WO2024042389A1 - Précurseurs durcissables de compositions adhésives structurales comprenant un agent de renforcement auto-polymérisable, et leurs procédés d'utilisation - Google Patents
Précurseurs durcissables de compositions adhésives structurales comprenant un agent de renforcement auto-polymérisable, et leurs procédés d'utilisation Download PDFInfo
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- WO2024042389A1 WO2024042389A1 PCT/IB2023/057326 IB2023057326W WO2024042389A1 WO 2024042389 A1 WO2024042389 A1 WO 2024042389A1 IB 2023057326 W IB2023057326 W IB 2023057326W WO 2024042389 A1 WO2024042389 A1 WO 2024042389A1
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- precursor
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- formula
- curable precursor
- free
- Prior art date
Links
- 239000002243 precursor Substances 0.000 title claims abstract description 158
- 239000012745 toughening agent Substances 0.000 title claims abstract description 73
- 239000000853 adhesive Substances 0.000 title claims abstract description 69
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 69
- 239000000203 mixture Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 73
- 239000003822 epoxy resin Substances 0.000 claims abstract description 51
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 51
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 35
- 239000002954 polymerization reaction product Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000000178 monomer Substances 0.000 claims description 44
- 229910052739 hydrogen Inorganic materials 0.000 claims description 28
- 239000001257 hydrogen Substances 0.000 claims description 28
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 28
- 125000000217 alkyl group Chemical group 0.000 claims description 27
- 229910052760 oxygen Inorganic materials 0.000 claims description 27
- 229910052717 sulfur Inorganic materials 0.000 claims description 27
- 229920000620 organic polymer Polymers 0.000 claims description 25
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 24
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 125000000732 arylene group Chemical group 0.000 claims description 19
- 230000000977 initiatory effect Effects 0.000 claims description 19
- 125000002947 alkylene group Chemical group 0.000 claims description 16
- 125000004474 heteroalkylene group Chemical group 0.000 claims description 13
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 13
- 239000003085 diluting agent Substances 0.000 claims description 12
- 125000000524 functional group Chemical group 0.000 claims description 12
- 229920000768 polyamine Chemical class 0.000 claims description 12
- 125000001302 tertiary amino group Chemical group 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- VILAVOFMIJHSJA-UHFFFAOYSA-N dicarbon monoxide Chemical group [C]=C=O VILAVOFMIJHSJA-UHFFFAOYSA-N 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 9
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical class NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 6
- 239000011258 core-shell material Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000005060 rubber Substances 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 238000001723 curing Methods 0.000 description 50
- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 27
- 238000012360 testing method Methods 0.000 description 24
- -1 n- heptyl Chemical group 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 16
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 239000007870 radical polymerization initiator Substances 0.000 description 10
- 238000001029 thermal curing Methods 0.000 description 10
- 239000003999 initiator Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 230000009477 glass transition Effects 0.000 description 7
- 150000003254 radicals Chemical group 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229930006711 bornane-2,3-dione Natural products 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229920000578 graft copolymer Polymers 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000193 polymethacrylate Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 150000003672 ureas Chemical class 0.000 description 3
- BVQVLAIMHVDZEL-UHFFFAOYSA-N 1-phenyl-1,2-propanedione Chemical compound CC(=O)C(=O)C1=CC=CC=C1 BVQVLAIMHVDZEL-UHFFFAOYSA-N 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 235000013877 carbamide Nutrition 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001429 visible spectrum Methods 0.000 description 2
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- MHINGNWUUYJOSW-UHFFFAOYSA-N 2-chlorobut-1-enylbenzene Chemical compound CCC(Cl)=CC1=CC=CC=C1 MHINGNWUUYJOSW-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- CEBRPXLXYCFYGU-UHFFFAOYSA-N 3-methylbut-1-enylbenzene Chemical compound CC(C)C=CC1=CC=CC=C1 CEBRPXLXYCFYGU-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- IXNDUSYZJBQPJN-UHFFFAOYSA-N C(=O)(C=C)[PH2]=O Chemical compound C(=O)(C=C)[PH2]=O IXNDUSYZJBQPJN-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 241000282485 Vulpes vulpes Species 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical group 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical group C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 125000002362 bornane-2,3-dione group Chemical group 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- LKAVYBZHOYOUSX-UHFFFAOYSA-N buta-1,3-diene;2-methylprop-2-enoic acid;styrene Chemical compound C=CC=C.CC(=C)C(O)=O.C=CC1=CC=CC=C1 LKAVYBZHOYOUSX-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052621 halloysite Inorganic materials 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 150000002462 imidazolines Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229910052628 phlogopite Inorganic materials 0.000 description 1
- 150000003004 phosphinoxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Definitions
- the present disclosure generally relates to curable compositions including toughening agents, cured compositions, and related methods.
- Structural adhesives are known to be useful for bonding one substrate to another, e.g., a metal to a metal, a metal to a plastic, a plastic to a plastic, a glass to a glass.
- Structural adhesives are attractive alternatives to mechanical joining methods, such as riveting or spot welding, because structural adhesives distribute load stresses over larger areas rather than concentrating such stresses at a few points.
- Structural adhesives may also produce cleaner and quieter products because they can dampen vibration and reduce noise. Additionally, structural adhesives can be used to bond a variety of materials, sometimes without extensive surface preparation.
- a curable precursor of a structural adhesive composition comprises: an epoxy resin; a thermally activatable curing agent for the epoxy resin; a first toughening agent; and a second toughening agent comprising a free-radically self-polymerizable material represented by the formula:
- each R 1 is independently selected from a functional group represented by the formula: wherein: each R 2 is independently hydrogen or methyl; n is an integer from 1 to 5, inclusive;
- X is O, S, orNH
- Y is a single bond or a divalent group represented by the formula: Ijl wherein:
- N' is a nitrogen bonded to the carbonyl carbon of R 1 ;
- T is a divalent group selected from the group consisting of a linear alkylene, a cyclic alkylene, an unsubstituted arylene, a substituted arylene, and combinations thereof; q is an integer of at least 2; and
- L is a q-valent organic polymer comprising a monomer unit represented by the formula: wherein R 3 is a hydrogen, a (meth)acrylate group, or a Z-terminated alkyl or heteroalkylene chain, wherein each Z-terminated chain may independently include a linkage selected from the group consisting of a secondary amino linkage, a tertiary amino linkage, an ether linkage, and combinations thereof, and wherein each Z is independently O, S, or NH.
- a partially cured precursor of a structural adhesive composition comprises: an epoxy resin; a thermally activatable curing agent for the epoxy resin; a first toughening agent; and a second toughening agent comprising a self-polymerization reaction product of a free- radically self-polymerizable material represented by the formula:
- each R 1 is independently selected from a functional group represented by the formula: wherein: each R 2 is independently hydrogen or methyl; n is an integer from 1 to 5, inclusive;
- X is O, S, orNH
- Y is a single bond or a divalent group represented by the formula: wherein:
- N' is a nitrogen bonded to the carbonyl carbon of R 1 ;
- T is a divalent group selected from the group consisting of a linear alkylene, a cyclic alkylene, an unsubstituted arylene, a substituted arylene, and combinations thereof; q is an integer of at least 2; and
- L is an q-valent organic polymer comprising a monomer unit selected from the group consisting of monomer units represented by the formula: wherein R 3 is hydrogen, a (meth)acrylate group, or a Z-terminated alkyl or heteroalkylene chain, wherein each Z-terminated chain may independently include a linkage selected from the group consisting of a secondary amino linkage, a tertiary amino linkage, an ether linkage, and combinations thereof, and wherein each Z is independently O, S, or NH.
- a method of manufacturing a structural adhesive article comprises: a) applying a curable precursor according to the first aspect onto a substrate; b) partially curing the curable precursor of step a) by initiating a photoinitiator for the free- radically self-polymerizable material by actinic irradiation, thereby forming a partially cured precursor of a structural adhesive article comprising a polymeric material resulting from the self-polymerization reaction product of the free -radically self-polymerizable material; and c) substantially fully curing the partially cured precursor of a structural adhesive article obtained in step b) by initiating the thermally activatable curing agent for the epoxy resin, thereby obtaining a substantially fully cured structural adhesive article.
- a method of bonding two parts comprises: a) applying a curable precursor according to the first aspect or a partially cured precursor according to the second aspect to a surface of at least one of the two parts; b) joining the two parts so that the curable precursor or the partially cured precursor is positioned between the two parts; and c) substantially fully curing the partially cured precursor of step a) or c) by initiating the thermally activatable curing agent for the epoxy resin, thereby obtaining a substantially fully cured structural adhesive composition and bonding the two parts.
- alkyl refers to a monovalent group that is a radical of an alkane, which is a saturated hydrocarbon.
- the alkyl can be linear, branched, cyclic, or combinations thereof and typically has 1 to 20 carbon atoms.
- alkyl groups include, but are not limited to, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, n-hexyl, cyclohexyl, n- heptyl, n-octyl, and ethylhexyl.
- alkylene refers to a divalent group that is a radical of an alkane.
- the alkylene can be straight-chained, branched, cyclic, or combinations thereof.
- the alkylene typically has 1 to 20 carbon atoms.
- the radical centers of the alkylene can be on the same carbon atom (i.e., an alkylidene) or on different carbon atoms.
- alkoxy refers to a monovalent group of formula -OR where R is an alkyl.
- arylene refers to a polyvalent, aromatic, such as phenylene, naphthalene, and the like.
- heteroalkylene refers to an alkylene having one or more -CH2- groups replaced with a thio, oxy, or -NR b -where R b is hydrogen or alkyl.
- the heteroalkylene can be linear, branched, cyclic, or combinations thereof.
- Exemplary heteroalkylene include alkylene oxides or poly(alkylene oxides). That is, the heteroalkylenes include at least one group of formula -(R-O)- where R is an alkylene.
- (meth)acrylate or “(meth)acrylic acid” is used herein to denote the corresponding acrylate and methacrylate.
- the term “(meth)acrylic acid” covers both methacrylic acid and acrylic acid
- the term “(meth)acrylate” covers both acrylates and methacrylates.
- the (meth)acrylate or the (meth)acrylic acid may consist only of the methacrylate or methacrylic acid, respectively, or may consist only of the acrylate or the acrylic acid, respectively, yet may also relate to a mixture of the respective acrylate and methacrylate (or acrylic acid and methacrylic acid).
- free-radically self-polymerizable compound is meant to refer to a compound able to form a polymeric product (homopolymer) resulting from the free-radically-induced polymerization of the compound almost exclusively with itself, thereby forming a homopolymer.
- radiation exposure is used in the generation of free radicals.
- homopolymer is herein meant to designate polymer(s) resulting exclusively from the polymerization of a single type of monomers.
- the expression “the thermally curable resins are substantially uncured” is meant to designate that less than 10 wt.%, less than 5 wt.%, less than 2 wt.%, or even less than 1 wt.% of the initial curable resins are unreacted.
- glass transition temperature and “Tg” are used interchangeably and refer to the glass transition temperature of a (co)polymeric material or a mixture of monomers and polymers. Unless otherwise indicated, glass transition temperature values are determined by Differential Scanning Calorimetry (DSC).
- phrases “comprises at least one of’ followed by a list refers to comprising any one of the items in the list and any combination of two or more items in the list.
- the phrase “at least one of’ followed by a list refers to any one of the items in the list or any combination of two or more items in the list.
- a and/or B includes, (A and B) and (A or B).
- room temperature refers to a temperature in the range of 20 °C to 25 °C.
- Epoxy adhesives are widely used structural adhesives having not only certain desirable mechanical properties but also a high resistance towards chemicals and aging. However, epoxy adhesives also tend to be rather brittle, which makes it necessary to further toughen them. These toughening agents or tougheners are typically based on the concept of phase separation within the epoxy matrix. Depending on the curing cycle, toughening can be achieved in-situ during a heat cure by using different polarities of polymers for example, or by introduction of separated phases in a form of core-shell rubber particles. For example, block-copolymers with epoxy end groups may be suitable as toughening agents.
- a toughening agent comprising a selfpolymerization reaction product of a free-radically self-polymerizable material represented by the formula LR ' q as described in the present disclosure showed improved impact peel toughness not only at room temperature but also at -30°C. Vehicles (e.g., automobiles) may be used at such low ambient temperatures, thus higher impact peel toughness at low temperatures is desirable. It was further discovered that this increase in impact peel toughness occurs even if the toughening agent is not crosslinked prior to the heat cure of the epoxy adhesive.
- the present disclosure provides a curable precursor of a structural adhesive composition.
- the curable precursor comprises: an epoxy resin; a thermally activatable curing agent for the epoxy resin; a first toughening agent; and a second toughening agent comprising a free-radically self-polymerizable material represented by the formula:
- each R 1 is independently selected from a functional group represented by the formula: wherein: each R 2 is independently hydrogen or methyl; n is an integer from 1 to 5, inclusive;
- X is O, S, orNH
- Y is a single bond or a divalent group represented by the formula: wherein:
- N' is a nitrogen bonded to the carbonyl carbon of R 1 ;
- T is a divalent group selected from the group consisting of a linear alkylene, a cyclic alkylene, an unsubstituted arylene, a substituted arylene, and combinations thereof; q is an integer of at least 2; and L is a q-valent organic polymer comprising a monomer unit represented by the formula: wherein R 3 is a hydrogen, a (meth)acrylate group, or a Z-terminated alkyl or heteroalkylene chain, wherein each Z-terminated chain may independently include a linkage selected from the group consisting of a secondary amino linkage, a tertiary amino linkage, an ether linkage, and combinations thereof, and wherein each Z is independently O, S, or NH.
- Curable precursors of the present disclosure may be prepared by methods known to those of ordinary skill in the relevant arts. Each of the components of the curable precursor of a structural adhesive composition is described in detail below.
- the curable precursor of a structural adhesive contains an epoxy resin.
- Epoxy resins are well known to those skilled in the art of structural adhesive compositions. Suitable epoxy resins for use herein and their methods of manufacturing are amply described for example in EP-A1-2 700 683 (Elgimiabi et al.) and in WO 2017/197087 (Aizawa).
- Exemplary epoxy resins for use herein may be advantageously selected from the group consisting of phenolic epoxy resins, bisphenol epoxy resins, hydrogenated epoxy resins, aliphatic epoxy resins, halogenated bisphenol epoxy resins, novolac epoxy resins, and any mixtures thereof.
- the epoxy resin for use in the present disclosure often comprises glycidyl groups.
- the epoxy resin is selected from the group consisting of novolac epoxy resins, bisphenol epoxy resins, in particular those derived from the reaction of bisphenol-A with epichlorhydrin (DGEBA resins), hydrogenated bisphenol epoxy resins, in particular those derived from the reaction of hydrogenated bisphenol-A with epichlorhydrin (hydrogenated DGEBA resins), and any mixtures thereof.
- novolac epoxy resins bisphenol epoxy resins, in particular those derived from the reaction of bisphenol-A with epichlorhydrin (DGEBA resins), hydrogenated bisphenol epoxy resins, in particular those derived from the reaction of hydrogenated bisphenol-A with epichlorhydrin (hydrogenated DGEBA resins), and any mixtures thereof.
- the curable precursor according to the disclosure comprises from 2 to 50 wt.%, from 2 to 40 wt.%, from 3 to 40 wt.%, from 5 to 30 wt.%, from 10 to 30 wt.%, or even from 15 to 30 wt.%, of the epoxy resin(s), wherein the weight percentages are based on the total weight of the curable precursor.
- Thermally activatable curing agents for the curable precursor of the present disclosure are not particularly limited. Any thermally activatable curing agents for thermally curable epoxy resins commonly known in the art of structural adhesives may be used in the context of the present disclosure. Suitable thermally activatable curing agents for use herein may be easily identified by those skilled in the art in the light of the present disclosure.
- Thermally activatable curing agents for use herein may be selected from the group consisting of rapid-reacting curing initiators, latent curing initiators, and any combinations or mixtures thereof. More typically, the thermal curing initiator for use herein may be selected from the group consisting of rapid-reacting thermally-initiated curing initiators, latent thermally- initiated curing initiators, and any combinations or mixtures thereof.
- Suitable thermally activatable curing agent(s) may be selected from the group consisting of primary amines, secondary amines, and any combinations or mixtures thereof.
- amines for use as a thermally activatable curing agent for the curable precursor are selected from the group consisting of aliphatic amines, cycloaliphatic amines, aromatic amines, aromatic structures having one or more amino moiety, polyamines, polyamine adducts, dicyandiamides, and any combinations or mixtures thereof.
- the thermally activatable curing agent for use herein is selected from the group consisting of dicyandiamide, polyamines, polyamine adducts, and any combinations or mixtures thereof.
- the curing agent of the epoxy resin for use in the present disclosure is selected to be dicyandiamide.
- the curable precursor of the present disclosure further comprises a thermal curing accelerator for the thermally curable epoxy resin.
- a thermal curing accelerator for the thermally curable epoxy resin Any thermal curing accelerators for thermally curable resins commonly known in the art of structural adhesives may be formally used in the context of the present disclosure. Suitable thermal curing initiators for use herein may be easily identified by those skilled in the art in the light of the present disclosure.
- Thermally activatable curing agents and thermal curing accelerators are well known to those skilled in the art of structural adhesive compositions. Suitable thermally activatable curing agents and thermal curing accelerators for use herein and their methods of manufacturing are amply described for example in EP-A1-2 700 683 (Elgimiabi et al.) and in WO 2017/197087 (Aizawa).
- a suitable thermal curing accelerator for use herein is selected from the group consisting of polyamines, polyamine adducts, ureas, substituted urea adducts, imidazoles, imidazole salts, imidazolines, aromatic tertiary amines, and any combinations or mixtures thereof.
- a suitable thermal curing accelerator may be selected from the group of polyamine adducts, substituted ureas, in particular N-substituted urea adducts.
- the curable precursor of the present disclosure comprises a first toughening agent. It is to be understood that the first toughening agent and the second toughening are not the same but rather are different materials from each other.
- the terms “first” and “second” (and optionally “third”, “fourth”, “fifth”, etc.) are used merely to distinguish between different toughening agents.
- First toughening agents which are useful in the present invention are polymeric compounds having both a rubbery phase and a thermoplastic phase such as: graft polymers having a polymerized, diene, rubbery core and a polyacrylate, polymethacrylate shell; graft polymers having a rubbery, polyacrylate core with a polyacrylate or polymethacrylate shell; and elastomeric particles polymerized in situ in the epoxide from free radical polymerizable monomers and a copolymerizable polymeric stabilizer.
- Examples of useful toughening agents of the first type include graft copolymers having a polymerized, diene, rubbery backbone or core to which is grafted a shell of an acrylic acid ester or methacrylic acid ester, monovinyl aromatic hydrocarbon, or a mixture thereof, such as disclosed in U.S. 3,496,250 (Czerwinski), incorporated herein by reference.
- Preferable rubbery backbones comprise polymerized butadiene or a polymerized mixture of butadiene and styrene.
- Preferable shells comprising polymerized methacrylic acid esters are lower alkyl (C1-C4) substituted methacrylates.
- Preferable monovinyl aromatic hydrocarbons are styrene, alphamethylstyrene, vinyltoluene, vinylxylene, ethylvinylbenzene, isopropylstyrene, chlorostyrene, dichlorostyrene, and ethylchlorostyrene.
- acrylate core-shell graft copolymers wherein the core or backbone is a polyacrylate polymer having a glass transition temperature below about 0° C, such as polybutyl acrylate or polyisooctyl acrylate to which is grafted a polymethacrylate polymer (shell) having a glass transition above about 25° C, such as polymethylmethacrylate .
- the third class of toughening agents useful in the curable precursor comprises elastomeric particles that have a glass transition temperature (Tg) below about 25° C before mixing with the other components of the curable precursor.
- Tg glass transition temperature
- These elastomeric particles are polymerized from free radical polymerizable monomers and a copolymerizable polymeric stabilizer that is soluble in the resins.
- the free radical polymerizable monomers are ethylenically unsaturated monomers or diisocyanates combined with coreactive difunctional hydrogen compounds such as diols, diamines, and alkanolamines.
- Useful toughening agents include core/shell polymers such as methacrylate-butadiene- styrene (MBS) copolymer wherein the core is crosslinked styrene/butadiene rubber and the shell is polymethylacrylate (for example, ACRYLOID KM653 and KM680, available from Rohm and Haas, Philadelphia, PA), those having a core comprising polybutadiene and a shell comprising poly(methyl methacrylate) (for example, KANE ACE M511 , M521 , B 11 A, B22, B31 , and M901 available from Kaneka Corporation, Houston, TX and CLEARSTRENGTH C223 available from ATOFINA, Philadelphia, PA), those having a polysiloxane core and a polyacrylate shell (for example, CLEARSTRENGTH S-2001 available from ATOFINA and GENIOPERL P22 available from Wacker-Chemie GmbH, Wacker Silicones, Kunststoff, Germany), those having
- the first toughening agent comprises a core shell rubber.
- the first toughening agent is useful in an amount equal to about 1-50 parts by weight, preferably about 3-25 parts by weight, relative to 100 parts by weight of total polymerizable components (including the epoxy resin) of the curable precursor.
- the curable precursor of the present disclosure comprises a second toughening agent.
- Second toughening agents of the present disclosure comprise a free-radically self-polymerizable material represented by the formula:
- each R 1 is independently selected from a functional group represented by the formula: wherein: each R 2 is independently hydrogen or methyl; n is an integer from 1 to 5, inclusive;
- X is O, S, orNH
- Y is a single bond or a divalent group represented by the formula: Ijl wherein:
- N' is a nitrogen bonded to the carbonyl carbon of R 1 ;
- T is a divalent group selected from the group consisting of a linear alkylene, a cyclic alkylene, an unsubstituted arylene, a substituted arylene, and combinations thereof; q is an integer of at least 2; and
- L is a q-valent organic polymer comprising a monomer unit represented by the formula a): wherein R 3 is a hydrogen, a (meth)acrylate group, or a Z-terminated alkyl or heteroalkylene chain, wherein each Z-terminated chain may independently include a linkage selected from the group consisting of a secondary amino linkage, a tertiary amino linkage, an ether linkage, and combinations thereof, and wherein each Z is independently O, S, or NH.
- R 3 is a (meth)acrylate and is a functional group of R 1 .
- L is a homopolymer as opposed to a block copolymer or a random copolymer.
- a homopolymer would include only one type of monomer unit, e.g., a), b), c), or d) in the polymer chain.
- the q-valent organic polymer L typically comprises 100 wt.% of monomer unit a) monomers.
- Free-radically self-polymerizable materials of the present disclosure represented by the formula LR' q (or L 2 R 1 q , L 3 R 1 q , L 4 R 1 q , etc., described below.) may be prepared by methods known to those of ordinary skill in the relevant arts and by methods as described, for example, in Cooper, S.L. and Guan, J. (Eds) Advances in Polyurethane Biomaterials, Chapter 4, (Elsevier Ltd., 2016) and Lin et al., “UV-curable low-surface-energy fluorinated poly(urethane-acrylates)s for biomedical applications,” European Polymer Journal, Vol. 44, pp. 2927-2937 (2008).
- a crosslinker including monomer units represented by the formulas a) and b) may be prepared by the reaction of polyether polyprimary polyamines, either obtained from 3M Company (St. Paul, MN) under the trade designation DYNAMAR HC-1101 or prepared as described in U.S. Patent 3,436,359 (Hubin et al.), with 2-isocyanatoethyl methacrylate (“IEM”).
- polyether polyprimary polyamines either obtained from 3M Company (St. Paul, MN) under the trade designation DYNAMAR HC-1101 or prepared as described in U.S. Patent 3,436,359 (Hubin et al.), with 2-isocyanatoethyl methacrylate (“IEM”).
- the q-valent organic polymer L has a number average molecular weight of from 4000 to 54000 grams per mole versus a polystyrene standard.
- Curable precursors of the present disclosure generally include 2 wt.% or greater of the free-radically self-polymerizable materials described herein, based on the total weight of the curable precursor, 2.25 wt.%, 2.5 wt.%, 2.75 wt.%, 3 wt.%, 3.25 wt.%, 3.5 wt.%, 3.75 wt.%, 4 wt.%, 4.5 wt.%, or 5 wt.% or greater; and 10 wt.% or less, 9 wt.%, 8 wt.%, 7 wt.%, 6 wt.%, or 5 wt.% or less of the free-radically self-polymerizable materials described herein, based on the total weight of the curable precursor.
- the curable precursor according to the present disclosure optionally further comprises additional components, such as a photoinitiator, a reactive diluent, at least one additional toughening agent, and/or conventional additives.
- Additives may include, for example, tackifiers, plasticizers, dyes, pigments, antioxidants, UV stabilizers, corrosion inhibitors, dispersing agents, wetting agents, adhesion promotors, and fillers.
- Fillers useful in embodiments of the present disclosure include, for example, fillers selected from the group consisting of a micro-fibrillated polyethylene, a fumed silica, a talc, a wollastonite, an aluminosilicate clay (e.g., halloysite), phlogopite mica, calcium carbonate, kaolin clay, metal oxides (e.g., barium oxide, calcium oxide, magnesium oxide, zirconium oxide, titanium oxide, zinc oxide), nanoparticle fillers (e.g. nanosilica, nanozirconia), and combinations thereof.
- fillers selected from the group consisting of a micro-fibrillated polyethylene, a fumed silica, a talc, a wollastonite, an aluminosilicate clay (e.g., halloysite), phlogopite mica, calcium carbonate, kaolin clay, metal oxides (e.g., barium oxide, calcium oxide, magnesium oxide, zi
- Suitable photoinitiators include for instance a free-radical polymerization initiator for the free-radically self-polymerizable second toughening agent, which may be activated by visible light.
- Free-radical polymerization initiators for the free-radically self-polymerizable second toughening agent are not particularly limited, as long as they may be activated by visible light. Suitable compounds for use herein may be easily identified by those skilled in the art in the light of the present disclosure.
- the photoinitiator is activated by light having wavelengths of at least 350 nm. Also, it is preferred that the photoinitiator is activated by light having wavelengths of up to 750 nm. Accordingly, it is preferred that the photoinitiator is activated by light having wavelengths in the range of from 350 nm to 750 nm, preferably from 380 to 700 nm, more preferably from 400 to 650 nm.
- the photoinitiator may be activated by light having wavelengths in the range of from 380 to 450 nm, and/or from 450 to 485 nm, and/or from 485 to 500 nm, and/or 500 to 565 nm, and/or from 565 to 590 nm, and/or from 590 to 625 nm, and/or from 625 to 700 nm.
- Particularly preferred herein is blue light, i.e., light having wavelengths from 450 to 485 nm.
- the photoinitiator may be activated by light having wavelengths in the range of from (i) 450 to 485 nm, and optionally (ii) from 380 to 450 nm, from 485 to 500 nm, 500 to 565 nm, from 565 to 590 nm, from 590 to 625 nm, and/or from 625 to 700 nm.
- light having wavelengths in the range of from (i) 450 to 485 nm, and optionally (ii) from 380 to 450 nm, from 485 to 500 nm, 500 to 565 nm, from 565 to 590 nm, from 590 to 625 nm, and/or from 625 to 700 nm.
- other wavelengths of the visible spectrum of light may be utilized.
- the photoinitiator of the free -radically self- polymerizable second toughening agent is selected from the group consisting of Norrish type (I) free-radical polymerization initiators, Norrish type (II) free-radical polymerization initiators, and any combinations or mixtures thereof.
- the photoinitiator of the free -radically self-polymerizable second toughening agent is selected from the group consisting of Norrish type (I) free-radical polymerization initiators, and any combinations or mixtures thereof.
- the free-radical polymerization initiator of the free-radically self-polymerizable second toughening agent is selected from alphadiketones and/or phosphinoxides, preferably from camphorquinone, acylphosphinoxide, phenyl- propane-dione, acrylphosphinoxide, dibenzoyl, 1 -phenyl- 1,2-propandione, and any mixtures and combinations thereof.
- the photoinitiator is preferably camphorquinone.
- the curable precursor of the disclosure comprises no greater than 10 wt.%, no greater than 8 wt.%, no greater than 6 wt.%, no greater than 5 wt.%, no greater than 4 wt.%, no greater than 2 wt.%, no greater than 1 wt.%, no greater than 0.8 wt.%, no greater than 0.6 wt.%, no greater than 0.5 wt.%, no greater than 0.4 wt.%, no greater than 0.2 wt.%, or even no greater than 0.1 wt.%, of the photoinitiator of the free-radically self-polymerizable second toughening agent, wherein the weight percentages are based on the total weight of the curable precursor.
- the curable precursor of the disclosure comprises from 0.01 to 10 wt.%, from 0.01 to 8 wt.%, from 0.02 to 6 wt.%, from 0.02 to 5 wt.%, from 0.02 to 4 wt.%, from 0.03 to 3 wt.%, from 0.03 to 2 wt.%, from 0.03 to 1.8 wt.%, from 0.03 to 1.6 wt.%, from 0.03 to 1.5 wt.%, from 0.03 to 1.4 wt.%, or even from 0.03 to 1 wt.%, of the photoinitiator of the free- radically self-polymerizable second toughening agent, wherein the weight percentages are based on the total weight of the curable precursor.
- At least one reactive diluent may be better dissolved in such a reactive diluent than in the epoxy resin. Accordingly, it is preferred that any optional free-radical polymerization initiators are dissolved in an at least one reactive diluent before mixing with the other constituents of the curable precursor according to the present disclosure.
- Reactive diluents are known to the skilled person generally from the technical field of structural adhesives, in particular epoxy-resin based structural adhesives.
- the at least one reactive diluent is selected from glycidyl ethers of linear or branched alkanol, preferably from diglycidyl ethers of linear or branched alkyldiols.
- the curable precursor contains at least one more toughening agent (e.g., a third toughening agent, a fourth toughening agent, etc.).
- an additional toughening agent may comprise a free-radically self-polymerizable material represented by the formula L ⁇ q, wherein R’ q is the same as in LR' C
- an additional toughening agent comprises a free-radically self- polymerizable material represented by the formula L 3 R 1 q , wherein R’ q is the same as in LR' q described in detail above and L 3 is a q-valent organic polymer L 3 comprising a monomer unit c) represented by the formula: wherein n is an integer from 1 to 5, inclusive, each R 4 is independently hydrogen or alkyl, and each Z is independently O, S, orNH.
- an additional toughening agent comprises a free-radically self- polymerizable material represented by the formula L 4 R 1 q , wherein R' q is the same as in LR' q described in detail above and L 4 is a q-valent organic polymer L 4 comprising a monomer unit d) represented by the formula: wherein R 6 is hydrogen, a monomer unit selected from the group consisting of monomer units a) - c) or a Z-terminated alkyl chain, wherein the Z-terminated alkyl chain may include a linkage selected from the group consisting of a secondary amino linkage, a tertiary amino linkage, an ether linkage, and combinations thereof, and wherein Z is O, S, or NH, where it is understood that monomer units of formula d) are not located at a terminus of L if they are present.
- the present disclosure provides a partially cured precursor of a structural adhesive composition.
- the partially cured precursor comprises: an epoxy resin; a thermally activatable curing agent for the epoxy resin; a first toughening agent; and a second toughening agent comprising a self-polymerization reaction product of a free- radically self-polymerizable material represented by the formula:
- each R 1 is independently selected from a functional group represented by the formula: wherein: each R 2 is independently hydrogen or methyl; n is an integer from 1 to 5, inclusive;
- X is O, S, orNH
- Y is a single bond or a divalent group represented by the formula: wherein: N' is a nitrogen bonded to the carbonyl carbon of R 1 ;
- T is a divalent group selected from the group consisting of a linear alkylene, a cyclic alkylene, an unsubstituted arylene, a substituted arylene, and combinations thereof; q is an integer of at least 2; and
- L is an q-valent organic polymer comprising a monomer unit selected from the group consisting of monomer units represented by the formula: wherein R 3 is hydrogen, a (meth)acrylate group, or a Z-terminated alkyl or heteroalkylene chain, wherein each Z-terminated chain may independently include a linkage selected from the group consisting of a secondary amino linkage, a tertiary amino linkage, an ether linkage, and combinations thereof, and wherein each Z is independently O, S, or NH.
- the partially cured precursor differs from the curable precursor of the first aspect described in detail above in that the second toughening agent comprises a self-polymerization reaction product of the free -radically self-polymerizable material.
- the free -radically self- polymerizable material has been polymerized instead of being self-polymerizable.
- the selfpolymerization reaction product of the free-radically self-polymerizable material may be formed by exposing the curable precursor to actinic radiation (e.g., UV radiation, visible radiation, e-beam radiation, or any combination thereof) and/or heat.
- the partially cured precursor further comprises residual photoinitiator for the second toughening agent.
- Such residual photoinitiator is what portion of the photoinitiator included in the curable precursor that remains following exposure of the curable precursor to actinic radiation.
- the components of the partially cured precursor i.e., epoxy resin, thermally activatable curing agent, first toughening agent, second toughening agent, and optional component(s)
- the components of the partially cured precursor i.e., epoxy resin, thermally activatable curing agent, first toughening agent, second toughening agent, and optional component(s)
- the polymeric material comprising the self-polymerization reaction product of the free-radically self-polymerizable material is substantially fully polymerized and has in particular a degree of polymerization of more than 90%, more than 95%, more than 98%, or even more than 99%.
- this polymerization reaction has advantageously a fixed and irreversible end and will not trigger any shelf-life reducing reactions in the remainder of the curable precursor. This characteristic is believed to beneficially impact the overall shelf-life of the curable precursor.
- the partially cured precursor according to the disclosure has a glass transition temperature (Tg) no greater than 0°C, no greater than -5°C, no greater than -10°C, no greater than -15°C, or even no greater than -20°C, when measured by DSC.
- Tg glass transition temperature
- the partially cured precursor has an elongation at break of at least 50%, at least 80%, at least 100%, at least 150%, or even at least 200%, when measured according to tensile test DIN EN ISO 527.
- DIN EN ISO 527 This particular property makes the partially cured precursor and the resulting structural adhesive suitable for automated handling and application, in particular by high-speed robotic equipment. More particularly, the partially cured precursor and the resulting structural adhesive of the present disclosure enables efficient automation of the process of forming a metal joint between metal plates.
- a method of manufacturing a structural adhesive article comprises: a) applying a curable precursor according to the first aspect onto a substrate; b) partially curing the curable precursor of step a) by initiating a photoinitiator for the free- radically self-polymerizable material by actinic irradiation, thereby forming a partially cured precursor of a structural adhesive article comprising a polymeric material resulting from the selfpolymerization reaction product of the free-radically self-polymerizable material; and c) substantially fully curing the partially cured precursor of a structural adhesive article obtained in step b) by initiating the thermally activatable curing agent for the epoxy resin, thereby obtaining a substantially fully cured structural adhesive article.
- the curable precursor is as described in detail above with respect to the first aspect, including any of the various embodiments described therein.
- the curable precursor is particularly suitable to perform an overall curing mechanism involving a two-stage reaction whereby two polymer networks are formed sequentially.
- the free-radically self-polymerizable material selfpolymerizes upon initiation by the free-radical polymerization initiator for the free-radically self- polymerizable material, thereby forming a polymeric material comprising the self-polymerization reaction product of a polymerizable material comprising the self-polymerizable material.
- the temperature T1 at which the free-radical polymerization initiator for the free- radically self-polymerizable multi-functional compound is initiated is insufficient to cause initiation of the thermally activatable curing agent of the thermally curable resin (i.e., the epoxy resin and any other curable materials, e.g., reactive diluent(s)).
- the first stage reaction typically results in a partially cured precursor, wherein the thermally curable resin(s) are substantially uncured and are in particular embedded into the polymeric material comprising the self-polymerization reaction product of the polymerizable material comprising the self- polymerizable material.
- the first stage reaction which typically leads to a phase change of the initial curable precursor due in particular to the polymeric material comprising the self-polymerization reaction product of the self-polymerizable material providing structural integrity to the initial curable precursor, is typically referred to as a film-forming reaction.
- the first stage reaction does typically not require any substantial energy input.
- the photoinitiator may be initiated by exposure to actinic radiation, such as by light having wavelengths in the range of from 350 nm to 750 nm as described in detail above with respect to suitable photoinitiators for the curable precursor. It is particularly advantageous when light of the visible spectrum of the light, in particular blue light, is used to activate the free-radical polymerization initiator, when compared to UV-light activation commonly utilized for initiating cure of adhesive in industrial applications. Not only is the penetration of visible light, in particular blue light, higher, the reaction tends to proceed much faster than with UV-A-light. While the former has the advantage that thicker films may be generated, the latter has the advantage that films may be generally manufactured faster. Also, EHS concerns using UV light at manufacturing sites may be avoided.
- the partially cured precursor may typically take the form of a film-like self-supporting composition or a multi-dimensional object having a dimensional stability, which makes it possible for it to be pre-applied on a selected substrate, in particular a liner, until further processing.
- the method above further comprises removing the partially cured precursor of a structural adhesive article obtained in step b) or the substantially fully cured structural adhesive article obtained in step c) from the substrate.
- the partially cured precursor is typically provided with excellent characteristics and performance as to elasticity, tackiness, cold-flow and surface wetting.
- the free -radically self- polymerizable material of the second toughening agent is believed to play a critical role in obtaining the advantageous properties of the partially cured precursor as described above.
- the partially cured precursor may be appropriately shaped to fulfil the requirements of any specific applications.
- the second stage reaction occurs after the first stage reaction and involves thermally curing the thermally curable resin(s) (i.e., the epoxy resin and any other curable materials, e.g., reactive diluent(s)) upon thermal initiation by the appropriate thermally activatable curing agent at a temperature T2 which is typically greater than the temperature T1.
- This reaction step typically results in forming a polymeric product resulting from the thermal curing of the thermally curable resin(s), in particular from the (co)polymerization of the thermally curable resin(s) and the thermally activatable curing agents of the thermally curable resin(s).
- the expression “substantially fully curing the curable precursor” or “substantially fully curing the partially cured precursor” is meant to express that more than 90 wt.%, more than 95 wt.%, more than 98 wt.%, or even more than 99 wt.% of the overall amount of the thermally curable resin(s) and the free -radically self-polymerizable material are polymerized/cured as the result of the polymerization/curing step(s).
- the curable precursor of the present disclosure typically relies on the above-described dual/hybrid curing system involving two independent reactive systems activated with distinct triggering steps to ensure performing the above-described two-stage reaction in a sequential manner.
- the curable precursor of the present disclosure may be partially cured (or pre-cured) and pre-applied on a selected substrate before being finally cured in-place to produce a structural adhesive provided with excellent characteristics directly on the desired substrate or article.
- the curable precursor or the partially or fully cured structural adhesive composition of the present disclosure is shaped in the form of an elongated film.
- the elongated film shape is one conventional and convenient shape for the structural adhesive to be pre-applied on a selected substrate, in particular a liner, until further processing.
- the elongated film for use herein has a thickness greater than 500 micrometers, greater than 600 micrometers, greater than 700 micrometers, greater than 800 micrometers, greater than 900 micrometers, or even greater than 1000 micrometers.
- the elongated film for use herein has a thickness no greater than 500 micrometers, no greater than 400 micrometers, no greater than 300 micrometers, no greater than 200 micrometers, no greater than 100 micrometers, or even greater than 50 micrometers.
- the elongated film shape may be convenient in many different applications, this specific shape is not always satisfactory for adhesively bond assemblies provided with complex three-dimensional configurations or topologies, in particular when provided with challenging bonding areas or surfaces.
- the curable precursor or the partially or fully cured (hybrid) structural adhesive composition of the disclosure may - in another aspect - be shaped in the form of a three- dimensional object.
- Suitable three-dimensional object shapes for use herein will broadly vary depending on the targeted bonding application and the specific configuration of the assembly to bond, in particular the bonding area. Exemplary three-dimensional object shapes for use herein will be easily identified by those skilled in the art in the light of the present disclosure.
- the three-dimensional object has a shape selected from the group consisting of circular, semi-circular, ellipsoidal, square, rectangular, triangular, trapezoidal, polygonal shape, or any combinations thereof.
- the shape of the three-dimensional object is herein meant to refer to the shape of the section of the three-dimensional object according to a direction substantially perpendicular to the greatest dimension of the three-dimensional object.
- the present disclosure relates to a composite article comprising a curable precursor or a partially or fully cured (hybrid) structural adhesive composition as described above applied on at least part of the surface of the article.
- Suitable surfaces and articles for use herein are not particularly limited. Any surfaces, articles, substrates and material commonly known to be suitable for use in combination with structural adhesive compositions may be used in the context of the present disclosure.
- the article for use herein comprises at least one part, in particular a metal or a composite material part.
- the composite article according to the disclosure is used for body-in-white bonding applications for the automotive industry, in particular for hem flange bonding of parts, more in particular metal or composite material parts; and for structural bonding operations for the aeronautic and aerospace industries.
- a method of bonding two parts comprises: a) applying a curable precursor according to the first aspect or a partially cured precursor according to the second aspect to a surface of at least one of the two parts; b) joining the two parts so that the curable precursor or the partially cured precursor is positioned between the two parts; and c) substantially fully curing the partially cured precursor of step a) by initiating the thermally activatable curing agent for the epoxy resin, thereby obtaining a substantially fully cured structural adhesive composition and bonding the two parts.
- the two parts are metal parts.
- the method of bonding two parts is for hem flange bonding of metal parts, wherein:
- the partially cured precursor is shaped in the form of an elongated film
- the partially cured precursor film has a first portion near a first end of the precursor film and a second portion near the second end opposite to the first end of the precursor film;
- the first metal part comprises a first metal panel having a first body portion and a first flange portion along a margin of the first body portion adjacent a first end of the first body portion;
- the second metal part comprises a second metal panel having a second body portion and a second flange portion along a margin of the second body portion adjacent a second end of the second body portion; wherein the method comprises the steps of: a) adhering the partially cured precursor film to the first metal panel or second metal panel, whereby following adhering and folding, a metal joint is obtained wherein the partially cured precursor film is folded such that: i. the first portion of the partially cured precursor film is provided between the second flange of the second metal panel and the first body portion of the first metal panel, and ii.
- the second portion of the partially cured precursor film is provided between the first flange of the first metal panel and the second body portion of the second metal panel; and b) substantially fully curing the partially cured precursor by initiating the thermal curing initiator for the thermally curable resin, thereby obtaining a substantially fully cured (hybrid) structural adhesive composition and bonding the metal joint.
- a side of a first edge portion of the first metal part is folded back and a hem flange structure is formed so as to sandwich the second metal part, and the curable precursor or the partially cured precursor as described above is disposed so as to adhere at least the first edge portion of the first metal part and a first surface side of the second metal part to each other.
- the substrates, parts and surfaces for use in these methods comprise a metal selected from the group consisting of aluminum, steel, iron, and any mixtures, combinations or alloys thereof. More advantageously, the substrates, parts and surfaces for use herein comprise a metal selected from the group consisting of aluminum, steel, stainless steel and any mixtures, combinations or alloys thereof. In a particularly advantageous execution of the present disclosure, the substrates, parts and surfaces for use herein comprise aluminum. It has yet surprisingly been discovered that, in some executions, the curable precursor as described above is suitable for manufacturing structural adhesive compositions provided with excellent characteristics and performance as to adhesion to oily contaminated substrates, such as stainless steel and aluminum.
- a curable precursor of a structural adhesive composition comprises an epoxy resin; a thermally activatable curing agent for the epoxy resin; a first toughening agent; and a second toughening agent comprising a free-radically self- polymerizable material represented by the formula: L ' C
- a curable precursor according to the second embodiment wherein the at least one reactive diluent comprises a glycidyl ether of a linear or branched alkanol.
- a curable precursor according to any of the first through third embodiments further comprising a photoinitiator activated by light having wavelengths in a range of from 350 nm to 750 nm.
- a curable precursor according to any of the first through fourth embodiments, wherein the first toughening agent comprises a core shell rubber.
- thermoly activatable curing agent for the epoxy resin is selected from the group consisting of dicyandiamide, polyamines, polyamine adducts, and any combination thereof.
- a seventh embodiment is provided a curable precursor according to any of the first through sixth embodiments, wherein the q-valent organic polymer L has a number average molecular weight of from 4000 to 54000 grams per mole versus a polystyrene standard.
- a curable precursor according to any of the first through seventh embodiments further comprising a third toughening agent comprising a free- radically self-polymerizable material represented by the formula L 2 R 1 q , wherein R’ q is the same as in LR ’q and L 2 is a q-valent organic polymer L 2 comprising a monomer unit b) represented by the formula: wherein n is an integer from 1 to 5, inclusive, each R 4 is independently hydrogen or an alkyl, and each Z is independently O, S, or NH.
- a third toughening agent comprising a free- radically self-polymerizable material represented by the formula L 2 R 1 q , wherein R’ q is the same as in LR ’q and L 2 is a q-valent organic polymer L 2 comprising a monomer unit b) represented by the formula: wherein n is an integer from 1 to 5, inclusive, each R 4 is independently hydrogen or an alkyl, and each Z is independently O, S,
- a curable precursor according to any of the first through eighth embodiments further comprising a fourth toughening agent comprising a free-radically self-polymerizable material represented by the formula L 3 R 1 q , wherein R' q is the same as in LR' q and L 3 is a q-valent organic polymer L 3 comprising a monomer unit c) represented by the formula: wherein n is an integer from 1 to 5, inclusive, each R 4 is independently hydrogen or an alkyl, and each Z is independently O, S, or NH.
- a fourth toughening agent comprising a free-radically self-polymerizable material represented by the formula L 3 R 1 q , wherein R' q is the same as in LR' q and L 3 is a q-valent organic polymer L 3 comprising a monomer unit c) represented by the formula: wherein n is an integer from 1 to 5, inclusive, each R 4 is independently hydrogen or an alkyl, and each Z is independently O, S, or
- a curable precursor according to any of the first through ninth embodiments, further comprising a fifth toughening agent comprising a free-radically self- polymerizable material represented by the formula L 4 R 1 q , wherein R’ q is the same as in LR' C
- a fifth toughening agent comprising a free-radically self- polymerizable material represented by the formula L 4 R 1 q , wherein R’ q is the same as in LR'
- a curable precursor according to any of the first through tenth embodiments, wherein R 3 is a (meth)acrylate and is a functional group of R 1 .
- a curable precursor according to any of the first through eleventh embodiments, wherein the q-valent organic polymer L comprises 100 wt.% of monomer unit a) monomers.
- a curable precursor according to any of the first through twelfth embodiments wherein the second toughener is present in an amount of up to 10 wt.%, based on the total weight of the curable precursor.
- a fourteenth embodiment is provided a partially cured precursor of a structural adhesive composition.
- the partially cured precursor comprises an epoxy resin; a thermally activatable curing agent for the epoxy resin; a first toughening agent; and a second toughening agent comprising a self-polymerization reaction product of a free-radically self-polymerizable material represented by the formula: LR' C
- a fifteenth embodiment is provided a partially cured precursor according to the fourteenth embodiment, further comprising residual photoinitiator for the second toughening agent.
- a method of manufacturing a structural adhesive article comprises a) applying a curable precursor according to any of the first through thirteenth embodiments onto a substrate; b) partially curing the curable precursor of step a) by initiating a photoinitiator for the free-radically self-polymerizable material by actinic irradiation, thereby forming a partially cured precursor of a structural adhesive article comprising a polymeric material resulting from the self-polymerization reaction product of the free-radically self-polymerizable material; and c) substantially fully curing the partially cured precursor of a structural adhesive article obtained in step b) by initiating the thermally activatable curing agent for the epoxy resin, thereby obtaining a substantially fully cured structural adhesive article.
- a seventeenth embodiment is provided a method according to the sixteenth embodiment, further comprising removing the partially cured precursor of a structural adhesive article obtained in step b) or the substantially fully cured structural adhesive article obtained in step c) from the substrate.
- a method of bonding two parts comprises a) applying a curable precursor or a partially cured precursor according to any of the first through fifteenth embodiments to a surface of at least one of the two parts; b) joining the two parts so that the curable precursor or the partially cured precursor is positioned between the two parts; and c) substantially fully curing the partially cured precursor of step a) by initiating the thermally activatable curing agent for the epoxy resin, thereby obtaining a substantially fully cured structural adhesive composition and bonding the two parts.
- a method according to the eighteenth embodiment further comprising, prior to step c), partially curing the curable precursor of step a) by initiating a photoinitiator for the free -radically self-polymerizable material by actinic irradiation, thereby forming a partially cured precursor of a structural adhesive article comprising a polymeric material resulting from the self-polymerization reaction product of the free-radically self-polymerizable material.
- KaneAce MX 153, KaneAce MX 257, Epikote 1001 and KaneAce B 564 were placed in a beaker, which was placed in a high-speed mixer (DAC 150.1 FVZ Speedmixer, Hauschild Engineering, Germany) at 3500 rpm for 5 minutes. The mixture was allowed to cool down and the process was repeated several times until the solid parts were thoroughly homogenously mixed in. Then, Epikote 828 as well as ipox RD24 were added to the mixture and mixed in at 3500 rpm for 1 minute.
- DAC 150.1 FVZ Speedmixer Hauschild Engineering, Germany
- a toughening agent comprising a free-radically self-polymerizable material as specified in Table 1, which in some cases had to be heated up to 80°C to liquify, was mixed in, followed by dicyandiamide (DICY) and finally camphorquinone.
- DIX dicyandiamide
- camphorquinone The mixture was kept dark from there on to avoid premature cure of the B -stage or quenching of the camphorquinone.
- the material was extruded in shape of a film of 0.3 mm thickness between two sheets of PET Silphan liner by using a knife-coater.
- the extruded film was irradiated with a blue light LED array (10 cm x 10 cm; 460 nm; commercially available from Dr. Gobel Opsitec) for 30 s until the B-stage reaction was complete.
- OLS, T-peel and impact peel samples were cleaned with n-heptane and coated with 3 g/m 2 of the testing oil (PL 3802-39S commercially available from Fuchs Petrolub AG, Germany).
- the test samples were left at ambient room temperature (23°C +/- 2°C, 50% relative humidity +/-5%) for 24 hours prior to testing and the OLS, T-peel and impact peel strengths were measured as described below.
- Overlap shear strength was determined according to DIN EN 1465 using a Zwick Z050 tensile tester (commercially available by Zwick GmbH & Co. KG, Ulm, Germany) operating at a cross head speed of 10 mm/min.
- a Zwick Z050 tensile tester commercially available by Zwick GmbH & Co. KG, Ulm, Germany
- For the preparation of an Overlap Shear Strength test assembly the extruded film resulting from blue light irradiation was cut into a rectangular shape and applied onto one surface of a test panel to give a defined layer having a thickness of 0.3 mm. The sample was then covered by a second steel strip forming an overlap joint of 13 mm. The overlap joints were then clamped together using two binder clips and the test assemblies were further stored at room temperature for 4 hours after bonding, and then placed into an air circulating oven for 30 minutes at 180 °C. The next day, the samples were tested. Five samples were measured for each of the examples and results averaged and reported in Megapascal (
- T-Peel strength was determined according to DIN EN ISO 11339 using a Zwick Z050 tensile tester (commercially available by Zwick GmbH & Co. KG, Ulm, Germany) operating at a cross head speed of 100 mm/min.
- a Zwick Z050 tensile tester commercially available by Zwick GmbH & Co. KG, Ulm, Germany
- the second test panel surface was then bonded to the first forming an overlap joint of 100 mm.
- the samples were fixed together with clamps and first stored at room temperature for 12 hours, and then placed into an air circulating oven for 30 minutes at 180 °C. The next day, the samples were tested. Three samples were measured for each of the examples and results averaged and reported in Newton (N).
- Impact peel performance was determined according to DIN EN ISO 11343 using a Zwick HIT450P pendulum test machine (commercially available by Zwick GmbH & Co. KG, Ulm, Germany).
- the extruded film resulting from blue light irradiation was cut into a rectangular shape and applied onto one surface of a test panel to give a defined layer having a thickness of 0.3 mm.
- the second test panel surface was then bonded to the first forming a bonded joint of 30 mm.
- the samples were fixed together with clamps and first stored at room temperature for 12 hours, and then placed into an air circulating oven for 30 minutes at 180 °C. The next day, the samples were tested.
- the substrates were bonded over a length of 30 mm and the free arms of the specimen were clamped. A wedge was drawn through the bonded portion of the specimen with a test rate of 2 m/s. The result was averaged and reported in N/mm indicating the adhesive resistance to crack growth influence of different temperatures. Per test ten samples were prepared; five of which were tested at room temperature, five at -30°C. Test results for the formulations are shown in Table 2.
- the structural adhesives according to the present disclosure provide improved impact peel strength performance on oily contaminated substrates when compared to the comparative examples formulated without the second toughening agent comprising a free-radically self-polymerizable material. This improvement can be especially seen when testing at low temperatures (-30°C), where the examples show only a slight drop in performance compared to testing at room temperature.
- comparative examples 1 and 4 (not comprising any photoinitiated self-polymerizable monomer or any polymerization initiator thereof) expectedly show a significant loss of impact peel strength on oily contaminated substrates when the test is performed at low temperature and compared to the value at room temperature.
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Abstract
La présente invention concerne des précurseurs durcissables de compositions adhésives structurales comprenant une résine époxy, un agent de durcissement pouvant être activé thermiquement et des agents de renforcement. L'un des agents de renforcement comprend un matériau auto-polymérisable par voie radicalaire. L'invention concerne en outre des précurseurs partiellement durcis dans lesquels l'agent de renforcement comprend un produit de réaction d'auto-polymérisation radicalaire du matériau auto-polymérisable. L'invention concerne en outre des procédés de fabrication d'un article adhésif structural et de liaison de deux pièces l'une à l'autre.
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US3436359A (en) | 1965-10-14 | 1969-04-01 | Minnesota Mining & Mfg | Polyether polyprimary polyamines and elastomeric products thereof |
US3496250A (en) | 1967-02-21 | 1970-02-17 | Borg Warner | Blends of epoxy resins and acrylonitrile butadiene-styrene graft copolymers |
EP2700683A1 (fr) | 2012-08-23 | 2014-02-26 | 3M Innovative Properties Company | Film adhésif structurel |
WO2017197087A1 (fr) | 2016-05-12 | 2017-11-16 | 3M Innovative Properties Company | Film adhésif structural, ensemble d'éléments métalliques et procédé pour les fabriquer |
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US3436359A (en) | 1965-10-14 | 1969-04-01 | Minnesota Mining & Mfg | Polyether polyprimary polyamines and elastomeric products thereof |
US3496250A (en) | 1967-02-21 | 1970-02-17 | Borg Warner | Blends of epoxy resins and acrylonitrile butadiene-styrene graft copolymers |
EP2700683A1 (fr) | 2012-08-23 | 2014-02-26 | 3M Innovative Properties Company | Film adhésif structurel |
WO2017197087A1 (fr) | 2016-05-12 | 2017-11-16 | 3M Innovative Properties Company | Film adhésif structural, ensemble d'éléments métalliques et procédé pour les fabriquer |
WO2020250154A1 (fr) * | 2019-06-13 | 2020-12-17 | 3M Innovative Properties Company | Agents de réticulation et compositions durcissables les comprenant |
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