WO2023215995A1 - Antennes à résonateur diélectrique à pseudo-réseau - Google Patents

Antennes à résonateur diélectrique à pseudo-réseau Download PDF

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Publication number
WO2023215995A1
WO2023215995A1 PCT/CA2023/050654 CA2023050654W WO2023215995A1 WO 2023215995 A1 WO2023215995 A1 WO 2023215995A1 CA 2023050654 W CA2023050654 W CA 2023050654W WO 2023215995 A1 WO2023215995 A1 WO 2023215995A1
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WIPO (PCT)
Prior art keywords
antenna
metal
layers
layer
pgdra
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PCT/CA2023/050654
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English (en)
Inventor
Muhammad Hammad AKHTAR
David Mathew KLYMYSHYN
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University Of Saskatchewan
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Publication of WO2023215995A1 publication Critical patent/WO2023215995A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0485—Dielectric resonator antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Definitions

  • the embodiments described herein relate to antennas and, more particularly, to dielectric resonator antennas.
  • DRAs Dielectric resonator antennas
  • military to medical usages from low frequency to very high frequency bands, and as elements in array applications.
  • DRAs are three-dimensional structures with lateral dimensions that can be several times smaller than traditional planar patch antennas, and which may offer superior performance in terms of radiation efficiency and bandwidth.
  • an artificial dielectric antenna comprising: a multi-layer structure, the multi-layer structure formed via alternating metal and dielectric layers, parallel to an xy-plane, along a z-axis; and a plurality of metal structures provided within the multi-layer structure in a plurality of layers, wherein each adjacent layer of the plurality of layers along the z-axis is separated from the respective adjacent layer by the dielectric material.
  • the multi-layer structure is a multi-layer printed circuit board (PCB) formed via layered lamination.
  • PCB printed circuit board
  • the multi-layer structure is mounted to a printed circuit board or substrate.
  • each of the plurality of metal structures, in each respective layer of the plurality of layers, is separated from adjacent metal structures in the respective layer by the dielectric material.
  • each of the plurality of metal structures, in each respective layer of the plurality of layers forms a structure group in the xy-plane.
  • the structure group formed by each of the plurality of layers is aligned along the x- or y-axis.
  • the structure group formed by each of the plurality of layers is staggered along the x- or y-axis. In some cases, the staggering results in a shift in orientation of the radiated beam.
  • shapes of the plurality of metal structures in the x- or y- axis are formed in each metal layer during lamination of of the multi-layer structure.
  • the antenna includes a coupling structure operatively coupled to the multi-layer structure. In some cases, at least a portion of the coupling structure is embedded within the multi-layer structure.
  • the antenna includes a signal distribution structure operatively coupled to the coupling structure to provide an excitation signal thereto.
  • the signal distribution structure comprises a feedline operatively coupled to the coupling structure.
  • the feedline is a waveguide selected from the group consisting of millimetre-wave transmission lines, microstrips, striplines, coplanar waveguides, substrate integrated waveguides or microwave feedlines.
  • the signal distribution structure comprises a second feedline coupled to the coupling structure, the second feedline orthogonal to the first feedline, and wherein the antenna implements frequency-domain multiplexing. In some cases, at least a portion of the feedline is embedded within the multi-layer structure.
  • each metal structure has a substantially rectangular profile in the xz and yz planes.
  • each of the plurality of layers is less than 500 pm, and preferably less than 100 pm, in thickness along the z-axis.
  • each metal structure has a substantially similarthickness in the z-direction.
  • a first metal structure of the metal structures has a different thickness in the z-direction than a second metal structure of the metal structures.
  • the number of metal structure layers is at least 2, and optionally 4, and preferably fewer than 30.
  • each metal structure has an H-shaped topology in the xy plane.
  • each metal structure has a polygonal topology in the xy plane, and preferably wherein the polygonal cross-section is selected from the group consisting of rectangle, cross, triangle, and hexagon.
  • the plurality of metal structures has a honeycomb topology in the xy plane.
  • each metal structure is formed of metal traces having a consistent trace width.
  • the metal traces comprise one or more vertices.
  • the antenna has an operating frequency greater than 10 GHz, and preferably greater than 20 GHz.
  • the plurality of metal structures forms an antenna element.
  • the antenna element is one of a plurality of antenna elements forming an antenna array.
  • the structure is a metal strip.
  • a method of fabricating an antenna comprising: providing a printed circuit board substrate with a first planar surface parallel to an xy-plane; laminating a multi-layer structure, via layering of alternating dielectric and metal material layers adjacent to the printed circuit board substrate along a z-axis; while laminating the multi-layer structure, forming a plurality of metal structures within the metal layers of the multi-layer structure, wherein each adjacent layer of the plurality of metal layers along the z-axis is separated from the respective adjacent layer by the dielectric material.
  • FIG. 1 A is an isometric view of a pseudo-grid dielectric resonator antenna in accordance with at least some embodiments
  • FIG. 1 B is an isometric view of the antenna of FIG. 1A, in which metal traces are depicted in solid shading, and without base dielectric;
  • FIG. 1 C is a side view of the antenna of FIG. 1 A;
  • FIG. 1 D is a top view of the antenna of FIG. 1 A;
  • FIG. 2A is a top view of an example single element pseudo-grid dielectric resonator antenna in accordance with at least some embodiments
  • FIG. 2B is a side view of the antenna of FIG. 2A;
  • FIG. 2C is a plot illustrating the return loss of the antenna of FIG. 2A;
  • FIG. 2D is a plot illustrating the realized gain of the antenna of FIG. 2A;
  • FIGS. 2E to 2G are plots illustrating the radiation pattern samples of the antenna of FIG. 2A;
  • FIG. 3A is a top view of a staggered single element pseudo-grid dielectric resonator antenna in accordance with at least some embodiments
  • FIG. 3B is a side view of the antenna of FIG. 3A;
  • FIG. 3C is a plot illustrating the return loss of the antenna of FIG. 3A.
  • FIG. 3D is a plot illustrating the realized gain of the antenna of FIG. 3A;
  • FIGS. 3E to 3G are plots illustrating the radiation pattern samples of the antenna of FIG. 3A;
  • FIG. 4A is a top view of a multiple element pseudo-grid dielectric resonator antenna in accordance with at least some embodiments
  • FIG. 4B is a plot illustrating the return loss of the antenna of FIG. 4A;
  • FIG. 4C is a plot illustrating the realized gain of the antenna of FIG. 4A.
  • FIG. 5A is an exploded isometric view of an example grid dielectric resonator antenna.
  • FIG. 5B is an isometric view of the grid dielectric resonator antenna of FIG. 5A.
  • the wording “and/or” is intended to represent an inclusive-or. That is, “X and/or Y” is intended to mean X or Y or both, for example. As a further example, “X, Y, and/or Z” is intended to mean X or Y or Z or any combination thereof.
  • Some elements herein may be identified by a part number, which is composed of a base number followed by an alphabetical or subscript-numerical suffix (e.g. 112a, or 112-1). Multiple elements herein may be identified by part numbers that share a base number in common and that differ by their suffixes (e.g. 112-1 , 112-2, and 112-3). All elements with a common base number may be referred to collectively or generically using the base number without a suffix (e.g. 112).
  • GDRAs Metal grid dielectric resonator antennas
  • DRAs dielectric resonator antennas
  • GDRAs offer potential for interesting antenna applications, they typically require X-ray lithography for their manufacture which is a highly specialized method that may not be suitable for mass production and rapid prototyping.
  • FIG. 5A there is illustrated an exploded isometric view of an example GDRA 1100, illustrating in a distribution of embedded metal inclusions, in this case in a regular grid pattern.
  • FIG. 5B is an isometric view of the GDRA 1100, in which the embedded metal inclusions are shown in stippled outline.
  • vertical metal inclusions 1128 are fabricated using synchrontron-based (e.g., X-ray) lithographic fabrication techniques and provided in a grid within resonator body 1132.
  • embedded inclusions 1128 have an “H” (or I-beam) shape when viewed from above.
  • Metal inclusions 1128 can be formed of a conductive material (e.g., gold, silver, copper, nickel, etc.) and extend substantially perpendicularly from the surface of a substrate through resonator body 1132. Typically, metal inclusions 1128 have a height corresponding to between 2-100% of the thickness of resonator body 1132.
  • a conductive material e.g., gold, silver, copper, nickel, etc.
  • Embedding metal inclusions 1128 within the resonator body 1132 produces an artificial dielectric material.
  • the effective relative permittivity of the GDRA resonator body can be controlled and altered.
  • the controllable relative permittivity may range from that of a pure polymer or polymer-based material (e.g., about 2 or 3) up to 17 or more.
  • the artificial dielectric has desirable properties as noted, the tall, high aspect ratio metal inclusions 1128 can be difficult to fabricate in large volumes, due to the fine lateral geometries and very high vertical -to- lateral aspect ratios and the requirement for X-ray lithography.
  • PGDRAs can offer the performance benefits of GDRAs, but employ easier fabrication techniques than the specialized synchrotron techniques required for existing GDRAs.
  • PGDRAs may be realized within a printed circuit board (PCB) stack, in particular thin-layer laminated PCB stack-ups, rather than as external antennas.
  • PCB printed circuit board
  • ICs integrated circuits
  • LTCC low-temperature co-fired ceramics
  • metal layers or structures can be thought of as thin 2D cross sections of the inclusions of a GDRA. There may be at least 2 metal structure layers, though many cases will have 3 or 4 or more layers. Generally, there may be a practical achievable limit of around 30 metal structure layers, however this may be expanded in some cases.
  • the metal structures can have various lateral shapes, for instance “I- beam”, ”H-beam”, crosses, squares, rectangles, triangles, hexagons, honeycombs, or various other regular or irregular polygons arranged in rows and columns in a grid.
  • These structures form localized areas of increased electrical polarization inside the multilayered PCB, resulting in high effective permittivity and creating an “engineered” artificial dielectric material, provided that the grid is sufficiently dense and has sufficient inclusion structures per operating wavelength. Typically there should be at least 3 or more elements per quarter wavelength in the lateral dimensions to achieve the desired artificial dielectric behavior. These areas when excited by a feed such as a microstrip line, can behave as radiating elements and can be used to form antenna arrays.
  • the metal structures will be metal traces formed via PCB fabrication techniques in the metal layers of the stack-up, accordingly the metal traces may have a consistent trace width (e.g., in xy-plane, for example as shown in FIG. 1A). In some other cases, the metal traces may have variable widths. These metal structures are typically grouped together functionally, to form an antenna element. Several of these functional antenna element groupings can be arranged together with appropriate group spacing to realize an antenna array.
  • PGDRAs relative to GDRAs are their alternative manufacturing method, which nevertheless retains the ability to increase the permittivity of base dielectric materials while having similar resonant modes.
  • the number of layers and rows used to form a PDGRA depends upon the geometry and size of inclusions and the frequency of operation.
  • Another advantage of PGDRAs is that, due to lack of vertical surface currents in the inclusions, they are more efficient than GDRAs due to lower conductive losses.
  • PGDRAs can be either integrated, at the time of fabrication, into the PCB stack containing the feed structures such as microstrip (or via probes or coupling slots), and also signal distribution structures connected to and providing signals to these feeds (made from various mm-wave waveguide transmission lines).
  • PGDRAs can be fabricated separately and combined with feed assemblies and signal distribution structures on other substrates or PCBs later.
  • the first, integrated fabrication approach allows for the antenna/array to be manufactured along with the rest of the circuit, thus saving time and simplifying assembly cost. Nevertheless, both approaches give very wideband and high efficiency performance at frequencies greater than 10 GHz or 20 GHz, and well into the millimetre-wave range of, e.g., 100 GHz.
  • the increased effective permittivity of the artificial dielectric provides antenna element size reduction, and also fundamental mode frequency performance which is similar to a traditional homogeneous DRA, however with wider frequency bandwidth resulting from the multiple modes of the grid structure.
  • FIG. 1 A is an isometric view of a PGDRA 100.
  • PGDRA has a base dielectric body 102 and a two-dimensional arrangement of metal traces 104 in the X-Y plane.
  • dielectric body 102 is depicted as transparent, so that metal traces 104 can be viewed.
  • FIG. 1 B is an isometric view of metal traces 104 depicted in solid shading, without base dielectric 102.
  • FIG. 1 C is a side view of PGDRA 100 (Z-X plane), whereas FIG. 1 D is a top view of PGDRA 100 (X-Y plane).
  • Metal traces 104 may be metal strips, and are shown as having a rectangular cross-section in the x-y plane. Due to fabrication via layered lamination building up along a z-axis, the metal traces 104 also have a rectangular cross-section in the x-z and y-z planes, thus forming a three-dimensional cuboid. However, many different lateral (i.e., cross-sectional in the x-y plane) shapes for the individual metal traces 104 may be used. For example, polygonal cross-sections such as cross, square, triangle, hexagon and other polygons can be used. In some cases an H-shape may be used (similar to inclusions 1128), or honeycomb shapes. Each of the plurality of metal structures within each metal layer is separated from other metal structures in the same respective layer with dielectric material.
  • the metal traces 104 of PGDRA 100 do not extend contiguously substantially from the surface of a substrate through base dielectric 102. Instead, the structure is “sliced” horizontally into a plurality of thin layers.
  • PGDRA 100 is fabricated via successive layered lamination of dielectric and metal layers, thereby building up the antenna body in the z-direction relative to the xy-plane parallel to the substrate surface.
  • the structure is comprised of “sandwiched” layers alternating between metal and dielectric, such that each adjacent metal layer of the plurality of layers along the z-axis is separated from the respective adjacent metal layer by a layer of dielectric material. This “sandwiched” structure results in a 3-dimensional structure, with somewhat different modes and behaviours to the GDRA 1100, though still functioning in a similar sense.
  • the PGDRA 100 may be formed concurrently and integrally with a larger PCB. Accordingly, the coupling and signal distribution structures, such as a feedline, (not shown) can also be integrated into the layered structure. Feedlines can be any waveguide, such as, e.g., millimetre-wave transmission lines, microstrips, striplines, coplanar waveguides, substrate integrated waveguides or microwave feedlines. This integration is not possible with an external antenna such as a conventional GDRA. However, in some embodiments, the PGDRA 100 may be a discrete antenna, that is later mounted or coupled to a separate PCB.
  • FIGS. 2A and 2B there is illustrated an example single element PGDRA in accordance with at least some embodiments.
  • FIG. 2A is a top view of PGDRA 200 and
  • FIG. 2B is a side view of PGDRA 200.
  • PGDRA 200 is formed using alternating copper layers and dielectric layers in a PCB stack.
  • PGDRA 200 is a multi-layer structure with X-Y dimensions typically in the range of 1.0 mm - 10.0 mm, Z dimension in the range 0.3 mm - 3.0 mm, and with 6 copper layers - formed of metal traces 204 - and 6 dielectric layers (202) in the stack as shown in FIG. 2B.
  • Metal traces 204 have H-shaped cross- sectional patterns in the x-y plane (though other lateral shapes could be used), and are arranged in a grid structure of 7 rows and 5 columns in the x-y plane.
  • PGDRA 200 is fed by a microstrip line 210 on a separate printed circuit board 290 under the PGDRA, which forms a first planar surface parallel to an x-y- plane.
  • the feed structure could alternatively be incorporated inside the PGDRA as a seventh metal and dielectric layer in the PGDRA stack.
  • PGDRA 200 is tuned to resonate in the n257 and n258 frequency bands, which is demonstrated in the following descriptions referring to FIGS. 2C-2G.
  • the PGDRA 200 can be fed by a microstrip line 210 positioned in an orthogonal direction (X orientation on the 7 row side rather than the Y orientation on the 5 column side shown in FIG. 2A). In this case, the radiated signal electric field polarization will be excited in the orthogonal direction to the demonstrated case. If the arrangement of stuctures is asymmetric (different number of rows and columns as shown in FIG. 2A), then orthogonal microstrip lines will each produce a different resonating frequency (i.e. , a different passband) that can be used as a diplexer function implementing frequency-domain multiplexing, to transmit or receive signals simultaneously (i.e., in full duplex fashion) using the same PGDRA antenna element.
  • a different resonating frequency i.e. , a different passband
  • FIG. 2C is a plot illustrating the return loss (Sn) of PGDRA 200
  • FIG. 2D is a plot illustrating realized gain of PGDRA 200.
  • FIG. 2D illustrates a peak gain of 8.04 dBi, which is high compared to a typical single DRA element.
  • the gain is also generally uniform across both n257 and n258 frequency bands.
  • the operating -10 dB bandwidth is very wide, in this case approximately 5 GHz. Accordingly, the artificial dielectric properties of the PGDRA are providing an effective permittivity multiplication factor in the low permittivity base dielectric of more than 3 times.
  • FIGS. 2E to 2G are plots illustrating the radiation pattern samples of PGDRA 200 at 28 GHz, showing well-formed beams with high efficiencies (peak 91 %).
  • FIG. 2E illustrates the 3-D pattern.
  • the main lobe is tilted or skewed by about 11 ° due to asymmetric microstrip feeding. 11 ° is the maximum tilt across the frequency band.
  • FIGS. 3A and 3B there is illustrated an example staggered single element PGDRA in accordance with at least some embodiments.
  • FIG. 3A is a top view of PGDRA 300 and
  • FIG. 3B is a side view of PGDRA 300.
  • Staggered PGDRA 300 can be obtained by modifying PGDRA 200 by taking successive copper layers, each layer forming a structure group in the x-y plane, and staggering the structure groups in the opposite direction of the lobe tilt in one or both of the x- and y-planes. This staggering alleviates the tilt present in PGDRA 200 due to asymmetric microstrip feeding. In this sense, the staggering can also be considered as a static beam steering function.
  • PGDRA 300 is formed using alternating copper layers and dielectric layers in a PCB stack.
  • PGDRA 300 also has 6 copper layers - formed of metal traces 304 - and 6 dielectric layers (302) in the stack as shown in FIG. 3B.
  • Metal traces 304 have H-shaped cross-sectional patterns in the x-y plane (though other lateral shapes could be used), and are arranged in a grid structure of 7 rows and 5 columns in the x-y plane.
  • the dimensions of staggered PGDRA 300 are analogous to those of PGDRA 200, but with a slight increase in overall length to accommodate the increased area of the staggered copper layers.
  • PGDRA 300 is fed by a microstrip line 310 on a substrate 390 under the PGDRA.
  • the feed structure could alternatively be incorporated inside the PGDRA as a seventh metal and dielectric layer in the PGDRA stack.
  • FIG. 3C is a plot illustrating the return loss of PGDRA 300
  • FIG. 3D is a plot illustrating realized gain of PGDRA 300. It can be seen that, as compared to PGDRA 200, the resonant frequency has shifted down due to the increased size of PGDRA 300 and slight increase in effective permittivity of the artificial dielectric. The gain of PGDRA 300 has also increased slightly relative to PGDRA 200 as can be seen in FIG. 3D.
  • FIGS. 3E to 3G are plots illustrating the radiation pattern samples of PGDRA 300 at 25 GHz, showing good gains and efficiencies.
  • FIG. 3E illustrates the 3-D pattern.
  • the maximum tilt has reduced to 4° in the case of staggered PGDRA 300, as compared to 11 ° for PGRDA 200. More aggressive staggering may further reduce the tilt.
  • FIG. 4A there is illustrated an example multiple element PGDRA in accordance with at least some embodiments.
  • FIG. 4A is a top view of PGDRA 400.
  • An antenna array is an arrangement of antenna elements. Each antenna element receives signal power through a feeding structure, and radiates this power into space with a specific electromagnetic radiation pattern or “beam shape”, defined by an effective power gain in a certain spatial direction.
  • the overall radiation pattern for the antenna array is the spatial combination of the radiated signals from all the antenna elements.
  • the overall radiation pattern, or the gain may be approximated with an array factor and an antenna factor.
  • the array factor can define the spatial combination of the various antenna elements of the antenna array and the antenna factor corresponds to the gain, of each antenna element in the antenna array.
  • the overall radiation pattern may then be approximated by multiplying the array factor with the antenna factor, for example.
  • an antenna array can offer certain advantages.
  • the gain of an antenna array is typically greater than that of a single antenna element, for instance.
  • the gain of an antenna array can be varied without necessarily replacing the antenna element, but by changing the associated array factor.
  • the array factor can depend on various factors, such as spatial characteristics of the antenna elements (e.g., the number of antenna elements in the antenna array, a separation distance between each of the antenna elements, and a position of each antenna element in the antenna array) and characteristics of the excitation signal (e.g., an amplitude, a phase, etc.).
  • spatial characteristics of the antenna elements e.g., the number of antenna elements in the antenna array, a separation distance between each of the antenna elements, and a position of each antenna element in the antenna array
  • characteristics of the excitation signal e.g., an amplitude, a phase, etc.
  • the spatial characteristics of the antenna elements may not be easy or practical to change, especially after fabrication. It may, therefore, be more appropriate to change the array factor by varying the excitation signal. For example, a beam direction of a radiation pattern of the antenna array may be changed by changing the phase of the excitation signals provided to the antenna elements. No mechanical rotation of the antenna array is required.
  • the characteristics of the excitation signal may be controlled by certain weight coefficients in the array factor.
  • the weight coefficients are applied to control the electromagnetic energy distribution generated by each antenna element, which in turn controls the performance of the antenna array.
  • the weight coefficients can be determined based on known distributions, such as uniform, binomial, Chebyshev, etc.
  • various aspects of the antenna array may be adjusted.
  • the various aspects include the material, shape, number, size and physical arrangement of the antenna elements in the antenna array and a configuration of a feed structure that provides the excitation signal to the antenna elements.
  • the arrangement of the antenna elements is typically restricted by an operating wavelength of the excitation signal and potential mutual coupling between neighbouring antenna elements.
  • the configuration of the feed structure and/or feed signals for the antenna array can provide control of the amplitude and phase of the excitation signals, and can control the overall pattern of the array, enhance the gain, and control the direction of maximum gain.
  • An array structure can also be used to improve the performance of certain antenna types.
  • Single DRA elements operating in their dominant mode are relatively low gain antennas (e.g., gain of up to approximately 5 d Bi).
  • gain of up to approximately 5 d Bi By arranging the DRAs in an array structure, the corresponding gain of the DRA array can be increased.
  • PGDRA 400 is an example of a 1 -dimensional 1x4 array antenna, accordingly it has four antenna elements 450a to 450d arranged in a single row. Alternatively, a 2-dimensional NxM array could be arranged with multiple rows of fed elements. As with PGDRAs 200 and 300, PGDRA 400 is formed using alternating copper layers and dielectric layers in a PCB stack. PGDRA 400 also has 6 copper layers - formed of metal traces 404 - and 6 dielectric layers (not shown).
  • Metal traces 404 have rectangular-shaped cross-sectional patterns in the x-y plane (though other lateral shapes could be used), and are arranged in grid structures of 6 rows and 7 columns in the x-y plane, each grid structure forming an element 450a to 450d.
  • Each element 450a to 450d is fed by a microstrip line 410a to 41 Od, respectively, on a separate substrate 490 under the PGDRA.
  • the feed structure could alternatively be incorporated inside the PGDRA as a seventh metal and dielectric layer in the PGDRA stack.
  • the elements 450a to 450d are spaced in the range of 1 of the free- space wavelength.
  • the elements 450a to 450d are comprised of rectangular lateral shapes (though other lateral shapes could be used).
  • the stack layers and microstrip feed lines are similar to those of PGDRAs 200 and 300. In particular, the staggered approach of PGDRA 300 could also be employed.
  • FIG. 4B The return loss of the outside port (Sn) and inside port (S22) of PGDRA 400 are shown in FIG. 4B. This is the return loss during simultaneous excitation of all four ports feeding the elements 450a to 450d.
  • the return loss of ports 3 and 4 are similar as the array is symmetric.
  • the gain vs. frequency plot of the array is shown in FIG. 4C, showing increased gain compared to a typical single element gain (e.g., in Fig. 2D), due the arraying effect and spatial power combining.
  • the gain is quite high compared to typical linear 4 element arrays (12.4 dBi peak), and the response is very wideband, in this case greater than 5 GHz.

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  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

Antennes et procédés de fabrication d'antennes utilisant des cartes de circuit imprimé multicouches formées par une stratification en couches de couches de matériau diélectrique et de métal. Les couches métalliques contiennent une pluralité de structures métalliques présentant une variété de géométries latérales pour obtenir une performance d'antenne souhaitée. Les antennes peuvent être des antennes discrètes destinées à être couplées à des cartes de circuit imprimé préfabriquées ou peuvent être formées en tant que parties intégrales de plus grandes cartes de circuit imprimé.
PCT/CA2023/050654 2022-05-12 2023-05-12 Antennes à résonateur diélectrique à pseudo-réseau WO2023215995A1 (fr)

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US63/341,208 2022-05-12

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Citations (2)

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US7379030B1 (en) * 2004-11-12 2008-05-27 Lockheed Martin Corporation Artificial dielectric antenna elements
US11069965B2 (en) * 2017-07-18 2021-07-20 Southeast University Low-profile broadband circularly-polarized array antenna using stacked traveling wave antenna elements

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7379030B1 (en) * 2004-11-12 2008-05-27 Lockheed Martin Corporation Artificial dielectric antenna elements
US11069965B2 (en) * 2017-07-18 2021-07-20 Southeast University Low-profile broadband circularly-polarized array antenna using stacked traveling wave antenna elements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WAQAS, M. ET AL.: "Low-Profile Artificial Grid Dielectric Resonator Antenna Arrays for mm- Wave Applications", IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, vol. 67, no. 7, 7 July 2019 (2019-07-07), pages 4406 - 4417, XP011733820, DOI: 10.1109/TAP.2019.2907610 *

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