WO2023248458A1 - Shaping method and shaping device - Google Patents

Shaping method and shaping device Download PDF

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Publication number
WO2023248458A1
WO2023248458A1 PCT/JP2022/025269 JP2022025269W WO2023248458A1 WO 2023248458 A1 WO2023248458 A1 WO 2023248458A1 JP 2022025269 W JP2022025269 W JP 2022025269W WO 2023248458 A1 WO2023248458 A1 WO 2023248458A1
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WO
WIPO (PCT)
Prior art keywords
modeling
structural layer
thickness
distribution
height information
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PCT/JP2022/025269
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French (fr)
Japanese (ja)
Inventor
祐一 柴崎
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株式会社ニコン
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Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to PCT/JP2022/025269 priority Critical patent/WO2023248458A1/en
Publication of WO2023248458A1 publication Critical patent/WO2023248458A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding

Definitions

  • the present invention relates to a molding method and a molding apparatus for forming a molded object using, for example, an additive manufacturing (AM) method.
  • AM additive manufacturing
  • a modeling apparatus that forms a modeled object by stacking a plurality of structural layers (modeling layers) by repeating resolidification (see Patent Document 1). In such a modeling apparatus, it is required to improve the surface precision of the surface of the modeled object.
  • a modeling method in which a structure is formed by stacking a plurality of structural layers, and the thickness of the modeling material is determined according to the height information of the surface of the first structural layer.
  • a modeling method is provided that controls the thickness distribution of a modeling material of a second structural layer that is formed in an overlapping manner.
  • the first method includes controlling the thickness distribution of a building material of a second structural layer formed overlying the first structural layer by using a different first method and a second method in combination;
  • the second method includes changing the relative positional relationship between the material supply unit that supplies the modeling material and the modeling surface, and the second method includes controlling the intensity of the light beam irradiated to the modeling material.
  • a modeling method is provided.
  • a modeling apparatus that forms a structure by stacking a plurality of structural layers, and includes an irradiation section that irradiates a light beam onto a modeling surface, and an area that is irradiated with the light beam.
  • a material supply section that supplies the modeling material, a moving section that relatively moves the light beam and the modeling material, a first thickness control section that controls the thickness of the modeling material, and the first thickness control section.
  • a second thickness control section that controls the thickness of the modeling material at a spatial frequency higher than a compatible spatial frequency; and first and second thickness control sections thereof according to height information of the surface of the first structural layer.
  • a modeling apparatus is provided, which includes a modeling control unit that uses the modeling controller in combination with the modeling controller to control the thickness distribution of the modeling material of a second structural layer formed overlying the first structural layer.
  • a modeling apparatus that forms a structure by stacking a plurality of structural layers, including an irradiation section that irradiates a light beam onto a modeling surface, and an area that is irradiated with the light beam.
  • a material supply section that supplies a modeling material, and first and second thickness control sections whose corresponding spatial frequency components differ from each other according to the height information of the surface of the first structure layer are used together to create the first structure.
  • a modeling control section that controls the thickness distribution of the modeling material of the second structural layer formed in layers, and the first thickness control section controls the relative thickness distribution between the material supply section and the modeling surface.
  • a shaping device is provided, in which the second thickness control section is a change section that changes the positional relationship, and the second thickness control section is an intensity control section that controls the intensity of the light beam.
  • FIG. 1 is a cross-sectional view showing the modeling apparatus of the first embodiment.
  • (A) is a plan view showing an example of the arrangement of a plurality of light projectors
  • (B) and (C) are views showing an example of the relationship between the height of the modeling surface and the interval between two projected patterns.
  • (A) is a diagram showing when the distance between the material nozzle and the modeling surface is at the center of the variable range
  • (B) and (C) are diagrams showing when the distance is the longest and shortest in the variable range, respectively.
  • (A), (B), (C), and (D) are diagrams showing a process in which a convex pattern is formed on a workpiece by irradiating the modeling material with processing light and cooling it.
  • (A) is a cross-sectional view showing a state in which a pattern of the first structural layer is formed and the height distribution of the pattern after the formation is measured;
  • (B) is a view showing an example of a spatial frequency component with a low error distribution;
  • (C) is a diagram showing an example of a high spatial frequency component, and
  • (D) is a cross-sectional view showing a state in which the pattern of the second structural layer is formed and the height distribution of the pattern after the formation is measured.
  • (A), (B), and (C) are cross-sectional views showing the process of forming a line pattern as a three-dimensional structure.
  • (A), (B), and (C) are cross-sectional views each showing a process of modeling a three-dimensional structure.
  • (A) is a flowchart showing an example of the modeling method
  • (B) is a flowchart showing the operation of a modified example.
  • (A) is a cross-sectional view showing a state in which the pattern of the second structural layer is formed while measuring the height distribution of the surface of the first structural layer in a modified example
  • (B) is a cross-sectional view showing the state in which the pattern of the second structural layer is formed while measuring the height distribution of the surface of the first structural layer.
  • (C) is a diagram showing an example of a high spatial frequency component.
  • (A) is a diagram showing the case where the inclination angle of the material nozzle is at the center of the variable range
  • (B) and (C) are diagrams showing the case where the inclination angle is at the maximum and minimum of the variable range, respectively.
  • (A) is a cross-sectional view showing a state in which the height distribution of the surface of the pattern of the second structural layer is measured while measuring the height distribution of the surface of the first structural layer in the second embodiment;
  • (B) 3 is a diagram showing an example of a low spatial frequency component of an error distribution,
  • (C) is a diagram showing an example of a high spatial frequency component, and
  • (D) is a diagram showing an example of an error distribution when feedback control is also used.
  • a three-dimensional model is modeled (manufactured) using an additive manufacturing (AM) method in which materials such as metal or synthetic resin are sequentially added like a 3D printer.
  • AM additive manufacturing
  • the additive manufacturing method will also be referred to as the AM method.
  • a laser metal deposition (LMD) method (hereinafter referred to as "LMD"), which uses light such as a laser beam as an energy beam, is used as an AM method in a directed energy deposition method (DED method).
  • DED method directed energy deposition method
  • LMD methods can also be referred to as direct metal deposition, direct energy deposition, laser cladding, laser powder deposition, laser additive manufacturing, or laser rapid forming. .
  • FIG. 1 shows a modeling device 4 consisting of a 3D printer using the LMD method.
  • the positional relationships of various components constituting the modeling device 4 will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X, Y, and Z axes.
  • the plane formed by the X-axis and the Y-axis is parallel to the horizontal plane, and the Z-axis is perpendicular to the horizontal plane.
  • the direction parallel to the Z axis (Z direction) is parallel to the vertical direction
  • the -Z direction is the vertical direction.
  • the modeling device 4 places a three-dimensional structure ST (see FIG. 7(C)) (in any three-dimensional direction It is possible to form objects with size.
  • the modeling device 4 can form the three-dimensional structure ST on the stage 28.
  • the modeling device 4 can add a new structure onto the existing structure to form the three-dimensional structure ST.
  • the modeling device 4 may form a three-dimensional structure ST that is integrated with an existing structure.
  • the modeling device 4 may form a three-dimensional structure ST that is separable from an existing structure, or may form a three-dimensional structure ST so as to repair a damaged portion of an existing structure.
  • the modeling device 4 includes an irradiation optical system 30 that irradiates the workpiece W with a modeling light beam (hereinafter referred to as processing light) EL, and material nozzles 32A and 32B (material supply section) that supply the modeling material M to the workpiece W.
  • a drive system 26 that moves the printing head 24, a material supply device 12, a gas supply device 18, a recovery device 22 that recovers unsolidified modeling material, and controls the operation of the entire device.
  • a control device 20 is provided. Processing light EL generated by the light source 10 is supplied to the irradiation optical system 30 via an optical fiber 36.
  • the control device 20 controls the intensity (energy per unit time) of the processing light EL generated by the light source 10 via the light source control section 16.
  • the modeling section 14 includes a modeling head 24, a drive system 26, and a stage 28.
  • the intensity of the processing light EL emitted from the light source 10 may be controlled using a modulation device using, for example, an acousto-optic device (AOM) or the like.
  • AOM acousto-optic device
  • the material supply device 12 supplies the material nozzles 32A, 32B of the modeling head 24 with the amount of modeling material M required per unit time for the modeling unit 14 to form the three-dimensional structure ST.
  • the modeling material M is a material that can be melted by irradiation with processing light EL having a predetermined intensity or higher.
  • a modeling material M for example, at least one of a metallic material and a resinous material can be used.
  • the modeling material M other materials different from metal materials and resin materials may be used.
  • the modeling material M is a powder or granular material (powder material).
  • the modeling material M does not have to be a powder or granule, and for example, a wire-shaped modeling material or a gaseous modeling material may be used.
  • the modeling unit 14 processes the modeling material M supplied from the material supply device 12 to form a three-dimensional structure ST.
  • the modeling head 24 of the modeling section 14 includes an irradiation optical system 30 and material nozzles (supply system for supplying the modeling material M) 32A, 32B.
  • a suction port 22a connected to the collection device 22 via a flexible pipe (not shown) is supported by the modeling head 24 via a support member (not shown), for example.
  • the modeling head 24, drive system 26, and stage 28 are housed in a space 8IN within the chamber 8.
  • the irradiation optical system 30 is optically connected to the light source 10 via an optical fiber 36.
  • a light transmission member such as a light guide can be used instead of the optical fiber 36.
  • the light emitted from the light source 10 may be directly supplied to the irradiation optical system 30.
  • the light source 10 is, for example, a laser light source that emits laser light of at least one wavelength among infrared, visible, and ultraviolet wavelengths as processing light EL. However, other types of light may be used as the processing light EL.
  • a gas laser such as a CO 2 laser or an excimer laser
  • a solid laser such as a neodymium YAG (Nd:YAG) laser or a yttrium (YVO 4 ) laser
  • a semiconductor laser LD Laser Diode
  • the light source 10 may emit continuous light or pulsed light.
  • the processing light EL does not need to be a laser beam, and the light source 10 may include any light source (for example, at least one of an LED (Light Emitting Diode) or a discharge lamp).
  • the timing and intensity of light emission (energy per unit time) of the light source 10 are controlled by the light source control unit 16.
  • the irradiation optical system 30 includes a condenser lens system (not shown) that condenses the processed light EL emitted from the optical fiber 36 and converts it into a parallel beam, and a condenser lens that focuses the processed light EL on the modeling surface CS. system 30a.
  • the modeling surface CS is arranged at a focusing plane (focus position) near the rear focal plane of the condenser lens system 30a, and the optical axis AX of the condenser lens system 30a is parallel to the Z axis.
  • the irradiation optical system 30 emits the processing light EL propagated from the light source 10 via the optical fiber 36 downward (in the ⁇ Z direction) along the optical axis AX.
  • the irradiation optical system 30 irradiates the processing light EL toward the workpiece W on the stage 28.
  • the irradiation optical system 30 can irradiate the irradiation area EA set on the workpiece W with the processing light EL.
  • the state of the irradiation optical system 30 is switchable under the control of the control device 20 between a state in which the irradiation area EA is irradiated with the processing light EL and a state in which the irradiation area EA is not irradiated with the processing light EL.
  • the direction of the processing light EL emitted from the irradiation optical system 30 is not limited to directly below (-Z direction), but may be, for example, a direction inclined at a predetermined angle with respect to the Z axis.
  • the modeling head 24 also includes light projecting units 44A and 44B that are arranged to sandwich the irradiation optical system 30 in the Y direction and project two circular spot lights GLA and GLB obliquely onto the modeling surface, respectively, and Light projecting units 44C and 44D (see FIG. 2A) that are arranged to sandwich the optical system 30 in the X direction and project two circular spot lights GLC and GLD obliquely onto the modeling surface, respectively, and irradiation optics.
  • Light projecting units 44E, 44F, 44G, and 44H are arranged to sandwich the system 30 in an oblique direction and project two circular spot lights GLE, GLF, GLG, and GLH obliquely onto the modeling surface, respectively (Fig.
  • the light projecting sections 44A to 44H, the imaging device 46, and the imaging signal processing section 48 constitute a height measuring device 42 that measures the height distribution of the surface of the printing surface CS or the pattern formed.
  • an error calculation section 50 a high-pass filter section 52H, and a low-pass filter section 52L for processing the height distribution signal RS are also provided (the functions of these sections will be described later). Note that any method may be used to measure the height of the modeling surface, etc., and for example, the height may be measured using a proximity sensor, an air micrometer, or the like.
  • the material nozzles 32A and 32B connected to the material supply device 12 are arranged symmetrically and inclined so as to sandwich the irradiation optical system 30 in the Y direction.
  • the modeling head 24 is provided with drive mechanisms 34A and 34B for controlling the positions of the material nozzles 32A and 32B in the Z direction. Note that the number of material nozzles 32A, 32B may be three or more.
  • the control device 20 can control the positions of the material nozzles 32A, 32B in the Z direction (relative positions in the Z direction with respect to the modeling surface CS) by driving the drive mechanisms 34A, 34B via the nozzle control unit 60.
  • the material nozzles 32A and 32B each supply (specifically, inject, jet, or spray) the modeling material M from the supply port in an oblique direction to the modeling surface CS.
  • the material nozzles 32A, 32B are physically connected to the material supply device 12, which is a supply source of the modeling material M, via a flexible pipe 54 or the like.
  • the material nozzles 32A, 32B may force-feed the modeling material M supplied from the material supply device 12 via the pipe 54 or the like to the modeling surface CS.
  • a mixture of the modeling material M from the material supply device 12 and a transporting gas (for example, an inert gas such as nitrogen or argon) is fed under pressure to the material nozzles 32A and 32B via the pipe 54, and the material nozzle The mixture may be pumped from 32A and 32B.
  • a transporting gas for example, an inert gas such as nitrogen or argon
  • the material nozzles 32A and 32B are drawn in a tube shape in FIG. 1, the shape of the material nozzle 32 is not limited to this shape.
  • the material nozzles 32A and 32B supply the modeling material M toward the workpiece W on the stage 28.
  • the traveling direction of the modeling material M supplied from the material nozzles 32A and 32B is a direction symmetrically inclined by a predetermined angle (an acute angle as an example) with respect to the Z axis.
  • the material nozzles 32A and 32B supply the modeling material M toward the irradiation area EA where the irradiation optical system 30 irradiates the processing light EL.
  • the material nozzles 32A, 32B and the irradiation optical system 30 are aligned.
  • a drive system 26 including, for example, a motor and an encoder for position detection moves the modeling head 24 along at least one of the X-axis, Y-axis, and Z-axis.
  • the irradiation area EA moves on the workpiece W along at least one of the X-axis and the Y-axis.
  • the drive system 26 may tilt the printing head 24 in at least one of the ⁇ x direction, the ⁇ y direction, and the ⁇ z direction, which are rotational directions around axes parallel to the X, Y, and Z axes. good.
  • the control device 20 is provided with a control section 56 that controls the operation of the drive system 26.
  • the drive system 26 may move the irradiation optical system 30 and the material nozzles 32A, 32B separately. Specifically, for example, the drive system 26 can adjust at least one of the position and direction of the emission part (tip part) of the irradiation optical system 30, the position of the supply ports of the material nozzles 32A and 32B, and the direction thereof. It may be. In this case, the irradiation area EA where the irradiation optical system 30 irradiates the processing light EL and the supply area MA where the material nozzles 32A and 32B supply the modeling material M can be controlled separately. Note that the drive system 26 may allow the modeling head 24 to rotate around an axis parallel to an axis (rotation axis) that is inclined with respect to an axis parallel to the X axis and the Y axis.
  • the stage 28 can hold and release the workpiece W via a mechanical chuck, a vacuum suction chuck, or the like.
  • the stage 28 can move and/or rotate the workpiece W relative to the modeling head 24 in directions along the X, Y, and Z axes, and in rotational directions in the ⁇ x, ⁇ y, and ⁇ z directions.
  • the control device 20 is provided with a control section 58 that controls the operation of the stage 28.
  • the irradiation optical system 30 irradiates the processing light EL, and the material nozzles 32A and 32B supply the modeling material M.
  • the modeling device 4 includes a recovery device 22 that collects the modeling material M that remains unsolidified on the stage 28 or the workpiece W (modeling layer) and the modeling material M that has been scattered or fallen around the stage 28. We are prepared.
  • the gas supply device 18 is a supply source of purge gas.
  • the purge gas includes an inert gas (nitrogen gas, helium gas, argon gas, etc.).
  • Gas supply device 18 supplies purge gas into chamber 8 via pipe 38 .
  • the internal space 8IN of the chamber 8 becomes a space filled with purge gas.
  • the gas supply device 18 may be a cylinder storing inert gas, or if the inert gas is nitrogen gas, it may be a device that separates nitrogen gas from the atmosphere. A part of the purge gas is also supplied from the gas supply device 18 to the material supply device 12 as needed.
  • the control device 20 controls the operation of the modeling device 4.
  • the control device 20 includes, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a memory, an input/output unit, etc., and a storage device (storage medium) 40.
  • three-dimensional model data of a modeling object is output from a server (not shown) to the control device 20.
  • the control device 20 slices the three-dimensional model data to create modeling data of a plurality of structural layers.
  • the modeling material M is supplied to the supply area MA on the workpiece W
  • the light EL is supplied to the irradiation area EA, which is at least partially the same as the supply area MA.
  • the structure is modeled on the workpiece W by controlling the irradiation, the movement of the modeling head 24 by the drive system 26, and/or the movement of the workpiece W by the stage 28.
  • the control device 20 functions as a device that controls the operation of the modeling device 4 by the CPU executing a computer program.
  • This computer program is a computer program for causing the control device 20 (for example, CPU) to execute operations to be performed by the modeling device 4.
  • the computer program executed by the CPU may be recorded in the storage device 40 or in a storage medium (for example, a hard disk, CD-ROM, DVD-RAM, semiconductor memory, etc.) that can be connected to the storage device 42. You can leave it there.
  • the control device 20 may download the computer program to be executed from a device external to the control device 20 via a network interface.
  • the control device 20 does not need to be installed inside the room in which the chamber 8 of the modeling device 4 is installed, and may be installed as a server or the like outside the room, for example.
  • the control device 20 controls the emission mode of the light EL by the irradiation device 10 via the light source control section 16.
  • the injection mode includes, for example, at least one of the intensity of the processing light EL and the injection timing of the processing light EL.
  • the emission mode is, for example, the emission frequency of the pulsed light, the length of the emission time of the pulsed light, and the ratio of the emission time and extinction time of the pulsed light (so-called duty ratio). It may contain at least one of the following.
  • the control device 20 controls the movement mode of the modeling head 24 by the drive system 26 via the control unit 56 and controls the movement mode of the stage 28 via the control unit 58.
  • the movement mode includes, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing. Furthermore, the control device 20 controls the supply mode of the modeling material M by the material nozzles 32A and 32B.
  • the supply mode includes, for example, at least one of the supply amount (particularly the supply amount per unit time), the thickness of the modeling material to be supplied, and the supply timing.
  • the irradiation optical system 30 is directed at a constant distance from the irradiation optical system 30 to the building surface CS.
  • the processing light EL is irradiated with the output of The EL moves at a constant scanning speed with respect to the modeling material M. Therefore, ideally, the surface of each structural layer after modeling should be almost completely flat.
  • the shape of the structural layer stacked below the layer concerned is not uniform, and therefore the heat capacity is also not uniform. Heat diffusion due to the supplied processing light EL is not uniform.
  • the diameter and depth of the molten pool will vary; for example, if the molten pool is large, more modeling material will be melted and a thicker layer will be added, and if the molten pool is small, less material will be added. As the layer becomes thinner, irregularities occur on the surface of the structural layer after modeling. In other words, even if modeling is performed under the above-mentioned constant conditions, the height distribution of the surface of each structural layer after modeling will have an error with respect to the target distribution.
  • such height distribution errors are corrected by controlling the thickness distribution of the modeling material M supplied to the modeling surface CS and controlling the intensity of the processing light EL as described below.
  • processing by the irradiation optical system 30 is performed from a plurality of (eight in this case) light projecting parts 44A to 44H of the height measuring device 42 arranged so as to surround the irradiation optical system 30.
  • Two spot lights GLA to GLH are diagonally projected onto areas distant from the irradiation area EA of the light EL toward the light projecting units 44A to 44H.
  • the two spot lights GLA to GLH are projected so that the interval becomes gradually narrower.
  • the position Zbf means the Z position of the focusing plane (the plane on which the processing light EL is focused the smallest) with respect to the irradiation optical system 30.
  • the interval h1 of the spot lights GLA is smaller than the interval h2
  • Z1 is, for example, the upper limit of the expected amount of variation
  • the interval h3 between the two spot lights GLA is larger than the interval h2. Therefore, if the interval between the spot lights GLA is h, the relationship with the height Z of the modeling surface CS using the coefficients a and b is, for example, as follows.
  • the coefficients a, b and the position Zbf are determined in advance, for example, by actual measurement, and the coefficients a, b and the position Zbf are stored in the imaging signal processing unit 48 in FIG. 1.
  • h a+b(Z-Zbf)...(1)
  • the imaging signal processing unit 48 processes the imaging signal of the imaging device 46 to determine the interval h between the corresponding spot lights GLA to GLH for each of the light projectors 44A to 44H, and calculates the interval h between the corresponding spot lights GLA to GLH with respect to each of the light projecting units 44A to 44H. Using the position Zbf, the height (Z position) of the portion where the spot lights GLA to GLH are projected can be calculated from equation (1).
  • the height (position Z) determined from the spot light GLA of the light projecting section 44A is This is the height of the surface of the layer after modeling
  • the height (position Z) determined from the spot light GLB of the light projecting section 44B is the height of the surface of the structural layer below the structural layer. Therefore, by determining the height from the interval between the front and rear spot lights GLA to GLH in the moving direction relative to the printing surface CS of the printing head 24, the height of the structural layer after printing and the structure below can be calculated. The height of the surface of the layer can be measured.
  • a height distribution signal RS (indicating the relationship between the relative movement direction and the height (Z position) signal) is output to the error calculation section 50.
  • the error calculation unit 50 is supplied with information on the target distribution of the surface height distribution of each structural layer from the control device 20.
  • the error calculation section 50 subtracts the signal representing the target distribution from the height distribution signal RS to obtain a signal representing the error component, and supplies the signal representing the error component to the high-pass filter section 52H and the low-pass filter section 52L.
  • the high-pass filter section 52H extracts a high spatial frequency signal HS whose spatial frequency is higher than a predetermined threshold SPF from the signal representing the error component
  • the low-pass filter section 52L extracts a high spatial frequency signal HS whose spatial frequency is lower than the threshold SPF from the signal representing the error component.
  • Extract the spatial frequency signal LS extracts the spatial frequency signal LS.
  • the high spatial frequency signal HS and the low spatial frequency signal LS are each supplied to the control device 20.
  • the spatial frequency threshold SPA is, for example, about 0.1 mm ⁇ 1 (about 10 mm in terms of wavelength).
  • the threshold value SPA is a value that changes depending on the relative speed between the printing head 24 and the workpiece W by the drive system 26 and/or the stage 28, and the threshold value SPA is, for example, about 0.05 to 0.2 mm -1 (wavelength (about 20 to 5 mm) may be sufficient.
  • the control device 20 also controls the output (intensity per unit time) of the light source 10 via the light source control unit 16 so as to correct errors in the height distribution of high spatial frequencies corresponding to the high spatial frequency signal HS. Then, the distances of the material nozzles 32A and 32B to the modeling surface CS are controlled via the nozzle control unit 60 so as to correct errors in the height distribution of low spatial frequencies corresponding to the low spatial frequency signal LS.
  • the material nozzles 32A and 32B are symmetrically inclined so that the irradiation optical system 30 is sandwiched therebetween.
  • the modeling surface CS coincides with the focal plane BF of the irradiation optical system 30 in a normal modeling operation.
  • the modeling material M supplied from the material nozzles 32A, 32B is It is assumed that the angles of the material nozzles 32A and 32B are set so that they overlap in the concentrated region 62 by a predetermined amount below the focal plane BF (in the -Z direction). The distance ⁇ z in the Z direction between the focused area 62 and the focal plane BF is determined from the drive amount of the drive mechanisms 34A and 34B.
  • the amount of the modeling material 64 supplied to the modeling surface CS per unit time can be increased.
  • the thickness th can be largely controlled, and the thickness of the pattern finally formed on the modeling surface CS can also be largely controlled. Therefore, in FIG. 3A, there is a difference between the distance ⁇ z of the concentrated region 62 in the ⁇ Z direction with respect to the focusing plane BF and the thickness th of the modeling material 64 supplied per unit time to the modeling surface CS.
  • the control device 20 determines the interval ⁇ z by driving the drive mechanisms 34A and 34B, and uses this interval ⁇ z and the known coefficients c and d to calculate the amount of modeling that is supplied from the material nozzles 32A and 32B to the modeling surface CS per unit time.
  • the thickness th of the material 64 can be determined.
  • the control device 20 can control the thickness th of the modeling material 64 supplied to the modeling surface CS by controlling the positions of the material nozzles 32A, 32B in the Z direction with the nozzle control unit 60.
  • the thickness of the pattern of the modeling material formed by irradiating the modeling material 64 with the processing light EL, melting, cooling, and solidification can also be controlled.
  • the thickness th of the modeling material 64 can be greatly changed, and the thickness of the pattern that is finally formed can also be greatly controlled.
  • the control of the positions of the material nozzles 32A and 32B is mechanical control, and the response speed is not very high, so it is not suitable for controlling the height of the high spatial frequency component corresponding to the high spatial frequency signal HS. do not have. Therefore, in this embodiment, the height of the low spatial frequency component corresponding to the low spatial frequency signal LS is controlled by controlling the thickness of the modeling material by controlling the positions of the material nozzles 32A and 32B.
  • FIGS. 4(A) to 4(D) a method for controlling the thickness of the modeling material by controlling the intensity of the processing light EL will be explained with reference to FIGS. 4(A) to 4(D).
  • FIG. 4(A) when the processing light EL is irradiated onto the modeling surface CS of the workpiece W and the modeling material M is supplied to the irradiation area, as shown in FIG. 4(B), the modeling surface CS is A molten pool MP is formed. Then, as shown in FIG. 4C, a part of the material 66 of the supplied modeling material M is fused by the molten pool MP.
  • the processing light EL passes therethrough, and as a result of cooling and solidification, the portion corresponding to the material 66 becomes a convex pattern 66A, as shown in FIG. 4(D).
  • the intensity of the processing light EL emitted from the light source 10 increases under the control of the light source control unit 16 in FIG. Since the amount to be fused increases, the finally formed pattern 66B is higher than the pattern 66A. Conversely, when the intensity of the processing light EL decreases, the pattern finally formed will be lower than the pattern 66A.
  • the thickness of the pattern formed in the structural layer can be controlled. Furthermore, electrical (or optical) control of the intensity of the light source 10 by the light source control unit 16 can be performed faster than mechanical control of the positions of the material nozzles 32A, 32B. However, the amount of control of the thickness of the pattern formed in the structural layer by controlling the intensity of the light source 10 is smaller than the amount of control of the thickness of the pattern by mechanically controlling the positions of the material nozzles 32A, 32B. Therefore, controlling the intensity of the processing light EL is suitable for controlling the height of the high spatial frequency component corresponding to the high spatial frequency signal HS.
  • FIGS. 5(A) to 5(D). First, as shown in FIG. 5(A), the surface of the workpiece W is irradiated with processing light EL from the irradiation optical system 30, the modeling material M is supplied from the material nozzles 32A and 32B to the irradiation area of the processing light EL, and the workpiece It is assumed that the pattern of the first structural layer 68A is formed by moving the printing head 24 relative to W, for example, in the -Y direction.
  • the target shape of the surface of the first structural layer 68A is, for example, a flat target distribution 70A shown by a dotted line.
  • an image of spot light GLA is projected onto the surface of the pattern immediately after printing from the light projection unit 44A located at the rear in the scanning direction from the irradiation optical system 30 in the printing head 24.
  • An image is captured by the imaging device 46 in FIG. 1, and the height distribution of the surface 68Aa of the pattern of the first structural layer 68A immediately after modeling is measured.
  • the error signal is obtained by subtracting the signal of the target distribution in the error calculation section 50 from the distribution signal RS output from the imaging signal processing section 48 in FIG.
  • the low-pass filter section 52L and the high-pass filter section 52H produce a low spatial frequency signal LS with a low spatial frequency (long wavelength) as shown in FIG.
  • a high spatial frequency signal HS with a high spatial frequency (short wavelength) of 5(C) is supplied to the control device 20.
  • the high spatial frequency signal HS in FIG. 5(C) corresponds to the small wavelength and small amplitude fluctuation portions 69A and 69B of the height distribution in FIG. 5(A).
  • the material nozzles 32A and 32B are used to form the material in the irradiation area of the processing light EL.
  • the control device 20 corrects the Z positions of the material nozzles 32A and 32B via the nozzle control section 60 using a feedforward control method.
  • control device 20 controls the output (intensity) of the light source 10 via the light source control unit 16 using the feedforward control method so as to correct the error in the height distribution indicated by the high spatial frequency signal HS in FIG. 5(C). Control.
  • the low spatial frequency signal LS and the high spatial frequency signal HS are measured in advance, when modeling the second structural layer 68B, the thickness of the modeling material M at each position is measured in advance. It can be controlled using a feedforward method to cancel out the errors that occur.
  • the target shape of the surface of the second structural layer 68B is also a flat target distribution 70B shown by a dotted line, for example.
  • the unevenness of the surface 68Ba after modeling by build-up of the second structural layer 68B becomes small, and the surface accuracy (flatness) after modeling becomes small. etc.) will be improved.
  • the image of the spot light GLA projected onto the surface of the pattern immediately after printing from the light projection unit 44A located behind the irradiation optical system 30 in the scanning direction in the printing head 24 is also shown.
  • the first imaging device 46 takes an image and measures the height distribution of the surface 68Ba of the pattern of the second structural layer 68B immediately after modeling.
  • This error in the height distribution from the target distribution 70B is corrected when forming the third structural layer (not shown) on the second structural layer 68B.
  • this control method even if printing is performed under certain conditions, the height distribution of the surface after printing of each structural layer will have an error distribution with respect to the target distribution due to the non-uniformity of thermal diffusion as described above.
  • By controlling the thickness distribution of the structural layer above it so as to cancel out the error distribution when printing the structural layer above it it is possible to target the surface accuracy of the surface of the structure after printing. It can be finished to the desired precision.
  • the modeling device 4 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed.
  • the three-dimensional model data (hereinafter also referred to as 3D data) is supplied to the control device 20 of the modeling device 4 from, for example, a server (not shown).
  • 3D data measurement data of a three-dimensional object measured by a shape measuring device etc. (not shown) provided in the modeling device 4, measurement data of a three-dimensional shape measuring device etc. provided separately from the modeling device 4. may also be used.
  • the modeling device 4 creates a plurality of partial structures (hereinafter also referred to as structural layers) SL obtained by, for example, cutting the three-dimensional structure ST into rounds along the Z direction. are formed one layer at a time.
  • structural layers hereinafter also referred to as structural layers
  • a three-dimensional structure ST which is a layered structure in which a plurality of structural layers SL are stacked, is formed.
  • a flow of operations for forming a three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.
  • the modeling device 4 sets an irradiation area EA in a desired area on the modeling surface CS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL, and Processing light EL is irradiated from the irradiation optical system 30.
  • the focal plane (that is, the condensing position) of the processing light EL coincides with the modeling surface CS.
  • a molten pool (that is, a pool of metal melted by the light EL) MP is formed in a desired area on the modeling surface CS by the processing light EL emitted from the irradiation optical system 30. be done. Furthermore, under the control of the control device 20, the modeling device 4 sets a supply area MA in a desired area on the modeling surface CS, and supplies the modeling material M to the supply area MA from the material nozzles 32A, 32B. Here, the supply area MA is set in the area where the molten pool MP is formed. For this reason, the modeling device 4 supplies the modeling material M from the material nozzles 32A and 32B to the molten pool MP, as shown in FIG. 6(B).
  • the modeling material M supplied to the molten pool MP is melted.
  • the modeling material M melted in the molten pool MP is cooled and solidified again (that is, solidified).
  • the solidified modeling material M (part of the object) is deposited on the object surface CS.
  • a series of modeling processes including forming a molten pool MP by irradiating the light EL, supplying the modeling material M to the molten pool MP, melting the supplied modeling material M, and resolidifying the melted modeling material M, This process is repeated while moving the printing head 24 relatively to the printing surface CS along the XY plane. That is, when the printing head 24 moves relative to the printing surface CS, the irradiation area EA also moves relatively to the printing surface CS. Therefore, a series of modeling processes are repeated while moving the irradiation area EA along the XY plane (that is, within a two-dimensional plane) relative to the modeling surface CS.
  • the processing light EL is selectively irradiated to the irradiation area EA set in the area where the object is to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed.
  • the irradiation area EA set in the area is not selectively irradiated (it can also be said that the irradiation area EA is not set in the area where it is not desired to form a modeled object).
  • the modeling device 4 moves the irradiation area EA along a predetermined movement locus on the modeling surface CS, and adjusts the pattern according to the distribution pattern of the area in which the object is to be formed (that is, the object in the structural layer SL).
  • the processing light EL is irradiated onto the modeling surface CS at the appropriate timing.
  • the molten pool MP also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA.
  • the molten pool MP is sequentially formed on the modeling surface CS in the portions irradiated with the processing light EL among the regions along the movement locus of the irradiation area EA.
  • the supply area MA also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. Become.
  • a structural layer SL corresponding to an aggregate of objects made of the solidified modeling material M is formed on the modeling surface CS.
  • a structural layer SL corresponding to an aggregate of shaped objects formed on the shaped surface CS in a pattern according to the movement locus of the molten pool MP is formed.
  • the supply of the modeling material M may be stopped while irradiating the processing light EL to the irradiation area EA.
  • the modeling material M is supplied to the irradiation area EL, and the irradiation area EL is irradiated with light EL with an intensity that does not create a molten pool MP. You can.
  • the movement trajectory of the irradiation area EA on the workpiece W may be either a movement trajectory corresponding to scanning in so-called raster scanning or a movement trajectory corresponding to scanning in so-called vector scanning.
  • the irradiation area EA was moved with respect to the printing surface CS by moving the printing head 24 (that is, the light EL) with respect to the printing surface CS, but even if the printing surface CS is moved, Alternatively, both the printing head 24 (that is, the processing light EL) and the printing surface CS may be moved.
  • step 102 the control device 20 creates slice data by slicing the three-dimensional model data at a stacking pitch, and stores the slice data in the storage device 40. Note that data obtained by partially modifying this slice data according to the characteristics of the modeling device 4 may be used. Then, the control device 20 reads the modeling pattern data for the next structural layer to be modeled. In the next step 104, the control device 20 causes the light source 10 to start emitting the processing light EL via the light source control unit 16.
  • step 106 the supply of the modeling material M from the material nozzles 32A and 32B is started, and in step 108, the processing light EL (light beam) and the modeling material M are moved relative to each other by the drive system 26 and/or the stage 28. Then, modeling is done by overlaying.
  • step 110 in parallel with the operations in steps 106 and 108, the height distribution of the surface of the part (pattern) formed by this structural layer is measured using the height measuring device 42, as in FIG. 5(A). is measured.
  • step 112 it is determined whether or not the modeling of this layer has been completed. If the modeling has not been completed, the operations of steps 106 and 108 and the operation of step 110 are executed in parallel.
  • the supply of the modeling material is stopped and the light source 10 stops emitting light.
  • a first structural layer SL#1 is formed on the modeling surface CS corresponding to the surface of the workpiece W.
  • the process moves to step 114, and the error calculation unit 50 calculates an error distribution signal from the height distribution signal RS of the formed structural layer.
  • step 116 the error distribution signal is supplied to the low-pass filter section 52L and the high-pass filter section 52H, and a low spatial frequency signal LS and a high spatial frequency signal HS are extracted, respectively.
  • the extracted signals LS and HS are stored in the storage device 40.
  • the control device 20 reads the modeling pattern data for the next structural layer to be modeled. Then, as shown in FIG. 7(B), the surface of the structural layer SL#1 is set as a new modeling surface CS, and a second structural layer SL#2 is formed on this new modeling surface CS. do.
  • the control device 20 first controls the drive system 26 so that the printing head 24 moves along the Z-axis. Specifically, the control device 20 controls the drive system 26 to set the +Z The printing head 24 is moved in the direction. Thereby, the focal plane of the processing light EL coincides with the new modeling surface CS.
  • the low spatial frequency component is corrected by controlling the Z positions of the material nozzles 32A and 32B in step 120, and the output of the processing light EL emitted from the light source 10 is corrected in step 122.
  • Correction of high spatial frequency components by control and modeling by relative movement of the processing light EL and the modeling material M in step 124 are performed. Note that the operations of steps 120, 122, and 124 are performed substantially in parallel.
  • step 126 similarly to step 110, the height distribution of the surface of the portion (pattern) formed by this structural layer is measured using the height measuring device 42. be done.
  • the output (intensity per unit time) of the processing light EL is, for example, , when the thickness of the modeling material supplied to the modeling surface CS is the thickest, the output may be set such that the entire thickness of the modeling material can be melted.
  • the output of the processing light EL is set to an output that can melt the thickness of the modeling material when the thickness of the modeling material is at the median of the variable range, and the material nozzle 32A , 32B, the output of the processing light EL may be increased or decreased depending on the thickness.
  • step 124 even if the thickness of the supplied modeling material is constant, the thickness of the modeling material after modeling can be controlled within a certain range by controlling the output of the processing light EL.
  • step 128 if the modeling of this layer is not completed, the operations of steps 120 to 124 and step 126 are repeated. If the modeling of this layer is finished, the operation moves to step 130, where it is determined whether the modeling is finished. If the modeling is not completed, the operation moves to step 114, where the modeling of the next structural layer is performed while correcting the thickness distribution of the building material to correct the error in the height distribution of the previous layer. It will be done. In this way, as shown in FIG. 7(C), a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.
  • the height distribution after printing is measured when printing the previous layer, and when printing the next layer, the thickness of the printing material is controlled so as to cancel out the error distribution of the height distribution of the previous layer. Accordingly, the surface precision (flatness, etc.) of the surface of the structure after modeling can be improved.
  • the modeling method of the modeling apparatus 4 of this embodiment is a modeling method in which a structure is formed by stacking a plurality of structural layers, and the height distribution signal of the surface of the first structural layer 68A is A first method of controlling the thickness of the modeling material according to RS (height information) (a method of controlling the Z position of the material nozzles 32A, 32B), and a method of controlling the thickness of the modeling material according to the spatial frequency component corresponding to the first method.
  • the second structural layer 68B formed overlapping the first structural layer 68A is combined with the second method of controlling the thickness of the modeling material regarding high spatial frequency components (method of controlling the intensity of the processing light EL).
  • the thickness distribution of the modeling material is controlled (steps 120, 122, 124).
  • the modeling apparatus 4 of this embodiment is a modeling apparatus that forms a structure by stacking a plurality of structural layers, and includes an irradiation optical system 30 ( irradiation unit), material nozzles 32A, 32B (material supply unit) that supplies the modeling material M to the area irradiated with the processing light EL, a drive system 26 and a stage 28 that relatively move the processing light EL and the modeling material M. (moving unit), drive mechanisms 34A, 34B and a nozzle control unit 60 (hereinafter also referred to as a first thickness control unit) that control the Z positions of the material nozzles 32A, 32B in order to control the thickness of the modeling material.
  • irradiation optical system 30 irradiation unit
  • material nozzles 32A, 32B material supply unit
  • drive system 26 and a stage 28 that relatively move the processing light EL and the modeling material M.
  • a nozzle control unit 60 hereinafter also referred to as a first thickness control unit
  • a light source control section 16 (hereinafter referred to as a second thickness control section) that controls the intensity of the processing light EL in order to control the thickness of the modeling material at a spatial frequency higher than the spatial frequency that the first thickness control section can handle. ), and the first thickness control section and the second thickness control section are used in combination according to the height distribution signal RS (height information) of the surface of the first structure layer 68A.
  • the thickness of the modeling material (the build-up amount ) is controlled. Therefore, even if the height distribution on the surface of the first structural layer 68A deviates from the target distribution due to non-uniformity of thermal diffusion or the like during the modeling of the first structural layer 68A, the second structural layer 68B By controlling the thickness distribution of the modeling material during modeling, the surface accuracy (flatness, etc.) of the surface of the second structural layer 68B can be improved.
  • the thickness distribution includes not only the unevenness distribution on the surface but also the distribution of the thickness itself. For example, by flattening the unevenness distribution as the thickness distribution, the surface accuracy (flatness, etc.) of the surface of the structure can be improved. Moreover, by controlling the thickness distribution of the modeling material so that it becomes a target distribution, it is possible to model the structural layer with a desired thickness distribution or a uniform thickness distribution.
  • the height measurement device 42 measures the height distribution of the surface of the pattern of the first structural layer 68A after forming, and this measurement result is used in the next step. It is used when forming the pattern of the two-structure layer 68B. For this reason, modeling can be performed more efficiently than when the height distribution of the surface of the pattern of the first structural layer 68A is separately measured.
  • a measurement process for measuring the height distribution of the surface of the first structural layer 68A may be provided between the forming process of the first structural layer 68A and the forming process of the second structural layer 68B.
  • step 126 in FIG. 8A of the above-described embodiment the height distribution of the surface of the portion where the modeling has been completed is measured during the modeling of the structural layer.
  • step 126A of FIG. 8(B) as shown in FIG. 9(A), when printing the second structural layer 68B, the irradiation optical system is An image of the spot light GLB projected onto the surface of the first structural layer 68A from the light projecting unit 44B located in front of the scanning direction from 30 is captured by the imaging device 46 of FIG. The distribution of heights may also be measured.
  • an error distribution signal of the height distribution of the surface 68Aa of the first structural layer 68A is obtained, and in the next step 116A, a low spatial frequency signal LS and a high spatial frequency signal are obtained from the error distribution signal. Extract the signal HS.
  • steps 126A, 114A, and 116A are performed on the area in front of the area where the processing light EL is irradiated and the printing material M is supplied from the printing head 24 in FIG. 9(A). It is being said.
  • the position Y2 is A low spatial frequency signal LS and a high spatial frequency signal HS are obtained up to the forward position Y1.
  • the second structural layer 68B is formed in a feedforward manner so as to cancel out the error distribution on the surface of the first structural layer 68A determined in step 116A.
  • the second structural layer 68A can be shaped while correcting the thickness of the material. That is, in this modification, it is possible to measure the height distribution of the surface of the previous layer and to control the thickness of the modeling material of the layer in almost real time using this measurement result. Therefore, there is no need to measure and store the height distribution of the surface of the previous layer in advance when modeling the previous layer.
  • the correction of the low spatial frequency components of the error distribution of the height distribution is performed by controlling the positions of the material nozzles 32A and 32B in the Z direction.
  • the error distribution may be corrected by controlling the angles of the material nozzles 32A and 32B.
  • material nozzles 32A and 32B for supplying the modeling material M are symmetrically provided in the modeling head 24 so as to sandwich the irradiation optical system 30 therebetween.
  • the material nozzles 32A, 32B are rotatably supported relative to the modeling head 24.
  • drive mechanisms 34C and 34D for rotating the material nozzles 32A and 32B with respect to the modeling head 24 are provided.
  • the configuration other than this is the same as the above embodiment.
  • the modeling surface CS matches the focal plane BF of the irradiation optical system 30 in normal modeling operations.
  • the modeling material M supplied from the material nozzles 32A, 32B is It is assumed that the angles of the material nozzles 32A and 32B are set so that they overlap in the concentrated region 62 by a predetermined amount below (-Z direction) with respect to BF.
  • the distance in the Z direction between the focused area 62 and the focal plane BF is determined from the drive amount of the drive mechanisms 34A and 34B.
  • the thickness th2 of the modeling material 64 supplied to the modeling surface CS per unit time is approximately 1/2 of the thickness th1.
  • the thickness th of the building material 64 supplied to the building surface CS per unit time can be greatly controlled. can do. Therefore, the thickness distribution of the pattern finally formed on the modeling surface CS can also be greatly controlled.
  • the distance is determined by driving the drive mechanisms 34C and 34D, and from this distance, the thickness th of the modeling material 64 supplied from the material nozzles 32A and 32B to the modeling surface CS per unit time is determined. be able to.
  • the control device 20 can control the thickness th of the modeling material 64 supplied to the modeling surface CS by controlling the rotation angles of the material nozzles 32A, 32B with the nozzle control unit 60.
  • the thickness of the pattern of the modeling material formed by irradiating the modeling material 64 with the processing light EL, melting, cooling, and solidification can also be controlled.
  • Rotation control of the material nozzles 32A, 32B is mechanical control, and although the response speed is not very high, the control range of the thickness of the modeling material is wide. Therefore, by controlling the rotation of the material nozzles 32A and 32B, it is possible to control the thickness of the modeling material with a low spatial frequency component and with a wide correction range.
  • the thickness of the modeling material M supplied to the modeling surface CS is controlled by controlling the relative positions of the material nozzles 32A, 32B and the modeling surface CS.
  • the thickness of the modeling material M may be controlled. In this way, when controlling the supply amount per unit time of the modeling material sent from the material supply device 12 to the material nozzles 32A, 32B, only one material nozzle (for example, 32A) of the material nozzles 32A, 32B is controlled. It is possible to provide the following information.
  • FIG. 11 Next, a second embodiment will be described with reference to FIG. 11. Although this embodiment also uses the modeling apparatus 4 of FIG. 1, the method of controlling the thickness distribution of the modeling material of the structural layer is different. An example of the operation when forming the first structural layer on the workpiece W and forming the second structural layer thereon in this embodiment will be described with reference to FIGS. 11(A) to 11(D).
  • the first structural layer 68A is formed on the surface of the workpiece W using the modeling apparatus 4. At this time, it is not necessarily necessary to measure the height distribution of the surface 68Aa of the first structural layer 68A.
  • the processing light EL is irradiated from the irradiation optical system 30 onto the first structural layer 68A, and the modeling material M is supplied from the material nozzles 32A and 32B to the irradiation area of the processing light EL, and the work W is modeled.
  • the head 24 is relatively moved, for example, in the ⁇ Y direction, and the pattern of the second structural layer 68B is built up and modeled.
  • the target shapes of the surfaces of the first structural layer 68A and the second structural layer 68B are, for example, flat target distributions 70A and 70B shown by dotted lines, respectively.
  • the image of the spot light GLB projected onto the surface 68Aa of the first structural layer 68A from the light projecting section 44B located in front of the irradiation optical system 30 in the scanning direction in the printing head 24 is illustrated.
  • the first imaging device 46 takes an image, and the height distribution of the surface 68Aa of the pattern of the first structural layer 68A, which is the previous layer, is measured. Then, an error signal is obtained by subtracting the signal of the target distribution from the signal RS of the height distribution in the error calculating section 50.
  • the low-pass filter section 52L and the high-pass filter section 52H produce a low spatial frequency signal LS shown in FIG. 11(B) and a high spatial frequency signal LS shown in FIG. 11(C), respectively.
  • a signal HS is supplied to the control device 20.
  • the position in the Y direction where the processing light EL is irradiated from the irradiation optical system 30 is Y4, then by capturing the image of the spot light GLB, As shown, the low spatial frequency signal LS and high spatial frequency signal HS are obtained up to position Y3 in front of position Y4. Therefore, by controlling the positions of the material nozzles 32A and 32B in the Z direction and the intensity of the processing light EL using the low spatial frequency signal LS and the high spatial frequency signal HS, the height of the surface of the first structural layer 68A can be adjusted.
  • the thickness distribution of the modeling material can be controlled substantially in real time and in a feedforward manner during the modeling of the second structural layer 68B so as to offset errors in the distribution.
  • the light projecting section 44A located behind the irradiation optical system 30 in the scanning direction in the printing head 24 is The image of the spot light GLA projected onto the surface of the pattern immediately after is captured by the imaging device 46 of FIG. 1, and the height distribution of the surface 68Ba of the pattern of the second structural layer 68B immediately after modeling is also measured.
  • the thickness distribution of the modeling material of the second structural layer 68B based on the measured value of the height distribution of the surface of the first structural layer 68A, the surface of the pattern formed so far Although 68Ba is close to the target distribution 70B, there is still a slight error.
  • the signal HB corresponding to the error has only low spatial frequency components, as shown by a curve 71A in FIG. 11(D).
  • the position of the irradiation optical system 30 is Y4
  • the signal HB is measured up to a position Y5 at the rear with respect to the scanning direction of the irradiation optical system 30. Therefore, in this embodiment, the Z positions of the material nozzles 32A and 32B are controlled by feedback control so as to cancel out the error in the height distribution corresponding to the signal HB.
  • the signal HB indicating the error of the height distribution of the surface 68Ba of the pattern formed on the second structural layer 68B with respect to the target distribution 70B becomes small as shown by the dotted curve 71B in FIG. 11(D).
  • the thickness distribution of the modeling material of the second structural layer 68B is controlled by the feedforward method so as to offset the measurement result of the error distribution of the height distribution of the surface of the first structural layer 68A.
  • the thickness distribution of the modeling material of the second structural layer 68B is adjusted in a feedback manner so as to cancel out the measurement result of the error distribution of the height distribution of the surface of the pattern formed so far in the second structural layer 68B. It's in control. Therefore, even if the error in the height distribution of the surface of the first structural layer 68A is large, the surface accuracy of the pattern of the second structural layer 68B can be formed with higher precision.
  • the error in the height distribution of the surface 68Ba of the pattern of the second structural layer 68B with respect to the target distribution 70B is calculated.
  • the low spatial frequency signal LS and the high spatial frequency signal HS may be extracted from the signal HB shown.
  • the thickness distribution includes not only the unevenness distribution on the surface but also the distribution of the thickness itself.
  • the surface of the second structural layer 68B is It is possible to print with higher precision.
  • the modeling apparatus 4 of each of the above-described embodiments uses a laser metal deposition method (LMD) of the directional energy deposition method (DED).
  • LMD laser metal deposition method
  • DED directed energy deposition method
  • the configuration of the modeling device 4 of the above-described embodiment is not limited to the above-described configuration, and any other configuration is possible.
  • the number and arrangement of the material nozzles 32A, 32B may be arbitrary, and the configuration of the height measuring device 42 and the like may also be arbitrary. Further, as the height measuring device 42, it is also possible to use a device that projects a bright and dark pattern.
  • a modeling method that includes changing the relative positional relationship between the material supply section and the modeling surface, and the second method includes controlling the intensity of the light beam irradiated to the modeling material.
  • Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material, The method includes controlling the thickness of the modeling material supplied from the material supply unit to the modeling surface when the light beam and the modeling material are moved relative to each other.
  • the modeling method according to 5 wherein the first method includes controlling the distance between the material supply section and the modeling surface.
  • Supplying the building material from the material supply section includes supplying the building material in an oblique direction from a plurality of material supply sections, and the first method includes controlling the angle of the material supply section. 5.
  • Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material, and forming the second structural layer.
  • 9) When forming the second structural layer measuring the height information of the surface of the first structural layer in a region before applying the modeling material of the second structural layer, The modeling method according to any one (or 1). 10) From 1 to 1, including measuring height information of the surface of the first structural layer in a region after the modeling material of the first structural layer is piled up when forming the first structural layer. 8. The modeling method according to any one of item 8 (or 1).
  • any one of 1 to 8 including a step of measuring height information of the surface of the first structural layer between the step of forming the first structural layer and the step of forming the second structural layer.
  • the modeling method according to any one of 1 to 11 (or 1) including controlling the thickness of the modeling material in the area where the modeling material is applied.
  • a modeling device that forms a structure by stacking a plurality of structural layers, including an irradiation unit that irradiates a modeling surface with a light beam, and a material that supplies a modeling material to a region that is irradiated with the light beam. a supply unit, a moving unit that relatively moves the light beam and the modeling material, a first thickness control unit that controls the thickness of the modeling material, and a spatial frequency that can be handled by the first thickness control unit.
  • a second thickness control section that controls the thickness of the modeling material at a high spatial frequency, and the first and second thickness control sections are used together according to the height information of the surface of the first structural layer
  • a modeling device comprising: a modeling control section that controls the thickness distribution of a modeling material of a second structural layer formed to overlap the first structural layer.
  • a modeling device that forms a structure by stacking a plurality of structural layers, comprising: an irradiation unit that irradiates a modeling surface with a light beam; and a material that supplies a modeling material to an area irradiated with the light beam.
  • the first structural layer is formed so as to be superimposed on the first structural layer by using a supply section and first and second thickness control sections whose corresponding spatial frequency components are different from each other according to the height information of the surface of the first structural layer.
  • a modeling control section that controls the thickness distribution of the modeling material of the second structural layer, the first thickness control section changing the relative positional relationship between the material supply section and the modeling surface.
  • a modeling apparatus wherein the second thickness control section is an intensity control section that controls the intensity of the light beam.
  • a calculation unit that extracts a low frequency component and a high frequency component related to spatial frequency from the height information of the surface of the first structural layer, and the modeling control unit extracts the low frequency component and the high frequency component regarding the spatial frequency from the height information of the surface of the first structural layer
  • the first thickness control section is used to control the thickness distribution of the modeling material of the second structural layer
  • the second thickness control section is used to control the thickness distribution of the modeling material of the second structural layer
  • the second thickness control section is used to control the thickness distribution of the modeling material of the second structural layer.
  • the modeling control unit controls the first thickness control unit and the second thickness control unit in a feedforward manner using the height information of the surface of the first structural layer, and 17.
  • the modeling device according to any one of 14 to 16 (or 14), which controls the thickness distribution of the modeling material of the structural layer.
  • the material supply unit has a plurality of material supply units that supply the modeling material obliquely, and the first thickness control unit controls the angle of the plurality of material supply units,
  • the modeling device according to any one (or 14).
  • the measurement unit includes a measurement light irradiation unit that irradiates the surface of the structural layer with a plurality of measurement lights obliquely, an imaging unit that receives the measurement light reflected by the structural layer, and an imaging unit of the imaging unit. 23.
  • the modeling apparatus further comprising: an imaging signal processing unit that processes a signal to determine the height of a portion of the structural layer that is irradiated with the measurement light.
  • the measurement unit measures height information of the surface of the second structural layer in a region where the modeling material of the second structural layer is piled up, and measures the height information of the surface of the second structural layer.
  • the control unit uses the first and second thickness control units to apply the next modeling material in the second structural layer according to the height information of the surface of the second structural layer measured by the measuring unit.
  • the modeling device according to 22 or 23 (or 22), which controls the thickness of the modeling material in the region where the material is piled up. 25)
  • the modeling apparatus according to any one of 14 to 24, wherein the surface height information of the first structural layer includes an error distribution of the surface height distribution with respect to a target distribution.
  • W... Workpiece EL... Processing light, M... Modeling material, 4... Modeling device, 10... Light source, 12... Material supply device, 16... Light source control section, 18... Gas supply device, 20... Control device, 26... Drive system , 28... Stage, 30... Irradiation optical system, 32A, 32B... Material nozzle, 34A, 34B... Drive mechanism, 42... Height measurement device, 44A to 44H... Light projection unit, 46... Imaging device, 48... Imaging signal processing Section, 50... Error calculation section, 52H... High pass filter section, 52L... Low pass filter section, 60... Nozzle control section

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Abstract

This shaping method for shaping a structure by forming a plurality of structural layers in a superimposed manner involves controlling the thickness distribution of a shaping material of a second structural layer formed by being superimposed on the first structural layer, by using, in combination: a first method for controlling the thickness of a shaping material in accordance with height information about a surface of a first structural layer; and a second method for controlling the thickness of the shaping material for a spatial frequency component differing from a spatial frequency component corresponding to the first method. The present invention makes it possible to improve the accuracy of the surface of the structure shaped by an additive manufacturing (AM) method.

Description

造形方法及び造形装置Molding method and device
　本発明は、例えば付加製造（ＡＭ：Additive Manufacturing)方式で造形物を形成する造形方法及び造形装置に関する。 The present invention relates to a molding method and a molding apparatus for forming a molded object using, for example, an additive manufacturing (AM) method.
　例えば３Ｄプリンタのように付加製造（ＡＭ)方式で造形物を形成する装置として、エネルギービームの照射領域に粉末状の造形材料を供給し、造形材料をエネルギービームで溶融した後、溶融した材料を再固化させることを繰り返して複数の構造層（造形層）を積み重ねて造形物を形成する造形装置が知られている（特許文献１参照）。このような造形装置では、造形物の表面の面精度の向上を図ることが求められている。 For example, in a device that forms objects using an additive manufacturing (AM) method, such as a 3D printer, powdered modeling material is supplied to the energy beam irradiation area, the modeling material is melted by the energy beam, and then the melted material is BACKGROUND ART A modeling apparatus is known that forms a modeled object by stacking a plurality of structural layers (modeling layers) by repeating resolidification (see Patent Document 1). In such a modeling apparatus, it is required to improve the surface precision of the surface of the modeled object.
米国特許出願公開第２０１６／０３７５５２１号明細書US Patent Application Publication No. 2016/0375521
　本発明の第１の態様によれば、複数の構造層を重ねて形成して構造物を造形する造形方法であって、第１構造層の表面の高さ情報に応じて、造形材料の厚さを制御する第１の方法、及びその第１の方法が対応する空間周波数成分と異なる空間周波数成分に関して造形材料の厚さを制御する第２の方法を併用して、その第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形方法が提供される。
　第２の態様によれば、複数の構造層を重ねて形成して構造物を造形する造形方法であって、第１構造層の表面の高さ情報に応じて、対応する空間周波数成分が互いに異なる第１の方法及び第２の方法を併用して、その第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御することを含み、その第１の方法は、造形材料を供給する材料供給部と造形面との相対的な位置関係を変更することを含み、その第２の方法は、造形材料に照射される光ビームの強度を制御することを含む、造形方法が提供される。 According to a first aspect of the present invention, there is provided a modeling method in which a structure is formed by stacking a plurality of structural layers, and the thickness of the modeling material is determined according to the height information of the surface of the first structural layer. a first method of controlling the thickness of the building material with respect to a spatial frequency component that is different from the spatial frequency component to which the first method corresponds; A modeling method is provided that controls the thickness distribution of a modeling material of a second structural layer that is formed in an overlapping manner.
According to the second aspect, there is provided a modeling method for forming a structure by stacking a plurality of structural layers, in which corresponding spatial frequency components are mutually differentiated according to height information of the surface of the first structural layer. The first method includes controlling the thickness distribution of a building material of a second structural layer formed overlying the first structural layer by using a different first method and a second method in combination; The second method includes changing the relative positional relationship between the material supply unit that supplies the modeling material and the modeling surface, and the second method includes controlling the intensity of the light beam irradiated to the modeling material. A modeling method is provided.
　第３の態様によれば、複数の構造層を重ねて形成して構造物を造形する造形装置であって、造形面に光ビームを照射する照射部と、その光ビームが照射される領域に造形材料を供給する材料供給部と、その光ビームとその造型材料とを相対移動する移動部と、造形材料の厚さを制御する第１厚さ制御部と、その第１厚さ制御部が対応可能な空間周波数より高い空間周波数で造形材料の厚さを制御する第２厚さ制御部と、第１構造層の表面の高さ情報に応じて、その第１及び第２厚さ制御部を併用して、その第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形制御部と、を備える造形装置が提供される。 According to a third aspect, there is provided a modeling apparatus that forms a structure by stacking a plurality of structural layers, and includes an irradiation section that irradiates a light beam onto a modeling surface, and an area that is irradiated with the light beam. A material supply section that supplies the modeling material, a moving section that relatively moves the light beam and the modeling material, a first thickness control section that controls the thickness of the modeling material, and the first thickness control section. a second thickness control section that controls the thickness of the modeling material at a spatial frequency higher than a compatible spatial frequency; and first and second thickness control sections thereof according to height information of the surface of the first structural layer. A modeling apparatus is provided, which includes a modeling control unit that uses the modeling controller in combination with the modeling controller to control the thickness distribution of the modeling material of a second structural layer formed overlying the first structural layer.
　第４の態様によれば、複数の構造層を重ねて形成して構造物を造形する造形装置であって、造形面に光ビームを照射する照射部と、その光ビームが照射される領域に造形材料を供給する材料供給部と、第１構造層の表面の高さ情報に応じて、対応する空間周波数成分が互いに異なる第１及び第２厚さ制御部を併用して、その第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形制御部と、を備え、その第１厚さ制御部は、その材料供給部と造形面との相対的な位置関係を変更する変更部であり、その第２厚さ制御部は、その光ビームの強度を制御する強度制御部である、造形装置が提供される。 According to a fourth aspect, there is provided a modeling apparatus that forms a structure by stacking a plurality of structural layers, including an irradiation section that irradiates a light beam onto a modeling surface, and an area that is irradiated with the light beam. A material supply section that supplies a modeling material, and first and second thickness control sections whose corresponding spatial frequency components differ from each other according to the height information of the surface of the first structure layer are used together to create the first structure. a modeling control section that controls the thickness distribution of the modeling material of the second structural layer formed in layers, and the first thickness control section controls the relative thickness distribution between the material supply section and the modeling surface. A shaping device is provided, in which the second thickness control section is a change section that changes the positional relationship, and the second thickness control section is an intensity control section that controls the intensity of the light beam.
[規則91に基づく訂正 30.06.2022]　
第１の実施形態の造形装置を示す断面図である。 （Ａ）は複数の投光部の配置例を示す平面図、（Ｂ）及び（Ｃ）は造形面の高さと投影される２つのパターンの間隔の関係の一例を示す図である。 （Ａ）は材料ノズルと造形面との距離が可変範囲の中央にあるときを示す図、（Ｂ）及び（Ｃ）はそれぞれその距離が可変範囲の最長及び最短の場合を示す図である。 （Ａ）、（Ｂ）、（Ｃ）、及び（Ｄ）は造形材料への加工光の照射及び冷却によってワークに凸のパターンが形成される過程を示す図である。 （Ａ）は第１構造層のパターンを形成しつつ、その形成後のパターンの高さ分布を計測する状態を示す断面図、（Ｂ）は誤差分布の低い空間周波数成分の一例を示す図、（Ｃ）は高い空間周波数成分の一例を示す図、（Ｄ）は第２構造層のパターンを形成しつつ、その形成後のパターンの高さ分布を計測する状態を示す断面図である。 （Ａ）、（Ｂ）、（Ｃ）は３次元構造物としてのラインパターンを造形する過程を示す断面図である。 （Ａ）、（Ｂ）、（Ｃ）はそれぞれ３次元構造物を造形する過程を示す断面図である。 （Ａ）は造形方法の一例を示すフローチャート、（Ｂ）は変形例の動作を示すフローチャートである。 （Ａ）は変形例において、第１構造層の表面の高さ分布を計測しつつ、第２構造層のパターンを形成する状態を示す断面図、（Ｂ）は誤差分布の低い空間周波数成分の一例を示す図、（Ｃ）は高い空間周波数成分の一例を示す図である。 （Ａ）は材料ノズルの傾斜角が可変範囲の中央にあるときを示す図、（Ｂ）及び（Ｃ）はそれぞれその傾斜角が可変範囲の最大及び最小の場合を示す図である。 （Ａ）は第２の実施形態において、第１構造層の表面の高さ分布を計測しつつ、第２構造層のパターンの表面の高さ分布を計測する状態を示す断面図、（Ｂ）は誤差分布の低い空間周波数成分の一例を示す図、（Ｃ）は高い空間周波数成分の一例を示す図、（Ｄ）はフィードバック制御を併用した場合の誤差分布の一例を示す図である。 [Amendment under Rule 91 30.06.2022]
FIG. 1 is a cross-sectional view showing the modeling apparatus of the first embodiment. (A) is a plan view showing an example of the arrangement of a plurality of light projectors, and (B) and (C) are views showing an example of the relationship between the height of the modeling surface and the interval between two projected patterns. (A) is a diagram showing when the distance between the material nozzle and the modeling surface is at the center of the variable range, and (B) and (C) are diagrams showing when the distance is the longest and shortest in the variable range, respectively. (A), (B), (C), and (D) are diagrams showing a process in which a convex pattern is formed on a workpiece by irradiating the modeling material with processing light and cooling it. (A) is a cross-sectional view showing a state in which a pattern of the first structural layer is formed and the height distribution of the pattern after the formation is measured; (B) is a view showing an example of a spatial frequency component with a low error distribution; (C) is a diagram showing an example of a high spatial frequency component, and (D) is a cross-sectional view showing a state in which the pattern of the second structural layer is formed and the height distribution of the pattern after the formation is measured. (A), (B), and (C) are cross-sectional views showing the process of forming a line pattern as a three-dimensional structure. (A), (B), and (C) are cross-sectional views each showing a process of modeling a three-dimensional structure. (A) is a flowchart showing an example of the modeling method, and (B) is a flowchart showing the operation of a modified example. (A) is a cross-sectional view showing a state in which the pattern of the second structural layer is formed while measuring the height distribution of the surface of the first structural layer in a modified example, and (B) is a cross-sectional view showing the state in which the pattern of the second structural layer is formed while measuring the height distribution of the surface of the first structural layer. A diagram showing an example, (C) is a diagram showing an example of a high spatial frequency component. (A) is a diagram showing the case where the inclination angle of the material nozzle is at the center of the variable range, and (B) and (C) are diagrams showing the case where the inclination angle is at the maximum and minimum of the variable range, respectively. (A) is a cross-sectional view showing a state in which the height distribution of the surface of the pattern of the second structural layer is measured while measuring the height distribution of the surface of the first structural layer in the second embodiment; (B) 3 is a diagram showing an example of a low spatial frequency component of an error distribution, (C) is a diagram showing an example of a high spatial frequency component, and (D) is a diagram showing an example of an error distribution when feedback control is also used.
　［第１の実施形態］
　以下、第１の実施形態につき図１～図８を参照して説明する。
　本実施形態では、三次元の造形物を、３Ｄプリンタのように金属又は合成樹脂等の材料を逐次付加する付加製造(ＡＭ：Additive Manufacturing)方式で造形（製造）する。以下では付加製造方式をＡＭ方式とも称する。本実施形態では、ＡＭ方式として指向性エネルギー堆積法(Directed Energy Deposition: ＤＥＤ法)の中で、エネルギービームとしてレーザ光等の光を使用するレーザ肉盛堆積法（Laser Metal Deposition:ＬＭＤ）（以下、ＬＭＤ法ともいう。）を使用するものとして説明する。ＬＭＤ法は、ダイレクト・メタル・デポジション、ダイレクト・エナジー・デポジション、レーザ・クラッディング、レーザ・パウダー・デポジション、レーザ・アディティブ・マニュファクチャリング、又はレーザ・ラピッド・フォーミング等と称することもできる。 [First embodiment]
The first embodiment will be described below with reference to FIGS. 1 to 8.
In this embodiment, a three-dimensional model is modeled (manufactured) using an additive manufacturing (AM) method in which materials such as metal or synthetic resin are sequentially added like a 3D printer. In the following, the additive manufacturing method will also be referred to as the AM method. In this embodiment, a laser metal deposition (LMD) method (hereinafter referred to as "LMD"), which uses light such as a laser beam as an energy beam, is used as an AM method in a directed energy deposition method (DED method). , also referred to as the LMD method). LMD methods can also be referred to as direct metal deposition, direct energy deposition, laser cladding, laser powder deposition, laser additive manufacturing, or laser rapid forming. .
　図１は、ＬＭＤ法を用いる３Ｄプリンタよりなる造形装置４を示す。図１において、互いに直交するＸ軸、Ｙ軸及びＺ軸から定義されるＸＹＺ直交座標系を用いて、造形装置４を構成する各種構成要素の位置関係について説明する。以下では、Ｘ軸及びＹ軸によって形成される面は水平面に平行であり、Ｚ軸は水平面に直交しているものとする。この場合、Ｚ軸に平行な方向（Ｚ方向）は鉛直方向に平行であり、－Ｚ方向を鉛直方向とする。 FIG. 1 shows a modeling device 4 consisting of a 3D printer using the LMD method. In FIG. 1, the positional relationships of various components constituting the modeling device 4 will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X, Y, and Z axes. In the following, it is assumed that the plane formed by the X-axis and the Y-axis is parallel to the horizontal plane, and the Z-axis is perpendicular to the horizontal plane. In this case, the direction parallel to the Z axis (Z direction) is parallel to the vertical direction, and the -Z direction is the vertical direction.
　造形装置４は、３次元構造物を形成するための基礎（つまり、母材）となるワークＷ上に、３次元構造物ＳＴ（図７（Ｃ）参照）（３次元のいずれの方向においても大きさを持つ物体）を形成可能である。ワークＷがステージ２８である場合には、造形装置４は、ステージ２８上に３次元構造物ＳＴを形成可能である。ワークＷがステージ２８によって保持されている既存構造物である場合には、造形装置４は、既存構造物上に、新たな構造物を付加して３次元構造物ＳＴを形成可能である。この場合、造形装置４は、既存構造物と一体化された３次元構造物ＳＴを形成してもよい。又は、造形装置４は、既存構造物と分離可能な３次元構造物ＳＴを形成してもよいし、既存構造物の破損部を修復するよう３次元構造物ＳＴを形成してもよい。以下では、ワークＷがステージ２８によって保持されている既存構造物であるとして説明する。 The modeling device 4 places a three-dimensional structure ST (see FIG. 7(C)) (in any three-dimensional direction It is possible to form objects with size. When the work W is the stage 28, the modeling device 4 can form the three-dimensional structure ST on the stage 28. When the workpiece W is an existing structure held by the stage 28, the modeling device 4 can add a new structure onto the existing structure to form the three-dimensional structure ST. In this case, the modeling device 4 may form a three-dimensional structure ST that is integrated with an existing structure. Alternatively, the modeling device 4 may form a three-dimensional structure ST that is separable from an existing structure, or may form a three-dimensional structure ST so as to repair a damaged portion of an existing structure. In the following description, it will be assumed that the workpiece W is an existing structure held by the stage 28.
　造形装置４は、造形用の光ビーム（以下、加工光という）ＥＬをワークＷに照射する照射光学系３０と、ワークＷに造形材料Ｍを供給する材料ノズル３２Ａ，３２Ｂ（材料供給部）とを有する造形ヘッド２４と、造形ヘッド２４を移動させる駆動系２６と、材料供給装置１２と、ガス供給装置１８と、固化されなかった造形材料を回収する回収装置２２と、装置全体の動作を制御する制御装置２０とを備えている。照射光学系３０には、光源１０で発生される加工光ＥＬが光ファイバ３６を介して供給されている。制御装置２０は光源制御部１６を介して光源１０で発生される加工光ＥＬの強度（単位時間当たりのエネルギー）を制御する。造形ヘッド２４と、駆動系２６と、ステージ２８とから造形部１４が構成されている。なお、光源制御部１６の代わりに、あるいはそれと併用し、光源１０から射出される加工光ＥＬの強度を例えば音響光学素子（ＡＯＭ）等を用いる変調装置を用いて制御してもよい。 The modeling device 4 includes an irradiation optical system 30 that irradiates the workpiece W with a modeling light beam (hereinafter referred to as processing light) EL, and material nozzles 32A and 32B (material supply section) that supply the modeling material M to the workpiece W. A drive system 26 that moves the printing head 24, a material supply device 12, a gas supply device 18, a recovery device 22 that recovers unsolidified modeling material, and controls the operation of the entire device. A control device 20 is provided. Processing light EL generated by the light source 10 is supplied to the irradiation optical system 30 via an optical fiber 36. The control device 20 controls the intensity (energy per unit time) of the processing light EL generated by the light source 10 via the light source control section 16. The modeling section 14 includes a modeling head 24, a drive system 26, and a stage 28. Note that, in place of the light source control unit 16 or in combination with it, the intensity of the processing light EL emitted from the light source 10 may be controlled using a modulation device using, for example, an acousto-optic device (AOM) or the like.
　材料供給装置１２は、造形部１４が３次元構造物ＳＴを形成するために単位時間当たりに必要とする量の造形材料Ｍを造形ヘッド２４の材料ノズル３２Ａ，３２Ｂに供給する。造形材料Ｍは、所定強度以上の加工光ＥＬの照射によって溶融可能な材料である。このような造形材料Ｍとして、例えば、金属性の材料及び樹脂性の材料の少なくとも一方が使用可能である。但し、造形材料Ｍとして、金属性の材料及び樹脂性の材料とは異なるその他の材料が用いられてもよい。造形材料Ｍは、粉状又は粒状の材料（粉粒体）である。但し、造形材料Ｍは、粉粒体でなくてもよく、例えばワイヤ状の造形材料やガス状の造形材料が用いられてもよい。 The material supply device 12 supplies the material nozzles 32A, 32B of the modeling head 24 with the amount of modeling material M required per unit time for the modeling unit 14 to form the three-dimensional structure ST. The modeling material M is a material that can be melted by irradiation with processing light EL having a predetermined intensity or higher. As such a modeling material M, for example, at least one of a metallic material and a resinous material can be used. However, as the modeling material M, other materials different from metal materials and resin materials may be used. The modeling material M is a powder or granular material (powder material). However, the modeling material M does not have to be a powder or granule, and for example, a wire-shaped modeling material or a gaseous modeling material may be used.
　造形部１４は、材料供給装置１２から供給される造形材料Ｍを加工して３次元構造物ＳＴを形成する。造形材料Ｍを加工するために、造形部１４の造形ヘッド２４は、照射光学系３０と、材料ノズル（造形材料Ｍを供給する供給系）３２Ａ，３２Ｂとを備えている。回収装置２２に不図示の可撓性を持つパイプ等を介して接続されている吸引口２２ａが、一例として造形ヘッド２４に不図示の支持部材を介して支持されている。造形ヘッド２４と、駆動系２６と、ステージ２８とは、チャンバ８内の空間８ＩＮに収容されている。 The modeling unit 14 processes the modeling material M supplied from the material supply device 12 to form a three-dimensional structure ST. In order to process the modeling material M, the modeling head 24 of the modeling section 14 includes an irradiation optical system 30 and material nozzles (supply system for supplying the modeling material M) 32A, 32B. A suction port 22a connected to the collection device 22 via a flexible pipe (not shown) is supported by the modeling head 24 via a support member (not shown), for example. The modeling head 24, drive system 26, and stage 28 are housed in a space 8IN within the chamber 8.
　照射光学系３０は、光ファイバ３６を介して光源１０と光学的に接続されている。光ファイバ３６の代わりにライトガイド等の光伝送部材を使用可能である。なお、光源１０から射出される光を直接に照射光学系３０に供給してもよい。
　光源１０は、例えば、赤外、可視及び紫外のうちの少なくとも一つの波長のレーザ光を加工光ＥＬとして射出するレーザ光源である。但し、加工光ＥＬとして、その他の種類の光が用いられてもよい。レーザ光源としては、ＣＯ２ レーザやエキシマレーザ等の気体レーザ、ネオジム・ヤグ（Ｎｄ：ＹＡＧ）レーザ又はイットリウム（ＹＶＯ4 ）レーザ等の固体レーザ、半導体レーザＬＤ（Laser Diode）、又はファイバ・レーザ等が使用できる。また、光源１０は連続発光又はパルス発光のいずれでもよい。なお、加工光ＥＬはレーザ光でなくともよく、光源１０は任意の光源（例えば、ＬＥＤ（Light Emitting Diode）又は放電ランプ等の少なくとも一つ）を含んでいてもよい。光源１０の発光のタイミング及び発光強度（単位時間当たりのエネルギー）は光源制御部１６によって制御される。 The irradiation optical system 30 is optically connected to the light source 10 via an optical fiber 36. A light transmission member such as a light guide can be used instead of the optical fiber 36. Note that the light emitted from the light source 10 may be directly supplied to the irradiation optical system 30.
The light source 10 is, for example, a laser light source that emits laser light of at least one wavelength among infrared, visible, and ultraviolet wavelengths as processing light EL. However, other types of light may be used as the processing light EL. As a laser light source, a gas laser such as a CO 2 laser or an excimer laser, a solid laser such as a neodymium YAG (Nd:YAG) laser or a yttrium (YVO 4 ) laser, a semiconductor laser LD (Laser Diode), a fiber laser, etc. can be used. Furthermore, the light source 10 may emit continuous light or pulsed light. Note that the processing light EL does not need to be a laser beam, and the light source 10 may include any light source (for example, at least one of an LED (Light Emitting Diode) or a discharge lamp). The timing and intensity of light emission (energy per unit time) of the light source 10 are controlled by the light source control unit 16.
　照射光学系３０は、光ファイバ３６から射出される加工光ＥＬを集光して平行光束に変換するコンデンサレンズ系（不図示）と、その加工光ＥＬを造形面ＣＳに集光する集光レンズ系３０ａとを有する。一例として、造形面ＣＳは集光レンズ系３０ａの後側焦点面の近傍の合焦面（フォーカス位置）に配置されており、集光レンズ系３０ａの光軸ＡＸはＺ軸に平行である。照射光学系３０は、光ファイバ３６を介して光源１０から伝搬してくる加工光ＥＬを光軸ＡＸに沿って下方（－Ｚ方向）に射出する。 The irradiation optical system 30 includes a condenser lens system (not shown) that condenses the processed light EL emitted from the optical fiber 36 and converts it into a parallel beam, and a condenser lens that focuses the processed light EL on the modeling surface CS. system 30a. As an example, the modeling surface CS is arranged at a focusing plane (focus position) near the rear focal plane of the condenser lens system 30a, and the optical axis AX of the condenser lens system 30a is parallel to the Z axis. The irradiation optical system 30 emits the processing light EL propagated from the light source 10 via the optical fiber 36 downward (in the −Z direction) along the optical axis AX.
　ステージ２８にワークＷが搭載されている場合には、照射光学系３０は、ステージ２８上のワークＷに向けて加工光ＥＬを照射する。照射光学系３０は、ワークＷ上に設定される照射領域ＥＡに加工光ＥＬを照射可能である。更に、照射光学系３０の状態は、制御装置２０の制御下で、照射領域ＥＡに加工光ＥＬを照射する状態と、照射領域ＥＡに加工光ＥＬを照射しない状態との間で切替可能である。なお、照射光学系３０から射出される加工光ＥＬの方向は真下（－Ｚ方向）には限定されず、例えば、Ｚ軸に対して所定角度だけ傾いた方向であってもよい。 When the workpiece W is mounted on the stage 28, the irradiation optical system 30 irradiates the processing light EL toward the workpiece W on the stage 28. The irradiation optical system 30 can irradiate the irradiation area EA set on the workpiece W with the processing light EL. Furthermore, the state of the irradiation optical system 30 is switchable under the control of the control device 20 between a state in which the irradiation area EA is irradiated with the processing light EL and a state in which the irradiation area EA is not irradiated with the processing light EL. . Note that the direction of the processing light EL emitted from the irradiation optical system 30 is not limited to directly below (-Z direction), but may be, for example, a direction inclined at a predetermined angle with respect to the Z axis.
　また、造形ヘッド２４には、照射光学系３０をＹ方向に挟むように配置されて、それぞれ造形面に２つの円形のスポット光ＧＬＡ，ＧＬＢを斜めに投影する投光部４４Ａ，４４Ｂと、照射光学系３０をＸ方向に挟むように配置されて、それぞれ造形面に２つの円形のスポット光ＧＬＣ，ＧＬＤを斜めに投影する投光部４４Ｃ，４４Ｄ（図２（Ａ）参照）と、照射光学系３０を斜め方向に挟むように配置されて、それぞれ造形面に２つの円形のスポット光ＧＬＥ，ＧＬＦ，ＧＬＧ，ＧＬＨを斜めに投影する投光部４４Ｅ，４４Ｆ，４４Ｇ，４４Ｈ（図２（Ａ）参照）と、スポット光ＧＬＡ～ＧＬＨの像を撮像する撮像装置４６とが保持されている。なお、投光部４４Ａ～４４Ｈの数は任意であり、撮像装置４６は造形ヘッド２４とは別の支持部材に支持されていてもよい。撮像装置４６の撮像信号を撮像信号処理部４８で処理することによって、スポット光ＧＬＡ～ＧＬＨが投影されている位置の造形面又はパターンの高さ（Ｚ方向の位置又はＺ位置）の分布を示す高さ分布信号ＲＳが得られる（詳細後述）。投光部４４Ａ～４４Ｈ、撮像装置４６、及び撮像信号処理部４８から、造形面ＣＳ又は造形されたパターンの表面の高さ分布を計測する高さ計測装置４２が構成されている。また、高さ分布信号ＲＳを処理するための誤差算出部５０、ハイパスフィルタ部５２Ｈ、及びローパスフィルタ部５２Ｌも設けられている（これらの作用については後述）。なお、造形面等の高さを計測する方法は任意であり、例えば近接センサ又は空気マイクロメータ等を用いてその高さを計測してもよい。 The modeling head 24 also includes light projecting units 44A and 44B that are arranged to sandwich the irradiation optical system 30 in the Y direction and project two circular spot lights GLA and GLB obliquely onto the modeling surface, respectively, and Light projecting units 44C and 44D (see FIG. 2A) that are arranged to sandwich the optical system 30 in the X direction and project two circular spot lights GLC and GLD obliquely onto the modeling surface, respectively, and irradiation optics. Light projecting units 44E, 44F, 44G, and 44H are arranged to sandwich the system 30 in an oblique direction and project two circular spot lights GLE, GLF, GLG, and GLH obliquely onto the modeling surface, respectively (Fig. 2(A) )) and an imaging device 46 that captures images of the spot lights GLA to GLH are held. Note that the number of light projectors 44A to 44H is arbitrary, and the imaging device 46 may be supported by a support member separate from the modeling head 24. By processing the imaging signal of the imaging device 46 in the imaging signal processing unit 48, the distribution of the height (Z-direction position or Z position) of the modeling surface or pattern at the position where the spot lights GLA to GLH are projected is shown. A height distribution signal RS is obtained (details will be described later). The light projecting sections 44A to 44H, the imaging device 46, and the imaging signal processing section 48 constitute a height measuring device 42 that measures the height distribution of the surface of the printing surface CS or the pattern formed. Further, an error calculation section 50, a high-pass filter section 52H, and a low-pass filter section 52L for processing the height distribution signal RS are also provided (the functions of these sections will be described later). Note that any method may be used to measure the height of the modeling surface, etc., and for example, the height may be measured using a proximity sensor, an air micrometer, or the like.
　材料供給装置１２に連結される材料ノズル３２Ａ，３２Ｂは、一例として照射光学系３０をＹ方向に挟むように対称に傾斜して配置されている。造形ヘッド２４には、材料ノズル３２Ａ，３２ＢのＺ方向の位置を制御するための駆動機構３４Ａ，３４Ｂが設けられている。なお、材料ノズル３２Ａ，３２Ｂの個数は３個以上でもよい。制御装置２０は、ノズル制御部６０を介して駆動機構３４Ａ，３４Ｂを駆動することで、材料ノズル３２Ａ，３２ＢのＺ方向の位置（造形面ＣＳに対するＺ方向の相対位置）を制御できる。材料ノズル３２Ａ，３２Ｂは、それぞれ供給口から造形材料Ｍを造形面ＣＳに対して斜め方向に供給（具体的には、噴射、噴出、又は吹き付け）する。材料ノズル３２Ａ，３２Ｂは、造形材料Ｍの供給源である材料供給装置１２と、可撓性を持つパイプ５４等を介して物理的に接続されている。材料ノズル３２Ａ，３２Ｂは、パイプ５４等を介して材料供給装置１２から供給される造形材料Ｍを造形面ＣＳに圧送してもよい。即ち、材料供給装置１２からの造形材料Ｍと搬送用の気体（例えば、窒素やアルゴン等の不活性ガス）とを混合した混合物をパイプ５４を介して材料ノズル３２Ａ，３２Ｂに圧送し、材料ノズル３２Ａ，３２Ｂからその混合物を圧送してもよい。なお、図１において材料ノズル３２Ａ，３２Ｂは、チューブ状に描かれているが、材料ノズル３２の形状は、この形状に限定されない。 For example, the material nozzles 32A and 32B connected to the material supply device 12 are arranged symmetrically and inclined so as to sandwich the irradiation optical system 30 in the Y direction. The modeling head 24 is provided with drive mechanisms 34A and 34B for controlling the positions of the material nozzles 32A and 32B in the Z direction. Note that the number of material nozzles 32A, 32B may be three or more. The control device 20 can control the positions of the material nozzles 32A, 32B in the Z direction (relative positions in the Z direction with respect to the modeling surface CS) by driving the drive mechanisms 34A, 34B via the nozzle control unit 60. The material nozzles 32A and 32B each supply (specifically, inject, jet, or spray) the modeling material M from the supply port in an oblique direction to the modeling surface CS. The material nozzles 32A, 32B are physically connected to the material supply device 12, which is a supply source of the modeling material M, via a flexible pipe 54 or the like. The material nozzles 32A, 32B may force-feed the modeling material M supplied from the material supply device 12 via the pipe 54 or the like to the modeling surface CS. That is, a mixture of the modeling material M from the material supply device 12 and a transporting gas (for example, an inert gas such as nitrogen or argon) is fed under pressure to the material nozzles 32A and 32B via the pipe 54, and the material nozzle The mixture may be pumped from 32A and 32B. In addition, although the material nozzles 32A and 32B are drawn in a tube shape in FIG. 1, the shape of the material nozzle 32 is not limited to this shape.
　ステージ２８にワークＷが搭載されている場合には、材料ノズル３２Ａ，３２Ｂは、ステージ２８上のワークＷに向けて造形材料Ｍを供給する。一例として、材料ノズル３２Ａ，３２Ｂから供給される造形材料Ｍの進行方向はＺ軸に対して所定角度（一例として鋭角）だけ対称に傾いた方向である。本実施形態では、材料ノズル３２Ａ，３２Ｂは、照射光学系３０が加工光ＥＬを照射する照射領域ＥＡに向けて造形材料Ｍを供給する。つまり、材料ノズル３２Ａ，３２Ｂが造形材料Ｍを供給するワークＷ上の供給領域ＭＡと照射領域ＥＡとが一致する（又は、少なくとも部分的に重複する）ように、材料ノズル３２Ａ，３２Ｂと照射光学系３０とが位置合わせされている。なお、照射光学系３０から射出された加工光ＥＬによって形成される溶融池ＭＰ（図６（Ａ）参照）に、材料ノズル３２Ａ，３２Ｂが造形材料Ｍを供給するように位置合わせされていてもよい。 When the workpiece W is mounted on the stage 28, the material nozzles 32A and 32B supply the modeling material M toward the workpiece W on the stage 28. As an example, the traveling direction of the modeling material M supplied from the material nozzles 32A and 32B is a direction symmetrically inclined by a predetermined angle (an acute angle as an example) with respect to the Z axis. In this embodiment, the material nozzles 32A and 32B supply the modeling material M toward the irradiation area EA where the irradiation optical system 30 irradiates the processing light EL. In other words, the material nozzles 32A, 32B and the irradiation optical system 30 are aligned. Note that even if the material nozzles 32A, 32B are aligned so as to supply the modeling material M to the molten pool MP (see FIG. 6(A)) formed by the processing light EL emitted from the irradiation optical system 30, good.
　例えばモータ及び位置検出用のエンコーダ等を含む駆動系２６は、造形ヘッド２４をＸ軸、Ｙ軸及びＺ軸の少なくともいずれかに沿って移動させる。造形ヘッド２４がＸ軸及びＹ軸の少なくとも一方に沿って移動すると、照射領域ＥＡは、ワークＷ上をＸ軸及びＹ軸の少なくとも一方に沿って移動する。更に、駆動系２６は、Ｘ軸、Ｙ軸、及びＺ軸に平行な軸の回りの回転方向であるθｘ方向、θｙ方向、及びθｚ方向の少なくとも一つの方向に造形ヘッド２４を傾斜させてもよい。制御装置２０には駆動系２６の動作を制御する制御部５６が設けられている。なお、駆動系２６は、照射光学系３０と材料ノズル３２Ａ，３２Ｂとを別々に移動させてもよい。具体的には、例えば、駆動系２６は、照射光学系３０の射出部（先端部）の位置、その方向、材料ノズル３２Ａ，３２Ｂの供給口の位置、及びその方向の少なくとも一つを調整可能であってもよい。この場合、照射光学系３０が加工光ＥＬを照射する照射領域ＥＡと、材料ノズル３２Ａ，３２Ｂが造形材料Ｍを供給する供給領域ＭＡとが別々に制御可能となる。なお、駆動系２６は、造形ヘッド２４をＸ軸、Ｙ軸に平行な軸に対して傾斜した軸（回転軸）に平行な軸の回りに回転可能にしてもよい。 A drive system 26 including, for example, a motor and an encoder for position detection moves the modeling head 24 along at least one of the X-axis, Y-axis, and Z-axis. When the modeling head 24 moves along at least one of the X-axis and the Y-axis, the irradiation area EA moves on the workpiece W along at least one of the X-axis and the Y-axis. Furthermore, the drive system 26 may tilt the printing head 24 in at least one of the θx direction, the θy direction, and the θz direction, which are rotational directions around axes parallel to the X, Y, and Z axes. good. The control device 20 is provided with a control section 56 that controls the operation of the drive system 26. Note that the drive system 26 may move the irradiation optical system 30 and the material nozzles 32A, 32B separately. Specifically, for example, the drive system 26 can adjust at least one of the position and direction of the emission part (tip part) of the irradiation optical system 30, the position of the supply ports of the material nozzles 32A and 32B, and the direction thereof. It may be. In this case, the irradiation area EA where the irradiation optical system 30 irradiates the processing light EL and the supply area MA where the material nozzles 32A and 32B supply the modeling material M can be controlled separately. Note that the drive system 26 may allow the modeling head 24 to rotate around an axis parallel to an axis (rotation axis) that is inclined with respect to an axis parallel to the X axis and the Y axis.
　ステージ２８は、機械式チャックや真空吸着チャック等を介してワークＷを保持及びリリース可能である。ステージ２８は、造形ヘッド２４に対してＸ軸、Ｙ軸、及びＺ軸に沿った方向、並びにθｘ方向、θｙ方向、及びθｚ方向の回転方向にワークＷを移動及び／又は回転できる。制御装置２０にはステージ２８の動作を制御する制御部５８が設けられている。ステージ２８がワークＷを保持している期間の少なくとも一部において、照射光学系３０は加工光ＥＬを照射し、材料ノズル３２Ａ，３２Ｂは造形材料Ｍを供給する。なお、材料ノズル３２Ａ，３２Ｂが供給した造形材料Ｍの一部は、ワークＷの表面からワークＷの外部へと（例えば、ステージ２８の周囲へと）散乱するか又は落下するとともに、加工光ＥＬで溶融されずに固化しなかった造形材料Ｍはステージ２８上（ワークＷ上）又は造形された層上に残留する。このため、造形装置４は、ステージ２８上又はワークＷ（造形層）上に固化されずに残留する造形材料Ｍ、及びステージ２８の周囲に散乱又は落下した造形材料Ｍを回収する回収装置２２を備えている。 The stage 28 can hold and release the workpiece W via a mechanical chuck, a vacuum suction chuck, or the like. The stage 28 can move and/or rotate the workpiece W relative to the modeling head 24 in directions along the X, Y, and Z axes, and in rotational directions in the θx, θy, and θz directions. The control device 20 is provided with a control section 58 that controls the operation of the stage 28. During at least part of the period during which the stage 28 holds the workpiece W, the irradiation optical system 30 irradiates the processing light EL, and the material nozzles 32A and 32B supply the modeling material M. Note that a part of the modeling material M supplied by the material nozzles 32A and 32B scatters or falls from the surface of the workpiece W to the outside of the workpiece W (for example, around the stage 28), and the processing light EL The modeling material M that is not melted and solidified remains on the stage 28 (on the workpiece W) or on the modeled layer. For this reason, the modeling device 4 includes a recovery device 22 that collects the modeling material M that remains unsolidified on the stage 28 or the workpiece W (modeling layer) and the modeling material M that has been scattered or fallen around the stage 28. We are prepared.
　ガス供給装置１８は、パージガスの供給源である。パージガスは、不活性ガス（窒素ガス及びヘリウムガスやアルゴンガス等）を含む。ガス供給装置１８は、チャンバ８内にパイプ３８を介してパージガスを供給する。その結果、チャンバ８の内部空間８ＩＮは、パージガスが満たされた空間となる。なお、ガス供給装置１８は、不活性ガスが格納されたボンベであってもよく、不活性ガスが窒素ガスである場合には、大気から窒素ガスを分離する装置であってもよい。ガス供給装置１８からは、必要に応じてパージガスの一部が材料供給装置１２にも供給される。 The gas supply device 18 is a supply source of purge gas. The purge gas includes an inert gas (nitrogen gas, helium gas, argon gas, etc.). Gas supply device 18 supplies purge gas into chamber 8 via pipe 38 . As a result, the internal space 8IN of the chamber 8 becomes a space filled with purge gas. Note that the gas supply device 18 may be a cylinder storing inert gas, or if the inert gas is nitrogen gas, it may be a device that separates nitrogen gas from the atmosphere. A part of the purge gas is also supplied from the gas supply device 18 to the material supply device 12 as needed.
　制御装置２０は、造形装置４の動作を制御する。制御装置２０は、例えばＣＰＵ（Central Processing Unit）、ＧＰＵ(Graphics Processing Unit)、メモリ、入出力部等、及び記憶装置（記憶媒体）４０を含んでいる。一例として、不図示のサーバから制御装置２０に、造形対象物の３次元モデルデータが出力される。制御装置２０は、その３次元モデルデータをスライスして複数の構造層の造形データを作成する。そして、各層の造形時に、制御装置２０の制御のもとで、ワークＷ上の供給領域ＭＡに造形材料Ｍを供給することと、供給領域ＭＡと少なくとも一部が同じ照射領域ＥＡに光ＥＬを照射することと、駆動系２６による造形ヘッド２４の移動、及び／又はステージ２８によるワークＷの移動とを制御することで、ワークＷ上にその構造物が造形される。 The control device 20 controls the operation of the modeling device 4. The control device 20 includes, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a memory, an input/output unit, etc., and a storage device (storage medium) 40. As an example, three-dimensional model data of a modeling object is output from a server (not shown) to the control device 20. The control device 20 slices the three-dimensional model data to create modeling data of a plurality of structural layers. When modeling each layer, under the control of the control device 20, the modeling material M is supplied to the supply area MA on the workpiece W, and the light EL is supplied to the irradiation area EA, which is at least partially the same as the supply area MA. The structure is modeled on the workpiece W by controlling the irradiation, the movement of the modeling head 24 by the drive system 26, and/or the movement of the workpiece W by the stage 28.
　制御装置２０は、ＣＰＵがコンピュータプログラムを実行することで、造形装置４の動作を制御する装置として機能する。このコンピュータプログラムは、造形装置４が行うべき動作を制御装置２０（例えば、ＣＰＵ）の制御で実行させるためのコンピュータプログラムである。ＣＰＵが実行するコンピュータプログラムは、記憶装置４０に記録されていてもよいし、記憶装置４２に連結可能な記憶媒体（例えば、ハードディスク、ＣＤ－ＲＯＭ、ＤＶＤ－ＲＡＭ、又は半導体メモリ等）に記録されていてもよい。或いは、制御装置２０は、実行するべきコンピュータプログラムを、ネットワークインタフェースを介して、制御装置２０の外部の装置からダウンロードしてもよい。制御装置２０は、造形装置４のチャンバ８が設置されている部屋の内部に設置されていなくてもよく、例えば、その部屋の外部にサーバ等として設置されていてもよい。 The control device 20 functions as a device that controls the operation of the modeling device 4 by the CPU executing a computer program. This computer program is a computer program for causing the control device 20 (for example, CPU) to execute operations to be performed by the modeling device 4. The computer program executed by the CPU may be recorded in the storage device 40 or in a storage medium (for example, a hard disk, CD-ROM, DVD-RAM, semiconductor memory, etc.) that can be connected to the storage device 42. You can leave it there. Alternatively, the control device 20 may download the computer program to be executed from a device external to the control device 20 via a network interface. The control device 20 does not need to be installed inside the room in which the chamber 8 of the modeling device 4 is installed, and may be installed as a server or the like outside the room, for example.
　本実施形態において、制御装置２０は、光源制御部１６を介して照射装置１０による光ＥＬの射出態様を制御する。射出態様は、例えば、加工光ＥＬの強度及び加工光ＥＬの射出タイミングの少なくとも一方を含む。加工光ＥＬがパルス光である場合には、射出態様は、例えば、パルス光の発光周波数、パルス光の発光時間の長さ及びパルス光の発光時間と消光時間との比（いわゆる、デューティ比）の少なくとも一つを含んでいてもよい。更に、制御装置２０は、制御部５６を介して駆動系２６による造形ヘッド２４の移動態様を制御し、制御部５８を介してステージ２８の移動態様を制御する。移動態様は、例えば、移動量、移動速度、移動方向及び移動タイミングの少なくとも一つを含む。更に、制御装置２０は、材料ノズル３２Ａ，３２Ｂによる造形材料Ｍの供給態様を制御する。供給態様は、例えば、供給量（特に、単位時間当たりの供給量）、供給される造形材料の厚さ、及び供給タイミングの少なくとも一つを含む。 In this embodiment, the control device 20 controls the emission mode of the light EL by the irradiation device 10 via the light source control section 16. The injection mode includes, for example, at least one of the intensity of the processing light EL and the injection timing of the processing light EL. When the processing light EL is pulsed light, the emission mode is, for example, the emission frequency of the pulsed light, the length of the emission time of the pulsed light, and the ratio of the emission time and extinction time of the pulsed light (so-called duty ratio). It may contain at least one of the following. Furthermore, the control device 20 controls the movement mode of the modeling head 24 by the drive system 26 via the control unit 56 and controls the movement mode of the stage 28 via the control unit 58. The movement mode includes, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing. Furthermore, the control device 20 controls the supply mode of the modeling material M by the material nozzles 32A and 32B. The supply mode includes, for example, at least one of the supply amount (particularly the supply amount per unit time), the thickness of the modeling material to be supplied, and the supply timing.
　次に、通常のＬＭＤ法（レーザ肉盛堆積法）（他のＤＥＤ法（指向性エネルギー堆積法）でも同様）による造形時には、各構造層の造形時に、照射光学系３０から造形面ＣＳに一定の出力で加工光ＥＬが照射され、材料ノズル３２Ａ，３２Ｂから造形面ＣＳに対して一定の単位時間当たりの供給量で造形材料Ｍが供給され、駆動系２６及び／又はステージ２８によって、加工光ＥＬは造形材料Ｍに対して一定の走査速度で移動する。このため、理想的には各構造層の造形後の表面はほぼ完全な平面になるはずである。
　しかしながら、実際には、当該層の下層に積み上げられた構造層の形状等が一様ではなく、このため熱容量も一様ではないため、上述の一定の条件で造形を行っても、当該層に供給される加工光ＥＬによる熱の拡散が一様ではない。このため、溶融池の径や深さが変動し、例えば溶融池が大きい場合には、より多くの造形材料が溶けて、付加される層が厚くなり、溶融池が小さい場合には、付加される層が薄くなるため、当該構造層の造形後の表面に凹凸が発生する。言い替えると、上述の一定の条件で造形を行っても、各構造層の造形後の表面の高さ分布が目標とする分布に対して誤差を持つようになる。 Next, when modeling by the normal LMD method (laser metal deposition method) (the same applies to other DED methods (directed energy deposition method)), when building each structural layer, the irradiation optical system 30 is directed at a constant distance from the irradiation optical system 30 to the building surface CS. The processing light EL is irradiated with the output of The EL moves at a constant scanning speed with respect to the modeling material M. Therefore, ideally, the surface of each structural layer after modeling should be almost completely flat.
However, in reality, the shape of the structural layer stacked below the layer concerned is not uniform, and therefore the heat capacity is also not uniform. Heat diffusion due to the supplied processing light EL is not uniform. For this reason, the diameter and depth of the molten pool will vary; for example, if the molten pool is large, more modeling material will be melted and a thicker layer will be added, and if the molten pool is small, less material will be added. As the layer becomes thinner, irregularities occur on the surface of the structural layer after modeling. In other words, even if modeling is performed under the above-mentioned constant conditions, the height distribution of the surface of each structural layer after modeling will have an error with respect to the target distribution.
　そこで、本実施形態では、以下のようにそのような高さ分布の誤差を造形面ＣＳに供給される造形材料Ｍの厚さ分布の制御、及び加工光ＥＬの強度の制御によって補正する。そのように高さ分布の誤差を補正するためには、まず高さ計測装置４２を用いてその高さ分布を高精度に計測する必要がある。図２（Ａ）に示すように、照射光学系３０を囲むように配置された高さ計測装置４２の複数（ここでは８個）の投光部４４Ａ～４４Ｈから、それぞれ照射光学系３０による加工光ＥＬの照射領域ＥＡから投光部４４Ａ～４４Ｈ側に離れた領域に斜めに２つのスポット光ＧＬＡ～ＧＬＨが投影されている。２つのスポット光ＧＬＡ～ＧＬＨは次第に間隔が狭くなるように投影されている。 Therefore, in the present embodiment, such height distribution errors are corrected by controlling the thickness distribution of the modeling material M supplied to the modeling surface CS and controlling the intensity of the processing light EL as described below. In order to correct errors in the height distribution in this way, it is first necessary to use the height measurement device 42 to measure the height distribution with high precision. As shown in FIG. 2A, processing by the irradiation optical system 30 is performed from a plurality of (eight in this case) light projecting parts 44A to 44H of the height measuring device 42 arranged so as to surround the irradiation optical system 30. Two spot lights GLA to GLH are diagonally projected onto areas distant from the irradiation area EA of the light EL toward the light projecting units 44A to 44H. The two spot lights GLA to GLH are projected so that the interval becomes gradually narrower.
　このため、図２（Ｂ）に示すように、例えばスポット光ＧＬＡが投影される造形面ＣＳの高さ（Ｚ位置）が位置Ｚｂｆであるときに、２つのスポット光ＧＬＡの間隔がｈ２であるとする。一例として、位置Ｚｂｆは照射光学系３０に対する合焦面（加工光ＥＬが最も小さく集光される面）のＺ位置を意味している。この場合、造形面ＣＳの高さが－Ｚ１だけ低い場合（Ｚ＝Ｚｂｆ－Ｚ１）（Ｚ１は例えば想定される変動量の上限値）にはスポット光ＧＬＡの間隔ｈ１は間隔ｈ２より小さくなり、造形面ＣＳの高さがＺ１だけ高い場合（Ｚ＝Ｚｂｆ＋Ｚ１）には、２つのスポット光ＧＬＡの間隔ｈ３は間隔ｈ２より大きくなる。このため、スポット光ＧＬＡの間隔をｈとすると、係数ａ，ｂを用いて造形面ＣＳの高さＺとの関係は例えば次のようになる。本実施形態では、予め例えば実測によって、係数ａ，ｂ及び位置Ｚｂｆが求められており、係数ａ，ｂ及び位置Ｚｂｆは図１の撮像信号処理部４８に記憶されている。
　ｈ＝ａ＋ｂ（Ｚ－Ｚｂｆ）　　…（１） Therefore, as shown in FIG. 2(B), for example, when the height (Z position) of the modeling surface CS on which the spot light GLA is projected is the position Zbf, the interval between the two spot lights GLA is h2. shall be. As an example, the position Zbf means the Z position of the focusing plane (the plane on which the processing light EL is focused the smallest) with respect to the irradiation optical system 30. In this case, when the height of the modeling surface CS is lower by -Z1 (Z=Zbf-Z1) (Z1 is, for example, the upper limit of the expected amount of variation), the interval h1 of the spot lights GLA is smaller than the interval h2, When the height of the modeling surface CS is higher by Z1 (Z=Zbf+Z1), the interval h3 between the two spot lights GLA is larger than the interval h2. Therefore, if the interval between the spot lights GLA is h, the relationship with the height Z of the modeling surface CS using the coefficients a and b is, for example, as follows. In this embodiment, the coefficients a, b and the position Zbf are determined in advance, for example, by actual measurement, and the coefficients a, b and the position Zbf are stored in the imaging signal processing unit 48 in FIG. 1.
h=a+b(Z-Zbf)...(1)
　撮像信号処理部４８では、撮像装置４６の撮像信号を処理して投光部４４Ａ～４４Ｈのそれぞれに関して対応するスポット光ＧＬＡ～ＧＬＨの間隔ｈを求め、この間隔ｈと上述の係数ａ，ｂ及び位置Ｚｂｆとを用いて、式（１）からスポット光ＧＬＡ～ＧＬＨが投影されている部分の高さ（Ｚ位置）を算出できる。例えば造形ヘッド２４（照射光学系３０）が造形面ＣＳに対して相対的に－Ｙ方向に移動する場合には、投光部４４Ａのスポット光ＧＬＡから求められる高さ（位置Ｚ）は当該構造層の造形後の表面の高さであり、投光部４４Ｂのスポット光ＧＬＢから求められる高さ（位置Ｚ）は当該構造層の下の構造層の表面の高さである。このため、造形ヘッド２４の造形面ＣＳに対する相対的な移動方向の前方又は後方のスポット光ＧＬＡ～ＧＬＨの間隔から高さを求めることによって、当該構造層の造形後の高さ、及び下の構造層の表面の高さを計測することができる。 The imaging signal processing unit 48 processes the imaging signal of the imaging device 46 to determine the interval h between the corresponding spot lights GLA to GLH for each of the light projectors 44A to 44H, and calculates the interval h between the corresponding spot lights GLA to GLH with respect to each of the light projecting units 44A to 44H. Using the position Zbf, the height (Z position) of the portion where the spot lights GLA to GLH are projected can be calculated from equation (1). For example, when the printing head 24 (irradiation optical system 30) moves in the -Y direction relative to the printing surface CS, the height (position Z) determined from the spot light GLA of the light projecting section 44A is This is the height of the surface of the layer after modeling, and the height (position Z) determined from the spot light GLB of the light projecting section 44B is the height of the surface of the structural layer below the structural layer. Therefore, by determining the height from the interval between the front and rear spot lights GLA to GLH in the moving direction relative to the printing surface CS of the printing head 24, the height of the structural layer after printing and the structure below can be calculated. The height of the surface of the layer can be measured.
　本実施形態では、図１の撮像信号処理部４８から造形面ＣＳの計測された高さの分布を示す高さ分布信号ＲＳ（相対的な移動方向と高さ（Ｚ位置）との関係を示す信号）が誤差算出部５０に出力される。誤差算出部５０には、各構造層の表面の高さ分布の目標分布の情報が制御装置２０から供給されている。誤差算出部５０は、高さ分布信号ＲＳから目標分布を表す信号を差し引いて誤差成分を表す信号を求め、この誤差成分を表す信号をハイパスフィルタ部５２Ｈ及びローパスフィルタ部５２Ｌに供給する。 In this embodiment, a height distribution signal RS (indicating the relationship between the relative movement direction and the height (Z position) signal) is output to the error calculation section 50. The error calculation unit 50 is supplied with information on the target distribution of the surface height distribution of each structural layer from the control device 20. The error calculation section 50 subtracts the signal representing the target distribution from the height distribution signal RS to obtain a signal representing the error component, and supplies the signal representing the error component to the high-pass filter section 52H and the low-pass filter section 52L.
　ハイパスフィルタ部５２Ｈでは、誤差成分を表す信号から空間周波数が所定の閾値ＳＰＦより高い高空間周波数信号ＨＳを抽出し、ローパスフィルタ部５２Ｌでは、誤差成分を表す信号から空間周波数が閾値ＳＰＦより低い低空間周波数信号ＬＳを抽出する。高空間周波数信号ＨＳ及び低空間周波数信号ＬＳはそれぞれ制御装置２０に供給される。空間周波数の閾値ＳＰＡは、一例として０．１ｍｍ-1程度（波長で１０ｍｍ程度）である。なお、閾値ＳＰＡは、駆動系２６及び／又はステージ２８による造形ヘッド２４とワークＷとの相対速度等によって変化する値であり、閾値ＳＰＡは、例えば０．０５～０．２ｍｍ-1程度（波長で２０～５ｍｍ程度）でもよい。 The high-pass filter section 52H extracts a high spatial frequency signal HS whose spatial frequency is higher than a predetermined threshold SPF from the signal representing the error component, and the low-pass filter section 52L extracts a high spatial frequency signal HS whose spatial frequency is lower than the threshold SPF from the signal representing the error component. Extract the spatial frequency signal LS. The high spatial frequency signal HS and the low spatial frequency signal LS are each supplied to the control device 20. The spatial frequency threshold SPA is, for example, about 0.1 mm −1 (about 10 mm in terms of wavelength). Note that the threshold value SPA is a value that changes depending on the relative speed between the printing head 24 and the workpiece W by the drive system 26 and/or the stage 28, and the threshold value SPA is, for example, about 0.05 to 0.2 mm -1 (wavelength (about 20 to 5 mm) may be sufficient.
　また、制御装置２０では、高空間周波数信号ＨＳに対応する高い空間周波数の高さ分布の誤差を補正するように、光源制御部１６を介して光源１０の出力（単位時間当たりの強度）を制御し、低空間周波数信号ＬＳに対応する低い空間周波数の高さ分布の誤差を補正するようにノズル制御部６０を介して材料ノズル３２Ａ，３２Ｂの造形面ＣＳに対する距離を制御する。
　本実施形態では、図１に示すように、材料ノズル３２Ａ，３２Ｂは照射光学系３０を挟むように対称に傾斜している。以下では、通常の造形動作では造形面ＣＳは照射光学系３０の合焦面ＢＦに合致しているものとする。そして、図３（Ａ）に示すように、駆動機構３４Ａ，３４Ｂによって材料ノズル３２Ａ，３２Ｂが可動範囲のＺ方向の中央にある場合、材料ノズル３２Ａ，３２Ｂから供給される造形材料Ｍは、合焦面ＢＦに対して所定量だけ下方（－Ｚ方向）の集中領域６２で重なるように、材料ノズル３２Ａ，３２Ｂの角度が設定されているものとする。合焦面ＢＦに対する集中領域６２のＺ方向の間隔δｚは、駆動機構３４Ａ，３４Ｂの駆動量から求められる。 The control device 20 also controls the output (intensity per unit time) of the light source 10 via the light source control unit 16 so as to correct errors in the height distribution of high spatial frequencies corresponding to the high spatial frequency signal HS. Then, the distances of the material nozzles 32A and 32B to the modeling surface CS are controlled via the nozzle control unit 60 so as to correct errors in the height distribution of low spatial frequencies corresponding to the low spatial frequency signal LS.
In this embodiment, as shown in FIG. 1, the material nozzles 32A and 32B are symmetrically inclined so that the irradiation optical system 30 is sandwiched therebetween. In the following, it is assumed that the modeling surface CS coincides with the focal plane BF of the irradiation optical system 30 in a normal modeling operation. As shown in FIG. 3(A), when the material nozzles 32A, 32B are located at the center of the movable range in the Z direction by the drive mechanisms 34A, 34B, the modeling material M supplied from the material nozzles 32A, 32B is It is assumed that the angles of the material nozzles 32A and 32B are set so that they overlap in the concentrated region 62 by a predetermined amount below the focal plane BF (in the -Z direction). The distance δz in the Z direction between the focused area 62 and the focal plane BF is determined from the drive amount of the drive mechanisms 34A and 34B.
　これに対して、図３（Ｂ）に示すように、駆動機構３４Ａ，３４Ｂを介して材料ノズル３２Ａ，３２Ｂを＋Ｚ方向に移動させて、集中領域６２が合焦面ＢＦに近づくと、合焦面ＢＦに対する集中領域６２の間隔δｚ１はかなり小さい値になる。そして、造形面ＣＳに単位時間に供給される造形材料６４の厚さｔｈ１は最も大きくなる。一方、図３（Ｃ）に示すように、駆動機構３４Ａ，３４Ｂを介して材料ノズル３２Ａ，３２Ｂを－Ｚ方向に移動させて、集中領域６２が合焦面ＢＦから離れると、合焦面ＢＦに対する集中領域６２の間隔δｚ２はかなり大きい値になる。そして、造形面ＣＳに単位時間に供給される造形材料６４の厚さｔｈ２は厚さｔｈ１のほぼ１／２になる。 On the other hand, as shown in FIG. 3(B), when the material nozzles 32A and 32B are moved in the +Z direction via the drive mechanisms 34A and 34B and the concentrated area 62 approaches the focusing plane BF, the focus The distance δz1 between the concentrated region 62 and the surface BF becomes a considerably small value. Then, the thickness th1 of the modeling material 64 supplied to the modeling surface CS per unit time becomes the largest. On the other hand, as shown in FIG. 3(C), when the material nozzles 32A, 32B are moved in the -Z direction via the drive mechanisms 34A, 34B, and the concentrated area 62 leaves the focal plane BF, the focal plane BF The distance δz2 between the concentrated regions 62 relative to each other becomes a considerably large value. The thickness th2 of the modeling material 64 supplied to the modeling surface CS per unit time is approximately 1/2 of the thickness th1.
　すなわち、材料ノズル３２Ａ，３２Ｂの造形面ＣＳに対する相対位置を変化させ、合焦面ＢＦに対する集中領域６２の間隔δｚを変化させることによって、造形面ＣＳに単位時間当たりに供給される造形材料６４の厚さｔｈを大きく制御することができ、最終的に造形面ＣＳに形成されるパターンの厚さも大きく制御できる。このため、図３（Ａ）において、合焦面ＢＦに対する集中領域６２の－Ｚ方向の間隔δｚと、造形面ＣＳに単位時間当たりに供給される造形材料６４の厚さｔｈとの間には、例えば実測で求められる係数ｃ，ｄを用いて次のような関係がある。なお、厚さｔｈの造形材料６４の中で加工光ＥＬが照射された部分だけが溶融後の冷却及び固化によって構造層の一部となる。
　δｚ＝ｃ＋ｄ・ｔｈ　　　…（２） That is, by changing the relative positions of the material nozzles 32A, 32B with respect to the modeling surface CS and changing the interval δz of the concentrated area 62 with respect to the focusing plane BF, the amount of the modeling material 64 supplied to the modeling surface CS per unit time can be increased. The thickness th can be largely controlled, and the thickness of the pattern finally formed on the modeling surface CS can also be largely controlled. Therefore, in FIG. 3A, there is a difference between the distance δz of the concentrated region 62 in the −Z direction with respect to the focusing plane BF and the thickness th of the modeling material 64 supplied per unit time to the modeling surface CS. For example, the following relationship exists using coefficients c and d found through actual measurements. Note that only the portion of the modeling material 64 having the thickness th that is irradiated with the processing light EL becomes part of the structural layer by cooling and solidifying after melting.
δz=c+d・th...(2)
　制御装置２０では、駆動機構３４Ａ，３４Ｂの駆動によって間隔δｚを求め、この間隔δｚと既知の係数ｃ，ｄとを用いて材料ノズル３２Ａ，３２Ｂから造形面ＣＳに単位時間当たりに供給される造形材料６４の厚さｔｈを求めることができる。言い替えると、制御装置２０は、ノズル制御部６０で材料ノズル３２Ａ，３２ＢのＺ方向の位置を制御することで、造形面ＣＳに供給される造形材料６４の厚さｔｈを制御できる。この結果、造形材料６４に加工光ＥＬを照射し、溶融、冷却、及び固化によって形成される造形材料のパターンの厚さも制御できる。なお、材料ノズル３２Ａ，３２Ｂの位置を制御する場合には、造形材料６４の厚さｔｈを大きく変化させることができ、最終的に形成されるパターンの厚さも大きく制御できる。その一方で、材料ノズル３２Ａ，３２Ｂの位置の制御は機械的な制御であり、応答速度があまり高くないため、高空間周波数信号ＨＳに対応する高い空間周波数成分の高さの制御にはあまり適さない。このため、本実施形態では、材料ノズル３２Ａ，３２Ｂの位置の制御による造形材料の厚さの制御によって、低空間周波数信号ＬＳに対応する低い空間周波数成分の高さの制御を行う。 The control device 20 determines the interval δz by driving the drive mechanisms 34A and 34B, and uses this interval δz and the known coefficients c and d to calculate the amount of modeling that is supplied from the material nozzles 32A and 32B to the modeling surface CS per unit time. The thickness th of the material 64 can be determined. In other words, the control device 20 can control the thickness th of the modeling material 64 supplied to the modeling surface CS by controlling the positions of the material nozzles 32A, 32B in the Z direction with the nozzle control unit 60. As a result, the thickness of the pattern of the modeling material formed by irradiating the modeling material 64 with the processing light EL, melting, cooling, and solidification can also be controlled. Note that when controlling the positions of the material nozzles 32A and 32B, the thickness th of the modeling material 64 can be greatly changed, and the thickness of the pattern that is finally formed can also be greatly controlled. On the other hand, the control of the positions of the material nozzles 32A and 32B is mechanical control, and the response speed is not very high, so it is not suitable for controlling the height of the high spatial frequency component corresponding to the high spatial frequency signal HS. do not have. Therefore, in this embodiment, the height of the low spatial frequency component corresponding to the low spatial frequency signal LS is controlled by controlling the thickness of the modeling material by controlling the positions of the material nozzles 32A and 32B.
　次に、加工光ＥＬの強度を制御して造形材料の厚さを制御する方法につき図４（Ａ）～（Ｄ）を参照して説明する。図４（Ａ）に示すように、ワークＷの造形面ＣＳに加工光ＥＬを照射し、その照射領域に造形材料Ｍを供給する場合、図４（Ｂ）に示すように、造形面ＣＳに溶融池ＭＰが形成される。そして、図４（Ｃ）に示すように、溶融池ＭＰによって、供給される造形材料Ｍの一部の材料６６が融着される。その後、加工光ＥＬが通過して冷却及び固化によって、図４（Ｄ）に示すように、材料６６に対応する部分が凸のパターン６６Ａとなる。この際に、図１の光源制御部１６の制御によって光源１０から射出される加工光ＥＬの強度が大きくなると、溶融池ＭＰが溶融池ＭＰ１のように大きくなり、供給される造形材料Ｍの、融着される量が多くなるため、最終的に形成されるパターン６６Ｂはパターン６６Ａよりも高くなる。逆に、加工光ＥＬの強度が小さくなると、最終的に形成されるパターンはパターン６６Ａよりも低くなる。 Next, a method for controlling the thickness of the modeling material by controlling the intensity of the processing light EL will be explained with reference to FIGS. 4(A) to 4(D). As shown in FIG. 4(A), when the processing light EL is irradiated onto the modeling surface CS of the workpiece W and the modeling material M is supplied to the irradiation area, as shown in FIG. 4(B), the modeling surface CS is A molten pool MP is formed. Then, as shown in FIG. 4C, a part of the material 66 of the supplied modeling material M is fused by the molten pool MP. Thereafter, the processing light EL passes therethrough, and as a result of cooling and solidification, the portion corresponding to the material 66 becomes a convex pattern 66A, as shown in FIG. 4(D). At this time, when the intensity of the processing light EL emitted from the light source 10 increases under the control of the light source control unit 16 in FIG. Since the amount to be fused increases, the finally formed pattern 66B is higher than the pattern 66A. Conversely, when the intensity of the processing light EL decreases, the pattern finally formed will be lower than the pattern 66A.
　このように加工光ＥＬの単位時間当たりの強度の制御によって、当該構造層に形成されるパターンの厚さを制御できる。また、光源制御部１６による光源１０の強度の電気的な（あるいは光学的な）制御は、材料ノズル３２Ａ，３２Ｂの位置の機械的な制御よりも高速に行うことができる。但し、光源１０の強度の制御による当該構造層に形成されるパターンの厚さの制御量は、材料ノズル３２Ａ，３２Ｂの位置の機械的な制御によるパターンの厚さの制御量よりも小さくなる。このため、加工光ＥＬの強度の制御は、高空間周波数信号ＨＳに対応する高い空間周波数成分の高さの制御に適している。 In this way, by controlling the intensity per unit time of the processing light EL, the thickness of the pattern formed in the structural layer can be controlled. Furthermore, electrical (or optical) control of the intensity of the light source 10 by the light source control unit 16 can be performed faster than mechanical control of the positions of the material nozzles 32A, 32B. However, the amount of control of the thickness of the pattern formed in the structural layer by controlling the intensity of the light source 10 is smaller than the amount of control of the thickness of the pattern by mechanically controlling the positions of the material nozzles 32A, 32B. Therefore, controlling the intensity of the processing light EL is suitable for controlling the height of the high spatial frequency component corresponding to the high spatial frequency signal HS.
　次に、本実施形態においてワークＷ上に第１構造層を形成し、この上に第２構造層を形成する場合の動作の一例につき図５（Ａ）～（Ｄ）を参照して説明する。まず、図５（Ａ）に示すように、ワークＷの表面に照射光学系３０から加工光ＥＬを照射し、加工光ＥＬの照射領域に材料ノズル３２Ａ，３２Ｂから造形材料Ｍを供給し、ワークＷに対して造形ヘッド２４を例えば－Ｙ方向に相対的に移動して、第１構造層６８Ａのパターンを造形するものとする。この際に、第１構造層６８Ａの表面の目標とする形状は、例えば点線で示す平坦な目標分布７０Ａであるとする。本実施形態では、第１構造層６８Ａの造形時に、造形ヘッド２４において照射光学系３０から走査方向に関して後方にある投光部４４Ａから造形直後のパターンの表面に投影されるスポット光ＧＬＡの像を図１の撮像装置４６で撮像し、造形直後の第１構造層６８Ａのパターンの表面６８Ａａの高さの分布を計測する。
　この例において、図１の撮像信号処理部４８から出力される分布信号ＲＳから誤差算出部５０において目標分布の信号を差し引くことで誤差信号が得られる。この誤差信号をハイパスフィルタ部５２Ｈ及びローパスフィルタ部５２Ｌに供給すると、ローパスフィルタ部５２Ｌ及びハイパスフィルタ部５２Ｈからそれぞれ図５（Ｂ）の低い空間周波数（長い波長）の低空間周波数信号ＬＳ、及び図５（Ｃ）の高い空間周波数（短い波長）の高空間周波数信号ＨＳが制御装置２０に供給される。図５（Ｃ）の高空間周波数信号ＨＳは、図５（Ａ）の高さ分布のうちの小さい波長で小さい振幅の変動部６９Ａ，６９Ｂに対応している。 Next, an example of the operation when forming the first structural layer on the workpiece W and forming the second structural layer thereon in this embodiment will be described with reference to FIGS. 5(A) to 5(D). . First, as shown in FIG. 5(A), the surface of the workpiece W is irradiated with processing light EL from the irradiation optical system 30, the modeling material M is supplied from the material nozzles 32A and 32B to the irradiation area of the processing light EL, and the workpiece It is assumed that the pattern of the first structural layer 68A is formed by moving the printing head 24 relative to W, for example, in the -Y direction. At this time, it is assumed that the target shape of the surface of the first structural layer 68A is, for example, a flat target distribution 70A shown by a dotted line. In this embodiment, when printing the first structural layer 68A, an image of spot light GLA is projected onto the surface of the pattern immediately after printing from the light projection unit 44A located at the rear in the scanning direction from the irradiation optical system 30 in the printing head 24. An image is captured by the imaging device 46 in FIG. 1, and the height distribution of the surface 68Aa of the pattern of the first structural layer 68A immediately after modeling is measured.
In this example, the error signal is obtained by subtracting the signal of the target distribution in the error calculation section 50 from the distribution signal RS output from the imaging signal processing section 48 in FIG. When this error signal is supplied to the high-pass filter section 52H and the low-pass filter section 52L, the low-pass filter section 52L and the high-pass filter section 52H produce a low spatial frequency signal LS with a low spatial frequency (long wavelength) as shown in FIG. A high spatial frequency signal HS with a high spatial frequency (short wavelength) of 5(C) is supplied to the control device 20. The high spatial frequency signal HS in FIG. 5(C) corresponds to the small wavelength and small amplitude fluctuation portions 69A and 69B of the height distribution in FIG. 5(A).
　その後、図５（Ｄ）に示すように、第１構造層６８Ａ上に肉盛りをして第２構造層６８Ｂを造形する場合には、加工光ＥＬの照射領域に材料ノズル３２Ａ，３２Ｂから造形材料Ｍを供給し、ワークＷに対して造形ヘッド２４を例えば－Ｙ方向に相対的に移動する際に、図５（Ｂ）の低空間周波数信号ＬＳが示す高さ分布の誤差を相殺するように、フィードフォワード制御方式で制御装置２０はノズル制御部６０を介して材料ノズル３２Ａ，３２ＢのＺ位置を補正する。さらに、図５（Ｃ）の高空間周波数信号ＨＳが示す高さ分布の誤差を補正するように、フィードフォワード制御方式で制御装置２０は光源制御部１６を介して光源１０の出力（強度）を制御する。この際に、低空間周波数信号ＬＳ及び高空間周波数信号ＨＳは予め計測されているため、第２構造層６８Ｂの造形を行う際に、各位置での造形材料Ｍの厚さをその予め計測されている誤差を相殺するようにフィードフォワード方式で制御できる。また、第２構造層６８Ｂの表面の目標とする形状も、例えば点線で示す平坦な目標分布７０Ｂであるとする。 After that, as shown in FIG. 5(D), when building up on the first structural layer 68A to form the second structural layer 68B, the material nozzles 32A and 32B are used to form the material in the irradiation area of the processing light EL. When supplying the material M and moving the printing head 24 relative to the workpiece W, for example, in the −Y direction, the error in the height distribution indicated by the low spatial frequency signal LS in FIG. 5(B) is canceled out. Next, the control device 20 corrects the Z positions of the material nozzles 32A and 32B via the nozzle control section 60 using a feedforward control method. Furthermore, the control device 20 controls the output (intensity) of the light source 10 via the light source control unit 16 using the feedforward control method so as to correct the error in the height distribution indicated by the high spatial frequency signal HS in FIG. 5(C). Control. At this time, since the low spatial frequency signal LS and the high spatial frequency signal HS are measured in advance, when modeling the second structural layer 68B, the thickness of the modeling material M at each position is measured in advance. It can be controlled using a feedforward method to cancel out the errors that occur. Further, it is assumed that the target shape of the surface of the second structural layer 68B is also a flat target distribution 70B shown by a dotted line, for example.
　この制御方法によれば、第１構造層６８Ａの表面６８Ａａの凹凸が大きい場合でも、第２構造層６８Ｂの肉盛りによる造形後の表面６８Ｂａの凹凸は小さくなり、造形後の面精度（平面度等）が改善される。さらに、この第２構造層６８Ｂの造形時にも、造形ヘッド２４において照射光学系３０から走査方向に関して後方にある投光部４４Ａから造形直後のパターンの表面に投影されるスポット光ＧＬＡの像を図１の撮像装置４６で撮像し、造形直後の第２構造層６８Ｂのパターンの表面６８Ｂａの高さの分布を計測する。この高さ分布の目標分布７０Ｂからの誤差は、第２構造層６８Ｂの上の第３構造層（不図示）の造形時に補正される。この制御方法によれば、仮に一定の条件で造形を行っても、上述の熱拡散の不均一性等によって各構造層の造形後の表面の高さ分布が目標とする分布に対して誤差分布を持つような場合にも、その上の構造層の造形時にその誤差分布を相殺するように当該構造層の厚さ分布を制御することによって、造形後の構造物の表面の面精度を目標とする精度に仕上げることができる。 According to this control method, even if the surface 68Aa of the first structural layer 68A has large irregularities, the unevenness of the surface 68Ba after modeling by build-up of the second structural layer 68B becomes small, and the surface accuracy (flatness) after modeling becomes small. etc.) will be improved. Furthermore, when printing the second structural layer 68B, the image of the spot light GLA projected onto the surface of the pattern immediately after printing from the light projection unit 44A located behind the irradiation optical system 30 in the scanning direction in the printing head 24 is also shown. The first imaging device 46 takes an image and measures the height distribution of the surface 68Ba of the pattern of the second structural layer 68B immediately after modeling. This error in the height distribution from the target distribution 70B is corrected when forming the third structural layer (not shown) on the second structural layer 68B. According to this control method, even if printing is performed under certain conditions, the height distribution of the surface after printing of each structural layer will have an error distribution with respect to the target distribution due to the non-uniformity of thermal diffusion as described above. By controlling the thickness distribution of the structural layer above it so as to cancel out the error distribution when printing the structural layer above it, it is possible to target the surface accuracy of the surface of the structure after printing. It can be finished to the desired precision.
　続いて、造形装置４による造形動作（つまり、３次元構造物ＳＴを形成するための動作）について説明する。造形装置４は、形成するべき３次元構造物ＳＴの３次元モデルデータ（例えば、ＣＡＤ（Computer Aided Design）データ）等に基づいて、ワークＷ上に３次元構造物ＳＴを形成する。３次元モデルデータ（以下、３Ｄデータともいう）は、例えば不図示のサーバから造形装置４の制御装置２０に供給されたものである。さらに、３Ｄデータとして、造形装置４内に設けられた形状測定装置等（不図示）で計測された立体物の計測データ、造形装置４とは別に設けられた３次元形状測定装置等の計測データを用いてもよい。なお、３Ｄデータとしては、例えばＳＴＬ(Stereo Lithography)フォーマット、ＶＲＭＬ(Virtual Reality Modeling Language)フォーマット、ＡＭＦ(Additive Manufacturing File Format)、又はビットマップフォーマット等を用いることができる。造形装置４は、３次元構造物ＳＴを形成するために、一例として３次元構造物ＳＴをＺ方向に沿って輪切りにすることで得られる複数の部分構造物（以下、構造層とも称する）ＳＬを１層ずつ順に形成していく。その結果、複数の構造層ＳＬが積層された積層構造体である３次元構造物ＳＴが形成される。以下、複数の構造層ＳＬを１層ずつ順に形成していくことで３次元構造物ＳＴを形成する動作の流れについて説明する。 Next, the modeling operation by the modeling device 4 (that is, the operation for forming the three-dimensional structure ST) will be explained. The modeling device 4 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. The three-dimensional model data (hereinafter also referred to as 3D data) is supplied to the control device 20 of the modeling device 4 from, for example, a server (not shown). Furthermore, as 3D data, measurement data of a three-dimensional object measured by a shape measuring device etc. (not shown) provided in the modeling device 4, measurement data of a three-dimensional shape measuring device etc. provided separately from the modeling device 4. may also be used. Note that as the 3D data, for example, STL (Stereo Lithography) format, VRML (Virtual Reality Modeling Language) format, AMF (Additive Manufacturing File Format), or bitmap format can be used. In order to form the three-dimensional structure ST, the modeling device 4 creates a plurality of partial structures (hereinafter also referred to as structural layers) SL obtained by, for example, cutting the three-dimensional structure ST into rounds along the Z direction. are formed one layer at a time. As a result, a three-dimensional structure ST, which is a layered structure in which a plurality of structural layers SL are stacked, is formed. Hereinafter, a flow of operations for forming a three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.
　まず、各構造層ＳＬを形成する動作について説明する。造形装置４は、制御装置２０の制御下で、ワークＷの表面又は形成済みの構造層ＳＬの表面に相当する造形面ＣＳ上の所望領域に照射領域ＥＡを設定し、照射領域ＥＡに対して照射光学系３０から加工光ＥＬを照射する。本実施形態においては、加工光ＥＬの合焦面（つまり、集光位置）が造形面ＣＳに一致している。その結果、図６（Ａ）に示すように、照射光学系３０から射出された加工光ＥＬによって造形面ＣＳ上の所望領域に溶融池（つまり、光ＥＬによって溶融した金属のプール）ＭＰが形成される。更に、造形装置４は、制御装置２０の制御下で、造形面ＣＳ上の所望領域に供給領域ＭＡを設定し、供給領域ＭＡに対して材料ノズル３２Ａ，３２Ｂから造形材料Ｍを供給する。ここで、供給領域ＭＡは、溶融池ＭＰが形成された領域に設定されている。このため、造形装置４は、図６（Ｂ）に示すように、溶融池ＭＰに対して、材料ノズル３２Ａ，３２Ｂから造形材料Ｍを供給する。その結果、溶融池ＭＰに供給された造形材料Ｍが溶融する。造形ヘッド２４の相対移動に伴って溶融池ＭＰに光ＥＬが照射されなくなると、溶融池ＭＰにおいて溶融した造形材料Ｍは、冷却されて再度固化（つまり、凝固）する。その結果、図６（Ｃ）に示すように、再度固化した造形材料Ｍ（造形物の一部）が造形面ＣＳ上に堆積される。 First, the operation of forming each structural layer SL will be explained. Under the control of the control device 20, the modeling device 4 sets an irradiation area EA in a desired area on the modeling surface CS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL, and Processing light EL is irradiated from the irradiation optical system 30. In this embodiment, the focal plane (that is, the condensing position) of the processing light EL coincides with the modeling surface CS. As a result, as shown in FIG. 6A, a molten pool (that is, a pool of metal melted by the light EL) MP is formed in a desired area on the modeling surface CS by the processing light EL emitted from the irradiation optical system 30. be done. Furthermore, under the control of the control device 20, the modeling device 4 sets a supply area MA in a desired area on the modeling surface CS, and supplies the modeling material M to the supply area MA from the material nozzles 32A, 32B. Here, the supply area MA is set in the area where the molten pool MP is formed. For this reason, the modeling device 4 supplies the modeling material M from the material nozzles 32A and 32B to the molten pool MP, as shown in FIG. 6(B). As a result, the modeling material M supplied to the molten pool MP is melted. When the molten pool MP is no longer irradiated with the light EL due to the relative movement of the modeling head 24, the modeling material M melted in the molten pool MP is cooled and solidified again (that is, solidified). As a result, as shown in FIG. 6(C), the solidified modeling material M (part of the object) is deposited on the object surface CS.
　このような光ＥＬの照射による溶融池ＭＰの形成、溶融池ＭＰへの造形材料Ｍの供給、供給された造形材料Ｍの溶融及び溶融した造形材料Ｍの再固化を含む一連の造形処理が、造形面ＣＳに対して造形ヘッド２４をＸＹ平面に沿って相対的に移動させながら繰り返される。つまり、造形面ＣＳに対して造形ヘッド２４が相対的に移動すると、造形面ＣＳに対して照射領域ＥＡもまた相対的に移動する。従って、一連の造形処理が、造形面ＣＳに対して照射領域ＥＡをＸＹ平面に沿って（つまり、二次元平面内において）相対的に移動させながら繰り返される。この際、加工光ＥＬは、造形面ＣＳ上において造形物を形成したい領域に設定された照射領域ＥＡに対して選択的に照射される一方で、造形面ＣＳ上において造形物を形成したくない領域に設定された照射領域ＥＡに対して選択的に照射されない（造形物を形成したくない領域には照射領域ＥＡが設定されないとも言える）。つまり、造形装置４は、造形面ＣＳ上を所定の移動軌跡に沿って照射領域ＥＡを移動させながら、造形物を形成したい領域の分布パターン（つまり、構造層ＳＬ内の造形物）に応じたタイミングで加工光ＥＬを造形面ＣＳに照射する。その結果、溶融池ＭＰもまた、照射領域ＥＡの移動軌跡に応じた移動軌跡に沿って造形面ＣＳ上を移動することになる。具体的には、溶融池ＭＰは、造形面ＣＳ上において、照射領域ＥＡの移動軌跡に沿った領域のうち加工光ＥＬが照射された部分に順次形成される。 A series of modeling processes including forming a molten pool MP by irradiating the light EL, supplying the modeling material M to the molten pool MP, melting the supplied modeling material M, and resolidifying the melted modeling material M, This process is repeated while moving the printing head 24 relatively to the printing surface CS along the XY plane. That is, when the printing head 24 moves relative to the printing surface CS, the irradiation area EA also moves relatively to the printing surface CS. Therefore, a series of modeling processes are repeated while moving the irradiation area EA along the XY plane (that is, within a two-dimensional plane) relative to the modeling surface CS. At this time, the processing light EL is selectively irradiated to the irradiation area EA set in the area where the object is to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed. The irradiation area EA set in the area is not selectively irradiated (it can also be said that the irradiation area EA is not set in the area where it is not desired to form a modeled object). In other words, the modeling device 4 moves the irradiation area EA along a predetermined movement locus on the modeling surface CS, and adjusts the pattern according to the distribution pattern of the area in which the object is to be formed (that is, the object in the structural layer SL). The processing light EL is irradiated onto the modeling surface CS at the appropriate timing. As a result, the molten pool MP also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. Specifically, the molten pool MP is sequentially formed on the modeling surface CS in the portions irradiated with the processing light EL among the regions along the movement locus of the irradiation area EA.
　更に、上述したように照射領域ＥＡと供給領域ＭＡとが一致しているため、供給領域ＭＡもまた、照射領域ＥＡの移動軌跡に応じた移動軌跡に沿って造形面ＣＳ上を移動することになる。その結果、造形面ＣＳ上に、凝固した造形材料Ｍによる造形物の集合体に相当する構造層ＳＬが形成される。つまり、溶融池ＭＰの移動軌跡に応じたパターンで造形面ＣＳ上に形成された造形物の集合体に相当する構造層ＳＬが形成される。なお、造形物を形成したくない領域に照射領域ＥＡが設定されている場合、加工光ＥＬを照射領域ＥＡに照射するとともに、造形材料Ｍの供給を停止してもよい。また、造形物を形成したくない領域に照射領域ＥＡが設定されている場合に、造形材料Ｍを照射領域ＥＬに供給するとともに、溶融池ＭＰができない強度の光ＥＬを照射領域ＥＬに照射してもよい。 Furthermore, as described above, since the irradiation area EA and the supply area MA coincide, the supply area MA also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. Become. As a result, a structural layer SL corresponding to an aggregate of objects made of the solidified modeling material M is formed on the modeling surface CS. In other words, a structural layer SL corresponding to an aggregate of shaped objects formed on the shaped surface CS in a pattern according to the movement locus of the molten pool MP is formed. In addition, when the irradiation area EA is set in a region where it is not desired to form a modeled object, the supply of the modeling material M may be stopped while irradiating the processing light EL to the irradiation area EA. In addition, when the irradiation area EA is set in an area where you do not want to form a modeled object, the modeling material M is supplied to the irradiation area EL, and the irradiation area EL is irradiated with light EL with an intensity that does not create a molten pool MP. You can.
　なお、ワークＷ上の照射領域ＥＡの移動軌跡は、いわゆるラスタスキャンでの走査に対応する移動軌跡、又はいわゆるベクタースキャンでの走査に対応する移動軌跡のいずれでもよい。なお、上述の説明では、造形面ＣＳに対して造形ヘッド２４（すなわち光ＥＬ）を移動させることにより、造形面ＣＳに対して照射領域ＥＡを移動させたが、造形面ＣＳを移動させてもよいし、造形ヘッド２４（すなわち加工光ＥＬ）と造形面ＣＳの両方を動かしてもよい。 Note that the movement trajectory of the irradiation area EA on the workpiece W may be either a movement trajectory corresponding to scanning in so-called raster scanning or a movement trajectory corresponding to scanning in so-called vector scanning. Note that in the above explanation, the irradiation area EA was moved with respect to the printing surface CS by moving the printing head 24 (that is, the light EL) with respect to the printing surface CS, but even if the printing surface CS is moved, Alternatively, both the printing head 24 (that is, the processing light EL) and the printing surface CS may be moved.
　次に、本実施形態の造形装置４の造形動作の一例につき図８（Ａ）のフローチャートを参照して説明する。まずステップ１０２において、制御装置２０は、３次元モデルデータを積層ピッチでスライス処理してスライスデータを作成して、記憶装置４０に記憶させる。なお、造形装置４の特性に応じてこのスライスデータを一部修正したデータを用いてもよい。そして、制御装置２０は次に造形する構造層の造形パターンデータを読み込む。次のステップ１０４において、制御装置２０は、光源制御部１６を介して光源１０に加工光ＥＬの発光を開始させる。 Next, an example of the modeling operation of the modeling device 4 of this embodiment will be described with reference to the flowchart in FIG. 8(A). First, in step 102, the control device 20 creates slice data by slicing the three-dimensional model data at a stacking pitch, and stores the slice data in the storage device 40. Note that data obtained by partially modifying this slice data according to the characteristics of the modeling device 4 may be used. Then, the control device 20 reads the modeling pattern data for the next structural layer to be modeled. In the next step 104, the control device 20 causes the light source 10 to start emitting the processing light EL via the light source control unit 16.
　次のステップ１０６で材料ノズル３２Ａ，３２Ｂからの造形材料Ｍの供給が開始され、ステップ１０８において、駆動系２６及び／又はステージ２８によって加工光ＥＬ（光ビーム）と造形材料Ｍとが相対移動して、肉盛りによる造形が行われる。また、ステップ１０６，１０８の動作と並行してステップ１１０において、図５（Ａ）と同様に、高さ計測装置４２を用いてこの構造層で造形された部分（パターン）の表面の高さ分布が計測される。 In the next step 106, the supply of the modeling material M from the material nozzles 32A and 32B is started, and in step 108, the processing light EL (light beam) and the modeling material M are moved relative to each other by the drive system 26 and/or the stage 28. Then, modeling is done by overlaying. In addition, in step 110 in parallel with the operations in steps 106 and 108, the height distribution of the surface of the part (pattern) formed by this structural layer is measured using the height measuring device 42, as in FIG. 5(A). is measured.
　次のステップ１１２でこの層の造形が終了かどうかを判定し、造形が終了していない場合には、ステップ１０６，１０８の動作とステップ１１０の動作とが並行して実行される。ステップ１１２でこの層の造形が終了したときには、造形材料の供給が停止され、光源１０の発光が停止される。これによって、例えば図７（Ａ）に示すように、ワークＷの表面に相当する造形面ＣＳ上に１層目の構造層ＳＬ＃１が形成される。
　そして、ステップ１１４に移行して、造形された構造層の高さの分布信号ＲＳから誤差算出部５０において誤差分布信号が求められる。さらにステップ１１６において、その誤差分布信号がローパスフィルタ部５２Ｌ及びハイパスフィルタ部５２Ｈに供給され、それぞれ低空間周波数信号ＬＳ及び高空間周波数信号ＨＳが抽出される。抽出された信号ＬＳ，ＨＳは記憶装置４０に記憶される。 In the next step 112, it is determined whether or not the modeling of this layer has been completed. If the modeling has not been completed, the operations of steps 106 and 108 and the operation of step 110 are executed in parallel. When the modeling of this layer is completed in step 112, the supply of the modeling material is stopped and the light source 10 stops emitting light. As a result, as shown in FIG. 7A, for example, a first structural layer SL#1 is formed on the modeling surface CS corresponding to the surface of the workpiece W.
Then, the process moves to step 114, and the error calculation unit 50 calculates an error distribution signal from the height distribution signal RS of the formed structural layer. Furthermore, in step 116, the error distribution signal is supplied to the low-pass filter section 52L and the high-pass filter section 52H, and a low spatial frequency signal LS and a high spatial frequency signal HS are extracted, respectively. The extracted signals LS and HS are stored in the storage device 40.
　次のステップ１１８において、制御装置２０は次に造形する構造層の造形パターンデータを読み込む。そして、図７（Ｂ）に示すように、構造層ＳＬ＃１の表面を新たな造形面ＣＳに設定した上で、この新たな造形面ＣＳ上に２層目の構造層ＳＬ＃２を形成する。この場合、制御装置２０は、まず、造形ヘッド２４がＺ軸に沿って移動するように駆動系２６を制御する。具体的には、制御装置２０は、駆動系２６を制御して、照射領域ＥＡ及び供給領域ＭＡが構造層ＳＬ＃１の表面（つまり、新たな造形面ＣＳ）に設定されるように、＋Ｚ方向に向かって造形ヘッド２４を移動させる。これにより、加工光ＥＬの合焦面が新たな造形面ＣＳに一致する。 In the next step 118, the control device 20 reads the modeling pattern data for the next structural layer to be modeled. Then, as shown in FIG. 7(B), the surface of the structural layer SL#1 is set as a new modeling surface CS, and a second structural layer SL#2 is formed on this new modeling surface CS. do. In this case, the control device 20 first controls the drive system 26 so that the printing head 24 moves along the Z-axis. Specifically, the control device 20 controls the drive system 26 to set the +Z The printing head 24 is moved in the direction. Thereby, the focal plane of the processing light EL coincides with the new modeling surface CS.
　次に、第１構造層の造形と同様に、ステップ１２０の材料ノズル３２Ａ，３２ＢのＺ位置の制御による低空間周波数成分の補正と、ステップ１２２の光源１０から射出される加工光ＥＬの出力の制御による高空間周波数成分の補正と、ステップ１２４の加工光ＥＬと造形材料Ｍとの相対移動による造形とが行われる。なお、ステップ１２０，１２２，１２４の動作は実質的に並行に実行される。また、ステップ１２０～１２４の動作と並行して、ステップ１２６において、ステップ１１０と同様に、高さ計測装置４２を用いてこの構造層で造形された部分（パターン）の表面の高さ分布が計測される。
　なお、ステップ１２０において、材料ノズル３２Ａ，３２ＢのＺ位置の制御によって造形面ＣＳに供給される造形材料の厚さを制御する際に、加工光ＥＬの出力（単位時間当たりの強度）は一例として、造形面ＣＳに供給される造形材料の厚さが最も厚いときに、その造形材料の厚さ方向の全部を溶融できるような出力に設定されていてもよい。また、別の例として、加工光ＥＬの出力は、造形材料の厚さが可変範囲の中央値であるときにその厚さの造形材料を溶融できるような出力に設定しておき、材料ノズル３２Ａ，３２ＢのＺ位置の制御によって造形材料の厚さを制御する場合には、その厚さに応じて加工光ＥＬの出力を増減してもよい。そして、ステップ１２４においては、供給される造形材料の厚さが一定であっても、加工光ＥＬの出力の制御によって造形後の造形材料の厚さをある程度の範囲で制御できる。 Next, similarly to the modeling of the first structural layer, the low spatial frequency component is corrected by controlling the Z positions of the material nozzles 32A and 32B in step 120, and the output of the processing light EL emitted from the light source 10 is corrected in step 122. Correction of high spatial frequency components by control and modeling by relative movement of the processing light EL and the modeling material M in step 124 are performed. Note that the operations of steps 120, 122, and 124 are performed substantially in parallel. In addition, in parallel with the operations in steps 120 to 124, in step 126, similarly to step 110, the height distribution of the surface of the portion (pattern) formed by this structural layer is measured using the height measuring device 42. be done.
In addition, in step 120, when controlling the thickness of the modeling material supplied to the modeling surface CS by controlling the Z positions of the material nozzles 32A and 32B, the output (intensity per unit time) of the processing light EL is, for example, , when the thickness of the modeling material supplied to the modeling surface CS is the thickest, the output may be set such that the entire thickness of the modeling material can be melted. As another example, the output of the processing light EL is set to an output that can melt the thickness of the modeling material when the thickness of the modeling material is at the median of the variable range, and the material nozzle 32A , 32B, the output of the processing light EL may be increased or decreased depending on the thickness. In step 124, even if the thickness of the supplied modeling material is constant, the thickness of the modeling material after modeling can be controlled within a certain range by controlling the output of the processing light EL.
　その後、ステップ１２８において、この層の造形が終了していない場合には、ステップ１２０から１２４の動作とステップ１２６の動作とが繰り返される。この層の造形が終了した場合には、動作はステップ１３０に移行して、造形終了かどうかが判定される。造形が終了していない場合には、動作はステップ１１４に移行して、前層の高さ分布の誤差を補正するように造形材料の厚さ分布の補正を行いながら次の構造層の造形が行われる。このようにして、図７（Ｃ）に示すように、複数の構造層ＳＬが積層された積層構造物によって、３次元構造物ＳＴが形成される。この造形方法では、前層の造形時に造形後の高さ分布を計測し、次の層の造形時に、前層の高さ分布の誤差分布を相殺するように造形材料の厚さを制御することによって、造形後の構造物の表面の面精度（平面度等）を向上できる。 Thereafter, in step 128, if the modeling of this layer is not completed, the operations of steps 120 to 124 and step 126 are repeated. If the modeling of this layer is finished, the operation moves to step 130, where it is determined whether the modeling is finished. If the modeling is not completed, the operation moves to step 114, where the modeling of the next structural layer is performed while correcting the thickness distribution of the building material to correct the error in the height distribution of the previous layer. It will be done. In this way, as shown in FIG. 7(C), a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked. In this printing method, the height distribution after printing is measured when printing the previous layer, and when printing the next layer, the thickness of the printing material is controlled so as to cancel out the error distribution of the height distribution of the previous layer. Accordingly, the surface precision (flatness, etc.) of the surface of the structure after modeling can be improved.
　上述のように、本実施形態の造形装置４の造形方法は、複数の構造層を重ねて形成して構造物を造形する造形方法であって、第１構造層６８Ａの表面の高さ分布信号ＲＳ（高さ情報）に応じて、造形材料の厚さを制御する第１の方法（材料ノズル３２Ａ，３２ＢのＺ位置を制御する方法）、及びその第１の方法が対応する空間周波数成分より高い空間周波数成分に関して造形材料の厚さを制御する第２の方法（加工光ＥＬの強度を制御する方法）を併用して、第１構造層６８Ａに重ねて形成される第２構造層６８Ｂの造形材料の厚さ分布を制御している（ステップ１２０，１２２，１２４）。 As described above, the modeling method of the modeling apparatus 4 of this embodiment is a modeling method in which a structure is formed by stacking a plurality of structural layers, and the height distribution signal of the surface of the first structural layer 68A is A first method of controlling the thickness of the modeling material according to RS (height information) (a method of controlling the Z position of the material nozzles 32A, 32B), and a method of controlling the thickness of the modeling material according to the spatial frequency component corresponding to the first method. The second structural layer 68B formed overlapping the first structural layer 68A is combined with the second method of controlling the thickness of the modeling material regarding high spatial frequency components (method of controlling the intensity of the processing light EL). The thickness distribution of the modeling material is controlled (steps 120, 122, 124).
　また、本実施形態の造形装置４は、複数の構造層を重ねて形成して構造物を造形する造形装置であって、造形面に加工光ＥＬ（光ビーム）を照射する照射光学系３０（照射部）と、加工光ＥＬが照射される領域に造形材料Ｍを供給する材料ノズル３２Ａ，３２Ｂ（材料供給部）と、加工光ＥＬと造型材料Ｍとを相対移動する駆動系２６及びステージ２８（移動部）と、造形材料の厚さを制御するために材料ノズル３２Ａ，３２ＢのＺ位置を制御する駆動機構３４Ａ，３４Ｂ及びノズル制御部６０（以下、第１厚さ制御部とも称する）と、その第１厚さ制御部が対応可能な空間周波数より高い空間周波数で造形材料の厚さを制御するために加工光ＥＬの強度を制御する光源制御部１６（以下、第２厚さ制御部とも称する）と、第１構造層６８Ａの表面の高さ分布信号ＲＳ（高さ情報）に応じて、その第１厚さ制御部及び第２厚さ制御部を併用して、第１構造層６８Ａに重ねて形成される第２構造層６８Ｂの造形材料の厚さ分布を制御する制御装置２０（以下、造形制御部とも称する）と、を備えている。 Moreover, the modeling apparatus 4 of this embodiment is a modeling apparatus that forms a structure by stacking a plurality of structural layers, and includes an irradiation optical system 30 ( irradiation unit), material nozzles 32A, 32B (material supply unit) that supplies the modeling material M to the area irradiated with the processing light EL, a drive system 26 and a stage 28 that relatively move the processing light EL and the modeling material M. (moving unit), drive mechanisms 34A, 34B and a nozzle control unit 60 (hereinafter also referred to as a first thickness control unit) that control the Z positions of the material nozzles 32A, 32B in order to control the thickness of the modeling material. , a light source control section 16 (hereinafter referred to as a second thickness control section) that controls the intensity of the processing light EL in order to control the thickness of the modeling material at a spatial frequency higher than the spatial frequency that the first thickness control section can handle. ), and the first thickness control section and the second thickness control section are used in combination according to the height distribution signal RS (height information) of the surface of the first structure layer 68A. It includes a control device 20 (hereinafter also referred to as a modeling control section) that controls the thickness distribution of the modeling material of the second structural layer 68B that is formed to overlap the second structural layer 68A.
　本実施形態によれば、第１構造層６８Ａの表面の高さ分布の誤差分布を相殺（補正）するように、第２構造層６８Ｂの肉盛りによる造形時に造形材料の厚さ（肉盛り量）を制御している。このため、第１構造層６８Ａの造形時に熱拡散の不均一性等によって、第１構造層６８Ａの表面の高さ分布に目標分布からの誤差が生じている場合でも、第２構造層６８Ｂの造形時に造形材料の厚さ分布を制御することによって、第２構造層６８Ｂの表面の面精度（平面度等）を向上できる。さらに、低い空間周波数成分を材料ノズル３２Ａ，３２Ｂと造形面ＣＳとの間隔の制御によって補正し、高い空間周波数成分を光源１０から射出される加工光ＥＬの強度の制御によって補正しているため、広い空間周波数領域で、かつ低い空間周波数領域では大きい振幅の誤差を高精度に補正することができる。
　なお、その厚さ分布には表面の凹凸分布のみならず、厚さそのものの分布も含まれる。例えば厚さ分布として凹凸分布を平坦にすることによって、構造物の表面の面精度（平面度等）を高めることができる。また、厚さ分布として造形材料の厚さの分布が目標とする分布になるように制御することによって、所望の厚さ分布、又は均一な膜厚分布で構造層を造形可能である。 According to this embodiment, the thickness of the modeling material (the build-up amount ) is controlled. Therefore, even if the height distribution on the surface of the first structural layer 68A deviates from the target distribution due to non-uniformity of thermal diffusion or the like during the modeling of the first structural layer 68A, the second structural layer 68B By controlling the thickness distribution of the modeling material during modeling, the surface accuracy (flatness, etc.) of the surface of the second structural layer 68B can be improved. Furthermore, since the low spatial frequency components are corrected by controlling the distance between the material nozzles 32A, 32B and the modeling surface CS, and the high spatial frequency components are corrected by controlling the intensity of the processing light EL emitted from the light source 10, Large amplitude errors can be corrected with high precision in a wide spatial frequency range and in a low spatial frequency range.
Note that the thickness distribution includes not only the unevenness distribution on the surface but also the distribution of the thickness itself. For example, by flattening the unevenness distribution as the thickness distribution, the surface accuracy (flatness, etc.) of the surface of the structure can be improved. Moreover, by controlling the thickness distribution of the modeling material so that it becomes a target distribution, it is possible to model the structural layer with a desired thickness distribution or a uniform thickness distribution.
　また、本実施形態では、第１構造層６８Ａの造形時に同時に、高さ計測装置４２によって造形後の第１構造層６８Ａのパターンの表面の高さ分布を計測し、この計測結果を次の第２構造層６８Ｂのパターンの造形時に使用している。このため、別途、第１構造層６８Ａのパターンの表面の高さ分布を計測する場合に比べて、効率的に造形を行うことができる。但し、第１構造層６８Ａの造形工程と、第２構造層６８Ｂの造形工程との間に、第１構造層６８Ａの表面の高さ分布を計測する計測工程を設けてもよい。 Further, in this embodiment, at the same time when the first structural layer 68A is formed, the height measurement device 42 measures the height distribution of the surface of the pattern of the first structural layer 68A after forming, and this measurement result is used in the next step. It is used when forming the pattern of the two-structure layer 68B. For this reason, modeling can be performed more efficiently than when the height distribution of the surface of the pattern of the first structural layer 68A is separately measured. However, a measurement process for measuring the height distribution of the surface of the first structural layer 68A may be provided between the forming process of the first structural layer 68A and the forming process of the second structural layer 68B.
　また、上述の実施形態の図８（Ａ）のステップ１２６では、当該構造層の造形時に、造形の終わった部分の表面の高さ分布を計測している。これに対して、上述の実施形態の変形例として、図８（Ｂ）のステップ１２６Ａにおいて、図９（Ａ）に示すように、第２構造層６８Ｂの造形時に、造形ヘッド２４において照射光学系３０から走査方向に関して前方にある投光部４４Ｂから第１構造層６８Ａの表面に投影されるスポット光ＧＬＢの像を図１の撮像装置４６で撮像し、第１構造層６８Ａのパターンの表面６８Ａａの高さの分布を計測してもよい。この変形例では、次のステップ１１４Ａにおいて、第１構造層６８Ａの表面６８Ａａの高さ分布の誤差分布信号を求め、次のステップ１１６Ａにおいて、その誤差分布信号から低空間周波数信号ＬＳ及び高空間周波数信号ＨＳを抽出する。 Furthermore, in step 126 in FIG. 8A of the above-described embodiment, the height distribution of the surface of the portion where the modeling has been completed is measured during the modeling of the structural layer. On the other hand, as a modification of the above-described embodiment, in step 126A of FIG. 8(B), as shown in FIG. 9(A), when printing the second structural layer 68B, the irradiation optical system is An image of the spot light GLB projected onto the surface of the first structural layer 68A from the light projecting unit 44B located in front of the scanning direction from 30 is captured by the imaging device 46 of FIG. The distribution of heights may also be measured. In this modification, in the next step 114A, an error distribution signal of the height distribution of the surface 68Aa of the first structural layer 68A is obtained, and in the next step 116A, a low spatial frequency signal LS and a high spatial frequency signal are obtained from the error distribution signal. Extract the signal HS.
　さらに、この変形例では、ステップ１２６Ａ，１１４Ａ，１１６Ａの動作は、図９（Ａ）の造形ヘッド２４から加工光ＥＬの照射及び造形材料Ｍの供給が行われる領域の前方の領域に対して行われている。例えば図９（Ａ）において、照射光学系３０から加工光ＥＬが照射されるＹ方向の位置をＹ２とすると、ステップ１１６Ａでは、図９（Ｂ）及び（Ｃ）に示すように、位置Ｙ２の前方の位置Ｙ１まで低空間周波数信号ＬＳ及び高空間周波数信号ＨＳが求められている。 Furthermore, in this modification, the operations of steps 126A, 114A, and 116A are performed on the area in front of the area where the processing light EL is irradiated and the printing material M is supplied from the printing head 24 in FIG. 9(A). It is being said. For example, in FIG. 9(A), if the position in the Y direction where the processing light EL is irradiated from the irradiation optical system 30 is Y2, in step 116A, as shown in FIGS. 9(B) and (C), the position Y2 is A low spatial frequency signal LS and a high spatial frequency signal HS are obtained up to the forward position Y1.
　このため、図８（Ｂ）のステップ１２０，１２２，１２４では、ステップ１１６Ａで求められた第１構造層６８Ａの表面の誤差分布を相殺するように、フィードフォワード方式で第２構造層６８Ｂの造形材料の厚さを補正しながら第２構造層６８Ａの造形を行うことができる。すなわち、この変形例では、前層の表面の高さ分布の計測と、この計測結果を用いるほぼリアルタイムでの当該層の造形材料の厚さの制御とを行うことができる。このため、予め前層の造形時に前層の表面の高さ分布を計測して記憶しておく必要がない。 Therefore, in steps 120, 122, and 124 of FIG. 8(B), the second structural layer 68B is formed in a feedforward manner so as to cancel out the error distribution on the surface of the first structural layer 68A determined in step 116A. The second structural layer 68A can be shaped while correcting the thickness of the material. That is, in this modification, it is possible to measure the height distribution of the surface of the previous layer and to control the thickness of the modeling material of the layer in almost real time using this measurement result. Therefore, there is no need to measure and store the height distribution of the surface of the previous layer in advance when modeling the previous layer.
　また、上述の実施形態では、高さ分布の誤差分布のうち低い空間周波周成分の補正を材料ノズル３２Ａ，３２ＢのＺ方向の位置の制御で行っている。これに対して、図１０（Ａ）～（Ｃ）の変形例で示すように、その誤差分布の補正を材料ノズル３２Ａ，３２Ｂの角度の制御で行うようにしてもよい。
　図１０（Ａ）において、造形ヘッド２４に照射光学系３０を挟むように造形材料Ｍを供給する材料ノズル３２Ａ，３２Ｂが対称に設けられている。この変形例では、材料ノズル３２Ａ，３２Ｂは、造形ヘッド２４に対して回転可能に支持されている。さらに、造形ヘッド２４に対して材料ノズル３２Ａ，３２Ｂを回転するための駆動機構３４Ｃ，３４Ｄが設けられている。これ以外の構成は上述の実施形態と同様である。 Furthermore, in the embodiment described above, the correction of the low spatial frequency components of the error distribution of the height distribution is performed by controlling the positions of the material nozzles 32A and 32B in the Z direction. On the other hand, as shown in the modified examples of FIGS. 10(A) to 10(C), the error distribution may be corrected by controlling the angles of the material nozzles 32A and 32B.
In FIG. 10(A), material nozzles 32A and 32B for supplying the modeling material M are symmetrically provided in the modeling head 24 so as to sandwich the irradiation optical system 30 therebetween. In this modification, the material nozzles 32A, 32B are rotatably supported relative to the modeling head 24. Furthermore, drive mechanisms 34C and 34D for rotating the material nozzles 32A and 32B with respect to the modeling head 24 are provided. The configuration other than this is the same as the above embodiment.
　以下では、通常の造形動作では造形面ＣＳは照射光学系３０の合焦面ＢＦに合致しているものとする。そして、図１０（Ａ）に示すように、駆動機構３４Ｃ，３４Ｄによって材料ノズル３２Ａ，３２Ｂが可動回転範囲の中央にある場合、材料ノズル３２Ａ，３２Ｂから供給される造形材料Ｍは、合焦面ＢＦに対して所定量だけ下方（－Ｚ方向）の集中領域６２で重なるように材料ノズル３２Ａ，３２Ｂの角度が設定されているものとする。合焦面ＢＦに対する集中領域６２のＺ方向の間隔は、駆動機構３４Ａ，３４Ｂの駆動量から求められる。 In the following, it is assumed that the modeling surface CS matches the focal plane BF of the irradiation optical system 30 in normal modeling operations. As shown in FIG. 10(A), when the material nozzles 32A, 32B are located at the center of the movable rotation range by the drive mechanisms 34C, 34D, the modeling material M supplied from the material nozzles 32A, 32B is It is assumed that the angles of the material nozzles 32A and 32B are set so that they overlap in the concentrated region 62 by a predetermined amount below (-Z direction) with respect to BF. The distance in the Z direction between the focused area 62 and the focal plane BF is determined from the drive amount of the drive mechanisms 34A and 34B.
　これに対して、図１０（Ｂ）に示すように、駆動機構３４Ｃ，３４Ｄを介して材料ノズル３２Ａ，３２Ｂを照射光学系３０側に回転させて、集中領域６２が合焦面ＢＦに近づくと、合焦面ＢＦに対する集中領域６２の間隔はかなり小さい値になる。そして、造形面ＣＳに単位時間に供給される造形材料６４の厚さｔｈ１は大きくなる。一方、図１０（Ｃ）に示すように、駆動機構３４Ｃ，３４Ｄを介して材料ノズル３２Ａ，３２Ｂを照射光学系３０から離れる方向に回転させて、集中領域６２が合焦面ＢＦから離れると、合焦面ＢＦに対する集中領域６２の間隔はかなり大きい値になる。そして、造形面ＣＳに単位時間に供給される造形材料６４の厚さｔｈ２は厚さｔｈ１のほぼ１／２になる。 On the other hand, as shown in FIG. 10(B), when the material nozzles 32A and 32B are rotated toward the irradiation optical system 30 side via the drive mechanisms 34C and 34D, and the concentrated area 62 approaches the focusing plane BF, , the distance between the focused area 62 and the focal plane BF is quite small. Then, the thickness th1 of the modeling material 64 supplied to the modeling surface CS per unit time increases. On the other hand, as shown in FIG. 10(C), when the material nozzles 32A and 32B are rotated in a direction away from the irradiation optical system 30 via the drive mechanisms 34C and 34D, and the concentrated area 62 is moved away from the focusing plane BF, The distance between the focused area 62 and the focal plane BF is quite large. The thickness th2 of the modeling material 64 supplied to the modeling surface CS per unit time is approximately 1/2 of the thickness th1.
　すなわち、材料ノズル３２Ａ，３２Ｂの回転角を変化させ、合焦面ＢＦに対する集中領域６２の間隔を変化させることによって、造形面ＣＳに単位時間に供給される造形材料６４の厚さｔｈを大きく制御することができる。このため、最終的に造形面ＣＳに形成されるパターンの厚さ分布も大きく制御できる。
　図１の制御装置２０では、駆動機構３４Ｃ，３４Ｄの駆動によってその間隔を求め、この間隔から材料ノズル３２Ａ，３２Ｂから造形面ＣＳに単位時間当たりに供給される造形材料６４の厚さｔｈを求めることができる。言い替えると、制御装置２０は、ノズル制御部６０で材料ノズル３２Ａ，３２Ｂの回転角を制御することで、造形面ＣＳに供給される造形材料６４の厚さｔｈを制御できる。この結果、造形材料６４に加工光ＥＬを照射し、溶融、冷却、及び固化によって形成される造形材料のパターンの厚さも制御できる。材料ノズル３２Ａ，３２Ｂの回転制御は機械的な制御であり、応答速度があまり高くないが、造形材料の厚さの制御範囲は広い。このため、材料ノズル３２Ａ，３２Ｂの回転制御によって、低い空間周波数成分で、かつ補正範囲が広い場合の造形材料の厚さ制御を行うことができる。 That is, by changing the rotation angles of the material nozzles 32A, 32B and changing the interval of the concentrated area 62 with respect to the focusing plane BF, the thickness th of the building material 64 supplied to the building surface CS per unit time can be greatly controlled. can do. Therefore, the thickness distribution of the pattern finally formed on the modeling surface CS can also be greatly controlled.
In the control device 20 of FIG. 1, the distance is determined by driving the drive mechanisms 34C and 34D, and from this distance, the thickness th of the modeling material 64 supplied from the material nozzles 32A and 32B to the modeling surface CS per unit time is determined. be able to. In other words, the control device 20 can control the thickness th of the modeling material 64 supplied to the modeling surface CS by controlling the rotation angles of the material nozzles 32A, 32B with the nozzle control unit 60. As a result, the thickness of the pattern of the modeling material formed by irradiating the modeling material 64 with the processing light EL, melting, cooling, and solidification can also be controlled. Rotation control of the material nozzles 32A, 32B is mechanical control, and although the response speed is not very high, the control range of the thickness of the modeling material is wide. Therefore, by controlling the rotation of the material nozzles 32A and 32B, it is possible to control the thickness of the modeling material with a low spatial frequency component and with a wide correction range.
　上述の実施形態及びその変形例では、材料ノズル３２Ａ，３２Ｂと造形面ＣＳとの相対位置を制御して造形面ＣＳに供給される造形材料Ｍの厚さを制御している。これに対して、図１の材料供給装置１２から材料ノズル３２Ａ，３２Ｂに送出される造形材料の単位時間値の供給量自体を制御することによって、材料ノズル３２Ａ，３２Ｂから造形面ＣＳに供給される造形材料Ｍの厚さを制御してもよい。このように材料供給装置１２から材料ノズル３２Ａ，３２Ｂに送出される造形材料の単位時間当たりの供給量自体を制御する場合、材料ノズル３２Ａ，３２Ｂのうちの一方の材料ノズル（例えば３２Ａ）のみを設けるようにすることができる。 In the above embodiment and its modified examples, the thickness of the modeling material M supplied to the modeling surface CS is controlled by controlling the relative positions of the material nozzles 32A, 32B and the modeling surface CS. On the other hand, by controlling the supply amount per unit time value of the modeling material sent from the material supply device 12 of FIG. The thickness of the modeling material M may be controlled. In this way, when controlling the supply amount per unit time of the modeling material sent from the material supply device 12 to the material nozzles 32A, 32B, only one material nozzle (for example, 32A) of the material nozzles 32A, 32B is controlled. It is possible to provide the following information.
　［第２の実施形態］
　次に第２の実施形態につき図１１を参照して説明する。本実施形態でも図１の造形装置４を使用するが、構造層の造形材料の厚さ分布の制御方法が異なっている。本実施形態においてワークＷ上に第１構造層を形成し、この上に第２構造層を形成する場合の動作の一例につき図１１（Ａ）～（Ｄ）を参照して説明する。まず、図１１（Ａ）に示すように、造形装置４を用いてワークＷの表面に第１構造層６８Ａを形成する。この際に第１構造層６８Ａの表面６８Ａａの高さ分布を計測する必要は必ずしもない。次に、第１構造層６８Ａの上に、照射光学系３０から加工光ＥＬを照射し、加工光ＥＬの照射領域に材料ノズル３２Ａ，３２Ｂから造形材料Ｍを供給し、ワークＷに対して造形ヘッド２４を例えば－Ｙ方向に相対的に移動して、第２構造層６８Ｂのパターンを肉盛りして造形するものとする。この際に、第１構造層６８Ａ及び第２構造層６８Ｂの表面の目標とする形状は、それぞれ例えば点線で示す平坦な目標分布７０Ａ及び７０Ｂであるとする。 [Second embodiment]
Next, a second embodiment will be described with reference to FIG. 11. Although this embodiment also uses the modeling apparatus 4 of FIG. 1, the method of controlling the thickness distribution of the modeling material of the structural layer is different. An example of the operation when forming the first structural layer on the workpiece W and forming the second structural layer thereon in this embodiment will be described with reference to FIGS. 11(A) to 11(D). First, as shown in FIG. 11(A), the first structural layer 68A is formed on the surface of the workpiece W using the modeling apparatus 4. At this time, it is not necessarily necessary to measure the height distribution of the surface 68Aa of the first structural layer 68A. Next, the processing light EL is irradiated from the irradiation optical system 30 onto the first structural layer 68A, and the modeling material M is supplied from the material nozzles 32A and 32B to the irradiation area of the processing light EL, and the work W is modeled. It is assumed that the head 24 is relatively moved, for example, in the −Y direction, and the pattern of the second structural layer 68B is built up and modeled. At this time, it is assumed that the target shapes of the surfaces of the first structural layer 68A and the second structural layer 68B are, for example, flat target distributions 70A and 70B shown by dotted lines, respectively.
　そして、第２構造層６８Ｂの造形時に、造形ヘッド２４において照射光学系３０から走査方向に関して前方にある投光部４４Ｂから第１構造層６８Ａの表面６８Ａａに投影されるスポット光ＧＬＢの像を図１の撮像装置４６で撮像し、前層である第１構造層６８Ａのパターンの表面６８Ａａの高さ分布を計測する。そして、その高さ分布の信号ＲＳから誤差算出部５０において目標分布の信号を差し引くことで誤差信号が得られる。この誤差信号をハイパスフィルタ部５２Ｈ及びローパスフィルタ部５２Ｌに供給すると、ローパスフィルタ部５２Ｌ及びハイパスフィルタ部５２Ｈからそれぞれ図１１（Ｂ）の低空間周波数信号ＬＳ、及び図１１（Ｃ）の高空間周波数信号ＨＳが制御装置２０に供給される。 Then, when printing the second structural layer 68B, the image of the spot light GLB projected onto the surface 68Aa of the first structural layer 68A from the light projecting section 44B located in front of the irradiation optical system 30 in the scanning direction in the printing head 24 is illustrated. The first imaging device 46 takes an image, and the height distribution of the surface 68Aa of the pattern of the first structural layer 68A, which is the previous layer, is measured. Then, an error signal is obtained by subtracting the signal of the target distribution from the signal RS of the height distribution in the error calculating section 50. When this error signal is supplied to the high-pass filter section 52H and the low-pass filter section 52L, the low-pass filter section 52L and the high-pass filter section 52H produce a low spatial frequency signal LS shown in FIG. 11(B) and a high spatial frequency signal LS shown in FIG. 11(C), respectively. A signal HS is supplied to the control device 20.
　この場合、図１１（Ａ）において、照射光学系３０から加工光ＥＬが照射されるＹ方向の位置をＹ４とすると、スポット光ＧＬＢの像の撮像によって、図１１（Ｂ）及び（Ｃ）に示すように、位置Ｙ４の前方の位置Ｙ３まで低空間周波数信号ＬＳ及び高空間周波数信号ＨＳが求められている。このため、低空間周波数信号ＬＳ及び高空間周波数信号ＨＳを用いて材料ノズル３２Ａ，３２ＢのＺ方向の位置、及び加工光ＥＬの強度を制御することによって、第１構造層６８Ａの表面の高さ分布の誤差を相殺するように、第２構造層６８Ｂの造形時に実質的にリアルタイムでかつフィードフォワード方式で造形材料の厚さ分布を制御できる。 In this case, in FIG. 11(A), if the position in the Y direction where the processing light EL is irradiated from the irradiation optical system 30 is Y4, then by capturing the image of the spot light GLB, As shown, the low spatial frequency signal LS and high spatial frequency signal HS are obtained up to position Y3 in front of position Y4. Therefore, by controlling the positions of the material nozzles 32A and 32B in the Z direction and the intensity of the processing light EL using the low spatial frequency signal LS and the high spatial frequency signal HS, the height of the surface of the first structural layer 68A can be adjusted. The thickness distribution of the modeling material can be controlled substantially in real time and in a feedforward manner during the modeling of the second structural layer 68B so as to offset errors in the distribution.
　さらに、本実施形態では、図１１（Ａ）に示すように、第２構造層６８Ｂの肉盛りによる造形時に、造形ヘッド２４において照射光学系３０から走査方向に関して後方にある投光部４４Ａから造形直後のパターンの表面に投影されるスポット光ＧＬＡの像を図１の撮像装置４６で撮像し、造形直後の第２構造層６８Ｂのパターンの表面６８Ｂａの高さの分布をも計測する。この場合、第１構造層６８Ａの表面の高さ分布の計測値に基づく第２構造層６８Ｂの造形材料の厚さ分布の制御によって、第２構造層６８Ｂのこれまでに形成されたパターンの表面６８Ｂａは目標分布７０Ｂに近づいているが、それでもわずかに誤差がある。 Furthermore, in this embodiment, as shown in FIG. 11A, when building the second structural layer 68B by overlaying, the light projecting section 44A located behind the irradiation optical system 30 in the scanning direction in the printing head 24 is The image of the spot light GLA projected onto the surface of the pattern immediately after is captured by the imaging device 46 of FIG. 1, and the height distribution of the surface 68Ba of the pattern of the second structural layer 68B immediately after modeling is also measured. In this case, by controlling the thickness distribution of the modeling material of the second structural layer 68B based on the measured value of the height distribution of the surface of the first structural layer 68A, the surface of the pattern formed so far Although 68Ba is close to the target distribution 70B, there is still a slight error.
　一例として、その誤差に対応する信号ＨＢは、図１１（Ｄ）の曲線７１Ａで示すように、低い空間周波数成分のみであるとする。このとき、照射光学系３０の位置をＹ４とすると、信号ＨＢは照射光学系３０の走査方向に対して後方の位置Ｙ５まで計測されている。そこで、本実施形態では、その信号ＨＢに対応する高さ分布の誤差を相殺するように、フィードバック制御によって、材料ノズル３２Ａ，３２ＢのＺ位置を制御する。この制御によって、第２構造層６８Ｂに形成されたパターンの表面６８Ｂａの高さ分布の目標分布７０Ｂに対する誤差を示す信号ＨＢは、図１１（Ｄ）の点線の曲線７１Ｂのように小さくなる。 As an example, assume that the signal HB corresponding to the error has only low spatial frequency components, as shown by a curve 71A in FIG. 11(D). At this time, if the position of the irradiation optical system 30 is Y4, the signal HB is measured up to a position Y5 at the rear with respect to the scanning direction of the irradiation optical system 30. Therefore, in this embodiment, the Z positions of the material nozzles 32A and 32B are controlled by feedback control so as to cancel out the error in the height distribution corresponding to the signal HB. By this control, the signal HB indicating the error of the height distribution of the surface 68Ba of the pattern formed on the second structural layer 68B with respect to the target distribution 70B becomes small as shown by the dotted curve 71B in FIG. 11(D).
　このように本実施形態によれば、第１構造層６８Ａの表面の高さ分布の誤差分布の計測結果を相殺するようにフィードフォワード方式で第２構造層６８Ｂの造形材料の厚さ分布を制御するとともに、第２構造層６８Ｂでそれまでに形成されたパターンの表面の高さ分布の誤差分布の計測結果を相殺するように、フィードバック方式で第２構造層６８Ｂの造形材料の厚さ分布を制御している。このため、第１構造層６８Ａの表面の高さ分布の誤差が大きい場合でも、第２構造層６８Ｂのパターンの表面の面精度をより高精度に造形できる。 As described above, according to the present embodiment, the thickness distribution of the modeling material of the second structural layer 68B is controlled by the feedforward method so as to offset the measurement result of the error distribution of the height distribution of the surface of the first structural layer 68A. At the same time, the thickness distribution of the modeling material of the second structural layer 68B is adjusted in a feedback manner so as to cancel out the measurement result of the error distribution of the height distribution of the surface of the pattern formed so far in the second structural layer 68B. It's in control. Therefore, even if the error in the height distribution of the surface of the first structural layer 68A is large, the surface accuracy of the pattern of the second structural layer 68B can be formed with higher precision.
　なお、本実施形態において、フィードバック方式で第２構造層６８Ｂの造形材料の厚さ分布を制御する際にも、第２構造層６８Ｂのパターンの表面６８Ｂａの高さ分布の目標分布７０Ｂに対する誤差を示す信号ＨＢから低空間周波数信号ＬＳ及び高空間周波数信号ＨＳを抽出してもよい。なお、その厚さ分布には表面の凹凸分布のみならず、厚さそのものの分布も含まれる。そして、低空間周波数信号ＬＳを用いて材料ノズル３２Ａ，３２ＢのＺ位置を制御し、高空間周波数信号ＨＳを用いて加工光ＥＬの強度を制御することによって、第２構造層６８Ｂの表面の面精度をより高精度に造形できる。さらに、厚さそのものの分布を制御する場合には、所望の厚さの分布で、かつ均一な膜厚で対象とする構造層を造形可能である。 In addition, in this embodiment, when controlling the thickness distribution of the modeling material of the second structural layer 68B using the feedback method, the error in the height distribution of the surface 68Ba of the pattern of the second structural layer 68B with respect to the target distribution 70B is calculated. The low spatial frequency signal LS and the high spatial frequency signal HS may be extracted from the signal HB shown. Note that the thickness distribution includes not only the unevenness distribution on the surface but also the distribution of the thickness itself. Then, by controlling the Z positions of the material nozzles 32A and 32B using the low spatial frequency signal LS and controlling the intensity of the processing light EL using the high spatial frequency signal HS, the surface of the second structural layer 68B is It is possible to print with higher precision. Furthermore, when controlling the distribution of the thickness itself, it is possible to form a target structural layer with a desired thickness distribution and a uniform thickness.
　また、上述の各実施形態の造形装置４は、指向性エネルギー堆積法(ＤＥＤ)のうちのレーザ肉盛堆積法（ＬＭＤ）を使用している。上述の各実施形態において、造装置４の代わりに、ＬＭＤ法以外の指向性エネルギー堆積法(ＤＥＤ)（例えば熱源をレーザ光以外のアークプラズマや電子ビームとする方法など）を用いる造形装置を使用する場合にも上述の実施形態及びその変形例が適用できる。また、上述の実施形態の造形装置４の構成は上述の構成に限られず、その他の任意の構成が可能である。例えば材料ノズル３２Ａ，３２Ｂの数や配置は任意であり、高さ計測装置４２などの構成も含めて任意で良い。さらに、高さ計測装置４２としては明暗パターンを投影するものなども用いることが可能である。 Furthermore, the modeling apparatus 4 of each of the above-described embodiments uses a laser metal deposition method (LMD) of the directional energy deposition method (DED). In each of the embodiments described above, instead of the manufacturing device 4, a modeling device that uses a directed energy deposition method (DED) other than the LMD method (for example, a method using an arc plasma or an electron beam as a heat source other than a laser beam) is used. The above-described embodiment and its modified examples can also be applied to the case where Further, the configuration of the modeling device 4 of the above-described embodiment is not limited to the above-described configuration, and any other configuration is possible. For example, the number and arrangement of the material nozzles 32A, 32B may be arbitrary, and the configuration of the height measuring device 42 and the like may also be arbitrary. Further, as the height measuring device 42, it is also possible to use a device that projects a bright and dark pattern.
　また、本明細書には、以下の発明の態様も記載されている。
１）複数の構造層を重ねて形成して構造物を造形する造形方法であって、第１構造層の表面の高さ情報に応じて、造形材料の厚さを制御する第１の方法、及び前記第１の方法が対応する空間周波数成分と異なる空間周波数成分に関して造形材料の厚さを制御する第２の方法を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形方法。２）複数の構造層を重ねて形成して構造物を造形する造形方法であって、第１構造層の表面の高さ情報に応じて、対応する空間周波数成分が互いに異なる第１の方法及び第２の方法を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御することを含み、前記第１の方法は、造形材料を供給する材料供給部と造形面との相対的な位置関係を変更することを含み、前記第２の方法は、造形材料に照射される光ビームの強度を制御することを含む、造形方法。３）前記第１構造層の表面の高さ情報のうち、空間周波数に関する低周波数成分を補正するように、前記第１の方法で前記第２構造層の造形材料の厚さ分布を制御し、前記高さ情報のうち空間周波数に関する高周波数成分を補正するように、前記第２の方法で前記第２構造層の造形材料の厚さ分布を制御する、１又は２（又は１）に記載の造形方法。４）前記第１構造層の表面の高さ情報を用いて、フィードフォワード方式で前記第１の方法及び前記第２の方法を併用して、前記第２構造層の造形材料の厚さ分布を制御する、１から３のいずれか一項（又は１）に記載の造形方法。５）前記第２構造層を形成することは、光ビームを照射する領域に材料供給部から造形材料を供給し、前記光ビームと前記造型材料とを相対移動することを含み、前記第１の方法は、前記光ビームと前記造型材料とを相対移動するときに、前記材料供給部から造形面に供給される造形材料の厚さを制御することを含む１から４のいずれか一項（又は１）に記載の造形方法。６）前記第１の方法は、前記材料供給部と造形面との距離を制御することを含む５に記載の造形方法。７）前記材料供給部から造形材料を供給することは、複数の材料供給部から斜め方向に造形材料を供給することを含み、前記第１の方法は、前記材料供給部の角度を制御することを含む５に記載の造形方法。 The following aspects of the invention are also described in this specification.
1) A first method of forming a structure by stacking a plurality of structural layers, in which the thickness of the building material is controlled according to height information of the surface of the first structural layer; and a second structural layer formed over the first structural layer by using a second method of controlling the thickness of the building material with respect to a spatial frequency component different from the spatial frequency component corresponding to the first method. A printing method that controls the thickness distribution of the printing material. 2) A first method of forming a structure by stacking a plurality of structural layers, in which corresponding spatial frequency components differ from each other according to surface height information of the first structural layer; controlling the thickness distribution of a building material of a second structural layer formed over the first structural layer by using a second method in combination, the first method supplying the building material; A modeling method that includes changing the relative positional relationship between the material supply section and the modeling surface, and the second method includes controlling the intensity of the light beam irradiated to the modeling material. 3) controlling the thickness distribution of the modeling material of the second structural layer using the first method so as to correct a low frequency component related to spatial frequency among the height information of the surface of the first structural layer; 1 or 2 (or 1), wherein the thickness distribution of the building material of the second structural layer is controlled by the second method so as to correct a high frequency component related to spatial frequency in the height information. Modeling method. 4) Using the height information of the surface of the first structural layer, combine the first method and the second method in a feedforward manner to determine the thickness distribution of the modeling material of the second structural layer. The modeling method according to any one of 1 to 3 (or 1), which controls. 5) Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material, The method includes controlling the thickness of the modeling material supplied from the material supply unit to the modeling surface when the light beam and the modeling material are moved relative to each other. The modeling method described in 1). 6) The modeling method according to 5, wherein the first method includes controlling the distance between the material supply section and the modeling surface. 7) Supplying the building material from the material supply section includes supplying the building material in an oblique direction from a plurality of material supply sections, and the first method includes controlling the angle of the material supply section. 5. The modeling method according to 5.
　８）前記第２構造層を形成することは、光ビームを照射する領域に材料供給部から造形材料を供給し、前記光ビームと前記造型材料とを相対移動することを含み、前記第２の方法は、前記光ビームの強度を制御することを含む１から７のいずれか一項（又は１）に記載の造形方法。９）前記第２構造層を形成する際に、前記第２構造層の造形材料を盛る前の領域で、前記第１構造層の表面の高さ情報を計測することを含む、１から８のいずれか一項（又は１）に記載の造形方法。１０）前記第１構造層を形成する際に、前記第１構造層の造形材料が盛られた後の領域で、前記第１構造層の表面の高さ情報を計測することを含む、１から８のいずれか一項（又は１）に記載の造形方法。１１）前記第１構造層を形成する工程と、前記第２構造層を形成する工程との間に、前記第１構造層の表面の高さ情報を計測する工程を含む、１から８のいずれか一項（又は１）に記載の造形方法。１２）前記第２構造層を形成する際に、前記第２構造層の造形材料が盛られた領域で、前記第２構造層の表面の高さ情報を計測することと、前記第２構造層の造形材料が盛られた領域の表面の高さ情報の計測結果と目標分布との誤差に応じて、前記第１の方法及び前記第２の方法を併用して、前記第２構造層に関して次に造形材料が盛られる領域における造形材料の厚さを制御することと、を含む１から１１のいずれか一項（又は１）に記載の造形方法。１３）前記第１構造層の表面の高さ情報は、前記表面の高さ分布の目標分布に対する誤差分布を含む１から１２のいずれか一項に記載の造形方法。１４）複数の構造層を重ねて形成して構造物を造形する造形装置であって、造形面に光ビームを照射する照射部と、前記光ビームが照射される領域に造形材料を供給する材料供給部と、前記光ビームと前記造型材料とを相対移動する移動部と、造形材料の厚さを制御する第１厚さ制御部と、前記第１厚さ制御部が対応可能な空間周波数より高い空間周波数で造形材料の厚さを制御する第２厚さ制御部と、第１構造層の表面の高さ情報に応じて、前記第１及び第２厚さ制御部を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形制御部と、を備える造形装置。１５）複数の構造層を重ねて形成して構造物を造形する造形装置であって、造形面に光ビームを照射する照射部と、前記光ビームが照射される領域に造形材料を供給する材料供給部と、第１構造層の表面の高さ情報に応じて、対応する空間周波数成分が互いに異なる第１及び第２厚さ制御部を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形制御部と、を備え、前記第１厚さ制御部は、前記材料供給部と造形面との相対的な位置関係を変更する変更部であり、前記第２厚さ制御部は、前記光ビームの強度を制御する強度制御部である、造形装置。 8) Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material, and forming the second structural layer. 8. The modeling method according to any one of 1 to 7 (or 1), wherein the method includes controlling the intensity of the light beam. 9) When forming the second structural layer, measuring the height information of the surface of the first structural layer in a region before applying the modeling material of the second structural layer, The modeling method according to any one (or 1). 10) From 1 to 1, including measuring height information of the surface of the first structural layer in a region after the modeling material of the first structural layer is piled up when forming the first structural layer. 8. The modeling method according to any one of item 8 (or 1). 11) Any one of 1 to 8, including a step of measuring height information of the surface of the first structural layer between the step of forming the first structural layer and the step of forming the second structural layer. The modeling method according to item 1 (or 1). 12) When forming the second structural layer, measuring height information of the surface of the second structural layer in a region where the modeling material of the second structural layer is piled up; According to the error between the measurement result of the surface height information of the area where the modeling material is piled up and the target distribution, the first method and the second method are used together to perform the following regarding the second structural layer. 12. The modeling method according to any one of 1 to 11 (or 1), including controlling the thickness of the modeling material in the area where the modeling material is applied. 13) The modeling method according to any one of 1 to 12, wherein the surface height information of the first structural layer includes an error distribution of the surface height distribution with respect to a target distribution. 14) A modeling device that forms a structure by stacking a plurality of structural layers, including an irradiation unit that irradiates a modeling surface with a light beam, and a material that supplies a modeling material to a region that is irradiated with the light beam. a supply unit, a moving unit that relatively moves the light beam and the modeling material, a first thickness control unit that controls the thickness of the modeling material, and a spatial frequency that can be handled by the first thickness control unit. A second thickness control section that controls the thickness of the modeling material at a high spatial frequency, and the first and second thickness control sections are used together according to the height information of the surface of the first structural layer, A modeling device comprising: a modeling control section that controls the thickness distribution of a modeling material of a second structural layer formed to overlap the first structural layer. 15) A modeling device that forms a structure by stacking a plurality of structural layers, comprising: an irradiation unit that irradiates a modeling surface with a light beam; and a material that supplies a modeling material to an area irradiated with the light beam. The first structural layer is formed so as to be superimposed on the first structural layer by using a supply section and first and second thickness control sections whose corresponding spatial frequency components are different from each other according to the height information of the surface of the first structural layer. a modeling control section that controls the thickness distribution of the modeling material of the second structural layer, the first thickness control section changing the relative positional relationship between the material supply section and the modeling surface. A modeling apparatus, wherein the second thickness control section is an intensity control section that controls the intensity of the light beam.
　１６）前記第１構造層の表面の高さ情報から空間周波数に関する低周波数成分及び高周波数成分を抽出する演算部を備え、前記造形制御部は、前記低周波数成分を補正するように、前記第１厚さ制御部を用いて前記第２構造層の造形材料の厚さ分布を制御し、前記高周波数成分を補正するように、前記第２厚さ制御部を用いて前記第２構造層の造形材料の厚さ分布を制御する、１４又は１５（又は１４）に記載の造形装置。１７）前記造形制御部は、前記第１構造層の表面の高さ情報を用いて、フィードフォワード方式で前記第１厚さ制御部及び前記第２厚さ制御部を制御して、前記第２構造層の造形材料の厚さ分布を制御する、１４から１６のいずれか一項（又は１４）に記載の造形装置。１８）前記第１厚さ制御部は、前記材料供給部から造形面に供給される造形材料の厚さを制御する、１４から１７のいずれか一項（又は１４）に記載の造形装置。１９）前記第１厚さ制御部は、前記材料供給部と造形面との距離を制御する、１４から１８のいずれか一項（又は１４）に記載の造形装置。２０）前記材料供給部は、それぞれ斜めに造形材料を供給する複数の材料供給部を有し、前記第１厚さ制御部は、複数の前記材料供給部の角度を制御する、１４から１８のいずれか一項（又は１４）に記載の造形装置。２１）前記第２厚さ制御部は、前記光ビームの強度を制御する、１４から２０のいずれか一項（又は１４）に記載の造形装置。２２）構造層の表面の高さを計測する計測部と、前記計測部で計測された前記構造層の表面の高さ情報を記憶する記憶部と、を備える１４から２１のいずれか一項（又は１４）に記載の造形装置。２３）前記計測部は、前記構造層の表面に斜めに複数の計測光を照射する計測光照射部と、前記構造層で反射される前記計測光を受光する撮像部と、前記撮像部の撮像信号を処理して前記構造層の前記計測光が照射されている部分の高さを求める撮像信号処理部と、を有する２２に記載の造形装置。２４）前記計測部は、前記第２構造層を形成する際に、前記第２構造層の造形材料が盛られた領域で、前記第２構造層の表面の高さ情報を計測し、前記造形制御部は、前記計測部で計測される前記第２構造層の表面の高さ情報に応じて、前記第１及び第２厚さ制御部を用いて、前記第２構造層において次に造形材料が盛られる領域における造形材料の厚さを制御する、２２又は２３（又は２２）に記載の造形装置。２５）前記第１構造層の表面の高さ情報は、前記表面の高さ分布の目標分布に対する誤差分布を含む１４から２４のいずれか一項に記載の造形装置。 16) A calculation unit that extracts a low frequency component and a high frequency component related to spatial frequency from the height information of the surface of the first structural layer, and the modeling control unit extracts the low frequency component and the high frequency component regarding the spatial frequency from the height information of the surface of the first structural layer, The first thickness control section is used to control the thickness distribution of the modeling material of the second structural layer, and the second thickness control section is used to control the thickness distribution of the modeling material of the second structural layer, and the second thickness control section is used to control the thickness distribution of the modeling material of the second structural layer. 15. The modeling device according to 14 or 15 (or 14), which controls the thickness distribution of the modeling material. 17) The modeling control unit controls the first thickness control unit and the second thickness control unit in a feedforward manner using the height information of the surface of the first structural layer, and 17. The modeling device according to any one of 14 to 16 (or 14), which controls the thickness distribution of the modeling material of the structural layer. 18) The modeling apparatus according to any one of 14 to 17 (or 14), wherein the first thickness control section controls the thickness of the modeling material supplied from the material supply section to the modeling surface. 19) The modeling apparatus according to any one of 14 to 18 (or 14), wherein the first thickness control section controls the distance between the material supply section and the modeling surface. 20) The material supply unit has a plurality of material supply units that supply the modeling material obliquely, and the first thickness control unit controls the angle of the plurality of material supply units, The modeling device according to any one (or 14). 21) The modeling apparatus according to any one of 14 to 20 (or 14), wherein the second thickness control section controls the intensity of the light beam. 22) Any one of 14 to 21 ( Or the modeling device according to 14). 23) The measurement unit includes a measurement light irradiation unit that irradiates the surface of the structural layer with a plurality of measurement lights obliquely, an imaging unit that receives the measurement light reflected by the structural layer, and an imaging unit of the imaging unit. 23. The modeling apparatus according to 22, further comprising: an imaging signal processing unit that processes a signal to determine the height of a portion of the structural layer that is irradiated with the measurement light. 24) When forming the second structural layer, the measurement unit measures height information of the surface of the second structural layer in a region where the modeling material of the second structural layer is piled up, and measures the height information of the surface of the second structural layer. The control unit uses the first and second thickness control units to apply the next modeling material in the second structural layer according to the height information of the surface of the second structural layer measured by the measuring unit. 23. The modeling device according to 22 or 23 (or 22), which controls the thickness of the modeling material in the region where the material is piled up. 25) The modeling apparatus according to any one of 14 to 24, wherein the surface height information of the first structural layer includes an error distribution of the surface height distribution with respect to a target distribution.
　Ｗ…ワーク、ＥＬ…加工光、Ｍ…造形材料、４…造形装置、１０…光源、１２…材料供給装置、１６…光源制御部、１８…ガス供給装置、２０…制御装置、２６…駆動系、２８…ステージ、３０…照射光学系、３２Ａ，３２Ｂ…材料ノズル、３４Ａ，３４Ｂ…駆動機構、４２…高さ計測装置、４４Ａ～４４Ｈ…投光部、４６…撮像装置、４８…撮像信号処理部、５０…誤差算出部、５２Ｈ…ハイパスフィルタ部、５２Ｌ…ローパスフィルタ部、６０…ノズル制御部 W... Workpiece, EL... Processing light, M... Modeling material, 4... Modeling device, 10... Light source, 12... Material supply device, 16... Light source control section, 18... Gas supply device, 20... Control device, 26... Drive system , 28... Stage, 30... Irradiation optical system, 32A, 32B... Material nozzle, 34A, 34B... Drive mechanism, 42... Height measurement device, 44A to 44H... Light projection unit, 46... Imaging device, 48... Imaging signal processing Section, 50... Error calculation section, 52H... High pass filter section, 52L... Low pass filter section, 60... Nozzle control section

Claims (25)

  1. 　複数の構造層を重ねて形成して構造物を造形する造形方法であって、
    　第１構造層の表面の高さ情報に応じて、造形材料の厚さを制御する第１の方法、及び前記第１の方法が対応する空間周波数成分と異なる空間周波数成分に関して造形材料の厚さを制御する第２の方法を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形方法。     A method for forming a structure by stacking and forming a plurality of structural layers, the method comprising:
    A first method of controlling the thickness of the building material according to height information of a surface of a first structural layer, and the first method controlling the thickness of the building material with respect to a spatial frequency component different from a corresponding spatial frequency component. A modeling method that controls the thickness distribution of a modeling material of a second structural layer formed to overlap the first structural layer by using a second method of controlling the above-mentioned first structural layer.
  2. 　複数の構造層を重ねて形成して構造物を造形する造形方法であって、
    　第１構造層の表面の高さ情報に応じて、対応する空間周波数成分が互いに異なる第１の方法及び第２の方法を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御することを含み、
    　前記第１の方法は、造形材料を供給する材料供給部と造形面との相対的な位置関係を変更することを含み、
    　前記第２の方法は、造形材料に照射される光ビームの強度を制御することを含む、造形方法。     A method for forming a structure by stacking and forming a plurality of structural layers, the method comprising:
    A second structure formed over the first structural layer by using a first method and a second method in which corresponding spatial frequency components differ from each other according to surface height information of the first structural layer. controlling the thickness distribution of the build material of the layer;
    The first method includes changing the relative positional relationship between the material supply unit that supplies the modeling material and the modeling surface,
    The second method is a modeling method including controlling the intensity of a light beam irradiated onto the modeling material.
  3. 　前記第１構造層の表面の高さ情報のうち、空間周波数に関する低周波数成分を補正するように、前記第１の方法で前記第２構造層の造形材料の厚さ分布を制御し、
    　前記高さ情報のうち空間周波数に関する高周波数成分を補正するように、前記第２の方法で前記第２構造層の造形材料の厚さ分布を制御する、請求項１又は２に記載の造形方法。     controlling the thickness distribution of the modeling material of the second structural layer using the first method so as to correct a low frequency component related to spatial frequency among the height information of the surface of the first structural layer;
    The modeling method according to claim 1 or 2, wherein the thickness distribution of the modeling material of the second structural layer is controlled by the second method so as to correct a high frequency component related to a spatial frequency in the height information. .
  4. 　前記第１構造層の表面の高さ情報を用いて、フィードフォワード方式で前記第１の方法及び前記第２の方法を併用して、前記第２構造層の造形材料の厚さ分布を制御する、請求項１から３のいずれか一項に記載の造形方法。 Using the height information of the surface of the first structural layer, the first method and the second method are used together in a feedforward manner to control the thickness distribution of the modeling material of the second structural layer. , The modeling method according to any one of claims 1 to 3.
  5. 　前記第２構造層を形成することは、光ビームを照射する領域に材料供給部から造形材料を供給し、前記光ビームと前記造型材料とを相対移動することを含み、
    　前記第１の方法は、前記光ビームと前記造型材料とを相対移動するときに、前記材料供給部から造形面に供給される造形材料の厚さを制御することを含む請求項１から４のいずれか一項に記載の造形方法。     Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material,
    5. The method according to claim 1, wherein the first method includes controlling the thickness of the modeling material supplied from the material supply unit to the modeling surface when the light beam and the modeling material are moved relative to each other. The modeling method described in any one of the items.
  6. 　前記第１の方法は、前記材料供給部と造形面との距離を制御することを含む請求項５に記載の造形方法。 The modeling method according to claim 5, wherein the first method includes controlling a distance between the material supply section and the modeling surface.
  7. 　前記材料供給部から造形材料を供給することは、複数の材料供給部から斜め方向に造形材料を供給することを含み、
    　前記第１の方法は、前記材料供給部の角度を制御することを含む請求項５に記載の造形方法。     Supplying the modeling material from the material supply unit includes supplying the modeling material in an oblique direction from a plurality of material supply units,
    6. The modeling method according to claim 5, wherein the first method includes controlling an angle of the material supply section.
  8. 　前記第２構造層を形成することは、光ビームを照射する領域に材料供給部から造形材料を供給し、前記光ビームと前記造型材料とを相対移動することを含み、
    　前記第２の方法は、前記光ビームの強度を制御することを含む請求項１から７のいずれか一項に記載の造形方法。     Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material,
    The modeling method according to any one of claims 1 to 7, wherein the second method includes controlling the intensity of the light beam.
  9. 　前記第２構造層を形成する際に、前記第２構造層の造形材料を盛る前の領域で、前記第１構造層の表面の高さ情報を計測することを含む、請求項１から８のいずれか一項に記載の造形方法。 9. The method according to claim 1, further comprising measuring height information of the surface of the first structural layer in a region before applying the modeling material of the second structural layer when forming the second structural layer. The modeling method described in any one of the items.
  10. 　前記第１構造層を形成する際に、前記第１構造層の造形材料が盛られた後の領域で、前記第１構造層の表面の高さ情報を計測することを含む、請求項１から８のいずれか一項に記載の造形方法。 From claim 1, further comprising measuring height information of the surface of the first structural layer in a region after the modeling material of the first structural layer is piled up when forming the first structural layer. 8. The modeling method according to any one of 8.
  11. 　前記第１構造層を形成する工程と、前記第２構造層を形成する工程との間に、
    　前記第１構造層の表面の高さ情報を計測する工程を含む、請求項１から８のいずれか一項に記載の造形方法。     Between the step of forming the first structural layer and the step of forming the second structural layer,
    The modeling method according to any one of claims 1 to 8, comprising the step of measuring surface height information of the first structural layer.
  12. 　前記第２構造層を形成する際に、前記第２構造層の造形材料が盛られた領域で、前記第２構造層の表面の高さ情報を計測することと、
    　前記第２構造層の造形材料が盛られた領域の表面の高さ情報の計測結果と目標分布との誤差に応じて、前記第１の方法及び前記第２の方法を併用して、前記第２構造層に関して次に造形材料が盛られる領域における造形材料の厚さを制御することと、を含む請求項１から１１のいずれか一項に記載の造形方法。     When forming the second structural layer, measuring height information of the surface of the second structural layer in a region where the modeling material of the second structural layer is piled up;
    The first method and the second method are used in combination according to the error between the measurement result of the surface height information of the area where the modeling material of the second structural layer is piled up and the target distribution. 12. The method according to claim 1, further comprising: controlling the thickness of the building material in the region where the building material is applied next with respect to the two structural layers.
  13. 　前記第１構造層の表面の高さ情報は、前記表面の高さ分布の目標分布に対する誤差分布を含む請求項１から１２のいずれか一項に記載の造形方法。 13. The modeling method according to claim 1, wherein the surface height information of the first structural layer includes an error distribution of the surface height distribution with respect to a target distribution.
  14. 　複数の構造層を重ねて形成して構造物を造形する造形装置であって、
    　造形面に光ビームを照射する照射部と、
    　前記光ビームが照射される領域に造形材料を供給する材料供給部と、
    　前記光ビームと前記造型材料とを相対移動する移動部と、
    　造形材料の厚さを制御する第１厚さ制御部と、
    　前記第１厚さ制御部が対応可能な空間周波数より高い空間周波数で造形材料の厚さを制御する第２厚さ制御部と、
    　第１構造層の表面の高さ情報に応じて、前記第１及び第２厚さ制御部を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形制御部と、
    を備える造形装置。     A modeling device that shapes a structure by stacking and forming a plurality of structural layers,
    an irradiation unit that irradiates a light beam onto the modeling surface;
    a material supply unit that supplies a modeling material to a region irradiated with the light beam;
    a moving unit that relatively moves the light beam and the molding material;
    a first thickness control section that controls the thickness of the modeling material;
    a second thickness control section that controls the thickness of the modeling material at a higher spatial frequency than the spatial frequency that the first thickness control section can handle;
    Depending on the height information of the surface of the first structural layer, the thickness of the modeling material of the second structural layer formed to overlap the first structural layer is determined by using the first and second thickness control units together. a modeling control unit that controls distribution;
    A modeling device equipped with.
  15. 　複数の構造層を重ねて形成して構造物を造形する造形装置であって、
    　造形面に光ビームを照射する照射部と、
    　前記光ビームが照射される領域に造形材料を供給する材料供給部と、
    　第１構造層の表面の高さ情報に応じて、対応する空間周波数成分が互いに異なる第１及び第２厚さ制御部を併用して、前記第１構造層に重ねて形成される第２構造層の造形材料の厚さ分布を制御する造形制御部と、を備え、
    　前記第１厚さ制御部は、前記材料供給部と造形面との相対的な位置関係を変更する変更部であり、
    　前記第２厚さ制御部は、前記光ビームの強度を制御する強度制御部である、造形装置。     A modeling device that shapes a structure by stacking and forming a plurality of structural layers,
    an irradiation unit that irradiates a light beam onto the modeling surface;
    a material supply unit that supplies a modeling material to a region irradiated with the light beam;
    A second structure formed overlying the first structural layer by using first and second thickness controllers having different corresponding spatial frequency components in accordance with surface height information of the first structural layer. a modeling control unit that controls the thickness distribution of the modeling material of the layer;
    The first thickness control section is a changing section that changes the relative positional relationship between the material supply section and the modeling surface,
    In the modeling apparatus, the second thickness control section is an intensity control section that controls the intensity of the light beam.
  16. 　前記第１構造層の表面の高さ情報から空間周波数に関する低周波数成分及び高周波数成分を抽出する演算部を備え、
    　前記造形制御部は、前記低周波数成分を補正するように、前記第１厚さ制御部を用いて前記第２構造層の造形材料の厚さ分布を制御し、前記高周波数成分を補正するように、前記第２厚さ制御部を用いて前記第２構造層の造形材料の厚さ分布を制御する、請求項１４又は１５に記載の造形装置。     comprising a calculation unit that extracts a low frequency component and a high frequency component regarding spatial frequency from the height information of the surface of the first structural layer,
    The modeling control unit controls the thickness distribution of the modeling material of the second structural layer using the first thickness control unit so as to correct the low frequency component, and corrects the high frequency component. 16. The modeling apparatus according to claim 14, wherein the second thickness control section is used to control the thickness distribution of the modeling material of the second structural layer.
  17. 　前記造形制御部は、前記第１構造層の表面の高さ情報を用いて、フィードフォワード方式で前記第１厚さ制御部及び前記第２厚さ制御部を制御して、前記第２構造層の造形材料の厚さ分布を制御する、請求項１４から１６のいずれか一項に記載の造形装置。 The modeling control section controls the first thickness control section and the second thickness control section in a feedforward manner using the height information of the surface of the first structural layer, and controls the first thickness control section and the second thickness control section to form the second structural layer. The modeling device according to any one of claims 14 to 16, wherein the modeling device controls the thickness distribution of the modeling material.
  18. 　前記第１厚さ制御部は、前記材料供給部から造形面に供給される造形材料の厚さを制御する、請求項１４から１７のいずれか一項に記載の造形装置。 The modeling apparatus according to any one of claims 14 to 17, wherein the first thickness control section controls the thickness of the modeling material supplied from the material supply section to the modeling surface.
  19. 　前記第１厚さ制御部は、前記材料供給部と造形面との距離を制御する、請求項１４から１８のいずれか一項に記載の造形装置。 The modeling apparatus according to any one of claims 14 to 18, wherein the first thickness control section controls a distance between the material supply section and the modeling surface.
  20. 　前記材料供給部は、それぞれ斜めに造形材料を供給する複数の材料供給部を有し、
    　前記第１厚さ制御部は、複数の前記材料供給部の角度を制御する、請求項１４から１８のいずれか一項に記載の造形装置。     The material supply section has a plurality of material supply sections that each supply the modeling material diagonally,
    The modeling apparatus according to any one of claims 14 to 18, wherein the first thickness control section controls angles of the plurality of material supply sections.
  21. 　前記第２厚さ制御部は、前記光ビームの強度を制御する、請求項１４から２０のいずれか一項に記載の造形装置。 The modeling apparatus according to any one of claims 14 to 20, wherein the second thickness control section controls the intensity of the light beam.
  22. 　構造層の表面の高さを計測する計測部と、
    　前記計測部で計測された前記構造層の表面の高さ情報を記憶する記憶部と、
    を備える請求項１４から２１のいずれか一項に記載の造形装置。     a measurement unit that measures the height of the surface of the structural layer;
    a storage unit that stores height information of the surface of the structural layer measured by the measurement unit;
    The modeling apparatus according to any one of claims 14 to 21, comprising:
  23. 　前記計測部は、前記構造層の表面に斜めに複数の計測光を照射する計測光照射部と、前記構造層で反射される前記計測光を受光する撮像部と、前記撮像部の撮像信号を処理して前記構造層の前記計測光が照射されている部分の高さを求める撮像信号処理部と、を有する請求項２２に記載の造形装置。 The measurement unit includes a measurement light irradiation unit that irradiates a plurality of measurement lights diagonally onto the surface of the structural layer, an imaging unit that receives the measurement light reflected by the structural layer, and an imaging signal of the imaging unit. 23. The modeling apparatus according to claim 22, further comprising: an imaging signal processing unit that processes and determines the height of a portion of the structural layer that is irradiated with the measurement light.
  24. 　前記計測部は、前記第２構造層を形成する際に、前記第２構造層の造形材料が盛られた領域で、前記第２構造層の表面の高さ情報を計測し、
    　前記造形制御部は、前記計測部で計測される前記第２構造層の表面の高さ情報に応じて、前記第１及び第２厚さ制御部を用いて、前記第２構造層において次に造形材料が盛られる領域における造形材料の厚さを制御する、請求項２２又は２３に記載の造形装置。     When forming the second structural layer, the measuring unit measures height information of the surface of the second structural layer in a region where the modeling material of the second structural layer is piled up,
    The modeling control section uses the first and second thickness control sections to determine the next step in the second structural layer according to the height information of the surface of the second structural layer measured by the measuring section. The modeling device according to claim 22 or 23, wherein the thickness of the modeling material in the area where the modeling material is piled up is controlled.
  25. 　前記第１構造層の表面の高さ情報は、前記表面の高さ分布の目標分布に対する誤差分布を含む請求項１４から２４のいずれか一項に記載の造形装置。 The modeling apparatus according to any one of claims 14 to 24, wherein the surface height information of the first structural layer includes an error distribution of the surface height distribution with respect to a target distribution.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020069662A (en) * 2018-10-29 2020-05-07 東芝機械株式会社 Laminate molding apparatus, laminate molding method, and program
JP3231517U (en) * 2021-01-28 2021-04-08 株式会社ニコン Processing system
WO2022018853A1 (en) * 2020-07-22 2022-01-27 株式会社ニコン Processing system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020069662A (en) * 2018-10-29 2020-05-07 東芝機械株式会社 Laminate molding apparatus, laminate molding method, and program
WO2022018853A1 (en) * 2020-07-22 2022-01-27 株式会社ニコン Processing system
JP3231517U (en) * 2021-01-28 2021-04-08 株式会社ニコン Processing system

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