WO2023274224A1 - Single board, cabinet, and data center - Google Patents

Single board, cabinet, and data center Download PDF

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Publication number
WO2023274224A1
WO2023274224A1 PCT/CN2022/101861 CN2022101861W WO2023274224A1 WO 2023274224 A1 WO2023274224 A1 WO 2023274224A1 CN 2022101861 W CN2022101861 W CN 2022101861W WO 2023274224 A1 WO2023274224 A1 WO 2023274224A1
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WO
WIPO (PCT)
Prior art keywords
pipeline
heat dissipation
evaporator
single board
condenser
Prior art date
Application number
PCT/CN2022/101861
Other languages
French (fr)
Chinese (zh)
Inventor
邹恒龙
闫涛
刘清颖
陈杰
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023274224A1 publication Critical patent/WO2023274224A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change

Definitions

  • the present application relates to the technical field of heat dissipation, and in particular to a single board, a cabinet and a data center.
  • the current popular heat dissipation technology for high-power chips generally uses heat pipes, VC or loop heat pipes (LTS) to collect the heat generated by the chip in the board, and then transfers it to the condenser on the board that is far away from the chip.
  • VC loop heat pipes
  • LTS loop heat pipes
  • the evaporator and the condenser are connected through a pipeline, and the entire loop heat pipe is evacuated and filled with cooling fluid.
  • the liquid working fluid The evaporator absorbs the heat of the chip, evaporates and absorbs heat to become gaseous, and then the gaseous working medium condenses in the condenser to release heat to the environment.
  • the condenser takes away the heat generated by the single-board chip through the convection effect with the ambient air.
  • this method is used for heat dissipation, due to the limitation of the space and layout of the board, the increase of the heat dissipation area is limited, and the improvement of heat dissipation capacity is also limited. With the further increase of chip power consumption, there is still a bottleneck in chip heat dissipation.
  • the application provides a single board, a cabinet and a data center, which are used to improve the heat dissipation effect of the single board.
  • a single board includes a board body, and the board body is used for carrying a chip.
  • the single board also includes an evaporator disposed on the board body, wherein the evaporator is used to dissipate heat from the chip, and the chip can be disposed on the evaporator during installation.
  • the veneer also includes a first heat dissipation pipeline embedded in the board body and used to transport working fluid.
  • the first heat dissipation pipeline includes a first pipeline and a second pipeline; the first pipeline and the second pipeline are connected to the input end and the output end of the evaporator respectively.
  • the first pipeline is connected to the input end of the evaporator; and at least the first pipeline is provided with a switching valve.
  • the quick-plug connection between the condenser and the evaporator is realized through the first quick-pull joint, and the condenser can be installed in the cabinet, so that it is not limited by the size of the single board, and on the one hand, it avoids the influence of the condenser
  • both the first pipeline and the second pipeline are provided with on-off valves.
  • the switch valve is an electromagnetic control valve; the single board further includes a control unit, and the control unit is used to control the opening and closing of the electromagnetic control valve.
  • the automatic control of the electromagnetic control valve is realized through the control unit.
  • control unit is a control circuit arranged on the board, and the control circuit controls the conduction of the electromagnetic control valve when the single board is electrically connected with the backplane of the cabinet. Pass.
  • the electromagnetic control valve can be controlled to open.
  • the veneer further includes a sensor for detecting the temperature of the heat source on the veneer; the control unit controls the electromagnetic control valve to open when the temperature detected by the sensor exceeds a set value .
  • the opening or closing of the solenoid control valve is controlled by temperature.
  • the electromagnetic control valve is a normally closed control valve, so that when the veneer is removed, the carried working fluid can be reduced.
  • the first pipeline is provided with a liquid accumulation cavity.
  • the working medium in the first heat dissipation pipe is prevented from flowing backward into the condenser through the provided liquid accumulation chamber.
  • the liquid accumulation chamber is located on a side of the on-off valve away from the evaporator. It is ensured that the working fluid will not flow back into the condenser.
  • the first pipeline, the second pipeline or the evaporator is provided with a liquid filling hole. Fill the working medium into the first heat dissipation pipe in the single board through the liquid filling hole.
  • the liquid-filled hole is also a vacuum hole. Vacuum is drawn to the first heat dissipation pipe through the liquid filling hole.
  • the evaporator is embedded in the board, so that the height of the chips can be reduced.
  • the first heat dissipation pipe is filled with working fluid, and the flow of the working fluid and the conversion between liquid and gas absorb the heat generated by the chip.
  • a cabinet in a second aspect, includes a cabinet body, a condenser disposed in the cabinet, and a second heat dissipation pipeline for transferring working fluid;
  • the second heat dissipation pipeline includes a third pipeline and a second heat dissipation pipeline.
  • Four pipelines; the third pipeline and the fourth pipeline are respectively connected to the input end and the output end of the condenser in one-to-one correspondence; the third pipeline and the fourth pipeline are away from one end of the condenser
  • a second quick-pull joint for cooperating with the first quick-pull joint is provided.
  • the quick-plug connection between the condenser and the evaporator is realized through the cooperation of the first quick-pull joint and the second quick-pull joint, and the condenser can be set in the cabinet, so that it is not limited by the size of the single board
  • the condenser is prevented from affecting the arrangement of components on the board.
  • there is sufficient space in the cabinet to install a condenser with a larger size and better cooling effect, thereby improving the heat dissipation effect on the board.
  • the third aspect provides a data center, which includes a cabinet and the above-mentioned single board; wherein, the first quick-disconnect joint and the second quick-disconnect joint are connected in one-to-one correspondence; the evaporator and the The condenser communicates with the first heat dissipation pipe and the second heat dissipation pipe to form a heat dissipation loop.
  • the heat dissipation effect on the single board is improved.
  • the quick-plug connection between the condenser and the evaporator is realized through the cooperation of the first quick-pull joint and the second quick-pull joint, and the condenser can be set in the cabinet, so that it is not limited by the size of the single board
  • the condenser is prevented from affecting the arrangement of components on the board.
  • there is sufficient space in the cabinet to install a condenser with a larger size and better cooling effect, thereby improving the heat dissipation effect on the board.
  • at least the on-off valve is set on the first pipeline to ensure that when the board is powered on or unplugged, the working fluid in the board remains basically the same.
  • FIG. 1 is a schematic structural diagram of a single board in the prior art
  • FIG. 2 is a schematic diagram of an application scenario of a single board provided in an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of a single board provided in an embodiment of the present application.
  • Figure 4 is a schematic diagram of the measured work quality of the single board under different states of the actual measurement of the heat dissipation loop
  • Fig. 5 is a schematic diagram of the effect of the working medium on the heat dissipation efficiency in the heat dissipation loop
  • FIG. 6 is a schematic structural diagram of another single board provided in the embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a cabinet provided in an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a data center provided by an embodiment of the present application.
  • the single board provided by the embodiment of this application can be applied to data communication equipment, server, and energy equipment, and is used to carry the single board in the above equipment.
  • ICT application technologies such as AR/VR, 5G, and cloud computing
  • the single board The device density and power are rising rapidly, the power dissipation of microelectronic components is getting larger and the package size is getting smaller and smaller, so the heat dissipation requirements for single boards are getting higher and higher.
  • a heat dissipation system is often arranged on the single board to dissipate heat from the chip, as shown in FIG. 1 .
  • the single board 1 is provided with an evaporator 3 attached to the chip, and the single board 1 is also provided with a condenser 2.
  • the evaporator 3 and the condenser 2 form a heat dissipation loop through pipes, and the heat generated by the chip passes through the evaporator 3 Working fluid absorption, the working fluid enters the condenser 2 through the pipeline to cool down, and then returns to the evaporator 3 to absorb the heat generated by the chip again.
  • the condenser 2 is affected by the size of the board 1, resulting in poor condensation effect of the condenser 2.
  • the condenser 2 will occupy the space on the board 1, affecting the layout of the device.
  • This embodiment of the present application provides a single board 1 for improving the heat dissipation effect of the single board 1 . It will be described in detail below in conjunction with specific drawings and embodiments.
  • FIG. 2 shows a scenario where the single board 10 provided by the embodiment of the present application is applied in a data center.
  • the data center includes a cabinet and a single board 10.
  • the single board 10 is inserted into the cabinet to realize the main functions of the data center.
  • the cabinet includes a cabinet body 20 and a backboard 22 disposed in the cabinet body 20 , and the backboard 22 is fixedly connected to the cabinet body 20 through buckles or threaded connectors (bolts or screws, etc.).
  • the single board 10 When the single board 10 is inserted into the cabinet, the single board 10 and the backplane 22 are electrically connected through the connector.
  • a heat dissipation loop composed of the evaporator 11 and the condenser 21 is used to dissipate heat from the chips on the single board 10 .
  • the evaporator 11 is arranged on the single board 10
  • the condenser 21 is arranged in the cabinet
  • the condenser 21 and the evaporator 11 are connected through pipelines.
  • the electronic devices on the single board 10 are radiated heat through the heat dissipation loop formed by the condenser 21 and the evaporator 11 .
  • a working fluid flows in the heat dissipation loop, and when the working fluid flows through the evaporator 11 below the electronic device, it absorbs heat generated by the electronic device, thereby realizing heat dissipation for the electronic device.
  • the electronic devices include but are not limited to chips, capacitors, inductors and other electronic devices that generate high heat. In FIG. 1 , the positions of the electronic devices are exemplified by chips.
  • Working fluid refers to the medium used in various machines to realize the conversion of heat energy and other forms of energy, also known as thermodynamic working fluid.
  • the working fluid is generally a fluid (gas and liquid).
  • the working fluid may be common working fluids such as kerosene and water.
  • the working medium When the working medium is working, there are two states of liquid and gas.
  • the working fluid flows through the evaporator 11, the working fluid changes from a liquid state to a gaseous state (evaporation) after absorbing the heat transferred by the electronic device; Liquid (condensed).
  • the working fluid is constantly switching between liquid and gaseous states, and takes away the heat generated by the electronic devices to dissipate heat from the electronic devices.
  • the condenser 21 is arranged in a relatively large space in the cabinet, so a larger-sized condenser 21 can be arranged. As the size of the condenser 21 increases, its heat dissipation effect also increases, thereby increasing The heat dissipation effect on the single board 10 .
  • the condenser 21 and the evaporator 11 are connected by detachable pipes.
  • the detachable pipes are used to realize the synchronization between the evaporator 11 and the condenser 21 Perform plugging and unplugging.
  • the part of the pipe connected to the evaporator 11 is named the first heat dissipation pipe 12, and the part of the pipe connected to the condenser 21 is named the second heat dissipation pipe 23.
  • the first The heat dissipation pipe 12 is connected to the second heat dissipation pipe 23 , and the evaporator 11 and the condenser 21 form a heat dissipation loop through the first heat dissipation pipe 12 and the second heat dissipation pipe 23 .
  • the structure of the single board 10 and the cabinet will be described respectively below.
  • FIG. 3 shows a single board 10 provided by an embodiment of the present application.
  • the single board 10 includes a board body 13 .
  • the electronic device may be an active device or a passive device, which is not specifically limited in this application, such as a chip, a capacitor, an inductor, and the like.
  • the single board 10 also includes an evaporator 11 and a first heat dissipation pipe 12 connected to the evaporator 11 .
  • the evaporator 11 is arranged on the plate body 13 , and the specific arrangement method can be directly fixed on the surface of the plate body 13 , completely embedded in the plate body 13 or half embedded in the plate body 13 .
  • the veneer 10 is provided with a groove, the evaporator 11 is fixed in the groove, and a surface of the evaporator 11 is exposed outside the groove.
  • the surface of the evaporator 11 exposed on the board body 13 can be used to carry electronic devices, such as chips.
  • the chip and the evaporator 11 are directly bonded to improve the heat exchange effect between the chip and the evaporator 11 .
  • the evaporator 11 may also be directly arranged on the surface of the plate body 13 , or be completely embedded in the plate body 13 without being exposed, which will not be illustrated one by one here.
  • the first heat dissipation pipe 12 is divided into a first pipe 121 and a second pipe 122 .
  • the first pipeline 121 and the second pipeline 122 are connected to the input end and the output end of the evaporator 11 in one-to-one correspondence.
  • the first pipe 121 is connected to the input end of the evaporator 11
  • the second pipe 122 is connected to the output end of the evaporator 11 .
  • the working medium flowing in the first pipeline 121 is in liquid state, and the first pipeline 121 may also be called a liquid pipe;
  • the working medium flowing in the second pipeline 122 is in a gaseous state, and the second pipeline 122 may also be called a gas pipe.
  • first pipeline 121 can also be connected to the output end of the evaporator 11, and the second pipeline 122 is connected to the input end of the evaporator 11.
  • first pipeline 121 is used as the liquid pipe
  • second pipeline 122 is used as the liquid pipe.
  • 122 is the trachea as an example for description.
  • the first heat dissipation pipe 12 When the first heat dissipation pipe 12 is provided, the first heat dissipation pipe 12 is embedded in the single board 10 . However, it should be understood that besides the above-mentioned embedding manner, the first heat dissipation pipe 12 may also adopt other manners, such as being half-embedded or arranged on the surface of the plate body 13 , which will not be listed here.
  • the material of the first heat dissipation pipe 12 is not limited, and it may be a copper pipe, a stainless steel hose, an aluminum pipe, or the like.
  • first quick-disconnect joints 15 In order to facilitate the corresponding connection with the second heat dissipation pipe, the ends of the first pipe 121 and the second pipe 122 away from the evaporator 11 are respectively provided with first quick-disconnect joints 15 .
  • the first quick-disconnect joint 15 has a sealing function. When the first heat dissipation pipe 12 is separated from the second heat dissipation pipe, the first quick-disconnect joint 15 can seal the first pipe 121 and the second pipe 122, thereby preventing the first heat dissipation pipe 12 from leakage of working fluid.
  • the measured work quality of the single board under different states of the heat dissipation loop there is a large difference in the work quality of the evaporation terminal when the power is not turned on and the power is running at full power.
  • the liquid mass at the evaporation end is 211.6g.
  • the power consumption of the single board is 100W
  • the liquid working mass at the evaporating end is 161.8g
  • the cooling working medium is reduced by 49.8g.
  • the work quality of the evaporation end will gradually decrease, especially the work quality of the board with power consumption less than 100W decreases rapidly.
  • Too little or too much working fluid will reduce the heat transfer efficiency of the heat dissipation loop. As shown in Figure 5, too much working fluid will increase the evaporation thermal resistance and condensation thermal resistance, and the heat dissipation capacity of the chips on the board will be affected. Limit, there will be a situation where the chip operating temperature is too high. Too little working fluid will lead to "dry burning" phenomenon at the evaporation end of the board, and the chip temperature will rise sharply, resulting in an increased possibility of over-temperature damage. As shown in Figure 5, when the filling liquid (liquid working fluid) is low At 40%, the chip temperature soars sharply.
  • the board provided in the embodiment of the present application is provided with an on-off valve 14 on the first pipe 121 or the second pipe 122 to control the closing of the first pipe 121 or the second pipe 122 .
  • the first pipeline 121 is provided with an on-off valve 14 for controlling the conduction of the first pipeline 121 .
  • on-off valve 14 can adopt normally open electromagnetic valve (power-on closes, power-off promptly disconnects), also can adopt temperature valve (certain temperature Closed at lower temperature, disconnected at a certain temperature), it can also be other control valves that can achieve the same purpose.
  • the switching valve 14 is used to control the working quality of the evaporating end to keep stable, so as to ensure that the cooling capacity of the entire heat dissipation loop is kept constant after the boards are plugged and swapped at different temperatures.
  • the on-off valve 14 may be an electromagnetic valve, a memory alloy temperature-controlled valve, and other valves capable of controlling the distribution of working fluid.
  • the on-off valve 14 When setting the on-off valve 14, it can be set on different pipelines.
  • the on-off valve 14 is disposed on the first pipe 121 and located at an end of the first pipe 121 close to the first quick-disconnect joint 15 , so that the on-off valve 14 can cooperate with the first quick-disconnect joint 15 to seal the working fluid.
  • the on-off valve 14 can also be arranged in other positions of the first pipeline 121, which is not specifically limited in this embodiment of the present application.
  • on-off valves 14 are provided on both the first pipeline 121 and the second pipeline 122 .
  • the liquid working fluid in the condenser may flow back into the board through the first pipeline 121 , and a small part of the liquid working fluid may also flow back into the board through the second pipeline 122 .
  • the on-off valve 14 when setting the on-off valve 14, the on-off valve 14 is set on the first pipeline 121 and the second pipeline 122, so that after the veneer is powered off, the two The switch valve 14 closes the first pipeline and the second pipeline respectively, so as to prevent the liquid working medium in the condenser from flowing into the single plate. Ensure that the quality of the liquid working fluid in the board remains basically the same when the board is powered on or off, so as to avoid affecting the quality of the working fluid in the entire heat dissipation loop when the board is plugged in or removed.
  • the switch valve 14 can be controlled by an electric signal or a temperature signal, which will be described respectively below.
  • the on-off valve 14 When the on-off valve 14 is controlled by an electric signal, the on-off valve 14 can be an electromagnetic control valve, and the on-off valve 14 can be controlled by a control unit provided on the single board 10 . If the switching valve 14 is an electromagnetic control valve, the control unit can be used to control the opening and closing of the electromagnetic control valve.
  • the control unit When the single board 10 is inserted into the backplane, the single board 10 is powered on, and the control unit detects the signal that the single board 10 is powered on. Control the electromagnetic control valve to open; when the single board 10 is unplugged from the backplane, the single board 10 is powered off, and the control unit controls the electromagnetic control valve to close according to the detected signal that the single board 10 is powered off.
  • the electromagnetic control valve adopts a normally closed control valve, so that after the single board 10 is powered off, it can maintain a normally closed state, thereby cooperating with the first quick-pull joint 15 at the port of the first pipeline 121 to seal the inside of the pipeline. working medium.
  • the control unit may be a control circuit arranged on the board body 13, and the control circuit controls the conduction of the electromagnetic control valve when the single board 10 is electrically connected with the backplane of the cabinet.
  • the control unit may also adopt common control units capable of controlling the electromagnetic control valve such as PLC and relay.
  • the on-off valve 14 is kept normally closed when the board 10 is powered off, and is opened after the board 10 is powered on (correctly inserted into the machine frame), and can be opened in real time, or opened after a delay, for example After 10ms, 15ms, 20ms.
  • the switch valve 14 can be a temperature valve, such as a memory alloy temperature control valve.
  • the control part (memory alloy) in the memory alloy temperature control valve will shrink, driving the memory alloy temperature control valve to move, thereby opening the valve.
  • the control part (memory alloy) in the memory alloy temperature control valve will shrink, driving the memory alloy temperature control valve to act, thereby opening the valve.
  • the switching valve 14 may also be an electromagnetic control valve, and correspondingly, the single board 10 further includes a sensor and a control unit.
  • the sensor is used to detect the temperature of the heat source (chip)
  • the control unit is used to control the electromagnetic control valve to open when the temperature detected by the sensor exceeds the set value.
  • the on-off valve 14 is opened when the temperature of the chip is greater than 80 degrees (T1 threshold), and the on-off valve 14 is closed when the temperature of the chip is lower than 60 degrees (T2 threshold).
  • the on-off valve 14 can be controlled individually by temperature control and electric control, or by a combination of temperature control and electric control, which is not specifically limited in this embodiment of the application.
  • the veneer 10 When the veneer 10 is inserted between the back plates, the veneer 10 is filled with working fluid.
  • a liquid filling hole 16 is also provided on the veneer 10, through which the The liquid filling hole 16 fills the working medium into the first pipe 121 , the second pipe 122 and the evaporator 11 .
  • the liquid filling hole 16 may be disposed on the first pipe 121 , the second pipe 122 or the evaporator 11 .
  • the liquid filling hole 16 is arranged in the second pipe 122 , but it should be understood that in the embodiment of the present application, the liquid filling hole 16 can be arranged in different positions according to actual needs, which is not specifically limited in the embodiment of the present application.
  • the liquid filling hole 16 is also a vacuum hole for vacuuming the pipeline on the single board 10 .
  • a vacuum pump is connected to the filling hole 16 for vacuuming, and then the filling pump fills the pipeline with working fluid through the filling hole 16 .
  • the amount of liquid filled with the working medium in the single board 10 is based on the content of the working medium in the first heat dissipation pipe 12 when the single board 10 is in a working state.
  • the working weight in the single board 10 is 100g-180g
  • the working weight filled in the pipeline in the single board 10 is between 100g-180g, such as 100g, 130g, 150g and other different amounts.
  • the switch valve 14 is closed, and the liquid working medium of the condenser cannot flow into the pipeline of the veneer 10, so that the working mass in the veneer 10 remains basically unchanged, thereby ensuring that the veneer 10
  • the amount of working fluid in the heat dissipation loop formed by the evaporator 11 and the condenser changes too much.
  • the working state of the veneer 10 will be described in detail.
  • the electromagnetic valve is opened, and the evaporator 11 is connected with the condenser to form a heat dissipation loop.
  • the chip is electrically heated, and the liquid working medium becomes gaseous after evaporating and absorbing heat in the evaporator 11, and enters the condenser through the second pipeline 122, and the working medium condenses and releases heat in the condenser to become liquid, and the liquid working medium passes through the first pipeline 121 Return to the evaporator 11, thereby forming a circulation loop to realize the transfer of heat.
  • the solenoid valve When the single board 10 is powered off, the solenoid valve is quickly closed and disconnected, the heat dissipation loop is disconnected, and the amount of working fluid in the entire loop remains unchanged. It can be seen from the above description that no matter whether the single board 10 is plugged in when the power is turned on (working state), or the single board 10 is plugged and pulled out when the power is turned off (non-working state), the quality of work on the corresponding single board 10 is basically the same, so that the Maintenance and replacement of a new single board 10 or exchange of single boards 10 in different slots will not lead to a large change in the working quality of the loop, thereby maintaining the stability of the heat dissipation capability.
  • the main heat source device on the single board 10 has two chips.
  • two evaporators 11 are installed on the single board 10, and the two evaporators 11 are respectively in thermal contact with the two in one-to-one correspondence.
  • the number of heat sources is not limited to two as shown in FIG. 3 , and may be three, four, etc. different numbers.
  • FIG. 6 shows a modified structure based on the veneer 10 shown in FIG. 3
  • part numbers in FIG. 6 may refer to the same numbers in FIG. 3 .
  • a liquid accumulation cavity 17 is provided on the first pipe 121 .
  • the liquid accumulation chamber 17 acts as a buffer and stabilizes the distribution of the working fluid, which can prevent the part of the liquid working medium in the first pipeline 121 from flowing backward into the condenser due to the sudden increase in the pressure in the evaporator 11 when the board 10 is first powered on and started. , leading to the problem of low heat exchange efficiency of the condenser.
  • the liquid accumulation chamber 17 is located on the side of the on-off valve 14 away from the evaporator 11 , that is, the liquid accumulation chamber 17 is located between the first quick-disconnect joint 15 of the first pipeline 121 and the on-off valve 14 .
  • the liquid accumulation cavity 17 can also store too much working fluid, so as to prevent too much working fluid from affecting the heat dissipation effect of the entire heat dissipation loop.
  • the actual measurement is carried out on the veneer 10 with the liquid accumulation chamber 17 and without the liquid accumulation chamber.
  • the subcooling degree of the veneer 10 with the liquid accumulation cavity 17 is 2-3° C. better than that of the single plate 10 without the liquid accumulation cavity.
  • the superheat degree of the veneer 10 with the liquid accumulation cavity 17 is 2.8°C higher than that of the single plate 10 without the liquid accumulation cavity 17 .
  • the embodiment of the present application also provides a cabinet, which includes a cabinet body 10 , a condenser 21 disposed in the cabinet body 10 , and a second heat dissipation pipe 23 for transferring working fluid.
  • the second heat dissipation pipeline 23 includes a third pipeline 231 and a fourth pipeline 232; the third pipeline 231 and the fourth pipeline 232 are respectively connected to the input end and the output end of the condenser 21 in one-to-one correspondence; exemplary, the third pipeline 231 is connected to the input end of the condenser 21, and the fourth pipeline 232 is connected to the output end of the condenser 21; the third pipeline 231 can also be connected to the output end of the condenser 21, and the fourth pipeline 232 is connected to the input end of the condenser 21 connect.
  • the single board 10 is connected with the second heat dissipation pipe 23 and the first heat dissipation pipe.
  • the ends of the third pipeline 231 and the fourth pipeline 232 away from the condenser 21 are respectively provided with second quick-pull joints 25 for matching with the first quick-pull joints.
  • the single board 10 is arranged in the cabinet, the single board 10 is plugged and connected to the backplane 22 .
  • the first quick-disconnect connectors and the second quick-disconnect connectors 25 are connected one by one, and the evaporator and the condenser 21 are connected through the first heat dissipation pipe and the second heat dissipation pipe 23 to form a heat dissipation loop.
  • the condenser 21 may have tube-fin type or parallel flow heat exchange fins.
  • the pipeline material in the condenser 21 is not limited, it can be copper tube, stainless steel hose and so on.
  • a fan group 24 is also arranged in the cabinet, and the fan group 24 is used to supply air to the condenser 21 to improve the condensation effect of the condenser 21 .
  • the air provided by the fan group 24 can flow through the condenser 21 to take away the heat of the working fluid so that the working fluid changes from a gaseous state to a liquid state.
  • an on-off valve 26 can also be set on the second heat dissipation pipeline 23.
  • the on-off valve 26 is set on the third pipeline 231, so as to prevent the internal cooling of the condenser 21 when the single plate is cut off.
  • the liquid working fluid flows into the veneer.
  • the control method of the on-off valve 26 can refer to the control method of the on-off valve on the single board, and will not be repeated here.
  • a corresponding condenser 21 is provided with the single board 10 so that when each single board 10 is mated with the backplane 22, A corresponding heat dissipation loop can be formed for heat dissipation.
  • one condenser 21 may also be provided, but one condenser 21 is provided with multiple internal pipes, and the multiple internal pipes are in one-to-one correspondence with multiple single boards 10 to form a corresponding heat dissipation loop.
  • an embodiment of the present application further provides a data center, where the data center includes a cabinet and a board inserted into the cabinet.
  • Part numbers in FIG. 8 can refer to the same numbers in FIG. 3 and FIG. 7 .
  • the single board 10 includes two chip heat sources, and the number of corresponding evaporators 11 is also two, and the chips and the evaporators 11 form thermal contacts in one-to-one correspondence.
  • a condenser 21 and a fan group 24 are arranged in the cabinet. 21 and the evaporator 11 are connected by a sealed pipeline, on which an on-off valve 14 is arranged, and a quick-connect device (the first quick-pull joint and the second quick-pull joint) is used between the veneer 10 and the remote condenser 21 Forming a sealed connection, the quick-connection device can realize quick installation or removal of the single board 10 and the condenser 21 .
  • the single board 10 that undertakes business functions in the whole system needs to be plugged, installed and maintained.
  • the evaporation end of the single board 10 and the condenser 21 can be separated. Plugging and unplugging overcomes the defect that the external condenser 21 of the single board 10 cannot be integrated with the single board 10 due to space and reliability limitations.
  • an on-off valve 14 is provided on the pipeline at the evaporating end (or condensing end), and the on-off control of the on-off valve 14 can overcome the defect that the mass distribution in the loop heat pipe changes greatly when the single board 10 is inserted and removed in different scenarios.
  • the heat dissipation loop is divided into an evaporation end and a condensation end.
  • the entire heat dissipation loop is connected into one.
  • the heat dissipation loop can work normally. ;
  • the entire heat dissipation loop is divided into two parts, the evaporation end and the condensation end.
  • An on-off valve 14 is set on the entire heat dissipation loop (the on-off valve is set on a single board as an example in Fig. 8). on and off.
  • the single board 10 when the cabinet is powered on, the single board 10 is inserted into the cabinet, the first quick-disconnect connector is connected to the first quick-disconnect connector to form an integrated heat dissipation loop, and the connector of the single board 10 is inserted into the connector of the backplane 22 to realize Electrically connected, and the board is powered on.
  • the on-off valve 14 on the heat dissipation loop is energized and conducted, and the heat dissipation loop works normally.
  • the single board 10 is pulled out, the first quick-pull joint is disconnected from the first quick-pull joint, and the heat dissipation loop is separated.
  • the on-off valve 14 on the road is powered off, and the distribution state of the working fluid in the heat dissipation loop is consistent with the normal connection and power-on working state.
  • the cabinet is in a power-off state, when the board 10 is inserted into the cabinet, the first quick-pull joint and the second quick-pull joint are connected to form an integrated heat dissipation loop, and the connector of the single board 10 is inserted into the connection of the backplane 22. switch to achieve electrical connection, but the board is not powered on.
  • the on-off valve 14 on the heat dissipation loop is still in the power-off and disconnected state, and the distribution of the working fluid in the heat dissipation loop is still consistent with the disconnected state before the insertion of the single board 10, that is, it is also consistent with the normal connection and power-on working state.
  • the condenser 21 by extending the condenser 21 to an area outside the board 10, the heat dissipation area can be effectively expanded without being limited by the space and layout of the board 10, thereby increasing the heat dissipation capacity. And by setting a quick-drawing device on the pipeline of the heat dissipation loop, the problem of quick connection and disconnection of the pipeline is solved.
  • the condenser 21 can be arranged in an area other than the board 10, which can avoid the problem that the heat dissipation capacity of the condenser 21 is limited by the space and layout of the board 10, and at the same time reduce the occupied space of the board 10 and improve the device layout of the board. space.
  • the condenser 21 can effectively adjust the size and heat dissipation area of the condenser 21 according to the chip power consumption and heat dissipation requirements, so as to achieve a more flexible heat dissipation effect.
  • the total amount of cooling fluid in the entire heat dissipation loop should be kept as consistent as possible to ensure that the entire heat dissipation loop The cooling capacity of the circuit is consistent.

Abstract

Provided in the present application are a single board, a cabinet and a data center. The single board comprises a board body that is used for carrying a chip. The single board further comprises an evaporator that is arranged on the board body and a first heat dissipation pipe that is embedded in the board body and used for conveying a working medium, wherein the first heat dissipation pipe comprises a first pipe and a second pipe, which are correspondingly connected to an input end and an output end of the evaporator on a one-to-one basis; the ends of the first pipe and the second pipe that are away from the evaporator are each provided with a first quick-unplug connector; the first pipe is connected to the input end of the evaporator; and at least the first pipe is provided with a switch valve. The quick plugging and unplugging connection between a condenser and the evaporator is achieved by means of the first quick-unplug connector, and the condenser can be arranged in the cabinet, thereby improving the heat dissipation effect of the single board. In addition, at least the first pipe is provided with a switch valve, which ensures that the working medium in the single board is consistent when the single board is unplugged in a power-on or power-off state.

Description

一种单板、机柜及数据中心A single board, cabinet and data center
相关申请的交叉引用Cross References to Related Applications
本申请要求在2021年06月30日提交中国专利局、申请号为202110738563.0、申请名称为“一种单板、机柜及数据中心”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with the application number 202110738563.0 and the application name "A Single Board, Cabinet and Data Center" submitted to the China Patent Office on June 30, 2021, the entire contents of which are incorporated herein by reference Applying.
技术领域technical field
本申请涉及到散热技术领域，尤其涉及到一种单板、机柜及数据中心。The present application relates to the technical field of heat dissipation, and in particular to a single board, a cabinet and a data center.
背景技术Background technique
随着通信和计算设备性能要求的不断提升，半导体芯片技术发展，芯片性能越来越强大，同时芯片采用多核堆叠封装方式，导致芯片热密度以及通信设备单板热密度越来越高。在***风冷散热的条件下，在单板有限的散热空间内已经很难解决芯片散热问题，如何将热量有效传递到更大空间散热成为通信设备架构解决方案的有效路径。With the continuous improvement of the performance requirements of communication and computing equipment, the development of semiconductor chip technology, the performance of the chip is becoming more and more powerful. Under the condition of system air-cooling and heat dissipation, it is difficult to solve the problem of chip heat dissipation in the limited heat dissipation space of the single board. How to effectively transfer heat to a larger space for heat dissipation has become an effective path for communication equipment architecture solutions.
当前的比较流行的大功耗芯片散热技术，一般通过热管、VC或者环路热管(LTS)在单板内收集芯片工作产生的热量，拉远传递到单板上距离芯片较远处的冷凝器进行散热，如在单板内的一个空间安装冷凝器，在芯片下方设置蒸发器，蒸发器和冷凝器通过管路连接，整个环路热管抽真空后填充散热工质，工作时，液态工质在蒸发器吸收芯片的热量，蒸发吸热变成气态，然后气态工质在冷凝器内冷凝向环境放出热量，冷凝器通过与环境空气的对流效应，带走单板芯片工作产生的热量。但是在采用这种方式散热时，受单板内空间和布局的限制，散热面积增加有限，散热能力提升也有限。随着芯片功耗进一步增大，芯片散热仍然存在瓶颈。The current popular heat dissipation technology for high-power chips generally uses heat pipes, VC or loop heat pipes (LTS) to collect the heat generated by the chip in the board, and then transfers it to the condenser on the board that is far away from the chip. For heat dissipation, such as installing a condenser in a space in the single board, and setting an evaporator under the chip, the evaporator and the condenser are connected through a pipeline, and the entire loop heat pipe is evacuated and filled with cooling fluid. When working, the liquid working fluid The evaporator absorbs the heat of the chip, evaporates and absorbs heat to become gaseous, and then the gaseous working medium condenses in the condenser to release heat to the environment. The condenser takes away the heat generated by the single-board chip through the convection effect with the ambient air. However, when this method is used for heat dissipation, due to the limitation of the space and layout of the board, the increase of the heat dissipation area is limited, and the improvement of heat dissipation capacity is also limited. With the further increase of chip power consumption, there is still a bottleneck in chip heat dissipation.
发明内容Contents of the invention
本申请提供了一种单板、机柜及数据中心，用以改善单板的散热效果。The application provides a single board, a cabinet and a data center, which are used to improve the heat dissipation effect of the single board.
第一方面，提供了一种单板，该单板包括板体，该板体用于承载芯片。单板还包括设置在板体的蒸发器，其中，蒸发器用于对芯片散热，在设置时芯片可设置在蒸发器上。单板还包括埋设在板体内并用于输送工质的第一散热管道，第一散热管道包括第一管道和第二管道；第一管道和第二管道分别与蒸发器的输入端和输出端一一对应连接；且第一管道和第二管道远离所述蒸发器的一端分别设置有第一快拔接头。所述第一管道与所述蒸发器的输入端连接；且至少所述第一管道上设置有开关阀。在采用上述结构时，通过第一快拔接头实现冷凝器和蒸发器之间的快速插拔连接，冷凝器可设置在机柜内，从而不受单板的尺寸限制，一方面避免了冷凝器影响到单板上器件的排布，另一方面机柜内有充足的空间设置较大尺寸、制冷效果更好的冷凝器，从而可提高对单板的散热效果；另外，通过至少在第一管道上设置开关阀，保证单板在上电或者断电状态下拔下时，单板内的工质基本保持一致。According to a first aspect, a single board is provided, and the single board includes a board body, and the board body is used for carrying a chip. The single board also includes an evaporator disposed on the board body, wherein the evaporator is used to dissipate heat from the chip, and the chip can be disposed on the evaporator during installation. The veneer also includes a first heat dissipation pipeline embedded in the board body and used to transport working fluid. The first heat dissipation pipeline includes a first pipeline and a second pipeline; the first pipeline and the second pipeline are connected to the input end and the output end of the evaporator respectively. a corresponding connection; and the ends of the first pipeline and the second pipeline away from the evaporator are respectively provided with first quick-disconnect joints. The first pipeline is connected to the input end of the evaporator; and at least the first pipeline is provided with a switching valve. When the above structure is adopted, the quick-plug connection between the condenser and the evaporator is realized through the first quick-pull joint, and the condenser can be installed in the cabinet, so that it is not limited by the size of the single board, and on the one hand, it avoids the influence of the condenser On the other hand, there is enough space in the cabinet to install a condenser with a larger size and better cooling effect, so as to improve the heat dissipation effect on the board; in addition, through at least the first pipeline Set the on-off valve to ensure that the working fluid in the board remains basically the same when the board is powered on or unplugged.
在一个具体的可实施方案中，所述第一管道和所述第二管道均设置有开关阀。通过在 第一管道和第二管道分别设置开关阀，保证单板在上电或者断电状态下拔下时，单板内的工质基本保持一致。In a specific embodiment, both the first pipeline and the second pipeline are provided with on-off valves. By setting on-off valves in the first pipeline and the second pipeline respectively, it is ensured that when the board is powered on or unplugged, the working medium in the board remains basically the same.
在一个具体的可实施方案中，所述开关阀为电磁控制阀；所述单板还包括控制单元，所述控制单元用于控制所述电磁控制阀开闭。通过控制单元实现对电磁控制阀的自动控制。In a specific implementation, the switch valve is an electromagnetic control valve; the single board further includes a control unit, and the control unit is used to control the opening and closing of the electromagnetic control valve. The automatic control of the electromagnetic control valve is realized through the control unit.
在一个具体的可实施方案中，所述控制单元为设置在所述板体上的控制电路，所述控制电路在所述单板与机柜的背板导电连通时，控制所述电磁控制阀导通。在单板与背板连接时，即可控制电磁控制阀打开。In a specific embodiment, the control unit is a control circuit arranged on the board, and the control circuit controls the conduction of the electromagnetic control valve when the single board is electrically connected with the backplane of the cabinet. Pass. When the single board is connected with the back board, the electromagnetic control valve can be controlled to open.
在一个具体的可实施方案中，所述单板还包括用于检测单板上热源温度的传感器；所述控制单元在所述传感器检测的温度超过设定值时，控制所述电磁控制阀打开。通过温度控制电磁控制阀的打开或关闭。In a specific implementation, the veneer further includes a sensor for detecting the temperature of the heat source on the veneer; the control unit controls the electromagnetic control valve to open when the temperature detected by the sensor exceeds a set value . The opening or closing of the solenoid control valve is controlled by temperature.
在一个具体的可实施方案中，电磁控制阀为常闭控制阀，使得单板在取下时，可以减少携带的工质。In a specific implementation, the electromagnetic control valve is a normally closed control valve, so that when the veneer is removed, the carried working fluid can be reduced.
在一个具体的可实施方案中，所述第一管道上设置有积液腔。通过设置的积液腔避免第一散热管道与冷凝器连接时，第一散热管道内的工质倒流入冷凝器中。In a specific embodiment, the first pipeline is provided with a liquid accumulation cavity. When the first heat dissipation pipe is connected to the condenser, the working medium in the first heat dissipation pipe is prevented from flowing backward into the condenser through the provided liquid accumulation chamber.
在一个具体的可实施方案中，所述积液腔位于所述开关阀远离所述蒸发器的一侧。保证了工质不会倒流入到冷凝器中。In a specific embodiment, the liquid accumulation chamber is located on a side of the on-off valve away from the evaporator. It is ensured that the working fluid will not flow back into the condenser.
在一个具体的可实施方案中，所述第一管道、所述第二管道或所述蒸发器上设置有充液孔。通过充液孔向单板内的第一散热管道填充工质。In a specific embodiment, the first pipeline, the second pipeline or the evaporator is provided with a liquid filling hole. Fill the working medium into the first heat dissipation pipe in the single board through the liquid filling hole.
在一个具体的可实施方案中，所述充液孔也为抽真空孔。通过该充液孔对第一散热管道抽真空。In a specific embodiment, the liquid-filled hole is also a vacuum hole. Vacuum is drawn to the first heat dissipation pipe through the liquid filling hole.
在一个具体的可实施方案中，所述蒸发器的个数为多个，且所述多个蒸发器并联。实现对不同芯片的散热。In a specific embodiment, there are multiple evaporators, and the multiple evaporators are connected in parallel. Realize the heat dissipation of different chips.
在一个具体的可实施方案中，蒸发器埋设在板体内，从而可降低芯片的设置高度。In a specific implementation, the evaporator is embedded in the board, so that the height of the chips can be reduced.
在一个具体的可实施方案中，第一散热管道内填充有工质，通过该工质的流动，以及在液态和气态的转换吸收芯片产生的热量。In a specific embodiment, the first heat dissipation pipe is filled with working fluid, and the flow of the working fluid and the conversion between liquid and gas absorb the heat generated by the chip.
第二方面，提供了一种机柜，该机柜包括柜体，设置在所述柜体内的冷凝器，以及用于传输工质的第二散热管道；所述第二散热管道包括第三管道和第四管道；所述第三管道和所述第四管道分别与所述冷凝器的输入端和输出端一一对应连接；所述第三管道和所述第四管道远离所述冷凝器的一端分别设置有用于与第一快拔接头配合的第二快拔接头。在采用上述结构时，通过第一快拔接头和第二快拔接头的配合实现冷凝器和蒸发器之间的快速插拔连接，冷凝器可设置在机柜内，从而不受单板的尺寸限制，一方面避免了冷凝器影响到单板上器件的排布，另一方面机柜内有充足的空间设置较大尺寸、制冷效果更好的冷凝器，从而可提高对单板的散热效果。In a second aspect, a cabinet is provided, the cabinet includes a cabinet body, a condenser disposed in the cabinet, and a second heat dissipation pipeline for transferring working fluid; the second heat dissipation pipeline includes a third pipeline and a second heat dissipation pipeline. Four pipelines; the third pipeline and the fourth pipeline are respectively connected to the input end and the output end of the condenser in one-to-one correspondence; the third pipeline and the fourth pipeline are away from one end of the condenser A second quick-pull joint for cooperating with the first quick-pull joint is provided. When the above-mentioned structure is adopted, the quick-plug connection between the condenser and the evaporator is realized through the cooperation of the first quick-pull joint and the second quick-pull joint, and the condenser can be set in the cabinet, so that it is not limited by the size of the single board On the one hand, the condenser is prevented from affecting the arrangement of components on the board. On the other hand, there is sufficient space in the cabinet to install a condenser with a larger size and better cooling effect, thereby improving the heat dissipation effect on the board.
第三方面提供了一种数据中心，该数据中心包括机柜和上述的单板；其中，所述第一快拔接头和所述第二快拔接头一一对应连接；所述蒸发器和所述冷凝器通过所述第一散热管道和第二散热管道连通形成散热环路。提高了对单板的散热效果。在采用上述结构时，通过第一快拔接头和第二快拔接头的配合实现冷凝器和蒸发器之间的快速插拔连接，冷凝器可设置在机柜内，从而不受单板的尺寸限制，一方面避免了冷凝器影响到单板上器件的排布，另一方面机柜内有充足的空间设置较大尺寸、制冷效果更好的冷凝器，从而可提高对单板的散热效果。另外，通过至少在第一管道上设置开关阀，保证单板在上电或者断电 状态下拔下时，单板内的工质基本保持一致。The third aspect provides a data center, which includes a cabinet and the above-mentioned single board; wherein, the first quick-disconnect joint and the second quick-disconnect joint are connected in one-to-one correspondence; the evaporator and the The condenser communicates with the first heat dissipation pipe and the second heat dissipation pipe to form a heat dissipation loop. The heat dissipation effect on the single board is improved. When the above-mentioned structure is adopted, the quick-plug connection between the condenser and the evaporator is realized through the cooperation of the first quick-pull joint and the second quick-pull joint, and the condenser can be set in the cabinet, so that it is not limited by the size of the single board On the one hand, the condenser is prevented from affecting the arrangement of components on the board. On the other hand, there is sufficient space in the cabinet to install a condenser with a larger size and better cooling effect, thereby improving the heat dissipation effect on the board. In addition, at least the on-off valve is set on the first pipeline to ensure that when the board is powered on or unplugged, the working fluid in the board remains basically the same.
附图说明Description of drawings
图1为现有技术中单板的结构示意图；FIG. 1 is a schematic structural diagram of a single board in the prior art;
图2为本申请实施例提供的单板的应用场景示意图；FIG. 2 is a schematic diagram of an application scenario of a single board provided in an embodiment of the present application;
图3为本申请实施例提供的单板的结构示意图；FIG. 3 is a schematic structural diagram of a single board provided in an embodiment of the present application;
图4为散热环路实测不同状态下的单板实测工质量示意图；Figure 4 is a schematic diagram of the measured work quality of the single board under different states of the actual measurement of the heat dissipation loop;
图5为散热环路中工质对散热效率影响的示意图；Fig. 5 is a schematic diagram of the effect of the working medium on the heat dissipation efficiency in the heat dissipation loop;
图6为本申请实施例提供的另一单板的结构示意图；FIG. 6 is a schematic structural diagram of another single board provided in the embodiment of the present application;
图7为本申请实施例提供的机柜的结构示意图；FIG. 7 is a schematic structural diagram of a cabinet provided in an embodiment of the present application;
图8为本申请实施例提供的数据中心的机构示意图。FIG. 8 is a schematic structural diagram of a data center provided by an embodiment of the present application.
具体实施方式detailed description
本申请实施例提供的单板可应用于数通设备、服务器、能源设备，用于承载上述设备中的单板，而随着AR/VR、5G、云计算等ICT应用技术推广，单板上器件密度和功率快速上升，微电子元件耗散功率越来越大而封装尺寸越来越小，因此对单板的散热要求越来越高。现有技术中的单板为提高散热效率，往往在单板上设置散热***对芯片进行散热，如图1所示。单板1上设置有与芯片贴合的蒸发器3，单板1上还设置了冷凝器2，蒸发器3和冷凝器2通过管道形成散热环路，芯片产生的热量通过蒸发器3内的工质吸收，工质通过管道进入到冷凝器2内进行降温，之后再回流到蒸发器3内再次吸收芯片产生的热量。在采用上述散热方式时，冷凝器2受单板1的尺寸影响，造成冷凝器2的冷凝效果较差，另一方面冷凝器2还会占用单板1上的空间，影响器件的布局，为此本申请实施例提供了一种单板1，用以改善单板1的散热效果。下面结合具体的附图以及实施例对其进行详细的说明。The single board provided by the embodiment of this application can be applied to data communication equipment, server, and energy equipment, and is used to carry the single board in the above equipment. With the promotion of ICT application technologies such as AR/VR, 5G, and cloud computing, the single board The device density and power are rising rapidly, the power dissipation of microelectronic components is getting larger and the package size is getting smaller and smaller, so the heat dissipation requirements for single boards are getting higher and higher. In order to improve the heat dissipation efficiency of the single board in the prior art, a heat dissipation system is often arranged on the single board to dissipate heat from the chip, as shown in FIG. 1 . The single board 1 is provided with an evaporator 3 attached to the chip, and the single board 1 is also provided with a condenser 2. The evaporator 3 and the condenser 2 form a heat dissipation loop through pipes, and the heat generated by the chip passes through the evaporator 3 Working fluid absorption, the working fluid enters the condenser 2 through the pipeline to cool down, and then returns to the evaporator 3 to absorb the heat generated by the chip again. When using the above heat dissipation method, the condenser 2 is affected by the size of the board 1, resulting in poor condensation effect of the condenser 2. On the other hand, the condenser 2 will occupy the space on the board 1, affecting the layout of the device. This embodiment of the present application provides a single board 1 for improving the heat dissipation effect of the single board 1 . It will be described in detail below in conjunction with specific drawings and embodiments.
参考图2，图2示出了本申请实施例提供的单板10的应用在数据中心的场景。数据中心包括机柜和单板10，在使用时，单板10***到机柜内，实现数据中心的主体功能。Referring to FIG. 2 , FIG. 2 shows a scenario where the single board 10 provided by the embodiment of the present application is applied in a data center. The data center includes a cabinet and a single board 10. When in use, the single board 10 is inserted into the cabinet to realize the main functions of the data center.
机柜包括柜体20以及设置在柜体20内的背板22，背板22通过卡扣或者螺纹连接件(螺栓或螺钉等)与柜体20固定连接。在单板10***到机柜内时，单板10与背板22之间通过连接器实现电气连接。The cabinet includes a cabinet body 20 and a backboard 22 disposed in the cabinet body 20 , and the backboard 22 is fixedly connected to the cabinet body 20 through buckles or threaded connectors (bolts or screws, etc.). When the single board 10 is inserted into the cabinet, the single board 10 and the backplane 22 are electrically connected through the connector.
为改善对单板10的散热效果，采用蒸发器11和冷凝器21组成的散热环路对单板10上的芯片进行散热。其中，蒸发器11设置在单板10上，冷凝器21设置在机柜内，冷凝器21和蒸发器11通过管道连接。In order to improve the heat dissipation effect on the single board 10 , a heat dissipation loop composed of the evaporator 11 and the condenser 21 is used to dissipate heat from the chips on the single board 10 . Wherein, the evaporator 11 is arranged on the single board 10 , the condenser 21 is arranged in the cabinet, and the condenser 21 and the evaporator 11 are connected through pipelines.
在工作时，通过冷凝器21和蒸发器11组成的散热环路对单板10上的电子器件进行散热。散热环路内流动有工质，工质在流经电子器件下方的蒸发器11时，吸收电子器件产生的热量，从而实现对电子器件的散热。在本申请实施例中电子器件包括但不限定为芯片、电容、电感等产生热量较高的电子器件，在图1中以芯片示例出的电子器件的位置。During operation, the electronic devices on the single board 10 are radiated heat through the heat dissipation loop formed by the condenser 21 and the evaporator 11 . A working fluid flows in the heat dissipation loop, and when the working fluid flows through the evaporator 11 below the electronic device, it absorbs heat generated by the electronic device, thereby realizing heat dissipation for the electronic device. In the embodiment of the present application, the electronic devices include but are not limited to chips, capacitors, inductors and other electronic devices that generate high heat. In FIG. 1 , the positions of the electronic devices are exemplified by chips.
工质指代为各种机器中用以实现热能与其他形式能量转换的媒介物，又称热力学工质。工质一般为流体(气体和液体)，示例性的，工质可为煤油、水等常见的工质。工质在工作时，存在液态和气态两种状态。在工质流经蒸发器11时，工质吸收电子器件传递的热量 后，由液态变为气态(蒸发)；在气态的工质流经冷凝器21时，工质释放出热量由气态变为液态(冷凝)。工质不断的在液态和气态之间转换，并带走电子器件产生的热量，以实现对电子器件进行散热。Working fluid refers to the medium used in various machines to realize the conversion of heat energy and other forms of energy, also known as thermodynamic working fluid. The working fluid is generally a fluid (gas and liquid). Exemplarily, the working fluid may be common working fluids such as kerosene and water. When the working medium is working, there are two states of liquid and gas. When the working fluid flows through the evaporator 11, the working fluid changes from a liquid state to a gaseous state (evaporation) after absorbing the heat transferred by the electronic device; Liquid (condensed). The working fluid is constantly switching between liquid and gaseous states, and takes away the heat generated by the electronic devices to dissipate heat from the electronic devices.
在采用上述结构时，冷凝器21设置在机柜内的较大空间中，因此可设置更大尺寸的冷凝器21，随着冷凝器21的尺寸增大，其散热效果也增大，从而增大对单板10的散热效果。When the above-mentioned structure is adopted, the condenser 21 is arranged in a relatively large space in the cabinet, so a larger-sized condenser 21 can be arranged. As the size of the condenser 21 increases, its heat dissipation effect also increases, thereby increasing The heat dissipation effect on the single board 10 .
冷凝器21和蒸发器11之间采用可拆分的管道进行连接，在单板10与背板22之间插拔连接时，通过可拆分的管道实现蒸发器11与冷凝器21之间同步进行插拔。为方便描述，将与蒸发器11连接的部分管道命名为第一散热管道12，与冷凝器21连接的部分管道命名为第二散热管道23，在单板10与背板22连接时，第一散热管道12和第二散热管道23连接，蒸发器11和冷凝器21通过第一散热管道12和第二散热管道23组成散热环路。为方便理解上述结构，下面对单板10以及机柜的结构分别进行描述。The condenser 21 and the evaporator 11 are connected by detachable pipes. When the single board 10 and the backplane 22 are plugged in and connected, the detachable pipes are used to realize the synchronization between the evaporator 11 and the condenser 21 Perform plugging and unplugging. For the convenience of description, the part of the pipe connected to the evaporator 11 is named the first heat dissipation pipe 12, and the part of the pipe connected to the condenser 21 is named the second heat dissipation pipe 23. When the single board 10 is connected to the backplane 22, the first The heat dissipation pipe 12 is connected to the second heat dissipation pipe 23 , and the evaporator 11 and the condenser 21 form a heat dissipation loop through the first heat dissipation pipe 12 and the second heat dissipation pipe 23 . To facilitate the understanding of the above structure, the structure of the single board 10 and the cabinet will be described respectively below.
参考图3，图3示出了本申请实施例提供的单板10，单板10包括板体13，板体13作为一个承载结构，用以承载实现单板10电气功能的电子器件。示例性的，电子器件可为有源器件或无源器件，在本申请中不做具体限定，如芯片、电容、电感等。Referring to FIG. 3 , FIG. 3 shows a single board 10 provided by an embodiment of the present application. The single board 10 includes a board body 13 . Exemplarily, the electronic device may be an active device or a passive device, which is not specifically limited in this application, such as a chip, a capacitor, an inductor, and the like.
单板10还包括蒸发器11以及与蒸发器11连接的第一散热管道12。蒸发器11设置在板体13上，具体设置方式可以为直接固定在板体13的表面、完全埋设在板体13内或者半埋设在板体13的方式。示例性的，单板10上设置有凹槽，蒸发器11固定在该凹槽内，且蒸发器11的一表面外露在凹槽外。蒸发器11外露在板体13的表面可用以承载电子器件，如芯片。在装配时，芯片与蒸发器11之间直接贴合，提高芯片与蒸发器11之间的换热效果。当然，蒸发器11也可直接设置在板体13的表面，或者完全埋设在板体13内不外露等情况，在此不再一一示例说明。The single board 10 also includes an evaporator 11 and a first heat dissipation pipe 12 connected to the evaporator 11 . The evaporator 11 is arranged on the plate body 13 , and the specific arrangement method can be directly fixed on the surface of the plate body 13 , completely embedded in the plate body 13 or half embedded in the plate body 13 . Exemplarily, the veneer 10 is provided with a groove, the evaporator 11 is fixed in the groove, and a surface of the evaporator 11 is exposed outside the groove. The surface of the evaporator 11 exposed on the board body 13 can be used to carry electronic devices, such as chips. During assembly, the chip and the evaporator 11 are directly bonded to improve the heat exchange effect between the chip and the evaporator 11 . Certainly, the evaporator 11 may also be directly arranged on the surface of the plate body 13 , or be completely embedded in the plate body 13 without being exposed, which will not be illustrated one by one here.
第一散热管道12划分为第一管道121和第二管道122。第一管道121和第二管道122与蒸发器11的输入端和输出端一一对应连接。示例性的，第一管道121与蒸发器11的输入端连接，第二管道122与蒸发器11的输出端连接。其中，第一管道121内流动的工质为液态，第一管道121也可称为液管；第二管道122内流动的工质为气态，第二管道122也可称为气管。或者，也可采用第一管道121与蒸发器11的输出端连接，第二管道122与蒸发器11的输入端连接，在本申请实施例中，以第一管道121为液管，第二管道122为气管为例进行说明。The first heat dissipation pipe 12 is divided into a first pipe 121 and a second pipe 122 . The first pipeline 121 and the second pipeline 122 are connected to the input end and the output end of the evaporator 11 in one-to-one correspondence. Exemplarily, the first pipe 121 is connected to the input end of the evaporator 11 , and the second pipe 122 is connected to the output end of the evaporator 11 . Wherein, the working medium flowing in the first pipeline 121 is in liquid state, and the first pipeline 121 may also be called a liquid pipe; the working medium flowing in the second pipeline 122 is in a gaseous state, and the second pipeline 122 may also be called a gas pipe. Alternatively, the first pipeline 121 can also be connected to the output end of the evaporator 11, and the second pipeline 122 is connected to the input end of the evaporator 11. In the embodiment of the present application, the first pipeline 121 is used as the liquid pipe, and the second pipeline 122 is used as the liquid pipe. 122 is the trachea as an example for description.
在设置第一散热管道12时，第一散热管道12埋设在单板10内。但应理解，第一散热管道12除上述的埋设方式外，还可采用其他方式，如半埋设或者设置在板体13的表面，在此不再一一列举说明。第一散热管道12对管道的材质不限，可以是铜管、不锈钢软管、铝管等。When the first heat dissipation pipe 12 is provided, the first heat dissipation pipe 12 is embedded in the single board 10 . However, it should be understood that besides the above-mentioned embedding manner, the first heat dissipation pipe 12 may also adopt other manners, such as being half-embedded or arranged on the surface of the plate body 13 , which will not be listed here. The material of the first heat dissipation pipe 12 is not limited, and it may be a copper pipe, a stainless steel hose, an aluminum pipe, or the like.
为方便与第二散热管道对应连接，第一管道121和第二管道122远离蒸发器11的一端分别设置有第一快拔接头15。第一快拔接头15具备密封功能，在第一散热管道12与第二散热管道分开时，第一快拔接头15可密封第一管道121和第二管道122，从而避免第一散热管道12内的工质泄露。In order to facilitate the corresponding connection with the second heat dissipation pipe, the ends of the first pipe 121 and the second pipe 122 away from the evaporator 11 are respectively provided with first quick-disconnect joints 15 . The first quick-disconnect joint 15 has a sealing function. When the first heat dissipation pipe 12 is separated from the second heat dissipation pipe, the first quick-disconnect joint 15 can seal the first pipe 121 and the second pipe 122, thereby preventing the first heat dissipation pipe 12 from leakage of working fluid.
在散热环路中，由于蒸发端(蒸发器11侧)的液体工质受热变成气态，冷凝端(冷凝器侧)的散热工质冷却后变为液态。因此在不同的工作温度环境下，蒸发端管路(第一散热管道12)和冷凝端管路(第二散热管道)中的冷却工质的留存量会不完全一致。当单板 10内蒸发端管路与板外的冷凝端管路插拔的时候，会导致不同温度状态下插拔替换时，整个散热环路中冷却工质的总量会不一致，导致整个散热环路散热能力不一致。In the heat dissipation loop, since the liquid working medium at the evaporating end (evaporator 11 side) is heated and becomes gaseous, the heat dissipation working medium at the condensing end (condenser side) becomes liquid after being cooled. Therefore, under different working temperature environments, the remaining amount of cooling working medium in the evaporating end pipeline (first heat dissipation pipe 12 ) and the condensing end pipeline (second heat dissipation pipe) will not be completely consistent. When plugging and unplugging the evaporator pipe inside the board 10 and the condensing pipe outside the board, it will result in plugging and replacing under different temperature conditions, and the total amount of cooling fluid in the entire heat dissipation loop will be inconsistent, resulting in Loop cooling capacity is inconsistent.
举例而言，如图4所示，散热环路实测不同状态下的单板实测工质量，不上电冷态与上电满功耗运行时蒸发端工质量相差较大。如单板在低功耗时，蒸发端的液体工质量为211.6g。而单板在功耗100W时，蒸发端的液体工质量为161.8g，冷却工质减少了49.8g。随着单板的功耗逐渐增加，蒸发端的工质量会逐渐下降，尤其单板在功耗100W以内的工质量下降速率较快。此时如果用一块处于冷却状态的单板替换一块工作的发热的单板，会导致单板交换插拔会后留在蒸发端的冷却工质的量过大，导致最后环路热管散热能力受内部工质的量的影响比较大。同时，若将处于工作状态下的单板拔下后，单板内的工质较少，因此在该单板与另外的背板配合时，蒸发器与冷凝器组成的新的散热环路中的工质会减少。For example, as shown in Figure 4, the measured work quality of the single board under different states of the heat dissipation loop, there is a large difference in the work quality of the evaporation terminal when the power is not turned on and the power is running at full power. For example, when the board is at low power consumption, the liquid mass at the evaporation end is 211.6g. When the power consumption of the single board is 100W, the liquid working mass at the evaporating end is 161.8g, and the cooling working medium is reduced by 49.8g. As the power consumption of the board gradually increases, the work quality of the evaporation end will gradually decrease, especially the work quality of the board with power consumption less than 100W decreases rapidly. At this time, if a board that is in a cooling state is used to replace a working and heating board, the amount of cooling fluid remaining at the evaporating end after the board is swapped and removed will be too large, resulting in the heat dissipation capacity of the final loop heat pipe being limited by the internal The impact of the amount of working fluid is relatively large. At the same time, if the single board in the working state is unplugged, there will be less working fluid in the single board, so when the single board cooperates with another back board, the new heat dissipation loop formed by the evaporator and the condenser will The working fluid will be reduced.
而工质过少或者过多都会造成散热环路的换热效率降低，如图5所示，工质太多将导致蒸发热阻和冷凝热阻都增大，单板上的芯片散热能力受限，会出现芯片工作温度偏高的情况。而工质太少将导致单板内蒸发端产生“干烧”现象，芯片温度会急剧升高导致超温损坏的可能性增加，如图5中所示的当充液量(液态工质)低于40％时，芯片温度急剧飙升。Too little or too much working fluid will reduce the heat transfer efficiency of the heat dissipation loop. As shown in Figure 5, too much working fluid will increase the evaporation thermal resistance and condensation thermal resistance, and the heat dissipation capacity of the chips on the board will be affected. Limit, there will be a situation where the chip operating temperature is too high. Too little working fluid will lead to "dry burning" phenomenon at the evaporation end of the board, and the chip temperature will rise sharply, resulting in an increased possibility of over-temperature damage. As shown in Figure 5, when the filling liquid (liquid working fluid) is low At 40%, the chip temperature soars sharply.
为避免出现更换单板影响到散热效果，本申请实施例提供的单板在第一管道121或第二管道122上设置有开关阀14，以控制第一管道121或第二管道122关闭。示例性的，第一管道121与蒸发器的输入端连接时，第一管道121上设置有控制第一管道121导通的开关阀14。以通过在散热环路上设置控制工质的开关阀14实现工质量的有效控制，开关阀14可以采用常开电磁阀(上电闭合，断电即断开)，也可以采用温度阀门(一定温度下闭合，一定温度下断开)，也可以是其他可实现同样目的控制阀门。以通过开关阀14控制蒸发端的工质量保持稳定，确保在不同的温度单板插拔互换以后，保持整个散热环路的冷却能力保持恒定。示例性的，开关阀14可以是电磁阀门、记忆合金温控阀门及其他可实现工质量分配控制的阀门。为方便理解本申请实施例提供的上述单板，下面结合具体的附图对其进行详细描述。In order to avoid affecting the cooling effect due to board replacement, the board provided in the embodiment of the present application is provided with an on-off valve 14 on the first pipe 121 or the second pipe 122 to control the closing of the first pipe 121 or the second pipe 122 . Exemplarily, when the first pipeline 121 is connected to the input end of the evaporator, the first pipeline 121 is provided with an on-off valve 14 for controlling the conduction of the first pipeline 121 . Realize the effective control of working quality by arranging the on-off valve 14 of control working fluid on the heat dissipation loop, on-off valve 14 can adopt normally open electromagnetic valve (power-on closes, power-off promptly disconnects), also can adopt temperature valve (certain temperature Closed at lower temperature, disconnected at a certain temperature), it can also be other control valves that can achieve the same purpose. The switching valve 14 is used to control the working quality of the evaporating end to keep stable, so as to ensure that the cooling capacity of the entire heat dissipation loop is kept constant after the boards are plugged and swapped at different temperatures. Exemplarily, the on-off valve 14 may be an electromagnetic valve, a memory alloy temperature-controlled valve, and other valves capable of controlling the distribution of working fluid. In order to facilitate understanding of the above veneer provided in the embodiment of the present application, it will be described in detail below with reference to specific drawings.
在设置开关阀14时，可设置在不同的管道上。示例性的，开关阀14设置在第一管道121上，并位于第一管道121靠近第一快拔接头15的一端，使得开关阀14可与第一快拔接头15一起配合密封工质。当然，开关阀14也可设置在第一管道121的其他位置，在本申请实施例中不做具体限定。或者，在第一管道121和第二管道122上均设置开关阀14。在单板断电未工作时，冷凝器中的液态工质可能会通过第一管道121回流到单板内，也会有少部分液态工质通过的第二管道122回流到单板内。为了避免液态工质回流导致单板内的工质质量增加，在设置开关阀14时，第一管道121和第二管道122上均设置开关阀14，以在单板断电后，通过两个开关阀14将第一管道和第二管道分别关闭，避免冷凝器中的液态工质流入到单板内。保证单板在上电或者下电时，单板内的液态工质的质量基本保持一致，从而在插拔单板时，避免影响到整个散热环路的工质质量。When setting the on-off valve 14, it can be set on different pipelines. Exemplarily, the on-off valve 14 is disposed on the first pipe 121 and located at an end of the first pipe 121 close to the first quick-disconnect joint 15 , so that the on-off valve 14 can cooperate with the first quick-disconnect joint 15 to seal the working fluid. Of course, the on-off valve 14 can also be arranged in other positions of the first pipeline 121, which is not specifically limited in this embodiment of the present application. Alternatively, on-off valves 14 are provided on both the first pipeline 121 and the second pipeline 122 . When the board is powered off and not working, the liquid working fluid in the condenser may flow back into the board through the first pipeline 121 , and a small part of the liquid working fluid may also flow back into the board through the second pipeline 122 . In order to avoid the increase of the working medium quality in the veneer due to the backflow of the liquid working medium, when setting the on-off valve 14, the on-off valve 14 is set on the first pipeline 121 and the second pipeline 122, so that after the veneer is powered off, the two The switch valve 14 closes the first pipeline and the second pipeline respectively, so as to prevent the liquid working medium in the condenser from flowing into the single plate. Ensure that the quality of the liquid working fluid in the board remains basically the same when the board is powered on or off, so as to avoid affecting the quality of the working fluid in the entire heat dissipation loop when the board is plugged in or removed.
开关阀14可通过电信号或者温度信号进行控制，下面分别对其进行说明。The switch valve 14 can be controlled by an electric signal or a temperature signal, which will be described respectively below.
在开关阀14采用电信号控制时，开关阀14可为电磁控制阀，开关阀14可通过单板10上设置的控制单元进行控制。如开关阀14为电磁控制阀，控制单元可用于控制电磁控制阀开闭，当单板10***到背板上时，单板10上电，控制单元根据检测到的单板10上电的信号控制电磁控制阀打开；当单板10从背板拔下时，单板10断电，控制单元根据检测到的单板10断电的信号控制电磁控制阀关闭。在上述状态中，电磁控制阀采用常闭控 制阀，从而在单板10断电后，可保持常闭状态，从而与第一管道121的端口处的第一快拔接头15一起配合密封管道内的工质。When the on-off valve 14 is controlled by an electric signal, the on-off valve 14 can be an electromagnetic control valve, and the on-off valve 14 can be controlled by a control unit provided on the single board 10 . If the switching valve 14 is an electromagnetic control valve, the control unit can be used to control the opening and closing of the electromagnetic control valve. When the single board 10 is inserted into the backplane, the single board 10 is powered on, and the control unit detects the signal that the single board 10 is powered on. Control the electromagnetic control valve to open; when the single board 10 is unplugged from the backplane, the single board 10 is powered off, and the control unit controls the electromagnetic control valve to close according to the detected signal that the single board 10 is powered off. In the above state, the electromagnetic control valve adopts a normally closed control valve, so that after the single board 10 is powered off, it can maintain a normally closed state, thereby cooperating with the first quick-pull joint 15 at the port of the first pipeline 121 to seal the inside of the pipeline. working medium.
控制单元可为设置在板体13上的控制电路，控制电路在单板10与机柜的背板导电连通时，控制电磁控制阀导通。当然，控制单元还可采用PLC、继电器等常见的可控制电磁控制阀的控制单元。The control unit may be a control circuit arranged on the board body 13, and the control circuit controls the conduction of the electromagnetic control valve when the single board 10 is electrically connected with the backplane of the cabinet. Certainly, the control unit may also adopt common control units capable of controlling the electromagnetic control valve such as PLC and relay.
在采用上述电控制时，单板10断电的情况下保持开关阀14常闭，在单板10上电后(正确***机框)打开，可以实时打开，也可以延迟一段时间后打开，比如10ms、15ms、20ms之后。When the above-mentioned electrical control is adopted, the on-off valve 14 is kept normally closed when the board 10 is powered off, and is opened after the board 10 is powered on (correctly inserted into the machine frame), and can be opened in real time, or opened after a delay, for example After 10ms, 15ms, 20ms.
在开关阀14采用温度控制时，开关阀14可为温度阀门，如记忆合金温控阀门。记忆合金温度控制阀门在单板10上电后，记忆合金温度控制阀门中的控制部分(记忆合金)会收缩，带动记忆合金温度控制阀门动作，从而打开阀门。当单板10断电后，记忆合金温度控制阀门中的控制部分(记忆合金)会收缩，带动记忆合金温度控制阀门动作，从而打开阀门。When the switch valve 14 adopts temperature control, the switch valve 14 can be a temperature valve, such as a memory alloy temperature control valve. After the memory alloy temperature control valve is powered on, the control part (memory alloy) in the memory alloy temperature control valve will shrink, driving the memory alloy temperature control valve to move, thereby opening the valve. When the single board 10 is powered off, the control part (memory alloy) in the memory alloy temperature control valve will shrink, driving the memory alloy temperature control valve to act, thereby opening the valve.
另外，开关阀14还可采用电磁控制阀，对应的，单板10还包括传感器和控制单元。其中，传感器用于检测热源(芯片)温度，控制单元用于在传感器检测的温度超过设定值时，控制电磁控制阀打开。示例性的，当芯片的温度大于80度(T1阈值)时打开开关阀14，在芯片的温度低于60度(T2阈值)关闭开关阀14。In addition, the switching valve 14 may also be an electromagnetic control valve, and correspondingly, the single board 10 further includes a sensor and a control unit. Wherein, the sensor is used to detect the temperature of the heat source (chip), and the control unit is used to control the electromagnetic control valve to open when the temperature detected by the sensor exceeds the set value. Exemplarily, the on-off valve 14 is opened when the temperature of the chip is greater than 80 degrees (T1 threshold), and the on-off valve 14 is closed when the temperature of the chip is lower than 60 degrees (T2 threshold).
在具体控制上述开关阀14时，既可以采用单独的温度控制和电控制，也可采用温度控制和电控制相结合一起控制开关阀14，在本申请实施例中不做具体限定。When specifically controlling the on-off valve 14, the on-off valve 14 can be controlled individually by temperature control and electric control, or by a combination of temperature control and electric control, which is not specifically limited in this embodiment of the application.
在单板10***背板之间，单板10内填充有工质，为方便工质冲入到单板10上的管道内，单板10上还设置了一个充液孔16，可通过该充液孔16向第一管道121、第二管道122及蒸发器11内填充工质。When the veneer 10 is inserted between the back plates, the veneer 10 is filled with working fluid. In order to facilitate the flow of the working fluid into the pipeline on the veneer 10, a liquid filling hole 16 is also provided on the veneer 10, through which the The liquid filling hole 16 fills the working medium into the first pipe 121 , the second pipe 122 and the evaporator 11 .
充液孔16可设置在第一管道121、第二管道122或蒸发器11上。示例性的，充液孔16设置在第二管道122，但应理解，在本申请实施例中，充液孔16可根据实际需要设置在不同位置，在本申请实施例中不做具体限定。该充液孔16也为抽真空孔，以用于对单板10上的管道抽真空。示例性的，通过真空泵于充液孔16连接，并进行抽真空，之后充液泵通过充液孔16向管道内充入工质。The liquid filling hole 16 may be disposed on the first pipe 121 , the second pipe 122 or the evaporator 11 . Exemplarily, the liquid filling hole 16 is arranged in the second pipe 122 , but it should be understood that in the embodiment of the present application, the liquid filling hole 16 can be arranged in different positions according to actual needs, which is not specifically limited in the embodiment of the present application. The liquid filling hole 16 is also a vacuum hole for vacuuming the pipeline on the single board 10 . Exemplarily, a vacuum pump is connected to the filling hole 16 for vacuuming, and then the filling pump fills the pipeline with working fluid through the filling hole 16 .
在对单板10进行充液时，单板10内工质的充液量基于单板10在工作状态时第一散热管道12内的工质含量。示例性的，在单板10正常上电工作时，若单板10内的工质量为100g～180g，则在单板10内的管道充入的工质量在100g～180g之间，如100g、130g、150g等不同的量。在采用单板10内工质量为单板10正常工作时其包含的工质量时，避免工质冲入过多导致在单板10与背板连接后，蒸发器11和冷凝器组成的散热环路中的工质量过多影响整个散热环路的散热效果。同时，单板10在断电时，开关阀14关闭，冷凝器的液态工质无法流入到单板10的管道内，使得单板10内的工质量基本保持不变，从而保证该单板10在***其他背板内时，蒸发器11和冷凝器组成的散热环路中的工质变化量过大。When filling the single board 10 with liquid, the amount of liquid filled with the working medium in the single board 10 is based on the content of the working medium in the first heat dissipation pipe 12 when the single board 10 is in a working state. Exemplarily, when the board 10 is normally powered on and working, if the working weight in the single board 10 is 100g-180g, then the working weight filled in the pipeline in the single board 10 is between 100g-180g, such as 100g, 130g, 150g and other different amounts. When the internal working mass of the single board 10 is used as the working mass contained in the single board 10 during normal operation, avoid too much working fluid rushing into the heat dissipation ring formed by the evaporator 11 and the condenser after the single board 10 is connected to the backplane. Too much work in the circuit affects the heat dissipation effect of the entire heat dissipation loop. Simultaneously, when the veneer 10 is powered off, the switch valve 14 is closed, and the liquid working medium of the condenser cannot flow into the pipeline of the veneer 10, so that the working mass in the veneer 10 remains basically unchanged, thereby ensuring that the veneer 10 When inserted into other backplanes, the amount of working fluid in the heat dissipation loop formed by the evaporator 11 and the condenser changes too much.
为方便理解上述单板10内工质的变化情况，详细说明一下单板10的工作状态。单板10上电后，电磁阀打开，蒸发器11与冷凝器连通组成散热环路。芯片上电发热，液态工质在蒸发器11蒸发吸热后变成气态，由第二管道122进入冷凝器，工质在冷凝器中冷凝放热变成液态，液态工质由第一管道121回到蒸发器11中，从而形成一个循环回路实现热量 的转移。单板10断电时，电磁阀快速关闭断开，散热环路断开，工质在整个环路中的量维持不变。由上述描述可看出，无论是在上电(工作状态)插拔单板10，还是在断电(非工作状态)插拔单板10，对应单板10上的工质量基本一致，从而在维护更换新单板10或者不同槽位单板10互换不会导致环路的工质量产生较大变化，从而维持散热能力的稳定性。In order to facilitate the understanding of the change of the working fluid in the above veneer 10 , the working state of the veneer 10 will be described in detail. After the single board 10 is powered on, the electromagnetic valve is opened, and the evaporator 11 is connected with the condenser to form a heat dissipation loop. The chip is electrically heated, and the liquid working medium becomes gaseous after evaporating and absorbing heat in the evaporator 11, and enters the condenser through the second pipeline 122, and the working medium condenses and releases heat in the condenser to become liquid, and the liquid working medium passes through the first pipeline 121 Return to the evaporator 11, thereby forming a circulation loop to realize the transfer of heat. When the single board 10 is powered off, the solenoid valve is quickly closed and disconnected, the heat dissipation loop is disconnected, and the amount of working fluid in the entire loop remains unchanged. It can be seen from the above description that no matter whether the single board 10 is plugged in when the power is turned on (working state), or the single board 10 is plugged and pulled out when the power is turned off (non-working state), the quality of work on the corresponding single board 10 is basically the same, so that the Maintenance and replacement of a new single board 10 or exchange of single boards 10 in different slots will not lead to a large change in the working quality of the loop, thereby maintaining the stability of the heat dissipation capability.
继续参考图3，单板10上主要热源器件有两个芯片。对应的，单板10上安装有两个蒸发器11，两个蒸发器11分别与两个一一对应热接触。Continuing to refer to FIG. 3 , the main heat source device on the single board 10 has two chips. Correspondingly, two evaporators 11 are installed on the single board 10, and the two evaporators 11 are respectively in thermal contact with the two in one-to-one correspondence.
应理解，在本申请实施例中，热源的个数不限于图3所示的两个，还可为三个、四个等不同的个数。对应的蒸发器11的个数也为多个。在采用多个蒸发器11时，多个蒸发器11之间并联，如图3中所示，第一管道121和第二管道122分列在每个蒸发器11的两侧，并分别与每个蒸发器11的输入端和输出端一一对应连接。It should be understood that, in the embodiment of the present application, the number of heat sources is not limited to two as shown in FIG. 3 , and may be three, four, etc. different numbers. There are also multiple corresponding evaporators 11 . When multiple evaporators 11 are used, the multiple evaporators 11 are connected in parallel, as shown in FIG. The input ends and output ends of each evaporator 11 are connected in one-to-one correspondence.
参考图6，图6示出了基于图3所示的单板10的一种变形结构，图6中的部分标号可参考图3中的相同标号。为避免单板10在***背板上时，第一散热管道12内的工质存在倒流进入冷凝器的风险，因此在第一管道121上设置一个积液腔17。积液腔17作为缓冲和稳定工质分布作用，可规避单板10刚开始上电启动时，由于蒸发器11内压力突然增大导致第一管道121内部分液态工质倒灌进入到冷凝器内，导致冷凝器换热效率低的问题。Referring to FIG. 6 , FIG. 6 shows a modified structure based on the veneer 10 shown in FIG. 3 , and part numbers in FIG. 6 may refer to the same numbers in FIG. 3 . In order to avoid the risk of the working fluid in the first cooling pipe 12 flowing back into the condenser when the single board 10 is inserted into the backboard, a liquid accumulation cavity 17 is provided on the first pipe 121 . The liquid accumulation chamber 17 acts as a buffer and stabilizes the distribution of the working fluid, which can prevent the part of the liquid working medium in the first pipeline 121 from flowing backward into the condenser due to the sudden increase in the pressure in the evaporator 11 when the board 10 is first powered on and started. , leading to the problem of low heat exchange efficiency of the condenser.
示例性的，积液腔17位于开关阀14远离蒸发器11的一侧，即积液腔17位于第一管道121的第一快拔接头15与开关阀14之间。第一管道121内的工质在出现倒流时，会流入到积液腔17中，避免其倒流进入到冷凝器中。另外，积液腔17还可存储过多的工质，避免工质过多影响到整个散热环路的散热效果。Exemplarily, the liquid accumulation chamber 17 is located on the side of the on-off valve 14 away from the evaporator 11 , that is, the liquid accumulation chamber 17 is located between the first quick-disconnect joint 15 of the first pipeline 121 and the on-off valve 14 . When the working fluid in the first pipeline 121 flows back, it will flow into the liquid accumulation chamber 17 to prevent it from flowing back into the condenser. In addition, the liquid accumulation cavity 17 can also store too much working fluid, so as to prevent too much working fluid from affecting the heat dissipation effect of the entire heat dissipation loop.
为方便体现积液腔17的效果，对带有积液腔17和没有积液腔的单板10进行实测。其中，有积液腔17的单板10比无积液腔的单板10的过冷度优化2～3℃。且实测300W负载下，有积液腔17的单板10比无积液腔17的单板10的过热度要好2.8℃。In order to conveniently reflect the effect of the liquid accumulation chamber 17, the actual measurement is carried out on the veneer 10 with the liquid accumulation chamber 17 and without the liquid accumulation chamber. Wherein, the subcooling degree of the veneer 10 with the liquid accumulation cavity 17 is 2-3° C. better than that of the single plate 10 without the liquid accumulation cavity. Moreover, under the measured load of 300W, the superheat degree of the veneer 10 with the liquid accumulation cavity 17 is 2.8°C higher than that of the single plate 10 without the liquid accumulation cavity 17 .
参考图7，本申请实施例还提供了一种机柜，该机柜包括柜体10，设置在柜体10内的冷凝器21，以及用于传输工质的第二散热管道23。其中，第二散热管道23包括第三管道231和第四管道232；第三管道231和第四管道232分别与冷凝器21的输入端和输出端一一对应连接；示例性的，第三管道231与冷凝器21的输入端连接，第四管道232与冷凝器21的输出端连接；也可采用第三管道231与冷凝器21的输出端连接，第四管道232与冷凝器21的输入端连接。Referring to FIG. 7 , the embodiment of the present application also provides a cabinet, which includes a cabinet body 10 , a condenser 21 disposed in the cabinet body 10 , and a second heat dissipation pipe 23 for transferring working fluid. Wherein, the second heat dissipation pipeline 23 includes a third pipeline 231 and a fourth pipeline 232; the third pipeline 231 and the fourth pipeline 232 are respectively connected to the input end and the output end of the condenser 21 in one-to-one correspondence; exemplary, the third pipeline 231 is connected to the input end of the condenser 21, and the fourth pipeline 232 is connected to the output end of the condenser 21; the third pipeline 231 can also be connected to the output end of the condenser 21, and the fourth pipeline 232 is connected to the input end of the condenser 21 connect.
为方便与第二散热管道23和第一散热管道连接。第三管道231和第四管道232远离冷凝器21的一端分别设置有用于与第一快拔接头配合的第二快拔接头25。在机柜内设置单板10时，单板10与背板22插拔连接。单板10***背板22时，第一快拔接头和第二快拔接头25一一对应连接，蒸发器和冷凝器21通过第一散热管道和第二散热管道23连通形成散热环路。For convenience, it is connected with the second heat dissipation pipe 23 and the first heat dissipation pipe. The ends of the third pipeline 231 and the fourth pipeline 232 away from the condenser 21 are respectively provided with second quick-pull joints 25 for matching with the first quick-pull joints. When the single board 10 is arranged in the cabinet, the single board 10 is plugged and connected to the backplane 22 . When the single board 10 is inserted into the backplane 22, the first quick-disconnect connectors and the second quick-disconnect connectors 25 are connected one by one, and the evaporator and the condenser 21 are connected through the first heat dissipation pipe and the second heat dissipation pipe 23 to form a heat dissipation loop.
为提高冷凝器21的散热效果，冷凝器21可以有管翅式或平行流换热翅片。冷凝器21内的管路材质不限，可以是铜管，不锈钢软管等。空气流经冷凝器21翅片时，冷空气与翅片换热带走热量，冷凝器21中的工质冷凝放热变成液态。In order to improve the heat dissipation effect of the condenser 21, the condenser 21 may have tube-fin type or parallel flow heat exchange fins. The pipeline material in the condenser 21 is not limited, it can be copper tube, stainless steel hose and so on. When the air flows through the fins of the condenser 21, the cold air exchanges heat with the fins to dissipate heat, and the working medium in the condenser 21 condenses and releases heat to become liquid.
另外，机柜内还设置有风扇组24，该风扇组24用于向冷凝器21送风，以提高冷凝器21的冷凝效果。风扇组24提供的空气可流经冷凝器21，带走工质的热量使得工质由气态变成液态。In addition, a fan group 24 is also arranged in the cabinet, and the fan group 24 is used to supply air to the condenser 21 to improve the condensation effect of the condenser 21 . The air provided by the fan group 24 can flow through the condenser 21 to take away the heat of the working fluid so that the working fluid changes from a gaseous state to a liquid state.
作为一个可选的方案，还可在第二散热管道23上设置开关阀26，示例性的，开关阀26设置在第三管道231上，以用以在单板切断时，阻止冷凝器21内的液态工质流入到单板内。开关阀26的控制方式可参考单板上的开关阀的控制方式，在此不再赘述。As an optional solution, an on-off valve 26 can also be set on the second heat dissipation pipeline 23. Exemplarily, the on-off valve 26 is set on the third pipeline 231, so as to prevent the internal cooling of the condenser 21 when the single plate is cut off. The liquid working fluid flows into the veneer. The control method of the on-off valve 26 can refer to the control method of the on-off valve on the single board, and will not be repeated here.
应理解，在机柜内设置有多个与单板10配合的插槽时，对应的设置有与单板10一一的冷凝器21，以使得每个单板10在与背板22配合时，可组成相应的散热环路进行散热。或者还可采用设置有一个冷凝器21，但是一个冷凝器21内设置有多个内部管道，多个内部管道与多个单板10一一对应，以组成响应的散热环路。It should be understood that when a plurality of slots for matching with the single board 10 are provided in the cabinet, a corresponding condenser 21 is provided with the single board 10 so that when each single board 10 is mated with the backplane 22, A corresponding heat dissipation loop can be formed for heat dissipation. Alternatively, one condenser 21 may also be provided, but one condenser 21 is provided with multiple internal pipes, and the multiple internal pipes are in one-to-one correspondence with multiple single boards 10 to form a corresponding heat dissipation loop.
参考图8，本申请实施例还提供了一种数据中心，该数据中心包括机柜以及***到机柜内的单板。图8中的部分标号可参考图3和图7中的相同标号。Referring to FIG. 8 , an embodiment of the present application further provides a data center, where the data center includes a cabinet and a board inserted into the cabinet. Part numbers in FIG. 8 can refer to the same numbers in FIG. 3 and FIG. 7 .
单板10包含有两个芯片热源，对应的蒸发器11的个数也为两个，且芯片和蒸发器11一一对应形成热接触，机柜内设置有冷凝器21和风扇组24，冷凝器21和蒸发器11通过密封的管路连接，管路上设置有开关阀14，单板10和外部拉远的冷凝器21之间通过快接装置(第一快拔接头和第二快拔接头)形成密封连接，快接装置可以实现单板10和冷凝器21的快速安装或者解除。The single board 10 includes two chip heat sources, and the number of corresponding evaporators 11 is also two, and the chips and the evaporators 11 form thermal contacts in one-to-one correspondence. A condenser 21 and a fan group 24 are arranged in the cabinet. 21 and the evaporator 11 are connected by a sealed pipeline, on which an on-off valve 14 is arranged, and a quick-connect device (the first quick-pull joint and the second quick-pull joint) is used between the veneer 10 and the remote condenser 21 Forming a sealed connection, the quick-connection device can realize quick installation or removal of the single board 10 and the condenser 21 .
一般而言，在整机***内的承担业务功能的单板10是需要插拔安装维护的，通过在散热环路上设置快接装置，可实现单板10的蒸发端与冷凝器21的分体插拔，克服单板10板外冷凝器21受空间及可靠性限制无法与单板10一体插拔的缺陷。同时在蒸发端(或冷凝端)的管路上设置有开关阀14，可以通过开关阀14的通断控制克服单板10在不同场景下插拔导致环路热管中工质量分布大幅变化的缺陷。Generally speaking, the single board 10 that undertakes business functions in the whole system needs to be plugged, installed and maintained. By setting a quick-connect device on the heat dissipation loop, the evaporation end of the single board 10 and the condenser 21 can be separated. Plugging and unplugging overcomes the defect that the external condenser 21 of the single board 10 cannot be integrated with the single board 10 due to space and reliability limitations. At the same time, an on-off valve 14 is provided on the pipeline at the evaporating end (or condensing end), and the on-off control of the on-off valve 14 can overcome the defect that the mass distribution in the loop heat pipe changes greatly when the single board 10 is inserted and removed in different scenarios.
散热环路分为蒸发端和冷凝端，蒸发端和冷凝端的管路上分别有第一快速接头，当第一快速接头***第二快速接头，整个散热环路连接成一体散热环路可正常工作状态；当第一快速接头拔出，与第一快速接头断开，整个散热环路成分体状态，分为蒸发端和冷凝端两部分。整个散热环路上设置有开关阀14(图8中示例出了在单板上设置开关阀)，开关阀14通过是否上电来控制通断，也可以通过温度是否达到一定阈值等其他方式来控制通断。如当机柜处于上电状态，单板10***机柜，第一快拔接头与第一快拔接头连接导通形成一体散热环路，同时单板10的连接器***背板22的连接器，实现电连接，且单板上电。散热环路上的开关阀14通电导通，散热环路正常工作。在此状态下将单板10拔出，第一快拔接头与第一快拔接头断开，散热环路成分体状态，单板10的连接器与背板22的连接器同步分开，散热环路上的开关阀14断电，散热环路中的工质分布状态与正常连通上电工作状态保持一致。当机柜处于断电状态，此时单板10***机柜内时，第一快拔接头与第二快拔接头连接导通形成一体散热环路，同时单板10的连接器***背板22的连接器，实现电连接，但单板未上电。散热环路上的开关阀14仍处于断电断开状态，散热环路中的工质分布仍保持单板10***前断开状态一致，即与正常连通上电工作状态也一致。The heat dissipation loop is divided into an evaporation end and a condensation end. There are first quick connectors on the pipelines of the evaporation end and the condensation end respectively. When the first quick connector is inserted into the second quick connector, the entire heat dissipation loop is connected into one. The heat dissipation loop can work normally. ; When the first quick connector is pulled out and disconnected from the first quick connector, the entire heat dissipation loop is divided into two parts, the evaporation end and the condensation end. An on-off valve 14 is set on the entire heat dissipation loop (the on-off valve is set on a single board as an example in Fig. 8). on and off. For example, when the cabinet is powered on, the single board 10 is inserted into the cabinet, the first quick-disconnect connector is connected to the first quick-disconnect connector to form an integrated heat dissipation loop, and the connector of the single board 10 is inserted into the connector of the backplane 22 to realize Electrically connected, and the board is powered on. The on-off valve 14 on the heat dissipation loop is energized and conducted, and the heat dissipation loop works normally. In this state, the single board 10 is pulled out, the first quick-pull joint is disconnected from the first quick-pull joint, and the heat dissipation loop is separated. The on-off valve 14 on the road is powered off, and the distribution state of the working fluid in the heat dissipation loop is consistent with the normal connection and power-on working state. When the cabinet is in a power-off state, when the board 10 is inserted into the cabinet, the first quick-pull joint and the second quick-pull joint are connected to form an integrated heat dissipation loop, and the connector of the single board 10 is inserted into the connection of the backplane 22. switch to achieve electrical connection, but the board is not powered on. The on-off valve 14 on the heat dissipation loop is still in the power-off and disconnected state, and the distribution of the working fluid in the heat dissipation loop is still consistent with the disconnected state before the insertion of the single board 10, that is, it is also consistent with the normal connection and power-on working state.
通过上述描述，可看出，本申请实施例中，通过将冷凝器21拉远到单板10外的区域，可以不受单板10空间和布局限有效扩大散热面积，从而增大散热能力。并且通过在散热环路的管路上设置快拔装置，解决管路的快速连接和断开的问题。从而实现冷凝器21可设置在单板10以外的区域，可以规避冷凝器21受单板10空间及布局限制导致散热能力受限问题，同时减少占用单板10的空间，提高单板的器件布局空间。冷凝器21可以根据芯片功耗和散热需求有效调整冷凝器21的尺寸和散热面积，以达到更灵活的散热效果。另外，当单板10内蒸发端与板外的冷凝端分体插拔的时候，不同温度状态下插拔替换后， 整个散热环路中冷却工质的总量尽量保持一致，确保整个散热环路的冷却散热能力一致。From the above description, it can be seen that in the embodiment of the present application, by extending the condenser 21 to an area outside the board 10, the heat dissipation area can be effectively expanded without being limited by the space and layout of the board 10, thereby increasing the heat dissipation capacity. And by setting a quick-drawing device on the pipeline of the heat dissipation loop, the problem of quick connection and disconnection of the pipeline is solved. In this way, the condenser 21 can be arranged in an area other than the board 10, which can avoid the problem that the heat dissipation capacity of the condenser 21 is limited by the space and layout of the board 10, and at the same time reduce the occupied space of the board 10 and improve the device layout of the board. space. The condenser 21 can effectively adjust the size and heat dissipation area of the condenser 21 according to the chip power consumption and heat dissipation requirements, so as to achieve a more flexible heat dissipation effect. In addition, when the evaporating end inside the board 10 and the condensing end outside the board are plugged separately, after plugging and replacing under different temperature conditions, the total amount of cooling fluid in the entire heat dissipation loop should be kept as consistent as possible to ensure that the entire heat dissipation loop The cooling capacity of the circuit is consistent.
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the application without departing from the spirit and scope of the application. In this way, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims (11)

  1. 一种单板，其特征在于，包括：板体，设置在所述板体的蒸发器，以及埋设在所述板体内并用于输送工质的第一散热管道，其中，所述第一散热管道包括第一管道和第二管道；A veneer, characterized in that it includes: a board body, an evaporator disposed on the board body, and a first heat dissipation pipe embedded in the board body and used to transport working fluid, wherein the first heat dissipation pipe including a first pipeline and a second pipeline;
    所述第一管道和所述第二管道分别与所述蒸发器的输入端和输出端一一对应连接；The first pipeline and the second pipeline are respectively connected to the input end and the output end of the evaporator in a one-to-one correspondence;
    所述第一管道和所述第二管道远离所述蒸发器的一端分别设置有第一快拔接头；One end of the first pipeline and the second pipeline away from the evaporator is respectively provided with a first quick-pull joint;
    所述第一管道与所述蒸发器的输入端连接；且至少所述第一管道上设置有开关阀。The first pipeline is connected to the input end of the evaporator; and at least the first pipeline is provided with a switching valve.
  2. 如权利要求1所述的单板，其特征在于，所述第一管道和所述第二管道均设置有开关阀。The veneer according to claim 1, characterized in that, both the first pipeline and the second pipeline are provided with on-off valves.
  3. 如权利要求1或2所述的单板，其特征在于，所述开关阀为电磁控制阀；The veneer according to claim 1 or 2, wherein the switching valve is an electromagnetic control valve;
    所述单板还包括控制单元，所述控制单元用于控制所述电磁控制阀开闭。The single board also includes a control unit, which is used to control the opening and closing of the electromagnetic control valve.
  4. 如权利要求3所述的单板，其特征在于，所述控制单元为设置在所述板体上的控制电路，所述控制电路在所述单板与机柜的背板导电连通时，控制所述电磁控制阀导通。The single board according to claim 3, wherein the control unit is a control circuit arranged on the board body, and when the single board is electrically connected with the backplane of the cabinet, the control circuit controls The above solenoid control valve conducts.
  5. 如权利要求3所述的单板，其特征在于，所述单板还包括用于检测单板上热源温度的传感器；The veneer according to claim 3, wherein the veneer further comprises a sensor for detecting the temperature of the heat source on the veneer;
    所述控制单元在所述传感器检测的温度超过设定值时，控制所述电磁控制阀打开。The control unit controls the electromagnetic control valve to open when the temperature detected by the sensor exceeds a set value.
  6. 如权利要求2～5任一项所述的单板，其特征在于，所述第一管道上设置有积液腔。The veneer according to any one of claims 2-5, characterized in that, a liquid accumulation chamber is arranged on the first pipeline.
  7. 如权利要求6所述的单板，其特征在于，所述积液腔位于所述开关阀远离所述蒸发器的一侧。The veneer according to claim 6, wherein the liquid accumulation chamber is located on a side of the on-off valve away from the evaporator.
  8. 如权利要求1～7任一项所述的单板，其特征在于，所述第一管道、所述第二管道或所述蒸发器上设置有充液孔。The veneer according to any one of claims 1-7, wherein a liquid filling hole is arranged on the first pipeline, the second pipeline or the evaporator.
  9. 如权利要求1～8任一项所述的单板，其特征在于，所述蒸发器的个数为多个，且所述多个蒸发器并联。The veneer according to any one of claims 1-8, characterized in that there are multiple evaporators, and the multiple evaporators are connected in parallel.
  10. 一种机柜，其特征在于，包括柜体，设置在所述柜体内的冷凝器，以及用于传输工质的第二散热管道；所述第二散热管道包括第三管道和第四管道；A cabinet, characterized in that it includes a cabinet body, a condenser disposed in the cabinet, and a second heat dissipation pipe for transferring working fluid; the second heat dissipation pipe includes a third pipe and a fourth pipe;
    所述第三管道和所述第四管道分别与所述冷凝器的输入端和输出端一一对应连接；The third pipeline and the fourth pipeline are respectively connected to the input end and the output end of the condenser in a one-to-one correspondence;
    所述第三管道和所述第四管道远离所述冷凝器的一端分别设置有用于与第一快拔接头配合的第二快拔接头。The ends of the third pipeline and the fourth pipeline away from the condenser are respectively provided with second quick-pull joints for matching with the first quick-pull joints.
  11. 一种数据中心，其特征在于，包括如权利要求1～9任一项所述的单板，以及如权利要求10所述的机柜；其中，A data center, characterized by comprising the single board according to any one of claims 1 to 9, and the cabinet according to claim 10; wherein,
    所述第一快拔接头和所述第二快拔接头一一对应连接；The first quick-pull joint and the second quick-pull joint are connected in one-to-one correspondence;
    所述蒸发器和所述冷凝器通过所述第一散热管道和第二散热管道连通形成散热环路。The evaporator and the condenser communicate through the first heat dissipation pipe and the second heat dissipation pipe to form a heat dissipation loop.
PCT/CN2022/101861 2021-06-30 2022-06-28 Single board, cabinet, and data center WO2023274224A1 (en)

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Publication number Priority date Publication date Assignee Title
US20100243214A1 (en) * 2007-12-04 2010-09-30 Electronics and Telecommunications Research Insti tute Flat plate type micro heat transport device
CN106465562A (en) * 2015-10-23 2017-02-22 华为技术有限公司 Heat pipe cooling system and power equipment
CN109496110A (en) * 2018-12-13 2019-03-19 中国航天空气动力技术研究院 A kind of data center heat dissipation system of loop circuit heat pipe and refrigerating circulation direct connection
CN213126882U (en) * 2020-07-28 2021-05-04 华为技术有限公司 Heat dissipation rack and communication equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100243214A1 (en) * 2007-12-04 2010-09-30 Electronics and Telecommunications Research Insti tute Flat plate type micro heat transport device
CN106465562A (en) * 2015-10-23 2017-02-22 华为技术有限公司 Heat pipe cooling system and power equipment
CN109496110A (en) * 2018-12-13 2019-03-19 中国航天空气动力技术研究院 A kind of data center heat dissipation system of loop circuit heat pipe and refrigerating circulation direct connection
CN213126882U (en) * 2020-07-28 2021-05-04 华为技术有限公司 Heat dissipation rack and communication equipment

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