WO2024016568A1 - 探针和集成电路测试设备 - Google Patents

探针和集成电路测试设备 Download PDF

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Publication number
WO2024016568A1
WO2024016568A1 PCT/CN2022/138037 CN2022138037W WO2024016568A1 WO 2024016568 A1 WO2024016568 A1 WO 2024016568A1 CN 2022138037 W CN2022138037 W CN 2022138037W WO 2024016568 A1 WO2024016568 A1 WO 2024016568A1
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WO
WIPO (PCT)
Prior art keywords
contact
probe
section
connecting section
limiting
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PCT/CN2022/138037
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English (en)
French (fr)
Inventor
陶杉
段超毅
蒋伟
周闯
Original Assignee
深圳凯智通微电子技术有限公司
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Publication of WO2024016568A1 publication Critical patent/WO2024016568A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Definitions

  • the present application relates to the technical field of testing equipment, and in particular to a probe and integrated circuit testing equipment.
  • test probes When testing the electrical performance of integrated circuits, conductors such as test probes or conductive glue are generally used. Test probes are used in test sockets or test contacts to provide electrical interconnection between a test circuit board and a device under test (DUT), such as an electronic package.
  • DUT device under test
  • the probe in the prior art is composed of a needle, a needle tube and a spring assembly, so that the needle is in compressed contact with the spring and the needle tube.
  • There will be a certain amount of friction during compression which will have a certain impact on the life of the probe and cause the current to pass through during testing.
  • the path is long, and multiple components are in contact with each other, making the contact resistance larger, affecting the actual testing effect of the integrated circuit, thus not meeting the existing needs.
  • the main purpose of this application is to provide a probe that is designed to reduce the impedance of the probe during testing and improve the testing effect of the probe.
  • the probes proposed in this application include:
  • Both of the two first contact segments can Elastic deformation occurs in the horizontal direction;
  • a first connecting section is connected to the lower ends of the two first contact sections
  • the second connecting section includes a plurality of straight sections and a plurality of bent sections.
  • the plurality of straight sections and the plurality of bent sections are connected end to end, and the plurality of straight sections are all facing the first connecting section. Extending in the length direction, the bent section at the first end of the second connecting section is connected to the first connecting section; and
  • the second contact section is connected to the straight section at the end of the second connection section, and is used to contact the test PCB;
  • the second connecting sections are all elastically arranged, so that the probe has elasticity and comes into contact with the test PCB.
  • a reinforcing protrusion is provided on each of the two first contact segments, and the two reinforcing protrusions are respectively provided on the sides of the two first contact segments facing each other.
  • the test IC includes a solder ball, and the solder ball squeezes the two contact surfaces, so that the two first contact segments are deformed in a horizontal direction.
  • each of the two first contact segments is provided with a positioning piece, and the contact surface is provided on the positioning piece.
  • the two positioning pieces can be close to and away from each other for clamping and loosening. Open the solder ball.
  • the sides of the two contact surfaces facing each other are arranged in an outwardly convex arc.
  • the second contact segment in the test state, is in contact with the adjacent straight segment.
  • the probe further includes a first limiting part, a support plate is provided between the test IC and the test PCB, and a second limiting part is provided on the supporting plate. The probe is limited to the second limiting part through the first limiting part.
  • the first limiting part is a limiting protrusion
  • the second limiting part is a limiting groove
  • the limiting protrusion is inserted into the limiting groove
  • This application also proposes an integrated circuit testing equipment, including the probe as mentioned above.
  • the technical solution of this application is to provide an elastic second connecting section, and to connect the straight section and the bent section end to end, so that when the probe is in the testing state, the two adjacent straight sections are in contact, thereby shortening the length of the probe.
  • the path that the current needs to pass through is reduced, thereby reducing the impedance of the probe during the test process, thereby improving the test effect of the probe.
  • Figure 1 is a schematic structural diagram of an embodiment of the probe of the present application.
  • Figure 2 is a schematic structural diagram of an embodiment of the probe of the present application after assembly
  • Figure 3 is a schematic structural diagram of another embodiment of the probe of the present application.
  • Figure 4 is a schematic structural diagram of another embodiment of the probe of the present application after assembly.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited.
  • fixing can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited.
  • this application proposes a probe 20, including:
  • Two first contact segments 21 are arranged at intervals.
  • the upper ends of the two first contact segments 21 are each provided with a contact surface 212 for contacting the test IC 10.
  • the two first contact segments 21 are arranged at intervals.
  • the contact segments 21 can all undergo elastic deformation in the horizontal direction;
  • the first connecting section 22 is connected to the lower ends of the two first contact sections 21;
  • the second connecting section 23 includes a plurality of straight sections 231 and a plurality of bent sections 232 .
  • the plurality of straight sections 231 and the plurality of bent sections 232 are connected end to end in sequence.
  • the plurality of straight sections 231 Both extend in the length direction of the first connecting section 22, and the bent section 232 at the first end of the second connecting section 23 is connected to the first connecting section 22; and
  • the second contact section 24 is connected to the straight section 231 at the end of the second connection section 23 for contact with the test PCB 30;
  • the second connecting sections 23 are all elastically arranged so that the probe 20 has an initial state and a test state.
  • the initial state any two adjacent straight sections 231 are arranged at intervals.
  • the test state any two adjacent straight sections 231 are arranged at intervals. In this state, any two adjacent straight sections 231 are in contact.
  • the technical solution of the present application provides an elastic second connecting section 23 and connects the straight section 231 and the bent section 232 end to end, so that when the probe 20 is in the testing state, there is no gap between the two adjacent straight sections 231 The contact shortens the path that the current needs to pass, thereby reducing the impedance of the probe 20 during the test process, thereby improving the test effect of the probe 20 .
  • each of the two first contact segments 21 is provided with a reinforcing protrusion 213, and the two reinforcing protrusions 213 are respectively provided on the sides of the two first contact segments 21 facing each other;
  • the probe 20 is used in integrated circuit testing equipment and is disposed between the test IC 10 and the test PCB 30.
  • the first contact section 21 , the first connection section 22 , the second connection section 23 and the second contact section 24 are integrally arranged; through the integrated arrangement, compared with other general fixed connection methods, the integrated There is no contact resistance produced by other fixed connection methods, thereby reducing the impedance of the probe 20.
  • the cost of the integrated molding is tighter and lower than other fixing methods.
  • the test IC 10 includes a solder ball 11, and the solder ball 11 squeezes the two contact surfaces 212, so that the two contact surfaces 212 are deformed in the horizontal direction; in the test state, the solder ball 11 The ball 11 is squeezed between the two contact surfaces 212, and then moves the two contact surfaces 212 in the horizontal direction away from each other; by providing the elastic contact surface 212, the probe 20 can be used to adapt to solder balls of different sizes. 11. Improve the practicality of the probe 20.
  • the arrangement of the contact surface 212 can increase the size of the first contact section 21 of the probe 20 and the solder ball 11.
  • the contact area in one embodiment, the contact surface 212 in this embodiment can be arranged in a plane or in an arc shape.
  • first contact section 21 is deformed in the horizontal direction
  • second connecting section 23 is deformed in the vertical direction, so that the probe 20 is in a squeezed state during the test state, so that the test IC 10 and
  • the connection between the test PCB 30 and the probe 20 is tighter, and at the same time, the probe 20 can be applied to integrated circuits of different sizes, thereby improving the practicality of the probe 20 .
  • each of the two first contact segments 21 is provided with a positioning member 211, and the contact surface 212 is provided on the positioning member 211.
  • the two positioning members 211 can be close to and away from each other. To clamp and loosen the solder balls 11.
  • the sides of the two contact surfaces 212 facing each other are arranged in an outwardly protruding arc; the outwardly protruding arcuate arrangement enhances the structural strength of the two positioning members 211 and increases the The toughness of the positioning member 211 and the arc-shaped arrangement increase the contact area between the cross-section and the solder ball 11, thereby improving the testing effect of the integrated circuit testing equipment.
  • the second contact segment 24 is in a convex shape and extends in the direction of the second connecting segment 23 away from the first contact segment 21; since the second contact segment 24 is provided on the second connecting segment, At the end of the section 23, the second connecting section 23 will produce a certain vertical deformation during the test state, and the second connecting section 23 is arranged in an S shape, so the second contact section 24 is provided on the second connecting section 23 on the center line in the vertical direction, so that the distance between the second contact section 24 and the test PCB 30 when compressed is closer than the distance between the second connection section 23 and the test PCB 30, preventing the second connection section from 23 is in direct contact with the test PCB 30, while the second contact segment 24 is suspended.
  • the probe 20 in order to reduce the shaking of the probe 20 during testing and extrusion, the probe 20 further includes a first limiting portion 25 , and is provided between the test IC 10 and the test PCB 30 . There is a support plate 40, and a second limiting part is provided on the supporting plate 40. The probe 20 is limited to the second limiting part through the first limiting part 25.
  • the probe 20 The needle 20 is firmly fixed between the test IC 10 and the test PCB 30 through the cooperation of the first limit part 25 and the second limit part, thereby reducing the shaking of the probe 20, increasing the fixing effect of the probe 20, and improving Test efficiency and accuracy of probe 20.
  • the first limiting part 25 is a limiting protrusion
  • the second limiting part is a limiting groove
  • the limiting protrusion is stuck into the limiting groove
  • the limiting protrusion and the limiting groove are
  • the size of the position grooves is consistent, so that when the probe 20 is in the test state, the limit protrusion of the probe 20 is just limited to the limit groove, thereby reducing the shaking of the probe 20, and the limit protrusion and the limit groove are
  • the structure is simple and easy to manufacture; of course, in other embodiments, the first limiting part 25 and the second limiting part can also be configured as a snap-in structure for snap-connection.
  • two limiting protrusions and two limiting grooves are provided, and the two limiting protrusions are respectively They are located at both ends of the first connecting section 22 and extend in a direction close to the contact surface 212 .
  • This application also proposes an integrated circuit testing equipment, which includes the probe 20 mentioned above.
  • the specific structure of the probe 20 refers to the above-mentioned embodiments. Since this integrated circuit test equipment adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, and will not be discussed here. Let’s go over them one by one.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

一种探针和集成电路测试设备，探针包括两个第一接触段、第一连接段、第二连接段以及第二接触段；两个第一接触段间隔设置，两个第一接触段的上端各设有一用于与测试IC接触的接触面，两个第一接触段均可在水平方向上发生弹性形变，第二连接段包括多个平直段和多个折弯段，多个平直段和多个折弯段依次首尾相连，多个平直段均朝第一连接段的长度方向延伸，第二连接段首端的折弯段与第一连接段连接，第二连接段均为弹性设置。

Description

探针和集成电路测试设备
相关申请
本申请要求于2022年7月22日提交的申请号为202221929758.X、名称为“探针及集成电路测试设备”的中国专利申请的优先权，其全部内容通过引用结合在申请中。
技术领域
本申请涉及测试设备技术领域，特别涉及一种探针和集成电路测试设备。
 背景技术
对集成电路电性能进行测试时，一般都要用到导电体例如测试探针或导电胶。测试探针被用于测试插座或测试接触器中，以在测试电路板和被测器件(DUT)(诸如电子封装)之间提供电互连。
而现有技术中的探针由针头、针管以及弹簧组件，使得针头与弹簧及针管压缩接触，压缩时会有一定的摩擦，使探针的寿命有一定的影响，且导致测试时电流需要通过的路径较长，多个部件相互接触导通构成，使其接触阻抗较大，影响集成电路的实际测试效果，从而不满足现有的需求。
 技术解决方案
本申请的主要目的是提供一种探针，旨在降低探针在测试时的阻抗，提高探针的测试效果。
为实现上述目的，本申请提出的探针，包括：
两个第一接触段，两个所述第一接触段间隔设置，两所述第一接触段的上端各设有一用于与测试IC接触的接触面，两个所述第一接触段均可在水平方向上发生弹性形变；
第一连接段，连接于两个所述第一接触段的下端；
第二连接段，包括多个平直段和多个折弯段，多个所述平直段和多个所述折弯段依次首尾相连，多个所述平直段均朝所述第一连接段的长度方向延伸，所述第二连接段首端的折弯段与所述第一连接段连接；以及
第二接触段，所述第二接触段与所述第二连接段末端的平直段连接，用于与测试PCB接触；
其中，所述第二连接段均为弹性设置，以使所述探针具有弹性和测试PCB相接触接触。
在一实施例中，两个所述第一接触段上各设有一加强凸起，两个所述加强凸起分别设于两个所述第一接触段相互朝向的一侧。
在一实施例中，所述测试IC包括锡球，所述锡球挤压两所述接触面，以使两所述第一接触段在水平方向上产生形变。
在一实施例中，两个所述第一接触段上各设有一定位件，所述接触面设于所述定位件上，两个所述定位件可相互靠近和远离，以夹紧和松开所述锡球。
在一实施例中，两个所述接触面相互朝向的一侧均为向外凸起的弧形设置。
在一实施例中，于所述测试状态，所述第二接触段与相邻的平直段抵接。
在一实施例中，所述探针还包括第一限位部，所述测试IC和所述测试PCB之间各设有一支撑板，所述支撑板上设有第二限位部，所述探针通过所述第一限位部限位于所述第二限位部。
在一实施例中，所述第一限位部是限位凸起，所述第二限位部是限位槽，所述限位凸起卡入所述限位槽内。
在一实施例中，所述限位凸起和所述限位槽均设有两个，两个所述限位凸起分别位于所述第一连接段的两端，并朝靠近所述接触面的方向延伸。
本申请还提出一种集成电路测试设备，包括如上所述的探针。
本申请技术方案通过设置弹性的第二连接段，通过将平直段和折弯段首尾相连设置，从而使探针在测试状态时，相邻的两个平直段之间抵接，进而缩短了电流需要通过的路径，进而降低了探针在测试过程中的阻抗，进而提高了探针的测试效果。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请探针一实施例的结构示意图；
图2为本申请探针一实施例装配后的结构示意图；
图3为本申请探针另一实施例的结构示意图；
图4为本申请探针另一实施例装配后的结构示意图。
附图标号说明：
标号 名称 标号 名称
10 测试IC 23 第二连接段
11 锡球 231 平直段
20 探针 232 折弯段
21 第一接触段 24 第二接触段
211 定位件 25 第一限位部
212 接触面 30 测试PCB
213 加强凸起 40 支撑板
22 第一连接段    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本申请中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
另外，在本申请中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中的“和/或”包括三个方案，以A和/或B为例，包括A技术方案、B技术方案，以及A和B同时满足的技术方案；另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
参照图1至图4，本申请提出一种探针20，包括：
两个第一接触段21，两个所述第一接触段21间隔设置，两所述第一接触段21的上端各设有一用于与测试IC10接触的接触面212，两个所述第一接触段21均可在水平方向上发生弹性形变；
第一连接段22，连接于两个所述第一接触段21的下端；
第二连接段23，包括多个平直段231和多个折弯段232，多个所述平直段231和多个所述折弯段232依次首尾相连，多个所述平直段231均朝所述第一连接段22的长度方向延伸，所述第二连接段23首端的折弯段232与所述第一连接段22连接；以及
第二接触段24，所述第二接触段24与所述第二连接段23末端的平直段231连接，用于与测试PCB30接触；
其中，所述第二连接段23均为弹性设置，以使所述探针20具有初始状态和测试状态，于所述初始状态，任意相邻的两平直段231间隔设置，于所述测试状态，任意相邻的两平直段231抵接。
本申请技术方案通过设置弹性的第二连接段23，通过将平直段231和折弯段232首尾相连设置，从而使探针20在测试状态时，相邻的两个平直段231之间抵接，进而缩短了电流需要通过的路径，进而降低了探针20在测试过程中的阻抗，进而提高了探针20的测试效果。
在一实施例中，两个所述第一接触段21上各设有一加强凸起213，两个所述加强凸起213分别设于两个所述第一接触段21相互朝向的一侧；通过设置加强凸起213从而增强了第一接触段21的强度，降低了因锡球11挤压导致第一接触段21折断的风险。
探针20应用于集成电路测试设备，且设置于测试IC10和测试PCB30之间，为了进一步降低探针20的阻抗，提高探针20各部分之间的固定效果，在本实施例中，所述第一接触段21、所述第一连接段22、所述第二连接段23以及所述第二接触段24一体化设置；通过一体化设置，相比于其它的一般固定连接方式，一体化设置没有其它固定连接方式产生的接触电阻，从而降低了探针20的阻抗，同时一体成型其成本也相较于其它的固定方式更加紧密，且成本较低。
在本实施例中，所述测试IC10包括锡球11，所述锡球11挤压两所述接触面212，以使两所述接触面212在水平方向上产生形变；于测试状态时，锡球11挤压与两接触面212之间，进而将两接触面212朝相互远离的水平方向运动；通过设置具有弹性的接触面212，从而使探针20可以用于适应不同大小尺寸的锡球11，提高探针20的实用性，同时相比于与接触面212平行设置于锡球11两侧的方案，接触面212的设置能够增大探针20的第一接触段21与锡球11的接触面积；在一实施例中，本实施例中的接触面212既可以平面设置，还可以是弧形设置。
可以理解地，通过第一接触段21在水平方向上产生形变，通过第二连接段23在竖直方向上产生形变，从而使探针20在测试状态时处于挤压状态，从而使测试IC10和测试PCB30与探针20之间的连接更加的紧密，同时，也使探针20可以适用不同大小尺寸的集成电路，提高探针20的实用性。
在一实施例中，两个所述第一接触段21上各设有一定位件211，所述接触面212设于所述定位件211上，两个所述定位件211可相互靠近和远离，以夹紧和松开所述锡球11。
在一实施例中，两个所述接触面212相互朝向的一侧均为向外凸起的弧形设置；向外凸起的弧形设置增强了两个定位件211的结构强度，增加了定位件211的韧性，同时弧形设置增加了截面面与锡球11的接触面积，提高了集成电路测试设备的测试效果。
在本实施例中，所述第二接触段24呈凸起状，且沿所述第二连接段23背离所述第一接触段21的方向延伸；由于第二接触段24设于第二连接段23的末端，第二连接段23在测试状态时会产生一定的竖直方向上的形变，且第二连接段23呈S型设置，因此将第二接触段24设于第二连接段23竖直方向的中心线上，从而使第二接触段24在被压缩时与测试PCB30之间的距离，相较于第二连接段23与测试PCB30之间的距离更近，防止第二连接段23直接与测试PCB30接触，而第二接触段24被悬空。
在一实施例中，为了降低探针20在测试和挤压过程中产生的晃动，因此，所述探针20还包括第一限位部25，所述测试IC10和所述测试PCB30之间设有支撑板40，所述支撑板40上设有第二限位部，所述探针20通过所述第一限位部25限位于所述第二限位部，当处于测试状态时，探针20通过第一限位部25和第二限位部的配合，牢牢固定于测试IC10和测试PCB30之间，从而降低了探针20的晃动，增加了探针20的固定效果，提高了探针20的测试效率和准确性。
具体地，所述第一限位部25是限位凸起，所述第二限位部是限位槽，所述限位凸起卡入所述限位槽内；限位凸起和限位槽的大小一致，从而使探针20处于测试状态时，探针20的限位凸起刚好限位于限位槽内，从而降低了探针20的晃动，且限位凸起和限位槽结构简单，便于制造；当然在其它实施例中，第一限位部25和第二限位部还可以设置为卡接结构来卡扣连接。
在一实施例中，为了进一步增加探针20的限位效果，在本实施例中，所述限位凸起和所述限位槽均设有两个，两个所述限位凸起分别位于所述第一连接段22的两端，并朝靠近所述接触面212的方向延伸。
本申请还提出一种集成电路测试设备，所述集成电路测试设备包括上文所述的探针20。该探针20的具体结构参照上述实施例，由于本集成电路测试设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (9)

  1. 一种探针，包括：
    两个第一接触段，两个所述第一接触段间隔设置，两所述第一接触段的上端各设有一用于与测试IC接触的接触面，两个所述第一接触段均可在水平方向上发生弹性形变；
    第一连接段，连接于两个所述第一接触段的下端；
    第二连接段，包括多个平直段和多个折弯段，多个所述平直段和多个所述折弯段依次首尾相连，多个所述平直段均朝所述第一连接段的长度方向延伸，所述第二连接段首端的折弯段与所述第一连接段连接；以及
    第二接触段，所述第二接触段与所述第二连接段末端的段连接，用于与测试PCB接触；
  2. 如权利要求1所述的探针，其中，两个所述第一接触段上各设有一加强凸起，两个所述加强凸起分别设于两个所述第一接触段相互朝向的一侧。
  3. 如权利要求1所述的探针，其中，所述测试IC包括锡球，所述锡球挤压两所述接触面，以使两所述第一接触段在水平方向上产生形变。
  4. 如权利要求3所述的探针，其中，两个所述第一接触段上各设有一定位件，所述接触面设于所述定位件上，两个所述定位件可相互靠近和远离，以夹紧和松开所述锡球。
  5. 如权利要求4所述的探针，其中，两个所述接触面相互朝向的一侧均为向外凸起的弧形设置或者喇叭口状，以便锡球导向落入接触位置。
  6. 如权利要求1所述的探针，其中，所述探针还包括第一限位部，所述测试IC和所述测试PCB之间设有支撑板，所述支撑板上设有第二限位部，所述探针通过所述第一限位部限位于所述第二限位部。
  7. 如权利要求6所述的探针，其中，所述第一限位部是限位凸起，所述第二限位部是限位槽，所述限位凸起卡入所述限位槽内。
  8. 如权利要求7所述的探针，其中，所述限位凸起和所述限位槽均设有两个，两个所述限位凸起分别位于所述第一连接段的两端，并朝靠近所述接触面的方向延伸。
  9. 一种集成电路测试设备，其中，所述集成电路测试设备包括如权利要求1至8中任意一项所述的探针。
PCT/CN2022/138037 2022-07-22 2022-12-09 探针和集成电路测试设备 WO2024016568A1 (zh)

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