WO2023221529A1

WO2023221529A1 - Packaging structure, packaging method and electronic device

Info

Publication number: WO2023221529A1
Application number: PCT/CN2022/143799
Authority: WO
Inventors: 何大鹏; 曹曦; 于超伟; 梁英; 彭开强
Original assignee: 华为技术有限公司
Priority date: 2022-05-20
Filing date: 2022-12-30
Publication date: 2023-11-23
Also published as: CN117135823A

Abstract

A packaging structure, a packaging method and an electronic device. The packaging structure comprises a high-density printed circuit board (110) and a power supply printed circuit board (120). One side surface of the high-density printed circuit board is provided with a first component (111), and the other side surface thereof is provided with the power supply printed circuit board. The first component is directly arranged on the surface of the high-density printed circuit board to reduce the thickness of the packaging structure. A side surface of the power supply printed circuit board may be provided with a second component (121), and the second component is used for supplying power to the first component. The first component and the second component are integrated in the same packaging structure, so that the integration level of the packaging structure is improved. The side of the high-density printed circuit board provided with the first component is provided with a first protection board (130) for protecting the first component on the surface of the high-density printed circuit board from damage and contamination. A fastening structure (140) passes through the first protection board and the high-density printed circuit board to achieve the fixed connection between the high-density printed circuit board provided with the first component and the first protection board, thereby improving the packaging strength of the packaging structure.

Description

一种封装结构、封装方法以及电子设备A packaging structure, packaging method and electronic equipment

本申请要求于2022年5月20日提交中国国家知识产权局、申请号为202210550660.1、发明名称为“一种封装结构、封装方法以及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on May 20, 2022, with application number 202210550660.1 and the invention title "A packaging structure, packaging method and electronic device", the entire content of which is incorporated by reference. incorporated in this application.

技术领域Technical field

本申请涉及集成电路制造领域，尤其涉及一种封装结构、封装方法以及电子设备。The present application relates to the field of integrated circuit manufacturing, and in particular to a packaging structure, packaging method and electronic equipment.

背景技术Background technique

随着计算机、半导体和通信技术的发展，电子设备中可以设置多种芯片，以实现电子设备的计算或数据通信等功能。具体可以是将多个芯片进行封装，得到封装结构，将封装结构安装于电子设备中，最终实现电子设备的功能。With the development of computers, semiconductors and communication technologies, a variety of chips can be installed in electronic devices to realize functions such as computing or data communication of electronic devices. Specifically, multiple chips may be packaged to obtain a package structure, and the package structure may be installed in an electronic device to finally realize the functions of the electronic device.

在一种封装结构中，可以将半导体芯片(die)贴装到封装基板上，而后将多个贴装有半导体芯片的封装基板通过焊接工艺焊接在印刷电路板(printed circuit board，PCB)上，不同封装基板上的半导体芯片之间通过封装基板以及PCB板实现电连接，参考图1所示，为目前一种封装结构的结构示意图，位于左侧封装基板上的半导体芯片通过左侧的封装基板、下方的PCB板和右侧的封装基板，与右侧封装基板上的半导体芯片电连接。然而这种封装结构存在封装结构的集成度较低的问题。In a packaging structure, semiconductor chips (die) can be mounted on a packaging substrate, and then multiple packaging substrates with semiconductor chips mounted on them are welded to a printed circuit board (PCB) through a welding process. Semiconductor chips on different packaging substrates are electrically connected through the packaging substrate and PCB board. Refer to Figure 1, which is a structural schematic diagram of a current packaging structure. The semiconductor chip on the left packaging substrate passes through the left packaging substrate. , the lower PCB board and the packaging substrate on the right are electrically connected to the semiconductor chip on the right packaging substrate. However, this packaging structure has the problem of low integration level of the packaging structure.

因此，如何得到高集成度的封装结构，是本领域技术人员亟待解决的问题。Therefore, how to obtain a highly integrated packaging structure is an urgent problem for those skilled in the art to solve.

发明内容Contents of the invention

有鉴于此，本申请实施例提供了一种封装结构、封装方法以及电子设备，能够实现封装结构的高集成度。In view of this, embodiments of the present application provide a packaging structure, a packaging method and an electronic device, which can achieve high integration of the packaging structure.

本申请实施例的第一方面，提供了一种封装结构，封装结构包括高密印刷电路板和供电印刷电路板，高密印刷电路板的一侧表面设置有第一元器件，另一侧表面设置有供电印刷电路板，第一元器件直接设置在高密印刷电路板表面实现与高密印刷电路板的电连接，无需在第一元器件和高密印刷电路板之间设置封装基板来实现电连接，从而在节省工艺流程的同时降低封装结构的厚度，此外由于第一元器件和封装基板的封装工艺的不同，封装结构中相邻的第一元器件之间的距离远远小于封装结构中相邻的封装基板之间的距离，因此减少了封装结构的面积浪费，缩短了第一元器件之间的通信路径减少能量损耗。供电印刷电路板的一侧表面可以设置第二元器件，第二元器件可以通过供电印刷电路板和高密印刷电路板实现与第一元器件电连接，用于对第一元器件进供电，将第一元器件和第二元器件集成在同一封装结构中，在提高封装结构的集成度的同时，还保证了第一元器件和第二元器件的连接可靠性，供电印刷电路板的存在可以在一定程度上降低高密印刷电路板的布线复杂度以及电流密集度，提高高密印刷电路板的可靠性。高密印刷电路板设置有第一元器件的一侧具有第一保护板，用于保护高密印刷板表面的第一元器件不受损伤和污染。利用紧固结构贯穿第一保护板和高密印刷电路板，实现设置有第一元器件的高密印刷电路板和第一保护板的固定连接，增强封装结构的封装强度。A first aspect of the embodiment of the present application provides a packaging structure. The packaging structure includes a high-density printed circuit board and a power supply printed circuit board. A first component is provided on one side of the high-density printed circuit board, and a first component is provided on the other surface of the high-density printed circuit board. In the power supply printed circuit board, the first component is directly arranged on the surface of the high-density printed circuit board to achieve electrical connection with the high-density printed circuit board. There is no need to set a packaging substrate between the first component and the high-density printed circuit board to achieve electrical connection, thereby achieving electrical connection between the first component and the high-density printed circuit board. It saves process flow while reducing the thickness of the packaging structure. In addition, due to the difference in packaging processes between the first component and the packaging substrate, the distance between adjacent first components in the packaging structure is much smaller than that between adjacent packages in the packaging structure. The distance between the substrates thus reduces the area waste of the packaging structure, shortens the communication path between the first components and reduces energy loss. A second component can be disposed on one side of the power supply printed circuit board. The second component can be electrically connected to the first component through the power supply printed circuit board and the high-density printed circuit board, and is used to supply power to the first component. The first component and the second component are integrated in the same packaging structure. While improving the integration of the packaging structure, it also ensures the connection reliability of the first component and the second component. The presence of the power supply printed circuit board can Reduce the wiring complexity and current density of high-density printed circuit boards to a certain extent, and improve the reliability of high-density printed circuit boards. The side of the high-density printed circuit board on which the first component is disposed has a first protection plate for protecting the first component on the surface of the high-density printed circuit board from damage and contamination. The fastening structure is used to penetrate the first protective board and the high-density printed circuit board to achieve a fixed connection between the high-density printed circuit board provided with the first component and the first protective board, thereby enhancing the packaging strength of the packaging structure.

在一些可能的实施方式中，所述第一元器件设置于所述高密印刷电路板远离所述供电印刷电路板的一侧表面；In some possible implementations, the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board;

所述高密印刷电路板具有避让开口，在所述避让开口暴露的所述供电印刷电路板上设置有所述第二元器件。The high-density printed circuit board has an escape opening, and the second component is disposed on the power supply printed circuit board exposed by the escape opening.

在本申请实施例中，通过在高密印刷电路板上设置避让开口，并在避让开口内设置第二元器件，能够进一步降低封装结构的整体厚度，有效降低封装结构的体积，实现封装结构的小型化。In the embodiment of the present application, by arranging an escape opening on the high-density printed circuit board and arranging the second component in the escape opening, the overall thickness of the packaging structure can be further reduced, effectively reducing the volume of the packaging structure, and achieving a compact package structure. change.

在一些可能的实施方式中，所述第一元器件设置于所述高密印刷电路板远离所述供电印刷电路板的一侧表面，所述第二元器件设置于所述供电印刷电路板远离所述高密印刷电路板的一侧表面。In some possible implementations, the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board, and the second component is disposed on a side surface of the power supply printed circuit board away from the power supply printed circuit board. One side surface of the high-density printed circuit board.

在本申请实施例中，第一元器件和第二元器件相对设置，这样可以实现高密印刷电路板的一侧表面设置多个第一元器件，并且多个第一元器件之间的间距较短，能够提高在有限的封装面积内的集成度。并且在供电印刷电路板的一侧表面设置多个第二元器件，能够为多个第一元器件提供足够的供电支持。In the embodiment of the present application, the first component and the second component are arranged oppositely, so that multiple first components can be arranged on one side surface of the high-density printed circuit board, and the spacing between the multiple first components is relatively small. Short, it can improve the integration within the limited packaging area. Moreover, multiple second components are arranged on one side surface of the power supply printed circuit board, which can provide sufficient power supply support for the multiple first components.

在一些可能的实施方式中，所述供电印刷电路板的数量为多个，每个供电印刷电路板为对应的第一元器件进行供电。In some possible implementations, there are multiple power supply printed circuit boards, and each power supply printed circuit board supplies power to a corresponding first component.

在本申请实施例中，利用多个供电印刷电路板进行供电，多个供电印刷电路板的特征尺寸可以较小，能够进一步降低封装结构的成本。In the embodiment of the present application, multiple power supply printed circuit boards are used for power supply, and the characteristic sizes of the multiple power supply printed circuit boards can be smaller, which can further reduce the cost of the packaging structure.

在一些可能的实施方式中，还包括：第二保护板；In some possible implementations, it also includes: a second protection plate;

所述第二保护板设置于所述供电印刷电路板远离所述高密印刷电路板的一侧。The second protection board is disposed on the side of the power supply printed circuit board away from the high-density printed circuit board.

在本申请实施例中，利用第二保护板保护设置于在供电印刷电路板远离高密印刷电路板的一侧的器件。In the embodiment of the present application, the second protection board is used to protect the devices provided on the side of the power supply printed circuit board away from the high-density printed circuit board.

在一些可能的实施方式中，若所述高密印刷电路板具有避让开口，在所述避让开口暴露的所述供电印刷电路板上设置有所述第二元器件，还包括：In some possible implementations, if the high-density printed circuit board has an escape opening, the second component is disposed on the power supply printed circuit board exposed by the escape opening, and further includes:

所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置有第三元器件，所述第二保护板用于保护所述第三元器件。A third component is provided on a side surface of the power supply printed circuit board away from the high-density printed circuit board, and the second protection plate is used to protect the third component.

在本申请实施例中，将第三元器件设置于供电印刷电路板远离高密印刷电路板的一侧表面，以在封装结构中集成更多的芯片，提高集成度。In the embodiment of the present application, the third component is disposed on the side surface of the power supply printed circuit board away from the high-density printed circuit board, so as to integrate more chips in the packaging structure and improve the integration level.

在一些可能的实施方式中，所述第一保护板和所述第二保护板分别用于为所述第一元器件和所述第二元器件进行散热。In some possible implementations, the first protection board and the second protection board are used to dissipate heat for the first component and the second component respectively.

在本申请实施例中，第一保护板和第二保护板既能够对第一元器件和第二元器件进行保护，也能够对第一元器件和第二元器件进行散热。In the embodiment of the present application, the first protection board and the second protection board can not only protect the first component and the second component, but also dissipate heat of the first component and the second component.

在一些可能的实施方式中，所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，所述紧固结构贯穿所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板，实现所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板的固定连接。In some possible implementations, the characteristic size of the high-density printed circuit board is equal to the characteristic size of the power supply printed circuit board, and the fastening structure penetrates the first protection plate, the high-density printed circuit board, the The power supply printed circuit board and the second protection board realize the fixed connection of the first protection board, the high-density printed circuit board, the power supply printed circuit board and the second protection board.

在本申请实施例中，第一保护板、高密印刷电路板、供电印刷电路板和第二保护板的固定连接，能够增强封装结构的封装强度，提高封装结构的性能。In the embodiment of the present application, the fixed connection of the first protection board, the high-density printed circuit board, the power supply printed circuit board and the second protection board can enhance the packaging strength of the packaging structure and improve the performance of the packaging structure.

在一些可能的实施方式中，还包括：连接器件；In some possible implementations, it also includes: a connecting device;

所述连接器件设置于所述高密印刷电路板远离所述供电印刷电路板的一侧表面，所述第一保护板具有第一开口，所述第一开口暴露所述连接器件；The connecting device is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board, the first protection plate has a first opening, and the first opening exposes the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，所述连接器件设置于所述供电印刷电路板远离所述高密印刷电路板的一侧表面，所述第二保护板具有第二开口，所述第二开口暴露所述连接器件；When the characteristic size of the high-density printed circuit board is equal to the characteristic size of the power supply printed circuit board, the connecting device is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board, and the second protection device The board has a second opening exposing the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸大于所述供电印刷电路板的特征尺寸，所述连接器件设置于所述高密印刷电路板靠近所述供电印刷电路板的一侧表面，所述第二保护板具有第三开口，所述第三开口暴露所述连接器件。When the characteristic size of the high-density printed circuit board is larger than the characteristic size of the power supply printed circuit board, the connecting device is disposed on a side surface of the high-density printed circuit board close to the power supply printed circuit board, and the second protection device The plate has a third opening exposing the connection means.

在本申请实施例中，连接器件可以设置在高密印刷电路板，也可以设置在供电印刷电路板，不同的设置方式能够为封装结构提供更多的应用场景。In the embodiment of the present application, the connecting device can be arranged on a high-density printed circuit board or a power supply printed circuit board. Different arrangement methods can provide more application scenarios for the packaging structure.

在一些可能的实施方式中，所述第一元器件和所述第一保护板之间还包括导热材料。In some possible implementations, a thermally conductive material is further included between the first component and the first protection plate.

在本申请实施例中，导热材料用于为第一元器件进一步提供散热效果。In the embodiment of the present application, the thermal conductive material is used to further provide a heat dissipation effect for the first component.

在一些可能的实施方式中，还包括：第一支撑结构；In some possible implementations, it also includes: a first support structure;

所述第一支撑结构设置于所述第一保护板和所述高密印刷电路板之间。The first support structure is disposed between the first protection board and the high-density printed circuit board.

在本申请实施例中，第一支撑结构用于支撑第一保护板，避免第一保护板对第一元器件的挤压，还能够实现封装结构的校平以及平面度控制。In the embodiment of the present application, the first support structure is used to support the first protection plate to prevent the first protection plate from squeezing the first component, and can also achieve leveling and flatness control of the packaging structure.

在一些可能的实施方式中，所述高密印刷电路板和所述供电印刷电路板之间还包括粘接材料。In some possible implementations, an adhesive material is further included between the high-density printed circuit board and the power supply printed circuit board.

在本申请实施例中，粘接材料实现高密印刷电路板和供电印刷电路板的紧密固定连接，进一步增加封装结构的刚性，满足封装结构力学和可靠性的要求。In the embodiment of the present application, the adhesive material realizes a tight and fixed connection between the high-density printed circuit board and the power supply printed circuit board, further increasing the rigidity of the packaging structure and meeting the mechanical and reliability requirements of the packaging structure.

在一些可能的实施方式中，所述第一元器件包括半导体芯片和表面贴装器件。In some possible implementations, the first component includes a semiconductor chip and a surface mount device.

在一些可能的实施方式中，所述第二元器件包括供电器件，所述供电器件包括电压调节模块、谐振转换器和电容。In some possible implementations, the second component includes a power supply device, and the power supply device includes a voltage adjustment module, a resonant converter, and a capacitor.

本申请实施例第二方面，提供了一种封装方法，包括：The second aspect of the embodiment of the present application provides a packaging method, including:

在高密印刷电路板的一侧表面设置第一元器件，在所述高密印刷电路板的另一侧设置供电印刷电路板，所述供电印刷电路板的一侧表面设置有第二元器件；所述第二元器件通过所述高密印刷电路板和所述供电印刷电路板实现与所述第一元器件的电连接，用于为所述第一元器件供电；A first component is provided on one side surface of the high-density printed circuit board, a power supply printed circuit board is provided on the other side of the high-density printed circuit board, and a second component is provided on one side surface of the power supply printed circuit board; The second component is electrically connected to the first component through the high-density printed circuit board and the power supply printed circuit board, and is used to power the first component;

在所述高密印刷电路板设置有所述第一元器件的一侧设置第一保护板；设置紧固结构，所述紧固结构贯穿所述第一保护板和所述高密印刷电路板，实现所述高密印刷电路板和所述第一保护板的固定连接。A first protective plate is provided on the side of the high-density printed circuit board where the first component is provided; a fastening structure is provided, and the fastening structure penetrates the first protective plate and the high-density printed circuit board to achieve Fixed connection of the high-density printed circuit board and the first protection board.

在一些可能的实施方式中，在高密印刷电路板的一侧表面设置第一元器件之前，还包括：In some possible implementations, before arranging the first component on one side surface of the high-density printed circuit board, the method further includes:

在所述高密印刷电路板形成避让开口；Form an escape opening in the high-density printed circuit board;

所述在所述高密印刷电路板的另一侧设置供电印刷电路板，所述供电印刷电路板上设置有第二元器件包括：The power supply printed circuit board is provided on the other side of the high-density printed circuit board, and the second component provided on the power supply printed circuit board includes:

所述供电印刷电路板被所述避让开口暴露的一侧表面设置有所述第二元器件。The second component is disposed on a side surface of the power supply printed circuit board exposed by the avoidance opening.

在一些可能的实施方式中，还包括：In some possible implementations, it also includes:

在所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置第三元器件。A third component is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board.

在一些可能的实施方式中，所述第一元器件设置于高密印刷电路板远离所述供电印刷电路板的一侧表面；In some possible implementations, the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board;

在所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置所述第二元器件。The second component is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board.

在一些可能的实施方式中，在设置紧固结构之前，还包括：In some possible implementations, before setting the fastening structure, it also includes:

在所述供电印刷电路板远离所述高密印刷电路板的一侧设置第二保护板。A second protection board is provided on the side of the power supply printed circuit board away from the high-density printed circuit board.

在一些可能的实施方式中，所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，所述设置紧固结构包括：In some possible implementations, the characteristic dimensions of the high-density printed circuit board are equal to the characteristic dimensions of the power supply printed circuit board, and the setting of the fastening structure includes:

所述紧固结构贯穿所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板，实现所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板的固定连接。The fastening structure penetrates the first protective board, the high-density printed circuit board, the power supply printed circuit board and the second protective board to realize the first protective board, the high-density printed circuit board, the Fixed connection between the power supply printed circuit board and the second protection board.

在所述高密印刷电路板远离所述供电印刷电路板的一侧表面设置连接器件，所述第一保护板具有第一开口，所述第一开口暴露所述连接器件；A connecting device is provided on a side surface of the high-density printed circuit board away from the power supply printed circuit board, the first protective plate has a first opening, and the first opening exposes the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，在所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置所述连接器件，所述第二保护板具有第二开口，所述第二开口暴露所述连接器件；When the characteristic size of the high-density printed circuit board is equal to the characteristic size of the power supply printed circuit board, the connecting device is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board, and the second protection device The board has a second opening exposing the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸大于所述供电印刷电路板的特征尺寸，在所述高密印刷电路板靠近所述供电印刷电路板的一侧表面设置所述连接器件，所述第二保护板具有第三开口，所述第三开口暴露所述连接器件。When the characteristic size of the high-density printed circuit board is larger than the characteristic size of the power supply printed circuit board, the connecting device is provided on a side surface of the high-density printed circuit board close to the power supply printed circuit board, and the second protection device The plate has a third opening exposing the connection means.

在一些可能的实施方式中，在所述高密印刷电路板设置有所述第一元器件的一侧设置第一保护板之前，还包括：In some possible implementations, before arranging the first protection board on the side of the high-density printed circuit board where the first component is disposed, the method further includes:

在所述第一元器件远离所述高密印刷电路板的一侧表面覆盖导热材料。A surface of the first component away from the high-density printed circuit board is covered with a thermally conductive material.

在一些可能的实施方式中，在所述高密印刷电路板设置有所述第一元器件的一侧设置第一保护板之前，还包括：In some possible implementations, before arranging the first protection board on the side of the high-density printed circuit board where the first component is arranged, the method further includes:

在所述高密印刷电路板设置所述第一元器件的一侧设置第一支撑结构。A first support structure is provided on the side of the high-density printed circuit board on which the first component is provided.

在所述高密印刷电路板和所述供电印刷电路板之间填充粘接材料。An adhesive material is filled between the high-density printed circuit board and the power supply printed circuit board.

本申请实施例的第三方面，提供了一种电子设备，所述电子设备包括如上述实施例所述的封装结构。A third aspect of the embodiment of the present application provides an electronic device, which includes the packaging structure as described in the above embodiment.

从以上技术方案可以看出，本申请实施例具有以下优点：It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

本申请实施例提供一种封装结构，封装结构包括高密印刷电路板和供电印刷电路板，高密印刷电路板的一侧表面设置有第一元器件，另一侧表面设置有供电印刷电路板，第一元器件直接设置在高密印刷电路板表面实现与高密印刷电路板的电连接，无需在第一元器件和高密印刷电路板之间设置封装基板来实现电连接，从而在节省工艺流程的同时降低封装结构的厚度，此外由于第一元器件和封装基板的封装工艺的不同，封装结构中相邻的第一元器件之间的距离远远小于封装结构中相邻的封装基板之间的距离，因此减少了封装结构的面积浪费，缩短了第一元器件之间的通信路径减少能量损耗。供电印刷电路板的一侧表面可以设置第二元器件，第二元器件可以通过供电印刷电路板和高密印刷电路板实现与第一元器件电连接，用于对第一元器件进供电，将第一元器件和第二元器件集成在同一封装结构中，在提高封装结构的集成度的同时，还保证了第一元器件和第二元器件的连接可靠性，供电印刷电路板的存在可以在一定程度上降低高密印刷电路板的布线复杂度以及电流密集度，提高高密印刷电路板的可靠性。高密印刷电路板设置有第一元器件的一侧具有第一保护板，用于保护高密印刷板表面的第一元器件不受损伤和污染。利用紧固结构贯穿第一保护板和高密印刷电路板，实现设置有第一元器件的高密印刷电路板和第一保护板的固定连接，增强封装结构的封装强度。Embodiments of the present application provide a packaging structure. The packaging structure includes a high-density printed circuit board and a power supply printed circuit board. A first component is provided on one side of the high-density printed circuit board, and a power supply printed circuit board is provided on the other side surface. A component is directly placed on the surface of the high-density printed circuit board to achieve electrical connection with the high-density printed circuit board. There is no need to set a packaging substrate between the first component and the high-density printed circuit board to achieve electrical connection, thereby saving process flow and reducing costs. The thickness of the packaging structure. In addition, due to the difference in packaging processes between the first component and the packaging substrate, the distance between adjacent first components in the packaging structure is much smaller than the distance between adjacent packaging substrates in the packaging structure. Therefore, the area waste of the packaging structure is reduced, and the communication path between the first components is shortened and energy loss is reduced. A second component can be disposed on one side of the power supply printed circuit board. The second component can be electrically connected to the first component through the power supply printed circuit board and the high-density printed circuit board, and is used to supply power to the first component. The first component and the second component are integrated in the same packaging structure. While improving the integration of the packaging structure, it also ensures the connection reliability of the first component and the second component. The presence of the power supply printed circuit board can Reduce the wiring complexity and current density of high-density printed circuit boards to a certain extent, and improve the reliability of high-density printed circuit boards. The side of the high-density printed circuit board on which the first component is disposed has a first protection plate for protecting the first component on the surface of the high-density printed circuit board from damage and contamination. The fastening structure is used to penetrate the first protective board and the high-density printed circuit board to achieve a fixed connection between the high-density printed circuit board provided with the first component and the first protective board, thereby enhancing the packaging strength of the packaging structure.

附图说明Description of the drawings

为了清楚地理解本申请的具体实施方式，下面将描述本申请具体实施方式时用到的附图做一简要说明。显而易见地，这些附图仅是本申请的部分实施例。In order to clearly understand the specific embodiments of the present application, a brief description of the drawings used in describing the specific embodiments of the present application will be given below. Obviously, these drawings are only part of the embodiments of the present application.

图1为一种封装结构的结构示意图；Figure 1 is a schematic structural diagram of a packaging structure;

图2-图14为本申请实施例提供的多种封装结构的结构示意图；Figures 2-14 are structural schematic diagrams of various packaging structures provided by embodiments of the present application;

图15为本申请实施例提供的一种封装方法的流程示意图；Figure 15 is a schematic flow chart of a packaging method provided by an embodiment of the present application;

图16-27为本申请实施例根据封装方法制造封装结构的结构示意图。Figures 16-27 are structural schematic diagrams of a packaging structure manufactured according to a packaging method according to an embodiment of the present application.

具体实施方式Detailed ways

本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、***、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second", "third", "fourth", etc. (if present) in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects without necessarily using Used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments described herein can be practiced in sequences other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus that encompasses a series of steps or units and need not be limited to those explicitly listed. Those steps or elements may instead include other steps or elements not expressly listed or inherent to the process, method, product or apparatus.

本申请结合示意图进行详细描述，在详述本申请实施例时，为便于说明，表示器件结构的剖面图会不依一般比例作局部放大，而且所述示意图只是示例，其在此不应限制本申请保护的范围。此外，在实际制作中应包含长度、宽度及深度的三维空间尺寸。The present application will be described in detail with reference to schematic diagrams. When describing the embodiments of the present application in detail, for the convenience of explanation, the cross-sectional diagrams showing the device structure will be partially enlarged according to the general scale, and the schematic diagrams are only examples, which shall not limit the present application. scope of protection. In addition, the three-dimensional dimensions of length, width and depth should be included in actual production.

目前，随着计算机、半导体和通信技术的发展，电子设备中可以设置多种芯片，以实现电子设备的计算或数据通信等功能。具体可以是将多个芯片进行封装，得到封装结构，将封装结构安装于电子设备中，最终实现电子设备的功能。At present, with the development of computers, semiconductors and communication technologies, a variety of chips can be installed in electronic devices to realize functions such as computing or data communication of electronic devices. Specifically, multiple chips may be packaged to obtain a package structure, and the package structure may be installed in an electronic device to finally realize the functions of the electronic device.

在一种封装结构中，可以将半导体芯片(die)贴装到封装基板上，而后将多个贴装有半导体芯片的封装基板通过焊接工艺焊接在印刷电路板(printed circuit board，PCB)上，不同封装基板上的半导体芯片之间通过封装基板以及PCB板实现电连接，参考图1所示，为目前一种封装结构的结构示意图，位于左侧封装基板上的半导体芯片通过左侧的封装基板、下方的PCB板和右侧的封装基板，与右侧封装基板上的半导体芯片电连接，这就导致位于不同的封装基板上的半导体芯片通信路径较长。由于大尺寸封装基板制造较为困难，因此多个半导体芯片需要设置于多个封装基板上，封装基板之间的距离决定了封装结构的集成度，而当前封装基板之间的距离最小范围为0.9～1毫米，远远大于同一封装基板上相邻两个半导体芯片之间的距离，也就是说，当前的封装结构在有限的面积内，不能集成更多的半导体芯片。此外，封装基板上的半导体芯片通过PCB板实现与供电器件的电连接，以便实现供电器件对半导体芯片的供电，但是受限于PCB板的面积，无法设置更多的供电器件。因此这种封装结构存在封装结构无法设置较多的半导体芯片或供电器件的问题，封装结构的集成度较低。In a packaging structure, semiconductor chips (die) can be mounted on a packaging substrate, and then multiple packaging substrates with semiconductor chips mounted on them are welded to a printed circuit board (PCB) through a welding process. Semiconductor chips on different packaging substrates are electrically connected through the packaging substrate and PCB board. Refer to Figure 1, which is a structural schematic diagram of a current packaging structure. The semiconductor chip on the left packaging substrate passes through the left packaging substrate. , the lower PCB board and the packaging substrate on the right are electrically connected to the semiconductor chip on the right packaging substrate, which results in a longer communication path for the semiconductor chips located on different packaging substrates. Since it is difficult to manufacture large-size packaging substrates, multiple semiconductor chips need to be placed on multiple packaging substrates. The distance between packaging substrates determines the integration level of the packaging structure. Currently, the minimum distance between packaging substrates ranges from 0.9 to 1 mm, which is much larger than the distance between two adjacent semiconductor chips on the same packaging substrate. In other words, the current packaging structure cannot integrate more semiconductor chips within a limited area. In addition, the semiconductor chip on the packaging substrate is electrically connected to the power supply device through the PCB board so that the power supply device can supply power to the semiconductor chip. However, due to the limited area of the PCB board, more power supply devices cannot be installed. Therefore, this packaging structure has the problem that the packaging structure cannot be equipped with more semiconductor chips or power supply devices, and the integration level of the packaging structure is low.

在另一种封装结构中，采用集成扇出型封装(InFO)技术，不采用封装基板和PCB板，将半导体芯片和供电器件直接纵向焊接，实现半导体芯片和供电器件的电连接，但是这种方案良率较低，无法在产业上大规模应用。In another packaging structure, the integrated fan-out packaging (InFO) technology is used, without using the packaging substrate and PCB board. The semiconductor chip and the power supply device are directly welded vertically to realize the electrical connection between the semiconductor chip and the power supply device. However, this The solution yield is low and cannot be applied on a large scale in industry.

基于此，本申请实施例提供一种封装结构，封装结构包括高密印刷电路板和供电印刷电路板，高密印刷电路板的一侧表面设置有第一元器件，另一侧表面设置有供电印刷电路板，第一元器件直接设置在高密印刷电路板表面实现与高密印刷电路板的电连接，无需在第一元器件和高密印刷电路板之间设置封装基板来实现电连接，从而在节省工艺流程的同时降低封装结构的厚度，此外由于第一元器件和封装基板的封装工艺的不同，封装结构中相邻的第一元器件之间的距离远远小于封装结构中相邻的封装基板之间的距离，因此减少了封装结构的面积浪费，缩短了第一元器件之间的通信路径减少能量损耗。供电印刷电路板的一侧表面可以设置第二元器件，第二元器件可以通过供电印刷电路板和高密印刷电路板实现与第一元器件电连接，用于对第一元器件进供电，将第一元器件和第二元器件集成在同一封装结构中，在提高封装结构的集成度的同时，还保证了第一元器件和第二元器件的连接可靠性，供电印刷电路板的存在可以在一定程度上降低高密印刷电路板的布线复杂度以及电流密集度，提高高密印刷电路板的可靠性。高密印刷电路板设置有第一元器件的一侧具有第一保护板，用于保护高密印刷板表面的第一元器件不受损伤和污染。利用紧固结构贯穿第一保护板和高密印刷电路板，实现设置有第一元器件的高密印刷电路板和第一保护板的固定连接，增强封装结构的封装强度。Based on this, embodiments of the present application provide a packaging structure. The packaging structure includes a high-density printed circuit board and a power supply printed circuit board. A first component is provided on one side of the high-density printed circuit board, and a power supply printed circuit is provided on the other side surface. board, the first component is directly placed on the surface of the high-density printed circuit board to achieve electrical connection with the high-density printed circuit board. There is no need to set a packaging substrate between the first component and the high-density printed circuit board to achieve electrical connection, thereby saving process flow. while reducing the thickness of the packaging structure. In addition, due to the difference in packaging processes between the first component and the packaging substrate, the distance between adjacent first components in the packaging structure is much smaller than that between adjacent packaging substrates in the packaging structure. distance, thus reducing the area waste of the packaging structure, shortening the communication path between the first components and reducing energy loss. A second component can be disposed on one side of the power supply printed circuit board. The second component can be electrically connected to the first component through the power supply printed circuit board and the high-density printed circuit board, and is used to supply power to the first component. The first component and the second component are integrated in the same packaging structure. While improving the integration of the packaging structure, it also ensures the connection reliability of the first component and the second component. The presence of the power supply printed circuit board can Reduce the wiring complexity and current density of high-density printed circuit boards to a certain extent, and improve the reliability of high-density printed circuit boards. The side of the high-density printed circuit board on which the first component is disposed has a first protection plate for protecting the first component on the surface of the high-density printed circuit board from damage and contamination. The fastening structure is used to penetrate the first protective board and the high-density printed circuit board to achieve a fixed connection between the high-density printed circuit board provided with the first component and the first protective board, thereby enhancing the packaging strength of the packaging structure.

为使本申请的上述目的、特征和优点能够更加明显易懂，下面结合附图对本申请的具体实施方式做详细的说明。In order to make the above objects, features and advantages of the present application more obvious and easy to understand, the specific implementation modes of the present application will be described in detail below with reference to the accompanying drawings.

参考图2-图13所示，为本申请实施例提供的多种封装结构的结构示意图。本申请实施例提供的封装结构包括高密印刷电路板110、供电印刷电路板120、第一保护板130和紧固结构140。Refer to Figures 2 to 13, which are schematic structural diagrams of various packaging structures provided by embodiments of the present application. The packaging structure provided by the embodiment of the present application includes a high-density printed circuit board 110, a power supply printed circuit board 120, a first protection plate 130 and a fastening structure 140.

为了便于说明，本申请实施例中将第一保护板作为封装结构的下方，其他部件设置于第一保护板的上方进行举例说明。实际上，封装结构的“上”、“下”与封装结构的放置方向相关，在其他实施例中，第一保护板可以朝上放置，则其他部件设置于第一保护板的下方。For convenience of explanation, in the embodiment of the present application, the first protection plate is placed below the packaging structure, and other components are arranged above the first protection plate for illustration. In fact, the "top" and "bottom" of the packaging structure are related to the placement direction of the packaging structure. In other embodiments, the first protection plate can be placed upward, and other components are arranged below the first protection plate.

在本申请实施例中，高密印刷电路板110可以为一层或多层叠压的印刷电路板。在高密印刷电路板110的一侧表面设置有第一元器件111，参考图2-图7所示，图2为沿着图3所示的封装结构的俯视图的AA方向进行截面得到的，图4为沿着图5所示的封装结构的俯视图的BB方向进行截面得到的，图6为沿着图7所示的封装结构的俯视图的CC方向进行截面得到的。第一元器件111可以包括半导体芯片和表面贴装器件(surface mounting devices，SMD)，其中，半导体芯片可以是内存芯片或大尺寸芯片等，也就是说，高密印刷电路板110的表面能够直接设置大尺寸芯片，实现大尺寸芯片与高密印刷电路板110的直接电连接，无需在大尺寸芯片和高密印刷电路板之间设置封装基板来实现电连接，既能节省工艺流程，也能降低封装结构的厚度。表面贴装器件可以是具体可以是电容器件、电阻器件和电感器件中的至少一种，满足封装结构的个性化需求。表面贴装器件可以采用表面贴装技术(surface mounting technology，SMT)设置于高密印刷电路板110的表面。在高密印刷电路板110中，设置有微带或铜皮走线，实现高密印刷电路板110的电引出。In this embodiment of the present application, the high-density printed circuit board 110 may be a one- or multi-layer laminated printed circuit board. A first component 111 is provided on one side surface of the high-density printed circuit board 110. Refer to Figures 2 to 7. Figure 2 is a cross-section along the AA direction of the top view of the packaging structure shown in Figure 3. Figure 4 is a cross-section along the BB direction of the top view of the packaging structure shown in FIG. 5 , and FIG. 6 is a cross-section along the CC direction of the top view of the packaging structure shown in FIG. 7 . The first component 111 may include a semiconductor chip and surface mounting devices (SMD). The semiconductor chip may be a memory chip or a large-size chip. That is to say, the surface of the high-density printed circuit board 110 can be directly mounted Large-size chips realize direct electrical connection between the large-size chip and the high-density printed circuit board 110. There is no need to set up a packaging substrate between the large-size chip and the high-density printed circuit board to achieve electrical connection. This can not only save the process flow, but also reduce the packaging structure. thickness of. The surface mount device may specifically be at least one of a capacitor device, a resistor device, and an inductor device to meet the individual needs of the packaging structure. The surface mount device can be disposed on the surface of the high-density printed circuit board 110 using surface mounting technology (SMT). In the high-density printed circuit board 110, microstrip or copper traces are provided to realize electrical extraction from the high-density printed circuit board 110.

在本申请实施例中，高密印刷电路板110的一侧表面设置有第一元器件111，另一侧表面设置有供电印刷电路板120，即供电印刷电路板120设置于高密印刷电路板110未设置第一元器件111的一侧表面。具体的，供电印刷电路板120和高密印刷电路板110可以利用烧结或焊接的方式结合，以实现供电印刷电路板120和高密印刷电路板110之间的电连接。供电印刷电路板120的一侧表面设置有第二元器件121，参考图2、图4或图6所示。第二元器件121包括供电器件，供电器件包括电压调节模块、谐振转换器和电容。第二元器件121可以通过供电印刷电路板120和高密印刷电路板110实现与第一元器件111的电连接，以便第二元器件121为第一元器件进行供电。In the embodiment of the present application, the first component 111 is provided on one side surface of the high-density printed circuit board 110, and the power supply printed circuit board 120 is provided on the other side surface. That is, the power supply printed circuit board 120 is provided on the high-density printed circuit board 110. One side surface of the first component 111 is provided. Specifically, the power supply printed circuit board 120 and the high-density printed circuit board 110 can be combined by sintering or welding to achieve electrical connection between the power supply printed circuit board 120 and the high-density printed circuit board 110 . A second component 121 is provided on one side surface of the power supply printed circuit board 120, as shown in FIG. 2, FIG. 4 or FIG. 6. The second component 121 includes a power supply device, and the power supply device includes a voltage adjustment module, a resonant converter, and a capacitor. The second component 121 can be electrically connected to the first component 111 through the power supply printed circuit board 120 and the high-density printed circuit board 110, so that the second component 121 supplies power to the first component.

也就是说，本申请实施例中的高密印刷电路板110的一侧表面直接设置第一元器件111，第一元器件111之间的距离较近，因此减少了封装结构的面积浪费，缩短了第一元器件111之间的通信路径减少能量损耗。并且供电印刷电路板120的一侧表面可以设置第二元器件121，第二元器件121对第一元器件111进供电，将第一元器件111和第二元器件121集成在同一封装结构中，在提高封装结构的集成度的同时，还保证了第一元器件111和第二元器件121的连接可靠性，此外，在第二元器件121向第一元器件111进行供电时，供电印刷电路板120可以在一定程度上降低高密印刷电路板110的布线复杂度以及电流密集度，提高高密印刷电路板110的可靠性。That is to say, the first component 111 is directly disposed on one side surface of the high-density printed circuit board 110 in the embodiment of the present application, and the distance between the first components 111 is relatively close, thus reducing the area waste of the packaging structure and shortening the time. The communication path between the first components 111 reduces energy loss. Moreover, a second component 121 can be provided on one side surface of the power supply printed circuit board 120, and the second component 121 supplies power to the first component 111, so that the first component 111 and the second component 121 are integrated into the same packaging structure. , while improving the integration of the packaging structure, it also ensures the connection reliability of the first component 111 and the second component 121. In addition, when the second component 121 supplies power to the first component 111, the power supply prints The circuit board 120 can reduce the wiring complexity and current density of the high-density printed circuit board 110 to a certain extent, and improve the reliability of the high-density printed circuit board 110 .

在本申请的实施例中，第二元器件121可以设置在供电印刷电路板120的任意一侧表面，参考图2、图4或图6所示，下面进行具体介绍：In the embodiment of the present application, the second component 121 can be disposed on any side surface of the power supply printed circuit board 120, as shown in Figure 2, Figure 4 or Figure 6, which will be introduced in detail below:

作为一种可能的实现方式，参考图2或图4所示，第一元器件111设置于高密印刷电路板110远离供电印刷电路板120的一侧表面，第二元器件121设置于供电印刷电路板120远离高密印刷电路板110的一侧表面，也就是说，若第一元器件111设置于高密印刷电路板110的下侧，则第二元器件121设置于供电印刷电路板120的上侧，即第一元器件111和第二元器件121相对设置。这样可以实现高密印刷电路板110的一侧表面设置多个第一元器件111，并且多个第一元器件111之间的间距较短，能够提高在有限的封装面积内的集成度。并且在供电印刷电路板120的一侧表面设置多个第二元器件121，能够为多个第一元器件111提供足够的供电支持。As a possible implementation manner, with reference to Figure 2 or Figure 4, the first component 111 is disposed on a side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120, and the second component 121 is disposed on the power supply printed circuit board 120. The side surface of the board 120 is away from the high-density printed circuit board 110. That is to say, if the first component 111 is disposed on the lower side of the high-density printed circuit board 110, the second component 121 is disposed on the upper side of the power supply printed circuit board 120. , that is, the first component 111 and the second component 121 are arranged oppositely. In this way, multiple first components 111 can be arranged on one side surface of the high-density printed circuit board 110, and the spacing between the multiple first components 111 is short, which can improve the integration within a limited packaging area. Moreover, multiple second components 121 are provided on one side surface of the power supply printed circuit board 120, which can provide sufficient power supply support for the multiple first components 111.

作为另一种可能的实现方式，参考图6所示，第一元器件111设置于高密印刷电路板110远离供电印刷电路板120的一侧表面，高密印刷电路板110具有避让开口112，避让开口112暴露供电印刷电路板120靠近高密印刷电路板110的一侧表面，第二元器件121设置在避让开口112暴露的供电印刷电路板120的表面，也就是说，第一元器件111和第二元器件121设置在供电印刷电路板120的同一侧。通过在高密印刷电路板110上设置避让开口112，并在避让开口112内设置第二元器件121，能够进一步降低封装结构的整体厚度，有效降低封装结构的体积，实现封装结构的小型化。As another possible implementation, as shown in FIG. 6 , the first component 111 is disposed on a side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120 . The high-density printed circuit board 110 has an escape opening 112 . 112 exposes the side surface of the power supply printed circuit board 120 close to the high-density printed circuit board 110, and the second component 121 is disposed on the surface of the power supply printed circuit board 120 exposed by the avoidance opening 112. That is to say, the first component 111 and the second The component 121 is provided on the same side of the power supply printed circuit board 120 . By arranging the escape opening 112 on the high-density printed circuit board 110 and arranging the second component 121 in the escape opening 112, the overall thickness of the packaging structure can be further reduced, the volume of the packaging structure can be effectively reduced, and the packaging structure can be miniaturized.

也就是说，第二元器件121既可以设置在供电印刷电路板120远离高密印刷电路板110的一侧，也可以设置在供电印刷电路板120靠近高密印刷电路板110的一侧，为封装结构的第二元器件的设置提供更多的可能性，满足封装结构的个性化需求，以拓宽封装结构的应用场景。That is to say, the second component 121 can be disposed on the side of the power supply printed circuit board 120 away from the high-density printed circuit board 110, or can be disposed on the side of the power supply printed circuit board 120 close to the high-density printed circuit board 110, which is a package structure. The setting of the second component provides more possibilities to meet the personalized needs of the packaging structure to broaden the application scenarios of the packaging structure.

在本申请的实施例中，在高密印刷电路板110设置有第一元器件111的一侧设置有第一保护板130，参考图2-图7所示，第一保护板130用于保护第一元器件111不受污染和损伤。第一保护板130还可以具有散热功能，即第一保护板130可以选用导热性能良好的材料，以便对第一元器件111进行散热。In the embodiment of the present application, a first protection board 130 is provided on the side of the high-density printed circuit board 110 where the first component 111 is provided. Referring to FIGS. 2-7 , the first protection board 130 is used to protect the first component 111 . One component 111 is protected from contamination and damage. The first protection plate 130 may also have a heat dissipation function, that is, the first protection plate 130 may be made of a material with good thermal conductivity to dissipate heat from the first component 111 .

在本申请的实施例中，紧固结构140贯穿第一保护板130和高密印刷电路板110，实现设置第一元器件111的高密印刷电路板110和第一保护板130的固定连接，相较于将第一元器件设置于封装基板，而后封装基板焊接至印刷电路板的封装结构而言，直接利用紧固结构140实现高密印刷电路板110和第一保护板130的固定连接，使得第一元器件111能够更加稳固在高密印刷电路板110的表面，进一步增强封装结构的封装强度。具体的，紧固结构140可以是紧固螺钉。In the embodiment of the present application, the fastening structure 140 penetrates the first protection plate 130 and the high-density printed circuit board 110 to achieve a fixed connection between the high-density printed circuit board 110 and the first protection plate 130 on which the first component 111 is provided. Compared with For a packaging structure in which the first component is disposed on the packaging substrate, and then the packaging substrate is welded to the printed circuit board, the fastening structure 140 is directly used to achieve a fixed connection between the high-density printed circuit board 110 and the first protection plate 130, so that the first The component 111 can be more firmly fixed on the surface of the high-density printed circuit board 110, further enhancing the packaging strength of the packaging structure. Specifically, the fastening structure 140 may be a fastening screw.

也就是说，本申请实施例提供的封装结构，直接在高密印刷电路板110的表面设置多个第一元器件111，利用紧固结构140使得第一保护板130和高密印刷电路板110固定连接，在提高封装结构的集成度的同时增强封装结构的封装强度，提高封装结构的性能，并且规避了对封装基板的需求，能够避免封装基板的供应难题。That is to say, the packaging structure provided by the embodiment of the present application directly sets a plurality of first components 111 on the surface of the high-density printed circuit board 110, and uses the fastening structure 140 to fixedly connect the first protection plate 130 and the high-density printed circuit board 110. , while improving the integration of the packaging structure, it also enhances the packaging strength of the packaging structure, improves the performance of the packaging structure, and avoids the need for packaging substrates, and can avoid the supply problem of packaging substrates.

在本申请的实施例中，供电印刷电路板120的数量可以是一个，也可以是多个，为封装结构提供了更多结构的可能性，满足封装结构的多种场景需求，参考图2-图13所示，下面进行具体介绍：In the embodiment of the present application, the number of power supply printed circuit boards 120 can be one or multiple, which provides more structural possibilities for the packaging structure and meets the needs of various scenarios of the packaging structure. Refer to Figure 2- As shown in Figure 13, detailed introduction is given below:

作为一种可能的实现方式，供电印刷电路板120的数量为一个，参考图2、图3、图8-图10、图12-图14所示，图8为沿着图9所示的封装结构的俯视图的DD方向进行截面得到的，可以在完整的一个供电印刷电路板120上设置多个第二元器件121，以便第二元器件121为第一元器件111进行供电，利用一个完整的供电印刷电路板120既能够为多个第二元器件121提供稳定的支撑作用，还能够与高密印刷电路板110结合后获得刚性较强的封装结构。As a possible implementation, the number of the power supply printed circuit board 120 is one. Refer to Figures 2, 3, 8-10, 12-14. Figure 8 is a package along the lines shown in Figure 9. A cross-section in the DD direction of the top view of the structure can be obtained. Multiple second components 121 can be provided on a complete power supply printed circuit board 120, so that the second component 121 supplies power to the first component 111. Using a complete The power supply printed circuit board 120 can not only provide stable support for the plurality of second components 121, but can also be combined with the high-density printed circuit board 110 to obtain a highly rigid packaging structure.

作为一种示例，供电印刷电路板120的特征尺寸可以和高密印刷电路板110的特征尺寸相同，即供电印刷电路板120的特征尺寸可以等于高密印刷电路板110的特征尺寸，这样供电印刷电路板120能够为高密印刷电路板110提供较强的支撑作用，避免高密印刷电路板110的断裂，能够进一步增强封装结构的刚性，参考图2、图8、图12或图13所示。As an example, the characteristic dimensions of the power supply printed circuit board 120 may be the same as the characteristic dimensions of the high-density printed circuit board 110 , that is, the characteristic dimensions of the power supply printed circuit board 120 may be equal to the characteristic dimensions of the high-density printed circuit board 110 , such that the power supply printed circuit board 120 can provide strong support for the high-density printed circuit board 110, avoid breakage of the high-density printed circuit board 110, and further enhance the rigidity of the packaging structure, as shown in Figure 2, Figure 8, Figure 12 or Figure 13.

当供电印刷电路板120的特征尺寸可以和高密印刷电路板110的特征尺寸相同时，紧固结构140可以贯穿第一保护板130、高密印刷电路板110和供电印刷电路板120，以实现第一保护板130、高密印刷电路板110和供电印刷电路板120的固定连接，在提高封装结构刚性的同时提供更为稳定紧固的封装结构。When the characteristic dimensions of the power supply printed circuit board 120 may be the same as the characteristic dimensions of the high-density printed circuit board 110, the fastening structure 140 may penetrate the first protection plate 130, the high-density printed circuit board 110 and the power supply printed circuit board 120 to achieve the first The fixed connection of the protection board 130, the high-density printed circuit board 110 and the power supply printed circuit board 120 improves the rigidity of the packaging structure and provides a more stable and fastening packaging structure.

作为另一种示例，供电印刷电路板120的特征尺寸可以和高密印刷电路板110的特征尺寸不同，例如供电印刷电路板120的特征尺寸可以小于高密印刷电路板110的特征尺寸，参考图4或图14所示。尺寸较大的供电印刷电路板120的价格较为昂贵，因此可以采用特征尺寸稍小于高密印刷电路板110的特征尺寸的供电印刷电路板120，既能够为高密印刷电路板110提供支撑作用，还能够降低封装结构的成本。As another example, the characteristic dimensions of the power supply printed circuit board 120 may be different from the characteristic dimensions of the high-density printed circuit board 110 . For example, the characteristic dimensions of the power supply printed circuit board 120 may be smaller than the characteristic dimensions of the high-density printed circuit board 110 . Refer to FIG. 4 or As shown in Figure 14. The power supply printed circuit board 120 with a larger size is relatively expensive, so a power supply printed circuit board 120 with a characteristic size slightly smaller than that of the high-density printed circuit board 110 can be used, which can not only provide support for the high-density printed circuit board 110, but also Reduce the cost of packaging structures.

作为另一种可能的实现方式，供电印刷电路板120的数量为多个，参考图4或图11所示，可以在多个供电印刷电路板120上分别设置多个第二元器件121，以便每个供电印刷电路板120上的第二元器件121都能为对应的第一元器件111进行供电，利用多个供电印刷电路板120进行供电，多个供电印刷电路板120的特征尺寸可以较小，能够进一步降低封装结构的成本。As another possible implementation, the number of power supply printed circuit boards 120 is multiple. Referring to FIG. 4 or FIG. 11 , multiple second components 121 can be respectively provided on multiple power supply printed circuit boards 120 so that The second component 121 on each power supply printed circuit board 120 can power the corresponding first component 111. Multiple power supply printed circuit boards 120 are used to provide power. The characteristic sizes of the multiple power supply printed circuit boards 120 can be smaller. Small, which can further reduce the cost of the packaging structure.

作为一种示例，当第一元器件111设置于高密印刷电路板110远离供电印刷电路板120的一侧表面，第二元器件121设置于供电印刷电路板120远离高密印刷电路板110的一侧表面时，每个供电印刷电路板120可以和高密印刷电路板120上的第一元器件111正对，参考图4所示，以实现利用最小的供电路径对第一元器件111进行供电，避免供电损耗，提高封装结构的整体性能。As an example, when the first component 111 is disposed on the side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120 , the second component 121 is disposed on the side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110 When on the surface, each power supply printed circuit board 120 can be directly opposite to the first component 111 on the high-density printed circuit board 120, as shown in FIG. 4, so as to realize power supply to the first component 111 using the smallest power supply path to avoid power supply loss and improve the overall performance of the packaging structure.

作为另一种示例，当第二元器件121设置于高密印刷电路板110的避让开口112内时，针对位于高密印刷电路板110的不同区域的第一元器件111，可以设置对应的供电印刷电路板120。供电印刷电路板120的尺寸范围覆盖多个第一元器件111所在的区域，这样可以保证供电印刷电路板120的电流可以均匀分配至多个第一元器件111。As another example, when the second component 121 is disposed in the escape opening 112 of the high-density printed circuit board 110 , corresponding power supply printed circuits may be provided for the first components 111 located in different areas of the high-density printed circuit board 110 Plate 120. The size range of the power supply printed circuit board 120 covers the area where the multiple first components 111 are located, which ensures that the current of the power supply printed circuit board 120 can be evenly distributed to the multiple first components 111 .

在本申请的实施例中，封装结构还可以在供电印刷电路板120远离高密印刷电路板110的一侧设置第二保护板150，参考图8-图14所示，利用第二保护板150保护设置于在供电印刷电路板120远离高密印刷电路板110的一侧的器件。In the embodiment of the present application, the packaging structure can also be provided with a second protection plate 150 on the side of the power supply printed circuit board 120 away from the high-density printed circuit board 110. As shown in FIGS. 8-14, the second protection plate 150 is used to protect A device disposed on a side of the power supply printed circuit board 120 away from the high-density printed circuit board 110 .

作为一种示例，当第一元器件111设置于高密印刷电路板110远离供电印刷电路板120的一侧表面，第二元器件121设置于供电印刷电路板120远离高密印刷电路板110的一侧表面时，第二保护板150用于保护设置于在供电印刷电路板120远离高密印刷电路板110的一侧的第二元器件121不受污染和损伤，参考图8所示。第二保护板150还可以具有散热功能，即第二保护板150可以选用导热性能良好的材料，以便对第二元器件121进行散热。As an example, when the first component 111 is disposed on the side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120 , the second component 121 is disposed on the side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110 On the surface, the second protection plate 150 is used to protect the second component 121 disposed on the side of the power supply printed circuit board 120 away from the high-density printed circuit board 110 from contamination and damage, as shown in FIG. 8 . The second protection plate 150 may also have a heat dissipation function, that is, the second protection plate 150 may be made of a material with good thermal conductivity to dissipate heat from the second component 121 .

作为另一种示例，当第二元器件121设置于高密印刷电路板110的避让开口112内时，可以将第三元器件113设置于供电印刷电路板120远离高密印刷电路板110的一侧表面，以在封装结构中集成更多的芯片，提高集成度，第二保护板150可以用于保护设置于在供电印刷电路板120远离高密印刷电路板110的一侧的第三元器件113，参考图12或图13所示。第三元器件113可以包括表面贴装器件，具体可以将表面贴装器件设置在供电印刷电路板120远离高密印刷电路板110的一侧表面，表面贴装器件高度较低，不会额外增加整个封装结构的体积。As another example, when the second component 121 is disposed in the avoidance opening 112 of the high-density printed circuit board 110 , the third component 113 can be disposed on a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110 , in order to integrate more chips in the package structure and improve the integration level, the second protection plate 150 can be used to protect the third component 113 provided on the side of the power supply printed circuit board 120 away from the high-density printed circuit board 110. Refer to As shown in Figure 12 or Figure 13. The third component 113 may include a surface mount device. Specifically, the surface mount device may be disposed on a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110. The height of the surface mount device is low and does not increase the overall height of the printed circuit board. The volume of the package structure.

在本申请的实施例中，可以利用紧固结构140贯穿第一保护板130、高密印刷电路板110和第二保护板150，参考图10所示，实现第一保护板130、高密印刷电路板110和第二保护板150的固定连接，能够增强封装结构的封装强度，提高封装结构的性能。进一步的，当供电印刷电路板120的特征尺寸可以和高密印刷电路板110的特征尺寸相同时，紧固结构140可以同时贯穿第一保护板130、高密印刷电路板110、供电印刷电路板120和第二保护板150，进一步增大封装结构的封装强度。In the embodiment of the present application, the fastening structure 140 can be used to penetrate the first protection plate 130, the high-density printed circuit board 110 and the second protection plate 150. As shown in FIG. 10, the first protection plate 130 and the high-density printed circuit board can be realized. The fixed connection between 110 and the second protection plate 150 can enhance the packaging strength of the packaging structure and improve the performance of the packaging structure. Further, when the characteristic dimensions of the power supply printed circuit board 120 may be the same as the characteristic dimensions of the high-density printed circuit board 110, the fastening structure 140 may simultaneously penetrate the first protection plate 130, the high-density printed circuit board 110, the power supply printed circuit board 120 and The second protection plate 150 further increases the packaging strength of the packaging structure.

在本申请的实施例中，封装结构中还可以设置连接器件160，连接器件160用于实现第一元器件111的信号传输功能。连接器件160可以是高速接口连接器。连接器件160可以设置在高密印刷电路板110，也可以设置在供电印刷电路板120，不同的设置方式能够为封装结构提供更多的应用场景。In the embodiment of the present application, a connecting device 160 may also be provided in the packaging structure, and the connecting device 160 is used to implement the signal transmission function of the first component 111 . Connecting device 160 may be a high speed interface connector. The connecting device 160 can be arranged on the high-density printed circuit board 110 or the power supply printed circuit board 120. Different arrangement methods can provide more application scenarios for the packaging structure.

作为一种示例，连接器件160可以设置于高密印刷电路板110远离供电印刷电路板120的一侧表面，参考图13所示，即连接器件160和第一元器件111设置在高密印刷电路板110的同一侧，连接器件160可以直接利用高密印刷电路板110实现与第一元器件111的电连接。由于连接器件160厚度较厚，因此第一保护板130具有第一开口131，第一开口131暴露连接器件160。As an example, the connecting device 160 can be disposed on a side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120 , as shown in FIG. 13 , that is, the connecting device 160 and the first component 111 are disposed on the high-density printed circuit board 110 On the same side, the connecting device 160 can directly use the high-density printed circuit board 110 to achieve electrical connection with the first component 111 . Since the connecting device 160 is thicker, the first protection plate 130 has a first opening 131 , and the first opening 131 exposes the connecting device 160 .

作为另一种示例，当高密印刷电路板110的特征尺寸等于供电印刷电路板120的特征尺寸时，连接器件160可以设置于供电印刷电路板120远离高密印刷电路板110的一侧表面，参考图8或图12所示，即连接器件160设置在供电印刷电路板120上，连接器件160可以利用供电印刷电路板120和高密印刷电路板110实现与第一元器件111的电连接。由于连接器件160厚度较厚，第二保护板150具有第二开口151，第二开口151暴露连接器件160。As another example, when the characteristic size of the high-density printed circuit board 110 is equal to the characteristic size of the power supply printed circuit board 120, the connection device 160 may be disposed on a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110. Refer to FIG. 8 or as shown in FIG. 12 , that is, the connecting device 160 is disposed on the power supply printed circuit board 120 , and the connecting device 160 can use the power supply printed circuit board 120 and the high-density printed circuit board 110 to achieve electrical connection with the first component 111 . Since the connecting device 160 is thicker, the second protection plate 150 has a second opening 151 , and the second opening 151 exposes the connecting device 160 .

作为又一种示例，当高密印刷电路板110的特征尺寸大于供电印刷电路板120的特征尺寸时，连接器件160可以设置于高密印刷电路板110靠近供电印刷电路板120的一侧表面，参考图10、图11或图14所示，即连接器件160和第一元器件111设置在高密印刷电路板110的不同侧，连接器件160可以直接利用高密印刷电路板110实现与第一元器件111的电连接。由于连接器件160厚度较厚，第二保护板150具有第三开口152，第三开口152暴露连接器件160。As another example, when the characteristic size of the high-density printed circuit board 110 is larger than the characteristic size of the power supply printed circuit board 120, the connecting device 160 may be disposed on a side surface of the high-density printed circuit board 110 close to the power supply printed circuit board 120. Refer to FIG. 10. As shown in Figure 11 or Figure 14, that is, the connecting device 160 and the first component 111 are arranged on different sides of the high-density printed circuit board 110. The connecting device 160 can directly use the high-density printed circuit board 110 to realize the connection with the first component 111. Electrical connection. Since the connecting device 160 is thicker, the second protection plate 150 has a third opening 152 , and the third opening 152 exposes the connecting device 160 .

由上述陈述可知，附图2-附图7展示了连接器件160的多种放置位置，并且连接器件160的数量可以是一个也可以是多个，因此连接器件160的具体数量和位置可以根据封装结构的应用场景进行设置。As can be seen from the above statements, Figures 2 to 7 show various placement positions of the connecting device 160, and the number of the connecting device 160 can be one or multiple, so the specific number and position of the connecting device 160 can be determined according to the package. Set up the application scenario of the structure.

在本申请的实施例中，第一元器件111和第一保护板130之间还包括导热材料170，导热材料用于为第一元器件111进一步提供散热效果，参考图8-图14所示。具体的，当第二元器件121设置在供电印刷电路板120远离高密印刷电路板110的一侧表面时，第二元器件121和第二保护板150之间包括导热材料171导热材料171用于为第二元器件121进一步提供散热效果。当第二元器件121设置在供电印刷电路板120靠近高密印刷电路板110的一侧表面的避让开口112内时，第二元器件121和第一保护板130之间包括导热材料172。In the embodiment of the present application, a thermal conductive material 170 is also included between the first component 111 and the first protection plate 130. The thermal conductive material is used to further provide a heat dissipation effect for the first component 111. Refer to Figures 8-14. . Specifically, when the second component 121 is disposed on the side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110, the thermal conductive material 171 is included between the second component 121 and the second protection plate 150. The heat dissipation effect is further provided for the second component 121 . When the second component 121 is disposed in the avoidance opening 112 on a side surface of the power supply printed circuit board 120 close to the high-density printed circuit board 110 , a thermally conductive material 172 is included between the second component 121 and the first protection plate 130 .

在本申请的实施例中，封装结构中还可以包括支撑结构，支撑结构用于支撑第一保护板130或第二保护板150，避免第一保护板130或第二保护板150对第一元器件111或第二元器件121的挤压，还能够实现封装结构的校平以及平面度控制。支撑结构包括第一支撑结构181和第二支撑结构182，第一支撑结构181设置于第一保护板130和高密印刷电路板110之间，第二支撑结构182设置于第二保护板150和供电印刷电路板120之间。具体的，第一支撑结构181和第一保护板130可以为一体结构，第二支撑结构182和第二保护板150可以是一体结构。In the embodiment of the present application, the packaging structure may also include a support structure. The support structure is used to support the first protection plate 130 or the second protection plate 150 to prevent the first protection plate 130 or the second protection plate 150 from damaging the first element. The extrusion of the component 111 or the second component 121 can also achieve leveling and flatness control of the packaging structure. The support structure includes a first support structure 181 and a second support structure 182. The first support structure 181 is disposed between the first protection plate 130 and the high-density printed circuit board 110. The second support structure 182 is disposed between the second protection plate 150 and the power supply. between printed circuit boards 120. Specifically, the first support structure 181 and the first protection plate 130 may be an integral structure, and the second support structure 182 and the second protection plate 150 may be an integral structure.

在本申请的实施例中，高密印刷电路板110和供电印刷电路板120之间是通过焊接或烧结实现结合的，高密印刷电路板110和供电印刷电路板120之间除了焊料之外，还可以设置粘接材料，即利用粘接材料实现高密印刷电路板110和供电印刷电路板120的紧密固定连接，进一步增加封装结构的刚性，满足封装结构力学和可靠性的要求。In the embodiment of the present application, the high-density printed circuit board 110 and the power-supply printed circuit board 120 are combined by welding or sintering. In addition to solder, the high-density printed circuit board 110 and the power-supply printed circuit board 120 can also be connected by soldering. The adhesive material is provided, that is, the adhesive material is used to achieve a tight and fixed connection between the high-density printed circuit board 110 and the power supply printed circuit board 120, further increasing the rigidity of the packaging structure and meeting the mechanical and reliability requirements of the packaging structure.

在本申请的实施例中，在将第一元器件111设置在高密印刷电路板110的表面后，在第一元器件110靠近高密印刷电路板110的底部，还包括底部填充胶(underfill)，底部填充胶用于保护第一元器件110，并且增强第一元器件110和高密印刷电路板110之间的固定连接。还可以在第一元器件111的周围设置保护结构，保护结构用于对第一元器件111进行封装，以保护第一元器件111不受损伤。In the embodiment of the present application, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, an underfill is also included at the bottom of the first component 110 close to the high-density printed circuit board 110. The underfill glue is used to protect the first component 110 and enhance the fixed connection between the first component 110 and the high-density printed circuit board 110 . A protective structure may also be provided around the first component 111, and the protective structure is used to encapsulate the first component 111 to protect the first component 111 from damage.

基于本申请实施例提供的一种封装结构，本申请实施例还提供了一种封装方法，参考图15所示，为本申请实施例提供的一种封装方法的流程图，图16-图27为封装结构在制造过程中的结构示意图，该方法可以包括：Based on the packaging structure provided by the embodiment of the present application, the embodiment of the present application also provides a packaging method. Refer to Figure 15, which is a flow chart of a packaging method provided by the embodiment of the present application. Figures 16-27 This is a schematic diagram of the structure of the packaging structure during the manufacturing process. The method may include:

S101，在高密印刷电路板110的一侧表面设置第一元器件111，在高密印刷电路板110的另一侧设置供电印刷电路板120，参考图16-图27所示。S101, set the first component 111 on one side of the high-density printed circuit board 110, and set the power supply printed circuit board 120 on the other side of the high-density printed circuit board 110, as shown in Figures 16-27.

在本申请的实施例中，在高密印刷电路板110的一侧表面可以设置第一元器件111，在另一侧表面设置供电印刷电路板120，其中供电印刷电路板120的一侧表面上设置有第二元器件121，第二元器件121利用高密印刷电路板110和供电印刷电路板120实现与第一元器件111的电连接，第二元器件121用于为第一元器件111进行供电。In the embodiment of the present application, the first component 111 may be disposed on one side surface of the high-density printed circuit board 110, and the power supply printed circuit board 120 may be disposed on the other side surface, wherein the power supply printed circuit board 120 may be disposed on one side surface thereof. There is a second component 121. The second component 121 uses the high-density printed circuit board 110 and the power supply printed circuit board 120 to achieve electrical connection with the first component 111. The second component 121 is used to provide power to the first component 111. .

具体在高密印刷电路板110设置第一元器件111以及设置供电印刷电路板120的工艺可以有如下三种可能的实现方式：Specifically, the process of arranging the first component 111 on the high-density printed circuit board 110 and the power supply printed circuit board 120 can be implemented in the following three possible ways:

第一种实现方式为在结合高密印刷电路板110和供电印刷电路板120之后，在高密印刷电路板110以及供电印刷电路板120的表面分别设置第一元器件111和第二元器件121。The first implementation is that after combining the high-density printed circuit board 110 and the power supply printed circuit board 120, the first component 111 and the second component 121 are respectively provided on the surfaces of the high-density printed circuit board 110 and the power supply printed circuit board 120.

第二种实现方式为在高密印刷电路板110的表面设置第一元器件111之后，高密印刷电路板110结合已经设置第二元器件121的供电印刷电路板120。The second implementation is that after the first component 111 is disposed on the surface of the high-density printed circuit board 110, the high-density printed circuit board 110 is combined with the power supply printed circuit board 120 on which the second component 121 has been disposed.

第三种实现方式为在高密印刷电路板110上形成避让开口112，而后在高密印刷电路板110的一侧表面设置第一元器件111，另一侧表面设置供电印刷电路板120，避让开口112暴露供电印刷电路板120表面设置的第二元器件121。The third implementation method is to form the avoidance opening 112 on the high-density printed circuit board 110, and then set the first component 111 on one side of the high-density printed circuit board 110, and set the power supply printed circuit board 120 on the other side of the high-density printed circuit board 110 to avoid the opening 112. The second component 121 provided on the surface of the power supply printed circuit board 120 is exposed.

以上三种可能的实现方式在后文中进行详细介绍，在此不再赘述。The above three possible implementation methods will be introduced in detail later and will not be repeated here.

S102，在高密印刷电路板110设置有第一元器件111的一侧设置第一保护板130，设置紧固结构140，参考图8-图14所示。S102, set the first protection plate 130 and the fastening structure 140 on the side of the high-density printed circuit board 110 where the first component 111 is set, as shown in FIGS. 8-14.

在本申请的实施例中，在高密印刷电路板110的一侧设置第一元器件111，另一侧设置供电印刷电路板120之后，可以在高密印刷电路板110设置有第一元器件111的一侧设置第一保护板130，而后设置紧固结构140。In the embodiment of the present application, after the first component 111 is disposed on one side of the high-density printed circuit board 110 and the power supply printed circuit board 120 is disposed on the other side, the first component 111 can be disposed on the high-density printed circuit board 110 A first protective plate 130 is provided on one side, and then a fastening structure 140 is provided.

具体的，在高密印刷电路板110设置有第一元器件111的一侧设置第一保护板130，参考图8所示，第一保护板130用于保护第一元器件111不受污染和损伤。第一保护板130 还可以具有散热功能，即第一保护板130可以选用导热性能良好的材料，以便对第一元器件111进行散热。Specifically, a first protection plate 130 is provided on the side of the high-density printed circuit board 110 where the first component 111 is provided. As shown in FIG. 8 , the first protection plate 130 is used to protect the first component 111 from contamination and damage. . The first protection plate 130 may also have a heat dissipation function, that is, the first protection plate 130 may be made of a material with good thermal conductivity to dissipate heat from the first component 111 .

具体的，紧固结构140贯穿第一保护板130和高密印刷电路板110，实现设置第一元器件111的高密印刷电路板110和第一保护板130的固定连接，相较于将第一元器件设置于封装基板，而后封装基板焊接至印刷电路板的封装结构而言，直接利用紧固结构140实现高密印刷电路板110和第一保护板130的固定连接，使得第一元器件111能够更加稳固在高密印刷电路板110的表面，进一步增强封装结构的封装强度。具体的，紧固结构140可以是紧固螺钉。Specifically, the fastening structure 140 penetrates the first protective plate 130 and the high-density printed circuit board 110 to achieve a fixed connection between the high-density printed circuit board 110 and the first protective plate 130 on which the first component 111 is provided. For a packaging structure in which the device is installed on the packaging substrate and then the packaging substrate is welded to the printed circuit board, the fastening structure 140 is directly used to achieve a fixed connection between the high-density printed circuit board 110 and the first protection plate 130 so that the first component 111 can be more It is firmly fixed on the surface of the high-density printed circuit board 110 to further enhance the packaging strength of the packaging structure. Specifically, the fastening structure 140 may be a fastening screw.

下面对在高密印刷电路板110设置第一元器件111以及设置供电印刷电路板120的工艺的三种可能的实现方式进行详细介绍：The following is a detailed introduction to three possible implementation methods of the process of arranging the first component 111 on the high-density printed circuit board 110 and the power supply printed circuit board 120:

S101A-1：结合高密印刷电路板110和供电印刷电路板120，参考图16所示。S101A-1: Combine the high-density printed circuit board 110 and the power supply printed circuit board 120, as shown in Figure 16.

在本申请的实施例中，可以采用烧结或焊接的方式将高密印刷电路板110和供电印刷电路板120进行结合，高密印刷电路板110和供电印刷电路板120之间具有焊料，实现高密印刷电路板110和供电印刷电路板120之间的电连接。焊接工艺可以是栅格阵列封装(land grid array，LGA)或焊球阵列封装(ball grid array，BGA)，具体焊接时，可以利用垫片spacer控制高密印刷电路板110和供电印刷电路板120之间的距离。In the embodiment of the present application, the high-density printed circuit board 110 and the power supply printed circuit board 120 can be combined by sintering or welding. There is solder between the high-density printed circuit board 110 and the power supply printed circuit board 120 to realize a high-density printed circuit. Electrical connection between board 110 and power supply printed circuit board 120. The welding process can be a land grid array package (LGA) or a ball grid array package (BGA). During specific welding, a spacer can be used to control the connection between the high-density printed circuit board 110 and the power supply printed circuit board 120. distance between.

高密印刷电路板110和供电印刷电路板120的特征尺寸可以相同，也可以不同，附图10以相同为例进行展示。The characteristic dimensions of the high-density printed circuit board 110 and the power supply printed circuit board 120 may be the same or different. Figure 10 shows the same dimensions as an example.

S101A-2：在高密印刷电路板110远离供电印刷电路板120的一侧表面设置第一元器件111，参考图17所示。S101A-2: Set the first component 111 on the surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120, as shown in FIG. 17 .

在本申请的实施例中，可以在高密印刷电路板110远离供电印刷电路板120的一侧表面设置第一元器件111。具体的，第一元器件111可以包括半导体芯片和表面贴装器件，由于表面贴装器件的特征尺寸较小，因此可以在高密印刷电路板110表面上利用表面贴装技术设置完毕表面贴装器件之后，在高密印刷电路板110表面上通过焊接或绑定打线bonding的工艺设置半导体芯片。In the embodiment of the present application, the first component 111 may be disposed on a side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120 . Specifically, the first component 111 may include a semiconductor chip and a surface mount device. Since the characteristic size of the surface mount device is small, the surface mount device can be installed on the surface of the high-density printed circuit board 110 using surface mount technology. Afterwards, the semiconductor chip is placed on the surface of the high-density printed circuit board 110 through a welding or bonding process.

具体的，在将第一元器件111设置在高密印刷电路板110的表面后，在第一元器件110靠近高密印刷电路板110的底部，还可以设置底部填充胶，底部填充胶用于保护第一元器件110，并且增强第一元器件110和高密印刷电路板110之间的固定连接。还可以在第一元器件111的周围设置保护结构，保护结构用于对第一元器件111进行封装，以保护第一元器件111不受损伤。保护结构可以采用填充(fill)工艺或注塑(molding)工艺形成。Specifically, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, underfill glue can also be provided at the bottom of the first component 110 close to the high-density printed circuit board 110. The underfill glue is used to protect the third component. A component 110 is provided, and the fixed connection between the first component 110 and the high-density printed circuit board 110 is enhanced. A protective structure may also be provided around the first component 111, and the protective structure is used to encapsulate the first component 111 to protect the first component 111 from damage. The protective structure can be formed using a filling process or an injection molding process.

S101A-3：在高密印刷电路板110设置第一元器件111的一侧设置第一支撑结构181，参考图18所示。S101A-3: Set the first support structure 181 on the side of the high-density printed circuit board 110 on which the first component 111 is set, as shown in FIG. 18 .

在本申请的实施例中，在高密印刷电路板110远离供电印刷电路板120的一侧表面设置第一元器件111之后，可以在高密印刷电路板110设置第一元器件111的一侧表面设置第一支撑结构181，实现封装结构的校平以及平面度控制。具体的，第一支撑结构181可以是粘接或利用螺钉紧固在高密印刷电路板110上。In the embodiment of the present application, after the first component 111 is disposed on the side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120, the first component 111 can be disposed on the side surface of the high-density printed circuit board 110. The first support structure 181 realizes leveling and flatness control of the packaging structure. Specifically, the first support structure 181 may be bonded or fastened to the high-density printed circuit board 110 using screws.

S101A-4：在供电印刷电路板120远离高密印刷电路板110的一侧表面设置第二元器件121，参考图19或图20所示。S101A-4: Set the second component 121 on the surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110, as shown in Figure 19 or Figure 20.

在本申请的实施例中，在设置完毕第一支撑结构181之后，可以在供电印刷电路板120远离高密印刷电路板110的一侧表面设置第二元器件121。具体的，第二元器件121可以是焊接至供电印刷电路板120。In the embodiment of the present application, after the first support structure 181 is set up, the second component 121 can be disposed on the side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110 . Specifically, the second component 121 may be soldered to the power supply printed circuit board 120 .

在本申请的实施例中，在焊接完毕第二元器件121时，还可以将连接器件160设置在封装结构中。In the embodiment of the present application, after the second component 121 is soldered, the connecting device 160 can also be disposed in the packaging structure.

作为一种示例，当高密印刷电路板110的特征尺寸等于供电印刷电路板120的特征尺寸时，连接器件160可以焊接至供电印刷电路板120远离高密印刷电路板110的一侧表面，参考图19所示，即连接器件160焊接在供电印刷电路板120上，连接器件160可以利用供电印刷电路板120和高密印刷电路板110实现与第一元器件111的电连接。As an example, when the characteristic size of the high-density printed circuit board 110 is equal to the characteristic size of the power supply printed circuit board 120, the connection device 160 may be soldered to a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110, with reference to FIG. 19 As shown, the connecting device 160 is welded on the power supply printed circuit board 120, and the connecting device 160 can use the power supply printed circuit board 120 and the high-density printed circuit board 110 to achieve electrical connection with the first component 111.

作为另一种示例，当高密印刷电路板110的特征尺寸大于供电印刷电路板120的特征尺寸时，连接器件160可以焊接至高密印刷电路板110靠近供电印刷电路板120的一侧表面，参考图20所示，即连接器件160和第一元器件111设置在高密印刷电路板110的不同侧，连接器件160可以直接利用高密印刷电路板110实现与第一元器件111的电连接。As another example, when the characteristic size of the high-density printed circuit board 110 is larger than the characteristic size of the power supply printed circuit board 120, the connection device 160 may be soldered to a side surface of the high-density printed circuit board 110 close to the power supply printed circuit board 120. Refer to FIG. As shown in 20, that is, the connecting device 160 and the first component 111 are disposed on different sides of the high-density printed circuit board 110, and the connecting device 160 can directly use the high-density printed circuit board 110 to achieve electrical connection with the first component 111.

S101B-1：在高密印刷电路板110的一侧表面设置第一元器件111，参考图21所示。S101B-1: Set the first component 111 on one side surface of the high-density printed circuit board 110, as shown in Figure 21.

在本申请的实施例中，可以在高密印刷电路板110的一侧表面设置第一元器件111。具体的，第一元器件111可以包括半导体芯片和表面贴装器件，由于表面贴装器件的特征尺寸较小，因此可以在高密印刷电路板110表面上利用表面贴装技术设置完毕表面贴装器件之后，在高密印刷电路板110表面上通过焊接或绑定打线(bonding)的工艺设置半导体芯片。In the embodiment of the present application, the first component 111 may be disposed on one side surface of the high-density printed circuit board 110 . Specifically, the first component 111 may include a semiconductor chip and a surface mount device. Since the characteristic size of the surface mount device is small, the surface mount device can be installed on the surface of the high-density printed circuit board 110 using surface mount technology. Afterwards, the semiconductor chip is disposed on the surface of the high-density printed circuit board 110 through a welding or bonding process.

具体的，在将第一元器件111设置在高密印刷电路板110的表面后，在第一元器件110靠近高密印刷电路板110的底部，还可以设置底部填充胶，底部填充胶用于保护第一元器件110，并且增强第一元器件110和高密印刷电路板110之间的固定连接。还可以在第一元器件111的周围设置保护结构，保护结构用于对第一元器件111进行封装，以保护第一元器件111不受损伤。保护结构可以采用填充工艺或注塑工艺形成。Specifically, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, underfill glue can also be provided at the bottom of the first component 110 close to the high-density printed circuit board 110. The underfill glue is used to protect the third component. A component 110 is provided, and the fixed connection between the first component 110 and the high-density printed circuit board 110 is enhanced. A protective structure may also be provided around the first component 111, and the protective structure is used to encapsulate the first component 111 to protect the first component 111 from damage. The protective structure can be formed using a filling process or an injection molding process.

S101B-2：在高密印刷电路板110设置第一元器件111的一侧设置第一支撑结构181，参考图22所示。S101B-2: Set the first support structure 181 on the side of the high-density printed circuit board 110 on which the first component 111 is set, as shown in FIG. 22 .

在本申请的实施例中，在高密印刷电路板110的一侧表面设置第一元器件111之后，可以在高密印刷电路板110设置第一元器件111的一侧表面设置第一支撑结构181，实现封装结构的校平以及平面度控制。具体的，第一支撑结构181可以是粘接或利用螺钉紧固在高密印刷电路板110上。In the embodiment of the present application, after the first component 111 is disposed on one side surface of the high-density printed circuit board 110, the first support structure 181 may be disposed on one side surface of the high-density printed circuit board 110 where the first component 111 is disposed. Realize the leveling and flatness control of the packaging structure. Specifically, the first support structure 181 may be bonded or fastened to the high-density printed circuit board 110 using screws.

S101B-3：在高密印刷电路板110背离所述第一元器件111的一侧表面设置供电印刷电路板120，参考图23所示。S101B-3: Set the power supply printed circuit board 120 on the side surface of the high-density printed circuit board 110 away from the first component 111, as shown in Figure 23.

在本申请的实施例中，在高密印刷电路板110的一侧表面设置第一元器件111之后，可以在另一侧表面设置供电印刷电路板120，供电印刷电路板120可以已经设置完毕第二元器件121。具体可以是将供电印刷电路板120焊接至高密印刷电路板110的另一侧表面，焊接工艺可以是栅格阵列封装或焊球阵列封装，具体焊接时，可以利用垫片(spacer)控制高密印刷电路板110和供电印刷电路板120之间的距离。In the embodiment of the present application, after the first component 111 is disposed on one side of the high-density printed circuit board 110, the power supply printed circuit board 120 can be disposed on the other side surface, and the power supply printed circuit board 120 may have already been disposed. Components 121. Specifically, the power supply printed circuit board 120 can be welded to the other side surface of the high-density printed circuit board 110. The welding process can be grid array packaging or solder ball array packaging. During specific welding, a spacer can be used to control the high-density printing. The distance between the circuit board 110 and the power supply printed circuit board 120.

具体的，供电印刷电路板120的数量可以为多个，可以在多个供电印刷电路板120上分别设置多个第二元器件121，将多个供电印刷电路板120分别焊接至高密印刷电路板110的另一侧表面，以便每个供电印刷电路板120上的第二元器件121都能为对应的第一元器件111进行供电。Specifically, the number of power supply printed circuit boards 120 can be multiple. Multiple second components 121 can be respectively provided on the multiple power supply printed circuit boards 120 , and the multiple power supply printed circuit boards 120 can be welded to high-density printed circuit boards respectively. 110, so that the second component 121 on each power supply printed circuit board 120 can supply power to the corresponding first component 111.

在本申请的实施例中，在焊接完毕供电印刷电路板120之后，还可以将连接器件160设置在封装结构中。In the embodiment of the present application, after the power supply printed circuit board 120 is soldered, the connection device 160 may also be disposed in the packaging structure.

作为一种示例，当高密印刷电路板110的特征尺寸大于供电印刷电路板120的特征尺寸时，连接器件160可以焊接至高密印刷电路板110靠近供电印刷电路板120的一侧表面，参考图23所示，即连接器件160和第一元器件111设置在高密印刷电路板110的不同侧，连接器件160可以直接利用高密印刷电路板110实现与第一元器件111的电连接。As an example, when the characteristic size of the high-density printed circuit board 110 is larger than the characteristic size of the power supply printed circuit board 120, the connection device 160 can be soldered to a side surface of the high-density printed circuit board 110 close to the power supply printed circuit board 120, with reference to FIG. 23 As shown, the connecting device 160 and the first component 111 are disposed on different sides of the high-density printed circuit board 110 , and the connecting device 160 can directly use the high-density printed circuit board 110 to achieve electrical connection with the first component 111 .

S101C-1：在高密印刷电路板110形成避让开口112，参考图24所示。S101C-1: Form the escape opening 112 on the high-density printed circuit board 110, as shown in Figure 24.

在本申请的实施例中，在高密印刷电路板110的一侧表面设置第一元器件111之前，可以在高密印刷电路板110上形成避让开口112，避让开口112贯穿高密印刷电路板110。In the embodiment of the present application, before disposing the first component 111 on one side surface of the high-density printed circuit board 110 , an escape opening 112 may be formed on the high-density printed circuit board 110 , and the escape opening 112 penetrates the high-density printed circuit board 110 .

S101C-2：在高密印刷电路板110的一侧表面设置第一元器件111，参考图25所示。S101C-2: Set the first component 111 on one side surface of the high-density printed circuit board 110, as shown in Figure 25.

在本申请的实施例中，可以在高密印刷电路板110的一侧表面设置第一元器件111。具体的，第一元器件111可以包括半导体芯片和表面贴装器件，由于表面贴装器件的特征尺寸较小，因此可以在高密印刷电路板110表面上利用表面贴装技术设置完毕表面贴装器件之后，在高密印刷电路板110表面上通过焊接或绑定打线的工艺设置半导体芯片。In the embodiment of the present application, the first component 111 may be disposed on one side surface of the high-density printed circuit board 110 . Specifically, the first component 111 may include a semiconductor chip and a surface mount device. Since the characteristic size of the surface mount device is small, the surface mount device can be installed on the surface of the high-density printed circuit board 110 using surface mount technology. After that, the semiconductor chip is placed on the surface of the high-density printed circuit board 110 through a welding or bonding wire bonding process.

具体的，在将第一元器件111设置在高密印刷电路板110的表面后，在第一元器件110靠近高密印刷电路板110的底部，还可以设置底部填充胶，底部填充胶用于保护第一元器件110，并且增强第一元器件110和高密印刷电路板110之间的固定连接。还可以在第一元器件111的周围设置保护结构，保护结构用于对第一元器件111进行封装，以保护第一元器件111不受损伤。保护结构可以采用填充fill工艺或注塑molding工艺形成。Specifically, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, underfill glue can also be provided at the bottom of the first component 110 close to the high-density printed circuit board 110. The underfill glue is used to protect the third component. A component 110 is provided, and the fixed connection between the first component 110 and the high-density printed circuit board 110 is enhanced. A protective structure may also be provided around the first component 111, and the protective structure is used to encapsulate the first component 111 to protect the first component 111 from damage. The protective structure can be formed by filling process or injection molding process.

S101C-3：在供电印刷电路板120的一侧表面设置第二元器件121，参考图26所示。S101C-3: Set the second component 121 on one side of the power supply printed circuit board 120, as shown in Figure 26.

在本申请的实施例中，可以在供电印刷电路板120的一侧表面设置第二元器件121。具体的，第二元器件121可以是焊接至供电印刷电路板120。In the embodiment of the present application, the second component 121 may be disposed on one side surface of the power supply printed circuit board 120 . Specifically, the second component 121 may be soldered to the power supply printed circuit board 120 .

具体的，可以将第三元器件113设置于供电印刷电路板120远离第二元器件121的一侧表面，以在封装结构中集成更多的芯片，提高集成度，参考图26所示。第三元器件可以包括表面贴装器件，具体可以将表面贴装器件设置在供电印刷电路板120远离第二元器件 121的一侧表面，表面贴装器件高度较低，不会额外增加整个封装结构的体积。Specifically, the third component 113 can be disposed on a side surface of the power supply printed circuit board 120 away from the second component 121 to integrate more chips in the packaging structure and improve the integration level, as shown in FIG. 26 . The third component may include a surface mount device. Specifically, the surface mount device may be disposed on a side surface of the power supply printed circuit board 120 away from the second component 121. The height of the surface mount device is low and does not increase the entire package. The volume of the structure.

在本申请的实施例中，还可以将连接器件160设置在封装结构中。In embodiments of the present application, the connection device 160 may also be provided in a packaging structure.

作为一种示例，当高密印刷电路板110的特征尺寸等于供电印刷电路板120的特征尺寸时，连接器件160可以焊接至供电印刷电路板120远离第二元器件121的一侧表面，参考图26所示，即连接器件160焊接在供电印刷电路板120上，后续连接器件160可以利用供电印刷电路板120和高密印刷电路板110实现与第一元器件111的电连接。As an example, when the characteristic size of the high-density printed circuit board 110 is equal to the characteristic size of the power supply printed circuit board 120, the connecting device 160 can be soldered to a side surface of the power supply printed circuit board 120 away from the second component 121, with reference to FIG. 26 As shown, the connecting device 160 is welded on the power supply printed circuit board 120, and the subsequent connecting device 160 can use the power supply printed circuit board 120 and the high-density printed circuit board 110 to achieve electrical connection with the first component 111.

作为另一种示例，当高密印刷电路板110的特征尺寸等于供电印刷电路板120的特征尺寸时，连接器件160可以设置于高密印刷电路板110靠近第一元器件111的一侧表面，参考图25所示，即连接器件160和第一元器件111设置在高密印刷电路板110的同一侧，连接器件160可以直接利用高密印刷电路板110实现与第一元器件111的电连接。具体可以是在高密印刷电路板110上设置第一元器件111时焊接连接器件160。As another example, when the characteristic size of the high-density printed circuit board 110 is equal to the characteristic size of the power supply printed circuit board 120, the connecting device 160 may be disposed on a side surface of the high-density printed circuit board 110 close to the first component 111. Refer to FIG. 25, that is, the connecting device 160 and the first component 111 are disposed on the same side of the high-density printed circuit board 110, and the connecting device 160 can directly use the high-density printed circuit board 110 to achieve electrical connection with the first component 111. Specifically, the connecting device 160 may be soldered when the first component 111 is disposed on the high-density printed circuit board 110 .

S101C-4：供电印刷电路板120以设置第二元器件121的方向和高密印刷电路板110未设置第一元器件111的方向，结合供电印刷电路板120和高密印刷电路板110，参考图27所示。S101C-4: The direction in which the power supply printed circuit board 120 is set with the second component 121 and the high-density printed circuit board 110 is not set with the first component 111, combine the power supply printed circuit board 120 and the high-density printed circuit board 110, refer to Figure 27 shown.

在本申请的实施例中，供电印刷电路板120以设置第二元器件121的方向和高密印刷电路板110未设置第一元器件111的方向，结合供电印刷电路板120和高密印刷电路板110，结合后，供电印刷电路板120被避让开口112暴露的一侧表面设置有所述第二元器件121，即避让开口112暴露第二元器件121。可以采用烧结或焊接的方式将高密印刷电路板110和供电印刷电路板120进行结合，高密印刷电路板110和供电印刷电路板120之间具有焊料，实现高密印刷电路板110和供电印刷电路板120之间的电连接。焊接工艺可以是栅格阵列封装(land grid array，LGA)或焊球阵列封装(ball grid array，BGA)，具体焊接时，可以利用垫片spacer控制高密印刷电路板110和供电印刷电路板120之间的距离。In the embodiment of the present application, the power supply printed circuit board 120 is arranged in a direction in which the second component 121 is disposed and the high-density printed circuit board 110 is not disposed in a direction in which the first component 111 is disposed. The power supply printed circuit board 120 and the high-density printed circuit board 110 are combined. , after combination, the second component 121 is provided on the side surface of the power supply printed circuit board 120 exposed by the avoidance opening 112 , that is, the second component 121 is exposed by the avoidance opening 112 . The high-density printed circuit board 110 and the power-supply printed circuit board 120 can be combined by sintering or welding. There is solder between the high-density printed circuit board 110 and the power-supply printed circuit board 120 to realize the high-density printed circuit board 110 and the power-supply printed circuit board 120. electrical connection between them. The welding process can be a land grid array package (LGA) or a ball grid array package (BGA). During specific welding, a spacer can be used to control the connection between the high-density printed circuit board 110 and the power supply printed circuit board 120. distance between.

附图27以高密印刷电路板110的特征尺寸等于供电印刷电路板120的特征尺寸，连接器件160焊接至供电印刷电路板120远离第二元器件121的一侧表面为例进行展示。27 shows an example in which the characteristic dimensions of the high-density printed circuit board 110 are equal to the characteristic dimensions of the power supply printed circuit board 120 and the connecting device 160 is welded to the side surface of the power supply printed circuit board 120 away from the second component 121 .

以上对在高密印刷电路板110设置第一元器件111以及设置供电印刷电路板120的工艺的三种可能的实现方式进行了详细介绍，具体形成封装结构的形成工艺的步骤顺序可以进行调整，本领域技术人员可以进行任意变型。The above describes in detail three possible implementation methods of the process of arranging the first component 111 on the high-density printed circuit board 110 and the power supply printed circuit board 120. The specific sequence of steps of the forming process of forming the packaging structure can be adjusted. Those skilled in the art can make any modifications.

作为另一种示例，当第二元器件121设置于高密印刷电路板110的避让开口112内时，可以将部分第一元器件111设置于供电印刷电路板120远离高密印刷电路板110的一侧表面，以在封装结构中集成更多的芯片，提高集成度，第二保护板150可以用于保护设置于在供电印刷电路板120远离高密印刷电路板110的一侧的部分第一元器件111，参考图12或图13所示。具体可以将表面贴装器件设置在供电印刷电路板120远离高密印刷电路板110的一侧表面，表面贴装器件高度较低，不会额外增加整个封装结构的体积。As another example, when the second component 121 is disposed in the avoidance opening 112 of the high-density printed circuit board 110 , part of the first component 111 can be disposed on a side of the power supply printed circuit board 120 away from the high-density printed circuit board 110 In order to integrate more chips in the package structure and improve the integration level, the second protection plate 150 can be used to protect part of the first components 111 provided on the side of the power supply printed circuit board 120 away from the high-density printed circuit board 110 , refer to Figure 12 or Figure 13. Specifically, the surface mount device can be disposed on a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110. The height of the surface mount device is low and does not increase the volume of the entire packaging structure.

在本申请的实施例中，在高密印刷电路板110设置有第一元器件111的一侧设置第一保护板130之前，在第一元器件111远离高密印刷电路板110的一侧表面覆盖导热材料170，导热材料170用于为第一元器件111进一步提供散热效果，参考图8-图14所示。具体的，当第二元器件121设置在供电印刷电路板120远离高密印刷电路板110的一侧表面时，在第二元器件121远离供电印刷电路板120的一侧表面覆盖导热材料171，导热材料171用于为第二元器件121进一步提供散热效果。当第二元器件121设置在供电印刷电路板120靠近高密印刷电路板110的一侧表面的避让开口112内时，第二元器件121和第一保护板130之间包括导热材料172。In the embodiment of the present application, before the first protection plate 130 is provided on the side of the high-density printed circuit board 110 where the first component 111 is disposed, the surface of the first component 111 away from the high-density printed circuit board 110 is covered with a thermally conductive surface. The material 170 and the thermal conductive material 170 are used to further provide a heat dissipation effect for the first component 111, as shown in FIGS. 8-14. Specifically, when the second component 121 is disposed on the side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110, the side surface of the second component 121 away from the power supply printed circuit board 120 is covered with a thermally conductive material 171 to conduct heat. The material 171 is used to further provide a heat dissipation effect for the second component 121 . When the second component 121 is disposed in the avoidance opening 112 on a side surface of the power supply printed circuit board 120 close to the high-density printed circuit board 110 , a thermally conductive material 172 is included between the second component 121 and the first protection plate 130 .

在本申请的实施例中，高密印刷电路板110和供电印刷电路板120之间是通过焊接或烧结实现结合的，高密印刷电路板110和供电印刷电路板120之间除了焊料之外，还可以在高密印刷电路板110和供电印刷电路板120之间填充粘接材料，利用粘接材料实现高密印刷电路板110和供电印刷电路板120的紧密固定连接，进一步增加封装结构的刚性，满足封装结构力学和可靠性的要求。In the embodiment of the present application, the high-density printed circuit board 110 and the power-supply printed circuit board 120 are combined by welding or sintering. In addition to solder, the high-density printed circuit board 110 and the power-supply printed circuit board 120 can also be connected by soldering. The adhesive material is filled between the high-density printed circuit board 110 and the power supply printed circuit board 120, and the adhesive material is used to achieve a tight and fixed connection between the high-density printed circuit board 110 and the power supply printed circuit board 120, further increasing the rigidity of the packaging structure and satisfying the requirements of the packaging structure. Mechanics and reliability requirements.

本申请实施例还提供了一种电子设备，电子设备包括上述实施例所述的封装结构。本申请实施例提供的电子设备可以是具有大宽带需求的通讯或计算需求的产品设备。An embodiment of the present application also provides an electronic device. The electronic device includes the packaging structure described in the above embodiment. The electronic device provided by the embodiment of the present application may be a product device with communication or computing requirements that require large bandwidth.

本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。Each embodiment in this specification is described in a progressive manner. The same and similar parts between the various embodiments can be referred to each other. Each embodiment focuses on its differences from other embodiments.

以上为本申请的具体实现方式。应当理解，以上所述实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。The above is the specific implementation method of this application. It should be understood that the above embodiments are only used to illustrate the technical solution of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still The technical solutions described in the foregoing embodiments may be modified, or some of the technical features may be equivalently replaced; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present application.

Claims

一种封装结构，其特征在于，包括：A packaging structure, characterized by including:

高密印刷电路板，所述高密印刷电路板的一侧表面设置有第一元器件；A high-density printed circuit board, a first component is provided on one side surface of the high-density printed circuit board;

供电印刷电路板，所述供电印刷电路板设置于所述高密印刷电路板的另一侧表面；所述供电印刷电路板的一侧表面设置有第二元器件；所述第二元器件通过所述供电印刷电路板和所述高密印刷电路板实现与所述第一元器件的电连接，用于为所述第一元器件供电；A power supply printed circuit board, the power supply printed circuit board is provided on the other side surface of the high-density printed circuit board; a second component is provided on one side surface of the power supply printed circuit board; the second component passes through The power supply printed circuit board and the high-density printed circuit board realize electrical connection with the first component and are used to supply power to the first component;

第一保护板，设置于所述高密印刷电路板设置有所述第一元器件的一侧；A first protection board, disposed on the side of the high-density printed circuit board on which the first component is disposed;

紧固结构，所述紧固结构贯穿所述第一保护板和所述高密印刷电路板，实现所述高密印刷电路板和所述第一保护板的固定连接。A fastening structure that penetrates the first protective board and the high-density printed circuit board to achieve a fixed connection between the high-density printed circuit board and the first protective board.
根据权利要求1所述的封装结构，其特征在于，所述第一元器件设置于所述高密印刷电路板远离所述供电印刷电路板的一侧表面；The packaging structure according to claim 1, wherein the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board;

所述高密印刷电路板具有避让开口，在所述避让开口暴露的所述供电印刷电路板上设置有所述第二元器件。The high-density printed circuit board has an escape opening, and the second component is disposed on the power supply printed circuit board exposed by the escape opening.
根据权利要求1所述的封装结构，其特征在于，所述第一元器件设置于所述高密印刷电路板远离所述供电印刷电路板的一侧表面，所述第二元器件设置于所述供电印刷电路板远离所述高密印刷电路板的一侧表面。The packaging structure of claim 1, wherein the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board, and the second component is disposed on the A side surface of the power supply printed circuit board away from the high-density printed circuit board.
根据权利要求3所述的封装结构，其特征在于，所述供电印刷电路板的数量为多个，每个供电印刷电路板为对应的第一元器件进行供电。The packaging structure according to claim 3, characterized in that there are multiple power supply printed circuit boards, and each power supply printed circuit board supplies power to a corresponding first component.
根据权利要求2或3所述的封装结构，其特征在于，还包括：第二保护板；The packaging structure according to claim 2 or 3, further comprising: a second protection plate;

所述第二保护板设置于所述供电印刷电路板远离所述高密印刷电路板的一侧。The second protection board is disposed on the side of the power supply printed circuit board away from the high-density printed circuit board.
根据权利要求5所述的封装结构，其特征在于，若所述高密印刷电路板具有避让开口，在所述避让开口暴露的所述供电印刷电路板上设置有所述第二元器件，还包括：The packaging structure according to claim 5, wherein if the high-density printed circuit board has an escape opening, the second component is disposed on the power supply printed circuit board exposed by the escape opening, and further includes :

所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置有第三元器件，所述第二保护板用于保护所述第三元器件。A third component is provided on a side surface of the power supply printed circuit board away from the high-density printed circuit board, and the second protection plate is used to protect the third component.
根据权利要求5所述的封装结构，其特征在于，所述第一保护板和所述第二保护板分别用于为所述第一元器件和所述第二元器件进行散热。The packaging structure according to claim 5, wherein the first protection plate and the second protection plate are respectively used to dissipate heat for the first component and the second component.
根据权利要求5所述的封装结构，其特征在于，所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，所述紧固结构贯穿所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板，实现所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板的固定连接。The packaging structure according to claim 5, wherein the characteristic size of the high-density printed circuit board is equal to the characteristic size of the power supply printed circuit board, and the fastening structure penetrates the first protection plate and the high-density printed circuit board. The printed circuit board, the power supply printed circuit board and the second protection board realize the fixed connection of the first protection board, the high density printed circuit board, the power supply printed circuit board and the second protection board.
根据权利要求5所述的封装结构，其特征在于，还包括：连接器件；The packaging structure according to claim 5, further comprising: a connecting device;

所述连接器件设置于所述高密印刷电路板远离所述供电印刷电路板的一侧表面，所述第一保护板具有第一开口，所述第一开口暴露所述连接器件；The connecting device is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board, the first protection plate has a first opening, and the first opening exposes the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，所述连接器件设置于所述供电印刷电路板远离所述高密印刷电路板的一侧表面，所述第二保护板具有第二开口，所述第二开口暴露所述连接器件；When the characteristic size of the high-density printed circuit board is equal to the characteristic size of the power supply printed circuit board, the connecting device is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board, and the second protection device The board has a second opening exposing the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸大于所述供电印刷电路板的特征尺寸，所述连接器件设置于所述高密印刷电路板靠近所述供电印刷电路板的一侧表面，所述第二保护板具有第三开口，所述第三开口暴露所述连接器件。When the characteristic size of the high-density printed circuit board is larger than the characteristic size of the power supply printed circuit board, the connecting device is disposed on a side surface of the high-density printed circuit board close to the power supply printed circuit board, and the second protection device The plate has a third opening exposing the connection means.
根据权利要求1-9任意一项所述的封装结构，其特征在于，所述第一元器件和所述第一保护板之间还包括导热材料。The packaging structure according to any one of claims 1 to 9, characterized in that a thermally conductive material is further included between the first component and the first protection plate.
根据权利要求1-9任意一项所述的封装结构，其特征在于，还包括：第一支撑结构；The packaging structure according to any one of claims 1-9, further comprising: a first support structure;

所述第一支撑结构设置于所述第一保护板和所述高密印刷电路板之间。The first support structure is disposed between the first protection board and the high-density printed circuit board.
根据权利要求1-9任意一项所述的封装结构，其特征在于，所述高密印刷电路板和所述供电印刷电路板之间还包括粘接材料。The packaging structure according to any one of claims 1 to 9, characterized in that an adhesive material is further included between the high-density printed circuit board and the power supply printed circuit board.
根据权利要求1-9任意一项所述的封装结构，其特征在于，所述第一元器件包括半导体芯片和表面贴装器件。The packaging structure according to any one of claims 1 to 9, characterized in that the first component includes a semiconductor chip and a surface mount device.
根据权利要求1-9任意一项所述的封装结构，其特征在于，所述第二元器件包括供电器件，所述供电器件包括电压调节模块、谐振转换器和电容。The packaging structure according to any one of claims 1 to 9, characterized in that the second component includes a power supply device, and the power supply device includes a voltage adjustment module, a resonant converter and a capacitor.
一种封装方法，其特征在于，包括：A packaging method, characterized by including:

在高密印刷电路板的一侧表面设置第一元器件，在所述高密印刷电路板的另一侧设置供电印刷电路板，所述供电印刷电路板的一侧表面设置有第二元器件；所述第二元器件通过所述高密印刷电路板和所述供电印刷电路板实现与所述第一元器件的电连接，用于为所述第一元器件供电；A first component is provided on one side surface of the high-density printed circuit board, a power supply printed circuit board is provided on the other side of the high-density printed circuit board, and a second component is provided on one side surface of the power supply printed circuit board; The second component is electrically connected to the first component through the high-density printed circuit board and the power supply printed circuit board, and is used to power the first component;

在所述高密印刷电路板设置有所述第一元器件的一侧设置第一保护板；设置紧固结构，所述紧固结构贯穿所述第一保护板和所述高密印刷电路板，实现所述高密印刷电路板和所述第一保护板的固定连接。A first protective plate is provided on the side of the high-density printed circuit board where the first component is provided; a fastening structure is provided, and the fastening structure penetrates the first protective plate and the high-density printed circuit board to achieve Fixed connection of the high-density printed circuit board and the first protection board.
根据权利要求15所述的方法，其特征在于，在高密印刷电路板的一侧表面设置第一元器件之前，还包括：The method according to claim 15, characterized in that before arranging the first component on one side surface of the high-density printed circuit board, it further includes:

在所述高密印刷电路板形成避让开口；Form an escape opening in the high-density printed circuit board;

所述在所述高密印刷电路板的另一侧设置供电印刷电路板，所述供电印刷电路板上设置有第二元器件包括：The power supply printed circuit board is provided on the other side of the high-density printed circuit board, and the second component provided on the power supply printed circuit board includes:

所述供电印刷电路板被所述避让开口暴露的一侧表面设置有所述第二元器件。The second component is disposed on a side surface of the power supply printed circuit board exposed by the avoidance opening.
根据权利要求16所述的方法，其特征在于，还包括：The method of claim 16, further comprising:

在所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置第三元器件。A third component is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board.
根据权利要求15所述的方法，其特征在于，所述第一元器件设置于高密印刷电路板远离所述供电印刷电路板的一侧表面；The method according to claim 15, characterized in that the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board;

所述在所述高密印刷电路板的另一侧设置供电印刷电路板，所述供电印刷电路板上设置有第二元器件包括：The power supply printed circuit board is provided on the other side of the high-density printed circuit board, and the second component provided on the power supply printed circuit board includes:

在所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置所述第二元器件。The second component is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board.
根据权利要求18所述的方法，其特征在于，所述供电印刷电路板的数量为多个，每个供电印刷电路板为对应的第一元器件进行供电。The method according to claim 18, characterized in that there are multiple power supply printed circuit boards, and each power supply printed circuit board supplies power to a corresponding first component.
根据权利要求17或18所述的方法，其特征在于，在设置紧固结构之前，还包括：The method according to claim 17 or 18, characterized in that, before setting the fastening structure, it further includes:

在所述供电印刷电路板远离所述高密印刷电路板的一侧设置第二保护板。A second protection board is provided on the side of the power supply printed circuit board away from the high-density printed circuit board.
根据权利要求20所述的方法，其特征在于，所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，所述设置紧固结构包括：The method according to claim 20, wherein the characteristic size of the high-density printed circuit board is equal to the characteristic size of the power supply printed circuit board, and the setting of the fastening structure includes:

所述紧固结构贯穿所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板，实现所述第一保护板、所述高密印刷电路板、所述供电印刷电路板和所述第二保护板的固定连接。The fastening structure penetrates the first protective board, the high-density printed circuit board, the power supply printed circuit board and the second protective board to realize the first protective board, the high-density printed circuit board, the Fixed connection between the power supply printed circuit board and the second protection board.
根据权利要求20所述的方法，其特征在于，还包括：The method according to claim 20, further comprising:

在所述高密印刷电路板远离所述供电印刷电路板的一侧表面设置连接器件，所述第一保护板具有第一开口，所述第一开口暴露所述连接器件；A connecting device is provided on a side surface of the high-density printed circuit board away from the power supply printed circuit board, the first protective plate has a first opening, and the first opening exposes the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸等于所述供电印刷电路板的特征尺寸，在所述供电印刷电路板远离所述高密印刷电路板的一侧表面设置所述连接器件，所述第二保护板具有第二开口，所述第二开口暴露所述连接器件；When the characteristic size of the high-density printed circuit board is equal to the characteristic size of the power supply printed circuit board, the connecting device is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board, and the second protection device The board has a second opening exposing the connecting device;

或，or,

当所述高密印刷电路板的特征尺寸大于所述供电印刷电路板的特征尺寸，在所述高密印刷电路板靠近所述供电印刷电路板的一侧表面设置所述连接器件，所述第二保护板具有第三开口，所述第三开口暴露所述连接器件。When the characteristic size of the high-density printed circuit board is larger than the characteristic size of the power supply printed circuit board, the connecting device is provided on a side surface of the high-density printed circuit board close to the power supply printed circuit board, and the second protection device The plate has a third opening exposing the connection means.
根据权利要求15-22任意一项所述的方法，其特征在于，在所述高密印刷电路板设置有所述第一元器件的一侧设置第一保护板之前，还包括：The method according to any one of claims 15 to 22, characterized in that before arranging the first protection plate on the side of the high-density printed circuit board where the first component is arranged, it further includes:

在所述第一元器件远离所述高密印刷电路板的一侧表面覆盖导热材料。A surface of the first component away from the high-density printed circuit board is covered with a thermally conductive material.
根据权利要求15-22任意一项所述的方法，其特征在于，在所述高密印刷电路板设置有所述第一元器件的一侧设置第一保护板之前，还包括：The method according to any one of claims 15 to 22, characterized in that before arranging the first protection plate on the side of the high-density printed circuit board where the first component is arranged, it further includes:

在所述高密印刷电路板设置所述第一元器件的一侧设置第一支撑结构。A first support structure is provided on the side of the high-density printed circuit board on which the first component is provided.
根据权利要求15-22任意一项所述的方法，其特征在于，还包括：The method according to any one of claims 15-22, further comprising:

在所述高密印刷电路板和所述供电印刷电路板之间填充粘接材料。An adhesive material is filled between the high-density printed circuit board and the power supply printed circuit board.
根据权利要求15-22任意一项所述的方法，其特征在于，所述第一元器件包括半导体芯片和表面贴装器件。The method according to any one of claims 15-22, wherein the first component includes a semiconductor chip and a surface mount device.
根据权利要求15-22任意一项所述的方法，其特征在于，所述第二元器件包括供电器件，所述供电器件包括电压调节模块、谐振转换器和电容。The method according to any one of claims 15-22, characterized in that the second component includes a power supply device, and the power supply device includes a voltage adjustment module, a resonant converter and a capacitor.
一种电子设备，其特征在于，所述电子设备包括如权利要求1至14中任一项所述的封装结构。An electronic device, characterized in that the electronic device includes the packaging structure according to any one of claims 1 to 14.