WO2024076073A1 - Microphone and human body-implantable device including same - Google Patents

Microphone and human body-implantable device including same Download PDF

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Publication number
WO2024076073A1
WO2024076073A1 PCT/KR2023/014636 KR2023014636W WO2024076073A1 WO 2024076073 A1 WO2024076073 A1 WO 2024076073A1 KR 2023014636 W KR2023014636 W KR 2023014636W WO 2024076073 A1 WO2024076073 A1 WO 2024076073A1
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WO
WIPO (PCT)
Prior art keywords
sensor
sensor package
microphone
disposed
elastic support
Prior art date
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PCT/KR2023/014636
Other languages
French (fr)
Korean (ko)
Inventor
정주용
오승하
구운회
Original Assignee
원광대학교산학협력단
서울대학교산학협력단
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Application filed by 원광대학교산학협력단, 서울대학교산학협력단 filed Critical 원광대학교산학협력단
Publication of WO2024076073A1 publication Critical patent/WO2024076073A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/36036—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation of the outer, middle or inner ear
    • A61N1/36038—Cochlear stimulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H04R25/606—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers acting directly on the eardrum, the ossicles or the skull, e.g. mastoid, tooth, maxillary or mandibular bone, or mechanically stimulating the cochlea, e.g. at the oval window

Definitions

  • the present invention relates to a microphone and a human implant device including the same.
  • a cochlear implant is a machine that replaces the cochlea for patients with severe hearing loss in whom the cochlea cannot function due to damage to the auditory cells in the cochlea. It stimulates the auditory nerve to produce sound by inserting electrodes into the cochlea and applying electrical stimulation. It operates on the principle of detecting.
  • cochlear implants receive sound through a microphone in an external device, analyze it by frequency and time in a sound processor, convert it into an electrical signal, and transmit it to a stimulator implanted in the body. Then, the sound is transmitted to the auditory nerve through electrodes implanted in the cochlea. It was designed to stimulate this.
  • the external microphone and speech analyzer function as the outer ear, middle ear, and auditory cells to convert sound stimulation into electrical energy and transmit it to the electrodes within the cochlea.
  • implantable hearing devices such as cochlear implants and middle ear implants have disadvantages such as the social stigma of being hearing impaired and restrictions on physical activities such as swimming due to external devices such as external microphones for hearing loss patients.
  • the fully implantable cochlear implants developed to date are in the research stage and have not yet been commercialized.
  • the reason is that in the case of subcutaneous implantable microphones, which are widely used in fully implantable middle ear implants and fully implantable cochlear implants, it is difficult to hear sound due to noise caused by masticatory movements and skin friction, and the high frequency sensitivity of the microphone is low due to subcutaneous implantation. This is because the problem of deterioration occurs.
  • Embodiments aim to provide a sensor package inserted into the human body and a microphone including the same.
  • a microphone includes a sensor package and an elastic supporter supporting a lower portion of the sensor package, the sensor package including a lower film disposed on the elastic supporter, a sensor disposed on the lower film, and the sensor. It includes an upper membrane disposed on the upper membrane and a case surrounding the lower membrane and the outer side of the upper membrane, and the elastic support is disposed between the sensor package and the cochlear shell (Promontory) to hold the upper membrane and the malleus handle. It can be adhered closely.
  • the sensor package may include a support substrate disposed on the lower membrane and a osteoarthritis support portion disposed between the sensor and the upper membrane.
  • the upper membrane is in contact with the malleus handle and is manufactured in a circular or ring shape to adjust the elastic modulus
  • the lower membrane is in contact with the elastic support and is manufactured in a circular or ring shape to adjust the elastic modulus.
  • the lower membrane is made of an elastic material or a rigid material
  • the elastic support has a cross-section of any one of a square, trapezoid, and oval shape
  • the upper surface of the elastic support has a flat surface and the lower surface is convex. It may have a concave shape to fit closely to the cochlear shell.
  • the vertebral disease support portion contacts the upper membrane and the sensor, and the cross section of the vertebral disease support portion has a tapered shape that becomes narrower as it approaches the sensor, so that vibration energy can be amplified and transmitted to the sensor.
  • the case may include an extension portion that extends downward and accommodates the elastic support.
  • a plurality of electrodes are disposed on the lower part of the extension part, and the plurality of electrodes can apply stimulation signals to the cochlear shell.
  • a microphone includes a sensor package and an elastic supporter supporting a lower portion of the sensor package, wherein the sensor package includes a case, a sensor disposed within the case, and a vertical member disposed on the sensor and in contact with the sensor. , and a resin that fills the case, wherein the resin is cured while surrounding the vertical member, and the elastic support is disposed between the sensor package and the cochlear shell (Promontory) to form a contact between the sensor package and the malleus handle. can be brought into close contact.
  • the resin is polydimethylsiloxane (PDMS), siloxane-based resin, liquid silicone rubber (LSR), fluorosilicone, polyurethane, and It may include at least one selected from the group consisting of thermoplastic elastomer (TPE).
  • PDMS polydimethylsiloxane
  • LSR liquid silicone rubber
  • fluorosilicone polyurethane
  • TPE thermoplastic elastomer
  • the case includes a lower surface, a side surrounding the outside of the lower surface, and an internal space surrounded by the lower surface and the side, and the sensor is disposed on the lower surface and the internal space. It can be stored in .
  • At least a portion of the internal space may be filled with the resin, and at least a portion of the vertical member may be present in the resin.
  • all of the vertical members may be in the resin.
  • the resin includes a first resin layer disposed on the sensor and a second resin layer other than the first resin layer, and the vertical length d2 of the vertical member is the first resin layer disposed on the sensor. 1 It may be 2/3 or more of the vertical length (d1) of the resin layer.
  • the vertical length (d3) from the upper surface of the vertical member to the upper surface of the first resin layer may be less than 1/3 of the vertical length (d2) of the vertical member.
  • the senor includes a diaphragm area, and the area of the area where the sensor contacts the vertical member may be less than 80% of the area of the diaphragm area.
  • a microphone according to another embodiment may further include a coating layer covering the outside of the sensor package.
  • the coating layer may be formed by Parylene coating.
  • a human implant device includes a microphone and a stimulation device that communicates with the microphone, the microphone includes a sensor package and an elastic support body supporting a lower portion of the sensor package, and the sensor package includes the elastic support. It includes a lower membrane disposed on a support, a sensor disposed on the lower membrane, an upper membrane disposed on the sensor, and a case surrounding the outside of the lower membrane and the upper membrane, wherein the elastic support is connected to the sensor package and the cochlea. It is placed between the promontory and can bring the upper membrane and the malleus handle into close contact.
  • the sensor package may include a support substrate disposed on the lower membrane and a osteoarthritis support portion disposed between the sensor and the upper membrane.
  • the upper membrane is in contact with the malleus handle and is made in a circular or ring shape to adjust the elastic modulus
  • the lower membrane is in contact with the elastic support and is made in a circular or ring shape to control the elastic modulus.
  • the lower membrane is made of an elastic material or a rigid material
  • the elastic support has a cross-section of any one of a square, trapezoid, and oval shape
  • the upper surface of the elastic support has a flat surface and the lower surface is convex. It may have a concave shape to fit closely to the cochlear shell.
  • a human implant device includes a microphone and a stimulation device that communicates with the microphone, the microphone includes a sensor package and an elastic support for supporting a lower portion of the sensor package, the sensor package includes a case, It includes a sensor disposed in the case, a vertical member disposed on the sensor and in contact with the sensor, and a resin that fills the case. The resin is cured while surrounding the vertical member, and the elastic support is connected to the sensor package and the cochlear shell. It can be placed between the promontory and bring the sensor package and the malleus handle into close contact.
  • the physiological amplification mechanisms of the outer and middle ear such as the collection effect of the auricle and eardrum and the resonance effect of the external auditory canal, can be used as is, and the directionality of sound can also be obtained.
  • the microphone can be installed with good performance.
  • the malleus support is formed in a tapered shape, so it can collect energy and transmit it to the sensor, which has the advantage of acting as an amplification.
  • the microphone can be used as a microphone at the input of an inner ear or middle ear stimulation device.
  • FIG. 1 is a perspective view of a microphone according to an embodiment of the present invention.
  • Figure 2 is a modified example of the upper film according to an embodiment of the present invention.
  • Figure 3 is a modified example of the lower film according to an embodiment of the present invention.
  • Figure 4 is an exemplary diagram of a microphone according to an embodiment of the present invention applied to the human body.
  • Figure 5 is a partially enlarged view of Figure 4.
  • Figure 6 is a first modified example of Figure 1.
  • Figure 7 is a view showing the lower surface of the extension part according to an embodiment of the present invention.
  • Figure 8 is a second modified example of Figure 1.
  • Figure 9 is a partially cut away perspective view of a microphone according to another embodiment of the present invention.
  • Figure 10a is a plan view showing a first modified example of the lower surface according to another embodiment of the present invention.
  • Figure 10b is a plan view showing a second modified example of the lower surface according to another embodiment of the present invention.
  • 11A to 11C are longitudinal cross-sectional views for explaining components included in a sensor package according to another embodiment of the present invention.
  • Figure 11d is a longitudinal cross-sectional view showing several modified examples of the longitudinal cross-section of the vertical member of the present invention.
  • Figure 11e is a cross-sectional view showing various modifications of the cross-section of the vertical member of the present invention.
  • Figure 11f is a graph comparing sensor sensitivity according to the presence or absence of the vertical member of the present invention.
  • Figure 12 is a longitudinal cross-sectional view of a sensor package according to another embodiment of the present invention.
  • Figure 13a is a partially enlarged view of the upper part of line I-I' in Figure 12.
  • Figures 13b and 13c are graphs comparing the force applied to the sensor according to the height of the vertical member of the present invention.
  • Figure 14 is a plan view showing a sensor according to another embodiment of the present invention.
  • Figure 15 is a partially cut away perspective view of a microphone according to another embodiment of the present invention.
  • Figure 16 is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention.
  • FIG. 17 is a partially enlarged view of the upper part of line I-I” in FIG. 16.
  • Figure 18 is a longitudinal cross-sectional view of a sensor package according to another embodiment of the present invention.
  • Figure 19 is an example diagram of a microphone according to another embodiment of the present invention applied to the human body.
  • Figure 20 is a block diagram of a human implant device according to an embodiment of the present invention.
  • At least one should be understood to include all possible combinations from one or more related items.
  • “at least one of the first item, the second item, and the third item” means each of the first item, the second item, or the third item, as well as two of the first item, the second item, and the third item. It means a combination of all items that can be presented from more than one.
  • on means not only the case where a certain configuration is formed directly on top of another configuration, but also the case where a third configuration is interposed between these configurations.
  • Figure 1 is a perspective view of an implantable microphone according to an embodiment of the present invention.
  • Figure 2 is a modified example of the upper membrane.
  • Figure 3 is a modified example of the lower membrane.
  • Figure 4 is an example of an implantable microphone applied to the human body.
  • Figure 5 is a partially enlarged view of Figure 4.
  • a microphone may include a sensor package 100 and an elastic support 200 supporting the lower portion of the sensor package 100.
  • the sensor package 100 can be inserted into the human body through surgery, and the elastic support 200 can be arranged so that the sensor package 100 is in close contact with the human body.
  • the sensor package 100 includes a lower membrane 110 disposed on the elastic support 200, a sensor 130 disposed on the lower membrane 110, an upper membrane 120 disposed on the sensor 130, and It may include a case 160.
  • the lower membrane 110 and the upper membrane 120 are biocompatible materials and may include an elastic material.
  • the lower film 110 and the upper film 120 may include materials such as PDMS, TPU, polyurethane, and silicone.
  • the lower film 110 and the upper film 120 may be fixed to the case 160.
  • Case 160 is a biocompatible material and may be made of rigid material.
  • the case 160 may include titanium or PPEK.
  • the upper film 120 and the lower film 110 may be formed in a circular film structure or a ring structure.
  • the upper membrane 120 is formed in a ring structure connecting the osteoarthritis support portion 140 and the case 160, so that the elastic modulus can be adjusted to an appropriate range.
  • the upper membrane 120 may be formed in a circular membrane structure and may have a structure in which the osteoarthritis support portion 140 is attached to the lower portion.
  • the lower film 110 may also be formed in a circular film structure or a ring structure.
  • the lower film 110 may have a ring structure connecting the support substrate 150 and the case 160, and as the size of the support substrate 150 increases, the area of the ring structure decreases. You can. Therefore, it can serve to support the sensor with appropriate force. As a result, the vibration signal of the ossicles can be effectively transmitted to the sensor 130.
  • the lower film 110 may be formed in a circular film structure and have a structure in which the support substrate 150 is disposed on the top.
  • the support substrate 150 supports the sensor 130 so that the sensor 130 can effectively receive the vibration of the osteoid disease connected to the upper membrane 120.
  • the sensor 130 may be placed on the support substrate 150.
  • the rotator cuff support portion 140 is disposed between the sensor 130 and the upper membrane 120 so that the vibration of the rotator cuff connected to the upper membrane 120 can be transmitted to the sensor 130.
  • the sensor 130 may be placed on the support 131.
  • the sensor 130 may be a variety of sensors capable of detecting vibration of the ossicles, that is, the ossicles.
  • the sensor 130 can convert vibration signals into electrical signals.
  • the sensor 130 may be a pressure sensor (Piezoelectric sensor) capable of measuring pressure changes at four points.
  • displacement sensors or acceleration sensors can be applied, and there is no limit to the type of sensor.
  • the senor detects the vibration of the malleus disease and converts it into an electrical signal, so it is possible to utilize the physiological amplifiers of the outer and middle ear, such as the collecting effect of the auricle and the resonance effect of the external auditory canal, and also obtain the directionality of the sound.
  • the physiological amplifiers of the outer and middle ear such as the collecting effect of the auricle and the resonance effect of the external auditory canal, and also obtain the directionality of the sound.
  • the vertebral disease support portion may serve to support the vertebral disease and transmit the vibration of the vertebral disease to the sensor.
  • the upper surface of the osteoarthritis support portion can secure a sufficient area to support the osteoarthritis.
  • the osteoarthritis support portion may have a tapered shape (funnel shape) whose area decreases as it approaches the sensor. According to this configuration, sensitivity can be increased by amplifying the signal and reducing noise.
  • the case 160 is arranged to surround the outside of the upper membrane 120 and the lower membrane 110 to seal the interior.
  • Case 160 is made of biocompatible material.
  • the sealed interior can be filled with gas.
  • the gas may be air, helium, or an inert gas, but is not necessarily limited thereto.
  • the sensor package 100 may be placed between the malleus handle (T1), which is a protrusion of the ossicle located at the bottom of the eardrum (T3), and the cochlear shell (T2).
  • T1 malleus handle
  • T2 cochlear shell
  • the sensor package 100 can be brought into close contact between the malleus handle (T1) and the cochlear shell (T2) by the elastic support 200.
  • the elastic support 200 is a biocompatible material and various materials having elasticity may be selected.
  • the elastic support 200 may include materials such as PDMS, TPU, PU, and silicon.
  • the thickness of the elastic support 200 can be adjusted depending on the gap between the malleus handle (T1) and the cochlear shell (T2). That is, the gap between the patient's malleus handle (T1) and the cochlear shell (T2) can be measured in advance, the gap can be calculated, and the thickness of the elastic support 200 can be adjusted to ensure close contact with the sensor package 100. .
  • elastic supports 200 of various thicknesses may be prepared in advance and the elastic supports 200 of appropriate thickness may be inserted during surgery.
  • the embodiment has the advantage of increasing the sensitivity of the sensor 130 because the height of the sensor package 100 can be adjusted by the elastic support 200, and has the advantage of being convenient to install during surgery.
  • the upper membrane 120 and the malleus handle (T1) can be bonded with an adhesive, and the adhesive can also be applied to the upper and/or lower surfaces of the elastic support 200.
  • the elastic support may have a cross-section of any one of square, trapezoid, and oval shapes. That is, the sensor package 100 can have various shapes whose height can be adjusted.
  • the upper surface of the elastic support has a flat surface to easily support the sensor package, and the lower surface 201 may have a concave shape to be in close contact with the convex cochlear shell (T2). According to this configuration, the fixation force can be improved in the convex cochlear conch region.
  • Figure 6 is a first modified example of Figure 1.
  • Figure 7 is a view showing the lower surface of the extension part.
  • Figure 8 is a second modified example of Figure 1.
  • the case 160 may include an extension portion 161 protruding downward.
  • the elastic support 200 may be accommodated inside the sensor package 100 by the extension portion 161. According to this configuration, there is an advantage in that the elastic support 200 is accommodated in the extension portion 161 and can stably support the sensor package 100.
  • a plurality of electrodes 162 may be disposed on the lower surface 161a of the extension portion 161.
  • the lower surface 161a of the extension portion 161 has a ring structure and may have a plurality of electrodes 162 spaced apart from each other.
  • the plurality of electrodes 162 can apply electrical stimulation to the portion in contact with the cochlear shell. Therefore, the tinnitus phenomenon can be improved at the same time.
  • the upper space S1 and the lower space S2 of the sensor package 100 may be spaced apart by the lower film 110 . While the sensor 130 is disposed in the upper space (S1), fluid may flow into the lower space (S2) through the pipe 171. Depending on the amount of fluid injected into the lower space S2, the lower membrane 110 swells, and the upper membrane 120 also swells accordingly, so that the contact pressure with the ossicles may change.
  • the type of fluid is not particularly limited.
  • Figure 9 is a partially cut away perspective view of a microphone according to another embodiment of the present invention.
  • the x-direction can be defined as the horizontal or width direction
  • the y-direction can be defined as the vertical or longitudinal direction
  • the z-direction can be defined as the height, thickness, or vertical direction.
  • the direction in which arbitrary planes parallel to the xy plane are viewed in the +z or -z direction may be the plane or cross-section direction of the microphone 10 according to another embodiment.
  • the direction in which arbitrary planes parallel to the yz plane are viewed in the +x or -x direction may be the vertical cross-section direction of the microphone 10 according to another embodiment.
  • the direction in which arbitrary planes parallel to the xz plane are viewed in the +y or -y direction may be the vertical cross-section direction of the microphone 10 according to another embodiment.
  • the microphone 10 may include a sensor package 100 and an elastic support 200 that supports the lower portion of the sensor package 100.
  • the sensor package 100 according to another embodiment is different from the sensor package 100 according to one embodiment in that it does not include the upper film 120 disposed on the sensor 130.
  • the sensor package 100 can be inserted into the human body through surgery, and the elastic support 200 can be arranged so that the sensor package 100 is in close contact with the human body.
  • the sensor package 100 includes a case 160, a sensor 130 disposed within the case 160, a vertical member 145 disposed on the sensor 130 and in contact with the sensor 130, and a resin filling the case 160. It may include (170).
  • the sensor package 100 supports the sensor 130 and may further include a support 131 disposed within the case 160.
  • Case 160 may include a lower surface 166, a side 167 surrounding the outside of the lower surface 166, and an internal space 169 surrounded by the lower surface 166 and the side 167. .
  • FIGS. 10A and 10B are plan views showing first and second modified examples of the lower surface according to another embodiment of the present invention.
  • the lower surface 166 may include a surface of the case 160 that is substantially in contact with the elastic support 200.
  • the lower surface 166 may, but is not limited to, be polygonal in shape (eg, Figure 10A) or circular in shape (eg, Figure 10B). Preferably, it may have substantially the same shape as the upper surface of the elastic support 200 supporting the sensor package 100. Accordingly, the sensor package 100 can be stably fixed to the elastic support 200.
  • the lower surface 166 is substantially in contact with the elastic support 200, it may include any structure that can be fixed to the elastic support 200.
  • the sensor package 100 may include a recess structure or a plurality of grooves to prevent the sensor package 100 from slipping off the elastic support 200 during use of the microphone 10.
  • At least one of the upper and lower surfaces of the lower surface 166 may be concave in the +z and/or -z directions.
  • the surface of the elastic support 200 in contact with the sensor package 100 may have a convex surface to correspond to the recess structure.
  • the lower surface 166 may be convex and the elastic support 200 may be concave.
  • FIG. 10A and 10B are top views of the lower surface 166, so in FIG. 10 the entire lower surface 166 may appear to be parallel to the xy plane.
  • the lower surface 166 may not only include a plane parallel to the xy plane.
  • the lower surface 166 may be formed as a curved surface.
  • the lower surface 166 may include a first lower surface area 166a and a second lower surface area 166b.
  • the first lower surface area 166a may be an area surrounding the outside of the second lower surface area 166b.
  • the first lower surface area 166a and the second lower surface area 166b may be formed of the same material or different materials.
  • the lower surface regions 166a and 166b may both be formed of a rigid material, or one region may be formed of a rigid material and the other region may be formed of a material different from the rigid material.
  • the material forming the lower surface regions 166a and 166b may be a biocompatible material.
  • the biocompatible materials include glass epoxy, glass paper epoxy, polytetrafluoroethylene (PTFE), ceramic, polyvinyl chloride (PVC), and acrylonitrile butadiene styrene ( Acrylonitrile butadiene styrene (ABS), polyacetal resin, polypropylene (PP), polyethylene (PE), modified polyphenylene oxide (PPO), polybutylene terephthalate, PBT), polyethylene terephthalate (PET), phenol-based resin, fluorine-based resin, epoxy-based resin, unsaturated polyester (UP)-based resin, methacrylate resin (Polymetylmethacrylate, PMMA), polyphenylene sulfide ( Polyphenylene sulfide (PPS), Polyamide (PA), Polycarbonate (PC), Polydimethylsiloxane (PDMS), Thermoplastic Polyurethan
  • the lower surface 166 may have a film structure in which the lower surface regions 166a and 166b are all formed of the same material, or may have a ring structure in which the lower surface regions 166a and 166b are formed of different materials.
  • the lower surface 166 may serve as a support substrate to support the sensor. Therefore, the sensor 130 can stably receive the vibration of the malleus handle (T1).
  • the thickness of the lower surface 166 takes into account the z-direction height between the T1 and Promontory (T2), which varies from person to person. This can be adjusted appropriately.
  • the thickness of the lower surface 166 may be greater than or equal to 0.1 mm and less than or equal to 2.0 mm. In the above range, the sensor package 100 can be properly fixed to the elastic support 200 and come into close contact with the osteoarthritis T1. Additionally, the microphone 10 can be stably seated between the malleolus (T1) and the cochlear shell (T2).
  • the first lower surface area 166a and the second lower surface area 166b may have the same or different thicknesses.
  • the thickness may be the length in the thickness direction (+z or -z) of the lower surface 166 in the coordinate system of FIG. 10.
  • the thickness of the second lower surface area 166b may be greater than the thickness of the first lower surface area 166a.
  • the second lower surface region 166b may serve as a main support substrate for the lower surface 166.
  • the senor 130 may be disposed on the second lower surface area 166b, although it is not necessarily limited thereto. As the proportion of the second lower surface area 166b of the lower surface 166 increases, the second lower surface area 166b can support the sensor 130 with an appropriate force. Accordingly, the vibration signal of the ossicles can be effectively transmitted to the sensor 130.
  • Figure 11a is a longitudinal cross-sectional view to explain the configuration included in the sensor package according to another embodiment of the present invention.
  • the side surface 167 may surround or wrap around the outside of the lower surface 166.
  • the side 167 may be formed of biocompatible material.
  • the biocompatible material may be made of rigid material.
  • the side 167 is illustratively made of glass epoxy, glass paper epoxy, polytetrafluoroethylene (PTFE), ceramic, polyvinyl chloride (PVC), Acrylonitrile butadiene styrene (ABS), polyacetal resin, polypropylene (PP), polyethylene (PE), modified polyphenylene oxide (PPO), Polybutylene terephthalate (PBT), Polyethylene terephthalate (PET), phenol resin, fluorine resin, epoxy resin, unsaturated polyester (UP) resin, methacrylic resin (Polymetylmethacrylate) , PMMA), Polyphenylene sulfide (PPS), Polyamide (PA), Polycarbonate (PC), Polydimethylsiloxane (PDMS), Thermoplastic Polyure
  • the side surface 167 and the bottom surface 166 may be formed of the same material or may be formed of different materials. If they are made of the same material, there is an advantage in reducing manufacturing costs.
  • the height of the side 167 can be appropriately adjusted taking into account the z-direction distance between the malleus malleum (T1) and the cochlear conchae (T2) in the human body where the microphone 10 will be mounted. In other words, the distance may vary from person to person, so it can be set taking this into account.
  • the height of the side surface 167 may be 0.1 mm or more and 2.0 mm or less. In the above range, the adhesion between the osteoarthritis T1 and the elastic support 200 can be improved.
  • the x-direction width of the side 167 may not be constant as it moves toward the z-direction.
  • the longitudinal cross-section of the side surface 167 may have a width in the x-direction that gradually increases toward the lower surface 166.
  • the sensor package 100 When the microphone 10 is placed between the malleus malleum (T1) and the cochlear shell (T2), the sensor package 100 receives a fixing force in the z direction by the elastic support 200.
  • the limit of the internal resistance force eg, compressive stress
  • the sensor package 100 according to another embodiment has the advantage of not being deformed even with increased fixation force.
  • Case 160 may include an internal space 169 surrounded by a lower surface 166 and a side surface 167.
  • Figure 11b is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention. Descriptions of configurations that are substantially the same as the above-described configuration (for example, the lower surface 160 or the side surface 167) are omitted.
  • the senor 130 may be placed within the case 160.
  • the sensor 130 may be placed on the lower surface 166 and stored in the internal space 169.
  • a vertical member and a resin are disposed on the sensor 130 so that the vibration of the osteoarthritis T1 can be transmitted to the sensor 130.
  • the sensor 130 may be placed on the support 131.
  • the support 131 may serve to seal a portion of the sensor 130 that is in contact with the lower surface 166.
  • the support 131 may be formed of the same material as the sensor 130.
  • the support 131 may be formed of a silicon-based semiconductor and/or metal.
  • the sensor 130 may be a variety of sensors capable of detecting the vibration of the ossicles (T1), that is, the ossicles.
  • the sensor 130 can convert vibration signals into electrical signals.
  • the sensor 130 may be a pressure sensor (piezoelectric sensor) or a piezoelectric sensor capable of measuring pressure changes at four points.
  • a displacement sensor or an acceleration sensor may be applied, and the type of sensor 130 is not limited.
  • the sensor 130 detects the vibration of the vertebral column (T1) and converts it into an electrical signal, it is possible to utilize the physiological amplifiers of the outer and middle ears, such as the collecting effect of the auricle and the resonance effect of the external auditory canal. In addition, there is an advantage that the directionality of the sound can also be obtained.
  • the sensor package may include a space 132 surrounded by the sensor in an area where the sensor is placed.
  • the space 132 may be a space for the diaphragm to vibrate in the diaphragm area 133, which will be described later.
  • the space 132 may be filled with gas such as air, nitrogen, and helium, or may be in a vacuum state.
  • Figure 11c is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention. Descriptions of components that are substantially the same as those described above (eg, sensor 130 or support 131) are omitted.
  • the sensor package 100 may include resin 170 filling the case 160.
  • at least a portion of the internal space 169 may be filled with the resin 170.
  • the resin 170 may be in a cured state while surrounding the sensor 130 and/or the vertical member 145.
  • the vertical member 145 in contact with the sensor 130 may be fixed by the cured resin 170.
  • the vertical member 145 may be maintained in contact with the sensor 130 without leaving the sensor 130. Accordingly, the service life characteristics of the microphone 10 can be improved. Additionally, the vertical member 145 may not be tilted on the sensor 9130, and may be placed exactly at the position of the vertical member 145 that the operator of the microphone 10 wishes to implement.
  • the resin 170 may be formed of a biocompatible material.
  • the living body may refer to the human body.
  • biocompatibility can be defined as the ability of a prosthesis implanted in the human body to exist in harmony with human tissue without causing harmful changes in the human body.
  • the resin 170 may include a silicone-based material.
  • Resin 170 is polydimethylsiloxane (PDMS), siloxane-based resin, liquid silicone rubber (LSR), fluorosilicone, polyurethane, and thermosetting elastomer ( It may include at least one selected from the group consisting of Thermo Plastic Elastomer (TPE).
  • PDMS polydimethylsiloxane
  • LSR liquid silicone rubber
  • fluorosilicone fluorosilicone
  • polyurethane polyurethane
  • thermosetting elastomer It may include at least one selected from the group consisting of Thermo Plastic Elastomer (TPE).
  • the microphone 10 including the case 160 has the advantage of maintaining its sensitivity over time.
  • the resin 170 may perform the function of receiving the vibration of the vertebral disease (T1) and transmitting it to the vertical member 145. Accordingly, the vibration of the osteoarthritis T1 may not be immediately transmitted to the sensor 130, and the sensor 130 may not be damaged.
  • the vibration of the osteoarthritis T1 can be damped by the resin 170, and the stability of the sensor package 100 can be improved. Accordingly, there is an advantage that the usable life of the microphone 10 can be extended.
  • the sensor 130 may be damaged during the process of using the sensor 130, such as during an insertion surgery. Accordingly, as the resin 170 is used, the risk of the sensor 130 being damaged may be reduced, and this was confirmed through repeated experiments.
  • the manufacturing process of the sensor package 100 can be simplified by filling the resin 170, and thus the process yield can be increased.
  • a vertical member 145 in contact with the sensor 130 may be disposed on the sensor 130.
  • the vertical member 145 may be defined as a member having a length in the vertical direction of the sensor package 100.
  • the vertical member 145 may be formed by a process using a photosensitive material. The process can be performed by the following steps:
  • the photosensitive material pattern is created. can be formed.
  • the vertical member 145 may be part of a photosensitive material pattern formed by positive PR or negative PR.
  • Photomasks used for the above-described masking may be of various types depending on the height of the vertical member 145. For example, masking can be done using only one layer of mask, or masking can be done using multiple layers of masks.
  • the longitudinal cross-sectional shape of the vertical member 145 is not particularly limited as long as it can detect the vibration of the osteoarthritis T1.
  • the longitudinal cross-section of the vertical member 145 may have a rectangular shape, a trapezoidal shape, or a structure in which steps are formed from the top (or bottom) to the bottom (or top).
  • the shape of the cross section of the vertical member 145 is not particularly limited.
  • the cross-section may be circular or polygonal in shape.
  • the vertical member 145 is made of polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), polyacetal resin, and polypropylene.
  • PVC polyvinyl chloride
  • ABS acrylonitrile butadiene styrene
  • PES polyacetal resin
  • polypropylene polypropylene.
  • PP polyethylene
  • PPO modified polyphenylene oxide
  • PBT polybutylene terephthalate
  • PET polyethylene terephthalate
  • phenolic resin fluorine resin
  • epoxy resin unsaturated polyester (UP) resin, methacrylic resin (Polymetylmethacrylate, PMMA), polyphenylene sulfide (PPS), polyamide (PA), polycarbonate, PC), polyimide (PI), polyethylene glycol (PEG), polylactic acid (PLA), polyurethane (PU), polyhydroxyalkanoates (PHA) ) and polyether ether ketone (PEEK).
  • Figure 11f is a graph comparing the sensitivity of the sensor 130 depending on whether or not the vertical member of the present invention is introduced.
  • the x-axis (Modulus of Molding Material) represents the strength (Pa) of the filled resin 170
  • the y-axis represents the sensor response performance of the conventional sensor package and the sensor package according to the present invention. It represents the ratio (sensor response performance of the sensor package according to the present invention / sensor response performance of the conventional sensor package).
  • the red line (Mold with SU8 Post) shows the experimental results measured in the presence of the vertical member 145, and the black line (Molded Package) shows the experimental results measured without the vertical member.
  • the strength of the filled resin 170 is 1 MPa, unlike the experimental results along the solid line, which measured a performance of about 35% compared to the conventional sensor package, the experimental results along the red line showed a performance of about 58%. It was measured.
  • the sensitivity of the sensor 130 is improved in the experimental results along the red line where the vertical member 145 is introduced.
  • Figure 12 is a longitudinal cross-sectional view of the sensor package 100 according to another embodiment of the present invention.
  • Figure 13a is a partially enlarged view of the upper part of line I-I' in Figure 12. Descriptions of components that are substantially the same as those described above (eg, sensor 130 or support 131) are omitted.
  • the resin 170 includes a first resin layer 175 and a first resin layer 175 disposed on the sensor 130. It may include the remaining second resin layer 177.
  • the vertical member 145 is in contact with the sensor 130 and the sensor 130 is disposed in the internal space 169 of the case 160, so at least a portion of the vertical member 145 is in the resin 170. It can exist.
  • All of the vertical members 145 may be present in the resin 170.
  • the vertical length d1 of the first resin layer 175 may be greater than the vertical length d2 of the vertical member 145.
  • a vertical length d3 from the upper surface of the vertical member 145 to the upper surface of the first resin layer 175 may be defined.
  • the material of the vertical member 145 is not particularly limited. Since the sensor package 100 can be inserted into the human body, it may contain biocompatible materials. “Biocompatibility” describes the material of the resin 170 and can be defined as the ability of a prosthesis implanted in the human body to exist in harmony with human tissue without causing harmful changes to the human body.
  • the vertical member 145 is made of polyimide (PI), polyethylene glycol (PEG), polylactic acid (PLA), polyurethane (PU), and polyhydroxy It may include at least one selected from the group consisting of alkanoates (polyhydroxyalkanoates, PHA) and polyetheretherketone (PEEK).
  • PI polyimide
  • PEG polyethylene glycol
  • PLA polylactic acid
  • PU polyurethane
  • Phydroxy It may include at least one selected from the group consisting of alkanoates (polyhydroxyalkanoates, PHA) and polyetheretherketone (PEEK).
  • Figures 13b and 13c are graphs comparing the force applied to the sensor according to the height of the vertical member according to another embodiment of the present invention.
  • the x-axis (Post Height) is the height of the vertical member 145
  • the y-axis (Max. Stress in Sensor Membrane) is a parameter related to the output (e.g., sensitivity, etc.) of the sensor 130. means. The above parameters are positively correlated with the output of the sensor.
  • the height (d1) of the first resin layer 175 was fixed at 200 ⁇ m, and the improvement in sensor output according to the strength of the height (d2) of the vertical member tended to be saturated when d2 was around 100 ⁇ m.
  • the output of the sensor may be improved when the strength of the resin 170 is 1 MPa or less or when the height d2 of the vertical member 145 is greater than 1/2 of d1.
  • the vertical length d2 of the vertical member 145 may be 2/3 or more of the vertical length d1 of the first resin layer 175. In this range, vertical member 145 is present and the sensitivity of sensor 130 can be increased.
  • the vertical length d3 from the upper surface of the vertical member 145 to the upper surface of the first resin layer 175 is 1/ of the vertical length d2 of the vertical member 145. It may be 3 or less. In the above range, the effect of transmitting the vibration of the vertebral disease (T1) to the sensor 130 in the presence of the vertical member 145 can be improved.
  • the x-axis (Post Height) is the height of the vertical member 145 like the x-axis of the first graph
  • the y-axis (Post Diameter) is the diameter of the vertical member 145
  • the z-axis (Max . Stress) refers to the same parameter as the y-axis of the first graph above. Therefore, the z-axis parameters have a positive correlation with the sensor's output (e.g., sensitivity, etc.).
  • the sensor output of the sensor package according to another embodiment may be improved.
  • the vertical length d3 from the upper surface of the vertical member 145 to the upper surface of the first resin layer 175 is 1/ of the vertical length d2 of the vertical member 145. It may be 3 or less. In the above range, the effect of transmitting the vibration of the vertebral disease (T1) to the sensor 130 in the presence of the vertical member 145 can be improved.
  • Figure 14 is a plan view showing a sensor according to another embodiment of the present invention.
  • the senor 130 may include an area 146 in contact with the vertical member 145.
  • the sensor 130 according to another embodiment may include a diaphragm area 133.
  • the diaphragm area 133 may be defined as an area of the sensor 130 that performs a major function in the actual operation of the sensor 130. This may be a part of the central part of the sensor 130 that is thin in the z-direction and vibrates due to external stimulation caused by osteoarthritis T1.
  • the purpose of the sensor 130 according to another embodiment may be to detect movement of the diaphragm area 133.
  • the area of the area 146 where the vertical member 145 and the sensor 130 contact each other may be 80% or less of the area of the diaphragm area 133. In the above range, the sensitivity of the sensor 130 to vibration of the tendon disease T1 can be improved.
  • Figure 15 is a partially cut away perspective view of a microphone according to another embodiment of the present invention.
  • Figure 16 is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention.
  • FIG. 17 is a partially enlarged view of the upper part of line I-I” in FIG. 16.
  • the vertical length d2 of the vertical member 145 may not be smaller than the vertical length d1 of the first resin layer 175.
  • the material of the vertical member 145 may not be particularly limited. However, when the sensor package 100 is included in a living body, a portion of the vertical member 145 that is not present in the resin 170 may substantially contact the osteoarthritis T1. Accordingly, the vertical member 145 may include a biocompatible material.
  • a biocompatible material for example, polyethylene (PE), polypropylene (PP), polytetrafluoroethylene (PTFE), polymethylmethacrylate (PMMA), polyimide (PI), polyethylene Glycol (Polyethylene glycol, PEG), Polylactic acid (PLA), Polyurethane (PU), Polyhydroxyalkanoates (PHA), and Polyether ether ketone (PEEK)
  • PE polyethylene
  • PP polypropylene
  • PTFE polytetrafluoroethylene
  • PMMA polymethylmethacrylate
  • PI polyimide
  • polyethylene Glycol Polyethylene glycol, PEG
  • PVA Polylactic acid
  • PPU Polyurethane
  • PHA Polyhydroxyal
  • Biocompatibility describes the material of the resin 170 and can be defined as the ability of a prosthesis implanted in the human body to exist in harmony with human tissue without causing harmful changes to the human body.
  • the vertical length d4 from the upper surface of the first resin layer 175 to the upper surface of the vertical member 145 is 1/ of the vertical length d2 of the vertical member 145. It may not exceed 10. If it exceeds 1/10, the effect of damping the vibration of the osteoarthritis T1 by the resin 170 may be reduced. Accordingly, the vibration transmitted to the sensor 130 increases and the sensor 130 may be damaged, and the lifespan characteristics of the microphone 10 may be reduced.
  • Figure 18 is a longitudinal cross-sectional view of a sensor package according to another embodiment of the present invention.
  • a sensor package 100 may include a coating layer 180 surrounding the outside of the sensor package 100.
  • the coating layer 180 may be formed of a biocompatible material. This has the advantage of ensuring that the resin and/or case included in the sensor package 100 is not made of biocompatible material.
  • the sensor package 100 can exist in harmony with human tissue without causing harmful changes to the human host.
  • the coating layer 180 is a uniform coating film and may not undergo thermal or mechanical deformation. Additionally, the coating layer 180 may include at least one of moisture penetration resistance, corrosion resistance, and gas barrier properties.
  • the coating layer 180 may be formed by paraline coating.
  • Paraline coating is a coating technology that uses chemical vapor deposition (CVD) to form a polymer film by vaporizing powdered raw materials in a vacuum.
  • the raw materials may be those well known in the art.
  • Figure 19 is an example diagram of a microphone according to another embodiment of the present invention applied to the human body.
  • the microphone 10 may include the sensor package 100 according to the above-described embodiments and an elastic support 200 supporting the lower part of the sensor package 100.
  • the sensor package 100 may be placed between the malleolus (T1), which is a protrusion of the ossicle located below the tympanic membrane (T3), and the cochlear conchae (T2).
  • T1 malleolus
  • T3 tympanic membrane
  • T2 cochlear conchae
  • the sensor package 100 it may be advantageous for the sensor package 100 to be in close contact with the malleus ossicle (T1). Therefore, the sensor package 100 can be brought into close contact between the malleolus (T1) and the cochlear shell (T2) by the elastic support 200.
  • the elastic support 200 is a biocompatible material and may include various materials having elasticity.
  • the elastic support 200 may include materials such as PDMS, TPU, PU, and silicon.
  • the thickness of the elastic support 200 can be adjusted depending on the gap between the malleus vertebrae (T1) and the cochlear conchae (T2). That is, the thickness of the elastic support 200 can be adjusted so that the sensor package 100 can be brought into close contact by measuring the gap in advance between the patient's malleolus (T1) and the cochlear shell (T2) and calculating the gap.
  • elastic supports 200 of various thicknesses may be prepared in advance and the elastic supports 200 of appropriate thickness may be inserted during surgery.
  • the height of the sensor package 100 can be adjusted by the elastic support 200, which has the advantage of increasing the sensitivity of the sensor 130 and convenient installation during surgery.
  • the upper surface of the resin 170 or the upper surface of the vertical member 145 and the malleus T1 may be bonded with an adhesive, and the adhesive may be applied to the upper and/or lower surfaces of the elastic support 200. It could be.
  • PDMS polydimethylsiloxane
  • the elastic support 200 may have a cross-sectional shape of any one of square, trapezoid, and oval. That is, the sensor package 100 can have various shapes whose height can be adjusted.
  • the upper surface of the elastic support 200 may have a flat surface to facilitate supporting the sensor package 100, and the lower surface 201 may have a concave shape to be in close contact with the convex cochlear shell (T2). According to this configuration, the fixation force can be improved in the convex cochlear conch area.
  • the lower surface 166 of the case 160 includes a recess structure or has a plurality of grooves, as described above. It can be included.
  • the elastic support 200 may support the sensor package 100 using a cradle method.
  • the elastic support 200 may include a groove, and the sensor package 100 may be seated in the groove.
  • Figure 20 is a block diagram of a human implant device according to an embodiment of the present invention.
  • the implant device 1 may include a microphone 10, a sound processor 11, and a stimulator 12.
  • the microphone 10 may detect the vibration of the osteoarthritis T1 and convert the vibration signal into an electrical signal.
  • the sensor detects the vibration of the vertebral column (T1) and converts it into an electrical signal, so it is possible to utilize the physiological amplifiers of the outer and middle ears, such as the collecting effect of the auricle and the resonance effect of the external auditory canal, and the directionality of the sound. There are advantages that can be gained.
  • the sound processor 11 can analyze signals by frequency and time, then convert them into electrical signals and transmit them to a stimulator implanted in the body.
  • This bill processor can be applied to existing known configurations without limitation.
  • the stimulator 12 can stimulate the auditory nerve through electrodes according to the input signal.
  • the structure of this stimulator can be applied to various types of stimulators commonly used in cochlear implants without limitation.

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  • Engineering & Computer Science (AREA)
  • Otolaryngology (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Neurosurgery (AREA)
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  • Biomedical Technology (AREA)
  • Prostheses (AREA)

Abstract

The present specification discloses a microphone comprising: a sensor package; and an elastic support which supports the bottom of the sensor package. The sensor package comprises: a lower diaphragm which is disposed on the elastic support; a sensor which is disposed on the lower diaphragm; an upper diaphragm which is disposed on the sensor; and a case which covers the outer sides of the lower diaphragm and the upper diaphragm. The elastic support is arranged between the sensor package and the promontory to bring the upper diaphragm and the malleus handle into close contact with each other.

Description

마이크로폰 및 이를 포함하는 인체 임플란트 장치Microphone and human implant device including same
본 발명은 마이크로폰 및 이를 포함하는 인체 임플란트 장치에 관한 것이다.The present invention relates to a microphone and a human implant device including the same.
정상적인 귀에서는 소리에너지가 외이와 중이를 거치면서 기계적 진동으로 바뀌어 증폭되고 달팽이관의 림프에 전달된 후 달팽이관에 있는 청각유모세포가 흔들릴 때 이온이 유입되면서 발생하는 전기에너지가 청신경을 자극하여 뇌로 전달되는 과정을 거친다.In a normal ear, sound energy is converted into mechanical vibration as it passes through the outer and middle ears, amplified, and transmitted to the lymph of the cochlea. Then, when the auditory hair cells in the cochlea are shaken, the electrical energy generated by the influx of ions stimulates the auditory nerve and is transmitted to the brain. Go through the process.
인공와우는 달팽이관 안에 청각세포의 손상으로 전기적 신호를 발생하지 못해 달팽이관이 기능을 하지 못하는 고도 이상의 난청 환자들에게 달팽이관을 대체하는 기계이며, 달팽이관 안에 전극을 삽입하여 전기자극을 가하여 청신경을 자극하여 소리를 감지하는 원리로 작동한다. A cochlear implant is a machine that replaces the cochlea for patients with severe hearing loss in whom the cochlea cannot function due to damage to the auditory cells in the cochlea. It stimulates the auditory nerve to produce sound by inserting electrodes into the cochlea and applying electrical stimulation. It operates on the principle of detecting.
현재 상용되는 인공와우는 소리를 외부장치에 있는 마이크로폰으로 받아들여 어음처리기에서 주파수별로 시간에 따라 분석한 후 이를 전기신호로 바꾸어 생체 내 이식한 자극기에 전달되도록 한 후 와우에 이식한 전극을 통하여 청신경이 자극되도록 고안되었다. 즉 외부에 있는 마이크로폰과 어음분석기가 외이, 중이, 청각세포의 역할을 하도록 함으로써 소리자극을 전기에너지로 바꾼 후 와우 내 전극에 전달 하는 것이다.Currently commercially available cochlear implants receive sound through a microphone in an external device, analyze it by frequency and time in a sound processor, convert it into an electrical signal, and transmit it to a stimulator implanted in the body. Then, the sound is transmitted to the auditory nerve through electrodes implanted in the cochlea. It was designed to stimulate this. In other words, the external microphone and speech analyzer function as the outer ear, middle ear, and auditory cells to convert sound stimulation into electrical energy and transmit it to the electrodes within the cochlea.
그러나 기존의 인공와우 및 중이이식기 등의 이식형 청각장치는 난청 환자들에게 외부 마이크로폰과 같은 외부 기기로 인해서 청각장애인이라는 사회적 낙인효과 및 수영 등의 신체 활동의 제약과 같은 단점이 있다. However, existing implantable hearing devices such as cochlear implants and middle ear implants have disadvantages such as the social stigma of being hearing impaired and restrictions on physical activities such as swimming due to external devices such as external microphones for hearing loss patients.
이런 외부기기로 인한 불편함을 해결하기 위해 현재까지 개발된 완전이식형 인공와우는 연구단계이며 아직 상용화되지는 않고 있다. 그 이유는 완전이식형 중이 이식기 및 완전 이식형 인공와우에서 많이 사용하고 있는 피하 이식형 마이크로폰의 경우, 저작 운동 및 피부 마찰에 의한 잡음으로 인해 소리의 청취가 어렵고, 피하 이식으로 인해 마이크로폰의 고주파 감도가 저하되는 문제가 발생하기 때문이다.To solve the inconvenience caused by such external devices, the fully implantable cochlear implants developed to date are in the research stage and have not yet been commercialized. The reason is that in the case of subcutaneous implantable microphones, which are widely used in fully implantable middle ear implants and fully implantable cochlear implants, it is difficult to hear sound due to noise caused by masticatory movements and skin friction, and the high frequency sensitivity of the microphone is low due to subcutaneous implantation. This is because the problem of deterioration occurs.
실시예들은 인체 내부에 삽입되는 센서 패키지 및 이를 포함하는 마이크로폰을 제공하는 것을 일 과제로 한다.Embodiments aim to provide a sensor package inserted into the human body and a microphone including the same.
본 발명이 해결하고자 하는 과제는 이상에서 언급된 과제에 국한되지 않으며 여기서 언급되지 않은 또 다른 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems not mentioned here will be clearly understood by those skilled in the art from the description below.
일 실시예에 따른 마이크로폰은 센서 패키지 및 상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고, 상기 센서 패키지는, 상기 탄성 지지체 상에 배치되는 하부막, 상기 하부막 상에 배치되는 센서, 상기 센서 상에 배치되는 상부막 및 상기 하부막 및 상부막의 외측을 둘러싸는 케이스를 포함하고, 상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 상부막과 추골병(malleus handle)을 밀착시킬 수 있다.A microphone according to an embodiment includes a sensor package and an elastic supporter supporting a lower portion of the sensor package, the sensor package including a lower film disposed on the elastic supporter, a sensor disposed on the lower film, and the sensor. It includes an upper membrane disposed on the upper membrane and a case surrounding the lower membrane and the outer side of the upper membrane, and the elastic support is disposed between the sensor package and the cochlear shell (Promontory) to hold the upper membrane and the malleus handle. It can be adhered closely.
일 실시예에서, 상기 센서 패키지는, 상기 하부막 상에 배치되는 지지기판 및 상기 센서와 상기 상부막 사이에 배치되는 추골병 지지부를 포함할 수 있다.In one embodiment, the sensor package may include a support substrate disposed on the lower membrane and a osteoarthritis support portion disposed between the sensor and the upper membrane.
일 실시예에서, 상기 상부막은 상기 추골병(malleus handle)과 접촉하고, 원형 또는 링형상으로 제작되어 탄성 계수를 조절하고, 상기 하부막은 상기 탄성 지지체에 접촉하고, 원형 또는 링형상으로 제작되어 상기 센서를 지지하고, 상기 하부막은 탄성 재질 또는 리지드 재질로 구성되고 상기 탄성 지지체는 단면이 사각형, 사다리꼴, 타원형 중 어느 하나의 형상을 갖고, 상기 탄성 지지체의 상부면은 평탄면을 갖고 하부면은 볼록한 와우갑각에 밀착되도록 오목한 형상을 가질 수 있다.In one embodiment, the upper membrane is in contact with the malleus handle and is manufactured in a circular or ring shape to adjust the elastic modulus, and the lower membrane is in contact with the elastic support and is manufactured in a circular or ring shape to adjust the elastic modulus. Supporting the sensor, the lower membrane is made of an elastic material or a rigid material, the elastic support has a cross-section of any one of a square, trapezoid, and oval shape, the upper surface of the elastic support has a flat surface and the lower surface is convex. It may have a concave shape to fit closely to the cochlear shell.
일 실시예에서, 상기 추골병 지지부는 상부막과 센서에 접촉하고, 상기 추골병 지지부의 단면은 상기 센서에 가까워질수록 좁아지는 테이퍼 형상을 가져 진동 에너지를 상기 센서에 증폭시켜 전달할 수 있다.In one embodiment, the vertebral disease support portion contacts the upper membrane and the sensor, and the cross section of the vertebral disease support portion has a tapered shape that becomes narrower as it approaches the sensor, so that vibration energy can be amplified and transmitted to the sensor.
일 실시예에서, 상기 케이스는 하부로 연장되어 상기 탄성 지지체를 수용하는 연장부를 포함할 수 있다.In one embodiment, the case may include an extension portion that extends downward and accommodates the elastic support.
일 실시예에서, 상기 연장부의 하부에는 복수 개의 전극이 배치되고, 상기 복수 개의 전극은 상기 와우갑각에 자극 신호를 인가할 수 있다.In one embodiment, a plurality of electrodes are disposed on the lower part of the extension part, and the plurality of electrodes can apply stimulation signals to the cochlear shell.
다른 실시예에 따른 마이크로폰은 센서 패키지 및 상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고, 상기 센서 패키지는, 케이스, 상기 케이스 내에 배치되는 센서, 상기 센서 상에 상기 센서와 접하며 배치되는 수직부재, 및 상기 케이스를 메우는 수지를 포함하고, 상기 수지는 상기 수직부재를 감싼 채로 경화되고, 상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 센서 패키지와 추골병(malleus handle)을 밀착시킬 수 있다.A microphone according to another embodiment includes a sensor package and an elastic supporter supporting a lower portion of the sensor package, wherein the sensor package includes a case, a sensor disposed within the case, and a vertical member disposed on the sensor and in contact with the sensor. , and a resin that fills the case, wherein the resin is cured while surrounding the vertical member, and the elastic support is disposed between the sensor package and the cochlear shell (Promontory) to form a contact between the sensor package and the malleus handle. can be brought into close contact.
다른 실시예에서, 상기 수지는 폴리다이메틸실록산(Polydimethylsiloxane, PDMS), 실록산(Siloxane)계 수지, 액상 실리콘 고무(Liquid Silicone Rubber, LSR), 플루오로실리콘(Fluorosilicone), 폴리우레탄(Polyurethane), 및 열가소성 엘라스토머(Thermo Plastic Elastomer, TPE)로 이루어지는 군에서 선택되는 적어도 하나를 포함할 수 있다.In another embodiment, the resin is polydimethylsiloxane (PDMS), siloxane-based resin, liquid silicone rubber (LSR), fluorosilicone, polyurethane, and It may include at least one selected from the group consisting of thermoplastic elastomer (TPE).
다른 실시예에서, 상기 케이스는, 하부면, 상기 하부면의 외측을 둘러싸는 측면 및 상기 하부면과 상기 측면으로 둘러싸인 내부공간을 포함하고, 상기 센서는, 상기 하부면 상에 배치되어 상기 내부공간에 수납될 수 있다.In another embodiment, the case includes a lower surface, a side surrounding the outside of the lower surface, and an internal space surrounded by the lower surface and the side, and the sensor is disposed on the lower surface and the internal space. It can be stored in .
다른 실시예에서, 상기 내부공간의 적어도 일부는 상기 수지에 의해 충전되며, 상기 수직부재의 적어도 일부는 상기 수지에 존재할 수 있다.In another embodiment, at least a portion of the internal space may be filled with the resin, and at least a portion of the vertical member may be present in the resin.
다른 실시예에서, 상기 수직부재의 전부는 상기 수지에 존재할 수 있다.In another embodiment, all of the vertical members may be in the resin.
다른 실시예에서, 상기 수지는, 상기 센서 상에 배치되는 제1 수지층 및 상기 제1 수지층을 제외한 나머지의 제2 수지층을 포함하고, 상기 수직부재의 수직 방향 길이(d2)는 상기 제1 수지층의 수직 방향 길이(d1)의 2/3 이상일 수 있다.In another embodiment, the resin includes a first resin layer disposed on the sensor and a second resin layer other than the first resin layer, and the vertical length d2 of the vertical member is the first resin layer disposed on the sensor. 1 It may be 2/3 or more of the vertical length (d1) of the resin layer.
다른 실시예에서, 상기 수직부재의 상부면부터 상기 제1 수지층의 상부면까지의 수직 방향 길이(d3)는 상기 수직부재의 수직 방향 길이(d2)의 1/3 이하일 수 있다.In another embodiment, the vertical length (d3) from the upper surface of the vertical member to the upper surface of the first resin layer may be less than 1/3 of the vertical length (d2) of the vertical member.
다른 실시예에서, 상기 센서는 다이어프램 영역을 포함하고, 상기 수직부재와 상기 센서가 접하는 영역의 면적은 상기 다이어프램 영역의 면적의 80% 이하일 수 있다.In another embodiment, the sensor includes a diaphragm area, and the area of the area where the sensor contacts the vertical member may be less than 80% of the area of the diaphragm area.
다른 실시예에 따른 마이크로폰은, 상기 센서 패키지의 외측을 덮는 코팅층을 더 포함할 수 있다.A microphone according to another embodiment may further include a coating layer covering the outside of the sensor package.
다른 실시예에서, 상기 코팅층은 패럴린(Parylene) 코팅에 의해 형성될 수 있다.In another embodiment, the coating layer may be formed by Parylene coating.
일 실시예에 따른 인체 임플란트 장치는 마이크로폰 및 상기 마이크로폰과 통신하는 자극 장치를 포함하고, 상기 마이크로폰은, 센서 패키지 및 상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고, 상기 센서 패키지는, 상기 탄성 지지체 상에 배치되는 하부막, 상기 하부막 상에 배치되는 센서, 상기 센서 상에 배치되는 상부막 및 상기 하부막 및 상부막의 외측을 둘러싸는 케이스를 포함하고, 상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 상부막과 추골병(malleus handle)을 밀착시킬 수 있다.A human implant device according to one embodiment includes a microphone and a stimulation device that communicates with the microphone, the microphone includes a sensor package and an elastic support body supporting a lower portion of the sensor package, and the sensor package includes the elastic support. It includes a lower membrane disposed on a support, a sensor disposed on the lower membrane, an upper membrane disposed on the sensor, and a case surrounding the outside of the lower membrane and the upper membrane, wherein the elastic support is connected to the sensor package and the cochlea. It is placed between the promontory and can bring the upper membrane and the malleus handle into close contact.
일 실시예에서, 상기 센서 패키지는, 상기 하부막 상에 배치되는 지지기판 및 상기 센서와 상기 상부막 사이에 배치되는 추골병 지지부를 포함할 수 있다.In one embodiment, the sensor package may include a support substrate disposed on the lower membrane and a osteoarthritis support portion disposed between the sensor and the upper membrane.
일 실시예에서, 상기 상부막은 상기 추골병(malleus handle)과 접촉하고, 원형 또는 고리 형상으로 제작되어 탄성 계수를 조절하고, 상기 하부막은 상기 탄성 지지체에 접촉하고, 원형 또는 고리 형상으로 제작되어 상기 센서를 지지하고, 상기 하부막은 탄성 재질 또는 리지드 재질로 구성되고 상기 탄성 지지체는 단면이 사각형, 사다리꼴, 타원형 중 어느 하나의 형상을 갖고, 상기 탄성 지지체의 상부면은 평탄면을 갖고 하부면은 볼록한 와우갑각에 밀착되도록 오목한 형상을 가질 수 있다.In one embodiment, the upper membrane is in contact with the malleus handle and is made in a circular or ring shape to adjust the elastic modulus, and the lower membrane is in contact with the elastic support and is made in a circular or ring shape to control the elastic modulus. Supporting the sensor, the lower membrane is made of an elastic material or a rigid material, the elastic support has a cross-section of any one of a square, trapezoid, and oval shape, the upper surface of the elastic support has a flat surface and the lower surface is convex. It may have a concave shape to fit closely to the cochlear shell.
다른 실시예에 따른 인체 임플란트 장치는 마이크로폰 및 상기 마이크로폰과 통신하는 자극 장치를 포함하고, 상기 마이크로폰은, 센서 패키지 및 상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고, 상기 센서 패키지는, 케이스, 상기 케이스 내에 배치되는 센서, 상기 센서 상에 상기 센서와 접하며 배치되는 수직부재 및 상기 케이스를 메우는 수지를 포함하고 상기 수지는 상기 수직부재를 감싼 채로 경화되고, 상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 센서 패키지와 추골병(malleus handle)을 밀착시킬 수 있다.A human implant device according to another embodiment includes a microphone and a stimulation device that communicates with the microphone, the microphone includes a sensor package and an elastic support for supporting a lower portion of the sensor package, the sensor package includes a case, It includes a sensor disposed in the case, a vertical member disposed on the sensor and in contact with the sensor, and a resin that fills the case. The resin is cured while surrounding the vertical member, and the elastic support is connected to the sensor package and the cochlear shell. It can be placed between the promontory and bring the sensor package and the malleus handle into close contact.
실시예들에 따르면, 귀바퀴와 고막의 집음 효과, 외이도의 공명 효과 등 외이와 중이의 생리적 증폭기전을 그대로 이용할 수 있고, 소리의 방향성도 획득할 수 있다.According to embodiments, the physiological amplification mechanisms of the outer and middle ear, such as the collection effect of the auricle and eardrum and the resonance effect of the external auditory canal, can be used as is, and the directionality of sound can also be obtained.
또한, 외부 소음이나 피부마찰과 같은 생리적 소음의 영향이 없이 고막의 버클링 효과(buckling effect)를 이용하여 잡음을 줄이면서도 감도가 높아지는 효과가 있다.In addition, there is an effect of increasing sensitivity while reducing noise by using the buckling effect of the eardrum without being affected by physiological noise such as external noise or skin friction.
또한 생체내에서 적합한 물질로 제작되어 염증반응 없이 장기간 안정성을 갖는 마이크로폰의 기능을 수행할 수 있다.In addition, since it is made of materials suitable for living organisms, it can perform the function of a microphone with long-term stability without inflammatory reactions.
또한, 개인마다 추골병과 와우갑각 사이 간격의 차이가 있기 때문에 하부 탄성체의 높이를 개인에 맞게 맞춤형으로 조절할 수 있는 장점이 있다. 따라서, 마이크로폰을 성능이 좋은 상태로 설치할 수 있다. In addition, because there are differences in the distance between the malleus and the cochlear conchae for each individual, there is an advantage in that the height of the lower elastic body can be customized to suit the individual. Therefore, the microphone can be installed with good performance.
추골병 지지부가 테이퍼 형상으로 형성되어 에너지를 모아 센서로 전달할 수 있어 증폭의 역할을 하는 장점이 있다. The malleus support is formed in a tapered shape, so it can collect energy and transmit it to the sensor, which has the advantage of acting as an amplification.
또한 마이크로폰은 내이 또는 중이 자극 장치의 입력부의 마이크로폰으로 활용할 수 있다.Additionally, the microphone can be used as a microphone at the input of an inner ear or middle ear stimulation device.
본 발명의 다양하면서도 유익한 장점과 효과는 상술한 내용에 한정되지 않으며, 본 발명의 실시를 위한 형태를 설명하는 과정에서 보다 쉽게 이해될 수 있을 것이다.The various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood through the description of the form for implementing the present invention.
도 1은 본 발명의 일 실시예에 따른 마이크로폰의 사시도이다.1 is a perspective view of a microphone according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 상부막의 변형예이다.Figure 2 is a modified example of the upper film according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 하부막의 변형예이다.Figure 3 is a modified example of the lower film according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 마이크로폰이 인체에 적용된 예시도이다.Figure 4 is an exemplary diagram of a microphone according to an embodiment of the present invention applied to the human body.
도 5는 도 4의 일부 확대도이다.Figure 5 is a partially enlarged view of Figure 4.
도 6은 도 1의 제1 변형예이다.Figure 6 is a first modified example of Figure 1.
도 7은 본 발명의 일 실시예에 따른 연장부의 하부면을 보여주는 도면이다.Figure 7 is a view showing the lower surface of the extension part according to an embodiment of the present invention.
도 8은 도 1의 제2 변형예이다.Figure 8 is a second modified example of Figure 1.
도 9는 본 발명의 다른 실시예에 따른 마이크로폰의 부분 절개 사시도이다.Figure 9 is a partially cut away perspective view of a microphone according to another embodiment of the present invention.
도 10a는 본 발명의 다른 실시예에 따른 하부면의 제1 변형예를 나타내는 평면도이다.Figure 10a is a plan view showing a first modified example of the lower surface according to another embodiment of the present invention.
도 10b는 본 발명의 다른 실시예에 따른 하부면의 제2 변형예를 나타내는 평면도이다.Figure 10b is a plan view showing a second modified example of the lower surface according to another embodiment of the present invention.
도 11a 내지 11c는 본 발명의 다른 실시예에 따른 센서 패키지에 포함되는 구성을 설명하기 위한 종단면도이다.11A to 11C are longitudinal cross-sectional views for explaining components included in a sensor package according to another embodiment of the present invention.
도 11d는 본 발명의 수직부재의 종단면의 여러 변형예들을 나타내는 종단면도이다.Figure 11d is a longitudinal cross-sectional view showing several modified examples of the longitudinal cross-section of the vertical member of the present invention.
도 11e는 본 발명의 수직부재의 횡단면의 여러 변형예들을 나타내는 횡단면도이다.Figure 11e is a cross-sectional view showing various modifications of the cross-section of the vertical member of the present invention.
도 11f는 본 발명의 수직부재의 도입 유무에 따른 센서 감도를 비교한 그래프이다.Figure 11f is a graph comparing sensor sensitivity according to the presence or absence of the vertical member of the present invention.
도 12는 본 발명의 다른 실시예에 따른 센서 패키지의 종단면도이다.Figure 12 is a longitudinal cross-sectional view of a sensor package according to another embodiment of the present invention.
도 13a는 도 12에서 I-I’선 상부의 일부확대도이다.Figure 13a is a partially enlarged view of the upper part of line I-I' in Figure 12.
도 13b 및 13c는 본 발명의 수직부재의 높이에 따라 센서에 가해지는 힘을 비교한 그래프이다.Figures 13b and 13c are graphs comparing the force applied to the sensor according to the height of the vertical member of the present invention.
도 14는 본 발명의 다른 실시예에 따른 센서를 나타내는 평면도이다.Figure 14 is a plan view showing a sensor according to another embodiment of the present invention.
도 15는 본 발명의 또 다른 실시예에 따른 마이크로폰의 부분 절개 사시도이다.Figure 15 is a partially cut away perspective view of a microphone according to another embodiment of the present invention.
도 16은 본 발명의 또 다른 실시예에 따른 센서 패키지에 포함되는 구성을 설명하기 위한 종단면도이다.Figure 16 is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention.
도 17은 도 16에서 I-I”선 상부의 일부확대도이다.FIG. 17 is a partially enlarged view of the upper part of line I-I” in FIG. 16.
도 18은 본 발명의 또 다른 실시예에 따른 센서 패키지의 종단면도이다.Figure 18 is a longitudinal cross-sectional view of a sensor package according to another embodiment of the present invention.
도 19는 본 발명의 다른 실시예에 따른 마이크로폰이 인체에 적용된 예시도이다.Figure 19 is an example diagram of a microphone according to another embodiment of the present invention applied to the human body.
도 20은 본 발명의 일 실시예에 따른 인체 임플란트 장치의 블록도이다.Figure 20 is a block diagram of a human implant device according to an embodiment of the present invention.
본 명세서에서 서술되는 용어의 의미는 다음과 같이 이해되어야 할 것이다.The meaning of terms described in this specification should be understood as follows.
단수의 표현은 문맥상 명백하게 다르게 정의하지 않는 한 복수의 표현을 포함하는 것으로 이해되어야 한다.Singular expressions should be understood to include plural expressions unless the context clearly defines otherwise.
“제1”, “제2” 등의 용어는 하나의 구성요소를 다른 구성요소로부터 구별하기 위한 것으로, 이들 용어들에 의해 권리범위가 한정되어서는 아니 된다.Terms such as “first” and “second” are used to distinguish one component from another component, and the scope of rights should not be limited by these terms.
“포함하다” 또는 “가지다” 또는 “구비하다” 등의 용어는 하나 또는 그 이상의 다른 특징이나 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Terms such as “include,” “have,” or “equipped” do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. It must be understood.
“적어도 하나”의 용어는 하나 이상의 관련 항목으로부터 제시 가능한 모든 조합을 포함하는 것으로 이해되어야 한다. 예를 들어, “제1 항목, 제2 항목 및 제3 항목 중에서 적어도 하나”의 의미는 제1 항목, 제2 항목 또는 제3 항목 각각 뿐만 아니라 제1 항목, 제2 항목 및 제3 항목 중에서 2개 이상으로부터 제시될 수 있는 모든 항목의 조합을 의미한다.The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of the first item, the second item, and the third item” means each of the first item, the second item, or the third item, as well as two of the first item, the second item, and the third item. It means a combination of all items that can be presented from more than one.
“적어도 일부”의 용어는 대상물의 일 부(部)부터 전 부(部)에 있어, 최소한의 부(部) 부터 최대한의 부(部)를 모두 지칭할 수 있는 것으로 해석되어야 한다. The term “at least a portion” should be interpreted as being able to refer to all parts, from the minimum to the maximum, of an object.
“상에”라는 용어는 어떤 구성이 다른 구성의 바로 상면에 형성되는 경우 뿐 아니라 이들 구성들 사이에 제3의 구성이 개재되는 경우까지 포함하는 것을 의미한다.The term “on” means not only the case where a certain configuration is formed directly on top of another configuration, but also the case where a third configuration is interposed between these configurations.
이하에서는 본 발명의 일 실시예에 따른 센서 패키지 및 이를 포함하는 마이크로폰을 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, a sensor package and a microphone including the same according to an embodiment of the present invention will be described in detail with reference to the attached drawings.
각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가질 수 있다. 또한, 본 발명을 설명함에 있어, 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 본 발명의 요지를 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명은 생략할 수 있다.In adding reference numerals to components in each drawing, identical components may have the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.
이하, 첨부된 도면을 참조하여 실시예를 상세히 설명하되, 도면 부호에 관계없이 동일하거나 대응하는 구성 요소는 동일한 참조 번호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, embodiments will be described in detail with reference to the attached drawings, but identical or corresponding components will be assigned the same reference numbers regardless of reference numerals, and duplicate descriptions thereof will be omitted.
도 1은 본 발명의 일 실시예에 따른 이식형 마이크로폰의 사시도이다. 도 2는 상부막의 변형예이다. 도 3은 하부막의 변형예이다. 도 4는 이식형 마이크로폰이 인체에 적용된 예시도이다. 도 5는 도 4의 일부 확대도이다.Figure 1 is a perspective view of an implantable microphone according to an embodiment of the present invention. Figure 2 is a modified example of the upper membrane. Figure 3 is a modified example of the lower membrane. Figure 4 is an example of an implantable microphone applied to the human body. Figure 5 is a partially enlarged view of Figure 4.
도 1을 참조하면, 실시예에 따른 마이크로폰은, 센서 패키지(100) 및 센서 패키지(100)의 하부를 지지하는 탄성 지지체(200)를 포함할 수 있다. 센서 패키지(100)는 수술에 의해 인체에 삽입될 수 있으며, 탄성 지지체(200)는 센서 패키지(100)가 인체 내에 밀착되도록 배치될 수 있다.Referring to FIG. 1, a microphone according to an embodiment may include a sensor package 100 and an elastic support 200 supporting the lower portion of the sensor package 100. The sensor package 100 can be inserted into the human body through surgery, and the elastic support 200 can be arranged so that the sensor package 100 is in close contact with the human body.
센서 패키지(100)는, 탄성 지지체(200) 상에 배치되는 하부막(110), 하부막(110) 상에 배치되는 센서(130), 센서(130) 상에 배치되는 상부막(120) 및 케이스(160)를 포함할 수 있다.The sensor package 100 includes a lower membrane 110 disposed on the elastic support 200, a sensor 130 disposed on the lower membrane 110, an upper membrane 120 disposed on the sensor 130, and It may include a case 160.
하부막(110)과 상부막(120)은 생체 적합성 소재이고 탄성 재질을 갖는 재질을 포함할 수 있다. 예시적으로 하부막(110)과 상부막(120)은 PDMS, TPU, 폴리우레탄, 실리콘 등의 재질을 포함할 수 있다. 하부막(110)과 상부막(120)은 케이스(160)에 고정될 수 있다. 케이스(160)는 생체 적합성 소재이고 리지드(Rigid) 재질로 제작될 수 있다. 예시적으로 케이스(160)는 티타늄, PPEK 재질을 포함할 수 있다.The lower membrane 110 and the upper membrane 120 are biocompatible materials and may include an elastic material. For example, the lower film 110 and the upper film 120 may include materials such as PDMS, TPU, polyurethane, and silicone. The lower film 110 and the upper film 120 may be fixed to the case 160. Case 160 is a biocompatible material and may be made of rigid material. By way of example, the case 160 may include titanium or PPEK.
상부막(120)과 하부막(110)은 원형상의 막 구조로 형성되거나 링 구조로 형성될 수 있다. 도 2를 참조하면, 상부막(120)은 추골병 지지부(140)와 케이스(160) 사이를 연결하는 링 구조로 형성되어 탄성 계수를 적절한 범위로 조절할 수 있다. 그러나, 반드시 이에 한정하는 것은 아니고 상부막(120)은 원형상의 막 구조로 형성되고 하부에 추골병 지지부(140)가 부착되는 구조를 가질 수도 있다.The upper film 120 and the lower film 110 may be formed in a circular film structure or a ring structure. Referring to FIG. 2, the upper membrane 120 is formed in a ring structure connecting the osteoarthritis support portion 140 and the case 160, so that the elastic modulus can be adjusted to an appropriate range. However, it is not necessarily limited to this, and the upper membrane 120 may be formed in a circular membrane structure and may have a structure in which the osteoarthritis support portion 140 is attached to the lower portion.
하부막(110) 역시 원 형상의 막 구조로 형성되거나 링 구조로 형성될 수 있다.The lower film 110 may also be formed in a circular film structure or a ring structure.
도 2를 참조하면, 하부막(110)은 지지기판(150)과 케이스(160) 사이를 연결하는 링 구조를 가질 수 있고, 지지기판(150)의 크기가 커질수록 링 구조의 면적은 작아질 수 있다. 따라서, 적절한 힘으로 센서를 받치는 역할을 할 수 있다. 그 결과 이소골의 진동 신호를 센서(130)에 효과적으로 전달할 수 있다. 그러나, 반드시 이에 한정하는 것은 아니고 하부막(110)은 원형상의 막 구조로 형성되고 상부에 지지기판(150)이 배치되는 구조를 가질 수도 있다.Referring to FIG. 2, the lower film 110 may have a ring structure connecting the support substrate 150 and the case 160, and as the size of the support substrate 150 increases, the area of the ring structure decreases. You can. Therefore, it can serve to support the sensor with appropriate force. As a result, the vibration signal of the ossicles can be effectively transmitted to the sensor 130. However, it is not necessarily limited to this, and the lower film 110 may be formed in a circular film structure and have a structure in which the support substrate 150 is disposed on the top.
지지기판(150)은 센서(130)를 지지함으로써 센서(130)가 상부막(120)에 연결된 추골병의 진동을 효과적으로 수신할 수 있다.The support substrate 150 supports the sensor 130 so that the sensor 130 can effectively receive the vibration of the osteoid disease connected to the upper membrane 120.
센서(130)는 지지기판(150) 상에 배치될 수 있다. 또한, 센서(130)와 상부막(120) 사이에는 추골병 지지부(140)가 배치되어 상부막(120)에 연결된 추골병의 진동이 센서(130)에 전달될 수 있다. 센서(130)는 지지대(131) 상에 배치될 수 있다.The sensor 130 may be placed on the support substrate 150. In addition, the rotator cuff support portion 140 is disposed between the sensor 130 and the upper membrane 120 so that the vibration of the rotator cuff connected to the upper membrane 120 can be transmitted to the sensor 130. The sensor 130 may be placed on the support 131.
센서(130)는 추골병 즉 이소골(Ossicles) 돌기의 진동을 감지할 수 있는 다양한 센서가 채택될 수 있다. 센서(130)는 진동 신호를 전기 신호로 변환할 수 있다. 예시적으로 센서(130)는 4개의 지점에서 압력 변화를 측정할 수 있는 압력 센서(Piezoelectric 센서)일 수 있다. 이외에도 변위센서 혹은 가속도 센서 등을 적용할 수 있으며 센서의 종류에 제한이 없다.The sensor 130 may be a variety of sensors capable of detecting vibration of the ossicles, that is, the ossicles. The sensor 130 can convert vibration signals into electrical signals. For example, the sensor 130 may be a pressure sensor (Piezoelectric sensor) capable of measuring pressure changes at four points. In addition, displacement sensors or acceleration sensors can be applied, and there is no limit to the type of sensor.
실시예에 따르면, 센서가 추골병의 진동을 감지하여 전기 신호로 변환하므로 귀바퀴의 집음 효과, 외이도의 공명 효과 등 외이와 중이의 생리적 증폭기전을 그대로 이용할 수 있고, 소리의 방향성도 획득할 수 있는 장점이 있다. According to an embodiment, the sensor detects the vibration of the malleus disease and converts it into an electrical signal, so it is possible to utilize the physiological amplifiers of the outer and middle ear, such as the collecting effect of the auricle and the resonance effect of the external auditory canal, and also obtain the directionality of the sound. There is an advantage.
추골병 지지부는 추골병을 지지하고 추골병의 진동을 센서에 전달하는 역할을 수 있다. 이를 위해 추골병 지지부의 상면은 추골병을 지지할 수 있는 충분한 면적을 확보할 수 있다. 또한, 추골병 지지부는 센서에 가까워질수록 면적이 감소하는 테이퍼 형상(깔때기 형상)을 가질 수 있다. 이러한 구성에 의하면, 신호를 증폭하고 잡음을 줄여 감도를 높일 수 있다. The vertebral disease support portion may serve to support the vertebral disease and transmit the vibration of the vertebral disease to the sensor. For this purpose, the upper surface of the osteoarthritis support portion can secure a sufficient area to support the osteoarthritis. Additionally, the osteoarthritis support portion may have a tapered shape (funnel shape) whose area decreases as it approaches the sensor. According to this configuration, sensitivity can be increased by amplifying the signal and reducing noise.
케이스(160)는 상부막(120)과 하부막(110)의 외측을 둘러싸도록 배치되어 내부를 밀폐할 수 있다. 케이스(160)는 생체 적합성 물질로 구성된다. 밀폐된 내부에는 기체가 충전될 수 있다. 기체는 공기 또는 헬륨, 불활성 기체일 수 있으나 반드시 이에 한정하지 않는다. The case 160 is arranged to surround the outside of the upper membrane 120 and the lower membrane 110 to seal the interior. Case 160 is made of biocompatible material. The sealed interior can be filled with gas. The gas may be air, helium, or an inert gas, but is not necessarily limited thereto.
도 4 및 5를 참조하면, 센서 패키지(100)는 고막(T3)의 하부에 배치되는 이소골의 돌기인 추골병(malleus handle, T1)과 와우갑각(Promontory, T2) 사이에 배치될 수 있다. 이소골의 진동 신호를 효과적으로 수신하기 위해서는 센서 패키지(100)가 추골병(malleus handle, T1)과 밀착되는 것이 유리할 수 있다. 따라서, 실시예에 따르면, 탄성 지지체(200)에 의해 센서 패키지(100)를 추골병(malleus handle, T1)과 와우갑각(T2) 사이에 밀착시킬 수 있다.Referring to FIGS. 4 and 5, the sensor package 100 may be placed between the malleus handle (T1), which is a protrusion of the ossicle located at the bottom of the eardrum (T3), and the cochlear shell (T2). In order to effectively receive vibration signals from the ossicles, it may be advantageous for the sensor package 100 to be in close contact with the malleus handle (T1). Therefore, according to the embodiment, the sensor package 100 can be brought into close contact between the malleus handle (T1) and the cochlear shell (T2) by the elastic support 200.
탄성 지지체(200)는 생체적합성 소재이며 탄성을 갖는 다양한 재질이 선택될 수 있다. 예시적으로 탄성 지지체(200)는 PDMS, TPU, PU, 실리콘 등의 재질을 포함할 수 있다.The elastic support 200 is a biocompatible material and various materials having elasticity may be selected. By way of example, the elastic support 200 may include materials such as PDMS, TPU, PU, and silicon.
탄성 지지체(200)의 두께는 추골병(malleus handle, T1)과 와우갑각(T2) 사이의 간격에 따라 조절될 수 있다. 즉, 환자의 추골병(malleus handle, T1)과 와우갑각(T2) 사이의 간격을 미리 측정하고 간격을 산출하고 센서 패키지(100)를 밀착시킬 수 있도록 탄성 지지체(200)의 두께를 조절할 수 있다. 또는, 다양한 두께의 탄성 지지체(200)가 미리 준비되고 수술시 적당한 두께의 탄성 지지체(200)를 삽입할 수도 있다.The thickness of the elastic support 200 can be adjusted depending on the gap between the malleus handle (T1) and the cochlear shell (T2). That is, the gap between the patient's malleus handle (T1) and the cochlear shell (T2) can be measured in advance, the gap can be calculated, and the thickness of the elastic support 200 can be adjusted to ensure close contact with the sensor package 100. . Alternatively, elastic supports 200 of various thicknesses may be prepared in advance and the elastic supports 200 of appropriate thickness may be inserted during surgery.
실시예는 탄성 지지체(200)에 의해 센서 패키지(100)의 높이를 조절할 수 있으므로 센서(130)의 감도가 상승하는 장점이 있으며, 수술 시 설치가 편리한 장점이 있다. 필요에 따라 상부막(120)과 추골병(malleus handle, T1)의 사이는 접착제로 접착할 수 있으며, 탄성 지지체(200)의 상면 및/또는 하면에 접착제를 도포할 수도 있다.The embodiment has the advantage of increasing the sensitivity of the sensor 130 because the height of the sensor package 100 can be adjusted by the elastic support 200, and has the advantage of being convenient to install during surgery. If necessary, the upper membrane 120 and the malleus handle (T1) can be bonded with an adhesive, and the adhesive can also be applied to the upper and/or lower surfaces of the elastic support 200.
탄성 지지체는 단면이 사각형, 사다리꼴, 타원형 중 어느 하나의 형상을 가질 수 있다. 즉, 센서 패키지(100)의 높이를 조절할 수 있는 다양한 형상을 가질 수 있다.The elastic support may have a cross-section of any one of square, trapezoid, and oval shapes. That is, the sensor package 100 can have various shapes whose height can be adjusted.
탄성 지지체의 상부면은 센서 패키지를 지지하기 용이하도록 평탄면을 갖고 하부면(201)은 볼록한 와우갑각(T2)에 밀착되도록 오목한 형상을 가질 수 있다. 이러한 구성에 의하면, 볼록한 와우갑각 영역에서 고정력이 우수해질 수 있다.The upper surface of the elastic support has a flat surface to easily support the sensor package, and the lower surface 201 may have a concave shape to be in close contact with the convex cochlear shell (T2). According to this configuration, the fixation force can be improved in the convex cochlear conch region.
도 6은 도 1의 제1 변형예이다. 도 7은 연장부의 하부면을 보여주는 도면이다. 도 8은 도 1의 제2 변형예이다.Figure 6 is a first modified example of Figure 1. Figure 7 is a view showing the lower surface of the extension part. Figure 8 is a second modified example of Figure 1.
도 6을 참조하면, 케이스(160)는 하부로 돌출된 연장부(161)를 포함할 수 있다. 연장부(161)에 의해 탄성 지지체(200)가 센서 패키지(100)의 내부로 수용될 수 있다. 이러한 구성에 의하면 탄성 지지체(200)가 연장부(161) 내에 수용되어 안정적으로 센서 패키지(100)를 지지할 수 있는 장점이 있다.Referring to FIG. 6, the case 160 may include an extension portion 161 protruding downward. The elastic support 200 may be accommodated inside the sensor package 100 by the extension portion 161. According to this configuration, there is an advantage in that the elastic support 200 is accommodated in the extension portion 161 and can stably support the sensor package 100.
도 7을 참조하면, 연장부(161)의 하부면(161a)에는 복수 개의 전극(162)이 배치될 수 있다. 연장부(161)의 하부면(161a)은 링 구조를 갖고 복수 개의 전극(162)을 서로 이격 배치될 수 있다. 복수 개의 전극(162)은 와우갑각과 접촉하는 부분에 전기 자극을 가할 수 있다. 따라서, 이명 현상을 동시에 개선할 수 있다.Referring to FIG. 7 , a plurality of electrodes 162 may be disposed on the lower surface 161a of the extension portion 161. The lower surface 161a of the extension portion 161 has a ring structure and may have a plurality of electrodes 162 spaced apart from each other. The plurality of electrodes 162 can apply electrical stimulation to the portion in contact with the cochlear shell. Therefore, the tinnitus phenomenon can be improved at the same time.
도 8을 참조하면, 센서 패키지(100)는 하부막(110)에 의해 상부 공간부(S1)와 하부 공간부(S2)가 이격될 수 있다. 상부 공간부(S1)에는 센서(130)가 배치되는 반면, 하부 공간부(S2)에는 파이프(171)를 통해 유체가 유입될 수 있다. 유체가 하부 공간부(S2)에 주입되는 양에 따라 하부막(110)이 부풀어 오르게 되고 이에 따라 상부막(120)도 부풀어오르게 되어서 이소골과 접촉 압력이 변화될 수 있다. 유체의 종류는 특별히 한정하지 않는다.Referring to FIG. 8 , the upper space S1 and the lower space S2 of the sensor package 100 may be spaced apart by the lower film 110 . While the sensor 130 is disposed in the upper space (S1), fluid may flow into the lower space (S2) through the pipe 171. Depending on the amount of fluid injected into the lower space S2, the lower membrane 110 swells, and the upper membrane 120 also swells accordingly, so that the contact pressure with the ossicles may change. The type of fluid is not particularly limited.
도 9는 본 발명의 다른 실시예에 따른 마이크로폰의 부분 절개 사시도이다.Figure 9 is a partially cut away perspective view of a microphone according to another embodiment of the present invention.
도 9의 좌표계를 참조하면, x 방향은 가로 또는 너비 방향, y 방향은 세로 또는 길이 방향, z 방향은 높이, 두께 또는 수직 방향으로 정의될 수 있다.Referring to the coordinate system of FIG. 9, the x-direction can be defined as the horizontal or width direction, the y-direction can be defined as the vertical or longitudinal direction, and the z-direction can be defined as the height, thickness, or vertical direction.
xy 평면과 평행한 임의의 평면들을 +z 또는 -z 방향으로 바라보는 방향은 다른 실시예에 따른 마이크로폰(10)의 평면 또는 횡단면 방향일 수 있다.The direction in which arbitrary planes parallel to the xy plane are viewed in the +z or -z direction may be the plane or cross-section direction of the microphone 10 according to another embodiment.
yz평면과 평행한 임의의 평면들을 +x 또는 -x 방향으로 바라보는 방향은 다른 실시예에 따른 마이크로폰(10)의 종단면 방향일 수 있다.The direction in which arbitrary planes parallel to the yz plane are viewed in the +x or -x direction may be the vertical cross-section direction of the microphone 10 according to another embodiment.
xz평면과 평행한 임의의 평면들을 +y 또는 -y 방향으로 바라보는 방향은 다른 실시예에 따른 마이크로폰(10)의 종단면 방향일 수 있다.The direction in which arbitrary planes parallel to the xz plane are viewed in the +y or -y direction may be the vertical cross-section direction of the microphone 10 according to another embodiment.
도 9를 참조하면, 마이크로폰(10)은 센서 패키지(100) 및 센서 패키지(100)의 하부를 지지하는 탄성 지지체(200)를 포함할 수 있다. 다른 실시예에 따른 센서 패키지(100)는 센서(130) 상부에 배치되는 상부막(120)을 포함하지 않는 점에서 일 실시예에 따른 센서 패키지(100)와 차이가 있다.Referring to FIG. 9 , the microphone 10 may include a sensor package 100 and an elastic support 200 that supports the lower portion of the sensor package 100. The sensor package 100 according to another embodiment is different from the sensor package 100 according to one embodiment in that it does not include the upper film 120 disposed on the sensor 130.
센서 패키지(100)는 수술에 의해 인체에 삽입될 수 있으며, 탄성 지지체(200)는 센서 패키지(100)가 인체 내에 밀착되도록 배치될 수 있다.The sensor package 100 can be inserted into the human body through surgery, and the elastic support 200 can be arranged so that the sensor package 100 is in close contact with the human body.
센서 패키지(100)는 케이스(160), 케이스(160) 내에 배치되는 센서(130), 센서(130) 상에 센서(130)와 접하며 배치되는 수직부재(145) 및 케이스(160)를 메우는 수지(170)를 포함할 수 있다. 센서 패키지(100)는 센서(130)를 지지하며 케이스(160) 내에 배치되는 지지대(131)를 더 포함할 수 있다.The sensor package 100 includes a case 160, a sensor 130 disposed within the case 160, a vertical member 145 disposed on the sensor 130 and in contact with the sensor 130, and a resin filling the case 160. It may include (170). The sensor package 100 supports the sensor 130 and may further include a support 131 disposed within the case 160.
케이스(160)는 하부면(166), 하부면(166)의 외측을 둘러싸는 측면(167) 및 상기 하부면(166)과 상기 측면(167)으로 둘러싸인 내부공간(169)을 포함할 수 있다. Case 160 may include a lower surface 166, a side 167 surrounding the outside of the lower surface 166, and an internal space 169 surrounded by the lower surface 166 and the side 167. .
도 10a 및 10b는 본 발명의 다른 실시예에 따른 하부면의 제1 및 제2 변형예를 나타내는 평면도이다. 하부면(166)은 케이스(160) 중에서 탄성 지지체(200)와 실질적으로 접하는 면을 포함할 수 있다.10A and 10B are plan views showing first and second modified examples of the lower surface according to another embodiment of the present invention. The lower surface 166 may include a surface of the case 160 that is substantially in contact with the elastic support 200.
하부면(166)은, 이에 제한되는 것은 아니지만, 다각형 형상이거나(예를 들면, 도 10a) 원형 형상일 수 있다(예를 들면, 도 10b). 바람직하게는, 센서 패키지(100)를 지지하는 탄성 지지체(200)의 상면과 실질적으로 동일한 형상일 수 있다. 이에, 센서 패키지(100)가 탄성 지지체(200)에 안정적으로 고정될 수 있다. The lower surface 166 may, but is not limited to, be polygonal in shape (eg, Figure 10A) or circular in shape (eg, Figure 10B). Preferably, it may have substantially the same shape as the upper surface of the elastic support 200 supporting the sensor package 100. Accordingly, the sensor package 100 can be stably fixed to the elastic support 200.
하부면(166)은 탄성 지지체(200)와 실질적으로 접하므로, 탄성 지지체(200)에 고정될 수 있는 모든 구조를 포함할 수 있다. 예시적으로, 상기 마이크로폰(10)의 사용 과정에서 센서 패키지(100)가 탄성 지지체(200)로부터 미끄러지지 않도록 리세스 구조를 포함하거나 복수 개의 홈(groove)을 포함할 수 있다.Since the lower surface 166 is substantially in contact with the elastic support 200, it may include any structure that can be fixed to the elastic support 200. For example, the sensor package 100 may include a recess structure or a plurality of grooves to prevent the sensor package 100 from slipping off the elastic support 200 during use of the microphone 10.
예를 들면, 하부면(166)의 종단면을 보았을 때, 하부면(166)의 상면과 하면 중 적어도 일면은 +z 및/또는 -z 방향으로 오목할 수 있다. 이 경우, 센서 패키지(100)에 접촉하는 탄성 지지체(200)의 면은 상기 리세스 구조에 대응되도록 볼록한 면을 가질 수 있다.For example, when looking at the longitudinal cross-section of the lower surface 166, at least one of the upper and lower surfaces of the lower surface 166 may be concave in the +z and/or -z directions. In this case, the surface of the elastic support 200 in contact with the sensor package 100 may have a convex surface to correspond to the recess structure.
반대로, 하부면(166)은 볼록하고 탄성 지지체(200)는 오목할 수도 있다.Conversely, the lower surface 166 may be convex and the elastic support 200 may be concave.
도 10a 및 10b는 하부면(166)의 평면도를 도시한 것이므로, 도 10에서는 하부면(166)의 전부가 xy 평면과 평행한 것처럼 보일 수 있다. 그러나, 하부면(166)은 xy 평면과 평행한 평면만을 포함하는 것이 아닐 수 있다. 예를 들면, 하부면(166)은 곡면으로 형성될 수 있다.10A and 10B are top views of the lower surface 166, so in FIG. 10 the entire lower surface 166 may appear to be parallel to the xy plane. However, the lower surface 166 may not only include a plane parallel to the xy plane. For example, the lower surface 166 may be formed as a curved surface.
하부면(166)은 제1 하부면 영역(166a) 및 제2 하부면 영역(166b)을 포함할 수 있다. 예를 들면, 제1 하부면 영역(166a)은 제2 하부면 영역(166b)의 외측을 둘러싸고 있는 영역일 수 있다.The lower surface 166 may include a first lower surface area 166a and a second lower surface area 166b. For example, the first lower surface area 166a may be an area surrounding the outside of the second lower surface area 166b.
다른 실시예에 따른 링 구조의 하부면(166)에 있어서, 제1 하부면 영역(166a)과 제2 하부면 영역(166b)은 서로 같은 재질로 형성되거나 서로 다른 재질로 형성될 수 있다. 예를 들면, 하부면 영역(166a, 166b)은 모두 리지드(Rigid) 재질로 형성되거나, 한 영역은 리지드 재질로 형성되고 다른 한 영역은 상기 리지드 재질과 다른 재질로 형성될 수 있다.In the lower surface 166 of the ring structure according to another embodiment, the first lower surface area 166a and the second lower surface area 166b may be formed of the same material or different materials. For example, the lower surface regions 166a and 166b may both be formed of a rigid material, or one region may be formed of a rigid material and the other region may be formed of a material different from the rigid material.
하부면 영역(166a, 166b)을 형성하는 재질은 생체 적합성 재질일 수 있다. 이에 제한되는 것은 아니지만, 상기 생체 적합성 재질은 유리 에폭시, 유리종이 에폭시, 폴리테트라플루오로에틸렌(polytetrafluoroethylene, PTFE), 세라믹, 폴리염화비닐(Polyvinyl chloride, PVC), 아크릴로니트릴 부타다이엔 스타이렌(Acrylonitrile butadiene styrene, ABS), 폴리아세탈(Polyacetal)계 수지, 폴리프로필렌(Polypropylene, PP), 폴리에틸렌(Polyethylene, PE), 변성 폴리페닐옥사이드(Polyphenylene oxide, PPO), 폴리부틸렌 테레프탈레이드(Polybutylene terephthalate, PBT), 폴리에틸렌 테레프탈레이트(Polyethylene terephthalate, PET), 페놀계 수지, 불소계 수지, 에폭시계 수지, 불포화 폴리에스테르(Unsaturated polyester, UP)계 수지, 메타크릴 수지(Polymetylmethacrylate, PMMA), 폴리페닐렌설파이드(Polyphenylene sulfide, PPS), 폴리아마이드(Polyamide, PA), 폴리카보네이트(Polycarbonate, PC), 폴리디메틸실록산(Polydimethylsiloxane, PDMS), 열가소성 폴리우레탄(Thermoplastic Polyurethane, TPU), 폴리우레탄(Polyurethane), 실리콘(Silicone)계 수지, 티타늄(Titanium) 및 폴리에테르에테르케톤(Polyetheretherketone, PEEK)로 이루어지는 군에서 선택되는 적어도 하나를 포함할 수 있다.The material forming the lower surface regions 166a and 166b may be a biocompatible material. Although not limited thereto, the biocompatible materials include glass epoxy, glass paper epoxy, polytetrafluoroethylene (PTFE), ceramic, polyvinyl chloride (PVC), and acrylonitrile butadiene styrene ( Acrylonitrile butadiene styrene (ABS), polyacetal resin, polypropylene (PP), polyethylene (PE), modified polyphenylene oxide (PPO), polybutylene terephthalate, PBT), polyethylene terephthalate (PET), phenol-based resin, fluorine-based resin, epoxy-based resin, unsaturated polyester (UP)-based resin, methacrylate resin (Polymetylmethacrylate, PMMA), polyphenylene sulfide ( Polyphenylene sulfide (PPS), Polyamide (PA), Polycarbonate (PC), Polydimethylsiloxane (PDMS), Thermoplastic Polyurethane (TPU), Polyurethane, Silicone )-based resin, titanium, and polyetheretherketone (PEEK).
하부면(166)은 하부면 영역(166a, 166b)이 모두 같은 재질로 형성되는 막구조를 갖거나 서로 다른 재질로 형성되는 링구조를 가질 수 있다.The lower surface 166 may have a film structure in which the lower surface regions 166a and 166b are all formed of the same material, or may have a ring structure in which the lower surface regions 166a and 166b are formed of different materials.
하부면(166)은 센서를 지지하는 지지기판의 역할을 수행할 수 있다. 따라서, 센서(130)는 추골병(malleus handle, T1)의 진동을 안정적으로 수신할 수 있다.The lower surface 166 may serve as a support substrate to support the sensor. Therefore, the sensor 130 can stably receive the vibration of the malleus handle (T1).
다른 실시예에 따른 마이크로폰(10)이 인체 내에 삽입된 경우를 고려하면, 하부면(166)의 두께는 개인 차가 있는 추골병(T1)과 와우갑각(Promontory, T2) 사이의 z 방향 높이를 고려하여 적절히 조절될 수 있다.Considering the case where the microphone 10 according to another embodiment is inserted into the human body, the thickness of the lower surface 166 takes into account the z-direction height between the T1 and Promontory (T2), which varies from person to person. This can be adjusted appropriately.
바람직한 다른 실시예에 있어서, 하부면(166)의 두께는 0.1mm 이상 및 2.0mm 이하일 수 있다. 상기 범위에서 센서 패키지(100)가 탄성 지지체(200)에 적절히 고정되면서 추골병(T1)에 밀착될 수 있다. 또한, 추골병(T1)과 와우갑각(T2) 사이에 마이크로폰(10)이 안정적으로 안착될 수 있다.In another preferred embodiment, the thickness of the lower surface 166 may be greater than or equal to 0.1 mm and less than or equal to 2.0 mm. In the above range, the sensor package 100 can be properly fixed to the elastic support 200 and come into close contact with the osteoarthritis T1. Additionally, the microphone 10 can be stably seated between the malleolus (T1) and the cochlear shell (T2).
제1 하부면 영역(166a)과 제2 하부면 영역(166b)은 서로 두께가 같거나 다를 수 있다. 상기 두께는 도 10의 좌표계에서 하부면(166)의 두께 방향(+z 또는 -z)의 길이일 수 있다.The first lower surface area 166a and the second lower surface area 166b may have the same or different thicknesses. The thickness may be the length in the thickness direction (+z or -z) of the lower surface 166 in the coordinate system of FIG. 10.
예를 들면, 제2 하부면 영역(166b)의 두께는 제1 하부면 영역(166a)의 두께보다 클 수 있다. 제2 하부면 영역(166b)은 하부면(166)의 메인 지지기판 역할을 수행할 수 있다.For example, the thickness of the second lower surface area 166b may be greater than the thickness of the first lower surface area 166a. The second lower surface region 166b may serve as a main support substrate for the lower surface 166.
다시 도 9를 참조하면, 반드시 이에 제한되는 것은 아니나, 센서(130)는 제2 하부면 영역(166b) 상에 배치될 수 있다. 하부면(166) 중 제2 하부면 영역(166b)의 비중이 커지면서, 제2 하부면 영역(166b)은 적절한 힘으로 센서(130)를 받칠 수 있다. 이에, 이소골의 진동 신호는 센서(130)에 효과적으로 전달될 수 있다.Referring again to FIG. 9, the sensor 130 may be disposed on the second lower surface area 166b, although it is not necessarily limited thereto. As the proportion of the second lower surface area 166b of the lower surface 166 increases, the second lower surface area 166b can support the sensor 130 with an appropriate force. Accordingly, the vibration signal of the ossicles can be effectively transmitted to the sensor 130.
도 11a는 본 발명의 다른 실시예에 따른 센서 패키지에 포함되는 구성을 설명하기 위한 종단면도이다.Figure 11a is a longitudinal cross-sectional view to explain the configuration included in the sensor package according to another embodiment of the present invention.
도 11a를 참조하면, 측면(167)은 하부면(166)의 외측을 둘러싸거나 감쌀 수 있다. 측면(167)은 생체 적합성 소재로 형성될 수 있다. 상기 생체 적합성 소재는 리지드(Rigid) 재질로 제작될 수 있다. 이에 제한되는 것은 아니지만, 예시적으로 측면(167)은 유리 에폭시(Epoxy), 유리종이 에폭시(Epoxy), 폴리테트라플루오로에틸렌(polytetrafluoroethylene, PTFE), 세라믹, 폴리염화비닐(Polyvinyl chloride, PVC), 아크릴로니트릴 부타다이엔 스타이렌(Acrylonitrile butadiene styrene, ABS), 폴리아세탈(Polyacetal)계 수지, 폴리프로필렌(Polypropylene, PP), 폴리에틸렌(Polyethylene, PE), 변성 폴리페닐옥사이드(Polyphenylene oxide, PPO), 폴리부틸렌 테레프탈레이드(Polybutylene terephthalate, PBT), 폴리에틸렌 테레프탈레이트(Polyethylene terephthalate, PET), 페놀계 수지, 불소계 수지, 에폭시계 수지, 불포화 폴리에스테르(Unsaturated polyester, UP)계 수지, 메타크릴 수지(Polymetylmethacrylate, PMMA), 폴리페닐렌설파이드(Polyphenylene sulfide, PPS), 폴리아마이드(Polyamide, PA), 폴리카보네이트(Polycarbonate, PC), 폴리디메틸실록산(Polydimethylsiloxane, PDMS), 열가소성 폴리우레탄(Thermoplastic Polyurethane, TPU), 폴리우레탄(Polyurethane), 실리콘(Silicone)계 수지, 티타늄(Titanium) 및 폴리에테르에테르케톤(Polyetheretherketone, PEEK)로 이루어지는 군에서 선택되는 적어도 하나를 포함할 수 있다.Referring to FIG. 11A, the side surface 167 may surround or wrap around the outside of the lower surface 166. The side 167 may be formed of biocompatible material. The biocompatible material may be made of rigid material. Although not limited thereto, the side 167 is illustratively made of glass epoxy, glass paper epoxy, polytetrafluoroethylene (PTFE), ceramic, polyvinyl chloride (PVC), Acrylonitrile butadiene styrene (ABS), polyacetal resin, polypropylene (PP), polyethylene (PE), modified polyphenylene oxide (PPO), Polybutylene terephthalate (PBT), Polyethylene terephthalate (PET), phenol resin, fluorine resin, epoxy resin, unsaturated polyester (UP) resin, methacrylic resin (Polymetylmethacrylate) , PMMA), Polyphenylene sulfide (PPS), Polyamide (PA), Polycarbonate (PC), Polydimethylsiloxane (PDMS), Thermoplastic Polyurethane (TPU), It may include at least one selected from the group consisting of polyurethane, silicone resin, titanium, and polyetheretherketone (PEEK).
측면(167)과 하부면(166)은 서로 같은 재질로 형성되거나 서로 다른 재질로 형성될 수 있다. 서로 같은 재질로 형성되는 경우, 제조 비용이 절감되는 이점이 있다.The side surface 167 and the bottom surface 166 may be formed of the same material or may be formed of different materials. If they are made of the same material, there is an advantage in reducing manufacturing costs.
측면(167)의 높이는 마이크로폰(10)이 장착될 인체 내 추골병(T1)과 와우갑각(T2)사이의 z 방향 거리를 고려하여 적절히 조절될 수 있다. 즉, 상기 거리는 개인마다 편차가 있을 수 있어 이를 고려하여 설정될 수 있다.The height of the side 167 can be appropriately adjusted taking into account the z-direction distance between the malleus malleum (T1) and the cochlear conchae (T2) in the human body where the microphone 10 will be mounted. In other words, the distance may vary from person to person, so it can be set taking this into account.
바람직한 다른 실시예에 있어서, 측면(167)의 높이는 0.1mm 이상 및 2.0mm 이하일 수 있다. 상기 범위에서 추골병(T1)과 탄성 지지체(200)의 밀착력이 향상될 수 있다.In another preferred embodiment, the height of the side surface 167 may be 0.1 mm or more and 2.0 mm or less. In the above range, the adhesion between the osteoarthritis T1 and the elastic support 200 can be improved.
측면(167)의 x 방향 너비는 z 방향으로 갈수록 일정하지 않을 수 있다. 예를 들면, 측면(167)의 종단면은 하부면(166) 측으로 갈수록 x 방향 너비가 점점 증가하는 형상일 수 있다.The x-direction width of the side 167 may not be constant as it moves toward the z-direction. For example, the longitudinal cross-section of the side surface 167 may have a width in the x-direction that gradually increases toward the lower surface 166.
마이크로폰(10)이 추골병(T1)과 와우갑각(T2) 사이에 배치되는 경우, 탄성 지지체(200)에 의해 센서 패키지(100)는 z 방향으로 고정력을 받는다. 측면(167)의 종단면이 상술한 예시적인 형상을 갖는 경우, z 방향의 내부 저항력(예를 들면, 압축응력)의 한도가 증가될 수 있다. 다른 실시예에 따른 센서 패키지(100)는 결과적으로 증가된 고정력에도 변형되지 않는 이점이 있다.When the microphone 10 is placed between the malleus malleum (T1) and the cochlear shell (T2), the sensor package 100 receives a fixing force in the z direction by the elastic support 200. When the longitudinal cross-section of the side 167 has the exemplary shape described above, the limit of the internal resistance force (eg, compressive stress) in the z direction can be increased. The sensor package 100 according to another embodiment has the advantage of not being deformed even with increased fixation force.
케이스(160)는 하부면(166)과 측면(167)으로 둘러싸인 내부공간(169)을 포함할 수 있다. Case 160 may include an internal space 169 surrounded by a lower surface 166 and a side surface 167.
도 11b는 본 발명의 다른 실시예에 따른 센서 패키지에 포함되는 구성을 설명하기 위한 종단면도이다. 상술한 구성(예를 들면, 하부면(160) 또는 측면(167))과 실질적으로 동일한 구성에 대한 설명은 생략된다.Figure 11b is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention. Descriptions of configurations that are substantially the same as the above-described configuration (for example, the lower surface 160 or the side surface 167) are omitted.
도 11b를 참조하면, 센서(130)는 케이스(160) 내에 배치될 수 있다. 센서(130)는 하부면(166) 상에 배치되어 내부공간(169)에 수납될 수 있다.Referring to FIG. 11B, the sensor 130 may be placed within the case 160. The sensor 130 may be placed on the lower surface 166 and stored in the internal space 169.
또한, 센서(130) 상에는 수직부재 및 수지가 배치되어 추골병(T1)의 진동은 센서(130)에 전달될 수 있다. 센서(130)는 지지대(131) 상에 배치될 수 있다.In addition, a vertical member and a resin are disposed on the sensor 130 so that the vibration of the osteoarthritis T1 can be transmitted to the sensor 130. The sensor 130 may be placed on the support 131.
지지대(131)는 센서(130)에 있어서 하부면(166)과 접촉하는 부분을 밀봉하는 역할을 수행할 수 있다. 다른 실시예에 있어서, 지지대(131)는 센서(130)와 동일한 소재로 형성될 수 있다. 예를 들면, 지지대(131)는 실리콘계 반도체 및/또는 금속을 포함하여 형성될 수 있다.The support 131 may serve to seal a portion of the sensor 130 that is in contact with the lower surface 166. In another embodiment, the support 131 may be formed of the same material as the sensor 130. For example, the support 131 may be formed of a silicon-based semiconductor and/or metal.
센서(130)는 추골병(T1) 즉 이소골(Ossicles) 돌기의 진동을 감지할 수 있는 다양한 센서가 채택될 수 있다. 센서(130)는 진동 신호를 전기 신호로 변환할 수 있다. 예시적으로 센서(130)는 4개의 지점에서 압력 변화를 측정할 수 있는 압력 센서(Piezoelectric 센서), 또는 압전 센서일 수 있다.The sensor 130 may be a variety of sensors capable of detecting the vibration of the ossicles (T1), that is, the ossicles. The sensor 130 can convert vibration signals into electrical signals. For example, the sensor 130 may be a pressure sensor (piezoelectric sensor) or a piezoelectric sensor capable of measuring pressure changes at four points.
이외에도 변위 센서 혹은 가속도 센서 등이 적용될 수 있으며 센서(130)의 종류는 제한되지 않는다.In addition, a displacement sensor or an acceleration sensor may be applied, and the type of sensor 130 is not limited.
센서(130)가 추골병(T1)의 진동을 감지하여 이를 전기 신호로 변환하므로, 귀바퀴의 집음 효과, 외이도의 공명 효과 등 외이와 중이의 생리적 증폭기전을 그대로 이용할 수 있다. 또한, 소리의 방향성도 획득될 수 있는 장점이 있다.Since the sensor 130 detects the vibration of the vertebral column (T1) and converts it into an electrical signal, it is possible to utilize the physiological amplifiers of the outer and middle ears, such as the collecting effect of the auricle and the resonance effect of the external auditory canal. In addition, there is an advantage that the directionality of the sound can also be obtained.
다른 실시예에 있어서, 센서 패키지는 센서가 배치되는 구역에 센서로 둘러싸인 공간(132)을 포함할 수 있다. 상기 공간(132)은 후술할 다이어프램 영역(133) 내 다이어프램이 진동을 위한 공간일 수 있다. 상기 공간(132)은 공기, 질소 및 헬륨 등의 기체로 채워지거나, 진공상태일 수 있다.In another embodiment, the sensor package may include a space 132 surrounded by the sensor in an area where the sensor is placed. The space 132 may be a space for the diaphragm to vibrate in the diaphragm area 133, which will be described later. The space 132 may be filled with gas such as air, nitrogen, and helium, or may be in a vacuum state.
도 11c는 본 발명의 다른 실시예에 따른 센서 패키지에 포함되는 구성을 설명하기 위한 종단면도이다. 상술한 구성들과 실질적으로 동일한 구성(예를 들면, 센서(130) 또는 지지대(131))에 대한 설명은 생략된다.Figure 11c is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention. Descriptions of components that are substantially the same as those described above (eg, sensor 130 or support 131) are omitted.
도 11c를 참조하면, 다른 실시예에 따른 센서 패키지(100)는 케이스(160)를 메우는 수지(170)를 포함할 수 있다. 환언하면, 내부공간(169)의 적어도 일부는 수지(170)에 의해 충전될 수 있다.Referring to FIG. 11C, the sensor package 100 according to another embodiment may include resin 170 filling the case 160. In other words, at least a portion of the internal space 169 may be filled with the resin 170.
수지(170)는 센서(130) 및/또는 수직부재(145)를 감싼 채로 경화되어 있는 상태일 수 있다. 경화된 수지(170)에 의해 센서(130)와 접하고 있는 수직부재(145)는 고정된 상태일 수 있다.The resin 170 may be in a cured state while surrounding the sensor 130 and/or the vertical member 145. The vertical member 145 in contact with the sensor 130 may be fixed by the cured resin 170.
따라서, 추골병(T1)의 진동이 센서 패키지(100)에 전달되어도 수직부재(145)는 센서(130)로부터 이탈하지 않고 센서(130)와 접촉한 상태로 유지될 수 있다. 이에, 마이크로폰(10)의 사용 수명특성이 향상될 수 있다. 또한, 수직부재(145)는 센서9130) 상에서 기울어지지 않을 수 있으며, 마이크로폰(10)의 실시자가 실시하고자 하는 수직 부재(145)의 위치에 정확히 배치될 수 있다.Accordingly, even if the vibration of the osteoarthritis T1 is transmitted to the sensor package 100, the vertical member 145 may be maintained in contact with the sensor 130 without leaving the sensor 130. Accordingly, the service life characteristics of the microphone 10 can be improved. Additionally, the vertical member 145 may not be tilted on the sensor 9130, and may be placed exactly at the position of the vertical member 145 that the operator of the microphone 10 wishes to implement.
다른 실시예에 있어서, 수지(170)는 생체 적합성(biocompatible) 소재로 형성될 수 있다.In another embodiment, the resin 170 may be formed of a biocompatible material.
센서 패키지(100)가 인체 내에 삽입되는 경우, 상기 생체는 인간의 몸체를 의미할 수 있다. 이 경우, 생체 적합성은 인체에 이식된 보철물이 인체에 유해한 변화를 일으키지 않고 인체 조직과 조화롭게 존재할 수 있는 능력으로 정의될 수 있다.When the sensor package 100 is inserted into the human body, the living body may refer to the human body. In this case, biocompatibility can be defined as the ability of a prosthesis implanted in the human body to exist in harmony with human tissue without causing harmful changes in the human body.
상기 수지(170)는 실리콘계 물질을 포함할 수 있다.The resin 170 may include a silicone-based material.
수지(170)는 폴리다이메틸실록산(Polydimethylsiloxane, PDMS), 실록산(Siloxane)계 수지, 액상 실리콘 고무(Liquid Silicone Rubber, LSR), 플루오로실리콘(Fluorosilicone), 폴리우레탄(Polyurethane), 및 열경화성 엘라스토머(Thermo Plastic Elastomer, TPE)로 이루어지는 군에서 선택되는 적어도 하나를 포함할 수 있다. Resin 170 is polydimethylsiloxane (PDMS), siloxane-based resin, liquid silicone rubber (LSR), fluorosilicone, polyurethane, and thermosetting elastomer ( It may include at least one selected from the group consisting of Thermo Plastic Elastomer (TPE).
상술한 소재들을 포함하는 수지(170)에 의해 메워진 케이스(160)가 인체 내에 도입되는 경우, 장기적인 관점에서 수지(170)의 섬유화에 의한 손상이 방지될 수 있다. 이에, 상기 케이스(160)를 포함하는 마이크로폰(10)은 그 감도가 시간이 지나도 유지될 수 있는 장점이 있다.When the case 160 filled with the resin 170 containing the above-described materials is introduced into the human body, damage due to fibrosis of the resin 170 can be prevented from a long-term perspective. Accordingly, the microphone 10 including the case 160 has the advantage of maintaining its sensitivity over time.
수지(170)는 추골병(T1)의 진동을 전달받아 수직부재(145)에 전달하는 기능을 수행할 수 있다. 이에, 추골병(T1)의 진동이 곧바로 센서(130)에 전달되지 않을 수 있으며, 센서(130)는 손상되지 않을 수 있다.The resin 170 may perform the function of receiving the vibration of the vertebral disease (T1) and transmitting it to the vertical member 145. Accordingly, the vibration of the osteoarthritis T1 may not be immediately transmitted to the sensor 130, and the sensor 130 may not be damaged.
다시 말하면, 추골병(T1)의 진동은 수지(170)에 의해 감쇠(damping)될 수 있으며, 센서 패키지(100)의 안정성이 증진될 수 있다. 이에, 마이크로폰(10)의 사용 수명이 길어질 수 있는 이점이 있다.In other words, the vibration of the osteoarthritis T1 can be damped by the resin 170, and the stability of the sensor package 100 can be improved. Accordingly, there is an advantage that the usable life of the microphone 10 can be extended.
보다 자세하게는, 센서(130)는 감도가 높은 동시에 강도가 약하기 때문에, 삽입 수술 등 센서(130)를 사용하는 과정에서 센서(130)가 손상될 수 있다. 이에, 수지(170)가 사용됨에 따라, 센서(130)가 파손될 위험성이 더 적을 수 있으며, 이는 반복적인 실험을 통해 확인되었다.More specifically, because the sensor 130 has high sensitivity and low strength, the sensor 130 may be damaged during the process of using the sensor 130, such as during an insertion surgery. Accordingly, as the resin 170 is used, the risk of the sensor 130 being damaged may be reduced, and this was confirmed through repeated experiments.
또한, 수지(170)를 충전시키는 방식에 의해 센서 패키지(100)의 제조공정은 단순화될 수 있으며, 이에 공정 수율이 증가할 수 있다.Additionally, the manufacturing process of the sensor package 100 can be simplified by filling the resin 170, and thus the process yield can be increased.
다른 실시예에 있어서, 센서(130) 상에는 센서(130)와 접하는 수직부재(145)가 배치될 수 있다.In another embodiment, a vertical member 145 in contact with the sensor 130 may be disposed on the sensor 130.
수직부재(145)는 센서 패키지(100)의 수직 방향으로 길이가 있는 부재로 정의될 수 있다.The vertical member 145 may be defined as a member having a length in the vertical direction of the sensor package 100.
수직부재(145)는 감광물질을 사용하는 공정에 의해 형성될 수 있다. 상기 공정은 다음과 같은 단계에 의해서 수행될 수 있다:The vertical member 145 may be formed by a process using a photosensitive material. The process can be performed by the following steps:
1) 센서(130) 표면 상에 감광물질 층을 도포한다.1) Apply a photosensitive material layer on the surface of the sensor 130.
2) 감광물질의 표면을 마스킹 한다.2) Mask the surface of the photosensitive material.
3) 감광물질의 비마스킹 부분을 자외선 광 또는 전자 빔과 같은 복사선에 노출시킨다.3) Exposing the non-masking portion of the photosensitive material to radiation such as ultraviolet light or electron beam.
4) 감광물질의 일부(예, 비마스킹 또는 마스킹 부분)을 제거하면서 감광물질의 일부(예, 비마스킹 또는 마스킹 부분의 다른 부분)를 센서(130) 표면 상에 남기는 것에 의해서, 감광물질 패턴이 형성될 수 있다.4) By removing a portion of the photosensitive material (e.g., the non-masking or masking portion) while leaving a portion of the photosensitive material (e.g., another portion of the non-masking or masking portion) on the surface of the sensor 130, the photosensitive material pattern is created. can be formed.
수직부재(145)는 포지티브 PR(positive PR) 또는 네거티브 PR(negative PR)에 의해 형성되는 감광물질 패턴의 일부일 수 있다.The vertical member 145 may be part of a photosensitive material pattern formed by positive PR or negative PR.
상술한 마스킹에 사용되는 포토마스크(Photomask)는 수직부재(145)의 높이에 따라 다양한 종류의 것이 사용될 수 있다. 예시적으로, 한 층의 마스크만을 마스킹하거나, 여러 층의 마스크를 이용해 마스킹할 수 있다.Photomasks used for the above-described masking may be of various types depending on the height of the vertical member 145. For example, masking can be done using only one layer of mask, or masking can be done using multiple layers of masks.
도 11d를 참조하면, 수직부재(145)의 종단면 형상은 추골병(T1)의 진동을 감지할 수 있는 것이라면 특별히 제한되지는 않는다. 수직부재(145)의 종단면은 직사각형 형상, 사다리꼴 형상, 또는 상부(또는, 하부)에서 하부(또는, 상부)로 갈수록 단차가 형성된 구조일 수 있다.Referring to FIG. 11D, the longitudinal cross-sectional shape of the vertical member 145 is not particularly limited as long as it can detect the vibration of the osteoarthritis T1. The longitudinal cross-section of the vertical member 145 may have a rectangular shape, a trapezoidal shape, or a structure in which steps are formed from the top (or bottom) to the bottom (or top).
도 11e를 참조하면, 수직부재(145)의 횡단면의 형상은 특별히 제한되지 않는다. 예를 들면, 상기 횡단면은 원형 또는 다각형의 형상일 수 있다.Referring to FIG. 11E, the shape of the cross section of the vertical member 145 is not particularly limited. For example, the cross-section may be circular or polygonal in shape.
다른 실시예에 있어서, 수직부재(145)는 폴리염화비닐(Polyvinyl chloride, PVC), 아크릴로니트릴 부타다이엔 스타이렌(Acrylonitrile butadiene styrene, ABS), 폴리아세탈(Polyacetal)계 수지, 폴리프로필렌(Polypropylene, PP), 폴리에틸렌(Polyethylene, PE), 변성 폴리페닐옥사이드(Polyphenylene oxide, PPO), 폴리부틸렌 테레프탈레이드(Polybutylene terephthalate, PBT), 폴리에틸렌 테레프탈레이트(Polyethylene terephthalate, PET), 페놀계 수지, 불소계 수지, 에폭시계 수지, 불포화 폴리에스테르(Unsaturated polyester, UP)계 수지, 메타크릴 수지(Polymetylmethacrylate, PMMA), 폴리페닐렌설파이드(Polyphenylene sulfide, PPS), 폴리아마이드(Polyamide, PA), 폴리카보네이트(Polycarbonate, PC), 폴리이미드(Polyimide, PI), 폴리에틸렌글라이콜(Polyethylene glycol, PEG), 폴리락틱산(Polylactic acid, PLA), 폴리우레탄(Polyurethane, PU), 폴리하이드록시알카노에이트(Polyhydroxyalkanoates, PHA) 및 폴리에테르에테르케톤(Polyether ether ketone, PEEK)로 이루어지는 군에서 선택되는 적어도 하나를 포함하여 형성될 수 있다.In another embodiment, the vertical member 145 is made of polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), polyacetal resin, and polypropylene. , PP), polyethylene (PE), modified polyphenylene oxide (PPO), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), phenolic resin, fluorine resin , epoxy resin, unsaturated polyester (UP) resin, methacrylic resin (Polymetylmethacrylate, PMMA), polyphenylene sulfide (PPS), polyamide (PA), polycarbonate, PC), polyimide (PI), polyethylene glycol (PEG), polylactic acid (PLA), polyurethane (PU), polyhydroxyalkanoates (PHA) ) and polyether ether ketone (PEEK).
도 11f는 본 발명의 수직부재의 도입 유무에 따라 센서(130)의 감도를 비교한 그래프이다.Figure 11f is a graph comparing the sensitivity of the sensor 130 depending on whether or not the vertical member of the present invention is introduced.
도 11f에서, x축(Modulus of Molding Material)은 충전된 수지(170)의 강도(Pa)를 나타내고, y축(Expected Singal Ratio)은 종래의 센서 패키지와 본 발명에 따른 센서 패키지의 센서 응답 성능 비(본 발명에 따른 센서 패키지의 센서 응답 성능 / 종래의 센서 패키지의 센서 응답 성능)를 나타낸다.In Figure 11f, the x-axis (Modulus of Molding Material) represents the strength (Pa) of the filled resin 170, and the y-axis (Expected Singal Ratio) represents the sensor response performance of the conventional sensor package and the sensor package according to the present invention. It represents the ratio (sensor response performance of the sensor package according to the present invention / sensor response performance of the conventional sensor package).
빨간색 선(Mold with SU8 Post)은 수직부재(145)의 존재 하에 측정된 실험 결과가, 검은색 선(Molded Package)은 수직부재 없이 측정된 실험 결과가 도시된 것이다.The red line (Mold with SU8 Post) shows the experimental results measured in the presence of the vertical member 145, and the black line (Molded Package) shows the experimental results measured without the vertical member.
빨간색 선과 검은색 선은 모두 센서 보호와 센서 패키지의 내구성 향상을 위해 수지(170)가 채워진 채로 측정된 실험 결과가 도시된 것이다.Both the red and black lines show experimental results measured with the resin 170 filled to protect the sensor and improve the durability of the sensor package.
충전된 수지(170)의 강도가 1MPa인 경우, 종래의 센서 패키지에 비해 약 35% 수준의 성능이 측정된 실선에 따른 실험 결과와 달리, 빨간색 선에 따른 실험 결과에서는 약 58% 수준의 성능이 측정되었다.When the strength of the filled resin 170 is 1 MPa, unlike the experimental results along the solid line, which measured a performance of about 35% compared to the conventional sensor package, the experimental results along the red line showed a performance of about 58%. It was measured.
이에 따라, 수직부재(145)가 도입된 빨간색 선에 따른 실험 결과에서 센서(130)의 감도가 향상된 것을 확인할 수 있다.Accordingly, it can be seen that the sensitivity of the sensor 130 is improved in the experimental results along the red line where the vertical member 145 is introduced.
도 12는 본 발명의 다른 실시예에 따른 센서 패키지(100)의 종단면도이다. 도 13a는 도 12에서 I-I’선 상부의 일부확대도이다. 상술한 구성들과 실질적으로 동일한 구성(예를 들면, 센서(130) 또는 지지대(131))에 대한 설명은 생략된다.Figure 12 is a longitudinal cross-sectional view of the sensor package 100 according to another embodiment of the present invention. Figure 13a is a partially enlarged view of the upper part of line I-I' in Figure 12. Descriptions of components that are substantially the same as those described above (eg, sensor 130 or support 131) are omitted.
도 12 및 도 13a를 참조하면, 다른 실시예 따른 센서 패키지(100)에 있어서, 수지(170)는 센서(130) 상에 배치되는 제1 수지층(175) 및 제1 수지층(175)을 제외한 나머지의 제2 수지층(177)을 포함할 수 있다.12 and 13A, in the sensor package 100 according to another embodiment, the resin 170 includes a first resin layer 175 and a first resin layer 175 disposed on the sensor 130. It may include the remaining second resin layer 177.
다른 실시예에 있어서, 수직부재(145)는 센서(130)와 접하고 센서(130)는 케이스(160)의 내부공간(169)에 배치되므로 수직부재(145)의 적어도 일부는 수지(170)에 존재할 수 있다. In another embodiment, the vertical member 145 is in contact with the sensor 130 and the sensor 130 is disposed in the internal space 169 of the case 160, so at least a portion of the vertical member 145 is in the resin 170. It can exist.
수직부재(145)의도 전부는 수지(170)에 존재할 수 있다. 이 경우, 제1 수지층(175)의 수직 방향 길이(d1)는 수직부재(145)의 수직 방향 길이(d2)보다 클 수 있다. 또한, 이 경우 수직부재(145)의 상부면부터 제1 수지층(175)의 상부면까지의 수직 방향 길이(d3)가 정의될 수 있다. All of the vertical members 145 may be present in the resin 170. In this case, the vertical length d1 of the first resin layer 175 may be greater than the vertical length d2 of the vertical member 145. Additionally, in this case, a vertical length d3 from the upper surface of the vertical member 145 to the upper surface of the first resin layer 175 may be defined.
수직부재(145)의 재질은 특별히 한정되지 않는다. 센서 패키지(100)는 인체에 삽입될 수 있으므로 생체 적합성 재질이 포함될 수 있다. “생체 적합성”은 수지(170)의 소재를 기재하며 정의된 바와 같이 인체에 이식된 보철물이 인체에 유해한 변화를 일으키지 않고 인체 조직과 조화롭게 존재할 수 있는 능력으로 정의될 수 있다.The material of the vertical member 145 is not particularly limited. Since the sensor package 100 can be inserted into the human body, it may contain biocompatible materials. “Biocompatibility” describes the material of the resin 170 and can be defined as the ability of a prosthesis implanted in the human body to exist in harmony with human tissue without causing harmful changes to the human body.
예를 들면, 수직부재(145)는 폴리이미드(Polyimide, PI), 폴리에틸렌글라이콜(Polyethylene glycol, PEG), 폴리락틱산(Polylactic acid, PLA), 폴리우레탄(Polyurethane, PU), 폴리하이드록시알카노에이트(Polyhydroxyalkanoates, PHA) 및 폴리에테르에테르케톤(Polyetheretherketone, PEEK)로 이루어지는 군에서 선택되는 적어도 하나를 포함할 수 있다.For example, the vertical member 145 is made of polyimide (PI), polyethylene glycol (PEG), polylactic acid (PLA), polyurethane (PU), and polyhydroxy It may include at least one selected from the group consisting of alkanoates (polyhydroxyalkanoates, PHA) and polyetheretherketone (PEEK).
도 13b 및 13c는 본 발명의 다른 실시예에 따른 수직부재의 높이에 따라 센서에 가해지는 힘을 비교한 그래프이다.Figures 13b and 13c are graphs comparing the force applied to the sensor according to the height of the vertical member according to another embodiment of the present invention.
도 13b를 참조하면, x축(Post Height)은 수직부재(145)의 높이를, y축(Max. Stress in Sensor Membrane)은 센서(130)의 출력(예를 들면, 감도 등)과 관련된 파라미터를 의미한다. 상기 파라미터는 센서의 출력과 양의 상관관계가 있다.Referring to Figure 13b, the x-axis (Post Height) is the height of the vertical member 145, and the y-axis (Max. Stress in Sensor Membrane) is a parameter related to the output (e.g., sensitivity, etc.) of the sensor 130. means. The above parameters are positively correlated with the output of the sensor.
제1 수지층(175)의 높이(d1)는 200㎛로 고정되었고, 수직부재의 높이(d2)의 강도에 따른 센서 출력의 향상은 d2가 100㎛ 전후인 경우 포화되는 경향을 보였다.The height (d1) of the first resin layer 175 was fixed at 200㎛, and the improvement in sensor output according to the strength of the height (d2) of the vertical member tended to be saturated when d2 was around 100㎛.
다른 실시예에 따른 센서 패키지는 수지(170)의 강도가 1MPa이하인 경우이거나, 수직부재(145)의 높이(d2)는 d1의 1/2 이상인 경우에 센서의 출력이 향상될 수 있다. 다른 실시예에 있어서, 수직부재(145)의 수직 방향 길이(d2)는 제1 수지층(175)의 수직 방향 길이(d1)의 2/3 이상일 수 있다. 상기 범위에서, 수직부재(145)가 존재하며 센서(130)의 감도가 증가될 수 있다.In the sensor package according to another embodiment, the output of the sensor may be improved when the strength of the resin 170 is 1 MPa or less or when the height d2 of the vertical member 145 is greater than 1/2 of d1. In another embodiment, the vertical length d2 of the vertical member 145 may be 2/3 or more of the vertical length d1 of the first resin layer 175. In this range, vertical member 145 is present and the sensitivity of sensor 130 can be increased.
다른 실시예에 있어서, 수직부재(145)의 상부면부터 제1 수지층(175)의 상부면까지의 수직 방향 길이(d3)는 상기 수직부재(145)의 수직 방향 길이(d2)의 1/3 이하일 수 있다. 상기 범위에서, 수직부재(145)의 존재 하에 추골병(T1)의 진동이 센서(130)로 전달되는 효과가 향상될 수 있다.In another embodiment, the vertical length d3 from the upper surface of the vertical member 145 to the upper surface of the first resin layer 175 is 1/ of the vertical length d2 of the vertical member 145. It may be 3 or less. In the above range, the effect of transmitting the vibration of the vertebral disease (T1) to the sensor 130 in the presence of the vertical member 145 can be improved.
도 13c를 참조하면, x축(Post Height)은 상기 첫번째 그래프의 x축과 같은 수직부재(145)의 높이를, y축(Post Diameter)은 수직부재(145)의 직경을, z축(Max. Stress)은 상기 첫번째 그래프의 y축과 같은 파라미터를 의미한다. 따라서, z축의 파라미터는 센서의 출력(예를 들면, 감도 등)과 양의 상관관계가 있다.Referring to FIG. 13C, the x-axis (Post Height) is the height of the vertical member 145 like the x-axis of the first graph, the y-axis (Post Diameter) is the diameter of the vertical member 145, and the z-axis (Max . Stress) refers to the same parameter as the y-axis of the first graph above. Therefore, the z-axis parameters have a positive correlation with the sensor's output (e.g., sensitivity, etc.).
후술하는 바와 같이, 수직부재(145)와 센서(130)가 접하는 영역의 면적이 센서(130)의 상면 면적의 일정 비율 이상인 경우, 다른 실시예에 따른 센서 패키지의 센서 출력이 향상될 수 있다.As will be described later, when the area of the area where the vertical member 145 and the sensor 130 are in contact is greater than a certain ratio of the top surface area of the sensor 130, the sensor output of the sensor package according to another embodiment may be improved.
다른 실시예에 있어서, 수직부재(145)의 상부면부터 제1 수지층(175)의 상부면까지의 수직 방향 길이(d3)는 상기 수직부재(145)의 수직 방향 길이(d2)의 1/3 이하일 수 있다. 상기 범위에서, 수직부재(145)의 존재 하에 추골병(T1)의 진동이 센서(130)로 전달되는 효과가 향상될 수 있다.In another embodiment, the vertical length d3 from the upper surface of the vertical member 145 to the upper surface of the first resin layer 175 is 1/ of the vertical length d2 of the vertical member 145. It may be 3 or less. In the above range, the effect of transmitting the vibration of the vertebral disease (T1) to the sensor 130 in the presence of the vertical member 145 can be improved.
도 14는 본 발명의 다른 실시예에 따른 센서를 나타내는 평면도이다. Figure 14 is a plan view showing a sensor according to another embodiment of the present invention.
도 14를 참조하면, 센서(130)는 수직부재(145)와 접하는 영역(146)을 포함할 수 있다. 다른 실시예에 따른 센서(130)는 다이어프램 영역(133)을 포함할 수 있다.Referring to FIG. 14, the sensor 130 may include an area 146 in contact with the vertical member 145. The sensor 130 according to another embodiment may include a diaphragm area 133.
다이어프램 영역(133)은 센서(130)의 실제 작동에 주요한 기능을 수행하는 센서(130)의 영역으로 정의될 수 있다. 이는 센서(130)의 중앙부 중 z 방향의 두께가 얇으면서 추골병(T1)에 의한 외부 자극에 진동하는 곳일 수 있다. 다른 실시예에 따른 센서(130)의 목적은 다이어프램 영역(133)의 움직임을 감지하는 것일 수 있다.The diaphragm area 133 may be defined as an area of the sensor 130 that performs a major function in the actual operation of the sensor 130. This may be a part of the central part of the sensor 130 that is thin in the z-direction and vibrates due to external stimulation caused by osteoarthritis T1. The purpose of the sensor 130 according to another embodiment may be to detect movement of the diaphragm area 133.
수직부재(145)와 센서(130)가 접하는 영역(146)의 면적은 다이어프램 영역(133)의 면적의 80% 이하일 수 있다. 상기 범위에서, 추골병(T1)의 진동에 대한 센서(130)의 감도가 향상될 수 있다.The area of the area 146 where the vertical member 145 and the sensor 130 contact each other may be 80% or less of the area of the diaphragm area 133. In the above range, the sensitivity of the sensor 130 to vibration of the tendon disease T1 can be improved.
도 15는 본 발명의 또 다른 실시예에 따른 마이크로폰의 부분 절개 사시도이다. 도 16은 본 발명의 또 다른 실시예에 따른 센서 패키지에 포함되는 구성을 설명하기 위한 종단면도이다. 도 17은 도 16에서 I-I”선 상부의 일부확대도이다.Figure 15 is a partially cut away perspective view of a microphone according to another embodiment of the present invention. Figure 16 is a longitudinal cross-sectional view for explaining the configuration included in the sensor package according to another embodiment of the present invention. FIG. 17 is a partially enlarged view of the upper part of line I-I” in FIG. 16.
상술한 구성들과 실질적으로 동일한 구성(예를 들면, 케이스(160), 센서(130), 또는 수지(170))에 대한 설명은 생략된다.Descriptions of components that are substantially the same as those described above (eg, case 160, sensor 130, or resin 170) are omitted.
도 15, 16 및 17을 참조하면, 수직부재(145)의 적어도 일부는 수지(170)에 존재하지 않을 수 있다. 이 경우, 수직부재(145)의 수직 방향 길이(d2)는 제1 수지층(175)의 수직 방향 길이(d1)보다 작지 않을 수 있다.15, 16, and 17, at least a portion of the vertical member 145 may not be present in the resin 170. In this case, the vertical length d2 of the vertical member 145 may not be smaller than the vertical length d1 of the first resin layer 175.
수직부재(145)의 재질은 특별히 한정되지 않을 수 있다. 다만, 센서 패키지(100)가 생체 내에 포함되는 경우, 수지(170)에 존재하지 않는 수직부재(145)의 일부는 추골병(T1)과 실질적으로 접할 수 있다. 따라서, 수직부재(145)는 생체 적합성 재질을 포함할 수 있다. 예를 들면, 폴리에틸렌(Polyethylene, PE), 폴리프로필렌(Polypropylene, PP), 폴리테트라플루오로에틸렌(Polytetrafluoroethylene, PTFE), 폴리메틸메타크릴레이트(Polymethylmethacrylate, PMMA), 폴리이미드(Polyimide, PI), 폴리에틸렌글라이콜(Polyethylene glycol, PEG), 폴리락틱산(Polylactic acid, PLA), 폴리우레탄(Polyurethane, PU), 폴리하이드록시알카노에이트(Polyhydroxyalkanoates, PHA) 및 폴리에테르에테르케톤(Polyether ether ketone, PEEK)로 이루어지는 군에서 선택되는 적어도 하나를 포함할 수 있다.The material of the vertical member 145 may not be particularly limited. However, when the sensor package 100 is included in a living body, a portion of the vertical member 145 that is not present in the resin 170 may substantially contact the osteoarthritis T1. Accordingly, the vertical member 145 may include a biocompatible material. For example, polyethylene (PE), polypropylene (PP), polytetrafluoroethylene (PTFE), polymethylmethacrylate (PMMA), polyimide (PI), polyethylene Glycol (Polyethylene glycol, PEG), Polylactic acid (PLA), Polyurethane (PU), Polyhydroxyalkanoates (PHA), and Polyether ether ketone (PEEK) ) may include at least one selected from the group consisting of
“생체 적합성”은 수지(170)의 소재를 기재하며 정의된 바와 같이 인체에 이식된 보철물이 인체에 유해한 변화를 일으키지 않고 인체 조직과 조화롭게 존재할 수 있는 능력으로 정의될 수 있다.“Biocompatibility” describes the material of the resin 170 and can be defined as the ability of a prosthesis implanted in the human body to exist in harmony with human tissue without causing harmful changes to the human body.
또 다른 실시예에 있어서, 제1 수지층(175)의 상부면부터 수직부재(145)의 상부면까지의 수직 방향 길이(d4)는 수직부재(145)의 수직 방향 길이(d2)의 1/10을 초과하지 않을 수 있다. 1/10을 초과하는 경우, 추골병(T1)의 진동이 수지(170)에 의해 감쇠(damping)되는 효과가 저하될 수 있다. 이에, 센서(130)로 전달되는 진동이 커져 센서(130)가 파손될 수 있으며, 마이크로폰(10)의 수명 특성이 저하될 수 있다.In another embodiment, the vertical length d4 from the upper surface of the first resin layer 175 to the upper surface of the vertical member 145 is 1/ of the vertical length d2 of the vertical member 145. It may not exceed 10. If it exceeds 1/10, the effect of damping the vibration of the osteoarthritis T1 by the resin 170 may be reduced. Accordingly, the vibration transmitted to the sensor 130 increases and the sensor 130 may be damaged, and the lifespan characteristics of the microphone 10 may be reduced.
도 18은 본 발명의 또 다른 실시예에 따른 센서 패키지의 종단면도이다.Figure 18 is a longitudinal cross-sectional view of a sensor package according to another embodiment of the present invention.
도 18을 참조하면, 또 다른 실시예에 따른 센서 패키지(100)는 센서 패키지(100)의 외측을 둘러싸는 코팅층(180)을 포함할 수 있다. 또 다른 실시예에 따른 코팅층(180)은 생체 적합성 소재로 형성될 수 있다. 이는 센서 패키지(100)에 포함된 수지 및/또는 케이스는 생체 적합성 소재로 형성되지 않도록 할 수 있는 장점이 있다.Referring to FIG. 18, a sensor package 100 according to another embodiment may include a coating layer 180 surrounding the outside of the sensor package 100. The coating layer 180 according to another embodiment may be formed of a biocompatible material. This has the advantage of ensuring that the resin and/or case included in the sensor package 100 is not made of biocompatible material.
코팅층(180)이 생체 적합성 소재로 형성되어 인체 내부에 삽입됨에 따라 센서 패키지(100)는 숙주인 인체에 유해한 변화를 일으키지 않고 인체 조직과 조화롭게 존재할 수 있다.As the coating layer 180 is formed of a biocompatible material and inserted into the human body, the sensor package 100 can exist in harmony with human tissue without causing harmful changes to the human host.
코팅층(180)은 균일한 코팅막으로서, 열적 또는 기계적 변형이 이루어지지 않을 수 있다. 또한, 코팅층(180)은 수분 침투 저항성, 내부식성 및 가스 차단 특성 중 적어도 하나의 특성을 포함할 수 있다.The coating layer 180 is a uniform coating film and may not undergo thermal or mechanical deformation. Additionally, the coating layer 180 may include at least one of moisture penetration resistance, corrosion resistance, and gas barrier properties.
또 다른 실시예에 있어서, 코팅층(180)은 패럴린 코팅에 의해 형성될 수 있다. 패럴린 코팅은 진공 상태에서 분말 상태의 원료를 기화시켜 폴리머 형태의 필름막을 형성시키는 기술로써 화학 증착법(CVD: Chmical-Vapor Deposition)을 이용하는 코팅 기술이다. 상기 원료는 당 분야에서 주지된 것을 사용할 수 있다.In another embodiment, the coating layer 180 may be formed by paraline coating. Paraline coating is a coating technology that uses chemical vapor deposition (CVD) to form a polymer film by vaporizing powdered raw materials in a vacuum. The raw materials may be those well known in the art.
도 19는 본 발명의 다른 실시예에 따른 마이크로폰이 인체에 적용된 예시도이다.Figure 19 is an example diagram of a microphone according to another embodiment of the present invention applied to the human body.
다른 실시예에 따른 마이크로폰(10)은 상술한 실시예들에 따른 센서 패키지(100) 및 센서 패키지(100)의 하부를 지지하는 탄성 지지체(200)를 포함할 수 있다.The microphone 10 according to another embodiment may include the sensor package 100 according to the above-described embodiments and an elastic support 200 supporting the lower part of the sensor package 100.
센서 패키지(100)는 고막(T3)의 하부에 배치되는 이소골의 돌기인 추골병(T1)과 와우갑각(T2) 사이에 배치될 수 있다. 이소골의 진동 신호를 효과적으로 수신하기 위해서는 센서 패키지(100)가 추골병(T1)과 밀착되는 것이 유리할 수 있다. 따라서, 탄성 지지체(200)에 의해 센서 패키지(100)를 추골병(T1)과 와우갑각(T2) 사이에 밀착시킬 수 있다.The sensor package 100 may be placed between the malleolus (T1), which is a protrusion of the ossicle located below the tympanic membrane (T3), and the cochlear conchae (T2). In order to effectively receive the vibration signal of the ossicles, it may be advantageous for the sensor package 100 to be in close contact with the malleus ossicle (T1). Therefore, the sensor package 100 can be brought into close contact between the malleolus (T1) and the cochlear shell (T2) by the elastic support 200.
탄성 지지체(200)는 생체적합성 소재이며 탄성을 갖는 다양한 재질을 포함할 수 있다. 예시적으로 탄성 지지체(200)는 PDMS, TPU, PU, 실리콘 등의 재질을 포함할 수 있다.The elastic support 200 is a biocompatible material and may include various materials having elasticity. By way of example, the elastic support 200 may include materials such as PDMS, TPU, PU, and silicon.
탄성 지지체(200)의 두께는 추골병(T1)과 와우갑각(T2) 사이의 간격에 따라 조절될 수 있다. 즉, 환자의 추골병(T1)과 와우갑각(T2) 사이의 간격을 미리 측정하고 간격을 산출해서 센서 패키지(100)를 밀착시킬 수 있도록 탄성 지지체(200)의 두께가 조절될 수 있다. 또는, 다양한 두께의 탄성 지지체(200)가 미리 준비되고 수술 시 적당한 두께의 탄성 지지체(200)가 삽입될 수 있다.The thickness of the elastic support 200 can be adjusted depending on the gap between the malleus vertebrae (T1) and the cochlear conchae (T2). That is, the thickness of the elastic support 200 can be adjusted so that the sensor package 100 can be brought into close contact by measuring the gap in advance between the patient's malleolus (T1) and the cochlear shell (T2) and calculating the gap. Alternatively, elastic supports 200 of various thicknesses may be prepared in advance and the elastic supports 200 of appropriate thickness may be inserted during surgery.
다른 실시예에 있어서, 탄성 지지체(200)에 의해 센서 패키지(100)의 높이가 조절될 수 있으므로 센서(130)의 감도가 상승하는 장점이 있으며, 수술 시 설치가 편리한 장점이 있다.In another embodiment, the height of the sensor package 100 can be adjusted by the elastic support 200, which has the advantage of increasing the sensitivity of the sensor 130 and convenient installation during surgery.
필요에 따라 수지(170)의 상부면 또는 수직부재(145)의 상부면과 추골병(T1)의 사이는 접착제로 접착될 수 있으며, 탄성 지지체(200)의 상면 및/또는 하면에 접착제가 도포될 수도 있다.If necessary, the upper surface of the resin 170 or the upper surface of the vertical member 145 and the malleus T1 may be bonded with an adhesive, and the adhesive may be applied to the upper and/or lower surfaces of the elastic support 200. It could be.
예를 들면, 상기 하부에 폴리다이메틸실록산(Polydimethylsiloxane, PDMS)이 코팅될 수 있다. 코팅된 센서 패키지(100) 하부와 탄성 지지체(200)는 O2 플라즈마가 적용되어 서로 접착될 수 있다.For example, polydimethylsiloxane (PDMS) may be coated on the lower portion. The coated lower part of the sensor package 100 and the elastic support 200 may be bonded to each other by applying O2 plasma.
탄성 지지체(200)는 단면이 사각형, 사다리꼴, 타원형 중 어느 하나의 형상을 가질 수 있다. 즉, 센서 패키지(100)의 높이를 조절할 수 있는 다양한 형상을 가질 수 있다.The elastic support 200 may have a cross-sectional shape of any one of square, trapezoid, and oval. That is, the sensor package 100 can have various shapes whose height can be adjusted.
탄성 지지체(200)의 상면은 센서 패키지(100)를 지지하기 용이하도록 평탄면을 갖고 하부면(201)은 볼록한 와우갑각(T2)에 밀착되도록 오목한 형상을 가질 수 있다. 이러한 구성에 의하면, 볼록한 와우갑각 영역에서 고정력이 우수해질 수 있다.The upper surface of the elastic support 200 may have a flat surface to facilitate supporting the sensor package 100, and the lower surface 201 may have a concave shape to be in close contact with the convex cochlear shell (T2). According to this configuration, the fixation force can be improved in the convex cochlear conch area.
상술한 바와 같이, 센서 패키지(100)가 탄성 지지체(200)로부터 미끄러지지 않기 위해 케이스(160)의 하부면(166)은, 상술한 바와 같이, 리세스 구조를 포함하거나 복수 개의 홈(groove)을 포함할 수 있다.As described above, in order to prevent the sensor package 100 from slipping from the elastic support 200, the lower surface 166 of the case 160 includes a recess structure or has a plurality of grooves, as described above. It can be included.
탄성 지지체(200)는 센서 패키지(100)를 크래들 방식에 의해 지지할 수 있다. 탄성 지지체(200)는 홈(groove)을 포함할 수 있으며, 센서 패키지(100)는 상기 홈에 안착될 수 있다.The elastic support 200 may support the sensor package 100 using a cradle method. The elastic support 200 may include a groove, and the sensor package 100 may be seated in the groove.
도 20은 본 발명의 일 실시예에 따른 인체 임플란트 장치의 블록도이다.Figure 20 is a block diagram of a human implant device according to an embodiment of the present invention.
도 20을 참조하면, 일 실시예에 따른 임플란트 장치(1)는 마이크로폰(10), 어음처리기(11) 및 자극기(12)를 포함할 수 있다.Referring to FIG. 20, the implant device 1 according to one embodiment may include a microphone 10, a sound processor 11, and a stimulator 12.
마이크로폰(10)은 전술한 바와 같이 추골병(T1)의 진동을 감지하여 진동 신호를 전기 신호로 변환할 수 있다. 일 실시예에 따르면, 센서가 추골병(T1)의 진동을 감지하여 전기 신호로 변환하므로 귀바퀴의 집음 효과, 외이도의 공명 효과 등 외이와 중이의 생리적 증폭기전을 그대로 이용할 수 있고, 소리의 방향성도 획득할 수 있는 장점이 있다.As described above, the microphone 10 may detect the vibration of the osteoarthritis T1 and convert the vibration signal into an electrical signal. According to one embodiment, the sensor detects the vibration of the vertebral column (T1) and converts it into an electrical signal, so it is possible to utilize the physiological amplifiers of the outer and middle ears, such as the collecting effect of the auricle and the resonance effect of the external auditory canal, and the directionality of the sound. There are advantages that can be gained.
어음처리기(11)는 주파수별로 시간에 따라 신호를 분석한 후 이를 전기신호로 바꾸어 생체 내 이식한 자극기에 전달할 수 있다. 이러한 어음 처리기는 기존의 공지 구성이 제한 없이 적용될 수 있다.The sound processor 11 can analyze signals by frequency and time, then convert them into electrical signals and transmit them to a stimulator implanted in the body. This bill processor can be applied to existing known configurations without limitation.
자극기(12)는 입력된 신호에 따라 전극을 통하여 청신경이 자극할 수 있다. 이러한 자극기의 구조는 일반적으로 인공 와우에 사용되는 다양한 형태의 자극기가 제한 없이 적용될 수 있다.The stimulator 12 can stimulate the auditory nerve through electrodes according to the input signal. The structure of this stimulator can be applied to various types of stimulators commonly used in cochlear implants without limitation.
이상, 첨부된 도면을 참조하여 본 발명의 실시예들을 더욱 상세하게 설명하였으나, 본 발명은 반드시 이러한 실시예로 국한되는 것은 아니고, 본 발명의 기술사상을 벗어나지 않는 범위 내에서 다양하게 변형 실시될 수 있다. Above, embodiments of the present invention have been described in more detail with reference to the accompanying drawings, but the present invention is not necessarily limited to these embodiments, and may be implemented in various modifications without departing from the technical spirit of the present invention. there is.
따라서, 본 발명에 개시된 실시예들은 본 발명의 기술 사상을 한정하기 위한 것이 아니라 설명하기 위한 것이고, 이러한 실시예에 의하여 본 발명의 기술 사상의 범위가 한정되는 것은 아니다. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments.
그러므로, 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.
본 발명의 보호 범위는 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다.The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

Claims (20)

  1. 센서 패키지; 및sensor package; and
    상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고,Includes an elastic support body supporting the lower part of the sensor package,
    상기 센서 패키지는,The sensor package is,
    상기 탄성 지지체 상에 배치되는 하부막;a lower film disposed on the elastic support;
    상기 하부막 상에 배치되는 센서;A sensor disposed on the lower film;
    상기 센서 상에 배치되는 상부막; 및 an upper film disposed on the sensor; and
    상기 하부막 및 상부막의 외측을 둘러싸는 케이스를 포함하고,It includes a case surrounding the outside of the lower membrane and the upper membrane,
    상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 상부막과 추골병(malleus handle)을 밀착시키는, 마이크로폰.The elastic support is disposed between the sensor package and the cochlear shell (Promontory) to bring the upper membrane and the malleus handle into close contact with the microphone.
  2. 제1항에 있어서,According to paragraph 1,
    상기 센서 패키지는, The sensor package is,
    상기 하부막 상에 배치되는 지지기판; 및a support substrate disposed on the lower film; and
    상기 센서와 상기 상부막 사이에 배치되는 추골병 지지부를 포함하는, 마이크로폰.A microphone comprising a vertebral disease support portion disposed between the sensor and the upper membrane.
  3. 제2항에 있어서,According to paragraph 2,
    상기 상부막은 상기 추골병(malleus handle)과 접촉하고, 원형 또는 링형상으로 제작되어 탄성 계수를 조절하고,The upper membrane is in contact with the malleus handle and is manufactured in a circular or ring shape to adjust the elastic modulus,
    상기 하부막은 상기 탄성 지지체에 접촉하고, 원형 또는 링형상으로 제작되어 상기 센서를 지지하고,The lower membrane contacts the elastic support and is manufactured in a circular or ring shape to support the sensor,
    상기 하부막은 탄성 재질 또는 리지드 재질로 구성되고 The lower membrane is made of an elastic material or a rigid material.
    상기 탄성 지지체는 단면이 사각형, 사다리꼴, 타원형 중 어느 하나의 형상을 갖고,The elastic support has a cross-section of any one of square, trapezoid, and oval shape,
    상기 탄성 지지체의 상부면은 평탄면을 갖고 하부면은 볼록한 와우갑각에 밀착되도록 오목한 형상을 갖는, 마이크로폰.A microphone wherein the upper surface of the elastic support has a flat surface and the lower surface has a concave shape to be in close contact with the convex cochlear shell.
  4. 제2항에 있어서,According to paragraph 2,
    상기 추골병 지지부는 상부막과 센서에 접촉하고,The osteoarthritis support portion contacts the upper membrane and the sensor,
    상기 추골병 지지부의 단면은 상기 센서에 가까워질수록 좁아지는 테이퍼 형상을 가져 진동 에너지를 상기 센서에 증폭시켜 전달하는, 마이크로폰.A microphone wherein the cross section of the malleus disease support portion has a tapered shape that becomes narrower as it approaches the sensor, thereby amplifying and transmitting vibration energy to the sensor.
  5. 제1항에 있어서,According to paragraph 1,
    상기 케이스는 하부로 연장되어 상기 탄성 지지체를 수용하는 연장부를 포함하는, 마이크로폰.The case includes an extension portion that extends downward and accommodates the elastic support.
  6. 제5항에 있어서,According to clause 5,
    상기 연장부의 하부에는 복수 개의 전극이 배치되고,A plurality of electrodes are disposed at the lower part of the extension part,
    상기 복수 개의 전극은 상기 와우갑각에 자극 신호를 인가하는, 마이크로폰.The plurality of electrodes are microphones that apply stimulation signals to the cochlear shell.
  7. 센서 패키지; 및sensor package; and
    상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고,Includes an elastic support body supporting the lower part of the sensor package,
    상기 센서 패키지는,The sensor package is,
    케이스;case;
    상기 케이스 내에 배치되는 센서;A sensor disposed within the case;
    상기 센서 상에 상기 센서와 접하며 배치되는 수직부재; 및A vertical member disposed on the sensor and in contact with the sensor; and
    상기 케이스를 메우는 수지를 포함하고,Contains a resin that fills the case,
    상기 수지는 상기 수직부재를 감싼 채로 경화되고,The resin is cured while surrounding the vertical member,
    상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 센서 패키지와 추골병(malleus handle)을 밀착시키는, 마이크로폰.The elastic support is disposed between the sensor package and the cochlear shell (Promontory) to bring the sensor package and the malleus handle into close contact with the microphone.
  8. 제7 항에 있어서,According to clause 7,
    상기 수지는 폴리다이메틸실록산(Polydimethylsiloxane, PDMS), 실록산(Siloxane)계 수지, 액상 실리콘 고무(Liquid Silicone Rubber, LSR), 플루오로실리콘(Fluorosilicone), 폴리우레탄(Polyurethane), 및 열가소성 엘라스토머(Thermo Plastic Elastomer, TPE)로 이루어지는 군에서 선택되는 적어도 하나를 포함하는, 마이크로폰.The resin includes polydimethylsiloxane (PDMS), siloxane-based resin, liquid silicone rubber (LSR), fluorosilicone, polyurethane, and thermoplastic elastomer (Thermo Plastic). A microphone comprising at least one selected from the group consisting of elastomer (TPE).
  9. 제7 항에 있어서,According to clause 7,
    상기 케이스는,In the above case,
    하부면;lower surface;
    상기 하부면의 외측을 둘러싸는 측면; 및A side surrounding the outside of the lower surface; and
    상기 하부면과 상기 측면으로 둘러싸인 내부공간을 포함하고,Comprising an internal space surrounded by the lower surface and the side surface,
    상기 센서는,The sensor is,
    상기 하부면 상에 배치되어 상기 내부공간에 수납되는, 마이크로폰.A microphone disposed on the lower surface and stored in the internal space.
  10. 제9 항에 있어서,According to clause 9,
    상기 내부공간의 적어도 일부는 상기 수지에 의해 충전되며,At least a portion of the internal space is filled with the resin,
    상기 수직부재의 적어도 일부는 상기 수지에 존재하는, 마이크로폰.At least a portion of the vertical member is present in the resin.
  11. 제10 항에 있어서,According to claim 10,
    상기 수직부재의 전부는 상기 수지에 존재하는, 마이크로폰.A microphone, wherein all of the vertical members are present in the resin.
  12. 제11 항에 있어서,According to claim 11,
    상기 수지는,The resin is,
    상기 센서 상에 배치되는 제1 수지층; 및A first resin layer disposed on the sensor; and
    상기 제1 수지층을 제외한 나머지의 제2 수지층을 포함하고,It includes a second resin layer excluding the first resin layer,
    상기 수직부재의 수직 방향 길이(d2)는 상기 제1 수지층의 수직 방향 길이(d1)의 2/3 이상인, 마이크로폰.The vertical length (d2) of the vertical member is 2/3 or more of the vertical length (d1) of the first resin layer.
  13. 제12 항에 있어서,According to claim 12,
    상기 수직부재의 상부면부터 상기 제1 수지층의 상부면까지의 수직 방향 길이(d3)는 상기 수직부재의 수직 방향 길이(d2)의 1/3 이하인, 마이크로폰.The vertical length (d3) from the upper surface of the vertical member to the upper surface of the first resin layer is less than 1/3 of the vertical length (d2) of the vertical member.
  14. 제10 항에 있어서,According to claim 10,
    상기 센서는 다이어프램 영역을 포함하고,The sensor includes a diaphragm area,
    상기 수직부재와 상기 센서가 접하는 영역의 면적은 상기 다이어프램 영역의 면적의 80% 이하인, 마이크로폰.A microphone wherein an area of a contact area between the vertical member and the sensor is 80% or less of an area of the diaphragm area.
  15. 제10 항에 있어서,According to claim 10,
    상기 센서 패키지의 외측을 덮는 코팅층을 더 포함하는, 마이크로폰.A microphone further comprising a coating layer covering the outside of the sensor package.
  16. 제15 항에 있어서,According to claim 15,
    상기 코팅층은 패럴린(Parylene) 코팅에 의해 형성되는, 마이크로폰.The coating layer is formed by Parylene coating.
  17. 마이크로폰; 및microphone; and
    상기 마이크로폰과 통신하는 자극 장치를 포함하고,comprising a stimulation device in communication with the microphone,
    상기 마이크로폰은,The microphone is,
    센서 패키지; 및sensor package; and
    상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고,Includes an elastic support body supporting the lower part of the sensor package,
    상기 센서 패키지는,The sensor package is,
    상기 탄성 지지체 상에 배치되는 하부막;a lower film disposed on the elastic support;
    상기 하부막 상에 배치되는 센서;A sensor disposed on the lower film;
    상기 센서 상에 배치되는 상부막; 및 an upper film disposed on the sensor; and
    상기 하부막 및 상부막의 외측을 둘러싸는 케이스를 포함하고,It includes a case surrounding the outside of the lower membrane and the upper membrane,
    상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 상부막과 추골병(malleus handle)을 밀착시키는, 인체 임플란트 장치.The elastic support is disposed between the sensor package and the cochlear shell (Promontory) to bring the upper membrane and the malleus handle into close contact.
  18. 제17 항에 있어서,According to claim 17,
    상기 센서 패키지는, The sensor package is,
    상기 하부막 상에 배치되는 지지기판; 및a support substrate disposed on the lower film; and
    상기 센서와 상기 상부막 사이에 배치되는 추골병 지지부를 포함하는, 인체 임플란트 장치.A human implant device comprising a malleus disease support portion disposed between the sensor and the upper membrane.
  19. 제17 항에 있어서,According to claim 17,
    상기 상부막은 상기 추골병(malleus handle)과 접촉하고, 원형 또는 고리 형상으로 제작되어 탄성 계수를 조절하고,The upper membrane is in contact with the malleus handle and is made into a circular or ring shape to adjust the elastic modulus,
    상기 하부막은 상기 탄성 지지체에 접촉하고, 원형 또는 고리 형상으로 제작되어 상기 센서를 지지하고,The lower membrane contacts the elastic support and is manufactured in a circular or ring shape to support the sensor,
    상기 하부막은 탄성 재질 또는 리지드 재질로 구성되고 The lower membrane is made of an elastic material or a rigid material.
    상기 탄성 지지체는 단면이 사각형, 사다리꼴, 타원형 중 어느 하나의 형상을 갖고,The elastic support has a cross-section of any one of square, trapezoid, and oval shape,
    상기 탄성 지지체의 상부면은 평탄면을 갖고 하부면은 볼록한 와우갑각에 밀착되도록 오목한 형상을 갖는, 인체 임플란트 장치.A human implant device, wherein the upper surface of the elastic support has a flat surface and the lower surface has a concave shape to be in close contact with the convex cochlear shell.
  20. 마이크로폰; 및microphone; and
    상기 마이크로폰과 통신하는 자극 장치를 포함하고,comprising a stimulation device in communication with the microphone,
    상기 마이크로폰은,The microphone is,
    센서 패키지; 및sensor package; and
    상기 센서 패키지의 하부를 지지하는 탄성 지지체를 포함하고,Includes an elastic support body supporting the lower part of the sensor package,
    상기 센서 패키지는,The sensor package is,
    케이스;case;
    상기 케이스 내에 배치되는 센서;A sensor disposed within the case;
    상기 센서 상에 상기 센서와 접하며 배치되는 수직부재; 및A vertical member disposed on the sensor and in contact with the sensor; and
    상기 케이스를 메우는 수지를 포함하고,Contains a resin that fills the case,
    상기 수지는 상기 수직부재를 감싼 채로 경화되고,The resin is cured while surrounding the vertical member,
    상기 탄성 지지체는 상기 센서 패키지와 와우갑각(Promontory) 사이에 배치되어 상기 센서 패키지와 추골병(malleus handle)을 밀착시키는, 인체 임플란트 장치.The elastic support is disposed between the sensor package and the cochlear shell (Promontory) to bring the sensor package and the malleus handle into close contact.
PCT/KR2023/014636 2022-10-04 2023-09-25 Microphone and human body-implantable device including same WO2024076073A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000016084A (en) * 1996-05-24 2000-03-25 알만드 피. 뉴커만스 Improved microphones for an implantable hearing aid
KR20080100967A (en) * 2007-05-15 2008-11-21 경북대학교 산학협력단 Implantable microphone and hearing aid for implanting in the middle ear with the same
KR20100005940A (en) * 2008-07-08 2010-01-18 단국대학교 산학협력단 Trans-tympanic vibration member and installation apparatus for implantable hearing aids
KR20150046172A (en) * 2012-08-20 2015-04-29 베터 히어링 에스.에이.에이.케이. 테크놀로지스 엘티디 Hearing aid device
KR20180130929A (en) * 2017-05-30 2018-12-10 경북대학교 산학협력단 Hybrid implantable microphone and controlling method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000016084A (en) * 1996-05-24 2000-03-25 알만드 피. 뉴커만스 Improved microphones for an implantable hearing aid
KR20080100967A (en) * 2007-05-15 2008-11-21 경북대학교 산학협력단 Implantable microphone and hearing aid for implanting in the middle ear with the same
KR20100005940A (en) * 2008-07-08 2010-01-18 단국대학교 산학협력단 Trans-tympanic vibration member and installation apparatus for implantable hearing aids
KR20150046172A (en) * 2012-08-20 2015-04-29 베터 히어링 에스.에이.에이.케이. 테크놀로지스 엘티디 Hearing aid device
KR20180130929A (en) * 2017-05-30 2018-12-10 경북대학교 산학협력단 Hybrid implantable microphone and controlling method thereof

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