WO2023241123A1 - Flexible circuit board and manufacturing method therefor - Google Patents

Flexible circuit board and manufacturing method therefor Download PDF

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Publication number
WO2023241123A1
WO2023241123A1 PCT/CN2023/080447 CN2023080447W WO2023241123A1 WO 2023241123 A1 WO2023241123 A1 WO 2023241123A1 CN 2023080447 W CN2023080447 W CN 2023080447W WO 2023241123 A1 WO2023241123 A1 WO 2023241123A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
diaphragm
preparing
board according
Prior art date
Application number
PCT/CN2023/080447
Other languages
French (fr)
Chinese (zh)
Inventor
岳春波
李健林
王小晖
Original Assignee
深圳Tcl新技术有限公司
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Publication of WO2023241123A1 publication Critical patent/WO2023241123A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Definitions

  • the present application relates to the technical field of flexible circuit boards, and in particular to a flexible circuit board and a preparation method thereof.
  • PCB is mainly used for circuit preparation, and its main circuits are copper foil formed after etching.
  • electroplating and evaporation solutions are currently mainly carried out.
  • the thickness of its evaporation is generally less than 1 ⁇ m. Even if the width is large and the cross-sectional area of the circuit is small, it cannot carry the current required to light the LED, and cannot meet the application requirements of large-size Mini-LED or Micro-LED.
  • the purpose of this application is to provide a flexible circuit board and a preparation method thereof.
  • the flexible circuit board is prepared by mold imprinting, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet Mini requirements. -LED or Micro-LED application requirements.
  • the embodiment of the present application provides a method for preparing a flexible circuit board.
  • the preparation method includes the following steps:
  • the recessed pattern is filled with conductive material to form conductive lines.
  • pressing the convex pattern on the embossing mold toward the diaphragm, and forming a concave pattern on the surface of the diaphragm includes:
  • the convex pattern on the imprinting mold is pressed into the resin coating to form a recessed pattern on the resin coating and the diaphragm, and the recessed pattern penetrates the resin coating.
  • pressing the convex pattern on the embossing mold toward the diaphragm, and forming a concave pattern on the surface of the diaphragm includes:
  • the convex pattern on the heated embossing mold is pressed into the film to form a recessed pattern.
  • the step of filling the recessed pattern with a conductive material to form a conductive circuit includes:
  • the membrane with the conductive lines is heated.
  • the step of filling the recessed pattern with conductive material includes:
  • the step of preparing a diaphragm includes:
  • the first preset temperature ranges from 100°C to 180°C.
  • the second preset temperature ranges from 170°C to 240°C.
  • the step of heating a film with conductive circuits includes:
  • the diaphragm with conductive lines is heated to 190°C-240°C.
  • the length and width of the conductive lines are both 100 ⁇ m-200 ⁇ m.
  • the imprinting mold is in the shape of a roll.
  • the center of the imprinting mold is a roller core, and a protruding pattern is provided on the periphery of the roller core.
  • the diaphragm is a diaphragm made of BT material.
  • the thickness of the conductive circuit is 20 ⁇ m-50 ⁇ m.
  • the thickness of the diaphragm is 0.08mm-0.5mm.
  • the flexible circuit board is prepared by the above preparation method, including:
  • the diaphragm is provided with a recessed pattern on one side of the surface, and the recessed pattern is filled with conductive material to form a conductive circuit.
  • the diaphragm is provided with a resin coating, and the recessed pattern penetrates the resin coating.
  • the diaphragm is a BT material diaphragm.
  • the thickness of the conductive circuit is 20 ⁇ m-50 ⁇ m.
  • the thickness of the diaphragm is 0.08mm-0.5mm.
  • the method for preparing a flexible circuit board prepareds a diaphragm and provides an embossing mold with a protruding pattern; the protruding pattern on the embossing mold is pressed against the diaphragm. A recessed pattern is formed on the surface; the recessed pattern is filled with conductive material to form conductive lines.
  • the flexible circuit board is prepared by hot stamping with a mold, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet the application requirements of Mini-LED or Micro-LED.
  • Figure 1 is a flow chart of a method for preparing a flexible circuit board provided by this application.
  • Figure 2 is a first structural diagram of an imprinting mold and a schematic diagram of a diaphragm with a recessed pattern in the method for preparing a flexible circuit board provided by this application.
  • Figure 3 is a schematic diagram of a diaphragm with conductive circuits in the method for preparing a flexible circuit board provided by this application.
  • Figure 4 is a flow chart of an embodiment of a method for manufacturing a flexible circuit board provided by this application.
  • Figure 5 is a schematic diagram of a diaphragm coated with a resin coating in the method for preparing a flexible circuit board provided by this application.
  • Figure 6 is a schematic diagram of the diaphragm in Figure 5 provided by this application after being filled with metal material.
  • Figure 7 is a second structural view of the imprinting mold in the method for preparing a flexible circuit board provided by this application.
  • FIG. 8 is a flow chart of another embodiment of the method for manufacturing a flexible circuit board provided by the present application.
  • the purpose of this application is to provide a flexible circuit board and a preparation method thereof.
  • the flexible circuit board is prepared by mold imprinting, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet Mini requirements. -LED or Micro-LED application requirements.
  • This application provides a method for preparing a flexible circuit board.
  • the preparation method includes the following steps:
  • a diaphragm 10 is first prepared, wherein the diaphragm 10 in this embodiment is a diaphragm 10 made of BT material.
  • the diaphragm 10 first mix bismaleimide, bisphenol A isocyanate, triazine resin and titanium dioxide to prepare a premixed slurry, and then put the premixed slurry on glass fiber cloth.
  • Dip coating is performed on the BT material to prepare a diaphragm 10 of BT material, which is in a white semi-cured state.
  • the thickness of the diaphragm 10 may be 0.08mm-0.5mm.
  • the diaphragm 10 made of BT material the reflectivity of the flexible circuit board can be effectively improved, and the yellow light preparation process of the white reflective ink can be omitted, thus simplifying the preparation process of the flexible circuit board.
  • the protruding pattern 21 is the required circuit pattern. Different shapes or different depths can be prepared according to the required conductive circuits 30. Raised pattern 21. It should be noted that the method steps provided in this application are not limited to the steps provided in this embodiment. In some embodiments, the steps can be performed simultaneously. For example, in this embodiment, the steps of preparing the diaphragm and providing the embossing mold with the protruding pattern can be performed simultaneously, and the order of these steps is not limited.
  • the embossing mold 20 is embossed on one side surface of the diaphragm 10 to form a concave pattern 11 on the surface of the diaphragm 10 , and the concave pattern 11 matches the protruding pattern 21 on the embossing mold 20 .
  • conductive material is filled in the recessed pattern 11 to form a conductive circuit 30.
  • the membrane 10 with the conductive circuit 30 is a flexible circuit board.
  • the thickness of the conductive circuit 30 in the flexible circuit board obtained by mold imprinting may be 20 ⁇ m-50 ⁇ m, and the length and width of the conductive circuit 30 may be 100 ⁇ m-200 ⁇ m.
  • the thickness of the conductive circuit 30 is increased.
  • the width of the entire conductive circuit 30 remains unchanged, it is equivalent to increasing the cross-sectional area of the conductive circuit 30, thereby increasing the current. Carrying capacity to meet the application requirements of Mini-LED or Micro-LED of different sizes.
  • the convex pattern on the imprinting mold is pressed against the diaphragm.
  • the steps of forming a concave pattern on the surface of the diaphragm include:
  • mold imprinting can indirectly imprint the resin coating to form a recessed pattern on the film. That is, the resin coating 40 is coated on the diaphragm 10, and then the imprinting mold is heated to the first preset temperature.
  • the range of the first preset temperature in this embodiment may be 100°C-180°C.
  • the embossing mold 20 with the convex pattern 21 presses the convex pattern 21 into the resin coating 40 to form a recessed pattern 11 on the resin coating 40 , and the recessed pattern 11 penetrates the resin coating 40 .
  • metal material is filled to form the conductive lines 30 .
  • the thermal transfer process is completed by thermal curing, so as to facilitate the preparation process of the thermal embossed flexible circuit board.
  • the imprinting mold 20 may be in the shape of a roll. As shown in FIG. 7 , the center of the imprinting mold 20 is a roller core 22 , and a protruding pattern 21 is provided on the periphery of the roller core 22 , which rolls along the resin coating 40 to perform imprinting.
  • the diaphragm itself can also be directly imprinted to form a concave pattern on the surface of the diaphragm.
  • the step of pressing the convex pattern on the imprinting mold against the diaphragm to form a concave pattern on the surface of the diaphragm includes:
  • the embossing mold 20 in this embodiment may be a plate-like structure.
  • the second preset temperature of heating is greater than the first preset temperature, and the second preset temperature may range from 170°C to 240°C.
  • the protruding pattern 21 in the imprinting mold 20 is directly pressed into the diaphragm 10 to form a recessed pattern 11 on the diaphragm 10, which is then filled with conductive material to form a flexible circuit board.
  • the step of filling the recessed pattern 11 with conductive material in this embodiment includes: using nano-copper or nano-silver-coated copper slurry to fill the recessed pattern 11 with scraping.
  • the conductive material in this embodiment can be nano-copper or nano-silver-coated copper.
  • Nano-copper slurry can be used to scrape-coat into the recessed pattern 11, and at the same time, a layer of tin powder slurry can be used; or nano-silver-coated copper slurry can be used to scrape-coat and fill the recessed pattern 11 to form a conductive state. Line 30.
  • the step of filling the recessed patterns 11 with conductive material to form the conductive lines 30 includes: heating the diaphragm 10 with the conductive lines 30 .
  • the diaphragm 10 with the conductive lines 30 can also be fully cured.
  • the diaphragm 10 with the conductive lines 30 can be heated to 190°C-240°C or the filled conductive material can be sintered using laser metal sintering, so that the diaphragm 10 with the conductive lines 30 can be After full curing, a white flexible circuit board is finally obtained. Since the diaphragm 10 in the flexible circuit board is made of BT material, the reflectivity of the flexible circuit board can be greater than 85%, thereby effectively improving the light efficiency of the Mini-LED light panel made by using the flexible circuit board. .
  • the flexible circuit board prepared by hot stamping in this application can increase the cross-sectional area of the conductive circuit 30 to improve the current carrying capacity and meet the application requirements of Mini-LED or Micro-LED of different sizes.
  • the flexible circuit board is made of a diaphragm 10 of BT material, which can effectively improve the reflectivity of the flexible circuit board; thus, the yellow light preparation process of white reflective ink can be omitted, thereby simplifying the preparation process of the flexible circuit board.
  • this application also provides a flexible circuit board, which can be prepared by the above-mentioned preparation method.
  • the flexible circuit board includes a diaphragm.
  • One side surface of the diaphragm is provided with a recessed pattern, and the recessed pattern is filled with conductive material to form a conductive circuit.
  • the recessed pattern may be directly imprinted on the film, or may be imprinted by applying a resin coating. Therefore, if the flexible circuit board is obtained by applying a resin coating and imprinting, then the resin coating is provided on the diaphragm, the recessed pattern penetrates the resin coating, and the recessed pattern is filled with conductive material to form conductive lines.
  • the diaphragm in the flexible circuit board in this application uses a BT material diaphragm, the reflectivity of the flexible circuit board can be greater than 85%, thereby effectively improving the Mini-LED produced by using the flexible circuit board.
  • the light effect of the light panel Since the method for preparing the flexible circuit board has been described in detail above, the details will not be described again here.
  • the preparation method of the flexible circuit board includes preparing a diaphragm; providing an embossing mold with a convex pattern; and pressing the convex pattern on the embossing mold.
  • a recessed pattern is formed on the surface of the diaphragm; the recessed pattern is filled with conductive material to form a conductive line.
  • the flexible circuit board is prepared by mold imprinting, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet the application requirements of Mini-LED or Micro-LED.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Disclosed in the present application are a flexible circuit board and a manufacturing method therefor. The manufacturing method for the flexible circuit board comprises: preparing a film; providing an imprinting mold having a protruding pattern; pressing to the film the protruding pattern on the imprinting mold, and forming on the surface of the film a recessed pattern; and filling the recessed pattern with a conductive material, so as to form a conductive circuit.

Description

一种柔性线路板及其制备方法Flexible circuit board and preparation method thereof
本申请要求于2022年06月16日提交中国专利局、申请号为202210684281.1   、申请名称为“一种柔性线路板及其制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application submitted to the China Patent Office on June 16, 2022, with the application number 202210684281.1 and the application title "A flexible circuit board and its preparation method", the entire content of which is incorporated herein by reference. Applying.
技术领域Technical field
本申请涉及柔性线路板技术领域，特别涉及一种柔性线路板及其制备方法。The present application relates to the technical field of flexible circuit boards, and in particular to a flexible circuit board and a preparation method thereof.
背景技术Background technique
Mini-LED或Micro-LED背光和显示技术中，其主要采用PCB进行电路制备，其主要线路为铜箔在经过蚀刻后形成。但对于采用柔性或者玻璃基板的过程中，由于不能完全按照PCB的制程工艺进行，故目前主要有电镀，蒸镀方案开展。In Mini-LED or Micro-LED backlight and display technology, PCB is mainly used for circuit preparation, and its main circuits are copper foil formed after etching. However, in the process of using flexible or glass substrates, since the PCB manufacturing process cannot be completely followed, electroplating and evaporation solutions are currently mainly carried out.
技术问题technical problem
但其蒸镀的厚度一般低于1μm，即使宽度大，线路的截面积小，也不能承载点亮LED需要的电流，无法满足大尺寸的Mini-LED或Micro-LED的应用要求。However, the thickness of its evaporation is generally less than 1 μm. Even if the width is large and the cross-sectional area of the circuit is small, it cannot carry the current required to light the LED, and cannot meet the application requirements of large-size Mini-LED or Micro-LED.
技术解决方案Technical solutions
本申请的目的在于提供一种柔性线路板及其制备方法，通过模具压印的方式制备得到柔性线路板，能够增大柔性线路板中导电线路的截面积，进而增加电流承载能力，以满足Mini-LED或Micro-LED的应用要求。The purpose of this application is to provide a flexible circuit board and a preparation method thereof. The flexible circuit board is prepared by mold imprinting, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet Mini requirements. -LED or Micro-LED application requirements.
为了达到上述目的，本申请采取了以下技术方案：In order to achieve the above purpose, this application adopts the following technical solutions:
本申请实施例提供一种柔性线路板的制备方法，制备方法包括如下步骤：The embodiment of the present application provides a method for preparing a flexible circuit board. The preparation method includes the following steps:
制备膜片；Prepare diaphragm;
提供具有凸出图案的压印模具；Imprinting molds with raised patterns are available;
将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案；Press the convex pattern on the embossing mold against the diaphragm to form a concave pattern on the surface of the diaphragm;
采用导电材料填充凹陷图案，以形成导电线路。The recessed pattern is filled with conductive material to form conductive lines.
在一些实施例中的柔性线路板的制备方法，将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案的步骤包括：In some embodiments of the method for preparing a flexible circuit board, pressing the convex pattern on the embossing mold toward the diaphragm, and forming a concave pattern on the surface of the diaphragm includes:
在膜片上涂敷树脂涂层；Apply a resin coating to the diaphragm;
将压印模具加热至第一预设温度；heating the imprinting mold to a first preset temperature;
将压印模具上的凸出图案压入树脂涂层，以在树脂涂层和膜片上形成凹陷图案，凹陷图案贯穿树脂涂层。The convex pattern on the imprinting mold is pressed into the resin coating to form a recessed pattern on the resin coating and the diaphragm, and the recessed pattern penetrates the resin coating.
在一些实施例中的柔性线路板的制备方法，将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案的步骤包括：In some embodiments of the method for preparing a flexible circuit board, pressing the convex pattern on the embossing mold toward the diaphragm, and forming a concave pattern on the surface of the diaphragm includes:
将压印模具加热至第二预设温度；heating the imprinting mold to a second preset temperature;
将加热后的压印模具上的凸出图案压入膜片，形成凹陷图案。The convex pattern on the heated embossing mold is pressed into the film to form a recessed pattern.
在一些实施例中的柔性线路板的制备方法，采用导电材料填充凹陷图案，以形成导电线路的步骤之后包括：In some embodiments of the method for preparing a flexible circuit board, the step of filling the recessed pattern with a conductive material to form a conductive circuit includes:
将具有导电线路的膜片进行加热处理。The membrane with the conductive lines is heated.
在一些实施例中的柔性线路板的制备方法，采用导电材料填充凹陷图案的步骤包括：In some embodiments of the method for preparing a flexible circuit board, the step of filling the recessed pattern with conductive material includes:
采用纳米铜或纳米银包铜的浆料对凹陷图案进行刮涂填充。Use nano-copper or nano-silver-coated copper slurry to fill the recessed pattern with scraping.
在一些实施例中的柔性线路板的制备方法，制备膜片的步骤包括：In some embodiments of the method for preparing a flexible circuit board, the step of preparing a diaphragm includes:
将双马来酰亚胺、双酚A型异氰酸酯、三嗪树脂和钛白粉进行混合制备得到预混浆料；Mix bismaleimide, bisphenol A isocyanate, triazine resin and titanium dioxide to prepare a premixed slurry;
将预混浆料在玻纤布上进行浸涂，得到半固化状态的膜片。Dip the premixed slurry on the glass fiber cloth to obtain a semi-cured membrane.
在一些实施例中的柔性线路板的制备方法，第一预设温度的范围为100℃-180℃。In some embodiments of the flexible circuit board preparation method, the first preset temperature ranges from 100°C to 180°C.
在一些实施例中的柔性线路板的制备方法，第二预设温度的范围为170℃-240℃。In some embodiments of the flexible circuit board preparation method, the second preset temperature ranges from 170°C to 240°C.
在一些实施例中的柔性线路板的制备方法，将具有导电线路的膜片进行加热处理的步骤包括：In some embodiments of the method for preparing a flexible circuit board, the step of heating a film with conductive circuits includes:
将具有导电线路的膜片升温至190℃-240℃。The diaphragm with conductive lines is heated to 190°C-240°C.
在一些实施例中的柔性线路板的制备方法，导电线路的长度和宽度均为100μm-200μm。In some embodiments of the method for preparing a flexible circuit board, the length and width of the conductive lines are both 100 μm-200 μm.
在一些实施例中的柔性线路板的制备方法，压印模具为卷筒状。In some embodiments of the method for preparing a flexible circuit board, the imprinting mold is in the shape of a roll.
在一些实施例中的柔性线路板的制备方法，压印模具的中心为辊芯，辊芯的***设置有凸出图案。In some embodiments of the method for preparing a flexible circuit board, the center of the imprinting mold is a roller core, and a protruding pattern is provided on the periphery of the roller core.
在一些实施例中的柔性线路板的制备方法，膜片为BT材料的膜片。In some embodiments of the method for preparing a flexible circuit board, the diaphragm is a diaphragm made of BT material.
在一些实施例中的柔性线路板的制备方法，导电线路的厚度20μm-50μm。In some embodiments of the method for preparing a flexible circuit board, the thickness of the conductive circuit is 20 μm-50 μm.
在一些实施例中的柔性线路板的制备方法，膜片的厚度为0.08mm-0.5mm。In some embodiments of the method for preparing a flexible circuit board, the thickness of the diaphragm is 0.08mm-0.5mm.
本申请还提供了一种柔性线路板，柔性电路板由上述的制备方法制备得到，包括：This application also provides a flexible circuit board. The flexible circuit board is prepared by the above preparation method, including:
膜片，膜片的一侧表面设置有凹陷图案，凹陷图案内填充有导电材料形成导电线路。The diaphragm is provided with a recessed pattern on one side of the surface, and the recessed pattern is filled with conductive material to form a conductive circuit.
在一些实施例中的柔性线路板，膜片上设置有树脂涂层，凹陷图案贯穿树脂涂层。In some embodiments of the flexible circuit board, the diaphragm is provided with a resin coating, and the recessed pattern penetrates the resin coating.
在一些实施例中的柔性线路板，膜片为BT材料膜片。In some embodiments of the flexible circuit board, the diaphragm is a BT material diaphragm.
在一些实施例中的柔性线路板的制备方法，导电线路的厚度20μm-50μm。In some embodiments of the method for preparing a flexible circuit board, the thickness of the conductive circuit is 20 μm-50 μm.
在一些实施例中的柔性线路板的制备方法，膜片的厚度为0.08mm-0.5mm。In some embodiments of the method for preparing a flexible circuit board, the thickness of the diaphragm is 0.08mm-0.5mm.
有益效果beneficial effects
相较于现有技术，本申请提供的柔性线路板的制备方法通过制备膜片并提供具有凸出图案的压印模具；将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案；采用导电材料填充凹陷图案，以形成导电线路。本申请中通过模具进行热压印的方式制备柔性线路板，能够增大柔性线路板中导电线路的截面积，进而增加电流承载能力，以满足Mini-LED或Micro-LED的应用要求。Compared with the prior art, the method for preparing a flexible circuit board provided by this application prepares a diaphragm and provides an embossing mold with a protruding pattern; the protruding pattern on the embossing mold is pressed against the diaphragm. A recessed pattern is formed on the surface; the recessed pattern is filled with conductive material to form conductive lines. In this application, the flexible circuit board is prepared by hot stamping with a mold, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet the application requirements of Mini-LED or Micro-LED.
附图说明Description of the drawings
图1为本申请提供的柔性线路板的制备方法的流程图。Figure 1 is a flow chart of a method for preparing a flexible circuit board provided by this application.
图2为本申请提供的柔性线路板的制备方法中压印模具的第一种结构图以及具有凹陷图案的膜片示意图。Figure 2 is a first structural diagram of an imprinting mold and a schematic diagram of a diaphragm with a recessed pattern in the method for preparing a flexible circuit board provided by this application.
图3为本申请提供的柔性线路板的制备方法中具有导电线路的膜片示意图。Figure 3 is a schematic diagram of a diaphragm with conductive circuits in the method for preparing a flexible circuit board provided by this application.
图4为本申请提供的柔性线路板的制备方法中一实施例的流程图。Figure 4 is a flow chart of an embodiment of a method for manufacturing a flexible circuit board provided by this application.
图5为本申请提供的柔性线路板的制备方法中涂敷有树脂涂层的膜片示意图。Figure 5 is a schematic diagram of a diaphragm coated with a resin coating in the method for preparing a flexible circuit board provided by this application.
图6为本申请提供的图5中的膜片填充金属材料后的示意图。Figure 6 is a schematic diagram of the diaphragm in Figure 5 provided by this application after being filled with metal material.
图7为本申请提供的柔性电路板的制备方法中压印模具的第二种结构图。Figure 7 is a second structural view of the imprinting mold in the method for preparing a flexible circuit board provided by this application.
图8为本申请提供的柔性电路板的制备方法中另一实施例的流程图。FIG. 8 is a flow chart of another embodiment of the method for manufacturing a flexible circuit board provided by the present application.
本发明的实施方式Embodiments of the invention
本申请的目的在于提供一种柔性线路板及其制备方法，通过模具压印的方式制备得到柔性线路板，能够增大柔性线路板中导电线路的截面积，进而增加电流承载能力，以满足Mini-LED或Micro-LED的应用要求。The purpose of this application is to provide a flexible circuit board and a preparation method thereof. The flexible circuit board is prepared by mold imprinting, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet Mini requirements. -LED or Micro-LED application requirements.
为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。In order to make the purpose, technical solutions and effects of the present application clearer and clearer, the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.
请参阅图1，本申请提供的一种柔性线路板的制备方法，该制备方法包括如下步骤：Please refer to Figure 1. This application provides a method for preparing a flexible circuit board. The preparation method includes the following steps:
100、制备膜片；100. Prepare diaphragm;
200、提供具有凸出图案的压印模具；200. Provide imprinting molds with raised patterns;
300、将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案；300. Press the convex pattern on the embossing mold toward the diaphragm to form a concave pattern on the surface of the diaphragm;
400、采用导电材料填充凹陷图案，以形成导电线路。400. Use conductive material to fill the recessed pattern to form conductive lines.
如图2和图3所示，在制备柔性线路板时，首先制备一膜片10，其中本实施例中的膜片10为BT材料的膜片10。在制备该膜片10时，首先将双马来酰亚胺、双酚A型异氰酸酯、三嗪树脂和钛白粉进行混合制备得到预混浆料，之后再将该预混浆料在玻纤布上进行浸涂，制备得到BT材料的膜片10，该膜片10为白色的半固化状态。其中，该膜片10的厚度可以是0.08mm-0.5mm。本实施例中通过采用BT材料的膜片10，能够有效地提高柔性线路板的反射率，同时也可以省去白色反射油墨的黄光制备过程，简化了柔性线路板的制备流程。As shown in Figures 2 and 3, when preparing a flexible circuit board, a diaphragm 10 is first prepared, wherein the diaphragm 10 in this embodiment is a diaphragm 10 made of BT material. When preparing the diaphragm 10, first mix bismaleimide, bisphenol A isocyanate, triazine resin and titanium dioxide to prepare a premixed slurry, and then put the premixed slurry on glass fiber cloth. Dip coating is performed on the BT material to prepare a diaphragm 10 of BT material, which is in a white semi-cured state. Wherein, the thickness of the diaphragm 10 may be 0.08mm-0.5mm. In this embodiment, by using the diaphragm 10 made of BT material, the reflectivity of the flexible circuit board can be effectively improved, and the yellow light preparation process of the white reflective ink can be omitted, thus simplifying the preparation process of the flexible circuit board.
与此同时，还需要提供一具有凸出图案21的压印模具20，该凸出图案21为所需要的线路图案，可依据所需要的导电线路30的不同来制备不同外型或不同深度的凸出图案21。需要说明的是本申请中提供的方法步骤并不限定于本实施例中提供的步骤，在一些实施例中的步骤可以同步进行。例如本实施例中的制备膜片的步骤和提供凸出图案的压印模具可以同步进行，对此步骤的先后顺序不作限定。之后，在将压印模具20向膜片10的一侧表面进行压印，在膜片10的表面成凹陷图案11，该凹陷图案11与压印模具20上的凸出图案21相适配。然后再在该凹陷图案11中填充导电材料以形成导电线路30，那么具有该导电线路30的膜片10即为柔性线路板。本实施例中通过模具压印的方式得到的柔性线路板中的导电线路30的厚度可以是20μm-50μm，导电线路30的长度和宽度可以是100μm-200μm。相对于通过蒸镀的方案得到的线路的厚度而言，增大了导电线路30的厚度，在整个导电线路30的宽度不变时，相当于增加了导电线路30的截面积，进而增加了电流的承载能力，以满足不同尺寸的Mini-LED或Micro-LED的应用要求。At the same time, it is also necessary to provide an imprinting mold 20 with a protruding pattern 21. The protruding pattern 21 is the required circuit pattern. Different shapes or different depths can be prepared according to the required conductive circuits 30. Raised pattern 21. It should be noted that the method steps provided in this application are not limited to the steps provided in this embodiment. In some embodiments, the steps can be performed simultaneously. For example, in this embodiment, the steps of preparing the diaphragm and providing the embossing mold with the protruding pattern can be performed simultaneously, and the order of these steps is not limited. After that, the embossing mold 20 is embossed on one side surface of the diaphragm 10 to form a concave pattern 11 on the surface of the diaphragm 10 , and the concave pattern 11 matches the protruding pattern 21 on the embossing mold 20 . Then, conductive material is filled in the recessed pattern 11 to form a conductive circuit 30. Then, the membrane 10 with the conductive circuit 30 is a flexible circuit board. In this embodiment, the thickness of the conductive circuit 30 in the flexible circuit board obtained by mold imprinting may be 20 μm-50 μm, and the length and width of the conductive circuit 30 may be 100 μm-200 μm. Compared with the thickness of the circuit obtained by evaporation, the thickness of the conductive circuit 30 is increased. When the width of the entire conductive circuit 30 remains unchanged, it is equivalent to increasing the cross-sectional area of the conductive circuit 30, thereby increasing the current. Carrying capacity to meet the application requirements of Mini-LED or Micro-LED of different sizes.
请参阅图4，本实施例中将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案的步骤包括：Please refer to Figure 4. In this embodiment, the convex pattern on the imprinting mold is pressed against the diaphragm. The steps of forming a concave pattern on the surface of the diaphragm include:
310、在膜片上涂敷树脂涂层；310. Apply resin coating on the diaphragm;
320、将压印模具加热至第一预设温度；320. Heat the imprinting mold to the first preset temperature;
330、将压印模具上的凸出图案压入树脂涂层，以在所述树脂涂层和所述膜片上形成所述凹陷图案，所述凹陷图案贯穿所述树脂涂层。330. Press the convex pattern on the imprinting mold into the resin coating to form the recessed pattern on the resin coating and the film, and the recessed pattern penetrates the resin coating.
如图5和图6所示，在一些实施例中模具压印可以间接的压印树脂涂层，在膜片上形成凹陷图案。也即在膜片10上涂敷树脂涂层40，之后将压印模具进行加热至第一预设温度。其中本实施例中的第一预设温度所在的范围可以是100℃-180℃。与此同时由带有凸出图案21的压印模具20将凸出图案21压入树脂涂层40，在树脂涂层40上形成凹陷图案11，且该凹陷图案11是贯穿树脂涂层40的。之后再进行金属材料的填充以形成导电线路30。由此采用热固化的方式完成热转印的过程，以便于实现热压印的柔性线路板制备过程。As shown in Figures 5 and 6, in some embodiments, mold imprinting can indirectly imprint the resin coating to form a recessed pattern on the film. That is, the resin coating 40 is coated on the diaphragm 10, and then the imprinting mold is heated to the first preset temperature. The range of the first preset temperature in this embodiment may be 100°C-180°C. At the same time, the embossing mold 20 with the convex pattern 21 presses the convex pattern 21 into the resin coating 40 to form a recessed pattern 11 on the resin coating 40 , and the recessed pattern 11 penetrates the resin coating 40 . Then, metal material is filled to form the conductive lines 30 . Thus, the thermal transfer process is completed by thermal curing, so as to facilitate the preparation process of the thermal embossed flexible circuit board.
需要说明的是，本实施例中压印模具20可以是卷筒状的。如图7所示，压印模具20的中心为辊芯22，辊芯22的***设置有凸出图案21，沿着树脂涂层40滚动进行压印。It should be noted that in this embodiment, the imprinting mold 20 may be in the shape of a roll. As shown in FIG. 7 , the center of the imprinting mold 20 is a roller core 22 , and a protruding pattern 21 is provided on the periphery of the roller core 22 , which rolls along the resin coating 40 to perform imprinting.
请参阅图8，在一些实施例中也可以采用直接压印膜片本身的方式，在膜片的表面形成凹陷图案。那么本实施例中的将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案的步骤包括：Referring to FIG. 8 , in some embodiments, the diaphragm itself can also be directly imprinted to form a concave pattern on the surface of the diaphragm. Then in this embodiment, the step of pressing the convex pattern on the imprinting mold against the diaphragm to form a concave pattern on the surface of the diaphragm includes:
311、将压印模具加热至第二预设温度；311. Heat the imprinting mold to the second preset temperature;
312、将加热后的压印模具上的凸出图案压入膜片，形成凹陷图案；其中，凹陷图案未贯穿膜片。312. Press the convex pattern on the heated embossing mold into the diaphragm to form a recessed pattern; the recessed pattern does not penetrate the diaphragm.
请继续参阅图2和图3，与采用树脂涂层进行热压印不同的是，本实施例中压印模具20可以是一板状结构。加热的第二预设温度大于第一预设温度，第二预设温度的范围可以是170℃-240℃。此时将压印模具20中的凸出图案21直接压入膜片10中，在膜片10上形成以凹陷图案11，之后再进行导电材料的填补，形成柔性线路板。Please continue to refer to FIGS. 2 and 3 . Different from using a resin coating for hot embossing, the embossing mold 20 in this embodiment may be a plate-like structure. The second preset temperature of heating is greater than the first preset temperature, and the second preset temperature may range from 170°C to 240°C. At this time, the protruding pattern 21 in the imprinting mold 20 is directly pressed into the diaphragm 10 to form a recessed pattern 11 on the diaphragm 10, which is then filled with conductive material to form a flexible circuit board.
具体地，本实施例中采用导电材料填充凹陷图案11的步骤包括：采用纳米铜或纳米银包铜的浆料对凹陷图案11进行刮涂填充。也即本实施例中的导电材料可以选择纳米铜，也可以选择纳米银包铜。可以采用纳米铜的浆料刮涂到凹陷图案11中，与此同时再刮涂一层锡粉浆料；或者采用纳米银包铜的浆料进行刮涂，填满凹陷图案11，以形成导电线路30。Specifically, the step of filling the recessed pattern 11 with conductive material in this embodiment includes: using nano-copper or nano-silver-coated copper slurry to fill the recessed pattern 11 with scraping. That is to say, the conductive material in this embodiment can be nano-copper or nano-silver-coated copper. Nano-copper slurry can be used to scrape-coat into the recessed pattern 11, and at the same time, a layer of tin powder slurry can be used; or nano-silver-coated copper slurry can be used to scrape-coat and fill the recessed pattern 11 to form a conductive state. Line 30.
进一步地，将导电材料填充凹陷图案11形成导电线路30的步骤之后包括：将具有导电线路30的膜片10进行加热处理。在填充完导电材料之后，还可对具有导电线路30的膜片10进行全固化。具体地，本实施例中可以将具有导电线路30的膜片10升温至190℃-240℃或者采用激光金属烧结的方式，针对填充的导电材料进行烧结，使得具有导电线路30的膜片10进行全固化，最终得到白色的柔性线路板。由于该柔性线路板中的膜片10为BT材料的膜片10，可以使得柔性线路板的反射率大于85%，进而有效地提高采用该柔性线路板制得到的Mini-LED灯板的光效。Further, the step of filling the recessed patterns 11 with conductive material to form the conductive lines 30 includes: heating the diaphragm 10 with the conductive lines 30 . After the conductive material is filled, the diaphragm 10 with the conductive lines 30 can also be fully cured. Specifically, in this embodiment, the diaphragm 10 with the conductive lines 30 can be heated to 190°C-240°C or the filled conductive material can be sintered using laser metal sintering, so that the diaphragm 10 with the conductive lines 30 can be After full curing, a white flexible circuit board is finally obtained. Since the diaphragm 10 in the flexible circuit board is made of BT material, the reflectivity of the flexible circuit board can be greater than 85%, thereby effectively improving the light efficiency of the Mini-LED light panel made by using the flexible circuit board. .
本申请中通过热压印的方式制备得到的柔性线路板，能够增加导电线路30的截面积，以提高电流的承载能力，满足不同尺寸的Mini-LED或者Micro-LED的应用要求。其中，该柔性线路板采用的是BT材料的膜片10制成，能够有效提高柔性线路板的反射率；由此可省去白色反射油墨的黄光制备过程，进而简化柔性线路板的制备流程。此外本申请中不需要像蒸镀方案中增加电镀的形式制备双层铜，能够有效地节约制备成本。The flexible circuit board prepared by hot stamping in this application can increase the cross-sectional area of the conductive circuit 30 to improve the current carrying capacity and meet the application requirements of Mini-LED or Micro-LED of different sizes. Among them, the flexible circuit board is made of a diaphragm 10 of BT material, which can effectively improve the reflectivity of the flexible circuit board; thus, the yellow light preparation process of white reflective ink can be omitted, thereby simplifying the preparation process of the flexible circuit board. . In addition, in this application, there is no need to add electroplating to prepare double-layer copper as in the evaporation solution, which can effectively save preparation costs.
进一步地，本申请还提供了一种柔性线路板，该柔性线路板可以由上述的制备方法制备得到。该柔性线路板包括膜片，膜片的一侧表面设置有凹陷图案，凹陷图案内填充有导电材料形成导电线路。其中，该凹陷图案可以是直接在膜片上压印得到，也可以是通过涂敷树脂涂层压印得到。因此，该柔性线路板若是通过涂敷树脂涂层压印得到，那么膜片上设置有树脂涂层，凹陷图案贯穿树脂涂层，凹陷图案中填充有导电材料以形成导电线路。其中，由于本申请中的柔性电路板中的膜片采用的是BT材料的膜片，可以使得柔性线路板的反射率大于85%，进而有效地提高采用该柔性线路板制得到的Mini-LED灯板的光效。由于上文对该柔性线路板的制备方法进行了详细描述，此处不再赘述。Furthermore, this application also provides a flexible circuit board, which can be prepared by the above-mentioned preparation method. The flexible circuit board includes a diaphragm. One side surface of the diaphragm is provided with a recessed pattern, and the recessed pattern is filled with conductive material to form a conductive circuit. The recessed pattern may be directly imprinted on the film, or may be imprinted by applying a resin coating. Therefore, if the flexible circuit board is obtained by applying a resin coating and imprinting, then the resin coating is provided on the diaphragm, the recessed pattern penetrates the resin coating, and the recessed pattern is filled with conductive material to form conductive lines. Among them, since the diaphragm in the flexible circuit board in this application uses a BT material diaphragm, the reflectivity of the flexible circuit board can be greater than 85%, thereby effectively improving the Mini-LED produced by using the flexible circuit board. The light effect of the light panel. Since the method for preparing the flexible circuit board has been described in detail above, the details will not be described again here.
综上，本申请提供的一种柔性线路板及其制备方法中，该柔性线路板的制备方法通过制备膜片；提供具有凸出图案的压印模具；将压印模具上的凸出图案压向膜片，在膜片的表面形成凹陷图案；采用导电材料填充凹陷图案，以形成导电线路。本申请中通过模具压印的方式制备柔性线路板，能够增大柔性线路板中导电线路的截面积，进而增加电流承载能力，以满足Mini-LED或Micro-LED的应用要求。In summary, in the flexible circuit board and its preparation method provided by this application, the preparation method of the flexible circuit board includes preparing a diaphragm; providing an embossing mold with a convex pattern; and pressing the convex pattern on the embossing mold. Toward the diaphragm, a recessed pattern is formed on the surface of the diaphragm; the recessed pattern is filled with conductive material to form a conductive line. In this application, the flexible circuit board is prepared by mold imprinting, which can increase the cross-sectional area of the conductive circuits in the flexible circuit board, thereby increasing the current carrying capacity to meet the application requirements of Mini-LED or Micro-LED.
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其申请构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。It can be understood that, for those of ordinary skill in the art, equivalent substitutions or changes can be made based on the technical solutions and application concepts of this application, and all such changes or substitutions should fall within the protection scope of the appended claims of this application.

Claims (20)

  1. 一种柔性线路板的制备方法，其特征在于，所述制备方法包括如下步骤：A method for preparing a flexible circuit board, characterized in that the preparation method includes the following steps:
    制备膜片；Prepare diaphragm;
    提供具有凸出图案的压印模具；Imprinting molds with raised patterns are available;
    将所述压印模具上的凸出图案压向所述膜片，在所述膜片的表面形成凹陷图案；Press the convex pattern on the embossing mold against the diaphragm to form a concave pattern on the surface of the diaphragm;
    采用导电材料填充所述凹陷图案，以形成导电线路。The recessed pattern is filled with conductive material to form conductive lines.
  2. 根据权利要求1所述的柔性线路板的制备方法，其特征在于，将所述压印模具上的凸出图案压向所述膜片，在所述膜片的表面形成凹陷图案的步骤包括：The method for preparing a flexible circuit board according to claim 1, wherein the step of pressing the convex pattern on the embossing mold toward the diaphragm, and forming a recessed pattern on the surface of the diaphragm includes:
    在所述膜片上涂敷树脂涂层；Apply a resin coating on the diaphragm;
    将所述压印模具加热至第一预设温度；heating the imprinting mold to a first preset temperature;
    将所述压印模具上的所述凸出图案压入所述树脂涂层，以在所述树脂涂层和所述膜片上形成所述凹陷图案，所述凹陷图案贯穿所述树脂涂层。The convex pattern on the imprinting mold is pressed into the resin coating to form the recessed pattern on the resin coating and the film, and the recessed pattern penetrates the resin coating .
  3. 根据权利要求1所述的柔性线路板的制备方法，其特征在于，将所述压印模具上的凸出图案压向所述膜片，在所述膜片的表面形成凹陷图案的步骤包括：The method for preparing a flexible circuit board according to claim 1, wherein the step of pressing the convex pattern on the embossing mold toward the diaphragm, and forming a recessed pattern on the surface of the diaphragm includes:
    将所述压印模具加热至第二预设温度；heating the imprinting mold to a second preset temperature;
    将加热后的所述压印模具上的所述凸出图案压入所述膜片，形成所述凹陷图案。The heated convex pattern on the embossing mold is pressed into the film to form the recessed pattern.
  4. 根据权利要求1-3任一项所述的柔性线路板的制备方法，其特征在于，所述采用导电材料填充所述凹陷图案，以形成导电线路的步骤之后包括：The method for preparing a flexible circuit board according to any one of claims 1 to 3, wherein the step of filling the recessed pattern with a conductive material to form a conductive circuit includes:
    将具有所述导电线路的膜片进行加热处理。The membrane with the conductive lines is subjected to heat treatment.
  5. 根据权利要求1-3任一项所述的柔性线路板的制备方法，其特征在于，所述采用导电材料填充所述凹陷图案的步骤包括：The method for preparing a flexible circuit board according to any one of claims 1 to 3, wherein the step of filling the recessed pattern with conductive material includes:
    采用纳米铜或纳米银包铜的浆料对所述凹陷图案进行刮涂填充。The recessed pattern is filled with a slurry of nano-copper or nano-silver clad copper.
  6. 根据权利要求1-3任一项所述的柔性线路板的制备方法，其特征在于，所述制备膜片的步骤包括：The method for preparing a flexible circuit board according to any one of claims 1 to 3, wherein the step of preparing a diaphragm includes:
    将双马来酰亚胺、双酚A型异氰酸酯、三嗪树脂和钛白粉进行混合制备得到预混浆料；Mix bismaleimide, bisphenol A isocyanate, triazine resin and titanium dioxide to prepare a premixed slurry;
    将所述预混浆料在玻纤布上进行浸涂，得到半固化状态的膜片。The premixed slurry is dip-coated on glass fiber cloth to obtain a semi-cured membrane.
  7. 根据权利要求2所述的柔性线路板的制备方法，其特征在于，所述第一预设温度的范围为100℃-180℃。The method for preparing a flexible circuit board according to claim 2, wherein the first preset temperature ranges from 100°C to 180°C.
  8. 根据权利要求3所述的柔性线路板的制备方法，其特征在于，所述第二预设温度的范围为170℃-240℃。The method for preparing a flexible circuit board according to claim 3, wherein the second preset temperature ranges from 170°C to 240°C.
  9. 根据权利要求4所述的柔性线路板的制备方法，其特征在于，所述将具有所述导电线路的膜片进行加热处理的步骤包括：The method for preparing a flexible circuit board according to claim 4, wherein the step of heating the film with the conductive circuit includes:
    将具有所述导电线路的膜片升温至190℃-240℃。The membrane with the conductive lines is heated to 190°C-240°C.
  10. 根据权利要求9所述的柔性线路板的制备方法，其特征在于，所述导电线路的长度和宽度均为100μm-200μm。The method for preparing a flexible circuit board according to claim 9, wherein the length and width of the conductive lines are both 100 μm-200 μm.
  11. 根据权利要求10所述的柔性线路板的制备方法，其特征在于，所述压印模具为卷筒状。The method for preparing a flexible circuit board according to claim 10, wherein the imprinting mold is in the shape of a roll.
  12. 根据权利要求11所述的柔性线路板的制备方法，其特征在于，所述压印模具的中心为辊芯，所述辊芯的***设置有所述凸出图案。The method for preparing a flexible circuit board according to claim 11, wherein the center of the imprinting mold is a roller core, and the protruding pattern is provided on the periphery of the roller core.
  13. 根据权利要求1-3任一项所述的柔性线路板的制备方法，其特征在于，所述膜片为BT材料的膜片。The method for preparing a flexible circuit board according to any one of claims 1 to 3, wherein the diaphragm is a diaphragm made of BT material.
  14. 根据权利要求1所述的柔性线路板的制备方法，其特征在于，所述导电线路的厚度20μm-50μm。The method for preparing a flexible circuit board according to claim 1, wherein the thickness of the conductive circuit is 20 μm-50 μm.
  15. 根据权利要求1所述的柔性线路板的制备方法，其特征在于，所述膜片的厚度为0.08mm-0.5mm。The method for preparing a flexible circuit board according to claim 1, wherein the thickness of the diaphragm is 0.08mm-0.5mm.
  16. 一种柔性线路板，其特征在于，所述柔性电路板包括：A flexible circuit board, characterized in that the flexible circuit board includes:
    膜片，所述膜片的一侧表面设置有凹陷图案，所述凹陷图案内填充有导电材料形成导电线路。Diaphragm, one side surface of the diaphragm is provided with a recessed pattern, and the recessed pattern is filled with conductive material to form a conductive circuit.
  17. 根据权利要求16所述的柔性线路板，其特征在于，所述膜片上设置有树脂涂层，所述凹陷图案贯穿所述树脂涂层。The flexible circuit board according to claim 16, wherein the diaphragm is provided with a resin coating, and the recessed pattern penetrates the resin coating.
  18. 根据权利要求16或17所述的柔性线路板，其特征在于，所述膜片为BT材料膜片。The flexible circuit board according to claim 16 or 17, characterized in that the diaphragm is a BT material diaphragm.
  19. 根据权利要求16所述的柔性线路板，其特征在于，所述导电线路的厚度20μm-50μm。The flexible circuit board according to claim 16, wherein the conductive circuit has a thickness of 20 μm-50 μm.
  20. 根据权利要求18所述的柔性线路板，其特征在于，所述膜片的厚度为0.08mm-0.5mm。The flexible circuit board according to claim 18, wherein the thickness of the diaphragm is 0.08mm-0.5mm.
PCT/CN2023/080447 2022-06-16 2023-03-09 Flexible circuit board and manufacturing method therefor WO2023241123A1 (en)

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Citations (4)

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Publication number Priority date Publication date Assignee Title
CN1859829A (en) * 2006-05-31 2006-11-08 威盛电子股份有限公司 Method for producing circuit board
TW200743421A (en) * 2006-05-11 2007-11-16 Via Tech Inc Method of fabricating a substrate having circuits
US20190088820A1 (en) * 2017-09-15 2019-03-21 Glo Ab Etendue enhancement for light emitting diode subpixels
CN115066086A (en) * 2022-06-16 2022-09-16 深圳Tcl新技术有限公司 Flexible circuit board and preparation method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200743421A (en) * 2006-05-11 2007-11-16 Via Tech Inc Method of fabricating a substrate having circuits
CN1859829A (en) * 2006-05-31 2006-11-08 威盛电子股份有限公司 Method for producing circuit board
US20190088820A1 (en) * 2017-09-15 2019-03-21 Glo Ab Etendue enhancement for light emitting diode subpixels
CN115066086A (en) * 2022-06-16 2022-09-16 深圳Tcl新技术有限公司 Flexible circuit board and preparation method thereof

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