WO2024009506A1

WO2024009506A1 - Substrate working apparatus

Info

Publication number: WO2024009506A1
Application number: PCT/JP2022/027126
Authority: WO
Inventors: 通永大西; 康貴小坂井; 幸則中山; 真一藤井
Original assignee: 株式会社Fuji
Priority date: 2022-07-08
Filing date: 2022-07-08
Publication date: 2024-01-11

Abstract

A substrate working apparatus according to the present disclosure comprises a work unit that performs substrate work with respect to a substrate, a substrate-holding unit that holds the substrate, a height-measuring unit that measures the substrate height of the substrate, and a control unit. The control unit performs a substrate-height-measuring process of controlling the height-measuring unit so as to measure the substrate height at a predetermined plurality of measuring points on the substrate that is held by the substrate-holding unit, and, when the substrate for which the substrate-height-measuring process has been performed has been held by the substrate-holding unit again, performs a representative-points-measuring process of controlling the height-measuring unit so as to measure the substrate height at representative points, which are part of the plurality of measuring points. When a difference between the measurement results of the representative-points-measuring process and the measurement results of the substrate-height-measuring process at the same measuring points as the representative points is within an acceptable range, the control unit omits measuring of the substrate height at the measuring points other than the representative points among the predetermined plurality of measuring points.

Description

対基板作業装置Board-to-board work equipment

　本明細書では、対基板作業装置を開示する。 In this specification, a substrate-to-board working device is disclosed.

　従来、部品を基板に実装する作業などの対基板作業を行う対基板作業装置において、基板の高さを測定することが知られている。例えば、特許文献１には、上流の部品実装装置で計測した１枚目の基板Ｂ（１）の高さと下流の部品実装装置で計測した１枚目の基板Ｂ（１）の高さに基づいて、上流の部品実装装置と下流の部品実装装置の個体差に起因する差分データを算出することが記載されている。また、下流の部品実装装置では、２枚目の基板Ｂ（２）の高さを計測せず、上流の部品実装装置で計測した２枚目の基板Ｂ（２）の高さと、差分データと、に基づいて下流の部品実装装置における２枚目の基板Ｂ（２）の高さを予測することが記載されている。これにより、下流の部品実装装置における高さ計測を省略しつつ、基板Ｂに反りがあっても実装品質を確保して効率的に部品Ｐを実装できると記載されている。 Conventionally, it has been known to measure the height of a board in a board-to-board work device that performs board-to-board work such as mounting components on a board. For example, in Patent Document 1, there is a method based on the height of the first board B(1) measured by an upstream component mounting device and the height of the first board B(1) measured by a downstream component mounting device. It is described that difference data due to individual differences between an upstream component mounting apparatus and a downstream component mounting apparatus is calculated. In addition, the downstream component mounting equipment does not measure the height of the second board B (2), but uses the height of the second board B (2) measured by the upstream component mounting equipment and the difference data. It is described that the height of the second board B(2) in the downstream component mounting apparatus is predicted based on , . It is stated that this allows the component P to be efficiently mounted while ensuring the mounting quality even if the board B is warped, while omitting the height measurement in the downstream component mounting device.

特開２０１８－１６０６４５号公報Japanese Patent Application Publication No. 2018-160645

　ところで、対基板作業装置が基板を保持して基板の高さを測定した後、同一の対基板作業装置が同一の基板を再度保持する場合がある。この場合、基板を保持する毎に基板の高さを改めて測定すると、基板の処理時間が長くなるという問題があった。特許文献１では、同一の基板に対して下流の部品実装装置での高さ計測を省略する点が記載されているが、同一の対基板作業装置で同一の基板を再度保持する場合の高さ計測については記載されていない。 By the way, after the board-to-board working device holds a board and measures the height of the board, the same board-to-board working device may hold the same board again. In this case, if the height of the substrate is measured anew each time the substrate is held, there is a problem that the processing time for the substrate becomes longer. Patent Document 1 describes that height measurement for the same board in a downstream component mounting device is omitted; There is no mention of measurements.

　本開示は、上述した課題を解決するためになされたものであり、同一の基板を再度保持した場合の基板高さの測定を効率よく行うことを主目的とする。 The present disclosure has been made to solve the above-mentioned problems, and its main purpose is to efficiently measure the height of a substrate when the same substrate is held again.

　本開示は、上述した主目的を達成するために以下の手段を採った。 The present disclosure has taken the following measures to achieve the above-mentioned main objective.

　本開示の対基板作業装置は、
　基板に対して対基板作業を行う作業部と、
　前記基板を保持する基板保持部と、
　前記基板の基板高さを測定する高さ測定部と、
　前記基板保持部に保持された前記基板上の所定の複数の測定点において前記基板高さの測定を行うよう前記高さ測定部を制御する基板高さ測定処理を行い、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持した場合には、前記所定の複数の測定点の一部である代表点において前記基板高さの測定を行うよう前記高さ測定部を制御する代表点測定処理を行い、前記代表点測定処理の測定結果と前記基板高さ測定処理における前記代表点と同じ測定点の測定結果との相違が許容範囲内である場合には前記所定の複数の測定点のうち前記代表点以外の測定点の前記基板高さの測定を省略する制御部と、
　を備えたものである。 The board-to-board working device of the present disclosure includes:
a working unit that performs board-to-board work on the board;
a substrate holding part that holds the substrate;
a height measurement unit that measures the substrate height of the substrate;
performing a substrate height measurement process that controls the height measurement unit to measure the substrate height at a plurality of predetermined measurement points on the substrate held by the substrate holding unit; When the substrate holder re-holds the substrate on which the measurement has been performed, the height measurement section is controlled to measure the substrate height at a representative point that is a part of the plurality of predetermined measurement points. If the difference between the measurement result of the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within a permissible range, a control unit that omits the measurement of the substrate height at measurement points other than the representative point among the measurement points;
It is equipped with the following.

　この対基板作業装置では、基板高さ測定処理が行われた基板を基板保持部が再度保持した場合には、所定の複数の測定点の一部である代表点において基板高さの測定を行う代表点測定処理を行う。そして、代表点測定処理における代表点の測定結果と基板高さ測定処理における代表点と同じ測定点の測定結果との相違が許容範囲内であれば、所定の複数の測定点のうち代表点以外の測定点の基板高さの測定を省略する。そのため、基板高さ測定処理が行われた基板と同一の基板を基板保持部が再度保持した場合であっても所定の複数の測定点の全てにおいて改めて基板高さの測定を行う場合と比べて、基板高さの測定を効率よく行うことができる。 In this board-to-board working device, when the board holder re-holds a board that has been subjected to board height measurement processing, the board height is measured at a representative point that is part of a plurality of predetermined measurement points. Perform representative point measurement processing. If the difference between the measurement result of the representative point in the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within the allowable range, then the measurement results other than the representative point among the plurality of predetermined measurement points are The measurement of the substrate height at the measurement point is omitted. Therefore, even if the board holder re-holds the same board as the one on which the board height measurement process was performed, compared to the case where the board height is measured anew at all of a plurality of predetermined measurement points. , it is possible to efficiently measure the substrate height.

部品実装機１０を含む実装システム１の構成の概略を示す説明図。1 is an explanatory diagram schematically showing the configuration of a mounting system 1 including a component mounter 10. FIG. 部品実装機１０の筐体１２の内側を示す概略斜視図。FIG. 2 is a schematic perspective view showing the inside of a casing 12 of the component mounting machine 10. FIG. 基板搬送装置２０および基板保持装置３０の概略構成図。FIG. 3 is a schematic configuration diagram of a substrate transport device 20 and a substrate holding device 30. 基板保持装置３０が基板Ｓを保持する様子を示す説明図。FIG. 3 is an explanatory diagram showing how the substrate holding device 30 holds the substrate S. 制御装置７０の電気的な接続関係を示す説明図。FIG. 7 is an explanatory diagram showing the electrical connection relationship of the control device 70. 実装準備ルーチンの一例を示すフローチャート。5 is a flowchart showing an example of a mounting preparation routine. 基板高さの測定点Ａ１～Ａ９の一例を示す説明図。An explanatory diagram showing an example of substrate height measurement points A1 to A9. 変形例の実装準備ルーチンの一例を示すフローチャート。7 is a flowchart illustrating an example of a modified implementation preparation routine.

　本開示の対基板作業装置の一例である部品実装機の実施形態について図面を参照しながら以下に説明する。図１は本実施形態の部品実装機１０を含む実装システム１の構成の概略を示す構成図、図２は部品実装機１０の筐体１２の内側を示す概略斜視図、図３は基板搬送装置２０および基板保持装置３０の概略構成図、図４は基板保持装置３０が基板Ｓを保持する様子を示す説明図、図５は制御装置７０の電気的な接続関係を示す説明図である。図４Ａは基板保持装置３０が基板Ｓを保持していない状態を示し、図４Ｂは基板保持装置３０が基板Ｓを保持している状態を示す。本実施形態において、上下方向（Ｚ軸方向），左右方向（Ｘ軸方向）及び前後方向（Ｙ軸方向）は、図１～図４に示した通りとする。 An embodiment of a component mounting machine, which is an example of a board-related work device of the present disclosure, will be described below with reference to the drawings. FIG. 1 is a block diagram schematically showing the configuration of a mounting system 1 including a component mounter 10 of this embodiment, FIG. 2 is a schematic perspective view showing the inside of a casing 12 of the component mounter 10, and FIG. 3 is a board transfer device. 20 and the substrate holding device 30, FIG. 4 is an explanatory diagram showing how the substrate holding device 30 holds the substrate S, and FIG. 5 is an explanatory diagram showing the electrical connection relationship of the control device 70. 4A shows a state in which the substrate holding device 30 does not hold the substrate S, and FIG. 4B shows a state in which the substrate holding device 30 holds the substrate S. In this embodiment, the up-down direction (Z-axis direction), left-right direction (X-axis direction), and front-back direction (Y-axis direction) are as shown in FIGS. 1 to 4.

　実装システム１は、図１及び図２に示すように、部品実装機１０と、部品実装機１０を管理する管理装置８０と、を備える。実装システム１は、部品Ｐを基板Ｓに実装する複数台の部品実装機１０が基板Ｓの搬送方向（Ｘ軸方向）に沿って配置されている。図１では、説明の便宜のため部品実装機１０を１台のみ示している。なお、実装システム１は、部品実装機１０と同じ実装ライン上にはんだ印刷機や検査機、リフロー炉などを備えるものとしてもよい。 As shown in FIGS. 1 and 2, the mounting system 1 includes a component mounter 10 and a management device 80 that manages the component mounter 10. In the mounting system 1, a plurality of component mounting machines 10 for mounting components P onto a board S are arranged along the transport direction (X-axis direction) of the board S. In FIG. 1, only one component mounting machine 10 is shown for convenience of explanation. Note that the mounting system 1 may include a solder printing machine, an inspection machine, a reflow oven, etc. on the same mounting line as the component mounter 10.

　部品実装機１０は、図１及び図２に示すように、基台１１と、筐体１２と、部品供給装置１５と、基板搬送装置２０と、基板保持装置３０と、基板検知センサ３７（図４参照）と、ＸＹロボット４０と、実装ヘッド５０と、マークカメラ５５と、パーツカメラ５８と、測距センサ６０と、制御装置７０（図５参照）とを備えている。部品供給装置１５は基台１１に対して着脱可能に配設されている。基板搬送装置２０及び基板保持装置３０は基台１１上部に配置された支持台１４上に配設されている。 As shown in FIGS. 1 and 2, the component mounting machine 10 includes a base 11, a housing 12, a component supply device 15, a board transfer device 20, a board holding device 30, and a board detection sensor 37 (see FIG. 4), an XY robot 40, a mounting head 50, a mark camera 55, a parts camera 58, a distance sensor 60, and a control device 70 (see FIG. 5). The component supply device 15 is removably installed on the base 11. The substrate transport device 20 and the substrate holding device 30 are arranged on a support stand 14 arranged above the base 11.

　筐体１２は、箱形の部材である。図２に示すように、筐体１２は、部品供給装置１５，基板搬送装置２０，基板保持装置３０，ＸＹロボット４０，及び実装ヘッド５０などを覆っている。図１に示すように、筐体１２の左側壁１２１と右側壁１２２には、それぞれ開口部１２１ａ及び開口部１２２ａが形成されている。また、筐体１２の前面には、開閉が可能な跳ね上げ式のカバー部材１２３が設けられている。カバー部材１２３には、部品実装機１０の動作状況などの各種情報を表示すると共に、作業者による各種入力が可能なタッチパネル式のディスプレイである操作パネル３８が設置されている。 The housing 12 is a box-shaped member. As shown in FIG. 2, the housing 12 covers the component supply device 15, the substrate transfer device 20, the substrate holding device 30, the XY robot 40, the mounting head 50, and the like. As shown in FIG. 1, an opening 121a and an opening 122a are formed in the left side wall 121 and right side wall 122 of the housing 12, respectively. Furthermore, a flip-up cover member 123 that can be opened and closed is provided on the front surface of the housing 12. The cover member 123 is provided with an operation panel 38 that is a touch panel display that displays various information such as the operating status of the component mounter 10 and allows various inputs by an operator.

　部品供給装置１５は、部品Ｐを部品供給位置まで供給する装置であり、本実施形態ではテープフィーダとして構成されている。部品供給装置１５は、所定間隔毎に形成された収容部に部品Ｐが収容されたテープをリールから引き出してピッチ送りすることで、部品Ｐを部品供給位置に供給する。 The component supply device 15 is a device that supplies the component P to a component supply position, and is configured as a tape feeder in this embodiment. The component supply device 15 supplies the components P to the component supply position by pulling out from a reel a tape containing the components P in storage portions formed at predetermined intervals and pitch-feeding the tape.

　基板搬送装置２０は、基板Ｓを上流から下流に向けて（例えば左から右に向けて）搬送する装置である。基板搬送装置２０は、図３に示すように、コンベアベルト２４により基板Ｓを搬送するベルトコンベア装置として構成されている。基板搬送装置２０は、Ｙ軸方向に所定の間隔を隔てて配置された一対のサイドフレーム２２と、一対のサイドフレーム２２の各々に設けられたコンベアベルト２４と、コンベアベルト２４を周回駆動するベルト駆動装置とを備える。基板Ｓは、コンベアベルト２４に乗せられた状態で、ベルト駆動装置がコンベアベルト２４を周回駆動することによりＸ軸方向に搬送される。一対のコンベアベルト２４の少なくとも一方は、他方に対して近接および離間できるように構成される。これにより、基板搬送装置２０は、一対のコンベアベルトのＹ軸方向における間隔を調整することで、Ｙ軸方向に幅が異なる複数種類の基板Ｓを搬送することが可能である。 The substrate transport device 20 is a device that transports the substrate S from upstream to downstream (for example, from left to right). The substrate transport device 20 is configured as a belt conveyor device that transports the substrate S using a conveyor belt 24, as shown in FIG. The substrate conveyance device 20 includes a pair of side frames 22 arranged at a predetermined interval in the Y-axis direction, a conveyor belt 24 provided on each of the pair of side frames 22, and a belt that drives the conveyor belt 24 around. A drive device is provided. The substrate S is placed on the conveyor belt 24 and is conveyed in the X-axis direction by the belt driving device driving the conveyor belt 24 around. At least one of the pair of conveyor belts 24 is configured to be able to approach and separate from the other. Thereby, the substrate conveyance device 20 can convey a plurality of types of substrates S having different widths in the Y-axis direction by adjusting the interval between the pair of conveyor belts in the Y-axis direction.

　基板保持装置３０は、コンベアベルト２４上に配置された基板Ｓを保持する装置であり、本実施形態では基板Ｓをクランプして保持するクランプ装置として構成されている。基板保持装置３０は、一対の基板押さえプレート３２と、一対のクランパ３４と、支持プレート３５と、昇降装置３６とを備える。一対の基板押さえプレート３２は、一対のサイドフレーム２２の上端部に各々設けられている。一対のクランパ３４は、一対の基板押さえプレート３２の各々の下方に配置されている。一対のクランパ３４の各々の下端面には、下方に突出する突出部３４ａが設けられている。支持プレート３５は、一対のクランパ３４の下方に配置された板状部材である。支持プレート３５は昇降装置３６によって昇降する。支持プレート３５が上昇すると、支持プレート３５の上面がクランパ３４の突出部３４ａに当接して、クランパ３４を押し上げる。支持プレート３５には、基板Ｓがクランプされたときに基板Ｓの下面を支持するための複数（本実施形態では６本）の支持ピン３５ａが配設されている。昇降装置３６は、支持台１４と支持プレート３５との間に配置され、支持プレート３５を介して一対のクランパ３４を昇降させる。基板Ｓがコンベアベルト２４上に載せられている状態（図４Ａ）で、昇降装置３６が一対のクランパ３４を上昇させると、基板Ｓは一対のクランパ３４に押し上げられて基板押さえプレート３２の下面に押し付けられる（図４Ｂ）。これにより、基板保持装置３０は、基板Ｓの前後両端の縁部の各々を２つの部材（基板押さえプレート３２及びクランパ３４）で上下から挟んで保持する。 The substrate holding device 30 is a device that holds the substrate S placed on the conveyor belt 24, and in this embodiment is configured as a clamp device that clamps and holds the substrate S. The substrate holding device 30 includes a pair of substrate holding plates 32 , a pair of clampers 34 , a support plate 35 , and a lifting device 36 . The pair of substrate holding plates 32 are provided at the upper ends of the pair of side frames 22, respectively. The pair of clampers 34 are arranged below each of the pair of substrate holding plates 32. A protrusion 34a that protrudes downward is provided on the lower end surface of each of the pair of clampers 34. The support plate 35 is a plate-like member arranged below the pair of clampers 34. The support plate 35 is raised and lowered by a lifting device 36. When the support plate 35 rises, the upper surface of the support plate 35 comes into contact with the protrusion 34a of the clamper 34, pushing the clamper 34 up. The support plate 35 is provided with a plurality of (six in this embodiment) support pins 35a for supporting the lower surface of the substrate S when the substrate S is clamped. The lifting device 36 is disposed between the support base 14 and the support plate 35, and raises and lowers the pair of clampers 34 via the support plate 35. When the lifting device 36 raises the pair of clampers 34 while the substrate S is placed on the conveyor belt 24 (FIG. 4A), the substrate S is pushed up by the pair of clampers 34 and onto the lower surface of the substrate holding plate 32. pressed (Figure 4B). Thereby, the substrate holding device 30 holds each of the front and rear edges of the substrate S between the two members (the substrate holding plate 32 and the clamper 34) from above and below.

　基板検知センサ３７は、図４Ａに示すように、部品実装機１０の基板搬送路（基板搬送装置２０）に設けられている。基板検知センサ３７は、例えば、基板搬送路を挟んで対向する位置に設けられた投光部３７ａと受光部３７ｂとを備える透過型の光センサである。投光部３７ａは、向かい合うサイドフレーム２２の一方の内面に設けられている。受光部３７ｂは、当該一対のサイドフレーム２２の他方の内面に設けられている。基板検知センサ３７は、反射型の光センサとしてもよい。投光部３７ａと受光部３７ｂとの間に、投光部３７ａからの光を遮るもの（例えば、基板Ｓ）があり、受光部３７ｂが投光部３７ａからの光を受光していないならば、基板検知センサ３７は、基板Ｓを検知した検知状態である旨の信号を制御装置７０（図４参照）に出力する。一方、投光部３７ａと受光部３７ｂとの間に、投光部３７ａからの光を遮るものがなく、受光部３７ｂが投光部３７ａからの光を受光しているならば、基板検知センサ３７は、基板Ｓを検知しない非検知状態である旨の信号を制御装置７０に出力する。 The board detection sensor 37 is provided in the board transport path (board transport device 20) of the component mounting machine 10, as shown in FIG. 4A. The substrate detection sensor 37 is, for example, a transmissive optical sensor that includes a light projecting section 37a and a light receiving section 37b that are provided at opposing positions across the substrate transport path. The light projecting portion 37a is provided on one inner surface of the opposing side frames 22. The light receiving portion 37b is provided on the other inner surface of the pair of side frames 22. The substrate detection sensor 37 may be a reflective optical sensor. If there is something between the light projector 37a and the light receiver 37b that blocks the light from the light projector 37a (for example, a board S), and the light receiver 37b does not receive the light from the light projector 37a, then , the substrate detection sensor 37 outputs a signal indicating that the substrate S is detected and is in a detection state to the control device 70 (see FIG. 4). On the other hand, if there is nothing between the light projector 37a and the light receiver 37b that blocks the light from the light projector 37a, and the light receiver 37b is receiving the light from the light projector 37a, the board detection sensor 37 outputs a signal indicating that the substrate S is not detected and is in a non-detection state to the control device 70.

　ＸＹロボット４０は、実装ヘッド５０，マークカメラ５５及び測距センサ６０をＸＹ方向に移動させる装置である。ＸＹロボット４０は、図２に示すように、前後方向（Ｙ軸方向）に沿って設けられた左右一対のＹ軸ガイドレール４３と、左右一対のＹ軸ガイドレール４３に架け渡されＹ軸ガイドレール４３に沿ってＹ軸方向に移動が可能なＹ軸スライダ４４とを備える。また、ＸＹロボット４０は、Ｙ軸スライダ４４の側面に左右方向（Ｘ軸方向）に沿って設けられたＸ軸ガイドレール４１と、Ｘ軸ガイドレール４１に沿ってＸ軸方向に移動が可能なＸ軸スライダ４２と、を備える。Ｘ軸スライダ４２は、Ｘ軸モータ４６（図５参照）の駆動によって移動可能であり、Ｙ軸スライダ４４は、Ｙ軸モータ４８（図５参照）の駆動によって移動可能である。Ｘ軸スライダ４２には実装ヘッド５０が取り付けられており、実装ヘッド５０は、制御装置７０によってＸＹロボット４０（Ｘ軸モータ４６およびＹ軸モータ４８）が駆動制御されることにより、ＸＹ方向に移動する。ＸＹロボット４０は、Ｘ軸スライダ４２のＸ軸方向の位置を検出するＸ軸位置センサ４７（図５参照）と、Ｙ軸スライダ４４のＹ軸方向の位置を検出するＹ軸位置センサ４９（図５参照）とを備えている。 The XY robot 40 is a device that moves the mounting head 50, mark camera 55, and distance measurement sensor 60 in the XY directions. As shown in FIG. 2, the XY robot 40 includes a pair of left and right Y-axis guide rails 43 provided along the front-rear direction (Y-axis direction), and a Y-axis guide that spans the pair of left and right Y-axis guide rails 43. A Y-axis slider 44 that is movable in the Y-axis direction along a rail 43 is provided. The XY robot 40 also has an X-axis guide rail 41 provided along the left-right direction (X-axis direction) on the side surface of the Y-axis slider 44, and is movable in the X-axis direction along the X-axis guide rail 41. An X-axis slider 42 is provided. The X-axis slider 42 is movable by driving an X-axis motor 46 (see FIG. 5), and the Y-axis slider 44 is movable by driving a Y-axis motor 48 (see FIG. 5). A mounting head 50 is attached to the X-axis slider 42, and the mounting head 50 is moved in the XY direction by drive control of the XY robot 40 (X-axis motor 46 and Y-axis motor 48) by the control device 70. do. The XY robot 40 includes an X-axis position sensor 47 (see FIG. 5) that detects the position of the X-axis slider 42 in the X-axis direction, and a Y-axis position sensor 49 (see FIG. 5) that detects the position of the Y-axis slider 44 in the Y-axis direction. 5).

　実装ヘッド５０は、部品供給装置１５から供給された部品Ｐを吸着ノズル５１で吸着（採取）して基板Ｓ上に実装する装置である。実装ヘッド５０は、Ｘ軸スライダ４２に取り外し可能に装着されており、ＸＹロボット４０によりＸＹ方向へ移動する。実装ヘッド５０は、吸着ノズル５１と、Ｚ軸モータ５２と、Ｚ軸位置センサ５３（図５参照）とを備える。吸着ノズル５１は、実装ヘッド５０の下面に取り外し可能に装着されている。本実施形態では実装ヘッド５０には１つの吸着ノズル５１が取り付けられているが、複数の吸着ノズル５１が取り付け可能であってもよい。吸着ノズル５１は、負圧を利用して部品Ｐを採取する採取部材である。Ｚ軸モータ５２は、Ｚ軸に沿って吸着ノズル５１を昇降させる機構であり、これにより吸着ノズル５１及び吸着ノズル５１に吸着された部品Ｐの高さが調整される。Ｚ軸位置センサ５３は、吸着ノズル５１のＺ軸方向の位置を検出する。また、実装ヘッド５０は、図示しない駆動モータによって吸着ノズル５１を回転（自転）させる回転装置を備え、吸着ノズル５１に保持（吸着）された部品Ｐの角度を調整可能となっている。 The mounting head 50 is a device that sucks (picks up) the component P supplied from the component supply device 15 with a suction nozzle 51 and mounts it onto the substrate S. The mounting head 50 is removably mounted on the X-axis slider 42 and is moved in the XY directions by the XY robot 40. The mounting head 50 includes a suction nozzle 51, a Z-axis motor 52, and a Z-axis position sensor 53 (see FIG. 5). The suction nozzle 51 is removably attached to the lower surface of the mounting head 50. Although one suction nozzle 51 is attached to the mounting head 50 in this embodiment, a plurality of suction nozzles 51 may be attachable. The suction nozzle 51 is a collecting member that collects the part P using negative pressure. The Z-axis motor 52 is a mechanism for raising and lowering the suction nozzle 51 along the Z-axis, thereby adjusting the height of the suction nozzle 51 and the component P suctioned by the suction nozzle 51. The Z-axis position sensor 53 detects the position of the suction nozzle 51 in the Z-axis direction. Furthermore, the mounting head 50 includes a rotation device that rotates (rotates) the suction nozzle 51 by a drive motor (not shown), and can adjust the angle of the component P held (suctioned) by the suction nozzle 51.

　マークカメラ５５は、基板Ｓに付された図示しない基準マークや識別情報などを上方から撮像するための装置である。マークカメラ５５は実装ヘッド５０の下面に配設されており、実装ヘッド５０の移動に伴ってＸＹ方向へ移動する。 The mark camera 55 is a device for capturing images of unillustrated reference marks, identification information, etc. attached to the substrate S from above. The mark camera 55 is disposed on the lower surface of the mounting head 50 and moves in the X and Y directions as the mounting head 50 moves.

　パーツカメラ５８は、基板搬送装置２０の前方に配置されている。パーツカメラ５８の撮像範囲は、パーツカメラ５８の上方である。部品Ｐを吸着した吸着ノズル５１がパーツカメラ５８の上方を通過する際、パーツカメラ５８は吸着ノズル５１に吸着された部品Ｐを下方から撮像する。 The parts camera 58 is arranged in front of the substrate transport device 20. The imaging range of the parts camera 58 is above the parts camera 58. When the suction nozzle 51 that has suctioned the component P passes above the parts camera 58, the parts camera 58 images the component P that has been suctioned by the suction nozzle 51 from below.

　測距センサ６０は、基板Ｓの高さ（Ｚ軸方向の位置）である基板高さを測定する装置である。基板高さは、基板Ｓの上面の高さである。測距センサ６０は実装ヘッド５０の下面に配設されており、実装ヘッド５０の移動に伴ってＸＹ方向へ移動する。測距センサ６０は、本実施形態ではレーザー高さセンサとして構成されており、図２の吹き出し部に示すように、レーザー光を下方に照射する照射部６１と、基板Ｓで反射された後のレーザー光を受光する検出部６２とを備える。照射部６１が下方に配置された基板Ｓに向かってレーザー光を斜め下方向に照射すると、レーザー光は基板Ｓの上面で反射し、反射したレーザー光が検出部６２に入射する。このとき、図２の吹き出し部に実線及び破線で示したように、基板Ｓの上面の位置に応じて反射光の光路（矢印で図示）は変化する。検出部６２は、この光路の違いによるレーザー光の入射位置の違いに基づいて測距センサ６０と基板Ｓの上面とのＺ軸方向の距離を検出し、検出した距離に基づいて基板高さを測定する。なお、基板高さは、測距センサ６０と基板Ｓの上面とのＺ軸方向の距離としてもよいし、この距離に基づいて導出される所定の高さを基準とした値としてもよい。 The distance sensor 60 is a device that measures the height of the substrate S (position in the Z-axis direction). The substrate height is the height of the upper surface of the substrate S. The distance measuring sensor 60 is disposed on the lower surface of the mounting head 50 and moves in the X and Y directions as the mounting head 50 moves. In this embodiment, the distance measurement sensor 60 is configured as a laser height sensor, and as shown in the balloon part of FIG. The detection unit 62 includes a detection unit 62 that receives laser light. When the irradiation section 61 irradiates a laser beam diagonally downward toward the substrate S disposed below, the laser beam is reflected on the upper surface of the substrate S, and the reflected laser beam enters the detection section 62 . At this time, the optical path of the reflected light (indicated by an arrow) changes depending on the position of the upper surface of the substrate S, as shown by the solid line and broken line in the balloon part of FIG. The detection unit 62 detects the distance in the Z-axis direction between the distance measuring sensor 60 and the top surface of the substrate S based on the difference in the incident position of the laser beam due to the difference in the optical path, and calculates the substrate height based on the detected distance. Measure. Note that the substrate height may be the distance in the Z-axis direction between the ranging sensor 60 and the top surface of the substrate S, or may be a value based on a predetermined height derived based on this distance.

　制御装置７０は、部品実装機１０全体を制御する装置である。制御装置７０は、図５に示すように、ＣＰＵ７１と、ＲＯＭ７２と、ストレージ７３（例えばＨＤＤやＳＳＤ）と、ＲＡＭ７４と、入出力インタフェース７５とを備える。これらはバス７６を介して電気的に接続されている。制御装置７０には、基板検知センサ３７からの検知信号、カバー部材１２３の開閉を検知するカバー開閉センサ１２３ａからの検知信号、操作パネル３８からの操作信号、Ｘ軸位置センサ４７及びＹ軸位置センサ４９からの検出信号、Ｚ軸位置センサ５３からの検出信号、マークカメラ５５及びパーツカメラ５８からの画像信号、及び測距センサ６０からの検出信号などが入出力インタフェース７５を介して入力される。また、制御装置７０からは、部品供給装置１５への制御信号、基板搬送装置２０及び基板保持装置３０への制御信号、操作パネル３８へ表示信号、ＸＹロボット４０（Ｘ軸モータ４６およびＹ軸モータ４８）への駆動信号、実装ヘッド５０への駆動信号、マークカメラ５５及びパーツカメラ５８への駆動信号、測距センサ６０への駆動信号などが入出力インタフェース７５を介して出力される。また、制御装置７０は、管理装置８０と双方向通信可能に接続されており、互いにデータや制御信号のやり取りを行っている。 The control device 70 is a device that controls the entire component mounting machine 10. As shown in FIG. 5, the control device 70 includes a CPU 71, a ROM 72, a storage 73 (for example, an HDD or an SSD), a RAM 74, and an input/output interface 75. These are electrically connected via a bus 76. The control device 70 includes a detection signal from the board detection sensor 37, a detection signal from the cover opening/closing sensor 123a that detects opening/closing of the cover member 123, an operation signal from the operation panel 38, an X-axis position sensor 47, and a Y-axis position sensor. 49, a detection signal from the Z-axis position sensor 53, an image signal from the mark camera 55 and the parts camera 58, a detection signal from the ranging sensor 60, and the like are inputted via the input/output interface 75. The control device 70 also sends control signals to the component supply device 15, control signals to the substrate transfer device 20 and substrate holding device 30, display signals to the operation panel 38, and control signals to the XY robot 40 (X-axis motor 46 and Y-axis motor 48), a drive signal to the mounting head 50, a drive signal to the mark camera 55 and parts camera 58, a drive signal to the distance measurement sensor 60, etc. are outputted via the input/output interface 75. Further, the control device 70 is connected to the management device 80 so as to be able to communicate bidirectionally, and exchanges data and control signals with each other.

　管理装置８０は、実装システム１全体を管理する装置である。管理装置８０は、図５に示すように、ＣＰＵ８１と、ＲＯＭ８２と、ストレージ８３（例えばＨＤＤやＳＳＤ）と、ＲＡＭ８４と、入出力インタフェース８５と、を備える。これらはバス８６を介して電気的に接続されている。また、管理装置８０は、キーボードやマウスなどの入力デバイス８７と、ＬＣＤなどのディスプレイ８８とを備える。この管理装置８０には、入力デバイス８７からの入力信号が入出力インタフェース８５を介して入力される。また、管理装置８０からは、ディスプレイ８８への画像信号が入出力インタフェース８５を介して出力される。管理装置８０は、入出力インタフェース８５を介して部品実装機１０の制御装置７０と情報の送受信を行う。管理装置８０のストレージ８３には、基板Ｓの生産プログラムなどが記憶されている。基板Ｓの生産プログラムには、実装システム１中の複数の部品実装機１０の各々について、部品実装機１０がどの基板Ｓのどの位置にどの順序でどの部品Ｐを実装するかの情報、及びそのように実装した基板Ｓを何枚作製するかの情報などを含んでいる。また、生産プログラムには、部品実装機１０がどの基板Ｓのどの位置で基板高さを測定するかの情報（基板Ｓ上の所定の複数の測定点の位置情報）、及び部品Ｐの高さ（厚さ）に関する情報も含まれている。 The management device 80 is a device that manages the entire mounting system 1. As shown in FIG. 5, the management device 80 includes a CPU 81, a ROM 82, a storage 83 (for example, an HDD or an SSD), a RAM 84, and an input/output interface 85. These are electrically connected via a bus 86. The management device 80 also includes an input device 87 such as a keyboard and a mouse, and a display 88 such as an LCD. An input signal from an input device 87 is input to this management device 80 via an input/output interface 85 . Further, the management device 80 outputs an image signal to the display 88 via the input/output interface 85. The management device 80 sends and receives information to and from the control device 70 of the component mounter 10 via the input/output interface 85. The storage 83 of the management device 80 stores a production program for the board S and the like. The production program for the board S includes, for each of the plurality of component mounters 10 in the mounting system 1, information on which component P the component mounter 10 will mount on which board S, in which position, in what order, and the like. It includes information such as how many boards S to be manufactured with the following mounting. The production program also includes information on which position of which board S the component mounting machine 10 measures the board height (position information of a plurality of predetermined measurement points on the board S), and the height of the component P. (Thickness) information is also included.

　次に、こうして構成された本実施形態の部品実装機１０の動作について説明する。まず、部品実装機１０が基板Ｓに部品を実装する実装動作について説明する。実装動作のルーチンはストレージ７３に記憶されており、作業者により、入力デバイス８７又は操作パネル３８を介して実装開始指示が入力されたあと開始される。実装動作を開始すると、ＣＰＵ７１は、まず、部品実装機１０への基板Ｓの搬入，基板Ｓのクランプ，及び基板Ｓの基板高さを測定する処理などを含む、後述する実装準備ルーチンを実行する。続いて、ＣＰＵ７１は、部品Ｐを基板Ｓ上の実装予定位置に実装（配置）する実装処理ルーチンを実行する。 Next, the operation of the component mounter 10 of this embodiment configured in this manner will be described. First, a mounting operation in which the component mounter 10 mounts a component onto the board S will be described. The mounting operation routine is stored in the storage 73, and is started after the operator inputs a mounting start instruction via the input device 87 or the operation panel 38. When the mounting operation is started, the CPU 71 first executes a mounting preparation routine, which will be described later, including carrying the board S into the component mounting machine 10, clamping the board S, and measuring the height of the board S. . Subsequently, the CPU 71 executes a mounting processing routine for mounting (arranging) the component P at the planned mounting position on the board S.

　実装処理ルーチンでは、ＣＰＵ７１は、まず、実装ヘッド５０の吸着ノズル５１に部品供給装置１５から供給される部品Ｐを吸着させる。具体的には、ＣＰＵ７１は、Ｘ軸モータ４６及びＹ軸モータ４８を制御して吸着ノズル５１を実装対象の部品Ｐの部品吸着位置の真上に移動させる。次に、ＣＰＵ７１は、Ｚ軸モータ５２を制御し、吸着ノズル５１を下降させると共にその吸着ノズル５１の吸引口に負圧を作用させる。これにより、吸着ノズル５１に実装対象の部品Ｐが吸着される。その後、ＣＰＵ７１は、吸着ノズル５１を上昇させ、Ｘ軸モータ４６及びＹ軸モータ４８を制御して、先端に部品Ｐを吸着した吸着ノズル５１を基板Ｓの実装予定位置の上方へ移動させる。そして、その所定の位置で、ＣＰＵ７１は、Ｚ軸モータ５２を制御し、吸着ノズル５１を下降させる。このとき、ＣＰＵ７１は、後述する実装準備ルーチンにおける基板高さの測定結果を利用して、吸着ノズル５１の下降量を制御する。また、ＣＰＵ７１は、下降させた吸着ノズル５１の吸引口に正圧を作用させて部品Ｐの吸着を解除する。これにより、吸着ノズル５１に吸着されていた部品Ｐが離間して基板Ｓの所定の位置に実装される。基板Ｓに実装すべき他の部品Ｐについても、同様にして基板Ｓ上に実装していき、すべての部品Ｐの実装が完了したら、ＣＰＵ７１は、基板保持装置３０を制御して基板Ｓのクランプを解除し、基板搬送装置２０を制御して基板Ｓを下流側へ送り出す。ＣＰＵ７１は、生産プログラムに含まれる基板Ｓの作製枚数に応じて、実装準備ルーチン及び実装処理ルーチンを繰り返す。 In the mounting processing routine, the CPU 71 first causes the suction nozzle 51 of the mounting head 50 to suction the component P supplied from the component supply device 15. Specifically, the CPU 71 controls the X-axis motor 46 and the Y-axis motor 48 to move the suction nozzle 51 directly above the component suction position of the component P to be mounted. Next, the CPU 71 controls the Z-axis motor 52 to lower the suction nozzle 51 and apply negative pressure to the suction port of the suction nozzle 51 . As a result, the component P to be mounted is attracted to the suction nozzle 51. After that, the CPU 71 raises the suction nozzle 51, controls the X-axis motor 46 and the Y-axis motor 48, and moves the suction nozzle 51, which has suctioned the component P to the tip, above the planned mounting position of the board S. Then, at the predetermined position, the CPU 71 controls the Z-axis motor 52 to lower the suction nozzle 51. At this time, the CPU 71 controls the amount of descent of the suction nozzle 51 using the measurement result of the substrate height in a mounting preparation routine to be described later. Further, the CPU 71 releases the suction of the component P by applying positive pressure to the suction port of the suction nozzle 51 that has been lowered. As a result, the component P that had been sucked by the suction nozzle 51 is separated and mounted on the substrate S at a predetermined position. The other components P to be mounted on the board S are similarly mounted on the board S, and when the mounting of all the components P is completed, the CPU 71 controls the board holding device 30 to clamp the board S. is released, and the substrate transport device 20 is controlled to send the substrate S to the downstream side. The CPU 71 repeats the mounting preparation routine and the mounting processing routine according to the number of substrates S to be produced included in the production program.

　ここで、部品実装機１０が実装準備ルーチン又は実装処理ルーチンを実行している際に、部品実装機１０又は実装システム１に含まれる他の部品実装機１０などにおいて異常が発生する場合がある。異常が発生した場合、ＣＰＵ７１は、部品実装機１０自身の図示しない異常検知装置，管理装置８０からの指令，又は作業者からの操作パネル３８を介した操作信号などに基づいて、異常が発生したことを検知する。異常の発生を検知すると、ＣＰＵ７１は、実装動作を中断して、基板保持装置３０が基板Ｓをクランプしている場合は必要に応じてクランプを解除するよう基板保持装置３０を制御する。また、ＣＰＵ７１は、ＸＹロボット４０及び実装ヘッド５０の動作を停止させる。作業者は、例えば管理装置８０のディスプレイ８８又は操作パネル３８を介して異常の発生に気づくと、異常内容の確認や実装システム１に対する異常の解消のために必要な作業を行う。そして、異常が解消すると、作業者は、例えば入力デバイス８７又は操作パネル３８などを介して実装システム１に実装動作の復帰を指示する。ＣＰＵ７１は、管理装置８０又は操作パネル３８を介して作業者の復帰の指示を入力すると、まず実装準備ルーチンを実行し、その後に実装処理ルーチンを開始又は再開する。 Here, while the component mounter 10 is executing the mounting preparation routine or the mounting processing routine, an abnormality may occur in the component mounter 10 or another component mounter 10 included in the mounting system 1. When an abnormality occurs, the CPU 71 determines whether the abnormality has occurred based on an abnormality detection device (not shown) of the component mounting machine 10 itself, a command from the management device 80, or an operation signal from the operator via the operation panel 38. Detect that. When detecting the occurrence of an abnormality, the CPU 71 interrupts the mounting operation, and if the substrate holding device 30 is clamping the substrate S, controls the substrate holding device 30 to release the clamp as necessary. Further, the CPU 71 stops the operations of the XY robot 40 and the mounting head 50. When the operator notices the occurrence of an abnormality through, for example, the display 88 of the management device 80 or the operation panel 38, the operator performs necessary work to confirm the details of the abnormality and to resolve the abnormality in the mounting system 1. When the abnormality is resolved, the operator instructs the mounting system 1 to resume the mounting operation, for example, via the input device 87 or the operation panel 38. When the CPU 71 receives an instruction to return the worker through the management device 80 or the operation panel 38, it first executes a mounting preparation routine, and then starts or restarts the mounting processing routine.

　実装準備ルーチンについて詳細を説明する。図６は、制御装置７０のＣＰＵ７１により実行される実装準備ルーチンの一例を示すフローチャートである。図７は、基板高さの測定点Ａ１～Ａ９の一例を示す説明図である。 The implementation preparation routine will be explained in detail. FIG. 6 is a flowchart showing an example of a mounting preparation routine executed by the CPU 71 of the control device 70. FIG. 7 is an explanatory diagram showing an example of the substrate height measurement points A1 to A9.

　実装準備ルーチンを開始すると、ＣＰＵ７１は、まず、現在が異常からの復帰時であるか否かを判定する（Ｓ１００）。ＣＰＵ７１は、例えば上述した管理装置８０又は操作パネル３８を介した作業者の復帰の指示を入力した直後の実装準備ルーチンの実行時には、Ｓ１００で肯定判定を行い、それ以外の場合には否定判定を行う。 When the mounting preparation routine is started, the CPU 71 first determines whether or not it is time to recover from an abnormality (S100). For example, the CPU 71 makes an affirmative determination in S100 when executing the implementation preparation routine immediately after inputting an instruction to return the worker through the management device 80 or the operation panel 38 described above, and otherwise makes a negative determination. conduct.

　Ｓ１００で否定判定を行ったならば、ＣＰＵ７１は、基板搬送装置２０を制御して基板Ｓを所定の作業位置まで搬送し（Ｓ１２０）、基板保持装置３０を制御して基板Ｓをクランプして保持する（Ｓ１３０）。ＣＰＵ７１は、Ｓ１２０では、例えば基板検知センサ３７が基板Ｓを検知するまで搬送したり、基板検知センサ３７が基板Ｓを検知してから所定の搬送量だけ基板Ｓを搬送することにより、基板Ｓを所定の作業位置まで搬送する。 If a negative determination is made in S100, the CPU 71 controls the substrate transfer device 20 to transfer the substrate S to a predetermined work position (S120), and controls the substrate holding device 30 to clamp and hold the substrate S. (S130). In S120, the CPU 71 transports the substrate S until the substrate detection sensor 37 detects the substrate S, or transports the substrate S by a predetermined transport amount after the substrate detection sensor 37 detects the substrate S, for example. Transport to the specified working position.

　続いて、ＣＰＵ７１は、基板保持装置３０に保持された基板Ｓ上の所定の複数の測定点において基板高さの測定を行うよう測距センサ６０を制御する基板高さ測定処理を行う（Ｓ１４０）。複数の測定点は、例えば作業者により予め設定されて管理装置８０のストレージ８３に記憶されており、ＣＰＵ７１は管理装置８０から複数の測定点の位置情報を取得する。複数の測定点は、例えば基板Ｓに付された図示しない基準マークの位置を基準としたＸＹ座標で表される。本実施形態では、複数の測定点は測定点Ａ１～Ａ９の９個とし、図７に示すように基板Ｓ上にＸ軸方向に沿って等間隔に３点及びＹ軸方向に沿って等間隔に３点並ぶように格子状に配置されている。測定点Ａ１～Ａ９のうち基板Ｓの中央に位置する測定点Ａ５以外は、基板Ｓの外縁に近い位置に配置するように位置が定められている。Ｓ１４０では、ＣＰＵ７１は、この測定点Ａ１～Ａ９の全てについて、基板高さを測定する。具体的には、ＣＰＵ７１は、まず、マークカメラ５５を基板Ｓ上に移動させて基板Ｓを撮像させ、得られた画像に基づいて基板Ｓの基準マークの位置を検出する。そして、ＣＰＵ７１は、検出した基準マークの位置に基づいて、測定点Ａ１の上方に測距センサ６０が移動するようＸＹロボット４０を制御し、測距センサ６０に基板Ｓの基板高さを測定させる。ＣＰＵ７１は、測定点Ａ２～Ａ９の各々についても、同様にＸＹロボット４０及び測距センサ６０を用いて基板高さを測定する。 Subsequently, the CPU 71 performs a substrate height measurement process that controls the distance measurement sensor 60 to measure the substrate height at a plurality of predetermined measurement points on the substrate S held by the substrate holding device 30 (S140). . The plurality of measurement points are set in advance by, for example, an operator and stored in the storage 83 of the management device 80, and the CPU 71 acquires position information of the plurality of measurement points from the management device 80. The plurality of measurement points are expressed, for example, by XY coordinates based on the position of a reference mark (not shown) attached to the substrate S. In this embodiment, the plurality of measurement points are nine measurement points A1 to A9, and as shown in FIG. They are arranged in a grid pattern with three points lined up. Among the measurement points A1 to A9, the positions of the measurement points A1 to A9 other than the measurement point A5 located at the center of the substrate S are determined to be close to the outer edge of the substrate S. In S140, the CPU 71 measures the substrate height at all of the measurement points A1 to A9. Specifically, the CPU 71 first moves the mark camera 55 onto the substrate S to image the substrate S, and detects the position of the reference mark on the substrate S based on the obtained image. Then, the CPU 71 controls the XY robot 40 to move the distance measurement sensor 60 above the measurement point A1 based on the detected position of the reference mark, and causes the distance measurement sensor 60 to measure the substrate height of the substrate S. . The CPU 71 similarly measures the substrate height at each of the measurement points A2 to A9 using the XY robot 40 and the distance measuring sensor 60.

　Ｓ１４０の基板高さ測定処理のあと、ＣＰＵ７１は、測定点Ａ１～Ａ９の各々と測定された基板高さとを対応付けてストレージ７３に記憶して（Ｓ１６０）、実装準備ルーチンを終了する。この場合、実装準備ルーチンに続いて実行される実装処理ルーチンでは、ＣＰＵ７１は、Ｓ１４０の基板高さ測定処理の測定結果を利用して実装ヘッド５０に部品Ｐの実装を行わせる。具体的には、ＣＰＵ７１は、ストレージ７３に記憶された測定結果に基づいて基板Ｓの上面の形状を公知の手法を用いた近似計算によって導出し、導出した形状に基づいて部品Ｐを基板Ｓに実装する際の実装高さを導出する。例えば、図７の位置Ｍが部品Ｐの実装予定位置であった場合、ＣＰＵ７１は、測定点Ａ１～Ａ９のうちこの位置Ｍを囲む最小の三角形を描くような３点の測定点（図７の例ではＡ５，Ａ６，Ａ９）を決定する。そして、ＣＰＵ７１は、決定した３点に囲まれる三角形の領域内の基板Ｓの表面形状をその３点を通る平面とみなした（近似した）場合の、吸着された部品Ｐの実装予定位置の実装高さを、３点の測定点の基板高さに基づいて導出する。そして、ＣＰＵ７１は、導出した基板高さに基づいて吸着ノズル５１の下降量を設定（又は補正）して、この下降量だけ吸着ノズル５１を下降させて部品Ｐの実装を行う。こうすることで、基板保持装置３０に保持された基板Ｓに反りなどが生じていても、適切に部品Ｐを基板Ｓに実装することができる。なお、部品Ｐの実装予定位置が基板Ｓの外縁付近に位置するなど、測定点Ａ１～Ａ９のみでは実装予定位置を囲む三角形が描けない場合、例えば、ＣＰＵ７１は基板Ｓの前後両端の基板高さを用いて実装高さを導出してもよい。基板Ｓの前後両端は基板保持装置３０にクランプされており、クランプされている部分の基板高さは常に同じ値（既知の値）となるから、ＣＰＵ７１はこの値も実装高さの導出に用いることができる。 After the substrate height measurement process in S140, the CPU 71 stores each of the measurement points A1 to A9 and the measured substrate height in association with each other in the storage 73 (S160), and ends the mounting preparation routine. In this case, in the mounting processing routine executed subsequent to the mounting preparation routine, the CPU 71 causes the mounting head 50 to mount the component P using the measurement result of the board height measurement processing in S140. Specifically, the CPU 71 derives the shape of the top surface of the board S by an approximate calculation using a known method based on the measurement results stored in the storage 73, and places the component P on the board S based on the derived shape. Derive the mounting height when mounting. For example, if the position M in FIG. 7 is the planned mounting position of the component P, the CPU 71 selects three measurement points that draw the smallest triangle surrounding this position M among the measurement points A1 to A9 ( In the example, A5, A6, A9) are determined. Then, the CPU 71 determines the mounting position of the picked-up component P when the surface shape of the board S within the triangular area surrounded by the determined three points is regarded (approximated) as a plane passing through the three points. The height is derived based on the substrate height at three measurement points. Then, the CPU 71 sets (or corrects) the amount of descent of the suction nozzle 51 based on the derived substrate height, and mounts the component P by lowering the suction nozzle 51 by this amount of descent. By doing so, even if the board S held by the board holding device 30 is warped, the component P can be appropriately mounted on the board S. Note that if the planned mounting position of the component P is located near the outer edge of the board S, and a triangle surrounding the planned mounting position cannot be drawn using only the measurement points A1 to A9, for example, the CPU 71 calculates the height of the board at both the front and rear ends of the board S. The mounting height may be derived using Both the front and back ends of the board S are clamped by the board holding device 30, and the board height of the clamped portion is always the same value (known value), so the CPU 71 also uses this value to derive the mounting height. be able to.

　一方、ステップＳ１００で肯定判定を行った場合、すなわち異常からの復帰時である場合、ＣＰＵ７１は、基板検知センサ３７が基板Ｓを検知しているか否かを判定する（Ｓ１１０）。Ｓ１１０で否定判定を行った場合は、ＣＰＵ７１はＳ１２０以降の処理を行って実装準備ルーチンを終了する。すなわち、ＣＰＵ７１は、異常からの復帰時に基板検知センサ３７が基板Ｓを検知していない場合は、異常からの復帰時でない場合すなわち通常時と同じように、新たな基板Ｓに対して搬入，クランプ及び基板高さ測定処理を行う。 On the other hand, when an affirmative determination is made in step S100, that is, when the recovery from an abnormality occurs, the CPU 71 determines whether or not the substrate detection sensor 37 is detecting the substrate S (S110). If a negative determination is made in S110, the CPU 71 performs the processes from S120 onwards and ends the mounting preparation routine. That is, if the substrate detection sensor 37 does not detect the substrate S at the time of recovery from an abnormality, the CPU 71 carries in and clamps a new substrate S in the same way as when the substrate is not recovered from the error, that is, in normal times. and performs substrate height measurement processing.

　Ｓ１１０で基板検知センサ３７が基板Ｓを検知している場合、ＣＰＵ７１は、基板保持装置３０を制御して基板Ｓをクランプして保持する（Ｓ２３０）。そして、ＣＰＵ７１は、異常発生後からＳ２３０のクランプまでの間にカバー部材１２３の開閉が行われたか否かを判定する（Ｓ２３５）。Ｓ２３５において、ＣＰＵ７１は、異常発生時からＳ２３０までの間にカバー開閉センサ１２３ａがカバー部材１２３が開いたことを一度でも検知した場合には肯定判定を行い、カバー部材１２３が開いたことを一度も検知していない場合には否定判定を行う。Ｓ２３５で肯定判定を行った場合、ＣＰＵ７１は、Ｓ１４０以降の処理を行って実装準備ルーチンを終了する。ここで、Ｓ１１０で基板Ｓが検知されていても、異常発生時からＳ２３０のクランプまでの間にカバー部材１２３が開いた場合には、作業者が基板Ｓにアクセスして基板Ｓが異常発生直前とは別の基板Ｓに交換された可能性がある。そこで、ＣＰＵ７１は、Ｓ２３５で肯定判定を行った場合は、Ｓ２３０でクランプした基板Ｓについて改めてＳ１４０で基板高さ測定処理を実行し、Ｓ１６０で測定結果をストレージ７３に記憶する。 If the substrate detection sensor 37 detects the substrate S in S110, the CPU 71 controls the substrate holding device 30 to clamp and hold the substrate S (S230). Then, the CPU 71 determines whether the cover member 123 has been opened or closed between the occurrence of the abnormality and the clamping in S230 (S235). In S235, the CPU 71 makes an affirmative determination if the cover opening/closing sensor 123a detects that the cover member 123 has been opened even once between the occurrence of the abnormality and S230, and determines that the cover member 123 has never been opened. If it is not detected, a negative determination is made. If an affirmative determination is made in S235, the CPU 71 performs the processes from S140 onwards and ends the mounting preparation routine. Here, even if the board S is detected in S110, if the cover member 123 is opened between the time the abnormality occurs and the clamping in S230, the operator accesses the board S and the board S is detected immediately before the abnormality occurs. There is a possibility that the board S was replaced with a different one. Therefore, when the CPU 71 makes an affirmative determination in S235, the CPU 71 executes the substrate height measurement process again in S140 for the substrate S clamped in S230, and stores the measurement result in the storage 73 in S160.

　一方、Ｓ２３５で否定判定を行った場合には、ＣＰＵ７１は、Ｓ１４０の基板高さ測定処理の代わりに、複数の測定点Ａ１～Ａ９の一部である代表点において基板高さの測定を行うよう測距センサ６０を制御する代表点測定処理を行う（Ｓ２４０）。ここで、Ｓ１３０で基板ＳをクランプするとＳ１４０の基板高さ測定処理が行われるから、異常からの復帰時に既に基板Ｓが存在し（Ｓ１１０で肯定判定）、且つ、異常発生時からＳ２３０までの間にカバー開閉センサ１２３ａがカバー部材１２３が開いたことを一度も検知していない場合（Ｓ２３５で否定判定）には、Ｓ２３０でクランプした基板Ｓは、既にＳ１４０の基板高さ測定処理が行われた基板Ｓであると判断できる。すなわち、Ｓ２３０のクランプは、Ｓ１４０の基板高さ測定処理が行われた基板Ｓと同一の基板Ｓの再クランプであると判断できる。そこで、Ｓ１１０で肯定判定且つＳ２３５で否定判定の場合には、ＣＰＵ７１は、複数の測定点Ａ１～Ａ９の全てについての基板高さ測定を行わず、まず代表点における基板高さの測定を行う。代表点は、複数の測定点Ａ１～Ａ９の一部であればよいが、２点以上とすることが好ましく、３点以上とすることがより好ましい。また、代表点は、複数の測定点Ａ１～Ａ９のうち互いの距離が最も遠い２点を含むことが好ましい。本実施形態では、代表点は、測定点Ａ１～Ａ９のうち基板Ｓの中央に最も近い測定点Ａ５と、測定点Ａ１～Ａ９のうち互いの距離が最も遠い測定点Ａ１，Ａ９と、の３点とした。本実施形態では測定点Ａ１～Ａ９のうち測定点Ａ３，Ａ７も互いの距離が最も遠い２点であるため、測定点Ａ１，Ａ９の代わりに測定点Ａ３，Ａ７を代表点に含めてもよい。代表点測定処理は、測定点Ａ１～Ａ９のうち代表点のみについて基板高さを測定すること以外は、Ｓ１４０と同様に行うことができる。代表点測定処理は、基板高さ測定処理に比して測定点の数が少ないため、短時間で行うことができる。 On the other hand, when a negative determination is made in S235, the CPU 71 instructs the CPU 71 to measure the substrate height at a representative point that is a part of the plurality of measurement points A1 to A9 instead of performing the substrate height measurement process in S140. A representative point measurement process is performed to control the distance measurement sensor 60 (S240). Here, when the substrate S is clamped in S130, the substrate height measurement process in S140 is performed, so the substrate S is already present at the time of recovery from the abnormality (affirmative determination in S110), and the period from the occurrence of the abnormality to S230 is If the cover opening/closing sensor 123a has never detected that the cover member 123 has been opened (negative determination in S235), the substrate S clamped in S230 has already been subjected to the substrate height measurement process in S140. It can be determined that it is the substrate S. That is, it can be determined that the clamping in S230 is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process in S140 was performed. Therefore, in the case of an affirmative determination in S110 and a negative determination in S235, the CPU 71 does not measure the substrate height at all of the plurality of measurement points A1 to A9, but first measures the substrate height at the representative point. The representative point may be a part of the plurality of measurement points A1 to A9, but preferably two or more points, more preferably three or more points. Further, it is preferable that the representative points include two points that are the farthest from each other among the plurality of measurement points A1 to A9. In this embodiment, the representative points are the measurement point A5 which is the closest to the center of the substrate S among the measurement points A1 to A9, and the measurement points A1 and A9 which are the farthest from each other among the measurement points A1 to A9. It was marked as a point. In this embodiment, measurement points A3 and A7 among measurement points A1 to A9 are also the two points that are the farthest from each other, so measurement points A3 and A7 may be included in the representative points instead of measurement points A1 and A9. . The representative point measurement process can be performed in the same manner as S140, except that the substrate height is measured only at the representative point among the measurement points A1 to A9. The representative point measurement process can be performed in a short time because the number of measurement points is smaller than that in the substrate height measurement process.

　Ｓ２３０の後、ＣＰＵ７１は、Ｓ２４０の代表点測定処理の測定結果と、直近のＳ１４０の基板高さ測定処理における代表点と同じ測定点の測定結果と、の相違が許容範囲内であるか否かを判定する（Ｓ２４５）。例えば、ＣＰＵ７１は、以下のようにＳ２４５の判定を行う。まず、直近のＳ１４０で測定されてストレージ７３に記憶された、代表点と同じ測定点Ａ１，Ａ５，Ａ９の測定結果をそれぞれ基板高さａ１，ａ５，ａ９とし、これらをまとめて測定結果ａとする。Ｓ２４０で測定された代表点すなわち測定点Ａ１，Ａ５，Ａ９の測定結果をそれぞれ基板高さｂ１，ｂ５，ｂ９とし、これらをまとめて測定結果ｂとする。この場合、Ｓ２４５では、ＣＰＵ７１は、基板高さａ１と基板高さｂ１との相違（例えば両者の差又は比）が所定の許容範囲内であるか否かを判定する。同様に基板高さａ５と基板高さｂ５との相違、基板高さａ９と基板高さｂ９との相違についても許容範囲内であるか否かを判定する。そして、ＣＰＵ７１は、基板高さｂ１，ｂ５，ｂ９のいずれも基板高さａ１，ａ５，ａ９との相違が許容範囲内であった場合には、測定結果ｂと測定結果ａとの相違が許容範囲内であるとしてＳ２４５で肯定判定を行う。基板高さｂ１，ｂ５，ｂ９のいずれか１以上について許容範囲外であった場合には、ＣＰＵ７１は測定結果ｂと測定結果ａとの相違が許容範囲内でないとしてＳ２４５で否定判定を行う。 After S230, the CPU 71 determines whether the difference between the measurement result of the representative point measurement process of S240 and the measurement result of the same measurement point as the representative point in the most recent board height measurement process of S140 is within an allowable range. is determined (S245). For example, the CPU 71 makes the determination in S245 as follows. First, the measurement results of the measurement points A1, A5, and A9, which are the same as the representative points and which were measured in the most recent S140 and stored in the storage 73, are set as the substrate heights a1, a5, and a9, respectively, and these are collectively referred to as the measurement result a. do. The measurement results at the representative points, that is, the measurement points A1, A5, and A9 measured in S240 are defined as substrate heights b1, b5, and b9, respectively, and these are collectively defined as the measurement result b. In this case, in S245, the CPU 71 determines whether the difference between the substrate height a1 and the substrate height b1 (for example, the difference or ratio between them) is within a predetermined allowable range. Similarly, it is determined whether the difference between the substrate height a5 and the substrate height b5 and the difference between the substrate height a9 and the substrate height b9 are within the allowable range. Then, if the difference between the board heights b1, b5, and b9 from the board heights a1, a5, and a9 is within the allowable range, the CPU 71 determines that the difference between the measurement result b and the measurement result a is acceptable. It is determined that it is within the range, and an affirmative determination is made in S245. If any one or more of the substrate heights b1, b5, and b9 is outside the allowable range, the CPU 71 determines that the difference between the measurement result b and the measurement result a is not within the allowable range, and makes a negative determination in S245.

　Ｓ２４５で否定判定を行った場合、ＣＰＵ７１は、複数の測定点Ａ１～Ａ９のうち代表点以外の残りの測定点（ここでは測定点Ａ２～Ａ４，Ａ６～Ａ８）の基板高さを測定し（Ｓ２５０）、Ｓ２４０及びＳ２５０の測定結果をストレージ７３に記憶して（Ｓ２６０）、実装準備ルーチンを終了する。すなわち、ＣＰＵ７１は、Ｓ２３０でクランプした基板ＳについてＳ２４０及びＳ２５０で複数の測定点Ａ１～Ａ９の全てについて基板高さを測定することで、Ｓ１４０の基板高さ測定処理と同じ処理を改めて行う。ＣＰＵ７１は、Ｓ２６０において、直近のＳ１６０で記憶された測定結果が存在する場合には、その測定結果をＳ２４０及びＳ２５０の測定結果で上書き（更新）する。そのため、Ｓ２６０の実行に続いて実行（開始又は再開）される実装処理ルーチンでは、ＣＰＵ７１は、Ｓ２４０及びＳ２５０の測定結果を利用して実装ヘッド５０に部品Ｐの実装を行わせる。 If a negative determination is made in S245, the CPU 71 measures the substrate heights of the remaining measurement points (here, measurement points A2 to A4, A6 to A8) other than the representative point among the plurality of measurement points A1 to A9 ( S250), the measurement results of S240 and S250 are stored in the storage 73 (S260), and the mounting preparation routine is ended. That is, the CPU 71 re-performs the same process as the substrate height measurement process in S140 by measuring the substrate height at all of the plurality of measurement points A1 to A9 in S240 and S250 for the substrate S clamped in S230. In S260, if there is a measurement result stored in the most recent S160, the CPU 71 overwrites (updates) the measurement result with the measurement result in S240 and S250. Therefore, in the mounting processing routine that is executed (started or restarted) following the execution of S260, the CPU 71 causes the mounting head 50 to mount the component P using the measurement results of S240 and S250.

　一方、Ｓ２４５で肯定判定を行った場合、ＣＰＵ７１は、複数の測定点Ａ１～Ａ９のうち代表点以外の残りの測定点（ここでは測定点Ａ２～Ａ４，Ａ６～Ａ８）の基板高さの測定は省略し、Ｓ２４０の測定結果ｂのストレージ７３への記憶も行わずに、実装準備ルーチンを終了する。この場合、ＣＰＵ７１は、続いて実行（開始又は再開）される実装処理ルーチンでは、Ｓ２４０の測定結果ｂは利用せず直近のＳ１６０の測定結果を利用して実装ヘッド５０に部品Ｐの実装を行わせる。なお、上述したＳ２４５の判定に用いる許容範囲は、Ｓ２４０ではなく直近のＳ１６０の測定結果を利用して実装高さを算出しても部品Ｐの実装に問題が生じないような測定結果ａと測定結果ｂとの相違の許容範囲として、予め設定されてストレージ７３又はストレージ８３に記憶されている。 On the other hand, when an affirmative determination is made in S245, the CPU 71 measures the substrate height at the remaining measurement points (here, measurement points A2 to A4, A6 to A8) other than the representative point among the plurality of measurement points A1 to A9. is omitted, and the mounting preparation routine is ended without storing the measurement result b in the storage 73 in S240. In this case, in the mounting processing routine that is subsequently executed (started or restarted), the CPU 71 mounts the component P on the mounting head 50 using the most recent measurement result of S160 without using the measurement result b of S240. let Note that the tolerance range used for the determination in S245 mentioned above is the measurement result a that does not cause any problem in mounting the component P even if the mounting height is calculated using the measurement result of the most recent S160 instead of S240. The allowable range of difference from result b is set in advance and stored in storage 73 or storage 83.

　ここで、本実施形態の構成要素と本開示の構成要素との対応関係を明らかにする。本実施形態の実装ヘッド５０が本開示の作業部に相当し、基板保持装置３０が基板保持部に相当し、測距センサ６０が高さ測定部に相当し、制御装置７０が制御部に相当する。 Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The mounting head 50 of this embodiment corresponds to a working part of the present disclosure, the substrate holding device 30 corresponds to a substrate holding part, the distance measuring sensor 60 corresponds to a height measuring part, and the control device 70 corresponds to a control part. do.

　以上詳述した本実施形態の部品実装機１０によれば、制御装置７０は、基板保持装置３０に保持された基板Ｓ上の所定の複数の測定点Ａ１～Ａ９において基板高さの測定を行うよう測距センサ６０を制御する基板高さ測定処理を行う。また、制御装置７０は、基板高さ測定処理が行われた基板Ｓを基板保持装置３０が再度保持した場合（ここではＳ１１０で肯定判定し且つＳ２３５で否定判定した場合）には、所定の複数の測定点Ａ１～Ａ９の一部である代表点（測定点Ａ１，Ａ５，Ａ９）において基板高さの測定を行うよう測距センサ６０を制御する代表点測定処理を行う。そして、制御装置７０は、代表点測定処理の測定結果ｂと基板高さ測定処理における代表点と同じ測定点の測定結果ａとの相違が許容範囲内である場合には、所定の複数の測定点Ａ１～Ａ９のうち代表点以外の測定点の基板高さの測定を省略する。これにより、基板高さ測定処理が行われた基板Ｓと同一の基板Ｓを基板保持装置３０が再クランプした場合であっても所定の複数の測定点Ａ１～Ａ９の全てにおいて改めて基板高さの測定を行う場合と比べて、基板高さの測定を効率よく行うことができる。 According to the component mounting machine 10 of the present embodiment described in detail above, the control device 70 measures the substrate height at a plurality of predetermined measurement points A1 to A9 on the substrate S held by the substrate holding device 30. Then, a substrate height measurement process is performed to control the distance measurement sensor 60. Further, when the substrate holding device 30 again holds the substrate S on which the substrate height measurement process has been performed (here, when an affirmative determination is made in S110 and a negative determination is made in S235), the control device 70 controls a predetermined plurality of Representative point measurement processing is performed to control the distance sensor 60 to measure the substrate height at representative points (measurement points A1, A5, A9) that are part of the measurement points A1 to A9. Then, if the difference between the measurement result b of the representative point measurement process and the measurement result a of the same measurement point as the representative point in the substrate height measurement process is within an allowable range, the control device 70 performs a plurality of predetermined measurements. The measurement of the substrate height at measurement points other than the representative points among points A1 to A9 is omitted. As a result, even if the substrate holding device 30 re-clamps the same substrate S as the one on which the substrate height measurement process was performed, the substrate height can be measured again at all of the plurality of predetermined measurement points A1 to A9. The height of the substrate can be measured more efficiently than when the measurement is performed.

　さらに、制御装置７０は、測定結果ｂと測定結果ａとの相違が許容範囲内である場合には、代表点測定処理の測定結果を利用せず基板高さ測定処理の測定結果を利用して実装ヘッド５０に部品Ｐの実装を行わせる。また、制御装置７０は、測定結果ｂと測定結果ａとの相違が許容範囲外である場合には、所定の複数の測定点Ａ１～Ａ９のうち代表点測定処理で使用していない以外の残りの測定点（測定点Ａ２～Ａ４，Ａ６～Ａ８）の基板高さの測定を行い、この残りの測定点の測定結果及び代表点測定処理の測定結果を利用して実装ヘッド５０に部品Ｐの実装を行わせる。これにより、代表点測定処理の測定結果と、基板高さ測定処理の測定結果とを混在させて用いる場合と比較して、より適切に基板高さの測定結果を利用して実装ヘッド５０に部品Ｐの実装を行わせることができる。 Further, if the difference between the measurement result b and the measurement result a is within the allowable range, the control device 70 uses the measurement result of the substrate height measurement process without using the measurement result of the representative point measurement process. The mounting head 50 is caused to mount the component P. In addition, if the difference between the measurement result b and the measurement result a is outside the allowable range, the control device 70 controls the remaining measurement points A1 to A9 other than those not used in the representative point measurement process. Measure the board height at the measurement points (measurement points A2 to A4, A6 to A8), and use the measurement results of the remaining measurement points and the measurement results of the representative point measurement process to place the component P on the mounting head 50. Let implementation take place. As a result, compared to the case where the measurement results of the representative point measurement process and the measurement results of the board height measurement process are used together, the board height measurement results can be used more appropriately to attach the component to the mounting head 50. It is possible to implement P.

　そして、制御装置７０は、基板保持装置３０が基板Ｓを前回保持し且つ基板高さ測定処理が行われてから基板保持装置３０が基板Ｓを今回保持するまでの間に作業者が基板Ｓにアクセスしていないとみなせる場合（Ｓ１１０で肯定判定し且つＳ２３５で否定判定した場合）には、基板高さ測定処理が行われた基板Ｓを基板保持装置３０が再度保持したと判定する、すなわちＳ２３０のクランプがＳ１４０の基板高さ測定処理が行われた基板Ｓと同一の基板Ｓの再クランプであると判定する。こうすれば、基板検知センサ３７及びカバー開閉センサ１２３ａを用いて、Ｓ２３０のクランプが基板高さ測定処理が行われた基板Ｓと同一の基板Ｓの再クランプであるか否かを判定できる。また、例えば異常発生時から異常の復帰（及びＳ２３０のクランプまで）の間に作業者が基板Ｓにアクセスしたか否かを基板検知センサ３７及びカバー開閉センサ１２３ａに基づいて推定することができる。なお、異常が発生しても作業者が基板Ｓにアクセスしない場合としては、例えば図６の実装準備ルーチンを実行している部品実装機１０とは異なる装置、例えば実装システム１に含まれる他の部品実装機１０における異常の発生時が挙げられる。 Then, the control device 70 determines that the operator holds the substrate S between the time when the substrate holding device 30 held the substrate S last time and the substrate height measurement processing was performed until the substrate holding device 30 holds the substrate S this time. If it can be considered that the access has not been made (if an affirmative determination is made in S110 and a negative determination is made in S235), it is determined that the substrate holding device 30 has re-held the substrate S on which the substrate height measurement process was performed, that is, in S230. It is determined that the clamping is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process of S140 was performed. In this way, using the substrate detection sensor 37 and the cover opening/closing sensor 123a, it can be determined whether the clamping in S230 is re-clamping of the same substrate S as the substrate S on which the substrate height measurement process was performed. Further, for example, it is possible to estimate whether or not the operator has accessed the substrate S between the occurrence of the abnormality and the recovery from the abnormality (and until the clamping in S230) based on the substrate detection sensor 37 and the cover opening/closing sensor 123a. Note that if the operator does not access the board S even if an abnormality occurs, for example, a device other than the component mounter 10 that is executing the mounting preparation routine of FIG. 6, for example, another device included in the mounting system 1 An example of this is when an abnormality occurs in the component mounting machine 10.

　また、代表点は、所定の複数の測定点Ａ１～Ａ９のうち互いの距離が最も遠い２点である測定点Ａ１，Ａ９を含んでいる。これにより、基板Ｓの高さに関してより代表的な２点が代表点に含まれる。したがって、代表点の測定結果ｂに基づく上述した許容範囲内か否かの判定によって、基板高さ測定処理時と代表点測定処理時との基板Ｓの状態の相違が許容範囲内か否かをより適切に判定できる。 Furthermore, the representative points include measurement points A1 and A9, which are the two points that are the farthest from each other among the plurality of predetermined measurement points A1 to A9. As a result, two more representative points regarding the height of the substrate S are included in the representative points. Therefore, by determining whether or not it is within the above-mentioned allowable range based on the measurement result b of the representative point, it is possible to determine whether the difference in the state of the board S between the board height measurement process and the representative point measurement process is within the allowable range. More appropriate judgment can be made.

　なお、本発明は上述した実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 It goes without saying that the present invention is not limited to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

　例えば、上述した実施形態では、ＣＰＵ７１は、Ｓ１１０で肯定判定し且つＳ２３５で否定判定した場合に、基板保持装置３０が基板Ｓを前回保持し且つ基板高さ測定処理が行われてから基板保持装置３０が基板Ｓを今回保持するまでの間に作業者が基板Ｓにアクセスしていないとみなして、Ｓ２３０が同一の基板Ｓの再クランプである（基板高さ測定処理が行われた基板Ｓを基板保持装置３０が再度保持した）と判定したが、これに限られない。例えば、制御装置７０は、マークカメラ５５（読取部の一例）が読み取った基板Ｓの識別情報に基づいて、Ｓ２３０が同一の基板Ｓの再クランプである（基板高さ測定処理が行われた基板Ｓを基板保持装置３０が再度保持した）か否かを判定してもよい。図８は、変形例の実装準備ルーチンの一例を示すフローチャートである。図８では、図６と同じ処理については同じステップ番号を付して詳細な説明を省略する。図８の実装準備ルーチンでは、ＣＰＵ７１は、Ｓ１３０で基板Ｓをクランプした後、Ｓ１４０の基板高さ測定処理を行う前に、基板Ｓにバーコードなどの形で付された識別情報を取得する（Ｓ３３２）。例えば、ＣＰＵ７１は、Ｘ軸モータ４６及びＹ軸モータ４８を制御して基板Ｓに付された図示しない識別情報の上方にマークカメラ５５を移動させて識別情報を撮像させることで、基板Ｓの識別情報を取得してストレージ７３に記憶する。Ｓ３３２はＳ１４０の後に行ってもよい。また、ＣＰＵ７１は、Ｓ１６０においてＳ３３２の識別情報とＳ１４０の測定結果とを対応付けて記憶することが好ましい。また、ＣＰＵ７１は、Ｓ２３０の後にもＳ３３２と同様に基板Ｓの識別情報を取得する（Ｓ４３２）。そして、ＣＰＵ７１は、Ｓ４３２の後に、前回のクランプ時（例えば直近のＳ３３２）に取得した基板Ｓの識別情報とＳ４３２で今回取得した基板Ｓの識別情報とが同一か否かを判定する（Ｓ４３５）。これにより、ＣＰＵ７１は、Ｓ２３０が同一の基板Ｓの再クランプである（基板高さ測定処理が行われた基板Ｓを基板保持装置３０が再度保持した）か否かを判定できる。そして、ＣＰＵ７１は、Ｓ４３５で否定判定を行った場合はＳ１４０以降の処理を行い、Ｓ４３５で肯定判定を行った場合はＳ２４０以降の処理を行う。この図８の実装準備ルーチンでは、基板高さ測定処理が行われた基板Ｓを基板保持装置３０が再度保持したか否か、言い換えると、今回基板保持装置３０が保持した基板Ｓが基板高さ測定処理が既に行われた基板Ｓと同一であるか否かを、基板Ｓの識別情報に基づいて適切に判定できる。なお、図８のＳ２６０においても、Ｓ１６０と同様に、Ｓ４３２の識別情報とＳ２４０及びＳ２５０の測定結果とを対応付けて記憶することが好ましい。Ｓ１６０及びＳ２６０において識別情報と測定結果とを対応付けて記憶しておくことで、ＣＰＵ７１は、Ｓ４３５の判定時に、直近のＳ３３２で取得された識別情報とＳ４３２で取得された識別情報とが同一か否かを判定するだけでなく、Ｓ４３２で取得した識別情報と同一の識別情報に対応する測定結果が既にストレージ７３に記憶されているか否かも調べることができる。これにより、ＣＰＵ７１は、Ｓ２３０でクランプされた基板ＳがＳ１４０の基板高さ測定処理が既に行われた基板Ｓであるか否かをＳ４３５でより確実に判定できる。なお、図８のＳ３３２の後、且つＳ１４０の前に、Ｓ４３５と同様に前回のクランプ時に取得した基板Ｓの識別情報と今回取得した基板Ｓの識別情報とが同一か否かを判定して、否定判定を行った場合はＳ１４０以降の処理を行い、肯定判定を行った場合はＳ２４０以降の処理を行ってもよい。すなわち、異常からの復帰時（Ｓ１００で肯定判定）であるか否かに関わらず、基板Ｓをクランプして基板Ｓの識別情報を取得した後に、今回のクランプが同一の基板Ｓの再クランプであるか否かを判定してもよい。 For example, in the embodiment described above, when the CPU 71 makes an affirmative determination in S110 and a negative determination in S235, the CPU 71 determines whether the substrate holding device 30 has held the substrate S last time and the substrate height measurement process has been performed. S230 re-clamps the same board S, assuming that the operator has not accessed the board S until S30 holds the board S this time. Although it was determined that the substrate holding device 30 held the substrate again, the present invention is not limited to this. For example, based on the identification information of the substrate S read by the mark camera 55 (an example of a reading unit), the control device 70 determines that S230 is re-clamping of the same substrate S (a substrate on which the substrate height measurement process has been performed). It may be determined whether the substrate holding device 30 has held S again. FIG. 8 is a flowchart illustrating an example of a modified implementation preparation routine. In FIG. 8, the same steps as those in FIG. 6 are given the same step numbers, and detailed explanations are omitted. In the mounting preparation routine of FIG. 8, after the CPU 71 clamps the board S in S130 and before performing the board height measurement process in S140, the CPU 71 acquires identification information attached to the board S in the form of a bar code or the like ( S332). For example, the CPU 71 controls the X-axis motor 46 and the Y-axis motor 48 to move the mark camera 55 above identification information (not shown) attached to the board S to image the identification information, thereby identifying the board S. The information is acquired and stored in the storage 73. S332 may be performed after S140. Further, it is preferable that the CPU 71 stores the identification information in S332 and the measurement result in S140 in association with each other in S160. Further, the CPU 71 obtains the identification information of the board S after S230 as well as in S332 (S432). After S432, the CPU 71 determines whether the identification information of the board S acquired during the previous clamping (for example, the most recent S332) and the identification information of the board S acquired this time in S432 are the same (S435). . Thereby, the CPU 71 can determine whether S230 is re-clamping of the same substrate S (the substrate holding device 30 has held the substrate S again after the substrate height measurement process). Then, when the CPU 71 makes a negative determination in S435, the CPU 71 performs the processes from S140 onwards, and when it makes an affirmative determination in S435, it performs the processes from S240 onwards. In the mounting preparation routine of FIG. 8, it is determined whether or not the substrate holding device 30 has held the substrate S on which the substrate height measurement process has been performed again. Based on the identification information of the substrate S, it can be appropriately determined whether the substrate S is the same as the substrate S on which the measurement process has already been performed. Note that in S260 of FIG. 8 as well, similarly to S160, it is preferable that the identification information of S432 and the measurement results of S240 and S250 are stored in association with each other. By storing the identification information and the measurement results in association in S160 and S260, the CPU 71 determines whether the identification information acquired in the most recent S332 and the identification information acquired in S432 are the same at the time of determination in S435. In addition to determining whether or not the measurement result is the same, it is also possible to check whether the measurement result corresponding to the same identification information as the identification information acquired in S432 has already been stored in the storage 73. Thereby, the CPU 71 can more reliably determine in S435 whether the substrate S clamped in S230 is the substrate S on which the substrate height measurement process in S140 has already been performed. Note that after S332 in FIG. 8 and before S140, similarly to S435, it is determined whether the identification information of the substrate S acquired during the previous clamping and the identification information of the substrate S acquired this time are the same, If a negative determination is made, the process from S140 onwards may be performed, and if a positive determination is made, the process from S240 onwards may be performed. In other words, regardless of whether or not it is the time of recovery from an abnormality (affirmative determination in S100), after the board S is clamped and the identification information of the board S is acquired, the current clamp is a re-clamp of the same board S. It may be determined whether or not there is one.

　上述した実施形態のＳ１１０において、ＣＰＵ７１は、異常発生時の基板保持装置３０のクランプの解除から現在までの間に基板検知センサ３７が基板Ｓを継続して検知していたか否かを判定してもよい。この場合、ＣＰＵ７１は、Ｓ１１０で肯定判定の場合にはＳ２３０及びＳ２４０を行ってＳ２４５以降の処理を行い、Ｓ１１０で否定判定の場合にはＳ１３０以降の処理を行ってもよい。ここで、異常発生時の基板保持装置３０のクランプの解除から現在までの間に基板検知センサ３７が基板Ｓを継続して検知していた場合には、基板保持装置３０が基板Ｓを前回保持し且つ基板高さ測定処理が行われてから作業者が基板Ｓにアクセスしていないとみなすことができる。そのため、このようにしてＳ１１０の判定を行うことで、Ｓ２３５とは異なる手法で作業者が基板Ｓにアクセスしたか否かを推定することができる。 In S110 of the embodiment described above, the CPU 71 determines whether or not the substrate detection sensor 37 has continuously detected the substrate S from the time when the clamp of the substrate holding device 30 was released when the abnormality occurred until now. Good too. In this case, the CPU 71 may perform S230 and S240 and perform the processes from S245 onwards if the determination is positive in S110, and may perform the processes from S130 onwards in the case of a negative determination in S110. Here, if the substrate detection sensor 37 has continuously detected the substrate S from the release of the clamp of the substrate holding device 30 at the time of abnormality occurrence until now, the substrate holding device 30 holds the substrate S last time. In addition, it can be assumed that the operator has not accessed the substrate S since the substrate height measurement process was performed. Therefore, by making the determination in S110 in this manner, it is possible to estimate whether or not the operator has accessed the board S using a method different from that in S235.

　上述した実施形態では、Ｓ２４５で測定結果ｂと測定結果ａとの相違が許容範囲内である場合には、代表点測定処理の測定結果を利用せず基板高さ測定処理の測定結果を利用して実装ヘッド５０に部品Ｐの実装を行わせたが、これに限られない。例えば、ＣＰＵ７１は、Ｓ２４５で肯定判定を行った場合に、直近のＳ１６０でストレージ７３に記憶した測定結果のうち代表点と同じ測定点Ａ１，Ａ５，Ａ９の基板高さについて、Ｓ２４０の測定結果ｂで上書き（更新）してもよい。この場合、続いて行われる実装処理ルーチンでは、代表点測定処理の測定結果と基板高さ測定処理の測定結果とを混在させて利用することになる。こうしても、ＣＰＵ７１が測定結果に基づいて実装高さを導出することはできる。 In the embodiment described above, if the difference between the measurement result b and the measurement result a is within the allowable range in S245, the measurement result of the substrate height measurement process is used instead of the measurement result of the representative point measurement process. Although the mounting head 50 is used to mount the component P, the present invention is not limited thereto. For example, when the CPU 71 makes an affirmative determination in S245, the CPU 71 selects the measurement results b in S240 for the board heights at measurement points A1, A5, and A9, which are the same as the representative points, among the measurement results stored in the storage 73 in the most recent S160. You can overwrite (update) it with . In this case, in the subsequent mounting processing routine, the measurement results of the representative point measurement process and the measurement results of the board height measurement process are mixed and used. Even in this case, the CPU 71 can derive the mounting height based on the measurement results.

　上述した実施形態では、所定の複数の測定点は図７に示す測定点Ａ１～Ａ９としたが、これに限られない。複数の測定点の数は９個以外の数でもよいし、複数の測定点が等間隔でなくともよいし、格子状でなくともよい。また、代表点は、複数の測定点のうち互いを結んだ線とＸ軸（基板Ｓの搬送方向）とのなす角が最も４５度に近い２点を含んでいてもよい。 In the embodiment described above, the predetermined plurality of measurement points are the measurement points A1 to A9 shown in FIG. 7, but the measurement points are not limited thereto. The number of the plurality of measurement points may be other than nine, the plurality of measurement points may not be equally spaced, and may not be in the form of a grid. Further, the representative points may include two points where the angle between the line connecting each other and the X axis (transfer direction of the substrate S) is closest to 45 degrees among the plurality of measurement points.

　上述した実施形態において、代表点は、所定の複数の測定点のうち基板高さ測定処理の測定結果において所定の基準高さとの相違が最も大きい測定点を含んでいてもよい。例えば、図６の実装準備ルーチンのＳ１４０の後又はＳ２４０の前などのタイミングにおいて、ＣＰＵ７１は、直近のＳ１４０の基板高さ測定処理の測定結果と所定の基準高さとを比較して、測定点Ａ１～Ａ９のうち測定された基板高さと所定の基準高さとの相違が最も大きい測定点を特定してもよい。そして、ＣＰＵ７１は、Ｓ２４０において、上述した実施形態における測定点Ａ１，Ａ５，Ａ９に加えて又は代えて、特定された基準高さとの相違が最も大きい測定点を代表点に含めて、代表点測定処理を行ってもよい。所定の基準高さは、例えば基板保持装置３０に保持された基板Ｓに反りなどの変形が生じていない場合の基板高さ（正常な基板Ｓの基板高さ）としてもよい。このような基準高さは、例えば基板保持装置３０に基準となる高さに合わせてあらかじめ基準ブロックを設けておきＣＰＵ７１が測距センサ６０にこの基準ブロックの高さを測定させて算出してもよいし、生産プログラムに含まれる基板Ｓの厚さに基づいてＣＰＵ７１が算出してもよい。あるいは、所定の基準高さは、直近の基板高さ測定処理で測定された所定の複数の測定点の基板高さの平均値としてもよい。所定の基準高さを正常な基板Ｓの基板高さ又は所定の複数の測定点の基板高さの平均値とする場合、この基準高さとの相違が最も大きい測定点は、基板Ｓの反りなどの変形状態を最も反映しているから、代表点に適している。 In the embodiment described above, the representative point may include a measurement point that has the largest difference from a predetermined reference height in the measurement results of the substrate height measurement process among the plurality of predetermined measurement points. For example, at a timing such as after S140 or before S240 of the mounting preparation routine in FIG. ~A9, a measurement point where the difference between the measured substrate height and a predetermined reference height is the largest may be specified. Then, in S240, in addition to or instead of the measurement points A1, A5, and A9 in the above-described embodiment, the CPU 71 includes the measurement point having the largest difference from the specified reference height as the representative points, and performs representative point measurement. Processing may be performed. The predetermined reference height may be, for example, the substrate height (normal substrate height of the substrate S) when the substrate S held by the substrate holding device 30 is not deformed such as warping. Such a reference height can be calculated by, for example, providing a reference block in advance on the substrate holding device 30 in accordance with the reference height, and then having the CPU 71 measure the height of the reference block using the distance measuring sensor 60. Alternatively, the CPU 71 may calculate it based on the thickness of the substrate S included in the production program. Alternatively, the predetermined reference height may be an average value of the substrate heights at a plurality of predetermined measurement points measured in the most recent substrate height measurement process. When the predetermined reference height is set as the board height of a normal board S or the average value of the board heights of a plurality of predetermined measurement points, the measurement point with the largest difference from this reference height is the one due to warpage of the board S, etc. It is suitable as a representative point because it best reflects the deformation state of .

　上述した実施形態では、測距センサ６０はレーザー光を用いたレーザー高さセンサとしたが、これに限らず基板高さを測定できればどのようなセンサを用いてもよい。例えば、接触式の高さセンサや超音波式の高さセンサを用いてもよい。 In the embodiment described above, the distance measuring sensor 60 is a laser height sensor that uses laser light, but the sensor is not limited to this, and any sensor may be used as long as it can measure the substrate height. For example, a contact height sensor or an ultrasonic height sensor may be used.

　上述した実施形態では、ＸＹロボット４０が実装ヘッド５０及び測距センサ６０を共に移動させたが、これに限られない。例えば、部品実装機１０は実装ヘッド５０を移動させるヘッド移動部と測距センサ６０を移動させる測定移動部とを別々に備えていてもよい。 In the embodiment described above, the XY robot 40 moves the mounting head 50 and the distance measurement sensor 60 together, but the present invention is not limited to this. For example, the component mounter 10 may separately include a head moving section that moves the mounting head 50 and a measurement moving section that moves the distance measurement sensor 60.

　上述した実施形態では、実装ヘッド５０は吸着ノズル５１により部品Ｐを吸着して基板Ｓ上に実装したが、これに限られない。例えば、実装ヘッド５０は、吸着ノズル５１に代えて部品Ｐを挟持して保持するメカニカルチャックを有していてもよい。 In the embodiment described above, the mounting head 50 suctions the component P using the suction nozzle 51 and mounts it on the substrate S, but the present invention is not limited thereto. For example, the mounting head 50 may include a mechanical chuck that clamps and holds the component P instead of the suction nozzle 51.

　上述した実施形態では、基板保持装置３０は基板Ｓをクランプすることで保持したが、これに限られない。例えば、基板保持装置３０は、基板Ｓを吸引して保持してもよい。 In the embodiment described above, the substrate holding device 30 holds the substrate S by clamping it, but the present invention is not limited to this. For example, the substrate holding device 30 may suck and hold the substrate S.

　上述した実施形態では、本開示の対基板作業装置を部品実装機１０に適用した場合について説明したが、これに限られない。例えば、本開示の対基板作業装置は、基板にはんだを印刷するはんだ印刷機や、基板に接着剤を塗布する接着剤塗布機、基板のこれらの作業結果を検査する検査機など、他のいかなる対基板作業装置に適用してもよい。 In the embodiment described above, a case has been described in which the board-to-board working device of the present disclosure is applied to the component mounting machine 10, but the present invention is not limited to this. For example, the board-related work device of the present disclosure may be any other type of machine, such as a solder printer that prints solder on a board, an adhesive applicator that applies adhesive to a board, or an inspection machine that inspects the results of these work on the board. It may also be applied to a board-facing work device.

　本開示の対基板作業装置は、以下のように構成してもよい。 The substrate-to-board working device of the present disclosure may be configured as follows.

　本開示の対基板作業装置において、前記制御部は、前記相違が前記許容範囲内である場合には、前記代表点測定処理における前記代表点の測定結果を利用せず前記基板高さ測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせ、前記相違が前記許容範囲外である場合には、前記所定の複数の測定点のうち前記代表点以外の残りの測定点の前記基板高さの測定を行い、前記残りの測定点の測定結果及び前記代表点測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせてもよい。こうすれば、代表点測定処理の測定結果と基板高さ測定処理の測定結果とを混在させて用いる場合と比較して、より適切に基板高さの測定結果を利用して対基板作業を行わせることができる。 In the board-to-board working device of the present disclosure, when the difference is within the allowable range, the control unit performs the board height measurement process without using the measurement result of the representative point in the representative point measurement process. The work unit is made to perform the board-facing work using the measurement results, and if the difference is outside the allowable range, the remaining measurement points other than the representative point among the plurality of predetermined measurement points are The height of the substrate may be measured, and the working unit may perform the substrate-facing work using the measurement results of the remaining measurement points and the measurement results of the representative point measurement process. In this way, the board height measurement results can be used more appropriately for board work compared to the case where the measurement results of the representative point measurement process and the measurement results of the board height measurement process are used together. can be set.

　本開示の対基板作業装置は、前記基板から該基板の識別情報を読み取る読取部、を備え、前記制御部は、前記読取部が読み取った前記基板の識別情報に基づいて、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したか否かを判定してもよい。こうすれば、基板高さ測定処理が行われた基板を基板保持部が再度保持したか否か、言い換えると、今回基板保持部が保持した基板が基板高さ測定処理が既に行われた基板と同一であるか否かを、基板の識別情報に基づいて適切に判定できる。 The substrate working device of the present disclosure includes a reading section that reads identification information of the substrate from the substrate, and the control section measures the substrate height based on the identification information of the substrate read by the reading section. It may be determined whether the substrate holding unit holds the processed substrate again. In this way, it is possible to check whether the substrate holder has held the substrate again after the substrate height measurement process has been performed, or in other words, whether the substrate held by the substrate holder this time is the substrate on which the substrate height measurement process has already been performed. Whether or not they are the same can be appropriately determined based on the identification information of the boards.

　本開示の対基板作業装置において、前記制御部は、前記基板保持部が前記基板を前回保持し且つ前記基板高さ測定処理が行われてから前記基板保持部が前記基板を今回保持するまでの間に作業者が該基板にアクセスしていないとみなせる場合には、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したと判定してもよい。 In the substrate-to-board working device of the present disclosure, the control unit is configured to control the process from when the substrate holding unit held the substrate last time and the substrate height measurement processing was performed until the substrate holding unit holds the substrate this time. If it can be assumed that the operator has not accessed the substrate during that time, it may be determined that the substrate holding unit has again held the substrate on which the substrate height measurement process was performed.

　本開示の対基板作業装置において、前記代表点は、前記所定の複数の測定点のうち互いの距離が最も遠い２点を含んでいてもよい。こうすれば、基板の高さに関してより代表的な２点が代表点に含まれる。したがって、代表点の測定結果に基づく上述した許容範囲内か否かの判定によって、基板高さ測定処理時と代表点測定処理時との基板の状態の相違が許容範囲内か否かをより適切に判定できる。 In the substrate-to-board working device of the present disclosure, the representative points may include two points that are farthest from each other among the plurality of predetermined measurement points. In this way, two points that are more representative regarding the height of the substrate are included in the representative points. Therefore, by determining whether or not the above-mentioned tolerance is within the range based on the measurement result of the representative point, it is possible to more appropriately determine whether the difference in the state of the board between the board height measurement process and the representative point measurement process is within the tolerance range. It can be determined that

　本開示の対基板作業装置において、前記代表点は、前記所定の複数の測定点のうち前記基板高さ測定処理の前記測定結果において所定の基準高さとの相違が最も大きい測定点を含んでいてもよい。 In the substrate-to-board working device of the present disclosure, the representative points include a measurement point having the largest difference from a predetermined reference height in the measurement result of the substrate height measurement process among the plurality of predetermined measurement points. Good too.

　本明細書では、出願当初の請求項４において「請求項１又は２に記載の対基板作業装置」を「請求項１～３のいずれか１項に記載の対基板作業装置」に変更した技術思想、出願当初の請求項５において「請求項１又は２に記載の対基板作業装置」を「請求項１～４のいずれか１項に記載の対基板作業装置」に変更した技術思想、及び、出願当初の請求項６において「請求項１又は２に記載の対基板作業装置」を「請求項１～５のいずれか１項に記載の対基板作業装置」に変更した技術思想も開示されている。 In this specification, a technology in which the "board-to-board working device according to claim 1 or 2" in claim 4 originally filed is changed to "the board-to-board working device according to any one of claims 1 to 3" Thought, a technical thought in which the "board-to-board working device according to claim 1 or 2" in claim 5 at the time of filing was changed to "the board-to-board working device according to any one of claims 1 to 4," and Also disclosed is a technical concept in which "the board-facing working device according to claim 1 or 2" is changed to "the board-facing working device according to any one of claims 1 to 5" in claim 6 at the time of filing. ing.

　本発明は、部品を基板に実装する作業などの対基板作業を行う各種産業に利用可能である。 The present invention can be used in various industries that perform board-to-board work such as mounting components on a board.

１　実装システム、１０　部品実装機、１１　基台、１２　筐体、１４　支持台、１５　部品供給装置、２０　基板搬送装置、２２　サイドフレーム、２４　コンベアベルト、３０　基板保持装置、３２　基板押さえプレート、３４　クランパ、３４ａ　突出部、３５　支持プレート、３５ａ　支持ピン、３６　昇降装置、３７　基板検知センサ、３７ａ　投光部、３７ｂ　受光部、３８　操作パネル、４０　ＸＹロボット、４１　Ｘ軸ガイドレール、４２　Ｘ軸スライダ、４３　Ｙ軸ガイドレール、４４　Ｙ軸スライダ、４６　Ｘ軸モータ、４７　Ｘ軸位置センサ、４８　Ｙ軸モータ、４９　Ｙ軸位置センサ、５０　実装ヘッド、５１　吸着ノズル、５２　Ｚ軸モータ、５３　Ｚ軸位置センサ、５５　マークカメラ、５８　パーツカメラ、６０　測距センサ、６１　照射部、６２　検出部、７０　制御装置、７１　ＣＰＵ、７２　ＲＯＭ、７３　ストレージ、７４　ＲＡＭ、７５　入出力インタフェース、７６　バス、８０　管理装置、８１　ＣＰＵ、８２　ＲＯＭ、８３　ストレージ、８４　ＲＡＭ、８５　入出力インタフェース、８６　バス、８７　入力デバイス、８８　ディスプレイ、１２１　左側壁、１２１ａ　開口部、１２２　右側壁、１２２ａ　開口部、１２３　カバー部材、１２３ａ　カバー開閉センサ、Ａ１～Ａ９　測定点、Ｐ　部品、Ｓ　基板。 1 Mounting system, 10 Component mounter, 11 Base, 12 Housing, 14 Support stand, 15 Component supply device, 20 Board transfer device, 22 Side frame, 24 Conveyor belt, 30 Board holding device, 32 Board holding plate, 34 Clamper, 34a protrusion, 35 support plate, 35a support pin, 36 lifting device, 37 board detection sensor, 37a light emitter, 37b light receiver, 38 operation panel, 40 XY robot, 41 X-axis guide rail, 42 X-axis slider , 43 Y-axis guide rail, 44 Y-axis slider, 46 X-axis motor, 47 X-axis position sensor, 48 Y-axis motor, 49 Y-axis position sensor, 50 Mounting head, 51 Suction nozzle, 52 Z-axis motor, 53 Z-axis Position sensor, 55 Mark camera, 58 Parts camera, 60 Distance sensor, 61 Irradiation unit, 62 Detection unit, 70 Control device, 71 CPU, 72 ROM, 73 Storage, 74 RAM, 75 Input/output interface, 76 Bus, 80 Management Device, 81 CPU, 82 ROM, 83 Storage, 84 RAM, 85 Input/output interface, 86 Bus, 87 Input device, 88 Display, 121 Left wall, 121a opening, 122 Right wall, 122a opening, 123 Cover member, 123a Cover open/close sensor, A1 to A9 measurement points, P parts, S board.

Claims

　基板に対して対基板作業を行う作業部と、
　前記基板を保持する基板保持部と、
　前記基板の基板高さを測定する高さ測定部と、
　前記基板保持部に保持された前記基板上の所定の複数の測定点において前記基板高さの測定を行うよう前記高さ測定部を制御する基板高さ測定処理を行い、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持した場合には、前記所定の複数の測定点の一部である代表点において前記基板高さの測定を行うよう前記高さ測定部を制御する代表点測定処理を行い、前記代表点測定処理の測定結果と前記基板高さ測定処理における前記代表点と同じ測定点の測定結果との相違が許容範囲内である場合には、前記所定の複数の測定点のうち前記代表点以外の測定点の前記基板高さの測定を省略する制御部と、
　を備えた対基板作業装置。 a working unit that performs board-to-board work on the board;
a substrate holding part that holds the substrate;
a height measurement unit that measures the substrate height of the substrate;
performing a substrate height measurement process that controls the height measurement unit to measure the substrate height at a plurality of predetermined measurement points on the substrate held by the substrate holding unit; When the substrate holder re-holds the substrate on which the measurement has been performed, the height measurement section is controlled to measure the substrate height at a representative point that is a part of the plurality of predetermined measurement points. If the difference between the measurement result of the representative point measurement process and the measurement result of the same measurement point as the representative point in the board height measurement process is within an allowable range, then a control unit that omits measurement of the substrate height at measurement points other than the representative point among the plurality of measurement points;
A board-to-board working device equipped with
　前記制御部は、前記相違が前記許容範囲内である場合には、前記代表点測定処理の測定結果を利用せず前記基板高さ測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせ、前記相違が前記許容範囲外である場合には、前記所定の複数の測定点のうち前記代表点以外の残りの測定点の前記基板高さの測定を行い、前記残りの測定点の測定結果及び前記代表点測定処理の測定結果を利用して前記作業部に前記対基板作業を行わせる、
　請求項１に記載の対基板作業装置。 If the difference is within the allowable range, the control unit may cause the working unit to use the measurement result of the substrate height measurement process without using the measurement result of the representative point measurement process. If the difference is outside the allowable range, measure the substrate height at the remaining measurement points other than the representative point among the plurality of predetermined measurement points, and causing the work unit to perform the board-facing work using the measurement results of the points and the measurement results of the representative point measurement process;
The substrate-to-board working device according to claim 1.
　請求項１又は２に記載の対基板作業装置であって、
　前記基板から該基板の識別情報を読み取る読取部、
　を備え、
　前記制御部は、前記読取部が読み取った前記基板の識別情報に基づいて、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したか否かを判定する、
　対基板作業装置。 The board-to-board working device according to claim 1 or 2,
a reading unit that reads identification information of the board from the board;
Equipped with
The control unit determines whether the substrate holding unit holds the substrate again, which has undergone the substrate height measurement process, based on the identification information of the substrate read by the reading unit.
Board-to-board working device.
　前記制御部は、前記基板保持部が前記基板を前回保持し且つ前記基板高さ測定処理が行われてから前記基板保持部が前記基板を今回保持するまでの間に作業者が該基板にアクセスしていないとみなせる場合には、前記基板高さ測定処理が行われた前記基板を前記基板保持部が再度保持したと判定する、
　請求項１又は２に記載の対基板作業装置。 The control unit is configured to allow a worker to access the substrate between when the substrate holding unit held the substrate last time and the substrate height measurement process was performed until the substrate holding unit held the substrate this time. If it can be considered that the substrate height measurement process has not been performed, it is determined that the substrate holding unit has held the substrate again after the substrate height measurement process was performed.
The substrate-to-board working device according to claim 1 or 2.
　前記代表点は、前記所定の複数の測定点のうち互いの距離が最も遠い２点を含む、
　請求項１又は２に記載の対基板作業装置。 The representative points include two points that are farthest from each other among the plurality of predetermined measurement points,
The substrate-to-board working device according to claim 1 or 2.
　前記代表点は、前記所定の複数の測定点のうち前記基板高さ測定処理の前記測定結果において所定の基準高さとの相違が最も大きい測定点を含む、
　請求項１又は２に記載の対基板作業装置。 The representative point includes a measurement point having the largest difference from a predetermined reference height in the measurement result of the substrate height measurement process among the plurality of predetermined measurement points.
The substrate-to-board working device according to claim 1 or 2.