WO2023281713A1 - エアロゾル生成装置の電源ユニット - Google Patents
エアロゾル生成装置の電源ユニット Download PDFInfo
- Publication number
- WO2023281713A1 WO2023281713A1 PCT/JP2021/025829 JP2021025829W WO2023281713A1 WO 2023281713 A1 WO2023281713 A1 WO 2023281713A1 JP 2021025829 W JP2021025829 W JP 2021025829W WO 2023281713 A1 WO2023281713 A1 WO 2023281713A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor
- power supply
- pin
- supply unit
- mcu
- Prior art date
Links
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- 229920000742 Cotton Polymers 0.000 description 1
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Images
Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
- A24F40/53—Monitoring, e.g. fault detection
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
- A24F40/57—Temperature control
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/90—Arrangements or methods specially adapted for charging batteries thereof
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0244—Heating of fluids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/06—Control, e.g. of temperature, of power
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B7/00—Heating by electric discharge
- H05B7/02—Details
- H05B7/06—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
Definitions
- the present invention relates to a power supply unit for an aerosol generator.
- Patent Literature 1 discloses a technique in which a plurality of capacitors are provided as smoothing capacitors on the output side of a first DC/DC converter that supplies power to a load.
- the present invention provides a power supply unit for an aerosol generator that can avoid increasing the size of the circuit board while mounting a plurality of capacitors connected to the output terminals of the voltage converter on the circuit board.
- the present invention a power supply; a connector connected to a load that consumes power supplied from the power supply and generates aerosol from an aerosol source, or a coil that transmits power to the load by electromagnetic induction; a voltage converter including an input terminal connected to the power supply and an output terminal connected to the connector; a first capacitor and a second capacitor connected between the output terminal of the voltage converter and the connector; a circuit board on which the voltage converter, the first capacitor, and the second capacitor are mounted; with wherein the first capacitor and the second capacitor are not aligned in the length direction or width direction of the circuit board; This is the power supply unit for the aerosol generator.
- a power supply unit for an aerosol generator that can avoid an increase in the size of the circuit board while mounting a plurality of capacitors connected to the output terminals of the voltage converter on the circuit board.
- FIG. 1 is a perspective view of an aerosol inhaler 1;
- FIG. 2 is another perspective view of the aerosol inhaler 1.
- FIG. 1 is a cross-sectional view of an aerosol inhaler 1;
- FIG. 2 is a perspective view of the power supply unit 10;
- FIG. 2 is an exploded perspective view of the power supply unit 10;
- FIG. 2 is a diagram showing a circuit configuration of the power supply unit 10;
- FIG. 2 is a perspective view of the power supply unit 10 with the case 11 removed;
- FIG. 7 is a diagram showing a main surface side surface layer 71a of the MCU-mounted substrate 7;
- FIG. 7 is a diagram showing a second wiring layer 74a of the MCU mounting substrate 7;
- FIG. 7 is a diagram showing a sub-surface side surface layer 71b of the MCU-mounted substrate 7;
- FIG. 7 is a diagram showing a fourth wiring layer 74b of the MCU mounting substrate 7;
- FIG. 4 is a diagram showing a positional relationship between an MCU mounting substrate 7 and discharge terminals 41.
- FIG. 4 is a cross-sectional view of the MCU mounting board 7.
- FIG. 10 is an enlarged view showing the periphery of the X1-direction-side end portion of the main-surface-side wiring layer 74a of the MCU-mounted substrate 7 shown in FIG. 9;
- FIG. 15 is an enlarged view of the wiring pattern 77_Ln6a shown in FIG. 14;
- FIG. 15 is an enlarged view of the wiring pattern 77_Ln6b shown in FIG. 14;
- a power supply unit of an aerosol generator according to one embodiment of the present invention will be described below.
- an aerosol generator hereinafter referred to as an aerosol inhaler
- a power supply unit will be described with reference to FIGS. 1 to 3. while explaining.
- the aerosol inhaler 1 is a device for inhaling flavored aerosol without burning, and has a rod shape extending along a predetermined direction (hereinafter referred to as the X direction). As shown in FIGS. 1 and 2, the aerosol inhaler 1 includes a power supply unit 10, a first cartridge 20, and a second cartridge 30 arranged in this order along the X direction.
- the first cartridge 20 may be detachable from the power supply unit 10
- the second cartridge 30 is detachable from the first cartridge 20 .
- the first cartridge 20 and the second cartridge 30 are replaceable with respect to the power supply unit 10 .
- the second cartridge 30 is also replaceable with respect to the first cartridge 20 .
- the first cartridge 20 may be fitted and fixed to the power supply unit 10 so that the user cannot easily attach or detach it.
- the power supply unit 10 of this embodiment includes a battery pack BP, an MCU (Micro Controller Unit) 50, an MCU mounting board 7, and a receptacle mounted inside a cylindrical case 11. It is constructed by accommodating the substrate 8 and the like.
- the power supply BAT housed in the battery pack BP is a rechargeable secondary battery, an electric double layer capacitor, etc., preferably a lithium ion secondary battery.
- the electrolyte of the power supply BAT may be composed of one or a combination of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid.
- a discharge terminal 41 is provided on the top portion 11a located on one end side (first cartridge 20 side) of the case 11 in the X direction.
- the discharge terminal 41 is composed of a positive discharge terminal 41a and a negative discharge terminal 41b.
- the "positive electrode side” means a higher potential side than the "negative electrode side”.
- the "negative side” means a lower potential side than the "positive side”. Therefore, the term “positive electrode side” and the term “negative electrode side” in the following description may be read as “high potential side” and “low potential side”, respectively.
- the positive discharge terminal 41a and the negative discharge terminal 41b are provided so as to protrude from the top portion 11a toward the first cartridge 20, and are configured to be electrically connectable to the heater 21 of the first cartridge 20. Further, in the case 11, a low floor portion 11b is provided around the top portion 11a.
- a charging opening 43 (see FIG. 2) that allows access to the charging terminal 42 is provided in the peripheral wall portion of the bottom portion 11c located on the other end side of the case 11 in the X direction (the side opposite to the first cartridge 20). be provided.
- the charging terminal 42 is electrically connected to an external power source such as an outlet or mobile battery to receive power supply, and in this embodiment, it is a USB (Universal Serial Bus) Type-C receptacle. It is not limited.
- the charging opening 43 may be provided on the bottom surface on the side of the bottom portion 11c instead of on the peripheral wall portion on the side of the bottom portion 11c.
- the charging terminal 42 may include, for example, a power receiving coil and be configured to be able to receive power transmitted from an external power source in a non-contact manner.
- the wireless power transfer method in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type.
- the charging terminal 42 may be connectable to various USB terminals or the like, and may have the power receiving coil described above. With such a configuration, the chances of charging the power supply BAT can be increased.
- an operation unit 14 that can be operated by the user is provided on the peripheral wall portion of the top portion 11a so as to face the side opposite to the charging opening 43.
- the operation unit 14 is composed of button-type switches, and is used to activate/deactivate the MCU 50 and various sensors reflecting the user's usage intention.
- the operation unit 14 may be configured by a touch panel or the like.
- the aerosol inhaler 1 is provided with a notification unit that notifies various information.
- the notification unit may be configured by a light emitting element, may be configured by a vibration element, or may be configured by a sound output element. Also, the notification unit may be a combination of two or more elements among the light emitting element, the vibration element, and the sound output element.
- the notification unit may be provided in any of the power supply unit 10, the first cartridge 20, and the second cartridge 30, but is preferably provided in the power supply unit 10 in order to shorten the lead wire (that is, the wiring distance) from the power supply BAT. preferable.
- the notification unit of the present embodiment includes an LED window 13 provided around the operation unit 14, and LED_L1 and LED_L2 (see FIGS. 6 and 8), which will be described later.
- the internal configuration of the power supply unit 10 will be described later.
- the first cartridge 20 has a reservoir 23 that stores the aerosol source 22 inside a cylindrical cartridge case 27, and atomizes and/or vaporizes the aerosol source 22 (hereinafter simply referred to as atomization). ), a wick 24 that draws the aerosol source from the reservoir 23 to the heater 21, an aerosol flow path 25 through which the aerosol generated by the atomization of the aerosol source 22 flows toward the second cartridge 30, a second and an end cap 26 that houses a portion of the cartridge 30 .
- the reservoir 23 is partitioned so as to surround the aerosol flow path 25 and stores the aerosol source 22 .
- the reservoir 23 may contain a porous material such as a resin web or cotton, and the porous material may be impregnated with the aerosol source 22 .
- the reservoir 23 may store only the aerosol source 22 without accommodating the resin web or the cotton-like porous body.
- Aerosol source 22 includes liquids such as glycerin, propylene glycol, and water. The storage amount of the aerosol source 22 in the reservoir 23 can be visually confirmed through a remaining amount confirmation window 28 (see FIGS. 1 and 2) provided in the first cartridge 20 .
- a gap (not shown) serving as an air intake port is formed between the remaining amount confirmation window 28 and the cartridge case 27, and outside air is drawn into the cartridge case 27 through this gap.
- the air intake port does not necessarily have to be provided around the remaining amount confirmation window 28 .
- a gap may be formed between the operation portion 14 provided in the power supply unit and the LED window 13, and outside air may be taken into the case 11 through the gap, or the charging opening 43 may be used.
- a communication hole may be provided in the wall surface of the cartridge case 27 or the case 11 to communicate the inside and the outside.
- the wick 24 is a liquid holding member that draws the aerosol source 22 from the reservoir 23 into the heater 21 by using capillary action, and is made of, for example, glass fiber or porous ceramic.
- the heater 21 atomizes the aerosol source 22 without combustion by power supplied from the power supply BAT via the discharge terminal 41 .
- the heater 21 is composed of a heating wire (coil) wound at a predetermined pitch.
- the heater 21 is an example of a load that can generate aerosol by atomizing the aerosol source 22, and the load is, for example, a heating element or an ultrasonic generator. Heating elements include heating resistors, ceramic heaters, induction heaters, and the like.
- the aerosol flow path 25 is provided downstream of the heater 21 and on the center line L of the power supply unit 10 (case 11).
- the center line L is a line that continuously connects the center points of the power supply unit 10 (case 11) in the X direction when the power supply unit 10 (case 11) is cut along a plane perpendicular to the X direction.
- the end cap 26 includes a cartridge accommodating portion 26a that accommodates a portion of the second cartridge 30, and a communicating passage 26b that communicates the aerosol flow path 25 and the cartridge accommodating portion 26a.
- the second cartridge 30 stores the flavor source 31 .
- the second cartridge 30 is detachably housed in a cartridge housing portion 26 a provided in the end cap 26 of the first cartridge 20 .
- the second cartridge 30 has a user's mouthpiece 32 at the end opposite to the first cartridge 20 side.
- the suction port 32 is not limited to being configured integrally with the second cartridge 30 , and may be configured to be detachable from the second cartridge 30 .
- the second cartridge 30 passes the aerosol generated by atomizing the aerosol source 22 by the heater 21 through the flavor source 31 to add flavor to the aerosol.
- the raw material piece constituting the flavor source 31 cut tobacco or a molded body obtained by molding tobacco raw material into granules can be used.
- the flavor source 31 may be composed of plants other than tobacco (for example, mint, Chinese medicine, herbs, etc.).
- the flavor source 31 may be provided with a flavor such as menthol.
- the aerosol with added flavor can be generated by the aerosol source 22, the flavor source 31, and the heater 21. That is, the aerosol source 22 and the flavor source 31 can be said to be aerosol generating sources that generate aerosol.
- the configuration of the aerosol generation source used in the aerosol inhaler 1 includes a configuration in which the aerosol source 22 and the flavor source 31 are separated, and a configuration in which the aerosol source 22 and the flavor source 31 are integrally formed. , a configuration in which the flavor source 31 is omitted and a substance that can be contained in the flavor source 31 is added to the aerosol source 22, or a configuration in which a drug or the like is added to the aerosol source 22 instead of the flavor source 31.
- the heater 21 atomizes the aerosol source 22 drawn or displaced from the reservoir 23 by the wick 24 .
- the aerosol generated by atomization flows through the aerosol flow path 25 together with the air that has flowed in from a gap (not shown) that serves as an air intake port formed between the remaining amount confirmation window 28 and the cartridge case 27, and flows through the communication path. 26b to the second cartridge 30.
- the aerosol supplied to the second cartridge 30 is flavored by passing through the flavor source 31 and supplied to the mouthpiece 32 .
- the receptacle mounting board 8 includes, as main electronic components, a charging terminal 42 which is a receptacle into which a USB Type-C plug (hereinafter simply referred to as a USB plug) can be inserted, the receptacle mounting board 8, and the MCU mounting board 7.
- the board connection cable Cb1 is an FPC (Flexible Printed Circuit) cable having six printed patterns, but it is not limited to this.
- the battery connection cable Cb2 may be connected with three wires.
- the electronic parts shown within the range surrounded by the two-dot chain line are the electronic parts mounted on the MCU mounting board 7 .
- the MCU-mounted board 7 includes, as main electronic components, an MCU-mounted board-side connector Cn2 to which the other end of the board connection cable Cb1 is connected, an MCU 50 that controls the entire aerosol inhaler 1 including the power supply unit 10, A charging IC (Integrated Circuit) 55 that charges the power supply BAT, etc., a protection IC 61 that protects the charging IC 55, an LDO (Low Dropout) regulator 62 that supplies a predetermined voltage to the MCU 50, etc., and a user's puff (suction).
- Integrated Circuit Integrated Circuit
- LDO Low Dropout
- a suction sensor 15 for detecting operation a discharge terminal 41 (41a, 41b) to which a heater 21 is connected, a DC/DC converter 63 capable of supplying power to the discharge terminal 41, a battery pack BP and an MCU. and a battery connector Cn3 to which a battery connection cable Cb2 connecting with the board 7 is connected.
- the MCU 50, the charging IC 55, the protection IC 61, the LDO regulator 62, the suction sensor 15, and the DC/DC converter 63 are configured by, for example, chipping a plurality of circuit elements, and electrically connect the inside and outside of the device.
- a pin is provided as a terminal for The details of the pins included in each of these chipped electronic components will be described later. It should be noted that, in this specification and the like, only major pins among the pins included in each of these chipped electronic components are described.
- the battery pack BP includes a power supply BAT, a fuse FS connected to the positive terminal of the power supply BAT, and a thermistor TH connected to the negative terminal of the power supply BAT and arranged close to the power supply BAT.
- the thermistor TH is mainly an element having NTC (Negative Temperature Coefficient) characteristics or PTC (Positive Temperature Coefficient) characteristics, that is, an element that has a correlation between electrical resistance and temperature.
- the battery connection cable Cb2 that connects the battery pack BP and the MCU mounting board 7 is an FPC cable having three printed patterns, but it is not limited to this.
- the battery connection cable Cb2 may be connected with three wires.
- the wiring indicated by the thick solid line is the wiring connected to the ground provided in the power supply unit 10 (for example, the wiring configured by the ground pattern 78 described later).
- this wiring has the same potential as the reference potential (ground potential) in the power supply unit 10, and is hereinafter also referred to as a ground line.
- main wirings other than the ground line include a VBUS line Ln1, a VBAT line Ln2, a D+ line Ln3a, a D ⁇ line Ln3b, a power-path line Ln4, and a VSYS line Ln4.
- a line Ln5 and a VHEAT line Ln6 are provided.
- Each of these lines (wiring) is mainly composed of a conductive pattern formed on the MCU mounting board 7 . Electronic components connected to these lines will be described later.
- a board connection cable Cb1 a receptacle mounting board-side connector Cn1, and an MCU mounting board-side connector Cn2, which are electronic components that connect the receptacle mounting board 8 and the MCU mounting board 7, are combined to form a board connection. Also referred to as part CN.
- the charging terminals 42 are the A1 pin, A4 pin, A5 pin, A6 pin, A7 pin, A8 pin, A9 pin, A12 pin, B1 pin, B4 pin, B5 pin, B6 pin, B7 pin, It has pins (terminals) connected to the B8 pin, B9 pin, and B12 pin, respectively.
- the pin of the charging terminal 42 corresponding to the Bn pin of the USB plug is also called the Bn pin of the charging terminal 42 .
- the A1 pin, A12 pin, B1 pin, and B12 pin of the charging terminal 42 corresponding to the GND (ground) pin of the USB plug are connected to the ground line.
- the A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42 corresponding to the V BUS pin of the USB plug are connected to the high potential side of the charging IC 55 via the board connection portion CN, the VBUS line Ln1, and the protection IC 61. It is connected to the VBUS pin, which is a power supply terminal.
- power for example, USB bus power
- the charging IC 55 used can charge the power supply BAT and supply power to the MCU 50 .
- the protection IC 61 provided between the charging terminal 42 and the charging IC 55 is detailed. , an OUT pin that is an output terminal for outputting a first system voltage Vs1 to be described later, a CE pin for turning on and off the operation of the protection IC 61 (hereinafter also referred to as on/off), and a power supply BAT. and a VBAT pin for sensing the state.
- the A4 pin and B9 pin of the charging terminal 42 and the A9 pin and B4 pin are connected in parallel to the IN pin of the protection IC 61 via the board connection portion CN and the VBUS line Ln1.
- the IN pin of the protection IC 61 is connected to the A4 pin and B9 pin of the charging terminal 42 and the A9 pin and B4 pin, respectively.
- the VSS pin, GND pin and CE pin of the protection IC 61 are connected to the ground line.
- the OUT pin of protection IC 61 is connected to the VBUS pin of charging IC 55 .
- the VBAT pin of the protection IC 61 is connected to the positive terminal (that is, high potential side) of the power supply BAT via the VBAT line Ln2, battery connector Cn3, battery connection cable Cb2, and fuse FS.
- the negative terminal (that is, the low potential side) of the power supply BAT is connected to the ground line via the battery connection cable Cb2 and the battery connector Cn3.
- the protection IC 61 is supplied with a power supply voltage based on the difference between the potential of the IN pin and the potential of the VSS pin, and operates when the input to the CE pin is at a low level to apply a predetermined first system voltage Vs1 to the OUT pin. and detects whether the power supply BAT is connected based on the input voltage to the VBAT pin.
- the charging IC 61 in the present embodiment is enabled by inputting a low level to the CE pin, and therefore performs negative logic operation.
- a positive logic protection IC 61 that is enabled by inputting a high level to the CE pin may be used.
- the CE pin is preferably connected to the IN pin so that a high level is input to the CE pin.
- pins A4, A9, B4 and B9 of the charging terminal 42 are connected. is supplied with a predetermined USB voltage (for example, 5 [V]) from an external power supply. As a result, this USB voltage is supplied to the protection IC 61 as a power supply voltage. Also, since the CE pin of the protection IC 61 is grounded, the input voltage to this CE pin is always low level. Therefore, the protection IC 61 outputs the first system voltage Vs1 to the charging IC 55 in response to the USB voltage being supplied from the external power supply via the charging terminal 42 .
- a predetermined USB voltage for example, 5 [V]
- the first system voltage Vs1 output by the protection IC 61 has a voltage value within the recommended input voltage range of the charging IC 55 (for example, the range of 4.35 to 6.4 [V]).
- the protection IC 61 uses the input voltage to the IN pin as the first system voltage Vs1 as it is. Output from the OUT pin.
- the protection IC 61 detects a predetermined voltage (for example, 5.5 ⁇ 0.2 [V]), and the converted voltage is output from the OUT pin as the first system voltage Vs1.
- the protection IC 61 opens a circuit (not shown) in the protection IC 61 that connects the IN pin and the OUT pin when a high voltage exceeding the maximum value of the recommended input voltage of the charging IC 55 is input to the IN pin.
- the high voltage input to the IN pin may be prevented from being output from the OUT pin.
- the protection IC 61 can detect whether or not the power supply BAT is connected based on the input voltage to the VBAT pin.
- the protection IC 61 may use the detection result of whether or not the power supply BAT is connected in its own device, or may output it to the outside of its own device (for example, the MCU 50 or the charging IC 55).
- the protection IC 61 may have various protection functions for protecting the electric circuit of the power supply unit 10, such as an overcurrent detection function and an overvoltage detection function, in addition to the function of protecting the charging IC 55 described above.
- a capacitor (also called a smoothing capacitor or a bypass capacitor) Cd1 for stabilizing (smoothing) the input to the IN pin of the protection IC 61 is connected to the VBUS line Ln1 as needed. connected as appropriate.
- a capacitor Cd2 is required between the OUT pin of the protection IC 61 and the VBUS pin of the charging IC 55 to stabilize the input to the VBUS pin of the charging IC 55 (that is, the first system voltage Vs1 output from the protection IC 61). are connected as appropriate.
- the A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42 connected to the IN pin of the protection IC 61 are also connected to the ground line via a varistor (Variable Resistor: non-linear resistance element) VR1.
- a varistor Variable Resistor: non-linear resistance element
- the A6 pin and B6 pin of the charging terminal 42 corresponding to the Dp (also called D+) 1 pin or Dp2 pin of the USB plug are connected to the PA11 pin of the MCU 50 via the board connection portion CN and the D+ line Ln3a. Also, the A7 pin and B7 pin of the charging terminal 42 corresponding to the Dn (also called D-) 1 pin or Dp2 pin of the USB plug are connected to the PA12 pin of the MCU 50 via the board connection portion CN and the D- line Ln3b. be done.
- the D+ line Ln3a and the D ⁇ line Ln3b are connected. It enables serial communication using two signal lines. Communication methods other than serial communication may be used for communication between the external device and the MCU 50 .
- the A6 pin and B6 pin of the charging terminal 42 connected to the PA11 pin of the MCU 50 are also connected to the ground line via the varistor VR2.
- the static electricity can be released to the ground line via the varistor VR2. Therefore, it is possible to protect the MCU 50 from static electricity generated at the A6 or B6 pin of the charging terminal 42 .
- a resistor R11 is provided between the A6 and B6 pins of the charging terminal 42 and the PA11 pin of the MCU 50, the large current input to the PA11 pin of the MCU 50 can be prevented by the resistor R11. can be suppressed by
- a resistor is an element having a predetermined electrical resistance value, which is composed of a resistive element, a transistor, or the like.
- the A7 pin and B7 pin of the charging terminal 42 connected to the PA12 pin of the MCU 50 are also connected to the ground line via the varistor VR3.
- the static electricity can be released to the ground line via the varistor VR3. Therefore, it is possible to protect the MCU 50 from static electricity generated at the A7 pin or the B7 pin of the charging terminal 42 .
- the power supply unit 10 there is no problem even if the MCU 50 does not recognize whether the USB plug is inserted into the charging terminal 42 in the upside-up direction or the upside-down direction. Therefore, the A5 pin and B5 pin of the charging terminal 42 corresponding to the CC1 pin or CC2 pin of the USB plug are connected to the ground line. Furthermore, the A8 pin and B8 pin of the charging terminal 42 corresponding to the SBU1 pin or SBU2 pin of the USB plug are not connected to the electric circuit of the power supply unit 10 . That is, since these pins of the charging terminal 42 are not used in the power supply unit 10, they can be omitted as appropriate. By doing so, it is possible to prevent the circuit configuration of the power supply unit 10 from becoming complicated.
- the charging IC 55 has a VBUS pin, which is one of power supply terminals on the high potential side, a GND pin, which is a power supply terminal on the low potential side, and a BAT_1 pin, which is an input/output terminal used for power transfer between the charging IC 55 and the power supply BAT. and a BAT_2 pin, a BAT_SNS pin as a detection terminal for detecting input to or output from the power supply BAT, and SYS_1, SYS_2, SW_1, and SW_2 as output terminals for outputting a second system voltage Vs2 described later. and a CE pin for turning on/off the operation of the charging IC 55 .
- the BAT_1 pin and the BAT_2 pin can also function as high-potential-side power supply terminals in the charging IC 55 .
- the VBUS pin of the charging IC 55 is connected to the OUT pin of the protection IC 61 as described above.
- the BAT_1 pin, BAT_2 pin, and BAT_SNS pin of the charging IC 55 are connected to the positive terminal of the power supply BAT via the VBAT line Ln2, battery connector Cn3, battery connection cable Cb2, and fuse FS.
- the SYS_1 pin, SYS_2 pin, SW_1 pin, and SW_2 pin of the charging IC 55 are connected via the power path line Ln4 to the IN pin, which is the power supply terminal on the high potential side of the LDO regulator 62, and the high potential side of the DC/DC converter 63. It is connected to the VIN pin which is a power supply terminal.
- the SW_1 pin and the SW_2 pin are connected to the power path line Ln4 via the reactor Rc1.
- the CE pin of the charging IC 55 is connected to the PB14 pin of the MCU 50 .
- the charging IC 55 is supplied with a power supply voltage based on the difference between the potential of the VBUS pin, BAT_1 pin, or BAT_2 pin and the potential of the GND pin, and operates when the input to the CE pin is at a high level. It performs charging, and supplies power discharged from the power supply BAT to the LDO regulator 62, the DC/DC converter 63, and the like.
- the charging IC 55 in this embodiment is enabled by inputting a high level to the CE pin, and therefore operates in positive logic.
- a negative logic charging IC 55 that is enabled by inputting a low level to the CE pin may be used.
- the charging IC 55 applies a voltage (for example, the first system voltage Vs1 ).
- the output voltage (terminal voltage) of the power supply BAT is input to the BAT_1 pin and the BAT_2 pin.
- the charging IC 55 applies the second system voltage Vs2 according to the input voltages to the BAT_1 pin and the BAT_2 pin from the SYS_1 pin, the SYS_2 pin, the SW_1 pin, and the SW_2 pin to the LDO regulator 62, DC/DC converter 63, etc.
- Output for The second system voltage Vs2 is, for example, the output voltage itself of the power supply BAT, and specifically can be a voltage of about 3 to 4 [V].
- the charging IC 55 further includes an SCL pin connected to the PB8 pin of the MCU50 and an SDA pin connected to the PB9 pin of the MCU50.
- I2C Inter-Integrated Circuit
- the charging IC 55 transmits, for example, battery information regarding the power supply BAT to the MCU 50 .
- the battery information is, for example, information indicating the charging state of the power supply BAT by the charging IC 55 (for example, charging or charging stopped), the remaining amount of the power supply BAT (SOC: State Of Charge), and the like.
- Communication between the charging IC 55 and the MCU 50 may employ a communication method other than the I2C communication.
- the charging IC 55 may further include an ISET pin, an ILIM pin, a TS pin, and the like. If the charging IC 55 has an ISET pin, the electric resistance value of the resistor connected between the ISET pin and the ground line can be used to set the current value output from the charging IC 55 to the power supply BAT. When the charging IC 55 has an ILIM pin, the current value output from the charging IC 55 to the LDO regulator 62, the DC/DC converter 63, etc. is determined by the electrical resistance value of the resistor connected between the ILIM pin and the ground line. can be set. If the charging IC 55 has a TS pin, the charging IC 55 can detect the electrical resistance value and temperature of the resistor connected to the TS pin based on the input voltage to this TS pin.
- a capacitor Cd3 for stabilizing the input to the BAT_SNS pin of the charging IC 55 is appropriately connected to the VBAT line Ln2 as required. Further, the power path line Ln4 is provided with a capacitor Cd4 for stabilizing the second system voltage Vs2 output from the charging IC 55, and a capacitor Cd5 for stabilizing the input to the IN pin of the LDO regulator 62. connected as appropriate.
- the power path line Ln4 to which the second system voltage Vs2 output from the charging IC 55 is supplied further includes a first LED circuit Cc1 for operating (for example, lighting) the LED_L1 and a second LED circuit Cc2 for operating the LED_L2. is connected.
- the first LED circuit Cc1 is configured by connecting in series an LED_L1 and a switch Sw1 that switches conduction and interruption of the first LED circuit Cc1.
- One end of the first LED circuit Cc1 is connected to the power path line Ln4, and the other end is connected to the ground line.
- the switch Sw1 of the first LED circuit Cc1 is turned on in response to an on command from the MCU50 and turned off in response to an off command from the MCU50.
- the switch Sw1 When the switch Sw1 is turned on, the first LED circuit Cc1 becomes conductive, the second system voltage Vs2 output from the charging IC 55 is supplied to the LED_L1, and the LED_L1 lights up.
- the switch Sw1 for example, a switch composed of a MOSFET can be adopted.
- the gate terminal of the MOSFET that constitutes the switch Sw1 is connected to the PA0 pin of the MCU 50, and the MCU 50 controls the output from the PA0 pin so that the gate terminal of the switch Sw1 is supplied with The gate voltage is changed to turn on or off the switch Sw1.
- the switch Sw1 is not limited to a MOSFET, and may be a switch that is turned on/off under the control of the MCU50.
- the second LED circuit Cc2 is configured by connecting in series LED_L2 and a switch Sw2 that switches conduction and interruption of the second LED circuit Cc2.
- One end of the second LED circuit Cc2 is connected to the power path line Ln4, and the other end is connected to the ground line.
- the switch Sw2 of the second LED circuit Cc2 is turned on in response to an on command from the MCU50 and turned off in response to an off command from the MCU50.
- the switch Sw2 is turned on, the second LED circuit Cc2 becomes conductive, the second system voltage Vs2 output from the charging IC 55 is supplied to the LED_L2, and the LED_L2 lights up.
- a switch composed of a MOSFET can be employed as the switch Sw2.
- the gate terminal of the MOSFET that constitutes the switch Sw2 is connected to the PB3 pin of the MCU 50, and the MCU 50 controls the output from the PB3 pin so that the voltage is applied to the gate terminal of the switch Sw2.
- the switch Sw2 is turned on or off.
- the switch Sw2 is not limited to a MOSFET, and may be a switch that is turned on/off under the control of the MCU50.
- the LDO regulator 62 has an IN pin that is a power supply terminal on the high potential side, a GND pin that is a power supply terminal on the low potential side, an OUT pin that is an output terminal for outputting a third system voltage Vs3 described later, and the operation of the LDO regulator 62. and an EN pin for turning on/off the .
- the IN pin of the LDO regulator 62 is connected to the SYS_1 pin, SYS_2 pin, etc. of the charging IC 55 via the power path line Ln4, as described above.
- the GND pin of LDO regulator 62 is connected to the ground line.
- the OUT pin of the LDO regulator 62 is connected to the VDD pin, which is the high-potential power terminal of the MCU 50, and the VDD pin, which is the high-potential power terminal of the suction sensor 15, via the VSYS line Ln5.
- the EN pin of LDO regulator 62 is connected to power path line Ln4.
- the LDO regulator 62 is supplied with a power supply voltage based on the difference between the potential of the IN pin and the potential of the GND pin, and operates when the input voltage to the EN pin is at a high level to generate a predetermined third system voltage Vs3. and output from the OUT pin.
- the LDO regulator 62 in this embodiment is a positive logic operation because it is enabled by inputting a high level to the EN pin.
- a positive logic LDO regulator 62 that is enabled by inputting a low level to the EN pin may be used.
- the EN pin is preferably connected to the ground line so that a low level is always input to the EN pin.
- the LDO regulator 62 in response to the charging IC 55 outputting the second system voltage Vs2, the LDO regulator 62 is supplied with the second system voltage Vs2 as the power supply voltage. Further, when the charging IC 55 outputs the second system voltage Vs2, the input voltage to the EN pin of the LDO regulator 62 becomes the second system voltage Vs2 (that is, high level). Therefore, when the charging IC 55 outputs the second system voltage Vs2, the LDO regulator 62 generates the third system voltage Vs3 and outputs the generated third system voltage Vs3 to the MCU 50, the suction sensor 15, and the like.
- the third system voltage Vs3 output by the LDO regulator 62 has a voltage value suitable for operating the MCU 50, the suction sensor 15, and the like.
- the third system voltage Vs3 is a voltage lower than the second system voltage Vs2, and can be set to 2.5 [V], for example.
- the VSYS line Ln5 to which the third system voltage Vs3 output from the LDO regulator 62 is supplied, further includes an operation switch circuit Cc3 for detecting the user's operation of the operation switch OPS, and an operation switch circuit Cc3 for detecting the temperature of the power supply BAT. is connected to the power supply temperature detection circuit Cc4.
- the operation switch circuit Cc3 is composed of a resistor R1, a resistor R2, a resistor R3, and an operation switch OPS.
- the resistor R1 has one end connected to the VSYS line Ln5 and the other end connected to one end of each of the resistors R2 and R3.
- the other end of the resistor R2 is connected to the PC4 pin of the MCU 50, and the other end of the resistor R3 is connected to one end of the operation switch OPS.
- the other end of the operation switch OPS is connected to the ground line.
- the PC4 pin of the MCU 50 receives a voltage obtained by stepping down the third system voltage Vs3 supplied to the VSYS line Ln5 by the resistors R1 and R2.
- the third system voltage Vs3 supplied to the VSYS line Ln5 is applied to the PC4 pin of the MCU 50 after being divided by the resistors R1 and R3.
- a voltage stepped down by R2 is input. Therefore, the MCU 50 can detect whether or not the operation switch OPS is operated by the user based on the input voltage to the PC4 pin.
- the power supply temperature detection circuit Cc4 is configured by connecting in series a thermistor TH, a resistor R4, and a switch Sw3 for switching conduction and interruption of the power supply temperature detection circuit Cc4.
- One end of the power supply temperature detection circuit Cc4 on the switch Sw3 side is connected to the VSYS line Ln5, and the other end of the power supply temperature detection circuit Cc4 on the thermistor TH side is connected to the ground line.
- the PC1 pin of the MCU 50 is connected to the connection point CP between the resistor R4 and the thermistor TH in the power supply temperature detection circuit Cc4.
- the switch Sw3 of the power supply temperature detection circuit Cc4 is turned on in response to an on command from the MCU50, and turned off in response to an off command from the MCU50.
- the power supply temperature detection circuit Cc4 becomes conductive, and the third system voltage Vs3 supplied to the VSYS line Ln5 is divided by the electrical resistance value of the resistor R4 and the electrical resistance value of the thermistor TH.
- a voltage is input to the PC1 pin of MCU 50 .
- the MCU 50 can detect the temperature of the thermistor TH (that is, the temperature of the power supply BAT) based on the input voltage to the PC1 pin when the switch Sw3 is turned on.
- the switch Sw3 may employ, for example, a switch configured by a MOSFET.
- the gate terminal of the MOSFET that constitutes the switch Sw3 is connected to the PA8 pin of the MCU 50, and the MCU 50 controls the output from the PA8 pin so that the gate terminal of the switch Sw3 is supplied with By changing the gate voltage, the switch Sw3 is turned on or off.
- the switch Sw3 is not limited to a MOSFET, and may be any switch that is turned on/off under the control of the MCU50.
- the DC/DC converter 63 has a VIN pin that is a power supply terminal on the high potential side, a GND pin that is a power supply terminal on the low potential side, a SW pin to which a voltage is input, and an output terminal for outputting a fourth system voltage Vs4, which will be described later. , an EN pin for turning on/off the operation of the DC/DC converter 63, and a MODE pin for setting the operation mode of the DC/DC converter 63.
- the VIN pin of the DC/DC converter 63 is connected to the SYS_1 pin, SYS_2 pin, etc. of the charging IC 55 via the power path line Ln4, as described above.
- a GND pin of the DC/DC converter 63 is connected to the ground line.
- the SW pin of DC/DC converter 63 is connected to power path line Ln4 via reactor Rc2.
- the VOUT pin of the DC/DC converter 63 is connected to the positive discharge terminal 41a, which is the positive terminal (that is, the high potential side) of the discharge terminal 41, via the VHEAT line Ln6.
- the EN pin of the DC/DC converter 63 is connected to the PB2 pin of MCU50.
- a MODE pin of the DC/DC converter 63 is connected to the power path line Ln4.
- a negative electrode side discharge terminal 41b which is the negative electrode terminal (that is, the low potential side) of the discharge terminal 41, is connected to the ground line.
- the DC/DC converter 63 is supplied with a power supply voltage based on the difference between the potential of the VIN pin and the potential of the GND pin, and operates when the input voltage to the EN pin is at a high level to boost the input voltage. output from the VOUT pin.
- the DC/DC converter 63 in this embodiment is a positive logic operation because it is enabled by inputting a high level to the EN pin.
- a negative logic DC/DC converter 63 that is enabled by inputting a low level to the EN pin may be used.
- the DC/DC converter 63 in response to the charging IC 55 outputting the second system voltage Vs2, the DC/DC converter 63 is supplied with the second system voltage Vs2 as the power supply voltage. Also, the MCU 50 inputs a high-level voltage signal to the EN pin of the DC/DC converter 63 when determining to heat the heater 21 in response to an aerosol generation request (for example, a user's puffing action). As a result, the DC/DC converter 63 outputs a fourth system voltage Vs4 obtained by boosting the voltage input to the DC/DC converter 63 to the discharge terminal 41 (that is, the heater 21).
- the fourth system voltage Vs4 output by the DC/DC converter 63 has a voltage value suitable for heating the heater 21.
- the fourth system voltage Vs4 is a voltage higher than the third system voltage Vs3, and can be set to a voltage of approximately 4.2 [V], for example.
- the DC/DC converter 63 is, for example, a switching regulator, and can take a pulse width modulation mode (hereinafter also referred to as PWM mode) and a pulse frequency modulation mode (hereinafter also referred to as PFM mode) as operation modes.
- PWM mode pulse width modulation mode
- PFM mode pulse frequency modulation mode
- the MODE pin of the DC/DC converter 63 is connected to the power path line Ln4 so that the input voltage to the MODE pin becomes high level when the DC/DC converter 63 can operate.
- the DC/DC converter 63 is operated in PWM mode.
- the VHEAT line Ln6 is provided with a switch Sw4 that switches between conduction and interruption of the VHEAT line Ln6.
- the switch Sw4 is turned on in response to an on command from the MCU50, and turned off in response to an off command from the MCU50.
- the switch Sw4 is turned on, the VHEAT line Ln6 becomes conductive, and the fourth system voltage Vs4 output from the DC/DC converter 63 is supplied to the discharge terminal 41 (specifically, the positive discharge terminal 41a). Heater 21 is heated. This allows the aerosol source to be atomized or vaporized to produce an aerosol.
- a switch composed of, for example, a MOSFET can be used as the switch Sw4. More specifically, the switch Sw4 is desirably a power MOSFET with a high switching speed.
- the gate terminal of the MOSFET that constitutes the switch Sw4 is connected to the PB4 pin of the MCU 50, and the MCU 50 controls the output from the PB4 pin to apply to the gate terminal of the switch Sw4. By changing the gate voltage, the switch Sw4 is turned on or off.
- the power supply unit 10 three capacitors, a capacitor Cd61, a capacitor Cd62, and a capacitor Cd63, are connected in parallel as capacitors for stabilizing the fourth system voltage Vs4 output from the DC/DC converter 63. are provided.
- stabilizing smoothing the voltage with a plurality of capacitors in this way, the heat generated due to the stabilization of the voltage can be distributed to the plurality of capacitors. Therefore, compared with the case where the voltage is stabilized by one capacitor, it is possible to avoid the capacitor from becoming hot and suppress deterioration and failure of the capacitor.
- a high voltage value is required for the fourth system voltage Vs4. If such a high voltage were to be stabilized by a single capacitor, it would be expected that this capacitor would reach a very high temperature. As a result, not only the capacitor, which has reached a high temperature, is significantly deteriorated, but also other electronic components arranged around this capacitor may be adversely affected. Therefore, as described above, it is desirable to stabilize the fourth system voltage Vs4 using a plurality of capacitors.
- the capacitor Cd61 has a relatively small electrostatic capacity, and accordingly has a relatively small physical size.
- the capacitor Cd62 and the capacitor Cd63 have relatively large electrostatic capacitances, and correspondingly have relatively large physical sizes.
- the capacitance of the capacitor Cd61 can be 0.1 [ ⁇ F]
- the capacitance of the capacitors Cd62 and Cd63 can be 50 [ ⁇ F].
- a varistor VR4 is provided between the discharge terminal 41 and the switch Sw4 in the VHEAT line Ln6. More specifically, one end of the varistor VR4 is connected to the VHEAT line Ln6 and the other end is connected to the ground line.
- a capacitor Cd7 is also connected between the discharge terminal 41 and the switch Sw4 for stabilizing the voltage supplied to the discharge terminal 41 via the switch Sw4.
- this capacitor Cd7 can also function as a protection component that protects the system of the power supply unit 10, such as the switch Sw4 and the DC/DC converter 63, from noise such as static electricity generated at the discharge terminal 41.
- FIG. Therefore, the capacitor Cd7 can also protect the system of the power supply unit 10 such as the switch Sw4 and the DC/DC converter 63 from noise such as static electricity generated at the discharge terminal 41.
- the suction sensor 15 includes a VDD pin that is a high-potential power terminal, a GND pin that is a low-potential power terminal, and an OUT pin that is an output terminal.
- the VDD pin of the suction sensor 15 is connected to the OUT pin of the LDO regulator 62 via the VSYS line Ln5 as described above.
- a GND pin of the suction sensor 15 is connected to the ground line.
- the OUT pin of the suction sensor 15 is connected to the PC5 pin of the MCU50.
- the suction sensor 15 operates when a power supply voltage is supplied by the difference between the potential of the VDD pin and the potential of the GND pin. Specifically, the suction sensor 15 operates by being supplied with the third system voltage Vs3 output from the LDO regulator 62 as a power supply voltage, and functions as a sensor device that detects the user's puffing action.
- the suction sensor 15 is mainly composed of a condenser microphone or a pressure sensor, and sends a signal indicating the value of the pressure (internal pressure) change in the power supply unit 10 caused by suction by the user as a detection result from the OUT pin to the MCU 50. output.
- a sensor device other than a condenser microphone or a pressure sensor may be employed as the suction sensor 15 .
- the MCU 50 includes a VDD pin that is a high-potential power terminal, a VSS pin that is a low-potential power terminal, and a plurality of pins (hereinafter also referred to as input/output pins) that function as input terminals or output terminals.
- the MCU 50 operates by being supplied with a power supply voltage based on the difference between the potential of the VDD pin and the potential of the VSS pin.
- the MCU 50 Since the MCU 50 has the aforementioned PA11 pin and PA12 pin as input/output pins, it can communicate with an external device using these pins, and can acquire, for example, firmware update data from the external device. Further, since the MCU 50 has the PB8 pin and the PB9 pin as input/output pins, it can communicate with the charging IC 55 using these pins, and can acquire the above-described battery information and the like from the charging IC 55 .
- the charging IC 55 is turned on/off by the output from the PB14 pin, and the DC/DC converter 63 is turned on/off by the output from the PB2 pin. can be individually controlled.
- the switch Sw1 is activated by the output from the PA0 pin, the switch Sw2 by the output from the PB3 pin, and the switch Sw2 by the output from the PA8 pin.
- the switch Sw3 can be turned on/off by the output from the PB4 pin, and the switch Sw4 can be turned on/off by the output from the PB4 pin.
- the MCU 50 Since the MCU 50 has the PC5 pin, the PC4 pin, and the PC1 pin as input/output pins, the user's puff action is performed based on the input to the PC5 pin, and the user's operation switch OPS is operated based on the input to the PC4 pin. , the temperature of the thermistor TH (that is, the temperature of the power supply BAT) can be detected based on the input to the PC1 pin when the switch Sw3 is turned on.
- FIG. A chassis 12 is provided in the inner space of the case 11, and a charging terminal 42 (see FIG. 3), a receptacle mounting board 8, a battery pack BP including a power supply BAT, and an MCU mounting board 7 extend from the bottom portion 11c to the top portion 11a. They are held by the chassis 12 in this order.
- the MCU-mounted board 7 can be arranged at a position closer to the power supply BAT than when the receptacle-mounted board 8 is arranged between them.
- the wiring distance between the electronic component (for example, the battery connector Cn3) connected to the power supply BAT on the MCU-mounted board 7 and the power supply BAT can be shortened.
- the size of the power supply unit 10 can be reduced by reducing unnecessary wiring. At the same time, the cost for manufacturing the power supply unit 10 can be reduced.
- the electronic components connected to the power supply BAT and the power supply BAT are short, the electronic components are more affected by the noise generated by the current flowing through the wiring than when the wiring distance is long. can be reduced. Therefore, even if the current value of the current flowing through this wiring (for example, the charging current for charging the power supply BAT or the discharging current from the power supply BAT) increases, the noise generated due to this current is The influence on electronic components can be reduced, and the operation of the power supply unit 10 can be stabilized.
- the current value of the current flowing through this wiring for example, the charging current for charging the power supply BAT or the discharging current from the power supply BAT
- the chassis 12 that holds the MCU mounting board 7, the battery pack BP, and the like is made of an insulating material such as synthetic resin (for example, plastic).
- the chassis 12 includes a wall portion 12a between the portion holding the MCU mounting board 7 and the portion holding the battery pack BP in the X direction. This wall portion 12a can function as a spacer that insulates the MCU mounting board 7 from the power source BAT of the battery pack BP.
- the wall portion 12a functioning as an insulating spacer between the MCU mounting board 7 and the battery pack BP, a short circuit occurs due to physical contact between the MCU mounting board 7 and the power supply BAT. can be avoided.
- the wall portion 12a of the chassis 12 constitutes the spacer that insulates the MCU mounting board 7 from the power supply BAT.
- the case 11 has a charging opening 43 that allows access to the charging terminal 42, an operating opening that exposes the operating portion 14 to the outside, and a pair of openings that expose the discharging terminal 41 to the outside from the top portion 11a.
- a discharge aperture is provided.
- the MCU mounting board 7 is a multi-layer board configured by laminating a plurality of layers, and has a substantially rectangular shape.
- the MCU mounting board 7 is arranged such that its longitudinal direction is along the extending direction of the center line L of the case 11 (that is, the X direction), and that one element mounting surface faces the operating section 14 .
- the X direction is sometimes referred to as the longitudinal direction X
- the top portion 11a side is referred to as the X1 direction
- the bottom portion 11c side is referred to as the X2 direction.
- the direction orthogonal to the longitudinal direction X is called a lateral direction Y
- one side (the left side in FIG. 7, the upper side in FIGS. 10 and 11) is referred to as the Y1 direction
- the other side (the right side in FIG. 7, the lower side in FIGS. 8 and 9 and the upper side in FIGS. 10 and 11) is referred to as the Y2 direction.
- the longitudinal direction X can also be called the length direction of the MCU mounting board 7
- the lateral direction Y can also be called the width direction of the MCU mounting board 7
- the centerline of the MCU mounting board 7 coincides with the centerline L of the power supply unit 10 (case 11) extending in the X direction.
- the center line of the MCU mounting board 7 is the center point of the width direction (transverse direction) and thickness direction of the MCU mounting board 7 when the MCU mounting board 7 is cut along a plane orthogonal to the longitudinal direction X. It is a line connected continuously to X.
- the MCU mounting board 7 is composed of a rectangular portion 81 that occupies most of the MCU mounting board 7 and a projecting portion 82 projecting from the rectangular portion 81 in the X1 direction. Both ends of the projecting portion 82 in the lateral direction Y are notched, and the end of the projecting portion 82 in the X1 direction faces the top portion 11a of the case 11, forming a rectangular portion 81 in which the projecting portion 82 is not provided. faces the low floor portion 11 b of the case 11 .
- the MCU mounting board 7 Assuming that the surface of the MCU mounting board 7 on the operation unit 14 side is the main surface 7a and the opposite side surface (that is, the back surface) is the subsurface 7b, the MCU mounting board 7 has electronic components on both the main surface 7a and the subsurface 7b. It is a double-sided mounting board to be mounted.
- a button-type operation switch OPS is mounted substantially in the center of the main surface 7a so as to face the operation unit 14. Thereby, the user can push down the operation switch OPS through the operation portion 14 of the case 11 . Further, near the operation switch OPS, LED_L1 and LED_L2 are mounted so as to sandwich the operation switch OPS in the lateral direction Y. As shown in FIG. Thereby, the user can visually recognize the light emitted from LED_L1 and LED_L2 through the LED window 13 provided around the operation unit 14 .
- a battery connector Cn3 is mounted on the end of the main surface 7a in the X2 direction.
- a battery connection cable Cb2 extending from a battery pack BP including a power source BAT is connected to the battery connector Cn3 from the Y2 direction side (see also FIG. 7).
- the end in the X2 direction where the battery connector Cn3 is mounted is located near the power source BAT.
- the battery connection cable Cb2 can be shortened, and the size of the power supply unit 10 can be reduced.
- the cost for manufacturing the power supply unit 10 can be reduced.
- the current value of the current flowing through the battery connection cable Cb2 such as the charging current for charging the power supply BAT or the discharging current from the power supply BAT, increases due to the shortening of the battery connection cable Cb2, it is caused by this current. Therefore, the influence of noise generated in the power supply unit 10 on the electronic components of the power supply unit 10 can be reduced, and the operation of the power supply unit 10 can be stabilized.
- the wall portion 12a which is a spacer for insulating them, is provided. Therefore, in this embodiment, the battery connector Cn3 is mounted on the MCU mounting board 7 with the battery connector Cn3 directed in the Y2 direction, and the battery connection cable Cb2 is connected to the battery connector Cn3 from the Y2 direction side. This makes it possible to avoid physical interference between the battery connection cable Cb2 and/or the wall portion 12a without making them complicated in shape.
- the battery connector Cn3 is mounted on the MCU mounting board 7 with the battery connector Cn3 directed in the Y2 direction, and the battery connection cable Cb2 is connected to the battery connector Cn3 from the Y2 direction side. Absent.
- the battery connector Cn3 may be mounted on the MCU mounting board 7 with the battery connector Cn3 directed in the Y1 direction, and the battery connection cable Cb2 may be connected to the battery connector Cn3 from the Y1 direction side.
- the dashed line indicated by reference numeral 55 represents the mounting position of the charging IC 55 mounted on the subsurface 7b, which is the back surface of the main surface 7a. That is, the battery connector Cn3 and the charging IC 55 are mounted on different surfaces of the MCU mounting board 7 so that at least part of the battery connector Cn3 overlaps the charging IC 55 in the direction orthogonal to the MCU mounting board 7 .
- the direction orthogonal to the MCU mounting board 7 refers to the direction orthogonal to the longitudinal direction X and the lateral direction Y. As shown in FIG.
- the physical size of the battery connector Cn3 and charging IC 55 is large and tends to occupy a large area on the MCU mounting board 7. Therefore, by mounting the battery connector Cn3 and the charging IC 55 on different surfaces of the MCU mounting substrate 7, both the main surface 7a and the subsurface 7b can be effectively used to mount the battery connector Cn3 and the charging IC 55. Become. As a result, the battery connector Cn3 and the charging IC 55 can be mounted on the MCU mounting board 7 while avoiding the MCU mounting board 7 from increasing in size.
- At least part of the battery connector Cn3 overlaps the charging IC 55 in the direction orthogonal to the main surface 7a of the MCU mounting board 7, so that the wiring distance between the battery connector Cn3 and the charging IC 55 can be shortened.
- unnecessary wiring for example, conductive patterns formed on the MCU mounting board 7
- the MCU mounting board 7 can be miniaturized.
- the cost for manufacturing the MCU mounting board 7 can be reduced.
- the wiring distance between the battery connector Cn3 and the charging IC 55 is short, even if the current value of the current flowing through this wiring (for example, the VBAT line Ln2) is large, the noise generated due to this current will not affect the MCU.
- the influence of the mounting board 7 on other electronic components can be reduced, and the operation of the power supply unit 10 can be stabilized.
- the current flowing through the wiring between the battery connector Cn3 and the charging IC 55 is, for example, a charging current for charging the power supply BAT (hereinafter simply referred to as charging current) or a discharging current from the power supply BAT (hereinafter simply referred to as discharging current). ).
- the positive electrode side discharge terminal 41a is mounted on the projecting portion 82, which is the end portion of the main surface 7a in the X1 direction.
- a heater 21 provided in the first cartridge 20 is connected to the positive discharge terminal 41a.
- the end in the X1 direction where the positive discharge terminal 41 a is mounted is located near the first cartridge 20 .
- the positive electrode side discharge terminal 41a is arranged on the Y2 direction side of the center line L in the protruding portion 82 .
- a switch Sw4 is arranged on the Y1 direction side of the projecting portion 82 with the center line L interposed therebetween.
- a DC/DC converter 63, a reactor Rc2, a capacitor Cd61, a capacitor Cd62, a capacitor Cd63, a capacitor Cd7, etc. are mounted on the main surface 7a between the operation switch OPS and the switch Sw4 in the X direction.
- the DC/DC converter 63, the capacitor Cd61, the capacitor Cd62, and the capacitor Cd63 are approximately They are arranged in an L shape.
- the capacitor Cd61 is aligned with the DC/DC converter 63 and the capacitor Cd62 in the lateral direction Y (that is, the width direction of the MCU mounting board 7), but is not aligned with the capacitor Cd63.
- lining up in the transverse direction Y means that at least a part of each overlaps when viewed from the transverse direction Y. As shown in FIG.
- the capacitor Cd63 is aligned with the DC/DC converter 63 in the longitudinal direction X (that is, the length direction of the MCU mounting board 7), but is not aligned with the capacitors Cd61 and Cd62.
- lining up in the longitudinal direction X means that at least a part of each overlaps when viewed from the longitudinal direction X.
- the capacitors Cd61 and Cd63 are not aligned in the longitudinal direction X, which is the length direction of the MCU mounting board 7, and the lateral direction Y, which is the width direction of the MCU mounting board 7, as shown in FIG. Similarly, the capacitors Cd62 and Cd63 are not aligned in the longitudinal direction X and the lateral direction Y.
- the longitudinal direction of the MCU mounting board 7 is required to secure space for arranging them.
- the size in the direction X that is, the size in the length direction; hereinafter also referred to as the length dimension
- the size in the lateral direction Y that is, the size in the width direction; hereinafter also referred to as the width dimension
- the capacitor Cd61 or the capacitor Cd62 and the capacitor Cd63 are mounted on the MCU mounting board 7 so as not to be aligned in the longitudinal direction X and the lateral direction Y, so that they are aligned in a line.
- the MCU mounting board 7 can be miniaturized, and the cost for manufacturing the MCU mounting board 7 can be reduced.
- miniaturizing the MCU mounting board 7 it is also possible to miniaturize the power supply unit 10 itself. Thereby, the portability of the aerosol inhaler 1 can be improved, and the user's convenience can be improved.
- the number of capacitors mounted on the MCU mounting board 7 so as to be aligned in the longitudinal direction X with the DC/DC converter 63 is one (only the capacitor Cd63). It is smaller than the number of capacitors (two capacitors Cd61 and Cd62) mounted on the MCU mounting board 7 so as to be aligned with the DC/DC converter 63 in a line. In this way, the number of capacitors mounted on the MCU-mounted board 7 so as to line up with the DC/DC converter 63 in the longitudinal direction X is reduced to the number of capacitors mounted on the MCU mounted in line with the DC/DC converter 63 in the lateral direction Y. By making the number of capacitors smaller than the number of capacitors mounted on the board 7, it is possible to prevent the length dimension of the MCU-mounted board 7 from becoming large, and to reduce the size of the MCU-mounted board 7. - ⁇
- the capacitance of the capacitor Cd63 is larger than that of the capacitor Cd61.
- the width dimension of the MCU mounting board 7 can be prevented from becoming large. Therefore, the size of the MCU mounting board 7 can be reduced.
- the capacitance of the capacitor Cd62 is also larger than that of the capacitor Cd61.
- the capacitor Cd62 which tends to have a large capacitance and a large physical size, with the DC/DC converter 63 in the lateral direction Y, it is possible to realize that the capacitors Cd62 and Cd63 are aligned in the lateral direction Y. can be avoided.
- the capacitors Cd62 and Cd63 are arranged in the lateral direction Y, it is possible to avoid increasing the width dimension of the MCU mounting board 7 . Therefore, the size of the MCU mounting board 7 can be reduced.
- the DC/DC converter 63, the capacitor Cd61, and the capacitor Cd62 are arranged in a line in this order in the transverse direction Y. That is, in the MCU mounting board 7, there tends to be a large number of vias and the like provided around the DC/DC converter 63. FIG. Therefore, it is difficult to mount a large-sized, large-capacity capacitor, such as the capacitor Cd 62 , close to the DC/DC converter 63 on the MCU mounting board 7 . On the other hand, a small-sized capacitor such as the capacitor Cd61 can be easily mounted on the MCU mounting board 7 in the vicinity of the DC/DC converter 63 .
- the MCU mounting board 7 can be miniaturized.
- the capacitor Cd63 has a rectangular shape with long sides and short sides in a plan view of the MCU mounting board 7 .
- the capacitor Cd63 is mounted on the MCU mounting board 7 so that its short sides are parallel to the longitudinal direction X. As shown in FIG. In other words, the capacitor Cd63 is mounted on the MCU mounting board 7 such that the short direction of the capacitor Cd63 is aligned with the longitudinal direction X of the MCU mounting board 7 .
- the capacitor Cd 63 and the DC/DC converter 63 are arranged in the longitudinal direction X, an increase in the length dimension of the MCU mounting board 7 can be suppressed. Therefore, the size of the MCU mounting board 7 can be reduced.
- the capacitor Cd62 has a rectangular shape with long sides and short sides in a plan view of the MCU mounting board 7 .
- the capacitor Cd62 is mounted on the MCU mounting board 7 so that its long sides are parallel to the longitudinal direction X. As shown in FIG. In other words, the capacitor Cd62 is mounted on the MCU mounting board 7 so that the short side direction of the capacitor Cd62 is aligned with the short side direction Y of the MCU mounting board 7 . Accordingly, even if the capacitor Cd 62 and the DC/DC converter 63 are arranged in the lateral direction Y, an increase in the width dimension of the MCU mounting board 7 can be suppressed. Therefore, the size of the MCU mounting board 7 can be reduced.
- a charging IC 55 As shown in FIG. 10, a charging IC 55, a reactor Rc1, a protection IC 61, an MCU mounting board side connector Cn2, a suction sensor 15, A negative electrode side discharge terminal 41b and the like are mounted.
- the MCU mounting board side connector Cn2 is mounted approximately in the center of the secondary surface 7b.
- 10 indicates the center of the MCU mounting board 7 viewed from a direction orthogonal to the MCU mounting board 7.
- the center O1 of the MCU mounting board 7 is the center of the MCU mounting board 7 in the longitudinal direction X, on the center line of the MCU mounting board 7 that coincides with the center line L of the case 11 .
- Reference O2 in FIG. 10 represents the center of the MCU mounting board side connector Cn2 as seen from the direction orthogonal to the MCU mounting board 7 .
- the MCU mounting board side connector Cn2 has a substantially rectangular shape in which two sides are parallel to the longitudinal direction X and the other two sides are parallel to the lateral direction Y in a plan view of the MCU mounting board 7 . Therefore, the center O2 of the MCU mounting board side connector Cn2 is the center of the MCU mounting board side connector Cn2 in the longitudinal direction X and the center of the MCU mounting board side connector Cn2 in the lateral direction Y.
- the shortest distance d1 between the edge of the MCU mounting board 7 closest to the MCU mounting board side connector Cn2 and the center O2 of the MCU mounting board side connector Cn2 is the distance between the center O1 of the MCU mounting board 7 and the MCU.
- the MCU mounting board side connector Cn2 is mounted on the secondary surface 7b of the MCU mounting board 7 so as to be longer than the shortest distance d2 to the center O2 of the mounting board side connector Cn2.
- the shortest distance d1 between the edge of the MCU mounting board 7 closest to the MCU mounting board side connector Cn2 and the MCU mounting board side connector Cn2 is the distance between the center of the MCU mounting board 7 and the MCU mounting board side connector Cn2.
- the MCU mounting board-side connector Cn2 By mounting the MCU mounting board-side connector Cn2 approximately in the center of the MCU mounting board 7, compared to the case where the MCU mounting board-side connector Cn2 is mounted at the end of the MCU mounting board 7, the MCU mounting board-side connector Cn2 and other electronic components mounted on the MCU mounting board 7 can be shortened. This is because many electronic components can be easily mounted around and in the vicinity of the MCU mounting board side connector Cn2. As a result, the conductive pattern formed on the MCU mounting board 7 as wiring for connecting the MCU mounting board side connector Cn2 and other electronic components mounted on the MCU mounting board 7 can be shortened. Therefore, it is possible to reduce the size of the MCU mounting board 7 by reducing redundant conductive patterns. At the same time, the cost for manufacturing the MCU mounting board 7 can be reduced.
- a board connection cable Cb1 extending from the receptacle mounting board 8 on which the charging terminal 42 and the like are mounted is connected to the MCU mounting board side connector Cn2. More specifically, in this embodiment, the MCU mounting board side connector Cn2 is mounted on the MCU mounting board 7 with the MCU mounting board side connector Cn2 directed in the Y1 direction, and the board connection cable Cb1 is connected to the MCU mounting board side connector Cn2 from the Y1 direction side. connected to.
- the MCU mounting board side connector Cn2 can be mounted substantially in the center of the MCU mounting board 7. , physical interference between other electronic components mounted on the MCU mounting board 7 and the board connection cable Cb1 can be made difficult. Therefore, it is possible to improve the durability of other electronic components mounted on the MCU mounting board 7 and improve the degree of freedom in layout of each electronic component on the MCU mounting board 7 .
- the MCU mounting board side connector Cn2 is mounted approximately in the center of the MCU mounting board 7 and the board connection cable Cb1 is connected to the MCU mounting board side connector Cn2 from the longitudinal direction X of the MCU mounting board 7,
- the electronic components aligned in the longitudinal direction X with the MCU-mounted board-side connector Cn2 are restricted from the standpoint of avoiding physical interference with the board connection cable Cb1, such as not being able to use tall electronic components. obtain.
- the MCU mounting board side connector Cn2 is mounted in the direction Y1, and the board connection cable Cb1 is connected to the MCU mounting board side connector Cn2 from the Y1 direction side.
- the MCU mounting board side connector Cn2 may be mounted on the MCU mounting board 7 with the MCU mounting board side connector Cn2 directed in the Y2 direction, and the board connection cable Cb1 may be connected to the MCU mounting board side connector Cn2 from the Y2 direction side.
- a charging IC 55 is mounted on the X2 direction side of the MCU mounting board side connector Cn2.
- the charging IC 55 can be arranged at a position close to the battery connector Cn3 mounted on the end of the main surface 7a in the X2 direction.
- at least part of the battery connector Cn3 can overlap the charging IC 55 in the direction orthogonal to the main surface 7a of the MCU mounting board 7.
- a reactor Rc1 is mounted near the Y1 direction in the lateral direction Y, and a reactor Rc1 is mounted near the Y2 direction.
- IC 61 is mounted.
- a suction sensor 15 is mounted on the X1 direction side of the MCU mounting board side connector Cn2.
- the receptacle mounting board 8 (see FIG. 7) arranged on the X2 direction side with respect to the MCU mounting board 7, the MCU mounting board side connector Cn2, and the suction sensor 15 are arranged in this order.
- the suction sensor 15 is not arranged in the longitudinal direction X between the receptacle mounting board 8 arranged on the X2 direction side with respect to the MCU mounting board 7 and the MCU mounting board side connector Cn2.
- the suction sensor 15 is an electronic component whose height from the secondary surface 7b (subsurface side surface layer 71b) is higher than the MCU mounting board side connector Cn2. This is because the suction sensor 15 tends to be large due to its structure in which suction is detected by vibration of a diaphragm provided inside. If such a suction sensor 15 is arranged on the MCU mounting board 7 on the X2 direction side of the MCU mounting board side connector Cn2 (that is, between the receptacle mounting board 8 and the MCU mounting board side connector Cn2), the MCU mounting board side The substrate connection cable Cb1 connected to the connector Cn2 and the suction sensor 15 are likely to physically interfere with each other. In order to avoid this interference, the board connection cable Cb1 has no choice but to have a complicated shape.
- the suction sensor 15 is arranged on the MCU mounting board 7 on the X1 direction side of the MCU mounting board side connector Cn2 (that is, on the opposite side of the receptacle mounting board 8). This makes it possible to easily avoid physical interference between the board connection cable Cb1 and the suction sensor 15 without making the board connection cable Cb1 have a complicated shape. Therefore, it is possible to suppress an increase in the manufacturing cost of the power supply unit 10 due to the complicated shape of the board connection cable Cb1.
- the reactor Rc2 and the operation switch OPS are, like the suction sensor 15, an electronic component taller than the MCU mounting board side connector Cn2 (that is, an electronic component having a higher height from the mounting surface of the MCU mounting board 7). parts). Therefore, in the present embodiment, as described above, the reactor Rc2 and the operation switch OPS are mounted on the main surface 7a. Cb1 is made to be physically less likely to interfere.
- the battery connector Cn3 is mounted on the main surface 7a, and the MCU mounting board side connector Cn2 is mounted on the subsurface 7b.
- the battery connector Cn3 and the MCU-mounted board-side connector Cn2 are physically large in size and tend to occupy a large area on the MCU-mounted board 7 . Therefore, by mounting the battery connector Cn3 and the MCU mounting board side connector Cn2 on different surfaces of the MCU mounting board 7 respectively, both the main surface 7a and the sub surface 7b can be effectively utilized. Cn2 can be implemented. As a result, the battery connector Cn3 and the MCU mounting board side connector Cn2 can be mounted on the MCU mounting board 7 while avoiding the MCU mounting board 7 from increasing in size.
- the dashed line indicated by reference numeral 50 indicates the mounting position of the MCU 50 mounted on the main surface 7a, which is the back surface of the subsurface 7b. That is, the MCU mounting board side connector Cn2 and the MCU50 are arranged on different MCU mounting boards 7 so that at least a part of the MCU mounting board side connector Cn2 overlaps the MCU50 in the direction perpendicular to the main surface 7a of the MCU mounting board 7. mounted on the surface.
- the MCU mounting board 7 In general, on the MCU mounting board 7, there tends to be fewer conductive patterns, vias, etc. provided at locations where connectors such as the MCU mounting board side connector Cn2 are mounted, compared to other locations. Therefore, on the MCU mounting board 7, it is easy to provide conductive patterns, vias, etc. necessary for other electronic components on the back side of the portion where the connectors such as the MCU mounting board side connector Cn2 are mounted. Therefore, in the direction perpendicular to the MCU mounting board 7, by mounting an IC such as the MCU 50 that uses many conductive patterns and vias at a position overlapping the MCU mounting board side connector Cn2, the board area of the MCU mounting board 7 is effectively utilized. As a result, the size of the MCU mounting board 7 can be reduced.
- the MCU 50 is an electronic component that overlaps the MCU mounting board side connector Cn2 in the direction perpendicular to the MCU mounting board 7, but the electronic component is not limited to this and may be any electronic component.
- the IC use many conductive patterns, vias, and the like.
- the dashed line indicated by symbol Cn3 represents the mounting position of the battery connector Cn3 mounted on the main surface 7a, which is the back surface of the subsurface 7b. That is, the battery connector Cn3 is mounted on the X2 direction side of the MCU mounting board side connector Cn2. Therefore, in the power supply unit 10, from the X2 direction side to the X1 direction side (that is, in the longitudinal direction X), the receptacle mounting board 8, the battery pack BP including the power supply BAT, the battery connector Cn3, and the MCU mounting board side connector Cn2. are arranged in this order.
- the battery connector Cn3 is arranged at a position close to the power source BAT, and the battery connection cable Cb2 can be shortened, so that the size of the power source unit 10 can be reduced.
- the cost for manufacturing the power supply unit 10 can be reduced, and the influence of noise generated by the current flowing through the battery connection cable Cb2 on the electronic components of the power supply unit 10 can be reduced. 10 can also be stabilized.
- the negative electrode side discharge terminal 41b is mounted on the projecting portion 82, which is the end portion of the secondary surface 7b in the X1 direction.
- a heater 21 provided in the first cartridge 20 is connected to the negative discharge terminal 41b.
- the end in the X1 direction where the negative discharge terminal 41 b is mounted is located near the first cartridge 20 .
- the negative discharge terminal 41b is arranged on the Y1 direction side of the projecting portion 82 with the center line L interposed therebetween.
- the main surface 7a of the MCU mounting substrate 7 is mounted with the positive discharge terminal 41a
- the subsurface 7b is mounted with the negative discharge terminal 41b.
- the positive electrode side discharge terminal 41a and the negative electrode side discharge terminal 41b have probes. Then, as shown in FIG.
- the MCU mounting substrate 7 has a first wiring layer 72a, a main surface side insulating layer 73a, and a second wiring layer 74a arranged in this order from the base layer 70 toward the main surface side surface layer 71a. Further, a third wiring layer 72b, a sub-surface insulating layer 73b, and a fourth wiring layer 74b are provided in this order from the base layer 70 toward the sub-surface side surface layer 71b.
- the MCU mounting board 7 is not limited to this, and various configurations can be adopted. For example, a plurality of second wiring layers 74a and/or fourth wiring layers 74b may be provided, or only one of the first wiring layer 72a and the third wiring layer may be provided.
- Conductive patterns made of copper foil or the like are provided on the second wiring layer 74a and the fourth wiring layer 74b. Further, the first wiring layer 72a and the third wiring layer 72b may also be provided with conductive patterns formed of copper foil or the like, like the second wiring layer 74a and the fourth wiring layer 74b.
- the conductive pattern forming the power lines and signal lines of the MCU-mounted substrate 7 will be referred to as wiring pattern 77
- the conductive pattern forming the ground line will be referred to as ground pattern 78 .
- wiring pattern 77_Ln1 constitutes VBUS line Ln1
- wiring pattern 77_Ln2 constitutes VBAT line Ln2
- wiring pattern 77_Ln3a constitutes D+ line Ln3a
- a wiring pattern 77_Ln3b constitutes the D-line Ln3b
- a wiring pattern 77_Ln4 constitutes the power path line Ln4
- a wiring pattern 77_Ln5 constitutes the VSYS line Ln5
- a wiring pattern 77_Ln6 constitutes the VHEAT line Ln6, are sometimes written respectively.
- the ground pattern 78 is provided so as to surround the wiring pattern 77 .
- 9 shows the second wiring layer 74a of the MCU mounting board 7
- FIG. 11 shows the fourth wiring layer 74b of the MCU mounting board 7.
- the wiring pattern 77 is hatched with oblique lines
- the ground pattern 78 is hatched with dots. 9 and 11, only some of the wiring patterns 77 provided on the MCU mounting substrate 7 are shown.
- the dashed line indicated by reference numeral 55 represents the charging IC 55 mounted on the secondary surface 7b (on the secondary surface layer 71b).
- the charge IC 55 connects the VBAT line Ln2 to the wiring pattern 77_Ln2 so that the BAT_1 pin and the BAT_2 pin are located at the location indicated by the symbol P1 in FIG. It is mounted on the MCU mounting board 7 so that the pins come.
- the location indicated by P2 is closer to the end of the MCU mounting substrate 7 on the X2 direction side than the location indicated by P1.
- the BAT_SNS pin which is a detection terminal for detecting the output voltage of the power supply BAT, is connected to the MCU mounting board 7 rather than the BAT_1 pin and BAT_2 pin, which are input/output terminals used for power transfer between the charging IC 55 and the power supply BAT. is arranged near the end on the X2 direction side of the .
- the BAT_SNS pin can be arranged at a position close to the power supply BAT, and the wiring distance between the power supply BAT and the BAT_SNS pin can be shortened.
- the charging IC 55 it is possible to reduce the influence of wire resistance and the like included in the input to the BAT_SNS pin, and allow the charging IC 55 to accurately detect the output voltage of the power supply BAT based on the input to the BAT_SNS pin. If the charging IC 55 can accurately detect the output voltage of the power supply BAT, the accuracy and speed of charging the power supply BAT by the charging IC 55 are improved.
- the dashed line indicated by symbol Cn2 represents the MCU mounting board side connector Cn2 mounted on the secondary surface 7b (on the secondary surface side surface layer 71b).
- a wiring pattern 77 is formed at a portion overlapping with the MCU mounting board side connector Cn2. That is, as described above, there tends to be fewer conductive patterns and vias provided at locations where connectors such as the MCU mounting board side connector Cn2 are mounted, compared to other locations.
- the board area of the MCU mounting board 7 can be reduced. can be effectively used to reduce the size of the MCU mounting board 7 .
- the type of electronic component to which the wiring pattern 77 formed in the portion overlapping with the MCU mounting board side connector Cn2 is connected is not particularly limited.
- the vias provided on the MCU mounting substrate 7 will be additionally explained.
- the first wiring layer 72a, the second wiring layer 74a, the third wiring layer 72b, and the fourth wiring layer 74b. do.
- a predetermined wiring pattern 77 formed in the second wiring layer 74a and a predetermined wiring pattern 77 formed in the fourth wiring layer 74b are electrically connected to each other through vias V1.
- the via V2 is composed of a conductor penetrating from the second wiring layer 74a to the first wiring layer 72a, and is a conductive pattern formed in each of the first wiring layer 72a and the second wiring layer 74a.
- the conductive pattern electrically connected to the via V2 is set to the same potential.
- the via V3 is composed of a conductor penetrating from the third wiring layer 72b to the fourth wiring layer 74b. Conductive patterns that are electrically connected are set at the same potential.
- the ground pattern 78 formed on the second wiring layer 74a and a part of the conductive pattern formed on the first wiring layer 72a are electrically connected to each other through vias V2, and formed on the fourth wiring layer 74b.
- the ground pattern 78 and the part of the conductive pattern formed on the third wiring layer 72b are electrically connected to each other through the via V3.
- the via V4 is composed of a conductor penetrating from the first wiring layer 72a to the third wiring layer 72b.
- Conductive patterns that are electrically connected are assumed to have the same potential.
- a portion of the conductive pattern formed on the first wiring layer 72a and a portion of the conductive pattern formed on the third wiring layer 72b are electrically connected to each other through the via V4.
- a part of the conductive pattern of the first wiring layer 72a and a part of the conductive pattern of the third wiring layer 72b are connected to the ground pattern 78 of the second wiring layer 74a and the ground of the fourth wiring layer 74b.
- Pattern 78 can be a ground line with a common reference potential.
- the wiring pattern 77 of the second wiring layer 74a and the wiring pattern 77 of the fourth wiring layer 74b can be electrically connected to each other through the via V1.
- the electronic component mounted on the main surface 7a (main surface side surface layer 71a) and the electronic component mounted on the subsurface 7b (on the subsurface side surface layer 71b) can be electrically connected. .
- the main-surface-side surface layer 71a and the sub-surface-side surface layer 71b are made of, for example, a resist film, cover the second wiring layer 74a and the fourth wiring layer 74b, prevent the wiring patterns 77 from shorting each other, and The wiring pattern 77 and the ground pattern 78 are protected from being short-circuited.
- the base layer 70, the main-surface-side insulating layer 73a, and the sub-surface-side insulating layer 73b are made of an insulator containing glass or epoxy resin, for example, and adhere to each other while preventing short circuits between the upper and lower layers.
- FIG. 14 is an enlarged view showing the periphery of the end portion on the X1 direction side of the second wiring layer 74a of the MCU mounting substrate 7 shown in FIG. 15 is an enlarged view of the wiring pattern 77_Ln6a (described later) shown in FIG. 14, and FIG. 16 is an enlarged view of the wiring pattern 77_Ln6b (described later) illustrated in FIG. be.
- each dashed line with a code represents an electronic component corresponding to the code among the electronic components mounted on the main surface 7a (main surface side surface layer 71a).
- the dashed line denoted by reference numeral 63 represents the DC/DC converter 63
- the broken line denoted by reference numeral Cd61 represents the capacitor Cd61
- the broken line denoted by reference numeral Cd62 represents the capacitor Cd62
- the broken line denoted by reference numeral Cd63 represents the capacitor Cd63.
- the dashed line denoted by symbol Sw4 represents the switch Sw4
- the dashed line denoted by symbol Cd7 represents the capacitor Cd7
- the dotted line denoted by symbol VR4 represents the varistor VR4
- the dotted line denoted by symbol 41a represents the positive side discharge terminal 41a.
- the wiring pattern 77_Ln6 is connected to the wiring pattern 77_Ln6a to which the DC/DC converter 63, the capacitor Cd61, the capacitor Cd62, the capacitor Cd63, and the like are connected, the capacitor Cd7, the varistor VR4, the positive discharge terminal 41a, and the like. and a wiring pattern 77_Ln6b.
- the wiring pattern 77_Ln6a is a conductive pattern forming a portion from the VOUT pin of the DC/DC converter 63 to the switch Sw4 in the VHEAT line Ln6 shown in FIG.
- the wiring pattern 77_Ln6b is a conductive pattern forming a portion from the switch Sw4 to the positive discharge terminal 41a in the VHEAT line Ln6 shown in FIG.
- the wiring pattern 77_Ln6a includes a trapezoidal portion 771 having a trapezoidal shape in plan view of the MCU mounting substrate 7 .
- the trapezoidal portion 771 includes an upper base 771a, a lower base 771b longer than the upper base 771a, a first leg 771c, a second leg 771d forming an angle with the lower base 771b smaller than that of the first leg 771c, have
- the VOUT pin of the DC/DC converter 63, one end (in other words, one terminal) of the capacitor Cd61, and one end (in other words, one terminal) of the capacitor Cd62 are connected to predetermined locations on the lower base 771b side of the wiring pattern 77_Ln6a. be done.
- the GND pin of the DC/DC converter 63, the other end (in other words, the other terminal) of the capacitor Cd61, and the other end (in other words, the other terminal) of the capacitor Cd62 are connected to the ground pattern 78, respectively.
- One end (in other words, one terminal) of the capacitor Cd63 is connected to a portion corresponding to the first leg 771c of the trapezoidal portion 771 in the wiring pattern 77_Ln6a, and the other end (in other words, the other terminal) of the capacitor Cd63 is connected to It is connected to the ground pattern 78 .
- the wiring pattern 77_Ln6a has a substantially rectangular shape in a plan view of the MCU mounting board 7, and a connection point p between the lower base 771b and the second leg 771d. and a rectangular portion 772 connected to the lower bottom 771b.
- the VOUT pin of the DC/DC converter 63, one end of the capacitor Cd61, and one end of the capacitor Cd62 are connected to corresponding portions of the rectangular portions 772, respectively.
- the capacitor Cd62 is arranged so as not to overlap the second leg 771d in a plan view of the MCU mounting board 7 .
- a portion surrounded by a dashed line in FIG. is formed in In this case, between the capacitor Cd62 and the capacitor Cd63, the current cannot flow through the shortest route as indicated by the arrow of symbol Ib, or even if the current can flow through the shortest route, the route must be sufficiently thick. Sometimes I can't. As a result, the (apparent) electrical resistance value of the conductive pattern connecting the DC/DC converter 63 to the capacitor Cd63 increases, and there is a risk that the current cannot efficiently flow from the DC/DC converter 63 to the capacitor Cd63. In addition, since the current flows so as to bend at right angles through the substantially L-shaped conductive pattern, noise may occur.
- the wiring pattern 77_Ln6a is configured to include the trapezoidal portion 771 and the rectangular portion 772 connected to the lower base 771b of the trapezoidal portion 771, and the DC/DC converter 63, the capacitor Cd61, And by connecting the capacitor Cd62 to the rectangular portion 772 and connecting the capacitor Cd63 to the trapezoidal portion 771, the (apparent) electrical resistance value of the conductive pattern connecting the DC/DC converter 63 to the capacitor Cd63 increases. can be avoided, and current can flow efficiently from the DC/DC converter 63 to the capacitor Cd63.
- each circle indicated by a dashed line represents a via.
- the via within the area surrounded by the dashed line indicated by symbol Cd62 is the via that connects the other end of the capacitor Cd62 described above and the ground (for example, the ground pattern 78 formed on the first wiring layer 72a).
- the via in the area surrounded by the dashed line indicated by symbol Cd63 is a via that connects the other end of the capacitor Cd63 and the ground (for example, the ground pattern 78 formed on the first wiring layer 72a).
- the number of vias connecting the other end of the capacitor Cd63 to the ground is equal to the number of vias connecting the other end of the capacitor Cd62 to the ground (eg, 13). less than In other words, the number of vias connecting the other end of the capacitor Cd62 to the ground is greater than the number of vias connecting the other end of the capacitor Cd63 to the ground.
- the smoothing effect of the capacitor improves (stabilizes) as the number of vias connected to the ground increases. Therefore, by connecting the other end of the capacitor Cd62 to the ground using a large number of vias, the output voltage (fourth system voltage Vs4) of the DC/DC converter 63 can be more effectively smoothed by the capacitor Cd62. Become. Therefore, a more stable voltage can be supplied to the heater 21 that generates the aerosol, and the generation of the aerosol by the heater 21 can be stabilized. As a result, deterioration of the flavor and taste of the aerosol inhaler 1 due to unstable generation of aerosol can be suppressed.
- the capacitor Cd63 is mounted on the MCU mounting board 7 so as to be closer to the switch Sw4 than the capacitor Cd62.
- the capacitor Cd62 connected to the ground using more vias than the capacitor Cd63 is mounted on the MCU mounting board 7 so as to be farther from the switch Sw4 than the capacitor Cd63.
- the capacitor Cd62 which is connected to the ground using more vias than the capacitor Cd63, more positively smoothes the output voltage of the DC/DC converter 63 than the capacitor Cd63, and thus tends to generate heat. be. Therefore, by disposing the capacitor Cd62 farther from the switch Sw4 than the capacitor Cd63, the heat generated by the capacitor Cd62 is less likely to be transmitted to the switch Sw4, thereby stabilizing the operation of the switch Sw4. Further, by making it difficult for the heat generated by the capacitor Cd62 to be transmitted to the switch Sw4, it is possible to suppress an increase in the temperature of the switch Sw4 and suppress an increase in the ON resistance of the switch Sw4. This increases the efficiency of power supply to the heater 21 that generates the aerosol, and enables the heater 21 to generate the aerosol with high efficiency.
- FIG. 14 shows only some of the vias provided on the MCU mounting board 7 .
- the wiring pattern 77_Ln6b to which the capacitor Cd7, the varistor VR4, and the positive discharge terminal 41a are connected will be described.
- the wiring pattern 77_Ln6b includes a first conductive pattern 77A and a second conductive pattern 77B.
- the first conductive pattern 77A is formed to extend along the lateral direction Y from the location where the switch Sw4 is mounted to the location where the positive electrode side discharge terminal 41a is mounted. It is configured to be able to supply the fourth system voltage Vs4 to the positive electrode side discharge terminal 41a. Considering that the fourth system voltage Vs4 is generated based on the output voltage of the power supply BAT, the first conductive pattern 77A is (at least part of) a conductive pattern that connects the power supply BAT and the positive discharge terminal 41a. can be done.
- a switch Sw4, a varistor VR4, a positive discharge terminal 41a, and the like are connected to the first conductive pattern 77A as electronic components.
- the second conductive pattern 77B is branched from the first conductive pattern 77A.
- the second conductive pattern 77B branches from a portion of the first conductive pattern 77A where it is connected to the positive discharge terminal 41a, and extends longitudinally on the side opposite to the positive discharge terminal 41a (X2 direction side). It is formed to extend along the direction X.
- a capacitor Cd7 is connected to the second conductive pattern 77B as an electronic component.
- the capacitor Cd7 protects the electronic components on the MCU-mounted board 7 from noise (for example, static electricity generated at the positive electrode discharge terminal 41a; hereinafter also referred to as external noise) that enters the power supply unit 10 via the positive electrode discharge terminal 41a. It can function as a component. Specifically, one end (in other words, one terminal) of the capacitor Cd7 is connected to the second conductive pattern 77B, and the other end (in other words, the other terminal) is connected to the ground pattern 78 (that is, the ground). It is mounted on the MCU mounting board 7 .
- noise for example, static electricity generated at the positive electrode discharge terminal 41a; hereinafter also referred to as external noise
- the second conductive pattern 77B branching from the first conductive pattern 77A connecting the power source BAT and the positive discharge terminal 41a is provided, and the second conductive pattern 77B is protected from external noise by the MCU.
- One end of a capacitor Cd7 as a protective component for protecting electronic components on the mounting substrate 7 is connected. This allows at least part of the external noise to escape from the first conductive pattern 77A to the second conductive pattern 77B. It is possible to protect electronic parts from external noise.
- Two or more electronic components including the switch Sw4 and the positive discharge terminal 41a are connected to the first conductive pattern 77A.
- the switch Sw4 and the positive discharge terminal 41a are connected to the first conductive pattern 77A.
- the capacitor Cd7 as an electronic component is connected to the second conductive pattern 77B.
- the number of electronic components connected to the second conductive pattern 77B is less than the number of electronic components connected to the first conductive pattern 77A.
- the number of electronic components affected by external noise can be reduced compared to the case where a large number of electronic components are connected to the second conductive pattern 77B.
- the second conductive pattern 77B is provided so as to branch from a portion of the first conductive pattern 77A that is connected to the positive electrode side discharge terminal 41a. This makes it difficult for external noise to flow toward the first conductive pattern 77A, thereby reducing the external noise flowing through the first conductive pattern 77A and protecting the electronic components connected to the first conductive pattern 77A from the external noise. becomes possible.
- a chamfered portion 77C is provided at a location where the second conductive pattern 77B branches from the first conductive pattern 77A (hereinafter also simply referred to as a branch location), and the branch location is 90° or less. angle (i.e. no acute angle). If a right-angled or acute-angled portion is provided at the branch point, noise may occur when the current flows through the corner portion. In other words, in this case, the interaction between the conductive pattern having a right-angled or acute-angled portion and the external noise flowing through the conductive pattern may further generate noise other than the external noise.
- the angle of the branched portion is not set to 90° or less, thereby preventing noise other than the external noise from being generated when the external noise flows into the second conductive pattern 77B. suppressed.
- the branched portion may be formed in an arc shape so that the branched portion does not have an angle of 90° or less.
- the second conductive pattern 77B is a conductive pattern thinner than the first conductive pattern 77A.
- the dimension of the thinnest portion of the first conductive pattern 77A is w1
- the dimension of the thinnest portion of the second conductive pattern 77B is w2 (where w2 ⁇ w1).
- first conductive pattern 77A This makes it possible to increase the thickness of the first conductive pattern 77A while avoiding an increase in the size of the MCU mounting board 7 . If the first conductive pattern 77A is thickened, even if a large current is applied to the first conductive pattern 77A in order to secure the amount of aerosol generated by the heater 21, the large current causes the first conductive pattern 77A to It is possible to reduce the generated heat and noise.
- the capacitor Cd7 has a rectangular shape with long sides and short sides in a plan view of the MCU mounting board 7 .
- the capacitor Cd7 is mounted on the MCU mounting board 7 so that its long sides are parallel to the longitudinal direction X.
- the longitudinal direction X which is the extension direction of the case 11 (that is, the power supply unit 10, and thus the aerosol inhaler 1).
- the second conductive pattern 77B is formed so as to extend in the X2 direction, that is, in the direction away from the positive discharge terminal 41a.
- the positive electrode discharge terminal 41a itself is a physically not small electronic component, and there is a tendency that a large number of components (for example, insulating components) are generally provided around the positive electrode discharge terminal 41a. Therefore, it may be difficult to mount the capacitor Cd7 near the positive discharge terminal 41a. Therefore, by forming the second conductive pattern 77B so as to extend in the X2 direction, that is, in the direction away from the positive discharge terminal 41a, it is possible to mount the capacitor Cd7 at a position away from the positive discharge terminal 41a. , the mounting of the capacitor Cd7 can be facilitated.
- the first conductive pattern 77A is connected with a varistor VR4 as a protection component that protects the electronic components of the MCU mounting board 7 from external noise.
- the varistor VR4 has one end (in other words, one terminal) connected to the first conductive pattern 77A and the other end (in other words, the other terminal) connected to the ground pattern 78 (that is, the ground). It is mounted on the MCU mounting board 7 . As a result, even if external noise flows into the first conductive pattern 77A, the external noise can be released to the ground by the varistor VR4, so that other electronic components connected to the first conductive pattern 77A can be protected from the external noise. .
- the varistor VR4 has a rectangular shape with long sides and short sides when the MCU mounting board 7 is viewed from above.
- the varistor VR4 is mounted on the MCU mounting board 7 so that its long sides are parallel to the longitudinal direction X.
- the length direction of the varistor VR4 coincides with the longitudinal direction X, which is the extending direction of the case 11 (that is, the power supply unit 10, and thus the aerosol inhaler 1).
- the switch Sw4, the varistor VR4, and the positive discharge terminal 41a connected to the first conductive pattern 77A are arranged in a line on the first conductive pattern 77A.
- the first conductive pattern 77A is formed to extend along the lateral direction Y from the location where the switch Sw4 is mounted toward the location where the positive discharge terminal 41a is mounted.
- the switch Sw4, the varistor VR4, and the positive discharge terminal 41a are arranged on the first conductive pattern 77A in a row in the lateral direction Y (that is, the extending direction of the first conductive pattern 77A). It is connected to the first conductive pattern 77A. This allows the first conductive pattern 77A to have a simple shape.
- the first conductive pattern 77A has a complicated shape for connecting the switch Sw4, the varistor VR4, and the positive discharge terminal 41a, it is possible to form the first conductive pattern 77A thicker. Become. By forming the first conductive pattern 77A thick, it is possible to reduce heat and noise generated when current flows through the first conductive pattern 77A.
- the varistor VR4 is arranged between the switch Sw4 and the positive discharge terminal 41a on the first conductive pattern 77A.
- the varistor VR4 can protect the switch Sw4 from this external noise. Therefore, it is possible to avoid failure of the switch Sw4 due to external noise, and to avoid unintended energization of the heater 21 due to the failure of the switch Sw4.
- a via V10 is provided in the space between the first conductive pattern 77A and the second conductive pattern 77B (in other words, the space adjacent to the first conductive pattern 77A and the second conductive pattern 77B). is provided.
- the via V10 is a via connected to the ground, and specifically connects the ground pattern 78 in the first wiring layer 72a (and/or the third wiring layer 72b) and the ground pattern 78 in the second wiring layer 74a. Beer.
- a via V10 connected to the ground (for example, the ground pattern 78 in the first wiring layer 72a) is provided between the first conductive pattern 77A and the second conductive pattern 77B.
- the ground heat can be radiated to the second wiring layer 74a near the main surface 7a of the MCU mounting substrate 7.
- FIG. 1 the space between the first conductive pattern 77A and the second conductive pattern 77B is effectively used to prevent the MCU mounting board 7 from increasing in size, while suppressing heat accumulation in the MCU mounting board 7.
- the MCU mounting board 7 can be efficiently cooled.
- the size of the MCU-mounted board 7 can be avoided and the size of the MCU-mounted board 7 can be reduced.
- the power supply unit 10 including the MCU-mounted substrate 7 can be miniaturized, and the portability of the aerosol inhaler 1 can be improved to enhance user convenience.
- the cost for manufacturing the MCU mounting board 7 can be reduced.
- the heater 21 is the heating unit that consumes the power supplied from the power source BAT to generate aerosol from the aerosol source, and power is supplied to the heater 21 from the discharge terminal 41 of the power supply unit 10.
- the heating unit that generates the aerosol can be composed of a susceptor built in the first cartridge 20 or the like and an induction heating coil that transmits power to the susceptor by electromagnetic induction.
- the discharge terminal 41 of the power supply unit 10 is connected to the induction heating coil to supply power to the induction heating coil.
- a power supply (power supply BAT); a load (heater 21) that consumes the power supplied from the power source and generates aerosol from the aerosol source, or a connector (discharge terminal 41) to which a coil that transmits power to the load by electromagnetic induction is connected; a voltage converter (DC/DC converter 63) including an input terminal (VIN pin) connected to the power supply and an output terminal (VOUT pin) connected to the connector; a first capacitor (capacitor Cd63) and a second capacitor (capacitor Cd61) connected between the output terminal of the voltage converter and the connector; a circuit board (MCU mounting board 7) on which the voltage converter, the first capacitor, and the second capacitor are mounted; with The first capacitor and the second capacitor are not aligned in a line in the length direction (longitudinal direction X) or width direction (lateral direction Y) of the circuit board, A power supply unit (power supply unit 10) of the aerosol generator (aerosol inhaler 1).
- the length dimension of the circuit board is smaller than when they are arranged in a line. And it is possible to avoid increasing the width dimension. As a result, the circuit board can be miniaturized, and the cost for manufacturing the circuit board can be reduced.
- a power supply unit of the aerosol generator according to (1) the first capacitor is aligned with the voltage converter along the length of the circuit board;
- the second capacitor is aligned with the voltage converter in the width direction of the circuit board, Power supply unit for the aerosol generator.
- the first capacitor and the second capacitor are not aligned in the length direction and the width direction of the circuit board, compared to the case where they are aligned in a line, the length dimension of the circuit board And it is possible to avoid increasing the width dimension.
- the first capacitor which tends to have a large capacity and a large physical size, with the voltage converter in the length direction of the circuit board, compared to the case where they are arranged in the width direction. Therefore, it is possible to avoid an increase in the width dimension of the circuit board. Therefore, the size of the circuit board can be reduced.
- a power supply unit of the aerosol generator according to (3) Further comprising a third capacitor (capacitor Cd62) mounted on the circuit board, the third capacitor is aligned in a line with the voltage converter and the second capacitor in the width direction of the circuit board; the capacity of the third capacitor is larger than the capacity of the second capacitor; Power supply unit for the aerosol generator.
- a third capacitor capacitor Cd62
- the first capacitor and the third capacitor are arranged in the length direction of the circuit board.
- a power supply unit of the aerosol generator according to (4), The voltage converter, the second capacitor, and the third capacitor are aligned in the width direction of the circuit board in the order of the voltage converter, the second capacitor, and the third capacitor, Power supply unit for the aerosol generator.
- the third capacitor has a rectangular shape with long sides and short sides, the long side of the third capacitor is parallel to the length direction of the circuit board; Power supply unit for the aerosol generator.
- the long side of the third capacitor is parallel to the length direction of the circuit board, even if the third capacitor is arranged in the width direction of the voltage converter and the circuit board, increase can be suppressed. Therefore, the size of the circuit board can be reduced.
- a power supply unit for the aerosol generator according to any one of (4) to (6), one end of the first capacitor and one end of the third capacitor are connected to the output terminal of the voltage converter; the other end of the first capacitor and the other end of the third capacitor are connected to the ground of the circuit board; the number of vias connecting the other end of the first capacitor to the ground is smaller than the number of vias connecting the other end of the third capacitor to the ground; Power supply unit for the aerosol generator.
- the smoothing effect of the capacitor improves (stabilizes) as the number of vias connected to the ground increases.
- the third capacitor can more effectively smooth the output voltage of the voltage converter. Therefore, it becomes possible to supply a more stable voltage to the load that generates aerosol, and the generation of aerosol by the load can be stabilized.
- the first capacitor is mounted on the circuit board so as to be closer to the switch than the third capacitor. Power supply unit for the aerosol generator.
- the third capacitor which is connected to the ground using more vias than the first capacitor, more actively smoothes the output voltage of the voltage converter than the first capacitor, and thus tends to generate heat. According to (8), by disposing the third capacitor farther from the switch than the first capacitor, the heat generated by the third capacitor is less likely to be transmitted to the switch, and the operation of the switch can be stabilized. In addition, by making it difficult for the heat generated by the third capacitor to be transmitted to the switch, it is possible to suppress an increase in the temperature of the switch and suppress an increase in the on-resistance of the switch. This increases the efficiency of power supply to the aerosol-generating load, enabling the load to generate highly efficient aerosol.
- the first capacitor has a rectangular shape with long sides and short sides, the short side of the first capacitor is parallel to the length direction of the circuit board; Power supply unit for the aerosol generator.
- the short side of the first capacitor is parallel to the length direction of the circuit board, even if the first capacitor and the voltage converter are arranged in the length direction of the circuit board, the length of the circuit board It is possible to suppress an increase in the height dimension. Therefore, the size of the circuit board can be reduced.
- a power supply unit for an aerosol generator according to any one of (2) to (9),
- the number of capacitors mounted on the circuit board so as to be aligned with the voltage converter in the length direction of the circuit board is such that the number of capacitors mounted on the circuit board is aligned with the voltage converter in the width direction of the circuit board. less than the number of capacitors implemented in Power supply unit for the aerosol generator.
- the number of capacitors mounted on the circuit board so as to be aligned with the voltage converter in the length direction of the circuit board is reduced to the number of capacitors mounted on the circuit board so as to be aligned with the voltage converter in the width direction of the circuit board.
- the power supply unit of the aerosol generator according to (2) includes a conductive pattern (wiring pattern 77_Ln6a) to which the voltage converter, the first capacitor, and the second capacitor are connected,
- the conductive pattern includes a trapezoidal trapezoidal portion (trapezoidal portion 771),
- the trapezoidal portion includes an upper base (upper base 771a), a lower base (lower base 771b) longer than the upper base, a first leg (first leg 771c), and an angle formed with the lower base at the first angle.
- a second leg (second leg 771d) that is smaller than the first leg; the voltage converter and the second capacitor are connected to the bottom side; the first capacitor is connected to the first leg; Power supply unit for the aerosol generator.
- the conductive pattern between the first capacitor and the second capacitor can be thickened, the electrical resistance value of the conductive pattern to which the voltage converter, the first capacitor, and the second capacitor are connected increases. can be avoided. As a result, even if the first and second capacitors are mounted on the circuit board so that they are not aligned in the length and width directions of the circuit board, Current can flow efficiently.
- the conductive pattern has a substantially rectangular shape, and further includes a connection point (connection point p) between the lower base and the second leg and a rectangular portion (rectangular portion 772) connected to the lower base. consists of the voltage converter and the second capacitor are connected to the rectangular portion; Power supply unit for the aerosol generator.
- the conductive pattern to which the voltage converter, the first capacitor, and the second capacitor are connected does not have an acute angle, the electrical resistance value of the conductive pattern increases and the heat generated from the conductive pattern increases. and noise can be reduced.
- the first capacitor does not overlap the second leg in a plan view of the circuit board, Power supply unit for the aerosol generator.
- the conductive pattern between the first capacitor and the second capacitor can be thickened, the electrical resistance value of the conductive pattern to which the voltage converter, the first capacitor, and the second capacitor are connected increases. can be avoided. As a result, even if the first and second capacitors are mounted on the circuit board so that they are not aligned in the length and width directions of the circuit board, Current can flow efficiently.
- Aerosol inhaler (aerosol generator) 7 MCU mounting board (circuit board) 10 power supply unit 21 heater (load) 41 discharge terminal (connector) 63 DC/DC converter (voltage converter) BAT Power supply Cd61 Capacitor (second capacitor) Cd62 capacitor (third capacitor) Cd63 capacitor (first capacitor) X longitudinal direction (longitudinal direction) Y Transverse direction (width direction)
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Abstract
Description
電源と、
前記電源から供給される電力を消費してエアロゾル源からエアロゾルを生成する負荷、又は、前記負荷へ電磁誘導により送電するコイルが接続されるコネクタと、
前記電源に接続される入力端子と、前記コネクタに接続される出力端子とを含んで構成される電圧変換器と、
前記電圧変換器の出力端子と前記コネクタとの間に接続される第1コンデンサ及び第2コンデンサと、
前記電圧変換器、前記第1コンデンサ、及び前記第2コンデンサが実装される回路基板と、
を備え、
前記第1コンデンサ及び前記第2コンデンサは、前記回路基板の長さ方向又は幅方向において一列に並ばない、
エアロゾル生成装置の電源ユニットである。
エアロゾル吸引器1は、燃焼を伴わずに香味が付加されたエアロゾルを吸引するための器具であり、所定方向(以下、X方向と称する)に沿って延びる棒形状を有する。エアロゾル吸引器1は、図1及び図2に示すように、X方向に沿って電源ユニット10と、第1カートリッジ20と、第2カートリッジ30と、がこの順に設けられている。第1カートリッジ20は、電源ユニット10に対して着脱可能としてもよく、第2カートリッジ30は、第1カートリッジ20に対して着脱可能である。言い換えると、電源ユニット10に対し、第1カートリッジ20及び第2カートリッジ30は、それぞれ交換可能である。第2カートリッジ30は、第1カートリッジ20に対し、交換可能でもある。なお、第1カートリッジ20を電源ユニット10に対して嵌合させて固定し、ユーザが容易に着脱できない構成としてもよい。
本実施形態の電源ユニット10は、図3~図5、図7に示すように、円筒状のケース11の内部に、バッテリパックBP、MCU(Micro Controller Unit)50、MCU搭載基板7、レセプタクル搭載基板8等を収容して構成される。
第1カートリッジ20は、図3に示すように、円筒状のカートリッジケース27の内部に、エアロゾル源22を貯留するリザーバ23と、エアロゾル源22を霧化及び/又は気化(以下、単に霧化という)するヒータ21と、リザーバ23からヒータ21へエアロゾル源を引き込むウィック24と、エアロゾル源22が霧化されることで発生したエアロゾルが第2カートリッジ30に向かって流れるエアロゾル流路25と、第2カートリッジ30の一部を収容するエンドキャップ26と、を備える。
第2カートリッジ30は、香味源31を貯留する。第2カートリッジ30は、第1カートリッジ20のエンドキャップ26に設けられたカートリッジ収容部26aに着脱可能に収容される。第2カートリッジ30は、第1カートリッジ20側とは反対側の端部が、ユーザの吸口32となっている。なお、吸口32は、第2カートリッジ30と一体不可分に構成される場合に限らず、第2カートリッジ30と着脱可能に構成されてもよい。このように吸口32を電源ユニット10と第1カートリッジ20とは別体に構成することで、吸口32を衛生的に保つことができる。
続いて、電源ユニット10の回路構成について図6を参照しながら説明する。
図6において、一点鎖線で囲んだ範囲内に図示した電子部品は、レセプタクル搭載基板8に実装された電子部品である。すなわち、レセプタクル搭載基板8は、主要な電子部品として、USB Type-Cのプラグ(以下、単にUSBプラグともいう)を挿入可能なレセプタクルである充電端子42と、レセプタクル搭載基板8とMCU搭載基板7とを接続する基板接続ケーブルCb1の一端が接続されるレセプタクル搭載基板側コネクタCn1と、を備える。本実施形態では、基板接続ケーブルCb1を、6本のプリントパターンを有するFPC(Flexible Printed Circuit)ケーブルとするが、これに限定されるものではない。バッテリ接続ケーブルCb2は3本のワイヤで接続されていてもよい。
充電端子42は、挿入されたUSBプラグのA1ピン、A4ピン、A5ピン、A6ピン、A7ピン、A8ピン、A9ピン、A12ピン、B1ピン、B4ピン、B5ピン、B6ピン、B7ピン、B8ピン、B9ピン、及びB12ピンの各ピンにそれぞれ接続されるピン(端子)を備える。本明細書等では、USBプラグのAnピン(ただしn=1~12)に対応する充電端子42のピンを、充電端子42のAnピンともいう。同様に、USBプラグのBnピンに対応する充電端子42のピンを、充電端子42のBnピンともいう。
充電IC55は、高電位側の電源端子の1つであるVBUSピンと、低電位側の電源端子であるGNDピンと、充電IC55と電源BATとの間の電力授受に用いられる入出力端子であるBAT_1ピン及びBAT_2ピンと、電源BATへの入力あるいは電源BATからの出力を検出する検出端子としてのBAT_SNSピンと、後述の第2システム電圧Vs2が出力される出力端子であるSYS_1、SYS_2ピン、SW_1ピン、及びSW_2ピンと、充電IC55の動作をオン/オフするためのCEピンと、を含んで構成される。なお、BAT_1ピン及びBAT_2ピンも、充電IC55における高電位側の電源端子として機能し得る。
充電IC55から出力された第2システム電圧Vs2が供給されるパワーパスラインLn4には、さらに、LED_L1を作動(例えば点灯)させるための第1LED回路Cc1と、LED_L2を作動させるための第2LED回路Cc2とが接続される。
LDOレギュレータ62は、高電位側の電源端子であるINピンと、低電位側の電源端子であるGNDピンと、後述の第3システム電圧Vs3が出力される出力端子であるOUTピンと、LDOレギュレータ62の動作をオン/オフするためのENピンと、を備える。
LDOレギュレータ62から出力された第3システム電圧Vs3が供給されるVSYSラインLn5には、さらに、操作スイッチOPSに対するユーザの操作を検出するための操作スイッチ回路Cc3と、電源BATの温度を検出するための電源温度検出回路Cc4とが接続される。
電源温度検出回路Cc4は、サーミスタTHと、抵抗器R4と、電源温度検出回路Cc4の導通及び遮断を切り替えるスイッチSw3とを直列に接続して構成される。電源温度検出回路Cc4におけるスイッチSw3側の一端はVSYSラインLn5に接続され、電源温度検出回路Cc4におけるサーミスタTH側の他端はグランドラインに接続される。また、MCU50のPC1ピンは、電源温度検出回路Cc4において抵抗器R4とサーミスタTHとの間となる接続点CPに接続される。
DC/DCコンバータ63は、高電位側の電源端子であるVINピンと、低電位側の電源端子であるGNDピンと、電圧が入力されるSWピンと、後述の第4システム電圧Vs4が出力される出力端子であるVOUTピンと、DC/DCコンバータ63の動作をオン/オフするためのENピンと、DC/DCコンバータ63の動作モードを設定するためのMODEピンと、を備える。
放電端子41に供給される電力が不安定になると、ヒータ21によって生成されるエアロゾルの量がばらついて香喫味の悪化につながるおそれがある。そこで、図6に示すように、VHEATラインLn6には、DC/DCコンバータ63から出力された第4システム電圧Vs4を安定化するためのコンデンサが接続される。
吸引センサ15は、高電位側の電源端子であるVDDピンと、低電位側の電源端子であるGNDピンと、出力端子であるOUTピンと、を備える。
MCU50は、高電位側の電源端子であるVDDピンと、低電位側の電源端子であるVSSピンと、入力端子あるいは出力端子として機能する複数のピン(以下、入出力ピンともいう)と、を備える。MCU50は、VDDピンの電位とVSSピンの電位との差分により電源電圧が供給されることで動作する。
続いて、電源ユニット10の内部構成について図5、及び図7~図12を参照しながら説明する。
ケース11の内部空間にはシャーシ12が設けられ、充電端子42(図3参照)、レセプタクル搭載基板8、電源BATを含むバッテリパックBP、及びMCU搭載基板7が、ボトム部11cからトップ部11aに向かってこの順にシャーシ12に保持される。
MCU搭載基板7には、電源ユニット10の回路構成(図6等を参照)で説明した複数の電子部品が実装されている。MCU搭載基板7は、複数の層が積層されて構成された多層基板であって、略矩形形状を有する。MCU搭載基板7は、長手方向がケース11の中心線Lの延伸方向(すなわちX方向)に沿うように、且つ、一方側の素子実装面が操作部14に対向するように配置される。
第2配線層74a及び第4配線層74bには、銅箔等から形成される導電パターンが設けられている。また、第1配線層72a及び第3配線層72bにも、第2配線層74a及び第4配線層74bと同様に、銅箔等から形成される導電パターンが設けられていてもよい。以下の説明において、MCU搭載基板7の電源ライン及び信号ラインを構成する導電パターンを配線パターン77と称し、グランドラインを構成する導電パターンをグランドパターン78と称する。また、本明細書等では、配線パターン77のうち、VBUSラインLn1を構成するものを配線パターン77_Ln1、VBATラインLn2を構成するものを配線パターン77_Ln2、D+ラインLn3aを構成するものを配線パターン77_Ln3a、D-ラインLn3bを構成するものを配線パターン77_Ln3b、パワーパスラインLn4を構成するものを配線パターン77_Ln4、VSYSラインLn5を構成するものを配線パターン77_Ln5、VHEATラインLn6を構成するものを配線パターン77_Ln6、とそれぞれ表記する場合がある。
続いて、VHEATラインLn6を構成する導電パターンである配線パターン77_Ln6及び配線パターン77_Ln6に接続される電子部品について、図14~図16を参照しながら補足説明する。なお、図14は、図9に示したMCU搭載基板7の第2配線層74aのうちのX1方向側の端部の周辺を拡大して示した図である。また、図15は、図14に示した配線パターン77_Ln6a(後述)を拡大して示した図であり、図16は、図14に示した配線パターン77_Ln6b(後述)を拡大して示した図である。
前記電源から供給される電力を消費してエアロゾル源からエアロゾルを生成する負荷(ヒータ21)、又は、前記負荷へ電磁誘導により送電するコイルが接続されるコネクタ(放電端子41)と、
前記電源に接続される入力端子(VINピン)と、前記コネクタに接続される出力端子(VOUTピン)とを含んで構成される電圧変換器(DC/DCコンバータ63)と、
前記電圧変換器の出力端子と前記コネクタとの間に接続される第1コンデンサ(コンデンサCd63)及び第2コンデンサ(コンデンサCd61)と、
前記電圧変換器、前記第1コンデンサ、及び前記第2コンデンサが実装される回路基板(MCU搭載基板7)と、
を備え、
前記第1コンデンサ及び前記第2コンデンサは、前記回路基板の長さ方向(長手方向X)又は幅方向(短手方向Y)において一列に並ばない、
エアロゾル生成装置(エアロゾル吸引器1)の電源ユニット(電源ユニット10)。
前記第1コンデンサは、前記回路基板の長さ方向において前記電圧変換器と一列に並び、
前記第2コンデンサは、前記回路基板の幅方向において前記電圧変換器と一列に並ぶ、
エアロゾル生成装置の電源ユニット。
前記第1コンデンサの容量は、前記第2コンデンサの容量よりも大きい、
エアロゾル生成装置の電源ユニット。
前記回路基板に実装される第3コンデンサ(コンデンサCd62)をさらに備え、
前記第3コンデンサは、前記回路基板の幅方向において前記電圧変換器及び前記第2コンデンサと一列に並び、
前記第3コンデンサの容量は、前記第2コンデンサの容量よりも大きい、
エアロゾル生成装置の電源ユニット。
前記電圧変換器、前記第2コンデンサ、及び前記第3コンデンサは、前記回路基板の幅方向において、前記電圧変換器、前記第2コンデンサ、前記第3コンデンサの順で一列に並ぶ、
エアロゾル生成装置の電源ユニット。
前記第3コンデンサは、長辺と短辺からなる長方形形状を有し、
前記第3コンデンサの長辺は、前記回路基板の長さ方向に対して平行である、
エアロゾル生成装置の電源ユニット。
前記第1コンデンサの一端及び前記第3コンデンサの一端は、前記電圧変換器の出力端子と接続され、
前記第1コンデンサの他端及び前記第3コンデンサの他端は、前記回路基板のグランドと接続され、
前記第1コンデンサの他端を前記グランドへ接続するビアの数は、前記第3コンデンサの他端を前記グランドへ接続するビアの数よりも少ない、
エアロゾル生成装置の電源ユニット。
前記回路基板に実装され、且つ前記電圧変換器の出力端子と前記コネクタとの間に接続されるスイッチ(スイッチSw4)をさらに備え、
前記第1コンデンサは、前記第3コンデンサよりも前記スイッチに近くなるように、前記回路基板に実装される、
エアロゾル生成装置の電源ユニット。
前記第1コンデンサは、長辺と短辺からなる長方形の形状を有し、
前記第1コンデンサの短辺は、前記回路基板の長さ方向に対して平行である、
エアロゾル生成装置の電源ユニット。
前記回路基板の長さ方向において前記電圧変換器と一列に並ぶように前記回路基板に実装されるコンデンサの数は、前記回路基板の幅方向において前記電圧変換器と一列に並ぶように前記回路基板に実装されるコンデンサの数よりも少ない、
エアロゾル生成装置の電源ユニット。
前記回路基板は、前記電圧変換器、前記第1コンデンサ、及び前記第2コンデンサが接続される導電パターン(配線パターン77_Ln6a)を含んで構成され、
前記導電パターンは、台形形状の台形部(台形部771)を含んで構成され、
前記台形部は、上底(上底771a)と、前記上底より長い下底(下底771b)と、第1の脚(第1の脚771c)と、前記下底となす角が前記第1の脚よりも小さい第2の脚(第2の脚771d)と、を有し、
前記電圧変換器及び前記第2コンデンサは、前記下底側に接続され、
前記第1コンデンサは、前記第1の脚に接続される、
エアロゾル生成装置の電源ユニット。
前記導電パターンは、略矩形形状を有し、且つ、前記下底と前記第2の脚との接続点(接続点p)及び前記下底に接続される矩形部(矩形部772)をさらに含んで構成され、
前記電圧変換器及び前記第2コンデンサは、前記矩形部に接続される、
エアロゾル生成装置の電源ユニット。
前記第1コンデンサは、前記回路基板の平面視で、前記第2の脚と重ならない、
エアロゾル生成装置の電源ユニット。
7 MCU搭載基板(回路基板)
10 電源ユニット
21 ヒータ(負荷)
41 放電端子(コネクタ)
63 DC/DCコンバータ(電圧変換器)
BAT 電源
Cd61 コンデンサ(第2コンデンサ)
Cd62 コンデンサ(第3コンデンサ)
Cd63 コンデンサ(第1コンデンサ)
X 長手方向(長さ方向)
Y 短手方向(幅方向)
Claims (13)
- 電源と、
前記電源から供給される電力を消費してエアロゾル源からエアロゾルを生成する負荷、又は、前記負荷へ電磁誘導により送電するコイルが接続されるコネクタと、
前記電源に接続される入力端子と、前記コネクタに接続される出力端子とを含んで構成される電圧変換器と、
前記電圧変換器の出力端子と前記コネクタとの間に接続される第1コンデンサ及び第2コンデンサと、
前記電圧変換器、前記第1コンデンサ、及び前記第2コンデンサが実装される回路基板と、
を備え、
前記第1コンデンサ及び前記第2コンデンサは、前記回路基板の長さ方向又は幅方向において一列に並ばない、
エアロゾル生成装置の電源ユニット。 - 請求項1に記載のエアロゾル生成装置の電源ユニットであって、
前記第1コンデンサは、前記回路基板の長さ方向において前記電圧変換器と一列に並び、
前記第2コンデンサは、前記回路基板の幅方向において前記電圧変換器と一列に並ぶ、
エアロゾル生成装置の電源ユニット。 - 請求項2に記載のエアロゾル生成装置の電源ユニットであって、
前記第1コンデンサの容量は、前記第2コンデンサの容量よりも大きい、
エアロゾル生成装置の電源ユニット。 - 請求項3に記載のエアロゾル生成装置の電源ユニットであって、
前記回路基板に実装される第3コンデンサをさらに備え、
前記第3コンデンサは、前記回路基板の幅方向において前記電圧変換器及び前記第2コンデンサと一列に並び、
前記第3コンデンサの容量は、前記第2コンデンサの容量よりも大きい、
エアロゾル生成装置の電源ユニット。 - 請求項4に記載のエアロゾル生成装置の電源ユニットであって、
前記電圧変換器、前記第2コンデンサ、及び前記第3コンデンサは、前記回路基板の幅方向において、前記電圧変換器、前記第2コンデンサ、前記第3コンデンサの順で一列に並ぶ、
エアロゾル生成装置の電源ユニット。 - 請求項4又は5に記載のエアロゾル生成装置の電源ユニットであって、
前記第3コンデンサは、長辺と短辺からなる長方形形状を有し、
前記第3コンデンサの長辺は、前記回路基板の長さ方向に対して平行である、
エアロゾル生成装置の電源ユニット。 - 請求項4から6のいずれか1項に記載のエアロゾル生成装置の電源ユニットであって、
前記第1コンデンサの一端及び前記第3コンデンサの一端は、前記電圧変換器の出力端子と接続され、
前記第1コンデンサの他端及び前記第3コンデンサの他端は、前記回路基板のグランドと接続され、
前記第1コンデンサの他端を前記グランドへ接続するビアの数は、前記第3コンデンサの他端を前記グランドへ接続するビアの数よりも少ない、
エアロゾル生成装置の電源ユニット。 - 請求項7に記載のエアロゾル生成装置の電源ユニットであって、
前記回路基板に実装され、且つ前記電圧変換器の出力端子と前記コネクタとの間に接続されるスイッチをさらに備え、
前記第1コンデンサは、前記第3コンデンサよりも前記スイッチに近くなるように、前記回路基板に実装される、
エアロゾル生成装置の電源ユニット。 - 請求項2から8のいずれか1項に記載のエアロゾル生成装置の電源ユニットであって、
前記第1コンデンサは、長辺と短辺からなる長方形の形状を有し、
前記第1コンデンサの短辺は、前記回路基板の長さ方向に対して平行である、
エアロゾル生成装置の電源ユニット。 - 請求項2から9のいずれか1項に記載のエアロゾル生成装置の電源ユニットであって、
前記回路基板の長さ方向において前記電圧変換器と一列に並ぶように前記回路基板に実装され且つ前記電圧変換器の出力端子に接続されるコンデンサの数は、前記回路基板の幅方向において前記電圧変換器と一列に並ぶように前記回路基板に実装され且つ前記電圧変換器の出力端子に接続されるコンデンサの数よりも少ない、
エアロゾル生成装置の電源ユニット。 - 請求項2から10のいずれか1項に記載のエアロゾル生成装置の電源ユニットであって、
前記回路基板は、前記電圧変換器、前記第1コンデンサ、及び前記第2コンデンサが接続される導電パターンを含んで構成され、
前記導電パターンは、台形形状の台形部を含んで構成され、
前記台形部は、上底と、前記上底より長い下底と、第1の脚と、前記下底となす角が前記第1の脚よりも小さい第2の脚と、を有し、
前記電圧変換器及び前記第2コンデンサは、前記下底側に接続され、
前記第1コンデンサは、前記第1の脚に接続される、
エアロゾル生成装置の電源ユニット。 - 請求項11に記載のエアロゾル生成装置の電源ユニットであって、
前記導電パターンは、略矩形形状を有し、且つ、前記下底と前記第2の脚との接続点及び前記下底に接続される矩形部をさらに含んで構成され、
前記電圧変換器及び前記第2コンデンサは、前記矩形部に接続される、
エアロゾル生成装置の電源ユニット。 - 請求項11又は12に記載のエアロゾル生成装置の電源ユニット。
前記第1コンデンサは、前記回路基板の平面視で、前記第2の脚と重ならない、
エアロゾル生成装置の電源ユニット。
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KR1020237044722A KR20240013211A (ko) | 2021-07-08 | 2021-07-08 | 에어로졸 생성 장치의 전원 유닛 |
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PCT/JP2021/025829 WO2023281713A1 (ja) | 2021-07-08 | 2021-07-08 | エアロゾル生成装置の電源ユニット |
JP2023532996A JPWO2023281713A1 (ja) | 2021-07-08 | 2021-07-08 | |
US18/405,684 US20240138488A1 (en) | 2021-07-08 | 2024-01-05 | Power supply unit of aerosol generating device |
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PCT/JP2021/025829 WO2023281713A1 (ja) | 2021-07-08 | 2021-07-08 | エアロゾル生成装置の電源ユニット |
Related Child Applications (1)
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US18/405,684 Continuation US20240138488A1 (en) | 2021-07-08 | 2024-01-05 | Power supply unit of aerosol generating device |
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WO2023281713A1 true WO2023281713A1 (ja) | 2023-01-12 |
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PCT/JP2021/025829 WO2023281713A1 (ja) | 2021-07-08 | 2021-07-08 | エアロゾル生成装置の電源ユニット |
Country Status (6)
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US (1) | US20240138488A1 (ja) |
EP (1) | EP4368037A1 (ja) |
JP (1) | JPWO2023281713A1 (ja) |
KR (1) | KR20240013211A (ja) |
CN (1) | CN117615668A (ja) |
WO (1) | WO2023281713A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002050722A (ja) * | 2000-08-01 | 2002-02-15 | Matsushita Electric Ind Co Ltd | 半導体パッケージおよびその応用装置 |
JP2007048879A (ja) * | 2005-08-09 | 2007-02-22 | Nec Corp | 電子装置 |
JP2012174518A (ja) * | 2011-02-22 | 2012-09-10 | Panasonic Corp | 点灯装置および、これを用いた照明器具 |
JP6833093B1 (ja) | 2020-07-09 | 2021-02-24 | 日本たばこ産業株式会社 | エアロゾル生成装置の電源ユニット、及びエアロゾル生成装置 |
-
2021
- 2021-07-08 JP JP2023532996A patent/JPWO2023281713A1/ja active Pending
- 2021-07-08 KR KR1020237044722A patent/KR20240013211A/ko unknown
- 2021-07-08 EP EP21949346.7A patent/EP4368037A1/en active Pending
- 2021-07-08 WO PCT/JP2021/025829 patent/WO2023281713A1/ja active Application Filing
- 2021-07-08 CN CN202180100296.2A patent/CN117615668A/zh active Pending
-
2024
- 2024-01-05 US US18/405,684 patent/US20240138488A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002050722A (ja) * | 2000-08-01 | 2002-02-15 | Matsushita Electric Ind Co Ltd | 半導体パッケージおよびその応用装置 |
JP2007048879A (ja) * | 2005-08-09 | 2007-02-22 | Nec Corp | 電子装置 |
JP2012174518A (ja) * | 2011-02-22 | 2012-09-10 | Panasonic Corp | 点灯装置および、これを用いた照明器具 |
JP6833093B1 (ja) | 2020-07-09 | 2021-02-24 | 日本たばこ産業株式会社 | エアロゾル生成装置の電源ユニット、及びエアロゾル生成装置 |
Also Published As
Publication number | Publication date |
---|---|
US20240138488A1 (en) | 2024-05-02 |
JPWO2023281713A1 (ja) | 2023-01-12 |
EP4368037A1 (en) | 2024-05-15 |
CN117615668A (zh) | 2024-02-27 |
KR20240013211A (ko) | 2024-01-30 |
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