the substrate 2 so that it can be transported.
  • the exposure heads 41-44 are aligned so that the beams L are irradiated to the vertices of the curved substrate 2 that are spanned across the support rollers 45-48 in the normal direction of the tangent plane at the vertices.
  • the support rollers 45-48 are arranged so that their rotation axes 45a-48a are aligned in a straight line.
  • the substrate 2 is stretched across the support rollers 45-48 so that its back surface 2b and front surface 2a alternately come into contact with the support rollers 45-48. As a result, the substrate 2 is curved at four points along the support rollers 45-48 in the exposure processing area R.
  • the support rollers 45-48 do not necessarily need to be arranged so that the rotation axes 45a-48a are aligned in a straight line.
  • the support rollers 45-48 can be arranged so that the area of the outer periphery of the support rollers 45-48 over which the substrate 2 is stretched is zigzag.
  • an auxiliary roller 49 may be arranged to help prevent the substrate 2 from floating up from the support rollers 45, 48.
  • an auxiliary roller 49 is arranged between the support roller 48 and the guide roller 33(2) to ensure that the substrate 2 is securely hung on the support roller 48.
  • the support rollers 45-48 support the substrate 2 so that at least a portion of the substrate 2 is curved in the thickness direction, thereby suppressing bending of the substrate 2.
  • This allows the beams L emitted from the exposure heads 41-44 to be accurately irradiated onto target positions on both sides of the substrate 2. This makes it possible to form wiring patterns with high precision on both sides of the substrate 2.
  • the beam L is irradiated toward the area of the substrate 2 supported by the support rollers 45 to 48, fluctuations in the position of the substrate 2 caused by the energy of the beam L can be suppressed.
  • two exposure heads and two support rollers are provided on the front surface 2a and back surface 2b of the substrate 2, but the number of exposure heads and support rollers may be increased.
  • Second Embodiment Figure 5 is a schematic diagram showing an exposure section of a drawing apparatus according to a second embodiment of the present invention, and shows the configuration of a portion of the transport path of the substrate 2 in the drawing apparatus near an exposure processing area R where a pattern is drawn by irradiating a beam L onto the substrate 2.
  • the exposure section 4A shown in FIG. 5 comprises a plurality of (four in FIG. 5) exposure heads 41A-44A arranged to irradiate the substrate 2 with an exposure beam L, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R.
  • the holding means comprises a plurality of (four in FIG. 5) support rollers 51-54 that support the substrate 2 so that it is flat, and two auxiliary rollers 55, 56 installed upstream and downstream near the support rollers 51-54, respectively.
  • the general configuration of the exposure heads 41A to 44A is generally the same as the exposure heads 41 to 44 in the first embodiment (see Figures 2 and 3). However, in the exposure heads 41A to 44A, a reflecting mirror is placed between the polygon mirror 414 and the imaging optical system 415 shown in Figure 3, so that the emission direction of the beam L is bent perpendicular to the optical axis direction of the beam shaping optical system 412. In this way, when the emission direction of the beam L is bent, the beam L can be emitted in a direction perpendicular to the longitudinal direction of the housing of the exposure head. Therefore, as shown in Figure 5, the housings of the exposure heads 41A to 44A are arranged horizontally, and the substrate 2 is transported horizontally in the exposure processing area R, so that the size of the drawing device can be made compact.
  • the support rollers 51, 54 located most upstream and downstream are arranged on the back surface 2b side of two irradiation areas by the beam L emitted from the two exposure heads 41A, 43A on the front surface 2a side, respectively, and support the substrate 2 so that it can be transported.
  • the remaining two support rollers 52, 53 are arranged on the front surface 2a side of two irradiation areas by the beam L emitted from the multiple exposure heads 42A, 44A on the back surface 2b side, respectively, and support the substrate 2 so that it can be transported.
  • These support rollers 51-54 are arranged so that the areas of the outer periphery of the support rollers 51-54 that come into contact with the substrate 2 are flush with each other. As a result, the substrate 2 is transported between the support rollers 51-54 while remaining flat and perpendicular to the beam L.
  • the diameters of the support rollers 51 and 54 on the back surface 2b side and the support rollers 52 and 53 on the front surface 2a side are different, but the sizes of these support rollers 51 to 54 may be the same.
  • the support rollers 51, 54 located below the substrate 2 may be provided with a number of bearings 57 for rotatably supporting each of the support rollers 51, 54.
  • FIG. 6 is a schematic diagram of a portion of the lower support rollers 51, 54 shown in FIG. 5, viewed from below.
  • the bearings 57 are provided at multiple locations along a direction parallel to the rotation axis of each support roller 51, 54 (left-right direction in FIG. 6), and contact the outer circumferential surface of the support rollers 51, 54 to support the support rollers.
  • Auxiliary roller 55 is disposed upstream of support roller 51, which is the most upstream of support rollers 51-54, and on the opposite side of support roller 51 with respect to substrate 2.
  • Auxiliary roller 56 is disposed downstream of support roller 54, which is the most downstream of support rollers 51-54, and on the opposite side of support roller 54 with respect to substrate 2.
  • Auxiliary rollers 55, 56 are disposed so that the outer circumferential surfaces of auxiliary rollers 55, 56 extend beyond the surface (flat surface) of substrate 2 between support rollers 51-54 toward the rotation axis of support rollers 51, 54 (downward in FIG. 5). This allows substrate 2 to be curved in the thickness direction upstream and downstream of support rollers 51-54.
  • the substrate 2 can be kept flat in the irradiation area of the beam L, while the substrate 2 can be curved in the thickness direction outside the irradiation area.
  • the support rollers 51, 54 on the lower side of the substrate 2 are supported by multiple bearings, so that deflection of the support rollers 51, 54 can be suppressed even if the diameter of the support rollers 51, 54 is small.
  • the transport direction of the substrate 2 in the exposure processing area R in the first embodiment may be horizontal.
  • each of the support rollers below the substrate 2 may be provided with a plurality of bearings (see FIG. 6) for rotatably supporting the support roller.
  • FIG. 7 is a schematic diagram showing an exposure section of a drawing apparatus according to a third embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
  • the exposure section 4B shown in FIG. 7 includes a plurality of exposure heads 41A-44A arranged to irradiate the substrate 2 with an exposure beam L, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R.
  • the configuration of the exposure heads 41A-44A is the same as in the second embodiment, and the substrate 2 is transported horizontally as it passes through the irradiation area of the beam L.
  • the holding means includes support rollers 61-64 that support the substrate 2 from the back surface 2b side (below) and auxiliary rollers 66-68 arranged on the front surface 2a side (above) of the substrate 2.
  • the two exposure heads 41A, 43A on the front surface 2a and the two exposure heads 42A, 44A on the back surface 2b are positioned opposite each other. This allows the pair of opposing exposure heads 41A and 42A to irradiate the beam L from both sides toward the same area in the longitudinal direction of the substrate 2. The same applies to the pair of exposure heads 43A, 44A.
  • the pair of two upstream support rollers 61, 62 are arranged on the back surface 2b side at a slight distance from each other, upstream and downstream of the irradiation area by the beam L emitted from the pair of two upstream exposure heads 41A, 42A, and support the substrate 2 so that it can be transported.
  • the distance between the two support rollers 61, 62 may be such that the beam L emitted from the exposure head 42A on the back surface 2b side can reach the substrate 2.
  • the same is true for the pair of two downstream support rollers 63, 64.
  • These support rollers 61-64 are arranged so that the upper end areas of the outer circumferential surfaces that come into contact with the substrate 2 are flush with each other, and at least in the areas between the support rollers 61 and 62, and between the support rollers 63 and 64, the substrate 2 is transported in a plane perpendicular to the beam L.
  • a plurality of bearings 65 may be provided that contact the outer circumferential surface of each of the support rollers 61 to 64 and rotatably support each of the support rollers 61 to 64.
  • the plurality of bearings 65 are disposed at a plurality of locations along a direction parallel to the rotation axis of each of the support rollers 61 to 64 (see bearing 57 in FIG. 6).
  • the auxiliary roller 66 is disposed on the surface 2a further upstream of the support roller 61 (on the opposite side of the substrate 2 to the support rollers 61 and 62) which is disposed upstream of the irradiation area by the beam L emitted from the exposure heads 41A and 42A which are located most upstream among the exposure heads 41A to 44A.
  • the auxiliary roller 68 is disposed on the surface 2a further downstream of the support roller 64 (on the opposite side of the substrate 2 to the support rollers 63 and 64) which is disposed downstream of the irradiation area by the beam L emitted from the exposure heads 43A and 44A which are located most downstream among the exposure heads 41A to 44A.
  • the auxiliary rollers 66, 68 are arranged so that the outer circumferential surfaces of the auxiliary rollers 66, 68 extend beyond the surface (flat surface) of the substrate 2 between the support rollers 61, 62 and between the support rollers 63, 64 toward the rotation axis of the support rollers 61 to 64. This allows the substrate 2 to be curved in the thickness direction on the upstream and downstream sides of the support rollers 61 to 64.
  • an auxiliary roller 67 may be arranged on the surface 2a side between two irradiation areas by the beams L emitted from the exposure heads 41A, 42A and the exposure heads 43A, 44A.
  • the auxiliary roller 67 may be arranged so that the area of the outer circumferential surface of the auxiliary roller 67 that contacts the substrate 2 is flush with the surface (plane) of the substrate 2 between the support rollers 61, 62 and between the support rollers 63, 64. In this case, the substrate 2 can be transported in a flat state even between two adjacent irradiation areas.
  • the auxiliary roller 67 may also be arranged so that the outer circumferential surface of the auxiliary roller 67 protrudes from the plane toward the rotation axis of the support rollers 61 to 64.
  • the substrate 2 can be curved in the thickness direction between the adjacent irradiation areas.
  • the auxiliary roller 67 can be arranged to improve the effect of suppressing the bending of the substrate 2.
  • the substrate 2 is kept flat in the irradiation area of the beam L, while the substrate 2 is curved in the thickness direction in the area outside the irradiation area, thereby suppressing bending of the substrate 2.
  • FIG. 8 is a schematic diagram showing an exposure section of a drawing apparatus according to a fourth embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
  • the exposure section 4C shown in FIG. 8 includes a plurality of exposure heads 41A-44A arranged to irradiate the substrate 2 with an exposure beam L, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R.
  • the configuration of the exposure heads 41A-44A is the same as in the second embodiment, and the substrate 2 is transported horizontally as it passes through the irradiation area of the beam L.
  • the holding means has a plurality of air stages 71-78 configured to hold the substrate 2 in a non-contact manner by blowing air onto the substrate 2.
  • a transport roller 81 is provided upstream of the air stages 71-77, and a suction roller 82 is provided downstream of the air stages 71-77.
  • the two exposure heads 41A, 43A on the front surface 2a and the two exposure heads 42A, 44A on the back surface 2b are positioned opposite each other. This allows the pair of opposing exposure heads 41A and 42A to irradiate the beam L from both sides toward the same area in the longitudinal direction of the substrate 2. The same applies to the pair of exposure heads 43A, 44A.
  • the suction roller 82 is a device in which a vacuum mechanism is attached to a roller with many holes or slits formed on its surface.
  • a mechanism that can control the rotation with high precision such as a combination of a servo motor and a reducer, or a direct drive motor.
  • the suction roller 82 transports the substrate 2 while vacuum adsorbing it. This prevents the substrate 2 from slipping, and allows the substrate 2 to pass through the area where the air stages 71 to 78 are provided accurately at a predetermined speed.
  • a position sensor 83 is provided near the transport roller 81, and the operation of the drive mechanism 82a, i.e., the timing at which the substrate 2 begins to be transported and the transport speed, can be controlled based on the detection signal of the position sensor 83.
  • Each air stage 71-78 has a flow path 79 that allows the air supplied from the air supply pipe 70 to flow and be sprayed from the surface of the stage.
  • the air supply pipe 70 is provided with a precision regulator 70a.
  • the precision regulator 70a adjusts the pressure of the air supplied from the air supply pipe 70 to each air stage 71-78 based on the pressure values input from the pressure sensors P1-P5 provided on the air stages 71-78, respectively. This allows feedback control so that air is sprayed from each air stage 71-78 at a predetermined pressure.
  • the air supply pipe 70 and precision regulator 70a are shown in only one location, but it is also possible to provide an air supply pipe and precision regulator 70a on each air stage 71-78 and adjust the air pressure for each air stage.
  • FIG. 9 is an enlarged schematic diagram of a substrate being transported on the air stage shown in FIG. 8. Note that in FIG. 9, the air stages 73, 75, and 77 provided on the surface 2a side of the substrate 2 are shown removed to make it easier to understand the structure of the air stages.
  • a number of air outlets 80 that eject air introduced through a flow path 79 are arranged on the air ejection surfaces 71a to 78a, which are the surfaces of the air stages 71 to 78. By ejecting air at a predetermined pressure from these air outlets 80, the substrate 2 can be held and transported in a non-contact state.
  • a pair of air stages 72, 73 are arranged upstream of the irradiation area by the beam L emitted from the pair of exposure heads 41A, 42A.
  • air stage 72 is arranged on the back surface 2b side of substrate 2, and has an air ejection surface 72a that curves in the longitudinal direction of substrate 2.
  • Air stage 73 is arranged on the front surface 2a side of substrate 2, and has an air ejection surface 73b that faces air ejection surface 72a and is spaced apart from air ejection surface 72a at a uniform interval.
  • a pair of air stages 76, 77 are arranged downstream of the irradiation area by the beam L emitted from the pair of exposure heads 43A, 44A.
  • air stage 76 is arranged on the back surface 2b side of substrate 2, and has an air ejection surface 76a that curves in the longitudinal direction of substrate 2.
  • air stage 77 is arranged on the front surface 2a side of substrate 2, and has an air ejection surface 77a that faces air ejection surface 76a and is spaced apart from air ejection surface 76a at a uniform interval.
  • the substrate 2 By blowing air onto both sides of the substrate 2 using these air stages 72, 73, 76, and 77, the substrate 2 can be curved in the thickness direction on the upstream and downstream sides of the irradiation area of the beam L while being held in a non-contact manner.
  • an air stage 71 Upstream of the air stages 72 and 73, an air stage 71 is arranged, which has an air ejection surface 71a that curves in the longitudinal direction of the substrate 2. Further, downstream of the air stages 76 and 77, an air stage 78 is arranged, which has an air ejection surface 78a that curves in the longitudinal direction of the substrate 2.
  • the substrate 2 can be sent out in a gently curved state from the transport rollers 81 towards the air stages 72 and 73, and from the air stages 76 and 77 towards the suction rollers 82.
  • a pair of air stages 74, 75 are disposed between two irradiation areas by the beam L emitted from the pair of exposure heads 41A, 42A and the pair of exposure heads 43A, 44A.
  • the distance between the air stages 72, 73 and the air stages 74, 75, and the distance between the air stages 74, 75 and the air stages 76, 77 need only be sufficient to allow the beam L emitted from the exposure heads 41A to 44A to reach the substrate 2.
  • Air stage 74 is disposed on the rear surface 2b side of substrate 2, and has a planar air ejection surface 74a.
  • Air stage 75 is disposed on the front surface 2a side of substrate 2, and faces air ejection surface 74a, and has air ejection surface 75a spaced at a uniform distance from air ejection surface 74a.
  • the substrate 2 is held in a non-contact manner by air stages 72, 73, 76, and 66 having curved air ejection surfaces on the upstream and downstream sides of the irradiation area of the beam L, so that deflection of the substrate 2 in the thickness direction can be suppressed.
  • air stages 72, 73, 76, and 66 having curved air ejection surfaces on the upstream and downstream sides of the irradiation area of the beam L, so that deflection of the substrate 2 in the thickness direction can be suppressed.
  • deflection of the substrate 2 in the width direction in the irradiation area of the beam L can be suppressed.
  • suction rollers 82 are provided downstream of the air stages 71 to 78, so the substrate 2, which is held in a non-contact manner between the transport rollers 81 and suction rollers 82, can be transported with appropriate tension.
  • two sets of exposure heads are provided to irradiate the beam L onto both sides of the substrate 2, but more sets of exposure heads may be provided. In this case, it is sufficient to provide more air stages 74, 75 arranged between adjacent irradiation areas of the beam L according to the number of sets of exposure heads.
  • FIG. 10 is a schematic diagram showing an exposure section of a drawing apparatus according to a fifth embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
  • Exposure section 4D shown in Fig. 10 has air stages 85 and 86 instead of air stages 74 and 75 of exposure section 4C shown in Fig. 8.
  • the configuration of each part of exposure section 4D other than air stages 85 and 86 is similar to the configuration of each part of exposure section 4C.
  • the air ejection surfaces 72a, 73a of the air stages 72, 73 arranged upstream of the irradiation area by the beam L emitted from the exposure heads 41A to 44A, and the air ejection surfaces 76a, 77a of the air stages 76, 77 arranged downstream of the same irradiation area, are curved in the same direction (upward convex in FIG. 10).
  • the air ejection surface 85a of the air stage 85 arranged on the back surface 2b side of the substrate 2 is curved in the opposite direction to the air ejection surfaces 72a, 73a, 76a, and 77a in the longitudinal direction of the substrate 2 (convex downward in FIG. 10).
  • the air ejection surface 86a of the air stage 86 arranged on the front surface 2a side of the substrate 2 faces the air ejection surface 85a and has an air ejection surface 86a spaced apart from the air ejection surface 85a at a uniform interval.
  • the air stages 85 and 86 are configured to hold the substrate 2 in a non-contact manner while bending it in the opposite direction to the substrate 2 on the air stages 72, 73, 76, and 77.
  • the exposure heads 41A to 44A are positioned so that the beam L is irradiated to an area that is a maximum or minimum point when the curved substrate 2 is viewed from the side.
  • two sets of exposure heads are provided to irradiate the beam L onto both sides of the substrate 2, but more sets of exposure heads may be provided. In this case, it is sufficient to provide more air stages 85, 86 that are positioned between the irradiation areas of adjacent beams L according to the number of sets of exposure heads.
  • FIG. 11 is a schematic diagram showing an exposure section of a drawing apparatus according to a sixth embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
  • Exposure section 4E shown in FIG. 11 is different from exposure section 4C shown in FIG. 8 in that air stage 75 arranged on the front surface 2a side of substrate 2 between adjacent irradiation areas of beam L is omitted.
  • the exposure heads 41A, 43A on the front surface 2a side of the substrate 2 can irradiate the beam L onto the substrate area above the air stage 74, allowing greater freedom in the arrangement of the exposure heads 41A, 43A and in the data design of the drawing pattern.
  • the present invention described above is not limited to the above first to sixth embodiments and modifications, and various inventions can be formed by appropriately combining multiple components disclosed in the above first to sixth embodiments and modifications. For example, some components may be removed from all the components shown in the first to sixth embodiments and modifications, or the components shown in the first to sixth embodiments and modifications may be appropriately combined to form various inventions.

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Abstract

Provided is a rendering device capable of efficiently and accurately forming a wiring pattern on both surfaces of a long sheet-shaped substrate. This rendering device comprises: a plurality of first exposure heads (41, 43) provided so as to each irradiate a first principal surface of a long sheet-shaped substrate (2) with an exposure beam (L) and disposed at positions apart from each other in the longitudinal direction of the substrate in a predetermined range within a conveyance path of the substrate; a plurality of second exposure heads (42, 44) provided so as to each irradiate a second principal surface that is a surface on the reverse side from the first principal surface of the substrate with an exposure beam (L) and disposed at positions apart from each other in the longitudinal direction of the substrate in the predetermined range; and a holding means configured so as to hold the substrate in at least part of the predetermined range such that the substrate is curved in the thickness direction of the substrate.

Description

描画装置Drawing device
 本発明は、可撓性を有する基板に配線パターンを描画する描画装置に関する。 The present invention relates to a drawing device that draws wiring patterns on a flexible substrate.
 近年、自動車や航空機等の輸送機において使用される電子機器の数は増加の一途を辿っている。これに伴い、電子機器への電源供給や信号の送受信に用いられるワイヤーハーネスの数も増加している。その一方で、輸送機においては軽量化や内部の省スペース化が要請されており、ワイヤーハーネスの増加に伴う重量増やスペース増が問題になっている。 In recent years, the number of electronic devices used in transport vehicles such as automobiles and airplanes has been steadily increasing. Accordingly, the number of wire harnesses used to supply power to the electronic devices and send and receive signals has also increased. At the same time, there is a demand for lighter weight and less space inside transport vehicles, and the increased weight and space required by an increased number of wire harnesses has become an issue.
 このような問題から、運送機で用いられるワイヤーハーネスを、可撓性を有し、長尺のシート状をなすフレキシブルプリント回路基板(Flexible Printed Circuit:FPC)により代替することも検討されている。 Due to these issues, there is also discussion about replacing the wire harnesses used in transport aircraft with flexible printed circuits (FPCs), which are long, flexible sheets.
 長尺のシート状の基板に対するパターン形成技術として、例えば、非特許文献1には、ロールトゥロール(Roll To Roll)方式でフィルム搬送を停止することなく連続的に搬送しながら処理を行うために、アライメント計測、重ね合わせ露光、ワーク交換を並列に行う技術が開示されている。 As a pattern formation technique for long sheet-like substrates, for example, Non-Patent Document 1 discloses a technique that performs alignment measurement, overlay exposure, and workpiece replacement in parallel in order to process the film while it is being transported continuously using a roll-to-roll method without stopping the film transport.
 また、シート状の基板の両側にレーザ光を照射することにより両面にパターンを描画する技術も知られている(例えば特許文献1~4参照)。 There is also a known technique for drawing patterns on both sides of a sheet-like substrate by irradiating both sides with laser light (see, for example, Patent Documents 1 to 4).
特開昭61-72216号公報Japanese Patent Application Laid-Open No. 61-72216 特開2001-272791号公報JP 2001-272791 A 特開2006-98488号公報JP 2006-98488 A 特開2006-98718号公報JP 2006-98718 A
 基板の両面に配線パターンを形成する方法として、露光用ビームの照射領域に基板の表面と裏面を順次通過させること(以下、両面順次露光とも記す)が考えられる。しかしながら、両面順次露光は、片面露光に対して約2倍の処理時間がかかってしまうため、効率が良くない。また、基板の表面のパターンと裏面のパターンとの位置合わせ精度が十分に得られないおそれもある。 One method for forming wiring patterns on both sides of a substrate is to pass the exposure beam through the irradiation area of the substrate in sequence on the front and back sides (hereafter referred to as double-sided sequential exposure). However, double-sided sequential exposure is inefficient, as it takes approximately twice as long to process as single-sided exposure. There is also a risk that sufficient alignment precision between the patterns on the front and back sides of the substrate cannot be obtained.
 また、基板の両面に露光用ビームを同時に照射することも考えられる。しかしながら、この場合、片面露光や両面順次露光の場合のように、基板をステージで支持することができないため、ビームの照射領域に基板を通過させる際に基板が撓み、描画されたパターンの精度が低下するおそれがある。 It is also possible to irradiate both sides of the substrate with the exposure beam simultaneously. However, in this case, the substrate cannot be supported by a stage as in the case of single-sided exposure or double-sided sequential exposure, and so the substrate may bend when passing through the beam irradiation area, which may reduce the accuracy of the drawn pattern.
 本発明は上記に鑑みてなされたものであって、長尺のシート状の基板の両面に、効率よく、且つ、精度良く配線パターンを形成することができる描画装置を提供することを目的とする。 The present invention has been made in consideration of the above, and aims to provide a drawing device that can efficiently and accurately form wiring patterns on both sides of a long sheet-like substrate.
 上記課題を解決するために、本発明の一態様である描画装置は、長尺のシート状をなす基板の搬送経路内の所定範囲において、前記基板の第1の主面に露光用のビームを照射するように設けられ、且つ、前記基板の長手方向において互いに離れた位置に配置された複数の第1の露光ヘッドと、前記所定範囲において、前記基板の前記第1の主面の反対側の面である第2の主面に露光用のビームを照射するように設けられ、且つ、前記基板の長手方向において互いに離れた位置に配置された複数の第2の露光ヘッドと、前記所定範囲の少なくとも一部において、前記基板が該基板の厚さ方向において湾曲するように前記基板を保持するように構成された保持手段と、を備える。 In order to solve the above problem, a drawing device according to one aspect of the present invention includes a plurality of first exposure heads arranged to irradiate an exposure beam onto a first main surface of a long sheet-like substrate within a predetermined range within a transport path of the substrate and positioned apart from one another in the longitudinal direction of the substrate, a plurality of second exposure heads arranged to irradiate an exposure beam onto a second main surface of the substrate, which is the surface opposite to the first main surface, within the predetermined range and positioned apart from one another in the longitudinal direction of the substrate, and a holding means configured to hold the substrate such that the substrate is curved in the thickness direction of the substrate within at least a portion of the predetermined range.
 上記描画装置において、前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、それぞれ、互いに対向する位置に配置され、互いに対向する位置に配置された第1及び第2の露光ヘッドからなる1組の露光ヘッドは、前記基板の長手方向における同一の領域に向けて露光用のビームを両面から照射するように構成され、前記保持手段は、複数組の露光ヘッドから出射するビームにより照射される複数の領域の上流側及び下流側に配置された2組のエアステージを有し、各組のエアステージは、前記基板の第1の主面側に配置され、前記基板の長手方向に湾曲する第1のエア噴出面を有する第1のエアステージと、前記基板の第2の主面側に配置され、前記第1のエア噴出面と対向し、前記第1のエア噴出面と均一の間隔で離れた第2のエア噴出面を有する第2のエアステージと、を含み、前記基板の第1及び第2の主面にエアを吹き付けることにより、前記基板を非接触で保持するように構成されても良い。 In the above-mentioned drawing device, the plurality of first exposure heads and the plurality of second exposure heads are arranged at positions facing each other, and a set of exposure heads consisting of the first and second exposure heads arranged at positions facing each other is configured to irradiate the exposure beam from both sides toward the same area in the longitudinal direction of the substrate, and the holding means has two sets of air stages arranged upstream and downstream of the plurality of areas irradiated by the beams emitted from the plurality of sets of exposure heads, and each set of air stages includes a first air stage arranged on the first main surface side of the substrate and having a first air ejection surface curved in the longitudinal direction of the substrate, and a second air stage arranged on the second main surface side of the substrate, facing the first air ejection surface, and having a second air ejection surface spaced apart from the first air ejection surface at a uniform interval, and may be configured to hold the substrate in a non-contact manner by blowing air onto the first and second main surfaces of the substrate.
 上記描画装置において、前記保持手段は、互いに隣り合う組の露光ヘッドから出射するビームにより照射される2つの領域の間に配置された1組のエアステージをさらに有し、前記1組のエアステージは、前記基板の第1の主面側に配置され、平面状の第3のエア噴出面を有する第3のエアステージと、前記基板の第2の主面側に配置され、前記第3のエア噴出面と対向し、前記第3のエア噴出面と均一の間隔で離れた第4のエア噴出面を有する第4のエアステージと、を含み、前記基板の第1及び第2の主面にエアを吹き付けることにより、前記基板を非接触で平面状に保持するように構成されても良い。 In the above-mentioned drawing device, the holding means may further have a set of air stages arranged between two regions irradiated by beams emitted from adjacent sets of exposure heads, the set of air stages including a third air stage arranged on the first main surface side of the substrate and having a planar third air ejection surface, and a fourth air stage arranged on the second main surface side of the substrate and facing the third air ejection surface and having a fourth air ejection surface spaced at a uniform distance from the third air ejection surface, and may be configured to hold the substrate in a non-contact, planar state by blowing air onto the first and second main surfaces of the substrate.
 上記描画装置において、前記2組のエアステージにおいて、前記第1のエア噴出面は互いに同じ向きに湾曲し、前記保持手段は、互いに隣り合う組の露光ヘッドから出射するビームにより照射される2つの領域の間に配置された1組のエアステージをさらに有し、前記1組のエアステージは、前記基板の第1の主面側に配置され、前記基板の長手方向において前記第1のエア噴出面とは反対の向きに湾曲する第3のエア噴出面を有する第3のエアステージと、前記基板の第2の主面側に配置され、前記第3のエア噴出面と対向し、前記第3のエア噴出面と均一の間隔で離れた第4のエア噴出面を有する第4のエアステージと、を含み、前記基板の第1及び第2の主面にエアを吹き付けることにより、前記基板を非接触で該基板の長手方向において湾曲させた状態で保持するように構成されても良い。 In the above-mentioned drawing device, the first air ejection surfaces of the two sets of air stages are curved in the same direction, and the holding means further has a set of air stages arranged between two regions irradiated by beams emitted from adjacent sets of exposure heads, and the set of air stages includes a third air stage arranged on the first main surface side of the substrate and having a third air ejection surface that is curved in the opposite direction to the first air ejection surface in the longitudinal direction of the substrate, and a fourth air stage arranged on the second main surface side of the substrate, facing the third air ejection surface, and having a fourth air ejection surface spaced apart from the third air ejection surface by a uniform distance, and may be configured to hold the substrate in a curved state in the longitudinal direction of the substrate without contact by blowing air onto the first and second main surfaces of the substrate.
 上記描画装置において、前記基板は、前記ビームにより照射される領域を通過する際に水平方向に搬送され、前記保持手段は、互いに隣り合う組の露光ヘッドから出射するビームにより照射される2つの領域の間、且つ、前記基板の下方に配置され、平面状のエア噴出面を有し、前記基板に下方からエアを吹き付けることにより前記基板を非接触で平面状に保持するように構成された第3のエアステージをさらに有しても良い。 In the above-mentioned drawing device, the substrate is transported horizontally as it passes through the area irradiated by the beam, and the holding means may further include a third air stage that is disposed between the two areas irradiated by the beams emitted from adjacent sets of exposure heads and below the substrate, has a planar air ejection surface, and is configured to hold the substrate flat without contact by blowing air onto the substrate from below.
 上記描画装置において、前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、それぞれ、互いに対向する位置に配置され、互いに対向する位置に配置された第1及び第2の露光ヘッドからなる1組の露光ヘッドは、前記基板の長手方向における同一の領域に向けて露光用のビームを両面から照射するように構成され、前記保持手段は、各組の露光ヘッドから出射したビームにより照射される領域の上流側及び下流側において、一方の主面側に設けられ、前記基板を搬送可能に支持するように構成された2つの支持ローラと、複数組の露光ヘッドのうち最も上流側に位置する組の露光ヘッドから出射したビームにより照射される領域の上流側に設けられた前記支持ローラよりもさらに上流側、且つ、前記基板の他方の主面側に設けられた第1の補助ローラと、前記複数組の露光ヘッドのうち最も下流側に位置する露光ヘッドから出射したビームにより照射される領域の下流側に設けられた前記支持ローラよりもさらに下流側、且つ、前記基板の他方の主面側に設けられた第2の補助ローラと、を有し、前記2つの支持ローラは、該2つの支持ローラの外周面のうち前記基板と接する領域同士が同一の平面となるように配置され、前記第1及び第2の補助ローラは、それぞれ、該第1及び第2の補助ローラの外周面が前記平面よりも前記2つの支持ローラの回転軸側にはみ出すように配置されていても良い。 In the above-mentioned drawing device, the plurality of first exposure heads and the plurality of second exposure heads are respectively arranged at positions facing each other, and a set of exposure heads consisting of the first and second exposure heads arranged at positions facing each other is configured to irradiate exposure beams from both sides toward the same area in the longitudinal direction of the substrate, and the holding means is provided on one main surface side at the upstream and downstream sides of the area irradiated by the beams emitted from each set of exposure heads, and is configured to support the substrate so as to be transportable, and a holding means is provided on the upstream side of the area irradiated by the beams emitted from the exposure head set located at the most upstream side among the plurality of sets of exposure heads, The exposure head may further include a first auxiliary roller provided further upstream of the support roller and on the other main surface side of the substrate, and a second auxiliary roller provided further downstream of the support roller provided downstream of the area irradiated by the beam emitted from the exposure head located most downstream of the plurality of exposure heads and on the other main surface side of the substrate, and the two support rollers are arranged so that the areas of the outer circumferential surfaces of the two support rollers that contact the substrate are flush with each other, and the first and second auxiliary rollers may be arranged so that the outer circumferential surfaces of the first and second auxiliary rollers extend beyond the plane toward the rotation axis of the two support rollers.
 上記描画装置において、前記保持手段は、互いに隣り合う組の露光ヘッドから出射したビームにより照射される2つの領域の間、且つ、前記基板の前記他方の主面側に設けられた第3の補助ローラをさらに有し、前記第3の補助ローラは、該第3の補助ローラの外周面のうち前記基板と接する領域が、前記平面と同一面となるように、又は、該第3の補助ローラの外周面が前記平面よりも前記2つの支持ローラの回転軸側にはみ出すように配置されていても良い。 In the above-mentioned drawing device, the holding means further has a third auxiliary roller provided between the two areas irradiated by the beams emitted from the adjacent sets of exposure heads and on the other main surface side of the substrate, and the third auxiliary roller may be arranged so that the area of the outer circumferential surface of the third auxiliary roller that contacts the substrate is flush with the plane, or so that the outer circumferential surface of the third auxiliary roller extends beyond the plane toward the rotation axis of the two support rollers.
 上記描画装置において、前記基板は、前記ビームにより照射される領域を通過する際に水平方向に搬送され、前記2つの支持ローラは、前記基板の下側に設けられ、前記保持手段は、前記2つの支持ローラの各々の外周面に接触して各支持ローラを回転可能に支持する複数のベアリングであって、各支持ローラの回転軸方向の複数箇所に分散して設けられた複数のベアリングをさらに有しても良い。 In the above-mentioned drawing device, the substrate is transported horizontally when passing through the area irradiated by the beam, the two support rollers are provided below the substrate, and the holding means may further include a plurality of bearings that contact the outer peripheral surfaces of each of the two support rollers to rotatably support each support roller, and may further include a plurality of bearings that are distributed at a plurality of locations in the direction of the rotation axis of each support roller.
 上記描画装置において、前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、互い違いに配置され、前記保持手段は、前記複数の第1の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第2の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第1の支持ローラと、前記複数の第2の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第1の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第2の支持ローラと、を有し、前記複数の第1及び第2の支持ローラは、該複数の第1及び第2の支持ローラの外周面のうち前記基板が架け渡される領域がジグザグとなるように配置されていても良い。 In the above-mentioned drawing device, the plurality of first exposure heads and the plurality of second exposure heads are arranged in a staggered manner, and the holding means includes a plurality of first support rollers arranged on the second main surface side of the plurality of areas irradiated by the beams emitted from the plurality of first exposure heads, respectively, and configured to support the substrate in a transportable manner, and a plurality of second support rollers arranged on the first main surface side of the plurality of areas irradiated by the beams emitted from the plurality of second exposure heads, respectively, and configured to support the substrate in a transportable manner, and the plurality of first and second support rollers may be arranged such that the area of the outer circumferential surface of the plurality of first and second support rollers over which the substrate is spanned is zigzag.
 上記描画装置において、前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、互い違いに配置され、前記保持手段は、前記複数の第1の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第2の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第1の支持ローラと、前記複数の第2の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第1の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第2の支持ローラと、前記複数の第1及び第2の支持ローラのうち最も上流側の支持ローラのさらに上流側、且つ、前記基板に対して該上流側の支持ローラの反対側に設けられた第1の補助ローラと、前記複数の第1及び第2の支持ローラのうち最も下流側の支持ローラのさらに下流側、且つ、前記基板に対して該下流側の支持ローラの反対側に設けられた第2の補助ローラと、を有し、前記複数の第1及び第2の支持ローラは、該複数の第1及び第2の支持ローラの外周面のうち前記基板と接する領域同士が同一の平面となるように配置され、前記第1の補助ローラは、該第1の補助ローラの外周面が前記平面よりも前記上流側の支持ローラの回転軸側にはみ出すように配置され、前記第2の補助ローラは、該第2の補助ローラの外周面が前記平面よりも前記下流側の支持ローラの回転軸側にはみ出すように配置されていても良い。 In the above-mentioned drawing device, the plurality of first exposure heads and the plurality of second exposure heads are arranged in a staggered manner, and the holding means includes a plurality of first support rollers arranged on the second main surface side of a plurality of areas irradiated by beams emitted from the plurality of first exposure heads, respectively, and configured to support the substrate in a transportable manner, a plurality of second support rollers arranged on the first main surface side of a plurality of areas irradiated by beams emitted from the plurality of second exposure heads, respectively, and configured to support the substrate in a transportable manner, and a plurality of second support rollers arranged further upstream of the most upstream support roller of the plurality of first and second support rollers, and further upstream of the upstream support roller with respect to the substrate. The first and second support rollers are arranged so that the regions of the outer circumferential surfaces of the first and second support rollers that contact the substrate are flush with each other, and the first auxiliary roller is arranged so that the outer circumferential surface of the first auxiliary roller extends beyond the plane toward the rotation axis of the upstream support roller, and the second auxiliary roller is arranged so that the outer circumferential surface of the second auxiliary roller extends beyond the plane toward the rotation axis of the downstream support roller.
 上記描画装置において、前記基板は、前記ビームにより照射される領域を通過する際に水平方向に搬送され、前記複数の第1の支持ローラは、前記基板の下側に設けられ、前記保持手段は、前記複数の第1の支持ローラの各々の外周面に接触して各第1の支持ローラを回転可能に支持する複数のベアリングであって、各第1の支持ローラの回転軸方向の複数箇所に分散して設けられた複数のベアリングをさらに有しても良い。 In the above-mentioned drawing device, the substrate is transported horizontally when passing through the area irradiated by the beam, the plurality of first support rollers are provided below the substrate, and the holding means may further include a plurality of bearings that contact the outer peripheral surface of each of the plurality of first support rollers to rotatably support each of the first support rollers, and are provided at multiple locations distributed in the direction of the rotation axis of each of the first support rollers.
 本発明によれば、長尺のシート状をなす基板の搬送経路内の所定範囲の少なくとも一部において、基板が該基板の厚さ方向において湾曲するように基板を保持するように構成された保持手段を設けるので、ステージにより基板を支持することなく、搬送中の基板の撓みを抑制することができる。従って、基板の両面に露光用ビームを同時に照射することにより、効率良く、且つ、精度良く配線パターンを形成することが可能となる。 According to the present invention, a holding means is provided that is configured to hold a long sheet-shaped substrate so that the substrate is curved in the thickness direction of the substrate in at least a portion of a predetermined range within the transport path of the substrate, so that the substrate is prevented from bending during transport without being supported by a stage. Therefore, by simultaneously irradiating both sides of the substrate with an exposure beam, it is possible to form a wiring pattern efficiently and accurately.
本発明の第1の実施形態に係る描画装置の概略構成を示す模式図である。1 is a schematic diagram showing a schematic configuration of a drawing apparatus according to a first embodiment of the present invention. 図1に示す露光部を拡大して示す模式図である。FIG. 2 is an enlarged schematic view of an exposed portion shown in FIG. 1 . 図2に示す露光ヘッドの内部の概略構成を示す模式図である。3 is a schematic diagram showing a schematic internal configuration of the exposure head shown in FIG. 2 . 複数の露光ヘッドから出射したビームによる基板における照射領域を説明するための模式図である。3 is a schematic diagram for explaining an irradiation area on a substrate by beams emitted from a plurality of exposure heads. FIG. 本発明の第2の実施形態に係る描画装置の露光部を示す模式図である。FIG. 11 is a schematic diagram showing an exposure unit of a drawing apparatus according to a second embodiment of the present invention. 図5に示す下側の支持ローラの一部を下方から見た模式図である。6 is a schematic diagram of a portion of the lower support roller shown in FIG. 5 as viewed from below. 本発明の第3の実施形態に係る描画装置の露光部を示す模式図である。FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a third embodiment of the present invention. 本発明の第4の実施形態に係る描画装置の露光部を示す模式図である。FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a fourth embodiment of the present invention. 図8に示すエアステージ上を搬送される基板を拡大して示す模式図である。9 is an enlarged schematic view showing a substrate being transported on the air stage shown in FIG. 8 . 本発明の第5の実施形態に係る描画装置の露光部を示す模式図である。FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a fifth embodiment of the present invention. 本発明の第6の実施形態に係る描画装置の露光部を示す模式図である。FIG. 13 is a schematic diagram showing an exposure unit of a drawing apparatus according to a sixth embodiment of the present invention.
 以下、本発明の実施の形態に係る描画装置について、図面を参照しながら説明する。なお、これらの実施の形態によって本発明が限定されるものではない。また、各図面の記載において、同一部分には同一の符号を付して示している。 The following describes a drawing device according to an embodiment of the present invention with reference to the drawings. Note that the present invention is not limited to these embodiments. In addition, in the descriptions of the drawings, the same parts are denoted by the same reference numerals.
 以下の説明において参照する図面は、本発明の内容を理解し得る程度に形状、大きさ、及び位置関係を概略的に示しているに過ぎない。即ち、本発明は各図で例示された形状、大きさ、及び位置関係のみに限定されるものではない。また、図面の相互間においても、互いの寸法の関係や比率が異なる部分が含まれている場合がある。 The drawings referred to in the following description merely show the shape, size, and positional relationships in a schematic manner to enable the contents of the present invention to be understood. In other words, the present invention is not limited to the shape, size, and positional relationships illustrated in each drawing. Furthermore, there may be parts in which the dimensional relationships and ratios differ between the drawings.
(第1の実施形態)
 図1は、本発明の第1の実施形態に係る描画装置の概略構成を示す模式図である。図1に示すように、描画装置1は、長尺のシート状をなす基板2を搬送する搬送システム3と、基板2に露光用のビームLを照射する露光部4と、搬送システム3及び露光部4の動作を制御する制御装置5とを備える。描画装置1は、ビームLで基板2を走査することにより基板2に配線パターンを直接描画する、所謂ダイレクト露光方式の描画装置である。
First Embodiment
Fig. 1 is a schematic diagram showing a schematic configuration of a drawing apparatus according to a first embodiment of the present invention. As shown in Fig. 1, the drawing apparatus 1 includes a transport system 3 that transports a long sheet-like substrate 2, an exposure unit 4 that irradiates the substrate 2 with an exposure beam L, and a control device 5 that controls the operations of the transport system 3 and the exposure unit 4. The drawing apparatus 1 is a so-called direct exposure type drawing apparatus that scans the substrate 2 with the beam L to directly draw a wiring pattern on the substrate 2.
 なお、以下においては、基板2の2つの主面を、便宜上、表面2a及び裏面2bと称するが、表面2a及び裏面2bの態様や特性、及び、表面2a及び裏面2bに対する処理が特段異なるわけではない。 In the following, the two main surfaces of the substrate 2 will be referred to as the front surface 2a and the back surface 2b for convenience, but there is no particular difference in the appearance or characteristics of the front surface 2a and the back surface 2b, or in the processing of the front surface 2a and the back surface 2b.
 本実施形態においては、フレキシブルプリント回路基板(Flexible Printed Circuit:FPC)を処理対象の基板2としている。FPCは、ポリイミド等の絶縁性を有する樹脂製のベースフィルムに銅等の金属箔を貼り合わせた可撓性を有する基板である。基板2は、例えば数m~数十mの帯状に成形されたFPCであり、巻出しリール31にロール状に巻かれた状態から巻き出され、搬送システム3により搬送されて露光部4によりパターンが形成された後、巻取りリール32に巻き取られる。このように、帯状のワークをロールから巻き出し、所定の処理を施した後でロールに巻き取る搬送方式のことを、ロールトゥロール(Roll to Roll)方式という。 In this embodiment, the substrate 2 to be processed is a flexible printed circuit (FPC). The FPC is a flexible substrate in which a metal foil such as copper is bonded to a base film made of insulating resin such as polyimide. The substrate 2 is an FPC formed in a strip shape, for example several meters to several tens of meters, and is unwound from a rolled state on the unwinding reel 31, transported by the transport system 3, a pattern is formed by the exposure unit 4, and then wound up on the take-up reel 32. This transport method in which a strip-shaped workpiece is unwound from a roll, subjected to a specified process, and wound up on a roll is called the roll-to-roll method.
 搬送システム3には、巻出しリール31を回転可能に支持する回転軸31aと、巻取りリール32を回転可能に支持する回転軸32aと、巻出しリール31と巻取りリール32との間で基板2を案内する複数の案内ローラ33と、2つのテンションプーリ34とが設けられている。以下においては、基板2の搬送経路において、巻出しリール31側を上流側、巻取りリール32側を下流側という。 The transport system 3 is provided with a rotating shaft 31a that rotatably supports the unwinding reel 31, a rotating shaft 32a that rotatably supports the take-up reel 32, a number of guide rollers 33 that guide the substrate 2 between the unwinding reel 31 and the take-up reel 32, and two tension pulleys 34. In the following, in the transport path of the substrate 2, the unwinding reel 31 side is referred to as the upstream side, and the take-up reel 32 side is referred to as the downstream side.
 テンションプーリ34は、露光部4の上流側及び下流側に、露光部4よりも下方において上下方向に移動可能に設置されている。詳細には、各テンションプーリ34は、上下方向に移動可能な回転軸34aに回転可能に支持されている。各回転軸34aは、当該回転軸34aを下方に向けて付勢するテンション調整機構に連結されている。このテンション調整機構により回転軸34aを介してテンションプーリ34を下方に付勢することにより、基板2に所定のテンションをかけながら露光部4を通過させることができる。 The tension pulleys 34 are installed on the upstream and downstream sides of the exposure section 4, below the exposure section 4, so as to be movable in the vertical direction. In detail, each tension pulley 34 is rotatably supported on a rotating shaft 34a which is movable in the vertical direction. Each rotating shaft 34a is connected to a tension adjustment mechanism which biases the rotating shaft 34a downward. By biasing the tension pulley 34 downward via the rotating shaft 34a by this tension adjustment mechanism, it is possible to pass the exposure section 4 while applying a predetermined tension to the substrate 2.
 各案内ローラ33は、回転軸33aに回転可能に支持されている。案内ローラ33は、巻出しリール31から巻き出された基板2が、上流側のテンションプーリ34を経て露光部4を通過し、下流側のテンションプーリ34を経て巻取りリール32に巻き取られるという搬送経路において、基板2の搬送方向が変化する各所に配置され、基板2を案内する。なお、搬送経路に設けられる案内ローラ33のサイズは必ずしも同一でなくても良く、基板2の搬送方向が変化する箇所における搬送経路の角度や配置スペース等に応じて適宜決定することができる。 Each guide roller 33 is rotatably supported by a rotating shaft 33a. The guide rollers 33 are arranged at various points along the transport path where the transport direction of the substrate 2 changes, as the substrate 2 is unwound from the unwinding reel 31, passes through the exposure section 4 via the upstream tension pulley 34, and is wound onto the take-up reel 32 via the downstream tension pulley 34, to guide the substrate 2. Note that the size of the guide rollers 33 provided along the transport path does not necessarily have to be the same, and can be determined appropriately depending on the angle of the transport path and the arrangement space at the point where the transport direction of the substrate 2 changes.
 露光部4よりも上流側のローラ33の近傍に、アライメント用のカメラ37を設置しても良い。或いは、カメラ37の代わりに、ローラ33(1)の近傍にアライメント用のカメラ38を設置しても良い。また、露光部4よりも上流側における基板2の搬送経路上に、エアブロー方式又はローラ方式によるゴミ取り装置39を設置しても良い。 An alignment camera 37 may be installed near the roller 33 upstream of the exposure unit 4. Alternatively, instead of the camera 37, an alignment camera 38 may be installed near the roller 33(1). Also, a dust removal device 39 using an air blower or roller system may be installed on the transport path of the substrate 2 upstream of the exposure unit 4.
 基板2を搬送する搬送手段としては、ロールトゥロール方式で基板2を搬送しながら基板2にパターンを描画することができれば、図1に示す搬送システム3の構成に限定されない。例えば、図1に示す露光部4においては、基板2が図の上方から下方に向けて搬送される態様となっており、この態様に合わせて複数の案内ローラ33が配置されている。しかしながら、露光部4において基板2を水平方向に搬送する態様であっても良く、その場合、基板2が搬送される態様に合わせて案内ローラ33を配置すれば良い。また、図1に示す搬送システム3に対し、巻出しリール31から基板2が巻き出された後、露光部4に至るまでの間、又は、露光部4を通過した基板2が巻取りリール32に巻き取られるまでの間に、さらに別の処理を行うユニット(前処理ユニット、後処理ユニット等)を設けても良い。なお、搬送システム3には、通常、基板搬送時の蛇行を防ぐため、基板2の端部位置を検出し、巻出し装置又は巻取り装置を微動させるエッジ・ポジション・コントロール(Edge Position Control:EPC)装置が設けられる。 The transport means for transporting the substrate 2 is not limited to the configuration of the transport system 3 shown in FIG. 1, as long as a pattern can be drawn on the substrate 2 while transporting it by a roll-to-roll method. For example, in the exposure section 4 shown in FIG. 1, the substrate 2 is transported from the top to the bottom of the figure, and multiple guide rollers 33 are arranged according to this mode. However, the substrate 2 may be transported horizontally in the exposure section 4, in which case the guide rollers 33 may be arranged according to the mode in which the substrate 2 is transported. In addition, the transport system 3 shown in FIG. 1 may be provided with a unit (pre-processing unit, post-processing unit, etc.) that performs further processing after the substrate 2 is unwound from the unwinding reel 31 and before it reaches the exposure section 4, or before the substrate 2 that has passed through the exposure section 4 is wound up by the take-up reel 32. Note that the transport system 3 is usually provided with an edge position control (EPC) device that detects the end position of the substrate 2 and finely moves the unwinding device or the winding device to prevent the substrate from meandering during transport.
 制御装置5は、描画装置1の各部の動作を統括的に制御する装置であり、CPU(Central Processing Unit)等の演算処理装置及び半導体メモリやディスクドライブ等の記憶装置を備えるコンピュータによって構成することができる。制御装置5は、インタフェースを介して、露光ヘッド41~44、巻取りリール32の回転量を検知するエンコーダ、搬送システム3を駆動する基板搬送駆動装置等の機器と接続され、これらの機器にデータ転送や指示を行い、描画装置1の動作を統括的に制御することにより、基板2へのパターン描画を実行させる。 The control device 5 is a device that comprehensively controls the operation of each part of the drawing device 1, and can be configured with a computer equipped with an arithmetic processing device such as a CPU (Central Processing Unit) and storage devices such as semiconductor memory and disk drives. The control device 5 is connected via an interface to devices such as the exposure heads 41-44, an encoder that detects the amount of rotation of the take-up reel 32, and a substrate transport drive device that drives the transport system 3, and transfers data and issues instructions to these devices, comprehensively controlling the operation of the drawing device 1, thereby causing the pattern to be drawn on the substrate 2.
 図2は、図1に示す露光部4を拡大して示す模式図である。露光部4は、基板2の搬送経路内の所定範囲である露光処理エリアRに設けられる。図2においては、2つの案内ローラ33(1),33(2)の間の領域が露光処理エリアRとなる。 FIG. 2 is an enlarged schematic diagram of the exposure unit 4 shown in FIG. 1. The exposure unit 4 is provided in an exposure processing area R, which is a predetermined range within the transport path of the substrate 2. In FIG. 2, the area between the two guide rollers 33(1) and 33(2) is the exposure processing area R.
 露光部4は、露光処理エリアRにおいて基板2に露光用のビームLを照射するように設けられた複数(図2においては4つ)の露光ヘッド41~44と、該露光処理エリアRの少なくとも一部において基板2が該基板2の厚さ方向において湾曲するように基板2を保持するように構成された保持手段とを備える。本実施形態において、保持手段は、複数(図2においては4つ)の支持ローラ45~48を有する。また、保持手段は、補助ローラ49をさらに含んでも良い。 The exposure unit 4 includes a plurality of exposure heads 41-44 (four in FIG. 2) arranged to irradiate the substrate 2 with an exposure beam L in the exposure processing area R, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R. In this embodiment, the holding means has a plurality of support rollers 45-48 (four in FIG. 2). The holding means may further include an auxiliary roller 49.
 図3は、各露光ヘッド41~44の内部の概略構成を示す模式図である。図3に示すように、各露光ヘッド41~44の内部には、レーザ光を出力するレーザ光源411と、ビーム成形光学系412と、反射ミラー413と、ポリゴンミラー414と、結像光学系415とが設けられている。ポリゴンミラー414には、該ポリゴンミラー414を回転軸414a回りに回転させる駆動装置が設けられている。 Figure 3 is a schematic diagram showing the general internal configuration of each of the exposure heads 41 to 44. As shown in Figure 3, each of the exposure heads 41 to 44 includes a laser light source 411 that outputs laser light, a beam shaping optical system 412, a reflecting mirror 413, a polygon mirror 414, and an imaging optical system 415. The polygon mirror 414 is provided with a drive device that rotates the polygon mirror 414 around a rotation axis 414a.
 ビーム成形光学系412は、コリメータレンズ、シリンドリカルレンズ、光量調整用のフィルタ、偏光フィルタ等の光学素子を含み、レーザ光源411から出力されたレーザ光を、スポット状のビーム形状を有するビームLに成形する。反射ミラー413は、ビーム成形光学系412により成形されたビームLを、ポリゴンミラー414の方向に反射する。ポリゴンミラー414は、回転軸414a回りに回転し、反射ミラー413の方向から入射したビームLを、回転軸414aと直交する面内において複数の方向に反射する。結像光学系415は、fθレンズ又はテレセントリックfθレンズ等の光学素子を含み、ポリゴンミラー414により反射されたビームLを、基板2において結像させる。各露光ヘッド41~44においては、ポリゴンミラー414の回転を制御することにより、露光ヘッド41~44から出射するビームLにより基板2上の所定の走査範囲SRを一次元的に走査することができる。 The beam shaping optical system 412 includes optical elements such as a collimator lens, a cylindrical lens, a filter for adjusting the amount of light, and a polarizing filter, and shapes the laser light output from the laser light source 411 into a beam L having a spot-shaped beam shape. The reflecting mirror 413 reflects the beam L shaped by the beam shaping optical system 412 toward the polygon mirror 414. The polygon mirror 414 rotates around the rotation axis 414a, and reflects the beam L incident from the direction of the reflecting mirror 413 in multiple directions in a plane perpendicular to the rotation axis 414a. The imaging optical system 415 includes optical elements such as an fθ lens or a telecentric fθ lens, and forms an image of the beam L reflected by the polygon mirror 414 on the substrate 2. In each of the exposure heads 41 to 44, the rotation of the polygon mirror 414 can be controlled to one-dimensionally scan a predetermined scanning range SR on the substrate 2 with the beam L emitted from the exposure heads 41 to 44.
 なお、露光ヘッド41~44の構成は、基板2にビームLを結像させ、ビームLにより基板2を幅方向(搬送方向と直交する方向)において1次元的に走査することができれば、図3に例示される構成に限定されない。例えば、ポリゴンミラー414と結像光学系415との間に反射ミラーを配置することにより、ビームLの出射方向を変化させても良い。 The configuration of the exposure heads 41 to 44 is not limited to the configuration exemplified in FIG. 3, as long as the beam L can be focused on the substrate 2 and the beam L can scan the substrate 2 one-dimensionally in the width direction (direction perpendicular to the transport direction). For example, the emission direction of the beam L may be changed by disposing a reflecting mirror between the polygon mirror 414 and the imaging optical system 415.
 図3に示すように、露光ヘッド41~44からのビームLの出射方向をビーム成形光学系412の光軸方向と一致させる場合、即ち、露光ヘッド41~44の筐体の長手方向と一致させる場合、図1に示すように、露光ヘッド41~44の筐体を水平に配置し、露光処理エリアRにおいて基板2を上下方向に搬送する構成とすることで、描画装置1のサイズをコンパクトにすることができる。 As shown in FIG. 3, when the emission direction of the beam L from the exposure heads 41-44 is aligned with the optical axis direction of the beam shaping optical system 412, i.e., when aligned with the longitudinal direction of the housings of the exposure heads 41-44, the size of the drawing device 1 can be made compact by arranging the housings of the exposure heads 41-44 horizontally and transporting the substrate 2 vertically in the exposure processing area R, as shown in FIG. 1.
 4つの露光ヘッド41~44のうち、2つの露光ヘッド41,43は、基板の表面2a側に設けられている。露光ヘッド41,43は、基板2の長手方向において互いに離れた位置に配置されており、基板2の表面2aに露光用のビームLを照射する。また、別の2つの露光ヘッド42,44は、基板2の裏面2b側に設けられている。露光ヘッド42,44は、基板2の長手方向において互いに離れた位置に配置されており、基板2の裏面2bに露光用のビームLを照射する。表面2a側の露光ヘッド41,43と、裏面2b側の露光ヘッド42,44とは、互い違いに配置されている。 Of the four exposure heads 41 to 44, two exposure heads 41, 43 are provided on the front surface 2a side of the substrate. The exposure heads 41, 43 are arranged at positions spaced apart from each other in the longitudinal direction of the substrate 2, and irradiate the front surface 2a of the substrate 2 with an exposure beam L. Two other exposure heads 42, 44 are provided on the back surface 2b side of the substrate 2. The exposure heads 42, 44 are arranged at positions spaced apart from each other in the longitudinal direction of the substrate 2, and irradiate the back surface 2b of the substrate 2 with an exposure beam L. The exposure heads 41, 43 on the front surface 2a side and the exposure heads 42, 44 on the back surface 2b side are arranged alternately.
 図4は、複数の露光ヘッド41~44から出射したビームによる基板における照射領域を説明するための模式図である。このうち、図4の(a)は、露光ヘッド41~44から出射したビームLにより照射される領域(照射領域)SA1~SA4を示し、図4の(b)は、ビームLに照射されることにより配線パターンが形成された領域(描画領域)PA1~PA4を示す。 FIG. 4 is a schematic diagram for explaining the areas on a substrate irradiated by beams emitted from multiple exposure heads 41-44. FIG. 4(a) shows areas (irradiation areas) SA1-SA4 irradiated by beams L emitted from exposure heads 41-44, and FIG. 4(b) shows areas (drawing areas) PA1-PA4 in which a wiring pattern is formed by being irradiated with beams L.
 図4の(a)に示すように、露光ヘッド41~44から出射したビームLの照射領域SA1~SA4の幅(即ち、走査範囲SR)は、基板2の片面側に配置された露光ヘッド41~44の数に応じて設定される。本実施形態のように、基板2の片面側に露光ヘッドが2つずつ配置されている場合、照射領域SA1~SA4の幅は、基板2の幅Wの概ね1/2となる。もっとも、基板2の幅方向の端部に、ビームLが照射されない領域を設けても良いし、基板2の幅方向の中央部に、2つの露光ヘッドから出射したビームLが重複して照射される領域を設けても良い。 As shown in FIG. 4A, the width of the irradiation areas SA1-SA4 of the beam L emitted from the exposure heads 41-44 (i.e., the scanning range SR) is set according to the number of exposure heads 41-44 arranged on one side of the substrate 2. When two exposure heads are arranged on each side of the substrate 2 as in this embodiment, the width of the irradiation areas SA1-SA4 is approximately 1/2 the width W of the substrate 2. However, it is also possible to provide an area at the end of the substrate 2 in the width direction where the beam L is not irradiated, or to provide an area at the center of the substrate 2 in the width direction where the beams L emitted from the two exposure heads are irradiated in an overlapping manner.
 図4の(a)に示すように、表面2a側の露光ヘッド41,43から出射したビームLの照射領域SA1,SA2は、基板2の幅方向において重ならないように設定されている。そのため、基板2を搬送しながら、露光ヘッド41,43から出射したビームLによりそれぞれの照射領域SA1,SA3を走査することにより、図4の(b)に示すように、領域PA1,PA3に配線パターンが描画される。基板2の裏面2b側においても同様である。 As shown in FIG. 4(a), the irradiation areas SA1, SA2 of the beam L emitted from the exposure heads 41, 43 on the front surface 2a side are set so as not to overlap in the width direction of the substrate 2. Therefore, by scanning the respective irradiation areas SA1, SA3 with the beam L emitted from the exposure heads 41, 43 while the substrate 2 is being transported, a wiring pattern is drawn in areas PA1, PA3 as shown in FIG. 4(b). The same is true on the back surface 2b side of the substrate 2.
 再び図2を参照すると、4つの支持ローラ45~48のうち、2つの支持ローラ45,47は、表面2a側の2つの露光ヘッド41,43から出射したビームLにより照射される2箇所の照射領域の裏面2b側にそれぞれ配置され、基板2を搬送可能に支持している。また、支持ローラ46,48は、裏面2b側の複数の露光ヘッド42,44から出射したビームLにより照射されるビームLの2箇所の照射領域の表面2a側にそれぞれ配置され、基板2を搬送可能に支持している。露光ヘッド41~44は、支持ローラ45~48に架け渡されて湾曲する基板2の頂点に、該頂点における接平面の法線方向からビームLが照射されるように、位置合わせされている。 Referring again to FIG. 2, of the four support rollers 45-48, two support rollers 45, 47 are arranged on the back surface 2b side of two irradiation areas irradiated with beams L emitted from two exposure heads 41, 43 on the front surface 2a side, respectively, and support the substrate 2 so that it can be transported. In addition, support rollers 46, 48 are arranged on the front surface 2a side of two irradiation areas irradiated with beams L emitted from multiple exposure heads 42, 44 on the back surface 2b side, respectively, and support the substrate 2 so that it can be transported. The exposure heads 41-44 are aligned so that the beams L are irradiated to the vertices of the curved substrate 2 that are spanned across the support rollers 45-48 in the normal direction of the tangent plane at the vertices.
 支持ローラ45~48は、回転軸45a~48aが直線上に並ぶように配置されている。基板2はその裏面2bと表面2aとが支持ローラ45~48に交互に接触するように、支持ローラ45~48に架け渡されている。それにより、露光処理エリアRにおいて基板2が、支持ローラ45~48に沿って、4箇所において湾曲する。 The support rollers 45-48 are arranged so that their rotation axes 45a-48a are aligned in a straight line. The substrate 2 is stretched across the support rollers 45-48 so that its back surface 2b and front surface 2a alternately come into contact with the support rollers 45-48. As a result, the substrate 2 is curved at four points along the support rollers 45-48 in the exposure processing area R.
 もっとも、支持ローラ45~48は、必ずしも回転軸45a~48aが直線上に並ぶように配置する必要はない。支持ローラ45~48の外周面のうち基板2が架け渡される領域がジグザグになるように、支持ローラ45~48を配置すれば良い。 However, the support rollers 45-48 do not necessarily need to be arranged so that the rotation axes 45a-48a are aligned in a straight line. The support rollers 45-48 can be arranged so that the area of the outer periphery of the support rollers 45-48 over which the substrate 2 is stretched is zigzag.
 また、最も上流側の支持ローラ45とその上流の案内ローラ33(1)との位置関係や、最も下流側の支持ローラ48とその下流の案内ローラ33(2)との位置関係に応じて、基板2が支持ローラ45,48から浮かないように補助する補助ローラ49を配置しても良い。例えば、図2においては、支持ローラ48と案内ローラ33(2)との間に補助ローラ49を配置し、基板2が支持ローラ48に確実に架け渡されるようにしている。 Also, depending on the positional relationship between the most upstream support roller 45 and the guide roller 33(1) upstream of it, and the positional relationship between the most downstream support roller 48 and the guide roller 33(2) downstream of it, an auxiliary roller 49 may be arranged to help prevent the substrate 2 from floating up from the support rollers 45, 48. For example, in FIG. 2, an auxiliary roller 49 is arranged between the support roller 48 and the guide roller 33(2) to ensure that the substrate 2 is securely hung on the support roller 48.
 以上、説明したように、本実施形態によれば、露光処理エリアRにおいて、支持ローラ45~48によって基板2の少なくとも一部が厚さ方向に湾曲するように、該基板2を支持することにより、基板2の撓みを抑制することができる。それにより、露光ヘッド41~44から出射したビームLを、基板2の両面の目標位置に正確に照射することができる。従って、基板2の両面に精度良く配線パターンを形成することが可能となる。 As described above, according to this embodiment, in the exposure processing area R, the support rollers 45-48 support the substrate 2 so that at least a portion of the substrate 2 is curved in the thickness direction, thereby suppressing bending of the substrate 2. This allows the beams L emitted from the exposure heads 41-44 to be accurately irradiated onto target positions on both sides of the substrate 2. This makes it possible to form wiring patterns with high precision on both sides of the substrate 2.
 また、支持ローラ45~48により支持された基板2の領域に向けてビームLを照射するので、ビームLのエネルギーによる基板2の位置の変動を抑制することができる。 In addition, because the beam L is irradiated toward the area of the substrate 2 supported by the support rollers 45 to 48, fluctuations in the position of the substrate 2 caused by the energy of the beam L can be suppressed.
 なお、本実施形態においては、基板2の表面2a側及び裏面2b側に露光ヘッド及び支持ローラを2つずつ設けたが、露光ヘッド及び支持ローラの数をさらに増やしても良い。 In this embodiment, two exposure heads and two support rollers are provided on the front surface 2a and back surface 2b of the substrate 2, but the number of exposure heads and support rollers may be increased.
(第2の実施形態)
 図5は、本発明の第2の実施形態に係る描画装置の露光部を示す模式図であり、描画装置における基板2の搬送経路のうち、基板2にビームLを照射することによりパターンを描画する露光処理エリアR近傍の構成を示している。
Second Embodiment
Figure 5 is a schematic diagram showing an exposure section of a drawing apparatus according to a second embodiment of the present invention, and shows the configuration of a portion of the transport path of the substrate 2 in the drawing apparatus near an exposure processing area R where a pattern is drawn by irradiating a beam L onto the substrate 2.
 図5に示す露光部4Aは、基板2に露光用のビームLを照射するように設けられた複数(図5においては4つ)の露光ヘッド41A~44Aと、露光処理エリアRの少なくとも一部において、基板2が該基板2の厚さ方向において湾曲するように基板2を保持するように構成された保持手段とを備える。本実施形態において、保持手段は、基板2を平面状となるように支持する複数(図5においては4つ)の支持ローラ51~54と、これらの支持ローラ51~54の近傍の上流側及び下流側にそれぞれ設置された2つの補助ローラ55,56とを備える。 The exposure section 4A shown in FIG. 5 comprises a plurality of (four in FIG. 5) exposure heads 41A-44A arranged to irradiate the substrate 2 with an exposure beam L, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R. In this embodiment, the holding means comprises a plurality of (four in FIG. 5) support rollers 51-54 that support the substrate 2 so that it is flat, and two auxiliary rollers 55, 56 installed upstream and downstream near the support rollers 51-54, respectively.
 露光ヘッド41A~44Aの概略構成は、第1の実施形態における露光ヘッド41~44(図2及び図3参照)と概ね同じであるが、露光ヘッド41A~44Aにおいては、図3に示すポリゴンミラー414と結像光学系415との間に反射ミラーを配置することにより、ビームLの出射方向を、ビーム成形光学系412の光軸方向に対して垂直に折り曲げている。このように、ビームLの出射方向を折り曲げる場合、露光ヘッドの筐体の長手方向と垂直な方向にビームLを出射させることができる。そのため、図5に示すように、露光ヘッド41A~44Aの筐体を水平に配置し、露光処理エリアRにおいて基板2を水平方向に搬送する構成とすることで、描画装置のサイズをコンパクトにすることができる。 The general configuration of the exposure heads 41A to 44A is generally the same as the exposure heads 41 to 44 in the first embodiment (see Figures 2 and 3). However, in the exposure heads 41A to 44A, a reflecting mirror is placed between the polygon mirror 414 and the imaging optical system 415 shown in Figure 3, so that the emission direction of the beam L is bent perpendicular to the optical axis direction of the beam shaping optical system 412. In this way, when the emission direction of the beam L is bent, the beam L can be emitted in a direction perpendicular to the longitudinal direction of the housing of the exposure head. Therefore, as shown in Figure 5, the housings of the exposure heads 41A to 44A are arranged horizontally, and the substrate 2 is transported horizontally in the exposure processing area R, so that the size of the drawing device can be made compact.
 4つの支持ローラ51~54のうち、最も上流側及び下流側に位置する支持ローラ51,54は、表面2a側の2つの露光ヘッド41A,43Aから出射したビームLによる2箇所の照射領域の裏面2b側にそれぞれ配置され、基板2を搬送可能に支持している。また、残りの2つの支持ローラ52,53は、裏面2b側の複数の露光ヘッド42A,44Aから出射したビームLによる2箇所の照射領域の表面2a側にそれぞれ配置され、基板2を搬送可能に支持している。これらの支持ローラ51~54は、支持ローラ51~54の外周面のうち基板2と接する領域同士が同一平面となるように配置されている。これにより、支持ローラ51~54の間において、基板2は、ビームLと直交する平面状のまま搬送される。 Of the four support rollers 51-54, the support rollers 51, 54 located most upstream and downstream are arranged on the back surface 2b side of two irradiation areas by the beam L emitted from the two exposure heads 41A, 43A on the front surface 2a side, respectively, and support the substrate 2 so that it can be transported. The remaining two support rollers 52, 53 are arranged on the front surface 2a side of two irradiation areas by the beam L emitted from the multiple exposure heads 42A, 44A on the back surface 2b side, respectively, and support the substrate 2 so that it can be transported. These support rollers 51-54 are arranged so that the areas of the outer periphery of the support rollers 51-54 that come into contact with the substrate 2 are flush with each other. As a result, the substrate 2 is transported between the support rollers 51-54 while remaining flat and perpendicular to the beam L.
 なお、図5においては、裏面2b側の支持ローラ51,54と表面2a側の支持ローラ52,53との径が異なっているが、これらの支持ローラ51~54のサイズは同じであっても良い。 In FIG. 5, the diameters of the support rollers 51 and 54 on the back surface 2b side and the support rollers 52 and 53 on the front surface 2a side are different, but the sizes of these support rollers 51 to 54 may be the same.
 図5に示すように、基板2の下側に位置する支持ローラ51,54に対し、各支持ローラ51,54を回転可能に支持する複数のベアリング57を設けても良い。図6は、図5に示す下側の支持ローラ51,54の一部を下方から見た模式図である。図6に示すように、ベアリング57は、各支持ローラ51,54の回転軸と平行な方向(図6の左右方向)に沿って複数箇所に分散して設けられ、支持ローラ51,54の外周面に接触して当該支持ローラを支持する。このようにベアリング57を分散して配置することにより、基板2の重さや基板2から受けるテンションにより支持ローラ51,54が撓むことを抑制し、支持ローラ51~54間における基板2の平面状態を維持することができる。 As shown in FIG. 5, the support rollers 51, 54 located below the substrate 2 may be provided with a number of bearings 57 for rotatably supporting each of the support rollers 51, 54. FIG. 6 is a schematic diagram of a portion of the lower support rollers 51, 54 shown in FIG. 5, viewed from below. As shown in FIG. 6, the bearings 57 are provided at multiple locations along a direction parallel to the rotation axis of each support roller 51, 54 (left-right direction in FIG. 6), and contact the outer circumferential surface of the support rollers 51, 54 to support the support rollers. By distributing the bearings 57 in this manner, it is possible to prevent the support rollers 51, 54 from bending due to the weight of the substrate 2 or the tension received from the substrate 2, and to maintain the flat state of the substrate 2 between the support rollers 51 to 54.
 補助ローラ55は、支持ローラ51~54のうち最も上流側の支持ローラ51のさらに上流側、且つ、基板2に対して該支持ローラ51の反対側に配置されている。また、補助ローラ56は、支持ローラ51~54のうち最も下流側の支持ローラ54のさらに下流側、且つ、基板2に対して該支持ローラ54の反対側に配置されている。補助ローラ55,56は、補助ローラ55,56の外周面が、支持ローラ51~54間における基板2の面(平面)よりも支持ローラ51,54の回転軸側(図5においては下方)にはみ出すように配置されている。これにより、支持ローラ51~54の上流側及び下流側において、基板2を厚さ方向に湾曲させることができる。 Auxiliary roller 55 is disposed upstream of support roller 51, which is the most upstream of support rollers 51-54, and on the opposite side of support roller 51 with respect to substrate 2. Auxiliary roller 56 is disposed downstream of support roller 54, which is the most downstream of support rollers 51-54, and on the opposite side of support roller 54 with respect to substrate 2. Auxiliary rollers 55, 56 are disposed so that the outer circumferential surfaces of auxiliary rollers 55, 56 extend beyond the surface (flat surface) of substrate 2 between support rollers 51-54 toward the rotation axis of support rollers 51, 54 (downward in FIG. 5). This allows substrate 2 to be curved in the thickness direction upstream and downstream of support rollers 51-54.
 本実施形態によれば、ビームLの照射領域においては基板2を平面状に保ちつつ、照射領域の外側においては基板2を厚さ方向に湾曲させることができる。 According to this embodiment, the substrate 2 can be kept flat in the irradiation area of the beam L, while the substrate 2 can be curved in the thickness direction outside the irradiation area.
 また、本実施形態によれば、基板2の下側の支持ローラ51,54を複数のベアリングで支持するので、支持ローラ51,54の径が小さい場合でも、支持ローラ51,54の撓みを抑制することができる。 In addition, according to this embodiment, the support rollers 51, 54 on the lower side of the substrate 2 are supported by multiple bearings, so that deflection of the support rollers 51, 54 can be suppressed even if the diameter of the support rollers 51, 54 is small.
(変形例)
 第1の実施形態(図2参照)の露光処理エリアRにおける基板2の搬送方向を水平方向としても良い。この場合、基板2の下側となる支持ローラの各々に、支持ローラを回転可能に支持する複数のベアリング(図6参照)を設けても良い。
(Modification)
The transport direction of the substrate 2 in the exposure processing area R in the first embodiment (see FIG. 2) may be horizontal. In this case, each of the support rollers below the substrate 2 may be provided with a plurality of bearings (see FIG. 6) for rotatably supporting the support roller.
(第3の実施形態)
 図7は、本発明の第3の実施形態に係る描画装置の露光部を示す模式図であり、描画装置における基板2の搬送経路のうち、露光処理エリアR近傍の構成を示している。
Third Embodiment
FIG. 7 is a schematic diagram showing an exposure section of a drawing apparatus according to a third embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
 図7に示す露光部4Bは、基板2に露光用のビームLを照射するように設けられた複数の露光ヘッド41A~44Aと、露光処理エリアRの少なくとも一部において、基板2が該基板2の厚さ方向において湾曲するように基板2を保持するように構成された保持手段とを備える。露光ヘッド41A~44Aの構成は、第2の実施形態と同様であり、基板2はビームLの照射領域を通過する際に水平方向に搬送される。また、本実施形態において、保持手段は、基板2を裏面2b側(下方)から支持する支持ローラ61~64と、基板2の表面2a側(上方)に配置された補助ローラ66~68とを有する。 The exposure section 4B shown in FIG. 7 includes a plurality of exposure heads 41A-44A arranged to irradiate the substrate 2 with an exposure beam L, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R. The configuration of the exposure heads 41A-44A is the same as in the second embodiment, and the substrate 2 is transported horizontally as it passes through the irradiation area of the beam L. In this embodiment, the holding means includes support rollers 61-64 that support the substrate 2 from the back surface 2b side (below) and auxiliary rollers 66-68 arranged on the front surface 2a side (above) of the substrate 2.
 本実施形態において、表面2a側の2つの露光ヘッド41A,43Aと、裏面2b側の2つの露光ヘッド42A、44Aとは、それぞれ、互いに対向する位置に配置されている。これにより、互いに対向する露光ヘッド41A及び露光ヘッド42Aの組は、基板2の長手方向における同一の領域に向けてビームLを両面から照射することができる。露光ヘッド43A,44Aの組についても同様である。 In this embodiment, the two exposure heads 41A, 43A on the front surface 2a and the two exposure heads 42A, 44A on the back surface 2b are positioned opposite each other. This allows the pair of opposing exposure heads 41A and 42A to irradiate the beam L from both sides toward the same area in the longitudinal direction of the substrate 2. The same applies to the pair of exposure heads 43A, 44A.
 支持ローラ61~64のうち、上流側の2つの支持ローラ61,62の組は、上流側の2つの露光ヘッド41A,42Aの組から出射するビームLによる照射領域の上流側及び下流側において、裏面2b側に互いに若干の間隔を空けて配置され、基板2を搬送可能に支持している。2つの支持ローラ61,62の間隔は、裏面2b側の露光ヘッド42Aから出射したビームLが基板2に到達可能な程度であれば良い。下流側の2つの支持ローラ63,64の組についても、同様である。これらの支持ローラ61~64は、基板2と接触する外周面の上端領域同士が同一平面となるように配置されており、少なくとも、支持ローラ61と支持ローラ62との間、及び支持ローラ63と支持ローラ64との間の領域においては、基板2がビームLと直交する平面状のまま搬送される。 Of the support rollers 61-64, the pair of two upstream support rollers 61, 62 are arranged on the back surface 2b side at a slight distance from each other, upstream and downstream of the irradiation area by the beam L emitted from the pair of two upstream exposure heads 41A, 42A, and support the substrate 2 so that it can be transported. The distance between the two support rollers 61, 62 may be such that the beam L emitted from the exposure head 42A on the back surface 2b side can reach the substrate 2. The same is true for the pair of two downstream support rollers 63, 64. These support rollers 61-64 are arranged so that the upper end areas of the outer circumferential surfaces that come into contact with the substrate 2 are flush with each other, and at least in the areas between the support rollers 61 and 62, and between the support rollers 63 and 64, the substrate 2 is transported in a plane perpendicular to the beam L.
 また、各支持ローラ61~64の外周面に接触して各支持ローラ61~64を回転可能に支持する複数のベアリング65を更に設けても良い。複数のベアリング65は、各支持ローラ61~64の回転軸と平行な方向に沿って複数箇所に分散して配置される(図6のベアリング57参照)。 Furthermore, a plurality of bearings 65 may be provided that contact the outer circumferential surface of each of the support rollers 61 to 64 and rotatably support each of the support rollers 61 to 64. The plurality of bearings 65 are disposed at a plurality of locations along a direction parallel to the rotation axis of each of the support rollers 61 to 64 (see bearing 57 in FIG. 6).
 補助ローラ66は、露光ヘッド41A~44Aのうち、最も上流側に位置する露光ヘッド41A,42Aから出射したビームLによる照射領域の上流側に設けられた支持ローラ61よりもさらに上流側の表面2a(基板2に対して支持ローラ61,62の反対側)に配置されている。また、補助ローラ68は、露光ヘッド41A~44Aのうち、最も下流側に位置する露光ヘッド43A,44Aから出射したビームLによる照射領域の下流側に設けられた支持ローラ64よりもさらに下流側の表面2a(基板2に対して支持ローラ63,64の反対側)に配置されている。 The auxiliary roller 66 is disposed on the surface 2a further upstream of the support roller 61 (on the opposite side of the substrate 2 to the support rollers 61 and 62) which is disposed upstream of the irradiation area by the beam L emitted from the exposure heads 41A and 42A which are located most upstream among the exposure heads 41A to 44A. The auxiliary roller 68 is disposed on the surface 2a further downstream of the support roller 64 (on the opposite side of the substrate 2 to the support rollers 63 and 64) which is disposed downstream of the irradiation area by the beam L emitted from the exposure heads 43A and 44A which are located most downstream among the exposure heads 41A to 44A.
 補助ローラ66,68は、それぞれ、補助ローラ66,68の外周面が、支持ローラ61,62間及び支持ローラ63,64間における基板2の面(平面)よりも支持ローラ61~64の回転軸側にはみ出すように配置されている。これにより、支持ローラ61~64の上流側及び下流側において、基板2を厚さ方向に湾曲させることができる。 The auxiliary rollers 66, 68 are arranged so that the outer circumferential surfaces of the auxiliary rollers 66, 68 extend beyond the surface (flat surface) of the substrate 2 between the support rollers 61, 62 and between the support rollers 63, 64 toward the rotation axis of the support rollers 61 to 64. This allows the substrate 2 to be curved in the thickness direction on the upstream and downstream sides of the support rollers 61 to 64.
 また、露光ヘッド41A,42A及び露光ヘッド43A,44Aからそれぞれ出射したビームLによる2箇所の照射領域の間の表面2a側に、補助ローラ67を配置しても良い。補助ローラ67は、該補助ローラ67の外周面のうち基板2と接する領域が、支持ローラ61,62間及び支持ローラ63,64間における基板2の面(平面)と同一面となるように配置することができる。この場合、互いに隣り合う2箇所の照射領域の間においても、基板2を平面状のまま搬送することができる。また、補助ローラ67の外周面が上記平面よりも支持ローラ61~64の回転軸側にはみ出すように、補助ローラ67を配置しても良い。この場合、互いに隣り合う照射領域の間において基板2を厚さ方向に湾曲させることができる。いずれの場合においても、補助ローラ67を配置することで、基板2の撓みを抑制する効果を向上させることができる。 Also, an auxiliary roller 67 may be arranged on the surface 2a side between two irradiation areas by the beams L emitted from the exposure heads 41A, 42A and the exposure heads 43A, 44A. The auxiliary roller 67 may be arranged so that the area of the outer circumferential surface of the auxiliary roller 67 that contacts the substrate 2 is flush with the surface (plane) of the substrate 2 between the support rollers 61, 62 and between the support rollers 63, 64. In this case, the substrate 2 can be transported in a flat state even between two adjacent irradiation areas. The auxiliary roller 67 may also be arranged so that the outer circumferential surface of the auxiliary roller 67 protrudes from the plane toward the rotation axis of the support rollers 61 to 64. In this case, the substrate 2 can be curved in the thickness direction between the adjacent irradiation areas. In either case, the auxiliary roller 67 can be arranged to improve the effect of suppressing the bending of the substrate 2.
 本実施形態によれば、ビームLの照射領域においては基板2を平面状に保ちつつ、照射領域の外側の領域においては基板2を厚さ方向に湾曲させ、基板2の撓みを抑制することができる。 According to this embodiment, the substrate 2 is kept flat in the irradiation area of the beam L, while the substrate 2 is curved in the thickness direction in the area outside the irradiation area, thereby suppressing bending of the substrate 2.
(第4の実施形態)
 図8は、本発明の第4の実施形態に係る描画装置の露光部を示す模式図であり、描画装置における基板2の搬送経路のうち、露光処理エリアR近傍の構成を示している。
Fourth Embodiment
FIG. 8 is a schematic diagram showing an exposure section of a drawing apparatus according to a fourth embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
 図8に示す露光部4Cは、基板2に露光用のビームLを照射するように設けられた複数の露光ヘッド41A~44Aと、露光処理エリアRの少なくとも一部において、基板2が該基板2の厚さ方向において湾曲するように基板2を保持するように構成された保持手段とを備える。露光ヘッド41A~44Aの構成は、第2の実施形態と同様であり、基板2はビームLの照射領域を通過する際に水平方向に搬送される。本実施形態において、保持手段は、基板2にエアを吹き付けることにより非接触で基板2を保持するように構成された複数のエアステージ71~78を有する。また、エアステージ71~77の上流側には搬送ローラ81が設置され、同下流側にはサクションローラ82が設置されている。 The exposure section 4C shown in FIG. 8 includes a plurality of exposure heads 41A-44A arranged to irradiate the substrate 2 with an exposure beam L, and a holding means configured to hold the substrate 2 so that the substrate 2 is curved in the thickness direction of the substrate 2 in at least a portion of the exposure processing area R. The configuration of the exposure heads 41A-44A is the same as in the second embodiment, and the substrate 2 is transported horizontally as it passes through the irradiation area of the beam L. In this embodiment, the holding means has a plurality of air stages 71-78 configured to hold the substrate 2 in a non-contact manner by blowing air onto the substrate 2. In addition, a transport roller 81 is provided upstream of the air stages 71-77, and a suction roller 82 is provided downstream of the air stages 71-77.
 本実施形態において、表面2a側の2つの露光ヘッド41A,43Aと、裏面2b側の2つの露光ヘッド42A、44Aとは、それぞれ、互いに対向する位置に配置されている。これにより、互いに対向する露光ヘッド41A及び露光ヘッド42Aの組は、基板2の長手方向における同一の領域に向けてビームLを両面から照射することができる。露光ヘッド43A,44Aの組についても同様である。 In this embodiment, the two exposure heads 41A, 43A on the front surface 2a and the two exposure heads 42A, 44A on the back surface 2b are positioned opposite each other. This allows the pair of opposing exposure heads 41A and 42A to irradiate the beam L from both sides toward the same area in the longitudinal direction of the substrate 2. The same applies to the pair of exposure heads 43A, 44A.
 サクションローラ82は、表面に多数の孔又はスリットが形成されたローラにバキューム機構が設けられた装置である。サクションローラ82を回転させる駆動機構82aとしては、サーボモータと減速機の組み合わせ、又は、ダイレクトドライブモータのように、回転を高精度に制御できる機構を用いることが好ましい。サクションローラ82は、基板2をバキューム吸着しながら搬送する。これにより、基板2のスリップを防ぎ、基板2を所定の速度で正確にエアステージ71~78が設けられた領域を通過させることができる。搬送ローラ81の近傍には、位置センサ83が設けられており、該位置センサ83の検出信号に基づいて、駆動機構82aの動作、即ち、基板2の搬送開始のタイミングや搬送速度を制御することができる。 The suction roller 82 is a device in which a vacuum mechanism is attached to a roller with many holes or slits formed on its surface. As the drive mechanism 82a that rotates the suction roller 82, it is preferable to use a mechanism that can control the rotation with high precision, such as a combination of a servo motor and a reducer, or a direct drive motor. The suction roller 82 transports the substrate 2 while vacuum adsorbing it. This prevents the substrate 2 from slipping, and allows the substrate 2 to pass through the area where the air stages 71 to 78 are provided accurately at a predetermined speed. A position sensor 83 is provided near the transport roller 81, and the operation of the drive mechanism 82a, i.e., the timing at which the substrate 2 begins to be transported and the transport speed, can be controlled based on the detection signal of the position sensor 83.
 各エアステージ71~78には、エア供給管70から供給されるエアを流通させ、ステージの表面から噴出させる流路79が形成されている。エア供給管70には、精密レギュレータ70aが設けられている。精密レギュレータ70aは、エアステージ71~78にそれぞれ設けられた圧力センサP1~P5から入力される圧力値に基づいて、エア供給管70から各エアステージ71~78に供給されるエアの圧力を調整する。これにより、各エアステージ71~78から所定の圧力でエアが噴出されるようにフィードバック制御することができる。なお、図8においては、エア供給管70及び精密レギュレータ70aを1箇所にのみ図示しているが、各エアステージ71~78にエア供給管及び精密レギュレータ70aを設け、エアステージ毎にエアの圧力を調整しても良い。 Each air stage 71-78 has a flow path 79 that allows the air supplied from the air supply pipe 70 to flow and be sprayed from the surface of the stage. The air supply pipe 70 is provided with a precision regulator 70a. The precision regulator 70a adjusts the pressure of the air supplied from the air supply pipe 70 to each air stage 71-78 based on the pressure values input from the pressure sensors P1-P5 provided on the air stages 71-78, respectively. This allows feedback control so that air is sprayed from each air stage 71-78 at a predetermined pressure. Note that in FIG. 8, the air supply pipe 70 and precision regulator 70a are shown in only one location, but it is also possible to provide an air supply pipe and precision regulator 70a on each air stage 71-78 and adjust the air pressure for each air stage.
 図9は、図8に示すエアステージ上を搬送される基板を拡大して示す模式図である。なお、図9においては、エアステージの構造を理解し易くするため、基板2の表面2a側に設けられたエアステージ73,75,77を取り外した状態を示している。エアステージ71~78の表面であるエア噴出面71a~78aには、流路79を導入されたエアを噴出する複数のエア噴出口80が配列されている。これらのエア噴出口80から所定の圧力でエアを噴出させることにより、基板2を非接触の状態で保持し、搬送することができる。 FIG. 9 is an enlarged schematic diagram of a substrate being transported on the air stage shown in FIG. 8. Note that in FIG. 9, the air stages 73, 75, and 77 provided on the surface 2a side of the substrate 2 are shown removed to make it easier to understand the structure of the air stages. A number of air outlets 80 that eject air introduced through a flow path 79 are arranged on the air ejection surfaces 71a to 78a, which are the surfaces of the air stages 71 to 78. By ejecting air at a predetermined pressure from these air outlets 80, the substrate 2 can be held and transported in a non-contact state.
 露光ヘッド41A,42Aの組から出射するビームLによる照射領域の上流側には、1組のエアステージ72,73が配置されている。このうち、エアステージ72は、基板2の裏面2b側に配置され、基板2の長手方向に湾曲するエア噴出面72aを有する。また、エアステージ73は、基板2の表面2a側に配置され、エア噴出面72aと対向し、該エア噴出面72aと均一の間隔で離れたエア噴出面73bを有する。 A pair of air stages 72, 73 are arranged upstream of the irradiation area by the beam L emitted from the pair of exposure heads 41A, 42A. Of these, air stage 72 is arranged on the back surface 2b side of substrate 2, and has an air ejection surface 72a that curves in the longitudinal direction of substrate 2. Air stage 73 is arranged on the front surface 2a side of substrate 2, and has an air ejection surface 73b that faces air ejection surface 72a and is spaced apart from air ejection surface 72a at a uniform interval.
 また、露光ヘッド43A,44Aの組から出射するビームLによる照射領域の下流側には、1組のエアステージ76,77が配置されている。このうち、エアステージ76は、基板2の裏面2b側に配置され、基板2の長手方向に湾曲するエア噴出面76aを有する。また、エアステージ77は、基板2の表面2a側に配置され、エア噴出面76aと対向し、該エア噴出面76aと均一の間隔で離れたエア噴出面77aを有する。 Furthermore, a pair of air stages 76, 77 are arranged downstream of the irradiation area by the beam L emitted from the pair of exposure heads 43A, 44A. Of these, air stage 76 is arranged on the back surface 2b side of substrate 2, and has an air ejection surface 76a that curves in the longitudinal direction of substrate 2. Furthermore, air stage 77 is arranged on the front surface 2a side of substrate 2, and has an air ejection surface 77a that faces air ejection surface 76a and is spaced apart from air ejection surface 76a at a uniform interval.
 これらエアステージ72,73,76,77によって基板2の両面にエアを吹き付けることにより、ビームLの照射領域の上流側及び下流側において基板2を厚さ方向に湾曲させつつ、基板を非接触で保持することができる。 By blowing air onto both sides of the substrate 2 using these air stages 72, 73, 76, and 77, the substrate 2 can be curved in the thickness direction on the upstream and downstream sides of the irradiation area of the beam L while being held in a non-contact manner.
 エアステージ72,73の上流側には、基板2の長手方向において湾曲するエア噴出面71aを有するエアステージ71が配置されている。また、エアステージ76,77の下流側には、基板2の長手方向において湾曲するエア噴出面78aを有するエアステージ78が配置されている。このようなエアステージ71,78を設けることにより、搬送ローラ81からエアステージ72,73に向けて、及び、エアステージ76,77からサクションローラ82に向けて、基板2を緩やかに湾曲させた状態で送り出すことができる。 Upstream of the air stages 72 and 73, an air stage 71 is arranged, which has an air ejection surface 71a that curves in the longitudinal direction of the substrate 2. Further, downstream of the air stages 76 and 77, an air stage 78 is arranged, which has an air ejection surface 78a that curves in the longitudinal direction of the substrate 2. By providing such air stages 71 and 78, the substrate 2 can be sent out in a gently curved state from the transport rollers 81 towards the air stages 72 and 73, and from the air stages 76 and 77 towards the suction rollers 82.
 露光ヘッド41A,42Aの組及び露光ヘッド43A,44Aの組から出射するビームLによる2箇所の照射領域の間には、1組のエアステージ74,75が配置されている。エアステージ72,73とエアステージ74,75との間隔、及び、エアステージ74,75とエアステージ76,77との間隔は、露光ヘッド41A~44Aから出射したビームLが基板2に到達可能な程度であれば良い。 A pair of air stages 74, 75 are disposed between two irradiation areas by the beam L emitted from the pair of exposure heads 41A, 42A and the pair of exposure heads 43A, 44A. The distance between the air stages 72, 73 and the air stages 74, 75, and the distance between the air stages 74, 75 and the air stages 76, 77 need only be sufficient to allow the beam L emitted from the exposure heads 41A to 44A to reach the substrate 2.
 エアステージ74は、基板2の裏面2b側に配置され、平面状のエア噴出面74aを有する。また、エアステージ75は、基板2の表面2a側に配置され、エア噴出面74aと対向し、エア噴出面74aと均一の間隔で離れたエア噴出面75aを有する。このようなエアステージ74,75を設けることにより、露光ヘッド41A,42Aから出射するビームLによる照射領域と、露光ヘッド43A,44Aから出射するビームLによる照射領域との間において、基板2を平面状のまま非接触で保持し、搬送することができる。 Air stage 74 is disposed on the rear surface 2b side of substrate 2, and has a planar air ejection surface 74a. Air stage 75 is disposed on the front surface 2a side of substrate 2, and faces air ejection surface 74a, and has air ejection surface 75a spaced at a uniform distance from air ejection surface 74a. By providing air stages 74, 75 like these, substrate 2 can be held and transported in a planar, non-contact manner between the irradiation area by beam L emitted from exposure heads 41A, 42A and the irradiation area by beam L emitted from exposure heads 43A, 44A.
 本実施形態によれば、ビームLの照射領域の上流側及び下流側において、湾曲したエア噴出面を有するエアステージ72,73,76,66により基板2を非接触で保持するので、基板2の厚さ方向における撓みを抑制することができる。また、基板2を湾曲させて保持することにより、ビームLの照射領域における基板2の幅方向における撓みを抑制することができる。 According to this embodiment, the substrate 2 is held in a non-contact manner by air stages 72, 73, 76, and 66 having curved air ejection surfaces on the upstream and downstream sides of the irradiation area of the beam L, so that deflection of the substrate 2 in the thickness direction can be suppressed. In addition, by holding the substrate 2 in a curved manner, deflection of the substrate 2 in the width direction in the irradiation area of the beam L can be suppressed.
 また、本実施形態によれば、エアステージ71~78の下流側にサクションローラ82を設けるので、搬送ローラ81とサクションローラ82との間において非接触で保持される基板2を、適切なテンションをかけながら搬送することができる。 In addition, according to this embodiment, suction rollers 82 are provided downstream of the air stages 71 to 78, so the substrate 2, which is held in a non-contact manner between the transport rollers 81 and suction rollers 82, can be transported with appropriate tension.
 なお、本実施形態においては、基板2の両面にビームLを照射する露光ヘッドの組を2組設けたが、露光ヘッドの組をさらに設けても良い。この場合、露光ヘッドの組数に応じて、隣り合うビームLの照射領域の間に配置されるエアステージ74,75をさらに設ければ良い。 In this embodiment, two sets of exposure heads are provided to irradiate the beam L onto both sides of the substrate 2, but more sets of exposure heads may be provided. In this case, it is sufficient to provide more air stages 74, 75 arranged between adjacent irradiation areas of the beam L according to the number of sets of exposure heads.
(第5の実施形態)
 図10は、本発明の第5の実施形態に係る描画装置の露光部を示す模式図であり、描画装置における基板2の搬送経路のうち、露光処理エリアR近傍の構成を示している。
 図10に示す露光部4Dは、図8に示す露光部4Cのエアステージ74,75の代わりに、エアステージ85,86を有する。エアステージ85,86以外の露光部4Dの各部の構成は、露光部4Cの各部の構成と同様である。
Fifth Embodiment
FIG. 10 is a schematic diagram showing an exposure section of a drawing apparatus according to a fifth embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
Exposure section 4D shown in Fig. 10 has air stages 85 and 86 instead of air stages 74 and 75 of exposure section 4C shown in Fig. 8. The configuration of each part of exposure section 4D other than air stages 85 and 86 is similar to the configuration of each part of exposure section 4C.
 ここで、露光ヘッド41A~44Aから出射したビームLによる照射領域の上流側に配置されたエアステージ72,73のエア噴出面72a,73aと、同下流側に配置されたエアステージ76,77のエア噴出面76a,77aとは、互いに同じ向き(図10においては上に凸)に湾曲している。 Here, the air ejection surfaces 72a, 73a of the air stages 72, 73 arranged upstream of the irradiation area by the beam L emitted from the exposure heads 41A to 44A, and the air ejection surfaces 76a, 77a of the air stages 76, 77 arranged downstream of the same irradiation area, are curved in the same direction (upward convex in FIG. 10).
 これに対し、基板2の裏面2b側に配置されたエアステージ85のエア噴出面85aは、基板2の長手方向において、エア噴出面72a,73a,76a,77aとは反対の向き(図10においては下に凸)に湾曲している。また、基板2の表面2a側に配置されたエアステージ86のエア噴出面86aは、上記エア噴出面85aと対向し、エア噴出面85aと均一の間隔で離れたエア噴出面86aを有する。エアステージ85,86は、基板2を、エアステージ72,73,76,77における基板2とは反対の向きに湾曲させつつ非接触で保持するように構成されている。この場合において、露光ヘッド41A~44Aは、湾曲する基板2を側方から見た場合に、極大点又は極小点となる領域にビームLが照射されるように位置調整されることが好ましい。 In contrast, the air ejection surface 85a of the air stage 85 arranged on the back surface 2b side of the substrate 2 is curved in the opposite direction to the air ejection surfaces 72a, 73a, 76a, and 77a in the longitudinal direction of the substrate 2 (convex downward in FIG. 10). The air ejection surface 86a of the air stage 86 arranged on the front surface 2a side of the substrate 2 faces the air ejection surface 85a and has an air ejection surface 86a spaced apart from the air ejection surface 85a at a uniform interval. The air stages 85 and 86 are configured to hold the substrate 2 in a non-contact manner while bending it in the opposite direction to the substrate 2 on the air stages 72, 73, 76, and 77. In this case, it is preferable that the exposure heads 41A to 44A are positioned so that the beam L is irradiated to an area that is a maximum or minimum point when the curved substrate 2 is viewed from the side.
 このように、隣り合うビームLの照射領域の間においても基板2を湾曲させることにより、基板2の幅方向における撓みをさらに抑制することが可能となる。 In this way, by curving the substrate 2 even between the irradiation areas of adjacent beams L, it is possible to further suppress the bending of the substrate 2 in the width direction.
 なお、本実施形態においては、基板2の両面にビームLを照射する露光ヘッドの組を2組設けたが、露光ヘッドの組をさらに設けても良い。この場合、露光ヘッドの組数に応じて、隣り合うビームLの照射領域の間に配置されるエアステージ85,86をさらに設ければ良い。 In this embodiment, two sets of exposure heads are provided to irradiate the beam L onto both sides of the substrate 2, but more sets of exposure heads may be provided. In this case, it is sufficient to provide more air stages 85, 86 that are positioned between the irradiation areas of adjacent beams L according to the number of sets of exposure heads.
(第6の実施形態)
 図11は、本発明の第6の実施形態に係る描画装置の露光部を示す模式図であり、描画装置における基板2の搬送経路のうち、露光処理エリアR近傍の構成を示している。
 図11に示す露光部4Eは、図8に示す露光部4Cに対し、隣り合うビームLの照射領域の間において基板2の表面2a側に配置されたエアステージ75を省略したものである。
Sixth Embodiment
FIG. 11 is a schematic diagram showing an exposure section of a drawing apparatus according to a sixth embodiment of the present invention, and shows the configuration in the vicinity of an exposure processing area R on the transport path of the substrate 2 in the drawing apparatus.
Exposure section 4E shown in FIG. 11 is different from exposure section 4C shown in FIG. 8 in that air stage 75 arranged on the front surface 2a side of substrate 2 between adjacent irradiation areas of beam L is omitted.
 エアステージ75を省略した場合であっても、サクションローラ82により基板2にかけられるテンションと、エアステージ71~74,76~78から噴出するエアの圧力とを適切に調整することにより、エアステージ74の上方において、エア噴出面74aからの基板2の浮上量を一定に維持し、平面状のまま非接触で基板2を搬送することができる。この場合、基板2の表面2a側の露光ヘッド41A,43Aにより、エアステージ74の上方の基板領域にビームLを照射できるようになり、露光ヘッド41A,43Aの配置や、描画パターンのデータ設計の自由度を高めることが可能となる。 Even if the air stage 75 is omitted, by appropriately adjusting the tension applied to the substrate 2 by the suction roller 82 and the pressure of the air ejected from the air stages 71-74, 76-78, the amount of levitation of the substrate 2 from the air ejection surface 74a above the air stage 74 can be maintained constant, and the substrate 2 can be transported without contact while remaining flat. In this case, the exposure heads 41A, 43A on the front surface 2a side of the substrate 2 can irradiate the beam L onto the substrate area above the air stage 74, allowing greater freedom in the arrangement of the exposure heads 41A, 43A and in the data design of the drawing pattern.
 以上説明した本発明は、上記第1~第6の実施形態及び変形例に限定されるものではなく、上記第1~第6の実施形態及び変形例に開示されている複数の構成要素を適宜組み合わせることによって、種々の発明を形成することができる。例えば、第1~第6の実施形態及び変形例に示した全構成要素からいくつかの構成要素を除外して形成しても良いし、第1~第6の実施形態及び変形例に示した構成要素を適宜組み合わせて形成しても良い。 The present invention described above is not limited to the above first to sixth embodiments and modifications, and various inventions can be formed by appropriately combining multiple components disclosed in the above first to sixth embodiments and modifications. For example, some components may be removed from all the components shown in the first to sixth embodiments and modifications, or the components shown in the first to sixth embodiments and modifications may be appropriately combined to form various inventions.
 1…描画装置、2…基板、2a…表面、2b…裏面、3…搬送システム、4・4A・4B・4C・4D・4E…露光部、5…制御装置、31…巻出しリール、31a・32a・33a・34a・45a~48a…回転軸、32…巻取りリール、33…案内ローラ、34…テンションプーリ、37・38…カメラ、39…ゴミ取り装置、41~44・41A~44A…露光ヘッド、45~48…支持ローラ、49・55・56・66~68…補助ローラ、51~54・61~64…支持ローラ、57・65…ベアリング、70…エア供給管、70a…精密レギュレータ、71~78・85・86…エアステージ、71a~78a・85a・86a…エア噴出面、79…流路、80…エア噴出口、81…搬送ローラ、82…サクションローラ、82a…駆動機構、83…位置センサ、411…レーザ光源、412…ビーム成形光学系、413…反射ミラー、414…ポリゴンミラー、414a…回転軸、415…結像光学系、P1~P5…圧力センサ、PA1…描画領域、SA1…照射領域 1...imaging device, 2...substrate, 2a...front surface, 2b...back surface, 3...transport system, 4, 4A, 4B, 4C, 4D, 4E...exposure section, 5...control device, 31...unwinding reel, 31a, 32a, 33a, 34a, 45a-48a...rotating shaft, 32...take-up reel, 33...guide roller, 34...tension pulley, 37, 38...camera, 39...dust removal device, 41-44, 41A-44A...exposure head, 45-48...support roller, 49, 55, 56, 66-68...auxiliary roller, 51-54, 61-64...support roller, 57, 65...bearing, 70...air supply pipe, 70a...precision regulator, 71-78, 85, 86...air stage, 71a-78a, 85a, 86a...air outlet surface, 79...flow path, 80...air outlet, 81...transport roller, 82...suction roller, 82a...driving mechanism, 83...position sensor, 411...laser light source, 412...beam shaping optical system, 413...reflection mirror, 414...polygon mirror, 414a...rotation axis, 415...imaging optical system, P1-P5...pressure sensor, PA1...drawing area, SA1...irradiation area

Claims (11)

  1.  長尺のシート状をなす基板の搬送経路内の所定範囲において、前記基板の第1の主面に露光用のビームを照射するように設けられ、且つ、前記基板の長手方向において互いに離れた位置に配置された複数の第1の露光ヘッドと、
     前記所定範囲において、前記基板の前記第1の主面の反対側の面である第2の主面に露光用のビームを照射するように設けられ、且つ、前記基板の長手方向において互いに離れた位置に配置された複数の第2の露光ヘッドと、
     前記所定範囲の少なくとも一部において、前記基板が該基板の厚さ方向において湾曲するように前記基板を保持するように構成された保持手段と、
    を備える描画装置。
    a plurality of first exposure heads arranged to irradiate a first main surface of a long sheet-like substrate with an exposure beam within a predetermined range within a transport path of the substrate, and disposed at positions spaced apart from each other in a longitudinal direction of the substrate;
    a plurality of second exposure heads arranged to irradiate an exposure beam onto a second main surface of the substrate, the second main surface being the surface opposite to the first main surface, within the predetermined range, and disposed at positions spaced apart from each other in a longitudinal direction of the substrate;
    a holding means configured to hold the substrate such that the substrate is curved in a thickness direction of the substrate in at least a portion of the predetermined range;
    A drawing device comprising:
  2.  前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、それぞれ、互いに対向する位置に配置され、
     互いに対向する位置に配置された第1及び第2の露光ヘッドからなる1組の露光ヘッドは、前記基板の長手方向における同一の領域に向けて露光用のビームを両面から照射するように構成され、
     前記保持手段は、複数組の露光ヘッドから出射するビームにより照射される複数の領域の上流側及び下流側に配置された2組のエアステージを有し、
     各組のエアステージは、
     前記基板の第1の主面側に配置され、前記基板の長手方向に湾曲する第1のエア噴出面を有する第1のエアステージと、
     前記基板の第2の主面側に配置され、前記第1のエア噴出面と対向し、前記第1のエア噴出面と均一の間隔で離れた第2のエア噴出面を有する第2のエアステージと、
    を含み、前記基板の第1及び第2の主面にエアを吹き付けることにより、前記基板を非接触で保持するように構成されている、
    請求項1に記載の描画装置。
    the first exposure heads and the second exposure heads are disposed in positions facing each other,
    a pair of exposure heads, each consisting of a first exposure head and a second exposure head arranged at positions opposite to each other, are configured to irradiate an exposure beam from both sides toward the same area in the longitudinal direction of the substrate;
    the holding means has two sets of air stages arranged on the upstream side and downstream side of a plurality of regions irradiated with beams emitted from a plurality of sets of exposure heads,
    The air stage for each group is as follows:
    a first air stage disposed on a first main surface side of the substrate and having a first air ejection surface curved in a longitudinal direction of the substrate;
    a second air stage disposed on a second main surface side of the substrate, facing the first air jetting surface and having a second air jetting surface spaced at a uniform interval from the first air jetting surface;
    and configured to hold the substrate in a non-contact manner by blowing air onto the first and second main surfaces of the substrate.
    The drawing device according to claim 1 .
  3.  前記保持手段は、互いに隣り合う組の露光ヘッドから出射するビームにより照射される2つの領域の間に配置された1組のエアステージをさらに有し、
     前記1組のエアステージは、
     前記基板の第1の主面側に配置され、平面状の第3のエア噴出面を有する第3のエアステージと、
     前記基板の第2の主面側に配置され、前記第3のエア噴出面と対向し、前記第3のエア噴出面と均一の間隔で離れた第4のエア噴出面を有する第4のエアステージと、
    を含み、前記基板の第1及び第2の主面にエアを吹き付けることにより、前記基板を非接触で平面状に保持するように構成されている、
    請求項2に記載の描画装置。
    the holding means further includes a pair of air stages disposed between two regions irradiated by beams emitted from adjacent pairs of exposure heads;
    The set of air stages includes:
    a third air stage disposed on the first main surface side of the substrate and having a planar third air ejection surface;
    a fourth air stage disposed on the second main surface side of the substrate, facing the third air jetting surface and having a fourth air jetting surface spaced at a uniform interval from the third air jetting surface;
    and configured to hold the substrate in a non-contact, flat state by blowing air onto the first and second main surfaces of the substrate.
    The drawing device according to claim 2.
  4.  前記2組のエアステージにおいて、前記第1のエア噴出面は互いに同じ向きに湾曲し、
     前記保持手段は、互いに隣り合う組の露光ヘッドから出射するビームにより照射される2つの領域の間に配置された1組のエアステージをさらに有し、
     前記1組のエアステージは、
     前記基板の第1の主面側に配置され、前記基板の長手方向において前記第1のエア噴出面とは反対の向きに湾曲する第3のエア噴出面を有する第3のエアステージと、
     前記基板の第2の主面側に配置され、前記第3のエア噴出面と対向し、前記第3のエア噴出面と均一の間隔で離れた第4のエア噴出面を有する第4のエアステージと、
    を含み、前記基板の第1及び第2の主面にエアを吹き付けることにより、前記基板を非接触で該基板の長手方向において湾曲させた状態で保持するように構成されている、
    請求項2に記載の描画装置。
    In the two sets of air stages, the first air ejection surfaces are curved in the same direction,
    the holding means further includes a pair of air stages disposed between two regions irradiated by beams emitted from adjacent pairs of exposure heads;
    The set of air stages includes:
    a third air stage disposed on the first main surface side of the substrate and having a third air jetting surface curved in an opposite direction to the first air jetting surface in the longitudinal direction of the substrate;
    a fourth air stage disposed on the second main surface side of the substrate, facing the third air jetting surface and having a fourth air jetting surface spaced at a uniform interval from the third air jetting surface;
    and configured to hold the substrate in a curved state in a longitudinal direction of the substrate without contact by blowing air onto the first and second main surfaces of the substrate.
    The drawing device according to claim 2.
  5.  前記基板は、前記ビームにより照射される領域を通過する際に水平方向に搬送され、
     前記保持手段は、互いに隣り合う組の露光ヘッドから出射するビームにより照射される2つの領域の間、且つ、前記基板の下方に配置され、平面状のエア噴出面を有し、前記基板に下方からエアを吹き付けることにより前記基板を非接触で平面状に保持するように構成された第3のエアステージをさらに有する、
    請求項2に記載の描画装置。
    the substrate is transported horizontally as it passes through an area irradiated by the beam;
    the holding means further includes a third air stage that is disposed below the substrate and between two regions irradiated by beams emitted from adjacent sets of exposure heads, has a planar air ejection surface, and is configured to hold the substrate flat in a non-contact manner by blowing air onto the substrate from below;
    The drawing device according to claim 2.
  6.  前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、それぞれ、互いに対向する位置に配置され、
     互いに対向する位置に配置された第1及び第2の露光ヘッドからなる1組の露光ヘッドは、前記基板の長手方向における同一の領域に向けて露光用のビームを両面から照射するように構成され、
     前記保持手段は、
     各組の露光ヘッドから出射したビームにより照射される領域の上流側及び下流側において、一方の主面側に設けられ、前記基板を搬送可能に支持するように構成された2つの支持ローラと、
     複数組の露光ヘッドのうち最も上流側に位置する組の露光ヘッドから出射したビームにより照射される領域の上流側に設けられた前記支持ローラよりもさらに上流側、且つ、前記基板の他方の主面側に設けられた第1の補助ローラと、
     前記複数組の露光ヘッドのうち最も下流側に位置する露光ヘッドから出射したビームにより照射される領域の下流側に設けられた前記支持ローラよりもさらに下流側、且つ、前記基板の他方の主面側に設けられた第2の補助ローラと、
    を有し、
     前記2つの支持ローラは、該2つの支持ローラの外周面のうち前記基板と接する領域同士が同一の平面となるように配置され、
     前記第1及び第2の補助ローラは、それぞれ、該第1及び第2の補助ローラの外周面が前記平面よりも前記2つの支持ローラの回転軸側にはみ出すように配置されている、
    請求項1に記載の描画装置。
    the first exposure heads and the second exposure heads are disposed in positions facing each other,
    a pair of exposure heads, each consisting of a first exposure head and a second exposure head arranged at positions opposite to each other, are configured to irradiate an exposure beam from both sides toward the same area in the longitudinal direction of the substrate;
    The holding means is
    two support rollers provided on one of the main surfaces of the substrate, on the upstream side and downstream side of an area irradiated with the beams emitted from each set of exposure heads, and configured to support the substrate so as to be transportable;
    a first auxiliary roller provided on the other main surface side of the substrate, the first auxiliary roller being provided upstream of the support roller provided upstream of an area irradiated with beams emitted from an exposure head set located on the most upstream side among the plurality of exposure head sets;
    a second auxiliary roller provided downstream of the support roller provided downstream of an area irradiated with a beam emitted from the exposure head located most downstream among the plurality of sets of exposure heads, and on the other main surface side of the substrate;
    having
    the two support rollers are arranged such that the regions of the outer circumferential surfaces of the two support rollers that come into contact with the substrate are flush with each other;
    the first and second auxiliary rollers are disposed such that their outer circumferential surfaces extend beyond the plane toward the rotation shafts of the two support rollers;
    The drawing device according to claim 1 .
  7.  前記保持手段は、互いに隣り合う組の露光ヘッドから出射したビームにより照射される2つの領域の間、且つ、前記基板の前記他方の主面側に設けられた第3の補助ローラをさらに有し、
     前記第3の補助ローラは、該第3の補助ローラの外周面のうち前記基板と接する領域が、前記平面と同一面となるように、又は、該第3の補助ローラの外周面が前記平面よりも前記2つの支持ローラの回転軸側にはみ出すように配置されている、
    請求項6に記載の描画装置。
    the holding means further includes a third auxiliary roller provided between two regions irradiated with beams emitted from adjacent pairs of exposure heads and on the other main surface side of the substrate,
    the third auxiliary roller is disposed so that an area of the outer circumferential surface of the third auxiliary roller that contacts the substrate is flush with the plane, or so that the outer circumferential surface of the third auxiliary roller protrudes beyond the plane toward the rotation shafts of the two support rollers.
    7. The drawing device according to claim 6.
  8.  前記基板は、前記ビームにより照射される領域を通過する際に水平方向に搬送され、
     前記2つの支持ローラは、前記基板の下側に設けられ、
     前記保持手段は、前記2つの支持ローラの各々の外周面に接触して各支持ローラを回転可能に支持する複数のベアリングであって、各支持ローラの回転軸方向の複数箇所に分散して設けられた複数のベアリングをさらに有する、
    請求項6又は7に記載の描画装置。
    the substrate is transported horizontally as it passes through an area irradiated by the beam;
    The two support rollers are provided below the substrate,
    the holding means further includes a plurality of bearings that contact the outer circumferential surfaces of the two support rollers to rotatably support each of the support rollers, the plurality of bearings being provided at a plurality of locations in a rotation axis direction of each of the support rollers.
    8. The drawing device according to claim 6 or 7.
  9.  前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、互い違いに配置され、
     前記保持手段は、
     前記複数の第1の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第2の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第1の支持ローラと、
     前記複数の第2の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第1の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第2の支持ローラと、
    を有し、前記複数の第1及び第2の支持ローラは、該複数の第1及び第2の支持ローラの外周面のうち前記基板が架け渡される領域がジグザグとなるように配置されている、
    請求項1に記載の描画装置。
    the plurality of first exposure heads and the plurality of second exposure heads are arranged in a staggered manner,
    The holding means is
    a plurality of first support rollers that are respectively disposed on the second main surface side of a plurality of regions that are irradiated with beams emitted from the plurality of first exposure heads, and are configured to support the substrate so as to be transportable;
    a plurality of second support rollers that are respectively disposed on the first main surface side of a plurality of regions that are irradiated with the beams emitted from the plurality of second exposure heads, and are configured to support the substrate so as to be transportable;
    the first and second support rollers are arranged such that the regions of the outer circumferential surfaces of the first and second support rollers over which the substrate is laid are zigzag.
    The drawing device according to claim 1 .
  10.  前記複数の第1の露光ヘッドと前記複数の第2の露光ヘッドとは、互い違いに配置され、
     前記保持手段は、
     前記複数の第1の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第2の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第1の支持ローラと、
     前記複数の第2の露光ヘッドから出射したビームによりそれぞれ照射される複数の領域の第1の主面側にそれぞれ配置され、前記基板を搬送可能に支持するように構成された複数の第2の支持ローラと、
     前記複数の第1及び第2の支持ローラのうち最も上流側の支持ローラのさらに上流側、且つ、前記基板に対して該上流側の支持ローラの反対側に設けられた第1の補助ローラと、
     前記複数の第1及び第2の支持ローラのうち最も下流側の支持ローラのさらに下流側、且つ、前記基板に対して該下流側の支持ローラの反対側に設けられた第2の補助ローラと、
    を有し、
     前記複数の第1及び第2の支持ローラは、該複数の第1及び第2の支持ローラの外周面のうち前記基板と接する領域同士が同一の平面となるように配置され、
     前記第1の補助ローラは、該第1の補助ローラの外周面が前記平面よりも前記上流側の支持ローラの回転軸側にはみ出すように配置され、
     前記第2の補助ローラは、該第2の補助ローラの外周面が前記平面よりも前記下流側の支持ローラの回転軸側にはみ出すように配置されている、
    請求項1に記載の描画装置。
    the plurality of first exposure heads and the plurality of second exposure heads are arranged in a staggered manner,
    The holding means is
    a plurality of first support rollers that are respectively disposed on the second main surface side of a plurality of regions that are irradiated with beams emitted from the plurality of first exposure heads, and are configured to support the substrate so as to be transportable;
    a plurality of second support rollers that are respectively disposed on the first main surface side of a plurality of regions that are irradiated with the beams emitted from the plurality of second exposure heads, and are configured to support the substrate so as to be transportable;
    a first auxiliary roller provided upstream of a most upstream support roller among the first and second support rollers and on an opposite side of the upstream support roller with respect to the substrate;
    a second auxiliary roller provided downstream of the most downstream support roller among the first and second support rollers and on the opposite side of the downstream support roller with respect to the substrate;
    having
    the first and second support rollers are arranged such that regions of the outer circumferential surfaces of the first and second support rollers that come into contact with the substrate are flush with each other;
    the first auxiliary roller is disposed such that an outer circumferential surface of the first auxiliary roller protrudes beyond the plane toward a rotation shaft of the upstream support roller,
    the second auxiliary roller is disposed such that an outer circumferential surface of the second auxiliary roller protrudes beyond the plane toward a rotation shaft of the downstream support roller;
    The drawing device according to claim 1 .
  11.  前記基板は、前記ビームにより照射される領域を通過する際に水平方向に搬送され、
     前記複数の第1の支持ローラは、前記基板の下側に設けられ、
     前記保持手段は、前記複数の第1の支持ローラの各々の外周面に接触して各第1の支持ローラを回転可能に支持する複数のベアリングであって、各第1の支持ローラの回転軸方向の複数箇所に分散して設けられた複数のベアリングをさらに有する、
    請求項9又は10に記載の描画装置。

     
    the substrate is transported horizontally as it passes through an area irradiated by the beam;
    the first support rollers are provided below the substrate;
    the holding means further includes a plurality of bearings that are in contact with the outer circumferential surfaces of the first support rollers and rotatably support each of the first support rollers, the bearings being provided at a plurality of locations in a rotation axis direction of each of the first support rollers.
    11. The drawing device according to claim 9 or 10.

PCT/JP2023/041448 2022-11-29 2023-11-17 Rendering device WO2024116900A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010018434A (en) * 2008-06-12 2010-01-28 Hideo Suzuki Flotation transfer method of film-like object and its device
WO2013035489A1 (en) * 2011-09-06 2013-03-14 株式会社ニコン Substrate processing device
WO2013065451A1 (en) * 2011-11-04 2013-05-10 株式会社ニコン Substrate processing unit and method for processing substrate
CN103787121A (en) * 2012-10-30 2014-05-14 上海永超真空镀铝有限公司 Guide roll supporting device
WO2021010370A1 (en) * 2019-07-12 2021-01-21 株式会社ニコン Substrate processing method, pattern forming method, and substrate processing system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010018434A (en) * 2008-06-12 2010-01-28 Hideo Suzuki Flotation transfer method of film-like object and its device
WO2013035489A1 (en) * 2011-09-06 2013-03-14 株式会社ニコン Substrate processing device
WO2013065451A1 (en) * 2011-11-04 2013-05-10 株式会社ニコン Substrate processing unit and method for processing substrate
CN103787121A (en) * 2012-10-30 2014-05-14 上海永超真空镀铝有限公司 Guide roll supporting device
WO2021010370A1 (en) * 2019-07-12 2021-01-21 株式会社ニコン Substrate processing method, pattern forming method, and substrate processing system

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