WO2023216568A1 - 一种测试设备和测试方法 - Google Patents

一种测试设备和测试方法 Download PDF

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Publication number
WO2023216568A1
WO2023216568A1 PCT/CN2022/136704 CN2022136704W WO2023216568A1 WO 2023216568 A1 WO2023216568 A1 WO 2023216568A1 CN 2022136704 W CN2022136704 W CN 2022136704W WO 2023216568 A1 WO2023216568 A1 WO 2023216568A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
test
tested
move
module
Prior art date
Application number
PCT/CN2022/136704
Other languages
English (en)
French (fr)
Inventor
谢剑
魏仲民
汪济欢
Original Assignee
中兴通讯股份有限公司
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Publication of WO2023216568A1 publication Critical patent/WO2023216568A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the embodiments of the present application relate to the field of electronic circuit technology, and in particular to a testing equipment and a testing method.
  • the high-speed serial signal rate of existing 5G bearer network products has reached 112Gbps, and the 224Gbps rate has entered the research and development stage. In the future, it may also face higher rates, such as 448G.
  • the main purpose of the embodiments of this application is to propose a testing device and a testing method to realize automated testing, save labor costs, and improve testing efficiency.
  • a test equipment including a workbench, a mobile module movably connected to the workbench, and a bearing fixed to the mobile module.
  • the bearing Used to carry the circuit board to be tested; a support frame fixed on the workbench, a camera module fixed on the support frame, a test probe movably connected to the support frame, connected to the mobile module, The camera module and the controller of the test probe; the camera module obtains an image of the circuit board under test; the controller is used to control the mobile module to drive the circuit under test according to the image
  • the board moves to align the test point on the circuit board to be tested with the test probe; and controls the test probe to move on the support frame in the direction toward the workbench, so that the test probe
  • the test probe contacts the point to be tested on the circuit board to be tested to form a test loop.
  • test method which is applied to the above test equipment; the test method includes: using a camera module to obtain an image of the circuit board to be tested; controlling the mobile module to drive the circuit board according to the image
  • the circuit board to be tested moves so that the test point on the circuit board to be tested is aligned with the test probe; the test probe is controlled to move on the support frame in the direction toward the workbench and align with the test probe.
  • the points under test on the circuit board are contacted to form a test loop.
  • the camera module in the test equipment proposed in this application acquires an image of the circuit board under test; the controller is used to control the moving module according to the image to drive the circuit board under test to move, so that the test point on the circuit board under test is aligned with the test probe ; and control the test probe to move on the support frame in the direction toward the workbench, so that the test probe contacts the point to be tested on the circuit board to be tested to form a test loop for testing, using the test equipment and test method in this embodiment.
  • the entire testing process does not require manual adjustment of the position of the test probe, enabling automated testing, which can save labor costs and improve testing efficiency.
  • Figure 1 is a schematic diagram of the internal structure of a testing device from a right side perspective according to an embodiment of the present application
  • Figure 2 is a schematic diagram of the internal structure of a test device from a left side perspective according to an embodiment of the present application;
  • Figure 3 is a schematic structural diagram of the mobile module and the circuit board to be tested of the test equipment according to the embodiment of the present application;
  • Figure 4 is a schematic structural diagram of the right side view of the sliding module in the mobile module of the test equipment according to the embodiment of the present application;
  • Figure 5 is a schematic structural diagram of the sliding module from the left side of the mobile module of the test equipment according to the embodiment of the present application;
  • Figure 6 is a schematic structural diagram of the rotating module in the mobile module of the test equipment according to the embodiment of the present application.
  • Figure 7 is a right side view of a support frame equipped with a camera module and a test probe according to the embodiment of the present application;
  • Figure 8 is a schematic structural diagram of a tray carrying a circuit board to be tested according to an embodiment of the present application.
  • Figure 9 is a schematic structural diagram of the test equipment equipped with a protective frame as shown in Figure 1;
  • Figure 10 is a schematic structural diagram of the test equipment provided with a shell as shown in Figure 9;
  • Figure 11 is a schematic diagram of the internal structure of another test device from a left side view according to an embodiment of the present application.
  • Figure 12 is a schematic structural diagram of the test equipment located in the test cabinet as shown in Figure 11;
  • Figure 13 is a schematic structural diagram of the circuit board box according to the embodiment of the present application.
  • Figure 14 is a schematic diagram of the internal structure of the test equipment and circuit board box shown in Figure 11 from the right side perspective;
  • Figure 15 is a schematic diagram of the external structure of the test equipment located in the test cabinet as shown in Figure 11 from the left side;
  • Figure 16 is a schematic diagram of the external structure of the test equipment located in the right side of the test cabinet as shown in Figure 11;
  • Figure 17 is a schematic flow chart of the testing method according to the embodiment of the present application.
  • the embodiment of the present application provides a test equipment, as shown in Figures 1 to 16, including a workbench 1, a mobile module 2 movably connected to the workbench 1, and a bearing 3 fixed to the mobile module 2 , the carrier 3 is used to carry the circuit board to be tested 200; the support frame 4 fixed on the workbench 1, the camera module 6 fixed on the support frame 4, the test probe 5 movably connected to the support frame 4, the connection and movement
  • the upper test point 202 contacts to form a test loop.
  • the camera module 6 in the test equipment proposed in this application acquires an image of the circuit board to be tested 200; the controller 8 is used to control the moving module 2 to drive the circuit board to be tested 200 to move according to the image, so that the circuit board to be tested is moved on the circuit board 200.
  • the test point 202 is aligned with the test probe 5; and the test probe 5 is controlled to move on the support frame 4 in the direction toward the workbench 1, so that the test probe 5 contacts the test point 202 on the circuit board 200 to be tested to form a test loop.
  • the entire testing process does not require manual adjustment of the position of the test probe 5, thereby realizing automated testing, which can save labor costs and improve testing efficiency.
  • test equipment of this embodiment The implementation details of the test equipment of this embodiment are described in detail below. The following content is only provided for the convenience of understanding and is not necessary for implementation of this solution.
  • High-speed link insertion loss ie, insertion loss, which is the signal loss generated by the signal transmission device, also known as attenuation, measured in decibels (db)
  • insertion loss which is the signal loss generated by the signal transmission device, also known as attenuation, measured in decibels (db)
  • db decibels
  • the insertion loss indicator may be out of control during network operation after the circuit board is manufactured, which will lead to a reduction in the system signal-to-noise ratio and an increase in the bit error rate. In serious cases There may even be high-speed link failures.
  • factors that affect insertion loss performance generally include board material selection, board material tolerances, PCB manufacturing tolerances, and environmental factors. Since the cost of the components to be assembled on the board during the production and assembly process is much higher than that of the bare PCB board, if it can be intercepted before assembly, the loss can be minimized.
  • the insertion loss detection of the incoming PCB bare board is useful for high-speed products. Very important meaning. Especially for high-speed systems with system design frequencies of 112Gbps and above, it is necessary to test the link insertion loss value of the printed circuit board.
  • test equipment provided in this embodiment is suitable for printed circuit board design products that require insertion loss testing, and is especially suitable for wired products and wireless products of 5G, 6G and above.
  • the circuit board 200 to be tested is generally placed on the tray 100.
  • the number of circuit boards 200 to be tested that the tray 100 can carry at one time is not limited to 1, for example, it can be no less than 10.
  • Each tray 100 is provided with positioning pins (not shown in the drawings), and the circuit board to be tested 200 is provided with positioning holes corresponding to the positioning pins (not shown in the drawings). The positioning pins and positioning holes cooperate to realize that the circuit board to be tested 200 is positioned Positioning on the pallet 100 .
  • the diameter of the pin is less than or equal to the diameter of the positioning hole on the circuit board 200 to be tested, and the height of the pin is less than or equal to the thickness of the circuit board 200 to be tested.
  • Each pallet 100 is provided with no less than 2 fine positioning pins and 4 coarse positioning pins.
  • the carrier 3 is also provided with positioning pins (not shown in the drawings) to achieve rough positioning of the pallet 100 on the carrier 3 .
  • Each circuit board to be tested 200 has an alignment point 201 and a point to be tested 202.
  • the alignment point 201 is different from the point to be tested 202.
  • the alignment point 201 can be positioned to achieve Positioning of measuring point 202.
  • An alignment hole is provided at the alignment point 201, and a test pad is provided at the point to be tested 202.
  • Each circuit board to be tested 200 has at least one point to be tested 202 , that is, it includes at least one pair of test pads, and the test pads are used to contact the test probe 5 for testing.
  • the point to be measured 202 can be used as the alignment point 201, and the alignment point 201 can be positioned directly.
  • the test probe 5 includes at least a first test probe and a second test probe.
  • the first test probe and the second test probe are arranged on the support frame 4 , and the first test probe and the second test probe can move up and down along the support frame 4 at the same time.
  • Each test probe 5 is used to connect to different test points 202 on the circuit board 200 to be tested.
  • the first test probe is connected to the first test point
  • the second test probe is connected to the second test point.
  • the first to-be-tested point and the second to-be-tested point form a test loop for testing the signal loss of the circuit board to be tested 200, and between the first test probe and the first to-be-tested point and the second test probe and the second to-be-tested point. Impedance continuity is maintained between measuring points.
  • the test probe 5 in this embodiment may be a probe.
  • the test equipment provided in this embodiment includes: a workbench 1 for carrying various components, a support frame 4 fixed on the workbench 1, and the support frame 4 houses the test probe 5 and the camera module.
  • Group 6 provides an installation position, the camera module 6 is fixed on the support frame 4, the test probe 5 is movably connected to the support frame 4, and the test probe 5 can move closer to or away from the workbench 1 along the support frame 4, as can be understood Therefore, the test probe 5 can move in the vertical direction (ie, Z direction).
  • the mobile module 2 is movably connected to the workbench 1.
  • a carrier 3 is fixed on the mobile module 2. The carrier 3 is used to carry the circuit board 200 to be tested.
  • the mobile module 2 can drive the circuit board 200 when it moves on the workbench 1.
  • the circuit board to be tested 200 on the carrier 3 moves on the workbench 1 .
  • the controller 8 connects the mobile module 2 , the camera module 6 and the test probe 5 to realize the cooperation of the mobile module 2 , the camera module 6 and the test probe 5 .
  • the alignment point 201 on the circuit board to be tested 200 is different from the point to be measured 202, and the positioning of the point to be measured 202 is achieved by positioning the alignment point 201.
  • the controller 8 is connected to the mobile module 2, the camera module 6 and the test probe 5.
  • the controller 8 is used to obtain the image of the circuit board to be tested 200 taken by the camera module 6, and obtain the actual position of the alignment point 201 on the circuit board to be tested 200 based on the image; based on the theoretical position and actual position of the alignment point 201,
  • the moving module 2 is controlled to drive the circuit board to be tested 200 to move on the workbench 1 until the actual coordinates are the same as the theoretical coordinates, so that the test point 202 on the circuit board to be tested 200 is aligned up and down with the test probe 5 .
  • the controller 8 controls the test probe 5 to move on the support frame 4 in the direction toward the workbench 1 , and the test probe 5 contacts the test point 202 on the circuit board 200 to be tested to form a test loop for testing.
  • the mobile module 2 drives the circuit board to be tested 200 to move on the XY plane, so that the test point 202 on the circuit board to be tested 200 and the test probe 5 are aligned in the vertical direction (ie, the Z direction); since The point to be tested 202 and the test probe 5 are aligned up and down in the vertical direction (i.e., the Z direction). Therefore, after the test probe 5 moves in the direction toward the workbench 1 on the support frame 4, the test probe 5 can be connected to the circuit under test.
  • the points to be tested 202 on the board 200 are in contact to form a test loop for testing.
  • the plane where XY is located is a plane parallel to the plane where the workbench 1 is located, and the vertical direction (ie, the Z direction) is a direction perpendicular to the plane where the workbench 1 is located.
  • the mobile module 2 includes: a sliding module 21 movably connected to the workbench 1.
  • the sliding module 21 is used to drive the circuit board 200 to be tested to move in the X direction and/or the Y direction; fixed to the sliding module 21
  • the carrier 3 is located on the rotating module 22; the controller 8 is used to control the sliding module 21 to drive the circuit board to be tested 200 to move in the X direction and/or the Y direction according to the image, and to control the rotating module 22 to drive the circuit board to be tested.
  • the circuit board 200 rotates around the center position of the rotating module 22 to align the test point 202 on the circuit board 200 to be tested with the test probe 5 .
  • the controller 8 is used to control the movement of the sliding module 21 and the rotating module 22 according to the image.
  • the sliding module 21 can move along the X direction and/or the Y direction on the workbench 1.
  • the sliding module 21 can move along the X direction and/or Y direction on the workbench 1.
  • the rotating module 22 fixed on the sliding module 21 and the circuit board to be tested 200 located on the rotating module 22 can be driven to move in the X direction and/or the Y direction.
  • the rotation module 22 can drive the circuit board under test 200 to rotate around the center position of the rotation module 22 to achieve precise alignment between the test point 202 on the circuit board under test 200 and the test probe 5 .
  • the sliding module 21 includes: a Y-axis moving component 211 fixed on the workbench 1, a carrier 212 movably connected to the Y-axis moving component 211, an The axis moving component 213 and the fixed platform 214 are movably connected to the X-axis moving component 213.
  • the rotating module 22 is fixed on the fixed platform 214; the controller 8 is used to control the Y-axis moving component 211 to drive the stage 212 on the workbench according to the image. 1 moves along the Y direction, and controls the X-axis moving component 213 according to the image to drive the fixed platform 214 to move along the X direction on the stage 212.
  • the controller 8 is used to control the movement of the X-axis moving component 213 and the Y-axis moving component 211 according to the image.
  • the Y-axis moving assembly 211 is fixed on the workbench 1.
  • the Y-axis moving assembly 211 can drive the carrier 212 and the components on the carrier 212 (X-axis moving assembly 213, fixed platform 214, rotating module 22, bearing 3 and to-be-installed components).
  • the circuit board under test 200) moves in the Y direction on the workbench 1, thereby realizing the movement of the circuit board to be tested 200 in the Y direction.
  • the X-axis moving component 213 is fixed on the carrier 212.
  • the X-axis moving component 213 can drive the fixed platform 214 and the components on the fixed platform 214 (the rotating module 22, the carrier 3 and the circuit board to be tested 200) to move along the upper edge of the carrier 212. Move in the X direction, thereby realizing the X direction movement of the circuit board 200 under test.
  • the Y-axis moving assembly 211 includes a Y-axis drag chain 212, a Y-axis motion motor 213, and a Y-axis slide rail 211 extending along the Y direction.
  • the Y-axis motion motor 213 and the Y-axis slide rail 211 are fixed to the working On the stage 1, the carrier 212 is movably connected to the Y-axis slide rail 211.
  • One end of the Y-axis drag chain 212 is fixed on the carrier 212.
  • the other end of the Y-axis drag chain 212 is connected to the Y-axis motion motor 213.
  • the Y-axis motion motor When 213 rotates, it drives the Y-axis drag chain 212 to move, so as to drive the carrier 212 to move along the Y-axis slide rail 211.
  • the X-axis moving assembly 213 includes an X-axis slide rail 2131, an X-axis drag chain 2132, and an X-axis motion motor (not shown in the drawing) extending along the X direction.
  • the X-axis motion motor can be fixed on the working On the platform 1, the X-axis slide rail 2131 is fixed on the carrier 212, the fixed platform 214 is movably connected to the X-axis slide rail 2131, one end of the X-axis drag chain 2132 is fixed on the fixed platform 214, and the other end of the X-axis drag chain 2132 One end is connected to the X-axis motion motor.
  • the X-axis motion motor rotates, it drives the X-axis drag chain 2132 to move, thereby driving the fixed platform 214 to move along the X-axis slide rail 2131 on the carrier 212.
  • the Y-axis moving component 211 and the X-axis moving module 2 are connected by a servo motor and a screw rod.
  • a servo motor and a screw rod are connected by a servo motor and a screw rod.
  • other driving methods can also be selected, as long as the tray 100 and the circuit board to be tested 200 can be driven in the X direction. Just move it in the Y direction.
  • the existing rotation module 22 can be used as the rotation module 22 in the embodiment of the present application.
  • the specific structure of the rotation module 22 will not be described in this embodiment.
  • the test equipment also includes a light source 7 fixed on the support frame 4.
  • the light source 7 is used to compensate the light for the camera module 6 to ensure the brightness of the image captured by the camera module 6.
  • the testing equipment also includes an electric cylinder 51 fixed on the support frame 4, and the electric cylinder 51 drives the test probe 5 to move in the vertical direction (ie, the Z direction).
  • the test equipment also includes: a protective frame 10 fixed on the workbench 1.
  • the protective frame 10 and the support frame 4 form a workspace on the workbench 1, and the mobile module 2 is located on the workbench. within the space.
  • the protection frame 10 includes: a first bracket 101 and a second bracket 102 fixed on the workbench 1 and arranged oppositely; a transmitting device 11 is fixed on the first bracket 101, and a receiving device 12 is fixed on the second bracket 102; the controller 8 It is also used to control the transmitting device 11 to transmit a safety signal during the test, and to send an alarm message when it is detected that the receiving device 12 does not receive the safety signal sent by the transmitting device 11 .
  • the test equipment also includes a housing 13.
  • the housing 13 and the workbench 1 form an accommodation space.
  • the protection frame 10, the mobile module 2, the support frame 4, the controller 8, etc. are all Located in the accommodation space, a window 130 is left on the housing 13, and the window 130 is located between the first bracket 101 and the second bracket 102.
  • the transmitting device 11 and the receiving device 12 are respectively located on opposite sides of the window 130, so , when external objects enter the window 130, the safety signal will be blocked. When the receiving device 12 cannot receive the safety signal, an alarm message will be sent out, thereby serving as a safety reminder when the external object enters the window 130 to ensure the safety of the test process. safety. Realistically, after closing the transmitting device 11, the operator can replace the circuit board 200 to be tested through the opening window 130.
  • the test equipment also includes: a network analyzer (not shown in Figure 1), one end of the network analyzer is connected to the circuit board 200 under test, and the other end is connected to the controller 8; the network analyzer is used to obtain the data to be tested.
  • the insertion loss signal of the circuit board 200 is measured, the insertion loss signal is analyzed to obtain the insertion loss result, and the insertion loss result is fed back to the controller 8; the controller 8 is used to determine whether the circuit board to be tested 200 is qualified based on the insertion loss result.
  • the network analyzer and controller 8 can be fixed on the workbench 1 and located inside the housing 13 . Of course, in some examples, the network analyzer can be placed outside the housing 13 .
  • the test equipment also includes an electric control board 9.
  • the electric control board 9 divides the accommodation space formed by the housing 13 and the workbench 1 into two working spaces, the front and the rear.
  • the mobile module 2 and the support frame 4 are located in the front working space, and the controller 8 can be fixed on the electric control panel 9 and located in the rear working space. If the network analyzer (not shown in Figure 1) is located in the housing 13, the network analyzer can be placed in the rear workspace.
  • the electric control board 9 is also fixed with other electrical parts or components required for testing, which will not be described in detail in this embodiment.
  • the test equipment also includes a display screen 14 , and the display screen 14 is connected to the controller 8 .
  • the display screen 14 can be embedded in the housing 13, and the operator can view the display screen 14 from the outside of the test equipment.
  • the display screen 14 is used to display the code of the circuit board under test 200 photographed by the camera module 6, and to display the insertion loss test data and insertion loss test results of the circuit board under test 200.
  • the test equipment also includes a fan 15 embedded in the housing 13 , and the fan is used to discharge the heat generated by the work in the housing 13 out of the housing 13 .
  • the carrier 3 may be in the shape of a flat plate, and the tray 100 and the circuit board to be tested 200 are directly placed on the carrier 3 . If the circuit board under test 200 needs to be replaced, the operator can manually replace the tray 100 and the circuit board under test 200, or use an external robotic arm to replace the tray 100 and the circuit board under test 200.
  • this embodiment also provides a test equipment.
  • the test equipment can automatically replace the tray 100 and the circuit board to be tested 200 without the need for an operator to replace them manually or with the help of an external robotic arm.
  • the load-bearing member 3 of the test equipment includes: a load-bearing platform 31 fixed on the mobile module 2; two support arms 32 fixed on the load-bearing platform 31 and arranged at intervals; the test equipment also includes: a load-bearing platform 31 fixed on the mobile module 2; 32 and is movably connected to the carrying platform 31; the controller 8 is used to control the clamping jaw assembly 16 to grab the tray 100 and drive it before using the camera module 6 to obtain the image of the circuit board 200 to be tested.
  • the pallet 100 moves onto the two support arms 32 .
  • the clamp assembly 16 can move along the extension direction of the support arm 32 to grab the tray 100 and drive the tray 100 to move to the two support arms 32 to realize automatic replacement of the tray 100 and the circuit board to be tested 200 .
  • the test equipment also includes a test cabinet 17.
  • the workbench 1 is fixed in the test cabinet 17 and divides the test cabinet 17 into upper and lower work spaces; the mobile module 2 and the support frame 4 are located in the upper work space 1701.
  • the workbench 1 is provided with a through hole 1000 connecting the upper and lower work spaces; the lower work space 1702 is provided with a lifting platform 18 facing the through hole 1000.
  • the platform 18 is used to carry the pallet 100; the controller 8 is used to control the lifting platform 18 to move in the direction toward the workbench 1 before controlling the jaw assembly 16 to grab the pallet 100 and drive the pallet 100 to move to the two support arms 32. To drive the tray 100 through the through hole 1000 into the upper working space 1701.
  • the lifting platform 18 can move along the vertical direction (ie, the Z-axis direction).
  • the operator can place the tray 100 carrying the circuit board 200 to be tested in the lower work space 1702.
  • the lifting platform 18 moves upward through the through hole 1000 and enters the upper working space 1701.
  • the clamping jaw assembly 16 moves in a direction close to the lifting platform 18 to grab the pallet 100 on the lifting platform 18 , and moves in a direction away from the lifting platform 18 to drive the pallet 100 to move to the two support arms 32 .
  • the distance between the mobile module 2 and the lifting platform 18 needs to be smaller than the length or width of the pallet 100 , so as to prevent the pallet 100 from falling into the mobile module 2 and the lifting platform when the clamping jaw assembly 16 pulls the pallet 100 .
  • the gap between the platforms 18 prevents the pallet 100 from being moved to the two support arms 32 .
  • the test cabinet 17 can isolate the external space and play a safety protection role.
  • the test cabinet 17 can be provided with at least one transparent window 1700, and the operator can view the test conditions in the test cabinet 17 through the transparent window 1700.
  • the display screen 14 is located on the outer wall of the test cabinet 17, and the operator can view the display screen 14 from the outer wall of the test cabinet 17.
  • the network analyzer 19 is located outside the test cabinet 17 and may be located on the top of the test cabinet 17 .
  • the test equipment is also provided with an alarm 20, and the controller 8 is connected to the alarm 20 to issue an alarm when the operation is abnormal.
  • the alarm 20 is located outside the test cabinet 17 and may be located on the top of the test cabinet 17 .
  • rollers are installed at the bottom of the test cabinet 17 to facilitate the transfer of the test cabinet 17 .
  • the test equipment also includes: a circuit board box 300 located on the lifting platform 18, the circuit board box 300 is open on one side, and the circuit board box 300 includes There are a plurality of slots 301, and each slot 301 is used to place a corresponding tray 100. That is to say, multiple pallets 100 are stored in the circuit board box 300, and each pallet 100 carries the circuit board 200 to be tested. In this way, the operator can pick and place multiple circuit boards 100 to be tested once. The replacement of the circuit board 200 avoids the inefficiency caused by manual frequent picking and placing of the circuit board 200 to be tested.
  • the controller 8 is used to control the lifting platform 18 to drive the circuit board box 300 to move in the direction toward the workbench 1, so as to drive the circuit board box 300 to pass through the through hole 1000 and enter the upper work space 1701; and to control the clamping jaw assembly 16 to move in the direction of the workbench 1. Move in the direction close to the lifting platform 18 and grab the pallet 100; after controlling the clamping jaw assembly 16 to grab the pallet 100, control the clamping jaw assembly 16 to move in a direction away from the lifting platform 18 to drive the pallet 100 out of the circuit board box 300 , and move to the two support arms 32 of the carrier 3 .
  • the tray 100 is provided with a handle 101, and the handle 101 is exposed to the outside of the circuit board box 300;
  • the clamping jaw assembly 16 includes a moving part 161 and a clamping jaw 162 connected to the moving part 161; the controlling moving part 161 Drive the clamping claw 162 to move in the direction close to the lifting platform 18 so that the clamping claw 162 is located directly above or directly below the handle 101; control the lifting platform 18 to move downward or upward so that the clamping claw 162 is locked with the handle 101; control the movement
  • the component 161 moves in a direction away from the lifting platform 18 to drive the tray 100 out of the circuit board box 300 and move to the two support arms 32 of the carrier 3 .
  • a first switch door 171 is provided below the test cabinet 17. After opening the first switch door 171, the circuit board box 300 can be placed on the lifting platform 18 located in the working space 1702 below. , the circuit board box 300 can be taken in and out through the first switch door 171 .
  • a second switch door 172 may also be provided above the test cabinet 17 , through which the mobile module 2 , the camera module 6 , the test probe 5 and other components can be inspected.
  • the pallet 100 is transported to the carrier 3 .
  • the light source 7 provides illumination to the workbench 1, and the camera module 6 captures images of the circuit board 200 to be tested.
  • the controller 8 obtains key information on the circuit board 200 to be tested based on the image.
  • the key information includes but is not limited to serial number or QR code information, and saves the key information.
  • the controller 8 also determines the actual coordinates of the alignment point 201 (the location of the alignment hole) on the circuit board to be tested 200 in the preset coordinate system based on the image.
  • the controller 8 controls the mobile module 2 to drive the circuit board to be tested 200 to move on the workbench 1 until the actual coordinates of the alignment point 201 (the location of the alignment hole) The same as the theoretical coordinates, at this time, the point to be measured 202 (the location of the test pad) on the circuit board to be tested 200 and the test probe 5 are aligned up and down in the vertical direction.
  • a coordinate system is established with the projection position of the camera module 6 on the plane of the tray 100 as the origin, and the test welding is predetermined.
  • the alignment points 201 on both sides of the disk are located at the theoretical coordinates of the coordinate system.
  • the controller 8 controls the mobile module 2 to drive the circuit board to be tested 200 to move on the workbench 1 until the alignment point 201 ( The actual coordinates of the position of the alignment hole are the same as the theoretical coordinates.
  • the test probe 5 and the test pad of the circuit board to be tested 200 are aligned up and down in the vertical direction, that is, the test probe 5 and the circuit board to be tested 200
  • the point to be measured 202 is aligned.
  • the controller 8 controls the test probe 5 to press down along the support frame 4 so that the test probe 5 contacts the test pad of the circuit board 200 to be tested to form a test loop.
  • the test probe 5 is provided with a pressure sensor (not shown in the drawings). The test probe 5 exerts a certain pressure on the circuit board 200 to be tested. After the pressure sensor feeds back the pressure, the network analyzer communicates with the circuit board 200 under test through the cable, probe and the circuit board 200 to be tested. The test pads are connected and the insertion loss test is started.
  • test data is transmitted to the controller 8 through the test probe 5 and the cable connected to the network analyzer and saved.
  • test probe 5 is lifted upward along the support frame 4, leaves the first test point 202 on the circuit board 200 to be tested, and moves to the second test point 202 on the circuit board 200 to be tested.
  • test probes 5 if there are two test probes 5 , two points to be tested 202 can be tested simultaneously at one time, and each test probe 5 corresponds to one point to be tested 202 .
  • the number of test probes 5 is not limited in this embodiment and can be designed according to actual needs. In the drawings of this embodiment, two test probes 5 are taken as an example for explanation.
  • the mobile module 2 After the test of the last circuit board 200 under test is completed, the mobile module 2 returns to the starting position. The operator replaces the test tray 100 with a new circuit board 200 to be tested.
  • the circuit board box 300 is transported manually or by an external robotic arm to the lifting platform 18 .
  • the circuit board box 300 is open on one side, and the circuit board box 300 includes a plurality of slots 301.
  • Each slot 301 is used to place a corresponding tray 100, and each tray 100 is used to carry several circuits to be tested. Plate 200.
  • the controller 8 controls the lifting platform 18 to rise and drive the circuit board box 300 to pass through the through hole 1000 on the workbench 1 and enter the upper working space 1701 of the test cabinet 17. After that, the controller 8 controls the clamping jaw assembly 16 to move upward. Move closer to the lifting platform 18 to grab a pallet 100 in the circuit board box 300 , and control the clamping jaw assembly 16 to move away from the lifting platform 18 to drive the pallet 100 to move to the two support arms 32 .
  • the pallet 100 is provided with a handle 101, and the handle 101 is exposed to the outside of the circuit board box 300;
  • the clamp assembly 16 includes a moving part 161 and a clamp 162 connected to the moving part 161;
  • the moving part 161 is controlled to drive the clamp 162 toward the lifting platform 18 move in the direction so that the clamping claw 162 is located directly above or below the handle 101; control the lifting platform 18 to move downward or upward so that the clamping claw 162 and the handle 101 are clamped; control the moving part 161 to move away from the lifting platform 18
  • the movement drives the tray 100 to be pulled out of the circuit board box 300 and moved to the two support arms 32 .
  • the light source 7 provides illumination to the working space 1701 above the control cabinet 17, and the camera module 6 captures images of the circuit board 200 to be tested.
  • the controller 8 obtains key information on the circuit board 200 to be tested based on the image.
  • the key information includes but is not limited to serial number or QR code information, and saves the key information.
  • the controller 8 also determines the actual coordinates of the alignment point 201 (the location of the alignment hole) on the circuit board to be tested 200 in the preset coordinate system based on the image.
  • the controller 8 controls the mobile module 2 to drive the circuit board to be tested 200 to move on the workbench 1 until the actual coordinates of the alignment point 201 (the location of the alignment hole) Same as the theoretical coordinates, at this time, the point to be measured 202 on the circuit board to be tested 200 and the test probe 5 are aligned up and down in the vertical direction.
  • a coordinate system is established with the projection position of the camera module 6 on the plane of the tray 100 as the origin, and the test welding is predetermined.
  • the alignment points 201 on both sides of the disk are located at the theoretical coordinates of the coordinate system.
  • the controller 8 controls the mobile module 2 to drive the circuit board to be tested 200 to move on the workbench 1 until the alignment point 201 ( The actual coordinates of the position of the alignment hole are the same as the theoretical coordinates.
  • the test probe 5 and the test pad of the circuit board to be tested 200 are aligned up and down in the vertical direction, that is, the test probe 5 and the circuit board to be tested 200
  • the point to be measured 202 is aligned.
  • the controller 8 controls the test probe 5 to press down along the support frame 4 so that the test probe 5 contacts the test pad of the circuit board 200 to be tested to form a test loop.
  • the test probe 5 is equipped with a pressure sensor, and the test probe 5 exerts a certain pressure on the circuit board 200 to be tested. After the pressure sensor feedbacks the pressure, the network analyzer 19 is connected to the test pad of the circuit board 200 to be tested through the cable and probe, and starts Perform insertion loss testing.
  • test data is transmitted to the controller 8 through the test probe 5 and the cable connected to the network analyzer 19 and saved.
  • the test probe 5 is lifted upward along the support frame 4, leaves the first test point 202 on the circuit board 200 to be tested, and moves to the second test point 202 on the circuit board 200 to be tested.
  • test probes 5 if there are two test probes 5 , two points to be tested 202 can be tested simultaneously at one time, and each test probe 5 corresponds to one point to be tested 202 .
  • the number of test probes 5 is not limited in this embodiment and can be designed according to actual needs. In the drawings of this embodiment, two test probes 5 are taken as an example for explanation.
  • the controller 8 controls the clamping jaw assembly 16 to move in a direction close to the lifting platform 18 and pushes the tray 100 after the test is completed to insert into the circuit board box 300 .
  • the gripper assembly 16 is controlled to grab another pallet 100 to be tested, and the gripper assembly 16 is controlled to move away from the lifting platform 18 to drive the pallet 100 out of the circuit board box 300 and move to the two support arms 32 .
  • steps (3) to (10) are performed on the circuit boards 200 under test on the new tray 100 until all circuit boards 200 under test in the circuit board box 300 are tested.
  • the controller 8 controls the lifting platform 18 to descend into the working space 1702 below the test cabinet 17 to facilitate manual or external robotic arm replacement of circuits. Board box body 300.
  • test equipment in the embodiment of the present application is different from the insertion loss test equipment in the industry in that (1) the X-axis moving component 213, the Y-axis moving component 211 and the rotation module 22 are linked to achieve high-precision positioning; (2) the display screen 14 is embedded style integration.
  • This application only starts from the structural design and realizes the automatic testing of the insertion loss value of the circuit board to be tested 200, solving the bottleneck problem of low manual efficiency in the existing testing process, saving labor costs and improving work efficiency. Moreover, automatic testing does not require manual loading and unloading of the circuit board to be tested 200. After the test is completed, the data is transmitted to the computer with zero delay, and the operation process and test results are presented intuitively.
  • the test equipment provided in this embodiment can currently continuously test 12 groups of insertion loss strips, and test without interruption for 24 hours. About one person can be responsible for 3 to 4 pieces of equipment, saving 3/4 of the manpower than manual measurement.
  • Each module involved in the above embodiment is a logical module.
  • a logical unit can be a physical unit, or a part of a physical unit, or can be implemented as a combination of multiple physical units.
  • units that are not closely related to solving the technical problems raised by the present application are not introduced in the above-mentioned embodiments, but this does not mean that other units do not exist in the above-mentioned embodiments.
  • the embodiment of the present application also provides a testing method, which can be applied to the testing equipment in any of the above embodiments.
  • the flow chart of the test method in this application is shown in Figure 17, including:
  • Step S11 Use the camera module to obtain an image of the circuit board to be tested.
  • Step S12 Control the moving module according to the image to drive the circuit board under test to move, so that the test point on the circuit board under test is aligned with the test probe.
  • Each circuit board to be tested 200 has an alignment point 201 and a point to be tested 202.
  • the alignment point 201 is different from the point to be tested 202.
  • the positioning of the point to be measured 202 is achieved by positioning the alignment point 201.
  • An alignment point 201 (where the alignment hole is located) is provided at the alignment point 201 , and a test pad is provided at the point to be tested 202 .
  • Each circuit board to be tested 200 has at least one point to be tested 202 , that is, it includes at least one pair of test pads, and the test pads are used to contact the test probe 5 for testing.
  • the point to be measured 202 can be used as the alignment point 201, and the alignment point 201 can be positioned directly.
  • controlling the moving module 2 according to the image drives the circuit board under test 200 to move so that the test point 202 on the circuit board under test 200 is aligned with the test probe 5 includes: acquiring the circuit board under test 200 according to the image the actual coordinates of the alignment point; according to the theoretical coordinates and actual coordinates of the alignment point, the moving module 2 is controlled to drive the circuit board 200 to be tested to move on the workbench 1 until the actual coordinates are the same as the theoretical coordinates, so that the circuit to be tested The point to be tested 202 on the board 200 is aligned with the test probe 5 .
  • the alignment point 201 on the circuit board to be tested 200 is different from the point to be measured 202, and the positioning of the point to be measured 202 is achieved by positioning the alignment point 201.
  • the controller 8 is connected to the mobile module 2, the camera module 6 and the test probe 5.
  • the controller 8 is used to obtain the image of the circuit board to be tested 200 taken by the camera module 6, and obtain the actual position of the alignment point 201 on the circuit board to be tested 200 based on the image; based on the theoretical position and actual position of the alignment point 201,
  • the movement module 2 is controlled to drive the circuit board to be tested 200 to move on the workbench 1 until the actual coordinates are the same as the theoretical coordinates, so that the test point 202 on the circuit board to be tested 200 is aligned up and down with the test probe 5 .
  • the controller 8 controls the test probe 5 to move on the support frame 4 in the direction toward the workbench 1 , and the test probe 5 contacts the test point 202 on the circuit board 200 to be tested to form a test loop for testing.
  • Step S13 Control the test probe to move on the support frame in the direction toward the workbench, and contact the point to be tested on the circuit board to be tested to form a test loop.
  • the embodiments of the present application are test method embodiments applied to the test equipment in any of the above embodiments. Therefore, the test methods in the embodiments of the present application can be used in combination with the test equipment in any of the above embodiments.

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Abstract

一种测试设备，包括工作台（1），可移动连接于工作台（1）上的移动模组（2），固定于移动模组（2）上的承载件（3），承载件（3）设置为承载待测电路板（200）；固定于工作台（1）上的支撑架（4），固定于支撑架（4）上的摄像模组（6），可移动连接于支撑架（4）的测试探头（5），连接移动模组（2）、摄像模组（6）和测试探头（5）的控制器（8）；摄像模组（6）获取待测电路板（200）的图像;控制器（8）设置为根据图像控制移动模组（2）带动待测电路板（200）移动，以使待测电路板（200）上的待测点与测试探头（5）对准；并控制测试探头（5）在支撑架（4）上沿朝向工作台（1）的方向移动，以使测试探头（5）与待测电路板（200）上待测点接触形成测试回路。

Description

一种测试设备和测试方法
相关申请
本申请要求于2022年5月12号申请的、申请号为202210520855.1的中国专利申请的优先权。
技术领域
本申请实施例涉及电子电路技术领域，特别涉及一种测试设备和测试方法。
背景技术
现有5G承载网产品的高速串行信号速率已经达到112Gbps，并且224Gbps速率已进入研发阶段，未来还可能面对更高速率，例如448G。高速串行信号的速率越高，对链路损耗要求越高，其中，印制电路板上的线路插损波动为关键因子之一。
因此，设计一款测量印制电路板上的线路插损的设备极为重要。目前用于测试插损的设备采用的是手动测量方式，需人工手动测试，效率较低。
发明内容
本申请实施例的主要目的在于提出一种测试设备和测试方法，实现自动化测试，能够节省人工成本，提高测试效率。
为实现上述目的，本申请实施例提供了一种测试设备，包括工作台，可移动连接于所述工作台上的移动模组，固定于所述移动模组上的承载件，所述承载件用于承载待测电路板；固定于所述工作台上的支撑架，固定于所述支撑架上的摄像模组，可移动连接于所述支撑架的测试探头，连接所述移动模组、所述摄像模组和所述测试探头的控制器；所述摄像模组获取所述待测电路板的图像；所述控制器用于根据所述图像控制所述移动模组带动所述待测电路板移动，以使所述待测电路板上的待测点与所述测试探头对准；并控制所述测试探头在所述支撑架上沿朝向所述工作台的方向移动，以使所述测试探头与所述待测电路板上所述待测点接触形成测试回路。
为实现上述目的，本申请实施例还提供了一种测试方法，应用于上述测试设备；所述测试方法包括：利用摄像模组获取待测电路板的图像；根据所述图像控制移动模组带动所述待测电路板移动，以使所述待测电路板上的待测点与测试探头对准；控制所述测试探头在支撑架上沿朝向工作台的方向移动，并与所述待测电路板上所述待测点接触以形成测试回路。
本申请提出的测试设备中摄像模组获取待测电路板的图像；控制器用于根据图像控制移动模组带动待测电路板移动，以使待测电路板上的待测点与测试探头对准；并控制测试探头在支撑架上沿朝向工作台的方向移动，以使测试探头与待测电路板上待测点接触形成测试回路从而进行测试，利用本实施例中的测试设备和测试方法进行测试时，整个测试过程无需手工调节测试探头的位置，实现自动化测试，能够节省人工成本，提高测试效率。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明并不构成对实施例的限定。
图1是本申请实施例一种测试设备的右侧视角的内部结构示意图；
图2是本申请实施例一种测试设备的左侧视角的内部结构示意图；
图3是本申请实施例测试设备的移动模组和待测电路板的结构示意图；
图4是本申请实施例测试设备的移动模组中滑动模块右侧视角的结构示意图；
图5是本申请实施例测试设备的移动模组中滑动模块左侧视角的结构示意图；
图6是本申请实施例测试设备的移动模组中旋转模块的结构示意图；
图7是本申请实施例支撑架上设有摄像模组和测试探头的右视图；
图8是本申请实施例托盘承载待测电路板的结构示意图；
图9是如图1所示测试设备设有保护架的结构示意图；
图10是如图9所示测试设备设有外壳的结构示意图；
图11是本申请实施例另一种测试设备的左侧视角的内部结构示意图；
图12是如图11所示测试设备位于测试柜内的结构示意图；
图13是本申请实施例电路板箱体的结构示意图；
图14是如图11所示测试设备和电路板箱体的右侧视角的内部结构示意图；
图15是如图11所示测试设备位于测试柜的左侧视角的外部结构示意图；
图16是如图11所示测试设备位于测试柜的右侧视角的外部结构示意图；
图17是本申请实施例测试方法的流程示意图。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请的各实施例进行详细的阐述。然而，本领域的普通技术人员可以理解，在本申请各实施例中，为了使读者更好地理解本申请而提出了许多技术细节。但是，即使没有这些技术细节和基于以下各实施例的种种变化和修改，也可以实现本申请所要求保护的技术方案。以下各个实施例的划分是为了描述方便，不应对本申请的具体实现方式构成任何限定，各个实施例在不矛盾的前提下可以相互结合相互引用。
在本申请的描述中，需要说明的是，除非另有说明，“多个”的含义是两个以上；术语“上”、“下”、“左”、“右”、“内”、“外”等指示的方位或位置关系仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”、“第三”等仅用于描述目的，而不能理解为指示或暗示相对重要性。“垂直”并不是严格意义上的垂直，而是在误差允许范围之内。“平行”并不是严格意义上的平行，而是在误差允许范围之内。
下述描述中出现的方位词均为图中示出的方向，并不是对本申请的具体结构进行限定。在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可视具体情况理解上述术语在本申请中的具体含义。
本申请实施例提供了一种测试设备，参见图1至图16所示，包括工作台1，可移动连接于工作台1上的移动模组2，固定于移动模组2上的承载件3，承载件3用于承载待测电路板200；固定于工作台1上的支撑架4，固定于支撑架4上的摄像模组6，可移动连接于支撑架4的测试探头5，连接移动模组2、摄像模组6和测试探头5的控制器8；摄像模组6获取待测电路板200的图像；控制器8用于根据图像控制移动模组2带动待测电路板200移动，以使待测电路板200上的待测点202与测试探头5对准；并控制测试探头5在支撑架4上沿朝 向工作台1的方向移动，以使测试探头5与待测电路板200上待测点202接触形成测试回路。
本申请提出的测试设备中摄像模组6获取待测电路板200的图像；控制器8用于根据图像控制移动模组2带动待测电路板200移动，以使待测电路板200上的待测点202与测试探头5对准；并控制测试探头5在支撑架4上沿朝向工作台1的方向移动，以使测试探头5与待测电路板200上待测点202接触形成测试回路从而进行测试，利用本实施例中的测试设备和测试方法进行测试时，整个测试过程无需手工调节测试探头5的位置，实现自动化测试，能够节省人工成本，提高测试效率。
下面对本实施方式的测试设备的实现细节进行具体的说明，以下内容仅为方便理解提供的实现细节，并非实施本方案的必须。
高速链路插损(即***损耗，是信号传输装置产生的信号损耗，也称为衰减，以分贝(decibel，db)为单位)性能是影响高速产品在网运行稳定性的重要指标。由于印制电路板(printed circuit board，简称为PCB)内走线占据整条高速链路插损预算的比例较高，因此PCB内走线的插损是影响***整体插损性能的重要部分。
如果无法在生产装配过程中有效拦截PCB内走线的插损制造偏差，电路板制成后在网运行中插损指标可能失控，进而将导致***信噪比降低和误码率增加，严重时甚至会出现高速链路不通。对于PCB内走线部分，影响插损性能因素一般包括板材选型、板材来料公差、PCB制造公差和环境因素等。由于生产装配过程中板上待装配器件的成本远高于PCB裸板，所以若能在装配之前进行拦截，可以将损失降至最低，因此PCB裸板来料的插损检测对高速产品中有十分重要的意义。尤其对于***设计频率达到112Gbps及以上的高速***，需要测试印制电路板的链路插损值。
本实施例提供的测试设备适用于有插损测试要求的印制电路板设计产品，尤其适合5G、6G及以上的有线产品和无线产品。
请参见图8，本实施例中待测电路板200一般放置于托盘100上，托盘100一次性可承载的待测电路板200的数目不限于1个，例如可不少于10个，每个托盘100上设有定位销钉(附图未示出)，待测电路板200上设有与定位销钉对应的定位孔(附图未示出)，定位销钉和定位孔配合实现待测电路板200在托盘100上的定位。销钉的直径尺寸小于或等于待测电路板200上定位孔的直径，销钉的高度小于或等于待测电路板200的厚度。每个托盘100上设有不少于2个精定位销钉和4个粗定位销钉。承载件3也设有定位销钉(附图未示出)，实现托盘100在承载件3上的粗定位。
请参见图8，每个待测电路板200上有对位点201和待测点202，本实施例中对位点201与待测点202不同，可通过对对位点201的定位实现对待测点202的定位。对位点201位置处设有对位孔，待测点202位置处设有测试焊盘。每个待测电路板200有至少1对待测点202，即包括至少1对测试焊盘，测试焊盘用于与测试探头5接触进行测试。当然在另外一些例子中，可将待测点202作为对位点201，直接对对位点201进行定位。
本实施例中测试探头5至少包括第一测试探头和第二测试探头。第一测试探头和第二测试探头被设置于支撑架4上，且第一测试探头和第二测试探头能够同时沿支撑架4上下移动。每一个测试探头5分别用于与待测电路板200上的不同待测点202连接，例如：第一测试探头与第一待测点连接，第二测试探头与第二待测点连接，以使第一待测点和第二待测点形成用于测试待测电路板200的信号损耗的测试回路，且第一测试探头与第一待测点之间以及第 二测试探头与第二待测点之间均保持阻抗连续。可实现地，本实施例测试探头5具体可为探针。
请一并参见图1和图11，本实施例提供的测试设备包括：用于承载各个部件的工作台1，固定于工作台1上的支撑架4，支撑架4为测试探头5和摄像模组6提供安装位置，摄像模组6固定于支撑架4上，测试探头5可移动连接于支撑架4，且测试探头5可沿支撑架4向靠近或远离工作台1的方向运动，可以理解为，测试探头5可沿竖直方向(即Z方向)运动。移动模组2可移动连接于工作台1，移动模组2上固定有承载件3，承载件3用于承载待测电路板200，如此，移动模组2在工作台1上移动时能够带动承载件3上的待测电路板200在工作台1上移动。控制器8连接移动模组2、摄像模组6和测试探头5用于实现移动模组2、摄像模组6和测试探头5的配合。
本实施例中待测电路板200上对位点201与待测点202不同，通过对对位点201的定位实现对待测点202的定位。请参见图1和图2，控制器8连接移动模组2、摄像模组6和测试探头5。控制器8用于获取摄像模组6拍摄的待测电路板200的图像，并根据图像获取待测电路板200上对位点201的实际位置；根据对位点201的理论位置和实际位置，控制移动模组2带动待测电路板200在工作台1上移动、直至实际坐标与理论坐标相同，以使待测电路板200上的待测点202与测试探头5上下对准。此时，控制器8控制测试探头5在支撑架4上沿朝向工作台1的方向移动，测试探头5与待测电路板200上待测点202接触以形成测试回路从而进行测试。
其中，移动模组2带动待测电路板200在XY所在平面上移动，以使待测电路板200上的待测点202与测试探头5在竖直方向(即Z方向)上对准；由于待测点202与测试探头5在竖直方向上(即Z方向)上下对准，因此，测试探头5在支撑架4上沿朝向工作台1的方向移动后，测试探头5能够与待测电路板200上的待测点202接触形成测试回路从而进行测试。需说明的是，本实施例中XY所在平面为与工作台1所在平面平行的平面，竖直方向(即Z方向)为垂直于工作台1所在平面的方向。
下面结合附图1、图3、图4、图5和图11对本实施例中的移动模组2的结构进行具体说明：
在一个例子中，移动模组2包括：可移动连接于工作台1上的滑动模块21，滑动模块21用于带动待测电路板200沿X方向和/或Y方向运动；固定于滑动模块21上的旋转模块22，承载件3位于旋转模块22上；控制器8用于根据图像控制滑动模块21带动待测电路板200沿X方向和/或Y方向运动，并控制旋转模块22带动待测电路板200围绕旋转模块22的中心位置旋转，以使待测电路板200上的待测点202与测试探头5对准。
本实施例中控制器8用于根据图像控制滑动模块21和旋转模块22运动，滑动模块21能够实现在工作台1上沿X方向和/或Y方向运动，滑动模块21在工作台1上沿X方向和/或Y方向运动时，能够带动固定于滑动模块21上的旋转模块22、以及位于旋转模块22上的待测电路板200沿X方向和/或Y方向运动。旋转模块22能够带动待测电路板200围绕旋转模块22的中心位置旋转以实现待测电路板200上的待测点202与测试探头5的精准对位。
在一个例子中，如图4所示，滑动模块21包括：固定于工作台1上的Y轴移动组件211，可移动连接于Y轴移动组件211的载台212，固定于载台212的X轴移动组件213、以及可移动连接于X轴移动组件213的固定平台214，旋转模块22固定于固定平台214上；控制器 8用于根据图像控制Y轴移动组件211带动载台212在工作台1上沿Y方向移动，并根据图像控制X轴移动组件213带动固定平台214在载台212上沿X方向移动。
本实施例中控制器8用于根据图像控制X轴移动组件213和Y轴移动组件211运动。Y轴移动组件211固定于工作台1上，Y轴移动组件211可带动载台212、以及载台212上的部件(X轴移动组件213、固定平台214、旋转模块22、承载件3和待测电路板200)在工作台1上沿Y方向移动，从而实现待测电路板200的Y方向移动。X轴移动组件213固定于载台212上，X轴移动组件213可带动固定平台214以及固定平台214上的部件(旋转模块22、承载件3和待测电路板200)在载台212上沿X方向移动，从而实现待测电路板200的X方向移动。
如图4所示，Y轴移动组件211包括Y轴拖链212、Y轴运动电机213、以及沿Y方向延伸的Y轴滑轨211，Y轴运动电机213和Y轴滑轨211固定于工作台1上，载台212可移动连接于Y轴滑轨211上，Y轴拖链212的一端固定于载台212，Y轴拖链212的另一端连接Y轴运动电机213，Y轴运动电机213转动时带动Y轴拖链212移动，以带动载台212沿Y轴滑轨211移动。
如图4所示，X轴移动组件213包括X轴滑轨2131、X轴拖链2132、以及沿X方向延伸的X轴运动电机(附图未示出)，X轴运动电机可固定于工作台1上，X轴滑轨2131固定于载台212上，固定平台214可移动连接于X轴滑轨2131上，X轴拖链2132的一端固定于固定平台214，X轴拖链2132的另一端连接X轴运动电机，X轴运动电机转动时带动X轴拖链2132移动，从而带动固定平台214在载台212上沿X轴滑轨2131移动。
本实施例中Y轴移动组件211和X轴移动模组2均采用伺服电机和丝杆连接的方式，当然也可选择其它方式驱动，只要能够实现带动托盘100和待测电路板200沿X方向和Y方向移动即可。
如图6所示，本申请实施例中旋转模块22可使用现有的旋转模块22，本实施例中对于旋转模块22的具体结构不进行说明。
可实现地，如图7所示，测试设备还包括固定于支撑架4上的光源7，光源7用于给摄像模组6补偿光线，以保证摄像模组6获取的图像的亮度。可实现地，测试设备还包括固定于支撑架4上的电缸51，电缸51带动测试探头5沿竖直方向(即Z方向)移动。
在一个例子中，如图9所示，测试设备还包括：固定于工作台1上的保护架10，保护架10与支撑架4在工作台1上围成工作空间，移动模组2位于工作空间内。保护架10包括：固定于工作台1上且相对设置的第一支架101和第二支架102；第一支架101上固定有发射装置11，第二支架102上固定有接收装置12；控制器8还用于在测试过程中控制发射装置11发射安全信号，并在检测到接收装置12未接收到发射装置11发出的安全信号时发出报警信息。
请一并参见图9和图10，本实施例中测试设备还包括外壳13，外壳13与工作台1形成容置空间，保护架10、移动模组2、支撑架4、控制器8等均位于容置空间内，外壳13上留有开窗130，且开窗130位于第一支架101和第二支架102之间，发射装置11和接收装置12分别位于开窗130的相对两侧，如此，当外部物体进入开窗130时，会阻隔安全信号，接收装置12接收不到安全信号时，发出报警信息，从而在外部物体进入开窗130时起到安全提醒的作用，以保证测试过程的安全性。可实现地，关闭发射装置11后，操作员可通过该开窗 130更换待测电路板200。
在一个例子中，测试设备还包括：网络分析仪(附图1未示出)，网络分析仪的一端与待测电路板200相连，另一端与控制器8相连；网络分析仪用于获取待测电路板200的插损信号，对插损信号进行分析得到插损结果，并将插损结果反馈给控制器8；控制器8用于根据插损结果判断待测电路板200是否合格。本实施例中网络分析仪和控制器8可固定于工作台1上且位于外壳13内，当然在一些例子中，网络分析仪可放置于外壳13外侧。
请一并参见图1、图2和图10，测试设备还包括电控板9，电控板9将外壳13与工作台1形成的容置空间分成前、后两个工作空间，移动模组2和支撑架4位于前方工作空间内，控制器8可固定于电控板9上、且位于后方工作空间内。若网络分析仪(附图1未示出)位于外壳13内，网络分析仪可将设置于后方工作空间内。电控板9上还固定有其他测试所需的电气件或元器件，本实施例中不一一赘述。
在一个例子中，如图10所示，测试设备还包括显示屏14，显示屏14与控制器8连接。显示屏14可嵌设于外壳13上，操作员从测试设备外侧即可查看显示屏14。显示屏14用于显示摄像模组6拍摄的待测电路板200的编码，并展示待测电路板200的插损测试数据和插损测试结果。可实现地，测试设备还包括嵌设于外壳13上的风扇15，风扇用于将外壳13内由于工作产生的热量排出外壳13。
在一个具体实施例中，如图1和图2所示，承载件3可呈平板状，托盘100和待测电路板200直接放置在承载件3上。若需更换待测电路板200，操作员可手动更换托盘100和待测电路板200，或者利用外部机械臂更换托盘100和待测电路板200。
如图11所示，本实施例还提供了一种测试设备，测试设备可自动更换托盘100和待测电路板200，无需操作员手动更换或者借助外部机械臂更换。本实施例中测试设备的承载件3包括：固定于移动模组2上的承载平台31，固定于承载平台31上且间隔设置的两个支撑臂32，测试设备还包括：位于两个支撑臂32之间、且可移动连接于承载平台31的夹爪组件16；控制器8用于在利用摄像模组6获取待测电路板200的图像之前，控制夹爪组件16抓取托盘100并带动托盘100移动至两个支撑臂32上。本实施例的测试设备中夹爪组件16可沿支撑臂32延伸方向移动，从而抓取托盘100并带动托盘100移动至两个支撑臂32上，以实现自动更换托盘100和待测电路板200。
在另一个例子中，如图11和图12所示，测试设备还包括测试柜17，工作台1固定于测试柜17内且将测试柜17划分为上、下两个工作空间；移动模组2和支撑架4均位于上方工作空间1701内，工作台1上设有连通上、下两个工作空间的通孔1000；下方工作空间1702内设有正对通孔1000的升降台18，升降台18用于承载托盘100；控制器8用于在控制夹爪组件16抓取托盘100并带动托盘100移动至两个支撑臂32上之前，控制升降台18沿朝向工作台1的方向移动，以带动托盘100穿过通孔1000进入上方工作空间1701内。
升降台18可沿竖直方向(即Z轴方向)移动，升降台18下降且位于下方工作空间1702内时，操作员可在下方工作空间1702内将承载有待测电路板200的托盘100放置于升降台18上，升降台18向上运动穿过通孔1000并进入上方工作空间1701内。夹爪组件16向靠近升降台18的方向移动以抓取升降台18上的托盘100，并向远离升降台18的方向移动以带动托盘100移动至两个支撑臂32上。需说明的是，移动模组2与升降台18之间的间隔距离需小于托盘100的长度或宽度，如此，避免夹爪组件16在拉动托盘100时，托盘100掉入移动 模组2与升降台18之间的间隙，而无法将托盘100移动至两个支撑臂32上。
如图15和图16所示，本实施例中测试柜17能够隔离外部空间，起到安全防护作用。测试柜17上可设有至少一个透明窗1700，操作员可透过该透明窗1700查看测试柜17内的测试情况。显示屏14位于测试柜17外壁，操作员从测试柜17外壁即可查看显示屏14。
如图15和图16所示，网络分析仪19位于测试柜17外，可位于测试柜17顶部。可实现地，测试设备还设有报警器20，控制器8连接报警器20用于在工作异常时，发出警报。报警器20位于测试柜17外，可位于测试柜17顶部。可实现地，测试柜17底部安装有滚轮，以方便测试柜17的转移。
在一个例子中，如图12、图13和图14所示，测试设备还包括：位于升降台18上的电路板箱体300，电路板箱体300单侧开口，电路板箱体300内包括多个插槽301，每个插槽301用于对应放置一个托盘100。也就是说，电路板箱体300内存放有多个托盘100，每个托盘100上均承载有待测电路板200，如此，操作员取放一次电路板箱体300即可实现多个待测电路板200的更换，避免人工频繁取放待测电路板200造成的低效率。
控制器8用于控制升降台18带动电路板箱体300沿朝向工作台1的方向移动，以带动电路板箱体300穿过通孔1000进入上方工作空间1701内；并控制夹爪组件16向靠近升降台18的方向移动并抓取托盘100；在控制夹爪组件16抓取托盘100后，控制夹爪组件16向远离升降台18的方向移动以带动托盘100从电路板箱体300内抽出，并移动至承载件3的两个支撑臂32上。
如图13和图14所示，托盘100设有拉手101，且拉手101暴露于电路板箱体300外侧；夹爪组件16包括移动部件161和连接移动部件161的夹爪162；控制移动部件161带动夹爪162向靠近升降台18的方向移动，以使夹爪162位于拉手101的正上方或正下方；控制升降台18向下或向上移动以使夹爪162与拉手101卡持；控制移动部件161向远离升降台18的方向移动以带动托盘100从电路板箱体300内抽出，并移动至承载件3的两个支撑臂32上。
可实现地，如图12所示，测试柜17下方设有第一开关门171，打开第一开关门171后，可将电路板箱体300放置于位于下方工作空间1702内的升降台18上，通过该第一开关门171可实现的电路板箱体300的取放。可实现地，测试柜17上方也可设有第二开关门172，可通过该第二开关门172实现对移动模组2、摄像模组6、测试探头5等部件的检修。
下面结合附图1至10所示的测试设备对待测电路板200的测试过程进行说明：
(1)在启动测试设备后，人工手动或者外部机械臂运送托盘100到承载件3上。
(2)光源7为工作台1提供光照，摄像模组6拍摄待测电路板200的图像。
(3)控制器8根据图像获取待测电路板200上的关键信息，关键信息包括但不限于序列号或二维码信息，并保存该关键信息。控制器8还根据该图像确定待测电路板200上的对位点201(对位孔所在位置)在预设坐标系中的实际坐标。
(4)控制器8根据对位点201的理论坐标和实际坐标，控制移动模组2带动待测电路板200在工作台1上移动直至对位点201(对位孔所在位置)的实际坐标与理论坐标相同，此时，待测电路板200上待测点202(测试焊盘所在位置)与测试探头5在竖直方向上上下对准。
由于托盘100与摄像模组6的垂直距离固定，摄像模组6在支撑架4上的位置固定，以摄像模组6在托盘100所在平面上的投影位置为原点建立坐标系，预先确定测试焊盘两侧的对位点201(对位孔所在位置)位于该坐标系的理论坐标。在测试时，获取对位点201(对位 孔所在位置)在该坐标系的实际坐标，控制器8控制移动模组2带动待测电路板200在工作台1上移动直至对位点201(对位孔所在位置)的实际坐标与理论坐标相同，此时，测试探头5与待测电路板200的测试焊盘在竖直方向上上下对准，即，测试探头5与待测电路板200的待测点202对准。
(5)控制器8控制测试探头5沿支撑架4下压，使得测试探头5与待测电路板200的测试焊盘接触以形成测试回路。测试探头5上设有压力传感器(附图未示出)，测试探头5对待测电路板200施加一定的压力，压力传感器反馈压力后，网络分析仪通过线缆、探头与待测电路板200的测试焊盘相连，开始进行插损测试。
(6)测试完成后，测试数据通过测试探头5及连接网络分析仪的线缆传输到控制器8中并保存。
(7)测试探头5沿支撑架4向上抬起，离开待测电路板200上的第一个待测点202，移动到待测电路板200上的第二个待测点202。
可实现地，若测试探头5有两个，则一次性可对两个待测点202同时进行测试，每个测试探头5对应一个待测点202。测试探头5的数目本实施例中不做限定，可根据实际需要进行设计，本实施例附图中以两个测试探头5为例进行说明。
(8)当待测电路板200上有多个待测点202时，重复执行上述(3)至(6)的测试过程，直至完成待测电路板200上所有待测点202的测试。待测电路板200测试完成后，通过线缆和网络分析仪19测量两组插损数据。如测试探头5为两对时，只需要测量一次。电脑对该数据进行分析并去嵌处理，保存分析程序和数据。
当托盘100上有多个待测电路板200时，重复执行上述(2)至(6)的测试过程，直至对托盘100上装载的所有待测电路板200完成测试。
最后一个待测电路板200测试完成后，移动模组2回归到起始位置。操作员进行测试托盘100更换，替换新的待测电路板200。
下面结合附图3至附图5以及附图11至附图16所示的测试设备对待测电路板200的测试过程进行说明：
(1)在启动测试设备后，人工手动或者外部机械臂运送电路板箱体300到升降台18上。其中，电路板箱体300单侧开口，电路板箱体300内包括多个插槽301，每个插槽301用于对应放置一个托盘100，每个托盘100上用于承载若干个待测电路板200。
(2)控制器8控制升降台18上升带动电路板箱体300穿过工作台1上的通孔1000进入测试柜17的上方工作空间1701内，之后，控制器8控制夹爪组件16于向靠近升降台18的方向移动以抓取电路板箱体300内的一个托盘100，并控制夹爪组件16向远离升降台18的方向移动以带动托盘100移动至两个支撑臂32上。
托盘100设有拉手101，且拉手101暴露于电路板箱体300外侧；夹爪组件16包括移动部件161和连接移动部件161的夹爪162；控制移动部件161带动夹爪162向靠近升降台18的方向移动，以使夹爪162位于拉手101的正上方或正下方；控制升降台18向下或向上移动以使夹爪162与拉手101卡持；控制移动部件161向远离升降台18的方向移动以带动托盘100从电路板箱体300内抽出，并移动至两个支撑臂32上。
(3)光源7为控制柜17的上方工作空间1701提供光照，摄像模组6拍摄待测电路板200的图像。
(4)控制器8根据图像获取待测电路板200上的关键信息，关键信息包括但不限于序列号或二维码信息，并保存该关键信息。控制器8还根据该图像确定待测电路板200上的对位点201(对位孔所在位置)在预设坐标系中的实际坐标。
(5)控制器8根据对位点201的理论坐标和实际坐标，控制移动模组2带动待测电路板200在工作台1上移动直至对位点201(对位孔所在位置)的实际坐标与理论坐标相同，此时，待测电路板200上待测点202与测试探头5在竖直方向上上下对准。
由于托盘100与摄像模组6的垂直距离固定，摄像模组6在支撑架4上的位置固定，以摄像模组6在托盘100所在平面上的投影位置为原点建立坐标系，预先确定测试焊盘两侧的对位点201(对位孔所在位置)位于该坐标系的理论坐标。在测试时，获取对位点201(对位孔所在位置)在该坐标系的实际坐标，控制器8控制移动模组2带动待测电路板200在工作台1上移动直至对位点201(对位孔所在位置)的实际坐标与理论坐标相同，此时，测试探头5与待测电路板200的测试焊盘在竖直方向上上下对准，即，测试探头5与待测电路板200的待测点202对准。
(6)控制器8控制测试探头5沿支撑架4下压，使得测试探头5与待测电路板200的测试焊盘接触以形成测试回路。测试探头5上设有压力传感器，测试探头5对待测电路板200施加一定的压力，压力传感器反馈压力后，网络分析仪19通过线缆、探头与待测电路板200的测试焊盘相连，开始进行插损测试。
(7)测试完成后，测试数据通过测试探头5及连接网络分析仪19的线缆传输到控制器8中并保存。
(8)测试探头5沿支撑架4向上抬起，离开待测电路板200上的第一个待测点202，移动到待测电路板200上的第二个待测点202。
可实现地，若测试探头5有两个，则一次性可对两个待测点202同时进行测试，每个测试探头5对应一个待测点202。测试探头5的数目本实施例中不做限定，可根据实际需要进行设计，本实施例附图中以两个测试探头5为例进行说明。
(9)当待测电路板200上有多个待测点202时，重复执行上述(3)至(6)的测试过程，直至完成待测电路板200上所有待测点202的测试。待测电路板200测试完成后，通过线缆和网络分析仪19测量两组插损数据。如测试探头5为两对时，只需要测量一次。电脑对该数据进行分析并去嵌处理，保存分析程序和数据。
当托盘100上有多个待测电路板200时，重复执行上述(2)至(6)的测试过程，直至对托盘100上装载的所有待测电路板200完成测试。
(10)当托盘100上最后一个待测电路板200测试完成后，控制器8控制夹爪组件16向靠近升降台18的方向移动并推动测试完成后托盘100***电路板箱体300内。并控制夹爪组件16抓取另一待测的托盘100，控制夹爪组件16向远离升降台18的方向移动以带动托盘100抽出电路板箱体300并移动至两个支撑臂32上。之后对新的托盘100上的待测电路板200执行步骤(3)至(10)的操作，直至电路板箱体300内的所有待测电路板200均完成测试。
(11)电路板箱体300内的所有待测电路板200均完成测试后，控制器8控制升降台18下降进入测试柜17的下方工作空间1702内，以方便人工手动或者外部机械臂更换电路板箱体300。
本申请实施例中的测试设备与行业内插损测试设备不同之处在于(1)X轴移动组件213、 Y轴移动组件211和旋转模块22联动实现高精度定位；(2)显示屏14嵌入式一体化。
本申请仅从结构设计出发，实现了自动测试待测电路板200的插损值，解决了现有测试过程中的人工效率低下的瓶颈问题，节省人工成本、提高工作效率。且自动测试无需人工上下待测电路板200，测试完成后数据0延时传输至电脑，操作过程及测试结果直观呈现。本实施例提供的测试设备目前可以连续测试12组插损条，24小时无间断测试，约1个人可负责3～4台设备，比手动测量节省3/4的人力。
上述实施例中所涉及到的各模块均为逻辑模块，在实际应用中，一个逻辑单元可以是一个物理单元，也可以是一个物理单元的一部分，还可以以多个物理单元的组合实现。此外，为了突出本申请的创新部分，上述实施例中并没有将与解决本申请所提出的技术问题关系不太密切的单元引入，但这并不表明上述实施例中不存在其它的单元。
本申请实施例还提供了一种测试方法，应用于上述任一实施例中的测试设备。本申请中测试方法的流程示意图如图17所示，包括：
步骤S11：利用摄像模组获取待测电路板的图像。
步骤S12：根据图像控制移动模组带动待测电路板移动，以使待测电路板上的待测点与测试探头对准。
请参见测试设备的附图1至附图16所示，每个待测电路板200上有对位点201和待测点202，本实施例中对位点201与待测点202不同，可通过对对位点201的定位实现对待测点202的定位。对位点201位置处设有对位点201(对位孔所在位置)，待测点202位置处设有测试焊盘。每个待测电路板200有至少1对待测点202，即包括至少1对测试焊盘，测试焊盘用于与测试探头5接触进行测试。当然在另外一些例子中，可将待测点202作为对位点201，直接对对位点201进行定位。
在一个例子中，根据图像控制移动模组2带动待测电路板200移动，以使待测电路板200上的待测点202与测试探头5对准，包括：根据图像获取待测电路板200上对位点的实际坐标；根据对位点的理论坐标和实际坐标，控制移动模组2带动待测电路板200在工作台1上移动、直至实际坐标与理论坐标相同，以使待测电路板200上的待测点202与测试探头5对准。
本实施例中待测电路板200上对位点201与待测点202不同，通过对对位点201的定位实现对待测点202的定位。请参见图1和图2，控制器8连接移动模组2、摄像模组6和测试探头5。控制器8用于获取摄像模组6拍摄的待测电路板200的图像，并根据图像获取待测电路板200上对位点201的实际位置；根据对位点201的理论位置和实际位置，控制移动模组2带动待测电路板200在工作台1上移动、直至实际坐标与理论坐标相同，以使待测电路板200上的待测点202与测试探头5上下对准。此时，控制器8控制测试探头5在支撑架4上沿朝向工作台1的方向移动，测试探头5与待测电路板200上待测点202接触以形成测试回路从而进行测试。
步骤S13：控制测试探头在支撑架上沿朝向工作台的方向移动，并与待测电路板上待测点接触以形成测试回路。
值得说明的是，本申请实施例为应用于上述任一实施例中的测试设备的测试方法实施例，因此本申请实施例的测试方法可与上述任一实施例中的测试设备结合使用。
本领域的普通技术人员可以理解，上述各实施例是实现本申请的具体实施例，而在实际 应用中，可以在形式上和细节上对其作各种改变，而不偏离本申请的精神和范围。

Claims (12)

  1. 一种测试设备，其中，所述测试设备包括工作台，可移动连接于所述工作台上的移动模组，固定于所述移动模组上的承载件，所述承载件设置为承载待测电路板；固定于所述工作台上的支撑架，固定于所述支撑架上的摄像模组，可移动连接于所述支撑架的测试探头，连接所述移动模组、所述摄像模组和所述测试探头的控制器；
    所述摄像模组获取所述待测电路板的图像；
    所述控制器设置为根据所述图像控制所述移动模组带动所述待测电路板移动，以使所述待测电路板上的待测点与所述测试探头对准；并控制所述测试探头在所述支撑架上沿朝向所述工作台的方向移动，以使所述测试探头与所述待测电路板上所述待测点接触形成测试回路。
  2. 根据权利要求1所述的测试设备，其中，所述移动模组包括：可移动连接于所述工作台上的滑动模块，所述滑动模块设置为带动所述待测电路板沿X方向和/或Y方向运动；固定于所述滑动模块上的旋转模块，所述承载件位于所述旋转模块上；
    所述控制器设置为根据所述图像控制所述滑动模块带动所述待测电路板沿X方向和/或Y方向运动，并控制所述旋转模块带动所述待测电路板围绕所述旋转模块的中心位置旋转，以使所述待测电路板上的待测点与所述测试探头对准。
  3. 根据权利要求2所述的测试设备，其中，所述滑动模块包括：固定于所述工作台上的Y轴移动组件，可移动连接于所述Y轴移动组件的载台，固定于所述载台的X轴移动组件、以及可移动连接于所述X轴移动组件的固定平台，所述旋转模块固定于所述固定平台上；
    所述控制器设置为根据所述图像控制所述Y轴移动组件带动所述载台在所述工作台上沿Y方向移动，并根据所述图像控制所述X轴移动组件带动所述固定平台在所述载台上沿X方向移动。
  4. 根据权利要求1至3中任一项所述的测试设备，其中，所述承载件包括：固定于所述移动模组上的承载平台，固定于所述承载平台上且间隔设置的两个支撑臂，位于两个所述支撑臂之间且可移动连接于所述承载平台的夹爪组件；
    所述控制器设置为在利用所述摄像模组获取所述待测电路板的图像之前，控制所述夹爪组件抓取托盘并带动所述托盘移动至所述两个支撑臂上，所述托盘设置为承载所述待测电路板。
  5. 根据权利要求4所述的测试设备，其中，所述测试设备还包括测试柜，所述工作台固定于所述测试柜内且将所述测试柜划分为上、下两个工作空间；所述移动模组和所述支撑架均位于上方工作空间内，所述工作台上设有连通上、下两个工作空间的通孔；下方工作空间内设有正对所述通孔的升降台，所述升降台设置为承载所述托盘；
    所述控制器设置为在控制所述夹爪组件抓取托盘并带动所述托盘移动至所述两个支撑臂上之前，控制所述升降台沿朝向所述工作台的方向移动，以带动所述托盘穿过所述通孔进入所述上方工作空间内。
  6. 根据权利要求5所述的测试设备，其中，所述测试设备还包括：位于所述升降台上的电路板箱体，所述电路板箱体单侧开口，所述电路板箱体内包括多个插槽，每个插槽设置为对应放置一个所述托盘。
  7. 根据权利要求6所述的测试设备，其中，所述托盘设有拉手，且所述拉手暴露于所述 电路板箱体外侧；所述夹爪组件包括移动部件和连接所述移动部件的夹爪；
    所述控制器设置为控制所述移动部件带动所述夹爪向靠近所述升降台的方向移动，以使所述夹爪位于所述拉手的正上方或正下方；并控制所述升降台向下或向上移动以使所述夹爪与所述拉手卡持；控制所述移动部件向远离所述升降台的方向移动以使所述夹爪带动所述托盘从所述电路板箱体内抽出，并移动至所述两个支撑臂上。
  8. 根据权利要求1至3中任一项所述的测试设备，其中，所述测试设备还包括固定于所述工作台上的保护架，所述保护架与所述支撑架在所述工作台上围成工作空间，所述移动模组位于所述工作空间内。
  9. 根据权利要求8所述的测试设备，其中，所述保护架包括：固定于所述工作台上且相对设置的第一支架和第二支架，发射装置固定于所述第一支架上，接收装置固定于所述第二支架上；
    所述控制器还设置为在测试过程中控制所述发射装置向所述接收装置发射安全信号；并在检测到所述接收装置未接收到所述发射装置发出的安全信号时，发出报警信息。
  10. 根据权利要求1至3中任一项所述的测试设备，所述测试设备还包括：网络分析仪；所述网络分析仪的一端与所述待测电路板相连，另一端与所述控制器相连；
    所述网络分析仪设置为获取所述待测电路板的插损信号，对所述插损信号进行分析得到插损结果，并将所述插损结果反馈给所述控制器；
    所述控制器还设置为根据所述插损结果判断所述待测电路板是否合格。
  11. 一种测试方法，应用于上述权利要求1至权利要求10中任一项所述的测试设备，其中，所述测试方法包括：
    利用摄像模组获取待测电路板的图像；
    根据所述图像控制移动模组带动所述待测电路板移动，以使所述待测电路板上的待测点与测试探头对准；
    控制所述测试探头在支撑架上沿朝向工作台的方向移动，并与所述待测电路板上所述待测点接触以形成测试回路。
  12. 根据权利要求11所述的测试方法，其中，所述根据所述图像控制移动模组带动所述待测电路板移动，以使所述待测电路板上的待测点与所述测试探头对准，包括：
    根据所述图像获取所述待测电路板上对位点的实际坐标；
    根据所述对位点的理论坐标和所述实际坐标，控制所述移动模组带动所述待测电路板在所述工作台上移动、直至所述实际坐标与所述理论坐标相同，以使所述待测电路板上的待测点与所述测试探头对准。
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