WO2024018663A1 - Immersion-cooling device - Google Patents

Immersion-cooling device Download PDF

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Publication number
WO2024018663A1
WO2024018663A1 PCT/JP2023/004297 JP2023004297W WO2024018663A1 WO 2024018663 A1 WO2024018663 A1 WO 2024018663A1 JP 2023004297 W JP2023004297 W JP 2023004297W WO 2024018663 A1 WO2024018663 A1 WO 2024018663A1
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WO
WIPO (PCT)
Prior art keywords
refrigerant
casing
header
cooling device
supply
Prior art date
Application number
PCT/JP2023/004297
Other languages
French (fr)
Japanese (ja)
Inventor
伸英 原
澄生 内田
博子 北本
Original Assignee
三菱重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱重工業株式会社 filed Critical 三菱重工業株式会社
Publication of WO2024018663A1 publication Critical patent/WO2024018663A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • Patent Document 1 discloses a cooling system that cools electronic equipment that has a heat generating element.
  • the cooling system includes a cooling tank containing a refrigerant.
  • Electronic equipment is immersed in a coolant in a cooling bath.
  • a plurality of electronic devices are arranged vertically in the cooling tank. After cooling the heating element, the refrigerant in the cooling tank is circulated so that it is cooled outside the cooling tank and then supplied to the cooling tank again.
  • the present disclosure has been made to solve the above problems, and aims to provide a liquid immersion cooling device that can be downsized and improve refrigerant management.
  • an immersion cooling device is a liquid immersion cooling device that cools a heating element provided on a substrate, and has a box shape extending in the horizontal direction, and has a box-like shape that extends inside the substrate. has a plurality of casings arranged so as to extend in the horizontal direction, and these casings are arranged in the vertical direction; a supply side header into which a first refrigerant can be introduced, a discharge side header which extends vertically adjacent to the casing and into which the first refrigerant is introduced from each of the plurality of casings, and the discharge side header. a refrigerant pumping section that pumps the first refrigerant from the supply header to the supply header; and a heat exchanger tube that cools the first refrigerant by exchanging heat.
  • a liquid immersion cooling device is a liquid immersion cooling device that cools a heating element provided on a substrate, and includes a casing in which a first refrigerant is stored and the substrate is arranged so as to extend in a horizontal direction. and a jet flow supply unit that supplies a jet flow of the first refrigerant to the heating element, and a second refrigerant that passes through the casing and circulates inside the casing and exchanges heat with the first refrigerant to cool the first refrigerant. and a heat exchanger tube.
  • liquid immersion cooling device of the present disclosure it is possible to achieve miniaturization while improving refrigerant manageability.
  • FIG. 1 is an overall diagram showing a schematic configuration of a liquid immersion cooling device according to a first embodiment of the present disclosure.
  • FIG. 1 is a schematic diagram of a liquid immersion cooling device according to a first embodiment of the present disclosure, viewed from an angle.
  • FIG. 2 is a schematic side view of the heat sink mechanism according to the first embodiment of the present disclosure.
  • 1 is a cross-sectional view of a heat exchanger tube according to a first embodiment of the present disclosure. It is a schematic diagram seen from the side of the liquid immersion cooling device concerning the first modification of the first embodiment of this indication. It is a sectional view of the heat exchanger tube concerning the second modification of the first embodiment of this indication.
  • FIG. 2 is a schematic diagram of a liquid immersion cooling device according to a second embodiment of the present disclosure viewed from the side. It is a schematic diagram showing the schematic structure of the whole immersion cooling device concerning a third embodiment of the present disclosure. It is a schematic diagram showing a schematic structure inside a casing concerning a third embodiment of the present disclosure.
  • a liquid immersion cooling device 10 is used for cooling electronic equipment that performs high-speed calculations.
  • the liquid immersion cooling device 10 is used in a server 1 installed in a data center.
  • a plurality of servers 1 are provided.
  • a plurality of servers 1 are installed in each stage of an air cooling rack 8.
  • This rack 8 is a general rack having a size of, for example, about 19 inches.
  • the server 1 includes a printed circuit board and elements such as a CPU and a GPU chip provided on the printed circuit board. Since the CPU and GPU are components responsible for high-speed calculation processing, they are subject to a high load and generate heat at a higher temperature than other parts of the server 1.
  • a heat exchanger 7 that uses water as a refrigerant is installed in the data center.
  • the heat exchanger 7 include a dry cooler and a chiller.
  • the liquid immersion cooling device 10 of this embodiment is provided separately from the heat exchanger 7, and is used to cool elements that generate heat at high temperatures, such as a CPU and a GPU.
  • the printed circuit board of the server 1 will be simply referred to as the "board 2," and the elements on the board 2, such as the CPU and GPU, that generate heat to a particularly high temperature may be referred to as the "heating element 3.”
  • the substrate 2 is formed into a rectangular plate shape.
  • a heating element 3 is provided on the surface of the substrate 2.
  • the heating element 3 has a base 4 and a heating element main body 6.
  • the base 4 is a rectangular plate-like member.
  • the base 4 is attached to the surface of the substrate 2.
  • a recess 5 is provided on the surface of the base 4 on the side opposite to the substrate 2.
  • the recess 5 is provided in the center of the base 4.
  • a heating element main body 6 is attached to the recess 5.
  • the heating element main body 6 is a part of the heating element 3 that mainly generates heat.
  • the heating element main body 6 is a semiconductor that constitutes a CPU or a GPU. Among the surfaces of the heating element main body 6, the surface on the opposite side from the substrate 2 is flush with the surface of the base 4.
  • the immersion cooling device 10 includes a casing 11, a heat sink mechanism 20, a jet flow supply section 30, a header pipe 40, and a heat transfer tube 50.
  • the casing 11 is arranged at each stage of the rack 8.
  • the casing 11 is formed into a rectangular box shape extending in the horizontal direction.
  • a first refrigerant R1 is stored in the casing 11.
  • the casing 11 is filled with the first refrigerant R1. That is, the entire storage space within the casing 11 is filled with the first refrigerant R1.
  • the first refrigerant R1 is an insulating refrigerant.
  • the first refrigerant R1 cools the heating element 3 in a liquid phase state. For this reason, it is desirable that the boiling point of the first refrigerant R1 is 70 degrees or higher.
  • Examples of the first refrigerant R1 include liquids based on fluorocarbons.
  • each server 1 is arranged so as to extend in the horizontal direction.
  • the substrate 2 is arranged so that the surface on which the heating element 3 is provided faces upward.
  • a heat sink mechanism 20 is provided on the heating element 3 provided on the substrate 2.
  • the heat sink mechanism 20 is attached to the surface of the heating element 3 on the opposite side from the substrate 2. As shown in FIG. 3, the heat sink mechanism 20 includes a first heat transfer plate 21, grease 22, a second heat transfer plate 23, and heat sink fins 24.
  • the first heat exchanger plate 21 is attached to the surface of the heating element 3 on the side opposite to the substrate 2 in an overlapping manner.
  • the outer edge of the first heat exchanger plate 21 coincides with the outer edge of the heat generating element 3 when viewed from the top and bottom.
  • the first heat exchanger plate 21 is made of stainless steel, for example.
  • the first heat transfer plate 21 is provided to increase the surface area of the heat generating body 6 and to diffuse the heat generated by the heat generating body 6.
  • Grease 22 is provided on the surface of first heat exchanger plate 21 on the side opposite to heating element 3 .
  • Grease 22 bonds first heat exchanger plate 21 and second heat exchanger plate 23 together.
  • the first heat exchanger plate 21 and the second heat exchanger plate 23 are in close contact with each other through grease 22 .
  • the second heat exchanger plate 23 is provided on the surface of the first heat exchanger plate 21 opposite to the heating element 3 with the grease 22 interposed therebetween.
  • the second heat exchanger plate 23 is made of metal such as copper, for example.
  • the heat sink fins 24 are provided on the surface of the second heat exchanger plate 23 that is opposite to the first heat exchanger plate 21 .
  • a plurality of heat sink fins 24 are provided on the second heat transfer plate 23.
  • the heat sink fins 24 are formed into a rod shape that extends perpendicularly to the second heat exchanger plate 23 .
  • the heat sink fins 24 are made of, for example, the same metal as the second heat transfer plate 23, such as copper.
  • the heat sink fins 24 are provided to further increase the surface area of the heat generating body 6 and to further diffuse the heat generated by the heat generating body 6.
  • the jet supply section 30 supplies a jet of the first refrigerant R1 to the heating element 3.
  • the jet flow supply section 30 includes a circulation pipe 31, a pump 32, and a filter 33.
  • Circulation piping 31 is provided outside of casing 11. Both ends of the circulation pipe 31 communicate with the inside of the casing 11.
  • the first refrigerant R1 can flow through the circulation pipe 31.
  • one end 31a of the circulation pipe 31 is connected to the lower surface of the casing 11.
  • One end 31a of the circulation pipe 31 is provided at a position overlapping the heating element 3 in the vertical direction.
  • the other end 31b of the circulation pipe 31 is connected to the upper surface of the casing 11.
  • the other end 31b of the circulation pipe 31 is provided at a position overlapping the heating element 3 in the vertical direction. Therefore, the other end 31b of the circulation pipe 31 is arranged at a position facing the heating element 3 and the heat sink mechanism 20.
  • the pump 32 is provided in the circulation pipe 31.
  • the pump 32 circulates the first refrigerant R1 from one end 31a of the circulation pipe 31 to the other end 31b.
  • the filter 33 is provided in the circulation pipe 31.
  • the filter 33 is provided downstream of the pump 32 in the flow direction of the first refrigerant R1.
  • the filter 33 is, for example, an activated carbon filter.
  • the first refrigerant R1 is circulated inside the casing 11 and the circulation pipe 31 by the jet supply section 30. Thereby, in the casing 11, the first refrigerant R1 is ejected from the other end 31b of the circulation pipe 31, bypasses the substrate 2, and flows into the one end 31a of the circulation pipe 31.
  • the flow direction of the first refrigerant R1 will be simply referred to as the "flow direction”
  • the other end 31b side of the circulation pipe 31 will be referred to as the "upstream side” in the flow direction of the first refrigerant R1.
  • the one end 31a side of the pipe 31 is sometimes referred to as the "downstream side.”
  • header pipe 40 As shown in FIG. 1, the header pipe 40 communicates with the heat exchanger 7.
  • the refrigerant of the heat exchanger 7 flows through the header pipe 40 .
  • second refrigerant R2 the refrigerant of the heat exchanger 7
  • the header pipe 40 has a main pipe 43 and a subheader 44.
  • One main pipe 43 is provided for each header pipe 40.
  • the main pipe 43 extends in the vertical direction.
  • a plurality of subheaders 44 are pipes extending from one main pipe 43. All of the plurality of subheaders 44 extend in the horizontal direction.
  • the plurality of subheaders 44 extend parallel to each other and are arranged at equal intervals in the vertical direction.
  • Two header pipes 40 are provided.
  • the two header pipes 40 are provided on opposite sides of the casing 11.
  • the second refrigerant R2 is supplied to one header pipe 40 from the heat exchanger 7.
  • the second refrigerant R2 supplied to one header pipe 40 passes through the casing 11 and is returned to the other header pipe 40.
  • This other header pipe 40 returns the second refrigerant R2 that has passed through the casing 11 to the heat exchanger 7.
  • header pipe 41 one header pipe 40 to which the second refrigerant R2 is supplied from the heat exchanger 7
  • return header pipe 41 the other header pipe 40 that returns the second refrigerant R2 to the heat exchanger 7
  • header pipe 42 It is called "header pipe 42”.
  • the subheader 44 of the supply header pipe 41 and the subheader 44 of the return header pipe 42 are connected by a plurality of heat transfer tubes 50.
  • a plurality of heat exchanger tubes 50 are provided in each casing 11.
  • the heat exchanger tubes 50 communicate with the heat exchanger 7.
  • the second refrigerant R2 of the heat exchanger 7 flows inside the heat exchanger tube 50.
  • the heat exchanger tube 50 penetrates the casing 11 in the horizontal direction.
  • the plurality of heat exchanger tubes 50 extend parallel to each other and are arranged at equal intervals.
  • the plurality of heat exchanger tubes 50 are provided at the same position in the vertical direction.
  • the flow of the second refrigerant R2 in each heat exchanger tube 50 is a laminar flow from the supply header tube 41 to the return header tube 42.
  • the heat exchanger tube 50 performs heat exchange between the second refrigerant R2 and the first refrigerant R1, and cools the first refrigerant R1.
  • the heat exchanger tube 50 is arranged within the casing 11 on the downstream side of the heating element 3 in the flow direction of the first refrigerant R1.
  • the heat exchanger tube 50 is formed into a rectangular cylindrical shape.
  • a plurality of fins 51 are provided on the inner peripheral surface of the heat exchanger tube 50.
  • the fins 51 are provided at corners of the inner peripheral surface of the heat exchanger tube 50.
  • the heat exchanger tube 50 is a so-called extruded tube manufactured by extrusion processing.
  • the circulation of the first refrigerant R1 within the immersion cooling device 10 will be explained.
  • the first refrigerant R1 of the casing 11 flows into the circulation pipe 31 from one end 31a of the circulation pipe 31.
  • the first refrigerant R1 is pumped by the pump 32 from one end 31a of the circulation pipe 31 to the other end 31b.
  • the first refrigerant R1 is ejected from the other end 31b of the circulation pipe 31 as a jet stream.
  • the jet of first refrigerant R1 is supplied to the heat sink mechanism 20. Heat from the heating element 3 is transferred to the first refrigerant R1 via the heat sink mechanism 20. In this way, the heating element 3 is cooled. Further, the first refrigerant R1 is supplied so as to collide with the heat sink mechanism 20. Therefore, the heating element 3 undergoes so-called impingement cooling.
  • the first refrigerant R1 passes through the heat sink fins 24 of the heat sink mechanism 20 and flows radially along the upper surface of the substrate 2.
  • the first refrigerant R1 reaches the outer edge of the substrate 2, it flows around to the lower side of the substrate 2.
  • the first refrigerant R1 then flows along the lower surface of the substrate 2.
  • the first refrigerant R1 passes through the plurality of heat exchanger tubes 50.
  • the first refrigerant R1 is cooled by exchanging heat with the second refrigerant R2 while passing through the plurality of heat transfer tubes 50.
  • the first refrigerant R1 cooled by the heat transfer tube 50 flows into one end 31a of the circulation pipe 31.
  • the first refrigerant R1 that has flowed into one end 31a of the circulation pipe 31 is pumped again by the pump 32. In this way, the first refrigerant R1 circulates within the immersion cooling device 10.
  • the liquid immersion cooling device 10 supplies a jet stream of the first refrigerant R1 to the heating element 3 and the casing 11 in which the first refrigerant R1 is stored and in which the substrate 2 is disposed so as to extend horizontally. and a heat transfer tube 50 that penetrates the casing 11 and performs heat exchange between the second refrigerant R2 and the first refrigerant R1 flowing inside the casing 11 to cool the first refrigerant R1.
  • the liquid immersion cooling device 10 can impinge-cool the heating element 3 by spraying the jet stream of the first refrigerant R1 onto the heating element 3.
  • the first refrigerant R1 sprayed onto the heating element 3 is cooled by the heat transfer tube 50 and used again to cool the heating element 3.
  • a large-scale cycle for circulating the first refrigerant R1 is not necessary. Therefore, the entire equipment can be downsized.
  • each casing 11 only needs to be large enough to accommodate one board 2, it is easy to freely utilize the space above the casing 11.
  • the casing 11 can be horizontally installed in each stage of the existing air cooling rack 8 so as to extend in the horizontal direction.
  • the casing 11 is arranged horizontally, but it is also possible to arrange the casing 11 regardless of whether the casing 11 is placed vertically or horizontally.
  • the immersion cooling device 10 can be made portable. This makes it easy to transport immersion cooling to other high-speed computing facilities.
  • the amount of the first refrigerant R1 is sufficient to fill the inside of the casing 11, it is also possible to reduce the amount of the first refrigerant R1, which is expensive because it has insulation properties.
  • the liquid immersion cooling device 10 can cool the first refrigerant R1 stored in the casing 11 within the casing 11 by the heat transfer tube 50. Thereby, there is no need to separately provide an external heat exchanger to cool the first refrigerant R1, and the number of heat exchangers can be reduced in the entire equipment. Furthermore, the circulation of the first refrigerant R1 can be completed within the immersion cooling device 10. As described above, since the circulation of the first refrigerant R1 can be completed within the immersion cooling device 10 while reducing the amount of the first refrigerant R1 used, the manageability of the first refrigerant R1 can also be improved. can.
  • the jet flow supply unit 30 is provided outside the casing 11 and communicates with the inside of the casing 11 at both ends, and is provided in the circulation pipe 31 and the circulation pipe 31 through which the first refrigerant R1 can flow.
  • a pump 32 that circulates the first refrigerant R1 from one end 31a of 31 to the other end 31b.
  • the other end 31b of the circulation pipe 31 is arranged at a position facing the heating element 3.
  • the flow direction of the first refrigerant R1 in the casing 11 is set by the installation locations of the one end 31a and the other end 31b of the circulation pipe 31. Therefore, since the flow path of the first refrigerant R1 in the casing 11 can be set arbitrarily, the cooling efficiency of the immersion cooling device 10 can be improved. Furthermore, by adjusting the pressure of the pump 32, the strength of the jet flow can be controlled according to the amount of heat generated by the heating element 3. Thereby, the heat generating element 3 can be cooled with the minimum amount of jet flow commensurate with the amount of heat removal necessary for the heat generating element 3. Therefore, the cooling efficiency of the liquid immersion cooling device 10 can be improved.
  • the heat exchanger tubes 50 are arranged in the casing 11 on the downstream side of the heating element 3 in the flow direction of the first refrigerant R1.
  • the second refrigerant R2 flowing in the heat transfer tube 50 can exchange heat with the first refrigerant R1 after cooling the heating element 3. Therefore, the cooling efficiency of the liquid immersion cooling device 10 can be further improved.
  • fins 51 are provided on the inner peripheral surface of the heat exchanger tube 50.
  • the heat exchanger tube 50 can improve the efficiency of heat exchange between the second refrigerant R2 and the first refrigerant R1.
  • the heating element 3 and the heat exchanger tube 50 are arranged on the same side with respect to the substrate 2 (for example, on the lower side of the substrate 2).
  • the other end 31b of the circulation pipe 31 that supplies the jet of the first refrigerant R1 of the jet supply section 30 is provided directly below the heating element 3.
  • one end 31a of the circulation pipe 31 is provided at a position close to the side wall of the casing 11.
  • one end 31a of the circulation pipe 31 is bifurcated.
  • One end 31a and the other end 31b of the circulation pipe 31 are both provided on the lower surface of the casing 11.
  • the plurality of heat exchanger tubes 50 are arranged at different positions in the vertical direction.
  • the jet of the first refrigerant R1 is supplied to the heating element 3 from below. After cooling the heating element 3, the first coolant R1 flows along the lower surface of the substrate 2. At this time, the first refrigerant R1 passes through the heat exchanger tube 50, and during the process of passing through the heat exchanger tube 50, it exchanges heat with the second refrigerant R2 in the heat exchanger tube 50 and is cooled. Thereafter, the first refrigerant R1 returns to the circulation pipe 31, is pumped again by the pump 32, and is sprayed onto the heating element 3.
  • the plurality of heat exchanger tubes 50 are arranged at different positions in the vertical direction. Thereby, the first refrigerant R1 passes through the plurality of heat exchanger tubes 50 while meandering. Therefore, the first refrigerant R1 can effectively exchange heat with the second refrigerant R2. Therefore, according to the liquid immersion cooling device 10 of this modification, cooling efficiency can be further improved.
  • the immersion cooling device 10 further includes an auxiliary propeller 15.
  • the auxiliary propeller 15 is provided within the casing 11.
  • the auxiliary propeller 15 stirs the first refrigerant R1 flowing inside the casing 11.
  • the stirring speed of the auxiliary propeller 15 is lower than the ejection speed of the jet flow supply section 30.
  • the immersion cooling device 10 can uniformly circulate the first refrigerant R1 within the casing 11 using the auxiliary propeller 15. Thereby, the liquid immersion cooling device 10 can favorably cool elements other than the heating element 3 of the substrate 2, for example. Therefore, according to the immersion cooling device 10 of this modification, cooling efficiency can be further improved.
  • the circulation pipe 31 is provided along the side surface of the casing 11.
  • the circulation pipe 31 is arranged so as to surround the casing 11 from the sides.
  • One end 31a and the other end 31b of the circulation pipe 31 are provided on a pair of opposing side surfaces of the casing 11, respectively.
  • One end 31a and the other end 31b of the circulation pipe 31 are provided at positions overlapping the heat sink mechanism 20 in the horizontal direction.
  • the circulation piping 31, the pump 32, and the filter 33 are provided not above and below the casing 11, but at positions overlapping the casing 11 in the horizontal direction.
  • the sub-header 44 of the header pipe 40 is formed in an L-shape. An end 44a of the subheader 44 opposite to the main pipe 43 extends upward. A plurality of heat exchanger tubes 50 are provided at the end portion 44a of the sub-header 44 that extends upward.
  • the heat exchanger tube 50 is provided in the casing 11 on the same side in the vertical direction as the heating element 3 with the substrate 2 in between.
  • a plurality of heat transfer tubes 50 are provided along the side surface of the casing 11 on the one end 31a side of the circulation pipe 31. That is, the plurality of heat exchanger tubes 50 are provided on the downstream side within the casing 11.
  • the plurality of heat exchanger tubes 50 are arranged at equal intervals in the vertical direction.
  • the jet of the first refrigerant R1 is directly supplied toward the heat sink mechanism 20 in the horizontal direction.
  • the first refrigerant R1 exchanges heat with the heating element 3 via the heat sink mechanism 20, and the heating element 3 is cooled.
  • the first coolant R1 flows along the upper surface of the substrate 2.
  • the first refrigerant R1 passes through the heat exchanger tube 50, and during the process of passing through the heat exchanger tube 50, it exchanges heat with the second refrigerant R2 in the heat exchanger tube 50 and is cooled.
  • the first refrigerant R1 returns to the circulation pipe 31, is pumped again by the pump 32, and is sprayed onto the heat sink mechanism 20.
  • the circulation pipe 31, the pump 32, and the filter 33 are provided at a position that overlaps the casing 11 in the horizontal direction.
  • the immersion cooling device 10 can be downsized in the vertical direction. Thereby, for example, when the immersion cooling devices 10 are arranged in multiple stages in the vertical direction using the racks 8 or the like, more immersion cooling devices 10 can be arranged in a small space.
  • one end 31a and the other end 31b of the circulation pipe 31 are provided at positions that overlap the heat sink mechanism 20 in the horizontal direction.
  • the immersion cooling device 10 can smoothly circulate the first refrigerant R1 within the casing 11. Thereby, the liquid immersion cooling device 10 can reduce the pressure loss of the first refrigerant R1 within the casing 11. Therefore, the cooling efficiency of the liquid immersion cooling device 10 can be improved.
  • FIG. 11 a sixth modification of the first embodiment will be described with reference to FIG. 11.
  • Heat exchanger tube 50 extends horizontally within casing 11 .
  • the heat exchanger tubes 50 are provided in a wavy shape within the casing 11 so as to be folded back multiple times between a pair of opposing side walls. Both ends of the heat exchanger tubes 50 protrude outside the casing 11 from the same side wall of the casing 11. Both ends of the heat exchanger tubes 50 are each directly connected to the heat exchanger 7.
  • both ends of the heat exchanger tube 50 may be connected to the heat exchanger 7 via the supply header tube 41 and the return header tube 42, respectively.
  • the jet flow supply section 30 includes one circulation pipe 31, and one end 31a of the circulation pipe 31 which is the inlet of the first refrigerant R1 and one end 31a of the circulation pipe 31 which is the inlet of the second refrigerant R2.
  • one other end 31b of the circulation pipe 31 is provided as an outflow port
  • the present invention is not limited to this.
  • a plurality of circulation pipes 31 may be provided, each having one end 31a serving as an inlet and the other end 31b serving as an outlet.
  • both ends of one circulation pipe 31 may branch into a plurality of parts, and this one circulation pipe 31 may each have a plurality of one end 31a serving as an inlet and a plurality of other ends 31b serving as an outlet.
  • the filter 33 is provided in the circulation pipe 31, but the present invention is not limited to this.
  • the filter 33 may not be provided in the circulation pipe 31.
  • the jet flow supply section 230 is a propeller 234 disposed within the casing 11 at a position facing the heating element 3.
  • the propeller 234 is installed above the board 2.
  • a rotating shaft 235 of the propeller 234 extends toward the heating element 3.
  • the heating element 3 and the heat exchanger tube 50 are arranged on the same side with respect to the substrate 2 (for example, on the lower side of the substrate 2).
  • the immersion cooling device 10 is provided with a guide 260 inside the casing 11 that determines the flow of the first refrigerant R1.
  • the guide 260 is provided closer to the side wall of the casing 11 than the heating element 3 and propeller 234 are.
  • the guide 260 includes an inclined guide 261 and a horizontal guide 262.
  • the inclined guide 261 is provided below the heating element 3.
  • the inclined guide 261 extends horizontally while being inclined downward.
  • the horizontal guide 262 extends from the lower end of the inclined guide 261 in the horizontal direction away from the heating element 3 .
  • the propeller 234 generates a jet of the first refrigerant R1 toward the heating element 3 from below.
  • the first coolant R1 flows along the lower surface of the substrate 2 by being guided by the upper surface of the guide 260.
  • the first refrigerant R1 passes through the heat exchanger tube 50, and during the process of passing through the heat exchanger tube 50, it exchanges heat with the second refrigerant R2 in the heat exchanger tube 50 and is cooled.
  • the first refrigerant R1 flows along the lower surface of the guide 260, returns to the propeller 234, and is again blown onto the heating element 3 by the propeller 234.
  • the jet flow supply section 230 is a propeller 234 that is disposed within the casing 11 at a position facing the heat generating element 3 and has a rotating shaft 235 extending toward the heat generating element 3.
  • the heat exchanger tube 50 is formed into a rectangular cylindrical shape or a polygonal cylindrical shape with five or more sides has been described, but it is not limited to this.
  • the heat exchanger tube 50 may be formed into a triangular tube shape or a cylindrical shape, for example.
  • a liquid immersion cooling device 310 according to a third embodiment of the present disclosure will be described with reference to FIGS. 13 and 14. Configurations similar to those of the first embodiment described above will be given the same names and numerals, and descriptions thereof will be omitted as appropriate.
  • the immersion cooling device 310 of this embodiment cools the heating element 3 provided on the substrate 2.
  • the liquid immersion cooling device 310 includes a casing group 311, a supply side header 320, a discharge side header 330, a refrigerant pressure feeding section 340, a heat transfer tube 350, and an upper side header 330.
  • the casing group 311 is a collection of casings 312 arranged in the vertical direction.
  • the casing 312 has a cubic box shape that extends in the horizontal direction.
  • a casing 312 is provided at each stage of the rack 8. In this embodiment, seven casings 312 are arranged in the vertical direction.
  • a first refrigerant R1 is stored in the casing 312.
  • the casing 312 is filled with the first refrigerant R1. That is, the entire storage space within the casing 312 is filled with the first refrigerant R1.
  • the board 2 is arranged inside the casing 312 so as to extend in the horizontal direction.
  • a heating element 3 is provided on the surface of the substrate 2.
  • a supply header 320 is provided on one side of the casing group 311 in the horizontal direction
  • a discharge header 330 is provided on the other side of the casing group 311 in the horizontal direction. That is, the supply header 320 and the discharge header 330 are provided to face each other in the horizontal direction with the casing group 311 in between.
  • the opposing direction Da between the supply header 320 and the discharge header 330 will be simply referred to as the "opposing direction Da", and the horizontal direction orthogonal to the opposing direction Da will be referred to as the "width direction Dw”.
  • the supply header 320 extends vertically adjacent to the casing 312.
  • the supply header 320 is capable of introducing the first refrigerant R1 into each of the plurality of casings 312.
  • the supply header 320 includes a supply header main body 321 and a supply branch pipe 322.
  • the supply side header main body 321 is formed into a cylindrical shape extending in the vertical direction. Both ends of the supply header main body 321 in the extending direction are closed. Inside the supply side header body 321, the first refrigerant R1 flows in the vertical direction.
  • a plurality of supply side branch pipes 322 are provided in the supply side header main body 321.
  • the plurality of supply side branch pipes 322 are arranged at equal intervals in the vertical direction along the casing group 311.
  • One supply branch pipe 322 is provided for each casing 312.
  • the supply side branch pipe 322 is connected to the side wall 312a of the casing 312 on the supply side header 320 side.
  • the supply side branch pipe 322 penetrates the side wall 312a of the casing 312.
  • the supply branch pipe 322 is provided at one end of the side wall 312a of the casing 312 in the width direction Dw.
  • the discharge header 330 extends in the vertical direction adjacent to the casing 312.
  • the first refrigerant R1 is introduced into the discharge side header 330 from each of the plurality of casings 312.
  • the discharge side header 330 has a discharge side header main body 331 and a discharge side branch pipe 332.
  • the discharge side header main body 331 is formed into a cylindrical shape extending in the vertical direction. Both ends of the discharge side header main body 331 in the extending direction are closed. Inside the discharge side header body 331, the first refrigerant R1 flows in the vertical direction.
  • a plurality of discharge side branch pipes 332 are provided in the discharge side header main body 331.
  • the plurality of discharge side branch pipes 332 are arranged at equal intervals in the vertical direction along the casing group 311.
  • One discharge side branch pipe 332 is provided for each casing 312.
  • the discharge side branch pipe 332 is connected to the side wall 312a of the casing 312 on the discharge side header 330 side.
  • the discharge side branch pipe 332 penetrates the side wall 312a of the casing 312.
  • the discharge side branch pipe 332 is provided at one end of the side wall 312a of the casing 312 in the width direction Dw.
  • the discharge side branch pipe 332 is provided at a position overlapping the supply side branch pipe 322 in the opposing direction Da.
  • the refrigerant pumping section 340 is provided below the casing group 311.
  • the refrigerant pumping section 340 is connected to the lower part of the discharge side header 330 by a first connecting pipe 315 and connected to the lower part of the supply side header 320 by a second connecting pipe 316.
  • the first connecting pipe 315 allows the discharge side header 330 and the refrigerant pumping section 340 to communicate with each other
  • the second connecting pipe 316 allows the supply side header 320 and the refrigerant pumping section 340 to communicate with each other.
  • the refrigerant pumping section 340 pumps the first refrigerant R1 from the lower part of the discharge side header 330 to the lower part of the supply side header 320.
  • the refrigerant pumping section 340 of this embodiment is a pump.
  • the heat exchanger tube 350 is a pipe that extends inside at least one of the discharge side header 330 and the supply side header 320.
  • the heat exchanger tube 350 is provided inside the discharge side header 330 so as to extend in the vertical direction.
  • a plurality of heat transfer tubes 350 are provided within the discharge header 330 at intervals in the horizontal direction.
  • the second refrigerant R2 flows from the bottom to the top.
  • the heat exchanger tube 350 cools the first refrigerant R1 by exchanging heat between the second refrigerant R2 flowing inside the heat exchanger tube 350 and the first refrigerant R1 flowing around the heat exchanger tube 350.
  • the heat transfer tube 350 cools the first refrigerant R1 in the discharge header 330 by exchanging heat between the second refrigerant R2 and the first refrigerant R1 in the discharge header 330.
  • the heat exchanger tubes 350 are provided in the discharge side header body 331 and penetrate through the end walls of the discharge side header body 331 on both sides in the extending direction.
  • a lower second header 313 is provided at the upper end of the discharge header 330.
  • the second lower header 313 is provided to cover the lower end wall of the discharge header 330 from below.
  • the lower second header 313 communicates with the lower end of the heat exchanger tube 350.
  • the second refrigerant R2 to be supplied to the heat exchanger tubes 350 is supplied into the lower second header 313.
  • the lower second header 313 is connected to the external heat exchanger 7 by a third connecting pipe 317.
  • the third connecting pipe 317 allows the lower second header 313 and the heat exchanger 7 to communicate with each other.
  • An upper second header 314 is provided at the upper end of the discharge header 330.
  • the upper second header 314 is provided to cover the upper end wall of the discharge header 330 from above.
  • the upper second header 314 communicates with the upper end of the heat exchanger tube 350.
  • the second refrigerant R2 that has passed through the heat exchanger tubes 350 is supplied into the upper second header 314.
  • the upper second header 314 is connected to the external heat exchanger 7 by a fourth connecting pipe 318.
  • the fourth connecting pipe 318 allows the upper second header 314 and the heat exchanger 7 to communicate with each other.
  • a refrigerant supply section 360 is provided within each casing 312.
  • the refrigerant supply section 360 is provided within the casing 312 on the supply side header 320 side.
  • the refrigerant supply section 360 includes a supply side manifold 361 and a nozzle 362.
  • the supply manifold 361 is a tubular member that extends in the width direction Dw along the side wall 312a of the casing 312 on the supply side header 320 side.
  • the supply side manifold 361 communicates with the supply side branch pipe 322 at one end in the width direction Dw.
  • the supply manifold 361 guides the first refrigerant R1 supplied from the supply header 320 into the casing 312 in the width direction Dw.
  • a plurality of nozzles 362 are provided in the supply side manifold 361 so as to be arranged in parallel in the width direction Dw.
  • six nozzles 362 are provided side by side in the width direction Dw.
  • the nozzle 362 is a cylindrical member that communicates with the supply side manifold 361 and extends in the opposing direction Da.
  • the nozzle 362 opens into the casing 312 in the opposing direction Da.
  • the nozzle 362 is capable of spouting the first refrigerant R1 in the supply manifold 361 to the discharge header 330 side.
  • the nozzle 362 gradually increases in diameter as it moves from the supply manifold 361 toward the discharge header 330 in the opposing direction Da.
  • a refrigerant discharge section 370 is provided within each casing 312.
  • the refrigerant discharge section 370 is provided within the casing 312 on the discharge side header 330 side.
  • the refrigerant discharge section 370 has a discharge side manifold 371.
  • the discharge side manifold 371 is a tubular member that extends in the width direction Dw along the side wall 312a of the casing 312 on the side of the discharge side header 330.
  • An introduction hole 372 passing through the side wall 312a is provided in the side wall of the discharge side manifold 371 on the supply side header 320 side.
  • the first refrigerant R1 in the casing 312 is introduced into the discharge side manifold 371 from the introduction hole 372.
  • the discharge side manifold 371 communicates with the discharge side branch pipe 332 at one end in the width direction Dw.
  • the discharge side manifold 371 guides the first refrigerant R1 discharged from the inside of the casing 312 to the discharge side header 330.
  • the circulation of the first refrigerant R1 within the immersion cooling device 310 will be explained.
  • the first refrigerant R1 is supplied from the supply header 320 into the casing 312.
  • the first refrigerant R1 is ejected into the casing 312 by the plurality of nozzles 362.
  • the first refrigerant R1 flows in the opposite direction Da in the casing 312 as a jet stream.
  • the first refrigerant R1 in the casing 312 passes through the heating element 3 and exchanges heat with the heating element 3. Thereby, the heating element 3 is cooled.
  • the first refrigerant R1 receives heat from the heating element 3 and is heated. Thereafter, the first refrigerant R1 is introduced from each casing 312 to the discharge side header 330. The first refrigerant R1 flows from above to below within the discharge side header 330 due to the pressure of the refrigerant pressure feeding section 340 and its own weight.
  • the second refrigerant R2 flows from the bottom to the top. That is, the first refrigerant R1 and the second refrigerant R2 flow in mutually opposite directions in the vertical direction.
  • the first refrigerant R1 exchanges heat with the second refrigerant R2 while flowing through the discharge side header 330. Thereby, the first refrigerant R1 is cooled and the second refrigerant R2 is heated.
  • the second refrigerant R2 is sent to the external heat exchanger 7 after exchanging heat with the first refrigerant R1.
  • the second refrigerant R2 is cooled by the heat exchanger 7 and supplied to each heat exchanger tube 350 again.
  • the first refrigerant R1 After the first refrigerant R1 is cooled by heat exchange with the second refrigerant R2, it is again pressure-fed to the supply-side header 320 by the refrigerant pressure-feeding section 340. Then, as described above, the first refrigerant R1 is supplied into the casing 312 again. In this way, the first refrigerant R1 circulates within the immersion cooling device 310.
  • the liquid immersion cooling device 310 has a box shape extending in the horizontal direction, and has a plurality of casings 312 arranged so that the substrate 2 extends in the horizontal direction, and these casings 312 are arranged in the vertical direction.
  • a heat transfer tube 350 that extends inside at least one of the discharge side header 330 and the supply side header 320, and cools the first refrigerant R1 by exchanging heat between the second refrigerant R2 and the first refrigerant R1 flowing therein; Equipped with.
  • the heat exchanger tubes 350 can be provided along the casings 312 for the plurality of casings 312 arranged in the vertical direction. Therefore, it is possible to suppress the liquid immersion cooling device 310 from expanding in the horizontal direction. Therefore, the liquid immersion cooling device 310 can be downsized in the horizontal direction. Furthermore, since the flow path of the first refrigerant R1 is compactly arranged in the horizontal direction, management of the first refrigerant R1 becomes easy. That is, the manageability of the first refrigerant R1 can be improved.
  • the heat exchanger tubes 350 extend in the vertical direction.
  • the arrangement direction of the casings 312 and the extending direction of the heat exchanger tubes 350 match. Therefore, the arrangement efficiency of the components of the immersion cooling device 310 such as the casing 312 and the heat transfer tubes 350 is improved. Furthermore, since the heat transfer tubes 350 can be provided to extend in the vertical direction inside the supply header 320 and the discharge header 330, which extend in the vertical direction, heat exchange is performed between the first refrigerant R1 and the second refrigerant R2. The distance traveled can be increased. Therefore, the liquid immersion cooling device 310 can cool the first refrigerant R1 well. Therefore, the cooling efficiency of the liquid immersion cooling device 310 can be improved.
  • the refrigerant pressure feeding unit 340 pumps the first refrigerant R1 from the lower part of the discharge header 330 to the supply header 320, and the heat transfer tube 350 is provided to extend inside the discharge header 330, and The second refrigerant R2 flows upward from the second refrigerant R2.
  • the first refrigerant R1 flows upward in the supply header 320 and is supplied into the casing 312. Thereafter, the first refrigerant R1 is discharged from the inside of the casing 312 to the discharge side header 330, and flows downward within the discharge side header 330.
  • the second refrigerant R2 flows upward in the heat transfer tube 350 provided in the discharge side header 330. Therefore, in the discharge side header 330, the flow of the first refrigerant R1 and the flow of the second refrigerant R2 become counterflows in which the flow directions are opposite to each other. Therefore, the heat exchange efficiency between the first refrigerant R1 and the second refrigerant R2 is improved.
  • the liquid immersion cooling device 310 can cool the first refrigerant R1 even better. Therefore, the cooling efficiency of the liquid immersion cooling device 310 can be further improved. Further, since the heat transfer tube 350 is provided inside the discharge side header 330, the liquid immersion cooling device 310 cools the first refrigerant R1 with the heat transfer tube 350, and then supplies the first refrigerant R1 to the refrigerant pressure feeding section 340. can lead.
  • the supply header 320 is provided on one side of the casing group 311 in the horizontal direction
  • the discharge header 330 is provided on the other side of the casing group 311 in the horizontal direction
  • the refrigerant provided in each casing 312 is
  • the refrigerant supply unit 360 further includes a supply unit 360, and the refrigerant supply unit 360 supplies the first refrigerant R1 from the supply header 320 in the width direction Dw, which is a horizontal direction orthogonal to the facing direction Da between the supply header 320 and the discharge header 330.
  • a supply side manifold 361 that leads to the discharge side, and a plurality of nozzles that are provided in the supply side manifold 361 so as to be arranged in parallel in the width direction Dw and can jet the first refrigerant R1 in the supply side manifold 361 to the discharge side header 330 side. 362.
  • the liquid immersion cooling device 310 can jet the first refrigerant R1 to the heating element 3 of the substrate 2. Furthermore, since the discharge side header 330 is located in the direction in which the first refrigerant R1 is ejected, the first refrigerant R1 that has undergone heat exchange can be smoothly discharged. Therefore, the liquid immersion cooling device 310 can reduce the pressure loss of the first refrigerant R1 within the casing 312. Therefore, the cooling efficiency of the liquid immersion cooling device 310 can be further improved.
  • the refrigerant pumping section 340 is provided below the casing group 311, but the present invention is not limited to this.
  • the refrigerant pumping section 340 may be provided above the casing group 311. In this case, the refrigerant pumping section 340 pumps the first refrigerant R1 from the upper part of the discharge side header 330 to the supply side header 320.
  • the heat exchanger tubes 350 are provided so as to extend inside the discharge side header 330, but the heat exchanger tubes 350 are not limited to this.
  • the heat exchanger tube 350 may be provided so as to extend inside the supply header 320.
  • the liquid immersion cooling device 310 can better cool the heating element 3 inside the casing 312. That is, the cooling efficiency of the liquid immersion cooling device 310 can be improved.
  • it may be provided so as to extend inside both the discharge side header 330 and the supply side header 320.
  • heat exchanger tubes 350 may extend in the horizontal direction and may be provided in plural numbers at intervals in the vertical direction along the casing group 311.
  • liquid immersion cooling devices 10, 210, and 310 described in each embodiment can be understood, for example, as follows.
  • the immersion cooling device 310 is a liquid immersion cooling device 310 that cools the heating element 3 provided on the substrate 2, and has a box shape extending in the horizontal direction, with the The substrate 2 has a plurality of casings 312 arranged to extend in the horizontal direction, a casing group 311 in which these casings 312 are arranged in the vertical direction, and a casing group 311 that extends in the vertical direction so as to be adjacent to the casings 312,
  • a supply header 320 that can introduce the first refrigerant R1 into each of the plurality of casings 312; a discharge side header 330 to be introduced, a refrigerant pressure feeding section 340 that pumps the first refrigerant R1 from the discharge side header 330 to the supply side header 320, and at least one of the discharge side header 330 and the supply side header 320.
  • the heat exchanger tube 350 extends inside and cools the first refrigerant R1 by exchanging heat between the second refrigerant R2 and the first refriger
  • the heat exchanger tubes 350 can be provided along the casings 312 for the plurality of casings 312 arranged in the vertical direction. Therefore, it is possible to suppress the liquid immersion cooling device 310 from expanding in the horizontal direction.
  • the immersion cooling device 310 of the second aspect is the immersion cooling device 310 of the first aspect, and the heat transfer tubes 350 may extend in the vertical direction.
  • the arrangement direction of the casings 312 and the extending direction of the heat exchanger tubes 350 match. Therefore, the arrangement efficiency of the components of the liquid immersion cooling device 310 such as the casing 312 and the heat transfer tubes 350 is improved. Furthermore, since the heat transfer tubes 350 can be provided to extend in the vertical direction inside the supply header 320 and the discharge header 330, which extend in the vertical direction, heat exchange is performed between the first refrigerant R1 and the second refrigerant R2. The distance traveled can be increased.
  • the liquid immersion cooling device 310 of the third aspect is the liquid immersion cooling device 310 of the second aspect, in which the refrigerant pressure feeding section 340 is directed from the lower part of the discharge side header 330 to the supply side header 320.
  • the first refrigerant R1 may be fed under pressure, and the heat transfer tube 350 may be provided to extend inside the discharge header 330, and the second refrigerant R2 may flow from the bottom to the top.
  • the first refrigerant R1 flows upward within the supply header 320 and is supplied into the casing 312. Thereafter, the first refrigerant R1 is discharged from the inside of the casing 312 to the discharge side header 330, and flows downward within the discharge side header 330.
  • the second refrigerant R2 flows upward in the heat transfer tube 350 provided in the discharge side header 330. Therefore, in the discharge side header 330, the flow of the first refrigerant R1 and the flow of the second refrigerant R2 become counterflows in which the flow directions are opposite to each other. Therefore, the heat exchange efficiency between the first refrigerant R1 and the second refrigerant R2 is improved.
  • the liquid immersion cooling device 310 of the fourth aspect is the liquid immersion cooling device 310 of any one of the first to third aspects, wherein the supply side header 320 is arranged in the horizontal direction of the casing group 311.
  • the discharge side header 330 is provided on one side, and the discharge side header 330 is provided on the other side of the casing group 311 in the horizontal direction, and further includes a refrigerant supply section 360 provided in each of the casings 312, and the refrigerant supply section 360 includes: a supply side manifold 361 that guides the first refrigerant R1 supplied from the supply side header 320 in the width direction Dw, which is a horizontal direction perpendicular to the opposing direction Da between the supply side header 320 and the discharge side header 330; A plurality of nozzles 362 are provided in the supply side manifold 361 so as to be arranged in parallel in the width direction Dw, and are capable of spouting the first refrigerant R1 in the supply side manifold 361 toward the discharge side header
  • the liquid immersion cooling device 310 can jet the first refrigerant R1 to the heating element 3 of the substrate 2. Furthermore, since the discharge side header 330 is located in the direction in which the first refrigerant R1 is ejected, the first refrigerant R1 that has undergone heat exchange can be smoothly discharged.
  • the liquid immersion cooling device 10, 210 is a liquid immersion cooling device 10, 210 that cools the heating element 3 provided on the substrate 2, and the first refrigerant R1 is stored inside the liquid immersion cooling device 10, 210.
  • the liquid immersion cooling devices 10 and 210 can impinge-cool the heat generating body 3 by spraying the jet stream of the first refrigerant R1 onto the heat generating body 3.
  • the first refrigerant R1 sprayed onto the heating element 3 is cooled by the heat transfer tube 50 and used again to cool the heating element 3.
  • a large-scale circulation cycle is not required to circulate the first refrigerant R1.
  • the liquid immersion cooling device 10, 210 can cool the first refrigerant R1 stored in the casing 11 within the casing 11 using the heat transfer tube 50.
  • the liquid immersion cooling device 10 of the sixth aspect is the liquid immersion cooling device 10 of the fifth aspect, in which the jet flow supply section 30 is provided outside the casing 11 and both ends thereof are connected to the casing 11.
  • a circulation pipe 31 that communicates with the inside and allows the first refrigerant R1 to flow therethrough; and a pump that is provided in the circulation pipe 31 and allows the first refrigerant R1 to flow from one end 31a of the circulation pipe 31 to the other end 31b. 32, and the other end 31b of the circulation pipe 31 may be arranged at a position facing the heating element 3.
  • the flow direction of the first refrigerant R1 in the casing 11 is set by the installation location of the one end 31a and the other end 31b of the circulation pipe 31.
  • the liquid immersion cooling device 210 of the seventh aspect is the liquid immersion cooling device 210 of the fifth aspect, in which the jet flow supply section 230 is located at a position facing the heating element 3 within the casing 11.
  • the propeller 234 may be arranged such that the rotating shaft 235 extends toward the heating element 3.
  • the immersion cooling device 10, 210 of the eighth aspect is the immersion cooling device 10, 210 of any one of the fifth to seventh aspects, in which the heat transfer tube 50 may be arranged downstream of the heating element 3 in the flow direction of the first refrigerant R1.
  • the second refrigerant R2 flowing in the heat transfer tube 50 can exchange heat with the first refrigerant R1 after cooling the heating element 3.
  • the immersion cooling device 10, 210 of the ninth aspect is any one of the fifth to eighth immersion cooling devices 10, 210, and the inner peripheral surface of the heat transfer tube 50 has fins. 51 may be provided.
  • liquid immersion cooling device of the present disclosure it is possible to achieve miniaturization while improving refrigerant manageability.

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Abstract

This immersion-cooling device cools a heat-generating body provided to a substrate, the immersion-cooling device comprising: a casing group that has a plurality of casings forming a box shape extending in a horizontal direction, substrates being disposed inside the casings so as to extend in the horizontal direction, and the casings being arranged in the vertical direction; a supply-side header that extends in the vertical direction so as to be adjacent to the casings, the supply-side header being capable of introducing respective first refrigerants into the plurality of casings; a discharge-side header that extends in the vertical direction so as to be adjacent to the casings, the first refrigerants being introduced into the discharge-side header from each of the plurality of casings; a refrigerant pressure-feeding unit that pressure-feeds the first refrigerants from the discharge-side header to the supply-side header; and heat transfer piping that extends inside the discharge-side header and/or the supply-side header, the heat transfer piping allowing heat exchange between the first refrigerants and a second refrigerant flowing through the interior of the heat transfer piping to cool the first refrigerants.

Description

液浸冷却装置liquid immersion cooling device
　本開示は、液浸冷却装置に関する。
　本願は、２０２２年７月２２日に日本に出願された特願２０２２－１１７５４５号について優先権を主張し、その内容をここに援用する。 TECHNICAL FIELD The present disclosure relates to immersion cooling devices.
This application claims priority to Japanese Patent Application No. 2022-117545 filed in Japan on July 22, 2022, the contents of which are incorporated herein.
　特許文献１には、発熱体を有する電子機器を冷却する冷却システムが開示されている。冷却システムは、冷媒が入れられた冷却槽を有する。電子機器は、冷却槽の冷媒中に浸漬される。電子機器は、冷却槽内に複数縦置きで配置されている。冷却槽内の冷媒は、発熱体を冷却した後、冷却槽の外部で冷却されて再び冷却槽に供給されるように循環する。 Patent Document 1 discloses a cooling system that cools electronic equipment that has a heat generating element. The cooling system includes a cooling tank containing a refrigerant. Electronic equipment is immersed in a coolant in a cooling bath. A plurality of electronic devices are arranged vertically in the cooling tank. After cooling the heating element, the refrigerant in the cooling tank is circulated so that it is cooled outside the cooling tank and then supplied to the cooling tank again.
国際公開第２０１６／０７５８３８号International Publication No. 2016/075838
　しかしながら、特許文献１に記載の冷却システムでは、１つの冷却槽内に複数の電子機器が縦置きで配置されるため、冷却システムが大型化してしまう。
　また、大型の冷却槽内を冷媒で満たす必要があるため、冷媒の使用量が多くなる。さらに、冷却槽内の冷媒を外部で冷却するための設備が別途必要となる。このため、冷媒の管理に多くの手間とコストを要し、冷媒の管理が困難となっていた。 However, in the cooling system described in Patent Document 1, since a plurality of electronic devices are vertically arranged in one cooling tank, the cooling system becomes large.
Furthermore, since it is necessary to fill a large cooling tank with refrigerant, the amount of refrigerant used increases. Furthermore, additional equipment is required to cool the refrigerant in the cooling tank externally. For this reason, managing the refrigerant requires a lot of effort and cost, making it difficult to manage the refrigerant.
　本開示は、上記課題を解決するためになされたものであって、小型化を実現しつつ、冷媒の管理性を向上させることができる液浸冷却装置を提供することを目的とする。 The present disclosure has been made to solve the above problems, and aims to provide a liquid immersion cooling device that can be downsized and improve refrigerant management.
　上記課題を解決するために、本開示に係る液浸冷却装置は、基板に設けられた発熱体を冷却する液浸冷却装置であって、水平方向に延びる箱型をなして、内部に前記基板が水平方向に延びるように配置された複数のケーシングを有し、これらケーシングが上下方向に配列されてなるケーシング群と、前記ケーシングに隣接するように上下方向に延びて、前記複数のケーシング内にそれぞれ第一冷媒を導入可能な供給側ヘッダと、前記ケーシングに隣接するように上下方向に延びて、前記複数のケーシングのそれぞれから前記第一冷媒が導入される排出側ヘッダと、前記排出側ヘッダから前記供給側ヘッダに前記第一冷媒を圧送する冷媒圧送部と、前記排出側ヘッダ及び前記供給側ヘッダの少なくとも一方の内側で延びて、内部を流通する第二冷媒と前記第一冷媒とを熱交換させて前記第一冷媒を冷却する伝熱管と、を備える。 In order to solve the above problems, an immersion cooling device according to the present disclosure is a liquid immersion cooling device that cools a heating element provided on a substrate, and has a box shape extending in the horizontal direction, and has a box-like shape that extends inside the substrate. has a plurality of casings arranged so as to extend in the horizontal direction, and these casings are arranged in the vertical direction; a supply side header into which a first refrigerant can be introduced, a discharge side header which extends vertically adjacent to the casing and into which the first refrigerant is introduced from each of the plurality of casings, and the discharge side header. a refrigerant pumping section that pumps the first refrigerant from the supply header to the supply header; and a heat exchanger tube that cools the first refrigerant by exchanging heat.
　本開示に係る液浸冷却装置は、基板に設けられた発熱体を冷却する液浸冷却装置であって、第一冷媒が貯留され、内部に前記基板が水平方向に延びるように配置されたケーシングと、前記発熱体に前記第一冷媒の噴流を供給する噴流供給部と、前記ケーシングを貫通し、内部を流通する第二冷媒と前記第一冷媒とで熱交換を行い前記第一冷媒を冷却する伝熱管と、を備える。 A liquid immersion cooling device according to the present disclosure is a liquid immersion cooling device that cools a heating element provided on a substrate, and includes a casing in which a first refrigerant is stored and the substrate is arranged so as to extend in a horizontal direction. and a jet flow supply unit that supplies a jet flow of the first refrigerant to the heating element, and a second refrigerant that passes through the casing and circulates inside the casing and exchanges heat with the first refrigerant to cool the first refrigerant. and a heat exchanger tube.
　本開示の液浸冷却装置によれば、小型化を実現しつつ、冷媒の管理性を向上させることができる。 According to the liquid immersion cooling device of the present disclosure, it is possible to achieve miniaturization while improving refrigerant manageability.
本開示の第一実施形態に係る液浸冷却装置の概略構成を示す全体図である。1 is an overall diagram showing a schematic configuration of a liquid immersion cooling device according to a first embodiment of the present disclosure. 本開示の第一実施形態に係る液浸冷却装置を斜方から見た模式図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a liquid immersion cooling device according to a first embodiment of the present disclosure, viewed from an angle. 本開示の第一実施形態に係るヒートシンク機構を側方から見た模式図である。FIG. 2 is a schematic side view of the heat sink mechanism according to the first embodiment of the present disclosure. 本開示の第一実施形態に係る伝熱管の断面図である。1 is a cross-sectional view of a heat exchanger tube according to a first embodiment of the present disclosure. 本開示の第一実施形態の第一変形例に係る液浸冷却装置を側方から見た模式図である。It is a schematic diagram seen from the side of the liquid immersion cooling device concerning the first modification of the first embodiment of this indication. 本開示の第一実施形態の第二変形例に係る伝熱管の断面図である。It is a sectional view of the heat exchanger tube concerning the second modification of the first embodiment of this indication. 本開示の第一実施形態の第三変形例に係る液浸冷却装置の概略構成を示す全体図である。It is an overall view showing a schematic configuration of a liquid immersion cooling device according to a third modification of the first embodiment of the present disclosure. 本開示の第一実施形態の第四変形例に係る液浸冷却装置を側方から見た模式図である。It is a schematic diagram seen from the side of the liquid immersion cooling device concerning the fourth modification of the first embodiment of the present disclosure. 本開示の第一実施形態の第五変形例に係る液浸冷却装置の概略構成を示す全体図である。It is an overall view showing a schematic configuration of a liquid immersion cooling device according to a fifth modification of the first embodiment of the present disclosure. 本開示の第一実施形態の第五変形例に係る液浸冷却装置を斜方から見た模式図である。It is a schematic diagram which looked at the liquid immersion cooling device concerning the fifth modification of the first embodiment of this indication from an angle. 本開示の第一実施形態の第六変形例に係る液浸冷却装置の概略構成を示す全体図である。It is an overall view showing a schematic configuration of a liquid immersion cooling device according to a sixth modification of the first embodiment of the present disclosure. 本開示の第二実施形態に係る液浸冷却装置を側方から見た模式図である。FIG. 2 is a schematic diagram of a liquid immersion cooling device according to a second embodiment of the present disclosure viewed from the side. 本開示の第三実施形態に係る液浸冷却装置全体の概略構成を示す模式図である。It is a schematic diagram showing the schematic structure of the whole immersion cooling device concerning a third embodiment of the present disclosure. 本開示の第三実施形態に係るケーシング内部の概略構成を示す模式図である。It is a schematic diagram showing a schematic structure inside a casing concerning a third embodiment of the present disclosure.
＜第一実施形態＞
　以下、本開示の実施形態に係る液浸冷却装置１０について、図１から図４を参照して説明する。
　図１に示すように、液浸冷却装置１０は、高速計算を行う電子機器の冷却に用いられる。本実施形態では、液浸冷却装置１０は、データセンターに設置されたサーバ１に使用されている。サーバ１は複数設けられている。複数のサーバ１は、空冷用のラック８の各段に設置されている。このラック８は、例えば１９インチ程度の大きさに形成された一般的なものである。 <First embodiment>
Hereinafter, a liquid immersion cooling device 10 according to an embodiment of the present disclosure will be described with reference to FIGS. 1 to 4.
As shown in FIG. 1, a liquid immersion cooling device 10 is used for cooling electronic equipment that performs high-speed calculations. In this embodiment, the liquid immersion cooling device 10 is used in a server 1 installed in a data center. A plurality of servers 1 are provided. A plurality of servers 1 are installed in each stage of an air cooling rack 8. This rack 8 is a general rack having a size of, for example, about 19 inches.
　図２に示すように、サーバ１は、プリント基板と、プリント基板に設けられたＣＰＵやＧＰＵのチップ等の素子と、を有する。ＣＰＵやＧＰＵは、高速計算処理を担う部品であるため高負荷がかかり、サーバ１の他の箇所に比べて高温に発熱する。 As shown in FIG. 2, the server 1 includes a printed circuit board and elements such as a CPU and a GPU chip provided on the printed circuit board. Since the CPU and GPU are components responsible for high-speed calculation processing, they are subject to a high load and generate heat at a higher temperature than other parts of the server 1.
　データセンターには、水を冷媒とする熱交換器７が設置されている。熱交換器７として、例えばドライクーラやチラー等が挙げられる。本実施形態の液浸冷却装置１０は、熱交換器７とは別に設けられ、ＣＰＵやＧＰＵ等の高温に発熱する素子を冷却するために用いられる。 A heat exchanger 7 that uses water as a refrigerant is installed in the data center. Examples of the heat exchanger 7 include a dry cooler and a chiller. The liquid immersion cooling device 10 of this embodiment is provided separately from the heat exchanger 7, and is used to cool elements that generate heat at high temperatures, such as a CPU and a GPU.
　以下では、サーバ１のプリント基板を単に「基板２」と称し、ＣＰＵやＧＰＵ等の基板２中で特に高温に発熱する素子を「発熱体３」と称する場合がある。 Hereinafter, the printed circuit board of the server 1 will be simply referred to as the "board 2," and the elements on the board 2, such as the CPU and GPU, that generate heat to a particularly high temperature may be referred to as the "heating element 3."
　図３に示すように、基板２は、矩形板状に形成されている。基板２の表面には、発熱体３が設けられている。 As shown in FIG. 3, the substrate 2 is formed into a rectangular plate shape. A heating element 3 is provided on the surface of the substrate 2.
　発熱体３は、基部４と、発熱体本体６と、を有する。基部４は、矩形板状の部材である。基部４は、基板２の表面に張り付けられている。基部４の表面のうち基板２と反対側の表面には、凹部５が設けられている。凹部５は、基部４の中央部に設けられている。凹部５には、発熱体本体６が取り付けられている。発熱体本体６は、発熱体３のうち主に発熱する部分である。本実施形態では、発熱体本体６は、ＣＰＵやＧＰＵを構成する半導体である。発熱体本体６の表面のうち基板２とは反対側の表面は、基部４の表面と面一となっている。 The heating element 3 has a base 4 and a heating element main body 6. The base 4 is a rectangular plate-like member. The base 4 is attached to the surface of the substrate 2. A recess 5 is provided on the surface of the base 4 on the side opposite to the substrate 2. The recess 5 is provided in the center of the base 4. A heating element main body 6 is attached to the recess 5. The heating element main body 6 is a part of the heating element 3 that mainly generates heat. In this embodiment, the heating element main body 6 is a semiconductor that constitutes a CPU or a GPU. Among the surfaces of the heating element main body 6, the surface on the opposite side from the substrate 2 is flush with the surface of the base 4.
（液浸冷却装置の構成）
　続いて、液浸冷却装置１０の構成について説明する。
　図１、図２に示すように、液浸冷却装置１０は、ケーシング１１と、ヒートシンク機構２０と、噴流供給部３０と、ヘッダ管４０と、伝熱管５０と、を有する。 (Configuration of liquid immersion cooling device)
Next, the configuration of the liquid immersion cooling device 10 will be explained.
As shown in FIGS. 1 and 2, the immersion cooling device 10 includes a casing 11, a heat sink mechanism 20, a jet flow supply section 30, a header pipe 40, and a heat transfer tube 50.
（ケーシング）
　ケーシング１１は、ラック８の各段に配置されている。ケーシング１１は、水平方向に延びる矩形箱状に形成されている。ケーシング１１内には、第一冷媒Ｒ１が貯留されている。本実施形態では、ケーシング１１は、第一冷媒Ｒ１で満液となっている。すなわち、第一冷媒Ｒ１は、ケーシング１１内の全貯留空間に満たされている。第一冷媒Ｒ１は、絶縁性を有する冷媒である。第一冷媒Ｒ１は、液相の状態で発熱体３を冷却する。このため、第一冷媒Ｒ１の沸点は、７０度以上であることが望ましい。第一冷媒Ｒ１の例として、フルオロカーボン類を基にした液体等が挙げられる。 (casing)
The casing 11 is arranged at each stage of the rack 8. The casing 11 is formed into a rectangular box shape extending in the horizontal direction. A first refrigerant R1 is stored in the casing 11. In this embodiment, the casing 11 is filled with the first refrigerant R1. That is, the entire storage space within the casing 11 is filled with the first refrigerant R1. The first refrigerant R1 is an insulating refrigerant. The first refrigerant R1 cools the heating element 3 in a liquid phase state. For this reason, it is desirable that the boiling point of the first refrigerant R1 is 70 degrees or higher. Examples of the first refrigerant R1 include liquids based on fluorocarbons.
　ケーシング１１の内部には、各サーバ１の基板２が水平方向に延びるように配置されている。本実施形態では、基板２は、発熱体３が設けられた側の表面が上向きとなるように配置されている。基板２に設けられた発熱体３には、ヒートシンク機構２０が設けられている。 Inside the casing 11, the boards 2 of each server 1 are arranged so as to extend in the horizontal direction. In this embodiment, the substrate 2 is arranged so that the surface on which the heating element 3 is provided faces upward. A heat sink mechanism 20 is provided on the heating element 3 provided on the substrate 2.
（ヒートシンク機構）
　ヒートシンク機構２０は、発熱体３の基板２とは反対側の表面に取り付けられている。図３に示すように、ヒートシンク機構２０は、第一伝熱板２１と、グリース２２と、第二伝熱板２３と、ヒートシンクフィン２４と、を有する。 (Heat sink mechanism)
The heat sink mechanism 20 is attached to the surface of the heating element 3 on the opposite side from the substrate 2. As shown in FIG. 3, the heat sink mechanism 20 includes a first heat transfer plate 21, grease 22, a second heat transfer plate 23, and heat sink fins 24.
（第一伝熱板）
　第一伝熱板２１は、発熱体３の表面のうち基板２とは反対側の表面に重ねて取り付けられている。上下方向から見て、第一伝熱板２１の外縁は、発熱体３の外縁と一致している。第一伝熱板２１は、例えばステレンスにより形成されている。第一伝熱板２１は、発熱体本体６の表面積を増大させて、発熱体本体６の発熱を拡散させるために設けられている。 (First heat transfer plate)
The first heat exchanger plate 21 is attached to the surface of the heating element 3 on the side opposite to the substrate 2 in an overlapping manner. The outer edge of the first heat exchanger plate 21 coincides with the outer edge of the heat generating element 3 when viewed from the top and bottom. The first heat exchanger plate 21 is made of stainless steel, for example. The first heat transfer plate 21 is provided to increase the surface area of the heat generating body 6 and to diffuse the heat generated by the heat generating body 6.
（グリース）
　グリース２２は、第一伝熱板２１の表面のうち発熱体３とは反対側の表面に設けられている。グリース２２は、第一伝熱板２１と第二伝熱板２３とを接着する。第一伝熱板２１と第二伝熱板２３とは、グリース２２によって密着している。 (grease)
Grease 22 is provided on the surface of first heat exchanger plate 21 on the side opposite to heating element 3 . Grease 22 bonds first heat exchanger plate 21 and second heat exchanger plate 23 together. The first heat exchanger plate 21 and the second heat exchanger plate 23 are in close contact with each other through grease 22 .
（第二伝熱板）
　第二伝熱板２３は、グリース２２を介して第一伝熱板２１の表面のうち発熱体３とは反対側の表面に設けられている。第二伝熱板２３は、例えば銅等の金属により形成されている。 (Second heat transfer plate)
The second heat exchanger plate 23 is provided on the surface of the first heat exchanger plate 21 opposite to the heating element 3 with the grease 22 interposed therebetween. The second heat exchanger plate 23 is made of metal such as copper, for example.
（ヒートシンクフィン）
　ヒートシンクフィン２４は、第二伝熱板２３の表面のうちの第一伝熱板２１とは反対側の表面に設けられている。ヒートシンクフィン２４は、第二伝熱板２３に複数設けられている。ヒートシンクフィン２４は、第二伝熱板２３に対して垂直に延びる棒状に形成されている。ヒートシンクフィン２４は、例えば第二伝熱板２３と同じ銅等の金属により形成されている。ヒートシンクフィン２４は、発熱体本体６の表面積をさらに増大させて、発熱体本体６の発熱をより一層拡散させるために設けられている。 (Heat sink fin)
The heat sink fins 24 are provided on the surface of the second heat exchanger plate 23 that is opposite to the first heat exchanger plate 21 . A plurality of heat sink fins 24 are provided on the second heat transfer plate 23. The heat sink fins 24 are formed into a rod shape that extends perpendicularly to the second heat exchanger plate 23 . The heat sink fins 24 are made of, for example, the same metal as the second heat transfer plate 23, such as copper. The heat sink fins 24 are provided to further increase the surface area of the heat generating body 6 and to further diffuse the heat generated by the heat generating body 6.
（噴流供給部）
　図２に示すように、噴流供給部３０は、発熱体３に第一冷媒Ｒ１の噴流を供給する。噴流供給部３０は、循環配管３１と、ポンプ３２と、フィルタ３３と、を有する。 (Jet flow supply section)
As shown in FIG. 2, the jet supply section 30 supplies a jet of the first refrigerant R1 to the heating element 3. The jet flow supply section 30 includes a circulation pipe 31, a pump 32, and a filter 33.
（循環配管）
　循環配管３１は、ケーシング１１の外部に設けられている。循環配管３１は、両端がケーシング１１内と連通している。循環配管３１には、第一冷媒Ｒ１が流通可能である。本実施形態では、循環配管３１の一端３１ａは、ケーシング１１の下面に接続されている。循環配管３１の一端３１ａは、発熱体３と上下方向で重なる位置に設けられている。循環配管３１の他端３１ｂは、ケーシング１１の上面に接続されている。循環配管３１の他端３１ｂは、発熱体３と上下方向で重なる位置に設けられている。このため、循環配管３１の他端３１ｂは、発熱体３及びヒートシンク機構２０と対向する位置に配置されている。 (circulation piping)
Circulation piping 31 is provided outside of casing 11. Both ends of the circulation pipe 31 communicate with the inside of the casing 11. The first refrigerant R1 can flow through the circulation pipe 31. In this embodiment, one end 31a of the circulation pipe 31 is connected to the lower surface of the casing 11. One end 31a of the circulation pipe 31 is provided at a position overlapping the heating element 3 in the vertical direction. The other end 31b of the circulation pipe 31 is connected to the upper surface of the casing 11. The other end 31b of the circulation pipe 31 is provided at a position overlapping the heating element 3 in the vertical direction. Therefore, the other end 31b of the circulation pipe 31 is arranged at a position facing the heating element 3 and the heat sink mechanism 20.
（ポンプ）
　ポンプ３２は、循環配管３１に設けられている。ポンプ３２は、循環配管３１の一端３１ａから他端３１ｂに向けて第一冷媒Ｒ１を流通させる。 (pump)
The pump 32 is provided in the circulation pipe 31. The pump 32 circulates the first refrigerant R1 from one end 31a of the circulation pipe 31 to the other end 31b.
（フィルタ）
　フィルタ３３は、循環配管３１に設けられている。フィルタ３３は、ポンプ３２よりも第一冷媒Ｒ１の流通方向の下流側に設けられている。フィルタ３３は、例えば活性炭フィルタである。 (filter)
The filter 33 is provided in the circulation pipe 31. The filter 33 is provided downstream of the pump 32 in the flow direction of the first refrigerant R1. The filter 33 is, for example, an activated carbon filter.
　上記噴流供給部３０によって、第一冷媒Ｒ１がケーシング１１及び循環配管３１の内部を循環する。これにより、ケーシング１１内では、第一冷媒Ｒ１は、循環配管３１の他端３１ｂから噴出されて基板２を迂回し、循環配管３１の一端３１ａに流入する。 The first refrigerant R1 is circulated inside the casing 11 and the circulation pipe 31 by the jet supply section 30. Thereby, in the casing 11, the first refrigerant R1 is ejected from the other end 31b of the circulation pipe 31, bypasses the substrate 2, and flows into the one end 31a of the circulation pipe 31.
　以下、ケーシング１１内では、第一冷媒Ｒ１の流通方向を単に「流通方向」と称し、第一冷媒Ｒ１の流通方向のうち、循環配管３１の他端３１ｂ側を「上流側」と称し、循環配管３１の一端３１ａ側を「下流側」と称する場合がある。 Hereinafter, within the casing 11, the flow direction of the first refrigerant R1 will be simply referred to as the "flow direction", and the other end 31b side of the circulation pipe 31 will be referred to as the "upstream side" in the flow direction of the first refrigerant R1. The one end 31a side of the pipe 31 is sometimes referred to as the "downstream side."
（ヘッダ管）
　図１に示すように、ヘッダ管４０は、熱交換器７と連通している。ヘッダ管４０には、熱交換器７の冷媒が流通する。以下では、熱交換器７の冷媒を単に「第二冷媒Ｒ２」と称する。
　ヘッダ管４０は、母管４３と、サブヘッダ４４と、を有する。母管４３は、ヘッダ管４０ごとに１本設けられている。母管４３は、上下方向に延びている。サブヘッダ４４は、１本の母管４３から複数延びる配管である。複数のサブヘッダ４４は、全て水平方向に延びている。複数のサブヘッダ４４は、互いに平行に延びるとともに、上下方向で等間隔に配置されている。ヘッダ管４０は、２本設けられている。本実施形態では、２本のヘッダ管４０は、ケーシング１１を挟んで互いに反対側に設けられている。一方のヘッダ管４０には、熱交換器７から第二冷媒Ｒ２が供給される。この一方のヘッダ管４０に供給された第二冷媒Ｒ２は、ケーシング１１内を通り、他方のヘッダ管４０に戻される。この他方のヘッダ管４０は、ケーシング１１内を通過した第二冷媒Ｒ２を熱交換器７に戻す。 (header pipe)
As shown in FIG. 1, the header pipe 40 communicates with the heat exchanger 7. The refrigerant of the heat exchanger 7 flows through the header pipe 40 . Below, the refrigerant of the heat exchanger 7 will be simply referred to as "second refrigerant R2."
The header pipe 40 has a main pipe 43 and a subheader 44. One main pipe 43 is provided for each header pipe 40. The main pipe 43 extends in the vertical direction. A plurality of subheaders 44 are pipes extending from one main pipe 43. All of the plurality of subheaders 44 extend in the horizontal direction. The plurality of subheaders 44 extend parallel to each other and are arranged at equal intervals in the vertical direction. Two header pipes 40 are provided. In this embodiment, the two header pipes 40 are provided on opposite sides of the casing 11. The second refrigerant R2 is supplied to one header pipe 40 from the heat exchanger 7. The second refrigerant R2 supplied to one header pipe 40 passes through the casing 11 and is returned to the other header pipe 40. This other header pipe 40 returns the second refrigerant R2 that has passed through the casing 11 to the heat exchanger 7.
　以下では、熱交換器７から第二冷媒Ｒ２が供給される一方のヘッダ管４０を「供給ヘッダ管４１」と称し、熱交換器７に第二冷媒Ｒ２を戻す他方のヘッダ管４０を「戻りヘッダ管４２」と称する。 Hereinafter, one header pipe 40 to which the second refrigerant R2 is supplied from the heat exchanger 7 will be referred to as a "supply header pipe 41", and the other header pipe 40 that returns the second refrigerant R2 to the heat exchanger 7 will be referred to as a "return header pipe 41". It is called "header pipe 42".
　供給ヘッダ管４１のサブヘッダ４４と、戻りヘッダ管４２のサブヘッダ４４とは、複数の伝熱管５０によって接続されている。 The subheader 44 of the supply header pipe 41 and the subheader 44 of the return header pipe 42 are connected by a plurality of heat transfer tubes 50.
（伝熱管）
　伝熱管５０は、各ケーシング１１に複数本設けられている。伝熱管５０は、熱交換器７と連通している。伝熱管５０の内部には、熱交換器７の第二冷媒Ｒ２が流通する。伝熱管５０は、ケーシング１１を水平方向に貫通している。複数の伝熱管５０は、互いに平行に延びるとともに、等間隔に配置されている。複数の伝熱管５０は、上下方向で同じに位置に設けられている。各伝熱管５０内の第二冷媒Ｒ２の流れは、供給ヘッダ管４１から戻りヘッダ管４２へ向かう層流である。伝熱管５０は、第二冷媒Ｒ２と第一冷媒Ｒ１とで熱交換を行い、第一冷媒Ｒ１を冷却する。 (heat exchanger tube)
A plurality of heat exchanger tubes 50 are provided in each casing 11. The heat exchanger tubes 50 communicate with the heat exchanger 7. The second refrigerant R2 of the heat exchanger 7 flows inside the heat exchanger tube 50. The heat exchanger tube 50 penetrates the casing 11 in the horizontal direction. The plurality of heat exchanger tubes 50 extend parallel to each other and are arranged at equal intervals. The plurality of heat exchanger tubes 50 are provided at the same position in the vertical direction. The flow of the second refrigerant R2 in each heat exchanger tube 50 is a laminar flow from the supply header tube 41 to the return header tube 42. The heat exchanger tube 50 performs heat exchange between the second refrigerant R2 and the first refrigerant R1, and cools the first refrigerant R1.
　伝熱管５０は、ケーシング１１内で、発熱体３よりも第一冷媒Ｒ１の流通方向の下流側に配置されている。 The heat exchanger tube 50 is arranged within the casing 11 on the downstream side of the heating element 3 in the flow direction of the first refrigerant R1.
　また、図４に示すように、伝熱管５０は、四角形筒状に形成されている。伝熱管５０の内周面には、フィン５１が複数設けられている。フィン５１は、伝熱管５０の内周面の角部に設けられている。伝熱管５０は、押出加工によって製造された、いわゆる押出管である。 Further, as shown in FIG. 4, the heat exchanger tube 50 is formed into a rectangular cylindrical shape. A plurality of fins 51 are provided on the inner peripheral surface of the heat exchanger tube 50. The fins 51 are provided at corners of the inner peripheral surface of the heat exchanger tube 50. The heat exchanger tube 50 is a so-called extruded tube manufactured by extrusion processing.
（第一冷媒の循環）
　続いて、液浸冷却装置１０内の第一冷媒Ｒ１の循環について説明する。
　まず、ケーシング１１の第一冷媒Ｒ１が、循環配管３１の一端３１ａから循環配管３１に流入する。第一冷媒Ｒ１は、ポンプ３２によって循環配管３１の一端３１ａから他端３１ｂに向けて圧送される。そして、第一冷媒Ｒ１は、循環配管３１の他端３１ｂからジェット噴流として噴出される。第一冷媒Ｒ１の噴流は、ヒートシンク機構２０に供給される。第一冷媒Ｒ１には、ヒートシンク機構２０を介して発熱体３の熱が伝達される。このようにして、発熱体３が冷却される。また、第一冷媒Ｒ１は、ヒートシンク機構２０に衝突するように供給される。このため、発熱体３には、いわゆるインピンジ冷却が行われることとなる。 (Circulation of first refrigerant)
Next, the circulation of the first refrigerant R1 within the immersion cooling device 10 will be explained.
First, the first refrigerant R1 of the casing 11 flows into the circulation pipe 31 from one end 31a of the circulation pipe 31. The first refrigerant R1 is pumped by the pump 32 from one end 31a of the circulation pipe 31 to the other end 31b. Then, the first refrigerant R1 is ejected from the other end 31b of the circulation pipe 31 as a jet stream. The jet of first refrigerant R1 is supplied to the heat sink mechanism 20. Heat from the heating element 3 is transferred to the first refrigerant R1 via the heat sink mechanism 20. In this way, the heating element 3 is cooled. Further, the first refrigerant R1 is supplied so as to collide with the heat sink mechanism 20. Therefore, the heating element 3 undergoes so-called impingement cooling.
　その後、第一冷媒Ｒ１は、ヒートシンク機構２０のヒートシンクフィン２４を通過し、基板２の上面に沿って放射状に流れる。第一冷媒Ｒ１は、基板２の外縁に到達すると、基板２の下側に回り込む。そして、第一冷媒Ｒ１は、基板２の下面に沿って流れる。この際、第一冷媒Ｒ１は、複数の伝熱管５０を通過する。第一冷媒Ｒ１は、複数の伝熱管５０を通過する過程で、第二冷媒Ｒ２と熱交換を行って冷却される。伝熱管５０によって冷却された第一冷媒Ｒ１は、循環配管３１の一端３１ａに流入する。循環配管３１の一端３１ａに流入した第一冷媒Ｒ１は、ポンプ３２によって再び圧送される。このようにして、第一冷媒Ｒ１は、液浸冷却装置１０内を循環する。 Thereafter, the first refrigerant R1 passes through the heat sink fins 24 of the heat sink mechanism 20 and flows radially along the upper surface of the substrate 2. When the first refrigerant R1 reaches the outer edge of the substrate 2, it flows around to the lower side of the substrate 2. The first refrigerant R1 then flows along the lower surface of the substrate 2. At this time, the first refrigerant R1 passes through the plurality of heat exchanger tubes 50. The first refrigerant R1 is cooled by exchanging heat with the second refrigerant R2 while passing through the plurality of heat transfer tubes 50. The first refrigerant R1 cooled by the heat transfer tube 50 flows into one end 31a of the circulation pipe 31. The first refrigerant R1 that has flowed into one end 31a of the circulation pipe 31 is pumped again by the pump 32. In this way, the first refrigerant R1 circulates within the immersion cooling device 10.
（作用効果）
　本実施形態の液浸冷却装置１０によれば、以下の作用効果が発揮される。
　本実施形態では、液浸冷却装置１０は、第一冷媒Ｒ１が貯留され、内部に基板２が水平方向に延びるように配置されたケーシング１１と、発熱体３に第一冷媒Ｒ１の噴流を供給する噴流供給部３０と、ケーシング１１を貫通し、内部を流通する第二冷媒Ｒ２と第一冷媒Ｒ１とで熱交換を行い第一冷媒Ｒ１を冷却する伝熱管５０と、を備える。 (effect)
According to the liquid immersion cooling device 10 of this embodiment, the following effects are exhibited.
In this embodiment, the liquid immersion cooling device 10 supplies a jet stream of the first refrigerant R1 to the heating element 3 and the casing 11 in which the first refrigerant R1 is stored and in which the substrate 2 is disposed so as to extend horizontally. and a heat transfer tube 50 that penetrates the casing 11 and performs heat exchange between the second refrigerant R2 and the first refrigerant R1 flowing inside the casing 11 to cool the first refrigerant R1.
　これにより、液浸冷却装置１０は、発熱体３に第一冷媒Ｒ１の噴流を吹き付けて発熱体３をインピンジ冷却することができる。発熱体３に吹き付けられた第一冷媒Ｒ１は、伝熱管５０によって冷却されて再び発熱体３の冷却に用いられる。このように、本実施形態によれば、第一冷媒Ｒ１を循環させるための大規模なサイクルが不要となる。したがって、設備全体として小型化を実現することができる。 Thereby, the liquid immersion cooling device 10 can impinge-cool the heating element 3 by spraying the jet stream of the first refrigerant R1 onto the heating element 3. The first refrigerant R1 sprayed onto the heating element 3 is cooled by the heat transfer tube 50 and used again to cool the heating element 3. In this way, according to the present embodiment, a large-scale cycle for circulating the first refrigerant R1 is not necessary. Therefore, the entire equipment can be downsized.
　さらに、各ケーシング１１は、基板２を１つ分収容できる程度の大きさであればよいので、ケーシング１１上部の空間を自由に利用することが容易となる。これにより、本実施形態のように、既存の空冷用のラック８の各段に、ケーシング１１を水平方向に延びるように横置きで設置することができる。また、本実施形態ではケーシング１１を横置きで配置したが、ケーシング１１の縦置き及び横置きを問わずに、ケーシング１１を配置することも可能である。また、ケーシング１１を、基板２を１つ分収容できる程度の小型に設計することにより、液浸冷却装置１０を可搬とすることができる。これにより、他の高速計算を行う設備に液浸冷却を搬送することが容易となる。また、第一冷媒Ｒ１の量は、ケーシング１１内を充填させる程度でよいため、絶縁性を有するため高価な第一冷媒Ｒ１の使用量を低減することも可能となる。 Furthermore, since each casing 11 only needs to be large enough to accommodate one board 2, it is easy to freely utilize the space above the casing 11. Thereby, as in this embodiment, the casing 11 can be horizontally installed in each stage of the existing air cooling rack 8 so as to extend in the horizontal direction. Further, in this embodiment, the casing 11 is arranged horizontally, but it is also possible to arrange the casing 11 regardless of whether the casing 11 is placed vertically or horizontally. Further, by designing the casing 11 to be small enough to accommodate one board 2, the immersion cooling device 10 can be made portable. This makes it easy to transport immersion cooling to other high-speed computing facilities. Moreover, since the amount of the first refrigerant R1 is sufficient to fill the inside of the casing 11, it is also possible to reduce the amount of the first refrigerant R1, which is expensive because it has insulation properties.
　また、液浸冷却装置１０は、伝熱管５０によって、ケーシング１１に貯留された第一冷媒Ｒ１をケーシング１１内で冷却することができる。これにより、第一冷媒Ｒ１を冷却するために、外部に熱交換器を別途設ける必要が無くなり、設備全体として熱交換器の台数を減らすことができる。また、第一冷媒Ｒ１の循環を液浸冷却装置１０内で完結させることができる。
　以上のように、第一冷媒Ｒ１の使用量を低減しつつ、第一冷媒Ｒ１の循環を液浸冷却装置１０内で完結させることができるので、第一冷媒Ｒ１の管理性を向上させることもできる。 Further, the liquid immersion cooling device 10 can cool the first refrigerant R1 stored in the casing 11 within the casing 11 by the heat transfer tube 50. Thereby, there is no need to separately provide an external heat exchanger to cool the first refrigerant R1, and the number of heat exchangers can be reduced in the entire equipment. Furthermore, the circulation of the first refrigerant R1 can be completed within the immersion cooling device 10.
As described above, since the circulation of the first refrigerant R1 can be completed within the immersion cooling device 10 while reducing the amount of the first refrigerant R1 used, the manageability of the first refrigerant R1 can also be improved. can.
　本実施形態では、噴流供給部３０は、ケーシング１１の外部に設けられるとともに両端がケーシング１１内と連通し、第一冷媒Ｒ１が流通可能な循環配管３１と、循環配管３１に設けられ、循環配管３１の一端３１ａから他端３１ｂに向けて第一冷媒Ｒ１を流通させるポンプ３２と、を有する。循環配管３１の他端３１ｂは、発熱体３と対向する位置に配置されている。 In this embodiment, the jet flow supply unit 30 is provided outside the casing 11 and communicates with the inside of the casing 11 at both ends, and is provided in the circulation pipe 31 and the circulation pipe 31 through which the first refrigerant R1 can flow. A pump 32 that circulates the first refrigerant R1 from one end 31a of 31 to the other end 31b. The other end 31b of the circulation pipe 31 is arranged at a position facing the heating element 3.
　これにより、ケーシング１１内の第一冷媒Ｒ１の流通方向が、循環配管３１の一端３１ａと他端３１ｂの設置箇所により設定される。したがって、ケーシング１１内の第一冷媒Ｒ１の流路の任意に設定できるので、液浸冷却装置１０の冷却効率を向上させることができる。
　さらに、ポンプ３２の圧力を調整することにより、発熱体３の発熱量に応じて噴流の強さをコントロールすることができる。これにより、発熱体３に必要な除熱量に見合った最低限の噴流で発熱体３を冷却することができる。したがって、液浸冷却装置１０の冷却効率を向上させることができる。 Thereby, the flow direction of the first refrigerant R1 in the casing 11 is set by the installation locations of the one end 31a and the other end 31b of the circulation pipe 31. Therefore, since the flow path of the first refrigerant R1 in the casing 11 can be set arbitrarily, the cooling efficiency of the immersion cooling device 10 can be improved.
Furthermore, by adjusting the pressure of the pump 32, the strength of the jet flow can be controlled according to the amount of heat generated by the heating element 3. Thereby, the heat generating element 3 can be cooled with the minimum amount of jet flow commensurate with the amount of heat removal necessary for the heat generating element 3. Therefore, the cooling efficiency of the liquid immersion cooling device 10 can be improved.
　本実施形態では、ケーシング１１内で、伝熱管５０は、発熱体３よりも第一冷媒Ｒ１の流通方向の下流側に配置されている。 In this embodiment, the heat exchanger tubes 50 are arranged in the casing 11 on the downstream side of the heating element 3 in the flow direction of the first refrigerant R1.
　これにより、伝熱管５０内を流通する第二冷媒Ｒ２は、発熱体３を冷却した後の第一冷媒Ｒ１と熱交換を行うことができる。したがって、液浸冷却装置１０の冷却効率をより一層向上させることができる。 Thereby, the second refrigerant R2 flowing in the heat transfer tube 50 can exchange heat with the first refrigerant R1 after cooling the heating element 3. Therefore, the cooling efficiency of the liquid immersion cooling device 10 can be further improved.
　本実施形態では、伝熱管５０の内周面には、フィン５１が設けられている。 In this embodiment, fins 51 are provided on the inner peripheral surface of the heat exchanger tube 50.
　これにより、第二冷媒Ｒ２と接触する伝熱管５０の内周面の表面積が増加する。したがって、伝熱管５０は、第二冷媒Ｒ２と第一冷媒Ｒ１との熱交換の効率を向上させることができる。 As a result, the surface area of the inner peripheral surface of the heat transfer tube 50 that comes into contact with the second refrigerant R2 increases. Therefore, the heat exchanger tube 50 can improve the efficiency of heat exchange between the second refrigerant R2 and the first refrigerant R1.
（第一実施形態の第一変形例）
　続いて、第一実施形態の第一変形例について、図５を参照して説明する。
　図５に示すように、本変形例では、発熱体３及び伝熱管５０は、基板２に対して同じ側（例えば、基板２の下側）に配置されている。噴流供給部３０の第一冷媒Ｒ１の噴流を供給する循環配管３１の他端３１ｂは、発熱体３の真下に設けられている。また、循環配管３１の一端３１ａは、ケーシング１１の側壁に近い位置に設けられている。なお、本変形例では、循環配管３１の一端３１ａは、二股に分岐している。循環配管３１の一端３１ａ及び他端３１ｂは、ともにケーシング１１の下面に設けられている。
　さらに、複数の伝熱管５０は、上下方向の位置が異なるように配置されている。 (First modification of the first embodiment)
Next, a first modification of the first embodiment will be described with reference to FIG. 5.
As shown in FIG. 5, in this modification, the heating element 3 and the heat exchanger tube 50 are arranged on the same side with respect to the substrate 2 (for example, on the lower side of the substrate 2). The other end 31b of the circulation pipe 31 that supplies the jet of the first refrigerant R1 of the jet supply section 30 is provided directly below the heating element 3. Further, one end 31a of the circulation pipe 31 is provided at a position close to the side wall of the casing 11. Note that in this modification, one end 31a of the circulation pipe 31 is bifurcated. One end 31a and the other end 31b of the circulation pipe 31 are both provided on the lower surface of the casing 11.
Furthermore, the plurality of heat exchanger tubes 50 are arranged at different positions in the vertical direction.
　第一冷媒Ｒ１の噴流は、下方から発熱体３に供給される。第一冷媒Ｒ１は、発熱体３を冷却した後、基板２の下面に沿って流れる。この時、第一冷媒Ｒ１は、伝熱管５０を通過し、伝熱管５０を通過する過程で伝熱管５０内の第二冷媒Ｒ２と熱交換を行って冷却される。その後、第一冷媒Ｒ１は、循環配管３１に戻り、再びポンプ３２によって圧送されて、発熱体３に吹き付けられる。 The jet of the first refrigerant R1 is supplied to the heating element 3 from below. After cooling the heating element 3, the first coolant R1 flows along the lower surface of the substrate 2. At this time, the first refrigerant R1 passes through the heat exchanger tube 50, and during the process of passing through the heat exchanger tube 50, it exchanges heat with the second refrigerant R2 in the heat exchanger tube 50 and is cooled. Thereafter, the first refrigerant R1 returns to the circulation pipe 31, is pumped again by the pump 32, and is sprayed onto the heating element 3.
　本変形例では、複数の伝熱管５０は、上下方向の位置が異なるように配置されている。
　これにより、第一冷媒Ｒ１は、複数の伝熱管５０を蛇行しながら通過する。このため、第一冷媒Ｒ１は、第二冷媒Ｒ２と良好に熱交換を行うことができる。したがって、本変形例の液浸冷却装置１０によれば、冷却効率をより一層向上させることができる。 In this modification, the plurality of heat exchanger tubes 50 are arranged at different positions in the vertical direction.
Thereby, the first refrigerant R1 passes through the plurality of heat exchanger tubes 50 while meandering. Therefore, the first refrigerant R1 can effectively exchange heat with the second refrigerant R2. Therefore, according to the liquid immersion cooling device 10 of this modification, cooling efficiency can be further improved.
（第一実施形態の第二変形例）
　続いて、第一実施形態の第二変形例について、図６を参照して説明する。
　図６に示すように、本変形例では、伝熱管５０は、六角形筒状に形成されている。 (Second modification of the first embodiment)
Next, a second modification of the first embodiment will be described with reference to FIG. 6.
As shown in FIG. 6, in this modification, the heat exchanger tube 50 is formed in a hexagonal cylindrical shape.
　これにより、伝熱管５０内により多くの第二冷媒Ｒ２を流通させることができる。したがって、本変形例の液浸冷却装置１０によれば、冷却効率をより一層向上させることが出来る。 Thereby, more second refrigerant R2 can be circulated within the heat exchanger tubes 50. Therefore, according to the liquid immersion cooling device 10 of this modification, cooling efficiency can be further improved.
　伝熱管５０が五角、又は七角以上の多角形筒状に形成されている場合でも、上述の作用効果と同様の作用効果を発揮することが可能となる。 Even when the heat exchanger tube 50 is formed into a polygonal cylinder shape of pentagons, heptagons or more, it is possible to achieve the same effects as those described above.
（第一実施形態の第三変形例）
　続いて、第一実施形態の第三変形例について、図７を参照して説明する。
　図７に示すように、本変形例では、供給ヘッダ管４１と戻りヘッダ管４２とがケーシング１１に対して同じ側に設けられている。伝熱管５０は、ケーシング１１内のヘッダ管４０とは反対側で折り返されるように曲げられている。 (Third modification of the first embodiment)
Next, a third modification of the first embodiment will be described with reference to FIG. 7.
As shown in FIG. 7, in this modification, the supply header pipe 41 and the return header pipe 42 are provided on the same side with respect to the casing 11. The heat exchanger tube 50 is bent so as to be folded back on the side opposite to the header tube 40 inside the casing 11 .
（第一実施形態の第四変形例）
　続いて、第一実施形態の第四変形例について、図８を参照して説明する。
　図８に示すように、本変形例では、液浸冷却装置１０は、補助プロペラ１５をさらに有する。補助プロペラ１５は、ケーシング１１内に設けられている。補助プロペラ１５は、ケーシング１１内を流れる第一冷媒Ｒ１を攪拌する。補助プロペラ１５の攪拌速度は、噴流供給部３０の噴出速度と比較して小さい。 (Fourth modification of the first embodiment)
Next, a fourth modification of the first embodiment will be described with reference to FIG. 8.
As shown in FIG. 8, in this modification, the immersion cooling device 10 further includes an auxiliary propeller 15. The auxiliary propeller 15 is provided within the casing 11. The auxiliary propeller 15 stirs the first refrigerant R1 flowing inside the casing 11. The stirring speed of the auxiliary propeller 15 is lower than the ejection speed of the jet flow supply section 30.
　本変形例によれば、液浸冷却装置１０は、補助プロペラ１５によって第一冷媒Ｒ１をケーシング１１内に均一に流通させることができる。これにより、液浸冷却装置１０は、例えば基板２の発熱体３以外の素子を良好に冷却することができる。したがって、本変形例の液浸冷却装置１０によれば、冷却効率をより一層向上させることができる。 According to this modification, the immersion cooling device 10 can uniformly circulate the first refrigerant R1 within the casing 11 using the auxiliary propeller 15. Thereby, the liquid immersion cooling device 10 can favorably cool elements other than the heating element 3 of the substrate 2, for example. Therefore, according to the immersion cooling device 10 of this modification, cooling efficiency can be further improved.
（第一実施形態の第五変形例）
　続いて、第一実施形態の第五変形例について、図９、図１０を参照して説明する。
　図９、図１０に示すように、本変形例では、循環配管３１は、ケーシング１１の側面に沿って設けられている。循環配管３１は、ケーシング１１を側方から囲うように配置されている。循環配管３１の一端３１ａ及び他端３１ｂは、それぞれ、ケーシング１１の対向する一対の側面に設けられている。循環配管３１の一端３１ａ及び他端３１ｂは、ヒートシンク機構２０と水平方向で重なる位置に設けられている。 (Fifth modification of the first embodiment)
Next, a fifth modification of the first embodiment will be described with reference to FIGS. 9 and 10.
As shown in FIGS. 9 and 10, in this modification, the circulation pipe 31 is provided along the side surface of the casing 11. The circulation pipe 31 is arranged so as to surround the casing 11 from the sides. One end 31a and the other end 31b of the circulation pipe 31 are provided on a pair of opposing side surfaces of the casing 11, respectively. One end 31a and the other end 31b of the circulation pipe 31 are provided at positions overlapping the heat sink mechanism 20 in the horizontal direction.
　循環配管３１及びポンプ３２、フィルタ３３は、ケーシング１１の上下ではなく、ケーシング１１と水平方向で重なる位置に設けられている。 The circulation piping 31, the pump 32, and the filter 33 are provided not above and below the casing 11, but at positions overlapping the casing 11 in the horizontal direction.
　ヘッダ管４０のサブヘッダ４４は、Ｌ字状に形成されている。サブヘッダ４４の母管４３と反対側の端部４４ａは、上向きに延びている。このサブヘッダ４４の上方に向けて延びる端部４４ａには、複数の伝熱管５０が設けられている。 The sub-header 44 of the header pipe 40 is formed in an L-shape. An end 44a of the subheader 44 opposite to the main pipe 43 extends upward. A plurality of heat exchanger tubes 50 are provided at the end portion 44a of the sub-header 44 that extends upward.
　伝熱管５０は、ケーシング１１内において、基板２を挟んで発熱体３と上下方向で同じ側に設けられている。伝熱管５０は、ケーシング１１の循環配管３１の一端３１ａ側の側面に沿って複数設けられている。すなわち、複数の伝熱管５０は、ケーシング１１内における下流側に設けられている。複数の伝熱管５０は、上下方向で等間隔に配置されている。 The heat exchanger tube 50 is provided in the casing 11 on the same side in the vertical direction as the heating element 3 with the substrate 2 in between. A plurality of heat transfer tubes 50 are provided along the side surface of the casing 11 on the one end 31a side of the circulation pipe 31. That is, the plurality of heat exchanger tubes 50 are provided on the downstream side within the casing 11. The plurality of heat exchanger tubes 50 are arranged at equal intervals in the vertical direction.
　第一冷媒Ｒ１の噴流は、水平方向にヒートシンク機構２０に向けて直接供給される。第一冷媒Ｒ１は、ヒートシンク機構２０を介して発熱体３と熱交換を行い、発熱体３が冷却される。第一冷媒Ｒ１は、発熱体３を冷却した後、基板２の上面に沿って流れる。その後、第一冷媒Ｒ１は、伝熱管５０を通過し、伝熱管５０を通過する過程で伝熱管５０内の第二冷媒Ｒ２と熱交換を行って冷却される。そして、第一冷媒Ｒ１は、循環配管３１内に戻り、再びポンプ３２によって圧送されてヒートシンク機構２０に吹き付けられる。 The jet of the first refrigerant R1 is directly supplied toward the heat sink mechanism 20 in the horizontal direction. The first refrigerant R1 exchanges heat with the heating element 3 via the heat sink mechanism 20, and the heating element 3 is cooled. After cooling the heating element 3, the first coolant R1 flows along the upper surface of the substrate 2. Thereafter, the first refrigerant R1 passes through the heat exchanger tube 50, and during the process of passing through the heat exchanger tube 50, it exchanges heat with the second refrigerant R2 in the heat exchanger tube 50 and is cooled. Then, the first refrigerant R1 returns to the circulation pipe 31, is pumped again by the pump 32, and is sprayed onto the heat sink mechanism 20.
　本変形例では、循環配管３１及びポンプ３２、フィルタ３３は、ケーシング１１と水平方向で重なる位置に設けられている。 In this modification, the circulation pipe 31, the pump 32, and the filter 33 are provided at a position that overlaps the casing 11 in the horizontal direction.
　本変形例によれば、液浸冷却装置１０を上下方向に小型化することができる。これにより、例えば液浸冷却装置１０がラック８等によって上下方向に多段配置される場合に、少ないスペースにより多くの液浸冷却装置１０を配置することができる。 According to this modification, the immersion cooling device 10 can be downsized in the vertical direction. Thereby, for example, when the immersion cooling devices 10 are arranged in multiple stages in the vertical direction using the racks 8 or the like, more immersion cooling devices 10 can be arranged in a small space.
　本変形例では、循環配管３１の一端３１ａ及び他端３１ｂは、ヒートシンク機構２０と水平方向で重なる位置に設けられている。 In this modification, one end 31a and the other end 31b of the circulation pipe 31 are provided at positions that overlap the heat sink mechanism 20 in the horizontal direction.
　本変形例によれば、液浸冷却装置１０は、ケーシング１１内に第一冷媒Ｒ１をスムーズに流通させることができる。これにより、液浸冷却装置１０は、ケーシング１１内の第一冷媒Ｒ１の圧損を低減することができる。したがって、液浸冷却装置１０の冷却効率を向上させることができる。 According to this modification, the immersion cooling device 10 can smoothly circulate the first refrigerant R1 within the casing 11. Thereby, the liquid immersion cooling device 10 can reduce the pressure loss of the first refrigerant R1 within the casing 11. Therefore, the cooling efficiency of the liquid immersion cooling device 10 can be improved.
（第一実施形態の第六変形例）
　続いて、第一実施形態の第六変形例について、図１１を参照して説明する。
　図１１に示すように、本変形例では、液浸冷却装置１０ごとに、伝熱管５０が１本設けられている。伝熱管５０は、ケーシング１１内において、水平方向に延在している。伝熱管５０は、ケーシング１１内において、対向する一対の側壁の間を複数回折り返すように波状に設けられている。伝熱管５０の両端は、ケーシング１１の同一の側壁からケーシング１１外に突出している。伝熱管５０の両端は、それぞれ熱交換器７に直接接続されている。
なお、伝熱管５０の両端は、それぞれ供給ヘッダ管４１と戻りヘッダ管４２を介して、熱交換器７と連通していてもよい。 (Sixth modification of the first embodiment)
Next, a sixth modification of the first embodiment will be described with reference to FIG. 11.
As shown in FIG. 11, in this modification, one heat transfer tube 50 is provided for each immersion cooling device 10. Heat exchanger tube 50 extends horizontally within casing 11 . The heat exchanger tubes 50 are provided in a wavy shape within the casing 11 so as to be folded back multiple times between a pair of opposing side walls. Both ends of the heat exchanger tubes 50 protrude outside the casing 11 from the same side wall of the casing 11. Both ends of the heat exchanger tubes 50 are each directly connected to the heat exchanger 7.
In addition, both ends of the heat exchanger tube 50 may be connected to the heat exchanger 7 via the supply header tube 41 and the return header tube 42, respectively.
　なお、上述した第一実施形態及び各変形例では、噴流供給部３０は１本の循環配管３１を備え、第一冷媒Ｒ１の流入口である循環配管３１の一端３１ａと、第二冷媒Ｒ２の流出口となる循環配管３１の他端３１ｂとが、それぞれ１つずつ設けられている場合ついて説明したが、これに限られるものではない。例えば、循環配管３１は、複数本設けられてそれぞれ流入口としての一端３１ａと流出口としての他端３１ｂとを有してもよい。また、例えば、１本の循環配管３１の両端が複数に分岐し、この１本の循環配管３１が流入口としての一端３１ａと流出口としての他端３１ｂとをそれぞれ複数個有してもよい。 In addition, in the first embodiment and each modification described above, the jet flow supply section 30 includes one circulation pipe 31, and one end 31a of the circulation pipe 31 which is the inlet of the first refrigerant R1 and one end 31a of the circulation pipe 31 which is the inlet of the second refrigerant R2. Although a case has been described in which one other end 31b of the circulation pipe 31 is provided as an outflow port, the present invention is not limited to this. For example, a plurality of circulation pipes 31 may be provided, each having one end 31a serving as an inlet and the other end 31b serving as an outlet. Further, for example, both ends of one circulation pipe 31 may branch into a plurality of parts, and this one circulation pipe 31 may each have a plurality of one end 31a serving as an inlet and a plurality of other ends 31b serving as an outlet. .
　なお、上述した第一実施形態及び各変形例では、循環配管３１にフィルタ３３が設けられているとしたが、これに限られない。循環配管３１にはフィルタ３３が設けられていなくてもよい。 Note that in the first embodiment and each modification described above, the filter 33 is provided in the circulation pipe 31, but the present invention is not limited to this. The filter 33 may not be provided in the circulation pipe 31.
＜第二実施形態＞
　以下、本開示の第二実施形態に係る液浸冷却装置２１０について、図１２を参照して説明する。前述した第一実施形態と同様の構成については、同一の名称及び同一の符号を付す等して説明を適宜省略する。 <Second embodiment>
Hereinafter, a liquid immersion cooling device 210 according to a second embodiment of the present disclosure will be described with reference to FIG. 12. Configurations similar to those of the first embodiment described above will be given the same names and numerals, and descriptions thereof will be omitted as appropriate.
　図１２に示すように、本実施形態では、噴流供給部２３０は、ケーシング１１内で発熱体３に対向する位置に配置されたプロペラ２３４である。プロペラ２３４は、基板２よりも上方に設置されている。プロペラ２３４の回転軸２３５は、発熱体３に向けて延びている。また、本実施形態では、発熱体３及び伝熱管５０は、基板２に対して同じ側（例えば、基板２の下側）に配置されている。 As shown in FIG. 12, in this embodiment, the jet flow supply section 230 is a propeller 234 disposed within the casing 11 at a position facing the heating element 3. The propeller 234 is installed above the board 2. A rotating shaft 235 of the propeller 234 extends toward the heating element 3. Further, in this embodiment, the heating element 3 and the heat exchanger tube 50 are arranged on the same side with respect to the substrate 2 (for example, on the lower side of the substrate 2).
　さらに、液浸冷却装置１０は、ケーシング１１内に、第一冷媒Ｒ１の流れを決定するガイド２６０が設けられている。ガイド２６０は、発熱体３及びプロペラ２３４よりもケーシング１１の側壁側に設けられている。ガイド２６０は、傾斜ガイド２６１と、水平ガイド２６２と、を有する。傾斜ガイド２６１は、発熱体３の下方に設けられている。傾斜ガイド２６１は、下方に傾斜しながら水平方向に延びている。水平ガイド２６２は、傾斜ガイド２６１の下端から、水平方向で発熱体３から離間する方向に延びている。 Furthermore, the immersion cooling device 10 is provided with a guide 260 inside the casing 11 that determines the flow of the first refrigerant R1. The guide 260 is provided closer to the side wall of the casing 11 than the heating element 3 and propeller 234 are. The guide 260 includes an inclined guide 261 and a horizontal guide 262. The inclined guide 261 is provided below the heating element 3. The inclined guide 261 extends horizontally while being inclined downward. The horizontal guide 262 extends from the lower end of the inclined guide 261 in the horizontal direction away from the heating element 3 .
　プロペラ２３４は、第一冷媒Ｒ１の噴流を、下方から発熱体３に向かうように発生させる。第一冷媒Ｒ１は、発熱体３を冷却した後、ガイド２６０の上面によって案内されることにより、基板２の下面に沿って流れる。この時、第一冷媒Ｒ１は、伝熱管５０を通過し、伝熱管５０を通過する過程で伝熱管５０内の第二冷媒Ｒ２と熱交換を行って冷却される。その後、第一冷媒Ｒ１は、ガイド２６０の下面に沿って流れてプロペラ２３４に戻り、再びプロペラ２３４によって、発熱体３に吹き付けられる。 The propeller 234 generates a jet of the first refrigerant R1 toward the heating element 3 from below. After cooling the heating element 3, the first coolant R1 flows along the lower surface of the substrate 2 by being guided by the upper surface of the guide 260. At this time, the first refrigerant R1 passes through the heat exchanger tube 50, and during the process of passing through the heat exchanger tube 50, it exchanges heat with the second refrigerant R2 in the heat exchanger tube 50 and is cooled. Thereafter, the first refrigerant R1 flows along the lower surface of the guide 260, returns to the propeller 234, and is again blown onto the heating element 3 by the propeller 234.
　本実施形態では、噴流供給部２３０は、ケーシング１１内で発熱体３に対向する位置に配置され、回転軸２３５が発熱体３に向けて延びるプロペラ２３４である。 In the present embodiment, the jet flow supply section 230 is a propeller 234 that is disposed within the casing 11 at a position facing the heat generating element 3 and has a rotating shaft 235 extending toward the heat generating element 3.
　これにより、噴流供給部２３０の全体が、ケーシング１１内に配置される。したがって、液浸冷却装置２１０の移動がより一層容易となる。 As a result, the entire jet flow supply section 230 is placed within the casing 11. Therefore, moving the immersion cooling device 210 becomes even easier.
　なお、上述した第一実施形態及び第二実施形態では、伝熱管５０が四角形筒状又は五角以上の多角形筒状に形成される場合について説明したが、これに限られるものではない。伝熱管５０は、例えば三角形筒状や円筒状に形成されていてもよい。 In addition, in the first embodiment and second embodiment described above, the case where the heat exchanger tube 50 is formed into a rectangular cylindrical shape or a polygonal cylindrical shape with five or more sides has been described, but it is not limited to this. The heat exchanger tube 50 may be formed into a triangular tube shape or a cylindrical shape, for example.
　なお、上述した第一実施形態の各変形例同士を適宜組み合わせてもよく、第一実施形態の各変形例と第二実施形態とを適宜組み合わせてもよい。 Note that the above-described modifications of the first embodiment may be combined as appropriate, and each modification of the first embodiment and the second embodiment may be combined as appropriate.
＜第三実施形態＞
　以下、本開示の第三実施形態に係る液浸冷却装置３１０について、図１３、図１４を参照して説明する。前述した第一実施形態と同様の構成については、同一の名称及び同一の符号を付す等して説明を適宜省略する。 <Third embodiment>
Hereinafter, a liquid immersion cooling device 310 according to a third embodiment of the present disclosure will be described with reference to FIGS. 13 and 14. Configurations similar to those of the first embodiment described above will be given the same names and numerals, and descriptions thereof will be omitted as appropriate.
　図１３、図１４に示すように、本実施形態の液浸冷却装置３１０は、基板２に設けられた発熱体３を冷却する。第一実施形態及び第二実施形態と同様に、液浸冷却装置３１０は、ケーシング群３１１と、供給側ヘッダ３２０と、排出側ヘッダ３３０と、冷媒圧送部３４０と、伝熱管３５０と、上側第二ヘッダ３１４と、下側第二ヘッダ３１３と、冷媒供給部３６０と、冷媒排出部３７０と、第一接続管３１５と、第二接続管３１６と、第三接続管３１７と、第四接続管３１８と、を備える。 As shown in FIGS. 13 and 14, the immersion cooling device 310 of this embodiment cools the heating element 3 provided on the substrate 2. Similar to the first embodiment and the second embodiment, the liquid immersion cooling device 310 includes a casing group 311, a supply side header 320, a discharge side header 330, a refrigerant pressure feeding section 340, a heat transfer tube 350, and an upper side header 330. The second header 314, the lower second header 313, the refrigerant supply section 360, the refrigerant discharge section 370, the first connection pipe 315, the second connection pipe 316, the third connection pipe 317, and the fourth connection pipe 318.
（ケーシング群）
　ケーシング群３１１は、ケーシング３１２が上下方向に配列されてなる集合体である。ケーシング３１２は、水平方向に延びる、立方体状の箱型をなしている。ケーシング３１２は、ラック８の各段に設けられている。本実施形態では、ケーシング３１２は、上下方向に並んで７個配置されている。 (Casing group)
The casing group 311 is a collection of casings 312 arranged in the vertical direction. The casing 312 has a cubic box shape that extends in the horizontal direction. A casing 312 is provided at each stage of the rack 8. In this embodiment, seven casings 312 are arranged in the vertical direction.
　ケーシング３１２内には、第一冷媒Ｒ１が貯留されている。本実施形態では、ケーシング３１２は、第一冷媒Ｒ１で満液となっている。すなわち、第一冷媒Ｒ１は、ケーシング３１２内の全貯留空間に満たされている。
　ケーシング３１２の内部には、基板２が水平方向に延びるように配置されている。基板２の表面には、発熱体３が設けられている。 A first refrigerant R1 is stored in the casing 312. In this embodiment, the casing 312 is filled with the first refrigerant R1. That is, the entire storage space within the casing 312 is filled with the first refrigerant R1.
The board 2 is arranged inside the casing 312 so as to extend in the horizontal direction. A heating element 3 is provided on the surface of the substrate 2.
　また、ケーシング群３１１の水平方向一方側には、供給側ヘッダ３２０が設けられ、ケーシング群３１１の水平方向他方側には、排出側ヘッダ３３０が設けられている。すなわち、ケーシング群３１１を挟んで、供給側ヘッダ３２０と排出側ヘッダ３３０とが水平方向に対向するように設けられている。 Furthermore, a supply header 320 is provided on one side of the casing group 311 in the horizontal direction, and a discharge header 330 is provided on the other side of the casing group 311 in the horizontal direction. That is, the supply header 320 and the discharge header 330 are provided to face each other in the horizontal direction with the casing group 311 in between.
　以下では、供給側ヘッダ３２０と排出側ヘッダ３３０との対向方向Ｄａを単に「対向方向Ｄａ」と称し、対向方向Ｄａに直交する水平方向を「幅方向Ｄｗ」と称する。 Hereinafter, the opposing direction Da between the supply header 320 and the discharge header 330 will be simply referred to as the "opposing direction Da", and the horizontal direction orthogonal to the opposing direction Da will be referred to as the "width direction Dw".
（供給側ヘッダ）
　供給側ヘッダ３２０は、ケーシング３１２に隣接するように上下方向に延びている。供給側ヘッダ３２０は、複数のケーシング３１２内にそれぞれ第一冷媒Ｒ１を導入可能とされている。供給側ヘッダ３２０は、供給側ヘッダ本体３２１と、供給側分岐管３２２と、を有する。 (Supply side header)
The supply header 320 extends vertically adjacent to the casing 312. The supply header 320 is capable of introducing the first refrigerant R1 into each of the plurality of casings 312. The supply header 320 includes a supply header main body 321 and a supply branch pipe 322.
　供給側ヘッダ本体３２１は、上下方向に延びる筒状に形成されている。供給側ヘッダ本体３２１の延在方向の両端部は、閉塞されている。供給側ヘッダ本体３２１の内部では、第一冷媒Ｒ１が上下方向に流通する。 The supply side header main body 321 is formed into a cylindrical shape extending in the vertical direction. Both ends of the supply header main body 321 in the extending direction are closed. Inside the supply side header body 321, the first refrigerant R1 flows in the vertical direction.
　供給側分岐管３２２は、供給側ヘッダ本体３２１に複数設けられている。複数の供給側分岐管３２２は、ケーシング群３１１に沿って上下方向に等間隔で配置されている。供給側分岐管３２２は、ケーシング３１２毎に１つずつ設けられている。供給側分岐管３２２は、ケーシング３１２の供給側ヘッダ３２０側の側壁３１２ａに接続されている。供給側分岐管３２２は、ケーシング３１２の側壁３１２ａを貫通している。供給側分岐管３２２は、ケーシング３１２の側壁３１２ａの幅方向Ｄｗ一方側の端部に設けられている。 A plurality of supply side branch pipes 322 are provided in the supply side header main body 321. The plurality of supply side branch pipes 322 are arranged at equal intervals in the vertical direction along the casing group 311. One supply branch pipe 322 is provided for each casing 312. The supply side branch pipe 322 is connected to the side wall 312a of the casing 312 on the supply side header 320 side. The supply side branch pipe 322 penetrates the side wall 312a of the casing 312. The supply branch pipe 322 is provided at one end of the side wall 312a of the casing 312 in the width direction Dw.
（排出側ヘッダ）
　排出側ヘッダ３３０は、ケーシング３１２に隣接するように上下方向に延びている。排出側ヘッダ３３０には、複数のケーシング３１２のそれぞれから第一冷媒Ｒ１が導入される。排出側ヘッダ３３０は、排出側ヘッダ本体３３１と、排出側分岐管３３２と、を有する。 (Discharge side header)
The discharge header 330 extends in the vertical direction adjacent to the casing 312. The first refrigerant R1 is introduced into the discharge side header 330 from each of the plurality of casings 312. The discharge side header 330 has a discharge side header main body 331 and a discharge side branch pipe 332.
　排出側ヘッダ本体３３１は、上下方向に延びる筒状に形成されている。排出側ヘッダ本体３３１の延在方向の両端部は、閉塞されている。排出側ヘッダ本体３３１の内部では、第一冷媒Ｒ１が上下方向に流通する。 The discharge side header main body 331 is formed into a cylindrical shape extending in the vertical direction. Both ends of the discharge side header main body 331 in the extending direction are closed. Inside the discharge side header body 331, the first refrigerant R1 flows in the vertical direction.
　排出側分岐管３３２は、排出側ヘッダ本体３３１に複数設けられている。複数の排出側分岐管３３２は、ケーシング群３１１に沿って上下方向に等間隔で配置されている。排出側分岐管３３２は、ケーシング３１２毎に１つずつ設けられている。排出側分岐管３３２は、ケーシング３１２の排出側ヘッダ３３０側の側壁３１２ａに接続されている。排出側分岐管３３２は、ケーシング３１２の側壁３１２ａを貫通している。排出側分岐管３３２は、ケーシング３１２の側壁３１２ａの幅方向Ｄｗ一方側の端部に設けられている。排出側分岐管３３２は、供給側分岐管３２２と対向方向Ｄａで重なる位置に設けられている。 A plurality of discharge side branch pipes 332 are provided in the discharge side header main body 331. The plurality of discharge side branch pipes 332 are arranged at equal intervals in the vertical direction along the casing group 311. One discharge side branch pipe 332 is provided for each casing 312. The discharge side branch pipe 332 is connected to the side wall 312a of the casing 312 on the discharge side header 330 side. The discharge side branch pipe 332 penetrates the side wall 312a of the casing 312. The discharge side branch pipe 332 is provided at one end of the side wall 312a of the casing 312 in the width direction Dw. The discharge side branch pipe 332 is provided at a position overlapping the supply side branch pipe 322 in the opposing direction Da.
（冷媒圧送部）
　冷媒圧送部３４０は、ケーシング群３１１の下方に設けられている。冷媒圧送部３４０は、第一接続管３１５によって排出側ヘッダ３３０の下部と接続され、第二接続管３１６によって供給側ヘッダ３２０の下部と接続されている。第一接続管３１５は、排出側ヘッダ３３０と冷媒圧送部３４０とを連通させ、第二接続管３１６は、供給側ヘッダ３２０と冷媒圧送部３４０とを連通させている。冷媒圧送部３４０は、排出側ヘッダ３３０の下部から供給側ヘッダ３２０の下部に第一冷媒Ｒ１を圧送する。本実施形態の冷媒圧送部３４０は、ポンプである。 (refrigerant pressure feeding section)
The refrigerant pumping section 340 is provided below the casing group 311. The refrigerant pumping section 340 is connected to the lower part of the discharge side header 330 by a first connecting pipe 315 and connected to the lower part of the supply side header 320 by a second connecting pipe 316. The first connecting pipe 315 allows the discharge side header 330 and the refrigerant pumping section 340 to communicate with each other, and the second connecting pipe 316 allows the supply side header 320 and the refrigerant pumping section 340 to communicate with each other. The refrigerant pumping section 340 pumps the first refrigerant R1 from the lower part of the discharge side header 330 to the lower part of the supply side header 320. The refrigerant pumping section 340 of this embodiment is a pump.
（伝熱管）
　伝熱管３５０は、排出側ヘッダ３３０及び供給側ヘッダ３２０の少なくとも一方の内側で延びる配管である。本実施形態では、伝熱管３５０は、排出側ヘッダ３３０の内側で上下方向に延びるように設けられている。伝熱管３５０は、排出側ヘッダ３３０内で、水平方向に間隔を空けて複数本設けられている。伝熱管３５０の内部では、下方から上方に向かって第二冷媒Ｒ２が流通する。伝熱管３５０は、伝熱管３５０の内部を流通する第二冷媒Ｒ２と伝熱管３５０の周りを流通する第一冷媒Ｒ１とを熱交換させて第一冷媒Ｒ１を冷却する。本実施形態では、伝熱管３５０は、第二冷媒Ｒ２と排出側ヘッダ３３０内の第一冷媒Ｒ１とを熱交させて排出側ヘッダ３３０内の第一冷媒Ｒ１を冷却する。 (heat exchanger tube)
The heat exchanger tube 350 is a pipe that extends inside at least one of the discharge side header 330 and the supply side header 320. In this embodiment, the heat exchanger tube 350 is provided inside the discharge side header 330 so as to extend in the vertical direction. A plurality of heat transfer tubes 350 are provided within the discharge header 330 at intervals in the horizontal direction. Inside the heat exchanger tube 350, the second refrigerant R2 flows from the bottom to the top. The heat exchanger tube 350 cools the first refrigerant R1 by exchanging heat between the second refrigerant R2 flowing inside the heat exchanger tube 350 and the first refrigerant R1 flowing around the heat exchanger tube 350. In the present embodiment, the heat transfer tube 350 cools the first refrigerant R1 in the discharge header 330 by exchanging heat between the second refrigerant R2 and the first refrigerant R1 in the discharge header 330.
　本実施形態では、伝熱管３５０は、排出側ヘッダ本体３３１内に設けられ、排出側ヘッダ本体３３１の延在方向両側の端壁を貫通している。 In this embodiment, the heat exchanger tubes 350 are provided in the discharge side header body 331 and penetrate through the end walls of the discharge side header body 331 on both sides in the extending direction.
（下側第二ヘッダ）
　排出側ヘッダ３３０の上端部には、下側第二ヘッダ３１３が設けられている。下側第二ヘッダ３１３は、排出側ヘッダ３３０の下端の端壁を下方から覆うように設けられている。下側第二ヘッダ３１３は、伝熱管３５０の下端と連通している。下側第二ヘッダ３１３内には、伝熱管３５０に供給される第二冷媒Ｒ２が供給される。下側第二ヘッダ３１３は、第三接続管３１７によって外部の熱交換器７と接続されている。第三接続管３１７は、下側第二ヘッダ３１３と熱交換器７とを連通させる。 (lower second header)
A lower second header 313 is provided at the upper end of the discharge header 330. The second lower header 313 is provided to cover the lower end wall of the discharge header 330 from below. The lower second header 313 communicates with the lower end of the heat exchanger tube 350. The second refrigerant R2 to be supplied to the heat exchanger tubes 350 is supplied into the lower second header 313. The lower second header 313 is connected to the external heat exchanger 7 by a third connecting pipe 317. The third connecting pipe 317 allows the lower second header 313 and the heat exchanger 7 to communicate with each other.
（上側第二ヘッダ）
　排出側ヘッダ３３０の上端部には、上側第二ヘッダ３１４が設けられている。上側第二ヘッダ３１４は、排出側ヘッダ３３０の上端の端壁を上方から覆うように設けられている。上側第二ヘッダ３１４は、伝熱管３５０の上端と連通している。上側第二ヘッダ３１４内には、伝熱管３５０を通過した第二冷媒Ｒ２が供給される。上側第二ヘッダ３１４は、第四接続管３１８によって外部の熱交換器７と接続されている。第四接続管３１８は、上側第二ヘッダ３１４と熱交換器７とを連通させる。 (upper second header)
An upper second header 314 is provided at the upper end of the discharge header 330. The upper second header 314 is provided to cover the upper end wall of the discharge header 330 from above. The upper second header 314 communicates with the upper end of the heat exchanger tube 350. The second refrigerant R2 that has passed through the heat exchanger tubes 350 is supplied into the upper second header 314. The upper second header 314 is connected to the external heat exchanger 7 by a fourth connecting pipe 318. The fourth connecting pipe 318 allows the upper second header 314 and the heat exchanger 7 to communicate with each other.
（冷媒供給部）
　冷媒供給部３６０は、各ケーシング３１２内に設けられている。冷媒供給部３６０は、ケーシング３１２内の供給側ヘッダ３２０側に設けられている。冷媒供給部３６０は、供給側マニホールド３６１と、ノズル３６２と、を有する。 (Refrigerant supply section)
A refrigerant supply section 360 is provided within each casing 312. The refrigerant supply section 360 is provided within the casing 312 on the supply side header 320 side. The refrigerant supply section 360 includes a supply side manifold 361 and a nozzle 362.
　供給側マニホールド３６１は、ケーシング３１２の供給側ヘッダ３２０側の側壁３１２ａに沿って幅方向Ｄｗに延びる管状の部材である。供給側マニホールド３６１は、幅方向Ｄｗ一方側の端部で供給側分岐管３２２と連通している。供給側マニホールド３６１は、供給側ヘッダ３２０から供給される第一冷媒Ｒ１を、ケーシング３１２内に、幅方向Ｄｗに導く。 The supply manifold 361 is a tubular member that extends in the width direction Dw along the side wall 312a of the casing 312 on the supply side header 320 side. The supply side manifold 361 communicates with the supply side branch pipe 322 at one end in the width direction Dw. The supply manifold 361 guides the first refrigerant R1 supplied from the supply header 320 into the casing 312 in the width direction Dw.
　ノズル３６２は、供給側マニホールド３６１に幅方向Ｄｗに複数が並設されるように設けられている。本実施形態では、ノズル３６２は、幅方向Ｄｗに並んで６個設けられている。ノズル３６２は、供給側マニホールド３６１と連通し、対向方向Ｄａに延びる円筒状の部材である。ノズル３６２は、ケーシング３１２内に向けて対向方向Ｄａに開口している。ノズル３６２は、供給側マニホールド３６１内の第一冷媒Ｒ１を排出側ヘッダ３３０側に噴出可能とされている。ノズル３６２は、供給側マニホールド３６１から対向方向Ｄａで排出側ヘッダ３３０側に向かうしたがい漸次拡径している。 A plurality of nozzles 362 are provided in the supply side manifold 361 so as to be arranged in parallel in the width direction Dw. In this embodiment, six nozzles 362 are provided side by side in the width direction Dw. The nozzle 362 is a cylindrical member that communicates with the supply side manifold 361 and extends in the opposing direction Da. The nozzle 362 opens into the casing 312 in the opposing direction Da. The nozzle 362 is capable of spouting the first refrigerant R1 in the supply manifold 361 to the discharge header 330 side. The nozzle 362 gradually increases in diameter as it moves from the supply manifold 361 toward the discharge header 330 in the opposing direction Da.
（冷媒排出部）
　冷媒排出部３７０は、各ケーシング３１２内に設けられている。冷媒排出部３７０は、ケーシング３１２内の排出側ヘッダ３３０側に設けられている。冷媒排出部３７０は、排出側マニホールド３７１を有する。 (refrigerant discharge section)
A refrigerant discharge section 370 is provided within each casing 312. The refrigerant discharge section 370 is provided within the casing 312 on the discharge side header 330 side. The refrigerant discharge section 370 has a discharge side manifold 371.
　排出側マニホールド３７１は、ケーシング３１２の排出側ヘッダ３３０側の側壁３１２ａに沿って幅方向Ｄｗに延びる管状の部材である。排出側マニホールド３７１の供給側ヘッダ３２０側の側壁には、該側壁３１２ａを貫通する導入孔３７２が設けられている。排出側マニホールド３７１内には、ケーシング３１２内の第一冷媒Ｒ１が導入孔３７２から導入される。排出側マニホールド３７１は、幅方向Ｄｗ一方側の端部で排出側分岐管３３２と連通している。排出側マニホールド３７１は、ケーシング３１２内から排出される第一冷媒Ｒ１を排出側ヘッダ３３０に導く。 The discharge side manifold 371 is a tubular member that extends in the width direction Dw along the side wall 312a of the casing 312 on the side of the discharge side header 330. An introduction hole 372 passing through the side wall 312a is provided in the side wall of the discharge side manifold 371 on the supply side header 320 side. The first refrigerant R1 in the casing 312 is introduced into the discharge side manifold 371 from the introduction hole 372. The discharge side manifold 371 communicates with the discharge side branch pipe 332 at one end in the width direction Dw. The discharge side manifold 371 guides the first refrigerant R1 discharged from the inside of the casing 312 to the discharge side header 330.
（第一冷媒の循環）
　続いて、液浸冷却装置３１０内の第一冷媒Ｒ１の循環について説明する。
　まず、冷媒圧送部３４０を稼動させると、供給側ヘッダ３２０からケーシング３１２内に第一冷媒Ｒ１が供給される。この時、第一冷媒Ｒ１は、複数のノズル３６２によってケーシング３１２内に噴出される。第一冷媒Ｒ１は、噴流としてケーシング３１２内を対向方向Ｄａに流れる。ケーシング３１２内の第一冷媒Ｒ１は、発熱体３を通過し、発熱体３と熱交換を行う。これにより、発熱体３が冷却される。一方で、第一冷媒Ｒ１は発熱体３の熱を受けて加熱される。その後、第一冷媒Ｒ１は、各ケーシング３１２から排出側ヘッダ３３０に導入される。第一冷媒Ｒ１は、冷媒圧送部３４０の圧力と自重によって、排出側ヘッダ３３０内を上方から下方に向けて流れる。 (Circulation of first refrigerant)
Next, the circulation of the first refrigerant R1 within the immersion cooling device 310 will be explained.
First, when the refrigerant pumping section 340 is operated, the first refrigerant R1 is supplied from the supply header 320 into the casing 312. At this time, the first refrigerant R1 is ejected into the casing 312 by the plurality of nozzles 362. The first refrigerant R1 flows in the opposite direction Da in the casing 312 as a jet stream. The first refrigerant R1 in the casing 312 passes through the heating element 3 and exchanges heat with the heating element 3. Thereby, the heating element 3 is cooled. On the other hand, the first refrigerant R1 receives heat from the heating element 3 and is heated. Thereafter, the first refrigerant R1 is introduced from each casing 312 to the discharge side header 330. The first refrigerant R1 flows from above to below within the discharge side header 330 due to the pressure of the refrigerant pressure feeding section 340 and its own weight.
　一方で、伝熱管３５０内では、第二冷媒Ｒ２が下方から上方に向けて流れる。すなわち、第一冷媒Ｒ１と第二冷媒Ｒ２とは、上下方向で互いに逆方向に流れる。第一冷媒Ｒ１は、排出側ヘッダ３３０内を流通する過程で、第二冷媒Ｒ２と熱交換を行う。これにより、第一冷媒Ｒ１は冷却され、第二冷媒Ｒ２は加熱される。第二冷媒Ｒ２は、第一冷媒Ｒ１と熱交換を行った後、外部の熱交換器７に送られる。第二冷媒Ｒ２は、熱交換器７によって冷却されて、再び各伝熱管３５０に供給される。 On the other hand, within the heat exchanger tube 350, the second refrigerant R2 flows from the bottom to the top. That is, the first refrigerant R1 and the second refrigerant R2 flow in mutually opposite directions in the vertical direction. The first refrigerant R1 exchanges heat with the second refrigerant R2 while flowing through the discharge side header 330. Thereby, the first refrigerant R1 is cooled and the second refrigerant R2 is heated. The second refrigerant R2 is sent to the external heat exchanger 7 after exchanging heat with the first refrigerant R1. The second refrigerant R2 is cooled by the heat exchanger 7 and supplied to each heat exchanger tube 350 again.
　第一冷媒Ｒ１は、第二冷媒Ｒ２との熱交換によって冷却されると、冷媒圧送部３４０によって供給側ヘッダ３２０に再び圧送される。そして上述したように、第一冷媒Ｒ１は、ケーシング３１２内に再び供給される。このようにして、第一冷媒Ｒ１は、液浸冷却装置３１０内を循環する。 After the first refrigerant R1 is cooled by heat exchange with the second refrigerant R2, it is again pressure-fed to the supply-side header 320 by the refrigerant pressure-feeding section 340. Then, as described above, the first refrigerant R1 is supplied into the casing 312 again. In this way, the first refrigerant R1 circulates within the immersion cooling device 310.
（作用効果）
　本実施形態の液浸冷却装置３１０によれば、以下の作用効果が発揮される。
　本実施形態では、液浸冷却装置３１０は、水平方向に延びる箱型をなして、内部に基板２が水平方向に延びるように配置された複数のケーシング３１２を有し、これらケーシング３１２が上下方向に配列されてなるケーシング群３１１と、ケーシング３１２に隣接するように上下方向に延びて、複数のケーシング３１２内にそれぞれ第一冷媒Ｒ１を導入可能な供給側ヘッダ３２０と、ケーシング３１２に隣接するように上下方向に延びて、複数のケーシング３１２のそれぞれから第一冷媒Ｒ１が導入される排出側ヘッダ３３０と、排出側ヘッダ３３０から供給側ヘッダ３２０に第一冷媒Ｒ１を圧送する冷媒圧送部３４０と、排出側ヘッダ３３０及び供給側ヘッダ３２０の少なくとも一方の内側で延びて、内部を流通する第二冷媒Ｒ２と第一冷媒Ｒ１とを熱交換させて第一冷媒Ｒ１を冷却する伝熱管３５０と、を備える。 (effect)
According to the liquid immersion cooling device 310 of this embodiment, the following effects are exhibited.
In this embodiment, the liquid immersion cooling device 310 has a box shape extending in the horizontal direction, and has a plurality of casings 312 arranged so that the substrate 2 extends in the horizontal direction, and these casings 312 are arranged in the vertical direction. a group of casings 311 arranged in a row, a supply header 320 extending vertically adjacent to the casings 312 and capable of introducing the first refrigerant R1 into each of the plurality of casings 312; a discharge side header 330 that extends in the vertical direction and into which the first refrigerant R1 is introduced from each of the plurality of casings 312; and a refrigerant pumping section 340 that force-feeds the first refrigerant R1 from the discharge header 330 to the supply header 320. , a heat transfer tube 350 that extends inside at least one of the discharge side header 330 and the supply side header 320, and cools the first refrigerant R1 by exchanging heat between the second refrigerant R2 and the first refrigerant R1 flowing therein; Equipped with.
　これにより、上下方向に配列される複数のケーシング３１２に対して、伝熱管３５０を、ケーシング３１２に沿うように設けることができる。このため、液浸冷却装置３１０が水平方向に広がることを抑制することができる。したがって、液浸冷却装置３１０を水平方向に小型化することができる。また、第一冷媒Ｒ１の流路が水平方向にコンパクトにまとめられるので、第一冷媒Ｒ１の管理が容易となる。すなわち、第一冷媒Ｒ１の管理性を向上させることができる。 Thereby, the heat exchanger tubes 350 can be provided along the casings 312 for the plurality of casings 312 arranged in the vertical direction. Therefore, it is possible to suppress the liquid immersion cooling device 310 from expanding in the horizontal direction. Therefore, the liquid immersion cooling device 310 can be downsized in the horizontal direction. Furthermore, since the flow path of the first refrigerant R1 is compactly arranged in the horizontal direction, management of the first refrigerant R1 becomes easy. That is, the manageability of the first refrigerant R1 can be improved.
　本実施形態では、伝熱管３５０は、上下方向に延びている。 In this embodiment, the heat exchanger tubes 350 extend in the vertical direction.
　これにより、ケーシング３１２の配列方向と伝熱管３５０の延在方向が一致する。このため、ケーシング３１２や伝熱管３５０等の液浸冷却装置３１０の構成の配置効率が向上される。さらに、上下方向に延びる供給側ヘッダ３２０と排出側ヘッダ３３０の内側に、伝熱管３５０を上下方向に延びるように設けることができるため、第一冷媒Ｒ１と第二冷媒Ｒ２とで熱交換が行われる距離を長くすることができる。したがって、液浸冷却装置３１０は、第一冷媒Ｒ１を良好に冷却することができる。よって、液浸冷却装置３１０の冷却効率を向上させることができる。 As a result, the arrangement direction of the casings 312 and the extending direction of the heat exchanger tubes 350 match. Therefore, the arrangement efficiency of the components of the immersion cooling device 310 such as the casing 312 and the heat transfer tubes 350 is improved. Furthermore, since the heat transfer tubes 350 can be provided to extend in the vertical direction inside the supply header 320 and the discharge header 330, which extend in the vertical direction, heat exchange is performed between the first refrigerant R1 and the second refrigerant R2. The distance traveled can be increased. Therefore, the liquid immersion cooling device 310 can cool the first refrigerant R1 well. Therefore, the cooling efficiency of the liquid immersion cooling device 310 can be improved.
　本実施形態では、冷媒圧送部３４０は、排出側ヘッダ３３０の下部から供給側ヘッダ３２０に第一冷媒Ｒ１を圧送し、伝熱管３５０は、排出側ヘッダ３３０の内側で延びるように設けられ、下方から上方に向かって第二冷媒Ｒ２が流通する。 In the present embodiment, the refrigerant pressure feeding unit 340 pumps the first refrigerant R1 from the lower part of the discharge header 330 to the supply header 320, and the heat transfer tube 350 is provided to extend inside the discharge header 330, and The second refrigerant R2 flows upward from the second refrigerant R2.
　これにより、第一冷媒Ｒ１は、供給側ヘッダ３２０内を上方に向けて流れ、ケーシング３１２内に供給される。その後、第一冷媒Ｒ１は、ケーシング３１２内から排出側ヘッダ３３０に排出され、排出側ヘッダ３３０内を下方に向けて流れる。一方で、第二冷媒Ｒ２は、排出側ヘッダ３３０内に設けられた伝熱管３５０内を上方に向けて流れる。よって、排出側ヘッダ３３０内において、第一冷媒Ｒ１の流れと第二冷媒Ｒ２の流れとは、互いに流通方向が反対向きの対向流となる。このため、第一冷媒Ｒ１と第二冷媒Ｒ２との熱交換効率が向上する。したがって、液浸冷却装置３１０は、第一冷媒Ｒ１をより一層良好に冷却することができる。よって、液浸冷却装置３１０の冷却効率をより一層向上させることができる。
　また、伝熱管３５０が排出側ヘッダ３３０の内側に設けられているので、液浸冷却装置３１０は、伝熱管３５０で第一冷媒Ｒ１を冷却してから、冷媒圧送部３４０に第一冷媒Ｒ１を導くことができる。 As a result, the first refrigerant R1 flows upward in the supply header 320 and is supplied into the casing 312. Thereafter, the first refrigerant R1 is discharged from the inside of the casing 312 to the discharge side header 330, and flows downward within the discharge side header 330. On the other hand, the second refrigerant R2 flows upward in the heat transfer tube 350 provided in the discharge side header 330. Therefore, in the discharge side header 330, the flow of the first refrigerant R1 and the flow of the second refrigerant R2 become counterflows in which the flow directions are opposite to each other. Therefore, the heat exchange efficiency between the first refrigerant R1 and the second refrigerant R2 is improved. Therefore, the liquid immersion cooling device 310 can cool the first refrigerant R1 even better. Therefore, the cooling efficiency of the liquid immersion cooling device 310 can be further improved.
Further, since the heat transfer tube 350 is provided inside the discharge side header 330, the liquid immersion cooling device 310 cools the first refrigerant R1 with the heat transfer tube 350, and then supplies the first refrigerant R1 to the refrigerant pressure feeding section 340. can lead.
　本実施形態では、供給側ヘッダ３２０は、ケーシング群３１１の水平方向一方側に設けられ、排出側ヘッダ３３０は、ケーシング群３１１の水平方向他方側に設けられ、各ケーシング３１２内に設けられた冷媒供給部３６０をさらに備え、冷媒供給部３６０は、供給側ヘッダ３２０から供給される第一冷媒Ｒ１を供給側ヘッダ３２０と排出側ヘッダ３３０との対向方向Ｄａに直交する水平方向である幅方向Ｄｗに導く供給側マニホールド３６１と、供給側マニホールド３６１に幅方向Ｄｗに複数が並設されるように設けられて、供給側マニホールド３６１内の第一冷媒Ｒ１を排出側ヘッダ３３０側に噴出可能なノズル３６２と、を有する。 In this embodiment, the supply header 320 is provided on one side of the casing group 311 in the horizontal direction, the discharge header 330 is provided on the other side of the casing group 311 in the horizontal direction, and the refrigerant provided in each casing 312 is The refrigerant supply unit 360 further includes a supply unit 360, and the refrigerant supply unit 360 supplies the first refrigerant R1 from the supply header 320 in the width direction Dw, which is a horizontal direction orthogonal to the facing direction Da between the supply header 320 and the discharge header 330. a supply side manifold 361 that leads to the discharge side, and a plurality of nozzles that are provided in the supply side manifold 361 so as to be arranged in parallel in the width direction Dw and can jet the first refrigerant R1 in the supply side manifold 361 to the discharge side header 330 side. 362.
　これにより、液浸冷却装置３１０は、第一冷媒Ｒ１を基板２の発熱体３に噴出することができる。さらに、第一冷媒Ｒ１の噴出方向に排出側ヘッダ３３０があるため、熱交換を終えた第一冷媒Ｒ１をスムーズに排出することができる。したがって、液浸冷却装置３１０は、ケーシング３１２内の第一冷媒Ｒ１の圧損を低減することができる。よって、液浸冷却装置３１０の冷却効率をより一層向上させることができる。 Thereby, the liquid immersion cooling device 310 can jet the first refrigerant R1 to the heating element 3 of the substrate 2. Furthermore, since the discharge side header 330 is located in the direction in which the first refrigerant R1 is ejected, the first refrigerant R1 that has undergone heat exchange can be smoothly discharged. Therefore, the liquid immersion cooling device 310 can reduce the pressure loss of the first refrigerant R1 within the casing 312. Therefore, the cooling efficiency of the liquid immersion cooling device 310 can be further improved.
　なお、上述した第三実施形態では、ケーシング３１２は、上下方向に並んで７個配置されている場合について説明したが、これに限られるものではない。ケーシング３１２の個数は適宜変更可能である。 Note that in the third embodiment described above, a case has been described in which seven casings 312 are arranged in the vertical direction, but the present invention is not limited to this. The number of casings 312 can be changed as appropriate.
　なお、上述した第三実施形態では、冷媒圧送部３４０は、ケーシング群３１１の下方に設けられている場合について説明したが、これに限られるものではない。冷媒圧送部３４０は、ケーシング群３１１の上方に設けられていてもよい。この場合、冷媒圧送部３４０は、排出側ヘッダ３３０の上部から供給側ヘッダ３２０に第一冷媒Ｒ１を圧送する。 Note that in the third embodiment described above, a case has been described in which the refrigerant pumping section 340 is provided below the casing group 311, but the present invention is not limited to this. The refrigerant pumping section 340 may be provided above the casing group 311. In this case, the refrigerant pumping section 340 pumps the first refrigerant R1 from the upper part of the discharge side header 330 to the supply side header 320.
　なお、上述した第三実施形態では、伝熱管３５０は、排出側ヘッダ３３０の内側で延びるように設けられている場合ついて説明したが、これに限るものではない。伝熱管３５０は、供給側ヘッダ３２０の内側で延びるように設けられていてもよい。この場合、第一冷媒Ｒ１がケーシング３１２内に導入される直前に、第一冷媒Ｒ１が伝熱管３５０によって冷却される。このため、液浸冷却装置３１０は、ケーシング３１２内の発熱体３をより良好に冷却することができる。すなわち、液浸冷却装置３１０の冷却効率を向上させることができる。また、排出側ヘッダ３３０及び供給側ヘッダ３２０の両方の内側で延びるように設けられていてもよい。 Note that in the third embodiment described above, a case has been described in which the heat exchanger tubes 350 are provided so as to extend inside the discharge side header 330, but the heat exchanger tubes 350 are not limited to this. The heat exchanger tube 350 may be provided so as to extend inside the supply header 320. In this case, immediately before the first refrigerant R1 is introduced into the casing 312, the first refrigerant R1 is cooled by the heat transfer tube 350. Therefore, the liquid immersion cooling device 310 can better cool the heating element 3 inside the casing 312. That is, the cooling efficiency of the liquid immersion cooling device 310 can be improved. Further, it may be provided so as to extend inside both the discharge side header 330 and the supply side header 320.
　なお、上述した第三実施形態では、伝熱管３５０は、ケーシング群３１１に沿うように上下方向に延びて、水平方向に間隔を空けて複数本設けられている場合ついて説明したが、これに限るものではない。伝熱管３５０は、水平方向に延びて、ケーシング群３１１に沿うように上下方向に間隔を空けて複数本設けられていてもよい。 In addition, in the third embodiment described above, a case has been described in which a plurality of heat exchanger tubes 350 are provided extending in the vertical direction along the casing group 311 and spaced apart in the horizontal direction, but the present invention is not limited to this. It's not a thing. The heat exchanger tubes 350 may extend in the horizontal direction and may be provided in plural numbers at intervals in the vertical direction along the casing group 311.
　なお、上述した第三実施形態では、ノズル３６２は、幅方向Ｄｗに並んで６個設けられている場合ついて説明したが、これに限るものではない。ノズル３６２の個数は適宜変更可能である。 Note that in the third embodiment described above, a case has been described in which six nozzles 362 are provided in a row in the width direction Dw, but the present invention is not limited to this. The number of nozzles 362 can be changed as appropriate.
（その他の実施形態）　　　
　以上、本開示の実施の形態について図面を参照して詳述したが、具体的な構成はこの実施の形態に限られるものではなく、本開示の要旨を逸脱しない範囲の設計変更等も含まれる。 (Other embodiments)
Although the embodiment of the present disclosure has been described above in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and includes design changes within the scope of the gist of the present disclosure. .
＜付記＞
　各実施形態に記載の液浸冷却装置１０、２１０、３１０は、例えば以下のように把握される。 <Additional notes>
The liquid immersion cooling devices 10, 210, and 310 described in each embodiment can be understood, for example, as follows.
（１）第１の態様に係る液浸冷却装置３１０は、基板２に設けられた発熱体３を冷却する液浸冷却装置３１０であって、水平方向に延びる箱型をなして、内部に前記基板２が水平方向に延びるように配置された複数のケーシング３１２を有し、これらケーシング３１２が上下方向に配列されてなるケーシング群３１１と、前記ケーシング３１２に隣接するように上下方向に延びて、前記複数のケーシング３１２内にそれぞれ第一冷媒Ｒ１を導入可能な供給側ヘッダ３２０と、前記ケーシング３１２に隣接するように上下方向に延びて、前記複数のケーシング３１２のそれぞれから前記第一冷媒Ｒ１が導入される排出側ヘッダ３３０と、前記排出側ヘッダ３３０から前記供給側ヘッダ３２０に前記第一冷媒Ｒ１を圧送する冷媒圧送部３４０と、前記排出側ヘッダ３３０及び前記供給側ヘッダ３２０の少なくとも一方の内側で延びて、内部を流通する第二冷媒Ｒ２と前記第一冷媒Ｒ１とを熱交換させて前記第一冷媒Ｒ１を冷却する伝熱管３５０と、を備える。 (1) The immersion cooling device 310 according to the first aspect is a liquid immersion cooling device 310 that cools the heating element 3 provided on the substrate 2, and has a box shape extending in the horizontal direction, with the The substrate 2 has a plurality of casings 312 arranged to extend in the horizontal direction, a casing group 311 in which these casings 312 are arranged in the vertical direction, and a casing group 311 that extends in the vertical direction so as to be adjacent to the casings 312, A supply header 320 that can introduce the first refrigerant R1 into each of the plurality of casings 312; a discharge side header 330 to be introduced, a refrigerant pressure feeding section 340 that pumps the first refrigerant R1 from the discharge side header 330 to the supply side header 320, and at least one of the discharge side header 330 and the supply side header 320. The heat exchanger tube 350 extends inside and cools the first refrigerant R1 by exchanging heat between the second refrigerant R2 and the first refrigerant R1 flowing inside.
　これにより、上下方向に配列される複数のケーシング３１２に対して、伝熱管３５０を、ケーシング３１２に沿うように設けることができる。このため、液浸冷却装置３１０が水平方向に広がることを抑制することができる。 Thereby, the heat exchanger tubes 350 can be provided along the casings 312 for the plurality of casings 312 arranged in the vertical direction. Therefore, it is possible to suppress the liquid immersion cooling device 310 from expanding in the horizontal direction.
（２）第２の態様の液浸冷却装置３１０は、第１の態様の液浸冷却装置３１０であって、前記伝熱管３５０は、上下方向に延びていてもよい。 (2) The immersion cooling device 310 of the second aspect is the immersion cooling device 310 of the first aspect, and the heat transfer tubes 350 may extend in the vertical direction.
　これにより、ケーシング３１２の配列方向と伝熱管３５０の延在方向が一致する。このため、ケーシング３１２や伝熱管３５０等の液浸冷却装置３１０の構成の配置効率が向上される。さらに、上下方向に延びる供給側ヘッダ３２０と排出側ヘッダ３３０の内側に、伝熱管３５０を上下方向に延びるように設けることができるため、第一冷媒Ｒ１と第二冷媒Ｒ２とで熱交換が行われる距離を長くすることができる。 As a result, the arrangement direction of the casings 312 and the extending direction of the heat exchanger tubes 350 match. Therefore, the arrangement efficiency of the components of the liquid immersion cooling device 310 such as the casing 312 and the heat transfer tubes 350 is improved. Furthermore, since the heat transfer tubes 350 can be provided to extend in the vertical direction inside the supply header 320 and the discharge header 330, which extend in the vertical direction, heat exchange is performed between the first refrigerant R1 and the second refrigerant R2. The distance traveled can be increased.
（３）第３の態様の液浸冷却装置３１０は、第２の態様の液浸冷却装置３１０であって、前記冷媒圧送部３４０は、前記排出側ヘッダ３３０の下部から前記供給側ヘッダ３２０に前記第一冷媒Ｒ１を圧送し、前記伝熱管３５０は、前記排出側ヘッダ３３０の内側で延びるように設けられ、下方から上方に向かって前記第二冷媒Ｒ２が流通してもよい。 (3) The liquid immersion cooling device 310 of the third aspect is the liquid immersion cooling device 310 of the second aspect, in which the refrigerant pressure feeding section 340 is directed from the lower part of the discharge side header 330 to the supply side header 320. The first refrigerant R1 may be fed under pressure, and the heat transfer tube 350 may be provided to extend inside the discharge header 330, and the second refrigerant R2 may flow from the bottom to the top.
　これにより、第一冷媒Ｒ１は、供給側ヘッダ３２０内を上方に向けて流れ、ケーシング３１２内に供給される。その後、第一冷媒Ｒ１は、ケーシング３１２内から排出側ヘッダ３３０に排出され、排出側ヘッダ３３０内を下方に向けて流れる。一方で、第二冷媒Ｒ２は、排出側ヘッダ３３０内に設けられた伝熱管３５０内を上方に向けて流れる。よって、排出側ヘッダ３３０内において、第一冷媒Ｒ１の流れと第二冷媒Ｒ２の流れとは、互いに流通方向が反対向きの対向流となる。このため、第一冷媒Ｒ１と第二冷媒Ｒ２との熱交換効率が向上する。 As a result, the first refrigerant R1 flows upward within the supply header 320 and is supplied into the casing 312. Thereafter, the first refrigerant R1 is discharged from the inside of the casing 312 to the discharge side header 330, and flows downward within the discharge side header 330. On the other hand, the second refrigerant R2 flows upward in the heat transfer tube 350 provided in the discharge side header 330. Therefore, in the discharge side header 330, the flow of the first refrigerant R1 and the flow of the second refrigerant R2 become counterflows in which the flow directions are opposite to each other. Therefore, the heat exchange efficiency between the first refrigerant R1 and the second refrigerant R2 is improved.
（４）第４の態様の液浸冷却装置３１０は、第１から第３の態様のいずれか１つの液浸冷却装置３１０であって、前記供給側ヘッダ３２０は、前記ケーシング群３１１の水平方向一方側に設けられ、前記排出側ヘッダ３３０は、前記ケーシング群３１１の水平方向他方側に設けられ、各前記ケーシング３１２内に設けられた冷媒供給部３６０をさらに備え、前記冷媒供給部３６０は、前記供給側ヘッダ３２０から供給される前記第一冷媒Ｒ１を前記供給側ヘッダ３２０と前記排出側ヘッダ３３０との対向方向Ｄａに直交する水平方向である幅方向Ｄｗに導く供給側マニホールド３６１と、前記供給側マニホールド３６１に前記幅方向Ｄｗに複数が並設されるように設けられて、前記供給側マニホールド３６１内の前記第一冷媒Ｒ１を前記排出側ヘッダ３３０側に噴出可能なノズル３６２と、を有してもよい。 (4) The liquid immersion cooling device 310 of the fourth aspect is the liquid immersion cooling device 310 of any one of the first to third aspects, wherein the supply side header 320 is arranged in the horizontal direction of the casing group 311. The discharge side header 330 is provided on one side, and the discharge side header 330 is provided on the other side of the casing group 311 in the horizontal direction, and further includes a refrigerant supply section 360 provided in each of the casings 312, and the refrigerant supply section 360 includes: a supply side manifold 361 that guides the first refrigerant R1 supplied from the supply side header 320 in the width direction Dw, which is a horizontal direction perpendicular to the opposing direction Da between the supply side header 320 and the discharge side header 330; A plurality of nozzles 362 are provided in the supply side manifold 361 so as to be arranged in parallel in the width direction Dw, and are capable of spouting the first refrigerant R1 in the supply side manifold 361 toward the discharge side header 330 side. May have.
　これにより、液浸冷却装置３１０は、第一冷媒Ｒ１を基板２の発熱体３に噴出することができる。さらに、第一冷媒Ｒ１の噴出方向に排出側ヘッダ３３０があるため、熱交換を終えた第一冷媒Ｒ１をスムーズに排出することができる。 Thereby, the liquid immersion cooling device 310 can jet the first refrigerant R1 to the heating element 3 of the substrate 2. Furthermore, since the discharge side header 330 is located in the direction in which the first refrigerant R1 is ejected, the first refrigerant R1 that has undergone heat exchange can be smoothly discharged.
（５）第５の態様に係る液浸冷却装置１０、２１０は、基板２に設けられた発熱体３を冷却する液浸冷却装置１０、２１０であって、第一冷媒Ｒ１が貯留され、内部に前記基板２が水平方向に延びるように配置されたケーシング１１と、前記発熱体３に前記第一冷媒Ｒ１の噴流を供給する噴流供給部３０、２３０と、前記ケーシング１１を貫通し、内部を流通する第二冷媒Ｒ２と前記第一冷媒Ｒ１とで熱交換を行い前記第一冷媒Ｒ１を冷却する伝熱管５０と、を備える。 (5) The liquid immersion cooling device 10, 210 according to the fifth aspect is a liquid immersion cooling device 10, 210 that cools the heating element 3 provided on the substrate 2, and the first refrigerant R1 is stored inside the liquid immersion cooling device 10, 210. A casing 11 in which the substrate 2 is arranged so as to extend horizontally, a jet supply section 30, 230 that supplies a jet of the first refrigerant R1 to the heating element 3, and a jet supply section 30, 230 that penetrates the casing 11 and internally It includes a heat transfer tube 50 that performs heat exchange between the circulating second refrigerant R2 and the first refrigerant R1 to cool the first refrigerant R1.
　これにより、液浸冷却装置１０、２１０は、発熱体３に第一冷媒Ｒ１の噴流を吹き付けて発熱体３をインピンジ冷却することができる。発熱体３に吹き付けられた第一冷媒Ｒ１は、伝熱管５０によって冷却されて再び発熱体３の冷却に用いられる。このように、本態様によれば、第一冷媒Ｒ１の循環をさせるために大規模な循環サイクルが不要となる。また、液浸冷却装置１０、２１０は、伝熱管５０によって、ケーシング１１に貯留された第一冷媒Ｒ１をケーシング１１内で冷却することができる。 Thereby, the liquid immersion cooling devices 10 and 210 can impinge-cool the heat generating body 3 by spraying the jet stream of the first refrigerant R1 onto the heat generating body 3. The first refrigerant R1 sprayed onto the heating element 3 is cooled by the heat transfer tube 50 and used again to cool the heating element 3. Thus, according to this aspect, a large-scale circulation cycle is not required to circulate the first refrigerant R1. Moreover, the liquid immersion cooling device 10, 210 can cool the first refrigerant R1 stored in the casing 11 within the casing 11 using the heat transfer tube 50.
（６）第６の態様の液浸冷却装置１０は、第５の態様の液浸冷却装置１０であって、前記噴流供給部３０は、前記ケーシング１１の外部に設けられるとともに両端が前記ケーシング１１内と連通し、前記第一冷媒Ｒ１が流通可能な循環配管３１と、前記循環配管３１に設けられ、前記循環配管３１の一端３１ａから他端３１ｂに向けて前記第一冷媒Ｒ１を流通させるポンプ３２と、を有し、前記循環配管３１の他端３１ｂは、前記発熱体３と対向する位置に配置されていてもよい。 (6) The liquid immersion cooling device 10 of the sixth aspect is the liquid immersion cooling device 10 of the fifth aspect, in which the jet flow supply section 30 is provided outside the casing 11 and both ends thereof are connected to the casing 11. a circulation pipe 31 that communicates with the inside and allows the first refrigerant R1 to flow therethrough; and a pump that is provided in the circulation pipe 31 and allows the first refrigerant R1 to flow from one end 31a of the circulation pipe 31 to the other end 31b. 32, and the other end 31b of the circulation pipe 31 may be arranged at a position facing the heating element 3.
　これにより、ケーシング１１内の第一冷媒Ｒ１の流通方向が、循環配管３１の一端３１ａと他端３１ｂの設置箇所により設定される。 Thereby, the flow direction of the first refrigerant R1 in the casing 11 is set by the installation location of the one end 31a and the other end 31b of the circulation pipe 31.
（７）第７の態様の液浸冷却装置２１０は、第５の態様の液浸冷却装置２１０であって、前記噴流供給部２３０は、前記ケーシング１１内で前記発熱体３に対向する位置に配置され、回転軸２３５が前記発熱体３に向けて延びるプロペラ２３４であってもよい。 (7) The liquid immersion cooling device 210 of the seventh aspect is the liquid immersion cooling device 210 of the fifth aspect, in which the jet flow supply section 230 is located at a position facing the heating element 3 within the casing 11. The propeller 234 may be arranged such that the rotating shaft 235 extends toward the heating element 3.
　これにより、噴流供給部２３０の全体が、ケーシング１１内に配置される。 As a result, the entire jet flow supply section 230 is placed within the casing 11.
（８）第８の態様の液浸冷却装置１０、２１０は、第５から第７の態様のいずれか１つの液浸冷却装置１０、２１０であって、前記ケーシング１１内で、前記伝熱管５０は、前記発熱体３よりも前記第一冷媒Ｒ１の流通方向の下流側に配置されてもよい。 (8) The immersion cooling device 10, 210 of the eighth aspect is the immersion cooling device 10, 210 of any one of the fifth to seventh aspects, in which the heat transfer tube 50 may be arranged downstream of the heating element 3 in the flow direction of the first refrigerant R1.
　これにより、伝熱管５０内を流通する第二冷媒Ｒ２は、発熱体３を冷却した後の第一冷媒Ｒ１と熱交換を行うことができる。 Thereby, the second refrigerant R2 flowing in the heat transfer tube 50 can exchange heat with the first refrigerant R1 after cooling the heating element 3.
（９）第９の態様の液浸冷却装置１０、２１０は、第５から第８のいずれか１つの液浸冷却装置１０、２１０であって、前記伝熱管５０の内周面には、フィン５１が設けられていてもよい。 (9) The immersion cooling device 10, 210 of the ninth aspect is any one of the fifth to eighth immersion cooling devices 10, 210, and the inner peripheral surface of the heat transfer tube 50 has fins. 51 may be provided.
　これにより、第二冷媒Ｒ２と接触する伝熱管５０の内周面の表面積が増加する。 As a result, the surface area of the inner peripheral surface of the heat transfer tube 50 that comes into contact with the second refrigerant R2 increases.
　本開示の液浸冷却装置によれば、小型化を実現しつつ、冷媒の管理性を向上させることができる。 According to the liquid immersion cooling device of the present disclosure, it is possible to achieve miniaturization while improving refrigerant manageability.
１…サーバ　２…基板　３…発熱体　４…基部　５…凹部　６…発熱体本体　７…熱交換器　８…ラック　１０…液浸冷却装置　１１…ケーシング　１５…補助プロペラ　２０…ヒートシンク機構　２１…第一伝熱板　２２…グリース　２３…第二伝熱板　２４…ヒートシンクフィン　３０…噴流供給部　３１…循環配管　３１ａ…一端　３１ｂ…他端　３２…ポンプ　３３…フィルタ　４０…ヘッダ管　４１…供給ヘッダ管　４２…戻りヘッダ管　４３…母管　４４…サブヘッダ　４４ａ…端部　５０…伝熱管　５１…フィン　２１０…液浸冷却装置　２３０…噴流供給部　２３４…プロペラ　２３５…回転軸　２６０…ガイド　２６１…傾斜ガイド　２６２…水平ガイド　３１０…液浸冷却装置　３１１…ケーシング群　３１２…ケーシング　３１２ａ…側壁　３１３…下側第二ヘッダ　３１４…上側第二ヘッダ　３１５…第一接続管　３１６…第二接続管　３１７…第三接続管　３１８…第四接続管　３２０…供給側ヘッダ　３２１…供給側ヘッダ本体　３２２…供給側分岐管　３３０…排出側ヘッダ　３３１…排出側ヘッダ本体　３３２…排出側分岐管　３４０…冷媒圧送部　３５０…伝熱管　３６０…冷媒供給部　３６１…供給側マニホールド　３６２…ノズル　３７０…冷媒排出部　３７１…排出側マニホールド　３７２…導入孔　Ｒ１…第一冷媒　Ｒ２…第二冷媒　Ｄａ…対向方向　Ｄｗ…幅方向 1... Server 2... Board 3... Heating element 4... Base 5... Recess 6... Heating element body 7... Heat exchanger 8... Rack 10... Liquid immersion cooling device 11... Casing 15... Auxiliary propeller 20... Heat sink mechanism 21... First Heat transfer plate 22...Grease 23...Second heat transfer plate 24...Heat sink fin 30...Jet flow supply section 31...Circulation piping 31a...One end 31b...Other end 32...Pump 33...Filter 40...Header pipe 41...Supply header pipe 42... Return header pipe 43...Main tube 44...Sub header 44a...End 50...Heat transfer tube 51...Fin 210...Immersion cooling device 230...Jet flow supply section 234...Propeller 235...Rotating shaft 260...Guide 261...Inclination guide 262...Horizontal guide 310...Liquid immersion cooling device 311...Casing group 312...Casing 312a...Side wall 313...Lower second header 314...Upper second header 315...First connecting pipe 316...Second connecting pipe 317...Third connecting pipe 318...No. Four connecting pipes 320... Supply side header 321... Supply side header body 322... Supply side branch pipe 330... Discharge side header 331... Discharge side header body 332... Discharge side branch pipe 340... Refrigerant pressure feeding section 350... Heat transfer tube 360... Refrigerant supply Part 361...Supply side manifold 362...Nozzle 370...Refrigerant discharge part 371...Discharge side manifold 372...Introduction hole R1...First refrigerant R2...Second refrigerant Da...Opposing direction Dw...Width direction

Claims (9)

  1. 　基板に設けられた発熱体を冷却する液浸冷却装置であって、
    　水平方向に延びる箱型をなして、内部に前記基板が水平方向に延びるように配置された複数のケーシングを有し、これらケーシングが上下方向に配列されてなるケーシング群と、
    　前記ケーシングに隣接するように上下方向に延びて、前記複数のケーシング内にそれぞれ第一冷媒を導入可能な供給側ヘッダと、
    　前記ケーシングに隣接するように上下方向に延びて、前記複数のケーシングのそれぞれから前記第一冷媒が導入される排出側ヘッダと、
    　前記排出側ヘッダから前記供給側ヘッダに前記第一冷媒を圧送する冷媒圧送部と、
    　前記排出側ヘッダ及び前記供給側ヘッダの少なくとも一方の内側で延びて、内部を流通する第二冷媒と前記第一冷媒とを熱交換させて前記第一冷媒を冷却する伝熱管と、
    を備える液浸冷却装置。     A liquid immersion cooling device that cools a heating element provided on a substrate,
    A casing group having a box shape extending in the horizontal direction and having a plurality of casings inside which the substrates are arranged so as to extend in the horizontal direction, and these casings are arranged in the vertical direction;
    a supply header that extends vertically adjacent to the casing and is capable of introducing a first refrigerant into each of the plurality of casings;
    a discharge side header that extends vertically adjacent to the casing and into which the first refrigerant is introduced from each of the plurality of casings;
    a refrigerant pressure-feeding unit that pumps the first refrigerant from the discharge-side header to the supply-side header;
    a heat transfer tube that extends inside at least one of the discharge side header and the supply side header and cools the first refrigerant by exchanging heat between a second refrigerant flowing therein and the first refrigerant;
    A liquid immersion cooling device.
  2. 　前記伝熱管は、上下方向に延びている請求項１に記載の液浸冷却装置。 The immersion cooling device according to claim 1, wherein the heat transfer tube extends in the vertical direction.
  3. 　前記冷媒圧送部は、前記排出側ヘッダの下部から前記供給側ヘッダに前記第一冷媒を圧送し、
    　前記伝熱管は、前記排出側ヘッダの内側で延びるように設けられ、下方から上方に向かって前記第二冷媒が流通する請求項２に記載の液浸冷却装置。     The refrigerant pressure-feeding section pressure-feeds the first refrigerant from the lower part of the discharge side header to the supply side header,
    The immersion cooling device according to claim 2, wherein the heat transfer tube is provided so as to extend inside the discharge side header, and the second refrigerant flows from the bottom to the top.
  4. 　前記供給側ヘッダは、前記ケーシング群の水平方向一方側に設けられ、
    　前記排出側ヘッダは、前記ケーシング群の水平方向他方側に設けられ、
    　各前記ケーシング内に設けられた冷媒供給部をさらに備え、
    　前記冷媒供給部は、
    　前記供給側ヘッダから供給される前記第一冷媒を前記供給側ヘッダと前記排出側ヘッダとの対向方向に直交する水平方向である幅方向に導く供給側マニホールドと、
    　前記供給側マニホールドに前記幅方向に複数が並設されるように設けられて、前記供給側マニホールド内の前記第一冷媒を前記排出側ヘッダ側に噴出可能なノズルと、
    を有する請求項１から３のいずれか一項に記載の液浸冷却装置。     The supply header is provided on one horizontal side of the casing group,
    The discharge side header is provided on the other horizontal side of the casing group,
    further comprising a refrigerant supply section provided in each of the casings,
    The refrigerant supply section includes:
    a supply side manifold that guides the first refrigerant supplied from the supply side header in a width direction that is a horizontal direction orthogonal to a direction in which the supply side header and the discharge side header face each other;
    A plurality of nozzles are provided in the supply side manifold so as to be arranged in parallel in the width direction, and are capable of jetting the first refrigerant in the supply side manifold toward the discharge side header side;
    The liquid immersion cooling device according to any one of claims 1 to 3.
  5. 　基板に設けられた発熱体を冷却する液浸冷却装置であって、
    　第一冷媒が貯留され、内部に前記基板が水平方向に延びるように配置されたケーシングと、
    　前記発熱体に前記第一冷媒の噴流を供給する噴流供給部と、
    　前記ケーシングを貫通し、内部を流通する第二冷媒と前記第一冷媒とで熱交換を行い前記第一冷媒を冷却する伝熱管と、
    　を備える液浸冷却装置。     A liquid immersion cooling device that cools a heating element provided on a substrate,
    a casing in which a first refrigerant is stored and in which the substrate is arranged so as to extend horizontally;
    a jet flow supply unit that supplies a jet flow of the first refrigerant to the heating element;
    a heat transfer tube that penetrates the casing and cools the first refrigerant by exchanging heat between the second refrigerant and the first refrigerant flowing inside;
    A liquid immersion cooling device.
  6. 　前記噴流供給部は、
    　前記ケーシングの外部に設けられるとともに両端が前記ケーシング内と連通し、前記第一冷媒が流通可能な循環配管と、
    　前記循環配管に設けられ、前記循環配管の一端から他端に向けて前記第一冷媒を流通させるポンプと、
    　を有し、
    　前記循環配管の他端は、前記発熱体と対向する位置に配置されている、請求項５に記載の液浸冷却装置。     The jet supply section includes:
    a circulation pipe that is provided outside the casing and communicates with the inside of the casing at both ends, through which the first refrigerant can flow;
    a pump provided in the circulation piping and circulating the first refrigerant from one end of the circulation piping to the other end;
    has
    The liquid immersion cooling device according to claim 5, wherein the other end of the circulation pipe is disposed at a position facing the heating element.
  7. 　前記噴流供給部は、前記ケーシング内で前記発熱体に対向する位置に配置され、回転軸が前記発熱体に向けて延びるプロペラである、
    　請求項５に記載の液浸冷却装置。     The jet flow supply unit is a propeller that is disposed within the casing at a position facing the heating element, and has a rotating shaft extending toward the heating element.
    The liquid immersion cooling device according to claim 5.
  8. 　前記ケーシング内で、
    　前記伝熱管は、前記発熱体よりも前記第一冷媒の流通方向の下流側に配置される、
    　請求項５から７のいずれか一項に記載の液浸冷却装置。     Within the casing,
    The heat exchanger tube is arranged downstream of the heating element in the flow direction of the first refrigerant.
    A liquid immersion cooling device according to any one of claims 5 to 7.
  9. 　前記伝熱管の内周面には、フィンが設けられている、
    　請求項５から７のいずれか一項に記載の液浸冷却装置。     Fins are provided on the inner peripheral surface of the heat exchanger tube,
    A liquid immersion cooling device according to any one of claims 5 to 7.
PCT/JP2023/004297 2022-07-22 2023-02-09 Immersion-cooling device WO2024018663A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018018857A (en) * 2016-07-25 2018-02-01 富士通株式会社 Immersion cooler, immersion cooling system, and control method of immersion cooler
JP2020532875A (en) * 2017-09-06 2020-11-12 アイスオトープ・グループ・リミテッドＩｃｅｏｔｏｐｅ Ｇｒｏｕｐ Ｌｉｍｉｔｅｄ Heat sink for immersion cooling, heat sink device and module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018018857A (en) * 2016-07-25 2018-02-01 富士通株式会社 Immersion cooler, immersion cooling system, and control method of immersion cooler
JP2020532875A (en) * 2017-09-06 2020-11-12 アイスオトープ・グループ・リミテッドＩｃｅｏｔｏｐｅ Ｇｒｏｕｐ Ｌｉｍｉｔｅｄ Heat sink for immersion cooling, heat sink device and module

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