WO2024000374A1 - 显示面板、显示装置 - Google Patents

显示面板、显示装置 Download PDF

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Publication number
WO2024000374A1
WO2024000374A1 PCT/CN2022/102734 CN2022102734W WO2024000374A1 WO 2024000374 A1 WO2024000374 A1 WO 2024000374A1 CN 2022102734 W CN2022102734 W CN 2022102734W WO 2024000374 A1 WO2024000374 A1 WO 2024000374A1
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WO
WIPO (PCT)
Prior art keywords
heating
area
display panel
display
heating wire
Prior art date
Application number
PCT/CN2022/102734
Other languages
English (en)
French (fr)
Inventor
邓银
李豪豪
吴博
左雄灿
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2022/102734 priority Critical patent/WO2024000374A1/zh
Priority to CN202280001973.XA priority patent/CN117693710A/zh
Publication of WO2024000374A1 publication Critical patent/WO2024000374A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel and a display device.
  • LCD monitors are often used in more extreme environments, such as low temperature environments, which requires the LCD monitor to be able to display normally in these extreme environments.
  • the viscosity coefficient of the liquid crystal is relatively large in a low-temperature environment, causing the response time of the liquid crystal to be significantly longer than that in a normal temperature environment, resulting in a visual smear effect, especially when the temperature is as low as the liquid crystal.
  • the crystallization temperature is close to the crystallization temperature, it greatly affects the display quality of the liquid crystal display.
  • a display panel which includes:
  • a substrate including a display area and a peripheral area surrounding the display area
  • a first conductive layer, located on one side of the substrate, includes a plurality of data lines located in the display area;
  • the second conductive layer located on the side of the first conductive layer away from the substrate, includes at least one first heating wire group.
  • the first heating wire group includes at least one first heating wire.
  • the hot wire extends from the display area to the peripheral area, and the first heating line and the data line extend in the same direction.
  • the orthographic projection of the first heating line on the substrate at least partially overlaps the orthographic projection of the data line on the substrate.
  • the display panel includes a black matrix layer located on a side of the second conductive layer away from the substrate,
  • the orthographic projection of the portion of the first heating line located in the display area on the substrate is within the orthographic projection of the black matrix layer on the substrate, and the data line is on the substrate.
  • the orthographic projection of is located within the orthographic projection of the black matrix layer on the substrate.
  • the orthographic projection of the portion of the first heating line located in the display area on the substrate is within the orthographic projection of the data line on the substrate.
  • the peripheral area further includes a first peripheral sub-area and a second peripheral sub-area, and the first peripheral sub-area and the second peripheral sub-area are located at two opposite sides of the display area. side;
  • the second conductive layer further includes at least one second heating wire group located in the first peripheral sub-region, and the second heating wire group includes at least one second heating wire;
  • Each of the first heating wires in the same first heating wire group intersects and is connected to each of the second heating wires in a second heating wire group.
  • the second conductive layer further includes at least two third heating wire groups located in the second peripheral sub-region, and the third heating wire group includes at least one third heating wire;
  • the number of the third heating wire group is twice the number of the second heating wire group
  • Some of the first heating wires in the same first heating wire group are intersectingly connected to each of the third heating wires in one of the third heating wire groups, and another part of the same first heating wire group The first heating wire is interconnected with each third heating wire in another third heating wire group.
  • the display panel further includes at least two heating binding terminals located in the second peripheral sub-region, and one of the third heating wire groups is electrically connected to one of the heating binding terminals. Connect, another said third heating wire group is electrically connected to another said heating binding terminal;
  • the first heating wire group, the second heating wire group, the two third heating wire groups and the two heating binding terminals are configured to form a first closed loop.
  • the display panel further includes at least one anti-static unit located in the peripheral area, and one of the first closed loops is electrically connected to at least one of the anti-static units.
  • the display panel further includes a plurality of first fan-out traces and a plurality of second fan-out traces located in the second peripheral sub-area, and the first fan-out traces are connected to the The data lines are electrically connected, and the second fan-out wiring is electrically connected to the third heating wire group and the heating binding terminal respectively;
  • An orthographic projection of the first fan-out trace on the substrate at least partially overlaps an orthographic projection of the second fan-out trace on the substrate.
  • the display panel is electrically connected to a flexible circuit board and at least one driver chip respectively;
  • the display panel further includes a plurality of display binding terminals located in the second peripheral sub-area, with a minimum distance from each display binding terminal to the display area on a plane parallel to the substrate. are greater than the minimum distance from the driving chip to the display area; the data line is electrically connected to the driving chip through the first fan-out line, and the driving chip is connected to the flexible display through the display binding terminal. circuit board electrical connections;
  • the heating binding terminals are arranged in the same row, and the display binding terminals are arranged in the same row, and the minimum distance between the heating binding terminals and the edge of the display panel is equal to the display binding terminals. The minimum distance between the edges of the display panel.
  • each of the heating binding terminals includes a first part and a second part, and all of the display binding terminals are located in an area between the first part and the second part.
  • each of the display binding terminals includes a first part and a second part
  • All of said heat-bonded terminals are located in an area between said first portion and said second portion;
  • a part of the heating binding terminals is located in an area between the first part and the second part, another part of the heating binding terminals is located in an area of the first part away from the second part, and another part of the heating binding terminals is located in an area of the first part away from the second part. Binding terminals are located in an area of the second portion remote from the first portion.
  • the display panel further includes a test unit located in the second peripheral sub-area, and the orthographic projection of the test unit on the substrate is consistent with the first fan-out trace and the The orthographic projections of the second fan-out traces on the substrate do not overlap;
  • the heat bonding terminals located in the area between the first part and the second part include a first group and a second group, and the test unit is located between the first group and the second group. area.
  • the display panel further includes a plurality of Dummy heating terminals located in the second peripheral sub-area.
  • Each of the Dummy heating terminals is arranged in the same row and is located away from the test unit.
  • the portion of the fourth heating line disposed in the first peripheral sub-region is located on a side of the second heating line away from the display area, and the fourth heating line is disposed in a portion of the second peripheral sub-region.
  • the orthographic projection of the fourth heating line on the substrate is at least the same as the orthographic projection of the first fan-out trace on the substrate. partial overlap;
  • One end of the fourth heating wire is connected to one of the heating binding terminals, and the other end of the fourth heating wire is connected to another of the heating binding terminals.
  • the fourth heating wire and the two heating binding terminals are configured to form a second closed loop.
  • the display panel includes one of the fourth heating lines located in the peripheral area, except that the fourth heating line is disposed in a portion of the second peripheral sub-area.
  • the line width of other parts of the fourth heating line is greater than the line width of the first heating line
  • the line width of other parts of the fourth heating line is greater than the line width of the second heating line
  • the fourth heating line The line width of other parts of the hot wire is greater than the line width of the third heating line.
  • FIGS 6, 7 and 8 are schematic structural diagrams of three display surface devices provided by embodiments of the present application.
  • Figure 10 is a schematic structural diagram of the first heating line and data line provided by the embodiment of the present application.
  • Figure 14 is a schematic diagram of the arrangement of heating lines in the display area and the first peripheral sub-area of the display panel provided by the embodiment of the present application;
  • Figure 15 is a schematic diagram of the arrangement of heating lines in the display area and the second peripheral sub-area of the display panel provided by the embodiment of the present application;
  • Figure 16 is a schematic structural diagram of the second peripheral sub-area of the display panel provided by the embodiment of the present application.
  • FIG. 17 is an enlarged view of the area where the heat-bonded terminals are located in FIG. 16 .
  • Liquid Crystal Display will be used in more extreme environments, such as low temperature environments, which requires the LCD to be able to display normally in these extreme environments.
  • the viscosity coefficient of the liquid crystal is relatively large in a low-temperature environment, causing the response time of the liquid crystal to be significantly longer than that in a normal temperature environment, resulting in a visual smear effect, especially when the temperature is as low as the liquid crystal.
  • the crystallization temperature is close to the crystallization temperature, it greatly affects the display quality of the liquid crystal display.
  • developing in-cell heating technology for liquid crystals in low-temperature environments is the key to solving this problem.
  • a heating wire is set up in the liquid crystal display, and the signal is input into the heating wire through an external FPC (Flexible Printed Circuit, flexible circuit board) used to control the heating signal, and the heating wire generates heat to realize the heating in a low-temperature environment.
  • FPC Flexible Printed Circuit, flexible circuit board
  • the mark 101 is the substrate of the display panel
  • the mark 102 is the edge position of the display area
  • the mark 103 is the heating line
  • the mark 104 is the COF (Chip On Film, Flip Chip) for heating.
  • the one marked 105 is the FPC for heating
  • the one marked 106 is the display driver chip (IC)
  • the one marked 107 is the binding terminal of the display FPC
  • the one marked 108 is the display FPC.
  • the heating lines in the related art are arranged in a direction parallel to the gate line (GL) and extend from the display area to the peripheral area.
  • the binding terminals of the FPC for heating are also The binding terminal 107 of the display FPC is usually provided on the lower side of the display panel.
  • embodiments of the present application provide a display panel, as shown in Figures 4, 5, 6, 7 and 8, including:
  • the substrate 200 includes a display area AA and a peripheral area surrounding the display area AA;
  • the first conductive layer located on one side of the substrate 200, includes a plurality of data lines DL located in the display area AA;
  • the second conductive layer located on the side of the first conductive layer away from the substrate 200, includes at least one first heating wire group.
  • the first heating wire group includes at least one first heating wire HL1.
  • the first heating wire HL1 extends from the display area AA Extending to the peripheral area, the first heating line HL1 and the data line DL extend in the same direction.
  • the above-mentioned display panel is an LCD (Liquid Crystal Display) display panel.
  • the LCD panel includes an array substrate, a color filter substrate, and a liquid crystal layer located between the array substrate and the color filter substrate.
  • substrate 200 refers to the substrate of the array substrate.
  • the substrate 200 may be a rigid substrate, such as glass.
  • the material of the above-mentioned first conductive layer is a conductive material.
  • the conductive material can be a metal material; the metal material can include at least one of copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti). or a combination of multiple.
  • the above-mentioned first conductive layer may be called a source-drain metal layer (SD layer), and may be used to form the data line DL and the source and drain of the transistor.
  • SD layer source-drain metal layer
  • the material of the above-mentioned second conductive layer is a conductive material.
  • the conductive material can be a metal material; the metal material can include at least one of copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti). or a combination of multiple.
  • first conductive layer and the second conductive layer are made of the same material.
  • the material of the second conductive layer can be selected from materials with better thermal effects. That is to say, the material of the second conductive layer can be selected from materials that easily generate heat under the action of electrical signals.
  • the specific position of the first heating line HL1 is not limited here.
  • the first heating line HL1 may be located in an area above the sub-pixel between two adjacent data lines DL, and overlap with the orthographic projection of the sub-pixel on the substrate 200 .
  • the orthographic projection of the first heating line HL1 on the substrate 200 and the orthographic projection of each sub-pixel on the substrate 200 do not overlap with each other.
  • the first heating line HL1 has less influence on the aperture ratio of the display panel, which can ensure that the display panel has a higher transmittance, improve the display effect, and reduce power consumption.
  • a first heating line HL1 may be provided between every two adjacent sub-pixels.
  • the orthographic projection of the first heating line HL1 on the substrate 200 at least partially overlaps with the orthographic projection of the data line DL on the substrate 200 .
  • the orthographic projection of the first heating line HL1 on the substrate 200 partially overlaps with the orthographic projection of the data line DL on the substrate 200;
  • the orthographic projection of the first heating line HL1 on the substrate 200 completely overlaps with the orthographic projection of the data line DL on the substrate 200 .
  • the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 is within the orthographic projection of the black matrix layer on the substrate 200 , including: the portion of the first heating line HL1 located in the display area AA is located on the substrate 200
  • the outer contour of the orthographic projection on the substrate 200 is located within the outer contour of the orthographic projection of the black matrix layer BM on the substrate 200; or, the outer contour of the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 is within The outer outline of the orthographic projection of the black matrix layer BM on the substrate 200 overlaps.
  • the orthographic projection of the data line DL on the substrate 200 is located within the orthographic projection of the black matrix layer BM on the substrate 200, including: the outer contour of the orthographic projection of the data line DL on the substrate 200 is located within the black matrix layer BM. within the outer contour of the orthographic projection on the substrate 200 ; or, the outer contour of the orthographic projection of the data line DL on the substrate 200 overlaps with the outer contour of the orthographic projection of the black matrix layer BM on the substrate 200 .
  • the orthographic projection of the two on the substrate 200 is located at the black matrix layer BM. Within the orthographic projection on substrate 200.
  • the outer contour of the orthographic projection of the data line DL on the substrate 200 is located on the black matrix layer BM.
  • the portion where the first heating line HL1 is located in the display area AA is located on the substrate 200.
  • the outer contour of the orthographic projection is located on the outer contour of the orthographic projection of the black matrix layer BM on the substrate 200.
  • the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 is located within the orthographic projection of the data line DL on the substrate 200 .
  • the peripheral area also includes a first peripheral sub-area B1 and a second peripheral sub-area B2, and the first peripheral sub-area B1 and the second peripheral sub-area B2 are located in the display area AA Opposite sides;
  • the second conductive layer also includes at least one second heating wire group located in the first peripheral sub-region B1, and the second heating wire group includes at least one second heating wire HL2;
  • the angle formed by the intersection of the first heating line HL1 and the second heating line HL2 is not limited.
  • the first heating line HL1 and the second heating line HL2 intersect and are perpendicular.
  • the second peripheral sub-area B2 includes a bonding area and a fan-out area, where the fan-out area is located between the bonding area and the display area, and at least various types of signal lines are provided in the fan-out area. Fan out the traces.
  • the number of the second heating wire groups is the same as the number of the first heating wire groups.
  • FIG. 12 and FIG. 13 respectively show two sets of first heating wire groups HL1Group and two sets of second heating wire groups HL2Group.
  • a first heating wire group HL1Group includes 16 first heating wires HL1
  • a second heating wire group HL2Group includes 4 second heating wires HL2.
  • a first heating wire group HL1Group includes 32 first heating wires HL1
  • a second heating wire group HL2Group includes 3 second heating wires HL2.
  • the number of the first heating wires HL1 included in the same first heating wire group can be adjusted according to the actual design. Generally, the number of the first heating wires HL1 included in the same first heating wire group is determined by the second peripheral sub-unit. The size of the design space of area B2 is determined.
  • the number of second heating wires HL2 included in the second heating wire group is greater than or equal to When there are 2 wires, set part of the second heating wire HL2 in the second heating wire group on the side of the area where the anti-static unit ESD is located away from the display area AA, and set the other part of the second heating wire HL2 in the second heating wire group on The area where the anti-static unit ESD is located is close to the side of the display area AA.
  • the orthographic projection of the second heating line HL2 on the substrate 200 on the side of the area where the anti-static unit ESD is located away from the display area AA in the second heating line group is equal to Orthographic projections of the Com signal lines on the substrate 200 at least partially overlap.
  • the Com signal line includes at least part of the line segment located on the gate layer and part of the line segment located on the source and drain metal layer.
  • some line segments of the Com signal line located on the gate layer have a block structure or a grid structure as shown in Figure 14.
  • the second conductive layer also includes at least two third heating wire groups located in the second peripheral sub-region B2, and the third heating wire group includes at least one third heating wire group.
  • the third heating wire group includes at least one third heating wire group.
  • Some of the first heating wires in the same first heating wire group are intersectingly connected to each third heating wire in a third heating wire group, and another part of the first heating wires in the same first heating wire group are connected to another third heating wire.
  • Each third heating wire in the hot wire group is intersected and connected.
  • the third heating wire group includes a plurality of third heating wires HL3, which can reduce the load of the third heating wire group, improve its conductivity, and facilitate the transmission of electrical signals.
  • multiple anti-static units ESD are also provided on the side of the second peripheral sub-area B2 close to the display area AA. As shown in Figure 15, each third heating line HL3 is located in this anti-static part. The area where the unit ESD is located is on the side away from the display area AA.
  • part of the same third heating wire group may be disposed on a side of the area where the anti-static unit ESD is located away from the display area AA, and the other part may be disposed on a side of the area where the anti-static unit ESD is located close to the display area AA. one side.
  • the display panel also includes at least two heating binding terminals 201 located in the second peripheral sub-area B2, and a third heating wire group is connected to one of the heating binding terminals.
  • the fixed terminal 201 is electrically connected, and another third heating wire group is electrically connected to another heating binding terminal 201; wherein, the first heating wire group, the second heating wire group, the two third heating wire groups and the two heating binding terminals are electrically connected.
  • the fixed terminal is configured to form a first closed loop.
  • FIG. 17 is an enlarged view of the area where the binding terminals are located in FIG. 16 .
  • the resistance of the parallel-connected heating wires is smaller.
  • W V 2 /R
  • the smaller the internal resistance R of the display panel the greater the power W generated on the panel.
  • the greater electrical power is conducive to the temperature rise of the display panel in a low-temperature environment, and its temperature rise rate is also faster.
  • the heating wire in the first closed loop is driven to generate heat by applying positive and negative voltages respectively to the two heating binding terminals of a first closed loop.
  • the display panel further includes at least one anti-static unit ESD located in the peripheral area, and a first closed loop is electrically connected to the at least one anti-static unit ESD.
  • the display panel includes a plurality of anti-static units ESD located in the peripheral area, where the specific location of the anti-static units ESD in the peripheral area is not limited.
  • a part of the anti-static unit ESD may be disposed in the first peripheral sub-area B1.
  • a part of the anti-static unit ESD may be disposed in the first peripheral sub-area B2.
  • the display panel further includes a plurality of first fan-out traces FL1 and a plurality of second fan-out traces FL2 located in the second peripheral sub-area B2 , the first fan-out trace line FL1 is electrically connected to the data line DL, and the second fan-out trace line FL2 is electrically connected to each third heating wire HL3 and the heating binding terminal 201 in the third heating wire group respectively;
  • the orthographic projection of the first fan-out trace FL1 on the substrate 200 and the orthographic projection of the second fan-out trace FL2 on the substrate 200 at least partially overlap.
  • the second peripheral sub-area B2 includes a bonding area B2-B and a fan-out area B2-F, where the first fan-out trace FL1 and the second fan-out trace FL2 They are all located in the fan-out area B2-F, and each heating binding terminal 201 is located in the binding area B2-B.
  • the first fan-out line FL1 may be located in the first conductive layer.
  • the first fan-out line FL1 may be located in the source-drain metal layer
  • the second fan-out line FL2 may be located in the second conductive layer.
  • the second fan-out trace FL2 also has a heating function.
  • the first fan-out line FL1 can be located in the source and drain metal layer, which means that the source and drain metal layer includes the first Fan-out trace FL1, other related descriptions have similar meanings as here.
  • the display panel may further include a third conductive layer, wherein the third conductive layer is located between the first conductive layer and the substrate 200 .
  • the third conductive layer is generally used to form gate lines GL and transistors. gate.
  • the first fan-out trace FL1 may be located in the third conductive layer.
  • part of the first fan-out trace FL1 is located in the first conductive layer, and part of the first fan-out trace FL1 is located in the third conductive layer.
  • the display panel is electrically connected to the flexible circuit board FPC and at least one driver chip IC respectively;
  • the display panel also includes a plurality of display binding terminals 202 located in the second peripheral sub-area B2. On a plane parallel to the substrate 200, the minimum distance between each display binding terminal 202 and the display area AA is greater than the driver chip IC. The minimum distance to the display area AA; the data line DL is electrically connected to the driver chip IC through the first fan-out line FL1, and the driver chip IC is electrically connected to the flexible circuit board FPC through the display binding terminal 202;
  • the minimum distance from each display binding terminal 202 to the display area AA is greater than the minimum distance from the driver chip IC to the display area AA. That is to say, at least part of the display binding terminals 202 is located at The driver chip IC is on the side away from the display area AA, and each display binding terminal 202 is used to electrically connect the driver chip IC to the flexible circuit board FPC. That is, the display binding terminals 202 involved in the embodiment of the present application refer to Display binding terminal for binding flexible circuit board FPC.
  • the display panel also includes display binding terminals for binding the driver chip IC and the first fan-out trace FL1 together.
  • the orthographic projection of this part of the display binding terminals on the substrate 200 is consistent with There is overlap in the orthographic projection of the driver chip IC on the substrate 200 .
  • the heating binding terminals 201 are arranged in the same row, the display binding terminals 202 are arranged in the same row, and the heating binding terminals 202 are arranged in the same row.
  • the minimum distance between the terminal 201 and the edge of the display panel is equal to the minimum distance between each display binding terminal 202 and the edge of the display panel.
  • the spacing between two adjacent heating binding terminals 201 is the same, and the spacing between two display binding terminals 202 is the same.
  • each display binding terminal 202 is electrically connected to one flexible circuit board FPC
  • each heating binding terminal 201 is electrically connected to another flexible circuit board FPC
  • two flexible circuit boards FPC with different functions are located on the display panel. same side.
  • each display binding terminal 202 and each heating binding terminal 201 have the same structure, and are electrically connected to the same flexible circuit board FPC, that is, each display binding terminal 202 and each heating binding terminal 201 share a flexible circuit board FPC.
  • each heating binding terminal 201 and the edge of the display panel equal to the minimum distance between each display binding terminal 202 and the edge of the display panel
  • each display binding The terminal 202 has the same structure as each heating binding terminal 201, and shares a flexible circuit board FPC, which can realize integrated binding of the heating binding terminal 201 and the display binding terminal 202, saving a flexible circuit board FPC and reducing the cost.
  • the difficulty of the binding process saves space for binding in the peripheral area of the display panel, reduces the manufacturing cost of the display panel, improves the internal heating efficiency of the display panel, and is also conducive to the preparation of display products with narrow borders.
  • each heated binding terminal 201 includes a first part and a second part, all showing a region where the binding terminal 202 is located between the first part and the second part.
  • the plurality of heating binding terminals 201 includes a first part located on the left side of all display binding terminals 202 and a second part located on the right side of all display binding terminals 202 .
  • each heating binding terminal 201 and each display binding terminal 202 have the same structure, the same size, and are arranged in the same row. In this way, the heating binding terminal 201 and the display binding terminal as shown in Figure 7 can be realized. 202 share the same flexible circuit board FPC.
  • all heating binding terminals 201 are located in the area between the first portion of the display binding terminals 202 and the second portion of the display binding terminals 202;
  • a part of the heating binding terminals 201 is located in the area between the first part of the display binding terminals 202 and the second part of the display binding terminals 202
  • another part of the heating binding terminals 201 is located in the area between the first part of the display binding terminals 202 and the second part of the display binding terminals 202
  • a portion of the display binding terminals 202 is located away from the second portion of the display binding terminals 202
  • the other portion of the heating binding terminals 201 is located in an area of the second portion of the display binding terminals 202 away from the first portion of the display binding terminals 202 .
  • the display panel also includes a test unit CT (Cell Test) located in the second peripheral sub-area B2, and the orthographic projection of the test unit CT on the substrate 200 is consistent with the first sector.
  • the orthographic projections of the outgoing trace line FL1 and the second fan outgoing trace line FL2 on the substrate 200 do not overlap;
  • the heating binding terminals 201 located in the area between the first part of the display binding terminals 202 and the second part of the display binding terminals 202 include a first group 201-G1 and a second group 201-G2, and the test unit CT is located in the first The area between the set of heat-bonded terminals 201-G1 and the second set of heat-bonded terminals 201-G2.
  • the display panel also includes multiple Dummy heating terminals 203 located in the second peripheral sub-area B2.
  • Each Dummy heating terminal 203 is arranged in the same row and is located in the test area.
  • each Dummy heating terminal 203 and the edge of the display panel is equal to the minimum distance between each heating binding terminal 201 and the edge of the display panel, and each Dummy heating terminal 203 is electrically connected to the flexible circuit board FPC.
  • each Dummy heating terminal 203 in the direction pointing to the second peripheral area B2 along the display area AA is smaller than that of each other heating terminal 201 in the direction pointing toward the second peripheral area B2 along the display area AA. size on.
  • binding mark patterns 204 located on both sides of the area where each heating binding terminal 201 is located, for alignment when the heating binding terminal 201 is bound to the flexible circuit board FPC.
  • a row of Dummy heating terminals 203 is arranged on the side of the test unit CT away from the display area AA, and the minimum distance between each Dummy heating terminal 203 and the edge of the display panel is bound to each heating terminal.
  • the minimum distance between the terminal 201 and the edge of the display panel is equal.
  • the first group of heating binding terminals 201-G1 and the second group of heating binding terminals 201-G2 When the flexible circuit board FPC is bound, since each heating binding terminal 201 is bound to the same flexible circuit board FPC, the first group of heating binding terminals 201-G1 and the second group of heating binding terminals 201-G1 are connected.
  • the Dummy heating terminals 203 between the binding terminals 201-G2 are beneficial to the stability of the electrical connection between each heating terminal and the flexible circuit board FPC.
  • the display panel also includes at least one fourth heating line HL4 located in the peripheral area.
  • the fourth heating line HL4 surrounds all the first heating lines HL1, the second heating line HL2 and the The third heating line HL3 setting;
  • the part of the fourth heating line HL4 disposed in the first peripheral sub-area B1 is located on the side of the second heating line HL2 away from the display area AA.
  • the fourth heating line HL4 is The portion of the hot line HL4 disposed in the second peripheral sub-area B2 is located on the side of the second fan-out line FL2 away from the display area AA; the orthographic projection of the fourth heating line HL4 on the substrate 200 is consistent with the position of the first fan-out line FL1 on the substrate. Orthographic projections on 200 at least partially overlap;
  • one end of the fourth heating wire HL4 is connected to one heating binding terminal 201, and the other end of the fourth heating wire HL4 is connected to another heating binding terminal 201.
  • the fourth heating wire HL4 and the two heating binding terminals 201 are configured as Able to form a second closed loop. Positive and negative voltages are applied in the second closed loop through the two heating binding terminals 201 to drive the heating wire in the second closed loop to generate heat.
  • the display panel includes a fourth heating line HL4 located in the peripheral area. Except for the part of the fourth heating line HL4 disposed in the second peripheral sub-area B2, other parts of the fourth heating line HL4 The line width is greater than the line width of the first heating line HL1, the line width of other parts of the fourth heating line HL4 is greater than the line width of the second heating line HL2, the line width of other parts of the fourth heating line HL4 is greater than the line width of the third heating line HL3 line width.
  • the display panel further includes a plurality of fourth heating lines HL4 located in the peripheral area, and the plurality of fourth heating lines HL4 are arranged in parallel.
  • the above line width refers to the size of the heating line perpendicular to its extending direction.
  • the second closed loop may be electrically connected to at least one anti-static unit ESD.
  • the display binding terminal 202 and the heating binding terminal 201 are arranged on the same side of the display panel, and each binding terminal electrically connected to the flexible circuit board FPC is arranged.
  • the structure of the fixed terminals is the same, and the minimum distance between these binding terminals and the edge of the display panel is the same.
  • the display binding terminal 202 and the heating binding terminal 201 can use the same flexible circuit board FPC, realizing the integration of the FPC.
  • the bonding technology simplifies the bonding process and saves the cost of FPC. At the same time, there is no need to reserve additional space for bonding and heating binding terminals, which meets the requirements of narrow borders and achieves the purpose of high-power heating of the panel.
  • the above-mentioned display panel may also include other structures.
  • the structures related to the invention are introduced.
  • Other structures of the above-mentioned liquid crystal display panel can be obtained based on related technologies or common knowledge, and will not be described again here.
  • Embodiments of the present application provide a display device, including a flexible circuit board, at least one driver chip, and a display panel as described above.
  • the display panel is electrically connected to the flexible circuit board and the driver chip respectively.
  • the structure of the display panel can be referred to the previous description and will not be described again.
  • the display device shown in FIG. 7 includes one driver chip IC; the display devices shown in FIGS. 6 and 8 include two driver chip ICs.
  • each display binding terminal 202 and heating binding terminal 201 share a flexible circuit board FPC.
  • the above-mentioned display device is a liquid crystal display device, and the above-mentioned liquid crystal display device may be a TN (Twisted Nematic) type, VA (Vertical Alignment, vertical alignment) type, IPS (In-Plane Switching, plane switching) type or ADS (Advanced Super Dimension Switch, advanced super-dimensional field switching) type and other liquid crystal display devices.
  • TN Transmission Nematic
  • VA Vertical Alignment, vertical alignment
  • IPS In-Plane Switching, plane switching
  • ADS Advanced Super Dimension Switch, advanced super-dimensional field switching
  • the display device may be a display device such as an LCD monitor, or any product or component with a display function such as a television, a digital camera, a mobile phone, a tablet computer, etc. including these display devices.
  • the display device provided by the embodiments of the present application has a high display effect under low temperature conditions and is suitable for display products with narrow borders.

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Abstract

提供了一种显示面板，包括衬底（200），显示区（AA）和围绕显示区（AA）的周边区；第一导电层，位于衬底（200）的一侧，包括位于显示区（AA）的多条数据线（DL）；第二导电层，位于第一导电层远离衬底（200）的一侧，包括至少一个第一加热线组，第一加热线组包括至少一条第一加热线（HL1），第一加热线（HL1）从显示区（AA）延伸至周边区、且第一加热线（HL1）与数据线（DL）的延伸方向相同。显示面板在低温条件下具有较高的显示效果，且适用于窄边框的显示产品。

Description

显示面板、显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板、显示装置。
背景技术
液晶显示器经常会在比较极端的环境下使用，比如低温环境，这就需要液晶显示器能够满足在这些极端环境下正常进行显示。但是，由于液晶自身性质的影响，在低温环境下，液晶的粘滞系数偏大，导致液晶的响应时间相对于常温环境明显偏大，造成视觉上的拖影效果，尤其当温度低至液晶的结晶温度附近时，极大的影响了液晶显示器的显示质量。
发明内容
本申请的实施例采用如下技术方案：
第一方面，本申请的实施例提供了一种显示面板，其中，包括：
衬底，包括显示区和围绕所述显示区的周边区；
第一导电层，位于所述衬底的一侧，包括位于所述显示区的多条数据线；
第二导电层，位于所述第一导电层远离所述衬底的一侧，包括至少一个第一加热线组，所述第一加热线组包括至少一条第一加热线，所述第一加热线从所述显示区延伸至所述周边区、且所述第一加热线与所述数据线的延伸方向相同。
在本申请的一些实施例中，所述第一加热线在所述衬底上的正投影与所述数据线在所述衬底上的正投影至少部分重叠。
在本申请的一些实施例中，所述显示面板包括位于所述第二导电层远离所述衬底一侧的黑色矩阵层，
所述第一加热线位于所述显示区的部分在所述衬底上的正投影位于所述黑色矩阵层在所述衬底上的正投影以内，且所述数据线在所述衬底上的正投影位于所述黑色矩阵层在所述衬底上的正投影以内。
在本申请的一些实施例中，所述第一加热线位于所述显示区的部分在所述衬底上的正投影位于所述数据线在所述衬底上的正投影以内。
在本申请的一些实施例中，所述周边区还包括第一周边子区和第二周边子区，所述第一周边子区和所述第二周边子区位于所述显示区相对的两侧；
所述第二导电层还包括位于所述第一周边子区的至少一个第二加热线组，所述第二加热线组包括至少一条第二加热线；
同一所述第一加热线组中的各所述第一加热线分别与一个所述第二加热线组中的各所述第二加热线相交且连接。
在本申请的一些实施例中，所述第二导电层还包括位于所述第二周边子区的至少两个第三加热线组，所述第三加热线组包括至少一条第三加热线；
所述第三加热线组的数量为所述第二加热线组的数量的两倍；
同一所述第一加热线组中的部分所述第一加热线与一个所述第三加热线组中的各所述第三加热线相交连接，同一所述第一加热线组中的另一部分所述第一加热线与另一个所述第三加热线组中的各所述第三加热线相交连接。
在本申请的一些实施例中，所述显示面板还包括位于所述第二周边子区的至少两个加热绑定端子，一个所述第三加热线组与其中一个所述加热绑定端子电连接，另一个所述第三加热线组与另一个所述加热绑定端子电连接；
所述第一加热线组、所述第二加热线组、两个所述第三加热线组与两个所述加热绑定端子被配置为能够形成一个第一闭合回路。
在本申请的一些实施例中，所述显示面板还包括位于所述周边区的至少一个防静电单元，一个所述第一闭合回路与至少一个所述防静电单元电连接。
在本申请的一些实施例中，所述显示面板还包括位于所述第二周边子区的多条第一扇出走线和多条第二扇出走线，所述第一扇出走线与所述数据线电连接，所述第二扇出走线分别与所述第三加热线组和所述加热绑定端子电连接；
所述第一扇出走线在所述衬底上的正投影与所述第二扇出走线在所述衬底上的正投影至少部分交叠。
在本申请的一些实施例中，所述显示面板分别与柔性电路板和至少一个驱动芯片电连接；
所述显示面板还包括位于所述第二周边子区的多个显示绑定端子，在沿 平行于所述衬底所在的平面上，各所述显示绑定端子到所述显示区的最小距离均大于所述驱动芯片到所述显示区的最小距离；所述数据线通过所述第一扇出走线与所述驱动芯片电连接，所述驱动芯片通过所述显示绑定端子与所述柔性电路板电连接；
各所述加热绑定端子同排设置，各所述显示绑定端子同排设置，且所述加热绑定端子到所述显示面板的边缘之间的最小距离等于所述显示绑定端子到所述显示面板的边缘之间的最小距离。
在本申请的一些实施例中，各所述显示绑定端子与各所述加热绑定端子的结构相同，且均与同一所述柔性电路板电连接。
在本申请的一些实施例中，各所述加热绑定端子包括第一部分和第二部分，所有所述显示绑定端子位于所述第一部分和所述第二部分之间的区域。
在本申请的一些实施例中，各所述显示绑定端子包括第一部分和第二部分，
所有所述加热绑定端子位于所述第一部分和所述第二部分之间的区域；
或者，
一部分所述加热绑定端子位于所述第一部分和所述第二部分之间的区域，又一部分所述加热绑定端子位于所述第一部分远离所述第二部分的区域，另一部分所述加热绑定端子位于所述第二部分远离所述第一部分的区域。
在本申请的一些实施例中，所述显示面板还包括位于所述第二周边子区的测试单元，所述测试单元在所述衬底上的正投影与所述第一扇出走线和所述第二扇出走线在所述衬底上的正投影均不交叠；
位于所述第一部分和所述第二部分之间的区域的所述加热绑定端子包括第一组和第二组，所述测试单元位于所述第一组和所述第二组之间的区域。
在本申请的一些实施例中，所述显示面板还包括位于所述第二周边子区的多个Dummy加热端子，各所述Dummy加热端子同排设置、且均位于所述测试单元远离所述显示区的一侧；
其中，各所述Dummy加热端子到所述显示面板的边缘之间的最小距离与各所述加热绑定端子到所述显示面板的边缘之间的最小距离相等，各所述Dummy加热端子均与所述柔性电路板电连接。
在本申请的一些实施例中，所述显示面板还包括位于所述周边区的至少一条第四加热线，所述第四加热线围绕所有所述第一加热线、所述第二加热线和所述第三加热线设置；
所述第四加热线设置在所述第一周边子区的部分位于所述第二加热线远离所述显示区的一侧，所述第四加热线设置在所述第二周边子区的部分位于所述第二扇出走线远离所述显示区的一侧；所述第四加热线在所述衬底上的正投影与所述第一扇出走线在所述衬底上的正投影至少部分交叠；
所述第四加热线的一端连接一个所述加热绑定端子，所述第四加热线的另一端连接另一个所述加热绑定端子，所述第四加热线和两个所述加热绑定端子被配置为能够形成一个第二闭合回路。
在本申请的一些实施例中，所述显示面板包括位于所述周边区的一条所述第四加热线，除所述第四加热线设置在所述第二周边子区的部分之外，所述第四加热线的其它部分的线宽大于所述第一加热线的线宽，所述第四加热线的其它部分的线宽大于所述第二加热线的线宽，所述第四加热线的其它部分的线宽大于所述第三加热线的线宽。
或者，所述显示面板还包括位于所述周边区的多条所述第四加热线，多条所述第四加热线并联设置。
第二方面，本申请的实施例提供了一种显示装置，包括柔性电路板、至少一个驱动芯片和上述第一方面所述的显示面板，所述显示面板分别与所述柔性电路板和所述驱动芯片电连接。
上述说明仅是本申请技术方案的概述，为了能够更清楚了解本申请的技术手段，而可依照说明书的内容予以实施，并且为了让本申请的上述和其它目的、特征和优点能够更明显易懂，以下特举本申请的具体实施方式。
附图说明
为了更清楚地说明本申请实施例或相关技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1A和图1B为本申请的实施例提供的两种相关技术中的显示装置的结构示意图；
图2和图3为本申请的实施例提供的两种相关技术中的显示面板的结构示意图；
图4、图5和图9为本申请的实施例提供的三种显示面板的结构示意图；
图6、图7和图8为本申请的实施例提供的三种显示面装置的结构示意图；
图10为本申请的实施例提供的第一加热线和数据线的结构示意图；
图11为本申请的实施例提供的显示面板中的加热线的排布示意图；
图12和图13为本申请的实施例提供的两种第一加热线与第二加热线的排布示意图；
图14为本申请的实施例提供的显示面板的显示区和第一周边子区的加热线的排布示意图；
图15为本申请的实施例提供的显示面板的显示区和第二周边子区的加热线的排布示意图；
图16为本申请的实施例提供的显示面板的第二周边子区的结构示意图；
图17为图16中加热绑定端子所在区域的放大图。
具体实施例
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在图中，为了清晰，可能夸大了区域和层的厚度。在图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。此外，附图仅为本申请的示意性图解，并非一定是按比例绘制。
另外，除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的 描述中，术语“一个实施例”、“一些实施例”、“示例性实施例”、“示例”、“特定示例”或“一些示例”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本申请的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
液晶显示器(Liquid Crystal Display，LCD)会在比较极端的环境下使用，比如低温环境，这就需要液晶显示器满足在这些极端环境下能够正常进行显示。但是，由于液晶自身性质的影响，在低温环境下，液晶的粘滞系数偏大，导致液晶的响应时间相对于常温环境明显偏大，造成视觉上的拖影效果，尤其当温度低至液晶的结晶温度附近时，极大的影响了液晶显示器的显示质量。为了拓宽液晶显示器的应用范围，开发低温环境下液晶的盒内加热技术是解决该问题的关键。
在相关技术中，使用在液晶显示器内设置加热线的方式，通过外接用于控制加热信号的FPC(Flexible Printed Circuit，柔性电路板)将信号输入加热线，由加热线产生热量实现在低温环境中对面板加热的目的。如图1A和图1B所示，标记101的为显示面板的衬底，标记102的为显示区的边缘位置，标记103的为加热线，标记104的为加热用COF(Chip On Film，覆晶薄膜)，标记105的为加热用FPC，标记106的为显示用驱动芯片(IC)，标记107的为显示用FPC的绑定端子，标记108的为显示用FPC。结合图1A、图2和图3所示，相关技术中的加热线沿平行于栅线(GL)方向排布，并从显示区延伸至周边区，相应的，加热用FPC的绑定端子也设置在显示面板的左侧边或右侧边，然而，通常，显示用FPC的绑定端子107设置在显示面板的下侧边。为了实现正常的显示和满足液晶盒内加热的要求，需要同时绑定显示用FPC和加热用FPC两个专用FPC用来供电，增加了生产成本和工艺复杂度，而且加热线的绑定需要额外预留更大的边框。
基于此，本申请的实施例提供了一种显示面板，如图4、图5、图6、图7和图8所示，包括：
衬底200，包括显示区AA和围绕显示区AA的周边区；
第一导电层，位于衬底200的一侧，包括位于显示区AA的多条数据线 DL；
第二导电层，位于第一导电层远离衬底200的一侧，包括至少一个第一加热线组，第一加热线组包括至少一条第一加热线HL1，第一加热线HL1从显示区AA延伸至周边区、且第一加热线HL1与数据线DL的延伸方向相同。
上述显示面板为LCD(Liquid Crystal Display，液晶显示器)显示面板，液晶显示面板包括阵列基板、彩膜基板和位于阵列基板与彩膜基板之间的液晶层。
需要说明的是，上述衬底200指的是阵列基板的衬底。
示例性的，衬底200可以为刚性衬底，例如，玻璃。
上述第一导电层的材料为导电材料，示例性的，导电材料可以为金属材料；金属材料可以包括铜(Cu)、铝(Al)、钼(Mo)、钛(Ti)中的至少一种或多种的组合。
在一些实施例中，上述第一导电层可以称作源漏金属层(SD层)，可以用于形成数据线DL以及晶体管的源极和漏极。
上述第二导电层的材料为导电材料，示例性的，导电材料可以为金属材料；金属材料可以包括铜(Cu)、铝(Al)、钼(Mo)、钛(Ti)中的至少一种或多种的组合。
这里对于上述第一导电层和第二导电层的材料是否相同不进行限定。
在一些实施例中，第二导电层的材料可以从热效应较好的材料中进行选择，也就是说，第二导电层的材料可以选择在电信号的作用下易发热的材料。
这里对于上述第一加热线HL1的具***置不进行限定。
示例性的，第一加热线HL1可以位于相邻的两条数据线DL之间的子像素上方的区域，且与子像素在衬底200上的正投影存在交叠。
示例性的，如图4所示，第一加热线HL1位于相邻的像素单元之间；或者，如图5和图9所示，第一加热线HL1位于相邻的两个子像素之间。
此时，第一加热线HL1在衬底200上的正投影与各子像素在衬底200上的正投影互不交叠。此时，第一加热线HL1对显示面板的开口率的影响较小，能够保证显示面板具有较高的透过率，提高显示效果，降低功耗。
这里对于上述第一加热线组的数量、每个第一加热线组中包括的第一加热线HL1的数量不进行限定，具体可以根据显示面板使用环境的温度确定。
示例性的，如图4所示，可以在每相邻两个像素单元之间设置一条第一加热线HL1，其中，图4中所示的一个像素单元包括三个子像素。
示例性的，如图5或如图9所示，可以在每相邻两个子像素之间设置一条第一加热线HL1。
这里对于第一加热线HL1在衬底200上的正投影的形状不进行限定。示例性的，在第一加热线HL1位于相邻的像素单元之间，或者，第一加热线HL1位于相邻的两个子像素之间的情况下，如图10所示，第一加热线HL1在衬底200上的正投影的形状可以与数据线DL在衬底200上的正投影的形状类似。
在本申请的实施例中，通过设置第一加热线HL1沿着数据线DL的延伸方向设置，这样，在后续工艺中，在绑定加热用FPC的过程中，可以将加热用FPC与显示用FPC(与数据线电连接的FPC)设置在显示面板的同一侧边，使得加热用FPC的绑定区域与显示用FPC的绑定区域共用，这样，能够改善液晶显示面板在低温环境下显示异常的同时，很大程度上节省显示面板的周边区的设计空间，从而有利于窄边框显示产品的制备。
在本申请的一些实施例中，如图4和图9所示，第一加热线HL1在衬底200上的正投影与数据线DL在衬底200上的正投影至少部分重叠。
上述第一加热线HL1在衬底200上的正投影与数据线DL在衬底200上的正投影至少部分重叠包括但不限于以下情况：
第一、第一加热线HL1在衬底200上的正投影与数据线DL在衬底200上的正投影部分重叠；
第二、第一加热线HL1在衬底200上的正投影与数据线DL在衬底200上的正投影完全重叠。
在本申请的实施例中，通过设置第一加热线HL1在衬底200上的正投影与数据线DL在衬底200上的正投影至少部分重叠，能够在改善液晶显示面板在低温环境下显示异常的同时，很大程度上确保设置第一加热线HL1后，显示面板的开口率尽可能不减小，尽可能的避免设置第一加热线HL1后对 显示面板的透过率的负面影响，保证显示面板的透过率，从而提高显示效果。
在本申请的一些实施例中，显示面板包括位于第二导电层远离衬底200一侧的黑色矩阵层BM，第一加热线HL1位于显示区AA的部分在衬底200上的正投影位于黑色矩阵层在衬底200上的正投影以内，且数据线DL在衬底200上的正投影位于黑色矩阵层BM在衬底200上的正投影以内。
需要说明的是，在液晶显示面板中，黑色矩阵层BM通常设置在彩膜基板上，在阵列基板与彩膜基板对盒后，黑色矩阵层BM位于第二导电层远离阵列基板的衬底200一侧。其中，黑色矩阵层BM具有遮光或吸光作用。
上述第一加热线HL1位于显示区AA的部分在衬底200上的正投影位于黑色矩阵层在衬底200上的正投影以内包括：第一加热线HL1位于显示区AA的部分在衬底200上的正投影的外轮廓位于黑色矩阵层BM在衬底200上的正投影的外轮廓以内；或者，第一加热线HL1位于显示区AA的部分在衬底200上的正投影的外轮廓与黑色矩阵层BM在衬底200上的正投影的外轮廓重叠。
类似的，数据线DL在衬底200上的正投影位于黑色矩阵层BM在衬底200上的正投影以内包括：数据线DL在衬底200上的正投影的外轮廓位于黑色矩阵层BM在衬底200上的正投影的外轮廓以内；或者，数据线DL在衬底200上的正投影的外轮廓与黑色矩阵层BM在衬底200上的正投影的外轮廓重叠。
在实际应用中，为了避免第一加热线HL1和数据线DL对显示面板中的光线存在反射作用，增加了显示面板的反射率，设置两者在衬底200上的正投影位于黑色矩阵层BM在衬底200上的正投影以内。
需要说明的是，显示面板的反射率越高，在显示面板的显示面上越容易出现镜面反射，投射出环境物的影子，从而造成显示效果降低。
另外，考虑到显示面板的膜层之间除了光线的反射作用，还存在光线的折射和散射作用，故而，设置数据线DL在衬底200上的正投影的外轮廓位于黑色矩阵层BM在衬底200上的正投影的外轮廓以内，设置第一加热线HL1位于显示区AA的部分在衬底200上的正投影的外轮廓位于黑色矩阵层BM在衬底200上的正投影的外轮廓以内，这样，能够更好的降低数据线DL 和第一加热线HL1对显示光线的反射作用，降低显示面板的反射率，提高显示效果。
在本申请的一些实施例中，第一加热线HL1位于显示区AA的部分在衬底200上的正投影位于数据线DL在衬底200上的正投影以内。
在示例性的实施例中，第一加热线HL1位于显示区AA的部分在衬底200上的正投影位于数据线DL在衬底200上的正投影以内包括：第一加热线HL1位于显示区AA的部分在衬底200上的正投影的外轮廓位于数据线DL在衬底200上的正投影的外轮廓以内；或者，第一加热线HL1位于显示区AA的部分在衬底200上的正投影的外轮廓与数据线DL在衬底200上的正投影的外轮廓重叠。
在实际应用中，通过设置第一加热线HL1位于显示区AA的部分在衬底200上的正投影位于数据线DL在衬底200上的正投影以内，这样，几乎能够避免第一加热线HL1位于显示区AA的部分对显示区AA的开口率的影响，从而确保显示面板的显示区AA具有较高的透过率，提高了显示面板的显示效果。
在本申请的一些实施例中，如图11所示，周边区还包括第一周边子区B1和第二周边子区B2，第一周边子区B1和第二周边子区B2位于显示区AA相对的两侧；
第二导电层还包括位于第一周边子区B1的至少一个第二加热线组，第二加热线组包括至少一条第二加热线HL2；
同一第一加热线组中的各第一加热线HL1分别与一个第二加热线组中的各第二加热线HL2相交且连接。
这里对于上述第一加热线HL1与第二加热线HL2相交之后形成的夹角的角度不进行限定。示例性的，如图11和图12所示，第一加热线HL1与第二加热线HL2相交且垂直。
在示例性的实施例中，第二周边子区B2包括绑定区和扇出区，其中，扇出区位于绑定区和显示区之间，扇出区中至少设置有各类信号线的扇出走线。
在示例性的实施例中，第二加热线组的数量与第一加热线组的数量相同。
示例性的，图12和图13中分别示出了两组第一加热线组HL1Group和两组第二加热线组HL2Group。
其中，在图12中，一组第一加热线组HL1Group包括16条第一加热线HL1，一组第二加热线组HL2Group包括4条第二加热线HL2，结合图12和图14所示，第二加热线HL2越靠近显示区AA设置，越有利于提升显示面板中的温度，从而改善因低温液晶粘滞性变差造成的显示异常的问题。
在图13中，一组第一加热线组HL1Group包括32条第一加热线HL1，一组第二加热线组HL2Group包括3条第二加热线HL2。
其中，同一组第一加热线组中包括的第一加热线HL1的数量可以根据实际设计进行调整，通常，同一组第一加热线组中包括的第一加热线HL1的数量由第二周边子区B2的设计空间的大小确定。
示例性的，同一组第一加热线组中包括的第一加热线HL1的数量越多，由于同一组第一加热线组中包括的第一加热线HL1并联设置，在通过第二周边子区B2中是扇出走线与加热绑定端子电连接时，可以节省扇出走线的数量，从而能够节省第二周边子区B2的设计空间。
在实际应用中，如图14所示，由于第一周边子区B1靠近显示区AA的一侧设置有多个防静电单元ESD，第一加热线HL1位于第一周边子区B1的部分从相邻两个防静电单元ESD之间穿过，第二加热线HL2也需要避开设置防静电单元ESD的区域，故而，在第二加热线组中包括的第二加热线HL2的数量大于或等于2条时，将第二加热线组中一部分的第二加热线HL2设置在防静电单元ESD所在区域远离显示区AA的一侧，将第二加热线组中另一部分第二加热线HL2设置在防静电单元ESD所在区域靠近显示区AA的一侧。
在示例性的实施例中，如图14所示，第二加热线组中设置在防静电单元ESD所在区域远离显示区AA的一侧的第二加热线HL2在衬底200上的正投影与Com信号线在衬底200上的正投影至少部分交叠。
示例性的，Com信号线至少包括位于栅极层的部分线段和位于源漏金属层的部分线段。其中，Com信号线位于栅极层的部分线段为块状结构或如图14中所示的网格状结构。
第二加热线组中设置在防静电单元ESD所在区域远离显示区AA的一侧的第二加热线HL2在衬底200上的正投影与Com信号线位于栅极层的部分线段在衬底200上的正投影部分交叠。
需要说明的是，在本申请中，涉及“一部分，另一部分”的相关描述并不是限定仅包括两部分，还可以包括第三部分、第四部分，具体可以根据实际情况确定，这里做出说明。
在本申请的一些实施例中，结合图11和图15所示，第二导电层还包括位于第二周边子区B2的至少两个第三加热线组，第三加热线组包括至少一条第三加热线HL3；第三加热线组的数量为第二加热线组的数量的两倍；
同一第一加热线组中的部分第一加热线与一个第三加热线组中的各第三加热线相交连接，同一第一加热线组中的另一部分第一加热线与另一个第三加热线组中的各第三加热线相交连接。
在示例性的实施例中，第三加热线组包括多条第三加热线HL3，这样，能够降低第三加热线组的负载，提高其导电率，有利于电信号的传输。
在示例性的实施例中，如图15所示，示出了一组第一加热线组和两组第三加热线组，其中，该第一加热线组包括16条第一加热线HL1，每组第三加热线组包括3条第三加热线HL3。该第一加热线组中一半的第一加热线HL1与其中一组第三加热线组相交且连接，该第一加热线组中另外一半的第一加热线HL1与其中另一组第三加热线组相交且连接。
在示例性的实施例中，第二周边子区B2中靠近显示区AA的一侧也设置有多个防静电单元ESD，如图15所示，各第三加热线HL3均位于这部分防静电单元ESD所在区域远离显示区AA的一侧。
在示例性的实施例中，同一第三加热线组中的一部分可以设置在防静电单元ESD所在区域远离显示区AA的一侧，另一部分可以设置在防静电单元ESD所在区域靠近显示区AA的一侧。
在本申请的一些实施例中，如图16和图17所示，显示面板还包括位于第二周边子区B2的至少两个加热绑定端子201，一个第三加热线组与其中一个加热绑定端子201电连接，另一个第三加热线组与另一个加热绑定端子201电连接；其中，第一加热线组、第二加热线组、两个第三加热线组与两 个加热绑定端子被配置为能够形成一个第一闭合回路。其中，图17是图16中绑定端子所在区域的放大图。
在示例性的实施例中，由于显示面板内部的加热线均采取并联方式，因此，在相同的外加电压V下，并联之后的加热线的电阻更小，根据功率公式，W＝V 2/R，显示面板内部电阻R越小，面板上产生的功率W越大，更大的电功率有利于显示面板在低温环境下的温升，其温升速率也更快。
在实际应用中，通过在一个第一闭合回路的两个加热绑定端子上分别施加正负电压，驱使第一闭合回路中的加热线发热。
在本申请的一些实施例中，显示面板还包括位于周边区的至少一个防静电单元ESD，一个第一闭合回路与至少一个防静电单元ESD电连接。
在示例性的实施例中，显示面板中包括位于周边区的多个防静电单元ESD，其中，这里对于防静电单元ESD在周边区中的具体设置位置不进行限定。
示例性的，如图14所示，一部分防静电单元ESD可以设置在第一周边子区B1中。
示例性的，如图15所示，一部分防静电单元ESD可以设置在第一周边子区B2中。
在本申请的一些实施例中，结合图15、图16和图17所示，显示面板还包括位于第二周边子区B2的多条第一扇出走线FL1和多条第二扇出走线FL2，第一扇出走线FL1与数据线DL电连接，第二扇出走线FL2分别与第三加热线组中的各第三加热线HL3和加热绑定端子201电连接；
如图15所示，第一扇出走线FL1在衬底200上的正投影与第二扇出走线FL2在衬底200上的正投影至少部分交叠。
在示例性的实施例中，如图16所示，第二周边子区B2包括绑定区B2-B和扇出区B2-F，其中，第一扇出走线FL1和第二扇出走线FL2均位于扇出区B2-F，各加热绑定端子201位于绑定区B2-B。
在示例性的实施例中，第一扇出走线FL1可以位于第一导电层中，例如第一扇出走线FL1可以位于源漏金属层中，第二扇出走线FL2位于第二导电层中。
在示例性的实施例中，第二扇出走线FL2也具备加热功能。
可以理解，在本申请的实施例中，“位于某一层”指的是该层包括的含义，例如，第一扇出走线FL1可以位于源漏金属层中指的是源漏金属层包括第一扇出走线FL1，其它相关的描述的含义与此处类似。
在示例性的实施例中，显示面板还可以包括第三导电层，其中，第三导电层位于第一导电层和衬底200之间，第三导电层通常用于形成栅线GL和晶体管的栅极。
在一些实施例中，第一扇出走线FL1可以位于第三导电层中。
在另一些实施例中，部分第一扇出走线FL1位于第一导电层中，部分第一扇出走线FL1位于第三导电层中。
在本申请的一些实施例中，如图6、图7和图8所示，显示面板分别与柔性电路板FPC和至少一个驱动芯片IC电连接；
显示面板还包括位于第二周边子区B2的多个显示绑定端子202，在沿平行于衬底200所在的平面上，各显示绑定端子202到显示区AA的最小距离均大于驱动芯片IC到显示区AA的最小距离；数据线DL通过第一扇出走线FL1与驱动芯片IC电连接，驱动芯片IC通过显示绑定端子202与柔性电路板FPC电连接；
在沿平行于衬底200所在的平面上，各显示绑定端子202到显示区AA的最小距离均大于驱动芯片IC到显示区AA的最小距离，也就是说，至少部分显示绑定端子202位于驱动芯片IC远离显示区AA的一侧，且各显示绑定端子202用于将驱动芯片IC与柔性电路板FPC电连接，即本申请的实施例中涉及的显示绑定端子202指的是用于绑定柔性电路板FPC的显示绑定端子。
在实际应用中，显示面板中还包括用于将驱动芯片IC与第一扇出走线FL1绑定在一起的显示绑定端子，通常，这部分显示绑定端子在衬底200上的正投影与驱动芯片IC在衬底200上的正投影存在交叠。
在示例性的实施例中，结合图6、图7、图8、图16和图17所示，各加热绑定端子201同排设置，各显示绑定端子202同排设置，且加热绑定端子201到显示面板的边缘之间的最小距离等于各显示绑定端子202到显示面板 的边缘之间的最小距离。
在示例性的实施例中，相邻两个加热绑定端子201之间的间距相同，两个显示绑定端子202之间的间距相同。
在一些实施例中，各显示绑定端子202与一个柔性电路板FPC电连接，各加热绑定端子201与另一个柔性电路板FPC电连接，两个不同功能的柔性电路板FPC位于显示面板的同一侧。
在本申请的一些实施例中，各显示绑定端子202与各加热绑定端子201的结构相同，且均与同一柔性电路板FPC电连接，即各显示绑定端子202与各加热绑定端子201共用一个柔性电路板FPC。
在本申请的实施例中，通过设置各加热绑定端子201到显示面板的边缘之间的最小距离等于各显示绑定端子202到显示面板的边缘之间的最小距离，在设置各显示绑定端子202与各加热绑定端子201的结构相同，且共用一个柔性电路板FPC，能够实现加热绑定端子201与显示绑定端子202的一体化绑定，节省了一个柔性电路板FPC，降低了绑定工艺的难度，节省了显示面板周边区中用于绑定的空间，降低了显示面板的制备成本，在提高显示面板内部加热效率的同时，还有利于制备窄边框的显示产品。
需要说明的是，由于相较于相关技术中，将加热线平行于栅线GL设置，本申请的实施例中将第一加热线HL1平行于数据线DL设置，在实际应用时，可以一定程度上提高第一加热线HL1的设置密度，从而能够提高加热线对显示面板的加热效率，提高升温速度，提升了低温环境下液晶快速响应的速率。
在本申请的一些实施例中，如图7所示，各加热绑定端子201包括第一部分和第二部分，所有显示绑定端子202位于第一部分和第二部分之间的区域。
在示例性的实施例中，如图7所示，该显示面板包括一颗驱动芯片IC，驱动芯片IC位于第二周边子区B2的中央区域，显示绑定端子202位于驱动芯片IC远离显示区AA的一侧，在图7中，并未绘制出数据线DL和第一扇出走线FL1，实际应用中，各第一扇出走线FL1和各第二扇出走线FL1相交且绝缘。
其中，多个加热绑定端子201包括位于所有显示绑定端子202左侧的第一部分以及位于所有显示绑定端子202右侧的第二部分。
在一些实施例中，各加热绑定端子201和各显示绑定端子202结构相同、尺寸相同且同排设置，这样，可以实现如图7中所示的加热绑定端子201和显示绑定端子202共用同一柔性电路板FPC。
在示例性的实施例中，如图6或图8所示，该显示面板包括两颗驱动芯片IC，此时，各显示绑定端子202包括两部分，第一部分和第二部分，一个驱动芯片IC与第一部分显示绑定端子202电连接，另一个驱动芯片IC与第二部分显示绑定端子202电连接。其中，在图6和图8中，第一部分显示绑定端子202可以为左侧的显示绑定端子，第二部分显示绑定端子202可以为右侧的显示绑定端子。
在一些实施例中，如图8所示，所有加热绑定端子201位于第一部分显示绑定端子202和第二部分显示绑定端子202之间的区域；
在另外一些实施例中，如图6所示，一部分加热绑定端子201位于第一部分显示绑定端子202和第二部分显示绑定端子202之间的区域，又一部分加热绑定端子201位于第一部分显示绑定端子202远离第二部分显示绑定端子202的区域，另一部分加热绑定端子201位于第二部分显示绑定端子202远离第一部分显示绑定端子202的区域。
在本申请的一些实施例中，如图16所示，显示面板还包括位于第二周边子区B2的测试单元CT(Cell Test)，测试单元CT在衬底200上的正投影与第一扇出走线FL1和第二扇出走线FL2在衬底200上的正投影均不交叠；
其中，位于第一部分显示绑定端子202和第二部分显示绑定端子202之间的区域的加热绑定端子201包括第一组201-G1和第二组201-G2，测试单元CT位于第一组加热绑定端子201-G1和第二组加热绑定端子201-G2之间的区域。
在本申请的一些实施例中，如图16和图17所示，显示面板还包括位于第二周边子区B2的多个Dummy加热端子203，各Dummy加热端子203同排设置、且均位于测试单元CT远离显示区AA的一侧；
其中，各Dummy加热端子203到显示面板的边缘之间的最小距离与各 加热绑定端子201到显示面板的边缘之间的最小距离相等，各Dummy加热端子203均与柔性电路板FPC电连接。
在示例性的实施例中，如图17所示，各Dummy加热端子203沿显示区AA指向第二周边区B2方向上的尺寸小于其它各加热端子201沿显示区AA指向第二周边区B2方向上的尺寸。
在图17中，还包括位于各加热绑定端子201所在区域两侧的绑定标记图案204，用于在加热绑定端子201与柔性电路板FPC绑定时进行对位。
在本申请的实施例中，通过在测试单元CT远离显示区AA的一侧设置一排Dummy加热端子203，并使得各Dummy加热端子203到显示面板的边缘之间的最小距离与各加热绑定端子201到显示面板的边缘之间的最小距离相等，这样，在不影响测试单元CT正常使用的情况下，将第一组加热绑定端子201-G1和第二组加热绑定端子201-G2之间的空白区域连接起来，在进行柔性电路板FPC的绑定时，由于各加热绑定端子201与同一柔性电路板FPC绑定，第一组加热绑定端子201-G1和第二组加热绑定端子201-G2之间Dummy加热端子203有利于各加热端子与柔性电路板FPC的电连接稳定性。
在本申请的一些实施例中，如图11所示，显示面板还包括位于周边区的至少一条第四加热线HL4，第四加热线HL4围绕所有第一加热线HL1、第二加热线HL2和第三加热线HL3设置；
结合图11和图14所示，第四加热线HL4设置在第一周边子区B1的部分位于第二加热线HL2远离显示区AA的一侧，结合图11和图15所示，第四加热线HL4设置在第二周边子区B2的部分位于第二扇出走线FL2远离显示区AA的一侧；第四加热线HL4在衬底200上的正投影与第一扇出走线FL1在衬底200上的正投影至少部分交叠；
其中，第四加热线HL4的一端连接一个加热绑定端子201，第四加热线HL4的另一端连接另一个加热绑定端子201，第四加热线HL4和两个加热绑定端子201被配置为能够形成一个第二闭合回路。通过两个加热绑定端子201在第二闭合回路中施加正负电压，驱使第二闭合回路中的加热线发热。
在本申请的一些实施例中，显示面板包括位于周边区的一条第四加热线 HL4，除第四加热线HL4设置在第二周边子区B2的部分之外，第四加热线HL4的其它部分的线宽大于第一加热线HL1的线宽，第四加热线HL4的其它部分的线宽大于第二加热线HL2的线宽，第四加热线HL4的其它部分的线宽大于第三加热线HL3的线宽。
或者，显示面板还包括位于周边区的多条第四加热线HL4，多条第四加热线HL4并联设置。
上述线宽指的是加热线沿垂直于其延伸方向上的尺寸。
在示例性的实施例中，第二闭合回路可以与至少一个防静电单元ESD电连接。
在本申请的实施例中，通过调整加热线的布线方式，将显示绑定端子202和加热绑定端子201设置到显示面板的同一侧边上，并设置与柔性电路板FPC电连接的各绑定端子的结构相同，且这些绑定端子到显示面板的边缘之间的最小距离相同，这样，能够使得显示绑定端子202和加热绑定端子201通用同一柔性电路板FPC，实现了FPC的一体化绑定技术，简化了绑定工艺流程，节约了FPC的成本，同时不需要额外为绑定加热绑定端子预留空间，实现了窄边框的要求，实现了对面板高功率加热的目的。
需要说明的是，上述显示面板还可以包括其它结构，这里仅介绍与发明点相关的结构，上述液晶显示面板的其它结构可以根据相关技术或者公知常识获得，这里不再赘述。
本申请的实施例提供了一种显示装置，包括柔性电路板、至少一个驱动芯片和如前文所述的显示面板，该显示面板分别与柔性电路板和驱动芯片电连接。
该显示面板的结构可以参考前文说明，这不再赘述。
在示例性的实施例中，在图7所示的显示装置中，包括一个驱动芯片IC；在图6和图8所示的显示装置中，包括两个驱动芯片IC。
在图6-图8中，各显示绑定端子202和加热绑定端子201均共用一个柔性电路板FPC。
上述显示装置为液晶显示装置，上述液晶显示装置可以是TN(Twisted  Nematic，扭曲向列)型、VA(Vertical Alignment，垂直取向)型、IPS(In-Plane Switching，平面转换)型或ADS(Advanced Super Dimension Switch，高级超维场转换)型等液晶显示装置。
该显示装置可以是LCD显示器等显示器件以及包括这些显示器件的电视、数码相机、手机、平板电脑等任何具有显示功能的产品或者部件。本申请的实施例提供的显示装置在低温条件下具有较高的显示效果，且适用于窄边框的显示产品。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (18)

  1. 一种显示面板，其中，包括：
    衬底，包括显示区和围绕所述显示区的周边区；
    第一导电层，位于所述衬底的一侧，包括位于所述显示区的多条数据线；
    第二导电层，位于所述第一导电层远离所述衬底的一侧，包括至少一个第一加热线组，所述第一加热线组包括至少一条第一加热线，所述第一加热线从所述显示区延伸至所述周边区、且所述第一加热线与所述数据线的延伸方向相同。
  2. 根据权利要求1所述的显示面板，其中，所述第一加热线在所述衬底上的正投影与所述数据线在所述衬底上的正投影至少部分重叠。
  3. 根据权利要求2所述的显示面板，其中，所述显示面板包括位于所述第二导电层远离所述衬底一侧的黑色矩阵层，
    所述第一加热线位于所述显示区的部分在所述衬底上的正投影位于所述黑色矩阵层在所述衬底上的正投影以内，且所述数据线在所述衬底上的正投影位于所述黑色矩阵层在所述衬底上的正投影以内。
  4. 根据权利要求3所述的显示面板，其中，所述第一加热线位于所述显示区的部分在所述衬底上的正投影位于所述数据线在所述衬底上的正投影以内。
  5. 根据权利要求2所述的显示面板，其中，所述周边区还包括第一周边子区和第二周边子区，所述第一周边子区和所述第二周边子区位于所述显示区相对的两侧；
    所述第二导电层还包括位于所述第一周边子区的至少一个第二加热线组，所述第二加热线组包括至少一条第二加热线；
    同一所述第一加热线组中的各所述第一加热线分别与一个所述第二加热线组中的各所述第二加热线相交且连接。
  6. 根据权利要求5所述的显示面板，其中，所述第二导电层还包括位于所述第二周边子区的至少两个第三加热线组，所述第三加热线组包括至少一条第三加热线；
    所述第三加热线组的数量为所述第二加热线组的数量的两倍；
    同一所述第一加热线组中的部分所述第一加热线与一个所述第三加热线组中的各所述第三加热线相交连接，同一所述第一加热线组中的另一部分所述第一加热线与另一个所述第三加热线组中的各所述第三加热线相交连接。
  7. 根据权利要求6所述的显示面板，其中，所述显示面板还包括位于所述第二周边子区的至少两个加热绑定端子，一个所述第三加热线组与其中一个所述加热绑定端子电连接，另一个所述第三加热线组与另一个所述加热绑定端子电连接；
    所述第一加热线组、所述第二加热线组、两个所述第三加热线组与两个所述加热绑定端子被配置为能够形成一个第一闭合回路。
  8. 根据权利要求7所述的显示面板，其中，所述显示面板还包括位于所述周边区的至少一个防静电单元，一个所述第一闭合回路与至少一个所述防静电单元电连接。
  9. 根据权利要求7所述的显示面板，其中，所述显示面板还包括位于所述第二周边子区的多条第一扇出走线和多条第二扇出走线，所述第一扇出走线与所述数据线电连接，所述第二扇出走线分别与所述第三加热线组和所述加热绑定端子电连接；
    所述第一扇出走线在所述衬底上的正投影与所述第二扇出走线在所述衬底上的正投影至少部分交叠。
  10. 根据权利要求9所述的显示面板，其中，所述显示面板分别与柔性电路板和至少一个驱动芯片电连接；
    所述显示面板还包括位于所述第二周边子区的多个显示绑定端子，在沿平行于所述衬底所在的平面上，各所述显示绑定端子到所述显示区的最小距离均大于所述驱动芯片到所述显示区的最小距离；所述数据线通过所述第一扇出走线与所述驱动芯片电连接，所述驱动芯片通过所述显示绑定端子与所述柔性电路板电连接；
    各所述加热绑定端子同排设置，各所述显示绑定端子同排设置，且所述加热绑定端子到所述显示面板的边缘之间的最小距离等于所述显示绑定端子到所述显示面板的边缘之间的最小距离。
  11. 根据权利要求10所述的显示面板，其中，各所述显示绑定端子与各所述加热绑定端子的结构相同，且均与同一所述柔性电路板电连接。
  12. 根据权利要求11所述的显示面板，其中，各所述加热绑定端子包括第一部分和第二部分，所有所述显示绑定端子位于所述第一部分和所述第二部分之间的区域。
  13. 根据权利要求11所述的显示面板，其中，各所述显示绑定端子包括第一部分和第二部分，
    所有所述加热绑定端子位于所述第一部分和所述第二部分之间的区域；
    或者，
    一部分所述加热绑定端子位于所述第一部分和所述第二部分之间的区域，又一部分所述加热绑定端子位于所述第一部分远离所述第二部分的区域，另一部分所述加热绑定端子位于所述第二部分远离所述第一部分的区域。
  14. 根据权利要求13所述的显示面板，其中，所述显示面板还包括位于所述第二周边子区的测试单元，所述测试单元在所述衬底上的正投影与所述第一扇出走线和所述第二扇出走线在所述衬底上的正投影均不交叠；
    位于所述第一部分和所述第二部分之间的区域的所述加热绑定端子包括第一组和第二组，所述测试单元位于所述第一组和所述第二组之间的区域。
  15. 根据权利要求14所述的显示面板，其中，所述显示面板还包括位于所述第二周边子区的多个Dummy加热端子，各所述Dummy加热端子同排设置、且均位于所述测试单元远离所述显示区的一侧；
    其中，各所述Dummy加热端子到所述显示面板的边缘之间的最小距离与各所述加热绑定端子到所述显示面板的边缘之间的最小距离相等，各所述Dummy加热端子均与所述柔性电路板电连接。
  16. 根据权利要求9-15中任一项所述的显示面板，其中，所述显示面板还包括位于所述周边区的至少一条第四加热线，所述第四加热线围绕所有所述第一加热线、所述第二加热线和所述第三加热线设置；
    所述第四加热线设置在所述第一周边子区的部分位于所述第二加热线远离所述显示区的一侧，所述第四加热线设置在所述第二周边子区的部分位于所述第二扇出走线远离所述显示区的一侧；所述第四加热线在所述衬底上 的正投影与所述第一扇出走线在所述衬底上的正投影至少部分交叠；
    所述第四加热线的一端连接一个所述加热绑定端子，所述第四加热线的另一端连接另一个所述加热绑定端子，所述第四加热线和两个所述加热绑定端子被配置为能够形成一个第二闭合回路。
  17. 根据权利要求16所述的显示面板，其中，所述显示面板包括位于所述周边区的一条所述第四加热线，除所述第四加热线设置在所述第二周边子区的部分之外，所述第四加热线的其它部分的线宽大于所述第一加热线的线宽，所述第四加热线的其它部分的线宽大于所述第二加热线的线宽，所述第四加热线的其它部分的线宽大于所述第三加热线的线宽。
    或者，所述显示面板还包括位于所述周边区的多条所述第四加热线，多条所述第四加热线并联设置。
  18. 一种显示装置，其中，包括柔性电路板、至少一个驱动芯片和如权利要求1-17中任一项所述的显示面板，所述显示面板分别与所述柔性电路板和所述驱动芯片电连接。
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CN108983476A (zh) * 2018-08-31 2018-12-11 上海天马微电子有限公司 液晶显示面板与液晶显示装置
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CN113109964A (zh) * 2021-04-26 2021-07-13 厦门天马微电子有限公司 一种阵列基板、液晶显示面板和显示装置

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JP2007199338A (ja) * 2006-01-26 2007-08-09 Epson Imaging Devices Corp 液晶装置及び電子機器
US20200343270A1 (en) * 2017-10-24 2020-10-29 HKC Corporation Limited Array substrate and display panel
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