WO2024038537A1 - Light source unit, illumination unit, exposure device, and exposure method - Google Patents

Light source unit, illumination unit, exposure device, and exposure method Download PDF

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Publication number
WO2024038537A1
WO2024038537A1 PCT/JP2022/031212 JP2022031212W WO2024038537A1 WO 2024038537 A1 WO2024038537 A1 WO 2024038537A1 JP 2022031212 W JP2022031212 W JP 2022031212W WO 2024038537 A1 WO2024038537 A1 WO 2024038537A1
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WIPO (PCT)
Prior art keywords
light source
substrate
source unit
heat sink
unit according
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PCT/JP2022/031212
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French (fr)
Japanese (ja)
Inventor
吉田亮平
鈴木智也
櫻井友紀也
犬童真成
Original Assignee
株式会社ニコン
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Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to PCT/JP2022/031212 priority Critical patent/WO2024038537A1/en
Publication of WO2024038537A1 publication Critical patent/WO2024038537A1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Definitions

  • It relates to a light source unit, a lighting unit, an exposure device, and an exposure method.
  • liquid crystal display panels have been widely used as display elements for personal computers, televisions, etc.
  • a liquid crystal display panel is manufactured by forming a circuit pattern of thin film transistors on a plate (glass substrate) using a photolithography method.
  • an exposure apparatus is used that projects and exposes an original pattern formed on a mask onto a photoresist layer on a plate via a projection optical system.
  • the light source unit includes a substrate having a first surface and a second surface facing each other, and a plurality of light source elements two-dimensionally arranged on the first surface of the substrate.
  • a heat sink the substrate has at least one recess formed in a portion of the second surface that faces the range in which the plurality of light source elements are arranged in a plan view
  • the heat sink includes: The substrate has a through hole, and the substrate and the heat sink are fixed by a fixing member that is inserted through the through hole and fitted into the recess.
  • the illumination unit includes the light source unit and an illumination optical system that guides the light emitted from the light source unit to the irradiated object.
  • the illumination unit includes a plurality of the above-mentioned light source units and a combining optical element that combines the light emitted from the plurality of light source units, and the combined light emitted from the combining optical element.
  • an illumination optical system that guides the light to the irradiated object.
  • an exposure apparatus includes the illumination unit described above and a projection optical system that projects a pattern image of a mask illuminated by the illumination unit onto a photosensitive substrate.
  • an exposure method is an exposure method using the above-mentioned exposure apparatus, comprising illuminating a mask with the illumination unit and projecting a pattern image of the mask using the projection optical system. and projecting onto a photosensitive substrate.
  • configurations of the embodiments described below may be modified as appropriate, and at least a portion thereof may be replaced with other components.
  • the configuration elements whose arrangement is not particularly limited are not limited to the arrangement disclosed in the embodiments, but can be arranged at a position where the function can be achieved.
  • FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus according to an embodiment.
  • FIG. 2 is a schematic diagram showing the configuration of the lighting unit.
  • 3(A) is a front view of the first and second light source arrays
  • FIG. 3(B) is a sectional view taken along the line AA in FIG. 3(A).
  • FIG. 4 is a rear view of the board.
  • FIG. 5 is a perspective view showing a heat sink and a first light source array.
  • FIG. 6 is a perspective view showing the ⁇ Z1 side surface of the heat sink.
  • FIG. 7(A) is a front view showing the heat sink and the first light source array
  • FIG. 7(B) is a sectional view taken along the line AA in FIG. 7(A).
  • FIG. 7(A) is a front view showing the heat sink and the first light source array
  • FIG. 7(B) is a sectional view taken along the line AA in FIG. 7(A).
  • FIG. 8 is a diagram for explaining the first and second enlarging optical systems.
  • 9(A) is a front view showing a heat sink and a light source array according to a comparative example
  • FIG. 9(B) is a sectional view taken along the line AA in FIG. 9(A).
  • FIG. 10 is a diagram showing the measurement results of the surface temperature of the substrate.
  • FIG. 11 is a sectional view for explaining a modification.
  • FIG. 1 is a diagram schematically showing the configuration of an exposure apparatus 10 according to an embodiment.
  • the exposure apparatus 10 drives the mask MSK and the glass substrate (hereinafter referred to as "plate") P in the same direction and at the same speed relative to the projection optical system PL, thereby transferring the pattern formed on the mask MSK to the plate P.
  • This is a scanning stepper (scanner) that transfers images onto the image.
  • the plate P is a rectangular glass substrate used, for example, in a liquid crystal display device (flat panel display), and has at least one side length or diagonal length of 500 mm or more.
  • the direction in which the mask MSK and plate P are driven during scanning exposure is the X-axis direction
  • the direction in the horizontal plane perpendicular to this is the Y-axis direction, which is perpendicular to the X-axis and the Y-axis.
  • the direction of rotation is defined as the Z-axis direction
  • the directions of rotation (tilt) around the X-axis, Y-axis, and Z-axis are defined as ⁇ x, ⁇ y, and ⁇ z directions, respectively.
  • the exposure apparatus 10 includes an illumination system IOP, a mask stage MST holding a mask MSK, a projection optical system PL, a body 70 supporting these, a substrate stage PST holding a plate P, a control system for these, and the like.
  • the control system centrally controls each component of the exposure apparatus 10.
  • the body 70 includes a base (vibration isolator) 71, columns 72A, 72B, an optical surface plate 73, a support 74, and a slide guide 75.
  • the base (vibration isolation table) 71 is placed on the floor F, isolates vibrations from the floor F, and supports the columns 72A, 72B, etc.
  • Columns 72A and 72B each have a frame shape, and column 72A is arranged inside column 72B.
  • the optical surface plate 73 has a flat plate shape and is fixed to the ceiling of the column 72A.
  • the support body 74 is supported on the ceiling of the column 72B via a slide guide 75.
  • Slide guide 75 includes an air ball lifter and a positioning mechanism, and positions support body 74 (that is, mask stage MST, which will be described later) at an appropriate position in the X-axis direction with respect to optical surface plate 73.
  • the illumination system IOP is arranged above the body 70.
  • the illumination system IOP irradiates the mask MSK with illumination light IL.
  • the detailed configuration of the illumination system IOP will be described later.
  • Mask stage MST is supported by support body 74.
  • a mask MSK having a pattern surface (lower surface in FIG. 1) on which a circuit pattern is formed is fixed to the mask stage MST by, for example, vacuum suction (or electrostatic suction).
  • Mask stage MST is driven with a predetermined stroke in the scanning direction (X-axis direction) by a drive system including, for example, a linear motor, and is also slightly driven in the non-scanning direction (Y-axis direction and ⁇ z direction).
  • Positional information (including rotational information in the ⁇ z direction) of mask stage MST in the XY plane is measured by an interferometer system.
  • the interferometer system irradiates a length measurement beam onto a movable mirror (or mirror-finished reflective surface (not shown)) provided at the end of mask stage MST, and receives reflected light from the movable mirror. Measure the position of mask stage MST.
  • the measurement results are supplied to a control device (not shown), and the control device drives mask stage MST via a drive system according to the measurement results of the interferometer system.
  • Projection optical system PL is supported by optical surface plate 73 below mask stage MST (-Z side).
  • the projection optical system PL is configured similarly to the projection optical system disclosed in, for example, U.S. Pat. 7), and forms a rectangular image field whose longitudinal direction is the Y-axis direction.
  • four projection optical units 100 are arranged at predetermined intervals in the Y-axis direction, and the remaining three projection optical units 100 are spaced apart from the four projection optical units 100 on the +X side and at predetermined intervals in the Y-axis direction. It is located in As each of the plurality of projection optical units 100, for example, one that forms an erect normal image with a double-sided telecentric, equal-magnification system is used.
  • the plurality of projection areas of the projection optical units 100 arranged in a staggered manner are collectively referred to as an exposure area.
  • the illumination light IL When the illumination region on the mask MSK is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask MSK illuminates the circuit pattern of the mask MSK in the illumination region through the projection optical system PL.
  • a projected image (partially erected image) is formed in an irradiation area (exposure area (conjugate to the illumination area)) on plate P arranged on the image plane side of projection optical system PL.
  • the surface of the plate P is coated with a resist (sensitizer).
  • Mask stage MST and substrate stage PST are driven synchronously, that is, mask MSK is driven in the scanning direction (X-axis direction) with respect to the illumination area (illumination light IL), and plate P is moved into the exposure area (illumination light IL). On the other hand, by driving in the same scanning direction, the plate P is exposed and the pattern of the mask MSK is transferred onto the plate P.
  • the substrate stage PST is arranged on a base (vibration isolation table) 71 below (-Z side) the projection optical system PL.
  • a plate P is held on substrate stage PST via a substrate holder (not shown).
  • Position information in the XY plane of substrate stage PST (including rotation information (yawing amount (rotation amount ⁇ z in the ⁇ z direction), pitching amount (rotation amount ⁇ x in the ⁇ x direction), rolling amount (rotation amount ⁇ y in the ⁇ y direction)) is measured by an interferometer system.
  • the interferometer system irradiates a length measurement beam from an optical surface plate 73 onto a movable mirror (or a mirror-finished reflective surface (not shown)) provided at the end of the substrate stage PST, and collects the reflected light from the movable mirror. By receiving light, the position of substrate stage PST is measured.
  • the measurement results are supplied to a control device (not shown), and the control device drives substrate stage PST according to the measurement results of the interferometer system.
  • the exposure apparatus 10 performs alignment measurement (eg, EGA, etc.) prior to exposure, and uses the results to expose the plate P according to the following procedure.
  • mask stage MST and substrate stage PST are synchronously driven in the X-axis direction.
  • the control device moves (steps) substrate stage PST to a position corresponding to the second shot area.
  • scanning exposure is performed for the second shot area.
  • the control device transfers the pattern of the mask MSK to all shot areas on the plate P by repeating stepping between shot areas of the plate P and scanning exposure for the shot areas.
  • the illumination system IOP includes a plurality of illumination units 90 corresponding to each of the plurality of projection optical units 100 included in the projection optical system PL.
  • FIG. 2 is a diagram schematically showing the configuration of the lighting unit 90.
  • the illumination unit 90 includes a first light source unit OPU1, a second light source unit OPU2, and an illumination optical system 80.
  • the first light source unit OPU1 includes a heat sink 40, a first light source array 20A, and a first enlarging optical system 30A
  • the second light source unit OPU2 includes a heat sink 40, a second light source array 20B, and a second enlarging optical system. system 30B.
  • FIG. 3(A) is a front view schematically showing the configuration of the first light source array 20A and the second light source array 20B
  • FIG. 3(B) is a sectional view taken along the line AA in FIG. 3(A). be.
  • FIG. 3(B) hatching of LED chips 23A and 23B, which will be described later, is omitted.
  • the first light source array 20A includes a substrate 21A and a plurality of (5 ⁇ 5 in FIG. 3A) LEDs (Light Emitting Diodes) two-dimensionally arranged on the substrate 21A.
  • a chip 23A is provided. The number of LED chips 23A may be changed as necessary.
  • the substrate 21A has a first surface 21a and a second surface 21b facing each other, and LED chips 23A are arranged on the first surface 21a.
  • the LED chips 23A are arranged at a pitch P1, and the pitch P1 is the distance between the centers of adjacent LED chips 23A.
  • Each of the plurality of LED chips 23A has a light emitting section 231A, and the peak wavelength of light emitted from the light emitting section 231A is within the range of 380 to 390 nm. That is, the light emitting section 231A is an ultraviolet LED (UV LED). More preferably, the peak wavelength of the light emitted from the light emitting section 231A is 385 nm.
  • the light emitting surface of the light emitting section 231A is square, and the length of one side thereof is a1.
  • the two directions in which the LED chips 23A are arranged are referred to as the X1 direction and the Y1 direction.
  • the X1 direction and the Y1 direction are orthogonal. Further, the direction perpendicular to the X1 direction and the Y1 direction is defined as the Z1 direction.
  • the Z1 direction is approximately parallel to the optical axis of light emitted by the light emitting section 231A.
  • the second light source array 20B includes a substrate 21B and a plurality of (5 ⁇ 5 in FIG. 3A) LED chips 23B two-dimensionally arranged on the substrate 21B.
  • the number of LED chips 23B may be changed as necessary.
  • the substrate 21B also has a first surface 21a and a second surface 21b facing each other, and LED chips 23B are arranged on the first surface 21a.
  • the LED chips 23B are arranged at a pitch P2, and the pitch P2 is the distance between the centers of adjacent LED chips 23B.
  • the arrangement pitch P1 of the LED chips 23A and the arrangement pitch P2 of the LED chips 23B may be the same or different.
  • Each of the plurality of LED chips 23B has a light emitting section 231B, and the peak wavelength of light emitted from the light emitting section 231B is within the range of 360 to 370 nm. That is, the light emitting section 231B is a UV LED. More preferably, the peak wavelength of the light emitted from the light emitting section 231B is 365 nm.
  • the light emitting surface of the light emitting section 231B is square, and the length of one side thereof is a2. The length a2 of one side of the light emitting surface of the light emitting section 231B may be the same as or different from the length a1 of one side of the light emitting surface of the light emitting section 231A.
  • FIG. 4 is a rear view of the substrates 21A and 21B.
  • the substrates 21A and 21B are metal substrates with a thickness of 5 mm or less.
  • the substrates 21A and 21B are preferably made of a material with high thermal conductivity, and may be, for example, a copper substrate.
  • on the second surface 21b of the substrates 21A, 21B opposite to the first surface 21a in a range where a plurality of LED chips 23A, 23B are arranged in plan view.
  • a plurality of recesses 211 (3 ⁇ 3 in FIG. 4) are formed in the opposing portion AR1. In this embodiment, the plurality of recesses 211 are provided at equal intervals in each of the X1 direction and the Y1 direction.
  • the recess 211 does not penetrate the substrates 21A and 21B.
  • the recess 211 is a screw hole, and the boards 21A and 21B can be fixed to the heat sink 40 by engaging the bolt 61 in the recess 211, which will be described in detail later.
  • FIG. 5 is a perspective view showing the heat sink 40 and the first light source array 20A
  • FIG. 6 is a perspective view showing the -Z1 side surface of the heat sink 40
  • FIG. 7(A) is a front view showing the heat sink 40 and the first light source array 20A
  • FIG. 7(B) is a sectional view taken along the line AA in FIG. 7(A). Since the relationship between the second light source array 20B and the heat sink 40 is the same as the relationship between the first light source array 20A and the heat sink 40, the heat sink 40 and the first light source array 20A will be described below.
  • FIG. 5 illustrates, as an example, a case where the first light source array 20A includes 10 ⁇ 14 LED chips 23A. Moreover, in FIG. 7(B), hatching of the LED chip 23A is omitted.
  • first light source arrays 20A are arranged on the heat sink 40.
  • the number of first light source arrays 20A arranged on the heat sink 40 is not limited to three, and may be two or less or four or more. That is, it is sufficient that at least one first light source array 20A is disposed on the heat sink 40.
  • the heat sink 40 has a flow path 402 through which the refrigerant passes, a supply port 41 that supplies the refrigerant to the flow path 402, and an exhaust port 42 that discharges the refrigerant that has passed through the flow path 402. and cools the LED chips 23A included in the first light source array 20A.
  • the refrigerant may be a liquid or a gas, but preferably water.
  • the brightness of light from the light emitting section 231A included in the LED chip 23A decreases as the temperature of the LED chip 23A increases. In other words, the luminous efficiency of the LED chip 23A decreases as the temperature increases.
  • the heat sink 40 has a through hole 401 that penetrates the heat sink 40, as shown in FIGS. 6 and 7(B).
  • the through hole 401 is a stepped through hole whose diameter changes in two steps.
  • a flow path 402 inside the heat sink 40 is formed in a portion where the through hole 401 is not formed.
  • the through hole 401 is provided at a position corresponding to the recess 211 provided in the second surface 21b of the substrate 21A included in the first light source array 20A.
  • a heat conductive member 50 such as Thermal Interface Material (TIM) is provided between the substrate 21A and the heat sink 40.
  • TIM Thermal Interface Material
  • a heat conductive sheet is used as the heat conductive member 50.
  • the thermally conductive member 50 may be thermally conductive grease or the like.
  • the thermally conductive member 50 is provided so as to be in contact with a portion AR1 of the second surface 21b of the substrate 21A that corresponds to at least the range where the LED chips 23A are arranged. Thereby, small gaps and unevenness between the substrate 21A and the heat sink 40 can be filled, and the LED chip 23A can be efficiently cooled by the heat sink 40.
  • the heat sink 40 and the substrate 21A are fixed by bolts 61 that pass through the through holes 401 and engage (fit) into the recesses 211.
  • the bolt 61 passes through the heat conductive member 50.
  • the length of the bolt 61 is set to such a length that it passes through the heat conduction member 50 and allows the heat sink 40 and the heat conduction member 50 and the substrate 21A and the heat conduction member 50 to come into close contact with each other. Thereby, the heat sink 40 can cool the LED chip 23A more efficiently.
  • the heat conductive member 50 is provided corresponding to each first light source array 20A, but for example, one sheet-like heat conductive member 50 is provided for three first light source arrays 20A. It may be provided.
  • FIG. 8 is a diagram for explaining the first enlarging optical system 30A and the second enlarging optical system 30B that are included in the first light source unit OPU1 and the second light source unit OPU2, respectively.
  • the first enlarging optical system 30A is an enlarging optical system for forming an enlarged image of the light emitting portion 231A of each LED chip 23A on a predetermined plane PP.
  • the first magnifying optical system 30A includes a plurality of lens sections 31A arranged to correspond to the arrangement of the LED chips 23A.
  • Each of the lens sections 31A is a double-sided telecentric optical system that enlarges and projects the light emitting section 231A at a magnification M1 equal to or greater than (array pitch P1 of LED chips 23B)/(length a1 of one side of the light emitting surface of the light emitting section 231A).
  • M1 magnification
  • FIG. 8 for clarity of the drawing, only four LED chips 23A (23B) lined up in a row along the Y1 direction are shown.
  • the second enlarging optical system 30B is an enlarging optical system for forming an enlarged image of the light emitting portion 231B of each LED chip 23B on a predetermined plane PP.
  • the second magnifying optical system 30B includes a plurality of lens sections 31B arranged to correspond to the arrangement of the LED chips 23B.
  • Each lens section 31B is a double-sided telecentric optical system that enlarges and projects the light emitting section 231B at a magnification M2 equal to or greater than (array pitch P2 of the LED chips 23A)/(length a2 of one side of the light emitting surface of the light emitting section 231B). .
  • each of the lens sections 31A and 31B includes four plano-convex lenses, but the invention is not limited to this.
  • the lens sections 31A and 31B include two biconvex lenses. Alternatively, it may include three biconvex lenses.
  • the lens portions 31A and 31B may include, for example, a plano-convex lens and a biconvex lens.
  • the illumination optical system 80 includes a first condensing optical system (first optical system) 81A that includes a first dichroic mirror DM1, and a second condensing optical system (second optical system). (optical system) 81B, a second dichroic mirror DM2, an imaging optical system 83, a fly's eye lens FEL, and a condenser optical system 84.
  • the first condensing optical system 81A forms a pupil of an enlarged image of the light emitting section 231A formed by the first enlarging optical system 30A. That is, the rear focal position of the first condensing optical system 81A is the position of the pupil.
  • the first condensing optical system 81A includes a first dichroic mirror DM1 in the middle of the optical path, and reflects at least a portion of the light having a peak wavelength of 385 nm. As a result, the light beam enters the second dichroic mirror DM2.
  • the first condensing optical system 81A may be configured without the first dichroic mirror DM1, and in that case, the arrangement of the first light source unit OPU1 and each lens of the first condensing optical system 81A may be changed. The arrangement may be appropriately adjusted so that the light beam is incident on the second dichroic mirror DM2. Further, the first condensing optical system 81A may be composed of one lens, or may be composed of a lens group including a plurality of lenses.
  • the second condensing optical system 81B forms a pupil of an enlarged image of the light emitting section 231B formed by the second enlarging optical system 30B. That is, the rear focal position of the second condensing optical system 81B is the position of the pupil.
  • the second condensing optical system 81B may be composed of one lens, or may be composed of a lens group including a plurality of lenses.
  • the second dichroic mirror DM2 transmits at least part of the light with a peak wavelength of 385 nm and reflects at least part of the light with a peak wavelength of 365 nm. Thereby, a composite image is formed in which the pupil image formed by the first condensing optical system 81A and the pupil image formed by the second condensing optical system 81B are superimposed.
  • the second dichroic mirror DM2 superimposes the pupil image formed by the first condensing optical system 81A and the pupil image formed by the second condensing optical system 81B to create a composite image. form. That is, the second dichroic mirror DM2 is arranged at a position that is the rear focal position of the first condensing optical system 81A and the rear focal position of the second condensing optical system 81B. Thereby, the second dichroic mirror DM2 is illuminated by Koehler illumination with the light emitted from the first light source unit OPU1 and the light emitted from the second light source unit OPU2.
  • the first condensing optical system 81A and the second condensing optical system 81B respectively attach the image of the first light source unit OPU1 and the second condensing optical system to the second dichroic mirror DM2. It may be configured to perform critical illumination to form an image of the light source unit OPU2.
  • the illumination unit 90 includes a detector DT10 for monitoring light with a peak wavelength of 385 nm, a detector DT20 for monitoring light with a peak wavelength of 365 nm, and a detector DT20 for monitoring light with a peak wavelength of 385 nm and light with a peak wavelength of 365 nm.
  • a detector DT30 is provided for the detection.
  • the detector DT10 detects the illuminance of the light with a peak wavelength of 385 nm reflected by the first dichroic mirror DM1.
  • the detector DT20 detects the illuminance of the light having a peak wavelength of 365 nm reflected by the second dichroic mirror DM2.
  • the detector DT30 detects the illuminance of the 385 nm light unintentionally reflected by the second dichroic mirror DM2 and the illuminance of the 365 nm light unintentionally transmitted by the second dichroic mirror DM2.
  • the detection results of the detectors DT10 to DT30 are output to a control device (not shown), and the control device outputs the LED chips 23A of the first light source unit OPU1 and the second light source unit OPU2, respectively, based on the detection results of the detectors DT10 to DT30. and controls the value of the current supplied to 23B.
  • the imaging optical system 83 is a double-sided telecentric optical system that projects the composite image synthesized by the second dichroic mirror DM2 at the same magnification onto the incident end of the fly's eye lens FEL. Note that the imaging optical system 83 may reduce and project the composite image synthesized by the second dichroic mirror DM2 onto the incident end of the fly's eye lens FEL.
  • the fly's eye lens FEL is constructed by densely arranging a large number of lens elements each having, for example, positive refractive power, vertically and horizontally so that their optical axes are parallel to the reference optical axis AX.
  • Each lens element constituting the fly's eye lens FEL has a rectangular cross section similar to the shape of the illumination field to be formed on the mask MSK (and thus the shape of the exposure area to be formed on the plate P).
  • the light beam incident on the fly's eye lens FEL is wavefront-divided by a large number of lens elements, and one light source image is formed at or near the rear focal plane (output surface) of each lens element. That is, a substantial surface light source, ie, a secondary light source, consisting of a large number of light source images is formed at or near the rear focal plane (output surface) of the fly's eye lens FEL.
  • a light beam from a secondary light source formed at or near the rear focal plane (output surface) of the fly's eye lens FEL enters an aperture stop 85 arranged near it.
  • the rear focal plane (output surface) of the fly's eye lens FEL and the first light source array 20A and the second light source array 20B are optically conjugate.
  • the aperture stop 85 is arranged at a position that is optically approximately conjugate with the entrance pupil plane of the projection optical system PL, and has a variable aperture for defining the range that contributes to the illumination of the secondary light source.
  • the aperture stop 85 changes the aperture diameter of the variable aperture to determine the ⁇ value (the aperture of the secondary light source image on the pupil plane of the projection optical system relative to the aperture diameter of the pupil plane of the projection optical system), which determines the illumination condition. ratio) to the desired value.
  • the light from the secondary light source passes through the aperture diaphragm 85 and, after being condensed by the condenser optical system 84, illuminates the mask MSK in which a predetermined pattern is formed in a superimposed manner.
  • the wavelengths of the light emitted by the first light source unit OPU1 and the second light source unit OPU2 are not limited to those described above, and the first light source unit OPU1 and the second light source unit OPU2 may be The light source unit OPU1 and the second light source unit OPU2 may be configured.
  • the first light source unit OPU1 may emit light with a peak wavelength of 405 nm
  • the second light source unit OPU2 may emit light with a peak wavelength of 385 nm.
  • the first light source unit OPU1 may emit light with a peak wavelength of 395 nm
  • the second light source unit OPU2 may emit light with a peak wavelength of 385 nm.
  • the combination of the wavelength of the light emitted from the first light source unit OPU1 and the wavelength of the light emitted from the second light source unit OPU2 is not limited to these examples. Note that if the combination of the wavelength of the light emitted by the first light source unit OPU1 and the wavelength of the light emitted by the second light source unit OPU2 is a combination other than that of the first embodiment, dichroic dichroic may be used as appropriate depending on the wavelength used. It is preferable to change the material of the mirror.
  • the temperature of the substrate was determined when the heat sink and the substrate were fixed by the method according to the embodiment and when the heat sink and the substrate were fixed by the method according to the comparative example.
  • the number of LED chips arranged in the light source array was 5 ⁇ 5.
  • FIG. 9(A) is a front view showing a heat sink 1040 and a light source array 1020 according to a comparative example
  • FIG. 9(B) is a sectional view taken along the line AA in FIG. 9(A).
  • Each light source array 1020 includes a substrate 1021 and a plurality of LED chips 23A.
  • the number of LED chips 23A provided on the substrate 1021 and the arrangement pitch are the same as those of the first light source array 20A.
  • the heat sink 1040 according to the comparative example includes a through hole 1401 and a fixing block 45.
  • Fixed block 45 is fixed to heat sink 1040 with bolts 46. Further, a screw hole is formed at the end of the fixed block 45 on the +Z1 side.
  • Through holes are provided in the substrate 1021 at four locations outside the area where the plurality of LED chips 23A are arranged.
  • the board 1021 is fixed to the heat sink 1040 by inserting the bolt 60 into the through hole from the +Z1 side and engaging the screw hole formed at the end of the fixing block 45 on the +Z1 side.
  • the other configurations are the same as those in the embodiment, so detailed description will be omitted.
  • FIG. 10 is a diagram showing the measurement results.
  • the horizontal axis in FIG. 10 indicates each board, and the "left” is the board placed on the -Y1 side, the “center” is the board placed in the center, and the “right” is the board placed on the +Y1 side. "Average” indicates the average value for all substrates.
  • the vertical axis in FIG. 10 indicates the temperature determined from the measurement value of the thermistor 25.
  • the surface temperature of the substrate was lower than that using the method according to the comparative example. It was done. That is, it was confirmed that the fixing method according to the embodiment has a higher cooling effect on the LED chip 23A than the fixing method according to the comparative example. This is considered to be due to the following reasons.
  • the board 1021 is fixed to the heat sink 1040 at four locations outside the range where the plurality of LED chips 23A are arranged. , the adhesion between the heat conductive member 50, the substrate 1021, and the heat sink 1040 becomes insufficient.
  • the fixing method according to the embodiment since the substrate 21A can be fixed to the heat sink 40 at nine locations within the range where the LED chips 23A are arranged, the warping of the board 21A in the range where the LED chips 23A are arranged can be avoided. Deflection can be suppressed, and the adhesion between the heat conductive member 50, the substrate 21A, and the heat sink 40 can be improved. As a result, it is thought that the fixing method according to the embodiment has a higher cooling effect on the LED chip 23A than the fixing method according to the comparative example.
  • the comparison can be made. It has been confirmed that the LED 23A can be cooled more efficiently than when the substrate 1021 and the heat sink 1040 are fixed by providing a mechanism for fixing the substrate 1021 and the heat sink 1040 outside the range where the LED chips 23A are arranged as in the example. Ta.
  • the first light source unit OPU1 includes a substrate 21A having a first surface 21a and a second surface 21b facing each other, and
  • the device includes LED chips 23A arranged two-dimensionally, a heat sink 40, and a heat conductive member 50 provided between the substrate 21A and the heat sink 40.
  • the substrate 21A has a plurality of recesses 211 in a portion AR1 of the second surface 21b that faces the range where the LED chips 23A are arranged in a plan view
  • the heat sink 40 has a through hole 401, which is connected to the substrate 21A.
  • the heat sink 40 is fixed to the heat sink 40 with a bolt 61 that passes through the through hole 401 and fits into the recess 211 .
  • the substrate 21A and the heat sink 40 are fixed outside the area where the LED chips 23A are arranged, warpage and deflection of the substrate 21A in the area where the LED chips 23A are arranged can be suppressed. Therefore, the adhesion between the heat conductive member 50, the substrate 21A, and the heat sink 40 can be improved. Therefore, the LED chip 23A can be efficiently cooled. Thereby, it is possible to suppress a decrease in the brightness of the light emitted from the light emitting section 231A due to a rise in the temperature of the LED chip 23A.
  • the recess 211 is a screw hole. Therefore, the board 21A and the heat sink 40 can be easily fixed using the bolts 61.
  • a plurality of recesses 211 are formed in the portion AR1 facing the range in which the LED chips 23A are arranged, and a plurality of through holes 401 are formed corresponding to the plurality of recesses 211.
  • the board 21A and the heat sink 40 can be fixed at multiple locations, so the board 21A and the heat conductive member 50 and the heat conductive member 50 and the heat sink 40 can be brought into close contact with each other, and the LED chip 23A can be fixed more efficiently. Can be cooled.
  • the plurality of recesses 211 and through holes 401 are formed at equal intervals. This makes it possible to equalize the force acting on the board 21A from the bolts 61, so that distortion, deflection, etc. of the board 21A can be suppressed.
  • the recess 211 does not penetrate the substrate 21A. This can prevent the bolt 61 from coming into contact with the LED chip 23A.
  • the substrate 21A is a metal substrate. Therefore, the recess 211 can be easily formed.
  • the heat conduction member 50 was provided between the heat sink 40 and the substrate 21A, but the heat conduction member 50 may be omitted. That is, the heat sink 40 and the substrate 21A may be fixed with the bolts 61 so that the heat sink 40 and the substrate 21A are in direct contact with each other. Even in this case, the LED chip 23A can be cooled, and the brightness of the light emitted by the light emitting part 231A of the LED chip 23A can be prevented from decreasing due to a rise in the temperature of the LED chip 23A.
  • the recess 211 is a screw hole, but it is not limited to this.
  • the recess 211 may be a hole without a thread groove.
  • a fixing member that fits into the recess 211 may be used, and the fixing member may be fixed to the substrate 21A by soldering or adhesive.
  • a plurality of recesses 211 are provided, and at least one recess 211 is provided in a portion of the second surface 21b of the substrate 21A that corresponds to a portion where the LED chips 23A are arranged. It is sufficient if it is formed. Further, the number of recesses 211 is not limited to the above embodiment, and may be 8 or less, or 10 or more.
  • the recesses 211 are provided at equal intervals in each of the X1 direction and the Y1 direction, but they may be provided at irregular intervals.
  • the through hole 401 of the heat sink 40 may be formed at a position corresponding to the position of the recess 211.
  • the heat sink 40 had the flow path 402 through which the refrigerant flows inside, but the heat sink 40 is not limited to this.
  • the heat sink 40 may be, for example, a fin type heat sink.
  • a control unit CTR for controlling the LED chips 23A may be arranged on the surface of the heat sink 40 opposite to the surface on which the substrates 21A are arranged.
  • the control unit CTR can be cooled by the heat sink 40, there is no need to separately provide a mechanism for cooling the control unit CTR, and the configuration of the first light source unit OPU1 can be simplified.
  • the illumination unit 90 includes the first light source unit OPU1, the second light source unit OPU2, and the illumination optical system 80 including the second dichroic mirror DM2. It is not limited.
  • the lighting unit 90 may include only one of the first light source unit OPU1 and the second light source unit OPU2.
  • the illumination optical system 80 can have any configuration as long as it can guide the light emitted from the first light source unit OPU1 or the second light source unit OPU2 to the mask MSK.
  • Exposure device 20A First light source array 20B Second light source array 21A, 21B Substrate 21a First surface 21b Second surface 23A, 23B LED chip 30A First magnifying optical system 30B Second magnifying optical system 31A, 31B Lens section 40 Heat sink 50 Thermal conduction member 61 Bolt 211 Recesses 231A, 231B Light emitting section 401 Through hole 80 Illumination optical system 90 Illumination unit 100 Projection optical unit CTR Control section DM2 Second dichroic mirror MSK Mask OPU1 First light source unit OPU2 Second light source unit P Glass substrate

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Abstract

The purpose of the present invention is to, by inhibiting warpage or bending of a substrate on which light source elements are arranged, improve adhesion between the substrate and a heat sink and increase cooling efficiency.　This light source unit comprises: a substrate (21A) that has a first surface and a second surface that are opposite each other; a plurality of light source elements (20A) that are two-dimensionally arranged on the first surface of the substrate (21A); and a heat sink (40). The substrate (21A) has at least one recess formed in a portion of the second surface opposing a range in which the plurality of light source elements (20A) are arranged in a plan view. The heat sink (40) has a through hole (401). The substrate (21A) and the heat sink (40) are fixed together by a fixing member (61) that is inserted through the through hole (401) and is fitted into the recess.

Description

光源ユニット、照明ユニット、露光装置、及び露光方法Light source unit, lighting unit, exposure device, and exposure method
　光源ユニット、照明ユニット、露光装置、及び露光方法に関する。 It relates to a light source unit, a lighting unit, an exposure device, and an exposure method.
　近年、パソコンやテレビ等の表示素子として、液晶表示パネルが多用されている。液晶表示パネルは、プレート（ガラス基板）上にフォトリソグラフィの手法で薄膜トランジスタの回路パターンを形成することによって製造される。このフォトリソグラフィ工程のための装置として、マスク上に形成された原画パターンを、投影光学系を介してプレート上のフォトレジスト層に投影露光する露光装置が用いられている。 In recent years, liquid crystal display panels have been widely used as display elements for personal computers, televisions, etc. A liquid crystal display panel is manufactured by forming a circuit pattern of thin film transistors on a plate (glass substrate) using a photolithography method. As an apparatus for this photolithography process, an exposure apparatus is used that projects and exposes an original pattern formed on a mask onto a photoresist layer on a plate via a projection optical system.
　上述の露光装置を含む様々な光学装置において、発光ダイオードを用いた光源を使用することが提案されている（例えば、特許文献１）。 It has been proposed to use a light source using a light emitting diode in various optical devices including the above-mentioned exposure device (for example, Patent Document 1).
特開２００６－２０１４７６号公報Japanese Patent Application Publication No. 2006-201476
　第１の開示の態様によれば、光源ユニットは、互いに対向する第１面と第２面とを有する基板と、前記基板の前記第１面上に２次元配列された複数の光源素子と、ヒートシンクと、を備え、前記基板は、前記第２面のうち、平面視において前記複数の光源素子が配列された範囲に対向する部分に形成された少なくとも１つの凹部を有し、前記ヒートシンクは、貫通孔を有し、前記基板と前記ヒートシンクとは、前記貫通孔を挿通するとともに前記凹部に嵌合する固定部材で固定されている。 According to the first aspect of the disclosure, the light source unit includes a substrate having a first surface and a second surface facing each other, and a plurality of light source elements two-dimensionally arranged on the first surface of the substrate. a heat sink, the substrate has at least one recess formed in a portion of the second surface that faces the range in which the plurality of light source elements are arranged in a plan view, and the heat sink includes: The substrate has a through hole, and the substrate and the heat sink are fixed by a fixing member that is inserted through the through hole and fitted into the recess.
　第２の開示の態様によれば、照明ユニットは、上記光源ユニットと、前記光源ユニットから出射された光を被照射体に導く照明光学系と、を備える。 According to the second aspect of the disclosure, the illumination unit includes the light source unit and an illumination optical system that guides the light emitted from the light source unit to the irradiated object.
　第３の開示の態様によれば、照明ユニットは、複数の上記光源ユニットと、複数の前記光源ユニットから出射された光を合成する合成光学素子を含み、前記合成光学素子から出射された合成光を被照射体に導く照明光学系と、を備える。 According to a third aspect of the disclosure, the illumination unit includes a plurality of the above-mentioned light source units and a combining optical element that combines the light emitted from the plurality of light source units, and the combined light emitted from the combining optical element. an illumination optical system that guides the light to the irradiated object.
　第４の開示の態様によれば、露光装置は、上記照明ユニットと、前記照明ユニットにより照明されるマスクのパターン像を感光性基板上に投影する投影光学系と、を備える。 According to a fourth aspect of the disclosure, an exposure apparatus includes the illumination unit described above and a projection optical system that projects a pattern image of a mask illuminated by the illumination unit onto a photosensitive substrate.
　第５の開示の態様によれば、露光方法は、上記露光装置を用いた露光方法であって、前記照明ユニットによりマスクを照明することと、前記投影光学系を用いて前記マスクのパターン像を感光性基板へ投影することと、を含む。 According to a fifth aspect of the disclosure, an exposure method is an exposure method using the above-mentioned exposure apparatus, comprising illuminating a mask with the illumination unit and projecting a pattern image of the mask using the projection optical system. and projecting onto a photosensitive substrate.
　なお、後述の実施形態の構成を適宜改良しても良く、また、少なくとも一部を他の構成物に代替させても良い。更に、その配置について特に限定のない構成要件は、実施形態で開示した配置に限らず、その機能を達成できる位置に配置することができる。 Note that the configurations of the embodiments described below may be modified as appropriate, and at least a portion thereof may be replaced with other components. Further, the configuration elements whose arrangement is not particularly limited are not limited to the arrangement disclosed in the embodiments, but can be arranged at a position where the function can be achieved.
図１は、実施形態に係る露光装置の構成を示す概略図である。FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus according to an embodiment. 図２は、照明ユニットの構成を示す概略図である。FIG. 2 is a schematic diagram showing the configuration of the lighting unit. 図３（Ａ）は、第１及び第２光源アレイの正面図であり、図３（Ｂ）は、図３（Ａ）のＡ－Ａ線断面図である。3(A) is a front view of the first and second light source arrays, and FIG. 3(B) is a sectional view taken along the line AA in FIG. 3(A). 図４は、基板の背面図である。FIG. 4 is a rear view of the board. 図５は、ヒートシンクと第１光源アレイとを示す斜視図である。FIG. 5 is a perspective view showing a heat sink and a first light source array. 図６は、ヒートシンクの－Ｚ１側の面を示す斜視図である。FIG. 6 is a perspective view showing the −Z1 side surface of the heat sink. 図７（Ａ）は、ヒートシンクと第１光源アレイとを示す正面図であり、図７（Ｂ）は、図７（Ａ）のＡ－Ａ線断面図であるFIG. 7(A) is a front view showing the heat sink and the first light source array, and FIG. 7(B) is a sectional view taken along the line AA in FIG. 7(A). 図８は、第１及び第２拡大光学系について説明するための図である。FIG. 8 is a diagram for explaining the first and second enlarging optical systems. 図９（Ａ）は、比較例に係るヒートシンク及び光源アレイを示す正面図であり、図９（Ｂ）は、図９（Ａ）のＡ－Ａ線断面図である。9(A) is a front view showing a heat sink and a light source array according to a comparative example, and FIG. 9(B) is a sectional view taken along the line AA in FIG. 9(A). 図１０は、基板の表面温度の計測結果を示す図である。FIG. 10 is a diagram showing the measurement results of the surface temperature of the substrate. 図１１は、変形例について説明するための断面図である。FIG. 11 is a sectional view for explaining a modification.
　一実施形態に係る露光装置１０について、図１～図８に基づいて説明する。 An exposure apparatus 10 according to one embodiment will be described based on FIGS. 1 to 8.
（露光装置の構成）
　まず、図１を用いて一実施形態に係る露光装置１０の構成について説明する。図１は、一実施形態に係る露光装置１０の構成を概略的に示す図である。 (Configuration of exposure device)
First, the configuration of an exposure apparatus 10 according to an embodiment will be described using FIG. 1. FIG. 1 is a diagram schematically showing the configuration of an exposure apparatus 10 according to an embodiment.
　露光装置１０は、マスクＭＳＫとガラス基板（以下、「プレート」と呼ぶ）Ｐとを投影光学系ＰＬに対して同一方向に同一速度で駆動することで、マスクＭＳＫに形成されたパターンをプレートＰ上に転写するスキャニング・ステッパ（スキャナ）である。プレートＰは、例えば液晶表示装置（フラットパネルディスプレイ）に用いられる矩形のガラス基板であり、少なくとも一辺の長さ又は対角長が５００ｍｍ以上である。 The exposure apparatus 10 drives the mask MSK and the glass substrate (hereinafter referred to as "plate") P in the same direction and at the same speed relative to the projection optical system PL, thereby transferring the pattern formed on the mask MSK to the plate P. This is a scanning stepper (scanner) that transfers images onto the image. The plate P is a rectangular glass substrate used, for example, in a liquid crystal display device (flat panel display), and has at least one side length or diagonal length of 500 mm or more.
　以下においては、走査露光の際にマスクＭＳＫ及びプレートＰが駆動される方向（走査方向）をＸ軸方向とし、これに直交する水平面内での方向をＹ軸方向、Ｘ軸及びＹ軸に直交する方向をＺ軸方向、Ｘ軸、Ｙ軸、及びＺ軸回りの回転（傾斜）方向をそれぞれθｘ、θｙ、及びθｚ方向とする。 In the following, the direction in which the mask MSK and plate P are driven during scanning exposure (scanning direction) is the X-axis direction, and the direction in the horizontal plane perpendicular to this is the Y-axis direction, which is perpendicular to the X-axis and the Y-axis. The direction of rotation is defined as the Z-axis direction, and the directions of rotation (tilt) around the X-axis, Y-axis, and Z-axis are defined as θx, θy, and θz directions, respectively.
　露光装置１０は、照明系ＩＯＰ、マスクＭＳＫを保持するマスクステージＭＳＴ、投影光学系ＰＬ、これらを支持するボディ７０、プレートＰを保持する基板ステージＰＳＴ、及びこれらの制御系等を備える。制御系は、露光装置１０の構成各部を統括制御する。 The exposure apparatus 10 includes an illumination system IOP, a mask stage MST holding a mask MSK, a projection optical system PL, a body 70 supporting these, a substrate stage PST holding a plate P, a control system for these, and the like. The control system centrally controls each component of the exposure apparatus 10.
　ボディ７０は、ベース（防振台）７１、コラム７２Ａ，７２Ｂ、光学定盤７３、支持体７４、及びスライドガイド７５を備える。ベース（防振台）７１は、床Ｆ上に配置され、床Ｆからの振動を除振してコラム７２Ａ，７２Ｂ等を支持する。コラム７２Ａ，７２Ｂはそれぞれ枠体形状を有し、コラム７２Ｂの内側にコラム７２Ａが配置されている。光学定盤７３は、平板形状を有し、コラム７２Ａの天井部に固定されている。支持体７４は、コラム７２Ｂの天井部にスライドガイド７５を介して支持されている。スライドガイド７５は、エアボールリフタと位置決め機構とを備え、支持体７４（すなわち後述するマスクステージＭＳＴ）を光学定盤７３に対してＸ軸方向の適当な位置に位置決めする。 The body 70 includes a base (vibration isolator) 71, columns 72A, 72B, an optical surface plate 73, a support 74, and a slide guide 75. The base (vibration isolation table) 71 is placed on the floor F, isolates vibrations from the floor F, and supports the columns 72A, 72B, etc. Columns 72A and 72B each have a frame shape, and column 72A is arranged inside column 72B. The optical surface plate 73 has a flat plate shape and is fixed to the ceiling of the column 72A. The support body 74 is supported on the ceiling of the column 72B via a slide guide 75. Slide guide 75 includes an air ball lifter and a positioning mechanism, and positions support body 74 (that is, mask stage MST, which will be described later) at an appropriate position in the X-axis direction with respect to optical surface plate 73.
　照明系ＩＯＰは、ボディ７０の上方に配置されている。照明系ＩＯＰは、照明光ＩＬをマスクＭＳＫに照射する。照明系ＩＯＰの詳細な構成については、後述する。 The illumination system IOP is arranged above the body 70. The illumination system IOP irradiates the mask MSK with illumination light IL. The detailed configuration of the illumination system IOP will be described later.
　マスクステージＭＳＴは、支持体７４に支持されている。マスクステージＭＳＴには、回路パターンが形成されたパターン面（図１における下面）を有するマスクＭＳＫが、例えば真空吸着（あるいは静電吸着）により固定されている。マスクステージＭＳＴは、例えばリニアモーターを含む駆動系により走査方向（Ｘ軸方向）に所定のストロークで駆動されるとともに、非走査方向（Ｙ軸方向及びθｚ方向）に微少駆動される。 Mask stage MST is supported by support body 74. A mask MSK having a pattern surface (lower surface in FIG. 1) on which a circuit pattern is formed is fixed to the mask stage MST by, for example, vacuum suction (or electrostatic suction). Mask stage MST is driven with a predetermined stroke in the scanning direction (X-axis direction) by a drive system including, for example, a linear motor, and is also slightly driven in the non-scanning direction (Y-axis direction and θz direction).
　マスクステージＭＳＴのＸＹ平面内の位置情報（θｚ方向の回転情報を含む）は、干渉計システムにより計測される。干渉計システムは、マスクステージＭＳＴの端部に設けられた移動鏡（又は鏡面加工された反射面（不図示））に測長ビームを照射し、移動鏡からの反射光を受光することにより、マスクステージＭＳＴの位置を計測する。その計測結果は制御装置（不図示）に供給され、制御装置は、干渉計システムの計測結果に従って、駆動系を介してマスクステージＭＳＴを駆動する。 Positional information (including rotational information in the θz direction) of mask stage MST in the XY plane is measured by an interferometer system. The interferometer system irradiates a length measurement beam onto a movable mirror (or mirror-finished reflective surface (not shown)) provided at the end of mask stage MST, and receives reflected light from the movable mirror. Measure the position of mask stage MST. The measurement results are supplied to a control device (not shown), and the control device drives mask stage MST via a drive system according to the measurement results of the interferometer system.
　投影光学系ＰＬは、マスクステージＭＳＴの下方（－Ｚ側）において、光学定盤７３に支持されている。投影光学系ＰＬは、例えば米国特許第５，７２９，３３１号明細書に開示された投影光学系と同様に構成され、マスクＭＳＫのパターン像の投影領域が例えば千鳥状に配置された複数（例えば７）の投影光学ユニット１００（マルチレンズ投影光学ユニット）を含み、Ｙ軸方向を長手方向とする矩形形状のイメージフィールドを形成する。ここでは、４つの投影光学ユニット１００がＹ軸方向に所定間隔で配置され、残りの３つの投影光学ユニット１００が、４つの投影光学ユニット１００から＋Ｘ側に離間して、Ｙ軸方向に所定間隔で配置されている。複数の投影光学ユニット１００のそれぞれとして、例えば両側テレセントリックな等倍系で正立正像を形成するものが用いられる。なお、千鳥状に配置された投影光学ユニット１００の複数の投影領域をまとめて露光領域と呼ぶ。 Projection optical system PL is supported by optical surface plate 73 below mask stage MST (-Z side). The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, U.S. Pat. 7), and forms a rectangular image field whose longitudinal direction is the Y-axis direction. Here, four projection optical units 100 are arranged at predetermined intervals in the Y-axis direction, and the remaining three projection optical units 100 are spaced apart from the four projection optical units 100 on the +X side and at predetermined intervals in the Y-axis direction. It is located in As each of the plurality of projection optical units 100, for example, one that forms an erect normal image with a double-sided telecentric, equal-magnification system is used. Note that the plurality of projection areas of the projection optical units 100 arranged in a staggered manner are collectively referred to as an exposure area.
　照明系ＩＯＰからの照明光ＩＬによってマスクＭＳＫ上の照明領域が照明されると、マスクＭＳＫを透過した照明光ＩＬにより、投影光学系ＰＬを介して、その照明領域内のマスクＭＳＫの回路パターンの投影像（部分正立像）が、投影光学系ＰＬの像面側に配置されるプレートＰ上の照射領域（露光領域（照明領域に共役））に形成される。ここで、プレートＰの表面にはレジスト（感応剤）が塗布されている。マスクステージＭＳＴと基板ステージＰＳＴとを同期駆動する、すなわちマスクＭＳＫを照明領域（照明光ＩＬ）に対して走査方向（Ｘ軸方向）に駆動するとともに、プレートＰを露光領域（照明光ＩＬ）に対して同じ走査方向に駆動することで、プレートＰが露光されてプレートＰ上にマスクＭＳＫのパターンが転写される。 When the illumination region on the mask MSK is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask MSK illuminates the circuit pattern of the mask MSK in the illumination region through the projection optical system PL. A projected image (partially erected image) is formed in an irradiation area (exposure area (conjugate to the illumination area)) on plate P arranged on the image plane side of projection optical system PL. Here, the surface of the plate P is coated with a resist (sensitizer). Mask stage MST and substrate stage PST are driven synchronously, that is, mask MSK is driven in the scanning direction (X-axis direction) with respect to the illumination area (illumination light IL), and plate P is moved into the exposure area (illumination light IL). On the other hand, by driving in the same scanning direction, the plate P is exposed and the pattern of the mask MSK is transferred onto the plate P.
　基板ステージＰＳＴは、投影光学系ＰＬの下方（－Ｚ側）のベース（防振台）７１上に配置されている。基板ステージＰＳＴ上に、プレートＰが、基板ホルダ（不図示）を介して保持されている。 The substrate stage PST is arranged on a base (vibration isolation table) 71 below (-Z side) the projection optical system PL. A plate P is held on substrate stage PST via a substrate holder (not shown).
　基板ステージＰＳＴのＸＹ平面内の位置情報（回転情報（ヨーイング量（θｚ方向の回転量θｚ）、ピッチング量（θｘ方向の回転量θｘ）、ローリング量（θｙ方向の回転量θｙ））を含む）は、干渉計システムによって計測される。干渉計システムは、光学定盤７３から基板ステージＰＳＴの端部に設けられた移動鏡（又は鏡面加工された反射面（不図示））に測長ビームを照射し、移動鏡からの反射光を受光することにより、基板ステージＰＳＴの位置を計測する。その計測結果は制御装置（不図示）に供給され、制御装置は、干渉計システムの計測結果に従って基板ステージＰＳＴを駆動する。 Position information in the XY plane of substrate stage PST (including rotation information (yawing amount (rotation amount θz in the θz direction), pitching amount (rotation amount θx in the θx direction), rolling amount (rotation amount θy in the θy direction))) is measured by an interferometer system. The interferometer system irradiates a length measurement beam from an optical surface plate 73 onto a movable mirror (or a mirror-finished reflective surface (not shown)) provided at the end of the substrate stage PST, and collects the reflected light from the movable mirror. By receiving light, the position of substrate stage PST is measured. The measurement results are supplied to a control device (not shown), and the control device drives substrate stage PST according to the measurement results of the interferometer system.
　露光装置１０では、露光に先立ってアライメント計測（例えば、ＥＧＡ等）を行い、その結果を用いて、以下の手順で、プレートＰを露光する。まず、制御装置の指示に従い、マスクステージＭＳＴ及び基板ステージＰＳＴをＸ軸方向に同期駆動する。これにより、プレートＰ上の１つめのショット領域への走査露光を行う。１つめのショット領域に対する走査露光が終了すると、制御装置は、基板ステージＰＳＴを２つめのショット領域に対応する位置へ移動（ステッピング）する。そして、２つめのショット領域に対する走査露光を行う。制御装置は、同様に、プレートＰのショット領域間のステッピングとショット領域に対する走査露光とを繰り返して、プレートＰ上の全てのショット領域にマスクＭＳＫのパターンを転写する。 The exposure apparatus 10 performs alignment measurement (eg, EGA, etc.) prior to exposure, and uses the results to expose the plate P according to the following procedure. First, according to instructions from a control device, mask stage MST and substrate stage PST are synchronously driven in the X-axis direction. As a result, the first shot area on the plate P is scanned and exposed. When the scanning exposure for the first shot area is completed, the control device moves (steps) substrate stage PST to a position corresponding to the second shot area. Then, scanning exposure is performed for the second shot area. Similarly, the control device transfers the pattern of the mask MSK to all shot areas on the plate P by repeating stepping between shot areas of the plate P and scanning exposure for the shot areas.
（照明系ＩＯＰの構成）
　次に、本実施形態における照明系ＩＯＰの構成について説明する。照明系ＩＯＰは、投影光学系ＰＬが備える複数の投影光学ユニット１００それぞれに対応する複数の照明ユニット９０を備える。図２は、照明ユニット９０の構成を概略的に示す図である。 (Configuration of lighting system IOP)
Next, the configuration of the illumination system IOP in this embodiment will be described. The illumination system IOP includes a plurality of illumination units 90 corresponding to each of the plurality of projection optical units 100 included in the projection optical system PL. FIG. 2 is a diagram schematically showing the configuration of the lighting unit 90.
　照明ユニット９０は、第１光源ユニットＯＰＵ１と、第２光源ユニットＯＰＵ２と、照明光学系８０と、を備える。 The illumination unit 90 includes a first light source unit OPU1, a second light source unit OPU2, and an illumination optical system 80.
（光源ユニットの構成）
　第１光源ユニットＯＰＵ１は、ヒートシンク４０と、第１光源アレイ２０Ａと、第１拡大光学系３０Ａとを備え、第２光源ユニットＯＰＵ２は、ヒートシンク４０と、第２光源アレイ２０Ｂと、第２拡大光学系３０Ｂとを備える。 (Configuration of light source unit)
The first light source unit OPU1 includes a heat sink 40, a first light source array 20A, and a first enlarging optical system 30A, and the second light source unit OPU2 includes a heat sink 40, a second light source array 20B, and a second enlarging optical system. system 30B.
　図３（Ａ）は、第１光源アレイ２０Ａ及び第２光源アレイ２０Ｂの構成を概略的に示す正面図であり、図３（Ｂ）は、図３（Ａ）のＡ－Ａ線断面図である。なお、図３（Ｂ）では、後述するＬＥＤチップ２３Ａ，２３Ｂのハッチングを省略している。 3(A) is a front view schematically showing the configuration of the first light source array 20A and the second light source array 20B, and FIG. 3(B) is a sectional view taken along the line AA in FIG. 3(A). be. In addition, in FIG. 3(B), hatching of LED chips 23A and 23B, which will be described later, is omitted.
　図３（Ａ）に示すように、第１光源アレイ２０Ａは、基板２１Ａと、基板２１Ａ上に２次元配列された複数（図３（Ａ）では、５×５）のＬＥＤ（Light Emitting Diode）チップ２３Ａを備える。ＬＥＤチップ２３Ａの個数は必要に応じて適宜変更してもよい。 As shown in FIG. 3A, the first light source array 20A includes a substrate 21A and a plurality of (5×5 in FIG. 3A) LEDs (Light Emitting Diodes) two-dimensionally arranged on the substrate 21A. A chip 23A is provided. The number of LED chips 23A may be changed as necessary.
　基板２１Ａは、互いに対向する第１面２１ａと第２面２１ｂとを有し、第１面２１ａ上にＬＥＤチップ２３Ａが配列されている。ＬＥＤチップ２３Ａは、ピッチＰ１で配列されており、ピッチＰ１は、隣り合うＬＥＤチップ２３Ａの中心間の距離である。 The substrate 21A has a first surface 21a and a second surface 21b facing each other, and LED chips 23A are arranged on the first surface 21a. The LED chips 23A are arranged at a pitch P1, and the pitch P1 is the distance between the centers of adjacent LED chips 23A.
　複数のＬＥＤチップ２３Ａは各々、発光部２３１Ａを有し、当該発光部２３１Ａから出射する光のピーク波長は３８０～３９０ｎｍの範囲内にある。すなわち、発光部２３１Ａは、紫外線ＬＥＤ（ＵＶ　ＬＥＤ）である。発光部２３１Ａから出射する光のピーク波長は３８５ｎｍであることがより好ましい。発光部２３１Ａの発光面は正方形であり、その一辺の長さはａ１である。なお、以後の説明において、ＬＥＤチップ２３Ａが配列された２方向を、Ｘ１方向及びＹ１方向とする。Ｘ１方向とＹ１方向とは直交している。また、Ｘ１方向及びＹ１方向に直交する方向をＺ１方向とする。Ｚ１方向は、発光部２３１Ａが出射する光の光軸と略平行である。 Each of the plurality of LED chips 23A has a light emitting section 231A, and the peak wavelength of light emitted from the light emitting section 231A is within the range of 380 to 390 nm. That is, the light emitting section 231A is an ultraviolet LED (UV LED). More preferably, the peak wavelength of the light emitted from the light emitting section 231A is 385 nm. The light emitting surface of the light emitting section 231A is square, and the length of one side thereof is a1. In the following description, the two directions in which the LED chips 23A are arranged are referred to as the X1 direction and the Y1 direction. The X1 direction and the Y1 direction are orthogonal. Further, the direction perpendicular to the X1 direction and the Y1 direction is defined as the Z1 direction. The Z1 direction is approximately parallel to the optical axis of light emitted by the light emitting section 231A.
　第２光源アレイ２０Ｂは、基板２１Ｂと、基板２１Ｂ上に２次元配列された複数（図３（Ａ）では、５×５）のＬＥＤチップ２３Ｂを備える。ＬＥＤチップ２３Ｂの個数は必要に応じて適宜変更してもよい。基板２１Ｂも、互いに対向する第１面２１ａと第２面２１ｂとを有し、第１面２１ａ上にＬＥＤチップ２３Ｂが配列されている。ＬＥＤチップ２３Ｂは、ピッチＰ２で配列されており、ピッチＰ２は、隣り合うＬＥＤチップ２３Ｂの中心間の距離である。ＬＥＤチップ２３Ａの配列ピッチＰ１と、ＬＥＤチップ２３Ｂの配列ピッチＰ２とは、同一でもよいし、異なっていてもよい。 The second light source array 20B includes a substrate 21B and a plurality of (5×5 in FIG. 3A) LED chips 23B two-dimensionally arranged on the substrate 21B. The number of LED chips 23B may be changed as necessary. The substrate 21B also has a first surface 21a and a second surface 21b facing each other, and LED chips 23B are arranged on the first surface 21a. The LED chips 23B are arranged at a pitch P2, and the pitch P2 is the distance between the centers of adjacent LED chips 23B. The arrangement pitch P1 of the LED chips 23A and the arrangement pitch P2 of the LED chips 23B may be the same or different.
　複数のＬＥＤチップ２３Ｂは各々、発光部２３１Ｂを有し、当該発光部２３１Ｂから出射する光のピーク波長は３６０～３７０ｎｍの範囲内にある。すなわち、発光部２３１Ｂは、ＵＶ　ＬＥＤである。発光部２３１Ｂから出射する光のピーク波長は３６５ｎｍであることがより好ましい。発光部２３１Ｂの発光面は正方形であり、その一辺の長さはａ２である。発光部２３１Ｂの発光面の一辺の長さａ２は、発光部２３１Ａの発光面の一辺の長さａ１と同一でもよいし、異なっていてもよい。 Each of the plurality of LED chips 23B has a light emitting section 231B, and the peak wavelength of light emitted from the light emitting section 231B is within the range of 360 to 370 nm. That is, the light emitting section 231B is a UV LED. More preferably, the peak wavelength of the light emitted from the light emitting section 231B is 365 nm. The light emitting surface of the light emitting section 231B is square, and the length of one side thereof is a2. The length a2 of one side of the light emitting surface of the light emitting section 231B may be the same as or different from the length a1 of one side of the light emitting surface of the light emitting section 231A.
　図４は、基板２１Ａ，２１Ｂの背面図である。基板２１Ａ，２１Ｂは、厚みが５ｍｍ以下の金属基板である。基板２１Ａ，２１Ｂは、熱伝導率の高い材料であることが好ましく、例えば、銅基板であってよい。図３（Ｂ）及び図４に示すように、基板２１Ａ，２１Ｂの第１面２１ａとは反対側の第２面２１ｂのうち、平面視において複数のＬＥＤチップ２３Ａ，２３Ｂが配列された範囲に対向する部分ＡＲ１には、複数の凹部２１１（図４では、３×３）が形成されている。本実施形態では、複数の凹部２１１は、Ｘ１方向及びＹ１方向の各々において、等間隔に設けられている。 FIG. 4 is a rear view of the substrates 21A and 21B. The substrates 21A and 21B are metal substrates with a thickness of 5 mm or less. The substrates 21A and 21B are preferably made of a material with high thermal conductivity, and may be, for example, a copper substrate. As shown in FIGS. 3(B) and 4, on the second surface 21b of the substrates 21A, 21B opposite to the first surface 21a, in a range where a plurality of LED chips 23A, 23B are arranged in plan view. A plurality of recesses 211 (3×3 in FIG. 4) are formed in the opposing portion AR1. In this embodiment, the plurality of recesses 211 are provided at equal intervals in each of the X1 direction and the Y1 direction.
　図３（Ｂ）に示すように、凹部２１１は、基板２１Ａ，２１Ｂを貫通しない。本実施形態では、凹部２１１はネジ孔になっており、詳細は後述するが、当該凹部２１１にボルト６１を係合させることにより基板２１Ａ，２１Ｂをヒートシンク４０に固定できるようになっている。 As shown in FIG. 3(B), the recess 211 does not penetrate the substrates 21A and 21B. In this embodiment, the recess 211 is a screw hole, and the boards 21A and 21B can be fixed to the heat sink 40 by engaging the bolt 61 in the recess 211, which will be described in detail later.
　図５は、ヒートシンク４０と、第１光源アレイ２０Ａとを示す斜視図であり、図６は、ヒートシンク４０の－Ｚ１側の面を示す斜視図である。また、図７（Ａ）は、ヒートシンク４０と、第１光源アレイ２０Ａとを示す正面図であり、図７（Ｂ）は、図７（Ａ）のＡ－Ａ線断面図である。第２光源アレイ２０Ｂとヒートシンク４０との関係は、第１光源アレイ２０Ａとヒートシンク４０との関係と同一であるため、以下ではヒートシンク４０と、第１光源アレイ２０Ａとについて説明する。なお、図５においては、一例として、第１光源アレイ２０Ａが１０×１４個のＬＥＤチップ２３Ａを備える場合について図示している。また、図７（Ｂ）において、ＬＥＤチップ２３Ａのハッチングを省略している。 FIG. 5 is a perspective view showing the heat sink 40 and the first light source array 20A, and FIG. 6 is a perspective view showing the -Z1 side surface of the heat sink 40. Further, FIG. 7(A) is a front view showing the heat sink 40 and the first light source array 20A, and FIG. 7(B) is a sectional view taken along the line AA in FIG. 7(A). Since the relationship between the second light source array 20B and the heat sink 40 is the same as the relationship between the first light source array 20A and the heat sink 40, the heat sink 40 and the first light source array 20A will be described below. Note that FIG. 5 illustrates, as an example, a case where the first light source array 20A includes 10×14 LED chips 23A. Moreover, in FIG. 7(B), hatching of the LED chip 23A is omitted.
　例えば図５及び図７（Ａ）に示すように、本実施形態では、ヒートシンク４０上に３つの第１光源アレイ２０Ａが配置されている。なお、ヒートシンク４０上に配置される第１光源アレイ２０Ａの数は、３つに限られるものではなく、２以下であってもよいし４以上であってもよい。すなわち、ヒートシンク４０上には、少なくとも１つの第１光源アレイ２０Ａが配置されていればよい。 For example, as shown in FIGS. 5 and 7(A), in this embodiment, three first light source arrays 20A are arranged on the heat sink 40. Note that the number of first light source arrays 20A arranged on the heat sink 40 is not limited to three, and may be two or less or four or more. That is, it is sufficient that at least one first light source array 20A is disposed on the heat sink 40.
　図６に示すように、ヒートシンク４０は、内部に冷媒を通す流路４０２と、流路４０２に冷媒を供給する供給口４１と、流路４０２を通過した冷媒を排出する排出口４２と、を有し、第１光源アレイ２０Ａが備えるＬＥＤチップ２３Ａを冷却する。冷媒は、液体であってもよいし気体であってもよいが、水であることが好ましい。ＬＥＤチップ２３Ａが備える発光部２３１Ａからの光の輝度は、ＬＥＤチップ２３Ａの温度が上昇すると低下する。換言すると、ＬＥＤチップ２３Ａは、温度が上昇すると発光効率が低下する。ヒートシンク４０によってＬＥＤチップ２３Ａを冷却することによって、第１光源アレイ２０Ａから出射される光の輝度の低下を抑制することができる。 As shown in FIG. 6, the heat sink 40 has a flow path 402 through which the refrigerant passes, a supply port 41 that supplies the refrigerant to the flow path 402, and an exhaust port 42 that discharges the refrigerant that has passed through the flow path 402. and cools the LED chips 23A included in the first light source array 20A. The refrigerant may be a liquid or a gas, but preferably water. The brightness of light from the light emitting section 231A included in the LED chip 23A decreases as the temperature of the LED chip 23A increases. In other words, the luminous efficiency of the LED chip 23A decreases as the temperature increases. By cooling the LED chips 23A with the heat sink 40, it is possible to suppress a decrease in the brightness of the light emitted from the first light source array 20A.
　また、ヒートシンク４０は、図６および図７（Ｂ）に示すように、ヒートシンク４０を貫通する貫通孔４０１を有する。貫通孔４０１は、その直径が２段階に変化する段付貫通孔である。ヒートシンク４０内部の流路４０２は、貫通孔４０１が形成されていない部分に形成されている。また、貫通孔４０１は、第１光源アレイ２０Ａが備える基板２１Ａの第２面２１ｂに設けられた凹部２１１と対応する位置に設けられている。 Further, the heat sink 40 has a through hole 401 that penetrates the heat sink 40, as shown in FIGS. 6 and 7(B). The through hole 401 is a stepped through hole whose diameter changes in two steps. A flow path 402 inside the heat sink 40 is formed in a portion where the through hole 401 is not formed. Further, the through hole 401 is provided at a position corresponding to the recess 211 provided in the second surface 21b of the substrate 21A included in the first light source array 20A.
　図７（Ｂ）に示すように、基板２１Ａとヒートシンク４０との間には、Thermal Interface Material (ＴＩＭ)等の熱伝導部材５０が設けられている。本実施形態では、熱伝導部材５０として熱伝導シートを用いている。熱伝導部材５０は、熱伝導グリス等でもよい。熱伝導部材５０は、基板２１Ａの第２面２１ｂのうち、少なくともＬＥＤチップ２３Ａが配列された範囲に対応する部分ＡＲ１と接触するように設けられている。これにより、基板２１Ａとヒートシンク４０との間の小さなすきまや凹凸を埋め、ヒートシンク４０によりＬＥＤチップ２３Ａを効率よく冷却できる。 As shown in FIG. 7(B), a heat conductive member 50 such as Thermal Interface Material (TIM) is provided between the substrate 21A and the heat sink 40. In this embodiment, a heat conductive sheet is used as the heat conductive member 50. The thermally conductive member 50 may be thermally conductive grease or the like. The thermally conductive member 50 is provided so as to be in contact with a portion AR1 of the second surface 21b of the substrate 21A that corresponds to at least the range where the LED chips 23A are arranged. Thereby, small gaps and unevenness between the substrate 21A and the heat sink 40 can be filled, and the LED chip 23A can be efficiently cooled by the heat sink 40.
　ヒートシンク４０と基板２１Ａとは、貫通孔４０１を挿通し、凹部２１１に係合（嵌合）するボルト６１によって固定されている。ボルト６１は、熱伝導部材５０を貫通している。ボルト６１の長さは、熱伝導部材５０を貫通し、ヒートシンク４０と熱伝導部材５０及び基板２１Ａと熱伝導部材５０とが、それぞれ密着するような長さに設定されている。これにより、ヒートシンク４０によりＬＥＤチップ２３Ａをより効率よく冷却できる。なお、本実施形態では、熱伝導部材５０が各第１光源アレイ２０Ａに対応して設けられているが、例えば１枚のシート状の熱伝導部材５０を３つの第１光源アレイ２０Ａに対して設けてもよい。 The heat sink 40 and the substrate 21A are fixed by bolts 61 that pass through the through holes 401 and engage (fit) into the recesses 211. The bolt 61 passes through the heat conductive member 50. The length of the bolt 61 is set to such a length that it passes through the heat conduction member 50 and allows the heat sink 40 and the heat conduction member 50 and the substrate 21A and the heat conduction member 50 to come into close contact with each other. Thereby, the heat sink 40 can cool the LED chip 23A more efficiently. In this embodiment, the heat conductive member 50 is provided corresponding to each first light source array 20A, but for example, one sheet-like heat conductive member 50 is provided for three first light source arrays 20A. It may be provided.
　次に、第１拡大光学系３０Ａ及び第２拡大光学系３０Ｂについて説明する。図８は、第１光源ユニットＯＰＵ１及び第２光源ユニットＯＰＵ２がそれぞれ備える第１拡大光学系３０Ａ及び第２拡大光学系３０Ｂについて説明するための図である。 Next, the first enlarging optical system 30A and the second enlarging optical system 30B will be explained. FIG. 8 is a diagram for explaining the first enlarging optical system 30A and the second enlarging optical system 30B that are included in the first light source unit OPU1 and the second light source unit OPU2, respectively.
　図８に示すように、第１拡大光学系３０Ａは、各ＬＥＤチップ２３Ａの発光部２３１Ａの拡大像を所定面ＰＰにそれぞれ形成するための拡大光学系である。第１拡大光学系３０Ａは、ＬＥＤチップ２３Ａの配列と対応するように配列された複数のレンズ部３１Ａを備える。レンズ部３１Ａは各々、発光部２３１Ａを、（ＬＥＤチップ２３Ｂの配列ピッチＰ１）／（発光部２３１Ａの発光面の一辺の長さａ１）以上の倍率Ｍ１で拡大投影する両側テレセントリックな光学系である。なお、図８では、図面の明瞭化のために、Ｙ１方向に沿って一列に並んだ４つのＬＥＤチップ２３Ａ（２３Ｂ）だけを示している。 As shown in FIG. 8, the first enlarging optical system 30A is an enlarging optical system for forming an enlarged image of the light emitting portion 231A of each LED chip 23A on a predetermined plane PP. The first magnifying optical system 30A includes a plurality of lens sections 31A arranged to correspond to the arrangement of the LED chips 23A. Each of the lens sections 31A is a double-sided telecentric optical system that enlarges and projects the light emitting section 231A at a magnification M1 equal to or greater than (array pitch P1 of LED chips 23B)/(length a1 of one side of the light emitting surface of the light emitting section 231A). . In addition, in FIG. 8, for clarity of the drawing, only four LED chips 23A (23B) lined up in a row along the Y1 direction are shown.
　第２拡大光学系３０Ｂは、各ＬＥＤチップ２３Ｂの発光部２３１Ｂの拡大像を所定面ＰＰにそれぞれ形成するための拡大光学系である。第２拡大光学系３０Ｂは、ＬＥＤチップ２３Ｂの配列と対応するように配列された複数のレンズ部３１Ｂを備える。レンズ部３１Ｂは各々、発光部２３１Ｂを、（ＬＥＤチップ２３Ａの配列ピッチＰ２）／（発光部２３１Ｂの発光面の一辺の長さａ２）以上の倍率Ｍ２で拡大投影する両側テレセントリックな光学系である。 The second enlarging optical system 30B is an enlarging optical system for forming an enlarged image of the light emitting portion 231B of each LED chip 23B on a predetermined plane PP. The second magnifying optical system 30B includes a plurality of lens sections 31B arranged to correspond to the arrangement of the LED chips 23B. Each lens section 31B is a double-sided telecentric optical system that enlarges and projects the light emitting section 231B at a magnification M2 equal to or greater than (array pitch P2 of the LED chips 23A)/(length a2 of one side of the light emitting surface of the light emitting section 231B). .
　本実施形態では、レンズ部３１Ａ，３１Ｂは各々、４枚の平凸レンズを備えているが、これに限定されるものではなく、レンズ部３１Ａ，３１Ｂは、例えば２枚の両凸レンズを備えていてもよいし、３枚の両凸レンズを備えていてもよい。また、レンズ部３１Ａ，３１Ｂは、例えば、平凸レンズと両凸レンズとを備えていてもよい。 In this embodiment, each of the lens sections 31A and 31B includes four plano-convex lenses, but the invention is not limited to this. For example, the lens sections 31A and 31B include two biconvex lenses. Alternatively, it may include three biconvex lenses. Further, the lens portions 31A and 31B may include, for example, a plano-convex lens and a biconvex lens.
（照明光学系８０の構成）
　図２に戻り、照明光学系８０は、第１のダイクロイックミラーＤＭ１を含んで構成される第１の集光光学系（第１の光学系）８１Ａと、第２の集光光学系（第２の光学系）８１Ｂと、第２のダイクロイックミラーＤＭ２と、結像光学系８３と、フライアイレンズＦＥＬと、コンデンサー光学系８４と、を備える。 (Configuration of illumination optical system 80)
Returning to FIG. 2, the illumination optical system 80 includes a first condensing optical system (first optical system) 81A that includes a first dichroic mirror DM1, and a second condensing optical system (second optical system). (optical system) 81B, a second dichroic mirror DM2, an imaging optical system 83, a fly's eye lens FEL, and a condenser optical system 84.
　第１の集光光学系８１Ａは、第１拡大光学系３０Ａによって形成される発光部２３１Ａの拡大像の瞳を形成する。すなわち、第１の集光光学系８１Ａの後側焦点位置が瞳の位置となる。第１の集光光学系８１Ａは、光路の途中に第１のダイクロイックミラーＤＭ１を有し、ピーク波長３８５ｎｍの光の少なくとも一部を反射する。これにより、第２のダイクロイックミラーＤＭ２に光束が入射する。なお、第１の集光光学系８１Ａは、第１のダイクロイックミラーＤＭ１を備えない構成としてもよく、その場合は、第１光源ユニットＯＰＵ１の配置と第１の集光光学系８１Ａの各レンズの配置を適宜調整して第２のダイクロイックミラーＤＭ２に光束が入射するように構成すればよい。また、第１の集光光学系８１Ａは、１枚のレンズで構成されていてもよいし、複数のレンズを含むレンズ群で構成されていてもよい。 The first condensing optical system 81A forms a pupil of an enlarged image of the light emitting section 231A formed by the first enlarging optical system 30A. That is, the rear focal position of the first condensing optical system 81A is the position of the pupil. The first condensing optical system 81A includes a first dichroic mirror DM1 in the middle of the optical path, and reflects at least a portion of the light having a peak wavelength of 385 nm. As a result, the light beam enters the second dichroic mirror DM2. Note that the first condensing optical system 81A may be configured without the first dichroic mirror DM1, and in that case, the arrangement of the first light source unit OPU1 and each lens of the first condensing optical system 81A may be changed. The arrangement may be appropriately adjusted so that the light beam is incident on the second dichroic mirror DM2. Further, the first condensing optical system 81A may be composed of one lens, or may be composed of a lens group including a plurality of lenses.
　第２の集光光学系８１Ｂは、第２拡大光学系３０Ｂによって形成される発光部２３１Ｂの拡大像の瞳を形成する。すなわち、第２の集光光学系８１Ｂの後側焦点位置が瞳の位置となる。第２の集光光学系８１Ｂは、１枚のレンズで構成されていてもよいし、複数枚のレンズを含むレンズ群で構成されていてもよい。 The second condensing optical system 81B forms a pupil of an enlarged image of the light emitting section 231B formed by the second enlarging optical system 30B. That is, the rear focal position of the second condensing optical system 81B is the position of the pupil. The second condensing optical system 81B may be composed of one lens, or may be composed of a lens group including a plurality of lenses.
　第２のダイクロイックミラーＤＭ２は、ピーク波長３８５ｎｍの光の少なくとも一部を透過し、ピーク波長３６５ｎｍの光の少なくとも一部を反射する。これにより、第１の集光光学系８１Ａによって形成された瞳像と、第２の集光光学系８１Ｂによって形成された瞳像とを重ね合わせた合成像が形成される。 The second dichroic mirror DM2 transmits at least part of the light with a peak wavelength of 385 nm and reflects at least part of the light with a peak wavelength of 365 nm. Thereby, a composite image is formed in which the pupil image formed by the first condensing optical system 81A and the pupil image formed by the second condensing optical system 81B are superimposed.
　本実施形態において、第２のダイクロイックミラーＤＭ２は、第１の集光光学系８１Ａによって形成された瞳像と、第２の集光光学系８１Ｂによって形成された瞳像とを重ね合わせて合成像を形成する。すなわち、第２のダイクロイックミラーＤＭ２は、第１の集光光学系８１Ａの後側焦点位置であって、第２の集光光学系８１Ｂの後側焦点位置である位置に配置される。これにより、第２のダイクロイックミラーＤＭ２は、第１光源ユニットＯＰＵ１から出射した光と、第２光源ユニットＯＰＵ２から出射した光と、にケーラー照明される。ケーラー照明することにより、第１の集光光学系８１Ａによって形成された瞳像の光束の照度変化及び第２の集光光学系８１Ｂによって形成された瞳像の光束の照度変化を小さくすることができる。なお、本実施形態の構成に限定されず、第１の集光光学系８１Ａと第２の集光光学系８１Ｂとが、それぞれ第２のダイクロイックミラーＤＭ２に第１光源ユニットＯＰＵ１の像と第２光源ユニットＯＰＵ２の像とを形成するクリティカル照明を行うように構成されてもよい。 In this embodiment, the second dichroic mirror DM2 superimposes the pupil image formed by the first condensing optical system 81A and the pupil image formed by the second condensing optical system 81B to create a composite image. form. That is, the second dichroic mirror DM2 is arranged at a position that is the rear focal position of the first condensing optical system 81A and the rear focal position of the second condensing optical system 81B. Thereby, the second dichroic mirror DM2 is illuminated by Koehler illumination with the light emitted from the first light source unit OPU1 and the light emitted from the second light source unit OPU2. By performing Koehler illumination, it is possible to reduce the change in illuminance of the light flux of the pupil image formed by the first condensing optical system 81A and the change in the illuminance of the light flux of the pupil image formed by the second condensing optical system 81B. can. Note that, without being limited to the configuration of the present embodiment, the first condensing optical system 81A and the second condensing optical system 81B respectively attach the image of the first light source unit OPU1 and the second condensing optical system to the second dichroic mirror DM2. It may be configured to perform critical illumination to form an image of the light source unit OPU2.
　照明ユニット９０には、ピーク波長３８５ｎｍの光をモニタリングするための検出器ＤＴ１０と、ピーク波長３６５ｎｍの光をモニタリングするための検出器ＤＴ２０と、ピーク波長３８５ｎｍの光とピーク波長３６５ｎｍの光とをモニタリングするための検出器ＤＴ３０とが設けられている。 The illumination unit 90 includes a detector DT10 for monitoring light with a peak wavelength of 385 nm, a detector DT20 for monitoring light with a peak wavelength of 365 nm, and a detector DT20 for monitoring light with a peak wavelength of 385 nm and light with a peak wavelength of 365 nm. A detector DT30 is provided for the detection.
　具体的には、検出器ＤＴ１０は、第１のダイクロイックミラーＤＭ１に反射されたピーク波長３８５ｎｍの光の照度を検出する。検出器ＤＴ２０は、第２のダイクロイックミラーＤＭ２に反射されたピーク波長３６５ｎｍの光の照度を検出する。検出器ＤＴ３０は、第２のダイクロイックミラーＤＭ２により意図せず反射された３８５ｎｍの光の照度と、第２のダイクロイックミラーＤＭ２が意図せず透過した３６５ｎｍの光の照度と、を検出する。 Specifically, the detector DT10 detects the illuminance of the light with a peak wavelength of 385 nm reflected by the first dichroic mirror DM1. The detector DT20 detects the illuminance of the light having a peak wavelength of 365 nm reflected by the second dichroic mirror DM2. The detector DT30 detects the illuminance of the 385 nm light unintentionally reflected by the second dichroic mirror DM2 and the illuminance of the 365 nm light unintentionally transmitted by the second dichroic mirror DM2.
　検出器ＤＴ１０～ＤＴ３０の検出結果は不図示の制御装置に出力され、制御装置は検出器ＤＴ１０～ＤＴ３０の検出結果に基づいて、第１光源ユニットＯＰＵ１及び第２光源ユニットＯＰＵ２がそれぞれ備えるＬＥＤチップ２３Ａ及び２３Ｂに供給する電流の値等を制御する。 The detection results of the detectors DT10 to DT30 are output to a control device (not shown), and the control device outputs the LED chips 23A of the first light source unit OPU1 and the second light source unit OPU2, respectively, based on the detection results of the detectors DT10 to DT30. and controls the value of the current supplied to 23B.
　結像光学系８３は、第２のダイクロイックミラーＤＭ２が合成した合成像をフライアイレンズＦＥＬの入射端に等倍投影する両側テレセントリックな光学系である。なお、結像光学系８３は、第２のダイクロイックミラーＤＭ２が合成した合成像をフライアイレンズＦＥＬの入射端に縮小投影してもよい。 The imaging optical system 83 is a double-sided telecentric optical system that projects the composite image synthesized by the second dichroic mirror DM2 at the same magnification onto the incident end of the fly's eye lens FEL. Note that the imaging optical system 83 may reduce and project the composite image synthesized by the second dichroic mirror DM2 onto the incident end of the fly's eye lens FEL.
　フライアイレンズＦＥＬは、たとえば正の屈折力を有する多数のレンズエレメントをその光軸が基準光軸ＡＸと平行になるように縦横に且つ稠密に配列することによって構成されている。フライアイレンズＦＥＬを構成する各レンズエレメントは、マスクＭＳＫ上において形成すべき照野の形状（ひいてはプレートＰ上において形成すべき露光領域の形状）と相似な矩形状の断面を有する。 The fly's eye lens FEL is constructed by densely arranging a large number of lens elements each having, for example, positive refractive power, vertically and horizontally so that their optical axes are parallel to the reference optical axis AX. Each lens element constituting the fly's eye lens FEL has a rectangular cross section similar to the shape of the illumination field to be formed on the mask MSK (and thus the shape of the exposure area to be formed on the plate P).
　したがって、フライアイレンズＦＥＬに入射した光束は多数のレンズエレメントにより波面分割され、各レンズエレメントの後側焦点面（出射面）またはその近傍には１つの光源像がそれぞれ形成される。すなわち、フライアイレンズＦＥＬの後側焦点面（出射面）またはその近傍には、多数の光源像からなる実質的な面光源すなわち二次光源が形成される。フライアイレンズＦＥＬの後側焦点面（出射面）またはその近傍に形成された二次光源からの光束は、その近傍に配置された開口絞り８５に入射する。なお、本実施形態においてフライアイレンズＦＥＬの後側焦点面（出射面）と、第１光源アレイ２０Ａ及び第２光源アレイ２０Ｂとは、光学的に共役である。 Therefore, the light beam incident on the fly's eye lens FEL is wavefront-divided by a large number of lens elements, and one light source image is formed at or near the rear focal plane (output surface) of each lens element. That is, a substantial surface light source, ie, a secondary light source, consisting of a large number of light source images is formed at or near the rear focal plane (output surface) of the fly's eye lens FEL. A light beam from a secondary light source formed at or near the rear focal plane (output surface) of the fly's eye lens FEL enters an aperture stop 85 arranged near it. In this embodiment, the rear focal plane (output surface) of the fly's eye lens FEL and the first light source array 20A and the second light source array 20B are optically conjugate.
　開口絞り８５は、投影光学系ＰＬの入射瞳面と光学的にほぼ共役な位置に配置され、二次光源の照明に寄与する範囲を規定するための可変開口部を有する。そして、開口絞り８５は、可変開口部の開口径を変化させることにより、照明条件を決定するσ値（投影光学系の瞳面の開口径に対するその瞳面上での二次光源像の口径の比）を所望の値に設定する。開口絞り８５を介した二次光源からの光は、コンデンサー光学系８４の集光作用を受けた後、所定のパターンが形成されたマスクＭＳＫを重畳的に照明する。 The aperture stop 85 is arranged at a position that is optically approximately conjugate with the entrance pupil plane of the projection optical system PL, and has a variable aperture for defining the range that contributes to the illumination of the secondary light source. The aperture stop 85 changes the aperture diameter of the variable aperture to determine the σ value (the aperture of the secondary light source image on the pupil plane of the projection optical system relative to the aperture diameter of the pupil plane of the projection optical system), which determines the illumination condition. ratio) to the desired value. The light from the secondary light source passes through the aperture diaphragm 85 and, after being condensed by the condenser optical system 84, illuminates the mask MSK in which a predetermined pattern is formed in a superimposed manner.
　なお、第１光源ユニットＯＰＵ１及び第２光源ユニットＯＰＵ２が出射する光の波長は上述したものに限られず、３６０～４４０ｎｍの範囲内にピーク波長を有する光を出射するＬＥＤチップを適宜組み合わせて第１光源ユニットＯＰＵ１と第２光源ユニットＯＰＵ２とを構成してもよい。例えば、第１光源ユニットＯＰＵ１がピーク波長４０５ｎｍの光を出射し、かつ、第２光源ユニットＯＰＵ２がピーク波長３８５ｎｍの光を出射するように構成してもよい。また、第１光源ユニットＯＰＵ１がピーク波長３９５ｎｍの光を出射し、かつ、第２光源ユニットＯＰＵ２がピーク波長３８５ｎｍの光を出射するように構成してもよい。第１光源ユニットＯＰＵ１から出射する光の波長と第２光源ユニットＯＰＵ２が出射する光の波長の組み合わせは、これらの例示には限られない。なお、第１光源ユニットＯＰＵ１が出射する光の波長と第２光源ユニットＯＰＵ２が出射する光の波長の組み合わせを、本第１実施形態以外の組み合わせとする場合は、使用する波長に応じて適宜ダイクロイックミラーの材料を変更することが好ましい。 Note that the wavelengths of the light emitted by the first light source unit OPU1 and the second light source unit OPU2 are not limited to those described above, and the first light source unit OPU1 and the second light source unit OPU2 may be The light source unit OPU1 and the second light source unit OPU2 may be configured. For example, the first light source unit OPU1 may emit light with a peak wavelength of 405 nm, and the second light source unit OPU2 may emit light with a peak wavelength of 385 nm. Alternatively, the first light source unit OPU1 may emit light with a peak wavelength of 395 nm, and the second light source unit OPU2 may emit light with a peak wavelength of 385 nm. The combination of the wavelength of the light emitted from the first light source unit OPU1 and the wavelength of the light emitted from the second light source unit OPU2 is not limited to these examples. Note that if the combination of the wavelength of the light emitted by the first light source unit OPU1 and the wavelength of the light emitted by the second light source unit OPU2 is a combination other than that of the first embodiment, dichroic dichroic may be used as appropriate depending on the wavelength used. It is preferable to change the material of the mirror.
（実験）
　実施形態に係る方法でヒートシンクと基板とを固定した場合と、比較例に係る方法でヒートシンクと基板とを固定した場合と、で基板の温度を求めた。ここで、光源アレイに配置されたＬＥＤチップの個数は５×５個とした。 (experiment)
The temperature of the substrate was determined when the heat sink and the substrate were fixed by the method according to the embodiment and when the heat sink and the substrate were fixed by the method according to the comparative example. Here, the number of LED chips arranged in the light source array was 5×5.
（比較例）
　まず、比較例に係る、ヒートシンク１０４０と基板１０２１との固定方法について説明する。図９（Ａ）は、比較例に係るヒートシンク１０４０と光源アレイ１０２０とを示す正面図であり、図９（Ｂ）は、図９（Ａ）のＡ－Ａ線断面図である。 (Comparative example)
First, a method of fixing the heat sink 1040 and the substrate 1021 according to a comparative example will be described. 9(A) is a front view showing a heat sink 1040 and a light source array 1020 according to a comparative example, and FIG. 9(B) is a sectional view taken along the line AA in FIG. 9(A).
　図９（Ａ）に示すように、比較例においても、ヒートシンク１０４０上に３つの光源アレイ１０２０が配置されている。各光源アレイ１０２０は、基板１０２１と、複数のＬＥＤチップ２３Ａとを備える。基板１０２１上に設けられるＬＥＤチップ２３Ａの数、及び配列ピッチは、第１光源アレイ２０Ａと同一である。 As shown in FIG. 9A, also in the comparative example, three light source arrays 1020 are arranged on the heat sink 1040. Each light source array 1020 includes a substrate 1021 and a plurality of LED chips 23A. The number of LED chips 23A provided on the substrate 1021 and the arrangement pitch are the same as those of the first light source array 20A.
　図９（Ｂ）に示すように、比較例に係るヒートシンク１０４０は、貫通孔１４０１と、固定ブロック４５と、を備えている。固定ブロック４５は、ボルト４６によってヒートシンク１０４０に固定されている。また、固定ブロック４５の＋Ｚ１側の端部には、ネジ孔が形成されている。 As shown in FIG. 9(B), the heat sink 1040 according to the comparative example includes a through hole 1401 and a fixing block 45. Fixed block 45 is fixed to heat sink 1040 with bolts 46. Further, a screw hole is formed at the end of the fixed block 45 on the +Z1 side.
　基板１０２１には、複数のＬＥＤチップ２３Ａが配列された範囲外の４箇所に貫通孔が設けられている。＋Ｚ１側から当該貫通孔にボルト６０を挿通し、固定ブロック４５の＋Ｚ１側の端部に形成されたネジ孔に係合させることで、基板１０２１がヒートシンク１０４０に固定される。その他の構成は、実施形態と同一であるため詳細な説明を省略する。 Through holes are provided in the substrate 1021 at four locations outside the area where the plurality of LED chips 23A are arranged. The board 1021 is fixed to the heat sink 1040 by inserting the bolt 60 into the through hole from the +Z1 side and engaging the screw hole formed at the end of the fixing block 45 on the +Z1 side. The other configurations are the same as those in the embodiment, so detailed description will be omitted.
　図９（Ａ）に示すように、基板１０２１の表面に、サーミスタ２５を配置し、基板１０２１の表面温度を計測した。基板２１Ａについても同様に、その表面にサーミスタ２５を配置し表面温度を計測した。サーミスタ２５は、基板２１Ａと基板１０２１とにおいて同一の位置に配置した。図１０は、計測結果を示す図である。 As shown in FIG. 9(A), a thermistor 25 was placed on the surface of the substrate 1021, and the surface temperature of the substrate 1021 was measured. Similarly, a thermistor 25 was placed on the surface of the substrate 21A to measure the surface temperature. Thermistor 25 was placed at the same position on substrate 21A and substrate 1021. FIG. 10 is a diagram showing the measurement results.
　図１０の横軸は、各基板を示しており、「左」は、－Ｙ１側に配置された基板、「中央」は、中央に配置された基板、「右」は、＋Ｙ１側に配置された基板を示し、「平均」はすべての基板の平均値を示す。図１０の縦軸は、サーミスタ２５の計測値から求めた温度を示す。 The horizontal axis in FIG. 10 indicates each board, and the "left" is the board placed on the -Y1 side, the "center" is the board placed in the center, and the "right" is the board placed on the +Y1 side. "Average" indicates the average value for all substrates. The vertical axis in FIG. 10 indicates the temperature determined from the measurement value of the thermistor 25.
　図１０に示すように、いずれの基板においても、実施形態に係る方法によってヒートシンク４０と基板２１Ａとを固定することで、比較例に係る方法よりも基板の表面温度が低下していることが確認された。すなわち、実施形態に係る固定方法の方が、比較例に係る固定方法よりも、ＬＥＤチップ２３Ａの冷却効果が高いことが確認された。これは、以下の理由によるものと考えられる。比較例に係る固定方法では、複数のＬＥＤチップ２３Ａが配列された範囲外の４箇所で基板１０２１をヒートシンク１０４０に固定するため、基板１０２１の反りやたわみによって、ＬＥＤチップ２３Ａが配列された範囲において、熱伝導部材５０と基板１０２１及びヒートシンク１０４０との密着性が不十分となってしまう。一方、実施形態に係る固定方法では、ＬＥＤチップ２３Ａが配列された範囲内の９箇所で基板２１Ａをヒートシンク４０に固定することができるため、ＬＥＤチップ２３Ａが配列された範囲における基板２１Ａの反りやたわみを抑制することができ、熱伝導部材５０と基板２１Ａ及びヒートシンク４０との密着性を高めることができる。この結果、実施形態に係る固定方法の方が、比較例に係る固定方法よりも、ＬＥＤチップ２３Ａの冷却効果が高くなると考えられる。 As shown in FIG. 10, it was confirmed that in any of the substrates, by fixing the heat sink 40 and the substrate 21A using the method according to the embodiment, the surface temperature of the substrate was lower than that using the method according to the comparative example. It was done. That is, it was confirmed that the fixing method according to the embodiment has a higher cooling effect on the LED chip 23A than the fixing method according to the comparative example. This is considered to be due to the following reasons. In the fixing method according to the comparative example, the board 1021 is fixed to the heat sink 1040 at four locations outside the range where the plurality of LED chips 23A are arranged. , the adhesion between the heat conductive member 50, the substrate 1021, and the heat sink 1040 becomes insufficient. On the other hand, in the fixing method according to the embodiment, since the substrate 21A can be fixed to the heat sink 40 at nine locations within the range where the LED chips 23A are arranged, the warping of the board 21A in the range where the LED chips 23A are arranged can be avoided. Deflection can be suppressed, and the adhesion between the heat conductive member 50, the substrate 21A, and the heat sink 40 can be improved. As a result, it is thought that the fixing method according to the embodiment has a higher cooling effect on the LED chip 23A than the fixing method according to the comparative example.
　このように、基板２１Ａの第２面２１ｂのうち、ＬＥＤチップ２３Ａが配列された範囲と対応する部分ＡＲ１に形成された凹部２１１を利用して、基板２１Ａをヒートシンク４０に固定することで、比較例のようにＬＥＤチップ２３Ａが配列された範囲外に基板１０２１をヒートシンク１０４０とを固定する機構を設けて基板１０２１とヒートシンク１０４０とを固定する場合よりも、ＬＥＤ２３Ａを効率的に冷却できることが確かめられた。 In this way, by fixing the substrate 21A to the heat sink 40 using the recess 211 formed in the portion AR1 corresponding to the range where the LED chips 23A are arranged on the second surface 21b of the substrate 21A, the comparison can be made. It has been confirmed that the LED 23A can be cooled more efficiently than when the substrate 1021 and the heat sink 1040 are fixed by providing a mechanism for fixing the substrate 1021 and the heat sink 1040 outside the range where the LED chips 23A are arranged as in the example. Ta.
　以上、詳細に説明したように、本実施形態によれば、第１光源ユニットＯＰＵ１は、互いに対向する第１面２１ａと第２面２１ｂとを有する基板２１Ａと、基板２１Ａの第１面２１ａ上に２次元配列されたＬＥＤチップ２３Ａと、ヒートシンク４０と、基板２１Ａとヒートシンク４０との間に設けられた熱伝導部材５０と、を備える。基板２１Ａは、第２面２１ｂのうち、平面視においてＬＥＤチップ２３Ａが配列された範囲に対向する部分ＡＲ１に複数の凹部２１１を有し、ヒートシンク４０は、貫通孔４０１を有し、基板２１Ａとヒートシンク４０とは、貫通孔４０１を挿通するとともに凹部２１１に嵌合するボルト６１で固定されている。これにより、例えば、ＬＥＤチップ２３Ａが配列された範囲外において、基板２１Ａとヒートシンク４０とを固定する場合と比較して、ＬＥＤチップ２３Ａが配列された範囲における基板２１Ａの反りやたわみを抑制することができるので、熱伝導部材５０と基板２１Ａ及びヒートシンク４０との密着性を高めることができる。このため、ＬＥＤチップ２３Ａを効率的に冷却することができる。これにより、ＬＥＤチップ２３Ａの温度上昇によって発光部２３１Ａから出射される光の輝度が低下することを抑制することができる。 As described above in detail, according to the present embodiment, the first light source unit OPU1 includes a substrate 21A having a first surface 21a and a second surface 21b facing each other, and The device includes LED chips 23A arranged two-dimensionally, a heat sink 40, and a heat conductive member 50 provided between the substrate 21A and the heat sink 40. The substrate 21A has a plurality of recesses 211 in a portion AR1 of the second surface 21b that faces the range where the LED chips 23A are arranged in a plan view, and the heat sink 40 has a through hole 401, which is connected to the substrate 21A. The heat sink 40 is fixed to the heat sink 40 with a bolt 61 that passes through the through hole 401 and fits into the recess 211 . As a result, for example, compared to the case where the substrate 21A and the heat sink 40 are fixed outside the area where the LED chips 23A are arranged, warpage and deflection of the substrate 21A in the area where the LED chips 23A are arranged can be suppressed. Therefore, the adhesion between the heat conductive member 50, the substrate 21A, and the heat sink 40 can be improved. Therefore, the LED chip 23A can be efficiently cooled. Thereby, it is possible to suppress a decrease in the brightness of the light emitted from the light emitting section 231A due to a rise in the temperature of the LED chip 23A.
　また、本実施形態において、凹部２１１はネジ孔である。これにより、ボルト６１を利用して簡単に基板２１Ａとヒートシンク４０とを固定することができる。 Furthermore, in this embodiment, the recess 211 is a screw hole. Thereby, the board 21A and the heat sink 40 can be easily fixed using the bolts 61.
　また、本実施形態において、凹部２１１は、ＬＥＤチップ２３Ａが配列された範囲に対向する部分ＡＲ１に複数形成され、貫通孔４０１は、複数の凹部２１１に対応して複数形成されている。これにより、基板２１Ａとヒートシンク４０とを、複数箇所で固定できるため、基板２１Ａと熱伝導部材５０と、熱伝導部材５０とヒートシンク４０とを密着させることができ、ＬＥＤチップ２３Ａをより効率的に冷却することができる。 Furthermore, in this embodiment, a plurality of recesses 211 are formed in the portion AR1 facing the range in which the LED chips 23A are arranged, and a plurality of through holes 401 are formed corresponding to the plurality of recesses 211. As a result, the board 21A and the heat sink 40 can be fixed at multiple locations, so the board 21A and the heat conductive member 50 and the heat conductive member 50 and the heat sink 40 can be brought into close contact with each other, and the LED chip 23A can be fixed more efficiently. Can be cooled.
　また、本実施形態において、複数の凹部２１１及び貫通孔４０１は、等間隔に形成されている。これにより、ボルト６１から基板２１Ａに作用する力を均等にすることができるため、基板２１Ａの歪み、たわみ等を抑制することができる。 Furthermore, in this embodiment, the plurality of recesses 211 and through holes 401 are formed at equal intervals. This makes it possible to equalize the force acting on the board 21A from the bolts 61, so that distortion, deflection, etc. of the board 21A can be suppressed.
　また、本実施形態において、凹部２１１は、基板２１Ａを貫通していない。これにより、ボルト６１がＬＥＤチップ２３Ａに接触することを防止することができる。 Furthermore, in this embodiment, the recess 211 does not penetrate the substrate 21A. This can prevent the bolt 61 from coming into contact with the LED chip 23A.
　また、本実施形態において、基板２１Ａは金属基板である。これにより、凹部２１１を容易に形成することができる。 Furthermore, in this embodiment, the substrate 21A is a metal substrate. Thereby, the recess 211 can be easily formed.
　なお、上記実施形態において、ヒートシンク４０と基板２１Ａとの間には、熱伝導部材５０が設けられていたが、熱伝導部材５０を省略してもよい。すなわち、ヒートシンク４０と基板２１Ａとが直接接触するようにボルト６１によってヒートシンク４０と基板２１Ａとを固定してもよい。このようにしても、ＬＥＤチップ２３Ａを冷却することができ、ＬＥＤチップ２３Ａの発光部２３１Ａが出射する光の輝度が、ＬＥＤチップ２３Ａの温度上昇によって低下することを抑制することができる。 Note that in the above embodiment, the heat conduction member 50 was provided between the heat sink 40 and the substrate 21A, but the heat conduction member 50 may be omitted. That is, the heat sink 40 and the substrate 21A may be fixed with the bolts 61 so that the heat sink 40 and the substrate 21A are in direct contact with each other. Even in this case, the LED chip 23A can be cooled, and the brightness of the light emitted by the light emitting part 231A of the LED chip 23A can be prevented from decreasing due to a rise in the temperature of the LED chip 23A.
　また、上記実施形態において、凹部２１１はネジ孔であるとしたが、これに限られるものではない。凹部２１１は、ねじ溝を有さない孔であってもよい。この場合、ボルト６１に代えて、凹部２１１に嵌合する固定部材を使用し、当該固定部材をはんだ付けや接着剤によって基板２１Ａに固定してもよい。 In addition, in the above embodiment, the recess 211 is a screw hole, but it is not limited to this. The recess 211 may be a hole without a thread groove. In this case, instead of the bolt 61, a fixing member that fits into the recess 211 may be used, and the fixing member may be fixed to the substrate 21A by soldering or adhesive.
　また、上記実施形態において、凹部２１１を複数設けていたが、凹部２１１は、基板２１Ａの第２面２１ｂのうち、ＬＥＤチップ２３ＡにＬＥＤチップ２３Ａが配列された部分と対応する部分に少なくとも１つ形成されていればよい。また、凹部２１１の数は、上記実施形態に限られるものではなく、８個以下であってもよいし、１０個以上であってもよい。 Further, in the above embodiment, a plurality of recesses 211 are provided, and at least one recess 211 is provided in a portion of the second surface 21b of the substrate 21A that corresponds to a portion where the LED chips 23A are arranged. It is sufficient if it is formed. Further, the number of recesses 211 is not limited to the above embodiment, and may be 8 or less, or 10 or more.
　また、上記実施形態において、凹部２１１は、Ｘ１方向及びＹ１方向のそれぞれにおいて、等間隔に設けられていたが、不規則な間隔で設けられていてもよい。この場合、ヒートシンク４０の貫通孔４０１を、凹部２１１の位置に対応する位置に形成すればよい。 Furthermore, in the above embodiment, the recesses 211 are provided at equal intervals in each of the X1 direction and the Y1 direction, but they may be provided at irregular intervals. In this case, the through hole 401 of the heat sink 40 may be formed at a position corresponding to the position of the recess 211.
　また、上記実施形態において、ヒートシンク４０は、内部に冷媒が流通する流路４０２を有していたが、これに限られるものではない。ヒートシンク４０は、例えば、フィンタイプのヒートシンクであってもよい。 Furthermore, in the above embodiment, the heat sink 40 had the flow path 402 through which the refrigerant flows inside, but the heat sink 40 is not limited to this. The heat sink 40 may be, for example, a fin type heat sink.
　また、上記実施形態において、図１１に示すように、ヒートシンク４０の基板２１Ａが配列された面とは反対側の面に、ＬＥＤチップ２３Ａを制御する制御部ＣＴＲを配置してもよい。この場合、ヒートシンク４０によって制御部ＣＴＲを冷却することができるので、制御部ＣＴＲを冷却する機構を別途設けなくてもよく、第１光源ユニットＯＰＵ１の構成をシンプルにすることができる。また、制御部ＣＴＲからＬＥＤチップ２３Ａに信号を送信するケーブルＣＢＬが長くなることを抑制できる。ケーブルが長くなると信号にノイズがのりやすくなるが、ケーブルを短くできるため、ノイズを低減することができる。第２光源ユニットＯＰＵ２についても同様である。 Furthermore, in the above embodiment, as shown in FIG. 11, a control unit CTR for controlling the LED chips 23A may be arranged on the surface of the heat sink 40 opposite to the surface on which the substrates 21A are arranged. In this case, since the control unit CTR can be cooled by the heat sink 40, there is no need to separately provide a mechanism for cooling the control unit CTR, and the configuration of the first light source unit OPU1 can be simplified. Moreover, it is possible to suppress the length of the cable CBL for transmitting a signal from the control unit CTR to the LED chip 23A. Longer cables tend to introduce noise into the signal, but since the cables can be made shorter, noise can be reduced. The same applies to the second light source unit OPU2.
　また、上記実施形態及び変形例では、照明ユニット９０は、第１光源ユニットＯＰＵ１と、第２光源ユニットＯＰＵ２と、第２のダイクロイックミラーＤＭ２を含む照明光学系８０と、を備えていたがこれに限られるものではない。例えば、照明ユニット９０は、第１光源ユニットＯＰＵ１と第２光源ユニットＯＰＵ２とのいずれか一方のみを有していてもよい。この場合、照明光学系８０は、第１光源ユニットＯＰＵ１又は第２光源ユニットＯＰＵ２から出射された光をマスクＭＳＫに導くことができれば、任意の構成を有することができる。 Further, in the above embodiment and modification, the illumination unit 90 includes the first light source unit OPU1, the second light source unit OPU2, and the illumination optical system 80 including the second dichroic mirror DM2. It is not limited. For example, the lighting unit 90 may include only one of the first light source unit OPU1 and the second light source unit OPU2. In this case, the illumination optical system 80 can have any configuration as long as it can guide the light emitted from the first light source unit OPU1 or the second light source unit OPU2 to the mask MSK.
　上述した実施形態は本発明の好適な実施の例である。但し、これに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変形実施可能である。 The embodiments described above are examples of preferred implementations of the present invention. However, the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention.
１０　露光装置
２０Ａ　第１光源アレイ
２０Ｂ　第２光源アレイ
２１Ａ，２１Ｂ　基板
２１ａ　第１面
２１ｂ　第２面
２３Ａ，２３Ｂ　ＬＥＤチップ
３０Ａ　第１拡大光学系
３０Ｂ　第２拡大光学系
３１Ａ，３１Ｂ　レンズ部
４０　ヒートシンク
５０　熱伝導部材
６１　ボルト
２１１　凹部
２３１Ａ，２３１Ｂ　発光部
４０１　貫通孔
８０　照明光学系
９０　照明ユニット
１００　投影光学ユニット
ＣＴＲ　制御部
ＤＭ２　第２のダイクロイックミラー
ＭＳＫ　マスク
ＯＰＵ１　第１光源ユニット
ＯＰＵ２　第２光源ユニット
Ｐ　ガラス基板
　
　 10 Exposure device 20A First light source array 20B Second light source array 21A, 21B Substrate 21a First surface 21b Second surface 23A, 23B LED chip 30A First magnifying optical system 30B Second magnifying optical system 31A, 31B Lens section 40 Heat sink 50 Thermal conduction member 61 Bolt 211 Recesses 231A, 231B Light emitting section 401 Through hole 80 Illumination optical system 90 Illumination unit 100 Projection optical unit CTR Control section DM2 Second dichroic mirror MSK Mask OPU1 First light source unit OPU2 Second light source unit P Glass substrate

Claims (19)

  1. 　互いに対向する第１面と第２面とを有する基板と、
    　前記基板の前記第１面上に２次元配列された複数の光源素子と、
    　ヒートシンクと、
    を備え、
    　前記基板は、前記第２面のうち、平面視において前記複数の光源素子が配列された範囲に対向する部分に形成された少なくとも１つの凹部を有し、
    　前記ヒートシンクは、貫通孔を有し、
    　前記基板と前記ヒートシンクとは、前記貫通孔を挿通するとともに前記凹部に嵌合する固定部材で固定されている、
    光源ユニット。     a substrate having a first surface and a second surface facing each other;
    a plurality of light source elements arranged two-dimensionally on the first surface of the substrate;
    heat sink and
    Equipped with
    The substrate has at least one recess formed in a portion of the second surface that faces the range in which the plurality of light source elements are arranged in a plan view,
    The heat sink has a through hole,
    The substrate and the heat sink are fixed by a fixing member that passes through the through hole and fits into the recess.
    light source unit.
  2. 　前記凹部はネジ孔である、
    請求項１に記載の光源ユニット。     the recess is a screw hole;
    The light source unit according to claim 1.
  3. 　前記固定部材はネジである、
    請求項２に記載の光源ユニット。     the fixing member is a screw;
    The light source unit according to claim 2.
  4. 　前記ヒートシンクは、前記ヒートシンクの内部に冷媒を通す流路を有する、
    請求項１から請求項３のいずれか一項に記載の光源ユニット。     The heat sink has a flow path for passing a refrigerant inside the heat sink,
    The light source unit according to any one of claims 1 to 3.
  5. 　前記流路は、前記貫通孔が形成されていない部分に形成されている、
    請求項４に記載の光源ユニット。     The flow path is formed in a portion where the through hole is not formed.
    The light source unit according to claim 4.
  6. 　前記凹部は、前記範囲に対向する部分に複数形成され、
    　前記貫通孔は、複数の前記凹部に対応して複数形成されている、
    請求項１から請求項５のいずれか一項に記載の光源ユニット。     A plurality of the recesses are formed in a portion facing the range,
    A plurality of the through holes are formed corresponding to the plurality of recesses,
    The light source unit according to any one of claims 1 to 5.
  7. 　複数の前記凹部と複数の前記貫通孔は、等間隔に形成されている、
    請求項６に記載の光源ユニット。     The plurality of recesses and the plurality of through holes are formed at equal intervals,
    The light source unit according to claim 6.
  8. 　前記凹部は、前記基板を貫通していない、
    請求項１から請求項７のいずれか一項に記載の光源ユニット。     the recess does not penetrate the substrate;
    The light source unit according to any one of claims 1 to 7.
  9. 　前記ヒートシンクと前記基板との間に設けられた熱伝導部材を備える、
    請求項１から請求項８のいずれか一項に記載の光源ユニット。     comprising a thermally conductive member provided between the heat sink and the substrate;
    The light source unit according to any one of claims 1 to 8.
  10. 　前記固定部材は前記熱伝導部材を貫通している、
    請求項９に記載の光源ユニット。     the fixing member passes through the heat conductive member;
    The light source unit according to claim 9.
  11. 　前記基板は金属基板である、
    請求項１から請求項１０のいずれか一項に記載の光源ユニット。     the substrate is a metal substrate;
    The light source unit according to any one of claims 1 to 10.
  12. 　前記基板は５ｍｍ以下の厚みを有する、
    請求項１から請求項１１のいずれか一項に記載の光源ユニット。     The substrate has a thickness of 5 mm or less,
    The light source unit according to any one of claims 1 to 11.
  13. 　前記複数の光源素子は各々、光を射出する発光部を備え、
    　前記複数の光源素子の各々の前記発光部の拡大像を形成するレンズを２次元平面上に複数配列したレンズアレイを更に備える、
    請求項１から請求項１２のいずれか一項に記載の光源ユニット。     Each of the plurality of light source elements includes a light emitting part that emits light,
    further comprising a lens array in which a plurality of lenses are arranged on a two-dimensional plane to form an enlarged image of the light emitting part of each of the plurality of light source elements;
    The light source unit according to any one of claims 1 to 12.
  14. 　前記ヒートシンクの前記基板が配置された面とは反対側の面に、前記複数の光源素子を制御する制御部が配置されている、
    請求項１から請求項１３のいずれか一項に記載の光源ユニット。     A control unit that controls the plurality of light source elements is disposed on a surface of the heat sink opposite to the surface on which the substrate is disposed.
    The light source unit according to any one of claims 1 to 13.
  15. 　請求項１から請求項１４のいずれか一項に記載の光源ユニットと、
    　前記光源ユニットから出射された光を被照射体に導く照明光学系と、
    を備える照明ユニット。     The light source unit according to any one of claims 1 to 14,
    an illumination optical system that guides the light emitted from the light source unit to an irradiated object;
    A lighting unit with.
  16. 　複数の請求項１から請求項１４のいずれか一項に記載の光源ユニットと、
    　複数の前記光源ユニットから出射された光を合成する合成光学素子を含み、前記合成光学素子から出射された合成光を被照射体に導く照明光学系と、
    を備える照明ユニット。     A plurality of light source units according to any one of claims 1 to 14,
    an illumination optical system including a combining optical element that combines light emitted from the plurality of light source units, and guiding the combined light emitted from the combining optical element to an irradiated object;
    A lighting unit with.
  17. 　請求項１５または請求項１６に記載の照明ユニットと、
    　前記照明ユニットにより照明されるマスクのパターン像を感光性基板上に投影する投影光学系と、
    を備える露光装置。     The lighting unit according to claim 15 or 16;
    a projection optical system that projects a pattern image of the mask illuminated by the illumination unit onto a photosensitive substrate;
    An exposure apparatus comprising:
  18. 　前記感光性基板は、少なくとも一辺の長さ又は対角長が５００ｍｍ以上である、
    請求項１７に記載の露光装置。     The photosensitive substrate has at least one side length or diagonal length of 500 mm or more,
    The exposure apparatus according to claim 17.
  19. 　請求項１７又は請求項１８に記載の露光装置を用いた露光方法であって、
    　前記照明ユニットによりマスクを照明することと、
    　前記投影光学系を用いて前記マスクのパターン像を感光性基板へ投影することと、
    を含む露光方法。
    　     An exposure method using the exposure apparatus according to claim 17 or 18,
    Illuminating the mask with the lighting unit;
    Projecting the pattern image of the mask onto a photosensitive substrate using the projection optical system;
    Exposure methods including.
PCT/JP2022/031212 2022-08-18 2022-08-18 Light source unit, illumination unit, exposure device, and exposure method WO2024038537A1 (en)

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US6683421B1 (en) * 2001-01-25 2004-01-27 Exfo Photonic Solutions Inc. Addressable semiconductor array light source for localized radiation delivery
WO2014061555A1 (en) * 2012-10-19 2014-04-24 シャープ株式会社 Light-emitting apparatus and structure for attaching light-emitting apparatus to heat sink
JP2016041959A (en) * 2014-08-18 2016-03-31 カシオ計算機株式会社 Fastening structure, projection device with the fastening structure, and fastening method
JP2017048263A (en) * 2015-08-31 2017-03-09 公立大学法人大阪府立大学 Method for producing cured product of photocurable resin composition and light irradiation device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6683421B1 (en) * 2001-01-25 2004-01-27 Exfo Photonic Solutions Inc. Addressable semiconductor array light source for localized radiation delivery
WO2014061555A1 (en) * 2012-10-19 2014-04-24 シャープ株式会社 Light-emitting apparatus and structure for attaching light-emitting apparatus to heat sink
JP2016041959A (en) * 2014-08-18 2016-03-31 カシオ計算機株式会社 Fastening structure, projection device with the fastening structure, and fastening method
JP2017048263A (en) * 2015-08-31 2017-03-09 公立大学法人大阪府立大学 Method for producing cured product of photocurable resin composition and light irradiation device

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