WO2024009506A1 - Substrate working apparatus - Google Patents
Substrate working apparatus Download PDFInfo
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- WO2024009506A1 WO2024009506A1 PCT/JP2022/027126 JP2022027126W WO2024009506A1 WO 2024009506 A1 WO2024009506 A1 WO 2024009506A1 JP 2022027126 W JP2022027126 W JP 2022027126W WO 2024009506 A1 WO2024009506 A1 WO 2024009506A1
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- substrate
- measurement
- board
- height
- points
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- 239000000758 substrate Substances 0.000 title claims abstract description 317
- 238000005259 measurement Methods 0.000 claims abstract description 282
- 238000000034 method Methods 0.000 claims abstract description 90
- 238000001514 detection method Methods 0.000 description 29
- 230000005856 abnormality Effects 0.000 description 25
- 238000002360 preparation method Methods 0.000 description 22
- 238000003860 storage Methods 0.000 description 19
- 238000012545 processing Methods 0.000 description 18
- 230000032258 transport Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 238000011084 recovery Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229930091051 Arenine Natural products 0.000 description 1
- 240000006829 Ficus sundaica Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Definitions
- Patent Document 1 there is a method based on the height of the first board B(1) measured by an upstream component mounting device and the height of the first board B(1) measured by a downstream component mounting device. It is described that difference data due to individual differences between an upstream component mounting apparatus and a downstream component mounting apparatus is calculated.
- the downstream component mounting equipment does not measure the height of the second board B (2), but uses the height of the second board B (2) measured by the upstream component mounting equipment and the difference data. It is described that the height of the second board B(2) in the downstream component mounting apparatus is predicted based on , . It is stated that this allows the component P to be efficiently mounted while ensuring the mounting quality even if the board B is warped, while omitting the height measurement in the downstream component mounting device.
- Patent Document 1 describes that height measurement for the same board in a downstream component mounting device is omitted; There is no mention of measurements.
- the present disclosure has been made to solve the above-mentioned problems, and its main purpose is to efficiently measure the height of a substrate when the same substrate is held again.
- the present disclosure has taken the following measures to achieve the above-mentioned main objective.
- the board-to-board working device of the present disclosure includes: a working unit that performs board-to-board work on the board; a substrate holding part that holds the substrate; a height measurement unit that measures the substrate height of the substrate; performing a substrate height measurement process that controls the height measurement unit to measure the substrate height at a plurality of predetermined measurement points on the substrate held by the substrate holding unit; When the substrate holder re-holds the substrate on which the measurement has been performed, the height measurement section is controlled to measure the substrate height at a representative point that is a part of the plurality of predetermined measurement points.
- a control unit that omits the measurement of the substrate height at measurement points other than the representative point among the measurement points; It is equipped with the following.
- the board height is measured at a representative point that is part of a plurality of predetermined measurement points. Perform representative point measurement processing. If the difference between the measurement result of the representative point in the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within the allowable range, then the measurement results other than the representative point among the plurality of predetermined measurement points are The measurement of the substrate height at the measurement point is omitted.
- FIG. 1 is an explanatory diagram schematically showing the configuration of a mounting system 1 including a component mounter 10.
- FIG. FIG. 2 is a schematic perspective view showing the inside of a casing 12 of the component mounting machine 10.
- FIG. 3 is a schematic configuration diagram of a substrate transport device 20 and a substrate holding device 30.
- FIG. 3 is an explanatory diagram showing how the substrate holding device 30 holds the substrate S.
- FIG. 7 is an explanatory diagram showing the electrical connection relationship of the control device 70.
- 5 is a flowchart showing an example of a mounting preparation routine.
- An explanatory diagram showing an example of substrate height measurement points A1 to A9. 7 is a flowchart illustrating an example of a modified implementation preparation routine.
- FIG. 1 is a block diagram schematically showing the configuration of a mounting system 1 including a component mounter 10 of this embodiment
- FIG. 2 is a schematic perspective view showing the inside of a casing 12 of the component mounter 10
- FIG. 3 is a board transfer device.
- 20 and the substrate holding device 30 FIG. 4 is an explanatory diagram showing how the substrate holding device 30 holds the substrate S
- FIG. 5 is an explanatory diagram showing the electrical connection relationship of the control device 70.
- 4A shows a state in which the substrate holding device 30 does not hold the substrate S
- FIG. 4B shows a state in which the substrate holding device 30 holds the substrate S.
- the up-down direction (Z-axis direction), left-right direction (X-axis direction), and front-back direction (Y-axis direction) are as shown in FIGS. 1 to 4.
- the mounting system 1 includes a component mounter 10 and a management device 80 that manages the component mounter 10.
- a plurality of component mounting machines 10 for mounting components P onto a board S are arranged along the transport direction (X-axis direction) of the board S.
- the mounting system 1 may include a solder printing machine, an inspection machine, a reflow oven, etc. on the same mounting line as the component mounter 10.
- the component mounting machine 10 includes a base 11, a housing 12, a component supply device 15, a board transfer device 20, a board holding device 30, and a board detection sensor 37 (see FIG. 4), an XY robot 40, a mounting head 50, a mark camera 55, a parts camera 58, a distance sensor 60, and a control device 70 (see FIG. 5).
- the component supply device 15 is removably installed on the base 11.
- the substrate transport device 20 and the substrate holding device 30 are arranged on a support stand 14 arranged above the base 11.
- the housing 12 is a box-shaped member. As shown in FIG. 2, the housing 12 covers the component supply device 15, the substrate transfer device 20, the substrate holding device 30, the XY robot 40, the mounting head 50, and the like. As shown in FIG. 1, an opening 121a and an opening 122a are formed in the left side wall 121 and right side wall 122 of the housing 12, respectively. Furthermore, a flip-up cover member 123 that can be opened and closed is provided on the front surface of the housing 12. The cover member 123 is provided with an operation panel 38 that is a touch panel display that displays various information such as the operating status of the component mounter 10 and allows various inputs by an operator.
- the component supply device 15 is a device that supplies the component P to a component supply position, and is configured as a tape feeder in this embodiment.
- the component supply device 15 supplies the components P to the component supply position by pulling out from a reel a tape containing the components P in storage portions formed at predetermined intervals and pitch-feeding the tape.
- the substrate transport device 20 is a device that transports the substrate S from upstream to downstream (for example, from left to right).
- the substrate transport device 20 is configured as a belt conveyor device that transports the substrate S using a conveyor belt 24, as shown in FIG.
- the substrate conveyance device 20 includes a pair of side frames 22 arranged at a predetermined interval in the Y-axis direction, a conveyor belt 24 provided on each of the pair of side frames 22, and a belt that drives the conveyor belt 24 around.
- a drive device is provided.
- the substrate S is placed on the conveyor belt 24 and is conveyed in the X-axis direction by the belt driving device driving the conveyor belt 24 around.
- At least one of the pair of conveyor belts 24 is configured to be able to approach and separate from the other.
- the substrate conveyance device 20 can convey a plurality of types of substrates S having different widths in the Y-axis direction by adjusting the interval between the pair of conveyor belts in the Y-axis direction.
- the substrate holding device 30 is a device that holds the substrate S placed on the conveyor belt 24, and in this embodiment is configured as a clamp device that clamps and holds the substrate S.
- the substrate holding device 30 includes a pair of substrate holding plates 32 , a pair of clampers 34 , a support plate 35 , and a lifting device 36 .
- the pair of substrate holding plates 32 are provided at the upper ends of the pair of side frames 22, respectively.
- the pair of clampers 34 are arranged below each of the pair of substrate holding plates 32.
- a protrusion 34a that protrudes downward is provided on the lower end surface of each of the pair of clampers 34.
- the support plate 35 is a plate-like member arranged below the pair of clampers 34. The support plate 35 is raised and lowered by a lifting device 36.
- the support plate 35 When the support plate 35 rises, the upper surface of the support plate 35 comes into contact with the protrusion 34a of the clamper 34, pushing the clamper 34 up.
- the support plate 35 is provided with a plurality of (six in this embodiment) support pins 35a for supporting the lower surface of the substrate S when the substrate S is clamped.
- the lifting device 36 is disposed between the support base 14 and the support plate 35, and raises and lowers the pair of clampers 34 via the support plate 35.
- the lifting device 36 raises the pair of clampers 34 while the substrate S is placed on the conveyor belt 24 (FIG. 4A)
- the substrate S is pushed up by the pair of clampers 34 and onto the lower surface of the substrate holding plate 32.
- pressed Figure 4B
- the board detection sensor 37 is provided in the board transport path (board transport device 20) of the component mounting machine 10, as shown in FIG. 4A.
- the substrate detection sensor 37 is, for example, a transmissive optical sensor that includes a light projecting section 37a and a light receiving section 37b that are provided at opposing positions across the substrate transport path.
- the light projecting portion 37a is provided on one inner surface of the opposing side frames 22.
- the light receiving portion 37b is provided on the other inner surface of the pair of side frames 22.
- the substrate detection sensor 37 may be a reflective optical sensor.
- the substrate detection sensor 37 outputs a signal indicating that the substrate S is detected and is in a detection state to the control device 70 (see FIG. 4).
- the board detection sensor 37 outputs a signal indicating that the substrate S is not detected and is in a non-detection state to the control device 70.
- the XY robot 40 is a device that moves the mounting head 50, mark camera 55, and distance measurement sensor 60 in the XY directions. As shown in FIG. 2, the XY robot 40 includes a pair of left and right Y-axis guide rails 43 provided along the front-rear direction (Y-axis direction), and a Y-axis guide that spans the pair of left and right Y-axis guide rails 43. A Y-axis slider 44 that is movable in the Y-axis direction along a rail 43 is provided.
- the XY robot 40 also has an X-axis guide rail 41 provided along the left-right direction (X-axis direction) on the side surface of the Y-axis slider 44, and is movable in the X-axis direction along the X-axis guide rail 41.
- An X-axis slider 42 is provided.
- the X-axis slider 42 is movable by driving an X-axis motor 46 (see FIG. 5)
- the Y-axis slider 44 is movable by driving a Y-axis motor 48 (see FIG. 5).
- a mounting head 50 is attached to the X-axis slider 42, and the mounting head 50 is moved in the XY direction by drive control of the XY robot 40 (X-axis motor 46 and Y-axis motor 48) by the control device 70. do.
- the XY robot 40 includes an X-axis position sensor 47 (see FIG. 5) that detects the position of the X-axis slider 42 in the X-axis direction, and a Y-axis position sensor 49 (see FIG. 5) that detects the position of the Y-axis slider 44 in the Y-axis direction. 5).
- the mounting head 50 is a device that sucks (picks up) the component P supplied from the component supply device 15 with a suction nozzle 51 and mounts it onto the substrate S.
- the mounting head 50 is removably mounted on the X-axis slider 42 and is moved in the XY directions by the XY robot 40.
- the mounting head 50 includes a suction nozzle 51, a Z-axis motor 52, and a Z-axis position sensor 53 (see FIG. 5).
- the suction nozzle 51 is removably attached to the lower surface of the mounting head 50. Although one suction nozzle 51 is attached to the mounting head 50 in this embodiment, a plurality of suction nozzles 51 may be attachable.
- the suction nozzle 51 is a collecting member that collects the part P using negative pressure.
- the Z-axis motor 52 is a mechanism for raising and lowering the suction nozzle 51 along the Z-axis, thereby adjusting the height of the suction nozzle 51 and the component P suctioned by the suction nozzle 51.
- the Z-axis position sensor 53 detects the position of the suction nozzle 51 in the Z-axis direction.
- the mounting head 50 includes a rotation device that rotates (rotates) the suction nozzle 51 by a drive motor (not shown), and can adjust the angle of the component P held (suctioned) by the suction nozzle 51.
- the mark camera 55 is a device for capturing images of unillustrated reference marks, identification information, etc. attached to the substrate S from above.
- the mark camera 55 is disposed on the lower surface of the mounting head 50 and moves in the X and Y directions as the mounting head 50 moves.
- the parts camera 58 is arranged in front of the substrate transport device 20.
- the imaging range of the parts camera 58 is above the parts camera 58.
- the parts camera 58 images the component P that has been suctioned by the suction nozzle 51 from below.
- the distance sensor 60 is a device that measures the height of the substrate S (position in the Z-axis direction).
- the substrate height is the height of the upper surface of the substrate S.
- the distance measuring sensor 60 is disposed on the lower surface of the mounting head 50 and moves in the X and Y directions as the mounting head 50 moves.
- the distance measurement sensor 60 is configured as a laser height sensor, and as shown in the balloon part of FIG.
- the detection unit 62 includes a detection unit 62 that receives laser light. When the irradiation section 61 irradiates a laser beam diagonally downward toward the substrate S disposed below, the laser beam is reflected on the upper surface of the substrate S, and the reflected laser beam enters the detection section 62 .
- the optical path of the reflected light (indicated by an arrow) changes depending on the position of the upper surface of the substrate S, as shown by the solid line and broken line in the balloon part of FIG.
- the detection unit 62 detects the distance in the Z-axis direction between the distance measuring sensor 60 and the top surface of the substrate S based on the difference in the incident position of the laser beam due to the difference in the optical path, and calculates the substrate height based on the detected distance. Measure.
- the substrate height may be the distance in the Z-axis direction between the ranging sensor 60 and the top surface of the substrate S, or may be a value based on a predetermined height derived based on this distance.
- the control device 70 is a device that controls the entire component mounting machine 10. As shown in FIG. 5, the control device 70 includes a CPU 71, a ROM 72, a storage 73 (for example, an HDD or an SSD), a RAM 74, and an input/output interface 75. These are electrically connected via a bus 76.
- the control device 70 includes a detection signal from the board detection sensor 37, a detection signal from the cover opening/closing sensor 123a that detects opening/closing of the cover member 123, an operation signal from the operation panel 38, an X-axis position sensor 47, and a Y-axis position sensor.
- the control device 70 also sends control signals to the component supply device 15, control signals to the substrate transfer device 20 and substrate holding device 30, display signals to the operation panel 38, and control signals to the XY robot 40 (X-axis motor 46 and Y-axis motor 48), a drive signal to the mounting head 50, a drive signal to the mark camera 55 and parts camera 58, a drive signal to the distance measurement sensor 60, etc. are outputted via the input/output interface 75. Further, the control device 70 is connected to the management device 80 so as to be able to communicate bidirectionally, and exchanges data and control signals with each other.
- the management device 80 is a device that manages the entire mounting system 1. As shown in FIG. 5, the management device 80 includes a CPU 81, a ROM 82, a storage 83 (for example, an HDD or an SSD), a RAM 84, and an input/output interface 85. These are electrically connected via a bus 86. The management device 80 also includes an input device 87 such as a keyboard and a mouse, and a display 88 such as an LCD. An input signal from an input device 87 is input to this management device 80 via an input/output interface 85 . Further, the management device 80 outputs an image signal to the display 88 via the input/output interface 85.
- the management device 80 sends and receives information to and from the control device 70 of the component mounter 10 via the input/output interface 85.
- the storage 83 of the management device 80 stores a production program for the board S and the like.
- the production program for the board S includes, for each of the plurality of component mounters 10 in the mounting system 1, information on which component P the component mounter 10 will mount on which board S, in which position, in what order, and the like. It includes information such as how many boards S to be manufactured with the following mounting.
- the production program also includes information on which position of which board S the component mounting machine 10 measures the board height (position information of a plurality of predetermined measurement points on the board S), and the height of the component P. (Thickness) information is also included.
- the mounting operation routine is stored in the storage 73, and is started after the operator inputs a mounting start instruction via the input device 87 or the operation panel 38.
- the CPU 71 first executes a mounting preparation routine, which will be described later, including carrying the board S into the component mounting machine 10, clamping the board S, and measuring the height of the board S. . Subsequently, the CPU 71 executes a mounting processing routine for mounting (arranging) the component P at the planned mounting position on the board S.
- the CPU 71 first causes the suction nozzle 51 of the mounting head 50 to suction the component P supplied from the component supply device 15. Specifically, the CPU 71 controls the X-axis motor 46 and the Y-axis motor 48 to move the suction nozzle 51 directly above the component suction position of the component P to be mounted. Next, the CPU 71 controls the Z-axis motor 52 to lower the suction nozzle 51 and apply negative pressure to the suction port of the suction nozzle 51 . As a result, the component P to be mounted is attracted to the suction nozzle 51.
- the CPU 71 raises the suction nozzle 51, controls the X-axis motor 46 and the Y-axis motor 48, and moves the suction nozzle 51, which has suctioned the component P to the tip, above the planned mounting position of the board S. Then, at the predetermined position, the CPU 71 controls the Z-axis motor 52 to lower the suction nozzle 51. At this time, the CPU 71 controls the amount of descent of the suction nozzle 51 using the measurement result of the substrate height in a mounting preparation routine to be described later. Further, the CPU 71 releases the suction of the component P by applying positive pressure to the suction port of the suction nozzle 51 that has been lowered.
- the component P that had been sucked by the suction nozzle 51 is separated and mounted on the substrate S at a predetermined position.
- the other components P to be mounted on the board S are similarly mounted on the board S, and when the mounting of all the components P is completed, the CPU 71 controls the board holding device 30 to clamp the board S. is released, and the substrate transport device 20 is controlled to send the substrate S to the downstream side.
- the CPU 71 repeats the mounting preparation routine and the mounting processing routine according to the number of substrates S to be produced included in the production program.
- an abnormality may occur in the component mounter 10 or another component mounter 10 included in the mounting system 1.
- the CPU 71 determines whether the abnormality has occurred based on an abnormality detection device (not shown) of the component mounting machine 10 itself, a command from the management device 80, or an operation signal from the operator via the operation panel 38. Detect that.
- the CPU 71 interrupts the mounting operation, and if the substrate holding device 30 is clamping the substrate S, controls the substrate holding device 30 to release the clamp as necessary. Further, the CPU 71 stops the operations of the XY robot 40 and the mounting head 50.
- the operator When the operator notices the occurrence of an abnormality through, for example, the display 88 of the management device 80 or the operation panel 38, the operator performs necessary work to confirm the details of the abnormality and to resolve the abnormality in the mounting system 1.
- the operator instructs the mounting system 1 to resume the mounting operation, for example, via the input device 87 or the operation panel 38.
- the CPU 71 receives an instruction to return the worker through the management device 80 or the operation panel 38, it first executes a mounting preparation routine, and then starts or restarts the mounting processing routine.
- FIG. 6 is a flowchart showing an example of a mounting preparation routine executed by the CPU 71 of the control device 70.
- FIG. 7 is an explanatory diagram showing an example of the substrate height measurement points A1 to A9.
- the CPU 71 When the mounting preparation routine is started, the CPU 71 first determines whether or not it is time to recover from an abnormality (S100). For example, the CPU 71 makes an affirmative determination in S100 when executing the implementation preparation routine immediately after inputting an instruction to return the worker through the management device 80 or the operation panel 38 described above, and otherwise makes a negative determination. conduct.
- S100 an abnormality
- the CPU 71 controls the substrate transfer device 20 to transfer the substrate S to a predetermined work position (S120), and controls the substrate holding device 30 to clamp and hold the substrate S. (S130).
- the CPU 71 transports the substrate S until the substrate detection sensor 37 detects the substrate S, or transports the substrate S by a predetermined transport amount after the substrate detection sensor 37 detects the substrate S, for example. Transport to the specified working position.
- the CPU 71 performs a substrate height measurement process that controls the distance measurement sensor 60 to measure the substrate height at a plurality of predetermined measurement points on the substrate S held by the substrate holding device 30 (S140). .
- the plurality of measurement points are set in advance by, for example, an operator and stored in the storage 83 of the management device 80, and the CPU 71 acquires position information of the plurality of measurement points from the management device 80.
- the plurality of measurement points are expressed, for example, by XY coordinates based on the position of a reference mark (not shown) attached to the substrate S.
- the plurality of measurement points are nine measurement points A1 to A9, and as shown in FIG. They are arranged in a grid pattern with three points lined up.
- the CPU 71 measures the substrate height at all of the measurement points A1 to A9. Specifically, the CPU 71 first moves the mark camera 55 onto the substrate S to image the substrate S, and detects the position of the reference mark on the substrate S based on the obtained image. Then, the CPU 71 controls the XY robot 40 to move the distance measurement sensor 60 above the measurement point A1 based on the detected position of the reference mark, and causes the distance measurement sensor 60 to measure the substrate height of the substrate S. . The CPU 71 similarly measures the substrate height at each of the measurement points A2 to A9 using the XY robot 40 and the distance measuring sensor 60.
- the CPU 71 stores each of the measurement points A1 to A9 and the measured substrate height in association with each other in the storage 73 (S160), and ends the mounting preparation routine.
- the CPU 71 causes the mounting head 50 to mount the component P using the measurement result of the board height measurement processing in S140.
- the CPU 71 derives the shape of the top surface of the board S by an approximate calculation using a known method based on the measurement results stored in the storage 73, and places the component P on the board S based on the derived shape. Derive the mounting height when mounting. For example, if the position M in FIG.
- the CPU 71 selects three measurement points that draw the smallest triangle surrounding this position M among the measurement points A1 to A9 ( In the example, A5, A6, A9) are determined. Then, the CPU 71 determines the mounting position of the picked-up component P when the surface shape of the board S within the triangular area surrounded by the determined three points is regarded (approximated) as a plane passing through the three points. The height is derived based on the substrate height at three measurement points. Then, the CPU 71 sets (or corrects) the amount of descent of the suction nozzle 51 based on the derived substrate height, and mounts the component P by lowering the suction nozzle 51 by this amount of descent.
- the component P can be appropriately mounted on the board S.
- the CPU 71 calculates the height of the board at both the front and rear ends of the board S.
- the mounting height may be derived using Both the front and back ends of the board S are clamped by the board holding device 30, and the board height of the clamped portion is always the same value (known value), so the CPU 71 also uses this value to derive the mounting height. be able to.
- step S100 determines whether or not the substrate detection sensor 37 is detecting the substrate S (S110). If a negative determination is made in S110, the CPU 71 performs the processes from S120 onwards and ends the mounting preparation routine. That is, if the substrate detection sensor 37 does not detect the substrate S at the time of recovery from an abnormality, the CPU 71 carries in and clamps a new substrate S in the same way as when the substrate is not recovered from the error, that is, in normal times. and performs substrate height measurement processing.
- the CPU 71 controls the substrate holding device 30 to clamp and hold the substrate S (S230). Then, the CPU 71 determines whether the cover member 123 has been opened or closed between the occurrence of the abnormality and the clamping in S230 (S235). In S235, the CPU 71 makes an affirmative determination if the cover opening/closing sensor 123a detects that the cover member 123 has been opened even once between the occurrence of the abnormality and S230, and determines that the cover member 123 has never been opened. If it is not detected, a negative determination is made. If an affirmative determination is made in S235, the CPU 71 performs the processes from S140 onwards and ends the mounting preparation routine.
- the CPU 71 instructs the CPU 71 to measure the substrate height at a representative point that is a part of the plurality of measurement points A1 to A9 instead of performing the substrate height measurement process in S140.
- a representative point measurement process is performed to control the distance measurement sensor 60 (S240).
- the substrate height measurement process in S140 is performed, so the substrate S is already present at the time of recovery from the abnormality (affirmative determination in S110), and the period from the occurrence of the abnormality to S230 is If the cover opening/closing sensor 123a has never detected that the cover member 123 has been opened (negative determination in S235), the substrate S clamped in S230 has already been subjected to the substrate height measurement process in S140. It can be determined that it is the substrate S. That is, it can be determined that the clamping in S230 is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process in S140 was performed.
- the CPU 71 does not measure the substrate height at all of the plurality of measurement points A1 to A9, but first measures the substrate height at the representative point.
- the representative point may be a part of the plurality of measurement points A1 to A9, but preferably two or more points, more preferably three or more points. Further, it is preferable that the representative points include two points that are the farthest from each other among the plurality of measurement points A1 to A9. In this embodiment, the representative points are the measurement point A5 which is the closest to the center of the substrate S among the measurement points A1 to A9, and the measurement points A1 and A9 which are the farthest from each other among the measurement points A1 to A9.
- measurement points A3 and A7 among measurement points A1 to A9 are also the two points that are the farthest from each other, so measurement points A3 and A7 may be included in the representative points instead of measurement points A1 and A9. .
- the representative point measurement process can be performed in the same manner as S140, except that the substrate height is measured only at the representative point among the measurement points A1 to A9. The representative point measurement process can be performed in a short time because the number of measurement points is smaller than that in the substrate height measurement process.
- the CPU 71 determines whether the difference between the measurement result of the representative point measurement process of S240 and the measurement result of the same measurement point as the representative point in the most recent board height measurement process of S140 is within an allowable range. is determined (S245). For example, the CPU 71 makes the determination in S245 as follows. First, the measurement results of the measurement points A1, A5, and A9, which are the same as the representative points and which were measured in the most recent S140 and stored in the storage 73, are set as the substrate heights a1, a5, and a9, respectively, and these are collectively referred to as the measurement result a. do.
- the measurement results at the representative points, that is, the measurement points A1, A5, and A9 measured in S240 are defined as substrate heights b1, b5, and b9, respectively, and these are collectively defined as the measurement result b.
- the CPU 71 determines whether the difference between the substrate height a1 and the substrate height b1 (for example, the difference or ratio between them) is within a predetermined allowable range. Similarly, it is determined whether the difference between the substrate height a5 and the substrate height b5 and the difference between the substrate height a9 and the substrate height b9 are within the allowable range.
- the CPU 71 determines that the difference between the measurement result b and the measurement result a is acceptable. It is determined that it is within the range, and an affirmative determination is made in S245. If any one or more of the substrate heights b1, b5, and b9 is outside the allowable range, the CPU 71 determines that the difference between the measurement result b and the measurement result a is not within the allowable range, and makes a negative determination in S245.
- the CPU 71 measures the substrate heights of the remaining measurement points (here, measurement points A2 to A4, A6 to A8) other than the representative point among the plurality of measurement points A1 to A9 ( S250), the measurement results of S240 and S250 are stored in the storage 73 (S260), and the mounting preparation routine is ended. That is, the CPU 71 re-performs the same process as the substrate height measurement process in S140 by measuring the substrate height at all of the plurality of measurement points A1 to A9 in S240 and S250 for the substrate S clamped in S230.
- the CPU 71 In S260, if there is a measurement result stored in the most recent S160, the CPU 71 overwrites (updates) the measurement result with the measurement result in S240 and S250. Therefore, in the mounting processing routine that is executed (started or restarted) following the execution of S260, the CPU 71 causes the mounting head 50 to mount the component P using the measurement results of S240 and S250.
- the CPU 71 measures the substrate height at the remaining measurement points (here, measurement points A2 to A4, A6 to A8) other than the representative point among the plurality of measurement points A1 to A9. is omitted, and the mounting preparation routine is ended without storing the measurement result b in the storage 73 in S240.
- the CPU 71 mounts the component P on the mounting head 50 using the most recent measurement result of S160 without using the measurement result b of S240.
- the tolerance range used for the determination in S245 mentioned above is the measurement result a that does not cause any problem in mounting the component P even if the mounting height is calculated using the measurement result of the most recent S160 instead of S240.
- the allowable range of difference from result b is set in advance and stored in storage 73 or storage 83.
- the mounting head 50 of this embodiment corresponds to a working part of the present disclosure
- the substrate holding device 30 corresponds to a substrate holding part
- the distance measuring sensor 60 corresponds to a height measuring part
- the control device 70 corresponds to a control part. do.
- the control device 70 measures the substrate height at a plurality of predetermined measurement points A1 to A9 on the substrate S held by the substrate holding device 30. Then, a substrate height measurement process is performed to control the distance measurement sensor 60. Further, when the substrate holding device 30 again holds the substrate S on which the substrate height measurement process has been performed (here, when an affirmative determination is made in S110 and a negative determination is made in S235), the control device 70 controls a predetermined plurality of Representative point measurement processing is performed to control the distance sensor 60 to measure the substrate height at representative points (measurement points A1, A5, A9) that are part of the measurement points A1 to A9.
- the control device 70 performs a plurality of predetermined measurements.
- the measurement of the substrate height at measurement points other than the representative points among points A1 to A9 is omitted.
- the substrate holding device 30 re-clamps the same substrate S as the one on which the substrate height measurement process was performed, the substrate height can be measured again at all of the plurality of predetermined measurement points A1 to A9. The height of the substrate can be measured more efficiently than when the measurement is performed.
- the control device 70 uses the measurement result of the substrate height measurement process without using the measurement result of the representative point measurement process.
- the mounting head 50 is caused to mount the component P.
- the control device 70 controls the remaining measurement points A1 to A9 other than those not used in the representative point measurement process. Measure the board height at the measurement points (measurement points A2 to A4, A6 to A8), and use the measurement results of the remaining measurement points and the measurement results of the representative point measurement process to place the component P on the mounting head 50. Let implementation take place.
- the board height measurement results can be used more appropriately to attach the component to the mounting head 50. It is possible to implement P.
- the control device 70 determines that the operator holds the substrate S between the time when the substrate holding device 30 held the substrate S last time and the substrate height measurement processing was performed until the substrate holding device 30 holds the substrate S this time. If it can be considered that the access has not been made (if an affirmative determination is made in S110 and a negative determination is made in S235), it is determined that the substrate holding device 30 has re-held the substrate S on which the substrate height measurement process was performed, that is, in S230. It is determined that the clamping is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process of S140 was performed.
- the substrate detection sensor 37 and the cover opening/closing sensor 123a it can be determined whether the clamping in S230 is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process was performed. Further, for example, it is possible to estimate whether or not the operator has accessed the substrate S between the occurrence of the abnormality and the recovery from the abnormality (and until the clamping in S230) based on the substrate detection sensor 37 and the cover opening/closing sensor 123a. Note that if the operator does not access the board S even if an abnormality occurs, for example, a device other than the component mounter 10 that is executing the mounting preparation routine of FIG. 6, for example, another device included in the mounting system 1 An example of this is when an abnormality occurs in the component mounting machine 10.
- the representative points include measurement points A1 and A9, which are the two points that are the farthest from each other among the plurality of predetermined measurement points A1 to A9.
- two more representative points regarding the height of the substrate S are included in the representative points. Therefore, by determining whether or not it is within the above-mentioned allowable range based on the measurement result b of the representative point, it is possible to determine whether the difference in the state of the board S between the board height measurement process and the representative point measurement process is within the allowable range. More appropriate judgment can be made.
- the CPU 71 determines whether the substrate holding device 30 has held the substrate S last time and the substrate height measurement process has been performed. S230 re-clamps the same board S, assuming that the operator has not accessed the board S until S30 holds the board S this time. Although it was determined that the substrate holding device 30 held the substrate again, the present invention is not limited to this. For example, based on the identification information of the substrate S read by the mark camera 55 (an example of a reading unit), the control device 70 determines that S230 is re-clamping of the same substrate S (a substrate on which the substrate height measurement process has been performed).
- FIG. 8 is a flowchart illustrating an example of a modified implementation preparation routine.
- the same steps as those in FIG. 6 are given the same step numbers, and detailed explanations are omitted.
- the CPU 71 acquires identification information attached to the board S in the form of a bar code or the like ( S332).
- the CPU 71 controls the X-axis motor 46 and the Y-axis motor 48 to move the mark camera 55 above identification information (not shown) attached to the board S to image the identification information, thereby identifying the board S.
- the information is acquired and stored in the storage 73.
- S332 may be performed after S140. Further, it is preferable that the CPU 71 stores the identification information in S332 and the measurement result in S140 in association with each other in S160. Further, the CPU 71 obtains the identification information of the board S after S230 as well as in S332 (S432). After S432, the CPU 71 determines whether the identification information of the board S acquired during the previous clamping (for example, the most recent S332) and the identification information of the board S acquired this time in S432 are the same (S435). . Thereby, the CPU 71 can determine whether S230 is re-clamping of the same substrate S (the substrate holding device 30 has held the substrate S again after the substrate height measurement process).
- the CPU 71 makes a negative determination in S435, the CPU 71 performs the processes from S140 onwards, and when it makes an affirmative determination in S435, it performs the processes from S240 onwards.
- the mounting preparation routine of FIG. 8 it is determined whether or not the substrate holding device 30 has held the substrate S on which the substrate height measurement process has been performed again. Based on the identification information of the substrate S, it can be appropriately determined whether the substrate S is the same as the substrate S on which the measurement process has already been performed. Note that in S260 of FIG. 8 as well, similarly to S160, it is preferable that the identification information of S432 and the measurement results of S240 and S250 are stored in association with each other.
- the CPU 71 determines whether the identification information acquired in the most recent S332 and the identification information acquired in S432 are the same at the time of determination in S435. In addition to determining whether or not the measurement result is the same, it is also possible to check whether the measurement result corresponding to the same identification information as the identification information acquired in S432 has already been stored in the storage 73. Thereby, the CPU 71 can more reliably determine in S435 whether the substrate S clamped in S230 is the substrate S on which the substrate height measurement process in S140 has already been performed. Note that after S332 in FIG.
- the CPU 71 determines whether or not the substrate detection sensor 37 has continuously detected the substrate S from the time when the clamp of the substrate holding device 30 was released when the abnormality occurred until now. Good too. In this case, the CPU 71 may perform S230 and S240 and perform the processes from S245 onwards if the determination is positive in S110, and may perform the processes from S130 onwards in the case of a negative determination in S110.
- the substrate detection sensor 37 if the substrate detection sensor 37 has continuously detected the substrate S from the release of the clamp of the substrate holding device 30 at the time of abnormality occurrence until now, the substrate holding device 30 holds the substrate S last time. In addition, it can be assumed that the operator has not accessed the substrate S since the substrate height measurement process was performed. Therefore, by making the determination in S110 in this manner, it is possible to estimate whether or not the operator has accessed the board S using a method different from that in S235.
- the measurement result of the substrate height measurement process is used instead of the measurement result of the representative point measurement process.
- the mounting head 50 is used to mount the component P, the present invention is not limited thereto.
- the CPU 71 makes an affirmative determination in S245, the CPU 71 selects the measurement results b in S240 for the board heights at measurement points A1, A5, and A9, which are the same as the representative points, among the measurement results stored in the storage 73 in the most recent S160. You can overwrite (update) it with .
- the measurement results of the representative point measurement process and the measurement results of the board height measurement process are mixed and used. Even in this case, the CPU 71 can derive the mounting height based on the measurement results.
- the predetermined plurality of measurement points are the measurement points A1 to A9 shown in FIG. 7, but the measurement points are not limited thereto.
- the number of the plurality of measurement points may be other than nine, the plurality of measurement points may not be equally spaced, and may not be in the form of a grid.
- the representative points may include two points where the angle between the line connecting each other and the X axis (transfer direction of the substrate S) is closest to 45 degrees among the plurality of measurement points.
- the representative point may include a measurement point that has the largest difference from a predetermined reference height in the measurement results of the substrate height measurement process among the plurality of predetermined measurement points. For example, at a timing such as after S140 or before S240 of the mounting preparation routine in FIG. ⁇ A9, a measurement point where the difference between the measured substrate height and a predetermined reference height is the largest may be specified. Then, in S240, in addition to or instead of the measurement points A1, A5, and A9 in the above-described embodiment, the CPU 71 includes the measurement point having the largest difference from the specified reference height as the representative points, and performs representative point measurement. Processing may be performed.
- the predetermined reference height may be, for example, the substrate height (normal substrate height of the substrate S) when the substrate S held by the substrate holding device 30 is not deformed such as warping.
- a reference height can be calculated by, for example, providing a reference block in advance on the substrate holding device 30 in accordance with the reference height, and then having the CPU 71 measure the height of the reference block using the distance measuring sensor 60.
- the CPU 71 may calculate it based on the thickness of the substrate S included in the production program.
- the predetermined reference height may be an average value of the substrate heights at a plurality of predetermined measurement points measured in the most recent substrate height measurement process.
- the measurement point with the largest difference from this reference height is the one due to warpage of the board S, etc. It is suitable as a representative point because it best reflects the deformation state of .
- the distance measuring sensor 60 is a laser height sensor that uses laser light, but the sensor is not limited to this, and any sensor may be used as long as it can measure the substrate height.
- a contact height sensor or an ultrasonic height sensor may be used.
- the XY robot 40 moves the mounting head 50 and the distance measurement sensor 60 together, but the present invention is not limited to this.
- the component mounter 10 may separately include a head moving section that moves the mounting head 50 and a measurement moving section that moves the distance measurement sensor 60.
- the mounting head 50 suctions the component P using the suction nozzle 51 and mounts it on the substrate S, but the present invention is not limited thereto.
- the mounting head 50 may include a mechanical chuck that clamps and holds the component P instead of the suction nozzle 51.
- the substrate holding device 30 holds the substrate S by clamping it, but the present invention is not limited to this.
- the substrate holding device 30 may suck and hold the substrate S.
- the board-to-board working device of the present disclosure is applied to the component mounting machine 10, but the present invention is not limited to this.
- the board-related work device of the present disclosure may be any other type of machine, such as a solder printer that prints solder on a board, an adhesive applicator that applies adhesive to a board, or an inspection machine that inspects the results of these work on the board. It may also be applied to a board-facing work device.
- the substrate-to-board working device of the present disclosure may be configured as follows.
- the control unit when the difference is within the allowable range, the control unit performs the board height measurement process without using the measurement result of the representative point in the representative point measurement process.
- the work unit is made to perform the board-facing work using the measurement results, and if the difference is outside the allowable range, the remaining measurement points other than the representative point among the plurality of predetermined measurement points are
- the height of the substrate may be measured, and the working unit may perform the substrate-facing work using the measurement results of the remaining measurement points and the measurement results of the representative point measurement process. In this way, the board height measurement results can be used more appropriately for board work compared to the case where the measurement results of the representative point measurement process and the measurement results of the board height measurement process are used together. can be set.
- the substrate working device of the present disclosure includes a reading section that reads identification information of the substrate from the substrate, and the control section measures the substrate height based on the identification information of the substrate read by the reading section. It may be determined whether the substrate holding unit holds the processed substrate again. In this way, it is possible to check whether the substrate holder has held the substrate again after the substrate height measurement process has been performed, or in other words, whether the substrate held by the substrate holder this time is the substrate on which the substrate height measurement process has already been performed. Whether or not they are the same can be appropriately determined based on the identification information of the boards.
- control unit is configured to control the process from when the substrate holding unit held the substrate last time and the substrate height measurement processing was performed until the substrate holding unit holds the substrate this time. If it can be assumed that the operator has not accessed the substrate during that time, it may be determined that the substrate holding unit has again held the substrate on which the substrate height measurement process was performed.
- the representative points may include two points that are farthest from each other among the plurality of predetermined measurement points. In this way, two points that are more representative regarding the height of the substrate are included in the representative points. Therefore, by determining whether or not the above-mentioned tolerance is within the range based on the measurement result of the representative point, it is possible to more appropriately determine whether the difference in the state of the board between the board height measurement process and the representative point measurement process is within the tolerance range. It can be determined that
- the representative points include a measurement point having the largest difference from a predetermined reference height in the measurement result of the substrate height measurement process among the plurality of predetermined measurement points. Good too.
- the present invention can be used in various industries that perform board-to-board work such as mounting components on a board.
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Abstract
A substrate working apparatus according to the present disclosure comprises a work unit that performs substrate work with respect to a substrate, a substrate-holding unit that holds the substrate, a height-measuring unit that measures the substrate height of the substrate, and a control unit. The control unit performs a substrate-height-measuring process of controlling the height-measuring unit so as to measure the substrate height at a predetermined plurality of measuring points on the substrate that is held by the substrate-holding unit, and, when the substrate for which the substrate-height-measuring process has been performed has been held by the substrate-holding unit again, performs a representative-points-measuring process of controlling the height-measuring unit so as to measure the substrate height at representative points, which are part of the plurality of measuring points. When a difference between the measurement results of the representative-points-measuring process and the measurement results of the substrate-height-measuring process at the same measuring points as the representative points is within an acceptable range, the control unit omits measuring of the substrate height at the measuring points other than the representative points among the predetermined plurality of measuring points.
Description
本明細書では、対基板作業装置を開示する。
In this specification, a substrate-to-board working device is disclosed.
従来、部品を基板に実装する作業などの対基板作業を行う対基板作業装置において、基板の高さを測定することが知られている。例えば、特許文献1には、上流の部品実装装置で計測した1枚目の基板B(1)の高さと下流の部品実装装置で計測した1枚目の基板B(1)の高さに基づいて、上流の部品実装装置と下流の部品実装装置の個体差に起因する差分データを算出することが記載されている。また、下流の部品実装装置では、2枚目の基板B(2)の高さを計測せず、上流の部品実装装置で計測した2枚目の基板B(2)の高さと、差分データと、に基づいて下流の部品実装装置における2枚目の基板B(2)の高さを予測することが記載されている。これにより、下流の部品実装装置における高さ計測を省略しつつ、基板Bに反りがあっても実装品質を確保して効率的に部品Pを実装できると記載されている。
Conventionally, it has been known to measure the height of a board in a board-to-board work device that performs board-to-board work such as mounting components on a board. For example, in Patent Document 1, there is a method based on the height of the first board B(1) measured by an upstream component mounting device and the height of the first board B(1) measured by a downstream component mounting device. It is described that difference data due to individual differences between an upstream component mounting apparatus and a downstream component mounting apparatus is calculated. In addition, the downstream component mounting equipment does not measure the height of the second board B (2), but uses the height of the second board B (2) measured by the upstream component mounting equipment and the difference data. It is described that the height of the second board B(2) in the downstream component mounting apparatus is predicted based on , . It is stated that this allows the component P to be efficiently mounted while ensuring the mounting quality even if the board B is warped, while omitting the height measurement in the downstream component mounting device.
ところで、対基板作業装置が基板を保持して基板の高さを測定した後、同一の対基板作業装置が同一の基板を再度保持する場合がある。この場合、基板を保持する毎に基板の高さを改めて測定すると、基板の処理時間が長くなるという問題があった。特許文献1では、同一の基板に対して下流の部品実装装置での高さ計測を省略する点が記載されているが、同一の対基板作業装置で同一の基板を再度保持する場合の高さ計測については記載されていない。
By the way, after the board-to-board working device holds a board and measures the height of the board, the same board-to-board working device may hold the same board again. In this case, if the height of the substrate is measured anew each time the substrate is held, there is a problem that the processing time for the substrate becomes longer. Patent Document 1 describes that height measurement for the same board in a downstream component mounting device is omitted; There is no mention of measurements.
本開示は、上述した課題を解決するためになされたものであり、同一の基板を再度保持した場合の基板高さの測定を効率よく行うことを主目的とする。
The present disclosure has been made to solve the above-mentioned problems, and its main purpose is to efficiently measure the height of a substrate when the same substrate is held again.
本開示は、上述した主目的を達成するために以下の手段を採った。
The present disclosure has taken the following measures to achieve the above-mentioned main objective.
本開示の対基板作業装置は、
基板に対して対基板作業を行う作業部と、
前記基板を保持する基板保持部と、
前記基板の基板高さを測定する高さ測定部と、
前記基板保持部に保持された前記基板上の所定の複数の測定点において前記基板高さの測定を行うよう前記高さ測定部を制御する基板高さ測定処理を行い、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持した場合には、前記所定の複数の測定点の一部である代表点において前記基板高さの測定を行うよう前記高さ測定部を制御する代表点測定処理を行い、前記代表点測定処理の測定結果と前記基板高さ測定処理における前記代表点と同じ測定点の測定結果との相違が許容範囲内である場合には前記所定の複数の測定点のうち前記代表点以外の測定点の前記基板高さの測定を省略する制御部と、
を備えたものである。 The board-to-board working device of the present disclosure includes:
a working unit that performs board-to-board work on the board;
a substrate holding part that holds the substrate;
a height measurement unit that measures the substrate height of the substrate;
performing a substrate height measurement process that controls the height measurement unit to measure the substrate height at a plurality of predetermined measurement points on the substrate held by the substrate holding unit; When the substrate holder re-holds the substrate on which the measurement has been performed, the height measurement section is controlled to measure the substrate height at a representative point that is a part of the plurality of predetermined measurement points. If the difference between the measurement result of the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within a permissible range, a control unit that omits the measurement of the substrate height at measurement points other than the representative point among the measurement points;
It is equipped with the following.
基板に対して対基板作業を行う作業部と、
前記基板を保持する基板保持部と、
前記基板の基板高さを測定する高さ測定部と、
前記基板保持部に保持された前記基板上の所定の複数の測定点において前記基板高さの測定を行うよう前記高さ測定部を制御する基板高さ測定処理を行い、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持した場合には、前記所定の複数の測定点の一部である代表点において前記基板高さの測定を行うよう前記高さ測定部を制御する代表点測定処理を行い、前記代表点測定処理の測定結果と前記基板高さ測定処理における前記代表点と同じ測定点の測定結果との相違が許容範囲内である場合には前記所定の複数の測定点のうち前記代表点以外の測定点の前記基板高さの測定を省略する制御部と、
を備えたものである。 The board-to-board working device of the present disclosure includes:
a working unit that performs board-to-board work on the board;
a substrate holding part that holds the substrate;
a height measurement unit that measures the substrate height of the substrate;
performing a substrate height measurement process that controls the height measurement unit to measure the substrate height at a plurality of predetermined measurement points on the substrate held by the substrate holding unit; When the substrate holder re-holds the substrate on which the measurement has been performed, the height measurement section is controlled to measure the substrate height at a representative point that is a part of the plurality of predetermined measurement points. If the difference between the measurement result of the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within a permissible range, a control unit that omits the measurement of the substrate height at measurement points other than the representative point among the measurement points;
It is equipped with the following.
この対基板作業装置では、基板高さ測定処理が行われた基板を基板保持部が再度保持した場合には、所定の複数の測定点の一部である代表点において基板高さの測定を行う代表点測定処理を行う。そして、代表点測定処理における代表点の測定結果と基板高さ測定処理における代表点と同じ測定点の測定結果との相違が許容範囲内であれば、所定の複数の測定点のうち代表点以外の測定点の基板高さの測定を省略する。そのため、基板高さ測定処理が行われた基板と同一の基板を基板保持部が再度保持した場合であっても所定の複数の測定点の全てにおいて改めて基板高さの測定を行う場合と比べて、基板高さの測定を効率よく行うことができる。
In this board-to-board working device, when the board holder re-holds a board that has been subjected to board height measurement processing, the board height is measured at a representative point that is part of a plurality of predetermined measurement points. Perform representative point measurement processing. If the difference between the measurement result of the representative point in the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within the allowable range, then the measurement results other than the representative point among the plurality of predetermined measurement points are The measurement of the substrate height at the measurement point is omitted. Therefore, even if the board holder re-holds the same board as the one on which the board height measurement process was performed, compared to the case where the board height is measured anew at all of a plurality of predetermined measurement points. , it is possible to efficiently measure the substrate height.
本開示の対基板作業装置の一例である部品実装機の実施形態について図面を参照しながら以下に説明する。図1は本実施形態の部品実装機10を含む実装システム1の構成の概略を示す構成図、図2は部品実装機10の筐体12の内側を示す概略斜視図、図3は基板搬送装置20および基板保持装置30の概略構成図、図4は基板保持装置30が基板Sを保持する様子を示す説明図、図5は制御装置70の電気的な接続関係を示す説明図である。図4Aは基板保持装置30が基板Sを保持していない状態を示し、図4Bは基板保持装置30が基板Sを保持している状態を示す。本実施形態において、上下方向(Z軸方向),左右方向(X軸方向)及び前後方向(Y軸方向)は、図1~図4に示した通りとする。
An embodiment of a component mounting machine, which is an example of a board-related work device of the present disclosure, will be described below with reference to the drawings. FIG. 1 is a block diagram schematically showing the configuration of a mounting system 1 including a component mounter 10 of this embodiment, FIG. 2 is a schematic perspective view showing the inside of a casing 12 of the component mounter 10, and FIG. 3 is a board transfer device. 20 and the substrate holding device 30, FIG. 4 is an explanatory diagram showing how the substrate holding device 30 holds the substrate S, and FIG. 5 is an explanatory diagram showing the electrical connection relationship of the control device 70. 4A shows a state in which the substrate holding device 30 does not hold the substrate S, and FIG. 4B shows a state in which the substrate holding device 30 holds the substrate S. In this embodiment, the up-down direction (Z-axis direction), left-right direction (X-axis direction), and front-back direction (Y-axis direction) are as shown in FIGS. 1 to 4.
実装システム1は、図1及び図2に示すように、部品実装機10と、部品実装機10を管理する管理装置80と、を備える。実装システム1は、部品Pを基板Sに実装する複数台の部品実装機10が基板Sの搬送方向(X軸方向)に沿って配置されている。図1では、説明の便宜のため部品実装機10を1台のみ示している。なお、実装システム1は、部品実装機10と同じ実装ライン上にはんだ印刷機や検査機、リフロー炉などを備えるものとしてもよい。
As shown in FIGS. 1 and 2, the mounting system 1 includes a component mounter 10 and a management device 80 that manages the component mounter 10. In the mounting system 1, a plurality of component mounting machines 10 for mounting components P onto a board S are arranged along the transport direction (X-axis direction) of the board S. In FIG. 1, only one component mounting machine 10 is shown for convenience of explanation. Note that the mounting system 1 may include a solder printing machine, an inspection machine, a reflow oven, etc. on the same mounting line as the component mounter 10.
部品実装機10は、図1及び図2に示すように、基台11と、筐体12と、部品供給装置15と、基板搬送装置20と、基板保持装置30と、基板検知センサ37(図4参照)と、XYロボット40と、実装ヘッド50と、マークカメラ55と、パーツカメラ58と、測距センサ60と、制御装置70(図5参照)とを備えている。部品供給装置15は基台11に対して着脱可能に配設されている。基板搬送装置20及び基板保持装置30は基台11上部に配置された支持台14上に配設されている。
As shown in FIGS. 1 and 2, the component mounting machine 10 includes a base 11, a housing 12, a component supply device 15, a board transfer device 20, a board holding device 30, and a board detection sensor 37 (see FIG. 4), an XY robot 40, a mounting head 50, a mark camera 55, a parts camera 58, a distance sensor 60, and a control device 70 (see FIG. 5). The component supply device 15 is removably installed on the base 11. The substrate transport device 20 and the substrate holding device 30 are arranged on a support stand 14 arranged above the base 11.
筐体12は、箱形の部材である。図2に示すように、筐体12は、部品供給装置15,基板搬送装置20,基板保持装置30,XYロボット40,及び実装ヘッド50などを覆っている。図1に示すように、筐体12の左側壁121と右側壁122には、それぞれ開口部121a及び開口部122aが形成されている。また、筐体12の前面には、開閉が可能な跳ね上げ式のカバー部材123が設けられている。カバー部材123には、部品実装機10の動作状況などの各種情報を表示すると共に、作業者による各種入力が可能なタッチパネル式のディスプレイである操作パネル38が設置されている。
The housing 12 is a box-shaped member. As shown in FIG. 2, the housing 12 covers the component supply device 15, the substrate transfer device 20, the substrate holding device 30, the XY robot 40, the mounting head 50, and the like. As shown in FIG. 1, an opening 121a and an opening 122a are formed in the left side wall 121 and right side wall 122 of the housing 12, respectively. Furthermore, a flip-up cover member 123 that can be opened and closed is provided on the front surface of the housing 12. The cover member 123 is provided with an operation panel 38 that is a touch panel display that displays various information such as the operating status of the component mounter 10 and allows various inputs by an operator.
部品供給装置15は、部品Pを部品供給位置まで供給する装置であり、本実施形態ではテープフィーダとして構成されている。部品供給装置15は、所定間隔毎に形成された収容部に部品Pが収容されたテープをリールから引き出してピッチ送りすることで、部品Pを部品供給位置に供給する。
The component supply device 15 is a device that supplies the component P to a component supply position, and is configured as a tape feeder in this embodiment. The component supply device 15 supplies the components P to the component supply position by pulling out from a reel a tape containing the components P in storage portions formed at predetermined intervals and pitch-feeding the tape.
基板搬送装置20は、基板Sを上流から下流に向けて(例えば左から右に向けて)搬送する装置である。基板搬送装置20は、図3に示すように、コンベアベルト24により基板Sを搬送するベルトコンベア装置として構成されている。基板搬送装置20は、Y軸方向に所定の間隔を隔てて配置された一対のサイドフレーム22と、一対のサイドフレーム22の各々に設けられたコンベアベルト24と、コンベアベルト24を周回駆動するベルト駆動装置とを備える。基板Sは、コンベアベルト24に乗せられた状態で、ベルト駆動装置がコンベアベルト24を周回駆動することによりX軸方向に搬送される。一対のコンベアベルト24の少なくとも一方は、他方に対して近接および離間できるように構成される。これにより、基板搬送装置20は、一対のコンベアベルトのY軸方向における間隔を調整することで、Y軸方向に幅が異なる複数種類の基板Sを搬送することが可能である。
The substrate transport device 20 is a device that transports the substrate S from upstream to downstream (for example, from left to right). The substrate transport device 20 is configured as a belt conveyor device that transports the substrate S using a conveyor belt 24, as shown in FIG. The substrate conveyance device 20 includes a pair of side frames 22 arranged at a predetermined interval in the Y-axis direction, a conveyor belt 24 provided on each of the pair of side frames 22, and a belt that drives the conveyor belt 24 around. A drive device is provided. The substrate S is placed on the conveyor belt 24 and is conveyed in the X-axis direction by the belt driving device driving the conveyor belt 24 around. At least one of the pair of conveyor belts 24 is configured to be able to approach and separate from the other. Thereby, the substrate conveyance device 20 can convey a plurality of types of substrates S having different widths in the Y-axis direction by adjusting the interval between the pair of conveyor belts in the Y-axis direction.
基板保持装置30は、コンベアベルト24上に配置された基板Sを保持する装置であり、本実施形態では基板Sをクランプして保持するクランプ装置として構成されている。基板保持装置30は、一対の基板押さえプレート32と、一対のクランパ34と、支持プレート35と、昇降装置36とを備える。一対の基板押さえプレート32は、一対のサイドフレーム22の上端部に各々設けられている。一対のクランパ34は、一対の基板押さえプレート32の各々の下方に配置されている。一対のクランパ34の各々の下端面には、下方に突出する突出部34aが設けられている。支持プレート35は、一対のクランパ34の下方に配置された板状部材である。支持プレート35は昇降装置36によって昇降する。支持プレート35が上昇すると、支持プレート35の上面がクランパ34の突出部34aに当接して、クランパ34を押し上げる。支持プレート35には、基板Sがクランプされたときに基板Sの下面を支持するための複数(本実施形態では6本)の支持ピン35aが配設されている。昇降装置36は、支持台14と支持プレート35との間に配置され、支持プレート35を介して一対のクランパ34を昇降させる。基板Sがコンベアベルト24上に載せられている状態(図4A)で、昇降装置36が一対のクランパ34を上昇させると、基板Sは一対のクランパ34に押し上げられて基板押さえプレート32の下面に押し付けられる(図4B)。これにより、基板保持装置30は、基板Sの前後両端の縁部の各々を2つの部材(基板押さえプレート32及びクランパ34)で上下から挟んで保持する。
The substrate holding device 30 is a device that holds the substrate S placed on the conveyor belt 24, and in this embodiment is configured as a clamp device that clamps and holds the substrate S. The substrate holding device 30 includes a pair of substrate holding plates 32 , a pair of clampers 34 , a support plate 35 , and a lifting device 36 . The pair of substrate holding plates 32 are provided at the upper ends of the pair of side frames 22, respectively. The pair of clampers 34 are arranged below each of the pair of substrate holding plates 32. A protrusion 34a that protrudes downward is provided on the lower end surface of each of the pair of clampers 34. The support plate 35 is a plate-like member arranged below the pair of clampers 34. The support plate 35 is raised and lowered by a lifting device 36. When the support plate 35 rises, the upper surface of the support plate 35 comes into contact with the protrusion 34a of the clamper 34, pushing the clamper 34 up. The support plate 35 is provided with a plurality of (six in this embodiment) support pins 35a for supporting the lower surface of the substrate S when the substrate S is clamped. The lifting device 36 is disposed between the support base 14 and the support plate 35, and raises and lowers the pair of clampers 34 via the support plate 35. When the lifting device 36 raises the pair of clampers 34 while the substrate S is placed on the conveyor belt 24 (FIG. 4A), the substrate S is pushed up by the pair of clampers 34 and onto the lower surface of the substrate holding plate 32. pressed (Figure 4B). Thereby, the substrate holding device 30 holds each of the front and rear edges of the substrate S between the two members (the substrate holding plate 32 and the clamper 34) from above and below.
基板検知センサ37は、図4Aに示すように、部品実装機10の基板搬送路(基板搬送装置20)に設けられている。基板検知センサ37は、例えば、基板搬送路を挟んで対向する位置に設けられた投光部37aと受光部37bとを備える透過型の光センサである。投光部37aは、向かい合うサイドフレーム22の一方の内面に設けられている。受光部37bは、当該一対のサイドフレーム22の他方の内面に設けられている。基板検知センサ37は、反射型の光センサとしてもよい。投光部37aと受光部37bとの間に、投光部37aからの光を遮るもの(例えば、基板S)があり、受光部37bが投光部37aからの光を受光していないならば、基板検知センサ37は、基板Sを検知した検知状態である旨の信号を制御装置70(図4参照)に出力する。一方、投光部37aと受光部37bとの間に、投光部37aからの光を遮るものがなく、受光部37bが投光部37aからの光を受光しているならば、基板検知センサ37は、基板Sを検知しない非検知状態である旨の信号を制御装置70に出力する。
The board detection sensor 37 is provided in the board transport path (board transport device 20) of the component mounting machine 10, as shown in FIG. 4A. The substrate detection sensor 37 is, for example, a transmissive optical sensor that includes a light projecting section 37a and a light receiving section 37b that are provided at opposing positions across the substrate transport path. The light projecting portion 37a is provided on one inner surface of the opposing side frames 22. The light receiving portion 37b is provided on the other inner surface of the pair of side frames 22. The substrate detection sensor 37 may be a reflective optical sensor. If there is something between the light projector 37a and the light receiver 37b that blocks the light from the light projector 37a (for example, a board S), and the light receiver 37b does not receive the light from the light projector 37a, then , the substrate detection sensor 37 outputs a signal indicating that the substrate S is detected and is in a detection state to the control device 70 (see FIG. 4). On the other hand, if there is nothing between the light projector 37a and the light receiver 37b that blocks the light from the light projector 37a, and the light receiver 37b is receiving the light from the light projector 37a, the board detection sensor 37 outputs a signal indicating that the substrate S is not detected and is in a non-detection state to the control device 70.
XYロボット40は、実装ヘッド50,マークカメラ55及び測距センサ60をXY方向に移動させる装置である。XYロボット40は、図2に示すように、前後方向(Y軸方向)に沿って設けられた左右一対のY軸ガイドレール43と、左右一対のY軸ガイドレール43に架け渡されY軸ガイドレール43に沿ってY軸方向に移動が可能なY軸スライダ44とを備える。また、XYロボット40は、Y軸スライダ44の側面に左右方向(X軸方向)に沿って設けられたX軸ガイドレール41と、X軸ガイドレール41に沿ってX軸方向に移動が可能なX軸スライダ42と、を備える。X軸スライダ42は、X軸モータ46(図5参照)の駆動によって移動可能であり、Y軸スライダ44は、Y軸モータ48(図5参照)の駆動によって移動可能である。X軸スライダ42には実装ヘッド50が取り付けられており、実装ヘッド50は、制御装置70によってXYロボット40(X軸モータ46およびY軸モータ48)が駆動制御されることにより、XY方向に移動する。XYロボット40は、X軸スライダ42のX軸方向の位置を検出するX軸位置センサ47(図5参照)と、Y軸スライダ44のY軸方向の位置を検出するY軸位置センサ49(図5参照)とを備えている。
The XY robot 40 is a device that moves the mounting head 50, mark camera 55, and distance measurement sensor 60 in the XY directions. As shown in FIG. 2, the XY robot 40 includes a pair of left and right Y-axis guide rails 43 provided along the front-rear direction (Y-axis direction), and a Y-axis guide that spans the pair of left and right Y-axis guide rails 43. A Y-axis slider 44 that is movable in the Y-axis direction along a rail 43 is provided. The XY robot 40 also has an X-axis guide rail 41 provided along the left-right direction (X-axis direction) on the side surface of the Y-axis slider 44, and is movable in the X-axis direction along the X-axis guide rail 41. An X-axis slider 42 is provided. The X-axis slider 42 is movable by driving an X-axis motor 46 (see FIG. 5), and the Y-axis slider 44 is movable by driving a Y-axis motor 48 (see FIG. 5). A mounting head 50 is attached to the X-axis slider 42, and the mounting head 50 is moved in the XY direction by drive control of the XY robot 40 (X-axis motor 46 and Y-axis motor 48) by the control device 70. do. The XY robot 40 includes an X-axis position sensor 47 (see FIG. 5) that detects the position of the X-axis slider 42 in the X-axis direction, and a Y-axis position sensor 49 (see FIG. 5) that detects the position of the Y-axis slider 44 in the Y-axis direction. 5).
実装ヘッド50は、部品供給装置15から供給された部品Pを吸着ノズル51で吸着(採取)して基板S上に実装する装置である。実装ヘッド50は、X軸スライダ42に取り外し可能に装着されており、XYロボット40によりXY方向へ移動する。実装ヘッド50は、吸着ノズル51と、Z軸モータ52と、Z軸位置センサ53(図5参照)とを備える。吸着ノズル51は、実装ヘッド50の下面に取り外し可能に装着されている。本実施形態では実装ヘッド50には1つの吸着ノズル51が取り付けられているが、複数の吸着ノズル51が取り付け可能であってもよい。吸着ノズル51は、負圧を利用して部品Pを採取する採取部材である。Z軸モータ52は、Z軸に沿って吸着ノズル51を昇降させる機構であり、これにより吸着ノズル51及び吸着ノズル51に吸着された部品Pの高さが調整される。Z軸位置センサ53は、吸着ノズル51のZ軸方向の位置を検出する。また、実装ヘッド50は、図示しない駆動モータによって吸着ノズル51を回転(自転)させる回転装置を備え、吸着ノズル51に保持(吸着)された部品Pの角度を調整可能となっている。
The mounting head 50 is a device that sucks (picks up) the component P supplied from the component supply device 15 with a suction nozzle 51 and mounts it onto the substrate S. The mounting head 50 is removably mounted on the X-axis slider 42 and is moved in the XY directions by the XY robot 40. The mounting head 50 includes a suction nozzle 51, a Z-axis motor 52, and a Z-axis position sensor 53 (see FIG. 5). The suction nozzle 51 is removably attached to the lower surface of the mounting head 50. Although one suction nozzle 51 is attached to the mounting head 50 in this embodiment, a plurality of suction nozzles 51 may be attachable. The suction nozzle 51 is a collecting member that collects the part P using negative pressure. The Z-axis motor 52 is a mechanism for raising and lowering the suction nozzle 51 along the Z-axis, thereby adjusting the height of the suction nozzle 51 and the component P suctioned by the suction nozzle 51. The Z-axis position sensor 53 detects the position of the suction nozzle 51 in the Z-axis direction. Furthermore, the mounting head 50 includes a rotation device that rotates (rotates) the suction nozzle 51 by a drive motor (not shown), and can adjust the angle of the component P held (suctioned) by the suction nozzle 51.
マークカメラ55は、基板Sに付された図示しない基準マークや識別情報などを上方から撮像するための装置である。マークカメラ55は実装ヘッド50の下面に配設されており、実装ヘッド50の移動に伴ってXY方向へ移動する。
The mark camera 55 is a device for capturing images of unillustrated reference marks, identification information, etc. attached to the substrate S from above. The mark camera 55 is disposed on the lower surface of the mounting head 50 and moves in the X and Y directions as the mounting head 50 moves.
パーツカメラ58は、基板搬送装置20の前方に配置されている。パーツカメラ58の撮像範囲は、パーツカメラ58の上方である。部品Pを吸着した吸着ノズル51がパーツカメラ58の上方を通過する際、パーツカメラ58は吸着ノズル51に吸着された部品Pを下方から撮像する。
The parts camera 58 is arranged in front of the substrate transport device 20. The imaging range of the parts camera 58 is above the parts camera 58. When the suction nozzle 51 that has suctioned the component P passes above the parts camera 58, the parts camera 58 images the component P that has been suctioned by the suction nozzle 51 from below.
測距センサ60は、基板Sの高さ(Z軸方向の位置)である基板高さを測定する装置である。基板高さは、基板Sの上面の高さである。測距センサ60は実装ヘッド50の下面に配設されており、実装ヘッド50の移動に伴ってXY方向へ移動する。測距センサ60は、本実施形態ではレーザー高さセンサとして構成されており、図2の吹き出し部に示すように、レーザー光を下方に照射する照射部61と、基板Sで反射された後のレーザー光を受光する検出部62とを備える。照射部61が下方に配置された基板Sに向かってレーザー光を斜め下方向に照射すると、レーザー光は基板Sの上面で反射し、反射したレーザー光が検出部62に入射する。このとき、図2の吹き出し部に実線及び破線で示したように、基板Sの上面の位置に応じて反射光の光路(矢印で図示)は変化する。検出部62は、この光路の違いによるレーザー光の入射位置の違いに基づいて測距センサ60と基板Sの上面とのZ軸方向の距離を検出し、検出した距離に基づいて基板高さを測定する。なお、基板高さは、測距センサ60と基板Sの上面とのZ軸方向の距離としてもよいし、この距離に基づいて導出される所定の高さを基準とした値としてもよい。
The distance sensor 60 is a device that measures the height of the substrate S (position in the Z-axis direction). The substrate height is the height of the upper surface of the substrate S. The distance measuring sensor 60 is disposed on the lower surface of the mounting head 50 and moves in the X and Y directions as the mounting head 50 moves. In this embodiment, the distance measurement sensor 60 is configured as a laser height sensor, and as shown in the balloon part of FIG. The detection unit 62 includes a detection unit 62 that receives laser light. When the irradiation section 61 irradiates a laser beam diagonally downward toward the substrate S disposed below, the laser beam is reflected on the upper surface of the substrate S, and the reflected laser beam enters the detection section 62 . At this time, the optical path of the reflected light (indicated by an arrow) changes depending on the position of the upper surface of the substrate S, as shown by the solid line and broken line in the balloon part of FIG. The detection unit 62 detects the distance in the Z-axis direction between the distance measuring sensor 60 and the top surface of the substrate S based on the difference in the incident position of the laser beam due to the difference in the optical path, and calculates the substrate height based on the detected distance. Measure. Note that the substrate height may be the distance in the Z-axis direction between the ranging sensor 60 and the top surface of the substrate S, or may be a value based on a predetermined height derived based on this distance.
制御装置70は、部品実装機10全体を制御する装置である。制御装置70は、図5に示すように、CPU71と、ROM72と、ストレージ73(例えばHDDやSSD)と、RAM74と、入出力インタフェース75とを備える。これらはバス76を介して電気的に接続されている。制御装置70には、基板検知センサ37からの検知信号、カバー部材123の開閉を検知するカバー開閉センサ123aからの検知信号、操作パネル38からの操作信号、X軸位置センサ47及びY軸位置センサ49からの検出信号、Z軸位置センサ53からの検出信号、マークカメラ55及びパーツカメラ58からの画像信号、及び測距センサ60からの検出信号などが入出力インタフェース75を介して入力される。また、制御装置70からは、部品供給装置15への制御信号、基板搬送装置20及び基板保持装置30への制御信号、操作パネル38へ表示信号、XYロボット40(X軸モータ46およびY軸モータ48)への駆動信号、実装ヘッド50への駆動信号、マークカメラ55及びパーツカメラ58への駆動信号、測距センサ60への駆動信号などが入出力インタフェース75を介して出力される。また、制御装置70は、管理装置80と双方向通信可能に接続されており、互いにデータや制御信号のやり取りを行っている。
The control device 70 is a device that controls the entire component mounting machine 10. As shown in FIG. 5, the control device 70 includes a CPU 71, a ROM 72, a storage 73 (for example, an HDD or an SSD), a RAM 74, and an input/output interface 75. These are electrically connected via a bus 76. The control device 70 includes a detection signal from the board detection sensor 37, a detection signal from the cover opening/closing sensor 123a that detects opening/closing of the cover member 123, an operation signal from the operation panel 38, an X-axis position sensor 47, and a Y-axis position sensor. 49, a detection signal from the Z-axis position sensor 53, an image signal from the mark camera 55 and the parts camera 58, a detection signal from the ranging sensor 60, and the like are inputted via the input/output interface 75. The control device 70 also sends control signals to the component supply device 15, control signals to the substrate transfer device 20 and substrate holding device 30, display signals to the operation panel 38, and control signals to the XY robot 40 (X-axis motor 46 and Y-axis motor 48), a drive signal to the mounting head 50, a drive signal to the mark camera 55 and parts camera 58, a drive signal to the distance measurement sensor 60, etc. are outputted via the input/output interface 75. Further, the control device 70 is connected to the management device 80 so as to be able to communicate bidirectionally, and exchanges data and control signals with each other.
管理装置80は、実装システム1全体を管理する装置である。管理装置80は、図5に示すように、CPU81と、ROM82と、ストレージ83(例えばHDDやSSD)と、RAM84と、入出力インタフェース85と、を備える。これらはバス86を介して電気的に接続されている。また、管理装置80は、キーボードやマウスなどの入力デバイス87と、LCDなどのディスプレイ88とを備える。この管理装置80には、入力デバイス87からの入力信号が入出力インタフェース85を介して入力される。また、管理装置80からは、ディスプレイ88への画像信号が入出力インタフェース85を介して出力される。管理装置80は、入出力インタフェース85を介して部品実装機10の制御装置70と情報の送受信を行う。管理装置80のストレージ83には、基板Sの生産プログラムなどが記憶されている。基板Sの生産プログラムには、実装システム1中の複数の部品実装機10の各々について、部品実装機10がどの基板Sのどの位置にどの順序でどの部品Pを実装するかの情報、及びそのように実装した基板Sを何枚作製するかの情報などを含んでいる。また、生産プログラムには、部品実装機10がどの基板Sのどの位置で基板高さを測定するかの情報(基板S上の所定の複数の測定点の位置情報)、及び部品Pの高さ(厚さ)に関する情報も含まれている。
The management device 80 is a device that manages the entire mounting system 1. As shown in FIG. 5, the management device 80 includes a CPU 81, a ROM 82, a storage 83 (for example, an HDD or an SSD), a RAM 84, and an input/output interface 85. These are electrically connected via a bus 86. The management device 80 also includes an input device 87 such as a keyboard and a mouse, and a display 88 such as an LCD. An input signal from an input device 87 is input to this management device 80 via an input/output interface 85 . Further, the management device 80 outputs an image signal to the display 88 via the input/output interface 85. The management device 80 sends and receives information to and from the control device 70 of the component mounter 10 via the input/output interface 85. The storage 83 of the management device 80 stores a production program for the board S and the like. The production program for the board S includes, for each of the plurality of component mounters 10 in the mounting system 1, information on which component P the component mounter 10 will mount on which board S, in which position, in what order, and the like. It includes information such as how many boards S to be manufactured with the following mounting. The production program also includes information on which position of which board S the component mounting machine 10 measures the board height (position information of a plurality of predetermined measurement points on the board S), and the height of the component P. (Thickness) information is also included.
次に、こうして構成された本実施形態の部品実装機10の動作について説明する。まず、部品実装機10が基板Sに部品を実装する実装動作について説明する。実装動作のルーチンはストレージ73に記憶されており、作業者により、入力デバイス87又は操作パネル38を介して実装開始指示が入力されたあと開始される。実装動作を開始すると、CPU71は、まず、部品実装機10への基板Sの搬入,基板Sのクランプ,及び基板Sの基板高さを測定する処理などを含む、後述する実装準備ルーチンを実行する。続いて、CPU71は、部品Pを基板S上の実装予定位置に実装(配置)する実装処理ルーチンを実行する。
Next, the operation of the component mounter 10 of this embodiment configured in this manner will be described. First, a mounting operation in which the component mounter 10 mounts a component onto the board S will be described. The mounting operation routine is stored in the storage 73, and is started after the operator inputs a mounting start instruction via the input device 87 or the operation panel 38. When the mounting operation is started, the CPU 71 first executes a mounting preparation routine, which will be described later, including carrying the board S into the component mounting machine 10, clamping the board S, and measuring the height of the board S. . Subsequently, the CPU 71 executes a mounting processing routine for mounting (arranging) the component P at the planned mounting position on the board S.
実装処理ルーチンでは、CPU71は、まず、実装ヘッド50の吸着ノズル51に部品供給装置15から供給される部品Pを吸着させる。具体的には、CPU71は、X軸モータ46及びY軸モータ48を制御して吸着ノズル51を実装対象の部品Pの部品吸着位置の真上に移動させる。次に、CPU71は、Z軸モータ52を制御し、吸着ノズル51を下降させると共にその吸着ノズル51の吸引口に負圧を作用させる。これにより、吸着ノズル51に実装対象の部品Pが吸着される。その後、CPU71は、吸着ノズル51を上昇させ、X軸モータ46及びY軸モータ48を制御して、先端に部品Pを吸着した吸着ノズル51を基板Sの実装予定位置の上方へ移動させる。そして、その所定の位置で、CPU71は、Z軸モータ52を制御し、吸着ノズル51を下降させる。このとき、CPU71は、後述する実装準備ルーチンにおける基板高さの測定結果を利用して、吸着ノズル51の下降量を制御する。また、CPU71は、下降させた吸着ノズル51の吸引口に正圧を作用させて部品Pの吸着を解除する。これにより、吸着ノズル51に吸着されていた部品Pが離間して基板Sの所定の位置に実装される。基板Sに実装すべき他の部品Pについても、同様にして基板S上に実装していき、すべての部品Pの実装が完了したら、CPU71は、基板保持装置30を制御して基板Sのクランプを解除し、基板搬送装置20を制御して基板Sを下流側へ送り出す。CPU71は、生産プログラムに含まれる基板Sの作製枚数に応じて、実装準備ルーチン及び実装処理ルーチンを繰り返す。
In the mounting processing routine, the CPU 71 first causes the suction nozzle 51 of the mounting head 50 to suction the component P supplied from the component supply device 15. Specifically, the CPU 71 controls the X-axis motor 46 and the Y-axis motor 48 to move the suction nozzle 51 directly above the component suction position of the component P to be mounted. Next, the CPU 71 controls the Z-axis motor 52 to lower the suction nozzle 51 and apply negative pressure to the suction port of the suction nozzle 51 . As a result, the component P to be mounted is attracted to the suction nozzle 51. After that, the CPU 71 raises the suction nozzle 51, controls the X-axis motor 46 and the Y-axis motor 48, and moves the suction nozzle 51, which has suctioned the component P to the tip, above the planned mounting position of the board S. Then, at the predetermined position, the CPU 71 controls the Z-axis motor 52 to lower the suction nozzle 51. At this time, the CPU 71 controls the amount of descent of the suction nozzle 51 using the measurement result of the substrate height in a mounting preparation routine to be described later. Further, the CPU 71 releases the suction of the component P by applying positive pressure to the suction port of the suction nozzle 51 that has been lowered. As a result, the component P that had been sucked by the suction nozzle 51 is separated and mounted on the substrate S at a predetermined position. The other components P to be mounted on the board S are similarly mounted on the board S, and when the mounting of all the components P is completed, the CPU 71 controls the board holding device 30 to clamp the board S. is released, and the substrate transport device 20 is controlled to send the substrate S to the downstream side. The CPU 71 repeats the mounting preparation routine and the mounting processing routine according to the number of substrates S to be produced included in the production program.
ここで、部品実装機10が実装準備ルーチン又は実装処理ルーチンを実行している際に、部品実装機10又は実装システム1に含まれる他の部品実装機10などにおいて異常が発生する場合がある。異常が発生した場合、CPU71は、部品実装機10自身の図示しない異常検知装置,管理装置80からの指令,又は作業者からの操作パネル38を介した操作信号などに基づいて、異常が発生したことを検知する。異常の発生を検知すると、CPU71は、実装動作を中断して、基板保持装置30が基板Sをクランプしている場合は必要に応じてクランプを解除するよう基板保持装置30を制御する。また、CPU71は、XYロボット40及び実装ヘッド50の動作を停止させる。作業者は、例えば管理装置80のディスプレイ88又は操作パネル38を介して異常の発生に気づくと、異常内容の確認や実装システム1に対する異常の解消のために必要な作業を行う。そして、異常が解消すると、作業者は、例えば入力デバイス87又は操作パネル38などを介して実装システム1に実装動作の復帰を指示する。CPU71は、管理装置80又は操作パネル38を介して作業者の復帰の指示を入力すると、まず実装準備ルーチンを実行し、その後に実装処理ルーチンを開始又は再開する。
Here, while the component mounter 10 is executing the mounting preparation routine or the mounting processing routine, an abnormality may occur in the component mounter 10 or another component mounter 10 included in the mounting system 1. When an abnormality occurs, the CPU 71 determines whether the abnormality has occurred based on an abnormality detection device (not shown) of the component mounting machine 10 itself, a command from the management device 80, or an operation signal from the operator via the operation panel 38. Detect that. When detecting the occurrence of an abnormality, the CPU 71 interrupts the mounting operation, and if the substrate holding device 30 is clamping the substrate S, controls the substrate holding device 30 to release the clamp as necessary. Further, the CPU 71 stops the operations of the XY robot 40 and the mounting head 50. When the operator notices the occurrence of an abnormality through, for example, the display 88 of the management device 80 or the operation panel 38, the operator performs necessary work to confirm the details of the abnormality and to resolve the abnormality in the mounting system 1. When the abnormality is resolved, the operator instructs the mounting system 1 to resume the mounting operation, for example, via the input device 87 or the operation panel 38. When the CPU 71 receives an instruction to return the worker through the management device 80 or the operation panel 38, it first executes a mounting preparation routine, and then starts or restarts the mounting processing routine.
実装準備ルーチンについて詳細を説明する。図6は、制御装置70のCPU71により実行される実装準備ルーチンの一例を示すフローチャートである。図7は、基板高さの測定点A1~A9の一例を示す説明図である。
The implementation preparation routine will be explained in detail. FIG. 6 is a flowchart showing an example of a mounting preparation routine executed by the CPU 71 of the control device 70. FIG. 7 is an explanatory diagram showing an example of the substrate height measurement points A1 to A9.
実装準備ルーチンを開始すると、CPU71は、まず、現在が異常からの復帰時であるか否かを判定する(S100)。CPU71は、例えば上述した管理装置80又は操作パネル38を介した作業者の復帰の指示を入力した直後の実装準備ルーチンの実行時には、S100で肯定判定を行い、それ以外の場合には否定判定を行う。
When the mounting preparation routine is started, the CPU 71 first determines whether or not it is time to recover from an abnormality (S100). For example, the CPU 71 makes an affirmative determination in S100 when executing the implementation preparation routine immediately after inputting an instruction to return the worker through the management device 80 or the operation panel 38 described above, and otherwise makes a negative determination. conduct.
S100で否定判定を行ったならば、CPU71は、基板搬送装置20を制御して基板Sを所定の作業位置まで搬送し(S120)、基板保持装置30を制御して基板Sをクランプして保持する(S130)。CPU71は、S120では、例えば基板検知センサ37が基板Sを検知するまで搬送したり、基板検知センサ37が基板Sを検知してから所定の搬送量だけ基板Sを搬送することにより、基板Sを所定の作業位置まで搬送する。
If a negative determination is made in S100, the CPU 71 controls the substrate transfer device 20 to transfer the substrate S to a predetermined work position (S120), and controls the substrate holding device 30 to clamp and hold the substrate S. (S130). In S120, the CPU 71 transports the substrate S until the substrate detection sensor 37 detects the substrate S, or transports the substrate S by a predetermined transport amount after the substrate detection sensor 37 detects the substrate S, for example. Transport to the specified working position.
続いて、CPU71は、基板保持装置30に保持された基板S上の所定の複数の測定点において基板高さの測定を行うよう測距センサ60を制御する基板高さ測定処理を行う(S140)。複数の測定点は、例えば作業者により予め設定されて管理装置80のストレージ83に記憶されており、CPU71は管理装置80から複数の測定点の位置情報を取得する。複数の測定点は、例えば基板Sに付された図示しない基準マークの位置を基準としたXY座標で表される。本実施形態では、複数の測定点は測定点A1~A9の9個とし、図7に示すように基板S上にX軸方向に沿って等間隔に3点及びY軸方向に沿って等間隔に3点並ぶように格子状に配置されている。測定点A1~A9のうち基板Sの中央に位置する測定点A5以外は、基板Sの外縁に近い位置に配置するように位置が定められている。S140では、CPU71は、この測定点A1~A9の全てについて、基板高さを測定する。具体的には、CPU71は、まず、マークカメラ55を基板S上に移動させて基板Sを撮像させ、得られた画像に基づいて基板Sの基準マークの位置を検出する。そして、CPU71は、検出した基準マークの位置に基づいて、測定点A1の上方に測距センサ60が移動するようXYロボット40を制御し、測距センサ60に基板Sの基板高さを測定させる。CPU71は、測定点A2~A9の各々についても、同様にXYロボット40及び測距センサ60を用いて基板高さを測定する。
Subsequently, the CPU 71 performs a substrate height measurement process that controls the distance measurement sensor 60 to measure the substrate height at a plurality of predetermined measurement points on the substrate S held by the substrate holding device 30 (S140). . The plurality of measurement points are set in advance by, for example, an operator and stored in the storage 83 of the management device 80, and the CPU 71 acquires position information of the plurality of measurement points from the management device 80. The plurality of measurement points are expressed, for example, by XY coordinates based on the position of a reference mark (not shown) attached to the substrate S. In this embodiment, the plurality of measurement points are nine measurement points A1 to A9, and as shown in FIG. They are arranged in a grid pattern with three points lined up. Among the measurement points A1 to A9, the positions of the measurement points A1 to A9 other than the measurement point A5 located at the center of the substrate S are determined to be close to the outer edge of the substrate S. In S140, the CPU 71 measures the substrate height at all of the measurement points A1 to A9. Specifically, the CPU 71 first moves the mark camera 55 onto the substrate S to image the substrate S, and detects the position of the reference mark on the substrate S based on the obtained image. Then, the CPU 71 controls the XY robot 40 to move the distance measurement sensor 60 above the measurement point A1 based on the detected position of the reference mark, and causes the distance measurement sensor 60 to measure the substrate height of the substrate S. . The CPU 71 similarly measures the substrate height at each of the measurement points A2 to A9 using the XY robot 40 and the distance measuring sensor 60.
S140の基板高さ測定処理のあと、CPU71は、測定点A1~A9の各々と測定された基板高さとを対応付けてストレージ73に記憶して(S160)、実装準備ルーチンを終了する。この場合、実装準備ルーチンに続いて実行される実装処理ルーチンでは、CPU71は、S140の基板高さ測定処理の測定結果を利用して実装ヘッド50に部品Pの実装を行わせる。具体的には、CPU71は、ストレージ73に記憶された測定結果に基づいて基板Sの上面の形状を公知の手法を用いた近似計算によって導出し、導出した形状に基づいて部品Pを基板Sに実装する際の実装高さを導出する。例えば、図7の位置Mが部品Pの実装予定位置であった場合、CPU71は、測定点A1~A9のうちこの位置Mを囲む最小の三角形を描くような3点の測定点(図7の例ではA5,A6,A9)を決定する。そして、CPU71は、決定した3点に囲まれる三角形の領域内の基板Sの表面形状をその3点を通る平面とみなした(近似した)場合の、吸着された部品Pの実装予定位置の実装高さを、3点の測定点の基板高さに基づいて導出する。そして、CPU71は、導出した基板高さに基づいて吸着ノズル51の下降量を設定(又は補正)して、この下降量だけ吸着ノズル51を下降させて部品Pの実装を行う。こうすることで、基板保持装置30に保持された基板Sに反りなどが生じていても、適切に部品Pを基板Sに実装することができる。なお、部品Pの実装予定位置が基板Sの外縁付近に位置するなど、測定点A1~A9のみでは実装予定位置を囲む三角形が描けない場合、例えば、CPU71は基板Sの前後両端の基板高さを用いて実装高さを導出してもよい。基板Sの前後両端は基板保持装置30にクランプされており、クランプされている部分の基板高さは常に同じ値(既知の値)となるから、CPU71はこの値も実装高さの導出に用いることができる。
After the substrate height measurement process in S140, the CPU 71 stores each of the measurement points A1 to A9 and the measured substrate height in association with each other in the storage 73 (S160), and ends the mounting preparation routine. In this case, in the mounting processing routine executed subsequent to the mounting preparation routine, the CPU 71 causes the mounting head 50 to mount the component P using the measurement result of the board height measurement processing in S140. Specifically, the CPU 71 derives the shape of the top surface of the board S by an approximate calculation using a known method based on the measurement results stored in the storage 73, and places the component P on the board S based on the derived shape. Derive the mounting height when mounting. For example, if the position M in FIG. 7 is the planned mounting position of the component P, the CPU 71 selects three measurement points that draw the smallest triangle surrounding this position M among the measurement points A1 to A9 ( In the example, A5, A6, A9) are determined. Then, the CPU 71 determines the mounting position of the picked-up component P when the surface shape of the board S within the triangular area surrounded by the determined three points is regarded (approximated) as a plane passing through the three points. The height is derived based on the substrate height at three measurement points. Then, the CPU 71 sets (or corrects) the amount of descent of the suction nozzle 51 based on the derived substrate height, and mounts the component P by lowering the suction nozzle 51 by this amount of descent. By doing so, even if the board S held by the board holding device 30 is warped, the component P can be appropriately mounted on the board S. Note that if the planned mounting position of the component P is located near the outer edge of the board S, and a triangle surrounding the planned mounting position cannot be drawn using only the measurement points A1 to A9, for example, the CPU 71 calculates the height of the board at both the front and rear ends of the board S. The mounting height may be derived using Both the front and back ends of the board S are clamped by the board holding device 30, and the board height of the clamped portion is always the same value (known value), so the CPU 71 also uses this value to derive the mounting height. be able to.
一方、ステップS100で肯定判定を行った場合、すなわち異常からの復帰時である場合、CPU71は、基板検知センサ37が基板Sを検知しているか否かを判定する(S110)。S110で否定判定を行った場合は、CPU71はS120以降の処理を行って実装準備ルーチンを終了する。すなわち、CPU71は、異常からの復帰時に基板検知センサ37が基板Sを検知していない場合は、異常からの復帰時でない場合すなわち通常時と同じように、新たな基板Sに対して搬入,クランプ及び基板高さ測定処理を行う。
On the other hand, when an affirmative determination is made in step S100, that is, when the recovery from an abnormality occurs, the CPU 71 determines whether or not the substrate detection sensor 37 is detecting the substrate S (S110). If a negative determination is made in S110, the CPU 71 performs the processes from S120 onwards and ends the mounting preparation routine. That is, if the substrate detection sensor 37 does not detect the substrate S at the time of recovery from an abnormality, the CPU 71 carries in and clamps a new substrate S in the same way as when the substrate is not recovered from the error, that is, in normal times. and performs substrate height measurement processing.
S110で基板検知センサ37が基板Sを検知している場合、CPU71は、基板保持装置30を制御して基板Sをクランプして保持する(S230)。そして、CPU71は、異常発生後からS230のクランプまでの間にカバー部材123の開閉が行われたか否かを判定する(S235)。S235において、CPU71は、異常発生時からS230までの間にカバー開閉センサ123aがカバー部材123が開いたことを一度でも検知した場合には肯定判定を行い、カバー部材123が開いたことを一度も検知していない場合には否定判定を行う。S235で肯定判定を行った場合、CPU71は、S140以降の処理を行って実装準備ルーチンを終了する。ここで、S110で基板Sが検知されていても、異常発生時からS230のクランプまでの間にカバー部材123が開いた場合には、作業者が基板Sにアクセスして基板Sが異常発生直前とは別の基板Sに交換された可能性がある。そこで、CPU71は、S235で肯定判定を行った場合は、S230でクランプした基板Sについて改めてS140で基板高さ測定処理を実行し、S160で測定結果をストレージ73に記憶する。
If the substrate detection sensor 37 detects the substrate S in S110, the CPU 71 controls the substrate holding device 30 to clamp and hold the substrate S (S230). Then, the CPU 71 determines whether the cover member 123 has been opened or closed between the occurrence of the abnormality and the clamping in S230 (S235). In S235, the CPU 71 makes an affirmative determination if the cover opening/closing sensor 123a detects that the cover member 123 has been opened even once between the occurrence of the abnormality and S230, and determines that the cover member 123 has never been opened. If it is not detected, a negative determination is made. If an affirmative determination is made in S235, the CPU 71 performs the processes from S140 onwards and ends the mounting preparation routine. Here, even if the board S is detected in S110, if the cover member 123 is opened between the time the abnormality occurs and the clamping in S230, the operator accesses the board S and the board S is detected immediately before the abnormality occurs. There is a possibility that the board S was replaced with a different one. Therefore, when the CPU 71 makes an affirmative determination in S235, the CPU 71 executes the substrate height measurement process again in S140 for the substrate S clamped in S230, and stores the measurement result in the storage 73 in S160.
一方、S235で否定判定を行った場合には、CPU71は、S140の基板高さ測定処理の代わりに、複数の測定点A1~A9の一部である代表点において基板高さの測定を行うよう測距センサ60を制御する代表点測定処理を行う(S240)。ここで、S130で基板SをクランプするとS140の基板高さ測定処理が行われるから、異常からの復帰時に既に基板Sが存在し(S110で肯定判定)、且つ、異常発生時からS230までの間にカバー開閉センサ123aがカバー部材123が開いたことを一度も検知していない場合(S235で否定判定)には、S230でクランプした基板Sは、既にS140の基板高さ測定処理が行われた基板Sであると判断できる。すなわち、S230のクランプは、S140の基板高さ測定処理が行われた基板Sと同一の基板Sの再クランプであると判断できる。そこで、S110で肯定判定且つS235で否定判定の場合には、CPU71は、複数の測定点A1~A9の全てについての基板高さ測定を行わず、まず代表点における基板高さの測定を行う。代表点は、複数の測定点A1~A9の一部であればよいが、2点以上とすることが好ましく、3点以上とすることがより好ましい。また、代表点は、複数の測定点A1~A9のうち互いの距離が最も遠い2点を含むことが好ましい。本実施形態では、代表点は、測定点A1~A9のうち基板Sの中央に最も近い測定点A5と、測定点A1~A9のうち互いの距離が最も遠い測定点A1,A9と、の3点とした。本実施形態では測定点A1~A9のうち測定点A3,A7も互いの距離が最も遠い2点であるため、測定点A1,A9の代わりに測定点A3,A7を代表点に含めてもよい。代表点測定処理は、測定点A1~A9のうち代表点のみについて基板高さを測定すること以外は、S140と同様に行うことができる。代表点測定処理は、基板高さ測定処理に比して測定点の数が少ないため、短時間で行うことができる。
On the other hand, when a negative determination is made in S235, the CPU 71 instructs the CPU 71 to measure the substrate height at a representative point that is a part of the plurality of measurement points A1 to A9 instead of performing the substrate height measurement process in S140. A representative point measurement process is performed to control the distance measurement sensor 60 (S240). Here, when the substrate S is clamped in S130, the substrate height measurement process in S140 is performed, so the substrate S is already present at the time of recovery from the abnormality (affirmative determination in S110), and the period from the occurrence of the abnormality to S230 is If the cover opening/closing sensor 123a has never detected that the cover member 123 has been opened (negative determination in S235), the substrate S clamped in S230 has already been subjected to the substrate height measurement process in S140. It can be determined that it is the substrate S. That is, it can be determined that the clamping in S230 is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process in S140 was performed. Therefore, in the case of an affirmative determination in S110 and a negative determination in S235, the CPU 71 does not measure the substrate height at all of the plurality of measurement points A1 to A9, but first measures the substrate height at the representative point. The representative point may be a part of the plurality of measurement points A1 to A9, but preferably two or more points, more preferably three or more points. Further, it is preferable that the representative points include two points that are the farthest from each other among the plurality of measurement points A1 to A9. In this embodiment, the representative points are the measurement point A5 which is the closest to the center of the substrate S among the measurement points A1 to A9, and the measurement points A1 and A9 which are the farthest from each other among the measurement points A1 to A9. It was marked as a point. In this embodiment, measurement points A3 and A7 among measurement points A1 to A9 are also the two points that are the farthest from each other, so measurement points A3 and A7 may be included in the representative points instead of measurement points A1 and A9. . The representative point measurement process can be performed in the same manner as S140, except that the substrate height is measured only at the representative point among the measurement points A1 to A9. The representative point measurement process can be performed in a short time because the number of measurement points is smaller than that in the substrate height measurement process.
S230の後、CPU71は、S240の代表点測定処理の測定結果と、直近のS140の基板高さ測定処理における代表点と同じ測定点の測定結果と、の相違が許容範囲内であるか否かを判定する(S245)。例えば、CPU71は、以下のようにS245の判定を行う。まず、直近のS140で測定されてストレージ73に記憶された、代表点と同じ測定点A1,A5,A9の測定結果をそれぞれ基板高さa1,a5,a9とし、これらをまとめて測定結果aとする。S240で測定された代表点すなわち測定点A1,A5,A9の測定結果をそれぞれ基板高さb1,b5,b9とし、これらをまとめて測定結果bとする。この場合、S245では、CPU71は、基板高さa1と基板高さb1との相違(例えば両者の差又は比)が所定の許容範囲内であるか否かを判定する。同様に基板高さa5と基板高さb5との相違、基板高さa9と基板高さb9との相違についても許容範囲内であるか否かを判定する。そして、CPU71は、基板高さb1,b5,b9のいずれも基板高さa1,a5,a9との相違が許容範囲内であった場合には、測定結果bと測定結果aとの相違が許容範囲内であるとしてS245で肯定判定を行う。基板高さb1,b5,b9のいずれか1以上について許容範囲外であった場合には、CPU71は測定結果bと測定結果aとの相違が許容範囲内でないとしてS245で否定判定を行う。
After S230, the CPU 71 determines whether the difference between the measurement result of the representative point measurement process of S240 and the measurement result of the same measurement point as the representative point in the most recent board height measurement process of S140 is within an allowable range. is determined (S245). For example, the CPU 71 makes the determination in S245 as follows. First, the measurement results of the measurement points A1, A5, and A9, which are the same as the representative points and which were measured in the most recent S140 and stored in the storage 73, are set as the substrate heights a1, a5, and a9, respectively, and these are collectively referred to as the measurement result a. do. The measurement results at the representative points, that is, the measurement points A1, A5, and A9 measured in S240 are defined as substrate heights b1, b5, and b9, respectively, and these are collectively defined as the measurement result b. In this case, in S245, the CPU 71 determines whether the difference between the substrate height a1 and the substrate height b1 (for example, the difference or ratio between them) is within a predetermined allowable range. Similarly, it is determined whether the difference between the substrate height a5 and the substrate height b5 and the difference between the substrate height a9 and the substrate height b9 are within the allowable range. Then, if the difference between the board heights b1, b5, and b9 from the board heights a1, a5, and a9 is within the allowable range, the CPU 71 determines that the difference between the measurement result b and the measurement result a is acceptable. It is determined that it is within the range, and an affirmative determination is made in S245. If any one or more of the substrate heights b1, b5, and b9 is outside the allowable range, the CPU 71 determines that the difference between the measurement result b and the measurement result a is not within the allowable range, and makes a negative determination in S245.
S245で否定判定を行った場合、CPU71は、複数の測定点A1~A9のうち代表点以外の残りの測定点(ここでは測定点A2~A4,A6~A8)の基板高さを測定し(S250)、S240及びS250の測定結果をストレージ73に記憶して(S260)、実装準備ルーチンを終了する。すなわち、CPU71は、S230でクランプした基板SについてS240及びS250で複数の測定点A1~A9の全てについて基板高さを測定することで、S140の基板高さ測定処理と同じ処理を改めて行う。CPU71は、S260において、直近のS160で記憶された測定結果が存在する場合には、その測定結果をS240及びS250の測定結果で上書き(更新)する。そのため、S260の実行に続いて実行(開始又は再開)される実装処理ルーチンでは、CPU71は、S240及びS250の測定結果を利用して実装ヘッド50に部品Pの実装を行わせる。
If a negative determination is made in S245, the CPU 71 measures the substrate heights of the remaining measurement points (here, measurement points A2 to A4, A6 to A8) other than the representative point among the plurality of measurement points A1 to A9 ( S250), the measurement results of S240 and S250 are stored in the storage 73 (S260), and the mounting preparation routine is ended. That is, the CPU 71 re-performs the same process as the substrate height measurement process in S140 by measuring the substrate height at all of the plurality of measurement points A1 to A9 in S240 and S250 for the substrate S clamped in S230. In S260, if there is a measurement result stored in the most recent S160, the CPU 71 overwrites (updates) the measurement result with the measurement result in S240 and S250. Therefore, in the mounting processing routine that is executed (started or restarted) following the execution of S260, the CPU 71 causes the mounting head 50 to mount the component P using the measurement results of S240 and S250.
一方、S245で肯定判定を行った場合、CPU71は、複数の測定点A1~A9のうち代表点以外の残りの測定点(ここでは測定点A2~A4,A6~A8)の基板高さの測定は省略し、S240の測定結果bのストレージ73への記憶も行わずに、実装準備ルーチンを終了する。この場合、CPU71は、続いて実行(開始又は再開)される実装処理ルーチンでは、S240の測定結果bは利用せず直近のS160の測定結果を利用して実装ヘッド50に部品Pの実装を行わせる。なお、上述したS245の判定に用いる許容範囲は、S240ではなく直近のS160の測定結果を利用して実装高さを算出しても部品Pの実装に問題が生じないような測定結果aと測定結果bとの相違の許容範囲として、予め設定されてストレージ73又はストレージ83に記憶されている。
On the other hand, when an affirmative determination is made in S245, the CPU 71 measures the substrate height at the remaining measurement points (here, measurement points A2 to A4, A6 to A8) other than the representative point among the plurality of measurement points A1 to A9. is omitted, and the mounting preparation routine is ended without storing the measurement result b in the storage 73 in S240. In this case, in the mounting processing routine that is subsequently executed (started or restarted), the CPU 71 mounts the component P on the mounting head 50 using the most recent measurement result of S160 without using the measurement result b of S240. let Note that the tolerance range used for the determination in S245 mentioned above is the measurement result a that does not cause any problem in mounting the component P even if the mounting height is calculated using the measurement result of the most recent S160 instead of S240. The allowable range of difference from result b is set in advance and stored in storage 73 or storage 83.
ここで、本実施形態の構成要素と本開示の構成要素との対応関係を明らかにする。本実施形態の実装ヘッド50が本開示の作業部に相当し、基板保持装置30が基板保持部に相当し、測距センサ60が高さ測定部に相当し、制御装置70が制御部に相当する。
Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The mounting head 50 of this embodiment corresponds to a working part of the present disclosure, the substrate holding device 30 corresponds to a substrate holding part, the distance measuring sensor 60 corresponds to a height measuring part, and the control device 70 corresponds to a control part. do.
以上詳述した本実施形態の部品実装機10によれば、制御装置70は、基板保持装置30に保持された基板S上の所定の複数の測定点A1~A9において基板高さの測定を行うよう測距センサ60を制御する基板高さ測定処理を行う。また、制御装置70は、基板高さ測定処理が行われた基板Sを基板保持装置30が再度保持した場合(ここではS110で肯定判定し且つS235で否定判定した場合)には、所定の複数の測定点A1~A9の一部である代表点(測定点A1,A5,A9)において基板高さの測定を行うよう測距センサ60を制御する代表点測定処理を行う。そして、制御装置70は、代表点測定処理の測定結果bと基板高さ測定処理における代表点と同じ測定点の測定結果aとの相違が許容範囲内である場合には、所定の複数の測定点A1~A9のうち代表点以外の測定点の基板高さの測定を省略する。これにより、基板高さ測定処理が行われた基板Sと同一の基板Sを基板保持装置30が再クランプした場合であっても所定の複数の測定点A1~A9の全てにおいて改めて基板高さの測定を行う場合と比べて、基板高さの測定を効率よく行うことができる。
According to the component mounting machine 10 of the present embodiment described in detail above, the control device 70 measures the substrate height at a plurality of predetermined measurement points A1 to A9 on the substrate S held by the substrate holding device 30. Then, a substrate height measurement process is performed to control the distance measurement sensor 60. Further, when the substrate holding device 30 again holds the substrate S on which the substrate height measurement process has been performed (here, when an affirmative determination is made in S110 and a negative determination is made in S235), the control device 70 controls a predetermined plurality of Representative point measurement processing is performed to control the distance sensor 60 to measure the substrate height at representative points (measurement points A1, A5, A9) that are part of the measurement points A1 to A9. Then, if the difference between the measurement result b of the representative point measurement process and the measurement result a of the same measurement point as the representative point in the substrate height measurement process is within an allowable range, the control device 70 performs a plurality of predetermined measurements. The measurement of the substrate height at measurement points other than the representative points among points A1 to A9 is omitted. As a result, even if the substrate holding device 30 re-clamps the same substrate S as the one on which the substrate height measurement process was performed, the substrate height can be measured again at all of the plurality of predetermined measurement points A1 to A9. The height of the substrate can be measured more efficiently than when the measurement is performed.
さらに、制御装置70は、測定結果bと測定結果aとの相違が許容範囲内である場合には、代表点測定処理の測定結果を利用せず基板高さ測定処理の測定結果を利用して実装ヘッド50に部品Pの実装を行わせる。また、制御装置70は、測定結果bと測定結果aとの相違が許容範囲外である場合には、所定の複数の測定点A1~A9のうち代表点測定処理で使用していない以外の残りの測定点(測定点A2~A4,A6~A8)の基板高さの測定を行い、この残りの測定点の測定結果及び代表点測定処理の測定結果を利用して実装ヘッド50に部品Pの実装を行わせる。これにより、代表点測定処理の測定結果と、基板高さ測定処理の測定結果とを混在させて用いる場合と比較して、より適切に基板高さの測定結果を利用して実装ヘッド50に部品Pの実装を行わせることができる。
Further, if the difference between the measurement result b and the measurement result a is within the allowable range, the control device 70 uses the measurement result of the substrate height measurement process without using the measurement result of the representative point measurement process. The mounting head 50 is caused to mount the component P. In addition, if the difference between the measurement result b and the measurement result a is outside the allowable range, the control device 70 controls the remaining measurement points A1 to A9 other than those not used in the representative point measurement process. Measure the board height at the measurement points (measurement points A2 to A4, A6 to A8), and use the measurement results of the remaining measurement points and the measurement results of the representative point measurement process to place the component P on the mounting head 50. Let implementation take place. As a result, compared to the case where the measurement results of the representative point measurement process and the measurement results of the board height measurement process are used together, the board height measurement results can be used more appropriately to attach the component to the mounting head 50. It is possible to implement P.
そして、制御装置70は、基板保持装置30が基板Sを前回保持し且つ基板高さ測定処理が行われてから基板保持装置30が基板Sを今回保持するまでの間に作業者が基板Sにアクセスしていないとみなせる場合(S110で肯定判定し且つS235で否定判定した場合)には、基板高さ測定処理が行われた基板Sを基板保持装置30が再度保持したと判定する、すなわちS230のクランプがS140の基板高さ測定処理が行われた基板Sと同一の基板Sの再クランプであると判定する。こうすれば、基板検知センサ37及びカバー開閉センサ123aを用いて、S230のクランプが基板高さ測定処理が行われた基板Sと同一の基板Sの再クランプであるか否かを判定できる。また、例えば異常発生時から異常の復帰(及びS230のクランプまで)の間に作業者が基板Sにアクセスしたか否かを基板検知センサ37及びカバー開閉センサ123aに基づいて推定することができる。なお、異常が発生しても作業者が基板Sにアクセスしない場合としては、例えば図6の実装準備ルーチンを実行している部品実装機10とは異なる装置、例えば実装システム1に含まれる他の部品実装機10における異常の発生時が挙げられる。
Then, the control device 70 determines that the operator holds the substrate S between the time when the substrate holding device 30 held the substrate S last time and the substrate height measurement processing was performed until the substrate holding device 30 holds the substrate S this time. If it can be considered that the access has not been made (if an affirmative determination is made in S110 and a negative determination is made in S235), it is determined that the substrate holding device 30 has re-held the substrate S on which the substrate height measurement process was performed, that is, in S230. It is determined that the clamping is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process of S140 was performed. In this way, using the substrate detection sensor 37 and the cover opening/closing sensor 123a, it can be determined whether the clamping in S230 is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process was performed. Further, for example, it is possible to estimate whether or not the operator has accessed the substrate S between the occurrence of the abnormality and the recovery from the abnormality (and until the clamping in S230) based on the substrate detection sensor 37 and the cover opening/closing sensor 123a. Note that if the operator does not access the board S even if an abnormality occurs, for example, a device other than the component mounter 10 that is executing the mounting preparation routine of FIG. 6, for example, another device included in the mounting system 1 An example of this is when an abnormality occurs in the component mounting machine 10.
また、代表点は、所定の複数の測定点A1~A9のうち互いの距離が最も遠い2点である測定点A1,A9を含んでいる。これにより、基板Sの高さに関してより代表的な2点が代表点に含まれる。したがって、代表点の測定結果bに基づく上述した許容範囲内か否かの判定によって、基板高さ測定処理時と代表点測定処理時との基板Sの状態の相違が許容範囲内か否かをより適切に判定できる。
Furthermore, the representative points include measurement points A1 and A9, which are the two points that are the farthest from each other among the plurality of predetermined measurement points A1 to A9. As a result, two more representative points regarding the height of the substrate S are included in the representative points. Therefore, by determining whether or not it is within the above-mentioned allowable range based on the measurement result b of the representative point, it is possible to determine whether the difference in the state of the board S between the board height measurement process and the representative point measurement process is within the allowable range. More appropriate judgment can be made.
なお、本発明は上述した実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。
It goes without saying that the present invention is not limited to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention.
例えば、上述した実施形態では、CPU71は、S110で肯定判定し且つS235で否定判定した場合に、基板保持装置30が基板Sを前回保持し且つ基板高さ測定処理が行われてから基板保持装置30が基板Sを今回保持するまでの間に作業者が基板Sにアクセスしていないとみなして、S230が同一の基板Sの再クランプである(基板高さ測定処理が行われた基板Sを基板保持装置30が再度保持した)と判定したが、これに限られない。例えば、制御装置70は、マークカメラ55(読取部の一例)が読み取った基板Sの識別情報に基づいて、S230が同一の基板Sの再クランプである(基板高さ測定処理が行われた基板Sを基板保持装置30が再度保持した)か否かを判定してもよい。図8は、変形例の実装準備ルーチンの一例を示すフローチャートである。図8では、図6と同じ処理については同じステップ番号を付して詳細な説明を省略する。図8の実装準備ルーチンでは、CPU71は、S130で基板Sをクランプした後、S140の基板高さ測定処理を行う前に、基板Sにバーコードなどの形で付された識別情報を取得する(S332)。例えば、CPU71は、X軸モータ46及びY軸モータ48を制御して基板Sに付された図示しない識別情報の上方にマークカメラ55を移動させて識別情報を撮像させることで、基板Sの識別情報を取得してストレージ73に記憶する。S332はS140の後に行ってもよい。また、CPU71は、S160においてS332の識別情報とS140の測定結果とを対応付けて記憶することが好ましい。また、CPU71は、S230の後にもS332と同様に基板Sの識別情報を取得する(S432)。そして、CPU71は、S432の後に、前回のクランプ時(例えば直近のS332)に取得した基板Sの識別情報とS432で今回取得した基板Sの識別情報とが同一か否かを判定する(S435)。これにより、CPU71は、S230が同一の基板Sの再クランプである(基板高さ測定処理が行われた基板Sを基板保持装置30が再度保持した)か否かを判定できる。そして、CPU71は、S435で否定判定を行った場合はS140以降の処理を行い、S435で肯定判定を行った場合はS240以降の処理を行う。この図8の実装準備ルーチンでは、基板高さ測定処理が行われた基板Sを基板保持装置30が再度保持したか否か、言い換えると、今回基板保持装置30が保持した基板Sが基板高さ測定処理が既に行われた基板Sと同一であるか否かを、基板Sの識別情報に基づいて適切に判定できる。なお、図8のS260においても、S160と同様に、S432の識別情報とS240及びS250の測定結果とを対応付けて記憶することが好ましい。S160及びS260において識別情報と測定結果とを対応付けて記憶しておくことで、CPU71は、S435の判定時に、直近のS332で取得された識別情報とS432で取得された識別情報とが同一か否かを判定するだけでなく、S432で取得した識別情報と同一の識別情報に対応する測定結果が既にストレージ73に記憶されているか否かも調べることができる。これにより、CPU71は、S230でクランプされた基板SがS140の基板高さ測定処理が既に行われた基板Sであるか否かをS435でより確実に判定できる。なお、図8のS332の後、且つS140の前に、S435と同様に前回のクランプ時に取得した基板Sの識別情報と今回取得した基板Sの識別情報とが同一か否かを判定して、否定判定を行った場合はS140以降の処理を行い、肯定判定を行った場合はS240以降の処理を行ってもよい。すなわち、異常からの復帰時(S100で肯定判定)であるか否かに関わらず、基板Sをクランプして基板Sの識別情報を取得した後に、今回のクランプが同一の基板Sの再クランプであるか否かを判定してもよい。
For example, in the embodiment described above, when the CPU 71 makes an affirmative determination in S110 and a negative determination in S235, the CPU 71 determines whether the substrate holding device 30 has held the substrate S last time and the substrate height measurement process has been performed. S230 re-clamps the same board S, assuming that the operator has not accessed the board S until S30 holds the board S this time. Although it was determined that the substrate holding device 30 held the substrate again, the present invention is not limited to this. For example, based on the identification information of the substrate S read by the mark camera 55 (an example of a reading unit), the control device 70 determines that S230 is re-clamping of the same substrate S (a substrate on which the substrate height measurement process has been performed). It may be determined whether the substrate holding device 30 has held S again. FIG. 8 is a flowchart illustrating an example of a modified implementation preparation routine. In FIG. 8, the same steps as those in FIG. 6 are given the same step numbers, and detailed explanations are omitted. In the mounting preparation routine of FIG. 8, after the CPU 71 clamps the board S in S130 and before performing the board height measurement process in S140, the CPU 71 acquires identification information attached to the board S in the form of a bar code or the like ( S332). For example, the CPU 71 controls the X-axis motor 46 and the Y-axis motor 48 to move the mark camera 55 above identification information (not shown) attached to the board S to image the identification information, thereby identifying the board S. The information is acquired and stored in the storage 73. S332 may be performed after S140. Further, it is preferable that the CPU 71 stores the identification information in S332 and the measurement result in S140 in association with each other in S160. Further, the CPU 71 obtains the identification information of the board S after S230 as well as in S332 (S432). After S432, the CPU 71 determines whether the identification information of the board S acquired during the previous clamping (for example, the most recent S332) and the identification information of the board S acquired this time in S432 are the same (S435). . Thereby, the CPU 71 can determine whether S230 is re-clamping of the same substrate S (the substrate holding device 30 has held the substrate S again after the substrate height measurement process). Then, when the CPU 71 makes a negative determination in S435, the CPU 71 performs the processes from S140 onwards, and when it makes an affirmative determination in S435, it performs the processes from S240 onwards. In the mounting preparation routine of FIG. 8, it is determined whether or not the substrate holding device 30 has held the substrate S on which the substrate height measurement process has been performed again. Based on the identification information of the substrate S, it can be appropriately determined whether the substrate S is the same as the substrate S on which the measurement process has already been performed. Note that in S260 of FIG. 8 as well, similarly to S160, it is preferable that the identification information of S432 and the measurement results of S240 and S250 are stored in association with each other. By storing the identification information and the measurement results in association in S160 and S260, the CPU 71 determines whether the identification information acquired in the most recent S332 and the identification information acquired in S432 are the same at the time of determination in S435. In addition to determining whether or not the measurement result is the same, it is also possible to check whether the measurement result corresponding to the same identification information as the identification information acquired in S432 has already been stored in the storage 73. Thereby, the CPU 71 can more reliably determine in S435 whether the substrate S clamped in S230 is the substrate S on which the substrate height measurement process in S140 has already been performed. Note that after S332 in FIG. 8 and before S140, similarly to S435, it is determined whether the identification information of the substrate S acquired during the previous clamping and the identification information of the substrate S acquired this time are the same, If a negative determination is made, the process from S140 onwards may be performed, and if a positive determination is made, the process from S240 onwards may be performed. In other words, regardless of whether or not it is the time of recovery from an abnormality (affirmative determination in S100), after the board S is clamped and the identification information of the board S is acquired, the current clamp is a re-clamp of the same board S. It may be determined whether or not there is one.
上述した実施形態のS110において、CPU71は、異常発生時の基板保持装置30のクランプの解除から現在までの間に基板検知センサ37が基板Sを継続して検知していたか否かを判定してもよい。この場合、CPU71は、S110で肯定判定の場合にはS230及びS240を行ってS245以降の処理を行い、S110で否定判定の場合にはS130以降の処理を行ってもよい。ここで、異常発生時の基板保持装置30のクランプの解除から現在までの間に基板検知センサ37が基板Sを継続して検知していた場合には、基板保持装置30が基板Sを前回保持し且つ基板高さ測定処理が行われてから作業者が基板Sにアクセスしていないとみなすことができる。そのため、このようにしてS110の判定を行うことで、S235とは異なる手法で作業者が基板Sにアクセスしたか否かを推定することができる。
In S110 of the embodiment described above, the CPU 71 determines whether or not the substrate detection sensor 37 has continuously detected the substrate S from the time when the clamp of the substrate holding device 30 was released when the abnormality occurred until now. Good too. In this case, the CPU 71 may perform S230 and S240 and perform the processes from S245 onwards if the determination is positive in S110, and may perform the processes from S130 onwards in the case of a negative determination in S110. Here, if the substrate detection sensor 37 has continuously detected the substrate S from the release of the clamp of the substrate holding device 30 at the time of abnormality occurrence until now, the substrate holding device 30 holds the substrate S last time. In addition, it can be assumed that the operator has not accessed the substrate S since the substrate height measurement process was performed. Therefore, by making the determination in S110 in this manner, it is possible to estimate whether or not the operator has accessed the board S using a method different from that in S235.
上述した実施形態では、S245で測定結果bと測定結果aとの相違が許容範囲内である場合には、代表点測定処理の測定結果を利用せず基板高さ測定処理の測定結果を利用して実装ヘッド50に部品Pの実装を行わせたが、これに限られない。例えば、CPU71は、S245で肯定判定を行った場合に、直近のS160でストレージ73に記憶した測定結果のうち代表点と同じ測定点A1,A5,A9の基板高さについて、S240の測定結果bで上書き(更新)してもよい。この場合、続いて行われる実装処理ルーチンでは、代表点測定処理の測定結果と基板高さ測定処理の測定結果とを混在させて利用することになる。こうしても、CPU71が測定結果に基づいて実装高さを導出することはできる。
In the embodiment described above, if the difference between the measurement result b and the measurement result a is within the allowable range in S245, the measurement result of the substrate height measurement process is used instead of the measurement result of the representative point measurement process. Although the mounting head 50 is used to mount the component P, the present invention is not limited thereto. For example, when the CPU 71 makes an affirmative determination in S245, the CPU 71 selects the measurement results b in S240 for the board heights at measurement points A1, A5, and A9, which are the same as the representative points, among the measurement results stored in the storage 73 in the most recent S160. You can overwrite (update) it with . In this case, in the subsequent mounting processing routine, the measurement results of the representative point measurement process and the measurement results of the board height measurement process are mixed and used. Even in this case, the CPU 71 can derive the mounting height based on the measurement results.
上述した実施形態では、所定の複数の測定点は図7に示す測定点A1~A9としたが、これに限られない。複数の測定点の数は9個以外の数でもよいし、複数の測定点が等間隔でなくともよいし、格子状でなくともよい。また、代表点は、複数の測定点のうち互いを結んだ線とX軸(基板Sの搬送方向)とのなす角が最も45度に近い2点を含んでいてもよい。
In the embodiment described above, the predetermined plurality of measurement points are the measurement points A1 to A9 shown in FIG. 7, but the measurement points are not limited thereto. The number of the plurality of measurement points may be other than nine, the plurality of measurement points may not be equally spaced, and may not be in the form of a grid. Further, the representative points may include two points where the angle between the line connecting each other and the X axis (transfer direction of the substrate S) is closest to 45 degrees among the plurality of measurement points.
上述した実施形態において、代表点は、所定の複数の測定点のうち基板高さ測定処理の測定結果において所定の基準高さとの相違が最も大きい測定点を含んでいてもよい。例えば、図6の実装準備ルーチンのS140の後又はS240の前などのタイミングにおいて、CPU71は、直近のS140の基板高さ測定処理の測定結果と所定の基準高さとを比較して、測定点A1~A9のうち測定された基板高さと所定の基準高さとの相違が最も大きい測定点を特定してもよい。そして、CPU71は、S240において、上述した実施形態における測定点A1,A5,A9に加えて又は代えて、特定された基準高さとの相違が最も大きい測定点を代表点に含めて、代表点測定処理を行ってもよい。所定の基準高さは、例えば基板保持装置30に保持された基板Sに反りなどの変形が生じていない場合の基板高さ(正常な基板Sの基板高さ)としてもよい。このような基準高さは、例えば基板保持装置30に基準となる高さに合わせてあらかじめ基準ブロックを設けておきCPU71が測距センサ60にこの基準ブロックの高さを測定させて算出してもよいし、生産プログラムに含まれる基板Sの厚さに基づいてCPU71が算出してもよい。あるいは、所定の基準高さは、直近の基板高さ測定処理で測定された所定の複数の測定点の基板高さの平均値としてもよい。所定の基準高さを正常な基板Sの基板高さ又は所定の複数の測定点の基板高さの平均値とする場合、この基準高さとの相違が最も大きい測定点は、基板Sの反りなどの変形状態を最も反映しているから、代表点に適している。
In the embodiment described above, the representative point may include a measurement point that has the largest difference from a predetermined reference height in the measurement results of the substrate height measurement process among the plurality of predetermined measurement points. For example, at a timing such as after S140 or before S240 of the mounting preparation routine in FIG. ~A9, a measurement point where the difference between the measured substrate height and a predetermined reference height is the largest may be specified. Then, in S240, in addition to or instead of the measurement points A1, A5, and A9 in the above-described embodiment, the CPU 71 includes the measurement point having the largest difference from the specified reference height as the representative points, and performs representative point measurement. Processing may be performed. The predetermined reference height may be, for example, the substrate height (normal substrate height of the substrate S) when the substrate S held by the substrate holding device 30 is not deformed such as warping. Such a reference height can be calculated by, for example, providing a reference block in advance on the substrate holding device 30 in accordance with the reference height, and then having the CPU 71 measure the height of the reference block using the distance measuring sensor 60. Alternatively, the CPU 71 may calculate it based on the thickness of the substrate S included in the production program. Alternatively, the predetermined reference height may be an average value of the substrate heights at a plurality of predetermined measurement points measured in the most recent substrate height measurement process. When the predetermined reference height is set as the board height of a normal board S or the average value of the board heights of a plurality of predetermined measurement points, the measurement point with the largest difference from this reference height is the one due to warpage of the board S, etc. It is suitable as a representative point because it best reflects the deformation state of .
上述した実施形態では、測距センサ60はレーザー光を用いたレーザー高さセンサとしたが、これに限らず基板高さを測定できればどのようなセンサを用いてもよい。例えば、接触式の高さセンサや超音波式の高さセンサを用いてもよい。
In the embodiment described above, the distance measuring sensor 60 is a laser height sensor that uses laser light, but the sensor is not limited to this, and any sensor may be used as long as it can measure the substrate height. For example, a contact height sensor or an ultrasonic height sensor may be used.
上述した実施形態では、XYロボット40が実装ヘッド50及び測距センサ60を共に移動させたが、これに限られない。例えば、部品実装機10は実装ヘッド50を移動させるヘッド移動部と測距センサ60を移動させる測定移動部とを別々に備えていてもよい。
In the embodiment described above, the XY robot 40 moves the mounting head 50 and the distance measurement sensor 60 together, but the present invention is not limited to this. For example, the component mounter 10 may separately include a head moving section that moves the mounting head 50 and a measurement moving section that moves the distance measurement sensor 60.
上述した実施形態では、実装ヘッド50は吸着ノズル51により部品Pを吸着して基板S上に実装したが、これに限られない。例えば、実装ヘッド50は、吸着ノズル51に代えて部品Pを挟持して保持するメカニカルチャックを有していてもよい。
In the embodiment described above, the mounting head 50 suctions the component P using the suction nozzle 51 and mounts it on the substrate S, but the present invention is not limited thereto. For example, the mounting head 50 may include a mechanical chuck that clamps and holds the component P instead of the suction nozzle 51.
上述した実施形態では、基板保持装置30は基板Sをクランプすることで保持したが、これに限られない。例えば、基板保持装置30は、基板Sを吸引して保持してもよい。
In the embodiment described above, the substrate holding device 30 holds the substrate S by clamping it, but the present invention is not limited to this. For example, the substrate holding device 30 may suck and hold the substrate S.
上述した実施形態では、本開示の対基板作業装置を部品実装機10に適用した場合について説明したが、これに限られない。例えば、本開示の対基板作業装置は、基板にはんだを印刷するはんだ印刷機や、基板に接着剤を塗布する接着剤塗布機、基板のこれらの作業結果を検査する検査機など、他のいかなる対基板作業装置に適用してもよい。
In the embodiment described above, a case has been described in which the board-to-board working device of the present disclosure is applied to the component mounting machine 10, but the present invention is not limited to this. For example, the board-related work device of the present disclosure may be any other type of machine, such as a solder printer that prints solder on a board, an adhesive applicator that applies adhesive to a board, or an inspection machine that inspects the results of these work on the board. It may also be applied to a board-facing work device.
本開示の対基板作業装置は、以下のように構成してもよい。
The substrate-to-board working device of the present disclosure may be configured as follows.
本開示の対基板作業装置において、前記制御部は、前記相違が前記許容範囲内である場合には、前記代表点測定処理における前記代表点の測定結果を利用せず前記基板高さ測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせ、前記相違が前記許容範囲外である場合には、前記所定の複数の測定点のうち前記代表点以外の残りの測定点の前記基板高さの測定を行い、前記残りの測定点の測定結果及び前記代表点測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせてもよい。こうすれば、代表点測定処理の測定結果と基板高さ測定処理の測定結果とを混在させて用いる場合と比較して、より適切に基板高さの測定結果を利用して対基板作業を行わせることができる。
In the board-to-board working device of the present disclosure, when the difference is within the allowable range, the control unit performs the board height measurement process without using the measurement result of the representative point in the representative point measurement process. The work unit is made to perform the board-facing work using the measurement results, and if the difference is outside the allowable range, the remaining measurement points other than the representative point among the plurality of predetermined measurement points are The height of the substrate may be measured, and the working unit may perform the substrate-facing work using the measurement results of the remaining measurement points and the measurement results of the representative point measurement process. In this way, the board height measurement results can be used more appropriately for board work compared to the case where the measurement results of the representative point measurement process and the measurement results of the board height measurement process are used together. can be set.
本開示の対基板作業装置は、前記基板から該基板の識別情報を読み取る読取部、を備え、前記制御部は、前記読取部が読み取った前記基板の識別情報に基づいて、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したか否かを判定してもよい。こうすれば、基板高さ測定処理が行われた基板を基板保持部が再度保持したか否か、言い換えると、今回基板保持部が保持した基板が基板高さ測定処理が既に行われた基板と同一であるか否かを、基板の識別情報に基づいて適切に判定できる。
The substrate working device of the present disclosure includes a reading section that reads identification information of the substrate from the substrate, and the control section measures the substrate height based on the identification information of the substrate read by the reading section. It may be determined whether the substrate holding unit holds the processed substrate again. In this way, it is possible to check whether the substrate holder has held the substrate again after the substrate height measurement process has been performed, or in other words, whether the substrate held by the substrate holder this time is the substrate on which the substrate height measurement process has already been performed. Whether or not they are the same can be appropriately determined based on the identification information of the boards.
本開示の対基板作業装置において、前記制御部は、前記基板保持部が前記基板を前回保持し且つ前記基板高さ測定処理が行われてから前記基板保持部が前記基板を今回保持するまでの間に作業者が該基板にアクセスしていないとみなせる場合には、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したと判定してもよい。
In the substrate-to-board working device of the present disclosure, the control unit is configured to control the process from when the substrate holding unit held the substrate last time and the substrate height measurement processing was performed until the substrate holding unit holds the substrate this time. If it can be assumed that the operator has not accessed the substrate during that time, it may be determined that the substrate holding unit has again held the substrate on which the substrate height measurement process was performed.
本開示の対基板作業装置において、前記代表点は、前記所定の複数の測定点のうち互いの距離が最も遠い2点を含んでいてもよい。こうすれば、基板の高さに関してより代表的な2点が代表点に含まれる。したがって、代表点の測定結果に基づく上述した許容範囲内か否かの判定によって、基板高さ測定処理時と代表点測定処理時との基板の状態の相違が許容範囲内か否かをより適切に判定できる。
In the substrate-to-board working device of the present disclosure, the representative points may include two points that are farthest from each other among the plurality of predetermined measurement points. In this way, two points that are more representative regarding the height of the substrate are included in the representative points. Therefore, by determining whether or not the above-mentioned tolerance is within the range based on the measurement result of the representative point, it is possible to more appropriately determine whether the difference in the state of the board between the board height measurement process and the representative point measurement process is within the tolerance range. It can be determined that
本開示の対基板作業装置において、前記代表点は、前記所定の複数の測定点のうち前記基板高さ測定処理の前記測定結果において所定の基準高さとの相違が最も大きい測定点を含んでいてもよい。
In the substrate-to-board working device of the present disclosure, the representative points include a measurement point having the largest difference from a predetermined reference height in the measurement result of the substrate height measurement process among the plurality of predetermined measurement points. Good too.
本明細書では、出願当初の請求項4において「請求項1又は2に記載の対基板作業装置」を「請求項1~3のいずれか1項に記載の対基板作業装置」に変更した技術思想、出願当初の請求項5において「請求項1又は2に記載の対基板作業装置」を「請求項1~4のいずれか1項に記載の対基板作業装置」に変更した技術思想、及び、出願当初の請求項6において「請求項1又は2に記載の対基板作業装置」を「請求項1~5のいずれか1項に記載の対基板作業装置」に変更した技術思想も開示されている。
In this specification, a technology in which the "board-to-board working device according to claim 1 or 2" in claim 4 originally filed is changed to "the board-to-board working device according to any one of claims 1 to 3" Thought, a technical thought in which the "board-to-board working device according to claim 1 or 2" in claim 5 at the time of filing was changed to "the board-to-board working device according to any one of claims 1 to 4," and Also disclosed is a technical concept in which "the board-facing working device according to claim 1 or 2" is changed to "the board-facing working device according to any one of claims 1 to 5" in claim 6 at the time of filing. ing.
本発明は、部品を基板に実装する作業などの対基板作業を行う各種産業に利用可能である。
The present invention can be used in various industries that perform board-to-board work such as mounting components on a board.
1 実装システム、10 部品実装機、11 基台、12 筐体、14 支持台、15 部品供給装置、20 基板搬送装置、22 サイドフレーム、24 コンベアベルト、30 基板保持装置、32 基板押さえプレート、34 クランパ、34a 突出部、35 支持プレート、35a 支持ピン、36 昇降装置、37 基板検知センサ、37a 投光部、37b 受光部、38 操作パネル、40 XYロボット、41 X軸ガイドレール、42 X軸スライダ、43 Y軸ガイドレール、44 Y軸スライダ、46 X軸モータ、47 X軸位置センサ、48 Y軸モータ、49 Y軸位置センサ、50 実装ヘッド、51 吸着ノズル、52 Z軸モータ、53 Z軸位置センサ、55 マークカメラ、58 パーツカメラ、60 測距センサ、61 照射部、62 検出部、70 制御装置、71 CPU、72 ROM、73 ストレージ、74 RAM、75 入出力インタフェース、76 バス、80 管理装置、81 CPU、82 ROM、83 ストレージ、84 RAM、85 入出力インタフェース、86 バス、87 入力デバイス、88 ディスプレイ、121 左側壁、121a 開口部、122 右側壁、122a 開口部、123 カバー部材、123a カバー開閉センサ、A1~A9 測定点、P 部品、S 基板。
1 Mounting system, 10 Component mounter, 11 Base, 12 Housing, 14 Support stand, 15 Component supply device, 20 Board transfer device, 22 Side frame, 24 Conveyor belt, 30 Board holding device, 32 Board holding plate, 34 Clamper, 34a protrusion, 35 support plate, 35a support pin, 36 lifting device, 37 board detection sensor, 37a light emitter, 37b light receiver, 38 operation panel, 40 XY robot, 41 X-axis guide rail, 42 X-axis slider , 43 Y-axis guide rail, 44 Y-axis slider, 46 X-axis motor, 47 X-axis position sensor, 48 Y-axis motor, 49 Y-axis position sensor, 50 Mounting head, 51 Suction nozzle, 52 Z-axis motor, 53 Z-axis Position sensor, 55 Mark camera, 58 Parts camera, 60 Distance sensor, 61 Irradiation unit, 62 Detection unit, 70 Control device, 71 CPU, 72 ROM, 73 Storage, 74 RAM, 75 Input/output interface, 76 Bus, 80 Management Device, 81 CPU, 82 ROM, 83 Storage, 84 RAM, 85 Input/output interface, 86 Bus, 87 Input device, 88 Display, 121 Left wall, 121a opening, 122 Right wall, 122a opening, 123 Cover member, 123a Cover open/close sensor, A1 to A9 measurement points, P parts, S board.
Claims (6)
- 基板に対して対基板作業を行う作業部と、
前記基板を保持する基板保持部と、
前記基板の基板高さを測定する高さ測定部と、
前記基板保持部に保持された前記基板上の所定の複数の測定点において前記基板高さの測定を行うよう前記高さ測定部を制御する基板高さ測定処理を行い、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持した場合には、前記所定の複数の測定点の一部である代表点において前記基板高さの測定を行うよう前記高さ測定部を制御する代表点測定処理を行い、前記代表点測定処理の測定結果と前記基板高さ測定処理における前記代表点と同じ測定点の測定結果との相違が許容範囲内である場合には、前記所定の複数の測定点のうち前記代表点以外の測定点の前記基板高さの測定を省略する制御部と、
を備えた対基板作業装置。 a working unit that performs board-to-board work on the board;
a substrate holding part that holds the substrate;
a height measurement unit that measures the substrate height of the substrate;
performing a substrate height measurement process that controls the height measurement unit to measure the substrate height at a plurality of predetermined measurement points on the substrate held by the substrate holding unit; When the substrate holder re-holds the substrate on which the measurement has been performed, the height measurement section is controlled to measure the substrate height at a representative point that is a part of the plurality of predetermined measurement points. If the difference between the measurement result of the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within an allowable range, then a control unit that omits measurement of the substrate height at measurement points other than the representative point among the plurality of measurement points;
A board-to-board working device equipped with - 前記制御部は、前記相違が前記許容範囲内である場合には、前記代表点測定処理の測定結果を利用せず前記基板高さ測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせ、前記相違が前記許容範囲外である場合には、前記所定の複数の測定点のうち前記代表点以外の残りの測定点の前記基板高さの測定を行い、前記残りの測定点の測定結果及び前記代表点測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせる、
請求項1に記載の対基板作業装置。 If the difference is within the allowable range, the control unit may cause the working unit to use the measurement result of the substrate height measurement process without using the measurement result of the representative point measurement process. If the difference is outside the allowable range, measure the substrate height at the remaining measurement points other than the representative point among the plurality of predetermined measurement points, and causing the work unit to perform the board-facing work using the measurement results of the points and the measurement results of the representative point measurement process;
The substrate-to-board working device according to claim 1. - 請求項1又は2に記載の対基板作業装置であって、
前記基板から該基板の識別情報を読み取る読取部、
を備え、
前記制御部は、前記読取部が読み取った前記基板の識別情報に基づいて、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したか否かを判定する、
対基板作業装置。 The board-to-board working device according to claim 1 or 2,
a reading unit that reads identification information of the board from the board;
Equipped with
The control unit determines whether the substrate holding unit holds the substrate again, which has undergone the substrate height measurement process, based on the identification information of the substrate read by the reading unit.
Board-to-board working device. - 前記制御部は、前記基板保持部が前記基板を前回保持し且つ前記基板高さ測定処理が行われてから前記基板保持部が前記基板を今回保持するまでの間に作業者が該基板にアクセスしていないとみなせる場合には、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したと判定する、
請求項1又は2に記載の対基板作業装置。 The control unit is configured to allow a worker to access the substrate between when the substrate holding unit held the substrate last time and the substrate height measurement process was performed until the substrate holding unit held the substrate this time. If it can be considered that the substrate height measurement process has not been performed, it is determined that the substrate holding unit has held the substrate again after the substrate height measurement process was performed.
The substrate-to-board working device according to claim 1 or 2. - 前記代表点は、前記所定の複数の測定点のうち互いの距離が最も遠い2点を含む、
請求項1又は2に記載の対基板作業装置。 The representative points include two points that are farthest from each other among the plurality of predetermined measurement points,
The substrate-to-board working device according to claim 1 or 2. - 前記代表点は、前記所定の複数の測定点のうち前記基板高さ測定処理の前記測定結果において所定の基準高さとの相違が最も大きい測定点を含む、
請求項1又は2に記載の対基板作業装置。 The representative point includes a measurement point having the largest difference from a predetermined reference height in the measurement result of the substrate height measurement process among the plurality of predetermined measurement points.
The substrate-to-board working device according to claim 1 or 2.
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JP2018160645A (en) * | 2017-03-24 | 2018-10-11 | パナソニックIpマネジメント株式会社 | Component mounting system and component mounting method |
WO2019171481A1 (en) * | 2018-03-07 | 2019-09-12 | 株式会社Fuji | Component mounting system |
WO2021152840A1 (en) * | 2020-01-31 | 2021-08-05 | 株式会社Fuji | Board working machine |
WO2022113241A1 (en) * | 2020-11-26 | 2022-06-02 | 株式会社Fuji | Mounting apparatus, mounting method, and method for measuring height of substrate |
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JP2018160645A (en) * | 2017-03-24 | 2018-10-11 | パナソニックIpマネジメント株式会社 | Component mounting system and component mounting method |
WO2019171481A1 (en) * | 2018-03-07 | 2019-09-12 | 株式会社Fuji | Component mounting system |
WO2021152840A1 (en) * | 2020-01-31 | 2021-08-05 | 株式会社Fuji | Board working machine |
WO2022113241A1 (en) * | 2020-11-26 | 2022-06-02 | 株式会社Fuji | Mounting apparatus, mounting method, and method for measuring height of substrate |
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