WO2024055165A1 - Ultrasonic fingerprint apparatus and electronic device - Google Patents

Ultrasonic fingerprint apparatus and electronic device Download PDF

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Publication number
WO2024055165A1
WO2024055165A1 PCT/CN2022/118504 CN2022118504W WO2024055165A1 WO 2024055165 A1 WO2024055165 A1 WO 2024055165A1 CN 2022118504 W CN2022118504 W CN 2022118504W WO 2024055165 A1 WO2024055165 A1 WO 2024055165A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic fingerprint
layer
fingerprint device
ultrasonic
chip
Prior art date
Application number
PCT/CN2022/118504
Other languages
French (fr)
Chinese (zh)
Inventor
曾媛媛
杜灿鸿
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2022/118504 priority Critical patent/WO2024055165A1/en
Priority to CN202211210176.0A priority patent/CN115690861A/en
Priority to PCT/CN2022/123095 priority patent/WO2024055370A1/en
Publication of WO2024055165A1 publication Critical patent/WO2024055165A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor

Definitions

  • Embodiments of the present application relate to the field of fingerprint identification, and more specifically, to an ultrasonic fingerprint device and electronic equipment.
  • ultrasonic fingerprint recognition Due to the strong penetration ability of ultrasound, ultrasonic fingerprint recognition can not only identify the surface topography of fingerprints, but also identify signals from the dermal layer of the finger. Therefore, ultrasonic fingerprint recognition has gradually become a new fingerprint identification method.
  • the ultrasonic fingerprint device is limited by its own structure and its cooperation with electronic equipment, which greatly affects its performance. Therefore, how to improve the packaging structure of the ultrasonic fingerprint device to enhance its performance has become a problem that needs to be solved.
  • Embodiments of the present application provide an ultrasonic fingerprint device and electronic equipment, which improve the packaging structure of the ultrasonic fingerprint device, thereby improving its fingerprint recognition performance.
  • an ultrasonic fingerprint device is provided.
  • the ultrasonic fingerprint device is arranged below the display screen of an electronic device to realize under-screen ultrasonic fingerprint recognition.
  • the ultrasonic fingerprint device includes an ultrasonic fingerprint chip and a piezoelectric transducer disposed above the ultrasonic fingerprint chip.
  • the piezoelectric transducer includes a piezoelectric layer, an upper electrode located above the piezoelectric layer, and A lower electrode located below the piezoelectric layer, and the ultrasonic fingerprint chip is connected to the circuit board below it through a lead;
  • a spacer layer is provided between the ultrasonic fingerprint device and the display screen, and the thickness of the spacer layer is set such that the height difference between the lower surface of the display screen and the upper surface of the ultrasonic fingerprint chip is greater than
  • the arc height of the lead is so as to form a space for accommodating the lead between the display screen and the ultrasonic fingerprint chip.
  • the ultrasonic fingerprint device includes an ultrasonic fingerprint chip and a piezoelectric transducer above it.
  • the piezoelectric transducer includes a piezoelectric layer, and upper electrodes and lower electrodes located on both sides of the piezoelectric layer.
  • the upper electrode and the lower electrode are connected to the circuit board through the leads on the ultrasonic fingerprint chip.
  • the ultrasonic fingerprint chip and the circuit board are connected by COB. Both ends of the lead are welded and fixed to the ultrasonic fingerprint chip and the circuit board respectively.
  • the display and the ultrasonic By setting a spacer layer between the ultrasonic fingerprint device and the display screen, the display and the ultrasonic The space between the fingerprint chips is used to accommodate the lead, which can effectively prevent the arc height of the lead from affecting the integration between the display screen and the ultrasonic fingerprint device.
  • the spacer layer includes a dielectric layer and a first adhesive layer located between the dielectric layer and the ultrasonic fingerprint device, wherein the first adhesive layer is glue, or the The first adhesive layer includes a first matching layer and first glue layers located on both sides of the first matching layer. Through the first adhesive layer, effective connection between the spacer layer and the ultrasonic fingerprint device can be achieved.
  • the material of the dielectric layer is set so that the acoustic impedance of the dielectric layer matches the acoustic impedance of the adjacent stacked layer, so as to reduce the passage of the ultrasonic signal and the ultrasonic detection signal.
  • the material of the dielectric layer may include at least one of the following: PET, PI, thermoplastic TPU, carbon fiber, and glass.
  • the thickness of the dielectric layer is between 30um and 100um.
  • the thickness of the dielectric layer is 50um.
  • the dielectric layer has a single-sided adhesive; or the dielectric layer has a double-sided adhesive to facilitate assembly.
  • the material of the first matching layer is copper, or the material of the first matching layer is PET.
  • the thickness of the first matching layer is between 5um and 15um.
  • the thickness of the first matching layer is 6um.
  • the first glue layer is acrylic.
  • the ultrasonic fingerprint device further includes a second adhesive layer, the second adhesive layer is used to connect the spacer layer and the display screen, and the second adhesive layer is glue, Or the second adhesive layer includes a second matching layer and second glue layers located on both sides of the second matching layer. Through the second adhesive layer, effective connection between the spacer layer and the display screen can be achieved.
  • the material of the second matching layer is copper, or the material of the second matching layer is PET.
  • the thickness of the second matching layer is between 5um and 15um.
  • the thickness of the second matching layer is 6um.
  • the second glue layer is, for example, acrylic.
  • the ultrasonic fingerprint device further includes a reinforcing plate, the ultrasonic fingerprint chip and the circuit board are arranged on the reinforcing plate, between the ultrasonic fingerprint chip and the reinforcing plate Connect via glue or DAF.
  • the reinforcing plate provides support for the ultrasonic fingerprint device and the circuit board, and improves the structural stability of the ultrasonic fingerprint device.
  • the ultrasonic fingerprint chip is a CMOS chip.
  • CMOS chip since it uses a silicon substrate, wires can be laid on the silicon substrate, and the ultrasonic fingerprint chip and the circuit board can be connected using the wires, thereby realizing the interconnection between the piezoelectric transducer and the circuit board.
  • the upper electrode is a metal or metal paste coating, such as silver paste (Ag), formed on the upper surface of the piezoelectric layer by sputtering.
  • silver paste Ag
  • the lower electrode is a metal electrode array formed on the upper surface of the ultrasonic fingerprint chip by sputtering or evaporation, and the metal electrode is aluminum or gold.
  • the surface of the upper electrode is covered with a protective layer to protect the upper electrode and the piezoelectric layer to avoid penetration and failure of the piezoelectric layer and the upper electrode under conditions such as high temperature and high humidity. behavior, improving the security of ultrasonic fingerprint devices.
  • the protective layer may be formed of, for example, polymer organic materials or inorganic materials.
  • the surface of the ultrasonic fingerprint chip is provided with driving traces, and the upper electrode is led from the upper surface of the piezoelectric layer to the surface of the ultrasonic fingerprint chip and passes through the driving traces. Connect to the lead. In this way, the interconnection between the piezoelectric transducer and the circuit board is achieved.
  • the material of the piezoelectric layer is PVDF, or the material of the piezoelectric layer is PVDF-TrFE.
  • an electronic device including: a display screen; the ultrasonic fingerprint device described in the first aspect or any implementation of the first aspect; and a spacer layer disposed between the ultrasonic fingerprint device and the between displays.
  • Figure 1 is a schematic diagram of an ultrasonic fingerprint device according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a possible implementation of the ultrasonic fingerprint device shown in FIG. 1 .
  • Figure 3 is a schematic diagram of a possible implementation of the first adhesive layer and the second adhesive layer.
  • Figure 4 is a schematic diagram of another possible implementation of the first adhesive layer and the second adhesive layer.
  • Figure 5 is a schematic diagram of yet another possible implementation of the first adhesive layer and the second adhesive layer.
  • Figure 6 is a schematic block diagram of an electronic device according to an embodiment of the present application.
  • Ultrasound has been commercially used in non-destructive testing, ultrasonic ranging, ultrasonic medicine and other fields for many years.
  • ultrasonic fingerprint devices can realize under-screen fingerprint recognition without lighting up the screen, and there are no special requirements for the visible light penetration of the screen, so it has great commercial value.
  • the ultrasonic fingerprint device can be integrated with the display screen in a back-mounted manner.
  • the ultrasonic fingerprint device is glued to the underside of the display.
  • the ultrasonic fingerprint device includes a thin film transistor (TFT) substrate and a piezoelectric transducer.
  • the piezoelectric transducer includes a piezoelectric layer, an electrode above the piezoelectric layer, and an electrode below the piezoelectric layer. The lower surface of the electrode Covered with a protective layer.
  • the TFT substrate Since the TFT substrate is located above the piezoelectric transducer, it will affect the signal volume of the ultrasonic signal emitted by the piezoelectric transducer to the finger above the display screen.
  • the ultrasonic fingerprint module and the circuit board need to be laminated with anisotropic conductive film (ACF), which makes the cost higher.
  • ACF anisotropic conductive film
  • this application provides an ultrasonic fingerprint device, which uses a front-facing method to realize the integration between the ultrasonic fingerprint device and the display screen, reduces signal loss during the fingerprint detection process, and can realize the ultrasonic fingerprint device and circuit through COB.
  • the connection between boards is easy to operate and low cost.
  • FIG. 1 shows a schematic diagram of an ultrasonic fingerprint device according to an embodiment of the present application.
  • this application adopts a front-to-side method to realize the integration between the ultrasonic fingerprint device 300 and the display screen 100 .
  • the ultrasonic fingerprint device 300 is directly attached to the bottom of the display screen 100 of the electronic device to achieve under-screen ultrasonic fingerprint recognition.
  • the ultrasonic fingerprint device 300 includes an ultrasonic fingerprint chip 310 and a piezoelectric transducer 320 disposed above the ultrasonic fingerprint chip 310.
  • the piezoelectric transducer 320 includes a piezoelectric layer 321, an upper electrode 322 located above the piezoelectric layer 321, and
  • the lower electrode 323 is located under the piezoelectric layer 321 .
  • the ultrasonic fingerprint chip 310 is an application specific integrated circuit (ASIC) used for ultrasonic fingerprint recognition, such as a complementary metal-oxide-semiconductor transistor (CMOS) chip.
  • ASIC application specific integrated circuit
  • CMOS complementary metal-oxide-semiconductor transistor
  • wires can be laid on the silicon substrate, so that the ultrasonic fingerprint device 300 can be connected to the circuit board 600 through the leads 700, thereby realizing the piezoelectric transducer 320 and the circuit board 600. Interconnections between circuit boards 600.
  • the ultrasonic fingerprint chip 310 and the circuit board 600 are connected using a chip on board (COB) method.
  • COB usually refers to a method of attaching the chip to the circuit board and using leads for electronic connection, also known as binding ( bonding) process or wiring process.
  • leads for electronic connection also known as binding ( bonding) process or wiring process.
  • FIG. 1 the two ends of the lead 700 are welded and fixed to the ultrasonic fingerprint chip 310 and the circuit board 600 respectively.
  • the upper electrode 322 and the lower electrode 323 can be interconnected with the circuit board 600 through the leads 700 on the ultrasonic fingerprint chip 310 .
  • COB has the advantages of simple operation and low cost.
  • the lead wire 700 may be a gold wire or an aluminum wire, for example.
  • the lead 700 has a certain arc height H1.
  • the arc height H1 is higher than the upper surface of the ultrasonic fingerprint device 300, the ultrasonic fingerprint device 300 will not be able to be directly attached to the lower surface of the display screen 100.
  • a spacer layer 400 is provided between the upper surface of the ultrasonic fingerprint device 300 and the lower surface of the display screen 100 .
  • the spacer layer 400 is used to increase the space between the display screen 100 and the ultrasonic fingerprint chip 310 , this space is used to accommodate the lead 700, thereby effectively preventing the arc height H1 of the lead 700 from affecting the integration between the display screen 100 and the ultrasonic fingerprint device 300.
  • a spacer layer 400 is provided between the display screen 100 and the ultrasonic fingerprint device 300 .
  • the thickness of the spacer layer 400 is set such that the distance between the lower surface of the display screen 100 and the upper surface of the ultrasonic fingerprint chip 310 is The height difference H2 is greater than the arc height H1 of the lead 700 to form a space (H2-H1) for accommodating the lead 700 between the display screen 100 and the ultrasonic fingerprint chip 310.
  • the driving signal generated by the circuit board 600 is loaded to the upper electrode 322 and the lower electrode 323 via the lead 700 .
  • the piezoelectric layer 321 vibrates, thereby transmitting light to the display screen 100
  • the upper finger emits ultrasonic signals.
  • the ultrasonic signal is transmitted to the surface of the finger, is emitted or scattered at the fingerprint valleys and fingerprint ridges, and returns an ultrasonic detection signal.
  • the ultrasonic detection signal is transmitted to the piezoelectric layer 321, based on the inverse piezoelectric effect, the upper electrode 322 and the lower electrode 323 A potential difference is generated between them, and a corresponding electrical signal is obtained.
  • the circuit board 600 receives the electrical signal via the lead 700 . After processing the electrical signal, the fingerprint information of the finger can be obtained.
  • the upper electrode 322 is usually a metal or metal mixture coating, such as silver paste, formed on the upper surface of the piezoelectric layer 321 by sputtering, which is a full-surface electrode; the lower electrode 323 may be formed on the upper surface of the piezoelectric layer 321 by sputtering or evaporation, for example.
  • the metal electrode array on the upper surface of the ultrasonic fingerprint chip 310 may be made of aluminum, gold, or the like.
  • the surface of the upper electrode 322 can also be covered with a protective layer 324 to protect the upper electrode 322 and the piezoelectric layer 321 to prevent the piezoelectric layer 321 and the upper electrode 322 from penetrating under conditions such as high temperature and high humidity. and failure behavior, thereby improving the security of the ultrasonic fingerprint device 300.
  • the protective layer 324 may be formed of, for example, a polymer organic material or an inorganic material, and is also called a passivation layer.
  • the ultrasonic fingerprint chip 300 and the circuit board 600 are connected through leads 700, and a spacer layer 400 is provided between the ultrasonic fingerprint device 300 and the display screen 100, thereby increasing the connection between the display screen 100 and the ultrasonic fingerprint device 300.
  • the space between the fingerprint chips 300 is used to accommodate the leads 700 to prevent the arc height of the leads 700 from affecting the integration between the display screen 100 and the ultrasonic fingerprint device 300 .
  • the upper electrode 3202 is usually made of silver paste and other materials, its density is very low and does not support wire bonding. Therefore, it needs to be led out to the surface of the ultrasonic fingerprint chip 310 and then connected to the lead 700 .
  • driving traces can be provided on the surface of the ultrasonic fingerprint chip 210, and the upper electrode 232 is led from the upper surface of the piezoelectric layer 231 to the surface of the ultrasonic fingerprint chip 310, and is connected to the lead 700 through the driving traces.
  • One end of the lead 700 is connected to the driving trace at the pad on the surface of the ultrasonic fingerprint chip 310 , and the other end of the lead 700 is connected to the circuit board 600 . In this way, the interconnection between the piezoelectric transducer 320 and the circuit board 600 is achieved.
  • the driving signal generated by the circuit board 600 can be transmitted to the upper electrode 322 and the lower electrode 323 through the lead 700, so that the upper electrode 322 and the lower electrode 323 emit ultrasonic signals to the fingers above the display screen 100 under the action of the driving signal, and can pass through
  • the lead 700 transmits the ultrasonic detection signal returned by the finger to the circuit board 600 .
  • the circuit board 600 may be, for example, a flexible printed circuit (FPC).
  • the piezoelectric layer 321 is formed of a piezoelectric material, such as polyvinylidene fluoride (PVDF) or polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE).
  • PVDF polyvinylidene fluoride
  • PVDF-TrFE polyvinylidene fluoride-trifluoroethylene
  • the display screen 100 includes a light-emitting layer 110 and a cover plate 120 .
  • the light emitting layer 110 may be formed of, for example, an organic light emitting diode (OLED) or an active matrix organic light emitting diode (AMOLED).
  • the cover 120 covers the top of the light-emitting layer 110 .
  • the ultrasonic fingerprint device 300 can also be disposed side by side under different areas of the cover 120 on the display screen 100 , which can also realize under-screen ultrasonic fingerprint recognition.
  • the ultrasonic fingerprint device 300 may also include a reinforcing plate 330, such as a reinforcing steel plate (Reinforcing Steel) 330, on which the ultrasonic fingerprint chip 310 and the circuit board 600 are disposed.
  • a reinforcing plate 330 such as a reinforcing steel plate (Reinforcing Steel) 330, on which the ultrasonic fingerprint chip 310 and the circuit board 600 are disposed.
  • the ultrasonic fingerprint chip 310 and the circuit board 600 may be disposed side by side in different areas on the surface of the reinforcing plate 330 .
  • the ultrasonic fingerprint chip 310 and the reinforcing plate 330 can be connected through a third adhesive layer 311, such as glue, die attach film (DAF) or epoxy resin.
  • the reinforcing plate 330 provides support for the ultrasonic fingerprint device 300 and the circuit board 600, and improves the structural stability of the ultrasonic fingerprint device 300.
  • FIG. 2 is a schematic diagram of a possible implementation of the ultrasonic fingerprint device 300 shown in FIG. 1 .
  • the spacer layer 400 includes a dielectric layer 410 and a first adhesive layer 420 located between the dielectric layer 410 and the ultrasonic fingerprint device 300 . Through the first adhesive layer 420, effective connection between the spacer layer 400 and the ultrasonic fingerprint device 300 can be achieved.
  • Acoustic impedance Z is an important indicator for evaluating signal transmission in the spacer layer 400.
  • Z ⁇ c, where ⁇ is the material density of the spacer layer 400, and c is the transmission speed of ultrasonic waves, that is, the speed of sound.
  • ⁇ the material density of the spacer layer 400
  • c the transmission speed of ultrasonic waves, that is, the speed of sound.
  • the sound speed c is related to its mechanical parameters and satisfies Among them, Y is Young's modulus and ⁇ is Poisson's ratio.
  • the acoustic impedance of the stack adjacent to the spacer layer 400 also needs to be considered. If the acoustic impedances of the adjacent stacked layers on both sides of the spacer layer 400 are Z1 and Z2 respectively, when the acoustic impedance of the spacer layer 400 When , optimal impedance matching can be achieved between the spacer layer 400 and its adjacent stacked layers.
  • the material of the dielectric layer 410 can be configured so that its acoustic impedance matches the acoustic impedance of the adjacent display screen 100 and the protective layer 324 , thereby reducing the loss generated when the signal passes through the spacer layer 400 .
  • the material of the bottom layer (back plate film) of the display screen 100 is PET.
  • the acoustic impedance of the PET can be about 3.3Mpa*s/m.
  • the thickness of the protective layer 324 is usually very small and can be ignored here.
  • the material of the dielectric layer 410 can be selected so that its acoustic impedance is close to that of the PET.
  • the material of the dielectric layer 410 may include at least one of the following: polyethylene terephthalate (PET), polyimide (PI), thermoplastic polyurethane (TPU), carbon fiber (carbon fiber) and glass.
  • PET polyethylene terephthalate
  • PI polyimide
  • TPU thermoplastic polyurethane
  • carbon fiber carbon fiber
  • glass glass
  • the spacer layer 400 is a PET layer as an example.
  • the transmittance of ultrasonic waves is also related to the thickness of the material.
  • the thickness of the dielectric layer 410 may be between 30um and 100um, preferably 50um.
  • the setting of the spacer layer 400 can ensure that the arc height H1 of the lead 700 will not affect the front placement of the ultrasonic fingerprint device 300.
  • the material of the dielectric layer 410 can also be selected to increase its acoustic impedance.
  • the acoustic impedance of the adjacent stacked layers is matched, and the thickness of the dielectric layer 410 is selected to reduce the loss generated when the signal passes through the spacer layer 400 .
  • the signal includes the aforementioned ultrasonic signal and the ultrasonic detection signal returned by the finger.
  • 3 to 5 respectively show schematic diagrams of several possible implementations of the first adhesive layer 420 and the second adhesive layer 500 in FIG. 2 .
  • the first adhesive layer 420 may include a first matching layer 421 and a first glue layer 422 located on both sides of the first matching layer 421 .
  • the first matching layer 421 can also be used to match the acoustic impedance and thickness to improve the signal transmission performance of the fingerprint identification device 300 .
  • the first adhesive layer 420 may be glue (adhesive) to simplify the laminate structure and reduce the laminate thickness and cost.
  • the first adhesive layer 420 is composed of the first matching layer 421 and the first glue layers 422 located on both sides of the first matching layer 421, by selecting an appropriate material and setting an appropriate thickness for the first matching layer 421 , improve the signal transmission performance of the ultrasonic fingerprint device 300.
  • the material of the first matching layer 421 may be copper (Cu) or PET, so that the acoustic impedance of the first matching layer 421 matches the acoustic impedance of its adjacent stacked layer.
  • the first adhesive layers 422 on both sides of the first matching layer 421 can be made of acrylic, that is, acrylic adhesive film (acrylicadhesive).
  • the first adhesive layer 420 can be regarded as copper foil with double-sided adhesive backing or PET with double-sided adhesive backing, which is also referred to as double-sided adhesive tape below.
  • the thickness of the first matching layer 421 may be between 5um and 15um. Preferably, the thickness of the first matching layer 421 is 6um.
  • the ultrasonic fingerprint device 300 may further include a second adhesive layer 500 , and the second adhesive layer 500 is used to connect the spacer layer 400 and the display screen 100 . Through the second adhesive layer 500, effective connection between the spacer layer 400 and the display screen 100 can be achieved.
  • the second adhesive layer 500 may include a second matching layer 510 and a second glue layer 520 located on both sides of the second matching layer 510 .
  • the second matching layer 510 can also be used to match the acoustic impedance and thickness to improve the signal transmission performance of the fingerprint identification device 300 .
  • the second adhesive layer 500 can be glue (adhesive) to simplify the laminate structure and reduce the laminate thickness and cost.
  • the second adhesive layer 500 is composed of the second matching layer 510 and the second glue layer 520 located on both sides of the second matching layer 510, by selecting an appropriate material and setting an appropriate thickness for the second matching layer 510 , improve the signal transmission performance of the ultrasonic fingerprint device 300.
  • the material of the second matching layer 510 may be copper (Cu), PET, or the like, so that the acoustic impedance of the second matching layer 510 matches the acoustic impedance of its adjacent stacked layer.
  • the second adhesive layer 520 on both sides of the second matching layer 510 can be made of acrylic, that is, acrylic adhesive film (acrylicadhesive).
  • the second adhesive layer 500 can be regarded as copper foil with double-sided adhesive backing or PET with double-sided adhesive backing, which is also referred to as double-sided adhesive tape below.
  • the thickness of the second matching layer 510 may be between 5um and 15um. Preferably, the thickness of the second matching layer 510 is 6um.
  • both the first adhesive layer 420 and the second adhesive layer 500 can be made of glue to simplify the laminate structure and reduce the thickness and cost of the laminate; alternatively, the first adhesive layer 420 can be double-sided.
  • Glue and the second adhesive layer 500 is glue, wherein the double-sided adhesive can be double-sided adhesive copper foil or double-sided adhesive PET; or, the first adhesive layer 420 is glue and the second adhesive layer 500 It is double-sided tape, where the double-sided tape can be copper foil with double-sided tape or PET with double-sided tape.
  • the first adhesive layer 420 and the second adhesive layer 500 are both double-sided adhesive copper foils.
  • the second adhesive layer 500 is a double-sided adhesive-backed copper foil, and the side used to adhere the display screen 100 is black, similar to the laminate under the display screen 100, so as to improve the appearance of the ultrasonic fingerprint module 300 under strong light. Less visibility.
  • the thickness of the copper foil and adhesive layer should be as thin as possible, for example, less than or equal to 10um, to ensure that the signal attenuation is small when the signal is transmitted in different media.
  • the total thickness of the spacer layer 400 is set to be greater than or equal to the arc height H1 of the lead 700 as much as possible.
  • the arc height H1 is usually greater than or equal to 30um, so that the upper surface of the spacer layer 400 is higher than the arc of the lead 700 to ensure that the ultrasonic fingerprint device 300 can It is attached to the lower surface of the display screen 100 .
  • the design of the total thickness of each stack below the display screen 100 that is, the total thickness of the ultrasonic fingerprint device 300 and the spacer layer 400, needs to consider the height space reserved for the ultrasonic fingerprint device 300 in the electronic device, which is usually less than or equal to 0.4mm.
  • Table 1 shows the thickness range of each laminated layer in FIG. 3 and the preferred value of the thickness.
  • the stacking sequence shown in each row of Table 1 corresponds to the stacking sequence of each layer in Figure 3.
  • the second matching layer 510 in the second adhesive layer 500 is copper, and the second adhesive layers 520 on both sides are acrylic adhesive films; the dielectric layer 410 is PET with a single-sided adhesive.
  • the adhesive can be located on either side surface of the PET layer, and the adhesive is not shown in Figure 3;
  • the first matching layer 421 in the first adhesive layer 420 is copper, and the first adhesive layers 422 on both sides It is an acrylic film;
  • the upper electrode 322 is made of silver, and the piezoelectric layer 321 is made of PVDF.
  • Table 1 The thickness ranges of each stack and their preferred values are shown in Table 1.
  • this laminated structure can not only ensure the stability of the laminated structure but also reduce signal attenuation according to the materials and thicknesses of each laminated layer shown in Table 1. , ensuring the signal transmission performance of the ultrasonic fingerprint device 300.
  • the signal-to-noise ratio (SNR) of the ultrasonic fingerprint device 300 is under the condition that the signal is not saturated. Can reach more than 20dB.
  • the dielectric layer 410 may not have adhesive backing; or the dielectric layer 410 may have single-sided adhesive backing or double-sided adhesive backing to facilitate assembly.
  • the single-sided adhesive can be located on the surface of the dielectric layer 410 facing the display screen 100 , or can be located on the surface of the dielectric layer 410 facing the piezoelectric transducer 320 .
  • the adhesive on the surface of the dielectric layer 410 is not shown in FIGS. 1 to 5 .
  • Figure 4 is a simplified spacer layer 400 based on Figure 3.
  • the first adhesive layer 420 in the spacer layer 400 can be directly made of glue.
  • the materials and thicknesses of each stack shown in Figure 4 can refer to the materials and thicknesses selected for each stack in Figure 3, as shown in Table 1.
  • Figure 5 simplifies the second adhesive layer 500 based on Figure 3.
  • the second adhesive layer 500 can directly use glue.
  • the materials and thicknesses of each stack shown in Figure 5 can refer to the materials and thicknesses selected for each stack in Figure 3, as shown in Table 1.
  • the ultrasonic fingerprint device 300 and the spacer layer 400 are directly attached to the lower surface of the display screen 100 through glue.
  • the dielectric layer 410 is PET as an example, and the double-sided adhesive tape 420 may be a copper foil with double-sided adhesive tape, or may be PET with double-sided adhesive tape.
  • Figure 5 is equivalent to thinning the PET thickness of the dielectric layer 410 in Figure 4 to obtain a superposition of multiple layers of PET, thereby improving the SNR of the ultrasonic fingerprint device 300.
  • the PET thickness of the dielectric layer 410 in Figure 4 is 50um
  • the first adhesive layer 420 is glue
  • the dielectric layer 410 is directly pasted on the upper surface of the ultrasonic fingerprint chip 300 through glue
  • the PET thickness of the dielectric layer 410 in Figure 5 is 30um
  • the first adhesive layer 420 is double-sided adhesive PET
  • the thickness of the PET in the first adhesive layer 420 is 20um
  • the dielectric layer 410 passes through the double-sided adhesive PET and the upper surface of the ultrasonic fingerprint chip 300 Paste them together.
  • the 50um PET is divided into 30um+20um PET and connected through the glue layer.
  • the electronic device 700 includes a display screen 100, the ultrasonic fingerprint device 300 in any of the above embodiments, and the spacer layer in any of the above embodiments. 400, the spacer layer 400 is provided between the ultrasonic fingerprint device 300 and the display screen 100.
  • the electronic device in the embodiment of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a gaming device, a vehicle-mounted electronic device or a wearable smart device, and Electronic databases, cars, bank automated teller machines (Automated Teller Machine, ATM) and other electronic equipment.
  • the wearable smart devices include devices that are full-featured, large in size, and can realize complete or partial functions without relying on smartphones, such as smart watches or smart glasses, as well as devices that only focus on a certain type of application function and require integration with other devices such as smartphones.
  • Equipment used in conjunction with it such as various smart bracelets, smart jewelry and other equipment for physical sign monitoring.
  • the systems, devices and methods disclosed in the embodiments of this application can be implemented in other ways. For example, some features of the method embodiments described above may be omitted or not performed.
  • the device embodiments described above are only illustrative, and the division of units is only a logical function division. In actual implementation, there may be other divisions, and multiple units or components may be combined or integrated into another system.
  • the coupling between units or the coupling between components may be direct coupling or indirect coupling, and the above-mentioned coupling includes electrical, mechanical or other forms of connection.

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Abstract

An ultrasonic fingerprint apparatus (300) and an electronic device. A packaging structure for the ultrasonic fingerprint apparatus (300) is improved, thereby improving the fingerprint recognition performance of the ultrasonic fingerprint apparatus (300). The ultrasonic fingerprint apparatus (300) is arranged below a display screen (100) of the electronic device so as to achieve under-screen ultrasonic fingerprint recognition. The ultrasonic fingerprint apparatus (300) comprises an ultrasonic fingerprint chip (310) and a piezoelectric transducer (320) provided above the ultrasonic fingerprint chip (310), wherein the piezoelectric transducer (320) comprises a piezoelectric layer (321), an upper electrode (322) located above the piezoelectric layer (321), and a lower electrode (323) located below the piezoelectric layer (321). The ultrasonic fingerprint apparatus (300) is connected to a circuit board (600) by means of a lead (700), and two ends of the lead (700) are respectively welded to the ultrasonic fingerprint chip (310) and the circuit board (600). A spacer layer (400) is provided between the ultrasonic fingerprint apparatus (300) and the display screen (100), and the spacer layer (400) is used for increasing a space between the display screen (100) and the ultrasonic fingerprint chip (310) so as to accommodate the lead (700).

Description

超声指纹装置和电子设备Ultrasonic fingerprint devices and electronic devices 技术领域Technical field
本申请实施例涉及指纹识别领域，并且更具体地，涉及一种超声指纹装置和电子设备。Embodiments of the present application relate to the field of fingerprint identification, and more specifically, to an ultrasonic fingerprint device and electronic equipment.
背景技术Background technique
随着社会进步，手机已成为现代生活必不可少的电子设备之一。目前市场上的手机都具有一种或多种身份认证方式，包括数字密码、手势图形、面部识别、指纹识别等。其中，指纹识别由于其应用方便、识别速度快和稳定可靠等特点，已经成为大多数手机的标配。指纹识别也发展出不同的技术路线，包括电容指纹识别、光学指纹识别和超声指纹识别等。With the progress of society, mobile phones have become one of the essential electronic devices in modern life. Currently, mobile phones on the market have one or more identity authentication methods, including digital passwords, gesture graphics, facial recognition, fingerprint recognition, etc. Among them, fingerprint recognition has become a standard feature of most mobile phones due to its convenient application, fast recognition speed, stability and reliability. Fingerprint recognition has also developed different technical routes, including capacitive fingerprint recognition, optical fingerprint recognition and ultrasonic fingerprint recognition.
由于超声具有较强的穿透能力，超声指纹识别不仅可以识别指纹的表层形貌，还可以识别到手指真皮层的信号，因此，超声指纹识别逐渐成为一种新的指纹识别方式。然而，超声指纹装置受其自身结构以及其与电子设备配合的限制，大幅度影响了其性能。因此，如何改善超声指纹装置的封装结构，以提升其性能，成为需要解决的问题。Due to the strong penetration ability of ultrasound, ultrasonic fingerprint recognition can not only identify the surface topography of fingerprints, but also identify signals from the dermal layer of the finger. Therefore, ultrasonic fingerprint recognition has gradually become a new fingerprint identification method. However, the ultrasonic fingerprint device is limited by its own structure and its cooperation with electronic equipment, which greatly affects its performance. Therefore, how to improve the packaging structure of the ultrasonic fingerprint device to enhance its performance has become a problem that needs to be solved.
发明内容Contents of the invention
本申请实施例提供一种超声指纹装置和电子设备，改善了超声指纹装置的封装结构，进而提升其指纹识别性能。Embodiments of the present application provide an ultrasonic fingerprint device and electronic equipment, which improve the packaging structure of the ultrasonic fingerprint device, thereby improving its fingerprint recognition performance.
第一方面，提供了一种所述超声指纹装置，所述超声指纹装置设置在电子设备的显示屏下方，以实现屏下超声指纹识别，In a first aspect, an ultrasonic fingerprint device is provided. The ultrasonic fingerprint device is arranged below the display screen of an electronic device to realize under-screen ultrasonic fingerprint recognition.
所述超声指纹装置包括超声指纹芯片、以及设置在所述超声指纹芯片上方的压电换能器，所述压电换能器包括压电层、位于所述压电层上方的上电极、以及位于所述压电层下方的下电极，所述超声指纹芯片通过引线与其下方的电路板连接；The ultrasonic fingerprint device includes an ultrasonic fingerprint chip and a piezoelectric transducer disposed above the ultrasonic fingerprint chip. The piezoelectric transducer includes a piezoelectric layer, an upper electrode located above the piezoelectric layer, and A lower electrode located below the piezoelectric layer, and the ultrasonic fingerprint chip is connected to the circuit board below it through a lead;
所述超声指纹装置与所述显示屏之间设置有间隔层，所述间隔层的厚度被设置为使得所述显示屏的下表面和所述超声指纹芯片的上表面之间的高度差大于所述引线的弧高，以在所述显示屏和所述超声指纹芯片之间形成用于容纳所述引线的空间。A spacer layer is provided between the ultrasonic fingerprint device and the display screen, and the thickness of the spacer layer is set such that the height difference between the lower surface of the display screen and the upper surface of the ultrasonic fingerprint chip is greater than The arc height of the lead is so as to form a space for accommodating the lead between the display screen and the ultrasonic fingerprint chip.
本申请实施例中，超声指纹装置包括超声指纹芯片及其上方的压电换能器，压电换能器包括压电层、以及分别位于压电层两侧的上电极和下电极，上电极和下电极通过超声指纹芯片上的引线，连接至电路板。超声指纹芯片与电路板之间采用COB的方式连接，该引线的两端分别焊接固定于超声指纹芯片和电路板上，通过在超声指纹装置和显示屏之间设置间隔层，增加显示屏与超声指纹芯片之间的空间，以容纳该引线，能够有效避免引线的弧高对显示屏和超声指纹装置之间的集成造成影响。In the embodiment of the present application, the ultrasonic fingerprint device includes an ultrasonic fingerprint chip and a piezoelectric transducer above it. The piezoelectric transducer includes a piezoelectric layer, and upper electrodes and lower electrodes located on both sides of the piezoelectric layer. The upper electrode and the lower electrode are connected to the circuit board through the leads on the ultrasonic fingerprint chip. The ultrasonic fingerprint chip and the circuit board are connected by COB. Both ends of the lead are welded and fixed to the ultrasonic fingerprint chip and the circuit board respectively. By setting a spacer layer between the ultrasonic fingerprint device and the display screen, the display and the ultrasonic The space between the fingerprint chips is used to accommodate the lead, which can effectively prevent the arc height of the lead from affecting the integration between the display screen and the ultrasonic fingerprint device.
在一种实现方式中，所述间隔层包括介质层、以及位于所述介质层和所述超声指纹装置之间的第一粘接层，其中，所述第一粘接层为胶水，或者所述第一粘接层包括第一匹配层、以及位于所述第一匹配层两侧的第一胶层。通过第一粘接层，可以实现间隔层与超声指纹装置之间的有效连接。In one implementation, the spacer layer includes a dielectric layer and a first adhesive layer located between the dielectric layer and the ultrasonic fingerprint device, wherein the first adhesive layer is glue, or the The first adhesive layer includes a first matching layer and first glue layers located on both sides of the first matching layer. Through the first adhesive layer, effective connection between the spacer layer and the ultrasonic fingerprint device can be achieved.
在一种实现方式中，所述介质层的材料被设置为，使所述介质层的声阻抗，与相邻叠层的声阻抗之间相匹配，以减小超声波信号和超声检测信号经过所述间隔层时产生的损耗。例如，所述介质层的材料可以包括以下中的至少一种：PET、PI、热塑TPU、碳纤维和玻璃。In one implementation, the material of the dielectric layer is set so that the acoustic impedance of the dielectric layer matches the acoustic impedance of the adjacent stacked layer, so as to reduce the passage of the ultrasonic signal and the ultrasonic detection signal. The loss that occurs when the spacer layer is mentioned. For example, the material of the dielectric layer may include at least one of the following: PET, PI, thermoplastic TPU, carbon fiber, and glass.
在一种实现方式中，所述介质层的厚度位于30um至100um之间，例如，所述介质层的厚度为50um。从而以减小超声波信号和超声检测信号经过所述间隔层时产生的损耗。In one implementation, the thickness of the dielectric layer is between 30um and 100um. For example, the thickness of the dielectric layer is 50um. Thereby, the loss generated when the ultrasonic signal and the ultrasonic detection signal pass through the spacer layer is reduced.
在一种实现方式中，所述介质层具有单面背胶；或者所述介质层具有双面背胶，以便于装配。In one implementation, the dielectric layer has a single-sided adhesive; or the dielectric layer has a double-sided adhesive to facilitate assembly.
在一种实现方式中，所述第一匹配层的材料为铜，或者所述第一匹配层的材料为PET。通过对第一匹配层的材料进行选择，可以提高超声指纹装置的信号传输性能。In one implementation, the material of the first matching layer is copper, or the material of the first matching layer is PET. By selecting the material of the first matching layer, the signal transmission performance of the ultrasonic fingerprint device can be improved.
在一种实现方式中，所述第一匹配层的厚度位于5um至15um之间，例如，所述第一匹配层的厚度为6um。通过对第一匹配层的厚度进行设置，可以提高超声指纹装置的信号传输性能。In one implementation, the thickness of the first matching layer is between 5um and 15um. For example, the thickness of the first matching layer is 6um. By setting the thickness of the first matching layer, the signal transmission performance of the ultrasonic fingerprint device can be improved.
为了适应第一匹配层的材料，在一种实现方式中，第一胶层为丙烯酸。In order to adapt to the material of the first matching layer, in one implementation, the first glue layer is acrylic.
在一种实现方式中，所述超声指纹装置还包括第二粘接层，所述第二粘接层用于连接所述间隔层与所述显示屏，所述第二粘接层为胶水，或者所述第二粘接层包括第二匹配层、以及位于所述第二匹配层两侧的第二胶层。通过第二粘接层，可以实现间隔层与显示屏之间的有效连接。In one implementation, the ultrasonic fingerprint device further includes a second adhesive layer, the second adhesive layer is used to connect the spacer layer and the display screen, and the second adhesive layer is glue, Or the second adhesive layer includes a second matching layer and second glue layers located on both sides of the second matching layer. Through the second adhesive layer, effective connection between the spacer layer and the display screen can be achieved.
在一种实现方式中，所述第二匹配层的材料为铜，或者所述第二匹配层的材料为PET。通过对第二匹配层的材料进行选择，可以提高超声指纹装置的信号传输性能。In one implementation, the material of the second matching layer is copper, or the material of the second matching layer is PET. By selecting the material of the second matching layer, the signal transmission performance of the ultrasonic fingerprint device can be improved.
在一种实现方式中，所述第二匹配层的厚度位于5um至15um之间，例如，所述第二匹配层的厚度为6um。通过对第二匹配层的厚度进行设置，可以提高超声指纹装置的信号传输性能。In one implementation, the thickness of the second matching layer is between 5um and 15um. For example, the thickness of the second matching layer is 6um. By setting the thickness of the second matching layer, the signal transmission performance of the ultrasonic fingerprint device can be improved.
为了适应第二匹配层的材料，在一种实现方式中，所述第二胶层例如为丙烯酸。In order to adapt to the material of the second matching layer, in one implementation, the second glue layer is, for example, acrylic.
在一种实现方式中，所述超声指纹装置还包括补强板，所述超声指纹芯片和所述电路板设置在所述补强板上，所述超声指纹芯片与所述补强板之间通过胶水或者DAF连接。通过补强板，提供对超声指纹装置和电路板的支撑，并提高了超声指纹装置的结构稳定性。In one implementation, the ultrasonic fingerprint device further includes a reinforcing plate, the ultrasonic fingerprint chip and the circuit board are arranged on the reinforcing plate, between the ultrasonic fingerprint chip and the reinforcing plate Connect via glue or DAF. The reinforcing plate provides support for the ultrasonic fingerprint device and the circuit board, and improves the structural stability of the ultrasonic fingerprint device.
在一种实现方式中，所述超声指纹芯片为CMOS芯片。当采用CMOS芯片作为超声指纹芯片时，由于其采用硅基底，能够在硅基底上进行打线，利用引线连接超声指纹芯片和电路板，进而实现压电换能器与电路板之间的互联。In one implementation, the ultrasonic fingerprint chip is a CMOS chip. When a CMOS chip is used as the ultrasonic fingerprint chip, since it uses a silicon substrate, wires can be laid on the silicon substrate, and the ultrasonic fingerprint chip and the circuit board can be connected using the wires, thereby realizing the interconnection between the piezoelectric transducer and the circuit board.
在一种实现方式中，所述上电极为通过溅射形成在所述压电层的上表面的金属或者金属混浆涂层，例如银浆(Ag)。In one implementation, the upper electrode is a metal or metal paste coating, such as silver paste (Ag), formed on the upper surface of the piezoelectric layer by sputtering.
在一种实现方式中，所述下电极为通过溅射或者蒸镀形成在超声指纹芯片的上表面的金属电极阵列，所述金属电极为铝或者金。In one implementation, the lower electrode is a metal electrode array formed on the upper surface of the ultrasonic fingerprint chip by sputtering or evaporation, and the metal electrode is aluminum or gold.
在一种实现方式中，所述上电极的表面覆盖有保护层，用于对上电极和压电层进行保护，以避免压电层和上电极在高温、高湿等条件下的渗透和失效行为，提升了超声指纹装置的安全性。所述保护层例如可以由高分子有机材料或者无机材料形成。In one implementation, the surface of the upper electrode is covered with a protective layer to protect the upper electrode and the piezoelectric layer to avoid penetration and failure of the piezoelectric layer and the upper electrode under conditions such as high temperature and high humidity. behavior, improving the security of ultrasonic fingerprint devices. The protective layer may be formed of, for example, polymer organic materials or inorganic materials.
在一种实现方式中，所述超声指纹芯片的表面设置有驱动走线，所述上电极从所述压电层的上表面引出至所述超声指纹芯片的表面，并通过所述驱动走线与所述引线连接。这样，就实现了压电换能器与电路板之间的互联。In one implementation, the surface of the ultrasonic fingerprint chip is provided with driving traces, and the upper electrode is led from the upper surface of the piezoelectric layer to the surface of the ultrasonic fingerprint chip and passes through the driving traces. Connect to the lead. In this way, the interconnection between the piezoelectric transducer and the circuit board is achieved.
在一种实现方式中，所述压电层的材料为PVDF，或者所述压电层的材料为PVDF-TrFE。In one implementation, the material of the piezoelectric layer is PVDF, or the material of the piezoelectric layer is PVDF-TrFE.
第二方面，提供了一种电子设备，包括：显示屏；第一方面或第一方面的任一实现方式中所述的超声指纹装置；以及间隔层，设置在所述超声指纹 装置与所述显示屏之间。In a second aspect, an electronic device is provided, including: a display screen; the ultrasonic fingerprint device described in the first aspect or any implementation of the first aspect; and a spacer layer disposed between the ultrasonic fingerprint device and the between displays.
附图说明Description of drawings
图1是本申请实施例的超声指纹装置的示意图。Figure 1 is a schematic diagram of an ultrasonic fingerprint device according to an embodiment of the present application.
图2是图1所示的超声指纹装置的一种可能的实现方式的示意图。FIG. 2 is a schematic diagram of a possible implementation of the ultrasonic fingerprint device shown in FIG. 1 .
图3是第一粘接层和第二粘接层的一种可能的实现方式的示意图。Figure 3 is a schematic diagram of a possible implementation of the first adhesive layer and the second adhesive layer.
图4是第一粘接层和第二粘接层的另一种可能的实现方式的示意图。Figure 4 is a schematic diagram of another possible implementation of the first adhesive layer and the second adhesive layer.
图5是第一粘接层和第二粘接层的再一种可能的实现方式的示意图。Figure 5 is a schematic diagram of yet another possible implementation of the first adhesive layer and the second adhesive layer.
图6是本申请实施例的电子设备的示意性框图。Figure 6 is a schematic block diagram of an electronic device according to an embodiment of the present application.
具体实施方式Detailed ways
下面将结合附图，对本申请中的技术方案进行描述。The technical solutions in this application will be described below with reference to the accompanying drawings.
超声波已在无损检测、超声测距、超声医学等领域商用多年。在指纹识别领域，超声指纹装置能够实现屏下指纹识别，而且不需要点亮屏幕，对屏幕的可见光的穿透力也没有特殊的要求，因此具有较大的商用价值。Ultrasound has been commercially used in non-destructive testing, ultrasonic ranging, ultrasonic medicine and other fields for many years. In the field of fingerprint recognition, ultrasonic fingerprint devices can realize under-screen fingerprint recognition without lighting up the screen, and there are no special requirements for the visible light penetration of the screen, so it has great commercial value.
超声指纹装置可以采用背贴的方式与显示屏集成。超声指纹装置通过胶水粘贴在显示屏的下方。超声指纹装置包括薄膜晶体管(thin film transistor，TFT)基底和压电换能器，压电换能器包括压电层、压电层上方的电极、以及压电层下方的电极，电极的下表面覆盖有保护层。The ultrasonic fingerprint device can be integrated with the display screen in a back-mounted manner. The ultrasonic fingerprint device is glued to the underside of the display. The ultrasonic fingerprint device includes a thin film transistor (TFT) substrate and a piezoelectric transducer. The piezoelectric transducer includes a piezoelectric layer, an electrode above the piezoelectric layer, and an electrode below the piezoelectric layer. The lower surface of the electrode Covered with a protective layer.
由于TFT基底位于压电换能器的上方，会影响压电换能器向显示屏上方的手指发出的超声波信号的信号量，并且，超声指纹模组与电路板之间需要通过异方性导电胶膜(anisotropic conductive film，ACF)压合，使得成本较高。Since the TFT substrate is located above the piezoelectric transducer, it will affect the signal volume of the ultrasonic signal emitted by the piezoelectric transducer to the finger above the display screen. In addition, the ultrasonic fingerprint module and the circuit board need to be laminated with anisotropic conductive film (ACF), which makes the cost higher.
为此，本申请提供一种超声指纹装置，采用正贴的方式实现超声指纹装置与显示屏之间的集成，减少指纹检测过程中的信号损失，并且能够通过COB的方式实现超声指纹装置与电路板之间的连接，操作简单且成本较低。To this end, this application provides an ultrasonic fingerprint device, which uses a front-facing method to realize the integration between the ultrasonic fingerprint device and the display screen, reduces signal loss during the fingerprint detection process, and can realize the ultrasonic fingerprint device and circuit through COB. The connection between boards is easy to operate and low cost.
图1示出了本申请实施例的超声指纹装置的示意图。如图1所示，本申请采用正贴的方式实现超声指纹装置300与显示屏100之间的集成，超声指纹装置300正贴在电子设备的显示屏100的下方，以实现屏下超声指纹识别。超声指纹装置300包括超声指纹芯片310、以及设置在超声指纹芯片310上方的压电换能器320，压电换能器320包括压电层321、位于压电层321上 方的上电极322、以及位于压电层321下方的下电极323。Figure 1 shows a schematic diagram of an ultrasonic fingerprint device according to an embodiment of the present application. As shown in Figure 1 , this application adopts a front-to-side method to realize the integration between the ultrasonic fingerprint device 300 and the display screen 100 . The ultrasonic fingerprint device 300 is directly attached to the bottom of the display screen 100 of the electronic device to achieve under-screen ultrasonic fingerprint recognition. . The ultrasonic fingerprint device 300 includes an ultrasonic fingerprint chip 310 and a piezoelectric transducer 320 disposed above the ultrasonic fingerprint chip 310. The piezoelectric transducer 320 includes a piezoelectric layer 321, an upper electrode 322 located above the piezoelectric layer 321, and The lower electrode 323 is located under the piezoelectric layer 321 .
超声指纹芯片310为用于超声指纹识别的专用集成电路(application specific integrated circuit，ASIC)，例如互补金属氧化物半导体(complementary metal-oxide-semiconductor transistor，CMOS)芯片。当采用CMOS芯片作为超声指纹芯片310时，由于其采用硅基底，能够在硅基底上进行打线，使超声指纹装置300能够通过引线700与电路板600连接，进而实现压电换能器320与电路板600之间的互联。The ultrasonic fingerprint chip 310 is an application specific integrated circuit (ASIC) used for ultrasonic fingerprint recognition, such as a complementary metal-oxide-semiconductor transistor (CMOS) chip. When a CMOS chip is used as the ultrasonic fingerprint chip 310, since it uses a silicon substrate, wires can be laid on the silicon substrate, so that the ultrasonic fingerprint device 300 can be connected to the circuit board 600 through the leads 700, thereby realizing the piezoelectric transducer 320 and the circuit board 600. Interconnections between circuit boards 600.
超声指纹芯片310与电路板600之间采用板上芯片(chip on board，COB)的方式连接，COB通常指将芯片贴在电路板上并利用引线进行电子连接的方式，也称为绑定(bonding)工艺或者打线工艺。例如，如图1所示，引线700的两端分别焊接固定于超声指纹芯片310和电路板600上。上电极322和下电极323可以通过超声指纹芯片310上的引线700，与电路板600之间互联。相比于前述的ACF压合等方式，COB具有操作简单、成本低等优势。The ultrasonic fingerprint chip 310 and the circuit board 600 are connected using a chip on board (COB) method. COB usually refers to a method of attaching the chip to the circuit board and using leads for electronic connection, also known as binding ( bonding) process or wiring process. For example, as shown in FIG. 1 , the two ends of the lead 700 are welded and fixed to the ultrasonic fingerprint chip 310 and the circuit board 600 respectively. The upper electrode 322 and the lower electrode 323 can be interconnected with the circuit board 600 through the leads 700 on the ultrasonic fingerprint chip 310 . Compared with the aforementioned ACF lamination and other methods, COB has the advantages of simple operation and low cost.
引线700例如可以是金线或者铝线。通常，引线700具有一定的弧高H1，当弧高H1高于超声指纹装置300的上表面时，将导致超声指纹装置300无法正贴于显示屏100的下表面。为此，本申请实施例中，在超声指纹装置300的上表面与显示屏100的下表面之间设置有间隔层400，间隔层400用于增加显示屏100与超声指纹芯片310之间的空间，该空间用于容纳引线700，从而有效避免引线700的弧高H1对显示屏100和超声指纹装置300之间的集成造成影响。The lead wire 700 may be a gold wire or an aluminum wire, for example. Generally, the lead 700 has a certain arc height H1. When the arc height H1 is higher than the upper surface of the ultrasonic fingerprint device 300, the ultrasonic fingerprint device 300 will not be able to be directly attached to the lower surface of the display screen 100. To this end, in the embodiment of the present application, a spacer layer 400 is provided between the upper surface of the ultrasonic fingerprint device 300 and the lower surface of the display screen 100 . The spacer layer 400 is used to increase the space between the display screen 100 and the ultrasonic fingerprint chip 310 , this space is used to accommodate the lead 700, thereby effectively preventing the arc height H1 of the lead 700 from affecting the integration between the display screen 100 and the ultrasonic fingerprint device 300.
例如，如图1所示，显示屏100和超声指纹装置300之间设置有间隔层400，间隔层400的厚度被设置为使得显示屏100的下表面和超声指纹芯片310的上表面之间的高度差H2大于引线700的弧高H1，以在显示屏100和超声指纹芯片310之间形成用于容纳引线700的空间(H2-H1)。For example, as shown in FIG. 1 , a spacer layer 400 is provided between the display screen 100 and the ultrasonic fingerprint device 300 . The thickness of the spacer layer 400 is set such that the distance between the lower surface of the display screen 100 and the upper surface of the ultrasonic fingerprint chip 310 is The height difference H2 is greater than the arc height H1 of the lead 700 to form a space (H2-H1) for accommodating the lead 700 between the display screen 100 and the ultrasonic fingerprint chip 310.
在进行指纹识别时，电路板600产生的驱动信号经由引线700加载至上电极322和下电极323，在该驱动信号的作用下，基于压电效应，压电层321产生振动，从而向显示屏100上方的手指发出超声波信号。该超声波信号传输至手指的表面，在指纹谷和指纹脊处发生发射或散射而返回超声检测信号，超声检测信号传输至压电层321时，基于逆压电效应，上电极322和下电极323之间产生电势差，得到相应的电信号，电路板600经由引线700接收该电信号。对该电信号进行处理后，便可以得到该手指的指纹信息。When performing fingerprint recognition, the driving signal generated by the circuit board 600 is loaded to the upper electrode 322 and the lower electrode 323 via the lead 700 . Under the action of the driving signal, based on the piezoelectric effect, the piezoelectric layer 321 vibrates, thereby transmitting light to the display screen 100 The upper finger emits ultrasonic signals. The ultrasonic signal is transmitted to the surface of the finger, is emitted or scattered at the fingerprint valleys and fingerprint ridges, and returns an ultrasonic detection signal. When the ultrasonic detection signal is transmitted to the piezoelectric layer 321, based on the inverse piezoelectric effect, the upper electrode 322 and the lower electrode 323 A potential difference is generated between them, and a corresponding electrical signal is obtained. The circuit board 600 receives the electrical signal via the lead 700 . After processing the electrical signal, the fingerprint information of the finger can be obtained.
上电极322通常是通过溅射形成在压电层321的上表面的金属或者金属混浆涂层，例如银浆，其为整面电极；下电极323例如可以是通过溅射或者蒸镀形成在超声指纹芯片310的上表面的金属电极阵列，该金属电极的材料可以为铝或者金等。The upper electrode 322 is usually a metal or metal mixture coating, such as silver paste, formed on the upper surface of the piezoelectric layer 321 by sputtering, which is a full-surface electrode; the lower electrode 323 may be formed on the upper surface of the piezoelectric layer 321 by sputtering or evaporation, for example. The metal electrode array on the upper surface of the ultrasonic fingerprint chip 310 may be made of aluminum, gold, or the like.
进一步地，上电极322的表面上还可以覆盖保护层324，用于对上电极322和压电层321进行保护，以避免压电层321和上电极322在高温、高湿等条件下的渗透和失效行为，提升了超声指纹装置300的安全性。保护层324例如可以由高分子有机材料，或者由无机材料形成，也称为钝化层。Further, the surface of the upper electrode 322 can also be covered with a protective layer 324 to protect the upper electrode 322 and the piezoelectric layer 321 to prevent the piezoelectric layer 321 and the upper electrode 322 from penetrating under conditions such as high temperature and high humidity. and failure behavior, thereby improving the security of the ultrasonic fingerprint device 300. The protective layer 324 may be formed of, for example, a polymer organic material or an inorganic material, and is also called a passivation layer.
基于上面的描述可知，本申请实施例中，超声指纹芯片300与电路板600之间通过引线700连接，超声指纹装置300和显示屏100之间设置间隔层400，从而增加了显示屏100与超声指纹芯片300之间的空间，以用于容纳引线700，避免引线700的弧高对显示屏100和超声指纹装置300之间的集成造成影响。Based on the above description, it can be seen that in the embodiment of the present application, the ultrasonic fingerprint chip 300 and the circuit board 600 are connected through leads 700, and a spacer layer 400 is provided between the ultrasonic fingerprint device 300 and the display screen 100, thereby increasing the connection between the display screen 100 and the ultrasonic fingerprint device 300. The space between the fingerprint chips 300 is used to accommodate the leads 700 to prevent the arc height of the leads 700 from affecting the integration between the display screen 100 and the ultrasonic fingerprint device 300 .
而由于上电极3202通常为银浆等材料，其致密度很低，不支持打线，因此需要将其引出至超声指纹芯片310的表面，再与引线700连接。例如，可以在超声指纹芯片210的表面设置驱动走线，上电极232从压电层231的上表面引出至超声指纹芯片310的表面，并通过该驱动走线与引线700连接。引线700的一端与该驱动走线在超声指纹芯片310表面的焊盘处连接，引线700的另一端连接至电路板600。这样，就实现了压电换能器320与电路板600之间的互联。Since the upper electrode 3202 is usually made of silver paste and other materials, its density is very low and does not support wire bonding. Therefore, it needs to be led out to the surface of the ultrasonic fingerprint chip 310 and then connected to the lead 700 . For example, driving traces can be provided on the surface of the ultrasonic fingerprint chip 210, and the upper electrode 232 is led from the upper surface of the piezoelectric layer 231 to the surface of the ultrasonic fingerprint chip 310, and is connected to the lead 700 through the driving traces. One end of the lead 700 is connected to the driving trace at the pad on the surface of the ultrasonic fingerprint chip 310 , and the other end of the lead 700 is connected to the circuit board 600 . In this way, the interconnection between the piezoelectric transducer 320 and the circuit board 600 is achieved.
电路板600产生的驱动信号可以通过引线700传输至上电极322和下电极323，以使上电极322和下电极323在该驱动信号的作用下向显示屏100上方的手指发出超声波信号，并且可以通过引线700将该手指返回的超声检测信号传输至电路板600。电路板600例如可以是柔性线路板(flexible printed circuit，FPC)。The driving signal generated by the circuit board 600 can be transmitted to the upper electrode 322 and the lower electrode 323 through the lead 700, so that the upper electrode 322 and the lower electrode 323 emit ultrasonic signals to the fingers above the display screen 100 under the action of the driving signal, and can pass through The lead 700 transmits the ultrasonic detection signal returned by the finger to the circuit board 600 . The circuit board 600 may be, for example, a flexible printed circuit (FPC).
压电层321由压电材料形成，例如聚偏二氟乙烯(polyvinylidene fluoride，PVDF)或者聚偏二氟乙烯-三氟乙烯共聚物(polyvinylidene fluoride-trifluoroethylene，PVDF-TrFE)等。The piezoelectric layer 321 is formed of a piezoelectric material, such as polyvinylidene fluoride (PVDF) or polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE).
如图1所示，显示屏100包括发光层110和盖板120。发光层110例如可以由有机发光二极管(organic light emitting diode，OLED)或者主动矩阵有机发光二极体(active matrixorganic light emitting diode，AMOLED)等形 成。盖板120覆盖于发光层110的上方。超声指纹装置300除了如图1所示那样设置在发光层110的下方，也可以于显示屏100并列设置在盖板120不同区域的下方，同样可以实现屏下超声指纹识别。As shown in FIG. 1 , the display screen 100 includes a light-emitting layer 110 and a cover plate 120 . The light emitting layer 110 may be formed of, for example, an organic light emitting diode (OLED) or an active matrix organic light emitting diode (AMOLED). The cover 120 covers the top of the light-emitting layer 110 . In addition to being disposed under the light-emitting layer 110 as shown in FIG. 1 , the ultrasonic fingerprint device 300 can also be disposed side by side under different areas of the cover 120 on the display screen 100 , which can also realize under-screen ultrasonic fingerprint recognition.
如图1所示，超声指纹装置300还可以包括补强板330，例如补强钢板(Reinforcing Steel)330，超声指纹芯片310和电路板600设置在补强板330上。具体地，超声指纹芯片310和电路板600可以并排设置在补强板330表面的不同区域。其中，超声指纹芯片310与补强板330之间可以通过第三粘接层311，例如胶水、芯片粘接膜(die attach film，DAF)或者环氧树脂等连接。通过补强板330，提供了对超声指纹装置300和电路板600的支撑，并提高了超声指纹装置300的结构稳定性。As shown in Figure 1, the ultrasonic fingerprint device 300 may also include a reinforcing plate 330, such as a reinforcing steel plate (Reinforcing Steel) 330, on which the ultrasonic fingerprint chip 310 and the circuit board 600 are disposed. Specifically, the ultrasonic fingerprint chip 310 and the circuit board 600 may be disposed side by side in different areas on the surface of the reinforcing plate 330 . The ultrasonic fingerprint chip 310 and the reinforcing plate 330 can be connected through a third adhesive layer 311, such as glue, die attach film (DAF) or epoxy resin. The reinforcing plate 330 provides support for the ultrasonic fingerprint device 300 and the circuit board 600, and improves the structural stability of the ultrasonic fingerprint device 300.
以下，结合图2至图5，详细描述本申请实施例的间隔层400及其与相邻叠层之间的连接。Below, the spacer layer 400 and the connection between the spacer layer 400 and the adjacent stacked layers according to the embodiment of the present application will be described in detail with reference to FIGS. 2 to 5 .
图2为图1所示的超声指纹装置300的一种可能的实现方式的示意图。在一种实现方式中，如图2所示，间隔层400包括介质层410、以及位于介质层410和超声指纹装置300之间的第一粘接层420。通过第一粘接层420，可以实现间隔层400与超声指纹装置300之间的有效连接。FIG. 2 is a schematic diagram of a possible implementation of the ultrasonic fingerprint device 300 shown in FIG. 1 . In one implementation, as shown in FIG. 2 , the spacer layer 400 includes a dielectric layer 410 and a first adhesive layer 420 located between the dielectric layer 410 and the ultrasonic fingerprint device 300 . Through the first adhesive layer 420, effective connection between the spacer layer 400 and the ultrasonic fingerprint device 300 can be achieved.
声阻抗Z是评估间隔层400中信号传输情况的重要指标，Z＝ρc，ρ是间隔层400的材料密度，c是超声波的传输速度即声速。对于固体材料来说，声速c与其力学参数相关，满足
Figure PCTCN2022118504-appb-000001
其中，Y为杨氏模量，ν为泊松比。 Acoustic impedance Z is an important indicator for evaluating signal transmission in the spacer layer 400. Z=ρc, where ρ is the material density of the spacer layer 400, and c is the transmission speed of ultrasonic waves, that is, the speed of sound. For solid materials, the sound speed c is related to its mechanical parameters and satisfies
Figure PCTCN2022118504-appb-000001
Among them, Y is Young's modulus and ν is Poisson's ratio.
为了使信号经过间隔层400时拥有最佳的传输性能，还需要考虑与间隔层400相邻的叠层的声阻抗。若间隔层400两侧的相邻叠层的声阻抗分别为Z1和Z2，当间隔层400的声阻抗
Figure PCTCN2022118504-appb-000002
时，间隔层400及其相邻叠层之间能够实现最优的阻抗匹配。 In order to have the best transmission performance when the signal passes through the spacer layer 400, the acoustic impedance of the stack adjacent to the spacer layer 400 also needs to be considered. If the acoustic impedances of the adjacent stacked layers on both sides of the spacer layer 400 are Z1 and Z2 respectively, when the acoustic impedance of the spacer layer 400
Figure PCTCN2022118504-appb-000002
When , optimal impedance matching can be achieved between the spacer layer 400 and its adjacent stacked layers.
为此，可以配置介质层410的材料，以使其声阻抗与相邻的显示屏100和保护层324的声阻抗之间相匹配，从而减小信号经过间隔层400时产生的损耗。To this end, the material of the dielectric layer 410 can be configured so that its acoustic impedance matches the acoustic impedance of the adjacent display screen 100 and the protective layer 324 , thereby reducing the loss generated when the signal passes through the spacer layer 400 .
通常，显示屏100的最底层(back plate film)的材料为PET，例如，该PET的声阻抗可以在3.3Mpa*s/m左右。保护层324的厚度通常很小，此处可以忽略。为了减小信号在间隔层400中的衰减，可以选择介质层410的材料，使其声阻抗与该PET的声阻抗相近。Usually, the material of the bottom layer (back plate film) of the display screen 100 is PET. For example, the acoustic impedance of the PET can be about 3.3Mpa*s/m. The thickness of the protective layer 324 is usually very small and can be ignored here. In order to reduce signal attenuation in the spacer layer 400, the material of the dielectric layer 410 can be selected so that its acoustic impedance is close to that of the PET.
例如，介质层410的材料可以包括以下中的至少一种：聚对苯二甲酸乙二醇酯(polyethylene terephthalate，PET)、(polyimide，PI)、热塑性聚氨酯(thermoplastic polyurethane，TPU)、碳纤维(carbon fiber)和玻璃(glass)。以下，以间隔层400为PET层为例进行描述。For example, the material of the dielectric layer 410 may include at least one of the following: polyethylene terephthalate (PET), polyimide (PI), thermoplastic polyurethane (TPU), carbon fiber (carbon fiber) and glass. In the following description, the spacer layer 400 is a PET layer as an example.
同时，对于叠层结构，超声波的透过率与材料厚度也有关系，例如，经过实验可知，当介质层410的厚度d与超声波的波长λ之间满足d＝(2n+1)×(λ/4)时，信号衰减较大；而d＝λ/2时，则对信号传输的影响较小。因此，在一些实现方式中，介质层410的厚度可以位于30um至100um之间，优选为50um。At the same time, for the laminated structure, the transmittance of ultrasonic waves is also related to the thickness of the material. For example, it can be seen through experiments that when the thickness d of the dielectric layer 410 and the wavelength λ of the ultrasonic waves satisfy d=(2n+1)×(λ/ 4), the signal attenuation is large; while when d=λ/2, the impact on signal transmission is small. Therefore, in some implementations, the thickness of the dielectric layer 410 may be between 30um and 100um, preferably 50um.
基于上面的描述可知，间隔层400的设置，即能保证引线700的弧高H1不会对超声指纹装置300的正贴造成影响，还可以通过对介质层410的材料进行选择，使其声阻抗与相邻叠层的声阻抗之间相匹配，同时对介质层410的厚度进行选择，从而减小信号经过间隔层400时产生的损耗。Based on the above description, it can be seen that the setting of the spacer layer 400 can ensure that the arc height H1 of the lead 700 will not affect the front placement of the ultrasonic fingerprint device 300. The material of the dielectric layer 410 can also be selected to increase its acoustic impedance. The acoustic impedance of the adjacent stacked layers is matched, and the thickness of the dielectric layer 410 is selected to reduce the loss generated when the signal passes through the spacer layer 400 .
这里，所述的信号，包括前述的超声波信号和手指返回的超声检测信号。Here, the signal includes the aforementioned ultrasonic signal and the ultrasonic detection signal returned by the finger.
图3至图5分别示出了图2中的第一粘接层420和第二粘接层500的几种可能的实现方式的示意图。3 to 5 respectively show schematic diagrams of several possible implementations of the first adhesive layer 420 and the second adhesive layer 500 in FIG. 2 .
在一种实现方式中，如图3和图5所示，第一粘接层420可以包括第一匹配层421、以及位于第一匹配层421两侧的第一胶层422。这样，在实现间隔层400与超声指纹装置300之间的连接的同时，还可以利用第一匹配层421进行声阻抗和厚度的匹配，以提高指纹识别装置300的信号传输性能。In one implementation, as shown in FIG. 3 and FIG. 5 , the first adhesive layer 420 may include a first matching layer 421 and a first glue layer 422 located on both sides of the first matching layer 421 . In this way, while realizing the connection between the spacer layer 400 and the ultrasonic fingerprint device 300 , the first matching layer 421 can also be used to match the acoustic impedance and thickness to improve the signal transmission performance of the fingerprint identification device 300 .
在另一种实现方式中，如图4所示，第一粘接层420可以为胶水(adhesive)，以简化叠层结构，降低叠层厚度和成本。In another implementation, as shown in FIG. 4 , the first adhesive layer 420 may be glue (adhesive) to simplify the laminate structure and reduce the laminate thickness and cost.
其中，当第一粘接层420由第一匹配层421、以及位于第一匹配层421两侧的第一胶层422组成时，通过为第一匹配层421选择合适的材料并设置合适的厚度，提高超声指纹装置300的信号传输性能。When the first adhesive layer 420 is composed of the first matching layer 421 and the first glue layers 422 located on both sides of the first matching layer 421, by selecting an appropriate material and setting an appropriate thickness for the first matching layer 421 , improve the signal transmission performance of the ultrasonic fingerprint device 300.
例如，第一匹配层421的材料可以是铜(Cu)或者PET等，以使第一匹配层421的声阻抗与其相邻叠层的声阻抗之间相匹配。为了适应第一匹配层421的材料，第一匹配层421两侧的第一胶层422可以采用丙烯酸，即亚克力胶膜(acrylicadhesive)。第一粘接层420可以看作具有双面背胶的铜箔或者双面背胶的PET，以下也称其为双面胶。又例如，第一匹配层421的厚度可以位于5um至15um之间，优选地，第一匹配层421的厚度为6um。 经测试，当为第一匹配层421选择了合适的材料和厚度时，可以使超声指纹装置300的信号传输性能更优。For example, the material of the first matching layer 421 may be copper (Cu) or PET, so that the acoustic impedance of the first matching layer 421 matches the acoustic impedance of its adjacent stacked layer. In order to adapt to the material of the first matching layer 421, the first adhesive layers 422 on both sides of the first matching layer 421 can be made of acrylic, that is, acrylic adhesive film (acrylicadhesive). The first adhesive layer 420 can be regarded as copper foil with double-sided adhesive backing or PET with double-sided adhesive backing, which is also referred to as double-sided adhesive tape below. For another example, the thickness of the first matching layer 421 may be between 5um and 15um. Preferably, the thickness of the first matching layer 421 is 6um. After testing, when an appropriate material and thickness are selected for the first matching layer 421, the signal transmission performance of the ultrasonic fingerprint device 300 can be improved.
如图2所示，超声指纹装置300还可以包括第二粘接层500，第二粘接层500用于连接间隔层400与显示屏100。通过第二粘接层500，可以实现间隔层400与显示屏100之间的有效连接。As shown in FIG. 2 , the ultrasonic fingerprint device 300 may further include a second adhesive layer 500 , and the second adhesive layer 500 is used to connect the spacer layer 400 and the display screen 100 . Through the second adhesive layer 500, effective connection between the spacer layer 400 and the display screen 100 can be achieved.
在一种实现方式中，如图3和图4所示，第二粘接层500可以包括第二匹配层510、以及位于第二匹配层510两侧的第二胶层520。这样，在实现间隔层400与显示屏100之间的连接的同时，还可以利用第二匹配层510进行声阻抗和厚度的匹配，以提高指纹识别装置300的信号传输性能。In one implementation, as shown in FIGS. 3 and 4 , the second adhesive layer 500 may include a second matching layer 510 and a second glue layer 520 located on both sides of the second matching layer 510 . In this way, while realizing the connection between the spacer layer 400 and the display screen 100 , the second matching layer 510 can also be used to match the acoustic impedance and thickness to improve the signal transmission performance of the fingerprint identification device 300 .
在另一种实现方式中，如图5所示，第二粘接层500可以为胶水(adhesive)，以简化叠层结构，降低叠层厚度和成本。In another implementation, as shown in FIG. 5 , the second adhesive layer 500 can be glue (adhesive) to simplify the laminate structure and reduce the laminate thickness and cost.
其中，当第二粘接层500由第二匹配层510、以及位于第二匹配层510两侧的第二胶层520组成时，通过为第二匹配层510选择合适的材料并设置合适的厚度，提高超声指纹装置300的信号传输性能。When the second adhesive layer 500 is composed of the second matching layer 510 and the second glue layer 520 located on both sides of the second matching layer 510, by selecting an appropriate material and setting an appropriate thickness for the second matching layer 510 , improve the signal transmission performance of the ultrasonic fingerprint device 300.
例如，第二匹配层510的材料可以是铜(Cu)或者PET等，以使第二匹配层510的声阻抗与其相邻叠层的声阻抗之间相匹配。为了适应第二匹配层510的材料，第二匹配层510两侧的第二胶层520可以采用为丙烯酸，即亚克力胶膜(acrylicadhesive)。第二粘接层500可以看作具有双面背胶的铜箔或者双面背胶的PET，以下也称其为双面胶。又例如，第二匹配层510的厚度可以位于5um至15um之间，优选地，第二匹配层510的厚度为6um。经测试，当为第二匹配层510选择了合适的材料和厚度时，可以使超声指纹装置300的信号传输性能更优。For example, the material of the second matching layer 510 may be copper (Cu), PET, or the like, so that the acoustic impedance of the second matching layer 510 matches the acoustic impedance of its adjacent stacked layer. In order to adapt to the material of the second matching layer 510, the second adhesive layer 520 on both sides of the second matching layer 510 can be made of acrylic, that is, acrylic adhesive film (acrylicadhesive). The second adhesive layer 500 can be regarded as copper foil with double-sided adhesive backing or PET with double-sided adhesive backing, which is also referred to as double-sided adhesive tape below. For another example, the thickness of the second matching layer 510 may be between 5um and 15um. Preferably, the thickness of the second matching layer 510 is 6um. After testing, when an appropriate material and thickness are selected for the second matching layer 510, the signal transmission performance of the ultrasonic fingerprint device 300 can be improved.
图3至图5所示的叠层结构仅为示例，本申请的间隔层400也可以具有其他结构，其与相邻叠层之间也可以具有其他连接方式。在图3至图5中，第一粘接层420和第二粘接层500可以都为胶水，以简化叠层结构，降低叠层厚度和成本；或者，第一粘接层420为双面胶而第二粘接层500为胶水，其中该双面胶可以是双面背胶的铜箔或者双面背胶的PET；或者，第一粘接层420为胶水而第二粘接层500为双面胶，其中该双面胶可以是双面背胶的铜箔或者双面背胶的PET。The stacked structures shown in Figures 3 to 5 are only examples. The spacer layer 400 of the present application can also have other structures, and it can also have other connection methods with adjacent stacked layers. In FIGS. 3 to 5 , both the first adhesive layer 420 and the second adhesive layer 500 can be made of glue to simplify the laminate structure and reduce the thickness and cost of the laminate; alternatively, the first adhesive layer 420 can be double-sided. Glue and the second adhesive layer 500 is glue, wherein the double-sided adhesive can be double-sided adhesive copper foil or double-sided adhesive PET; or, the first adhesive layer 420 is glue and the second adhesive layer 500 It is double-sided tape, where the double-sided tape can be copper foil with double-sided tape or PET with double-sided tape.
以下，以图3为例，详细描述各个叠层的材料和厚度的分布。如图3所示，第一粘接层420和第二粘接层500均为双面背胶的铜箔。第二粘接层500 为双面背胶的铜箔，其中用于粘贴显示屏100的一面为黑色，类似于显示屏100底下的叠层，以使超声指纹模组300在强光下的外观可见性较低。铜箔和胶层的厚度尽量薄，例如小于或等于10um，以保证信号在不同介质中传输时的信号衰减较小。Below, taking Figure 3 as an example, the distribution of materials and thicknesses of each stack will be described in detail. As shown in FIG. 3 , the first adhesive layer 420 and the second adhesive layer 500 are both double-sided adhesive copper foils. The second adhesive layer 500 is a double-sided adhesive-backed copper foil, and the side used to adhere the display screen 100 is black, similar to the laminate under the display screen 100, so as to improve the appearance of the ultrasonic fingerprint module 300 under strong light. Less visibility. The thickness of the copper foil and adhesive layer should be as thin as possible, for example, less than or equal to 10um, to ensure that the signal attenuation is small when the signal is transmitted in different media.
间隔层400的总厚度尽量设置为大于或等于引线700的弧高H1，弧高H1通常大于或等于30um，以使间隔层400的上表面高出引线700的线弧，保证超声指纹装置300可以正贴于显示屏100的下表面。The total thickness of the spacer layer 400 is set to be greater than or equal to the arc height H1 of the lead 700 as much as possible. The arc height H1 is usually greater than or equal to 30um, so that the upper surface of the spacer layer 400 is higher than the arc of the lead 700 to ensure that the ultrasonic fingerprint device 300 can It is attached to the lower surface of the display screen 100 .
显示屏100下方的各个叠层的总厚度，即超声指纹装置300和间隔层400的总厚度的设计，需要考虑电子设备内为超声指纹装置300预留的高度空间，该高度空间通常小于或等于0.4mm。The design of the total thickness of each stack below the display screen 100, that is, the total thickness of the ultrasonic fingerprint device 300 and the spacer layer 400, needs to consider the height space reserved for the ultrasonic fingerprint device 300 in the electronic device, which is usually less than or equal to 0.4mm.
以图3所示的叠层结构作为示例，表一示出了图3中各个叠层的厚度的范围以及厚度的优选值。表一中各行所示的叠层顺序，与图3中各个叠层的顺序相对应。其中，作为示例，在表一中，第二粘接层500中的第二匹配层510为铜，其两面的第二胶层520为亚克力胶膜；介质层410为具有单面背胶的PET层，该背胶可以位于PET层的任一侧表面，该背胶在图3中未示出；第一粘接层420中的第一匹配层421为铜，其两面的第一胶层422为亚克力胶膜；上电极322为银，压电层321采用PVDF。各个叠层的厚度的范围及其优选值如表一所示。Taking the laminated structure shown in FIG. 3 as an example, Table 1 shows the thickness range of each laminated layer in FIG. 3 and the preferred value of the thickness. The stacking sequence shown in each row of Table 1 corresponds to the stacking sequence of each layer in Figure 3. As an example, in Table 1, the second matching layer 510 in the second adhesive layer 500 is copper, and the second adhesive layers 520 on both sides are acrylic adhesive films; the dielectric layer 410 is PET with a single-sided adhesive. layer, the adhesive can be located on either side surface of the PET layer, and the adhesive is not shown in Figure 3; the first matching layer 421 in the first adhesive layer 420 is copper, and the first adhesive layers 422 on both sides It is an acrylic film; the upper electrode 322 is made of silver, and the piezoelectric layer 321 is made of PVDF. The thickness ranges of each stack and their preferred values are shown in Table 1.
该叠层结构除了能够实现超声指纹装置300正贴于显示屏100的下表面，对于表一所示的各个叠层的材料和厚度，既能够保证叠层结构的稳定性，同时能够减少信号衰减，保证超声指纹装置300的信号传输性能。In addition to enabling the ultrasonic fingerprint device 300 to be directly attached to the lower surface of the display screen 100, this laminated structure can not only ensure the stability of the laminated structure but also reduce signal attenuation according to the materials and thicknesses of each laminated layer shown in Table 1. , ensuring the signal transmission performance of the ultrasonic fingerprint device 300.
经过实验验证，基于图3所示的叠层结构，当采用表一中所示的材料和厚度时，在信号不饱和的情况下，超声指纹装置300的信噪比(Signal Noise Ratio，SNR)可以达到20dB以上。After experimental verification, based on the laminated structure shown in Figure 3, when using the materials and thicknesses shown in Table 1, the signal-to-noise ratio (SNR) of the ultrasonic fingerprint device 300 is under the condition that the signal is not saturated. Can reach more than 20dB.
表一Table I
Figure PCTCN2022118504-appb-000003
Figure PCTCN2022118504-appb-000003
Figure PCTCN2022118504-appb-000004
Figure PCTCN2022118504-appb-000004
应理解，介质层410可以不具有背胶；或者介质层410可以具有单面背胶或者双面背胶，以便于装配。其中，该单面背胶可以位于介质层410朝向显示屏100一侧的表面，也可以位于介质层410朝向压电换能器320一侧的表面。图1至图5中未示出介质层410表面的背胶。It should be understood that the dielectric layer 410 may not have adhesive backing; or the dielectric layer 410 may have single-sided adhesive backing or double-sided adhesive backing to facilitate assembly. The single-sided adhesive can be located on the surface of the dielectric layer 410 facing the display screen 100 , or can be located on the surface of the dielectric layer 410 facing the piezoelectric transducer 320 . The adhesive on the surface of the dielectric layer 410 is not shown in FIGS. 1 to 5 .
图4是基于图3简化了间隔层400，间隔层400中的第一粘接层420直接采用胶水即可。图4所示的各个叠层的材料和厚度可以参考图3中针对各个叠层所选择的材料和厚度，如表一所示。Figure 4 is a simplified spacer layer 400 based on Figure 3. The first adhesive layer 420 in the spacer layer 400 can be directly made of glue. The materials and thicknesses of each stack shown in Figure 4 can refer to the materials and thicknesses selected for each stack in Figure 3, as shown in Table 1.
图5基于图3简化了第二粘接层500，第二粘接层500直接采用胶水即可。图5所示的各个叠层的材料和厚度可以参考图3中针对各个叠层所选择的材料和厚度，如表一所示。基于图5，在超声指纹装置300上依次粘贴双面胶420和介质层410之后，直接将超声指纹装置300和间隔层400整体通过胶水贴合在显示屏100的下表面。其中，介质层410以PET作为示例，双面胶420可以为双面背胶的铜箔，也可以为双面背胶的PET。Figure 5 simplifies the second adhesive layer 500 based on Figure 3. The second adhesive layer 500 can directly use glue. The materials and thicknesses of each stack shown in Figure 5 can refer to the materials and thicknesses selected for each stack in Figure 3, as shown in Table 1. Based on FIG. 5 , after the double-sided tape 420 and the dielectric layer 410 are sequentially pasted on the ultrasonic fingerprint device 300 , the ultrasonic fingerprint device 300 and the spacer layer 400 are directly attached to the lower surface of the display screen 100 through glue. The dielectric layer 410 is PET as an example, and the double-sided adhesive tape 420 may be a copper foil with double-sided adhesive tape, or may be PET with double-sided adhesive tape.
对比图5和图4，图5相当于将图4中的介质层410的PET厚度减薄，得到多层PET的叠加，以此来提高超声指纹装置300的SNR。假设图4中的介质层410的PET厚度为50um，第一粘接层420为胶水，介质层410直接通过胶水粘贴在超声指纹芯片300的上表面；而图5中的介质层410的PET厚度为30um，第一粘接层420为双面背胶的PET，第一粘接层420中的该PET的厚度为20um，介质层410通过双面背胶的PET与超声指纹芯片300的上表面粘贴在一起。这样，就将50um的PET分成30um+20um 的PET且中间通过胶层连接。Comparing Figure 5 and Figure 4, Figure 5 is equivalent to thinning the PET thickness of the dielectric layer 410 in Figure 4 to obtain a superposition of multiple layers of PET, thereby improving the SNR of the ultrasonic fingerprint device 300. Assume that the PET thickness of the dielectric layer 410 in Figure 4 is 50um, the first adhesive layer 420 is glue, and the dielectric layer 410 is directly pasted on the upper surface of the ultrasonic fingerprint chip 300 through glue; and the PET thickness of the dielectric layer 410 in Figure 5 is 30um, the first adhesive layer 420 is double-sided adhesive PET, the thickness of the PET in the first adhesive layer 420 is 20um, the dielectric layer 410 passes through the double-sided adhesive PET and the upper surface of the ultrasonic fingerprint chip 300 Paste them together. In this way, the 50um PET is divided into 30um+20um PET and connected through the glue layer.
本申请还提供了一种电子设备700，请一并参见图6，电子设备700包括显示屏100、上述的任一实施例中的超声指纹装置300、以及上述的任一实施例中的间隔层400，间隔层400设置在超声指纹装置300与显示屏100之间。This application also provides an electronic device 700. Please refer to FIG. 6 as well. The electronic device 700 includes a display screen 100, the ultrasonic fingerprint device 300 in any of the above embodiments, and the spacer layer in any of the above embodiments. 400, the spacer layer 400 is provided between the ultrasonic fingerprint device 300 and the display screen 100.
作为示例而非限定，本申请实施例中的电子设备可以为终端设备、手机、平板电脑、笔记本电脑、台式机电脑、游戏设备、车载电子设备或穿戴式智能设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。该穿戴式智能设备包括功能全、尺寸大、可不依赖智能手机实现完整或部分功能的设备，例如智能手表或智能眼镜等，以及包括只专注于某一类应用功能并且需要和其它设备如智能手机配合使用的设备，例如各类进行体征监测的智能手环、智能首饰等设备。As an example and not a limitation, the electronic device in the embodiment of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a gaming device, a vehicle-mounted electronic device or a wearable smart device, and Electronic databases, cars, bank automated teller machines (Automated Teller Machine, ATM) and other electronic equipment. The wearable smart devices include devices that are full-featured, large in size, and can realize complete or partial functions without relying on smartphones, such as smart watches or smart glasses, as well as devices that only focus on a certain type of application function and require integration with other devices such as smartphones. Equipment used in conjunction with it, such as various smart bracelets, smart jewelry and other equipment for physical sign monitoring.
需要说明的是，在不冲突的前提下，本申请描述的各个实施例和/或各个实施例中的技术特征可以任意的相互组合，组合之后得到的技术方案也应落入本申请的保护范围。It should be noted that, on the premise of no conflict, the various embodiments described in this application and/or the technical features in each embodiment can be combined with each other arbitrarily, and the technical solution obtained after the combination should also fall within the protection scope of this application. .
本申请实施例中所揭露的***、装置和方法，可以通过其它的方式实现。例如，以上所描述的方法实施例的一些特征可以忽略或者不执行。以上所描述的装置实施例仅仅是示意性的，单元的划分仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，多个单元或组件可以结合或者可以集成到另一个***。另外，各单元之间的耦合或各个组件之间的耦合可以是直接耦合，也可以是间接耦合，上述耦合包括电的、机械的或其它形式的连接。The systems, devices and methods disclosed in the embodiments of this application can be implemented in other ways. For example, some features of the method embodiments described above may be omitted or not performed. The device embodiments described above are only illustrative, and the division of units is only a logical function division. In actual implementation, there may be other divisions, and multiple units or components may be combined or integrated into another system. In addition, the coupling between units or the coupling between components may be direct coupling or indirect coupling, and the above-mentioned coupling includes electrical, mechanical or other forms of connection.
本领域的技术人员可以清楚地了解到，为了描述的方便和简洁，上述描述的装置和设备的具体工作过程以及产生的技术效果，可以参考前述方法实施例中对应的过程和技术效果，在此不再赘述。Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes and technical effects produced by the above-described devices and equipment can be referred to the corresponding processes and technical effects in the foregoing method embodiments. Herein No longer.
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围，本领域技术人员可以在上述实施例的基础上进行各种改进和变形，而这些改进或者变形均落在本申请的保护范围内。It should be understood that the specific examples in the embodiments of the present application are only to help those skilled in the art better understand the embodiments of the present application, but are not intended to limit the scope of the embodiments of the present application. Those skilled in the art can use the above embodiments to Various improvements and deformations are made, and these improvements or deformations fall within the protection scope of the present application.
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易 想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application. should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (20)

  1. 一种超声指纹装置，其特征在于，所述超声指纹装置设置在电子设备的显示屏下方，以实现屏下超声指纹识别，An ultrasonic fingerprint device, characterized in that the ultrasonic fingerprint device is arranged below the display screen of an electronic device to realize under-screen ultrasonic fingerprint recognition,
    所述超声指纹装置包括超声指纹芯片、以及设置在所述超声指纹芯片上方的压电换能器，所述压电换能器包括压电层、位于所述压电层上方的上电极、以及位于所述压电层下方的下电极，所述超声指纹芯片通过引线与其下方的电路板连接；The ultrasonic fingerprint device includes an ultrasonic fingerprint chip and a piezoelectric transducer disposed above the ultrasonic fingerprint chip. The piezoelectric transducer includes a piezoelectric layer, an upper electrode located above the piezoelectric layer, and A lower electrode located below the piezoelectric layer, and the ultrasonic fingerprint chip is connected to the circuit board below it through a lead;
    所述超声指纹装置与所述显示屏之间设置有间隔层，所述间隔层的厚度被设置为使得所述显示屏的下表面和所述超声指纹芯片的上表面之间的高度差大于所述引线的弧高，以在所述显示屏和所述超声指纹芯片之间形成用于容纳所述引线的空间。A spacer layer is provided between the ultrasonic fingerprint device and the display screen, and the thickness of the spacer layer is set such that the height difference between the lower surface of the display screen and the upper surface of the ultrasonic fingerprint chip is greater than The arc height of the lead is so as to form a space for accommodating the lead between the display screen and the ultrasonic fingerprint chip.
  2. 根据权利要求1所述的超声指纹装置，其特征在于，所述间隔层包括介质层、以及位于所述介质层和所述超声指纹装置之间的第一粘接层，其中，所述第一粘接层为胶水，或者所述第一粘接层包括第一匹配层、以及位于所述第一匹配层两侧的第一胶层。The ultrasonic fingerprint device according to claim 1, wherein the spacer layer includes a dielectric layer and a first adhesive layer located between the dielectric layer and the ultrasonic fingerprint device, wherein the first adhesive layer The adhesive layer is glue, or the first adhesive layer includes a first matching layer and first glue layers located on both sides of the first matching layer.
  3. 根据权利要求2所述的超声指纹装置，其特征在于，所述介质层的材料包括以下中的至少一种：聚对苯二甲酸乙二醇酯PET、聚酰亚胺PI、热塑性聚氨酯TPU、碳纤维和玻璃。The ultrasonic fingerprint device according to claim 2, wherein the material of the dielectric layer includes at least one of the following: polyethylene terephthalate PET, polyimide PI, thermoplastic polyurethane TPU, Carbon fiber and glass.
  4. 根据权利要求2或3所述的超声指纹装置，其特征在于，所述介质层的厚度位于30um至100um之间。The ultrasonic fingerprint device according to claim 2 or 3, characterized in that the thickness of the dielectric layer is between 30um and 100um.
  5. 根据权利要求4所述的超声指纹装置，其特征在于，所述介质层的厚度为50um。The ultrasonic fingerprint device according to claim 4, wherein the thickness of the dielectric layer is 50um.
  6. 根据权利要求2至5中任一项所述的超声指纹装置，其特征在于，所述介质层具有单面背胶；或者，所述介质层具有双面背胶。The ultrasonic fingerprint device according to any one of claims 2 to 5, wherein the dielectric layer has a single-sided adhesive; or the dielectric layer has a double-sided adhesive.
  7. 根据权利要求2至6中任一项所述的超声指纹装置，其特征在于，所述第一匹配层的材料为铜，或者所述第一匹配层的材料为PET；所述第一匹配层的厚度位于5um至15um之间。The ultrasonic fingerprint device according to any one of claims 2 to 6, characterized in that the material of the first matching layer is copper, or the material of the first matching layer is PET; the first matching layer The thickness is between 5um and 15um.
  8. 根据权利要求7所述的超声指纹装置，其特征在于，所述第一匹配层的厚度为6um。The ultrasonic fingerprint device according to claim 7, wherein the thickness of the first matching layer is 6um.
  9. 根据权利要求2至8中任一项所述的超声指纹装置，其特征在于，所述第一胶层为丙烯酸。The ultrasonic fingerprint device according to any one of claims 2 to 8, characterized in that the first glue layer is acrylic.
  10. 根据权利要求1至9中任一项所述的超声指纹装置，其特征在于，所述超声指纹装置还包括第二粘接层，所述第二粘接层用于连接所述间隔层与所述显示屏，所述第二粘接层为胶水，或者所述第二粘接层包括第二匹配层、以及位于所述第二匹配层两侧的第二胶层。The ultrasonic fingerprint device according to any one of claims 1 to 9, characterized in that the ultrasonic fingerprint device further includes a second adhesive layer, the second adhesive layer is used to connect the spacer layer and the In the display screen, the second adhesive layer is glue, or the second adhesive layer includes a second matching layer and second adhesive layers located on both sides of the second matching layer.
  11. 根据权利要求10所述的超声指纹装置，其特征在于，所述第二匹配层的材料为铜，或者所述第二匹配层的材料为PET；所述第二匹配层的厚度位于5um至15um之间。The ultrasonic fingerprint device according to claim 10, characterized in that the material of the second matching layer is copper, or the material of the second matching layer is PET; the thickness of the second matching layer is between 5um and 15um. between.
  12. 根据权利要求11所述的超声指纹装置，其特征在于，所述第二匹配层的厚度为6um。The ultrasonic fingerprint device according to claim 11, wherein the thickness of the second matching layer is 6um.
  13. 根据权利要求10至12中任一项所述的超声指纹装置，其特征在于，所述第二胶层为丙烯酸。The ultrasonic fingerprint device according to any one of claims 10 to 12, wherein the second glue layer is acrylic.
  14. 根据权利要求1至13中任一项所述的超声指纹装置，其特征在于，所述超声指纹装置还包括补强板，所述超声指纹芯片和所述电路板设置在所述补强板上，所述超声指纹芯片与所述补强板之间通过胶水或者芯片粘接膜DAF连接。The ultrasonic fingerprint device according to any one of claims 1 to 13, characterized in that the ultrasonic fingerprint device further includes a reinforcing plate, and the ultrasonic fingerprint chip and the circuit board are arranged on the reinforcing plate. , the ultrasonic fingerprint chip and the reinforcing plate are connected through glue or chip adhesive film DAF.
  15. 根据权利要求1至14中任一项所述的超声指纹装置，其特征在于，所述超声指纹芯片为互补金属氧化物半导体CMOS芯片。The ultrasonic fingerprint device according to any one of claims 1 to 14, wherein the ultrasonic fingerprint chip is a complementary metal oxide semiconductor CMOS chip.
  16. 根据权利要求1至15中任一项所述的超声指纹装置，其特征在于，所述上电极为通过溅射形成在所述压电层的上表面的金属或者金属混浆涂层，所述下电极为通过溅射或者蒸镀形成在超声指纹芯片的上表面的金属电极阵列，所述金属电极为铝或者金。The ultrasonic fingerprint device according to any one of claims 1 to 15, wherein the upper electrode is a metal or metal slurry coating formed on the upper surface of the piezoelectric layer by sputtering, and the The lower electrode is a metal electrode array formed on the upper surface of the ultrasonic fingerprint chip by sputtering or evaporation. The metal electrode is aluminum or gold.
  17. 根据权利要求1至16中任一项所述的超声指纹装置，其特征在于，所述上电极的表面覆盖有保护层，所述保护层由高分子有机材料或者无机材料形成。The ultrasonic fingerprint device according to any one of claims 1 to 16, characterized in that the surface of the upper electrode is covered with a protective layer, and the protective layer is formed of a polymer organic material or an inorganic material.
  18. 根据权利要求1至17中任一项所述的超声指纹装置，其特征在于，所述超声指纹芯片的表面设置有驱动走线，所述上电极从所述压电层的上表面引出至所述超声指纹芯片的表面，并通过所述驱动走线与所述引线连接。The ultrasonic fingerprint device according to any one of claims 1 to 17, characterized in that the surface of the ultrasonic fingerprint chip is provided with drive wiring, and the upper electrode is led from the upper surface of the piezoelectric layer to the The surface of the ultrasonic fingerprint chip is connected to the lead through the driving wire.
  19. 根据权利要求1至18中任一项所述的超声指纹装置，其特征在于，所述压电层的材料为聚偏二氟乙烯PVDF，或者所述压电层的材料为聚偏二氟乙烯－三氟乙烯共聚物PVDF-TrFE。The ultrasonic fingerprint device according to any one of claims 1 to 18, characterized in that the material of the piezoelectric layer is polyvinylidene fluoride (PVDF), or the material of the piezoelectric layer is polyvinylidene fluoride (PVDF). -Trifluoroethylene copolymer PVDF-TrFE.
  20. 一种电子设备，其特征在于，包括：An electronic device, characterized by including:
    显示屏；display screen;
    根据权利要求1至19中任一项所述的超声指纹装置；以及，The ultrasonic fingerprint device according to any one of claims 1 to 19; and,
    间隔层，设置在所述超声指纹装置与所述显示屏之间。A spacer layer is provided between the ultrasonic fingerprint device and the display screen.
PCT/CN2022/118504 2022-09-13 2022-09-13 Ultrasonic fingerprint apparatus and electronic device WO2024055165A1 (en)

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CN202211210176.0A CN115690861A (en) 2022-09-13 2022-09-30 Ultrasonic fingerprint device and electronic equipment
PCT/CN2022/123095 WO2024055370A1 (en) 2022-09-13 2022-09-30 Ultrasonic fingerprint apparatus and electronic device

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200125815A1 (en) * 2018-10-17 2020-04-23 Qualcomm Incorporated Ultrasonic fingerprint sensor with flexible substrate
CN111144386A (en) * 2020-01-23 2020-05-12 上海思立微电子科技有限公司 Ultrasonic fingerprint detection sensor and fingerprint detection method
CN211349388U (en) * 2019-03-21 2020-08-25 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment
CN112183168A (en) * 2019-07-04 2021-01-05 南昌欧菲生物识别技术有限公司 Fingerprint identification subassembly and electronic equipment
CN113065472A (en) * 2018-12-13 2021-07-02 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment
CN113419645A (en) * 2021-07-15 2021-09-21 业泓科技(成都)有限公司 Ultrasonic fingerprint identification module, electronic equipment and ultrasonic fingerprint identification method
CN114758367A (en) * 2022-04-29 2022-07-15 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9945818B2 (en) * 2014-02-23 2018-04-17 Qualcomm Incorporated Ultrasonic authenticating button
KR102489440B1 (en) * 2017-12-27 2023-01-16 엘지디스플레이 주식회사 Fingerprint sensing display apparatus
CN109948496B (en) * 2019-03-12 2022-07-08 京东方科技集团股份有限公司 Fingerprint identification device and display device
CN109993156B (en) * 2019-04-24 2022-09-06 京东方科技集团股份有限公司 Ultrasonic fingerprint identification panel and display device
CN115551650A (en) * 2020-03-09 2022-12-30 应美盛公司 Ultrasonic fingerprint sensor with contact layer of non-uniform thickness
US20210377670A1 (en) * 2020-05-29 2021-12-02 Qualcomm Incorporated Audio speaker and proximity sensor with piezoelectric polymer technology
CN112541401A (en) * 2020-11-20 2021-03-23 京东方科技集团股份有限公司 Ultrasonic fingerprint identification device, preparation method thereof and display device
CN114708624A (en) * 2022-04-11 2022-07-05 京东方科技集团股份有限公司 Ultrasonic fingerprint identification module, manufacturing method thereof, display panel and display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200125815A1 (en) * 2018-10-17 2020-04-23 Qualcomm Incorporated Ultrasonic fingerprint sensor with flexible substrate
CN113065472A (en) * 2018-12-13 2021-07-02 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment
CN211349388U (en) * 2019-03-21 2020-08-25 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment
CN112183168A (en) * 2019-07-04 2021-01-05 南昌欧菲生物识别技术有限公司 Fingerprint identification subassembly and electronic equipment
CN111144386A (en) * 2020-01-23 2020-05-12 上海思立微电子科技有限公司 Ultrasonic fingerprint detection sensor and fingerprint detection method
CN113419645A (en) * 2021-07-15 2021-09-21 业泓科技(成都)有限公司 Ultrasonic fingerprint identification module, electronic equipment and ultrasonic fingerprint identification method
CN114758367A (en) * 2022-04-29 2022-07-15 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment

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