WO2024108432A1 - Micro bonding device, bonding backplane and display device - Google Patents

Micro bonding device, bonding backplane and display device Download PDF

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Publication number
WO2024108432A1
WO2024108432A1 PCT/CN2022/133769 CN2022133769W WO2024108432A1 WO 2024108432 A1 WO2024108432 A1 WO 2024108432A1 CN 2022133769 W CN2022133769 W CN 2022133769W WO 2024108432 A1 WO2024108432 A1 WO 2024108432A1
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WO
WIPO (PCT)
Prior art keywords
micro
bound
main body
electrode
binding device
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Application number
PCT/CN2022/133769
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French (fr)
Chinese (zh)
Inventor
马刚
Original Assignee
厦门市芯颖显示科技有限公司
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Application filed by 厦门市芯颖显示科技有限公司 filed Critical 厦门市芯颖显示科技有限公司
Priority to PCT/CN2022/133769 priority Critical patent/WO2024108432A1/en
Publication of WO2024108432A1 publication Critical patent/WO2024108432A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission

Definitions

  • the present application relates to the technical field of electronic devices, and in particular to a micro-binding device, a binding backplane and a display device.
  • Micro LED (Micro Light Emitting Diode) display technology is currently widely used in various display devices.
  • Micro LED display backplanes require a large number of Micro LED chips to be transferred and bonded.
  • Post-bonding repair technology is the key to achieving mass production.
  • the repair method in related technologies is generally to use laser to knock out the chip at the bad point position, and then add the bonding adhesive material or solder to the original position or the position of the spare electrode by dispensing or inkjet printing, and then add another chip. Finally, the repair core is bonded to the backplane by heating and welding.
  • the chip size becomes smaller and the gap between chips becomes smaller, it is becoming more and more difficult to use traditional processes for single-point repair.
  • the embodiments of the present application provide a micro binding device, a binding backplane and a display device, which can reduce the difficulty of repairing micro electronic devices and prevent the impact on surrounding already soldered chips during repair.
  • an embodiment of the present application provides a micro-binding device for binding and connecting two electrodes to be bound, the micro-binding device comprising: a main body; a plurality of micro-connectors protruding from the main body, the plurality of micro-connectors being arranged at intervals from each other; wherein the plurality of micro-connectors are used to respectively connect with the two electrodes to be bound.
  • the main body includes a first surface and a second surface opposite to each other in a first direction;
  • the multiple micro-connectors include a plurality of first microneedles protruding from the first surface and a plurality of second microneedles protruding from the second surface;
  • the multiple first microneedles are used to be respectively connected to one of the two electrodes to be bound, and the multiple second microneedles are used to be respectively connected to the other of the two electrodes to be bound.
  • the main body has a first height dimension along the first direction and a first width dimension along the second direction; the second direction is perpendicular to the first direction; the first height dimension is 1 to 3 microns; the first width dimension ranges from 1 to 5 microns; the heights of the plurality of first microneedles and the plurality of second microneedles protrude from the main body respectively in the range of 100 to 1000 nanometers; each first microneedle in the plurality of first microneedles and each second microneedle in the plurality of second microneedles has a second width dimension along the second direction, and the second width dimension ranges from 100 to 1000 nanometers.
  • it also includes a first flying wing and a second flying wing symmetrically arranged on opposite sides of the main body in a second direction; the second direction is perpendicular to the first direction; the first flying wing and the second flying wing extend respectively along the first direction.
  • the main body is formed with a first guide groove and a second guide groove symmetrically arranged in a third direction, and the third direction is perpendicular to the first direction; the first guide groove and the second guide groove respectively penetrate the first surface and the second surface along the first direction.
  • the main body includes a first surface and a second surface opposite to each other in a first direction, and side surfaces located on the first surface and the second surface;
  • the multiple micro-connectors are multiple blades respectively protruding from the side surfaces and arranged around the main body, and each of the multiple micro-connectors includes a first plug-in end and a second plug-in end opposite to each other in the first direction; the first plug-in end is used to be plugged into one of the two electrodes to be bound, and the second plug-in end is used to be plugged into the other of the two electrodes to be bound.
  • the main body has a third width dimension along a second direction; the second direction is perpendicular to the first direction; the third width dimension is 100-1000 nanometers; and the length of the blade of each micro connector protruding from the side surface is 1-2 micrometers.
  • the main body is provided with a through hole penetrating from the first surface to the second surface.
  • the main body has a third width dimension along a second direction; the second direction is perpendicular to the first direction; the third width dimension is 1-3 microns; and the length of the blade of each micro connector protruding from the side surface is 0.5-1 micron.
  • each of the micro-connectors includes a blade middle portion located between the first plug end and the second plug end, and the thickness of the first plug end and the second plug end are both less than or equal to the thickness of the blade middle portion.
  • an embodiment of the present application provides a binding backplane, comprising: a substrate having a first electrode to be bound; a microelectronic device having a second electrode to be bound; a microbinding device as described in any of the preceding items, arranged between the first electrode to be bound and the second electrode to be bound; at least some of the multiple microconnectors are plugged into the first electrode to be bound, and at least some of the multiple microconnectors are plugged into the second electrode to be bound.
  • the hardness of the plurality of micro-connectors is greater than the hardness of the first electrode to be bound and the hardness of the second electrode to be bound.
  • an embodiment of the present application provides a display device, comprising: a binding backplane as described in any one of the above, wherein the microelectronic device is a micro light-emitting device.
  • the micro-binding device can be plugged into two electrodes to be bound through multiple micro-plugs arranged at intervals, so that when binding the Micro LED chip to the corresponding substrate, the micro-binding device provided in the embodiment of the present application can be plugged into the electrodes of the Micro LED chip and the corresponding electrodes on the substrate to achieve binding.
  • the setting of multiple micro-plugs makes it unnecessary to heat and weld during binding, so the surrounding already welded chips will not be affected during the repair process.
  • the micro-binding device provided in the embodiment of the present application can be used for binding by laser transfer, which is less difficult than the traditional inkjet printing or glue dispensing repair process.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a micro-binding device provided in one embodiment of the present application.
  • FIG. 2 is a side schematic diagram of the micro-binding device shown in FIG. 1 .
  • FIG3 is a schematic diagram of a process for repairing a micro-binding device provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a three-dimensional structure of a micro-binding device provided in another embodiment of the present application.
  • FIG5 is a schematic diagram of a three-dimensional structure of a micro-binding device provided in another embodiment of the present application.
  • FIG6 is a schematic diagram of the structure of a binding backplane provided in one embodiment of the present application.
  • FIG. 7 is a schematic diagram of the structure of a display device provided in one embodiment of the present application.
  • micro-binding device 11: main body; 111: first surface; 112: second surface; 113: first guide groove; 114: second guide groove; 115: side; 12: micro-connector; 121: first micro-needle; 122: second micro-needle; 123: first plug-in end; 124: second plug-in end; 125: middle part of blade; 131: first flying wing; 132: second flying wing; 20: substrate; 21: first electrode to be bound; 30: micro-electronic device; 31: second electrode to be bound; 100: binding backplane; 200: display device.
  • the bonding repair process of Micro LED chips mainly includes the following steps: (1) removing the old chip at the position to be repaired; (2) using glue dispensing or inkjet printing process to add bonding glue or solder on the substrate electrode; (3) transferring the new chip to the position to be repaired; (4) performing single-point heating bonding on the position to be repaired.
  • the traditional glue dispensing process can no longer meet the accuracy requirements.
  • the traditional inkjet printing process has strict requirements on the selection of solder materials, so it is difficult to achieve high-precision repair.
  • the embodiment of the present application provides a new repair solution to solve at least part of the above-mentioned defects.
  • the first embodiment of the present application provides a micro-binding device 10 for binding and connecting two electrodes to be bound.
  • the micro-binding device 10 includes a main body 11 and a plurality of micro-plugs 12 protruding from the main body 11, and the plurality of micro-plugs 12 are arranged at intervals from each other. Among them, the plurality of micro-plugs 12 are used to plug with the two electrodes to be bound respectively.
  • the two electrodes to be bound can be, for example, a chip electrode of a Micro LED chip and a substrate electrode corresponding to the chip electrode on a display substrate. That is, the plurality of micro-plugs 12 are used to plug with a chip electrode and a substrate electrode respectively to achieve the binding of the Micro LED chip and the substrate.
  • the main body 11 includes a first surface 111 and a second surface 112 opposite to each other in a first direction.
  • the plurality of micro-plugs 12 include a plurality of first micro-needles 121 protruding from the first surface 111 and a plurality of second micro-needles 122 protruding from the second surface 112.
  • the plurality of first micro-needles 121 are used to plug with one of the two electrodes to be bound respectively, and the plurality of second micro-needles 122 are used to plug with the other of the two electrodes to be bound respectively.
  • a plurality of first micro needles 121 are plugged into the chip electrodes, and a plurality of second micro needles 122 are plugged into the substrate electrodes.
  • the physical plugging of the micro binding device 10 with the chip electrodes and the substrate electrodes replaces the heating and welding of the solder, and there is no need to heat the repair position separately, and it will not affect the adjacent soldered chips.
  • the micro-binding device 10 is made of a metal conductive material such as copper or nickel, and is in the shape of a metal block as a whole.
  • the main body 11 has a first height dimension H1 along the first direction and a first width dimension W1 along the second direction.
  • the second direction is perpendicular to the first direction.
  • the main body 11 is, for example, a rectangular parallelepiped structure, and the first width dimension W1 is the length or width of the first surface (or the second surface), which is related to the size of the two electrodes to be bound.
  • the first width dimension W1 ranges from 1 to 5 microns.
  • the first height dimension H1 is the height of the rectangular parallelepiped.
  • the first height dimension H1 is 1 to 3 microns.
  • the height H2 of the plurality of first microneedles 121 and the plurality of second microneedles 122 protruding from the main body 11 ranges from 100 to 1000 nanometers.
  • Each of the plurality of first microneedles 121 and each of the plurality of second microneedles 122 has a second width dimension W2 along the second direction, and the second width dimension ranges from 100 to 1000 nanometers.
  • the plurality of first microneedles 121 and the plurality of second microneedles 122 are, for example, spike structures, which can be inserted into two electrodes to be bound to achieve plug-in connection.
  • steps (a) to (b) the old chip at the position to be repaired on the substrate is knocked off to expose the electrode to be bound on the substrate 20.
  • steps (c) to (d) the micro-binding device 10 is transferred to the substrate electrode. This process can be realized by laser-assisted transfer.
  • the micro-binding device 10 is picked up by the transfer carrier. After being irradiated by laser, the adhesive material on the transfer carrier is vaporized to release the micro-binding device 10 and provide a certain flying speed, so that the micro-binding device 10 is plugged into the substrate electrode.
  • a new chip is transferred to the substrate.
  • laser-assisted transfer can be used to provide the chip with a certain flying speed, so that the chip electrode is plugged into the micro-binding device 10 on the substrate electrode.
  • a pressing method is used to make the plugging of the micro-binding device 10 with the chip electrode and the substrate electrode more stable, and finally the repaired binding structure in step (h) is obtained.
  • the micro-binding device 10 provided in this embodiment can be applied to the laser-assisted transfer process in the transfer of Micro LED chips. Compared with the conventional repair solution using conductive glue or solder, it can use existing process equipment, the solution is simple and feasible, and the repair difficulty is reduced.
  • the micro-binding device 10 provided in this embodiment can also be used for repair binding in other micro-device transfer processes similar to Micro LED.
  • the micro-binding device 10 further includes a first flying wing 131 and a second flying wing 132 symmetrically arranged on opposite sides of the main body 11 in the second direction, and the second direction is perpendicular to the first direction.
  • the first flying wing 131 and the second flying wing 132 extend respectively in the first direction. Referring to the orientation in FIG. 2 , the first flying wing 131 and the second flying wing 132 are symmetrically arranged on the left and right sides of the main body 11, and the first flying wing 131 and the second flying wing 132 extend respectively in the up and down directions to form a wing-shaped structure.
  • the first flying wing 131 and the second flying wing 132 can play a role in aligning the flight path when the transfer carrier releases the micro-binding device 10 onto the target substrate, that is, in the process of the aforementioned steps (c) to (d).
  • the main body 11 is formed with a first guide groove 113 and a second guide groove 114 symmetrically arranged in a third direction, and the third direction is perpendicular to the first direction.
  • the first guide groove 113 and the second guide groove 114 penetrate the first surface 111 and the second surface 112 respectively in the first direction.
  • the third direction may be the same as or different from the aforementioned second direction. For example, referring to the orientation shown in FIG.
  • the first flying wing 131 and the second flying wing 132 are symmetrical in the front-to-back direction
  • the first guide groove 113 and the second guide groove 114 are symmetrical in the left-to-right direction.
  • the second direction and the third direction are perpendicular to each other.
  • the first guide groove 113 and the second guide groove 114 may also be set to be symmetrical in the front-to-back direction as shown in FIG. 1 , in which case the second direction and the third direction are the same. This embodiment is not limited thereto.
  • the second embodiment of the present application provides another micro-binding device 10 for binding and connecting two electrodes to be bound.
  • the micro-binding device 10 includes a main body 11 and a plurality of micro-plugs 12 protruding from the main body 11, and the plurality of micro-plugs 12 are arranged at intervals from each other. Among them, the plurality of micro-plugs 12 are used to plug with the two electrodes to be bound respectively.
  • the two electrodes to be bound can be, for example, a chip electrode of a Micro LED chip and a substrate electrode corresponding to the chip electrode on a display substrate. That is, the plurality of micro-plugs 12 are used to plug with a chip electrode and a substrate electrode respectively to achieve the binding of the Micro LED chip and the substrate.
  • the main body 11 includes a first surface 111 and a second surface 112 opposite to each other in a first direction, and a side surface 115 located on the first surface 111 and the second surface 112.
  • the plurality of micro-plugs 12 are a plurality of blades protruding from the side surface 115 and arranged around the main body 11, and each of the plurality of micro-plugs 12 includes a first plug end 123 and a second plug end 124 opposite to each other in the first direction.
  • the first plug-in end 123 is used to plug into one of the two electrodes to be bound
  • the second plug-in end 124 is used to plug into the other of the two electrodes to be bound.
  • the main body 11 is, for example, a columnar structure, and 8 blade-shaped micro-connectors 12 are arranged around the main body 11.
  • the upper end of each micro-connector 12 is the first plug-in end 123
  • the lower end is the second plug-in end 124.
  • the Micro LED chip is bound to the display substrate
  • the upper end of each micro-connector 12 is plugged into the chip electrode
  • the lower end of each micro-connector 12 is plugged into the substrate electrode.
  • the physical plug-in of the micro-binding device 10 with the chip electrode and the substrate electrode replaces the heating and welding of the solder, and there is no need to perform single-point heating on the repair position, and it will not affect the adjacent soldered chips.
  • the main body 11 has a third width dimension W3 along the second direction.
  • the second direction is perpendicular to the first direction.
  • the main body 11 is a columnar structure, and the diameter of the columnar structure is the third width dimension W3.
  • the third width dimension W3 is 100 to 1000 nanometers.
  • the blade length W4 of each micro-connector 12 protruding from the side 115 is 1 to 2 micrometers.
  • the overall height of the micro-binding device 10 (the distance between the first surface 111 and the second surface) is 1 to 3 micrometers.
  • the thickness D of each micro-connector 12 is, for example, 100 to 1000 nm.
  • the main body 11 is set as a micro-needle structure, which can play a plug-in role
  • the plurality of micro-connectors 12 are set as a micro-blade-shaped structure, which can be plugged with two electrodes to be bound and also play a role in assisting flight alignment.
  • the main body 11 is a hollow columnar structure.
  • the main body 11 is provided with a through hole 116 extending from the first surface 111 to the second surface 112.
  • the third width dimension W3 is 1 to 3 microns.
  • the blade length W4 of each micro-connector 12 protruding from the side 115 is 0.5 to 1 micron.
  • the main body 11 has a relatively wide size to ensure the overall structural stability of the micro-binding device 10.
  • the provision of the through hole 116 allows the main body 11 to maintain a relatively thin wall thickness, which is more conducive to plugging.
  • each micro-connector 12 includes a blade middle portion 125 located between a first plug end 123 and a second plug end 124, and the thickness of the first plug end 123 and the second plug end 124 are both less than or equal to the thickness of the blade middle portion 125. Setting the first plug end 123 and the second plug end 124 to be thinner than the thickness of the blade middle portion can facilitate plugging.
  • the preparation of the micro-binding device 10 provided in the first embodiment and the second embodiment of the present application can be achieved, for example, by the following method steps: growing a substrate on a substrate, the substrate can be a glass substrate or a sapphire substrate, the substrate can be a gallium nitride substrate; coating a photoresist on the substrate; exposing and developing according to the shape of the micro-binding device to form a corresponding pattern. Then, a metal block of a corresponding shape is obtained by evaporation, metal removal, degumming and other processes.
  • the third embodiment of the present application provides a binding backplane 100, comprising a substrate 20, a microelectronic device 30, and any one of the microbinding devices 10 in the first and second embodiments.
  • the substrate 20 has a first electrode 21 to be bound.
  • the microelectronic device 30 has a second electrode 31 to be bound.
  • the microbinding device 10 is disposed between the first electrode 21 to be bound and the second electrode 31 to be bound. At least some of the microconnectors 12 among the plurality of microconnectors 12 are plugged into the first electrode 21 to be bound, and at least some of the microconnectors 12 among the plurality of microconnectors 12 are plugged into the second electrode 31 to be bound.
  • the microelectronic device 30 can be, for example, a Micro LED chip or other microdevices with similar repair requirements.
  • the substrate 20 is, for example, a drive array substrate of a Micro LED chip, on which a drive circuit for driving the Micro LED chip to emit light is also provided.
  • the second electrode to be bound 31 of the microelectronic device 30 is bound to the first electrode to be bound 21 on the substrate 20 to achieve electrical connection between the two.
  • FIG. 6 shows a schematic diagram of the structure of the binding backplane 100 using the microbinding device 10 provided in the first embodiment.
  • the microelectronic device 30 has two second electrodes to be bound 31, and two first electrodes to be bound 21 corresponding to the two electrodes to be bound 31 are provided on the substrate 20.
  • a microbinding device 10 is provided between each pair of second binding electrodes 31 and the first binding electrode 21 to achieve binding connection.
  • a plurality of first microneedles 121 are plugged into the first electrode to be bound 21, and a plurality of second microneedles 122 are plugged into the second electrode to be bound 31.
  • the first plugging ends 123 of the plurality of micro-plugs 12 are plugged with the first electrode to be bound 21, and the second plugging ends 124 of the plurality of micro-plugs 12 are plugged with the second electrode to be bound 31.
  • the hardness of the plurality of micro-plugs 12 is greater than the hardness of the first electrode to be bound 21 and the hardness of the second electrode to be bound 31, so that a better plugging and binding effect can be achieved.
  • an embodiment of the present application further provides a display device 200 , comprising any one of the aforementioned binding backplanes 100 , wherein the microelectronic device 30 is a micro light-emitting device.
  • the production cost and process difficulty of the binding backplane 100 and the display device 200 repaired by using the micro-binding device 10 provided in the above embodiment are greatly reduced.

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Abstract

A micro bonding device (10), a bonding backplane (100) and a display device (200). The micro bonding device (10) is used for bonding and connecting two electrodes to be bonded, and comprises: a main body portion (11); and a plurality of micro insertion connectors (12) protruding from the main body portion (11), wherein the plurality of micro insertion connectors (12) are spaced apart from each other, and are respectively connected to said two electrodes in an inserted manner. The difficulty of repairing a micro electronic device (30) can be reduced, and the impact on a peripheral welded chip during repairing can be prevented.

Description

微型绑定器件、绑定背板和显示装置Micro-binding device, binding backplane and display device 技术领域Technical Field
本申请涉及电子器件技术领域，尤其涉及一种微型绑定器件、一种绑定背板和一种显示装置。The present application relates to the technical field of electronic devices, and in particular to a micro-binding device, a binding backplane and a display device.
背景技术Background technique
Micro LED（Micro Light Emitting Diode，微型发光二极管）显示技术目前被广泛应用在各类显示设备中，Micro LED显示背板需要进行巨量Micro LED芯片转移和键合，键合后可修复技术是实现量产的关键，相关技术中修复方法一般是采用激光将坏点位置的芯片打掉，再在原位置或者备用电极的位置上通过点胶或喷墨打印的方式补充绑定用的粘附材料或者焊料，之后再补上一颗芯片。最后采用加热焊接的方式将修补芯bonding（绑定）在背板上。随着Micro LED显示面板的分辨率越来越高，芯片尺寸越来越小且芯片间的间隙越来越小，采用传统工艺进行单点修复的难度越来越大。并且在此过程中容易造成影响周边已经焊接好的芯片的焊点质量，因此现有的修复工艺存在修复难度大，修复成本高的问题。Micro LED (Micro Light Emitting Diode) display technology is currently widely used in various display devices. Micro LED display backplanes require a large number of Micro LED chips to be transferred and bonded. Post-bonding repair technology is the key to achieving mass production. The repair method in related technologies is generally to use laser to knock out the chip at the bad point position, and then add the bonding adhesive material or solder to the original position or the position of the spare electrode by dispensing or inkjet printing, and then add another chip. Finally, the repair core is bonded to the backplane by heating and welding. As the resolution of Micro LED display panels becomes higher and higher, the chip size becomes smaller and the gap between chips becomes smaller, it is becoming more and more difficult to use traditional processes for single-point repair. In addition, in this process, it is easy to affect the quality of the solder joints of the surrounding already welded chips. Therefore, the existing repair process has the problems of high repair difficulty and high repair cost.
技术问题technical problem
因此，亟需提供一种新方案来解决上述修复难度大的问题。Therefore, it is urgent to provide a new solution to solve the above-mentioned problem of difficulty in repair.
技术解决方案Technical Solutions
因此，为克服现有技术中的至少部分缺陷，本申请实施例提供了一种微型绑定器件、一种绑定背板和一种显示装置，可降低微型电子器件的修复难度，防止修复时对周边已经焊接好的芯片的影响。Therefore, in order to overcome at least some of the defects in the prior art, the embodiments of the present application provide a micro binding device, a binding backplane and a display device, which can reduce the difficulty of repairing micro electronic devices and prevent the impact on surrounding already soldered chips during repair.
一方面，本申请一个实施例提供一种微型绑定器件，用于将两个待绑定电极绑定连接，所述微型绑定器件包括：主体部；多个微插接件，凸出于所述主体部，所述多个微插接件相互间隔设置；其中，所述多个微插接件用于分别与所述两个待绑定电极相互插接。On the one hand, an embodiment of the present application provides a micro-binding device for binding and connecting two electrodes to be bound, the micro-binding device comprising: a main body; a plurality of micro-connectors protruding from the main body, the plurality of micro-connectors being arranged at intervals from each other; wherein the plurality of micro-connectors are used to respectively connect with the two electrodes to be bound.
在一个实施例中，所述主体部包括在第一方向上相对的第一表面和第二表面；所述多个微插接件包括凸出于所述第一表面的多个第一微针和凸出于所述第二表面的多个第二微针；所述多个第一微针用于分别于所述两个待绑定电极之一插接，所述多个第二微针用于分别与所述两个待绑定电极之另一插接。In one embodiment, the main body includes a first surface and a second surface opposite to each other in a first direction; the multiple micro-connectors include a plurality of first microneedles protruding from the first surface and a plurality of second microneedles protruding from the second surface; the multiple first microneedles are used to be respectively connected to one of the two electrodes to be bound, and the multiple second microneedles are used to be respectively connected to the other of the two electrodes to be bound.
在一个实施例中，所述主体部具有沿所述第一方向的第一高度尺寸和沿第二方向的第一宽度尺寸；所述第二方向垂直于所述第一方向；所述第一高度尺寸为1~3微米；所述第一宽度尺寸范围为1~5微米；所述多个第一微针和所述多个第二微针分别凸出于所述主体部的高度范围为100~1000纳米；所述多个第一微针中的每个第一微针和所述多个第二微针中的每个第二微针具有沿所述第二方向的第二宽度尺寸，所述第二宽度尺寸的范围为100~1000纳米。In one embodiment, the main body has a first height dimension along the first direction and a first width dimension along the second direction; the second direction is perpendicular to the first direction; the first height dimension is 1 to 3 microns; the first width dimension ranges from 1 to 5 microns; the heights of the plurality of first microneedles and the plurality of second microneedles protrude from the main body respectively in the range of 100 to 1000 nanometers; each first microneedle in the plurality of first microneedles and each second microneedle in the plurality of second microneedles has a second width dimension along the second direction, and the second width dimension ranges from 100 to 1000 nanometers.
在一个实施例中，还包括对称设置在所述主体部在第二方向上相对两侧的第一飞行翼和第二飞行翼；所述第二方向垂直于所述第一方向；所述第一飞行翼和所述第二飞行翼分别沿所述第一方向延伸。In one embodiment, it also includes a first flying wing and a second flying wing symmetrically arranged on opposite sides of the main body in a second direction; the second direction is perpendicular to the first direction; the first flying wing and the second flying wing extend respectively along the first direction.
在一个实施例中，所述主体部上形成有在第三方向上对称设置的第一导向槽和第二导向槽，所述第三方向垂直于所述第一方向；所述第一导向槽和所述第二导向槽分别沿所述第一方向贯通所述第一表面和所述第二表面。In one embodiment, the main body is formed with a first guide groove and a second guide groove symmetrically arranged in a third direction, and the third direction is perpendicular to the first direction; the first guide groove and the second guide groove respectively penetrate the first surface and the second surface along the first direction.
在一个实施例中，所述主体部包括在第一方向上相对的第一表面和第二表面，以及位于所述第一表面和所述第二表面的侧面；所述多个微插接件为分别凸出于所述侧面并围绕所述主体部设置的多个叶片，所述多个微插接件中的每个所述微插接件包括在所述第一方向上相对的第一插接端和第二插接端；所述第一插接端用于与所述两个待绑定电极之一插接，所述第二插接端用于与所述两个待绑定电极至另一插接。In one embodiment, the main body includes a first surface and a second surface opposite to each other in a first direction, and side surfaces located on the first surface and the second surface; the multiple micro-connectors are multiple blades respectively protruding from the side surfaces and arranged around the main body, and each of the multiple micro-connectors includes a first plug-in end and a second plug-in end opposite to each other in the first direction; the first plug-in end is used to be plugged into one of the two electrodes to be bound, and the second plug-in end is used to be plugged into the other of the two electrodes to be bound.
在一个实施例中，所述主体部具有沿第二方向的第三宽度尺寸；所述第二方向垂直于所述第一方向；所述第三宽度尺寸为100~1000纳米；每个所述微插接件凸出于所述侧面的叶片长度为1~2微米。In one embodiment, the main body has a third width dimension along a second direction; the second direction is perpendicular to the first direction; the third width dimension is 100-1000 nanometers; and the length of the blade of each micro connector protruding from the side surface is 1-2 micrometers.
在一个实施例中，所述主体部上设置有沿所述第一表面至所述第二表面贯穿的通孔。In one embodiment, the main body is provided with a through hole penetrating from the first surface to the second surface.
在一个实施例中，所述主体部具有沿有沿第二方向的第三宽度尺寸；所述第二方向垂直于所述第一方向；所述第三宽度尺寸为1~3微米；每个所述微插接件凸出于所述侧面的叶片长度为0.5~1微米。In one embodiment, the main body has a third width dimension along a second direction; the second direction is perpendicular to the first direction; the third width dimension is 1-3 microns; and the length of the blade of each micro connector protruding from the side surface is 0.5-1 micron.
在一个实施例中，每个所述微插接件包括位于所述第一插接端和所述第二插接端之间的叶片中部，所述第一插接端和所述第二插接端的厚度均小于等于所述叶片中部的厚度。In one embodiment, each of the micro-connectors includes a blade middle portion located between the first plug end and the second plug end, and the thickness of the first plug end and the second plug end are both less than or equal to the thickness of the blade middle portion.
另一方面，本申请一个实施例提供一种绑定背板，包括：基板，具有第一待绑定电极；微型电子器件，具有第二待绑定电极；如前述任意一项所述的微型绑定器件，设置在所述第一待绑定电极和所述第二待绑定电极之间；所述多个微插接件中的至少部分微插接件插接于所述第一待绑定电极上、且多个微插接件中的至少部分微插接件插接于所述第二待绑定电极上。On the other hand, an embodiment of the present application provides a binding backplane, comprising: a substrate having a first electrode to be bound; a microelectronic device having a second electrode to be bound; a microbinding device as described in any of the preceding items, arranged between the first electrode to be bound and the second electrode to be bound; at least some of the multiple microconnectors are plugged into the first electrode to be bound, and at least some of the multiple microconnectors are plugged into the second electrode to be bound.
在一个实施例中，所述多个微插接件的硬度大于所述第一待绑定电极的硬度和所述第二待绑定电极的硬度。In one embodiment, the hardness of the plurality of micro-connectors is greater than the hardness of the first electrode to be bound and the hardness of the second electrode to be bound.
另一方面，本申请一个实施例提供一种显示装置，包括：如前述任意一项所述的绑定背板，其中所述微型电子器件为微型发光器件。On the other hand, an embodiment of the present application provides a display device, comprising: a binding backplane as described in any one of the above, wherein the microelectronic device is a micro light-emitting device.
有益效果Beneficial Effects
本申请上述实施例至少具有如下一个或多个有益效果：该微型绑定器件可通过间隔设置的多个微插接件分别与两个待绑定电极相互插接，由此，绑定Micro LED芯片到对应的基板上时可通过本申请实施例提供的微型绑定器件分别与Micro LED芯片的电极和基板上对应的电极相互插接来实现绑定。多个微插接件的设置使得绑定时无需加热焊接，因此在修复过程中不会对周边已经焊接好的芯片造成影响。另外采用本申请实施例提供的微型绑定器件绑定可采用激光转移，相比于传统喷墨打印或点胶修复工艺难度更低。The above embodiments of the present application have at least one or more of the following beneficial effects: the micro-binding device can be plugged into two electrodes to be bound through multiple micro-plugs arranged at intervals, so that when binding the Micro LED chip to the corresponding substrate, the micro-binding device provided in the embodiment of the present application can be plugged into the electrodes of the Micro LED chip and the corresponding electrodes on the substrate to achieve binding. The setting of multiple micro-plugs makes it unnecessary to heat and weld during binding, so the surrounding already welded chips will not be affected during the repair process. In addition, the micro-binding device provided in the embodiment of the present application can be used for binding by laser transfer, which is less difficult than the traditional inkjet printing or glue dispensing repair process.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
下面将结合附图，对本申请的具体实施方式进行详细的说明。The specific implementation methods of the present application will be described in detail below with reference to the accompanying drawings.
图1为本申请一个实施例提供的一种微型绑定器件的立体结构示意图。FIG. 1 is a schematic diagram of a three-dimensional structure of a micro-binding device provided in one embodiment of the present application.
图2为图1所述的微型绑定器件的侧面示意图。FIG. 2 is a side schematic diagram of the micro-binding device shown in FIG. 1 .
图3为采用本申请一个实施例提供的微型绑定器件修复的流程示意图。FIG3 is a schematic diagram of a process for repairing a micro-binding device provided by an embodiment of the present application.
图4为本申请另一个实施例提供的一种微型绑定器件的立体结构示意图。FIG. 4 is a schematic diagram of a three-dimensional structure of a micro-binding device provided in another embodiment of the present application.
图5为本申请另一个实施例提供的一种微型绑定器件的立体结构示意图。FIG5 is a schematic diagram of a three-dimensional structure of a micro-binding device provided in another embodiment of the present application.
图6为本申请一个实施例提供的一种绑定背板的结构示意图。FIG6 is a schematic diagram of the structure of a binding backplane provided in one embodiment of the present application.
图7为本申请一个实施例提供的一种显示装置的结构示意图。FIG. 7 is a schematic diagram of the structure of a display device provided in one embodiment of the present application.
【附图标记说明】[Description of Reference Numerals]
10：微型绑定器件；11：主体部；111：第一表面；112：第二表面；113：第一导向槽；114：第二导向槽；115：侧面；12：微插接件；121：第一微针；122：第二微针；123：第一插接端；124：第二插接端；125：叶片中部；131：第一飞行翼；132：第二飞行翼；20：基板；21：第一待绑定电极；30：微型电子器件；31：第二待绑定电极；100：绑定背板；200：显示装置。10: micro-binding device; 11: main body; 111: first surface; 112: second surface; 113: first guide groove; 114: second guide groove; 115: side; 12: micro-connector; 121: first micro-needle; 122: second micro-needle; 123: first plug-in end; 124: second plug-in end; 125: middle part of blade; 131: first flying wing; 132: second flying wing; 20: substrate; 21: first electrode to be bound; 30: micro-electronic device; 31: second electrode to be bound; 100: binding backplane; 200: display device.
本发明的实施方式Embodiments of the present invention
为使本申请的上述目的、特征和优点能够更加明显易懂，下面结合附图对本申请的具体实施方式做详细的说明。In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.
为了使本领域普通技术人员更好地理解本申请的技术方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分的实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本申请保护的范围。In order to enable those skilled in the art to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present application.
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解这样使用的术语在适当情况下可以互换，以便这里描述的本申请实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、***、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其他步骤或单元。It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
还需要说明的是，本申请中多个实施例的划分仅是为了描述的方便，不应构成特别的限定，各种实施例中的特征在不矛盾的情况下可以相结合，相互引用。It should also be noted that the division of multiple embodiments in the present application is only for the convenience of description and should not constitute a special limitation. The features in various embodiments can be combined and referenced to each other without contradiction.
在相关技术中，Micro LED芯片的绑定修复过程主要包括如下步骤：（1）移除待修复位置旧芯片；（2）采用点胶或喷墨打印工艺在基板电极上补充绑定胶材或者焊料；（3）转移新的芯片至待修复位置；（4）对待修复位置进行单点加热绑定。但是随着Micro LED芯片尺寸的减小，芯片电极和基板电极的大小也大大减小，传统的点胶工艺已经难以满足精度需求，传统的喷墨打印工艺对焊材选择严格，因此难以实现高精度的修复。另外，Micro LED芯片之间的间距也越来越小，在进行单点加热绑定时也会影响到相邻位置已经绑定好的芯片。为此本申请实施例提供一种新的修复方案以解决上述至少部分缺陷。In the related art, the bonding repair process of Micro LED chips mainly includes the following steps: (1) removing the old chip at the position to be repaired; (2) using glue dispensing or inkjet printing process to add bonding glue or solder on the substrate electrode; (3) transferring the new chip to the position to be repaired; (4) performing single-point heating bonding on the position to be repaired. However, as the size of Micro LED chips decreases, the size of chip electrodes and substrate electrodes also decreases significantly. The traditional glue dispensing process can no longer meet the accuracy requirements. The traditional inkjet printing process has strict requirements on the selection of solder materials, so it is difficult to achieve high-precision repair. In addition, the spacing between Micro LED chips is getting smaller and smaller, and the single-point heating bonding will also affect the chips that have been bonded at adjacent positions. For this reason, the embodiment of the present application provides a new repair solution to solve at least part of the above-mentioned defects.
【第一实施例】[First embodiment]
本申请第一实施例提供一种微型绑定器件10，用于将两个待绑定电极绑定连接。微型绑定器件10包括主体部11和凸出于主体部11的多个微插接件12，多个微插接件12相互间隔设置。其中，多个微插接件12用于分别与两个待绑定电极相互插接。其中所述两个待绑定电极例如可以分别为Micro LED芯片的一个芯片电极和显示基板上与该芯片电极对应的基板电极。即多个微插接件12用于分别与一个芯片电极和一个基板电极插接，来实现Micro LED芯片与基板的绑定。具体地，如图1所示，在一个实施例中，主体部11包括在第一方向上相对的第一表面111和第二表面112。多个微插接件12包括凸出于第一表面111的多个第一微针121和凸出于第二表面112的多个第二微针122。多个第一微针121用于分别于两个待绑定电极之一插接，多个第二微针122用于分别与两个待绑定电极之另一插接。例如将Micro LED芯片绑定在基板上时，由多个第一微针121与芯片电极相互插接，而多个第二微针122与基板电极相互插接。如此进行修复时通过微型绑定器件10与芯片电极和基板电极的物理插接代替焊料的加热焊接，无需另外对该修复位置进行单点加热，也不会影响到相邻以焊接好的芯片。The first embodiment of the present application provides a micro-binding device 10 for binding and connecting two electrodes to be bound. The micro-binding device 10 includes a main body 11 and a plurality of micro-plugs 12 protruding from the main body 11, and the plurality of micro-plugs 12 are arranged at intervals from each other. Among them, the plurality of micro-plugs 12 are used to plug with the two electrodes to be bound respectively. The two electrodes to be bound can be, for example, a chip electrode of a Micro LED chip and a substrate electrode corresponding to the chip electrode on a display substrate. That is, the plurality of micro-plugs 12 are used to plug with a chip electrode and a substrate electrode respectively to achieve the binding of the Micro LED chip and the substrate. Specifically, as shown in FIG. 1 , in one embodiment, the main body 11 includes a first surface 111 and a second surface 112 opposite to each other in a first direction. The plurality of micro-plugs 12 include a plurality of first micro-needles 121 protruding from the first surface 111 and a plurality of second micro-needles 122 protruding from the second surface 112. The plurality of first micro-needles 121 are used to plug with one of the two electrodes to be bound respectively, and the plurality of second micro-needles 122 are used to plug with the other of the two electrodes to be bound respectively. For example, when the Micro LED chip is bound to the substrate, a plurality of first micro needles 121 are plugged into the chip electrodes, and a plurality of second micro needles 122 are plugged into the substrate electrodes. In this way, when repairing, the physical plugging of the micro binding device 10 with the chip electrodes and the substrate electrodes replaces the heating and welding of the solder, and there is no need to heat the repair position separately, and it will not affect the adjacent soldered chips.
具体的，本实施例提供的微型绑定器件10例如为铜、镍等金属导电材质，整体呈金属块状。参照图1和图2，主体部11具有沿第一方向的第一高度尺寸H1和沿第二方向的第一宽度尺寸W1。第二方向垂直于第一方向。主体部11例如为长方体结构，第一宽度尺寸W1为第一表面（或第二表面）的长或宽，与两个待绑定电极的尺寸相关。第一宽度尺寸W1范围为1~5微米。第一高度尺寸H1为长方体的高。第一高度尺寸H1为1~3微米。多个第一微针121和多个第二微针122分别凸出于主体部11的高度H2范围为100~1000纳米。多个第一微针121中的每个第一微针121和多个第二微针122中的每个第二微针122具有沿第二方向的第二宽度尺寸W2，第二宽度尺寸的范围为100~1000纳米。多个第一微针121和多个第二微针122例如为尖刺结构，可以刺入两个待绑定电极实现插接。Specifically, the micro-binding device 10 provided in this embodiment is made of a metal conductive material such as copper or nickel, and is in the shape of a metal block as a whole. Referring to FIGS. 1 and 2 , the main body 11 has a first height dimension H1 along the first direction and a first width dimension W1 along the second direction. The second direction is perpendicular to the first direction. The main body 11 is, for example, a rectangular parallelepiped structure, and the first width dimension W1 is the length or width of the first surface (or the second surface), which is related to the size of the two electrodes to be bound. The first width dimension W1 ranges from 1 to 5 microns. The first height dimension H1 is the height of the rectangular parallelepiped. The first height dimension H1 is 1 to 3 microns. The height H2 of the plurality of first microneedles 121 and the plurality of second microneedles 122 protruding from the main body 11 ranges from 100 to 1000 nanometers. Each of the plurality of first microneedles 121 and each of the plurality of second microneedles 122 has a second width dimension W2 along the second direction, and the second width dimension ranges from 100 to 1000 nanometers. The plurality of first microneedles 121 and the plurality of second microneedles 122 are, for example, spike structures, which can be inserted into two electrodes to be bound to achieve plug-in connection.
上述实施例提供的微型绑定器件10用于修复工艺中的原理如图3中的步骤（a）~(h)所示。首先，在步骤（a）~（b）中将基板上的待修复位置的旧芯片打掉，露出基板20上的待绑定电极。在步骤（c）~（d）中将微型绑定器件10转移到基板电极上，此过程可以通过激光辅助转移的方式实现微型绑定器件10与基板电极的插接，通过转移载板拾取微型绑定器件10，在受激光照射后转移载板上的粘附材料气化释放微型绑定器件10并提供一定的飞行速度，使得微型绑定器件10与基板电极插接。在步骤（e）~(f)中，将新的芯片转移到基板上，同样也可以采用激光辅助转移的方式，提供给芯片一定的飞行速度，使得芯片电极与基板电极上的微型绑定器件10插接。最后在步骤（g）中采用压合的方式，使得微型绑定器件10与芯片电极和基板电极的插接更加稳固，最后得到步骤（h）中修复后的绑定结构。本实施例提供的微型绑定器件10可适用Micro LED芯片转移中的激光辅助转移工艺，相比于传统修复方案中采用导电胶或焊料的方案，能够利用现有的工艺设备，方案简单可行，降低了修复难度。当然根据上述修复原理，本实施例提供的微型绑定器件10也可以用于其它与Micro LED类似的微型器件转移工艺中的修复绑定。The principle of the micro-binding device 10 provided in the above embodiment for use in the repair process is shown in steps (a) to (h) in FIG3. First, in steps (a) to (b), the old chip at the position to be repaired on the substrate is knocked off to expose the electrode to be bound on the substrate 20. In steps (c) to (d), the micro-binding device 10 is transferred to the substrate electrode. This process can be realized by laser-assisted transfer. The micro-binding device 10 is picked up by the transfer carrier. After being irradiated by laser, the adhesive material on the transfer carrier is vaporized to release the micro-binding device 10 and provide a certain flying speed, so that the micro-binding device 10 is plugged into the substrate electrode. In steps (e) to (f), a new chip is transferred to the substrate. Similarly, laser-assisted transfer can be used to provide the chip with a certain flying speed, so that the chip electrode is plugged into the micro-binding device 10 on the substrate electrode. Finally, in step (g), a pressing method is used to make the plugging of the micro-binding device 10 with the chip electrode and the substrate electrode more stable, and finally the repaired binding structure in step (h) is obtained. The micro-binding device 10 provided in this embodiment can be applied to the laser-assisted transfer process in the transfer of Micro LED chips. Compared with the conventional repair solution using conductive glue or solder, it can use existing process equipment, the solution is simple and feasible, and the repair difficulty is reduced. Of course, according to the above repair principle, the micro-binding device 10 provided in this embodiment can also be used for repair binding in other micro-device transfer processes similar to Micro LED.
更进一步地，在一个实施例中微型绑定器件10还包括对称设置在主体部11在第二方向上相对两侧的第一飞行翼131和第二飞行翼132，第二方向垂直于第一方向。第一飞行翼131和第二飞行翼132分别沿第一方向延伸。参照图2中的方位，第一飞行翼131和第二飞行翼132对称设置在主体部11的左右两侧，并且第一飞行翼131和第二飞行翼132分别沿上下方向延伸，形成翼状结构。第一飞行翼131和第二飞行翼132可以在转移载板将微型绑定器件10释放至目标基板上时，即前述步骤（c）~(d)的过程中起飞行路线准直的作用。更进一步的，主体部11上形成有在第三方向上对称设置的第一导向槽113和第二导向槽114，第三方向垂直于第一方向。第一导向槽113和第二导向槽114从分别沿第一方向贯通第一表面111和第二表面112。以进一步对飞行路线进行准直。其中第三方向可以与前述的第二方向相同或不同，例如参照图1所示的方位，第一飞行翼131和第二飞行翼132在前后方向上对称，第一导向槽113和第二导向槽114在左右方向上对称，此时第二方向和第三方向互相垂直。或者在一些实施例中，第一导向槽113和第二导向槽114也可以设置为在如图1所示的前后方向上对称，此时第二方向和第三方向相同。本实施例并不限制于此。Furthermore, in one embodiment, the micro-binding device 10 further includes a first flying wing 131 and a second flying wing 132 symmetrically arranged on opposite sides of the main body 11 in the second direction, and the second direction is perpendicular to the first direction. The first flying wing 131 and the second flying wing 132 extend respectively in the first direction. Referring to the orientation in FIG. 2 , the first flying wing 131 and the second flying wing 132 are symmetrically arranged on the left and right sides of the main body 11, and the first flying wing 131 and the second flying wing 132 extend respectively in the up and down directions to form a wing-shaped structure. The first flying wing 131 and the second flying wing 132 can play a role in aligning the flight path when the transfer carrier releases the micro-binding device 10 onto the target substrate, that is, in the process of the aforementioned steps (c) to (d). Furthermore, the main body 11 is formed with a first guide groove 113 and a second guide groove 114 symmetrically arranged in a third direction, and the third direction is perpendicular to the first direction. The first guide groove 113 and the second guide groove 114 penetrate the first surface 111 and the second surface 112 respectively in the first direction. To further align the flight path. The third direction may be the same as or different from the aforementioned second direction. For example, referring to the orientation shown in FIG. 1 , the first flying wing 131 and the second flying wing 132 are symmetrical in the front-to-back direction, and the first guide groove 113 and the second guide groove 114 are symmetrical in the left-to-right direction. In this case, the second direction and the third direction are perpendicular to each other. Alternatively, in some embodiments, the first guide groove 113 and the second guide groove 114 may also be set to be symmetrical in the front-to-back direction as shown in FIG. 1 , in which case the second direction and the third direction are the same. This embodiment is not limited thereto.
【第二实施例】[Second embodiment]
本申请第二实施例提供另一种微型绑定器件10，用于将两个待绑定电极绑定连接。微型绑定器件10包括主体部11和凸出于主体部11的多个微插接件12，多个微插接件12相互间隔设置。其中，多个微插接件12用于分别与两个待绑定电极相互插接。其中所述两个待绑定电极例如可以分别是Micro LED芯片的一个芯片电极和显示基板上与该芯片电极对应的基板电极。即多个微插接件12用于分别与一个芯片电极和一个基板电极插接，来实现Micro LED芯片与基板的绑定。具体参照图4，主体部11包括在第一方向上相对的第一表面111和第二表面112，以及位于第一表面111和第二表面112的侧面115。多个微插接件12为分别凸出于侧面115并围绕主体部11设置的多个叶片，多个微插接件12中的每个微插接件12包括在第一方向上相对的第一插接端123和第二插接端124。第一插接端123用于与两个待绑定电极之一插接，第二插接端124用于与两个待绑定电极至另一插接。参照图4，主体部11例如为一柱状结构，8个叶片状的微插接件12环绕主体部11设置，按照图4所示的方位，每个微插接件12的上端为第一插接端123，下端为第二插接端124。例如将Micro LED芯片绑定在显示基板上时，每个微插接件12的上端与芯片电极相互插接，而每个微插接件12的下端与基板电极相互插接。如此进行修复时通过微型绑定器件10与芯片电极和基板电极的物理插接代替焊料的加热焊接，无需另外对该修复位置进行单点加热，也不会影响到相邻以焊接好的芯片。The second embodiment of the present application provides another micro-binding device 10 for binding and connecting two electrodes to be bound. The micro-binding device 10 includes a main body 11 and a plurality of micro-plugs 12 protruding from the main body 11, and the plurality of micro-plugs 12 are arranged at intervals from each other. Among them, the plurality of micro-plugs 12 are used to plug with the two electrodes to be bound respectively. The two electrodes to be bound can be, for example, a chip electrode of a Micro LED chip and a substrate electrode corresponding to the chip electrode on a display substrate. That is, the plurality of micro-plugs 12 are used to plug with a chip electrode and a substrate electrode respectively to achieve the binding of the Micro LED chip and the substrate. Specifically referring to FIG. 4, the main body 11 includes a first surface 111 and a second surface 112 opposite to each other in a first direction, and a side surface 115 located on the first surface 111 and the second surface 112. The plurality of micro-plugs 12 are a plurality of blades protruding from the side surface 115 and arranged around the main body 11, and each of the plurality of micro-plugs 12 includes a first plug end 123 and a second plug end 124 opposite to each other in the first direction. The first plug-in end 123 is used to plug into one of the two electrodes to be bound, and the second plug-in end 124 is used to plug into the other of the two electrodes to be bound. Referring to Figure 4, the main body 11 is, for example, a columnar structure, and 8 blade-shaped micro-connectors 12 are arranged around the main body 11. According to the orientation shown in Figure 4, the upper end of each micro-connector 12 is the first plug-in end 123, and the lower end is the second plug-in end 124. For example, when the Micro LED chip is bound to the display substrate, the upper end of each micro-connector 12 is plugged into the chip electrode, and the lower end of each micro-connector 12 is plugged into the substrate electrode. When repairing in this way, the physical plug-in of the micro-binding device 10 with the chip electrode and the substrate electrode replaces the heating and welding of the solder, and there is no need to perform single-point heating on the repair position, and it will not affect the adjacent soldered chips.
在一个实施例中，主体部11具有沿第二方向的第三宽度尺寸W3。第二方向垂直于第一方向。例如主体部11为柱状结构，该柱状结构的直径即为第三宽度尺寸W3。主体部11为图4所示的实心柱状结构时，第三宽度尺寸W3为100~1000纳米。每个微插接件12凸出于侧面115的叶片长度W4为1~2微米。微型绑定器件10的整体高度（第一表面111与第二表面之间的距离）为1~3微米。每个微插接件12的厚度D例如为100~1000nm。采用本实施例提供的微型绑定器件10进行修复的原理与前述第一实施例中相同。本实施例中，主体部11设置成微针结构，可以起到插接作用，以及将多个微插接件12设置成微叶片状结构，可以与两个待绑定电极插接的同时还起到辅助飞行准直的作用。In one embodiment, the main body 11 has a third width dimension W3 along the second direction. The second direction is perpendicular to the first direction. For example, the main body 11 is a columnar structure, and the diameter of the columnar structure is the third width dimension W3. When the main body 11 is a solid columnar structure as shown in FIG. 4, the third width dimension W3 is 100 to 1000 nanometers. The blade length W4 of each micro-connector 12 protruding from the side 115 is 1 to 2 micrometers. The overall height of the micro-binding device 10 (the distance between the first surface 111 and the second surface) is 1 to 3 micrometers. The thickness D of each micro-connector 12 is, for example, 100 to 1000 nm. The principle of repairing using the micro-binding device 10 provided in this embodiment is the same as that in the aforementioned first embodiment. In this embodiment, the main body 11 is set as a micro-needle structure, which can play a plug-in role, and the plurality of micro-connectors 12 are set as a micro-blade-shaped structure, which can be plugged with two electrodes to be bound and also play a role in assisting flight alignment.
在另一个实施例中，主体部11为空心柱状结构，参照图5主体部11上设置有沿第一表面111至第二表面112贯穿的通孔116。本实施例中，第三宽度尺寸W3为1~3微米。每个微插接件12凸出于侧面115的叶片长度W4为0.5~1微米。主体部11具有较宽的尺寸以保证微型绑定器件10的整体结构稳定性，同时通孔116的设置使得主体部11保持较薄的壁厚，更有利于插接。In another embodiment, the main body 11 is a hollow columnar structure. Referring to FIG. 5 , the main body 11 is provided with a through hole 116 extending from the first surface 111 to the second surface 112. In this embodiment, the third width dimension W3 is 1 to 3 microns. The blade length W4 of each micro-connector 12 protruding from the side 115 is 0.5 to 1 micron. The main body 11 has a relatively wide size to ensure the overall structural stability of the micro-binding device 10. At the same time, the provision of the through hole 116 allows the main body 11 to maintain a relatively thin wall thickness, which is more conducive to plugging.
在一个实施例中，每个微插接件12包括位于第一插接端123和第二插接端124之间的叶片中部125，第一插接端123和第二插接端124的厚度均小于等于叶片中部125的厚度。将第一插接端123和第二插接端124设置得比叶片中部得厚度更薄可以更有利于插接。In one embodiment, each micro-connector 12 includes a blade middle portion 125 located between a first plug end 123 and a second plug end 124, and the thickness of the first plug end 123 and the second plug end 124 are both less than or equal to the thickness of the blade middle portion 125. Setting the first plug end 123 and the second plug end 124 to be thinner than the thickness of the blade middle portion can facilitate plugging.
本申请上述第一实施例和第二实施例提供的微型绑定器件10的制备例如可以采用如下方法步骤实现：在基板上生长衬底，基板可以是玻璃基板或蓝宝石基板，衬底可以是氮化镓衬底；在衬底上涂覆光刻胶；按照微型绑定器件的形状曝光显影形成对应的图形。然后通过蒸镀、金属去除，去胶等工艺得到对应形状的金属块。The preparation of the micro-binding device 10 provided in the first embodiment and the second embodiment of the present application can be achieved, for example, by the following method steps: growing a substrate on a substrate, the substrate can be a glass substrate or a sapphire substrate, the substrate can be a gallium nitride substrate; coating a photoresist on the substrate; exposing and developing according to the shape of the micro-binding device to form a corresponding pattern. Then, a metal block of a corresponding shape is obtained by evaporation, metal removal, degumming and other processes.
【第三实施例】[Third embodiment]
参照图6，本申请第三实施例提供一种绑定背板100，包括基板20、微型电子器件30和前述第一实施例和第二实施例中的任意一种微型绑定器件10。其中基板20具有第一待绑定电极21。微型电子器件30具有第二待绑定电极31。微型绑定器件10设置在第一待绑定电极21和第二待绑定电极31之间。多个微插接件12中的至少部分微插接件12插接于第一待绑定电极21上、且多个微插接件12中的至少部分微插接件12插接于第二待绑定电极31上。6 , the third embodiment of the present application provides a binding backplane 100, comprising a substrate 20, a microelectronic device 30, and any one of the microbinding devices 10 in the first and second embodiments. The substrate 20 has a first electrode 21 to be bound. The microelectronic device 30 has a second electrode 31 to be bound. The microbinding device 10 is disposed between the first electrode 21 to be bound and the second electrode 31 to be bound. At least some of the microconnectors 12 among the plurality of microconnectors 12 are plugged into the first electrode 21 to be bound, and at least some of the microconnectors 12 among the plurality of microconnectors 12 are plugged into the second electrode 31 to be bound.
其中，微型电子器件30例如可以为Micro LED芯片或者其它具有类似修复需求的微型器件。基板20例如为Micro LED芯片的驱动阵列基板，其上还设置有用于驱动Micro LED芯片发光的驱动电路。将微型电子器件30的第二待绑定电极31与基板20上的第一待绑定电极21绑定实现二者的电连接。例如图6所示为采用第一实施例中提供的微型绑定器件10的绑定背板100的结构示意图。微型电子器件30具有两个第二待绑定电极31，基板20上设置有与该两个待绑定电极31对应的两个第一待绑定电极21，在每对第二绑定电极31和第一绑定电极21之间设置一个微型绑定器件10来实现绑定连接。例如采用第一实施例中的微型绑定器件10时，由多个第一微针121与第一待绑定电极21插接，由多个第二微针122与第二待绑定电极31插接。或者采用第二实施例中的微型绑定器件10时，则分别由多个微插接件12的第一插接端123与第一待绑定电极21插接，由多个微插接件12的第二插接端124与第二待绑定电极31插接。在一个实施例中，多个微插接件12的硬度大于第一待绑定电极21的硬度和第二待绑定电极31的硬度可以实现更好的插接绑定效果。Among them, the microelectronic device 30 can be, for example, a Micro LED chip or other microdevices with similar repair requirements. The substrate 20 is, for example, a drive array substrate of a Micro LED chip, on which a drive circuit for driving the Micro LED chip to emit light is also provided. The second electrode to be bound 31 of the microelectronic device 30 is bound to the first electrode to be bound 21 on the substrate 20 to achieve electrical connection between the two. For example, FIG. 6 shows a schematic diagram of the structure of the binding backplane 100 using the microbinding device 10 provided in the first embodiment. The microelectronic device 30 has two second electrodes to be bound 31, and two first electrodes to be bound 21 corresponding to the two electrodes to be bound 31 are provided on the substrate 20. A microbinding device 10 is provided between each pair of second binding electrodes 31 and the first binding electrode 21 to achieve binding connection. For example, when the microbinding device 10 in the first embodiment is used, a plurality of first microneedles 121 are plugged into the first electrode to be bound 21, and a plurality of second microneedles 122 are plugged into the second electrode to be bound 31. Alternatively, when the micro-binding device 10 in the second embodiment is used, the first plugging ends 123 of the plurality of micro-plugs 12 are plugged with the first electrode to be bound 21, and the second plugging ends 124 of the plurality of micro-plugs 12 are plugged with the second electrode to be bound 31. In one embodiment, the hardness of the plurality of micro-plugs 12 is greater than the hardness of the first electrode to be bound 21 and the hardness of the second electrode to be bound 31, so that a better plugging and binding effect can be achieved.
如图7所示，本申请的一个实施例还提供一种显示装置200，包括前述任意一项的绑定背板100，其中微型电子器件30为微型发光器件。As shown in FIG. 7 , an embodiment of the present application further provides a display device 200 , comprising any one of the aforementioned binding backplanes 100 , wherein the microelectronic device 30 is a micro light-emitting device.
采用了上述实施例提供的微型绑定器件10进行修复的绑定背板100和显示装置200的生产成本和工艺难度大大降低。The production cost and process difficulty of the binding backplane 100 and the display device 200 repaired by using the micro-binding device 10 provided in the above embodiment are greatly reduced.
以上所述，仅是本申请的较佳实施例而已，并非对本申请作任何形式上的限制，虽然本申请已以较佳实施例揭露如上，然而并非用以限定本申请，任何熟悉本专业的技术人员，在不脱离本申请技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本申请技术方案内容，依据本申请的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本申请技术方案的范围内。The above is only a preferred embodiment of the present application and does not constitute any form of limitation to the present application. Although the present application has been disclosed as a preferred embodiment as above, it is not intended to limit the present application. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the technical contents disclosed above without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims (13)

  1. 一种微型绑定器件（10），用于将两个待绑定电极绑定连接，所述微型绑定器件（10）包括：A micro-binding device (10) is used to bind and connect two electrodes to be bound, the micro-binding device (10) comprising:
    主体部（11）；Main body (11);
    多个微插接件（12），凸出于所述主体部（11），所述多个微插接件（12）相互间隔设置；A plurality of micro-connectors (12) protruding from the main body (11), the plurality of micro-connectors (12) being arranged at intervals from one another;
    其中，所述多个微插接件（12）用于分别与所述两个待绑定电极相互插接。Wherein, the plurality of micro-connectors (12) are used to be plugged into the two electrodes to be bound, respectively.
  2. 如权利要求1所述的微型绑定器件（10），其中，所述主体部（11）包括在第一方向上相对的第一表面（111）和第二表面（112）；所述多个微插接件（12）包括凸出于所述第一表面（111）的多个第一微针（121）和凸出于所述第二表面（112）的多个第二微针（122）；所述多个第一微针（121）用于分别于所述两个待绑定电极之一插接，所述多个第二微针（122）用于分别与所述两个待绑定电极之另一插接。The micro-binding device (10) as claimed in claim 1, wherein the main body (11) includes a first surface (111) and a second surface (112) opposite to each other in a first direction; the plurality of micro-connectors (12) include a plurality of first microneedles (121) protruding from the first surface (111) and a plurality of second microneedles (122) protruding from the second surface (112); the plurality of first microneedles (121) are used to be respectively plugged into one of the two electrodes to be bound, and the plurality of second microneedles (122) are used to be respectively plugged into the other of the two electrodes to be bound.
  3. 如权利要求2所述的微型绑定器件（10），其中，所述主体部（11）具有沿所述第一方向的第一高度尺寸和沿第二方向的第一宽度尺寸；所述第二方向垂直于所述第一方向；所述第一高度尺寸为1~3微米；所述第一宽度尺寸范围为1~5微米；所述多个第一微针（121）和所述多个第二微针（122）分别凸出于所述主体部（11）的高度范围为100~1000纳米；所述多个第一微针（121）中的每个第一微针（121）和所述多个第二微针（122）中的每个第二微针（122）具有沿所述第二方向的第二宽度尺寸，所述第二宽度尺寸的范围为100~1000纳米。A micro-binding device (10) as claimed in claim 2, wherein the main body (11) has a first height dimension along the first direction and a first width dimension along the second direction; the second direction is perpendicular to the first direction; the first height dimension is 1 to 3 microns; the first width dimension ranges from 1 to 5 microns; the heights of the plurality of first microneedles (121) and the plurality of second microneedles (122) protruding from the main body (11) are in the range of 100 to 1000 nanometers; each first microneedle (121) of the plurality of first microneedles (121) and each second microneedle (122) of the plurality of second microneedles (122) has a second width dimension along the second direction, and the second width dimension ranges from 100 to 1000 nanometers.
  4. 如权利要求2所述的微型绑定器件（10），还包括对称设置在所述主体部（11）在第二方向上相对两侧的第一飞行翼（131）和第二飞行翼（132）；所述第二方向垂直于所述第一方向；所述第一飞行翼（131）和所述第二飞行翼（132）分别沿所述第一方向延伸。The micro-binding device (10) according to claim 2 further comprises a first flying wing (131) and a second flying wing (132) symmetrically arranged on opposite sides of the main body (11) in a second direction; the second direction is perpendicular to the first direction; the first flying wing (131) and the second flying wing (132) extend respectively along the first direction.
  5. 如权利要求4所述的微型绑定器件（10），其中，所述主体部（11）上形成有在第三方向上对称设置的第一导向槽（113）和第二导向槽（114），所述第三方向垂直于所述第一方向；所述第一导向槽（113）和所述第二导向槽（114）分别沿所述第一方向贯通所述第一表面（111）和所述第二表面（112）。The micro-binding device (10) according to claim 4, wherein the main body (11) is formed with a first guide groove (113) and a second guide groove (114) symmetrically arranged in a third direction, and the third direction is perpendicular to the first direction; the first guide groove (113) and the second guide groove (114) respectively penetrate the first surface (111) and the second surface (112) along the first direction.
  6. 如权利要求1所述的微型绑定器件（10），其中，所述主体部（11）包括在第一方向上相对的第一表面（111）和第二表面（112），以及位于所述第一表面（111）和所述第二表面（112）的侧面（115）；所述多个微插接件（12）为分别凸出于所述侧面（115）并围绕所述主体部（11）设置的多个叶片，所述多个微插接件（12）中的每个所述微插接件（12）包括在所述第一方向上相对的第一插接端（123）和第二插接端（124）；所述第一插接端（123）用于与所述两个待绑定电极之一插接，所述第二插接端（124）用于与所述两个待绑定电极至另一插接。The micro-binding device (10) according to claim 1, wherein the main body (11) includes a first surface (111) and a second surface (112) opposite to each other in a first direction, and side surfaces (115) located on the first surface (111) and the second surface (112); the plurality of micro-connectors (12) are a plurality of blades respectively protruding from the side surfaces (115) and arranged around the main body (11), and each of the plurality of micro-connectors (12) includes a first plug-in end (123) and a second plug-in end (124) opposite to each other in the first direction; the first plug-in end (123) is used for plugging with one of the two electrodes to be bound, and the second plug-in end (124) is used for plugging with the other of the two electrodes to be bound.
  7. 如权利要求6所述的微型绑定器件（10），其中，所述主体部（11）具有沿第二方向的第三宽度尺寸；所述第二方向垂直于所述第一方向；所述第三宽度尺寸为100~1000纳米；每个所述微插接件（12）凸出于所述侧面（115）的叶片长度为1~2微米。The micro-binding device (10) according to claim 6, wherein the main body (11) has a third width dimension along a second direction; the second direction is perpendicular to the first direction; the third width dimension is 100-1000 nanometers; and the length of the blade of each micro-connector (12) protruding from the side surface (115) is 1-2 micrometers.
  8. 如权利要求6所述的微型绑定器件（10），其中，所述主体部（11）上设置有沿所述第一表面（111）至所述第二表面（112）贯穿的通孔（116）。The micro-binding device (10) according to claim 6, wherein the main body (11) is provided with a through hole (116) penetrating from the first surface (111) to the second surface (112).
  9. 如权利要求8所述的微型绑定器件（10），其中，所述主体部（11）具有沿有沿第二方向的第三宽度尺寸；所述第二方向垂直于所述第一方向；所述第三宽度尺寸为1~3微米；每个所述微插接件（12）凸出于所述侧面（115）的叶片长度为0.5~1微米。The micro-binding device (10) according to claim 8, wherein the main body (11) has a third width dimension along a second direction; the second direction is perpendicular to the first direction; the third width dimension is 1 to 3 microns; and the length of the blade of each micro-connector (12) protruding from the side surface (115) is 0.5 to 1 micron.
  10. 如权利要求6所述的微型绑定器件（10），其中，每个所述微插接件（12）包括位于所述第一插接端（123）和所述第二插接端（124）之间的叶片中部（125），所述第一插接端（123）和所述第二插接端（124）的厚度均小于等于所述叶片中部（125）的厚度。The micro-binding device (10) as claimed in claim 6, wherein each of the micro-connectors (12) includes a blade middle portion (125) located between the first plug end (123) and the second plug end (124), and the thickness of the first plug end (123) and the second plug end (124) are both less than or equal to the thickness of the blade middle portion (125).
  11. 一种绑定背板（100），包括：A binding backplane (100), comprising:
    基板（20），具有第一待绑定电极（21）；A substrate (20) having a first electrode to be bound (21);
    微型电子器件（30），具有第二待绑定电极（31）；A microelectronic device (30) having a second electrode to be bound (31);
    如权利要求1~10中任意一项所述的微型绑定器件（10），设置在所述第一待绑定电极（21）和所述第二待绑定电极（31）之间；所述多个微插接件（12）中的至少部分微插接件（12）插接于所述第一待绑定电极（21）上、且多个微插接件（12）中的至少部分微插接件（12）插接于所述第二待绑定电极（31）上。The micro-binding device (10) as claimed in any one of claims 1 to 10 is arranged between the first electrode (21) to be bound and the second electrode (31) to be bound; at least some of the plurality of micro-connectors (12) are plugged into the first electrode (21) to be bound, and at least some of the plurality of micro-connectors (12) are plugged into the second electrode (31) to be bound.
  12. 如权利要求11所述的绑定背板（100），其中，所述多个微插接件（12）的硬度大于所述第一待绑定电极（21）的硬度和所述第二待绑定电极（31）的硬度。The binding backplane (100) according to claim 11, wherein the hardness of the plurality of micro-connectors (12) is greater than the hardness of the first electrode to be bound (21) and the hardness of the second electrode to be bound (31).
  13. 一种显示装置，包括：A display device, comprising:
    如权利要求11~12中任意一项所述的绑定背板（100），其中所述微型电子器件（30）为微型发光器件。The binding backplane (100) according to any one of claims 11 to 12, wherein the microelectronic device (30) is a micro light-emitting device.
PCT/CN2022/133769 2022-11-23 2022-11-23 Micro bonding device, bonding backplane and display device WO2024108432A1 (en)

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