WO2023221071A1 - 显示面板及其制备方法和显示装置 - Google Patents
显示面板及其制备方法和显示装置 Download PDFInfo
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- WO2023221071A1 WO2023221071A1 PCT/CN2022/094012 CN2022094012W WO2023221071A1 WO 2023221071 A1 WO2023221071 A1 WO 2023221071A1 CN 2022094012 W CN2022094012 W CN 2022094012W WO 2023221071 A1 WO2023221071 A1 WO 2023221071A1
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- Prior art keywords
- light
- micro
- emitting devices
- layer
- driving array
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- 238000002360 preparation method Methods 0.000 title claims abstract description 24
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
Definitions
- the present application relates to the field of display technology, and in particular, to a display panel, a display panel preparation method and a display device.
- Micro LED (Micro Light Emitting Diode) display technology is currently widely used in various display devices, and display devices usually need to have touch screen functions.
- the existing touch screen production processes are mainly divided into in-line (In- cell There are two types: Touch) and external (On-cell Touch).
- the in-cell process is usually used on LCD (Liquid Crystal Display, liquid crystal display) or OLED (Organic Touch).
- the existing embedded structure is used in Micro When displaying LED displays, due to the influence of the parasitic capacitance of the Micro LED itself, it is easy to cause the problem of inaccurate judgment of the position of the touch object; the plug-in process requires the sensing circuit or electrode to be prepared on the plug-in glass substrate, and there are high preparation costs and process Difficulty and other issues. Therefore, existing Micro LED touch display panels have the problem of incompatibility between high precision and low difficulty.
- embodiments of the present application provide a display panel, a display panel preparation method and a display device, which are characterized by low cost and accurate sensing.
- an embodiment of the present application provides a display panel, including: a display substrate, the display substrate including a driving array layer and a plurality of micro-light-emitting devices, the plurality of micro-light-emitting devices contact and electrically connect the driving array layer ;
- the capacitive touch sensing structure is located on one side of the driving array layer adjacent to the plurality of micro light-emitting devices and is spaced apart from the plurality of micro light-emitting devices.
- the capacitive touch sensing structure is electrically connected to the Driver array layer.
- the display panel further includes a light-shielding layer disposed between the plurality of micro-light-emitting devices and exposing a side of the plurality of micro-light-emitting devices away from the driving array layer.
- the display panel further includes a planarization layer covering the light shielding layer and a side of the plurality of micro devices away from the driving array layer; and conductive vias penetrating the planarization layer and The light-shielding layer extends to the driving array layer; the capacitive touch sensing structure includes a transparent sensing circuit layer covering a side of the planarization layer away from the light-shielding layer and electrically connected through the conductive via hole. Connect the driver array layer.
- the capacitive touch sensing structure is disposed in the light-shielding layer and between the plurality of micro-light-emitting devices; or the capacitive touch-sensing structure is disposed in the light-shielding layer away from the One side of the driving array layer and located between the plurality of micro-light emitting devices.
- the light-shielding layer includes a plurality of isolation pillars protruding from the driving array layer in a direction close to the side of the plurality of micro-light-emitting devices. Between any two adjacent micro-light-emitting devices, One isolating post is provided correspondingly in each space, and the height of each of the isolating posts protruding from the driving array layer is not less than the height of the plurality of micro-light-emitting devices protruding from the driving array layer.
- the capacitive touch sensing structure is disposed corresponding to a side of a target isolation pillar among the plurality of isolation pillars away from the driving array layer.
- the plurality of isolation columns are made of light reflective material.
- Another embodiment of the present application provides a display panel preparation method, including: providing a display substrate, the display substrate including a driving array layer and a plurality of micro-light-emitting devices, the plurality of micro-light-emitting devices contact and electrically connect the driving array layer; forming a capacitive touch sensing structure on one side of the display substrate adjacent to the plurality of micro light emitting devices, so that the capacitive touch sensing structure is spaced apart from the plurality of micro light emitting devices and is electrically connected to the Driver array layer.
- the display panel preparation method further includes: preparing a light-shielding layer between the plurality of micro-light-emitting devices and exposing a side of the micro-light-emitting devices away from the driving array layer.
- preparing a light-shielding layer between the plurality of micro-light-emitting devices and exposing a side of the micro-light-emitting devices away from the driving array layer includes: One side of the driving array layer is covered with a light-shielding film, and a side of the micro-light-emitting device away from the driving array layer is exposed to form the light-shielding layer; or a light-shielding material is filled between the multiple micro-light-emitting devices. liquid, causing the light-shielding material liquid to expose the side of the micro-light-emitting device away from the driving array layer, and solidifying the light-shielding material liquid to form the light-shielding layer.
- the display panel preparation method further includes: preparing a planarization layer on a side of the light shielding layer away from the driving array layer; A capacitive touch sensing structure is formed on one side, so that the capacitive touch sensing structure is spaced apart from the plurality of micro-light-emitting devices and electrically connected to the driving array layer, including: forming a structure through the planarization layer and the The conductive via hole of the light shielding layer; covering the transparent sensing circuit layer on the side of the planarization layer away from the light shielding layer, and allowing the transparent sensing circuit layer to be electrically connected to the driving array layer through the conductive via hole, so The transparent sensing circuit layer forms the capacitive touch sensing structure.
- a capacitive touch sensing structure is formed on a side of the display substrate adjacent to the plurality of micro light emitting devices, so that the capacitive touch sensing structure is spaced apart from the plurality of micro light emitting devices.
- Providing and electrically connecting the driving array layer includes: forming a capacitive touch sensing structure between two adjacent target micro-light-emitting devices among the plurality of micro-light-emitting devices.
- the display panel preparation method further includes: forming a plurality of isolation pillars on the light-shielding layer, so that an isolation pillar is formed between any two adjacent micro-light-emitting devices, and each of the The height of the isolation pillar protruding from the driving array layer is not less than the height of the plurality of micro-light emitting devices protruding from the driving array layer.
- forming a capacitive touch sensing structure between two adjacent micro-light-emitting devices among the plurality of micro-light-emitting devices includes: target isolation in the plurality of isolation columns. The side of the pillar away from the driving array layer forms a capacitive touch sensing structure.
- Another embodiment of the present application provides a display device, including a display panel as described in any of the foregoing embodiments, or a display panel manufactured by a display panel preparation method as described in any of the foregoing embodiments.
- the capacitive touch sensing structure and multiple micro light-emitting devices are arranged on the same side of the driving array layer.
- the top surface of the driving array layer may be arranged between multiple micro light-emitting devices and surrounded by multiple micro light-emitting devices, so that the capacitive touch sensing structure will not be affected by the parasitic capacitance of the micro light-emitting devices themselves and cause inaccurate judgment.
- the plug-in touch process is less difficult and cost-effective.
- the capacitive touch sensing structure and multiple micro light-emitting devices are arranged on the same side of the driving array layer.
- the top surface of the driving array layer may be arranged between multiple micro light-emitting devices and surrounded by multiple micro light-emitting devices, so that the capacitive touch sensing structure will not be affected by the parasitic capacitance of the micro light-emitting devices themselves and cause inaccurate judgment.
- the plug-in touch process is less difficult and cost-effective.
- FIG. 1 is a schematic structural diagram of a display panel provided by the first embodiment of the present application.
- FIG. 2 is a schematic structural diagram of a display panel provided by the second embodiment of the present application.
- FIG. 3 is a schematic structural diagram of another display panel provided by the second embodiment of the present application.
- FIG. 4 is a schematic structural diagram of another display panel provided by the second embodiment of the present application.
- FIG. 5 is a schematic structural diagram of a specific embodiment of the display panel shown in FIG. 2 .
- FIG. 6 is a schematic structural diagram of a specific embodiment of the display panel shown in FIG. 4 .
- FIG. 7 is a schematic structural diagram of a specific embodiment of the display panel shown in FIG. 6 .
- FIG. 8 is a schematic top structural view of a display panel in an embodiment of the present application.
- FIG. 9 is a flow block diagram of a display panel manufacturing method provided by an embodiment of the present application.
- FIG. 10 is a schematic flowchart of a display panel preparation method provided by an embodiment of the present application.
- FIG. 11 is a schematic flowchart of a display panel manufacturing method provided by another embodiment of the present application.
- Figure 12 is a schematic structural diagram of a display device provided by an embodiment of the present application.
- 100 Display device; 10: Display panel; 11: Display substrate; 111: Driving array layer; 112: Multiple micro-light-emitting devices; 12: Capacitive touch sensing structure; 121: Transparent sensing circuit layer; 13: Light shielding layer; 131: isolation pillar; 14: planarization layer; 15: conductive via hole.
- a first embodiment of the present application provides a display panel 10 .
- the display panel 10 includes, for example, a display substrate 11 , a capacitive touch sensing structure 12 , a light-shielding layer 13 and a planarization layer 14 .
- the display substrate 11 includes a driving array layer 111 and a plurality of micro-light-emitting devices 112.
- the plurality of micro-light-emitting devices 112 are in contact with and electrically connected to the driving array layer 111.
- the light-shielding layer 13 is disposed between the plurality of micro-light-emitting devices 112 and exposes the side of the plurality of micro-light-emitting devices 112 away from the driving array layer 111 .
- the planarization layer 14 covers the light-shielding layer 13 and the side of the plurality of micro-light-emitting devices 112 away from the driving array layer 111 .
- a conductive via 15 is also formed on the display substrate 10 .
- the conductive via 15 penetrates the planarization layer 14 and the light-shielding layer 13 and extends to the driving array layer 111 .
- the capacitive touch sensing structure 12 is located on one side of the driving array layer 111 adjacent to the plurality of micro light-emitting devices 112 and is spaced apart from the plurality of micro light-emitting devices 112.
- the capacitive touch sensing structure 12 is electrically connected to the driving array layer 111.
- the capacitive touch sensing structure 12 includes a transparent sensing circuit layer 121.
- the transparent sensing circuit layer 121 covers the side of the planarization layer 14 away from the light shielding layer 13 and is electrically connected to the driving array through the conductive via 15.
- the planarization layer 14 isolates the transparent sensing circuit layer 121 from the micro light-emitting devices 112 , that is, the capacitive touch sensing structure 12 is spaced apart from the plurality of micro light-emitting devices 112 through the planarization layer 14 .
- the micro light-emitting device 112 is, for example, a micro light-emitting diode device, that is, a Micro light-emitting diode device. LED.
- the driving array layer 111 includes a TFT driving array for driving the micro-light emitting device 112 to emit light. Specifically, it includes a substrate glass and a buffer layer (buffer layer) stacked in sequence on the surface of the substrate glass. layer), active layer (active layer), gate insulation layer (GI layer), first metal layer (metal layer), first passivation layer layer), a second metal layer and a second passivation layer, a third metal layer, etc.
- the active layer, the first metal layer and the second metal layer are used to form a TFT (Thin Film Transistor (thin film transistor) device structure
- the gate insulation layer, the first passivation layer and the second passivation layer are mainly used for insulation isolation between the active layer, the first metal layer and the second metal layer
- the third The metal layer may be used to electrically connect devices other than the drive array layer 111 .
- the driving array layer 111 is specifically a TFT driving board used to drive the micro-light-emitting devices 112 to emit light
- the display substrate 11 refers to a TFT driving array board on which a plurality of micro-light-emitting devices 112 have been welded.
- the micro light-emitting device 112 is specifically, for example, soldered on the third metal layer of the driving array layer 111 to electrically connect the driving array layer 111 .
- the light-shielding layer 13 is, for example, a whole layer of BM (Black Matrix) film, that is, a layer of black film, or other BM materials.
- the light-shielding layer 13 is disposed between the plurality of micro-light-emitting devices 112.
- the aforementioned light-shielding layer 13 exposes the side of the micro-light-emitting devices 112 away from the driving array layer 111. Specifically, it means that the light-shielding layer 13 does not block the micro-light-emitting devices 112 from driving.
- the upper surface of the light shielding layer 13 is flush with the upper surface of the micro light emitting device 112, and exposes the upper surface of the micro light emitting device 112 to block adjacent micro light emitting devices.
- the optical crosstalk between the devices 112 causes multiple micro-light-emitting devices 112 to emit light upward.
- the upper surface of the micro-light-emitting device 112 needs to be hollowed out, so that the surface of the micro-light-emitting device 112 can be exposed to the light-shielding layer 13 without being blocked.
- the planarization layer 14 covers the light-shielding layer 13 and the plurality of micro-light-emitting devices 112 to level the upper surface of the display substrate 11.
- the thickness between the upper surface of the planarization layer 14 and the upper surface of the driving array layer 111 is 7 ⁇ 15 ⁇ m.
- the conductive via 15 is formed, for example, by yellow light fabrication or plasma etching.
- the transparent sensing circuit layer 121 is, for example, an ITO (Indium tin oxide, indium tin oxide) film, which is used to sense changes in capacitance caused by the touch object.
- the transparent sensing circuit layer 121 is electrically connected to the driving array layer 11 through, for example, conductive vias 15
- the third metal layer transmits the sensing signal from the internal circuit of the driving array layer 11 to the IC (Integrated Circuit) chip of the TFT driving board to determine the position of the touch signal source to achieve the touch function of identifying the touch object.
- the display panel 10 provided in this embodiment can solve the problem of Micro LED when the touch sensing circuit is located under the Micro LED in the prior art.
- the internal capacitance value of the LED changes due to the applied current and voltage, which blocks or changes the difference in capacitance value illuminated by the touch object, thus causing inaccurate judgment. That is, the display panel 10 provided in this embodiment has a simple structure and accurate touch control.
- a second embodiment of the present application provides another display panel 10 .
- the display panel 10 includes, for example, a substrate 11 , a capacitive touch sensing structure 12 and a light-shielding layer 13 .
- the display substrate 11 includes a driving array layer 111 and a plurality of micro-light-emitting devices 112.
- the plurality of micro-light-emitting devices 112 contact the driving array layer 111 and are electrically connected to the driving array layer 111.
- the light-shielding layer 13 is disposed between the plurality of micro-light-emitting devices 112 and exposes the side of the plurality of micro-light-emitting devices 112 away from the driving array layer 111 .
- the capacitive touch sensing structure 12 is located on one side of the driving array layer 111 adjacent to the plurality of micro light-emitting devices 112 and is spaced apart from the plurality of micro light-emitting devices 112.
- the capacitive touch sensing structure 12 is electrically connected to the driving array layer 111.
- the micro light-emitting device 112 is, for example, a micro light-emitting diode device, that is, a Micro light-emitting diode device. LED.
- the driving array layer 111 includes a TFT driving array for driving the micro-light emitting device 112 to emit light. Specifically, it includes a substrate glass and a buffer layer (buffer layer) stacked in sequence on the surface of the substrate glass. layer), active layer (active layer), gate insulation layer (GI layer), first metal layer (metal layer), first passivation layer layer), a second metal layer and a second passivation layer, a third metal layer, etc.
- the active layer, the first metal layer and the second metal layer are used to form a TFT (Thin Film Transistor (thin film transistor) device structure
- the gate insulation layer, the first passivation layer and the second passivation layer are mainly used for insulation isolation between the active layer, the first metal layer and the second metal layer
- the third The metal layer may be used to electrically connect devices other than the drive array layer 111 .
- the driving array layer 111 is specifically a part of the TFT driving array used to drive the micro-light-emitting devices 112 to emit light, that is, the display substrate 11 refers to a TFT driving board on which a plurality of micro-light-emitting devices 112 have been welded, and the micro-light-emitting devices 112 specifically For example, it is welded on the third metal layer of the driving array layer 111 to electrically connect the driving array layer 111 .
- the capacitive touch sensing structure 12 is disposed in the light-shielding layer 13 and between the plurality of micro-light-emitting devices 112 .
- the light-shielding layer 13 is, for example, a full layer of BM (Black Matrix, black matrix) film, or other BM materials, and is disposed between multiple micro-light-emitting devices 112 , wherein the aforementioned light-shielding layer 13 exposes the micro-light-emitting devices.
- the side of 112 away from the driving array layer 111 specifically refers to the side of the light-shielding layer 13 that does not block the micro-light-emitting device 112 away from the driving array layer 111.
- the upper surface of the light-shielding layer 13 is in contact with the micro-luminescent device.
- the upper surface of the device 112 is flush and exposes the upper surface of the micro-light-emitting devices 112 to block optical crosstalk between adjacent micro-light-emitting devices 112 so that multiple micro-light-emitting devices 112 emit light upward.
- the upper surface of the micro-light-emitting device 112 needs to be hollowed out, so that the surface of the micro-light-emitting device 112 can be exposed to the light-shielding layer 13 without being blocked. Just cover it.
- the capacitive touch sensing structure 12 is located between the plurality of micro-light-emitting devices 112 , specifically referring to FIG. 2 , for example, located on the bottom side of the light-shielding layer 13 close to the driving array layer 111 . Or referring to FIG.
- the capacitive touch sensing structure 12 is, for example, located between the upper and lower surfaces of the light shielding layer 13 .
- the capacitive touch sensing structure 12 is, for example, located on the top side of the light shielding layer away from the driving array layer 111 .
- the capacitance value variation of the sensing touch object can be increased, making the touch signal more sensitive and increasing the sensing sensitivity.
- the capacitive touch sensing structure 12 forms a circuit surrounding the micro-light emitting device 112. For example, four sensing areas are formed in Figure 8. Of course, the area in Figure 8 is only an example.
- the capacitive touch sensing structures 12 in different sensing areas are electrically connected to the third layer of the driving array layer through conductive vias (not shown in Figure 2) at different positions in the light shielding layer 13, for example. Three metal layers.
- the internal circuit of the driving array layer 11 transmits the sensing signal to the IC chip of the TFT driving board to determine the position of the touch signal source, thereby achieving the touch function of identifying the touch object.
- the capacitive touch sensing structure 12 can be made of ITO or other metal materials, which can not only ensure the light emission of the micro-emitting device 112, but also avoid abnormal judgment caused by the influence of the parasitic capacitance of the micro-emitting device itself.
- the light-shielding layer 13 also includes a plurality of isolation pillars 131 protruding from the driving array layer 111 in a direction close to the micro-light-emitting devices 112. Any two adjacent micro-light-emitting devices One isolating post 131 is provided correspondingly between 112 , and the height of each isolating post 131 protruding from the driving array layer 111 is not less than the height of the plurality of micro-light-emitting devices 112 protruding from the driving array layer 111 .
- FIG. 5 is a schematic structural diagram of a specific embodiment of the display panel 10 shown in FIG. 2 .
- the light-shielding layer 13 is patterned and etched to form a plurality of isolation pillars 131.
- the isolation pillars 131 protrude from the driving array layer 111 to a height such as H1 shown in FIG. 5, and the micro-light-emitting devices 112 protrude from the driving array layer 111 at a height.
- H1 shown in FIG. 5
- H1 is not smaller than H2.
- FIG. 6 which is a schematic structural diagram of a specific embodiment of the display panel 10 shown in FIG. 4 .
- the capacitive touch sensing structure 12 corresponds to the side of the target isolation pillar provided in the plurality of isolation pillars 131 away from the driving array layer 111 .
- the capacitive touch sensing structure 12 is disposed on the top of the target isolation column.
- a capacitive touch sensing structure 12 is provided on the isolation pillar 131 between the first row, first column and the first row, second column of the micro-light-emitting devices 111 , that is, the isolation pillar 131 is the aforementioned isolation pillar 131 . target isolation column.
- This isolation pillar is not the target isolation pillar.
- the isolation pillars 131 block crosstalk between adjacent micro-light-emitting devices 112 and expose the upper surface of the micro-light-emitting devices 112 so that the micro-light-emitting devices 112 emit light upward. Further, refer to FIG. 7 , which is a schematic diagram of the specific embodiment of FIG. 6 , in which the isolation pillar 131 is made of light reflective material, so that the light emitted by the micro-light emitting device 112 can be recycled as much as possible.
- the third embodiment of the present application provides a display panel preparation method.
- the display panel preparation method provided by this embodiment includes, for example, step S1 and step S2.
- Step S1 Provide a display substrate, and the display substrate includes a driving array. layer and a plurality of micro-light-emitting devices, the plurality of micro-light-emitting devices contact the driving array layer and are electrically connected to the driving array layer;
- Step S2 Form a layer on the side of the display substrate adjacent to the plurality of micro-light-emitting devices.
- the capacitive touch sensing structure is configured to be spaced apart from the plurality of micro-light-emitting devices and electrically connected to the driving array layer.
- step S1 has the same structure as the display substrate 11 described in the first embodiment and the second embodiment, and will not be described again in this embodiment.
- step S1 and step S2 also include step S3: preparing a light-shielding layer between the plurality of micro-light-emitting devices and exposing the side of the micro-light-emitting devices away from the driving array layer. .
- step S4 preparing a planarization layer on the side of the light-shielding layer away from the driving array layer. After the surface of the light-shielding layer is leveled in step S4, step S2 is performed.
- Step S2 specifically includes step S21: forming a conductive via hole penetrating the planarization layer and the light-shielding layer;
- step S22 covering a transparent sensing circuit layer on the side of the planarization layer away from the light-shielding layer, and making the The transparent sensing circuit layer is electrically connected to the driving array layer through the conductive via hole, and the transparent sensing circuit layer forms the capacitive touch sensing structure.
- Step S21 conductive via holes are formed by, for example, yellow light processing or plasma etching.
- Step S3 specifically includes, for example, step S31: covering a light-shielding film on a side of the plurality of micro-light-emitting devices away from the driving array layer, and exposing a side of the micro-light-emitting devices away from the driving array layer to form the Light-shielding layer; specifically, for example, after covering the light-shielding film, use a polishing machine or a grinder to polish and remove excess parts, so that the upper surface of the micro-light-emitting device is exposed from the light-shielding layer without being blocked.
- the preparation steps of the display panel in this embodiment are as shown with reference to steps (a) to (f) in Figure 10 , (a) providing a display substrate ⁇ (b) covering a light-shielding film ⁇ (c) polishing to form a light-shielding layer ⁇ ( d) Prepare the planarization layer ⁇ (e) Form via holes ⁇ (f) Cover the transparent conductive layer.
- step S3 includes, for example, step S32: filling the light-shielding material liquid between the plurality of micro-light-emitting devices, so that the light-shielding material liquid exposes the side of the micro-light-emitting device away from the driving array layer. , solidify the light-shielding material liquid to form the light-shielding layer.
- the light-shielding material liquid is, for example, a material that is liquid in a heated state and has high fluidity, and has a cohesive function.
- the light-shielding material liquid is coated on the micro-light-emitting device by dropping or spin coating.
- step S32 in step S3 omits the polishing step and is simpler than the process of step S31 .
- the above-mentioned embodiment of the present invention can be used to prepare the display panel described in the first embodiment, which has the effect of simple process and has the same beneficial effects as the above-mentioned first embodiment. This embodiment will not be described again.
- the fourth embodiment of the present application provides a display panel preparation method.
- the display panel preparation method provided by this embodiment includes, for example, step S1 and step S2.
- Step S1 Provide a display substrate, and the display substrate includes a driving array. layer and a plurality of micro-light-emitting devices, the plurality of micro-light-emitting devices contact the driving array layer and are electrically connected to the driving array layer;
- Step S2 Form a layer on the side of the display substrate adjacent to the plurality of micro-light-emitting devices.
- the capacitive touch sensing structure is configured to be spaced apart from the plurality of micro-light-emitting devices and electrically connected to the driving array layer.
- step S2 specifically includes step S23: forming a capacitive touch sensing structure between two adjacent target micro-light-emitting devices among the plurality of micro-light-emitting devices.
- the target micro-light-emitting device can be part or all of the multiple micro-light-emitting devices, that is, the capacitive touch sensing structure can be only between some of the multiple micro-light-emitting devices, or it can also be between any two adjacent ones.
- a capacitive touch sensing structure is formed between the micro light-emitting devices, which is not limited in this embodiment.
- step S3 is also included: preparing a light-shielding layer between the plurality of micro-light-emitting devices and exposing the side of the micro-light-emitting devices away from the driving array layer. Or in some embodiments, step S3 may also be performed after step S23, for example.
- the structure performed before step S3 by step S23 may be used to prepare the display panel 10 as shown in the aforementioned FIGS. 2 and 3 .
- Performing step S3 after step S22 can be used to prepare the structure of the display panel 10 as shown in FIG. 4 .
- the step S23 may include, for example, the step of forming a conductive via, so that the capacitive touch sensing structure is electrically connected to the driving array layer through the conductive via.
- step S3 also includes, for example, step S33: forming a plurality of isolation pillars on the light-shielding layer, so that an isolation pillar is formed between any two adjacent micro-light-emitting devices, and each The height of each of the isolation pillars protruding from the driving array layer is not less than the height of the plurality of micro-light-emitting devices protruding from the driving array layer.
- the plurality of isolation pillars may be formed by patterning and etching the light-shielding layer, for example.
- step S33 may be performed after step S22 and may be used to prepare the display panel as shown in FIG. 5 .
- step S33 can also be performed before step S22.
- Step S22 specifically includes step S221: forming a capacitive touch sensing structure on the side of the target isolation pillar among the plurality of isolation pillars away from the driving array layer, which can be used to prepare A display panel as shown in Figure 6 or Figure 7.
- the display panel preparation method provided in this embodiment can be used to prepare the display panel 10 as described in the second embodiment, and therefore has the same beneficial effects as the second embodiment.
- a fifth embodiment of the present application provides a display device 100 .
- the display device 100 includes, for example, any one of the display panels 10 described in the first and second embodiments.
- the display device 100 can be, for example, any electronic product with a display function and a touch function, including but not limited to a television, a notebook computer, a desktop monitor, a tablet computer, a digital camera, a smart bracelet, smart glasses, a car monitor, a medical device Equipment, industrial control settings, touch interactive terminals, etc. are not limited in the embodiments of this application.
- the display device 100 adopts the display panel 10 described in the previous embodiment and therefore has the same beneficial effects as the previous embodiment.
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Abstract
本申请实施例公开了一种显示面板及其制备方法和一种显示装置。本申请实施例提供的显示面板包括:显示基板,所述显示基板包括驱动阵列层和多个微型发光器件,所述多个微型发光器件接触并电连接所述驱动阵列层;电容式触控感应结构,位于所述驱动阵列层邻近所述多个微型发光器件的一侧、且与所述多个微型发光器件间隔设置,所述电容式触控感应结构电连接所述驱动阵列层。本申请实施例具有结构简单、低成本且感应准确的特点。
Description
本申请涉及显示技术领域,尤其涉及一种显示面板、一种显示面板制备方法和一种显示装置。
Micro LED(Micro Light Emitting Diode,微型发光二极管)显示技术目前被广泛应用在各类显示设备中,而显示设备通常需要具有触屏功能,现有的触摸屏生产工艺主要分为内嵌式(In-cell
Touch)和外挂式(On-cell Touch)两种,内嵌式工艺通常使用在LCD(Liquid Crystal Display,液晶显示屏)上或者OLED(Organic
Light-Emitting Diode,有机发光半导体)显示屏上,现有内嵌式结构应用在Micro
LED显示上时由于Micro LED本身的寄生电容的影响易造成判断触控物位置失准的问题;而外挂式工艺需要将感测线路或者电极制备在外挂玻璃基板上,又存在制备成本高、工艺难度大等问题。因此现有的Micro
LED触控显示面板具有高精度和低难度不能兼容的问题。
因此,亟需提供一种新的方案以解决上述Micro LED触控面板的至少部分问题。
因此,为克服现有技术中的至少部分缺陷,本申请实施例提供了一种显示面板、一种显示面板制备方法和一种显示装置,具有低成本、感应准确的特点。
一方面,本申请一个实施例提供一种显示面板,包括:显示基板,所述显示基板包括驱动阵列层和多个微型发光器件,所述多个微型发光器件接触并电连接所述驱动阵列层;电容式触控感应结构,位于所述驱动阵列层邻近所述多个微型发光器件的一侧、且与所述多个微型发光器件间隔设置,所述电容式触控感应结构电连接所述驱动阵列层。
在一个实施例中,所述显示面板还包括遮光层,设置在所述多个微型发光器件之间,且露出所述多个微型发光器件远离所述驱动阵列层的一面。
在一个实施例中,所述显示面板还包括平坦化层,覆盖所述遮光层和所述多个微型器件远离所述驱动阵列层的一侧;以及导电过孔,贯穿所述平坦化层和所述遮光层并延伸至所述驱动阵列层;所述电容式触控感应结构包括透明感应电路层,覆盖在所述平坦化层远离所述遮光层的一侧且通过所述导电过孔电连接所述驱动阵列层。
在一个实施例中,所述电容式触控感应结构设置在所述遮光层内且位于所述多个微型发光器件之间;或者所述电容式触控感应结构设置在所述遮光层远离所述驱动阵列层的一侧,且位于所述多个微型发光器件之间。
在一个实施例中,所述遮光层包括朝靠近所述多个微型发光器件一侧的方向凸出于所述驱动阵列层的多个隔离柱,任意相邻的两个所述微型发光器件之间对应设置一个隔离柱,且每个所述隔离柱凸出于所述驱动阵列层的高度不小于所述多个微型发光器件凸出于所述驱动阵列层的高度。
在一个实施例中,所述电容式触控感应结构对应设置在所述多个隔离柱中的目标隔离柱远离所述驱动阵列层的一侧。
在一个实施例中,所述多个隔离柱采用光反射材料。
本申请另一个实施例提供一种显示面板制备方法,包括:提供显示基板,所述显示基板包括驱动阵列层和多个微型发光器件,所述多个微型发光器件接触并电连接所述驱动阵列层;在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层。
在一个实施例中,所述显示面板制备方法还包括:在所述多个微型发光器件之间制备遮光层,并露出所述微型发光器件远离所述驱动阵列层的一侧。
在一个实施例中,所述在所述多个微型发光器件之间制备遮光层,并露出所述微型发光器件远离所述驱动阵列层的一侧,包括:在所述多个微型发光器件远离所述驱动阵列层的一侧覆盖遮光薄膜,并露出所述微型发光器件远离所述驱动阵列层的一侧,以形成所述遮光层;或者在所述多个微型发光器件之间填充遮光材料液,使所述遮光材料液露出所述微型发光器件远离所述驱动阵列层的一侧,固化所述遮光材料液以形成所述遮光层。
在一个实施例中,所述显示面板制备方法还包括:在所述遮光层远离所述驱动阵列层的一侧制备平坦化层;所述在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层,包括:形成贯穿所述平坦化层和所述遮光层的导电过孔;在所述平坦化层远离所述遮光层的一侧覆盖透明感应电路层,并使得所述透明感应电路层通过所述导电过孔电连接所述驱动阵列层,所述透明感应电路层形成所述电容式触控感应结构。
在一个实施例中,所述在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层,包括:在所述多个微型发光器件中相邻的两个目标微型发光器件之间形成电容式触控感应结构。
在一个实施例中,所述显示面板制备方还包括:在所述遮光层形成多个隔离柱,使得任意相邻的两个所述微型发光器件之间形成一个隔离柱,且每个所述隔离柱凸出于所述驱动阵列层的高度不小于所述多个微型发光器件凸出于所述驱动阵列层的高度。
在一个实施例中,所述在所述多个微型发光器件中相邻的两个所述微型发光器件之间形成电容式触控感应结构,包括:在所述多个隔离柱中的目标隔离柱远离所述驱动阵列层的一侧形成电容式触控感应结构。
本申请的另一个实施例提供一种显示装置,包括如前述任意一项实施例所述的显示面板,或者包括如前述任意一项所述的显示面板制备方法制成的显示面板。
本申请上述实施例至少具有如下一个或多个有益效果:电容式触控感应结构与多个微型发光器件设置在驱动阵列层的同侧,通过将电容式触控感应结构设置在微型发光器件远离驱动阵列层的顶面或者设置在多个微型发光器件之间围绕多个微型发光器件设置,使得电容式触控感应结构不会受微型发光器件自身寄生电容影响造成判断失准的问题,相比于外挂式触控工艺的难度小、成本低。
通过以下参考附图的详细说明,本申请的其它方面和特征变得明显。但是应当知道,该附图仅仅为解释的目的设计,而不是作为本申请的范围的限定。还应当知道,除非另外指出,不必要依比例绘制附图,它们仅仅力图概念地说明此处描述的结构和流程。
本申请上述实施例至少具有如下一个或多个有益效果:电容式触控感应结构与多个微型发光器件设置在驱动阵列层的同侧,通过将电容式触控感应结构设置在微型发光器件远离驱动阵列层的顶面或者设置在多个微型发光器件之间围绕多个微型发光器件设置,使得电容式触控感应结构不会受微型发光器件自身寄生电容影响造成判断失准的问题,相比于外挂式触控工艺的难度小、成本低。
下面将结合附图,对本申请的具体实施方式进行详细的说明。
图1为本申请第一实施提供的显示面板的结构示意图。
图2为本申请第二实施例提供的一种显示面板的结构示意图。
图3为本申请第二实施例提供的另一种显示面板的结构示意图。
图4为本申请第二实施例提供的另一种显示面板的结构示意图。
图5为图2所示的显示面板的一个具体实施例的结构示意图。
图6为图4所示的显示面板的一个具体实施例的结构示意图。
图7为图6所示的显示面板的一个具体实施例的结构示意图。
图8为本申请一个实施例中显示面板的俯视结构示意图。
图9为本申请一个实施例提供的显示面板制备方法的流程方块图。
图10为本申请一个实施例提供的显示面板制备方法的流程示意图。
图11为本申请另一个实施例提供的显示面板制备方法的流程示意图。
图12为本申请一个实施例提供的显示装置的结构示意图。
【附图标记说明】
100:显示装置;10:显示面板;11:显示基板;111:驱动阵列层;112:多个微型发光器件;12:电容式触控感应结构;121:透明感应电路层;13:遮光层;131:隔离柱;14:平坦化层;15:导电过孔。
在此处键入本发明的最佳实施方式描述段落。
为使本申请的上述目的、特征和优点能够更加明显易懂,下面结合附图对本申请的具体实施方式做详细的说明。
为了使本领域普通技术人员更好地理解本申请的技术方案,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分的实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本申请保护的范围。
需要说明的是,本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应当理解这样使用的术语在适当情况下可以互换,以便这里描述的本申请实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、***、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其他步骤或单元。
还需要说明的是,本申请中多个实施例的划分仅是为了描述的方便,不应构成特别的限定,各种实施例中的特征在不矛盾的情况下可以相结合,相互引用。
【第一实施例】
如图1所示,本申请第一实施例提供一种显示面板10,显示面板10例如包括显示基板11、电容式触控感应结构12、遮光层13和平坦化层14。显示基板11包括驱动阵列层111和多个微型发光器件112,多个微型发光器件112接触并电连接驱动阵列层111。遮光层13设置在多个微型发光器件112之间且露出多个微型发光器件112远离驱动阵列层111的一面。平坦化层14覆盖遮光层13和多个微型发光器件112远离驱动阵列层111的一侧。显示基板10上还形成有导电过孔15,导电过孔15贯穿平坦化层14和遮光层13并延伸至驱动阵列层111。电容式触控感应结构12位于驱动阵列层111邻近多个微型发光器件112的一侧、且与多个微型发光器件112间隔设置,电容式触控感应结构12电连接驱动阵列层111。具体地,在本实施例中电容式触控感应结构12包括透明感应电路层121,透明感应电路层121覆盖在平坦化层14远离遮光层13的一侧且通过导电过孔15电连接驱动阵列层111。平坦化层14将透明感应电路层121与微型发光器件112隔离开来,即电容式触控感应结构12通过平坦化层14与多个微型发光器件112间隔设置。
其中,微型发光器件112例如具体为微型发光二极管器件,即Micro
LED。驱动阵列层111包括用于驱动微型发光器件112发光的TFT驱动阵列,具体地例如包括衬底玻璃以及在衬底玻璃的表面上依次堆叠的缓冲层(buffer
layer)、有源层(active layer)、栅极绝缘层(gateinsulationlayer,GI层)、第一金属层(metal layer)、第一钝化层(passivation
layer)、第二金属层和第二钝化层等、第三金属层等(图1中未示出),有源层、第一金属层和第二金属层用于形成TFT(Thin
Film Transistor,薄膜晶体管)器件结构,栅极绝缘层、第一钝化层和第二钝化层主要是用于有源层、第一金属层和第二金属层之间的绝缘隔离,第三金属层可用于与驱动阵列层111以外的器件电连接。也即驱动阵列层111具体地为用于驱动微型发光器件112发光的TFT驱动板,即显示基板11指的已经焊接有多个微型发光器件112的TFT驱动阵列板。微型发光器件112具体地例如焊接在驱动阵列层111的第三金属层上,以电连接驱动阵列层111。参照图1,遮光层13例如为整层的BM(Black Matrix,黑色矩阵)薄膜,即一层黑色的薄膜,或者其它BM材质。遮光层13设置在多个微型发光器件112之间,其中前述提到的遮光层13露出微型发光器件112远离驱动阵列层111的一面,具体指的是遮光层13不遮挡微型发光器件112远离驱动阵列层111的一面,例如遮光层13为整层的BM薄膜时遮光层13的上表面与微型发光器件112的上表面平齐,并露出微型发光器件112的上表面,以阻隔相邻微型发光器件112之间的光串扰,使得多个微型发光器件112朝上发光。或者在一些实施例中遮光层13的高度大于微型发光器件112的高度时,则需要对应微型发光器件112的上表面位置进行镂空,使得微型发光器件112的表面能外露于遮光层13而不被遮挡即可。平坦化层14覆盖在遮光层13和多个微型发光器件112上,以将显示基板11的上表面整平,平坦化层14的上表面至驱动阵列层111的上表面之间的厚度为7~15μm。导电过孔15例如通过黄光制成或等离子蚀刻形成。透明感应电路层121例如具体为ITO(Indium tin oxide,氧化铟锡)薄膜,用于感应触控物引起的电容值变化,透明感应电路层121例如通过导电过孔15电连接至驱动阵列层11的第三金属层,以由驱动阵列层11的内部线路将感应信号传输至TFT驱动板的IC(Integrated Circuit)芯片判断触控讯号源的位置,达到辨识触控物的触控功能。本实施例提供的显示面板10可以解决现有技术触控感应线路位于Micro LED 下方时,Micro
LED内部电容值因施加电流与电压而变化,遮蔽或改变触控物照成的电容值差异,从而造成判断失准的问题。即本实施例提供的显示面板10具有结构简单且触控准确的效果。
【第二实施例】
参照图2,本申请的第二实施例提供另一种显示面板10,显示面板10例如包括基板11、电容式触控感应结构12和遮光层13。显示基板11包括驱动阵列层111和多个微型发光器件112,多个微型发光器件112接触驱动阵列层111并电连接驱动阵列层111。遮光层13设置在多个微型发光器件112之间且露出多个微型发光器件112远离驱动阵列层111的一面。电容式触控感应结构12位于驱动阵列层111邻近多个微型发光器件112的一侧、且与多个微型发光器件112间隔设置,电容式触控感应结构12电连接驱动阵列层111。
其中,微型发光器件112例如具体为微型发光二极管器件,即Micro
LED。驱动阵列层111包括用于驱动微型发光器件112发光的TFT驱动阵列,具体地例如包括衬底玻璃以及在衬底玻璃的表面上依次堆叠的缓冲层(buffer
layer)、有源层(active layer)、栅极绝缘层(gateinsulationlayer,GI层)、第一金属层(metal layer)、第一钝化层(passivation
layer)、第二金属层和第二钝化层等、第三金属层等(图1中未示出),有源层、第一金属层和第二金属层用于形成TFT(Thin
Film Transistor,薄膜晶体管)器件结构,栅极绝缘层、第一钝化层和第二钝化层主要是用于有源层、第一金属层和第二金属层之间的绝缘隔离,第三金属层可用于与驱动阵列层111以外的器件电连接。也即驱动阵列层111具体地为用于驱动微型发光器件112发光的TFT驱动阵列的部分,即显示基板11指的已经焊接有多个微型发光器件112的TFT驱动板,微型发光器件112具体地例如焊接在驱动阵列层111的第三金属层上,以电连接驱动阵列层111。
在一个实施例中,具体地,电容式触控感应结构12设置在遮光层13内且位于多个微型发光器件112之间。参照图2,遮光层13例如为整层的BM(Black Matrix,黑色矩阵)薄膜,或者其它BM材质,设置在多个微型发光器件112之间,其中前述提到的遮光层13露出微型发光器件112远离驱动阵列层111的一面,具体指的是遮光层13不遮挡微型发光器件112远离驱动阵列层111的一面,例如遮光层13为整层的BM薄膜时遮光层13的上表面与微型发光器件112的上表面平齐,并露出微型发光器件112的上表面,以阻隔相邻微型发光器件112之间的光串扰,使得多个微型发光器件112朝上发光。或者在一些实施例中遮光层13的高度大于微型发光器件112的高度时,则需要对应微型发光器件112的上表面位置进行镂空,使得微型发光器件112的表面能外露于遮光层13而不被遮挡即可。电容式触控感应结构12位于多个微型发光器件112之间,具体地参照图2,例如位于遮光层13靠近驱动阵列层111的底侧。或者参照图3,在另一个实施例中电容式触控感应结构12例如位于遮光层13处于上下表面之间。再或者参照图4,在另外一个实施例中电容式触控感应结构12例如位于遮光层远离驱动阵列层111一侧的顶侧。将电容式触控感应结构12设置在遮光层13的中间位置和顶部位置时,可以增加感应触控物的电容值变异量,使得触控信号更加敏感,增加感应灵敏度。图2、图3和图4所示的显示面板10的俯视结构示意图例如可以参照图8,电容式触控感应结构12形成围绕微型发光器件112的线路,例如图8中形成四个感应区域,当然图8的区域仅为一种示例,不同感应区域的电容式触控感应结构12例如通过遮光层13内不同位置的导电过孔(图2中未示出)电连接至驱动阵列层的第三金属层。以由驱动阵列层11的内部线路将感应信号传输至TFT驱动板的IC芯片判断触控讯号源的位置,达到辨识触控物的触控功能。此时电容式触控感应结构12可选ITO材质或者其它金属材质,既可保证微型发器件112的出光,又可以避免微型发光器件自身寄生电容的影响导致的判断异常。
更具体地,在一个实施例中,遮光层13内还包括靠近多个微型发光器件112一侧的方向凸出于驱动阵列层111的多个隔离柱131,任意相邻的两个微型发光器件112之间对应设置一个隔离柱131,且每个隔离柱131凸出于驱动阵列层111的高度不小于多个微型发光器件112凸出于驱动阵列层111的高度。例如参照图5,其为图2所示的显示面板10的一个具体实施例的结构示意图。遮光层13被进行图样化设计蚀刻形成多个隔离柱131,隔离柱131凸出于驱动阵列层111的高度例如为图5所示的H1,微型发光器件112凸出于驱动阵列层111的高度例如为图5所示的H2,其中,H1不小于H2。或者参照图6,其为图4所示的显示面板10的一个具体实施例的结构示意图。电容式触控感应结构12对应设置在多个隔离柱131中的目标隔离柱远离驱动阵列层111的一侧。电容式触控感应结构12设置在目标隔离柱的顶部。例如参照图8的俯视结构示意图,在第一行第一列与第一行第二列微型发光器件111之间的隔离柱131上设置电容式触控感应结构12,即该隔离柱131为前述的目标隔离柱。而第一行第一列与第二行第一列微型发光器件111之间的隔离柱上没有电容式触控感应结构12,该隔离柱不是目标隔离柱。通过隔离柱131阻隔相邻的微型发光器件112的串扰,并且露出微型发光器件112的上表面,以使微型发光器件112朝上发光。更进一步的,参照图7,其为图6的具体实施例的示意图,其中隔离柱131采用光反射材料,使得微型发光器件112发出的光可尽量回收。
【第三实施例】
本申请的第三实施例提供一种显示面板制备方法,参照图9,本实施例提供的显示面板制备方法例如包括步骤S1和步骤S2,步骤S1:提供显示基板,所述显示基板包括驱动阵列层和多个微型发光器件,所述多个微型发光器件接触所述驱动阵列层并电连接所述驱动阵列层;步骤S2:在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层。
其中,步骤S1中提供的显示基板例如与第一实施例和第二实施例中所述的显示基板11结构相同,本实施例不再赘述。在一个具体实施例中,步骤S1和步骤S2之间例如还包括步骤S3:在所述多个微型发光器件之间制备遮光层,并露出所述微型发光器件远离所述驱动阵列层的一侧。
步骤S3和步骤S2之间还包括步骤S4:在所述遮光层远离所述驱动阵列层的一侧制备平坦化层。通过步骤S4将遮光层的表面整平后再执行步骤S2。步骤S2具体包括步骤S21:形成贯穿所述平坦化层和所述遮光层的导电过孔;步骤S22:在所述平坦化层远离所述遮光层的一侧覆盖透明感应电路层,并使得所述透明感应电路层通过所述导电过孔电连接所述驱动阵列层,所述透明感应电路层形成所述电容式触控感应结构。
其中,步骤S21中例如通过黄光制程或者等离子蚀刻形成导电过孔。步骤S3例如具体包括步骤S31:在所述多个微型发光器件远离所述驱动阵列层的一侧覆盖遮光薄膜,并露出所述微型发光器件远离所述驱动阵列层的一侧,以形成所述遮光层;具体地例如在覆盖遮光薄膜后采用抛平机或者削机进行磨光处理去除多余的部分,以使微型发光器件的上表面从遮光层中露出而不被遮挡。本实施例中显示面板的制备步骤例如参照图10中的步骤(a)至(f)所示,(a)提供显示基板→(b)覆盖遮光薄膜→(c)磨光形成遮光层→(d)制备平坦化层→(e)形成过孔→(f)覆盖透明导电层。
或者在另一个实施例中步骤S3例如包括步骤S32:在所述多个微型发光器件之间填充遮光材料液,使所述遮光材料液露出所述微型发光器件远离所述驱动阵列层的一侧,固化所述遮光材料液以形成所述遮光层。具体地,遮光材料液例如选择在加温状态下呈液态且具有高流动性的材料,其具有内聚力的功能,例如通过滴加或者旋涂的方式将遮光材料液涂覆在微型发光器件上,可由遮光材料液本身的内聚力使得其不残留在微型发光器件的表面,因此使得微型发光器件的上表面不被遮挡而从遮光层中露出。本实施例中显示面板的制备步骤例如参照图11中的步骤(g)至(l)所示,(g)提供显示基板→(h)滴或者旋涂遮光材料液→(i)固化遮光材料液形成遮光层→(j)制备平坦化层→(k)形成过孔→(l)覆盖透明导电层。对比图10和图11中的步骤可知步骤S3采用步骤S32的工艺比采用步骤S31的工艺省去了磨光步骤、且工艺更加简单。
本实用新型的上述实施例可用于制备前述第一实施例所述的显示面板,其具有工艺简单的效果,还具有如前述第一实施例相同的有益效果,本实施例不再赘述。
【第四实施例】
本申请的第四实施例提供一种显示面板制备方法,参照图9,本实施例提供的显示面板制备方法例如包括步骤S1和步骤S2,步骤S1:提供显示基板,所述显示基板包括驱动阵列层和多个微型发光器件,所述多个微型发光器件接触所述驱动阵列层并电连接所述驱动阵列层;步骤S2:在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层。
其中,步骤S1中提供的显示基板例如与第一实施例和第二实施例中所述的显示基板11结构相同,本实施例不再赘述。在一个具体实施例中,步骤S2例如具体包括步骤S23:在所述多个微型发光器件中相邻的两个目标微型发光器件之间形成电容式触控感应结构。其中目标微型发光器件可以是多个微型发光器件中的部分或者全部即电容式触控感应结构可以只在多个微型发光器件的部分微型发光器件之间,或者也可以在任意相邻的两个微型发光器件之间形成电容式触控感应结构,本实施例并不限制。
步骤S23之前例如还包括步骤S3:在所述多个微型发光器件之间制备遮光层,并露出所述微型发光器件远离所述驱动阵列层的一侧。或者在一些实施例中步骤S3例如也可以执行在步骤S23之后。通过步骤S23执行在步骤S3之前可用于制备如前述图2和图3所示的显示面板10的结构。通过步骤S22执行在步骤S3之后可用于制备如图4所示的显示面板10的结构。其中步骤S23之前例如还包括形成导电过孔的步骤,使得电容式触控感应结构通过导电过孔实现与驱动阵列层的电连接。
进一步的,在另一个实施例中,步骤S3例如还包括步骤S33:在所述遮光层形成多个隔离柱,使得任意相邻的两个所述微型发光器件之间形成一个隔离柱,且每个所述隔离柱凸出于所述驱动阵列层的高度不小于所述多个微型发光器件凸出于所述驱动阵列层的高度。其中多个隔离柱例如可由遮光层经图样化设计后蚀刻形成。通过隔离柱阻隔相邻的微型发光器件的串扰,并且露出微型发光器件的上表面,以使微型发光器件朝上发光。或者在一些实施例中例如还可采用光反射材料形成隔离柱,使得微型发光器件发出的光可尽量回收,光反射材料例如可以采用Ag(银)或Cr(铬)等金属反射材料、DBR(Distributed Bragg Reflection,分布式布拉格反射镜)材料或者TiO
2奈米粒子混合物等实现。同样,步骤S33可以执行在步骤S22之后,可用于制备如图5所示的显示面板。步骤S33例如还可以执行在步骤S22之前,步骤S22具体包括步骤S221:在所述多个隔离柱中的目标隔离柱远离所述驱动阵列层的一侧形成电容式触控感应结构,可用于制备如图6或图7所示的显示面板。
本实施例提供的显示面板制备方法可用于制备如前述第二实施例所述的显示面板10,因此具有与第二实施例相同的有益效果。
【第五实施例】
参照图12,本申请第五实施例提供一种显示装置100,显示装置100例如包括如前述第一实施例和第二实施例中所述的任意一种显示面板10。显示装置100例如可以为任何具有显示功能和触控功能的电子产品,包括但不限于电视机、笔记本电脑、桌上型显示器、平板电脑、数码相机、智能手环、智能眼镜、车载显示器、医疗设备、工控设置、触摸交互终端等,本申请实施例对此不作限制。显示装置100采用前述实施例所述的显示面板10因此具有与前述实施例相同的有益效果。
以上所述,仅是本申请的较佳实施例而已,并非对本申请作任何形式上的限制,虽然本申请已以较佳实施例揭露如上,然而并非用以限定本申请,任何熟悉本专业的技术人员,在不脱离本申请技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本申请技术方案内容,依据本申请的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本申请技术方案的范围内。
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Claims (15)
- 一种显示面板,包括:显示基板,所述显示基板包括驱动阵列层和多个微型发光器件,所述多个微型发光器件接触并电连接所述驱动阵列层;电容式触控感应结构,位于所述驱动阵列层邻近所述多个微型发光器件的一侧、且与所述多个微型发光器件间隔设置,所述电容式触控感应结构电连接所述驱动阵列层。
- 如权利要求1所述的显示面板,还包括遮光层,设置在所述多个微型发光器件之间,且露出所述多个微型发光器件远离所述驱动阵列层的一面。
- 如权利要求2所述的显示面板,还包括平坦化层,覆盖所述遮光层和所述多个微型器件远离所述驱动阵列层的一侧;以及导电过孔,贯穿所述平坦化层和所述遮光层并延伸至所述驱动阵列层;所述电容式触控感应结构包括透明感应电路层,覆盖在所述平坦化层远离所述遮光层的一侧且通过所述导电过孔电连接所述驱动阵列层。
- 如权利要求2所述的显示面板,其中,所述电容式触控感应结构设置在所述遮光层内且位于所述多个微型发光器件之间;或者所述电容式触控感应结构设置在所述遮光层远离所述驱动阵列层的一侧,且位于所述多个微型发光器件之间。
- 如权利要求2所述的显示面板,其中,所述遮光层包括朝靠近所述多个微型发光器件一侧的方向凸出于所述驱动阵列层的多个隔离柱,任意相邻的两个所述微型发光器件之间对应设置一个隔离柱,且每个所述隔离柱凸出于所述驱动阵列层的高度不小于所述多个微型发光器件凸出于所述驱动阵列层的高度。
- 如权利要求5所述的显示面板,其中,所述电容式触控感应结构对应设置在所述多个隔离柱中的目标隔离柱远离所述驱动阵列层的一侧。
- 如权利要求5所述的显示面板,其中,所述多个隔离柱采用光反射材料。
- 一种显示面板制备方法,包括:提供显示基板,所述显示基板包括驱动阵列层和多个微型发光器件,所述多个微型发光器件接触并电连接所述驱动阵列层;在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层。
- 如权利要求8所述的显示面板制备方法,还包括:在所述多个微型发光器件之间制备遮光层,并露出所述微型发光器件远离所述驱动阵列层的一侧。
- 如权利要求9所述的显示面板制备方法,其中,所述在所述多个微型发光器件之间制备遮光层,并露出所述微型发光器件远离所述驱动阵列层的一侧,包括:在所述多个微型发光器件远离所述驱动阵列层的一侧覆盖遮光薄膜,并露出所述微型发光器件远离所述驱动阵列层的一侧,以形成所述遮光层;或者在所述多个微型发光器件之间填充遮光材料液,使所述遮光材料液露出所述微型发光器件远离所述驱动阵列层的一侧,固化所述遮光材料液以形成所述遮光层。
- 如权利要求9所述的显示面板制备方法,还包括:在所述遮光层远离所述驱动阵列层的一侧制备平坦化层;所述在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层,包括:形成贯穿所述平坦化层和所述遮光层的导电过孔;在所述平坦化层远离所述遮光层的一侧覆盖透明感应电路层,并使得所述透明感应电路层通过所述导电过孔电连接所述驱动阵列层,所述透明感应电路层形成所述电容式触控感应结构。
- 如权利要求8所述的显示面板制备方法,其中,所述在所述显示基板邻近所述多个微型发光器件的一侧形成电容式触控感应结构,使所述电容式触控感应结构与所述多个微型发光器件间隔设置并电连接所述驱动阵列层,包括:在所述多个微型发光器件中相邻的两个目标微型发光器件之间形成电容式触控感应结构。
- 如权利要求12所述的显示面板制备方法,还包括:在所述遮光层形成多个隔离柱,使得任意相邻的两个所述微型发光器件之间形成一个隔离柱,且每个所述隔离柱凸出于所述驱动阵列层的高度不小于所述多个微型发光器件凸出于所述驱动阵列层的高度。
- 如权利要求13所述的显示面板制备方法,其中,所述在所述多个微型发光器件中相邻的两个所述微型发光器件之间形成电容式触控感应结构,包括:在所述多个隔离柱中的目标隔离柱远离所述驱动阵列层的一侧形成电容式触控感应结构。
- 一种显示装置,包括如权利要求1-7中任意一项所述的显示面板或采用如权利要求8-14任意一项所述的显示面板制备方法制成的显示面板。
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CN107331680A (zh) * | 2017-07-05 | 2017-11-07 | 上海天马微电子有限公司 | 一种显示面板及其制造方法、显示装置 |
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CN112114703A (zh) * | 2020-09-10 | 2020-12-22 | 厦门天马微电子有限公司 | 一种显示面板和显示装置 |
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CN112259006A (zh) * | 2020-10-29 | 2021-01-22 | 厦门天马微电子有限公司 | 一种显示面板和显示装置 |
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CN114115605A (zh) * | 2021-11-30 | 2022-03-01 | 湖北长江新型显示产业创新中心有限公司 | 一种显示面板及显示装置 |
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CN107331680A (zh) * | 2017-07-05 | 2017-11-07 | 上海天马微电子有限公司 | 一种显示面板及其制造方法、显示装置 |
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CN114115605A (zh) * | 2021-11-30 | 2022-03-01 | 湖北长江新型显示产业创新中心有限公司 | 一种显示面板及显示装置 |
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