WO2023216230A1 - Memory device having heat dissipation function - Google Patents

Memory device having heat dissipation function Download PDF

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Publication number
WO2023216230A1
WO2023216230A1 PCT/CN2022/092669 CN2022092669W WO2023216230A1 WO 2023216230 A1 WO2023216230 A1 WO 2023216230A1 CN 2022092669 W CN2022092669 W CN 2022092669W WO 2023216230 A1 WO2023216230 A1 WO 2023216230A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
storage device
housing
cover
module
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PCT/CN2022/092669
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French (fr)
Chinese (zh)
Inventor
周启文
廖廷倚
沈哲墉
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威刚科技股份有限公司
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Application filed by 威刚科技股份有限公司 filed Critical 威刚科技股份有限公司
Priority to PCT/CN2022/092669 priority Critical patent/WO2023216230A1/en
Publication of WO2023216230A1 publication Critical patent/WO2023216230A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a storage device, and in particular, to a storage device with a heat dissipation function.
  • SSD mobile solid-state drives
  • flash memory flash memory
  • the technical problem to be solved by the present invention is to provide a storage device with a heat dissipation function in view of the shortcomings of the existing technology.
  • a storage device with a heat dissipation function which includes a housing, a heat dissipation network, a storage module, a heat dissipation module and a support frame.
  • the housing has a surface with an opening.
  • the heat dissipation net is arranged in the opening, and the heat dissipation net is provided with a plurality of heat dissipation holes.
  • the storage module is arranged inside the casing.
  • the heat dissipation module is arranged inside the casing, and the heat dissipation module is located between the storage module and the heat dissipation network.
  • the support frame has a fixed part and a supporting part.
  • the fixed part is fixed on the surface of the housing so that the supporting part pivots relative to the fixed part.
  • the support frame is used to fold or unfold by pivoting the support part. When the support frame is folded, the support part is used to cover a plurality of heat dissipation holes. When the support frame is unfolded, the housing is used to stand upright through the support of the support part. Set up and expose multiple heat dissipation holes.
  • the projected area of the support part projected on the surface will completely overlap the heat dissipation net, so that the support part covers a plurality of the heat dissipation holes.
  • the projected area of the storage module on the surface at least partially overlaps the heat dissipation network.
  • the projected area of the heat dissipation module on the surface completely overlaps the heat dissipation network.
  • the storage device with heat dissipation function further includes a first cover, and the housing further includes a first through opening, and the first cover is detachably disposed in the first through opening. .
  • the storage device with heat dissipation function further includes a second cover, the second cover includes a bearing base, the storage module is disposed on the bearing base, and the housing further includes a first There are two openings, the second cover is detachably provided at the second opening, and the bearing seat is located inside the housing.
  • the first cover further includes an annular side wall, the annular side wall is provided with a plurality of first engaging holes and a plurality of second engaging holes, and the bearing base is provided with a plurality of engaging holes.
  • a stopper and a plurality of hooks When the first cover is disposed at the first through-port and the second cover is disposed at the second through-port, the plurality of catchers respectively engage It is provided in a plurality of first clamping holes, and a plurality of said hooks are respectively clamped in a plurality of said second clamping holes.
  • the carrier base further includes a plurality of fasteners arranged on both sides of the carrier base, wherein when the storage module is disposed on the carrier base, the plurality of fasteners are used to fix the storage module. module.
  • the second cover is further provided with a slot
  • the storage module has a communication interface
  • the communication interface is provided in the slot.
  • the heat dissipation module includes a switch component, a linkage component and a fan
  • the switch component is arranged inside the housing, and the linkage component is used to connect the switch component and the support.
  • the support part of the frame, and the switch assembly is electrically connected to the fan; wherein, when the support frame is deployed, the linkage member is driven by the pivot of the support part to trigger the switch assembly , causing the switch component to start the fan; wherein, when the support frame is folded, the linkage component stops triggering the switch component, and causes the switch component to stop starting the fan.
  • the storage device with heat dissipation function provided by the present invention allows users to freely adjust the covering or exposure of multiple heat dissipation holes by folding or unfolding the support frame.
  • the multiple heat dissipation holes of the storage device will be closed to achieve dust-proof effect;
  • the storage device can be erected to expose multiple heat dissipation holes, increasing the storage module and the air contact area.
  • FIG. 1 is a schematic three-dimensional view of the storage device with heat dissipation function of the present invention when the support frame is unfolded.
  • FIG. 2 is an exploded schematic diagram of the storage device with heat dissipation function of the present invention.
  • FIG 3 is another three-dimensional schematic view of the storage device with heat dissipation function of the present invention when the support frame is deployed.
  • FIG. 4 is a schematic three-dimensional view of the storage device with heat dissipation function of the present invention when the support frame is folded.
  • FIG. 5 is a schematic three-dimensional view of the second cover and the bearing base of the storage device with heat dissipation function of the present invention.
  • FIG. 6 is a functional block diagram of the heat dissipation module of the storage device with heat dissipation function of the present invention.
  • FIG. 1 is a three-dimensional schematic view of the storage device with heat dissipation function of the present invention when the support frame is unfolded.
  • FIG. 2 is an exploded schematic view of the storage device with heat dissipation function of the present invention.
  • An embodiment of the present invention provides a storage device D with a heat dissipation function, which includes: a housing 1, a heat dissipation network 2, a storage module 3, a heat dissipation module 4 and a support frame 5.
  • the housing 1 has a surface 11 , and the surface 11 is provided with an opening 110 .
  • the heat dissipation net 2 is provided at the opening 110 , and the heat dissipation net 2 is provided with a plurality of heat dissipation holes 20 .
  • the storage module 3 is arranged inside the housing 1 .
  • the heat dissipation module 4 is arranged inside the casing 1 .
  • the heat dissipation module 4 includes a fan 41 located between the storage module 3 and the heat dissipation network 2 .
  • the projected area of the storage module 3 on the surface 11 will at least partially overlap the heat dissipation network 2.
  • the projected area of the storage module 3 on the surface 11 will completely overlap the heat dissipation network 2.
  • the heat dissipation module 4 specifically the fan 41 , has a projected area on the surface 11 that completely overlaps the heat dissipation network 2 . Therefore, the heat generated by the storage module 3 can be completely dissipated through the heat dissipation network 2, and the heat dissipation speed is further increased through the fan 41 to enhance the heat dissipation effect.
  • the support frame 5 has a fixing part 51 and a supporting part 52. One side of the supporting part 52 is pivotally connected to the fixing part 51.
  • the fixing part 51 is fixed on the surface 11 of the housing 1 through a plurality of fasteners 53, so that the supporting part 52 is relatively
  • the fixing part 51 pivots, but the present invention is not limited to the manner in which the fixing part 51 is fixed to the housing 1 .
  • FIG. 3 is another three-dimensional schematic view of the storage device with heat dissipation function of the present invention when the support frame is deployed.
  • the supporting frame 5 of the storage device D shown in FIG. 3 is deployed sideways, and the housing 1 of the storage device D is also erected by the support portion 52 abutting against the desktop T.
  • FIG. 4 is a schematic three-dimensional view of the storage device with heat dissipation function of the present invention when the support frame is folded.
  • the support portion 52 is used to cover the plurality of heat dissipation holes 20 .
  • the projected area of the support portion 52 on the surface 11 of the housing 1 will completely overlap the heat dissipation net 2 , so that the support portion 52 covers the plurality of heat dissipation holes 20 .
  • the support portion 52 covers rather than blocks the plurality of heat dissipation holes 20 , and since the housing 1 and the heat dissipation net 2 themselves are made of materials with good thermal conductivity (such as aluminum), even when the support frame 5 When folded, the storage device D can also have a considerable heat dissipation effect.
  • FIG. 5 is a schematic perspective view of the second cover and the bearing base of the storage device with heat dissipation function of the present invention.
  • the storage device D also includes a first cover 6 and a second cover 7 , and the housing 1 further includes a first through opening 12 and a second through opening 13 .
  • the first cover 6 is detachably provided at the first through opening 12
  • the second cover 7 is detachably provided at the second through opening 13 .
  • the second cover 7 includes a bearing base 71
  • the storage module 3 is fixedly mounted on the bearing base 71 . When the second cover 7 is disposed in the second through opening 13 , the bearing seat 71 will be located inside the housing 1 .
  • the first cover 6 also includes an annular side wall 61.
  • the annular side wall 61 is provided with two first engaging holes 611 and two second engaging holes 612.
  • the bearing base 71 is provided with two engaging holes.
  • the two hooks 711 and the two hooks 712 are respectively provided on both sides of the bearing seat 71 , and the two hooks 712 are arranged on the bottom of the bearing seat 71 .
  • the carrying base 71 also includes four fastening parts 713, and the four fastening parts 713 are evenly arranged on both sides of the carrying base 71.
  • the four fasteners 713 can fix the storage module 3 on the carrying base 71 .
  • the memory module 3 includes a circuit board and a communication interface 31 electrically coupled to the circuit board.
  • the second cover 7 is also provided with a slot 714.
  • the memory module 3 has a communication interface 31.
  • the communication interface 31 is disposed in the slot. hole 714 and the communication interface 31 is connected with the slot 714 .
  • the storage device D provided by the present invention is a solid-state drive (SSD), and the communication interface 31 is a USB interface, but the present invention is not limited thereto.
  • FIG. 6 is a functional block diagram of the heat dissipation module of the storage device with heat dissipation function of the present invention.
  • the heat dissipation module 4 includes a fan 41, a linkage component 42 and a switch component 43.
  • the switch component 43 is arranged inside the housing 1.
  • the linkage component 42 at least includes a plurality of connecting rods (not shown) for connecting the switches.
  • the switch assembly 43 is electrically connected to the fan 41 .
  • the linkage member 42 When the support frame 5 is unfolded and the storage device D is erected, the linkage member 42 will be driven by the pivot of the support portion 52 to trigger the switch assembly 43, thereby starting the fan 41. On the other hand, when the support frame 5 is folded and the storage device D is laid flat, the linkage component 42 stops triggering the switch assembly 43 and stops the switch assembly 43 from starting the fan 41 .
  • the storage device D with a heat dissipation function provided by the present invention allows the user to freely adjust the covering or exposure of the multiple heat dissipation holes 20 by folding or unfolding the support frame 5, thereby allowing the storage device to D has different degrees of heat dissipation effect.
  • the plurality of heat dissipation holes 20 of the storage device D will be covered to achieve a dust-proof effect.
  • the support frame 5 is unfolded and the storage device D is erected, a plurality of heat dissipation holes 20 are exposed, thereby increasing the contact area between the storage module 3 and the air.
  • the fan 41 in the trigger device can also be started to operate, and the fan 41 can use the fan 41 to remove the external temperature of the device.
  • the cold air is sucked into the storage device D, so that the main control chip and storage particles on the circuit board of the housing 1 and the storage module 3 can exchange heat with the continuously flowing cold air, and the hot air is discharged from the inside of the storage device D, and then Improve heat dissipation efficiency and reduce the temperature of storage device D.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A memory device having a heat dissipation function. The memory device comprises a shell, a heat dissipation mesh, a memory module, a heat dissipation module and a supporting frame, wherein the shell has a surface provided with an opening; the heat dissipation mesh is arranged at the opening, and is provided with multiple heat dissipation holes; the memory module is arranged inside the shell; the heat dissipation module is arranged inside the shell, and is located between the memory module and the heat dissipation mesh; the supporting frame comprises a fixing portion and a supporting portion, one side edge of the supporting portion is pivotally connected to the fixing portion, and the fixing portion is fixed to the surface of the shell to allow the supporting portion to pivot relative to the fixing portion; and the supporting frame is collapsed or deployed by means of pivoting of the supporting portion. When the supporting frame is collapsed, the supporting portion covers the multiple heat dissipation holes to achieve a dust-proof effect. When the supporting frame is deployed, the shell is supported by means of the supporting portion and is arranged upright, such that the multiple heat dissipation holes are exposed to increase the contact area between the memory module and air.

Description

具有散热功能的存储装置Cooling storage device 技术领域Technical field
本发明涉及一种存储装置，尤其涉及一种具有散热功能的存储装置。The present invention relates to a storage device, and in particular, to a storage device with a heat dissipation function.
背景技术Background technique
随着科技的进步，存储装置，例如移动固态硬盘(SSD)或是闪存(Flash memory)等等，其读取/存储速度越来越快且效能越来越好。以移动固态硬盘来说，不同于传统读外接式硬盘装置，各家公司对于移动固态硬盘的产品要求点皆为体积小容量大，却容易因为体积小导致热容积不足而无法散热。With the advancement of technology, storage devices, such as mobile solid-state drives (SSD) or flash memory (Flash memory), etc., have faster and faster reading/storage speeds and better performance. For mobile solid-state drives, unlike traditional external hard drive devices, each company's product requirements for mobile solid-state drives are small size and large capacity. However, the small size easily leads to insufficient thermal capacity and cannot dissipate heat.
为了让存储装置能够长时间高速读写，降低存储装置内部的存储组件温度是最重要的目标。现有技术中，厂商常通过导热贴(Thermal Pad)及散热片将存储组件所产生的热能传导至存储装置外壳，通过更大的散热面积，达到降低温度的效果。然而，随着产品体积逐渐缩小，原本有限的散热面积越来越小，散热效果更打折扣，因此寻找新的装置降温方式势在必行。In order to enable the storage device to read and write at high speed for a long time, reducing the temperature of the storage components inside the storage device is the most important goal. In the existing technology, manufacturers often use thermal pads and heat sinks to conduct the heat energy generated by storage components to the storage device casing, thereby achieving the effect of lowering the temperature through a larger heat dissipation area. However, as the size of products gradually shrinks, the originally limited heat dissipation area becomes smaller and smaller, and the heat dissipation effect becomes even more compromised. Therefore, it is imperative to find new ways to cool down the device.
故，如何通过结构设计的改良，来克服上述的缺陷，已成为该领域所欲解决的重要课题之一。Therefore, how to overcome the above-mentioned defects through structural design improvements has become one of the important issues to be solved in this field.
发明内容Contents of the invention
本发明所要解决的技术问题在于，针对现有技术的不足提供一种具有散热功能的存储装置。The technical problem to be solved by the present invention is to provide a storage device with a heat dissipation function in view of the shortcomings of the existing technology.
为了解决上述的技术问题，本发明所采用的其中一技术方案是，提供一种具有散热功能的存储装置，其包括一壳体、一散热网、一存储模块、一散热模块以及一支撑架。壳体具有一表面，表面设有一开口。散热网设置在开口，散热网设有多个散热孔。存储模块设置在壳体内部。散热模块设置在壳体内部，散热模块位于存储模块与散热网之间。支撑架具有一固定部与一支撑部，支撑部的一侧边枢接于固定部，固定部固定在壳体的表面，使支撑部相对于固定部枢转。支撑架用于通过支撑部枢转来收折或展开，当支撑架收折时，支撑部用于遮蔽多个散热孔，当支撑架展开时，壳体用于通过支撑部的支撑而呈直立设置，并且使多个散热孔露出。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a storage device with a heat dissipation function, which includes a housing, a heat dissipation network, a storage module, a heat dissipation module and a support frame. The housing has a surface with an opening. The heat dissipation net is arranged in the opening, and the heat dissipation net is provided with a plurality of heat dissipation holes. The storage module is arranged inside the casing. The heat dissipation module is arranged inside the casing, and the heat dissipation module is located between the storage module and the heat dissipation network. The support frame has a fixed part and a supporting part. One side of the supporting part is pivotally connected to the fixed part. The fixed part is fixed on the surface of the housing so that the supporting part pivots relative to the fixed part. The support frame is used to fold or unfold by pivoting the support part. When the support frame is folded, the support part is used to cover a plurality of heat dissipation holes. When the support frame is unfolded, the housing is used to stand upright through the support of the support part. Set up and expose multiple heat dissipation holes.
优选地，当所述支撑部收折时，所述支撑部投影在所述表面的投影面积会完全重叠于所述散热网，使所述支撑部遮蔽多个所述散热孔。Preferably, when the support part is folded, the projected area of the support part projected on the surface will completely overlap the heat dissipation net, so that the support part covers a plurality of the heat dissipation holes.
优选地，所述存储模块投影在所述表面的投影面积至少部分重叠于所述散热网。Preferably, the projected area of the storage module on the surface at least partially overlaps the heat dissipation network.
优选地，所述散热模块投影在所述表面的投影面积完全重叠于所述散热网。Preferably, the projected area of the heat dissipation module on the surface completely overlaps the heat dissipation network.
优选地，所述的具有散热功能的存储装置还包括一第一盖体，且所述壳体还包括一第一通口，所述第一盖体可拆卸地设置在所述第一通口。Preferably, the storage device with heat dissipation function further includes a first cover, and the housing further includes a first through opening, and the first cover is detachably disposed in the first through opening. .
优选地，所述的具有散热功能的存储装置还包括一第二盖体，所述第二盖体包括一承载座，所述存储模块设置于所述承载座，所述壳体还包括一第二通口，所述第二盖体可拆卸地设置在所述第二通口，所述承载座位于所述壳体内部。Preferably, the storage device with heat dissipation function further includes a second cover, the second cover includes a bearing base, the storage module is disposed on the bearing base, and the housing further includes a first There are two openings, the second cover is detachably provided at the second opening, and the bearing seat is located inside the housing.
优选地，所述第一盖体还包括一环状侧壁，所述环状侧壁设有多个第一卡接孔与多个第二卡接孔，所述承载座设有多个卡止件与多个卡勾件，当所述第一盖体设置在所述第一通口且所述第二盖体设置在所述第二通口时，多个所述卡止件分别卡设于多个所述第一卡接孔，且多个所述卡勾件分别卡设于多个所述第二卡接孔。Preferably, the first cover further includes an annular side wall, the annular side wall is provided with a plurality of first engaging holes and a plurality of second engaging holes, and the bearing base is provided with a plurality of engaging holes. A stopper and a plurality of hooks. When the first cover is disposed at the first through-port and the second cover is disposed at the second through-port, the plurality of catchers respectively engage It is provided in a plurality of first clamping holes, and a plurality of said hooks are respectively clamped in a plurality of said second clamping holes.
优选地，所述承载座还包括多个卡固件，设置在所述承载座的两侧，其中当所述存储模块设置于所述承载座时，多个所述卡固件用于固定所述存储模块。Preferably, the carrier base further includes a plurality of fasteners arranged on both sides of the carrier base, wherein when the storage module is disposed on the carrier base, the plurality of fasteners are used to fix the storage module. module.
优选地，所述第二盖体还设有一槽孔，所述存储模块具有一通信接口，所述通信接口设置于所述槽孔。Preferably, the second cover is further provided with a slot, the storage module has a communication interface, and the communication interface is provided in the slot.
优选地，所述散热模块包括一开关组件、一连动机构件以及一风扇，所述开关组件设置在所述壳体内部，所述连动机构件用于连接所述开关组件及所述支撑架的所述支撑部，且所述开关组件电连接于所述风扇；其中，当所述支撑架展开时，所述连动机构件受到所述支撑部枢转的带动而触发所述开关组件，使所述开关组件启动所述风扇；其中，当所述支撑架收折时，所述连动机构件停止触发所述开关组件，并且使所述开关组件停止启动所述风扇。Preferably, the heat dissipation module includes a switch component, a linkage component and a fan, the switch component is arranged inside the housing, and the linkage component is used to connect the switch component and the support. The support part of the frame, and the switch assembly is electrically connected to the fan; wherein, when the support frame is deployed, the linkage member is driven by the pivot of the support part to trigger the switch assembly , causing the switch component to start the fan; wherein, when the support frame is folded, the linkage component stops triggering the switch component, and causes the switch component to stop starting the fan.
本发明的其中一有益效果在于，本发明所提供的具有散热功能的存储装置，能够让用户通过收折或展开支撑架来自由调整多个散热孔的遮蔽或露出。当支撑架收折时，会将存储装置的多个散热孔关闭来达到防尘的效果；而当支撑架展开时，能将存储装置立起，来使多个散热孔露出，增加存储模块与空气的接触面积。One of the beneficial effects of the present invention is that the storage device with heat dissipation function provided by the present invention allows users to freely adjust the covering or exposure of multiple heat dissipation holes by folding or unfolding the support frame. When the support frame is folded, the multiple heat dissipation holes of the storage device will be closed to achieve dust-proof effect; when the support frame is unfolded, the storage device can be erected to expose multiple heat dissipation holes, increasing the storage module and the air contact area.
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所提供的附图仅用于提供参考与说明，并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.
附图说明Description of the drawings
图1为本发明的具有散热功能的存储装置的支撑架展开时的立体示意图。FIG. 1 is a schematic three-dimensional view of the storage device with heat dissipation function of the present invention when the support frame is unfolded.
图2为本发明的具有散热功能的存储装置的分解示意图。FIG. 2 is an exploded schematic diagram of the storage device with heat dissipation function of the present invention.
图3为本发明的具有散热功能的存储装置的支撑架展开时的另一立体示意图。3 is another three-dimensional schematic view of the storage device with heat dissipation function of the present invention when the support frame is deployed.
图4为本发明的具有散热功能的存储装置的支撑架收折时的立体示意图。4 is a schematic three-dimensional view of the storage device with heat dissipation function of the present invention when the support frame is folded.
图5为本发明的具有散热功能的存储装置的第二盖体与承载座的立体示意图。5 is a schematic three-dimensional view of the second cover and the bearing base of the storage device with heat dissipation function of the present invention.
图6为本发明的具有散热功能的存储装置的散热模块的功能方块图。FIG. 6 is a functional block diagram of the heat dissipation module of the storage device with heat dissipation function of the present invention.
具体实施方式Detailed ways
以下是通过特定的具体实施例来说明本发明所公开有关“具有散热功能的存储装置”的实施方式，本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其他不同的具体实施例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本发明的构思下进行各种修改与变更。另外，本发明的附图仅为简单示意说明，并非依实际尺寸的描绘，事先声明。以下的实施方式将进一步详细说明本发明的相关技术内容，但所公开的内容并非用以限制本发明的保护范围。The following is a specific embodiment to illustrate the implementation of the "storage device with heat dissipation function" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.
应当可以理解的是，虽然本文中可能会使用到“第一”、“第二”、“第三”等术语来描述各种元件，但这些元件不应受这些术语的限制。这些术语主要是用以区分一元件与另一元件。另外，本文中所使用的术语“或”，应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are primarily used to distinguish one element from another element. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.
实施例Example
参阅图1与图2所示，图1为本发明的具有散热功能的存储装置的支撑架展开时的立体示意图，图2为本发明的具有散热功能的存储装置的分解示意图。本发明实施例提供一种具有散热功能的存储装置D，其包括：壳体1、散热网2、存储模块3、散热模块4以及支撑架5。Referring to FIGS. 1 and 2 , FIG. 1 is a three-dimensional schematic view of the storage device with heat dissipation function of the present invention when the support frame is unfolded. FIG. 2 is an exploded schematic view of the storage device with heat dissipation function of the present invention. An embodiment of the present invention provides a storage device D with a heat dissipation function, which includes: a housing 1, a heat dissipation network 2, a storage module 3, a heat dissipation module 4 and a support frame 5.
承上述，壳体1具有一表面11，表面11设有开口110。散热网2设置在开口110，散热网2设有多个散热孔20。存储模块3设置在壳体1内部。散热模块4设置在壳体1内部，散热模块4包括风扇41，其位于存储模块3与散热网2之间。进一步来说，存储模块3投影在表面11的投影面积会至少部分重叠于散热网2，较佳者，存储模块3投影 在表面11的投影面积会完全重叠于散热网2。散热模块4，具体来说是风扇41，其投影在表面11的投影面积完全重叠于散热网2。由此，存储模块3产生的热能够完全由散热网2逸散出，并且通过风扇41进一步提升散热速度，加强散热效果。Based on the above, the housing 1 has a surface 11 , and the surface 11 is provided with an opening 110 . The heat dissipation net 2 is provided at the opening 110 , and the heat dissipation net 2 is provided with a plurality of heat dissipation holes 20 . The storage module 3 is arranged inside the housing 1 . The heat dissipation module 4 is arranged inside the casing 1 . The heat dissipation module 4 includes a fan 41 located between the storage module 3 and the heat dissipation network 2 . Furthermore, the projected area of the storage module 3 on the surface 11 will at least partially overlap the heat dissipation network 2. Preferably, the projected area of the storage module 3 on the surface 11 will completely overlap the heat dissipation network 2. The heat dissipation module 4 , specifically the fan 41 , has a projected area on the surface 11 that completely overlaps the heat dissipation network 2 . Therefore, the heat generated by the storage module 3 can be completely dissipated through the heat dissipation network 2, and the heat dissipation speed is further increased through the fan 41 to enhance the heat dissipation effect.
支撑架5具有固定部51与支撑部52，支撑部52的一侧边枢接于固定部51，固定部51通过多个锁固件53固定在壳体1的表面11，使支撑部52相对于固定部51枢转，但本发明不以固定部51固定在壳体1的方式为限制。The support frame 5 has a fixing part 51 and a supporting part 52. One side of the supporting part 52 is pivotally connected to the fixing part 51. The fixing part 51 is fixed on the surface 11 of the housing 1 through a plurality of fasteners 53, so that the supporting part 52 is relatively The fixing part 51 pivots, but the present invention is not limited to the manner in which the fixing part 51 is fixed to the housing 1 .
因此，支撑架5能够通过支撑部52枢转来收折或展开。图1即为存储装置D的支撑架5展开的方式，当支撑架5展开时，壳体1用于通过支撑部52的支撑而直立设置在桌面T上，并且使多个散热孔20露出。值得一提的是，存储装置D的支撑架5展开的设置方式不限于此，参阅图3所示，图3为本发明的具有散热功能的存储装置的支撑架展开时的另一立体示意图。图3所示的存储装置D的支撑架5展开的方式是侧立设置的方式，其同样都是通过支撑部52抵靠在桌面T来立起存储装置D的壳体1。Therefore, the support frame 5 can be folded or unfolded by pivoting the support portion 52 . Figure 1 shows the way in which the support frame 5 of the storage device D is unfolded. When the support frame 5 is unfolded, the housing 1 is supported by the support portion 52 to be placed upright on the desktop T, and a plurality of heat dissipation holes 20 are exposed. It is worth mentioning that the deployed arrangement of the support frame 5 of the storage device D is not limited to this. Refer to FIG. 3 . FIG. 3 is another three-dimensional schematic view of the storage device with heat dissipation function of the present invention when the support frame is deployed. The supporting frame 5 of the storage device D shown in FIG. 3 is deployed sideways, and the housing 1 of the storage device D is also erected by the support portion 52 abutting against the desktop T.
另一方面，参阅图4所示，图4为本发明的具有散热功能的存储装置的支撑架收折时的立体示意图。当支撑架5收折时，支撑部52用于遮蔽多个散热孔20。此外，当支撑架5收折时，支撑部52投影在壳体1的表面11的投影面积会完全重叠于散热网2，使支撑部52遮蔽多个散热孔20。须说明的是，支撑部52是遮蔽而非堵塞住多个散热孔20，且由于壳体1及散热网2本身是由导热性佳的材质(例如铝)制成，因此即使在支撑架5收折时，存储装置D也能具备相当程度的散热效果。On the other hand, refer to FIG. 4 , which is a schematic three-dimensional view of the storage device with heat dissipation function of the present invention when the support frame is folded. When the support frame 5 is folded, the support portion 52 is used to cover the plurality of heat dissipation holes 20 . In addition, when the support frame 5 is folded, the projected area of the support portion 52 on the surface 11 of the housing 1 will completely overlap the heat dissipation net 2 , so that the support portion 52 covers the plurality of heat dissipation holes 20 . It should be noted that the support portion 52 covers rather than blocks the plurality of heat dissipation holes 20 , and since the housing 1 and the heat dissipation net 2 themselves are made of materials with good thermal conductivity (such as aluminum), even when the support frame 5 When folded, the storage device D can also have a considerable heat dissipation effect.
参阅图2与图5所示，图5为本发明的具有散热功能的存储装置的第二盖体与承载座的立体示意图。存储装置D还包括第一盖体6与第二盖体7，而壳体1还包括第一通口12与第二通口13。第一盖体6可拆卸地设置在第一通口12，第二盖体7可拆卸地设置在第二通口13。第二盖体7包括承载座71，且存储模块3固定设置于承载座71。当第二盖体7设置在第二通口13时，承载座71会位于壳体1的内部。Referring to FIGS. 2 and 5 , FIG. 5 is a schematic perspective view of the second cover and the bearing base of the storage device with heat dissipation function of the present invention. The storage device D also includes a first cover 6 and a second cover 7 , and the housing 1 further includes a first through opening 12 and a second through opening 13 . The first cover 6 is detachably provided at the first through opening 12 , and the second cover 7 is detachably provided at the second through opening 13 . The second cover 7 includes a bearing base 71 , and the storage module 3 is fixedly mounted on the bearing base 71 . When the second cover 7 is disposed in the second through opening 13 , the bearing seat 71 will be located inside the housing 1 .
进一步来说，第一盖体6还包括环状侧壁61，环状侧壁61设有两个第一卡接孔611与两个第二卡接孔612，承载座71设有两个卡止件711与两个卡勾件712，两个卡止件711分别设置于承载座71的两侧边，两个卡勾件712设置在承载座71的底部。当第一盖体6设置在第一通口12且第二盖体7设置在第二通口13时，两个卡止件711分别卡设于两个第一卡接孔611，且两个卡勾件712分别卡设于两个第二卡接孔612，进而组装成存储装置D。此外，承载座71还包括四个卡固件713，四个卡固件713平均设置在承载座 71的两侧。当存储模块3设置于承载座71时，四个卡固件713能够将存储模块3固定在承载座71上。存储模块3包括一电路板与一电性耦接于所述电路板的通信接口31，第二盖体7还设有槽孔714，存储模块3具有一通信接口31，通信接口31设置于槽孔714并且通信接口31与槽孔714相连通。举例来说，本发明所提供的存储装置D为一固态硬盘装置(Solid-State Drive，SSD)，而通信接口31为一USB接口，但本发明不以为限。Furthermore, the first cover 6 also includes an annular side wall 61. The annular side wall 61 is provided with two first engaging holes 611 and two second engaging holes 612. The bearing base 71 is provided with two engaging holes. The two hooks 711 and the two hooks 712 are respectively provided on both sides of the bearing seat 71 , and the two hooks 712 are arranged on the bottom of the bearing seat 71 . When the first cover 6 is disposed in the first through opening 12 and the second cover 7 is disposed in the second through opening 13, the two locking members 711 are respectively engaged in the two first engaging holes 611, and the two The hook pieces 712 are respectively engaged in the two second engaging holes 612, and then the storage device D is assembled. In addition, the carrying base 71 also includes four fastening parts 713, and the four fastening parts 713 are evenly arranged on both sides of the carrying base 71. When the storage module 3 is placed on the carrying base 71 , the four fasteners 713 can fix the storage module 3 on the carrying base 71 . The memory module 3 includes a circuit board and a communication interface 31 electrically coupled to the circuit board. The second cover 7 is also provided with a slot 714. The memory module 3 has a communication interface 31. The communication interface 31 is disposed in the slot. hole 714 and the communication interface 31 is connected with the slot 714 . For example, the storage device D provided by the present invention is a solid-state drive (SSD), and the communication interface 31 is a USB interface, but the present invention is not limited thereto.
接着，参阅图1、图4及图6所示，图6为本发明的具有散热功能的存储装置的散热模块的功能方块图。散热模块4包括风扇41、连动机构件42以及开关组件43，开关组件43设置在壳体1的内部，连动机构件42至少包含多个连杆(图未示出)，用于连接开关组件43及支撑架5的支撑部52。开关组件43电连接于风扇41。当支撑架5展开而使存储装置D立起时，连动机构件42会受到支撑部52枢转的带动而触发开关组件43，进而启动风扇41。另一方面，当支撑架5收折而使存储装置D平放时，连动机构件42会停止触发开关组件43，并且使开关组件43停止启动风扇41。Next, refer to FIG. 1 , FIG. 4 and FIG. 6 . FIG. 6 is a functional block diagram of the heat dissipation module of the storage device with heat dissipation function of the present invention. The heat dissipation module 4 includes a fan 41, a linkage component 42 and a switch component 43. The switch component 43 is arranged inside the housing 1. The linkage component 42 at least includes a plurality of connecting rods (not shown) for connecting the switches. The assembly 43 and the support portion 52 of the support frame 5 . The switch assembly 43 is electrically connected to the fan 41 . When the support frame 5 is unfolded and the storage device D is erected, the linkage member 42 will be driven by the pivot of the support portion 52 to trigger the switch assembly 43, thereby starting the fan 41. On the other hand, when the support frame 5 is folded and the storage device D is laid flat, the linkage component 42 stops triggering the switch assembly 43 and stops the switch assembly 43 from starting the fan 41 .
实施例的有益效果Beneficial effects of the embodiment
本发明的其中一有益效果在于，本发明所提供的具有散热功能的存储装置D，能够让用户通过收折或展开支撑架5来自由调整多个散热孔20的遮蔽或露出，进而让存储装置D具有不同程度大小的散热效果。当支撑架5收折而使存储装置D平放时，会遮蔽存储装置D的多个散热孔20来达到防尘效果。反之，当支撑架5展开时而使存储装置D立起时，并且由此使多个散热孔20露出，增加存储模块3与空气的接触面积。One of the beneficial effects of the present invention is that the storage device D with a heat dissipation function provided by the present invention allows the user to freely adjust the covering or exposure of the multiple heat dissipation holes 20 by folding or unfolding the support frame 5, thereby allowing the storage device to D has different degrees of heat dissipation effect. When the support frame 5 is folded so that the storage device D is laid flat, the plurality of heat dissipation holes 20 of the storage device D will be covered to achieve a dust-proof effect. On the contrary, when the support frame 5 is unfolded and the storage device D is erected, a plurality of heat dissipation holes 20 are exposed, thereby increasing the contact area between the storage module 3 and the air.
更进一步来说，当支撑架5展开时，除了能将存储装置D立起，而露出多个散热孔20，还能够通过触发装置内的风扇41开始运转，通过风扇41将外部温度较低的冷空气吸入存储装置D内，使得壳体1与存储模块3的电路板上的主控芯片及存储颗粒能够与持续流动的冷空气进行热交换，并将热空气从存储装置D内部排出，进而提升散热效率同时降低存储装置D的温度。Furthermore, when the support frame 5 is unfolded, in addition to erecting the storage device D to expose the plurality of heat dissipation holes 20 , the fan 41 in the trigger device can also be started to operate, and the fan 41 can use the fan 41 to remove the external temperature of the device. The cold air is sucked into the storage device D, so that the main control chip and storage particles on the circuit board of the housing 1 and the storage module 3 can exchange heat with the continuously flowing cold air, and the hot air is discharged from the inside of the storage device D, and then Improve heat dissipation efficiency and reduce the temperature of storage device D.
以上所公开的内容仅为本发明的优选可行实施例，并非因此局限本发明的权利要求书的保护范围，所以凡是运用本发明说明书及附图内容所做的等效技术变化，均包含于本发明的权利要求书的保护范围内。The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the present invention. within the protection scope of the invention claims.

Claims (10)

  1. 一种具有散热功能的存储装置，其特征在于，所述具有散热功能的存储装置包括：A storage device with a heat dissipation function, characterized in that the storage device with a heat dissipation function includes:
    一壳体，具有一表面，所述表面设有一开口；A housing having a surface, the surface being provided with an opening;
    一散热网，设置在所述开口，所述散热网设有多个散热孔；A heat dissipation net is provided at the opening, and the heat dissipation net is provided with a plurality of heat dissipation holes;
    一存储模块，设置在所述壳体内部；a storage module, arranged inside the housing;
    一散热模块，设置在所述壳体内部，所述散热模块位于所述存储模块与所述散热网之间；以及A heat dissipation module is provided inside the housing, the heat dissipation module is located between the storage module and the heat dissipation network; and
    一支撑架，具有一固定部与一支撑部，所述支撑部的一侧边枢接于所述固定部，所述固定部固定在所述壳体的所述表面，使所述支撑部相对于所述固定部枢转；A support frame has a fixed part and a supporting part. One side of the supporting part is pivotally connected to the fixed part. The fixed part is fixed on the surface of the housing so that the supporting part faces each other. Pivot on the fixed part;
    其中，所述支撑架用于通过所述支撑部枢转来收折或展开，当所述支撑架收折时，所述支撑部用于遮蔽多个所述散热孔，当所述支撑架展开时，所述壳体用于通过所述支撑部的支撑而呈直立设置，并且使多个所述散热孔露出。Wherein, the support frame is used to fold or unfold by pivoting the support part. When the support frame is folded, the support part is used to cover a plurality of the heat dissipation holes. When the support frame is unfolded When the housing is in use, the housing is supported by the support portion to be placed upright, and a plurality of the heat dissipation holes are exposed.
  2. 根据权利要求1所述的具有散热功能的存储装置，其特征在于，当所述支撑部收折时，所述支撑部投影在所述表面的投影面积会完全重叠于所述散热网，使所述支撑部遮蔽多个所述散热孔。The storage device with heat dissipation function according to claim 1, characterized in that when the support part is folded, the projected area of the support part projected on the surface will completely overlap the heat dissipation network, so that the The support part covers a plurality of the heat dissipation holes.
  3. 根据权利要求1所述的具有散热功能的存储装置，其特征在于，所述存储模块投影在所述表面的投影面积至少部分重叠于所述散热网。The storage device with a heat dissipation function according to claim 1, wherein the projected area of the storage module on the surface at least partially overlaps the heat dissipation network.
  4. 根据权利要求1所述的具有散热功能的存储装置，其特征在于，所述散热模块投影在所述表面的投影面积完全重叠于所述散热网。The storage device with a heat dissipation function according to claim 1, wherein the projected area of the heat dissipation module on the surface completely overlaps the heat dissipation network.
  5. 根据权利要求1所述的具有散热功能的存储装置，其特征在于，所述的具有散热功能的存储装置还包括一第一盖体，且所述壳体还包括一第一通口，所述第一盖体可拆卸地设置在所述第一通口。The storage device with a heat dissipation function according to claim 1, wherein the storage device with a heat dissipation function further includes a first cover, and the housing further includes a first through hole, and the The first cover is detachably disposed at the first through opening.
  6. 根据权利要求5所述的具有散热功能的存储装置，其特征在于，所述的具有散热功能的存储装置还包括一第二盖体，所述第二盖体包括一承载座，所述存储模块设置于所述承载座，所述壳体还包括一第二通口，所述第二盖体可拆卸地设置在所述第二通口，所述承载座位于所述壳体内部。The storage device with heat dissipation function according to claim 5, characterized in that, the storage device with heat dissipation function further includes a second cover body, the second cover body includes a bearing seat, and the storage module Disposed on the carrying seat, the housing further includes a second through opening, the second cover is detachably provided on the second through opening, and the carrying seat is located inside the housing.
  7. 根据权利要求6所述的具有散热功能的存储装置，其特征在于，所述第一盖体还包括一环状侧壁，所述环状侧壁设有多个第一卡接孔与多个第二卡接孔，所述承载座设有多个卡止件与多个卡勾件，当所述第一盖体设置在所述第一通口且所述第二盖体设置在所述 第二通口时，多个所述卡止件分别卡设于多个所述第一卡接孔，且多个所述卡勾件分别卡设于多个所述第二卡接孔。The storage device with heat dissipation function according to claim 6, characterized in that the first cover further includes an annular side wall, the annular side wall is provided with a plurality of first locking holes and a plurality of The second locking hole is provided with a plurality of locking parts and a plurality of hook parts on the bearing seat. When the first cover is disposed on the first through-hole and the second cover is disposed on the During the second opening, a plurality of the locking pieces are respectively clamped in a plurality of the first clamping holes, and a plurality of the hook pieces are respectively clamped in a plurality of the second clamping holes.
  8. 根据权利要求6所述的具有散热功能的存储装置，其特征在于，所述承载座还包括多个卡固件，设置在所述承载座的两侧，其中当所述存储模块设置于所述承载座时，多个所述卡固件用于固定所述存储模块。The storage device with heat dissipation function according to claim 6, characterized in that the carrying base further includes a plurality of fasteners disposed on both sides of the carrying base, wherein when the storage module is disposed on the carrying base When seated, a plurality of card firmwares are used to fix the storage module.
  9. 根据权利要求6所述的具有散热功能的存储装置，其特征在于，所述第二盖体还设有一槽孔，所述存储模块具有一通信接口，所述通信接口设置于所述槽孔。The storage device with heat dissipation function according to claim 6, wherein the second cover is further provided with a slot, the storage module has a communication interface, and the communication interface is provided in the slot.
  10. 根据权利要求1所述的具有散热功能的存储装置，其特征在于，所述散热模块包括一开关组件、一连动机构件以及一风扇，所述开关组件设置在所述壳体内部，所述连动机构件用于连接所述开关组件及所述支撑架的所述支撑部，且所述开关组件电连接于所述风扇；其中，当所述支撑架展开时，所述连动机构件受到所述支撑部枢转的带动而触发所述开关组件，使所述开关组件启动所述风扇；其中，当所述支撑架收折时，所述连动机构件停止触发所述开关组件，并且使所述开关组件停止启动所述风扇。The storage device with heat dissipation function according to claim 1, wherein the heat dissipation module includes a switch component, a linkage component and a fan, the switch component is disposed inside the housing, and the The linkage component is used to connect the switch assembly and the support portion of the support frame, and the switch assembly is electrically connected to the fan; wherein, when the support frame is deployed, the linkage member The switch assembly is triggered by the pivoting of the support portion, so that the switch assembly starts the fan; wherein, when the support frame is folded, the linkage member stops triggering the switch assembly, And the switch assembly stops starting the fan.
PCT/CN2022/092669 2022-05-13 2022-05-13 Memory device having heat dissipation function WO2023216230A1 (en)

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CN105041693A (en) * 2015-07-10 2015-11-11 苏州佳世达电通有限公司 Electronic device with fan
CN105895138A (en) * 2016-05-18 2016-08-24 张家港润盛科技材料有限公司 Mobile hard disk storage aluminum shell
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