WO2023281908A1 - Method for manufacturing electronic component and electronic component - Google Patents

Method for manufacturing electronic component and electronic component Download PDF

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Publication number
WO2023281908A1
WO2023281908A1 PCT/JP2022/019427 JP2022019427W WO2023281908A1 WO 2023281908 A1 WO2023281908 A1 WO 2023281908A1 JP 2022019427 W JP2022019427 W JP 2022019427W WO 2023281908 A1 WO2023281908 A1 WO 2023281908A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
electronic substrate
support member
electronic
substrate
Prior art date
Application number
PCT/JP2022/019427
Other languages
French (fr)
Japanese (ja)
Inventor
太郎 松前
隆之 河口
Original Assignee
Ｋｙｂ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｋｙｂ株式会社 filed Critical Ｋｙｂ株式会社
Publication of WO2023281908A1 publication Critical patent/WO2023281908A1/en

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

Definitions

  • the present invention relates to an electronic component manufacturing method and an electronic component.
  • An electronic component having a substrate has terminals that are joined to the substrate mounted on the support member by, for example, soldering.
  • Patent Literature 1 describes that connection terminals are inserted into through-holes formed in a substrate, and the through-hole portions are soldered to connect the substrate and the terminals.
  • the terminals are heated, but the amount of heat transferred to the supporting member is small. After being fixed to the substrate in the folded state, it contracts. Therefore, for example, when the terminal and the substrate are joined while the substrate is fixed to the supporting portion, the substrate cannot follow the contraction of the terminal, and stress is generated in the terminal and the substrate, and the joint portion of the terminal is damaged. There is concern about the possibility of damage.
  • the supporting portion is not fixed to the substrate, the substrate can follow the contraction of the terminals, but the substrate may vibrate and break when the electronic component is used. Therefore, it is required to suppress the risk of breakage.
  • the present invention has been made in view of the above, and it is an object of the present invention to provide an electronic component manufacturing method and an electronic component that can suppress the risk of damage to the joints of terminals.
  • a method for manufacturing an electronic component according to the present disclosure includes the steps of: placing an electronic substrate on one surface of a support member; The method includes bonding the electronic substrate and the terminal portion in an unfixed state, and fixing the electronic substrate to which the terminal portion is bonded and the supporting substrate with an adhesive.
  • an electronic component includes a support member and a hole provided on one surface of the support member and opening from one surface to the other surface. is formed on an electronic substrate, a terminal portion joined to the electronic substrate, and a cover member attached to one surface of the support member so as to cover the electronic substrate, wherein the support member and the electronic The substrate and the cover member are fixed via an adhesive provided over the upper side, the inner side, and the lower side of the hole.
  • FIG. 1 is a schematic cross-sectional view of an electronic component according to this embodiment.
  • FIG. 2 is a schematic perspective view of the board unit.
  • FIG. 3 is a schematic top view of the support member according to this embodiment.
  • FIG. 4 is a schematic diagram of a cover member.
  • FIG. 5 is a schematic top view of the electronic component with the cover member attached.
  • FIG. 6 is a schematic diagram illustrating the method for manufacturing an electronic component according to this embodiment.
  • FIG. 7 is a schematic diagram for explaining the method for manufacturing an electronic component according to this embodiment.
  • FIG. 8 is a flow chart for explaining the manufacturing flow of the electronic component according to this embodiment.
  • FIG. 1 is a schematic cross-sectional view of an electronic component according to this embodiment.
  • FIG. 2 is a schematic perspective view of the board unit.
  • the electronic component 1 according to this embodiment is a rotating electric machine.
  • the electronic component 1 is a motor unit having a substrate and a motor, more specifically, a brushless motor unit.
  • the electronic component 1 is used, for example, in an electric steering device for a vehicle, and provides a steering assist force to a steering shaft of the vehicle.
  • the application of the electronic component 1 is not limited thereto.
  • the electronic component 1 is not limited to a rotating electrical machine, and may be any electronic device.
  • the electronic component 1 includes a casing 10, a stator 20, a rotor 30, a busbar unit 40, a holding member 50, a substrate unit 60, a support member 100, a cover member 110, bearings B1 and B2.
  • FIG. 2 is a diagram of only the substrate unit 60 extracted from the electronic component 1.
  • the board unit 60 is a unit having a plurality of boards, and includes a control board 62, an electronic board 70, a connector section 80, and a connection member 90.
  • the predetermined direction in the coordinate system of the electronic component 1 is defined as the Z direction
  • one of the directions along the Z direction is defined as the Z1 direction (first direction)
  • the other of the directions along the Z direction is defined as the Z direction.
  • the direction, that is, the direction opposite to the Z1 direction is the Z2 direction (second direction).
  • the casing 10 is a housing that accommodates the stator 20, the rotor 30, the busbar unit 40, the holding member 50, and the control board 62 inside.
  • the casing 10 is a hollow member with an opening in the Z1 direction, and is a cylindrical member that is circular when viewed from the Z direction in this embodiment.
  • Casing 10 includes a bottom portion 12 and side portions 14 .
  • the bottom portion 12 constitutes the bottom surface of the casing 10 on the Z2 direction side.
  • the bottom portion 12 is formed with an opening 12A through which a drive shaft 32, which will be described later, is inserted.
  • the bottom portion 12 is provided with a bearing B1 as a bearing. Bearing B1 is fixed relative to bottom 12 .
  • the side portion 14 constitutes the side surface of the casing 10 .
  • the side portion 14 is provided so as to surround the outer edge of the bottom portion 12 and extends from the outer edge of the bottom portion 12 in the Z1 direction.
  • the casing 10 accommodates the stator 20 , the rotor 30 , the busbar unit 40 , the holding member 50 and the control board 62 in the space SP surrounded by the bottom portion 12 and the side portions 14 .
  • the casing 10 is composed of an aluminum alloy member. More specifically, the casing 10 is composed of a member of the ADC 12 standardized by JIS. However, the material of the casing 10 may be arbitrary.
  • a stator 20 is a stator of the electronic component 1 and a rotor 30 is a rotor of the electronic component 1 . It can be said that the casing 10 , the stator 20 , the rotor 30 , the busbar unit 40 and the holding member 50 constitute the motor 16 .
  • the stator 20 is provided within the space SP of the casing 10 .
  • Stator 20 includes a stator core 22 and stator coils 24 .
  • the stator core 22 is the core of the stator 20, and is formed with a through hole 22A penetrating in the Z direction at a central position when viewed in the Z direction.
  • the stator core 22 is made of a magnetic material, more specifically, an iron-based member.
  • An iron-based member is a member containing iron as a main component. More specifically, the stator core 22 according to this embodiment is made of an electromagnetic steel sheet.
  • the stator core 22 is configured by stacking electromagnetic steel plate members in the Z direction.
  • the stator core 22 is not limited to being composed of electromagnetic steel sheets, and is not limited to being composed of members laminated in the Z direction.
  • the stator coil 24 is the coil of the stator 20.
  • the stator coil 24 includes U-phase, V-phase, and W-phase electromagnetic coils.
  • the stator coil 24 is wound around the stator core 22 .
  • the rotor 30 is provided within the space SP of the casing 10 .
  • the rotor 30 has a drive shaft 32 and a rotor core 34 .
  • Rotor core 34 is the core of rotor 30 .
  • the rotor core 34 has a plurality of magnetic poles arranged in the circumferential direction.
  • the rotor core 34 is formed with a through-hole penetrating in the Z-direction at a center position viewed from the Z-direction.
  • the drive shaft 32 is a shaft inserted into a through hole of the rotor core 34 and fixed to the rotor core 34 .
  • the rotor 30 has the outer peripheral surface of the rotor core 34 provided in the through hole 22A of the stator core 22 .
  • the rotor 30 is provided within the through hole 22A such that the drive shaft 32 extends along the Z direction.
  • the drive shaft 32 preferably extends in the Z direction, and more preferably the axial direction of the drive shaft 32 extends along the Z direction
  • the rotor 30 is provided in the through hole 22A so as to be rotatable with respect to the stator 20.
  • the rotor 30 rotates around the center axis of the drive shaft 32 along the Z direction as a rotation axis due to electromagnetic action with the stator 20 .
  • the busbar unit 40 is provided on the Z1 direction side of the stator coil 24 in the space SP of the casing 10 .
  • the busbar unit 40 is a plate-shaped (disk-shaped here) member including a plurality of busbars and a busbar holder.
  • the busbar is a conductive member and is connected to each of the U-phase, V-phase, and W-phase of the stator coil 24 .
  • the busbar holder is an insulating member that covers the busbar.
  • the holding member 50 is provided on the Z1 direction side of the busbar unit 40 in the space SP of the casing 10 .
  • the holding member 50 is a plate-shaped (disc-shaped here) member that holds the bearing B2.
  • a drive shaft 32 of the rotor 30 is rotatably supported by bearings B1 and B2. That is, the drive shaft 32 has a portion on the Z2 direction side rotatably inserted in the bearing B1, and a portion on the Z1 direction side of the portion inserted in the bearing B1 rotatably inserted in the bearing B2.
  • control board As shown in FIG. 1 , the control board 62 is provided on the Z1 direction side of the holding member 50 within the space SP of the casing 10 . That is, it can be said that the control board 62 is provided on the Z1 direction side of the motor 16 in the space SP of the casing 10 .
  • the control board 62 is electrically connected to the busbars of the busbar unit 40 .
  • the control board 62 is a circuit board on which an ECU (Electronic Control Unit) circuit of the electronic component 1 is provided.
  • the control board 62 receives the driving current and the control signal input to the connector section 80 via the electronic board 70 and the connection member 90 .
  • the drive current is a current for driving the motor 16, and the control signal is an electrical signal for controlling the driving of the motor 16.
  • FIG. The control board 62 applies a drive current to the motor 16 to drive the motor 16 according to the control signal.
  • the electronic board 70 is provided on the Z1 direction side of the control board 62 .
  • the electronic board 70 is provided outside the space SP of the casing 10 .
  • the electronic board 70 extends from one end 70A to the other end 70B.
  • 70 A of edge parts are in the position which overlaps with the control board 62, when it sees from a Z direction, and it can be said that it exists in the position which overlaps with the casing 10.
  • the end portion 70B is positioned so as not to overlap with the control board 62 when viewed in the Z direction, and can be said to be positioned so as not to overlap with the casing 10 .
  • the electronic board 70 is directed outward in the radial direction when the drive shaft 32 is the central axis (the central axis of the motor 16 along the Z direction) from a position overlapping the control board 62 and the casing 10 . It extends to a position that does not overlap with 10.
  • the electronic board 70 is electrically connected to the control board 62 via the connection member 90 and is also electrically connected to the connector section 80 .
  • the electronic board 70 is connected to the connection member 90 at a location overlapping the casing 10 when viewed in the Z direction.
  • the electronic board 70 may be connected to the connecting member 90 at the end 70A, or may be connected to the connecting member 90 at a portion between the end 70A and the end 70B.
  • the electronic board 70 is connected to the connector section 80 at a location that does not overlap with the casing 10 when viewed in the Z direction.
  • the electronic board 70 may be connected to the connector portion 80 at the end portion 70B, or may be connected to the connector portion 80 at a portion between the end portions 70A and 70B.
  • the electronic board 70 has a current conducting portion 72A that conducts the driving current and a signal conducting portion 72B that conducts the control signal.
  • the current-conducting portion 72A and the signal-conducting portion 72B can be said to be wiring that conducts current, and are sheet-like wiring patterns in this embodiment. It is preferable that the electronic board 70 is not mounted with electronic components (mounted components) other than the current conducting portion 72A and the signal conducting portion 72B. Further, in the present embodiment, the area of the current conducting portion 72A is larger than the area of the signal conducting portion 72B. Although this allows the drive current to be conducted appropriately, the size relationship between the current conducting portion 72A and the signal conducting portion 72B is not limited to this and may be arbitrary. Note that the area here may be the area of the cross section of the current conducting portion 72A and the signal conducting portion 72B perpendicular to the direction in which the current flows. It may be called the area of the current conduction portion 72A and the signal conduction portion 72B.
  • the electronic substrate 70 is configured by laminating a plurality of layers, in other words, it has a plurality of layers of current-conducting portions 72A. Since the electronic substrate 70 has a multi-layer structure, the area of the current conduction portion 72A can be secured and the drive current can be appropriately passed. Further, as shown in FIG. 2, the electronic board 70 is formed with a plurality of connection holes CH1, a plurality of connection holes CH2, and a plurality of connection holes CH3 penetrating through each layer.
  • the connection hole CH1 is formed on the end portion 70B side, that is, at a position that does not overlap the control board 62 (casing 10) when viewed from the Z direction.
  • a terminal portion 82 of a connector portion 80 which will be described later, is inserted into the connection hole CH1.
  • the connection hole CH2 is formed on the end portion 70A side, that is, at a position overlapping the control board 62 (casing 10) when viewed from the Z direction.
  • a current connection portion 92 of a connection member 90 which will be described later, is inserted into the connection hole CH2.
  • the connection hole CH3 is formed on the end portion 70A side, that is, at a position overlapping the control board 62 (casing 10) when viewed from the Z direction.
  • a signal connection portion 94 of a connection member 90 which will be described later, is inserted into the connection hole CH3.
  • the current conduction portion 72A is electrically connected to a part of the connection hole CH1 and the connection hole CH2. Further, the signal conducting portion 72B is electrically connected to another part of the connection hole CH1 and the connection hole CH3.
  • the number of layers of the electronic board 70 and the wiring pattern of each layer may be arbitrary.
  • the electronic substrate 70 is not limited to having a structure in which a plurality of layers are laminated, and may have any structure having a current conducting portion 72A and a signal conducting portion 72B.
  • the electronic substrate 70 is not limited to the configuration in which the current conduction portion 72A and the signal conduction portion 72B are formed on the substrate, but may be wiring having the current conduction portion 72A and the signal conduction portion 72B.
  • the electronic substrate 70 is formed with a hole portion 74 penetrating from one surface to the other surface.
  • the hole portion 74 is a hole for applying an adhesive that fixes the electronic substrate 70 to the support member 100 and the cover member 110 .
  • the hole portion 74 is formed between a portion where the connection hole CH1 is provided and a portion where the connection holes CH2 and CH3 are provided.
  • a plurality of holes 74 are formed, and two are formed in the example of FIG. However, the number of holes 74 may be arbitrary.
  • the connector portion 80 has a plurality of terminal portions 82 and a cover portion 84 that accommodates the plurality of terminal portions 82 .
  • the terminal portion 82 extends in the Z1 direction from one end portion 82a to the other end portion 82b.
  • An end portion 82 a of the terminal portion 82 is electrically connected to a device other than the electronic component 1 .
  • the terminal portion 82 is connected to a portion on the Z1 direction side of the end portion 82a and to a portion of the electronic board 70 that does not overlap the control board 62 (casing 10) when viewed from the Z direction.
  • the terminal portion 82 is electrically connected to the control substrate 62 by inserting the terminal portion 82 into the connection hole CH1 of the electronic substrate 70 at a location on the Z1 direction side of the end portion 82a.
  • the terminal portion 82 is fixed to the electronic substrate 70 by being joined to the electronic substrate 70 while being inserted into the connection hole CH ⁇ b>1 of the electronic substrate 70 . Since the terminal portion 82 is connected to the electronic board 70 in this way, it is provided outside the space SP of the casing 10 and extends in the Z direction, that is, in the axial direction of the drive shaft 32 . It can be said. More preferably, the terminal portion 82 extends along the Z direction.
  • the plurality of terminal portions 82 include current terminal portions 82A to which drive currents are input, and signal terminal portions 82B to which control signals are input. That is, some of the plurality of terminal portions 82 are current terminal portions 82A, and some of the plurality of terminal portions 82 are signal terminal portions 82B.
  • the current terminal portion 82A is joined to the electronic substrate 70 while being inserted into the connection hole CH1 electrically connected to the current conducting portion 72A.
  • the signal terminal portion 82B is joined to the electronic substrate 70 while being inserted into the connection hole CH1 electrically connected to the signal conduction portion 72B.
  • the terminal portion 82 is joined to the electronic substrate 70 by soldering.
  • the terminal portion 82 and the electronic substrate 70 are joined by a solder layer.
  • the joining method is not limited to soldering and may be arbitrary. In other words, the joining portion of the terminal portion 82 may be made of any material without being limited to solder.
  • connection member 90 electrically connects the control board 62 and the electronic board 70 .
  • the connection member 90 is a pin header in this embodiment.
  • the connection member 90 extends in the Z1 direction from one end 90a to the other end 90b.
  • the connection member 90 is electrically connected to the control board 62 at the end 90a.
  • the connection member 90 is fixed to the control board 62 with the end portion 90 a connected to the control board 62 .
  • the connecting member 90 is electrically connected to a portion of the electronic board 70 that overlaps the control board 62 (casing 10) when viewed from the Z direction, at a point on the Z1 direction side of the end portion 90a.
  • connection member 90 is connected to the electronic substrate 70 at a location on the Z1 direction side of the end portion 90a, that is, is inserted into the connection hole CH2 or the connection hole CH3 of the electronic substrate 70, and is joined to the electronic substrate 70. By being fixed to the electronic substrate 70 .
  • connection member 90 includes a current connection portion 92 and a signal connection portion 94 . That is, it can be said that the connection member 90 of the present embodiment includes a current connection portion 92 that is a pin header for drive current and a signal connection portion 94 that is a pin header for control signals. However, the connection member 90 is not limited to being a pin header.
  • the current connection portion 92 has an end portion 90a electrically connected to a portion of the control board 62 through which the drive current flows, and a portion on the Z1 direction side of the end portion 90a electrically connected to the current conduction portion 72A of the electronic substrate 70. connected to In this embodiment, the current connecting portion 92 is joined to the electronic substrate 70 while being inserted into the connection hole CH2 of the electronic substrate 70, and is electrically connected to the current conducting portion 72A.
  • the signal connection portion 94 has an end portion 90a electrically connected to a portion of the control board 62 through which a control signal flows, and a portion on the Z1 direction side of the end portion 90a connected to the signal conducting portion 72B of the electronic substrate 70. electrically connected. In this embodiment, the signal connection portion 94 is joined to the electronic substrate 70 while being inserted into the connection hole CH3 of the electronic substrate 70, and is electrically connected to the signal conduction portion 72B.
  • connection member 90 is joined to the electronic board 70 and the control board 62 by soldering.
  • the joining method is not limited to soldering and may be arbitrary.
  • the board unit 60 is configured as described above. Therefore, in the present embodiment, the current terminal portion 82A of the connector portion 80, the current conduction portion 72A of the electronic substrate 70, the current connection portion 92 of the connection member 90, and the portion of the control substrate 62 through which the drive current flows are electrically connected. connected Therefore, the drive current from the current terminal portion 82A of the connector portion 80 is supplied to the control board 62 via the current conduction portion 72A and the current connection portion 92.
  • the signal terminal portion 82B of the connector portion 80, the signal conducting portion 72B of the electronic substrate 70, the signal connection portion 94 of the connection member 90, and the portion of the control substrate 62 through which the control signal flows are electrically connected. connected Therefore, the control signal from the signal terminal portion 82B of the connector portion 80 is supplied to the control board 62 via the current conduction portion 72A and the current connection portion 92.
  • FIG. 1 the signal terminal portion 82B of the connector portion 80, the signal conducting portion 72B of the electronic substrate 70, the signal connection portion 94 of the connection member 90, and the portion of the control substrate 62 through which the control signal flows are electrically connected. connected Therefore, the control signal from the signal terminal portion 82B of the connector portion 80 is supplied to the control board 62 via the current conduction portion 72A and the current connection portion 92.
  • FIG. 3 is a schematic top view of the support member according to this embodiment.
  • the support member 100 is a plate-shaped member to which the electronic substrate 70 is attached on the surface 100A. As shown in FIG. 1, in this embodiment, the support member 100 is provided between the control board 62 and the electronic board 70 in the Z direction, and radiates heat (cools) the control board 62 and the electronic board 70 .
  • the Z1 direction side surface 100A of the support member 100 is in contact with the electronic substrate 70 directly or indirectly via another member.
  • the Z2 direction side surface 100B of the support member 100 is in contact with the control board 62 directly or indirectly via another member.
  • the support member 100 may be made of the same material as the casing 10, such as an aluminum alloy, and in this embodiment, it is made of a member of the ADC 12 standardized by JIS. However, the material of the support member 100 may be arbitrary.
  • the support member 100 is a lid that closes the opening of the casing 10 on the Z1 direction side.
  • the support member 100 includes a flange portion 100C, an insertion portion 100D, and a projecting portion 100E.
  • the flange portion 100C is larger than the space SP of the casing 10 when viewed from the Z direction, and is positioned outside the space SP of the casing 10, more specifically, on the Z1 direction side of the space SP.
  • the flange portion 100C is positioned so as to overlap the casing 10 and the control board 62 when viewed from the Z direction.
  • the insertion portion 100D is a portion that protrudes from the flange portion 100C in the Z2 direction.
  • the insertion portion 100D is a portion of the support member 100 that is inserted into the casing 10 .
  • the insertion portion 100D is inserted into the casing 10 so as to be located on the Z1 direction side of the control board 62 in the space SP of the casing 10 .
  • the outer peripheral surface of the insertion portion 100D and the inner peripheral surface of the side portion 14 of the casing 10 are sealed to prevent water and foreign matter from entering the space SP.
  • the outer peripheral surface of the insertion portion 100D and the inner peripheral surface of the side portion 14 of the casing 10 may be sealed by an elastic member such as an O-ring, but any sealing method may be used.
  • the protruding portion 100E is a portion that protrudes radially outward from the flange portion 100C when the drive shaft 32 is the central axis (the central axis of the motor 16 along the Z direction). That is, of the portion of the support member 100 located outside the space SP, the portion that overlaps the casing 10 as viewed in the Z direction is the flange portion 100C, and the portion that does not overlap the casing 10 as viewed in the Z direction is It can be said that it is a projecting portion 100E.
  • the surface of the projecting portion 100E on the Z1 direction side and the surface of the flange portion 100C on the Z1 direction side are the same surface (that is, they are continuous), and the surface on the Z1 direction side of the projecting portion 100E and the surface on the Z1 direction side of the flange portion 100C are on the same plane.
  • the surface can be said to be the surface 100A of the support member 100 .
  • an electronic substrate 70 is provided on the surface 100A of the support member 100.
  • the area where the electronic substrate 70 is provided in the surface 100A that is, the area overlapping the electronic substrate 70 when viewed from the Z direction is referred to as an area AR1.
  • the area AR1 extends from a position where the surface 100A overlaps the casing 10 when viewed in the Z direction to a position where the surface 100A does not overlap the casing 10 when viewed in the Z direction. It can be said that it is provided from a position that overlaps with the casing 10 to a position that does not overlap with the casing 10 when viewed from the Z direction.
  • a fixing region 101 is formed on the surface 100A of the support member 100.
  • the fixed region 101 is a region adhered to a fixed region 118 of the cover member 110, which will be described later.
  • the fixed area 101 is formed in a circumferential shape so as to surround the area AR1.
  • the fixing region 101 is formed from a position of the surface 100A that overlaps the casing 10 when viewed from the Z direction to a position that does not overlap the casing 10 when viewed from the Z direction.
  • the fixing region 101 has a groove shape in this embodiment, it is not limited thereto, and may have, for example, a convex shape protruding from the surface 100A, or may be flush with the surface 100A without being recessed or protruding from the surface 100A. may be formed in
  • the area inside the fixed area 101 is wider than the area AR1. That is, it can be said that the area inside the inner periphery of the fixed area 101 includes the area AR1 overlapping with the electronic substrate 70 and the area AR2 not overlapping with the electronic substrate 70 .
  • the region inside the fixing region 101 refers to the region surrounded by the fixing region 101 when viewed from the Z direction. It refers to a region radially inside the inner circumference of the fixing region 101 .
  • An opening 102 is formed in the surface 100A of the support member 100.
  • the opening 102 is an opening penetrating from the surface 100A of the support member 100 to the surface 100B.
  • the opening 102 is formed in the area AR1, and is formed at a position overlapping the casing 10 (control board 62) in the area AR1 when viewed from the Z direction. Furthermore, the opening 102 is formed at a position overlapping the connection member 90 and the connection holes CH2 and CH3 of the electronic substrate 70 when viewed from the Z direction.
  • the connecting member 90 is positioned within the opening 102 and is connected to the electronic board 70 and the control board 62 through the opening 102 . Since the opening 102 is formed in the area AR, the Z1 direction side is covered with the electronic substrate 70 .
  • a recess 104 is formed in the surface 100A of the support member 100.
  • the depression 104 is a depression formed in the surface 100A of the support member 100 and recessed toward the surface 100B, and does not penetrate to the surface 100B.
  • the recess 104 is formed inside the fixing region 101 and at a position not overlapping the casing 10 (control board 62) when viewed in the Z direction.
  • Recess 104 is formed from area AR1 to area AR2. Note that the recess 104 is not an essential component and may not be formed.
  • An opening 105 is formed in the surface 100A of the support member 100.
  • the opening 105 is an opening penetrating from the surface 100A of the support member 100 to the surface 100B.
  • the opening 105 is formed in the area AR1, and is formed at a position where it does not overlap the casing 10 (control board 62) when viewed from the Z direction in the area AR1.
  • the opening 105 is formed at a position overlapping the terminal portion 82 of the connector portion 80 and the connection hole CH1 of the electronic substrate 70 when viewed from the Z direction.
  • the terminal portion 82 is positioned within the opening portion 105 and is connected to the electronic substrate 70 through the opening portion 105 .
  • the opening 105 is covered with the electronic substrate 70 on the Z1 direction side.
  • the opening 105 is formed in the depression 104 in the present embodiment, it is not limited to being formed in the depression 104 .
  • a hole 106 is formed in the surface 100A of the support member 100. As shown in FIG.
  • the hole portion 106 is an opening into which a press-fitting portion 128 of the cover member 110, which will be described later, is press-fitted.
  • the hole 106 is formed inside the fixing region 101 and at a position not overlapping the electronic substrate 70 when viewed in the Z direction, that is, in the region AR2.
  • a plurality of holes 106 are formed, and three holes are formed in the example of FIG.
  • Hole 106 penetrates support member 100 from surface 100A to surface 100B. Since the hole portion 106 can be processed from the surface 100B by penetrating the hole portion 106 to the surface 100B, the labor for processing can be suppressed.
  • the holes 106 are not limited to penetrating to the surface 100B. Also, the number and positions of the holes 106 are not limited to those described above and may be arbitrary.
  • the surface 100A of the support member 100 is formed with openings 107 through which bolts fixed to the connector section 80 and the electronic board 70 are inserted. Further, the support member 100 has a depression GR formed at a position overlapping the casing 10 when viewed from the Z direction on the surface 100A.
  • the recess GR is a recess formed at a position not covered by the cover member 110 and does not penetrate to the surface 100B.
  • the opening 107, the recess GR, etc. are not essential components.
  • a first adhesion region 108 is formed on the surface 100A of the support member 100. As shown in FIG. The first adhesive area 108 is an area to which an adhesive is applied for fixing the support member 100 to the electronic substrate 70 and the cover member 110 . ) is formed. The first adhesive region 108 is formed inside the fixing region 101 and overlapping the electronic substrate 70 when viewed in the Z direction, that is, in the region AR1. Furthermore, the first adhesive region 108 is formed at a position overlapping the hole 74 of the electronic substrate 70 when viewed from the Z direction.
  • the first adhesion region 108 has a convex shape that protrudes from the surface 100A in the Z1 direction.
  • the first adhesive regions 108 are provided in the same number as the holes 74 (two in this example).
  • the first adhesive region 108 is not limited to being convex, and may be of any shape such as flush with the surface 100A.
  • the number of first adhesive regions 108 provided may be arbitrary.
  • one first adhesive region 108 may be formed from a position overlapping one hole 74 to a position overlapping the other hole 74 when viewed in the Z direction.
  • the tip of the first adhesive region 108 on the Z1 direction side is planar in this embodiment, but may be recessed, for example, on the Z2 direction side. Adhesive can be properly applied by making the tip flat or concave. However, the shape of the tip of the first adhesive region 108 may be arbitrary.
  • FIG. 4 is a schematic diagram of a cover member.
  • the cover member 110 is a cover that covers the electronic substrate 70 by being attached to the surface 100A of the support member 100 so that the surface 110A (facing surface) on the Z2 direction side faces the surface 100A of the support member 100 .
  • cover member 110 includes cover portion 112 , side portion 114 , and fixing portion 116 .
  • the cover part 112 is a plate-like member, and is an upper surface part of the cover member 110 that overlaps the electronic board 70 when viewed from the Z direction when attached to the support member 100 .
  • the side portion 114 is a side portion of the cover member 110 that protrudes from the outer edge of the support member 100 in the Z2 direction.
  • the fixed portion 116 is a flange portion of the cover member 110 that is formed at the tip of the side portion 114 on the Z2 direction side and fixed to the support member 100 .
  • a fixing region 118 is formed on the surface 116A of the fixing portion 116 on the Z2 direction side.
  • the fixation area 118 is the area that is adhered to the fixation area 101 of the support member 100 .
  • the fixing region 118 is circumferentially formed over the entire outer edge of the cover portion 112 .
  • the fixing region 118 is provided at a position facing the fixing region 101 when attached to the support member 100 .
  • the fixing region 118 has a convex shape projecting from the surface 116A in the Z2 direction, but is not limited to this. It may be formed flush with surface 116A without recessing or protruding from the surface.
  • a second adhesion area 120 is formed on the surface 110A of the cover member 110 .
  • the second adhesive area 120 is an area where an adhesive is applied to fix the cover member 110 to the electronic substrate 70 and the support member 100 , and it can be said that an adhesive layer is formed on the surface of the second adhesive area 120 .
  • the second adhesive region 120 is formed on the surface 112A of the cover portion 112, and can be said to be provided inside the fixing region 118 (the region surrounded by the fixing region 118 when viewed in the Z direction). Furthermore, in the state where the cover member 110 is attached to the support member 100 , the second adhesion region 120 is positioned between the hole 74 of the electronic substrate 70 and the first adhesion region 108 of the support member 100 when viewed from the Z direction. formed at overlapping positions.
  • the second adhesion region 120 has a convex shape that protrudes from the surface 110A in the Z2 direction.
  • the second adhesive region 120 has a beam shape extending from one inner surface of the side portion 114 to the inner surface of the side portion 114 opposite to the inner surface.
  • the second adhesive region 120 extends from a position overlapping the one hole portion 74 and the first adhesive region 108 as viewed in the Z direction. It can be said that it extends to a position overlapping the adhesion region 108 .
  • the first bonding region 108 is not limited to being convex or beam-shaped, and may be of any shape. Also, the number of second adhesive regions 120 provided may be arbitrary.
  • a beam portion 122 extending in a direction parallel to the second bonding region 120 and a beam portion 124 extending in a direction intersecting the second bonding region 120 are formed.
  • beams 122 and 124 are not an essential component.
  • a third adhesive area 126 is formed on the surface 110A of the cover member 110 .
  • the third adhesive area 126 is an area where an adhesive is applied to fix the cover member 110 to the electronic substrate 70, and it can be said that an adhesive layer is formed on the surface of the third adhesive area 126.
  • FIG. It can be said that the third adhesive region 126 is formed on the surface 112 ⁇ /b>A of the cover portion 112 and provided inside the fixing region 118 . Furthermore, the third adhesive region 126 is formed at a position overlapping the surface of the electronic substrate 70 when the cover member 110 is attached to the support member 100 .
  • the third bonding area 126 has a convex shape that protrudes from the surface 110A in the Z2 direction.
  • the third bonding area 126 is beam-shaped.
  • the third bonding region 126 is not limited to being convex or beam-shaped, and may be of any shape.
  • the third adhesive area 126 is not an essential component, and the cover member 110 may have at least one adhesive area. Moreover, the cover member 110 may have a region fixed to the electronic substrate 70 or the support member 100 via an adhesive layer, in addition to the second adhesive region 120 and the third adhesive region 126 . In this case, for example, the beam 122 may be used as an adhesive region, and the beam 122 and the surface of the electronic substrate 70 may be fixed via an adhesive layer.
  • a press-fit portion 128 is formed on the surface 110A of the cover member 110 .
  • the press-fit portion 128 is a shaft-shaped member that protrudes from the surface 110A in the Z2 direction (toward the support member 100).
  • the press-fit portion 128 is press-fit into the hole portion 106 of the support member 100 .
  • the press-fitting portion 128 is provided at a position where it can be press-fitted into the hole portion 106 when the cover member 110 is attached to the support member 100 (a position overlapping the hole portion 106 when viewed from the Z direction).
  • a plurality of press-fitting portions 128 are formed, and three are formed in the example of FIG.
  • the number and positions of the press-fitting portions 128 may be arbitrary.
  • the cover member 110 has the structure described above. A state in which the cover member 110 is attached to the support member 100 will be described below.
  • FIG. 5 is a schematic top view of the electronic component with the cover member attached.
  • the cover member 110 is attached to the support member 100 so that the surface 110A faces the surface 100A of the support member 100 and covers the electronic substrate 70 on the support member 100.
  • first bonding region 108 of the support member 100, the hole 74 of the electronic substrate 70, and the second bonding region 120 of the cover member 110 overlap each other when viewed from the Z direction.
  • the support member 100, the electronic substrate 70, and the cover member 110 are fixed via an adhesive layer (cured adhesive) formed over the inner and lower sides of the housing. That is, the first adhesive region 108 and the second adhesive region 120 face each other through the hole 74 , and the adhesive layer formed between the first adhesive region 108 and the second adhesive region 120 allows the support member 100 to , the electronic board 70 and the cover member 110 are fixed.
  • the third adhesive region 126 of the cover member 110 and the substrate adhesive region 76 which is the region on the surface of the electronic substrate 70 overlapping the third adhesive region 126 when viewed in the Z direction, are fixed via an adhesive layer.
  • the substrate bonding area 76 is formed on the surface of the electronic substrate 70 at a position different from the hole 74, and is near the terminals (here, the current connection 92 and the signal connection 94 of the connection member 90).
  • the vicinity here means, for example, a position within 3 cm from the terminal portion (here, the current connection portion 92 and the signal connection portion 94 of the connection member 90).
  • the press-fit portion 128 of the cover member 110 is press-fitted into the hole portion 106 of the support member 100, and the fixing region 118 of the cover member 110 is attached to the fixing region 101 of the support member 100 via an adhesive layer (cured adhesive).
  • the cover member 110 and the support member 100 are fixed.
  • the convex fixing region 118 is inserted into the groove-shaped fixing region 101 and fixed via the adhesive layer between the fixing region 118 and the fixing region 101 .
  • the fixing region 118 and the fixing region 101 are not limited to having a convex shape and a groove shape, respectively.
  • one of the fixing regions 101 and 118 is groove-shaped, the other of the fixing regions 101 and 118 is convex, and one of the fixing regions 101 and 118 is grooved.
  • the other of the fixing region 101 and the fixing region 118 may be inserted and fixed inside.
  • the cover member 110 does not overlap the entire area of the support member 100 when viewed from the Z direction, and does not overlap at least a portion of the outside of the fixed region 101 of the support member 100 . Therefore, at least a part of the surface 100 ⁇ /b>A of the electronic substrate 70 that does not overlap the electronic substrate 70 is exposed without being covered with the cover member 110 .
  • the cover member 110 is not limited to overlapping only a part of the support member 100 when viewed from the Z direction, and may overlap the entire support member 100 .
  • FIG.6 and FIG.7 is a schematic diagram explaining the manufacturing method of the electronic component which concerns on this embodiment.
  • the electronic substrate 70 is placed on the front surface 100A side of the support member 100.
  • the area where the connection hole CH1 of the electronic board 70 is formed overlaps the opening 105 of the support member 100, and the area where the connection holes CH2 and CH3 of the electronic board 70 are formed overlaps the opening 102 of the support member 100.
  • the electronic substrate 70 is arranged on the surface 100A side of the support member 100 so that the holes 74 of the electronic substrate 70 overlap the first bonding regions 108 of the support member 100 . Further, in this manufacturing method, the electronic board 70 is placed on the front surface 100A side of the support member 100, but the electronic board 70 is kept in an unfixed state (unconnected state) to the support member 100. FIG. Then, the terminal portion 82 of the connector portion 80 is inserted into the connection hole CH1 of the electronic board 70 through the opening portion 105 from the surface 100B side of the support member 100 . Also, the connection member 90 is inserted into the connection holes CH2 and CH3 of the electronic board 70 from the surface 100B side of the support member 100 through the opening 102 . In the example of FIG.
  • connection member 90 already bonded to the control board 62 is inserted into the connection holes CH2 and CH3. Therefore, it can be said that the control board 62 is arranged on the surface 100B side of the support member 100 by inserting the connection member 90 into the connection holes CH2 and CH3. However, the control board 62 and the connection member 90 before bonding may be inserted into the connection holes CH2 and CH3. In this case, after inserting the connection member 90 into the connection holes CH2 and CH3, the control board 62 may be arranged on the front surface 100B side of the support member 100 and the connection member 90 may be joined to the control board 62 .
  • step S2 in FIG. 6 the electronic board 70 and the terminal portion 82 are joined together without fixing the electronic board 70 to the support member 100. Then, as shown in FIG. That is, the terminal portion 82 inserted into the connection hole CH ⁇ b>1 of the electronic substrate 70 through the opening 105 is joined to the electronic substrate 70 .
  • the electronic substrate 70 and the terminal portion 82 are joined by applying heated solder around the connection hole CH1.
  • the electronic substrate 70 and the connection member 90 are joined together without fixing the electronic substrate 70 to the support member 100 . That is, the connection member 90 inserted into the connection holes CH2 and CH3 of the electronic board 70 through the opening 102 is joined to the electronic board 70 .
  • the electronic substrate 70 and the connection member 90 are joined by applying heated solder around the connection holes CH2 and CH3.
  • the method of joining the electronic substrate 70 and the terminal portion 82 and the method of joining the electronic substrate 70 and the connection member 90 are not limited to soldering, and any method may be used.
  • the terminal portion 82 and the connection member 90 are heated and thermally expanded. After that, the terminal portion 82 and the connecting member 90 are cooled by natural cooling or forced cooling, and shrink back to their original sizes.
  • step S3 in FIG. 7 the adhesive A is applied to the first adhesive region 108 of the support member 100 exposed through the hole 74 of the electronic substrate 70. Then, as shown in FIG. As a result, the electronic substrate 70 and the support member 100 are brought into contact with the adhesive A before curing.
  • the adhesive A is also applied to the fixing region 101 of the support member 100 and the board bonding region 76 of the electronic board 70 .
  • the cover member 110 is placed so that the surface 110A of the cover member 110 faces the surface 100A of the support member 100, and the cover member 110 covers the electronic substrate 70 on the surface 100A of the support member 100.
  • a member 110 is attached to the support member 100 .
  • the fixing region 118 of the cover member 110 is arranged within the fixing region 101 of the support member 100
  • the second adhesion region 120 of the cover member 110 is arranged on the first adhesion region 108 of the support member 100
  • the cover The cover member 110 is attached to the support member 100 such that the third adhesive region 126 of the member 110 is positioned over the substrate adhesive region 76 of the electronic substrate 70 .
  • the fixing region 101 and the fixing region 118 are brought into contact with each other by the uncured adhesive A in the fixing region 101, and the second adhesion region 120, the hole portion 74 of the electronic substrate 70, and the first adhesion region 108 are brought into contact with each other. are in contact with the uncured adhesive A on the first adhesive area 108 , and the third adhesive area 126 and the substrate adhesive area 76 are in contact with the uncured adhesive A on the substrate adhesive area 76 .
  • the adhesive A is cured to form an adhesive layer Aa.
  • the support member 100 and the cover member 110 are fixed via the adhesive layer Aa in the fixing region 101 and the fixing region 118 .
  • the support member 100, the electronic substrate 70, and the cover member 110 are fixed via the adhesive layer Aa at the second adhesive region 120, the holes 74 of the electronic substrate 70, and the first adhesive region .
  • the electronic substrate 70 and the cover member 110 are fixed via the adhesive layer Aa in the third adhesive area 126 and the substrate adhesive area 76 .
  • FIG. 8 is a flow chart for explaining the manufacturing flow of the electronic component according to this embodiment.
  • the electronic substrate 70 is placed on the front surface 100A side of the support member 100 (step S10).
  • the terminal portion 82 is inserted into the connection hole CH1 of the electronic substrate 70, and the electronic substrate 70 and the terminal portion 82 are joined while the electronic substrate 70 is not fixed to the support member 100 (step S12).
  • the connection member 90 is inserted into the connection holes CH2 and CH3 of the substrate 70, and the electronic substrate 70 and the connection member 90 are joined while the electronic substrate 70 is not fixed to the support member 100 (step S14). Note that the execution order of steps S12 and S14 may be arbitrary.
  • the adhesive A is applied to the support member 100 (step S16; application step), and the cover member 110 is attached (step S18; cover member attachment step).
  • the adhesive A is applied to the first bonding area 108 and the fixing area 101 of the support member 100 and the substrate bonding area 76 of the electronic substrate 70 .
  • the fixing region 118 of the cover member 110 is arranged within the fixing region 101 of the support member 100
  • the second adhesion region 120 of the cover member 110 is arranged on the first adhesion region 108 of the support member 100
  • the cover member 110 is The cover member 110 is attached to the support member 100 such that the third adhesive area 126 is positioned over the substrate adhesive area 76 of the electronic substrate 70 .
  • the adhesive A is applied to the support member 100 and the electronic substrate 70 here, the adhesive may be applied to the cover member 110 without being limited thereto. That is, the adhesive A may be applied to at least one of the first adhesion region 108 and the second adhesion region 120, the adhesive A may be applied to at least one of the fixing region 101 and the fixing region 118, and substrate bonding may be performed. Adhesive A may be applied to at least one of area 76 and third adhesive area 126 .
  • the adhesive A is cured to fix the support member 100, the electronic substrate 70, and the cover member 110 (step S20; fixing step).
  • the method of manufacturing the electronic component 1 includes the steps of placing the electronic substrate 70 on one surface 100A of the support member 100, and fixing the electronic substrate 70 to the support member 100. a step of bonding the electronic substrate 70 and the terminal portion 82 in a state in which the terminal portion 82 is bonded to the electronic substrate 70;
  • the terminal portion 82 has a greater degree of thermal expansion than the support member 100, and the terminal portion 82 is in a thermally expanded state relative to the substrate. After being fixed, it shrinks. Therefore, the electronic substrate 70 cannot follow the contraction of the terminal portion 82, and stress is generated in the terminal portion 82, the electronic substrate 70, and the like, and there is concern that the joint portion of the terminal portion 82 may be damaged.
  • the electronic substrate 70 and the terminal portion 82 are joined together in a state in which the electronic substrate 70 is not fixed to the support member 100 , so the electronic substrate 70 follows the contraction of the terminal portion 82 .
  • the electronic substrate 70 may vibrate when the electronic component 1 is used, and the joints of the terminal portions 82 may be damaged.
  • the electronic substrate 70 is fixed to the support member 100 after the electronic substrate 70 and the terminal portion 82 are joined together. Therefore, the vibration of the electronic substrate 70 during use of the electronic component 1 is also suppressed, and the risk of damage to the joints of the terminal portions 82 can be appropriately suppressed.
  • a connection hole CH1 is formed in the electronic substrate 70, and the manufacturing method of the present embodiment further includes a step of inserting the terminal portion 82 into the connection hole CH1.
  • the terminal portion 82 inserted into the connection hole CH1 and the electronic substrate 70 are joined in a state in which the electronic substrate 70 is not fixed to the support member 100.
  • the terminal portion 82 and the electronic substrate 70 It is possible to suppress the possibility that the joint portion of the terminal portion 82 is damaged while properly connecting the .
  • the support member 100 has an opening 105 penetrating from the one surface 100A to the other surface 100B. 105, the terminal portion 82 is inserted into the connection hole CH1. In the present embodiment, since the terminal portion 82 is inserted through the opening 105, the joint portion of the terminal portion 82 can be prevented from being damaged while maintaining a compact configuration.
  • the step of fixing with the adhesive A includes an application step, a cover member mounting step, and a fixing step.
  • the adhesive A is applied to at least one of the electronic substrate 70 and the support member 100 so that the electronic substrate 70 and the support member 100 are in contact with the adhesive A.
  • the cover member attaching step the cover member 110 is applied with the adhesive A so as to cover the electronic substrate 70 from one surface 100A of the support member 100 while the electronic substrate 70 and the support member 100 are in contact with the adhesive A. so that it touches the In the fixing step, by curing the adhesive A, the cover member 110, the electronic substrate 70, and the support member 100 are fixed.
  • the electronic substrate 70 is formed with a hole 74 that opens from one surface to the other surface. Apply adhesive A.
  • the second adhesion region 120 formed on the surface 110A of the cover member 110 on the side of the electronic substrate 70 is arranged at a position overlapping the first adhesion region 108 so that the first adhesion region 108
  • the first adhesion area 108 is a projection projecting from one surface 100A of the support member 100
  • the second adhesion area 120 is a projection projecting from the surface 110A of the cover member 110 on the electronic board 70 side.
  • the adhesive is also applied to the vicinity of the terminal portion (here, the current connection portion 92 and the signal connection portion 94 of the connection member 90) (substrate adhesion region 76) on the surface of the electronic substrate 70 on the side of the cover member 110.
  • the adhesive A applied to the substrate bonding region 76 comes into contact with a position (third bonding region 126 ) of the cover member 110 different from the second bonding region 120 .
  • connection member 90 connected to the control board 62 which is a board different from the electronic board 70, is joined to the electronic board 70 while the electronic board 70 is not fixed to the support member 100. Further including steps. According to this manufacturing method, even when the connection member 90 is joined, the occurrence of stress can be suppressed, and the risk of damage to the joint portion of the terminal portion 82 can be appropriately suppressed.
  • the electronic component 1 includes a support member 100, an electronic substrate 70 provided on one surface of the support member 100 and having a hole 74 opening from one surface to the other surface, an electronic It has a terminal portion 82 joined to the substrate 70, and a cover member 110 attached to one surface 100A of the support member 100 so as to cover the electronic substrate 70.
  • the support member 100, the electronic substrate 70, and the cover member 110 are fixed via an adhesive (adhesive layer Aa) provided over the upper, inner and lower sides of the hole 74 .
  • the support member 100, the electronic substrate 70, and the cover member 110 are fixed via the adhesive layer Aa. It is possible to appropriately suppress the risk of damage to the joints.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

The present invention reduces the likelihood of damage to a joint of a terminal. This method for manufacturing an electronic component comprises: a step for disposing an electronic substrate (70) on one surface (100A) of a support member (100); a step for, in a state in which the electronic substrate (70) is yet to be fixed to the support member (100), joining the electronic substrate (70) and a terminal portion (82) together; and a step for fixing the electronic substrate (70), with the terminal portion (82) joined thereto, and the support member (100) together using an adhesive.

Description

電子部品の製造方法及び電子部品Electronic component manufacturing method and electronic component
　本発明は、電子部品の製造方法及び電子部品に関する。 The present invention relates to an electronic component manufacturing method and an electronic component.
　基板を有する電子部品は、支持部材上に搭載される基板に、例えばはんだなどによって、端子が接合される。例えば特許文献１には、基板に形成されたスルーホールに接続端子を挿入し、スルーホールの部分をはんだ接合することで、基板と端子とを接続する旨が記載されている。 An electronic component having a substrate has terminals that are joined to the substrate mounted on the support member by, for example, soldering. For example, Patent Literature 1 describes that connection terminals are inserted into through-holes formed in a substrate, and the through-hole portions are soldered to connect the substrate and the terminals.
特開２０１５－２６８２０号公報JP 2015-26820 A
　ここで、基板と端子を接合する際には、端子は加熱されるが、支持部材への伝熱量は小さいため、端子は支持部材と比べて熱膨張の度合いが大きくなり、端子は、熱膨張された状態で基板に対して固定された後に、収縮する。そのため、例えば基板が支持部に固定された状態で端子と基板とが接合されると、端子の収縮に基板が追従できずに、端子や基板などに応力が発生して、端子の接合部が破損するおそれが懸念される。一方、支持部を基板に固定しない場合には、端子の収縮に基板が追従できるが、電子部品の使用時に基板が振動して破損するおそれがある。従って、破損のおそれを抑制することが求められている。 Here, when the substrate and the terminals are joined, the terminals are heated, but the amount of heat transferred to the supporting member is small. After being fixed to the substrate in the folded state, it contracts. Therefore, for example, when the terminal and the substrate are joined while the substrate is fixed to the supporting portion, the substrate cannot follow the contraction of the terminal, and stress is generated in the terminal and the substrate, and the joint portion of the terminal is damaged. There is concern about the possibility of damage. On the other hand, if the supporting portion is not fixed to the substrate, the substrate can follow the contraction of the terminals, but the substrate may vibrate and break when the electronic component is used. Therefore, it is required to suppress the risk of breakage.
　本発明は、上記に鑑みてなされたものであって、端子の接合部が破損するおそれを抑制可能な電子部品の製造方法及び電子部品を提供することを目的とする。 The present invention has been made in view of the above, and it is an object of the present invention to provide an electronic component manufacturing method and an electronic component that can suppress the risk of damage to the joints of terminals.
　上述した課題を解決し、目的を達成するために、本開示に係る電子部品の製造方法は、支持部材の一方の表面に電子基板を配置するステップと、前記電子基板が前記支持基板に対して固定されていない状態で、前記電子基板と端子部とを接合するステップと、前記端子部が接合された電子基板と前記支持基板とを、接着剤で固定するステップと、を含む。 In order to solve the above-described problems and achieve the object, a method for manufacturing an electronic component according to the present disclosure includes the steps of: placing an electronic substrate on one surface of a support member; The method includes bonding the electronic substrate and the terminal portion in an unfixed state, and fixing the electronic substrate to which the terminal portion is bonded and the supporting substrate with an adhesive.
　上述した課題を解決し、目的を達成するために、本開示に係る電子部品は、支持部材と、前記支持部材の一方の表面上に設けられ、一方の表面から他方の表面まで開口する孔部が形成された電子基板と、前記電子基板に接合される端子部と、前記電子基板を覆うように前記支持部材の一方の表面に取り付けられるカバー部材と、を有し、前記支持部材と前記電子基板と前記カバー部材とが、前記孔部の上側と内側と下側にわたって設けられた接着剤を介して固定されている。 In order to solve the above-described problems and achieve the object, an electronic component according to the present disclosure includes a support member and a hole provided on one surface of the support member and opening from one surface to the other surface. is formed on an electronic substrate, a terminal portion joined to the electronic substrate, and a cover member attached to one surface of the support member so as to cover the electronic substrate, wherein the support member and the electronic The substrate and the cover member are fixed via an adhesive provided over the upper side, the inner side, and the lower side of the hole.
図１は、本実施形態に係る電子部品の模式的な断面図である。FIG. 1 is a schematic cross-sectional view of an electronic component according to this embodiment. 図２は、基板ユニットの模式的な斜視図である。FIG. 2 is a schematic perspective view of the board unit. 図３は、本実施形態に係る支持部材の模式的な上面図である。FIG. 3 is a schematic top view of the support member according to this embodiment. 図４は、カバー部材の模式図である。FIG. 4 is a schematic diagram of a cover member. 図５は、カバー部材が取り付けられた状態における電子部品の模式的な上面図である。FIG. 5 is a schematic top view of the electronic component with the cover member attached. 図６は、本実施形態に係る電子部品の製造方法を説明する模式図である。FIG. 6 is a schematic diagram illustrating the method for manufacturing an electronic component according to this embodiment. 図７は、本実施形態に係る電子部品の製造方法を説明する模式図である。FIG. 7 is a schematic diagram for explaining the method for manufacturing an electronic component according to this embodiment. 図８は、本実施形態に係る電子部品の製造フローを説明するフローチャートである。FIG. 8 is a flow chart for explaining the manufacturing flow of the electronic component according to this embodiment.
　以下に、本発明の好適な実施形態を図面に基づいて詳細に説明する。なお、以下に説明する実施形態により本発明が限定されるものではない。 Preferred embodiments of the present invention will be described in detail below based on the drawings. In addition, this invention is not limited by embodiment described below.
　（電子部品の全体構成）
　図１は、本実施形態に係る電子部品の模式的な断面図である。図２は、基板ユニットの模式的な斜視図である。本実施形態に係る電子部品１は、回転電機である。具体的には、電子部品１は、基板とモータとを有するモータユニット、さらに言えばブラシレスモータユニットである。電子部品１は、例えば車両の電動ステアリング装置に用いられ、車両のステアリングシャフトに操舵補助力を付与する。ただし、電子部品１の用途はそれに限られない。さらに言えば、電子部品１は、回転電機にも限られず、任意の電子機器であってよい。 (Overall configuration of electronic components)
FIG. 1 is a schematic cross-sectional view of an electronic component according to this embodiment. FIG. 2 is a schematic perspective view of the board unit. The electronic component 1 according to this embodiment is a rotating electric machine. Specifically, the electronic component 1 is a motor unit having a substrate and a motor, more specifically, a brushless motor unit. The electronic component 1 is used, for example, in an electric steering device for a vehicle, and provides a steering assist force to a steering shaft of the vehicle. However, the application of the electronic component 1 is not limited thereto. Furthermore, the electronic component 1 is not limited to a rotating electrical machine, and may be any electronic device.
　図１に示すように、電子部品１は、ケーシング１０と、ステータ２０と、ロータ３０と、バスバーユニット４０と、保持部材５０と、基板ユニット６０と、支持部材１００と、カバー部材１１０と、ベアリングＢ１、Ｂ２とを備える。図２は、電子部品１から基板ユニット６０のみを抜き出した図である。図１及び図２に示すように、基板ユニット６０は、複数の基板を有するユニットであり、制御基板６２と、電子基板７０と、コネクタ部８０と、接続部材９０とを含む。以下、電子部品１の座標系における所定方向をＺ方向とし、Ｚ方向に沿った方向のうちの一方の方向を、Ｚ１方向（第１方向）とし、Ｚ方向に沿った方向のうちの他方の方向を、すなわちＺ１方向の反対の方向を、Ｚ２方向（第２方向）とする。 As shown in FIG. 1, the electronic component 1 includes a casing 10, a stator 20, a rotor 30, a busbar unit 40, a holding member 50, a substrate unit 60, a support member 100, a cover member 110, bearings B1 and B2. FIG. 2 is a diagram of only the substrate unit 60 extracted from the electronic component 1. As shown in FIG. As shown in FIGS. 1 and 2, the board unit 60 is a unit having a plurality of boards, and includes a control board 62, an electronic board 70, a connector section 80, and a connection member 90. FIG. Hereinafter, the predetermined direction in the coordinate system of the electronic component 1 is defined as the Z direction, one of the directions along the Z direction is defined as the Z1 direction (first direction), and the other of the directions along the Z direction is defined as the Z direction. The direction, that is, the direction opposite to the Z1 direction is the Z2 direction (second direction).
　（ケーシング）
　図１に示すように、ケーシング１０は、ステータ２０、ロータ３０、バスバーユニット４０、保持部材５０、及び制御基板６２を内部に収納する筐体である。ケーシング１０は、Ｚ１方向側が開口する中空の部材であり、本実施形態ではＺ方向から見て円形となる円筒状の部材である。ケーシング１０は、底部１２と側部１４とを含む。底部１２は、ケーシング１０のＺ２方向側の底面を構成する。底部１２には、後述の駆動軸３２が挿通される開口１２Ａが形成されている。また、底部１２には、軸受けであるベアリングＢ１が設けられている。ベアリングＢ１は、底部１２に対して固定されている。側部１４は、ケーシング１０の側面を構成する。側部１４は、底部１２の外縁を囲うように設けられ、底部１２の外縁からＺ１方向に延在する。ケーシング１０は、底部１２と側部１４とで囲われる空間ＳＰに、ステータ２０、ロータ３０、バスバーユニット４０、保持部材５０、及び制御基板６２を収納する。 (casing)
As shown in FIG. 1, the casing 10 is a housing that accommodates the stator 20, the rotor 30, the busbar unit 40, the holding member 50, and the control board 62 inside. The casing 10 is a hollow member with an opening in the Z1 direction, and is a cylindrical member that is circular when viewed from the Z direction in this embodiment. Casing 10 includes a bottom portion 12 and side portions 14 . The bottom portion 12 constitutes the bottom surface of the casing 10 on the Z2 direction side. The bottom portion 12 is formed with an opening 12A through which a drive shaft 32, which will be described later, is inserted. Further, the bottom portion 12 is provided with a bearing B1 as a bearing. Bearing B1 is fixed relative to bottom 12 . The side portion 14 constitutes the side surface of the casing 10 . The side portion 14 is provided so as to surround the outer edge of the bottom portion 12 and extends from the outer edge of the bottom portion 12 in the Z1 direction. The casing 10 accommodates the stator 20 , the rotor 30 , the busbar unit 40 , the holding member 50 and the control board 62 in the space SP surrounded by the bottom portion 12 and the side portions 14 .
　ケーシング１０は、アルミニウム合金の部材で構成される。より詳しくは、ケーシング１０は、ＪＩＳで規格されるＡＤＣ１２の部材で構成される。ただし、ケーシング１０の材料は任意であってよい。 The casing 10 is composed of an aluminum alloy member. More specifically, the casing 10 is composed of a member of the ADC 12 standardized by JIS. However, the material of the casing 10 may be arbitrary.
　（モータ）
　ステータ２０は、電子部品１の固定子であり、ロータ３０は、電子部品１の回転子である。ケーシング１０とステータ２０とロータ３０とバスバーユニット４０と保持部材５０とで、モータ１６を構成しているといえる。 (motor)
A stator 20 is a stator of the electronic component 1 and a rotor 30 is a rotor of the electronic component 1 . It can be said that the casing 10 , the stator 20 , the rotor 30 , the busbar unit 40 and the holding member 50 constitute the motor 16 .
　ステータ２０は、ケーシング１０の空間ＳＰ内に設けられる。ステータ２０は、ステータコア２２と、ステータコイル２４とを含む。ステータコア２２は、ステータ２０のコアであり、Ｚ方向から見た中央位置に、Ｚ方向に貫通する貫通孔２２Ａが形成されている。ステータコア２２は、磁性体で構成されており、さらに言えば、鉄系の部材で構成される。鉄系の部材とは、鉄を主成分とする部材である。より詳しくは、本実施形態に係るステータコア２２は、電磁鋼板で構成されている。ステータコア２２は、電磁鋼板製の部材がＺ方向に積層されて構成されている。ただし、ステータコア２２は、電磁鋼板で構成されることに限られず、部材がＺ方向に積層されて構成されることにも限られない。 The stator 20 is provided within the space SP of the casing 10 . Stator 20 includes a stator core 22 and stator coils 24 . The stator core 22 is the core of the stator 20, and is formed with a through hole 22A penetrating in the Z direction at a central position when viewed in the Z direction. The stator core 22 is made of a magnetic material, more specifically, an iron-based member. An iron-based member is a member containing iron as a main component. More specifically, the stator core 22 according to this embodiment is made of an electromagnetic steel sheet. The stator core 22 is configured by stacking electromagnetic steel plate members in the Z direction. However, the stator core 22 is not limited to being composed of electromagnetic steel sheets, and is not limited to being composed of members laminated in the Z direction.
　ステータコイル２４は、ステータ２０のコイルである。ステータコイル２４は、Ｕ相、Ｖ相、及びＷ相の電磁コイルを含む。ステータコイル２４は、ステータコア２２に巻回されている。 The stator coil 24 is the coil of the stator 20. The stator coil 24 includes U-phase, V-phase, and W-phase electromagnetic coils. The stator coil 24 is wound around the stator core 22 .
　（ロータ）
　ロータ３０は、ケーシング１０の空間ＳＰ内に設けられる。ロータ３０は、駆動軸３２と、ロータコア３４とを備える。ロータコア３４は、ロータ３０のコアである。ロータコア３４は、周方向に並ぶ複数の磁極を備える。ロータコア３４は、Ｚ方向から見た中央位置に、Ｚ方向に貫通する貫通孔が形成されている。駆動軸３２は、シャフトであり、ロータコア３４の貫通孔に挿入されて、ロータコア３４に対して固定されている。ロータ３０は、ロータコア３４の外周面が、ステータコア２２の貫通孔２２Ａ内に設けられる。ロータ３０は、駆動軸３２がＺ方向に沿って延在するように、貫通孔２２Ａ内に設けられる。本実施形態では、駆動軸３２が、Ｚ方向に向かって延在することが好ましく、駆動軸３２の軸方向がＺ方向に沿っていることがより好ましい。 (rotor)
The rotor 30 is provided within the space SP of the casing 10 . The rotor 30 has a drive shaft 32 and a rotor core 34 . Rotor core 34 is the core of rotor 30 . The rotor core 34 has a plurality of magnetic poles arranged in the circumferential direction. The rotor core 34 is formed with a through-hole penetrating in the Z-direction at a center position viewed from the Z-direction. The drive shaft 32 is a shaft inserted into a through hole of the rotor core 34 and fixed to the rotor core 34 . The rotor 30 has the outer peripheral surface of the rotor core 34 provided in the through hole 22A of the stator core 22 . The rotor 30 is provided within the through hole 22A such that the drive shaft 32 extends along the Z direction. In this embodiment, the drive shaft 32 preferably extends in the Z direction, and more preferably the axial direction of the drive shaft 32 extends along the Z direction.
　ロータ３０は、ステータ２０に対して回転可能に、貫通孔２２Ａ内に設けられる。ロータ３０は、ステータ２０との電磁作用により、駆動軸３２のＺ方向に沿った中心軸を回転軸として、回転する。 The rotor 30 is provided in the through hole 22A so as to be rotatable with respect to the stator 20. The rotor 30 rotates around the center axis of the drive shaft 32 along the Z direction as a rotation axis due to electromagnetic action with the stator 20 .
　（バスバーユニット）
　バスバーユニット４０は、ケーシング１０の空間ＳＰ内において、ステータコイル２４のＺ１方向側に設けられる。バスバーユニット４０は、複数のバスバーとバスバーホルダとを備える板状（ここでは円板状）の部材である。バスバーは、導電性の部材であり、ステータコイル２４のＵ相、Ｖ相、Ｗ相のそれぞれに接続されている。バスバーホルダは、絶縁性の部材であり、バスバーを覆う。 (Busbar unit)
The busbar unit 40 is provided on the Z1 direction side of the stator coil 24 in the space SP of the casing 10 . The busbar unit 40 is a plate-shaped (disk-shaped here) member including a plurality of busbars and a busbar holder. The busbar is a conductive member and is connected to each of the U-phase, V-phase, and W-phase of the stator coil 24 . The busbar holder is an insulating member that covers the busbar.
　（保持部材）
　保持部材５０は、ケーシング１０の空間ＳＰ内において、バスバーユニット４０のＺ１方向側に設けられる。保持部材５０は、ベアリングＢ２を保持する、板状（ここでは円板状）の部材である。なお、ロータ３０の駆動軸３２は、ベアリングＢ１、Ｂ２に回転可能に支持されている。すなわち、駆動軸３２は、Ｚ２方向側の部分が、ベアリングＢ１内に回転可能に挿入され、ベアリングＢ１に挿入された部分よりもＺ１方向側の部分が、ベアリングＢ２内に回転可能に挿入されている。 (Holding member)
The holding member 50 is provided on the Z1 direction side of the busbar unit 40 in the space SP of the casing 10 . The holding member 50 is a plate-shaped (disc-shaped here) member that holds the bearing B2. A drive shaft 32 of the rotor 30 is rotatably supported by bearings B1 and B2. That is, the drive shaft 32 has a portion on the Z2 direction side rotatably inserted in the bearing B1, and a portion on the Z1 direction side of the portion inserted in the bearing B1 rotatably inserted in the bearing B2. there is
　（基板ユニット）
　（制御基板）
　図１に示すように、制御基板６２は、ケーシング１０の空間ＳＰ内において、保持部材５０のＺ１方向側に設けられる。すなわち、制御基板６２は、ケーシング１０の空間ＳＰ内において、モータ１６のＺ１方向側に設けられているといえる。制御基板６２は、バスバーユニット４０のバスバーに電気的に接続されている。 (substrate unit)
(control board)
As shown in FIG. 1 , the control board 62 is provided on the Z1 direction side of the holding member 50 within the space SP of the casing 10 . That is, it can be said that the control board 62 is provided on the Z1 direction side of the motor 16 in the space SP of the casing 10 . The control board 62 is electrically connected to the busbars of the busbar unit 40 .
　制御基板６２は、電子部品１のＥＣＵ（Ｅｌｅｃｔｒｏｎｉｃ　Ｃｏｎｔｒｏｌ　Ｕｎｉｔ）の回路が設けられる回路基板である。制御基板６２は、コネクタ部８０に入力される駆動電流と制御信号とが、電子基板７０及び接続部材９０を介して入力される。駆動電流は、モータ１６を駆動するための電流であり、制御信号は、モータ１６の駆動を制御するための電気信号である。制御基板６２は、駆動電流をモータ１６に印加して、制御信号に応じてモータ１６を駆動させる。 The control board 62 is a circuit board on which an ECU (Electronic Control Unit) circuit of the electronic component 1 is provided. The control board 62 receives the driving current and the control signal input to the connector section 80 via the electronic board 70 and the connection member 90 . The drive current is a current for driving the motor 16, and the control signal is an electrical signal for controlling the driving of the motor 16. FIG. The control board 62 applies a drive current to the motor 16 to drive the motor 16 according to the control signal.
　（電子基板）
　図１に示すように、電子基板７０は、制御基板６２のＺ１方向側に設けられる。電子基板７０は、ケーシング１０の空間ＳＰの外部に設けられている。電子基板７０は、一方の端部７０Ａから他方の端部７０Ｂまで延在している。端部７０Ａは、Ｚ方向から見た場合に、制御基板６２と重なる位置にあり、ケーシング１０と重なる位置にあるともいえる。一方、端部７０Ｂは、Ｚ方向から見た場合に、制御基板６２と重ならない位置にあり、ケーシング１０と重ならない位置にあるともいえる。すなわち、電子基板７０は、駆動軸３２を中心軸（Ｚ方向に沿うモータ１６の中心軸）とした場合の径方向外側に向けて、制御基板６２やケーシング１０と重なる位置から制御基板６２やケーシング１０と重ならない位置まで延在している。 (Electronic substrate)
As shown in FIG. 1, the electronic board 70 is provided on the Z1 direction side of the control board 62 . The electronic board 70 is provided outside the space SP of the casing 10 . The electronic board 70 extends from one end 70A to the other end 70B. 70 A of edge parts are in the position which overlaps with the control board 62, when it sees from a Z direction, and it can be said that it exists in the position which overlaps with the casing 10. As shown in FIG. On the other hand, the end portion 70B is positioned so as not to overlap with the control board 62 when viewed in the Z direction, and can be said to be positioned so as not to overlap with the casing 10 . That is, the electronic board 70 is directed outward in the radial direction when the drive shaft 32 is the central axis (the central axis of the motor 16 along the Z direction) from a position overlapping the control board 62 and the casing 10 . It extends to a position that does not overlap with 10.
　電子基板７０は、接続部材９０を介して制御基板６２に電気的に接続されており、コネクタ部８０にも電気的に接続される。具体的には、電子基板７０は、Ｚ方向から見てケーシング１０と重なる箇所において、接続部材９０に接続される。電子基板７０は、端部７０Ａが接続部材９０に接続されてもよいし、端部７０Ａと端部７０Ｂとの間の箇所が接続部材９０に接続されてもよい。また、電子基板７０は、Ｚ方向から見てケーシング１０と重ならない箇所において、コネクタ部８０に接続されている。電子基板７０は、端部７０Ｂがコネクタ部８０に接続されてもよいし、端部７０Ａと端部７０Ｂとの間の箇所がコネクタ部８０に接続されてもよい。 The electronic board 70 is electrically connected to the control board 62 via the connection member 90 and is also electrically connected to the connector section 80 . Specifically, the electronic board 70 is connected to the connection member 90 at a location overlapping the casing 10 when viewed in the Z direction. The electronic board 70 may be connected to the connecting member 90 at the end 70A, or may be connected to the connecting member 90 at a portion between the end 70A and the end 70B. Also, the electronic board 70 is connected to the connector section 80 at a location that does not overlap with the casing 10 when viewed in the Z direction. The electronic board 70 may be connected to the connector portion 80 at the end portion 70B, or may be connected to the connector portion 80 at a portion between the end portions 70A and 70B.
　図２に示すように、電子基板７０は、駆動電流を導通する電流導通部７２Ａと、制御信号を導通する信号導通部７２Ｂとを有する。電流導通部７２Ａ及び信号導通部７２Ｂは、電流を導通する配線であるといえ、本実施形態ではシート状の配線パターンである。電子基板７０は、電流導通部７２Ａと信号導通部７２Ｂ以外の電子部品（実装部品）が搭載されていないことが好ましい。また、本実施形態では、電流導通部７２Ａの面積が、信号導通部７２Ｂの面積より大きい。これにより駆動電流を適切に導通できるが、電流導通部７２Ａと信号導通部７２Ｂとの面積の大小関係はこれに限られず任意であってよい。なお、ここでの面積とは、電流導通部７２Ａ及び信号導通部７２Ｂの、電流が流れる方向に直交する断面の面積といってもよいし、配線パターンであるため、Ｚ方向から見た場合の電流導通部７２Ａ及び信号導通部７２Ｂの面積といってもよい。 As shown in FIG. 2, the electronic board 70 has a current conducting portion 72A that conducts the driving current and a signal conducting portion 72B that conducts the control signal. The current-conducting portion 72A and the signal-conducting portion 72B can be said to be wiring that conducts current, and are sheet-like wiring patterns in this embodiment. It is preferable that the electronic board 70 is not mounted with electronic components (mounted components) other than the current conducting portion 72A and the signal conducting portion 72B. Further, in the present embodiment, the area of the current conducting portion 72A is larger than the area of the signal conducting portion 72B. Although this allows the drive current to be conducted appropriately, the size relationship between the current conducting portion 72A and the signal conducting portion 72B is not limited to this and may be arbitrary. Note that the area here may be the area of the cross section of the current conducting portion 72A and the signal conducting portion 72B perpendicular to the direction in which the current flows. It may be called the area of the current conduction portion 72A and the signal conduction portion 72B.
　本実施形態では、電子基板７０は、複数の層が積層されて構成されており、言い換えれば、複数層の電流導通部７２Ａを有している。電子基板７０は、複数の層構成となることで、電流導通部７２Ａの面積を確保して、駆動電流を適切に流すことができる。また、図２に示すように、電子基板７０は、各層にわたって貫通する、複数の接続穴ＣＨ１と複数の接続穴ＣＨ２と複数の接続穴ＣＨ３とが形成されている。接続穴ＣＨ１は、端部７０Ｂ側に、すなわち、Ｚ方向から見た場合に制御基板６２（ケーシング１０）と重ならない位置に形成されている。接続穴ＣＨ１には、後述するコネクタ部８０の端子部８２が挿入される。接続穴ＣＨ２は、端部７０Ａ側に、すなわち、Ｚ方向から見た場合に制御基板６２（ケーシング１０）と重なる位置に形成されている。接続穴ＣＨ２には、後述する接続部材９０の電流接続部９２が挿入される。接続穴ＣＨ３は、端部７０Ａ側に、すなわち、Ｚ方向から見た場合に制御基板６２（ケーシング１０）と重なる位置に形成されている。接続穴ＣＨ３には、後述する接続部材９０の信号接続部９４が挿入される。 In the present embodiment, the electronic substrate 70 is configured by laminating a plurality of layers, in other words, it has a plurality of layers of current-conducting portions 72A. Since the electronic substrate 70 has a multi-layer structure, the area of the current conduction portion 72A can be secured and the drive current can be appropriately passed. Further, as shown in FIG. 2, the electronic board 70 is formed with a plurality of connection holes CH1, a plurality of connection holes CH2, and a plurality of connection holes CH3 penetrating through each layer. The connection hole CH1 is formed on the end portion 70B side, that is, at a position that does not overlap the control board 62 (casing 10) when viewed from the Z direction. A terminal portion 82 of a connector portion 80, which will be described later, is inserted into the connection hole CH1. The connection hole CH2 is formed on the end portion 70A side, that is, at a position overlapping the control board 62 (casing 10) when viewed from the Z direction. A current connection portion 92 of a connection member 90, which will be described later, is inserted into the connection hole CH2. The connection hole CH3 is formed on the end portion 70A side, that is, at a position overlapping the control board 62 (casing 10) when viewed from the Z direction. A signal connection portion 94 of a connection member 90, which will be described later, is inserted into the connection hole CH3.
　電流導通部７２Ａは、接続穴ＣＨ１のうちの一部と、接続穴ＣＨ２とに電気的に接続されている。また、信号導通部７２Ｂは、接続穴ＣＨ１のうちの他の一部と、接続穴ＣＨ３とに電気的に接続されている。 The current conduction portion 72A is electrically connected to a part of the connection hole CH1 and the connection hole CH2. Further, the signal conducting portion 72B is electrically connected to another part of the connection hole CH1 and the connection hole CH3.
　なお、電子基板７０の層の数や各層の配線パターンは、任意であってよい。また、電子基板７０は、複数の層が積層された構成であることにも限られず、電流導通部７２Ａと信号導通部７２Ｂとを有する任意の構成であってよい。例えば、電子基板７０は、基板上に電流導通部７２Ａと信号導通部７２Ｂが形成された構成であることに限られず、電流導通部７２Ａと信号導通部７２Ｂを有する配線であってもよい。 The number of layers of the electronic board 70 and the wiring pattern of each layer may be arbitrary. Further, the electronic substrate 70 is not limited to having a structure in which a plurality of layers are laminated, and may have any structure having a current conducting portion 72A and a signal conducting portion 72B. For example, the electronic substrate 70 is not limited to the configuration in which the current conduction portion 72A and the signal conduction portion 72B are formed on the substrate, but may be wiring having the current conduction portion 72A and the signal conduction portion 72B.
　また、図２に示すように、電子基板７０には、一方の表面から他方の表面まで貫通する孔部７４が形成されている。孔部７４は、電子基板７０を支持部材１００やカバー部材１１０と固定する接着剤を塗布するための穴である。孔部７４は、接続穴ＣＨ１が設けられる箇所と、接続穴ＣＨ２、ＣＨ３が設けられる箇所の間に形成されている。孔部７４は、複数形成されており、図２の例では、２つ形成されている。ただし、孔部７４の数は任意であってよい。 Further, as shown in FIG. 2, the electronic substrate 70 is formed with a hole portion 74 penetrating from one surface to the other surface. The hole portion 74 is a hole for applying an adhesive that fixes the electronic substrate 70 to the support member 100 and the cover member 110 . The hole portion 74 is formed between a portion where the connection hole CH1 is provided and a portion where the connection holes CH2 and CH3 are provided. A plurality of holes 74 are formed, and two are formed in the example of FIG. However, the number of holes 74 may be arbitrary.
　（コネクタ部）
　図１に示すように、コネクタ部８０は、複数の端子部８２と、複数の端子部８２を収納するカバー部８４とを有する。端子部８２は、一方の端部８２ａから他方の端部８２ｂまで、Ｚ１方向に向けて延在する。端子部８２は、端部８２ａが、電子部品１以外の機器に電気的に接続される。端子部８２は、端部８２ａよりもＺ１方向側の箇所で、電子基板７０の、Ｚ方向から見た場合に制御基板６２（ケーシング１０）と重ならない箇所に接続される。本実施形態では、端子部８２は、端部８２ａよりもＺ１方向側の箇所が、電子基板７０の接続穴ＣＨ１に挿入されることで、制御基板６２に電気的に接続される。端子部８２は、電子基板７０の接続穴ＣＨ１に挿入された状態で、電子基板７０と接合されることで、電子基板７０に固定されている。端子部８２は、このように電子基板７０に接続されているため、ケーシング１０の空間ＳＰの外部に設けられ、Ｚ方向に向けて、すなわち駆動軸３２の軸方向に向けて延在しているといえる。端子部８２は、Ｚ方向に沿って延在することがより好ましい。 (Connector part)
As shown in FIG. 1 , the connector portion 80 has a plurality of terminal portions 82 and a cover portion 84 that accommodates the plurality of terminal portions 82 . The terminal portion 82 extends in the Z1 direction from one end portion 82a to the other end portion 82b. An end portion 82 a of the terminal portion 82 is electrically connected to a device other than the electronic component 1 . The terminal portion 82 is connected to a portion on the Z1 direction side of the end portion 82a and to a portion of the electronic board 70 that does not overlap the control board 62 (casing 10) when viewed from the Z direction. In the present embodiment, the terminal portion 82 is electrically connected to the control substrate 62 by inserting the terminal portion 82 into the connection hole CH1 of the electronic substrate 70 at a location on the Z1 direction side of the end portion 82a. The terminal portion 82 is fixed to the electronic substrate 70 by being joined to the electronic substrate 70 while being inserted into the connection hole CH<b>1 of the electronic substrate 70 . Since the terminal portion 82 is connected to the electronic board 70 in this way, it is provided outside the space SP of the casing 10 and extends in the Z direction, that is, in the axial direction of the drive shaft 32 . It can be said. More preferably, the terminal portion 82 extends along the Z direction.
　図２に示すように、複数の端子部８２は、駆動電流が入力される電流端子部８２Ａと、制御信号が入力される信号端子部８２Ｂとを含む。すなわち、複数の端子部８２のうちの一部が電流端子部８２Ａであり、複数の端子部８２のうちの他の一部が信号端子部８２Ｂである。電流端子部８２Ａは、接続穴ＣＨ１のうちで電流導通部７２Ａに電気的に接続されている接続穴ＣＨ１に挿入された状態で電子基板７０と接合されている。信号端子部８２Ｂは、接続穴ＣＨ１のうちで信号導通部７２Ｂに電気的に接続されている接続穴ＣＨ１に挿入された状態で電子基板７０と接合されている。 As shown in FIG. 2, the plurality of terminal portions 82 include current terminal portions 82A to which drive currents are input, and signal terminal portions 82B to which control signals are input. That is, some of the plurality of terminal portions 82 are current terminal portions 82A, and some of the plurality of terminal portions 82 are signal terminal portions 82B. The current terminal portion 82A is joined to the electronic substrate 70 while being inserted into the connection hole CH1 electrically connected to the current conducting portion 72A. The signal terminal portion 82B is joined to the electronic substrate 70 while being inserted into the connection hole CH1 electrically connected to the signal conduction portion 72B.
　本実施形態では、端子部８２は、はんだによって電子基板７０に接合されており、言い換えれば、端子部８２と電子基板７０とがはんだ層で接合されているが、端子部８２と電子基板７０と接合方式ははんだ付けに限られず任意であってよく、言い換えれば、端子部８２の接合部は、はんだに限られず任意の材質で構成されていてよい。 In this embodiment, the terminal portion 82 is joined to the electronic substrate 70 by soldering. In other words, the terminal portion 82 and the electronic substrate 70 are joined by a solder layer. The joining method is not limited to soldering and may be arbitrary. In other words, the joining portion of the terminal portion 82 may be made of any material without being limited to solder.
　（接続部材）
　図１に示すように、接続部材９０は、制御基板６２と電子基板７０とを電気的に接続する。接続部材９０は、本実施形態ではピンヘッダである。接続部材９０は、一方の端部９０ａから他方の端部９０ｂまで、Ｚ１方向に向けて延在する。接続部材９０は、端部９０ａが、制御基板６２に電気的に接続される。接続部材９０は、端部９０ａが制御基板６２に接続された状態で、制御基板６２に対して固定されている。また、接続部材９０は、端部９０ａよりもＺ１方向側の箇所で、電子基板７０の、Ｚ方向から見た場合に制御基板６２（ケーシング１０）と重なる箇所に電気的に接続される。接続部材９０は、端部９０ａよりもＺ１方向側の箇所が電子基板７０に接続された状態で、すなわち電子基板７０の接続穴ＣＨ２又は接続穴ＣＨ３に挿入された状態で、電子基板７０と接合されることで、電子基板７０に固定されている。 (Connecting member)
As shown in FIG. 1 , the connection member 90 electrically connects the control board 62 and the electronic board 70 . The connection member 90 is a pin header in this embodiment. The connection member 90 extends in the Z1 direction from one end 90a to the other end 90b. The connection member 90 is electrically connected to the control board 62 at the end 90a. The connection member 90 is fixed to the control board 62 with the end portion 90 a connected to the control board 62 . Also, the connecting member 90 is electrically connected to a portion of the electronic board 70 that overlaps the control board 62 (casing 10) when viewed from the Z direction, at a point on the Z1 direction side of the end portion 90a. The connection member 90 is connected to the electronic substrate 70 at a location on the Z1 direction side of the end portion 90a, that is, is inserted into the connection hole CH2 or the connection hole CH3 of the electronic substrate 70, and is joined to the electronic substrate 70. By being fixed to the electronic substrate 70 .
　接続部材９０は、電流接続部９２と、信号接続部９４とを含む。すなわち、本実施形態の接続部材９０は、駆動電流用のピンヘッダである電流接続部９２と、制御信号用のピンヘッダである信号接続部９４とを含むといえる。ただし、接続部材９０はピンヘッダであることに限られない。 The connection member 90 includes a current connection portion 92 and a signal connection portion 94 . That is, it can be said that the connection member 90 of the present embodiment includes a current connection portion 92 that is a pin header for drive current and a signal connection portion 94 that is a pin header for control signals. However, the connection member 90 is not limited to being a pin header.
　電流接続部９２は、端部９０ａが、制御基板６２の駆動電流が流れる箇所に電気的に接続され、端部９０ａよりもＺ１方向側の箇所が、電子基板７０の電流導通部７２Ａに電気的に接続される。本実施形態では、電流接続部９２は、電子基板７０の接続穴ＣＨ２に挿入された状態で電子基板７０に接合されており、電流導通部７２Ａに電気的に接続される。また、信号接続部９４は、端部９０ａが、制御基板６２の制御信号が流れる箇所に電気的に接続され、端部９０ａよりもＺ１方向側の箇所が、電子基板７０の信号導通部７２Ｂに電気的に接続される。本実施形態では、信号接続部９４は、電子基板７０の接続穴ＣＨ３に挿入された状態で電子基板７０に接合されており、信号導通部７２Ｂに電気的に接続される。 The current connection portion 92 has an end portion 90a electrically connected to a portion of the control board 62 through which the drive current flows, and a portion on the Z1 direction side of the end portion 90a electrically connected to the current conduction portion 72A of the electronic substrate 70. connected to In this embodiment, the current connecting portion 92 is joined to the electronic substrate 70 while being inserted into the connection hole CH2 of the electronic substrate 70, and is electrically connected to the current conducting portion 72A. The signal connection portion 94 has an end portion 90a electrically connected to a portion of the control board 62 through which a control signal flows, and a portion on the Z1 direction side of the end portion 90a connected to the signal conducting portion 72B of the electronic substrate 70. electrically connected. In this embodiment, the signal connection portion 94 is joined to the electronic substrate 70 while being inserted into the connection hole CH3 of the electronic substrate 70, and is electrically connected to the signal conduction portion 72B.
　本実施形態では、接続部材９０は、はんだによって電子基板７０及び制御基板６２に接合されており、言い換えれば、接続部材９０と電子基板７０、及び接続部材９０と制御基板６２とがはんだ層で接合されているが、接合方式ははんだ付けに限られず任意であってよい。 In this embodiment, the connection member 90 is joined to the electronic board 70 and the control board 62 by soldering. However, the joining method is not limited to soldering and may be arbitrary.
　（基板ユニットの電気的接続）
　基板ユニット６０は、以上のような構成となっている。そのため、本実施形態では、コネクタ部８０の電流端子部８２Ａと、電子基板７０の電流導通部７２Ａと、接続部材９０の電流接続部９２と、制御基板６２の駆動電流が流れる箇所とが、電気的に接続される。従って、コネクタ部８０の電流端子部８２Ａからの駆動電流は、電流導通部７２Ａ、及び電流接続部９２を経て、制御基板６２に供給される。また、本実施形態では、コネクタ部８０の信号端子部８２Ｂと、電子基板７０の信号導通部７２Ｂと、接続部材９０の信号接続部９４と、制御基板６２の制御信号が流れる箇所とが、電気的に接続される。従って、コネクタ部８０の信号端子部８２Ｂからの制御信号は、電流導通部７２Ａ、及び電流接続部９２を経て、制御基板６２に供給される。 (Electrical connection of board unit)
The board unit 60 is configured as described above. Therefore, in the present embodiment, the current terminal portion 82A of the connector portion 80, the current conduction portion 72A of the electronic substrate 70, the current connection portion 92 of the connection member 90, and the portion of the control substrate 62 through which the drive current flows are electrically connected. connected Therefore, the drive current from the current terminal portion 82A of the connector portion 80 is supplied to the control board 62 via the current conduction portion 72A and the current connection portion 92. FIG. Further, in the present embodiment, the signal terminal portion 82B of the connector portion 80, the signal conducting portion 72B of the electronic substrate 70, the signal connection portion 94 of the connection member 90, and the portion of the control substrate 62 through which the control signal flows are electrically connected. connected Therefore, the control signal from the signal terminal portion 82B of the connector portion 80 is supplied to the control board 62 via the current conduction portion 72A and the current connection portion 92. FIG.
　（支持部材）
　図３は、本実施形態に係る支持部材の模式的な上面図である。支持部材１００は、表面１００Ａに電子基板７０が取り付けられる板状の部材である。図１に示すように、本実施形態では、支持部材１００は、Ｚ方向において制御基板６２と電子基板７０との間に設けられて、制御基板６２と電子基板７０とを放熱（冷却）する。本実施形態では、支持部材１００は、Ｚ１方向側の表面１００Ａが、電子基板７０に、直接的に又は他の部材を介して間接的に、接触している。本実施形態では、支持部材１００は、Ｚ２方向側の表面１００Ｂが、制御基板６２に、直接的に又は他の部材を介して間接的に、接触している。支持部材１００は、ケーシング１０と同じ材料であってよく、例えばアルミニウム合金で構成され、本実施形態ではＪＩＳで規格されるＡＤＣ１２の部材で構成される。ただし、支持部材１００の材料は任意であってよい。 (support member)
FIG. 3 is a schematic top view of the support member according to this embodiment. The support member 100 is a plate-shaped member to which the electronic substrate 70 is attached on the surface 100A. As shown in FIG. 1, in this embodiment, the support member 100 is provided between the control board 62 and the electronic board 70 in the Z direction, and radiates heat (cools) the control board 62 and the electronic board 70 . In this embodiment, the Z1 direction side surface 100A of the support member 100 is in contact with the electronic substrate 70 directly or indirectly via another member. In this embodiment, the Z2 direction side surface 100B of the support member 100 is in contact with the control board 62 directly or indirectly via another member. The support member 100 may be made of the same material as the casing 10, such as an aluminum alloy, and in this embodiment, it is made of a member of the ADC 12 standardized by JIS. However, the material of the support member 100 may be arbitrary.
　支持部材１００は、ケーシング１０のＺ１方向側の開口を閉塞する蓋である。支持部材１００は、フランジ部１００Ｃと、挿入部１００Ｄと、突出部１００Ｅとを含む。フランジ部１００Ｃは、Ｚ方向から見てケーシング１０の空間ＳＰよりも大きく、ケーシング１０の空間ＳＰの外側に、より詳しくは空間ＳＰよりもＺ１方向側に、位置している。フランジ部１００Ｃは、Ｚ方向から見てケーシング１０や制御基板６２に重なる位置にある。 The support member 100 is a lid that closes the opening of the casing 10 on the Z1 direction side. The support member 100 includes a flange portion 100C, an insertion portion 100D, and a projecting portion 100E. The flange portion 100C is larger than the space SP of the casing 10 when viewed from the Z direction, and is positioned outside the space SP of the casing 10, more specifically, on the Z1 direction side of the space SP. The flange portion 100C is positioned so as to overlap the casing 10 and the control board 62 when viewed from the Z direction.
　挿入部１００Ｄは、フランジ部１００ＣからＺ２方向側に突出する部分である。挿入部１００Ｄは、支持部材１００の、ケーシング１０に挿入される部分である。挿入部１００Ｄは、ケーシング１０の空間ＳＰ内において、制御基板６２よりもＺ１方向側に位置するように、ケーシング１０内に挿入される。本実施形態では、挿入部１００Ｄの外周面とケーシング１０の側部１４の内周面とがシールされることで、空間ＳＰ内への水や異物の侵入が抑制される。挿入部１００Ｄの外周面とケーシング１０の側部１４の内周面とは、例えばＯ－リングなどの弾性部材でシールされてよいが、シールの方式は任意であってよい。 The insertion portion 100D is a portion that protrudes from the flange portion 100C in the Z2 direction. The insertion portion 100D is a portion of the support member 100 that is inserted into the casing 10 . The insertion portion 100D is inserted into the casing 10 so as to be located on the Z1 direction side of the control board 62 in the space SP of the casing 10 . In the present embodiment, the outer peripheral surface of the insertion portion 100D and the inner peripheral surface of the side portion 14 of the casing 10 are sealed to prevent water and foreign matter from entering the space SP. The outer peripheral surface of the insertion portion 100D and the inner peripheral surface of the side portion 14 of the casing 10 may be sealed by an elastic member such as an O-ring, but any sealing method may be used.
　図３に示すように、突出部１００Ｅは、フランジ部１００Ｃから、駆動軸３２を中心軸（Ｚ方向に沿うモータ１６の中心軸）とした場合の径方向外側に向けて突出する部分である。すなわち、支持部材１００の空間ＳＰ外に位置している部分のうちで、Ｚ方向から見てケーシング１０と重なる部分が、フランジ部１００Ｃであり、Ｚ方向から見てケーシング１０と重ならない部分が、突出部１００Ｅといえる。突出部１００ＥのＺ１方向側の表面とフランジ部１００ＣのＺ１方向の表面とは、同一面であり（すなわち連続しており）、突出部１００ＥのＺ１方向側の表面とフランジ部１００ＣのＺ１方向の表面とが、支持部材１００の表面１００Ａとなるといえる。 As shown in FIG. 3, the protruding portion 100E is a portion that protrudes radially outward from the flange portion 100C when the drive shaft 32 is the central axis (the central axis of the motor 16 along the Z direction). That is, of the portion of the support member 100 located outside the space SP, the portion that overlaps the casing 10 as viewed in the Z direction is the flange portion 100C, and the portion that does not overlap the casing 10 as viewed in the Z direction is It can be said that it is a projecting portion 100E. The surface of the projecting portion 100E on the Z1 direction side and the surface of the flange portion 100C on the Z1 direction side are the same surface (that is, they are continuous), and the surface on the Z1 direction side of the projecting portion 100E and the surface on the Z1 direction side of the flange portion 100C are on the same plane. The surface can be said to be the surface 100A of the support member 100 .
　図３に示すように、支持部材１００の表面１００Ａには、電子基板７０が設けられる。以下、表面１００Ａのうちで電子基板７０が設けられる領域を、すなわちＺ方向から見て電子基板７０と重なる領域を、領域ＡＲ１とする。領域ＡＲ１は、表面１００Ａの、Ｚ方向から見てケーシング１０と重なる位置から、Ｚ方向から見てケーシング１０と重ならない位置までにわたっているため、電子基板７０は、表面１００Ａの、Ｚ方向から見てケーシング１０と重なる位置から、Ｚ方向から見てケーシング１０と重ならない位置までにわたって設けられているといえる。 As shown in FIG. 3, an electronic substrate 70 is provided on the surface 100A of the support member 100. As shown in FIG. Hereinafter, the area where the electronic substrate 70 is provided in the surface 100A, that is, the area overlapping the electronic substrate 70 when viewed from the Z direction is referred to as an area AR1. The area AR1 extends from a position where the surface 100A overlaps the casing 10 when viewed in the Z direction to a position where the surface 100A does not overlap the casing 10 when viewed in the Z direction. It can be said that it is provided from a position that overlaps with the casing 10 to a position that does not overlap with the casing 10 when viewed from the Z direction.
　図３に示すように、支持部材１００の表面１００Ａには、固定領域１０１が形成されている。固定領域１０１は、後述するカバー部材１１０の固定領域１１８に接着される領域である。固定領域１０１は、領域ＡＲ１を囲うように周状に形成されている。固定領域１０１は、表面１００Ａの、Ｚ方向から見てケーシング１０と重なる位置から、Ｚ方向から見てケーシング１０と重ならない位置までにわたって形成されている。固定領域１０１は、本実施形態では溝状であるが、それに限られず、例えば表面１００Ａから突出する凸形状であってもよいし、表面１００Ａから窪んだり突出したりせずに、表面１００Ａと同一面に形成されてもよい。 As shown in FIG. 3, a fixing region 101 is formed on the surface 100A of the support member 100. As shown in FIG. The fixed region 101 is a region adhered to a fixed region 118 of the cover member 110, which will be described later. The fixed area 101 is formed in a circumferential shape so as to surround the area AR1. The fixing region 101 is formed from a position of the surface 100A that overlaps the casing 10 when viewed from the Z direction to a position that does not overlap the casing 10 when viewed from the Z direction. Although the fixing region 101 has a groove shape in this embodiment, it is not limited thereto, and may have, for example, a convex shape protruding from the surface 100A, or may be flush with the surface 100A without being recessed or protruding from the surface 100A. may be formed in
　なお、固定領域１０１よりも内側の領域は、領域ＡＲ１よりも広くなっている。すなわち、固定領域１０１の内周よりも内側の領域は、電子基板７０と重なる領域ＡＲ１と、電子基板７０と重ならない領域ＡＲ２とを含むといえる。固定領域１０１よりも内側の領域とは、Ｚ方向から見て固定領域１０１に囲われる領域を指し、言い換えれば、固定領域１０１の中心を通るＺ方向に沿った軸を軸方向とした場合に、固定領域１０１の内周よりも径方向内側の領域を指す。 The area inside the fixed area 101 is wider than the area AR1. That is, it can be said that the area inside the inner periphery of the fixed area 101 includes the area AR1 overlapping with the electronic substrate 70 and the area AR2 not overlapping with the electronic substrate 70 . The region inside the fixing region 101 refers to the region surrounded by the fixing region 101 when viewed from the Z direction. It refers to a region radially inside the inner circumference of the fixing region 101 .
　支持部材１００の表面１００Ａには、開口部１０２が形成されている。開口部１０２は、支持部材１００の表面１００Ａから表面１００Ｂまで貫通する開口である。開口部１０２は、領域ＡＲ１に形成されており、領域ＡＲ１の、Ｚ方向から見てケーシング１０（制御基板６２）と重なる位置に形成されている。さらに言えば、開口部１０２は、Ｚ方向から見て、接続部材９０や、電子基板７０の接続穴ＣＨ２、ＣＨ３と重なる位置に形成されている。接続部材９０は、開口部１０２内に位置し、開口部１０２内を通って電子基板７０と制御基板６２とに接続される。開口部１０２は、領域ＡＲに形成されるため、Ｚ１方向側が電子基板７０に覆われる。 An opening 102 is formed in the surface 100A of the support member 100. The opening 102 is an opening penetrating from the surface 100A of the support member 100 to the surface 100B. The opening 102 is formed in the area AR1, and is formed at a position overlapping the casing 10 (control board 62) in the area AR1 when viewed from the Z direction. Furthermore, the opening 102 is formed at a position overlapping the connection member 90 and the connection holes CH2 and CH3 of the electronic substrate 70 when viewed from the Z direction. The connecting member 90 is positioned within the opening 102 and is connected to the electronic board 70 and the control board 62 through the opening 102 . Since the opening 102 is formed in the area AR, the Z1 direction side is covered with the electronic substrate 70 .
　支持部材１００の表面１００Ａには、窪み１０４が形成されている。窪み１０４は、支持部材１００の表面１００Ａに形成されて表面１００Ｂ側に凹む窪みであり、表面１００Ｂまで貫通しない。窪み１０４は、固定領域１０１よりも内側であって、Ｚ方向から見てケーシング１０（制御基板６２）と重ならない位置に形成されている。窪み１０４は、領域ＡＲ１から領域ＡＲ２にわたって形成されている。なお、窪み１０４は、必須の構成ではなく、形成されていなくてもよい。 A recess 104 is formed in the surface 100A of the support member 100. The depression 104 is a depression formed in the surface 100A of the support member 100 and recessed toward the surface 100B, and does not penetrate to the surface 100B. The recess 104 is formed inside the fixing region 101 and at a position not overlapping the casing 10 (control board 62) when viewed in the Z direction. Recess 104 is formed from area AR1 to area AR2. Note that the recess 104 is not an essential component and may not be formed.
　支持部材１００の表面１００Ａには、開口部１０５が形成されている。開口部１０５は、支持部材１００の表面１００Ａから表面１００Ｂまで貫通する開口である。開口部１０５は、領域ＡＲ１に形成されており、領域ＡＲ１の、Ｚ方向から見てケーシング１０（制御基板６２）と重ならない位置に形成されている。さらに言えば、開口部１０５は、Ｚ方向から見て、コネクタ部８０の端子部８２や電子基板７０の接続穴ＣＨ１と重なる位置に形成されている。端子部８２は、開口部１０５内に位置し、開口部１０５内を通って電子基板７０に接続される。開口部１０５は、Ｚ１方向側が電子基板７０に覆われる。なお、本実施形態では、開口部１０５は、窪み１０４内に形成されるが、窪み１０４内に形成されることに限られない。 An opening 105 is formed in the surface 100A of the support member 100. The opening 105 is an opening penetrating from the surface 100A of the support member 100 to the surface 100B. The opening 105 is formed in the area AR1, and is formed at a position where it does not overlap the casing 10 (control board 62) when viewed from the Z direction in the area AR1. Furthermore, the opening 105 is formed at a position overlapping the terminal portion 82 of the connector portion 80 and the connection hole CH1 of the electronic substrate 70 when viewed from the Z direction. The terminal portion 82 is positioned within the opening portion 105 and is connected to the electronic substrate 70 through the opening portion 105 . The opening 105 is covered with the electronic substrate 70 on the Z1 direction side. In addition, although the opening 105 is formed in the depression 104 in the present embodiment, it is not limited to being formed in the depression 104 .
　支持部材１００の表面１００Ａには、穴部１０６が形成されている。穴部１０６は、後述するカバー部材１１０の圧入部１２８が圧入される開口である。穴部１０６は、固定領域１０１よりも内側であって、Ｚ方向から見て電子基板７０に重ならない位置に、すなわち領域ＡＲ２に、形成される。本実施形態では、穴部１０６は、複数形成され、図３の例では３つが形成されている。穴部１０６は、支持部材１００の表面１００Ａから表面１００Ｂまで貫通する。穴部１０６が表面１００Ｂまで貫通することで、表面１００Ｂから穴部１０６を加工できるため、加工の手間が抑制できる。ただし、穴部１０６は、表面１００Ｂまで貫通されることに限られない。また、穴部１０６の数や設けられる位置は、以上の説明に限られず任意であってよい。 A hole 106 is formed in the surface 100A of the support member 100. As shown in FIG. The hole portion 106 is an opening into which a press-fitting portion 128 of the cover member 110, which will be described later, is press-fitted. The hole 106 is formed inside the fixing region 101 and at a position not overlapping the electronic substrate 70 when viewed in the Z direction, that is, in the region AR2. In this embodiment, a plurality of holes 106 are formed, and three holes are formed in the example of FIG. Hole 106 penetrates support member 100 from surface 100A to surface 100B. Since the hole portion 106 can be processed from the surface 100B by penetrating the hole portion 106 to the surface 100B, the labor for processing can be suppressed. However, the holes 106 are not limited to penetrating to the surface 100B. Also, the number and positions of the holes 106 are not limited to those described above and may be arbitrary.
　支持部材１００の表面１００Ａには、コネクタ部８０や電子基板７０に固定されるボルトが挿通される開口１０７が形成される。また、支持部材１００は、表面１００Ａの、Ｚ方向から見てケーシング１０と重なる位置に、窪みＧＲが形成されている。窪みＧＲは、カバー部材１１０に覆われない位置に形成される窪みであり、表面１００Ｂまでは貫通していない。ただし、開口１０７、窪みＧＲなどは必須の構成ではない。 The surface 100A of the support member 100 is formed with openings 107 through which bolts fixed to the connector section 80 and the electronic board 70 are inserted. Further, the support member 100 has a depression GR formed at a position overlapping the casing 10 when viewed from the Z direction on the surface 100A. The recess GR is a recess formed at a position not covered by the cover member 110 and does not penetrate to the surface 100B. However, the opening 107, the recess GR, etc. are not essential components.
　支持部材１００の表面１００Ａには、第１接着領域１０８が形成されている。第１接着領域１０８は、支持部材１００を電子基板７０やカバー部材１１０と固定するための接着剤が塗布される領域であり、第１接着領域１０８の表面に接着層（硬化した接着剤の層）が形成されるといえる。第１接着領域１０８は、固定領域１０１よりも内側であって、Ｚ方向から見て電子基板７０に重なる位置に、すなわち領域ＡＲ１に、形成される。さらに言えば、第１接着領域１０８は、Ｚ方向から見て、電子基板７０の孔部７４に重なる位置に形成される。 A first adhesion region 108 is formed on the surface 100A of the support member 100. As shown in FIG. The first adhesive area 108 is an area to which an adhesive is applied for fixing the support member 100 to the electronic substrate 70 and the cover member 110 . ) is formed. The first adhesive region 108 is formed inside the fixing region 101 and overlapping the electronic substrate 70 when viewed in the Z direction, that is, in the region AR1. Furthermore, the first adhesive region 108 is formed at a position overlapping the hole 74 of the electronic substrate 70 when viewed from the Z direction.
　第１接着領域１０８は、表面１００ＡからＺ１方向に向けて突出する凸形状となっている。第１接着領域１０８は、孔部７４と同じ数（本例では２つ）設けられている。ただし、第１接着領域１０８は、凸形状であることに限られず、例えば表面１００Ａと同一面であるなど、任意の形状であってよい。また、第１接着領域１０８の設けられる数も任意であってよい。例えば、Ｚ方向から見て一方の孔部７４と重なる位置から他方の孔部７４に重なる位置までにわたって、１つの第１接着領域１０８が形成されていてもよい。 The first adhesion region 108 has a convex shape that protrudes from the surface 100A in the Z1 direction. The first adhesive regions 108 are provided in the same number as the holes 74 (two in this example). However, the first adhesive region 108 is not limited to being convex, and may be of any shape such as flush with the surface 100A. Also, the number of first adhesive regions 108 provided may be arbitrary. For example, one first adhesive region 108 may be formed from a position overlapping one hole 74 to a position overlapping the other hole 74 when viewed in the Z direction.
　第１接着領域１０８のＺ１方向側の先端部は、本実施形態では平面状であるが、例えばＺ２方向側に窪んでいてもよい。先端部が平面状であったり窪んでいたりすることにより、接着剤を適切に塗布できる。ただし、第１接着領域１０８の先端部の形状は任意であってよい。 The tip of the first adhesive region 108 on the Z1 direction side is planar in this embodiment, but may be recessed, for example, on the Z2 direction side. Adhesive can be properly applied by making the tip flat or concave. However, the shape of the tip of the first adhesive region 108 may be arbitrary.
　（カバー部材）
　図４は、カバー部材の模式図である。カバー部材１１０は、Ｚ２方向側の表面１１０Ａ（対向面）が、支持部材１００の表面１００Ａに対向するように、表面１００Ａに取り付けられて、電子基板７０を覆うカバーである。図４に示すように、カバー部材１１０は、カバー部１１２と、側部１１４と、固定部１１６とを含む。カバー部１１２は、板状の部材であり、支持部材１００に取り付けられた際に、Ｚ方向から見て電子基板７０と重なるカバー部材１１０の上面部分である。側部１１４は、支持部材１００の外縁からＺ２方向側に突出する、カバー部材１１０の側面部分である。固定部１１６は、側部１１４のＺ２方向側の先端に形成されて、支持部材１００に固定される、カバー部材１１０のフランジ部分である。 (Cover member)
FIG. 4 is a schematic diagram of a cover member. The cover member 110 is a cover that covers the electronic substrate 70 by being attached to the surface 100A of the support member 100 so that the surface 110A (facing surface) on the Z2 direction side faces the surface 100A of the support member 100 . As shown in FIG. 4 , cover member 110 includes cover portion 112 , side portion 114 , and fixing portion 116 . The cover part 112 is a plate-like member, and is an upper surface part of the cover member 110 that overlaps the electronic board 70 when viewed from the Z direction when attached to the support member 100 . The side portion 114 is a side portion of the cover member 110 that protrudes from the outer edge of the support member 100 in the Z2 direction. The fixed portion 116 is a flange portion of the cover member 110 that is formed at the tip of the side portion 114 on the Z2 direction side and fixed to the support member 100 .
　固定部１１６のＺ２方向側の表面１１６Ａには、固定領域１１８が形成される。固定領域１１８は、支持部材１００の固定領域１０１に接着される領域である。固定領域１１８は、カバー部１１２の外縁の全区間にわたって周状に形成されている。固定領域１１８は、支持部材１００に取り付けられた際に、固定領域１０１と対向する位置に設けられる。本実施形態では、固定領域１１８は、表面１１６ＡからＺ２方向側に突出する凸形状であるが、それに限られず、例えば表面１１６ＡからＺ１方向側に窪む溝形状であってもよいし、表面１００Ａから窪んだり突出したりせずに、表面１１６Ａと同一面に形成されてもよい。 A fixing region 118 is formed on the surface 116A of the fixing portion 116 on the Z2 direction side. The fixation area 118 is the area that is adhered to the fixation area 101 of the support member 100 . The fixing region 118 is circumferentially formed over the entire outer edge of the cover portion 112 . The fixing region 118 is provided at a position facing the fixing region 101 when attached to the support member 100 . In the present embodiment, the fixing region 118 has a convex shape projecting from the surface 116A in the Z2 direction, but is not limited to this. It may be formed flush with surface 116A without recessing or protruding from the surface.
　カバー部材１１０の表面１１０Ａには、第２接着領域１２０が形成されている。第２接着領域１２０は、カバー部材１１０を電子基板７０や支持部材１００と固定するための接着剤が塗布される領域であり、第２接着領域１２０の表面に接着層が形成されるといえる。第２接着領域１２０は、カバー部１１２の表面１１２Ａに形成されており、固定領域１１８の内側（Ｚ方向から見て固定領域１１８に囲われる領域）に設けられているといえる。さらに言えば、第２接着領域１２０は、カバー部材１１０が支持部材１００に取り付けられた状態において、Ｚ方向から見て、電子基板７０の孔部７４、及び支持部材１００の第１接着領域１０８に重なる位置に形成される。 A second adhesion area 120 is formed on the surface 110A of the cover member 110 . The second adhesive area 120 is an area where an adhesive is applied to fix the cover member 110 to the electronic substrate 70 and the support member 100 , and it can be said that an adhesive layer is formed on the surface of the second adhesive area 120 . The second adhesive region 120 is formed on the surface 112A of the cover portion 112, and can be said to be provided inside the fixing region 118 (the region surrounded by the fixing region 118 when viewed in the Z direction). Furthermore, in the state where the cover member 110 is attached to the support member 100 , the second adhesion region 120 is positioned between the hole 74 of the electronic substrate 70 and the first adhesion region 108 of the support member 100 when viewed from the Z direction. formed at overlapping positions.
　第２接着領域１２０は、表面１１０ＡからＺ２方向に向けて突出する凸形状となっている。本実施形態では、第２接着領域１２０は、側部１１４の１つの内面から、その内面に対向する側部１１４の内面まで延在する梁状となっている。第２接着領域１２０は、カバー部材１１０が支持部材１００に取り付けられた状態において、Ｚ方向から見て一方の孔部７４及び第１接着領域１０８と重なる位置から、他方の孔部７４及び第１接着領域１０８に重なる位置までにわたって延在するといえる。ただし、第１接着領域１０８は、凸形状や梁形状であることに限られず、任意の形状であってよい。また、第２接着領域１２０の設けられる数も任意であってよい。また、カバー部材１１０の表面１１０Ａには、第２接着領域１２０と平行な方向に延在する梁部１２２や、第２接着領域１２０と交差する方向に延在する梁部１２４が形成されているが、梁部１２２、１２４は必須の構成ではない。 The second adhesion region 120 has a convex shape that protrudes from the surface 110A in the Z2 direction. In this embodiment, the second adhesive region 120 has a beam shape extending from one inner surface of the side portion 114 to the inner surface of the side portion 114 opposite to the inner surface. When the cover member 110 is attached to the support member 100 , the second adhesive region 120 extends from a position overlapping the one hole portion 74 and the first adhesive region 108 as viewed in the Z direction. It can be said that it extends to a position overlapping the adhesion region 108 . However, the first bonding region 108 is not limited to being convex or beam-shaped, and may be of any shape. Also, the number of second adhesive regions 120 provided may be arbitrary. Further, on the surface 110A of the cover member 110, a beam portion 122 extending in a direction parallel to the second bonding region 120 and a beam portion 124 extending in a direction intersecting the second bonding region 120 are formed. However, beams 122 and 124 are not an essential component.
　カバー部材１１０の表面１１０Ａには、第３接着領域１２６が形成されている。第３接着領域１２６は、カバー部材１１０を電子基板７０と固定するための接着剤が塗布される領域であり、第３接着領域１２６の表面に接着層が形成されるといえる。第３接着領域１２６は、カバー部１１２の表面１１２Ａに形成されており、固定領域１１８の内側に設けられているといえる。さらに言えば、第３接着領域１２６は、カバー部材１１０が支持部材１００に取り付けられた状態において、電子基板７０の表面に重なる位置に形成される。 A third adhesive area 126 is formed on the surface 110A of the cover member 110 . The third adhesive area 126 is an area where an adhesive is applied to fix the cover member 110 to the electronic substrate 70, and it can be said that an adhesive layer is formed on the surface of the third adhesive area 126. FIG. It can be said that the third adhesive region 126 is formed on the surface 112</b>A of the cover portion 112 and provided inside the fixing region 118 . Furthermore, the third adhesive region 126 is formed at a position overlapping the surface of the electronic substrate 70 when the cover member 110 is attached to the support member 100 .
　第３接着領域１２６は、表面１１０ＡからＺ２方向に向けて突出する凸形状となっている。本実施形態では、第３接着領域１２６は、梁状となっている。ただし、第３接着領域１２６は、凸形状や梁形状であることに限られず、任意の形状であってよい。 The third bonding area 126 has a convex shape that protrudes from the surface 110A in the Z2 direction. In this embodiment, the third bonding area 126 is beam-shaped. However, the third bonding region 126 is not limited to being convex or beam-shaped, and may be of any shape.
　なお、第３接着領域１２６は、必須の構成ではなく、カバー部材１１０は少なくとも１つの接着領域を有するものであってよい。また、カバー部材１１０は、第２接着領域１２０及び第３接着領域１２６以外にも、接着層を介して電子基板７０や支持部材１００に固定される領域を有していてもよい。この場合例えば、梁部１２２を接着領域として、梁部１２２と電子基板７０の表面とが、接着層を介して固定されていてよい。 The third adhesive area 126 is not an essential component, and the cover member 110 may have at least one adhesive area. Moreover, the cover member 110 may have a region fixed to the electronic substrate 70 or the support member 100 via an adhesive layer, in addition to the second adhesive region 120 and the third adhesive region 126 . In this case, for example, the beam 122 may be used as an adhesive region, and the beam 122 and the surface of the electronic substrate 70 may be fixed via an adhesive layer.
　カバー部材１１０の表面１１０Ａには、圧入部１２８が形成されている。圧入部１２８は、表面１１０ＡからＺ２方向側（支持部材１００側）に突出する軸状の部材である。圧入部１２８は、支持部材１００の穴部１０６に圧入される。圧入部１２８は、カバー部材１１０が支持部材１００に取り付けられた際に、穴部１０６に圧入可能な位置（Ｚ方向から見て穴部１０６と重なる位置）に設けられる。本実施形態では、圧入部１２８は、複数形成され、図３の例では３つが形成されている。ただし、圧入部１２８の数や位置は、任意であってよい。 A press-fit portion 128 is formed on the surface 110A of the cover member 110 . The press-fit portion 128 is a shaft-shaped member that protrudes from the surface 110A in the Z2 direction (toward the support member 100). The press-fit portion 128 is press-fit into the hole portion 106 of the support member 100 . The press-fitting portion 128 is provided at a position where it can be press-fitted into the hole portion 106 when the cover member 110 is attached to the support member 100 (a position overlapping the hole portion 106 when viewed from the Z direction). In this embodiment, a plurality of press-fitting portions 128 are formed, and three are formed in the example of FIG. However, the number and positions of the press-fitting portions 128 may be arbitrary.
　（カバー部材の取付状態）
　カバー部材１１０は、以上説明したような構造となっている。以下、カバー部材１１０が支持部材１００に取り付けられた状態を説明する。 (Mounting state of the cover member)
The cover member 110 has the structure described above. A state in which the cover member 110 is attached to the support member 100 will be described below.
　図５は、カバー部材が取り付けられた状態における電子部品の模式的な上面図である。図１及び図５に示すように、カバー部材１１０は、表面１１０Ａが支持部材１００の表面１００Ａに対向し、支持部材１００上の電子基板７０を覆うように、支持部材１００に取り付けられている。すなわち、図５に示すように、カバー部材１１０は、支持部材１００の固定領域１０１より内側の領域（領域ＡＲ１及び領域ＡＲ２）を覆い、Ｚ方向から見て、カバー部１１２の表面１１２Ａが、電子基板７０に重なる。 FIG. 5 is a schematic top view of the electronic component with the cover member attached. As shown in FIGS. 1 and 5, the cover member 110 is attached to the support member 100 so that the surface 110A faces the surface 100A of the support member 100 and covers the electronic substrate 70 on the support member 100. FIG. That is, as shown in FIG. 5, the cover member 110 covers the areas (area AR1 and area AR2) inside the fixing area 101 of the support member 100, and when viewed from the Z direction, the surface 112A of the cover part 112 is the electron It overlaps the substrate 70 .
　より詳しくは、支持部材１００の第１接着領域１０８と、電子基板７０の孔部７４と、カバー部材１１０の第２接着領域１２０とは、Ｚ方向から見て重なっており、孔部７４の上側と内側と下側にわたって形成された接着層（硬化した接着剤）を介して、支持部材１００と電子基板７０とカバー部材１１０とが固定されている。すなわち、第１接着領域１０８と第２接着領域１２０とが、孔部７４を介して対向し、第１接着領域１０８と第２接着領域１２０との間に形成された接着層によって、支持部材１００と電子基板７０とカバー部材１１０とが固定されている。また、カバー部材１１０の第３接着領域１２６と、Ｚ方向から見て第３接着領域１２６と重なる電子基板７０の表面上の領域である基板接着領域７６とが、接着層を介して固定されることで、電子基板７０とカバー部材１１０とが固定されている。基板接着領域７６は、電子基板７０の表面上における孔部７４と異なる位置に形成されており、端子部（ここでは接続部材９０の電流接続部９２及び信号接続部９４）の近傍にある。ここでの近傍とは、例えば、端子部（ここでは接続部材９０の電流接続部９２及び信号接続部９４）に対して、３ｃｍ以内の位置にあることを指す。 More specifically, the first bonding region 108 of the support member 100, the hole 74 of the electronic substrate 70, and the second bonding region 120 of the cover member 110 overlap each other when viewed from the Z direction. The support member 100, the electronic substrate 70, and the cover member 110 are fixed via an adhesive layer (cured adhesive) formed over the inner and lower sides of the housing. That is, the first adhesive region 108 and the second adhesive region 120 face each other through the hole 74 , and the adhesive layer formed between the first adhesive region 108 and the second adhesive region 120 allows the support member 100 to , the electronic board 70 and the cover member 110 are fixed. Also, the third adhesive region 126 of the cover member 110 and the substrate adhesive region 76, which is the region on the surface of the electronic substrate 70 overlapping the third adhesive region 126 when viewed in the Z direction, are fixed via an adhesive layer. Thus, the electronic board 70 and the cover member 110 are fixed. The substrate bonding area 76 is formed on the surface of the electronic substrate 70 at a position different from the hole 74, and is near the terminals (here, the current connection 92 and the signal connection 94 of the connection member 90). The vicinity here means, for example, a position within 3 cm from the terminal portion (here, the current connection portion 92 and the signal connection portion 94 of the connection member 90).
　また、カバー部材１１０の圧入部１２８が、支持部材１００の穴部１０６に圧入され、カバー部材１１０の固定領域１１８が、支持部材１００の固定領域１０１に接着層（硬化した接着剤）を介して固定（接着）されることで、カバー部材１１０と支持部材１００とが固定されている。本実施形態では、凸形状の固定領域１１８が、溝形状の固定領域１０１内に挿入されて、固定領域１１８と固定領域１０１との間にある接着層を介して固定されている。ただし、固定領域１１８と固定領域１０１とは、それぞれ凸形状及び溝形状であることに限られない。例えば、固定領域１０１と固定領域１１８との一方が溝状であり、固定領域１０１と固定領域１１８とのとの他方が凸状であり、固定領域１０１と固定領域１１８とのうちの一方の溝内に、固定領域１０１と固定領域１１８とのうちの他方が挿入された状態で固定されていてもよい。 Also, the press-fit portion 128 of the cover member 110 is press-fitted into the hole portion 106 of the support member 100, and the fixing region 118 of the cover member 110 is attached to the fixing region 101 of the support member 100 via an adhesive layer (cured adhesive). By being fixed (bonded), the cover member 110 and the support member 100 are fixed. In this embodiment, the convex fixing region 118 is inserted into the groove-shaped fixing region 101 and fixed via the adhesive layer between the fixing region 118 and the fixing region 101 . However, the fixing region 118 and the fixing region 101 are not limited to having a convex shape and a groove shape, respectively. For example, one of the fixing regions 101 and 118 is groove-shaped, the other of the fixing regions 101 and 118 is convex, and one of the fixing regions 101 and 118 is grooved. The other of the fixing region 101 and the fixing region 118 may be inserted and fixed inside.
　このように、カバー部材１１０が電子基板７０を覆うことで、電子基板７０や、電子基板７０のＺ２方向側の開口部１０２、１０５への水や異物の侵入が抑制される。なお、本実施形態では、カバー部材１１０は、Ｚ方向から見て、支持部材１００の全域にわたって重なっておらず、支持部材１００の固定領域１０１の外側の少なくとも一部には重ならない。従って、電子基板７０は、表面１００Ａのうち、電子基板７０と重ならない領域の少なくとも一部が、カバー部材１１０に覆われずに露出している。ただし、カバー部材１１０は、Ｚ方向から見て、支持部材１００の一部のみに重なることに限られず、支持部材１００の全域に重なっていてもよい。 By covering the electronic substrate 70 with the cover member 110 in this manner, entry of water and foreign matter into the electronic substrate 70 and the openings 102 and 105 of the electronic substrate 70 on the Z2 direction side is suppressed. In this embodiment, the cover member 110 does not overlap the entire area of the support member 100 when viewed from the Z direction, and does not overlap at least a portion of the outside of the fixed region 101 of the support member 100 . Therefore, at least a part of the surface 100</b>A of the electronic substrate 70 that does not overlap the electronic substrate 70 is exposed without being covered with the cover member 110 . However, the cover member 110 is not limited to overlapping only a part of the support member 100 when viewed from the Z direction, and may overlap the entire support member 100 .
　（電子部品の製造方法）
　以上説明した電子部品１の製造方法（組み立て方法）を説明する。図６及び図７は、本実施形態に係る電子部品の製造方法を説明する模式図である。図６のステップＳ１に示すように、本製造方法においては、支持部材１００の表面１００Ａ側に電子基板７０を配置する。より詳しくは、電子基板７０の接続穴ＣＨ１が形成される領域が支持部材１００の開口部１０５に重なり、電子基板７０の接続穴ＣＨ２、ＣＨ３が形成される領域が支持部材１００の開口部１０２に重なり、電子基板７０の孔部７４が支持部材１００の第１接着領域１０８に重なるように、支持部材１００の表面１００Ａ側に電子基板７０を配置する。また、本製造方法においては、支持部材１００の表面１００Ａ側に電子基板７０を配置するが、電子基板７０を支持部材１００に対して固定しない状態（接続されていない状態）に保つ。そして、コネクタ部８０の端子部８２を、支持部材１００の表面１００Ｂ側から、開口部１０５内を通して、電子基板７０の接続穴ＣＨ１に挿入する。また、接続部材９０を、支持部材１００の表面１００Ｂ側から、開口部１０２内を通して、電子基板７０の接続穴ＣＨ２、ＣＨ３に挿入する。図６の例では、制御基板６２に接合済みの接続部材９０が、接続穴ＣＨ２、ＣＨ３に挿入されている。従って、接続部材９０を接続穴ＣＨ２、ＣＨ３に挿入することで、制御基板６２を支持部材１００の表面１００Ｂ側に配置しているといえる。ただし、制御基板６２と接合前の接続部材９０を、接続穴ＣＨ２、ＣＨ３に挿入してもよい。この場合、接続部材９０を接続穴ＣＨ２、ＣＨ３に挿入した後に、制御基板６２を支持部材１００の表面１００Ｂ側に配置して、接続部材９０を制御基板６２に接合してもよい。 (Method for manufacturing electronic component)
A manufacturing method (assembling method) of the electronic component 1 described above will be described. FIG.6 and FIG.7 is a schematic diagram explaining the manufacturing method of the electronic component which concerns on this embodiment. As shown in step S1 in FIG. 6, in this manufacturing method, the electronic substrate 70 is placed on the front surface 100A side of the support member 100. As shown in FIG. More specifically, the area where the connection hole CH1 of the electronic board 70 is formed overlaps the opening 105 of the support member 100, and the area where the connection holes CH2 and CH3 of the electronic board 70 are formed overlaps the opening 102 of the support member 100. The electronic substrate 70 is arranged on the surface 100A side of the support member 100 so that the holes 74 of the electronic substrate 70 overlap the first bonding regions 108 of the support member 100 . Further, in this manufacturing method, the electronic board 70 is placed on the front surface 100A side of the support member 100, but the electronic board 70 is kept in an unfixed state (unconnected state) to the support member 100. FIG. Then, the terminal portion 82 of the connector portion 80 is inserted into the connection hole CH1 of the electronic board 70 through the opening portion 105 from the surface 100B side of the support member 100 . Also, the connection member 90 is inserted into the connection holes CH2 and CH3 of the electronic board 70 from the surface 100B side of the support member 100 through the opening 102 . In the example of FIG. 6, the connection member 90 already bonded to the control board 62 is inserted into the connection holes CH2 and CH3. Therefore, it can be said that the control board 62 is arranged on the surface 100B side of the support member 100 by inserting the connection member 90 into the connection holes CH2 and CH3. However, the control board 62 and the connection member 90 before bonding may be inserted into the connection holes CH2 and CH3. In this case, after inserting the connection member 90 into the connection holes CH2 and CH3, the control board 62 may be arranged on the front surface 100B side of the support member 100 and the connection member 90 may be joined to the control board 62 .
　その後、図６のステップＳ２に示すように、電子基板７０を支持部材１００に対して固定しない状態で、電子基板７０と端子部８２とを接合する。すなわち、開口部１０５内を通って電子基板７０の接続穴ＣＨ１に挿入された端子部８２を、電子基板７０と接合する。本実施形態では、接続穴ＣＨ１の周囲に加熱したはんだを塗布することで、電子基板７０と端子部８２とを接合する。また、電子基板７０を支持部材１００に対して固定しない状態で、電子基板７０と接続部材９０とを接合する。すなわち、開口部１０２内を通って電子基板７０の接続穴ＣＨ２、ＣＨ３に挿入された接続部材９０を、電子基板７０と接合する。本実施形態では、接続穴ＣＨ２、ＣＨ３の周囲に加熱したはんだを塗布することで、電子基板７０と接続部材９０とを接合する。ただし、電子基板７０と端子部８２との接合方法、及び電子基板７０と接続部材９０との接合方法は、はんだ接合に限られず、任意の方法を用いてもよい。 After that, as shown in step S2 in FIG. 6, the electronic board 70 and the terminal portion 82 are joined together without fixing the electronic board 70 to the support member 100. Then, as shown in FIG. That is, the terminal portion 82 inserted into the connection hole CH<b>1 of the electronic substrate 70 through the opening 105 is joined to the electronic substrate 70 . In the present embodiment, the electronic substrate 70 and the terminal portion 82 are joined by applying heated solder around the connection hole CH1. Also, the electronic substrate 70 and the connection member 90 are joined together without fixing the electronic substrate 70 to the support member 100 . That is, the connection member 90 inserted into the connection holes CH2 and CH3 of the electronic board 70 through the opening 102 is joined to the electronic board 70 . In this embodiment, the electronic substrate 70 and the connection member 90 are joined by applying heated solder around the connection holes CH2 and CH3. However, the method of joining the electronic substrate 70 and the terminal portion 82 and the method of joining the electronic substrate 70 and the connection member 90 are not limited to soldering, and any method may be used.
　電子基板７０と端子部８２、及び電子基板７０と接続部材９０とを接合する際には、端子部８２や接続部材９０が加熱されることにより、熱膨張する。その後、端子部８２や接続部材９０は、自然冷却又は強制冷却により冷却されて、収縮して元の大きさに戻る。 When the electronic substrate 70 and the terminal portion 82 and the electronic substrate 70 and the connection member 90 are joined, the terminal portion 82 and the connection member 90 are heated and thermally expanded. After that, the terminal portion 82 and the connecting member 90 are cooled by natural cooling or forced cooling, and shrink back to their original sizes.
　その後、図７のステップＳ３に示すように、電子基板７０の孔部７４を介して露出している支持部材１００の第１接着領域１０８に、接着剤Ａを塗布する。これにより、電子基板７０と支持部材１００とが硬化前の接着剤Ａに接する。また、支持部材１００の固定領域１０１と、電子基板７０の基板接着領域７６とにも、接着剤Ａを塗布する。 After that, as shown in step S3 in FIG. 7, the adhesive A is applied to the first adhesive region 108 of the support member 100 exposed through the hole 74 of the electronic substrate 70. Then, as shown in FIG. As a result, the electronic substrate 70 and the support member 100 are brought into contact with the adhesive A before curing. The adhesive A is also applied to the fixing region 101 of the support member 100 and the board bonding region 76 of the electronic board 70 .
　その後、図７のステップＳ４に示すように、カバー部材１１０の表面１１０Ａが支持部材１００の表面１００Ａに対向し、カバー部材１１０が支持部材１００の表面１００Ａ上の電子基板７０を覆うように、カバー部材１１０を支持部材１００に取り付ける。具体的には、カバー部材１１０の固定領域１１８が支持部材１００の固定領域１０１内に配置され、カバー部材１１０の第２接着領域１２０が支持部材１００の第１接着領域１０８上に配置され、カバー部材１１０の第３接着領域１２６が電子基板７０の基板接着領域７６上に配置されるように、カバー部材１１０を支持部材１００に取り付ける。これにより、固定領域１０１と固定領域１１８とが、固定領域１０１内の未硬化の接着剤Ａにより接して、第２接着領域１２０と電子基板７０の孔部７４の箇所と第１接着領域１０８とを、第１接着領域１０８上の未硬化の接着剤Ａにより接して、第３接着領域１２６と基板接着領域７６とを、基板接着領域７６上の未硬化の接着剤Ａにより接する。その後、接着剤Ａを硬化させて接着層Ａａとする。これにより、支持部材１００とカバー部材１１０とが、固定領域１０１と固定領域１１８とにおいて、接着層Ａａを介して固定される。また、支持部材１００と電子基板７０とカバー部材１１０とが、第２接着領域１２０と電子基板７０の孔部７４の箇所と第１接着領域１０８とにおいて、接着層Ａａを介して固定される。同様に、電子基板７０とカバー部材１１０とが、第３接着領域１２６と基板接着領域７６とにおいて、接着層Ａａを介して固定される。 After that, as shown in step S4 in FIG. 7, the cover member 110 is placed so that the surface 110A of the cover member 110 faces the surface 100A of the support member 100, and the cover member 110 covers the electronic substrate 70 on the surface 100A of the support member 100. A member 110 is attached to the support member 100 . Specifically, the fixing region 118 of the cover member 110 is arranged within the fixing region 101 of the support member 100, the second adhesion region 120 of the cover member 110 is arranged on the first adhesion region 108 of the support member 100, and the cover The cover member 110 is attached to the support member 100 such that the third adhesive region 126 of the member 110 is positioned over the substrate adhesive region 76 of the electronic substrate 70 . As a result, the fixing region 101 and the fixing region 118 are brought into contact with each other by the uncured adhesive A in the fixing region 101, and the second adhesion region 120, the hole portion 74 of the electronic substrate 70, and the first adhesion region 108 are brought into contact with each other. are in contact with the uncured adhesive A on the first adhesive area 108 , and the third adhesive area 126 and the substrate adhesive area 76 are in contact with the uncured adhesive A on the substrate adhesive area 76 . After that, the adhesive A is cured to form an adhesive layer Aa. Thereby, the support member 100 and the cover member 110 are fixed via the adhesive layer Aa in the fixing region 101 and the fixing region 118 . Further, the support member 100, the electronic substrate 70, and the cover member 110 are fixed via the adhesive layer Aa at the second adhesive region 120, the holes 74 of the electronic substrate 70, and the first adhesive region . Similarly, the electronic substrate 70 and the cover member 110 are fixed via the adhesive layer Aa in the third adhesive area 126 and the substrate adhesive area 76 .
　その後、例えば支持部材１００をケーシング１０に取り付けることで、電子部品１の製造は終了する。 After that, for example, by attaching the support member 100 to the casing 10, the manufacture of the electronic component 1 is completed.
　以上説明した電子部品１の製造方法のフローを、フローチャートに基づき説明する。図８は、本実施形態に係る電子部品の製造フローを説明するフローチャートである。図８に示すように、本製造方法においては、支持部材１００の表面１００Ａ側に電子基板７０を配置する（ステップＳ１０）。そして、電子基板７０の接続穴ＣＨ１に端子部８２を挿入して、電子基板７０が支持部材１００に固定されていない状態で、電子基板７０と端子部８２とを接合し（ステップＳ１２）、電子基板７０の接続穴ＣＨ２、ＣＨ３に接続部材９０を挿入して、電子基板７０が支持部材１００に固定されていない状態で、電子基板７０と接続部材９０とを接合する（ステップＳ１４）。なお、ステップＳ１２、Ｓ１４の実行順は任意であってよい。 The flow of the method for manufacturing the electronic component 1 described above will be described based on a flowchart. FIG. 8 is a flow chart for explaining the manufacturing flow of the electronic component according to this embodiment. As shown in FIG. 8, in this manufacturing method, the electronic substrate 70 is placed on the front surface 100A side of the support member 100 (step S10). Then, the terminal portion 82 is inserted into the connection hole CH1 of the electronic substrate 70, and the electronic substrate 70 and the terminal portion 82 are joined while the electronic substrate 70 is not fixed to the support member 100 (step S12). The connection member 90 is inserted into the connection holes CH2 and CH3 of the substrate 70, and the electronic substrate 70 and the connection member 90 are joined while the electronic substrate 70 is not fixed to the support member 100 (step S14). Note that the execution order of steps S12 and S14 may be arbitrary.
　その後、支持部材１００に接着剤Ａを塗布し（ステップＳ１６；塗布ステップ）、カバー部材１１０を取り付ける（ステップＳ１８；カバー部材取り付けステップ）。具体的には、支持部材１００の第１接着領域１０８及び固定領域１０１と、電子基板７０の基板接着領域７６とに、接着剤Ａを塗布する。そして、カバー部材１１０の固定領域１１８が支持部材１００の固定領域１０１内に配置され、カバー部材１１０の第２接着領域１２０が支持部材１００の第１接着領域１０８上に配置され、カバー部材１１０の第３接着領域１２６が電子基板７０の基板接着領域７６上に配置されるように、カバー部材１１０を支持部材１００に取り付ける。なお、ここでは、支持部材１００や電子基板７０に接着剤Ａを塗布したが、それに限られず、カバー部材１１０に接着剤を塗布してよい。すなわち、第１接着領域１０８と第２接着領域１２０との少なくとも一方に接着剤Ａを塗布してよく、固定領域１０１と固定領域１１８との少なくとも一方に接着剤Ａを塗布してよく、基板接着領域７６と第３接着領域１２６との少なくとも一方に接着剤Ａを塗布してよい。 After that, the adhesive A is applied to the support member 100 (step S16; application step), and the cover member 110 is attached (step S18; cover member attachment step). Specifically, the adhesive A is applied to the first bonding area 108 and the fixing area 101 of the support member 100 and the substrate bonding area 76 of the electronic substrate 70 . The fixing region 118 of the cover member 110 is arranged within the fixing region 101 of the support member 100 , the second adhesion region 120 of the cover member 110 is arranged on the first adhesion region 108 of the support member 100 , and the cover member 110 is The cover member 110 is attached to the support member 100 such that the third adhesive area 126 is positioned over the substrate adhesive area 76 of the electronic substrate 70 . Although the adhesive A is applied to the support member 100 and the electronic substrate 70 here, the adhesive may be applied to the cover member 110 without being limited thereto. That is, the adhesive A may be applied to at least one of the first adhesion region 108 and the second adhesion region 120, the adhesive A may be applied to at least one of the fixing region 101 and the fixing region 118, and substrate bonding may be performed. Adhesive A may be applied to at least one of area 76 and third adhesive area 126 .
　その後、接着剤Ａを硬化させて、支持部材１００と電子基板７０とカバー部材１１０とを固定する（ステップＳ２０；固定ステップ）。 After that, the adhesive A is cured to fix the support member 100, the electronic substrate 70, and the cover member 110 (step S20; fixing step).
　（効果）
　以上説明したように、本実施形態に係る電子部品１の製造方法は、支持部材１００の一方の表面１００Ａに電子基板７０を配置するステップと、電子基板７０が支持部材１００に対して固定されていない状態で、電子基板７０と端子部８２とを接合するステップと、端子部８２が接合された電子基板７０と支持部材１００とを、接着剤Ａで固定するステップと、を含む。 (effect)
As described above, the method of manufacturing the electronic component 1 according to the present embodiment includes the steps of placing the electronic substrate 70 on one surface 100A of the support member 100, and fixing the electronic substrate 70 to the support member 100. a step of bonding the electronic substrate 70 and the terminal portion 82 in a state in which the terminal portion 82 is bonded to the electronic substrate 70;
　このように電子基板７０と端子部８２を接合する際には、端子部８２は支持部材１００と比べて熱膨張の度合いが大きくなり、端子部８２は、熱膨張された状態で基板に対して固定された後に、収縮する。そのため、端子部８２の収縮に電子基板７０が追従できずに、端子部８２や電子基板７０などに応力が発生して、端子部８２の接合部が破損するおそれが懸念される。それに対し、本実施形態においては、電子基板７０が支持部材１００に対して固定されていない状態で、電子基板７０と端子部８２とを接合するため、端子部８２の収縮に電子基板７０を追従させることが可能となり、端子部８２の接合部が破損するおそれを抑制できる。一方、電子基板７０が支持部材１００に対して固定しない場合には、電子部品１の使用時に、電子基板７０が振動して、端子部８２の接合部が破損するおそれもある。それに対し、本実施形態においては、電子基板７０と端子部８２とを接合した後に、電子基板７０を支持部材１００に固定する。従って、電子部品１の使用時における電子基板７０の振動も抑制され、端子部８２の接合部が破損するおそれを適切に抑制できる。 When the electronic substrate 70 and the terminal portion 82 are joined in this way, the terminal portion 82 has a greater degree of thermal expansion than the support member 100, and the terminal portion 82 is in a thermally expanded state relative to the substrate. After being fixed, it shrinks. Therefore, the electronic substrate 70 cannot follow the contraction of the terminal portion 82, and stress is generated in the terminal portion 82, the electronic substrate 70, and the like, and there is concern that the joint portion of the terminal portion 82 may be damaged. In contrast, in the present embodiment, the electronic substrate 70 and the terminal portion 82 are joined together in a state in which the electronic substrate 70 is not fixed to the support member 100 , so the electronic substrate 70 follows the contraction of the terminal portion 82 . Therefore, it is possible to suppress the possibility that the joint portion of the terminal portion 82 is damaged. On the other hand, if the electronic substrate 70 is not fixed to the support member 100, the electronic substrate 70 may vibrate when the electronic component 1 is used, and the joints of the terminal portions 82 may be damaged. In contrast, in the present embodiment, the electronic substrate 70 is fixed to the support member 100 after the electronic substrate 70 and the terminal portion 82 are joined together. Therefore, the vibration of the electronic substrate 70 during use of the electronic component 1 is also suppressed, and the risk of damage to the joints of the terminal portions 82 can be appropriately suppressed.
　電子基板７０には、接続穴ＣＨ１が形成されており、本実施形態の製造方法は、接続穴ＣＨ１に端子部８２を挿入するステップをさらに含む。電子基板７０と端子部８２とを接合するステップにおいては、電子基板７０が支持部材１００に対して固定されていない状態で、接続穴ＣＨ１に挿入された端子部８２と電子基板７０とを接合する。本実施形態においては、電子基板７０が支持部材１００に対して固定されていない状態で、接続穴ＣＨ１に挿入された端子部８２と電子基板７０とを接合するため、端子部８２と電子基板７０とを適切に接続しつつ、端子部８２の接合部が破損するおそれを抑制できる。 A connection hole CH1 is formed in the electronic substrate 70, and the manufacturing method of the present embodiment further includes a step of inserting the terminal portion 82 into the connection hole CH1. In the step of joining the electronic substrate 70 and the terminal portion 82, the terminal portion 82 inserted into the connection hole CH1 and the electronic substrate 70 are joined in a state in which the electronic substrate 70 is not fixed to the support member 100. . In the present embodiment, since the terminal portion 82 inserted into the connection hole CH1 and the electronic substrate 70 are joined together in a state in which the electronic substrate 70 is not fixed to the support member 100, the terminal portion 82 and the electronic substrate 70 It is possible to suppress the possibility that the joint portion of the terminal portion 82 is damaged while properly connecting the .
　支持部材１００には、一方の表面１００Ａから他方の表面１００Ｂまで貫通する開口部１０５が形成されており、端子部８２を挿入するステップにおいては、支持部材１００の他方の表面１００Ｂ側から、開口部１０５を通して、接続穴ＣＨ１に端子部８２を挿入する。本実施形態においては、開口部１０５を通して端子部８２を挿入するため、コンパクトな構成としつつ、端子部８２の接合部が破損するおそれを抑制できる。 The support member 100 has an opening 105 penetrating from the one surface 100A to the other surface 100B. 105, the terminal portion 82 is inserted into the connection hole CH1. In the present embodiment, since the terminal portion 82 is inserted through the opening 105, the joint portion of the terminal portion 82 can be prevented from being damaged while maintaining a compact configuration.
　接着剤Ａで固定するステップは、塗布ステップと、カバー部材取り付けステップと、固定ステップとを含む。塗布ステップにおいては、電子基板７０と支持部材１００とが接着剤Ａと接するように、電子基板７０と支持部材１００との少なくとも一方に接着剤Ａを塗布する。カバー部材取り付けステップにおいては、電子基板７０と支持部材１００とが接着剤Ａと接した状態で、支持部材１００の一方の表面１００Ａ側から電子基板７０を覆うように、カバー部材１１０を接着剤Ａと接するように取り付ける。固定ステップにおいては、接着剤Ａを硬化させることで、カバー部材１１０と電子基板７０と支持部材１００とを固定する。本製造方法においては、カバー部材１１０で電子基板７０を覆いつつ、カバー部材１１０と電子基板７０と支持部材１００とを固定するため、電子基板７０に水や異物などが付着することを抑制しつつ、端子部８２の接合部が破損するおそれを抑制できる。 The step of fixing with the adhesive A includes an application step, a cover member mounting step, and a fixing step. In the application step, the adhesive A is applied to at least one of the electronic substrate 70 and the support member 100 so that the electronic substrate 70 and the support member 100 are in contact with the adhesive A. FIG. In the cover member attaching step, the cover member 110 is applied with the adhesive A so as to cover the electronic substrate 70 from one surface 100A of the support member 100 while the electronic substrate 70 and the support member 100 are in contact with the adhesive A. so that it touches the In the fixing step, by curing the adhesive A, the cover member 110, the electronic substrate 70, and the support member 100 are fixed. In this manufacturing method, since the cover member 110, the electronic substrate 70, and the support member 100 are fixed while covering the electronic substrate 70 with the cover member 110, adhesion of water, foreign matter, etc. to the electronic substrate 70 is suppressed. , it is possible to suppress the possibility that the joint portion of the terminal portion 82 is damaged.
　電子基板７０には、一方の表面から他方の表面まで開口する孔部７４が形成されており、塗布ステップにおいては、孔部７４から、支持部材１００の孔部７４と重なる第１接着領域１０８に接着剤Ａを塗布する。また、カバー部材取り付けステップにおいては、カバー部材１１０の電子基板７０側の表面１１０Ａに形成される第２接着領域１２０を、第１接着領域１０８と重なる位置に配置することで、第１接着領域１０８に塗布された接着剤Ａが、第２接着領域１２０に接する。これにより、カバー部材１１０と電子基板７０と支持部材１００とを１つの箇所で固定することが可能となり、端子部８２の接合部が破損するおそれを適切に抑制できる。 The electronic substrate 70 is formed with a hole 74 that opens from one surface to the other surface. Apply adhesive A. In addition, in the cover member attaching step, the second adhesion region 120 formed on the surface 110A of the cover member 110 on the side of the electronic substrate 70 is arranged at a position overlapping the first adhesion region 108 so that the first adhesion region 108 The adhesive A applied to contacts the second adhesive region 120 . As a result, the cover member 110, the electronic substrate 70, and the support member 100 can be fixed at one point, and the risk of damage to the joints of the terminal portions 82 can be appropriately suppressed.
　第１接着領域１０８は、支持部材１００の一方の表面１００Ａから突出する凸部であり、第２接着領域１２０は、カバー部材１１０の電子基板７０側の表面１１０Ａから突出する凸部である。第１接着領域１０８、第２接着領域１２０を凸部とすることで、カバー部材１１０と電子基板７０と支持部材１００とを適切に固定でき、端子部８２の接合部が破損するおそれを適切に抑制できる。 The first adhesion area 108 is a projection projecting from one surface 100A of the support member 100, and the second adhesion area 120 is a projection projecting from the surface 110A of the cover member 110 on the electronic board 70 side. By forming the first adhesive region 108 and the second adhesive region 120 as convex portions, the cover member 110, the electronic substrate 70, and the support member 100 can be properly fixed, and the risk of damage to the joints of the terminal portions 82 can be appropriately prevented. can be suppressed.
　塗布ステップにおいては、電子基板７０のカバー部材１１０側の表面であって、端子部（ここでは接続部材９０の電流接続部９２及び信号接続部９４）の近傍（基板接着領域７６）にも接着剤Ａを塗布し、カバー部材取り付けステップにおいては、基板接着領域７６に塗布された接着剤Ａが、カバー部材１１０の第２接着領域１２０とは異なる位置（第３接着領域１２６）に接する。電子基板７０とカバー部材１１０とを、端子部の近傍でも接着させることで、カバー部材１１０と電子基板７０とを適切に固定して、端子部８２の接合部が破損するおそれを適切に抑制できる。 In the application step, the adhesive is also applied to the vicinity of the terminal portion (here, the current connection portion 92 and the signal connection portion 94 of the connection member 90) (substrate adhesion region 76) on the surface of the electronic substrate 70 on the side of the cover member 110. In the step of applying A and attaching the cover member, the adhesive A applied to the substrate bonding region 76 comes into contact with a position (third bonding region 126 ) of the cover member 110 different from the second bonding region 120 . By bonding the electronic substrate 70 and the cover member 110 also in the vicinity of the terminal portion, the cover member 110 and the electronic substrate 70 can be appropriately fixed, and the risk of damage to the joint portion of the terminal portion 82 can be appropriately suppressed. .
　本製造方法は、電子基板７０が支持部材１００に対して固定されていない状態で、電子基板７０とは別の基板である制御基板６２に接続される接続部材９０を、電子基板７０に接合するステップをさらに含む。本製造方法によると、接続部材９０を接合する場合にも、応力の発生を抑制して、端子部８２の接合部が破損するおそれを適切に抑制できる。 In this manufacturing method, the connection member 90 connected to the control board 62, which is a board different from the electronic board 70, is joined to the electronic board 70 while the electronic board 70 is not fixed to the support member 100. Further including steps. According to this manufacturing method, even when the connection member 90 is joined, the occurrence of stress can be suppressed, and the risk of damage to the joint portion of the terminal portion 82 can be appropriately suppressed.
　本実施形態に係る電子部品１は、支持部材１００と、支持部材１００の一方の表面上に設けられ、一方の表面から他方の表面まで開口する孔部７４が形成された電子基板７０と、電子基板７０に接合される端子部８２と、電子基板７０を覆うように支持部材１００の一方の表面１００Ａに取り付けられるカバー部材１１０と、を有し、支持部材１００と電子基板７０とカバー部材１１０とが、孔部７４の上側と内側と下側にわたって設けられた接着剤（接着層Ａａ）を介して固定されている。本実施形態に係る電子部品１は、支持部材１００と電子基板７０とカバー部材１１０とが接着層Ａａを介して固定されているため、使用時における電子基板７０の振動が抑制され、端子部８２の接合部が破損するおそれを適切に抑制できる。 The electronic component 1 according to the present embodiment includes a support member 100, an electronic substrate 70 provided on one surface of the support member 100 and having a hole 74 opening from one surface to the other surface, an electronic It has a terminal portion 82 joined to the substrate 70, and a cover member 110 attached to one surface 100A of the support member 100 so as to cover the electronic substrate 70. The support member 100, the electronic substrate 70, and the cover member 110 are fixed via an adhesive (adhesive layer Aa) provided over the upper, inner and lower sides of the hole 74 . In the electronic component 1 according to the present embodiment, the support member 100, the electronic substrate 70, and the cover member 110 are fixed via the adhesive layer Aa. It is possible to appropriately suppress the risk of damage to the joints.
　以上、本発明の実施形態及び実施例を説明したが、これら実施形態等の内容により実施形態が限定されるものではない。また、前述した構成要素には、当業者が容易に想定できるもの、実質的に同一のもの、いわゆる均等の範囲のものが含まれる。さらに、前述した構成要素は適宜組み合わせることが可能である。さらに、前述した実施形態等の要旨を逸脱しない範囲で構成要素の種々の省略、置換又は変更を行うことができる。 Although the embodiments and examples of the present invention have been described above, the embodiments are not limited by the contents of these embodiments. In addition, the components described above include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within the so-called equivalent range. Furthermore, the components described above can be combined as appropriate. Further, various omissions, replacements, or modifications of components can be made without departing from the scope of the above-described embodiments.
　１　電子部品
　１０　ケーシング
　１６　モータ
　３２　駆動軸
　６２　制御基板
　７０　電子基板
　７４　孔部
　８２　端子部
　９０　接続部材
　１００　支持部材
　１０８　第１接着領域
　１２０　第２接着領域
　Ａ　接着剤
　Ａａ　接着層 1 Electronic Component 10 Casing 16 Motor 32 Drive Shaft 62 Control Board 70 Electronic Board 74 Hole 82 Terminal Part 90 Connection Member 100 Supporting Member 108 First Adhesive Area 120 Second Adhesive Area A Adhesive Aa Adhesive Layer

Claims (5)

  1. 　支持部材の一方の表面に電子基板を配置するステップと、
    　前記電子基板が前記支持部材に対して固定されていない状態で、前記電子基板と端子部とを接合するステップと、
    　前記端子部が接合された電子基板と前記支持部材とを、接着剤で固定するステップと、
    　を含む、電子部品の製造方法。     placing an electronic substrate on one surface of the support member;
    joining the electronic substrate and the terminal portion in a state where the electronic substrate is not fixed to the support member;
    a step of fixing the electronic substrate to which the terminal portion is joined and the supporting member with an adhesive;
    A method of manufacturing an electronic component, comprising:
  2. 　前記接着剤で固定するステップは、
    　前記電子基板と前記支持部材が前記接着剤と接するように、前記電子基板と前記支持部材との少なくとも一方に接着剤を塗布する塗布ステップと、
    　前記電子基板と前記支持部材とが接着剤と接した状態で、前記支持部材の一方の表面側から前記電子基板を覆うように、カバー部材を前記接着剤と接するように取り付けるカバー部材取り付けステップと、
    　前記接着剤を硬化させることで、前記カバー部材と前記電子基板と前記支持部材とを固定する固定ステップと、
    　をさらに含み、
    　前記電子基板には、一方の表面から他方の表面まで開口する孔部が形成されており、
    　前記塗布ステップにおいては、前記孔部から、前記支持部材の開口部と重なる第１接着領域に前記接着剤を塗布し、
    　前記カバー部材取り付けステップにおいては、前記カバー部材の前記電子基板側の表面に形成される第２接着領域を、前記第１接着領域と重なる位置に配置することで、前記第１接着領域に塗布された接着剤が、前記第２接着領域に接する、請求項１に記載の電子部品の製造方法。     The adhesive fixing step includes:
    an applying step of applying an adhesive to at least one of the electronic substrate and the supporting member so that the electronic substrate and the supporting member are in contact with the adhesive;
    a cover member attaching step of attaching a cover member so as to be in contact with the adhesive so as to cover the electronic substrate from one surface side of the support member while the electronic substrate and the support member are in contact with the adhesive; ,
    a fixing step of fixing the cover member, the electronic substrate, and the support member by curing the adhesive;
    further comprising
    The electronic substrate has a hole opening from one surface to the other surface,
    In the applying step, the adhesive is applied from the hole to a first adhesive region that overlaps the opening of the support member,
    In the cover member attaching step, the second adhesive region formed on the electronic substrate side surface of the cover member is arranged at a position overlapping the first adhesive region, so that the adhesive is applied to the first adhesive region. 2. The method of manufacturing an electronic component according to claim 1, wherein the adhesive is in contact with the second adhesive region.
  3. 　前記第２接着領域は、前記カバー部材の前記電子基板側の表面から突出する凸部である、請求項２に記載の電子部品の製造方法。 3. The method of manufacturing an electronic component according to claim 2, wherein the second adhesive region is a convex portion protruding from the surface of the cover member on the electronic substrate side.
  4. 　前記塗布ステップにおいては、前記電子基板の前記カバー部材側の表面であって、前記端子部の近傍にも接着剤を塗布し、
    　前記カバー部材取り付けステップにおいては、前記端子部の近傍に塗布された接着剤が、前記カバー部材の前記第２接着領域とは異なる位置に接する、請求項２に記載の電子部品の製造方法。     In the applying step, the adhesive is applied to the surface of the electronic substrate on the cover member side and also in the vicinity of the terminal portion,
    3. The method of manufacturing an electronic component according to claim 2, wherein, in said cover member attaching step, the adhesive applied near said terminal contacts a position of said cover member different from said second adhesive region.
  5. 　支持部材と、
    　前記支持部材の一方の表面上に設けられ、一方の表面から他方の表面まで開口する孔部が形成された電子基板と、
    　前記電子基板に接合される端子部と、
    　前記電子基板を覆うように前記支持部材の一方の表面に取り付けられるカバー部材と、
    　を有し、
    　前記支持部材と前記電子基板と前記カバー部材とが、前記孔部の上側と内側と下側にわたって設けられた接着剤を介して固定されている、
    　電子部品。     a support member;
    an electronic substrate provided on one surface of the support member and having a hole opening from one surface to the other surface;
    a terminal portion joined to the electronic substrate;
    a cover member attached to one surface of the support member so as to cover the electronic substrate;
    has
    The support member, the electronic substrate, and the cover member are fixed via an adhesive provided over the upper side, the inner side, and the lower side of the hole,
    electronic components.
PCT/JP2022/019427 2021-07-05 2022-04-28 Method for manufacturing electronic component and electronic component WO2023281908A1 (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61138387U (en) * 1985-02-15 1986-08-27
JP2008082812A (en) * 2006-09-27 2008-04-10 Denso Corp Sensor device and its manufacturing method
JP2010051062A (en) * 2008-08-19 2010-03-04 Showa Corp Motor control circuit case of electric power steering device
JP2010223777A (en) * 2009-03-24 2010-10-07 Yamatake Corp Sensor device
JP2010230329A (en) * 2009-03-25 2010-10-14 Panasonic Electric Works Co Ltd Substrate fixing structure and physical quantity sensor
JP2015028513A (en) * 2013-07-30 2015-02-12 日本オクラロ株式会社 Optical module
JP2016164900A (en) * 2015-03-06 2016-09-08 日立オートモティブシステムズ株式会社 Electronic circuit device
JP2017174893A (en) * 2016-03-22 2017-09-28 東芝メモリ株式会社 USB device and manufacturing method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61138387U (en) * 1985-02-15 1986-08-27
JP2008082812A (en) * 2006-09-27 2008-04-10 Denso Corp Sensor device and its manufacturing method
JP2010051062A (en) * 2008-08-19 2010-03-04 Showa Corp Motor control circuit case of electric power steering device
JP2010223777A (en) * 2009-03-24 2010-10-07 Yamatake Corp Sensor device
JP2010230329A (en) * 2009-03-25 2010-10-14 Panasonic Electric Works Co Ltd Substrate fixing structure and physical quantity sensor
JP2015028513A (en) * 2013-07-30 2015-02-12 日本オクラロ株式会社 Optical module
JP2016164900A (en) * 2015-03-06 2016-09-08 日立オートモティブシステムズ株式会社 Electronic circuit device
JP2017174893A (en) * 2016-03-22 2017-09-28 東芝メモリ株式会社 USB device and manufacturing method thereof

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