WO2024090272A1 - Module de source de lumière - Google Patents

Module de source de lumière Download PDF

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Publication number
WO2024090272A1
WO2024090272A1 PCT/JP2023/037416 JP2023037416W WO2024090272A1 WO 2024090272 A1 WO2024090272 A1 WO 2024090272A1 JP 2023037416 W JP2023037416 W JP 2023037416W WO 2024090272 A1 WO2024090272 A1 WO 2024090272A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
light source
protrusion
source module
metal
Prior art date
Application number
PCT/JP2023/037416
Other languages
English (en)
Japanese (ja)
Inventor
哲也 鈴木
吉正 村田
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Publication of WO2024090272A1 publication Critical patent/WO2024090272A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the technical field of light source modules that are attached to mounting members such as lamp housings.
  • Some vehicle lamps are provided with a light source module that is detachable from the lamp outer casing, which is made up of a lamp housing and a cover, and the light emitted from the light source of the light source module is transmitted through the cover and irradiated to the outside (see, for example, Patent Documents 1 and 2).
  • the light source module is provided with a heat dissipation section having heat dissipation fins for dissipating heat generated when the light source is operated to the outside.
  • a plate-shaped member formed of a metal material and functioning as a heat sink is provided, and the heat sink is covered with a resin material having thermal conductivity.
  • the heat sink is formed by bending a single metal plate into a specified shape.
  • the light source module of the present invention aims to improve heat dissipation without increasing the size.
  • the light source module comprises a board on which a light source is mounted, a board mounting section to which the board is mounted, a heat dissipation section having a plurality of heat dissipation fins that dissipate heat transferred through the board mounting section when the light source is driven, and a connector section having a power supply terminal connected to the board and a terminal holding section that holds the power supply terminal, the section having the board mounting section and the heat dissipation section being provided as a module main body, the module main body having a metal section and a resin section, the metal section being at least partially covered by the resin section, and being configured by joining a plurality of blocks.
  • the module body which has a board mounting section and a heat dissipation section, is configured to have a metal section to which multiple blocks are joined and a resin section that covers the metal section.
  • Another light source module comprises a board on which a light source is mounted, a board mounting section to which the board is mounted, a heat dissipation section having a plurality of heat dissipation fins that dissipate heat transferred through the board mounting section when the light source is driven, and a connector section having a power supply terminal connected to the board and a terminal holding section that holds the power supply terminal, the section having the board mounting section and the heat dissipation section being provided as a module main body, the module main body having a metal section and a resin section, the metal section being formed in a plate shape and at least partially covered by the resin section, and comprising a base section that constitutes a part of the board mounting section and at least three protrusions that constitute a part of the heat dissipation fins, the metal section being formed by the at least three protrusions protruding in different directions from the base section and bending each of the protrusions into a predetermined shape.
  • a single metal plate is bent into a specific shape to provide at least three sections that function as heat dissipation fins.
  • the module body having the board mounting portion and the heat dissipation portion is configured to have a metal portion to which multiple blocks are joined and a resin portion that covers the metal portion. This makes it possible to increase the thermal capacity of the metal portion by changing the number and shape of the blocks without increasing the external shape, thereby improving heat dissipation without increasing the size.
  • FIG. 2 to 6 show a first embodiment of the present invention, and this figure is a cross-sectional view of a vehicle lamp.
  • FIG. 2 is a perspective view of a light source module.
  • FIG. FIG. FIG. FIG. 13 is a perspective view showing a light source module having another configuration. 8 to 13 show a second embodiment of the present invention, and this figure is a cross-sectional view of a vehicle lamp.
  • FIG. 2 is a perspective view of a light source module.
  • FIG. FIG. FIG. FIG. 13 is a perspective view showing a metal part in a light source module having another configuration.
  • FIG. 13 is a rear view showing a light source module of another configuration.
  • the direction of the optical axis of the light emitted from the light source module is the front-rear direction, and the direction of light emission is forward, and the directions of front-rear, up-down, left-right are indicated. Note that the directions of front-rear, up-down, left-right are indicated below for the convenience of explanation, and the implementation of the present invention is not limited to these directions.
  • the vehicle lamp 1 comprises a lamp housing 2 with an opening at the front end and a cover 3 that closes the opening of the lamp housing 2 (see Figures 1 and 7).
  • the lamp housing 2 and the cover 3 form the lamp outer case 4, and the space inside the lamp outer case 4 is formed as the lamp chamber 5.
  • the lamp housing 2 constitutes part of the lamp housing 4 and also functions as a mounting member.
  • a reflector or the like may be provided as a mounting member other than the lamp housing 2.
  • the lamp housing 2 has a mounting hole 2a that penetrates from front to back.
  • a number of engagement grooves are formed around the mounting hole 2a in the lamp housing 2, spaced apart in the circumferential direction.
  • an optical element 6 made of, for example, a transparent resin material or glass material is arranged.
  • the optical element 6 for example, a light guide, an inner lens, a projection lens, etc. are used.
  • a light source module 7 according to a first embodiment will be described below (see Figs. 1 to 6).
  • the light source module 7 is detachably attached to the lamp housing 2 (see Figure 1).
  • the light source module 7 has a module body 8 and a connector portion 9 (see Figures 2 and 3).
  • the module body 8 has a heat dissipation section 10 and a board mounting section 11.
  • the heat dissipation section 10 has a substantially disk-shaped base surface section 12 facing in the front-to-rear direction, a pair of first heat dissipation fins 13 protruding rearward from the base surface section 12, and a second heat dissipation fin 14 protruding rearward from the base surface section 12.
  • the first heat dissipation fins 13 are positioned, for example, in a parallel state and spaced apart in the left-right direction.
  • the thickness direction of the first heat dissipation fins 13 is, for example, in the left-right direction.
  • the second heat dissipation fin 14 is positioned between a pair of first heat dissipation fins 13, and its thickness direction is perpendicular to the thickness direction of the first heat dissipation fin 13. Both the first heat dissipation fin 13 and the second heat dissipation fin 14 protrude rearward from the outer periphery or a portion close to the outer periphery of the base surface portion 12.
  • the board mounting portion 11 protrudes forward from the center of the base surface portion 12 and has a mounting insertion portion 15 formed with a circular outer shape and a number of mounting protrusions 16 protruding radially outward from the front end of the mounting insertion portion 15.
  • the mounting protrusions 16 are spaced apart in the circumferential direction.
  • the board mounting portion 11 has a placement recess 11a that opens forward.
  • the placement recess 11a is formed, for example, in a substantially rectangular shape.
  • the connector portion 9 is formed in a shape that extends in the front-rear direction, and is composed of a pair of power supply terminals 17 and a terminal holding portion 18 that holds the power supply terminals 17 (see FIG. 3).
  • the power supply terminals 17 are formed from a metal material
  • the terminal holding portion 18 is formed from a resin material.
  • the terminal holding portion 18 is formed in a cylindrical shape and protrudes rearward from the rear surface of the base surface portion 12, and is positioned in a space surrounded by a pair of first heat dissipation fins 13 and second heat dissipation fins 14. A portion of the power supply terminal 17 is inserted into the board mounting portion 11, the front end portion is positioned in the arrangement recess 11a, and the portion rearward from the board mounting portion 11 is positioned inside the terminal holding portion 18.
  • a connector (not shown) is inserted into the terminal holding portion 18, and the connector and the power supply terminal 17 are connected.
  • the module body 8 described above is composed of a metal part 19 and a resin part 20 (see Figures 2 to 5).
  • the metal part 19 and the resin part 20 are integrally formed by insert molding.
  • the power supply terminal 17 and the terminal holding part 18 of the connector part 9 and the metal part 19 and the resin part 20 of the module body 8 may be integrally formed by insert molding.
  • the metal part 19 is composed of, for example, three blocks. However, in the light source module 7, it is sufficient that the metal part 19 is composed of multiple blocks, and it may be composed of two blocks or four or more blocks.
  • the three blocks are provided as a pair of a first block 21 and a second block 22, and the first block 21 and the second block 22 are both formed from a metal material with high heat dissipation properties, such as aluminum or copper.
  • a metal material with high heat dissipation properties such as aluminum or copper.
  • the light source module 7 can be made lighter in weight in addition to having high heat dissipation properties.
  • the first block 21 and the second block 22 are both formed into a simple shape by extrusion molding.
  • the pair of first blocks 21 are formed in a symmetrical shape.
  • the first block 21 has a connecting plate portion 23 formed in a rectangular plate shape facing the front-rear direction, and a heat dissipation protrusion 24 protruding rearward from the outer end of the connecting plate portion 23 in the left-right direction.
  • a fitting protrusion 25 protrudes laterally from the inner end face in the left-right direction of the connecting plate portion 23.
  • the fitting protrusion 25 is formed in a shape that extends vertically.
  • the second block 22 is composed of a connecting plate portion 26 formed in the shape of a rectangular plate facing the front-rear direction, a heat dissipation protrusion 27 protruding rearward from approximately the upper half of the connecting plate portion 26, and a heat receiving portion 28 protruding forward from approximately the lower half of the connecting plate portion 26.
  • a fitting groove 29 extending vertically is formed on each of the left and right sides of the connecting plate portion 26.
  • the heat dissipation protrusion 27 is thicker than the heat dissipation protrusion 24, and has a larger volume and overall surface area. Therefore, the heat dissipation protrusion 27 is formed in a shape and size that allows for a sufficiently high amount of heat dissipation.
  • the metal part 19 is assembled by inserting the mating protrusions 25 of the pair of first blocks 21 into the mating grooves 29 of the second block 22 (see FIG. 5).
  • the metal part 19 assembled in this manner is placed inside a molding die (not shown) and is formed integrally with the resin part 20 by insert molding.
  • the fitting protrusion 25 of the first block 21 is inserted into the fitting groove 29 of the second block 22 to assemble the metal part 19, and the fitting protrusion 25 fits into the fitting groove 29 to join the first block 21 and the second block 22. This makes it possible to easily join the first block 21 and the second block 22 while ensuring high positional accuracy.
  • first block 21 is provided with a mating protrusion 25 and the second block 22 is formed with a mating groove 29, but conversely, the first block may be formed with a mating groove and the second block may be provided with a mating protrusion, which is inserted into the mating groove.
  • the resin part 20 is formed by solidifying the molten resin filled inside the molding die, and is composed of a first part 30, a second part 31, and a third part 32.
  • a first part 30, a second part 31, and a third part 32 are composed of a first part 30, a second part 31, and a third part 32.
  • PET polyethylene terephthalate
  • the resin part 20 is formed by solidifying the molten resin filled inside the molding die, and is composed of a first part 30, a second part 31, and a third part 32.
  • PET polyethylene terephthalate
  • thermally conductive filler or epoxy resin is used as the resin part 20.
  • the first part 30 is a part that covers the pair of connecting plate parts 23 and 26
  • the second part 31 is a part that covers the pair of heat dissipation protrusions 24 and 27
  • the third part 32 is a part that covers the heat receiving part 28.
  • the front surface of the heat receiving part 28 is exposed and not covered by the third part 32, and is formed as the board mounting surface 28a.
  • the first part 30 covers the pair of connecting plate parts 23 and 26 to form the base surface part 12 of the module body 8
  • the second part 31 covers the pair of heat dissipation protrusions 24 and 27 to form the pair of first heat dissipation fins 13 and second heat dissipation fins 14 of the module body 8
  • the third part 32 covers the heat receiving part 28 to form the board mounting part 11 of the module body 8.
  • a portion of the metal portion 19 is present inside the board mounting portion 11, and a portion of the metal portion 19 is also present inside each of the base surface portion 12, the first heat dissipation fin 13, and the second heat dissipation fin 14 of the heat dissipation portion 10.
  • the substrate 33 is attached to the substrate mounting surface 28a of the heat receiving portion 28, for example, by an adhesive having insulating and thermally conductive properties.
  • the substrate 33 is attached to the substrate mounting surface 28a while being inserted into the placement recess 11a.
  • a plurality of light sources 34 are mounted on the substrate 33 in a lined-up state.
  • a light emitting diode LED: Light Emitting Diode
  • a circuit pattern (not shown) is formed on the substrate 33, and a lighting circuit is configured.
  • the front ends of a pair of power supply terminals 17 are respectively joined to the terminal portions of the circuit pattern by, for example, soldering. Therefore, the light source 34 is connected to a power source on the vehicle side via the circuit pattern, the power supply terminals 17, and a connector, and the driving current generated by the lighting circuit is supplied to the light source 34.
  • annular gasket 35 is fitted onto the mounting insertion portion 15 of the board mounting portion 11 (see FIG. 1).
  • the gasket 35 is made of a resin material or a rubber material.
  • the light source module 7 is attached to the lamp housing 2 by inserting the board mounting portion 11 into the mounting hole 2a of the lamp housing 2 from the rear and rotating it circumferentially so that the mounting protrusions 16 engage with the respective engagement grooves. With the light source module 7 attached to the lamp housing 2, the gasket 35 prevents foreign matter such as moisture and dust from entering the lamp chamber 5 from the outside.
  • the mounting protrusion 16 is disengaged from the engagement groove, and the light source module 7 can be removed from the lamp housing 2.
  • a pair of first heat dissipation fins 13 are positioned parallel to each other and spaced apart from each other on the left and right, and the second heat dissipation fin 14 is positioned above the connector portion 9.
  • a driving current generated by the lighting circuit is supplied to the light source 34 from the vehicle side power source via the power supply terminal 17, and light is emitted from the light source 34.
  • the light emitted from the light source 34 is incident on the optical member 6, and the direction of travel is controlled by the optical member 6, and the light is transmitted through the cover 3 and irradiated to the outside.
  • the second heat dissipation fin 14 is positioned above the connector part 9 with its thickness direction in the up-down direction, so convection may not occur easily on the underside of the second heat dissipation fin 14.
  • the heat dissipation protrusion 27 of the second heat dissipation fin 14 is made thicker, increasing its volume and overall surface area, and increasing its thermal capacity. Therefore, a sufficient amount of heat dissipation can be ensured in the second heat dissipation fin 14 with respect to the heat generated when the light source 34 is driven.
  • first heat dissipation fins 13 are positioned on both the left and right sides of the connector part 9 with their thickness direction aligned in the left-right direction, convection currents from below to above tend to occur near both the left and right sides of the first heat dissipation fins 13, and a sufficient amount of heat can be dissipated from the first heat dissipation fins 13 with respect to the heat generated when the light source 34 is driven.
  • the module body 8 has a metal part 19 and a resin part 20, the metal part 19 is at least partially covered by the resin part 20, and the metal part 19 is formed by joining multiple blocks (a pair of a first block 21 and a second block 22).
  • the module body 8 including the board mounting section 11 and the heat dissipation section 10 is configured to have a metal section 19 to which multiple blocks are joined and a resin section 20 that covers the metal section 19. This makes it possible to increase the thermal capacity of the metal section by changing the number and shape of the blocks without increasing the external shape, thereby improving heat dissipation without increasing the size.
  • the metal part 19 is made up of multiple blocks joined together, it is possible to increase its volume and heat capacity, which increases the amount of heat generated when the light source 34 is driven and is absorbed by the metal part 19, ensuring sufficiently high heat dissipation performance of the light source module 7.
  • the heat dissipation protrusions 24, 27 are covered by the resin part 20, but for example, the heat dissipation protrusions 24, 27 may be configured to be exposed and not covered by the resin part 20 (see FIG. 6).
  • the first heat dissipation fin 13 is configured only by the heat dissipation protrusion 24
  • the second heat dissipation fin 14 is configured only by the heat dissipation protrusion 27, and the resin part 20 is configured without the second portion 31.
  • a light source module 7 configured in this way, less resin material is required to form the heat dissipation section 10, and because the heat dissipation protrusions 24, 27 are made of a metal material, a sufficient amount of heat can be dissipated from the heat dissipation protrusions 24, 27. Therefore, it is possible to reduce the manufacturing cost of the light source module 7 while ensuring high heat dissipation performance.
  • the light source module 7 may be configured, for example, with four heat dissipation fins positioned on the top, bottom, left, and right sides of the connector portion 9.
  • the light source module 7 may be configured with five or more heat dissipation fins positioned around the connector portion 9.
  • the light source module 57 is detachably attached to the lamp housing 2 (see Figure 7).
  • the light source module 57 has a module body 58 and a connector portion 59 (see Figures 8 and 9).
  • the module body 58 has a heat dissipation section 60 and a board mounting section 61.
  • the heat dissipation section 60 has a substantially disk-shaped base surface section 62 facing in the front-to-rear direction, a pair of first heat dissipation fins 63 protruding rearward from the base surface section 62, and a second heat dissipation fin 64 protruding rearward from the base surface section 62.
  • the first heat dissipation fins 63 are positioned, for example, in a parallel state and spaced apart in the left-right direction.
  • the thickness direction of the first heat dissipation fins 63 is, for example, in the left-right direction.
  • the second heat dissipation fin 64 is positioned between a pair of first heat dissipation fins 63, and its thickness direction is perpendicular to the thickness direction of the first heat dissipation fin 63. Both the first heat dissipation fin 63 and the second heat dissipation fin 64 protrude rearward from the outer periphery or a portion close to the outer periphery of the base surface portion 62.
  • the board mounting portion 61 protrudes forward from the center of the base surface portion 62 and has a mounting insertion portion 65 formed with a circular outer shape and a number of mounting protrusions 66 protruding radially outward from the front end of the mounting insertion portion 65.
  • the mounting protrusions 66 are spaced apart in the circumferential direction.
  • the board mounting portion 61 is formed with a placement recess 11a that opens forward.
  • the placement recess 11a is formed, for example, in a substantially rectangular shape.
  • the connector portion 59 is formed in a shape that extends in the front-rear direction and is composed of a pair of power supply terminals 67 and a terminal holding portion 68 that holds the power supply terminals 67 (see FIG. 9).
  • the power supply terminals 67 of the connector portion 59 are formed from a metal material, and the terminal holding portion 68 is formed from a resin material.
  • the terminal holding portion 68 is formed in a cylindrical shape and protrudes rearward from the rear surface of the base surface portion 62, and is positioned in a space surrounded by a pair of first and second heat dissipation fins 63 and 64.
  • a portion of the power supply terminal 67 is inserted into the board mounting portion 61, the front end portion is positioned in the arrangement recess 11a, and the portion rearward from the board mounting portion 61 is positioned inside the terminal holding portion 68.
  • a connector (not shown) is inserted into the terminal holder 68, and the connector is connected to the power supply terminal 67.
  • the module body 58 described above is composed of a metal part 69 and a resin part 70 (see Figures 8 and 9).
  • the metal part 69 and the resin part 70 are integrally formed by insert molding.
  • the power supply terminal 67 and the terminal holding part 68 of the connector part 59 and the metal part 69 and the resin part 70 of the module body 58 may be integrally formed by insert molding.
  • the metal part 69 is formed by bending a single metal plate 69X into a predetermined shape (see Figures 10 and 11).
  • the metal plate 69X is, for example, T-shaped (see FIG. 10).
  • the metal plate 69X is made up of a first bar 71 that corresponds to the horizontal bar of the T and a second bar 72 that corresponds to the vertical bar of the T, with the second bar 72 continuing to the center of the first bar 71 in the longitudinal direction so that the first bar 71 and the second bar 72 are perpendicular to each other.
  • the center of the metal plate 69X in the longitudinal direction is made into a reference portion 71a where the second bar 72 is continued.
  • the metal part 69 is formed by bending a metal plate 69X into a predetermined shape using a reference part 71a as a reference (see FIG. 11). Therefore, the part of the metal part 69 that corresponds to the reference part 71a is the base part 73 that serves as the reference for bending.
  • the base part 73 is formed in a rectangular shape.
  • the metal part 69 is made of a metal material with high heat dissipation properties, such as aluminum or copper.
  • the metal part 69 out of aluminum the light source module 57 can be made lighter in weight in addition to having high heat dissipation properties.
  • the metal portion 69 is composed of a base portion 73 as well as a first protrusion 74, a second protrusion 75, and a third protrusion 76, each of which is connected to the base portion 73.
  • the first protrusion 74 and the second protrusion 75 are formed in a symmetrical shape with respect to the base portion 73.
  • the first protrusion 74 and the second protrusion 75 are each connected to sides 73p and 73q located on opposite sides of the base portion 73, and the third protrusion 76 is connected to side 73r between sides 73p and 73q of the base portion 73.
  • the first protrusion 74 is composed of a continuous portion 74a bent at a right angle to the base portion 73, an intermediate portion 74b bent at a right angle to the continuous portion 74a, and a heat dissipation plate portion 74c bent at a right angle to the intermediate portion 74b.
  • the bending direction of the continuous portion 74a relative to the base portion 73 is opposite to the bending direction of the intermediate portion 74b relative to the continuous portion 74a, and the bending direction of the continuous portion 74a relative to the base portion 73 is the same as the bending direction of the heat dissipation plate portion 74c relative to the intermediate portion 74b.
  • the second protrusion 75 is composed of a continuous portion 75a bent at a right angle to the base portion 73, an intermediate portion 75b bent at a right angle to the continuous portion 75a, and a heat dissipation plate portion 75c bent at a right angle to the intermediate portion 75b.
  • the bending direction of the continuous portion 75a relative to the base portion 73 is opposite to the bending direction of the intermediate portion 75b relative to the continuous portion 75a, and the bending direction of the continuous portion 75a relative to the base portion 73 is the same as the bending direction of the heat dissipation plate portion 75c relative to the intermediate portion 75b.
  • the third protrusion 76 is composed of a continuous portion 76a bent at a right angle to the base portion 73, an intermediate portion 76b bent at a right angle to the continuous portion 76a, and a heat dissipation plate portion 76c bent at a right angle to the intermediate portion 76b.
  • the bending direction of the continuous portion 76a relative to the base portion 73 is opposite to the bending direction of the intermediate portion 76b relative to the continuous portion 76a, and the bending direction of the continuous portion 76a relative to the base portion 73 is the same as the bending direction of the heat dissipation plate portion 76c relative to the intermediate portion 76b.
  • portions 74a, 75a, 76a are arranged to protrude rearward from base portion 73, and heat dissipation plate portions 74c, 75c, 76c are arranged to protrude rearward from intermediate portions 74b, 75b, 76b, respectively.
  • the metal part 69 is placed inside a molding die (not shown) and is formed integrally with the resin part 70 by insert molding.
  • the resin part 70 is formed by solidifying the molten resin filled inside the molding die, and is composed of a first part 77, a second part 78, and a third part 79 (see Figures 8 and 9).
  • a first part 77, a second part 78, and a third part 79 see Figures 8 and 9.
  • PET polyethylene terephthalate
  • the resin part 70 is formed by solidifying the molten resin filled inside the molding die, and is composed of a first part 77, a second part 78, and a third part 79 (see Figures 8 and 9).
  • PET polyethylene terephthalate
  • thermally conductive filler or epoxy resin is used as the resin part 70.
  • the first part 77 is a part that covers the intermediate parts 74b, 75b, and 76b
  • the second part 78 is a part that covers the heat dissipation plate parts 74c, 75c, and 76c
  • the third part 79 is a part that covers the base part 73 and the continuous parts 74a, 75a, and 76a.
  • the front surface of the base part 73 is exposed and not covered by the third part 79, and is formed as the board mounting surface 73a.
  • the first part 77 covers the intermediate parts 74b, 75b, 76b to form the base surface part 62 of the module body 58
  • the second part 78 covers the heat dissipation plate parts 74c, 75c, 76c to form the pair of first and second heat dissipation fins 63 and 64 of the module body 58
  • the third part 79 covers the base part 73 and the continuous parts 74a, 75a, 76a to form the board mounting part 61 of the module body 58.
  • a portion of the metal portion 69 is present inside the board mounting portion 61, and a portion of the metal portion 69 is also present inside each of the base surface portion 62, the first heat dissipation fin 63, and the second heat dissipation fin 64 of the heat dissipation portion 60.
  • the substrate 33 is attached to the substrate mounting surface 73a of the base portion 73, for example, by an adhesive having insulating and thermally conductive properties.
  • the substrate 33 is attached to the substrate mounting surface 73a while being inserted into the placement recess 11a.
  • a plurality of light sources 34 are mounted on the substrate 33 in a lined-up state.
  • a light emitting diode LED: Light Emitting Diode
  • a circuit pattern (not shown) is formed on the substrate 33, and a lighting circuit is configured.
  • the front ends of a pair of power supply terminals 67 are joined to the terminal portions of the circuit pattern, for example, by soldering. Therefore, the light source 34 is connected to a power source on the vehicle side via the circuit pattern, the power supply terminals 67, and a connector, and the driving current generated by the lighting circuit is supplied to the light source 34.
  • annular gasket 35 is fitted onto the mounting insertion portion 65 of the board mounting portion 61 (see FIG. 7).
  • the gasket 35 is made of a resin material or a rubber material.
  • the light source module 57 is attached to the lamp housing 2 by inserting the board mounting portion 61 into the mounting hole 2a of the lamp housing 2 from the rear and rotating it circumferentially so that the mounting protrusions 66 engage with the respective engagement grooves.
  • the gasket 35 prevents foreign matter such as moisture and dust from entering the lamp chamber 5 from the outside.
  • the mounting protrusion 66 is disengaged from the engagement groove, and the light source module 57 can be removed from the lamp housing 2.
  • a pair of first heat dissipation fins 63 are positioned parallel to each other and spaced apart from each other on the left and right, and the second heat dissipation fin 64 is positioned above the connector portion 59.
  • the light source module 57 When the light source module 57 is attached to the lamp housing 2 and the connector is connected to the connector portion 59, a driving current generated by the lighting circuit is supplied to the light source 34 from the vehicle side power source via the power supply terminal 67, causing light to be emitted from the light source 34.
  • the light emitted from the light source 34 is incident on the optical member 6, the direction of travel of which is controlled by the optical member 6, and the light is transmitted through the cover 3 and irradiated to the outside.
  • the light source 34 When the light source 34 is driven (emitting light), heat is generated in the light source 34 and the substrate 33.
  • the generated heat is transferred from the substrate mounting portion 61 to the heat dissipation portion 60, and is mainly released from the pair of first heat dissipation fins 63 and second heat dissipation fins 64.
  • most of the heat is transferred from the base portion 73 of the metal portion 69 through the continuous portions 74a, 75a, 76a and the intermediate portions 74b, 75b, 76b to the heat dissipation plate portions 74c, 75c, 76c. Therefore, the temperature rise of the light source 34 is suppressed, and good light emission state of the light source 34 is ensured.
  • the second heat dissipation fin 64 is positioned above the connector part 59 with its thickness direction oriented vertically, so convection may not occur easily on the underside of the second heat dissipation fin 64, but the heat dissipation plate part 76c of the metal part 69 is present inside the second heat dissipation fin 64. Therefore, a sufficient amount of heat dissipation can be ensured in the second heat dissipation fin 64 with respect to the heat generated when the light source 34 is driven.
  • first heat dissipation fins 63 are positioned on both the left and right sides of the connector section 59 with their thickness direction aligned in the left-right direction, convection currents from below to above tend to occur near both the left and right sides of the first heat dissipation fins 63, and a sufficient amount of heat can be dissipated from the first heat dissipation fins 63 with respect to the heat generated when the light source 34 is driven.
  • the light source module 57 having three heat dissipation fins positioned around the connector portion 59 is shown, but the light source module 57 may be configured, for example, with four heat dissipation fins positioned above, below, left, and right of the connector portion 59. In addition, the light source module 57 may be configured with five or more heat dissipation fins positioned around the connector portion 59.
  • the metal part 69 is composed of a base part 73 that constitutes part of the board mounting part 61 and three protrusions (first protrusion 74, second protrusion 75, and third protrusion 76) that constitute part of each of the first heat dissipation fin 63 and the second heat dissipation fin 64, and the metal part 69 is formed by the three protrusions protruding in different directions from the base part 73 and each protrusion being bent into a predetermined shape.
  • one metal plate 69X is bent into a specific shape to provide three sections that function as heat dissipation fins, making it possible to increase the heat dissipation area without increasing the number of parts, and improving heat dissipation without increasing manufacturing costs.
  • a first protrusion 74, a second protrusion 75, and a third protrusion 76 are provided as protrusions, with the first protrusion 74 and the second protrusion 75 protruding in opposite directions from the base portion 73, and the third protrusion 76 protruding in a direction perpendicular to the first protrusion 74 and the second protrusion 75.
  • the metal portion 69 is formed in a T-shape before being bent (metal plate 69X), and the metal portion 69 is formed in a simple shape, which allows for further reduction in manufacturing costs and improved heat dissipation.
  • first protrusion 74 constituting one of the first heat dissipation fins 63 and the second protrusion 75 constituting the other of the first heat dissipation fins 63 are positioned in parallel.
  • the orientation of the two first heat dissipation fins 63 each having a first protrusion 74 and a second protrusion 75, in a predetermined direction, high heat dissipation can be ensured.
  • the thickness direction of the two first heat dissipation fins 63 the left-right direction, convection from below to above is likely to occur near both the left and right side surfaces of the first heat dissipation fin 63, and high heat dissipation can be ensured.
  • the metal part 69 is provided on each of the board mounting part 61 and the heat dissipation part 60, heat generated when the light source 34 is driven is transferred from the part of the metal part 69 provided on the board mounting part 61 to the part of the metal part 69 provided on the heat dissipation part 60 and is then dissipated from the heat dissipation part 60, thereby ensuring even higher heat dissipation performance in the light source module 57.
  • At least the tip end portion of the third protrusion 76 may be bifurcated into two parts to form a branch portion 80 (see Figures 12 and 13).
  • each branch 80 can be made part of the second heat dissipation fin 64A.
  • each second heat dissipation fin 64A is composed of a branch 80 and a part of the resin part 70 that covers the branch 80.
  • the thickness direction of the two second heat dissipation fins 64A is in the same direction as the thickness direction of the first heat dissipation fin 63, and they are positioned in parallel to the first heat dissipation fin 63. Therefore, when the light source module 57 is attached to the lamp housing 2, the two first heat dissipation fins 63 and the two second heat dissipation fins 64A are positioned in parallel, separated from each other on the left and right.
  • each branching portion 80 is provided as part of the second heat dissipation fin 64A, so the number of second heat dissipation fins 64A increases and the heat dissipation area becomes larger, thereby further improving heat dissipation.
  • the second heat dissipation fins 64A can be positioned parallel to the first heat dissipation fins 63, for example, lined up in the left-right direction, convection from below to above is more likely to occur near both the left and right sides of the second heat dissipation fins 64 in addition to near both the left and right sides of the first heat dissipation fins 63, ensuring even higher heat dissipation performance.
  • the heat dissipation plate section 76c may be branched into three or more branches 80.
  • the number of heat dissipation fins can be increased accordingly to increase the heat dissipation area, thereby improving heat dissipation.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne un module de source de lumière comprenant un substrat sur lequel est montée une source de lumière, un support de substrat sur lequel est fixé le substrat, une partie de rayonnement de chaleur ayant une pluralité d'ailettes de rayonnement de chaleur pour rayonner de la chaleur transférée par l'intermédiaire du support de substrat lorsque la source de lumière fonctionne et une partie connecteur comprenant des bornes d'alimentation électrique connectées au substrat et une partie de maintien de borne qui maintient les bornes d'alimentation électrique. Des portions comprenant à la fois le support de substrat et la partie de rayonnement de chaleur ont été disposées en tant que corps principal de module. Le corps principal de module est constitué d'une pluralité de blocs joints les uns aux autres, chaque bloc comprenant une portion métallique et une portion résineuse, au moins une partie de la portion métallique étant recouverte de la portion résineuse.
PCT/JP2023/037416 2022-10-28 2023-10-16 Module de source de lumière WO2024090272A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022-173701 2022-10-28
JP2022173701 2022-10-28
JP2022178112 2022-11-07
JP2022-178112 2022-11-07

Publications (1)

Publication Number Publication Date
WO2024090272A1 true WO2024090272A1 (fr) 2024-05-02

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Country Link
WO (1) WO2024090272A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009205834A (ja) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd 車両用灯具
JP2020004687A (ja) * 2018-07-02 2020-01-09 株式会社小糸製作所 灯具ユニット及び車両用灯具並びに灯具ユニット製造方法
JP2020149945A (ja) * 2019-03-15 2020-09-17 東芝ライテック株式会社 車両用照明装置、および車両用灯具
JP2022060094A (ja) * 2020-10-02 2022-04-14 株式会社小糸製作所 灯具ユニット

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009205834A (ja) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd 車両用灯具
JP2020004687A (ja) * 2018-07-02 2020-01-09 株式会社小糸製作所 灯具ユニット及び車両用灯具並びに灯具ユニット製造方法
JP2020149945A (ja) * 2019-03-15 2020-09-17 東芝ライテック株式会社 車両用照明装置、および車両用灯具
JP2022060094A (ja) * 2020-10-02 2022-04-14 株式会社小糸製作所 灯具ユニット

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