WO2023185437A1 - 透镜驱动装置及摄像模组 - Google Patents

透镜驱动装置及摄像模组 Download PDF

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Publication number
WO2023185437A1
WO2023185437A1 PCT/CN2023/081096 CN2023081096W WO2023185437A1 WO 2023185437 A1 WO2023185437 A1 WO 2023185437A1 CN 2023081096 W CN2023081096 W CN 2023081096W WO 2023185437 A1 WO2023185437 A1 WO 2023185437A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
ois
base
magnet
driving device
Prior art date
Application number
PCT/CN2023/081096
Other languages
English (en)
French (fr)
Inventor
阙嘉耀
赵波杰
张黎明
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202210323586.XA external-priority patent/CN116931217A/zh
Priority claimed from CN202210323591.0A external-priority patent/CN116939346A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2023185437A1 publication Critical patent/WO2023185437A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G03B13/34—Power focusing
    • G03B13/36—Autofocus systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing

Definitions

  • the present invention relates to the technical field of camera modules, and in particular, to a lens driving device and a camera module.
  • the structure of the camera module configured on it also needs to be miniaturized, but at the same time, the imaging quality of the camera module is required to be improved.
  • the imaging quality of the camera module not only the The size of the photosensitive device and the components adapted to it, and the driving force of the driving structure also need to be increased.
  • the motor is an indispensable component of the high-pixel camera module.
  • the motor can drive the lens to move in multiple directions to achieve the optical autofocus function (hereinafter referred to as the AF function, Auto Focus) during the shooting process. , automatic focus) and optical image stabilization function (hereinafter referred to as OIS function: Optical Image Stabilization, optical image stabilization).
  • the AF function refers to using a motor to move the bracket with the lens linearly in the direction of the optical axis to focus on the subject. , to produce a clear image at the image sensor (CMOS, CCD, etc.) located at the rear of the lens.
  • the OIS function is a function that, when the lens shakes due to vibration, uses a motor to adaptively move the bracket with the lens in a direction that compensates for the shake, thereby improving image clarity.
  • Increasing the driving force of the motor will inevitably increase the size of the overall camera module. Therefore, there is a contradiction between improving the image quality of the module and miniaturizing the overall structure.
  • the speed of the motor-driven lens movement becomes slower, and the longer it takes for the lens to reach the predetermined compensation position, it will directly affect the focus and anti-shake effects, resulting in unclear images.
  • the volume of the motor needs to be increased, resulting in a complicated motor mechanism, an increased number of parts, and a tendency to increase the thickness of the motor body.
  • a corresponding driving structure can also be set up on the photosensitive chip side, that is, a chip anti-shake structure, so that the photosensitive chip and the optical lens can move together, which can not only solve the problem of insufficient motor driving force but also effectively ensure the driving stroke, but how to make the lens on the motor side
  • a chip anti-shake structure so that the photosensitive chip and the optical lens can move together, which can not only solve the problem of insufficient motor driving force but also effectively ensure the driving stroke, but how to make the lens on the motor side
  • An object of the present invention is to provide a lens driving device and a camera module with a simple structure, which can ensure the miniaturization of the camera module while realizing the AF function of the lens assembly in the direction of the optical axis and the OIS function of the plane orthogonal to the optical axis.
  • Another object of the present invention is to provide a lens driving device and a camera module that facilitates maintaining the stability of the movable carrier in the camera module and restoring the centering effect through the magnetic attraction generated between the yoke piece and the magnet. .
  • Another object of the present invention is to provide a lens driving device and a camera module in which the yoke piece is injection molded in the base by inserting the yoke piece into the base, and the yoke piece is arranged by using two adjacent and connected sides to simplify the At the same time, the magnetic yoke piece manufacturing process can effectively reduce the resistance of the movable carrier to recover.
  • Another object of the present invention is to provide a lens driving device and camera module, which uses a guide groove design with no direction restrictions.
  • the support mechanism in the guide groove can realize movement in multiple degrees of freedom directions, simplifying the structure of the OIS carrier. Realize multi-degree-of-freedom movement of movable carriers.
  • Another object of the present invention is to provide a lens driving device and a camera module, which by arranging a yoke piece at a corresponding position of the supporting mechanism, can effectively limit the supporting mechanism to the magnetic attraction force between the yoke piece and the magnet.
  • the resistance caused by the yoke piece to the movement of the OIS carrier is reduced at the same time, so that the OIS carrier can quickly return to the initial position and reduce the requirements for the overall module driving force design.
  • Another object of the present invention is to provide a lens driving device and a camera module, which provide raised ball seats at the four corners of the base so that the ball seats are higher than the sides of the base by a certain height, leaving space for the installation of the OIS coil. , making full use of the space inside the motor.
  • Another object of the present invention is to provide a lens driving device and a camera module, which are designed to be installed on an AF carrier through a protruding support portion and an AF coil, and rationally utilize the effective space of the AF carrier and the OIS carrier to achieve the overall structure. miniaturization.
  • Another object of the present invention is to provide a lens driving device and a camera module that use an FPC soft board as a circuit board to facilitate moving the external welding points upward, and at the same time, corresponding positioning posts are provided on the sides of the ball seat. Effectively ensure the accuracy of FPC soft board welding.
  • Another object of the present invention is to provide a lens driving device and a camera module, which can effectively reserve a horizontal movement stroke for the OIS carrier while realizing line conduction by partially bending the side elastic piece, and also have the advantages of Helps the recovery of OIS carriers and achieves the dual functions of conduction and connection.
  • Another object of the present invention is to provide a lens driving device and camera module, which highly integrates electronic components and fully utilizes the space inside the motor through internal injection molded circuits and external external circuits to meet the needs of the motor.
  • the stroke movement simultaneously achieves the stability of the overall structure and improves the working efficiency of the motor.
  • a lens driving device includes:
  • a movable carrier the movable carrier is used to accommodate the lens assembly
  • a base, the base and the movable carrier are arranged correspondingly at intervals along the optical axis direction;
  • the driving mechanism includes at least one set of coils and at least one set of magnets, the at least one set of coils and the at least one set of magnets are arranged correspondingly, so that the driving mechanism is used to drive the movable carrier relative to the base Move along the direction orthogonal to the optical axis;
  • each of the yoke pieces includes a first part, a second part and a connecting part, the first part and the second part are respectively connected from the connecting part
  • the two ends integrally extend to both sides of the base, the connecting portion is located at the four corners of the base, and the first part and the second part respectively face the at least one group of magnets.
  • each yoke piece obliquely connects the first portion and the second portion, and the width of the connecting portion is smaller than the first portion and the second portion.
  • each of the yoke pieces further includes an extension portion extending outward from the connecting portions at the four corners of the base, and the outer end of each of the extension portions has an enlarged portion, and the extension portion The ground width is smaller than the first portion and the second portion.
  • it is further provided with a plurality of guide grooves and a plurality of support mechanisms.
  • the guide grooves are respectively opened concavely on the opposite surfaces of the movable carrier and the base, and each of the support mechanisms is accommodated in the In the guide groove, the yoke piece extends from the corresponding position of the guide groove to the corresponding position of the magnet, and the support mechanism rollably supports the displacement of the movable carrier along the direction orthogonal to the optical axis.
  • the guide groove is a planar square groove structure
  • the support mechanism is a ball, so that the support mechanism can move along the surface in the guide groove with multiple degrees of freedom.
  • the guide on the base The slot is higher than the side of the base to accommodate the at least one group of coils on the side of the base, so that the at least one group of coils is not higher than the guide slot of the base.
  • the yoke piece is built into the base through an injection molding process.
  • the driving mechanism includes at least one OIS coil and a circuit board, the circuit board is attached to the base, the movable carrier includes an OIS carrier, and the magnet is fixed to the side of the OIS carrier.
  • the OIS coil is attached to the side of the circuit board and is arranged corresponding to the magnet along the optical axis direction.
  • the OIS coil and the magnet form a first magnetic field loop to drive the OIS carrier relative to the The base moves along the direction orthogonal to the optical axis to perform shake correction.
  • the first sensing mechanism is installed on the back of the circuit board and is arranged corresponding to the magnet to detect the movement of the magnet and the OIS carrier. position, the base is provided with a first sensor mounting hole, the first sensor mounting hole is located in the middle of the adjacent yoke pieces, and the first sensing mechanism is accommodated in the first part of the base. into the sensor mounting hole.
  • the first sensor mounting hole includes an X-direction mounting hole and a Y-direction mounting hole
  • the first sensing mechanism is installed in the X-direction mounting hole and the Y-direction mounting hole respectively.
  • the first sensing mechanism includes an OIS structure IC controller and an OIS position sensor
  • the OIS position sensor is capable of sensing the OIS carrier Relative to the position of the base moving along the plane orthogonal to the optical axis
  • the OIS structure IC controller is able to control the movement direction and stroke of the OIS carrier.
  • the circuit board is an FPC soft board.
  • the circuit board includes a soft board bottom and a soft board side.
  • the soft board bottom is attached to the upper surface of the base, and the OIS coil is attached to
  • the sides of the bottom surface of the flexible board are integrally bent and extended from the bottom surface of the flexible board in the direction of the OIS carrier.
  • the side surfaces of the flexible board and the OIS carrier are arranged radially relative to each other. There are multiple welding points on the upper part of the side of the board.
  • the base is provided with a ball seat and a second guide groove
  • the ball seat integrally protrudes upward from the four corners of the base, and the second guide groove is opened in the ball seat
  • the ball seat protrudes from the bottom surface of the soft board of the circuit board
  • the OIS coil is not higher than the ball seat
  • the OIS carrier is provided with a first guide groove, the first guide groove and the second guide groove
  • the grooves are arranged correspondingly, and balls are accommodated in the first guide groove and the second guide groove.
  • the ball seat is provided with positioning posts.
  • the side of the soft plate is provided with positioning holes. The positioning posts are connected from the balls. One side of the seat extends toward the positioning hole, and the positioning post matches the positioning hole, so that the positioning post fixes the side of the soft board.
  • the movable carrier further includes an AF carrier, the AF carrier is movably arranged in the OIS carrier, the lens assembly is installed in the AF carrier, the driving mechanism further includes an AF coil, The AF coil is arranged on the outer periphery of the AF carrier. The AF coil and the magnet are arranged radially opposite each other. The AF coil and the magnet form a second magnetic field loop to drive the AF carrier to move along the optical axis. , perform autofocus.
  • the AF carrier is provided with a supporting part, a mounting part and a connecting part.
  • the connecting part integrally connects the supporting part and the mounting part.
  • the supporting part protrudes radially outward and Leaning on the magnet, the AF coil is arranged on the outer periphery of the mounting part, and the position of the mounting part is lower than the connecting part, so that the AF coil is held between the mounting part and the connecting part between.
  • the second sensing mechanism includes an AF structure IC controller, an AF position sensor and an AF sensing magnet
  • the AF sensing magnet is installed on the In the OIS carrier
  • the AF position sensor and the AF structure IC controller are installed in the AF carrier
  • the AF sensing magnet and the AF position sensor are arranged diametrically opposite
  • the AF position sensor The sensor can sense the position of the AF carrier moving along the optical axis direction relative to the AF sensing magnet
  • the AF structure IC controller can control the movement direction and stroke of the AF carrier.
  • the OIS carrier is provided with a first accommodating cavity, a second accommodating cavity and a supporting accommodating position.
  • the first accommodating cavity is opened at diagonal corners of the OIS carrier, and the AF
  • the sensing magnet is accommodated in the first accommodation cavity
  • the second accommodation cavity is adapted to accommodate the magnet
  • the supporting accommodation position accommodates the supporting portion of the AF carrier.
  • the movable carrier further includes an elastic support member, the elastic support member connects the AF carrier and the OIS carrier, and the elastic support member maintains the AF carrier in the position of the OIS carrier.
  • the elastic support member includes an upper elastic piece, a lower elastic piece and a plurality of side elastic pieces. The upper elastic piece is movably connected to the upper surfaces of the AF carrier and the OIS carrier, and the lower elastic piece is movably connected to the upper surfaces of the OIS carrier and the AF carrier.
  • the lower surface of the AF carrier and the OIS carrier, the side elastic piece is electrically connected to the circuit board and the upper elastic piece or the lower elastic piece to electrically conduct the embedded circuit in the AF carrier, so that the internal Embedded lines electrically connect the AF coil and the second sensing mechanism.
  • one end of the side elastic piece is fixed to the base, and the other end of the side elastic piece is fixed to the OIS carrier, so that the OIS carrier can be reset by moving along a plane orthogonal to the optical axis.
  • the side spring piece includes a line lead-out piece, a line lead-in piece and a connecting line.
  • the line lead-in piece is electrically connected to the circuit board.
  • the line lead-out piece is electrically connected to the upper spring piece or the lower spring piece.
  • the connecting line The circuit is electrically connected to the circuit lead-out piece and the circuit introduction piece.
  • the connecting line includes a straight line part and a bending part.
  • the bending part is a multi-section bending structure.
  • the straight line part is electrically connected to the line introduction piece and the line introduction piece.
  • the bent portion is electrically connected to the straight portion and the line lead-out piece.
  • the base is provided with a plurality of positioning protrusions, the positioning protrusions protrude outward from the side of the ball seat, and the positioning protrusions are attached to and fixed on the side of the ball seat.
  • the line lead-out piece is attached to the side of the OIS carrier
  • the elastic support member is provided with two sets of side elastic pieces, and each group of the side elastic pieces is located on both sides of the OIS carrier. Side corners, the side elastic piece of one side corner is electrically connected to the circuit board and the upper elastic piece, and the side elastic piece of the other side corner is electrically connected to the circuit board and the lower elastic piece, the AF carrier
  • the embedded circuits are injection molded into the AF carrier.
  • the number of the yoke pieces is 4, the number of the OIS coil, the magnets and the yoke pieces are consistent, and the magnets are arranged along the four sides of the OIS carrier .
  • a lens driving device includes:
  • a movable carrier includes an AF carrier and an OIS carrier, the AF carrier accommodates the lens assembly, and the OIS carrier accommodates the AF carrier;
  • a base, the base and the OIS carrier are arranged correspondingly at intervals along the optical axis direction;
  • the driving mechanism includes an AF coil, an OIS coil and a set of magnets.
  • the AF coil is arranged on the outer periphery of the AF carrier.
  • the AF coil and the magnet are arranged radially opposite to each other.
  • the OIS coil is arranged on Above the base, the OIS coil and the magnet are arranged axially relative to each other;
  • Guide grooves are concavely opened on the opposite surfaces of the OIS carrier and the base.
  • the guide grooves on the base are higher than the sides of the base and can be accommodated on the sides of the base.
  • each of the support mechanisms is accommodated in the guide groove, and the support mechanism moves along the surface in the guide groove with multiple degrees of freedom.
  • a camera module includes:
  • the lens driving device as described above;
  • a lens assembly with at least one lens mounted thereon;
  • a photosensitive component, the base is disposed between the photosensitive component and the lens component, and the photosensitive component is capable of photosensitive imaging.
  • the base is further provided with bottom corner bumps.
  • the bottom corner bumps are arranged at four corners of the lower surface of the base.
  • Sensing elements are provided in the bottom corner bumps to sense
  • the photosensitive chip is connected to an anti-shake motor, and the position information of the photosensitive chip is fed back to the control center.
  • Figure 1 is a structural perspective view of a lens driving device according to a preferred embodiment of the present invention.
  • FIG. 2 is an exploded view of the lens driving device according to the above-described embodiment of the present invention.
  • Figure 3 is a perspective view of the internal structure of the lens driving device according to the above embodiment of the present invention.
  • Figure 4 is a schematic cross-sectional view of the camera module according to the above embodiment of the present invention.
  • FIG. 5 is a side view of the internal structure of the lens driving device according to the above-described embodiment of the present invention.
  • Figure 6 is a schematic diagram of a motor circuit according to the above embodiment of the present invention.
  • Figure 7 is a schematic diagram of the embedded circuit in the AF carrier according to the above embodiment of the present invention.
  • Figures 8a and 8b are schematic structural views of the side elastic pieces according to the above-mentioned embodiment of the present invention.
  • Figure 9 is a schematic structural diagram of an AF carrier according to the above-mentioned embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of an OIS carrier according to the above-mentioned embodiment of the present invention.
  • Figure 11 is a bottom view of the OIS carrier according to the above-mentioned embodiment of the present invention.
  • Figure 12 is a bottom view of the lens driving device according to the above-described embodiment of the present invention.
  • Figure 13 is a structural perspective view of the base and circuit board according to the above embodiment of the present invention.
  • FIG. 14 is a schematic plan view of the yoke piece and the guide groove according to the above-described embodiment of the present invention.
  • Lens assembly In the picture: 1. Lens assembly; 2. Lens driving device; 10. Housing; 11. Light hole; 12. Avoidance hole; 20. Movable carrier; 21. AF carrier; 211. AF through hole; 212. Supporting part ; 213. Installation part; 214. Connecting part; 215. Embedded circuit; 22. OIS carrier; 221. OIS through hole; 222. First accommodation cavity; 223. Second accommodation cavity; 224. Support accommodation position ; 225. Bump; 226. Second guide groove; 30. Driving mechanism; 31. AF coil; 32. OIS coil; 33. Magnet; 34. Circuit board; 341. Bottom surface of soft board; 342.
  • the terms “set”, “installation”, “connected” and “connected” should be understood in a broad sense.
  • it can be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection or an indirect connection through an intermediate medium; it can be an internal connection between two components.
  • the specific meanings of the above terms in the present invention can be understood according to specific circumstances. meaning.
  • a lens driving device 2 is provided. As shown in FIGS. 1 to 4 , the lens driving device 2 includes a movable carrier 20 , a base 50 , a driving mechanism 30 , and a plurality of yoke pieces 60 , a plurality of guide grooves 41 and a plurality of supporting mechanisms 42.
  • the movable carrier 20 is used to accommodate the lens assembly 1.
  • the base 50 and the movable carrier 20 are arranged correspondingly at intervals along the optical axis direction.
  • the driving mechanism 30 It includes at least one set of coils and at least one set of magnets 33.
  • the at least one set of coils and the at least one set of magnets 33 are arranged correspondingly, so that the driving mechanism 30 is used to drive the movable carrier 20 relative to the base 50 along the light direction.
  • the yoke piece 60 moves in the direction orthogonal to the axis, and the yoke pieces 60 are installed on the base 50.
  • Each of the yoke pieces 60 includes a first part 61, a second part 62 and a connecting part 63.
  • the first part 61 and the The second part 62 integrally extends from both ends of the connecting part 63 to both sides of the base 50 .
  • the connecting part 63 is located at the four corners of the base 50 .
  • the first part 61 and the second part 62 respectively face the at least one group of magnets 33, the guide grooves 41 are respectively opened concavely on the opposite surfaces of the movable carrier 20 and the base 50, and each of the support mechanisms 42 is accommodated in the guide grooves 41.
  • the yoke piece 60 extends from the corresponding position of the guide groove 41 to the corresponding position of the magnet 33 , and the supporting mechanism 42 rollably supports the displacement of the movable carrier 20 along the direction orthogonal to the optical axis. Therefore, the magnetic attraction force generated between the yoke piece 60 and the magnet can easily maintain the stability of the movable carrier 20 in the camera module, restore the centering effect, and effectively prevent the movable carrier 20 from shaking with the camera module. Or it may fall off due to inversion.
  • the supporting mechanism 42 can support the relative movement between the base 50 and the movable carrier 20 in the guide groove 41 .
  • the orthogonal coordinate system (X, Y, Z) is used for explanation.
  • the Z direction is the optical axis direction, which is the front and back direction.
  • the X direction and the Y direction orthogonal to the Z axis are regarded as the optical axis orthogonal directions.
  • the X direction is the up and down direction (or left and right direction)
  • the Y direction is the left and right direction (or up and down direction)
  • the plane orthogonal to the optical axis is the plane formed by the X direction and the Y direction
  • the "radial direction” is orthogonal to the Z axis
  • the direction, "axial direction” refers to the corresponding setting between the two Z-axis orthogonal surfaces, including not only the direction parallel to the Z-axis, but also the direction close to parallel to the Z-axis, as shown in Figure 1.
  • the movable carrier 20 includes an AF carrier 21 and an OIS carrier 22.
  • the AF carrier 21 accommodates the lens assembly 1.
  • the OIS carrier 22 accommodates the AF carrier 21.
  • the driving mechanism 30 includes an AF coil 31, an OIS coil 32 and a set of magnets 33.
  • the AF coil 31 is arranged on the outer periphery of the AF carrier 21.
  • the AF coil 31 and the The magnet 33 is arranged relatively radially, the OIS coil 32 is arranged above the base 50, the OIS coil 32 and the magnet 33 are arranged oppositely axially, and the guide grooves 41 are respectively opened concavely in the OIS carrier.
  • the guide groove 41 on the base 50 is higher than the side of the base 50, so that the OIS coil 32 can be accommodated on the side of the base 50, and each of the supports
  • the mechanism 42 is accommodated in the guide groove 41 , and the support mechanism 42 moves along a plane in the guide groove 41 with multiple degrees of freedom.
  • the OIS coil 32 and the magnet 33 form a first magnetic field loop to drive the OIS carrier 22 to move relative to the base 50 along the direction orthogonal to the optical axis (ie, move in the X/Y direction) to compensate for
  • the AF coil 31 and the magnet 33 form a second magnetic field loop to drive the AF carrier 21 to move along the optical axis direction (i.e., the Z-axis direction, later expressed as the Z-axis direction). (direction of the optical axis) to achieve automatic focusing with clear focus.
  • the support mechanism 42 supports the OIS carrier 22 to move along the plane orthogonal to the optical axis with multiple degrees of freedom.
  • the driving mechanism 30 further includes a circuit board 34 attached to the base 50 , the magnet 33 is fixed to the side of the OIS carrier 22 , and the OIS coil 32 is attached to the side of the circuit board 34 and is arranged correspondingly with the magnet 33 along the optical axis direction, wherein the OIS coil 32 and the magnet 33 are arranged correspondingly, and the OIS coil 32 and the magnet 32 are arranged correspondingly.
  • 33 may be completely aligned along the optical axis direction, or the corresponding arrangement may not be completely aligned along the optical axis direction.
  • the circuit board 34 is attached to the upper surface of the base 50, and the OIS coil 32 needs to be conductive with the circuit board 34 on the base 50, because the circuit board 34 on the side of the base 50 is bonded
  • the space of the OIS coil 32 is limited, and the position of the magnet 33 is limited by the OIS carrier 22, resulting in different available spaces for the two components, causing the centers of the OIS coil 32 and the magnet 33 to be inconsistent.
  • the circuit board 34 is an FPC flexible board 34.
  • the circuit board 34 includes a flexible board bottom surface 341 and a flexible board side surface 342.
  • the flexible board bottom surface 341 is attached to the upper surface of the base 50.
  • the OIS coil 32 is attached to the side of the bottom surface 341 of the flexible board.
  • the side surface 342 of the flexible board integrally bends and extends from the bottom surface 341 of the flexible board toward the OIS carrier 22.
  • the side surface 342 of the flexible board Arranged radially opposite to the OIS carrier 22 , a plurality of welding points 346 are provided on the upper part of the side surface 342 of the soft plate, as shown in FIG. 13 .
  • the lens driving device 2 further includes a housing 10 that covers the movable carrier 20 and the base 50 .
  • the housing 10 is disposed outside the lens driving device 2 .
  • Other components inside the lens driving device 2 are accommodated in its internal space to protect the components inside the lens driving device 2 and ensure the stability of the overall structure.
  • the housing 10 is provided with a light hole 11 and an avoidance Hole 12.
  • the light hole 11 is used to accommodate the optical lens structure to allow external light to enter.
  • the motor welding point is located on the side of the housing and close to the side of the light hole 11.
  • the FPC soft board 34 The soft board side 342 is bent from the soft board bottom surface 341 and extends to the welding point 346 on the side of the motor.
  • the avoidance hole 12 is provided at the corresponding position of the housing 10 and the soft board side 342 to avoid the FPC.
  • the bending of the flexible plate 34 causes the bent FPC flexible plate 34 to pass through the escape hole 12 , so that the welding points 346 on the side 342 of the flexible plate are connected to the welding points on the side of the motor and connected with the outside.
  • the power supply device is connected to provide the current required for the motor to operate.
  • the magnet 33 is a dual-purpose magnet, that is, the OIS coil 32 and the AF coil 31 share the magnet 33
  • the AF carrier 21 is provided with a supporting part 212 , a mounting part 213 and a connecting part 214 , the connecting part 214 integrally connects the supporting part 212 and the mounting part 213, the supporting part 212 protrudes radially outward and bears on the magnet 33, and the AF coil 31 is disposed on the
  • the outer periphery of the mounting portion 213 is positioned lower than the connecting portion 214 , so that the AF coil 31 is held between the mounting portion 213 and the connecting portion 214 .
  • the AF carrier 21 has an AF through hole 211 for mounting a lens assembly to allow external light to enter through the optical lens, and the connecting portion 214 is located between the supporting portion 212 and the mounting portion 213 During the period, the supporting portion 212 and the connecting portion 214 protrude outward step by step, so that a receiving space is formed between the connecting portion 214 and the mounting portion 213, so that the AF coil 31 can be wound around the mounting portion. part 213. At the same time, a receiving space is formed between the supporting part 212 and the connecting part 214, so that the supporting part 212 can be supported above the magnet 33, and the AF coil 31 is located on the AF coil.
  • the magnet 33 and the AF coil 31 are arranged radially correspondingly. After being wound, the AF coil 31 is flush with the surface of the side of the AF carrier 21, making full use of the AF carrier 21 and the AF coil 31.
  • the relative installable space of the OIS carrier 22 not only ensures the stability of the AF carrier 21, but also reduces the overall mass of the AF carrier 21 to reduce the requirements for the driving force of the AF carrier 21, as shown in Figure 9.
  • the movable carrier 20 further includes an elastic support member 23 that connects the AF carrier 21 and the OIS carrier 22 , and the elastic support member 23 maintains the AF carrier 21 In the centered state of the OIS carrier 22, the elastic support member 23 includes an upper elastic piece 231, a lower elastic piece 232 and a plurality of side elastic pieces 233.
  • the upper elastic piece 231 can movably connect the AF carrier 21 and the OIS.
  • the upper surface of the carrier 22, the lower elastic piece 232 is movably connected to the lower surface of the AF carrier 21 and the OIS carrier 22, and the side elastic piece 233 is electrically connected to the circuit board 34 and the upper elastic piece 231 or the
  • the elastic piece 232 can electrically conduct the embedded circuit 215 in the AF carrier 21 .
  • the lens driving device 2 further includes a first sensing mechanism 71 and a second sensing mechanism 72 .
  • the first sensing mechanism 71 is installed on the back of the circuit board 34 and connected with the circuit board 34 .
  • the magnets 33 are arranged correspondingly to detect the positions of the magnet 33 and the OIS carrier 22.
  • the base 50 is provided with a sensor mounting hole 53.
  • the sensor mounting hole 53 is located on the adjacent yoke piece. 60
  • the first sensing mechanism 71 is accommodated in the sensor mounting hole 53 of the base 50 .
  • the second sensing mechanism 72 includes an AF structure IC controller 721, an AF position sensor 722 and an AF sensing magnet 723.
  • the AF sensing magnet 723 is installed in the OIS carrier 22.
  • the position sensor 722 and the AF structure IC controller 721 are installed in the AF carrier 21 .
  • the AF sensing magnet 723 and the AF position sensor 722 are arranged diametrically opposite to each other.
  • the AF position sensing The sensor 722 can sense the position of the AF carrier 21 moving along the optical axis direction relative to the AF sensing magnet 723 to achieve more accurate focusing.
  • the AF structure IC controller 721 is based on the AF position sensor.
  • the magnetic variation data fed back by 722 is used to control the current of the AF coil 31 to control the movement direction and stroke of the AF carrier 21 .
  • the AF position sensor 722 is located on one side of the AF carrier 21.
  • the AF sensing magnet 723 is provided inside the OIS carrier 22 corresponding to the radial direction.
  • the AF sensing magnet 723 and the AF position sensor 722 cooperate to sense the position of the AF carrier 21 .
  • the OIS carrier 22 is further provided with a counterweight block 724 , and the counterweight block 724 and the AF sensing magnet 723 are respectively located at opposite corners of the OIS carrier 22 , to ensure the balance of the OIS carrier 22 during movement.
  • the weight block 724 may be a magnet or other metal material, as long as the OIS carrier 22 is kept balanced, as shown in FIG. 11 .
  • the sensor mounting hole 53 includes an X-direction mounting hole 531 and a Y-direction mounting hole 532, and the first sensing mechanism 71 is installed in the X-direction mounting hole 531 and the Y-direction mounting hole 531 respectively.
  • the first sensing mechanism 71 includes an OIS structure IC controller 711 and an OIS position sensor 712.
  • the OIS position sensor The sensor 712 can sense the position of the OIS carrier 22 relative to the base 50 along the plane orthogonal to the optical axis.
  • the OIS structure IC controller 711 controls the magnetic change amount fed back by the OIS position sensor 712.
  • the current of the OIS coil 32 further controls the movement direction and stroke of the OIS carrier 22, as shown in Figure 12.
  • the AF position sensor 722 and the OIS position sensor 712 are Hall sensors.
  • the OIS coil 32 on the base 50 drives the optical lens 1 in the OIS carrier 22 to move in multiple degrees of freedom directions, thereby realizing movement in the X-axis direction and the Y-axis direction.
  • the OIS position sensor 712 and the OIS structure IC controller 711 cooperate with each other to achieve more accurate movement of the OIS carrier 22 in the X-axis direction, and the OIS position sensor 712 and the OIS structure IC in the Y-axis direction
  • the controllers 711 cooperate with each other to achieve more accurate movement of the OIS carrier 22 in the Y-axis direction.
  • the first sensing mechanism 71 passes through the X-direction mounting hole 531 and the Y-direction mounting hole 532 on the base 50 to be flush with the lower surface of the base 50 .
  • the mechanisms 71 are respectively located directly below the magnets 33 for accurately sensing the moving direction of the OIS carrier 22 .
  • the first sensing mechanisms 71 are electrically connected to the soft board bottom surface 341 of the FPC soft board 34 .
  • the OIS carrier 22 is provided with a first accommodating cavity 222 , a second accommodating cavity 223 and a supporting accommodating position 224 .
  • the first accommodating cavity 222 is opened on the opposite side of the OIS carrier 22 .
  • the AF sensing magnet 723 and the counterweight 724 are symmetrically accommodated in the first accommodation cavity 222, and the second accommodation cavity 223 is located on the side of the OIS carrier 22.
  • the second accommodation cavity 223 is capable of accommodating the magnets 33 , which are evenly distributed along the four sides of the OIS carrier 22 , and the abutment accommodating position 224 accommodates the abutment portion 212 of the AF carrier 21 .
  • the OIS carrier 22 has an OIS through hole 221 for accommodating the AF carrier 21.
  • the AF carrier 21 is connected to the OIS carrier 22 through the supporting portion 212 on its side.
  • the upper surface of the carrier 22 and the supporting part At the position corresponding to 212, the supporting accommodating position 224 is provided.
  • a certain space is reserved between the bottom surface of the AF carrier 21 and the bottom of the motor to facilitate the installation of the OIS coil 32. , effectively avoiding the OIS coil 32 on the base 50, and also providing space for the AF carrier 21 to move, so that the AF carrier 21 always moves above the magnet 33 and will not collide with it.
  • the OIS coil 32 is also beneficial to the installation of the lower elastic piece on the lower surface of the AF carrier. As described in Figure 10.
  • the OIS carrier 22 is further provided with bumps 225 that protrude upward from four corners of the upper surface of the OIS carrier 22 , and the bumps 225 protrude from the OIS carrier.
  • the upper surface of 22 has a certain height to reserve a certain movement space for the movement of the AF carrier 21 along the optical axis direction.
  • the AF coil 31 is located on the lower side of the AF carrier 21, which helps to keep the center of the AF coil 31 consistent with the center of the magnet 33, providing the maximum AF driving force.
  • the coil 31 is located on the middle side of the AF carrier 21, which will not only increase the volume of the AF carrier 21, but also cause the AF coil 31 to be located at the upper position of the magnet 33.
  • the AF coil 31 rises above the magnet 33 , enlarging the distance between the AF coil 31 and the magnet 33 , resulting in insufficient AF driving force and affecting the accuracy of adjustment.
  • the guide groove 41 is a planar square groove structure, and the support mechanism 42 is a ball, so that the support mechanism 42 can move along the plane in the guide groove 41 with multiple degrees of freedom.
  • the guide groove 41 on the base 50 is higher than the side of the base 50, so that the OIS coil 32 can be accommodated on the side of the base 50, so that the OIS coil 32 is not higher than the guide groove of the base 50. 41. That is to say, the guide groove 41 is not a track in a specific X-axis direction or Y-axis direction.
  • the planar square groove structure of the guide groove 41 can provide direction-free support for the OIS carrier 32 so that the balls 42 move along the
  • the X/Y direction movement is integrated in the same pair of guide grooves 41, which is beneficial to reducing the friction limit of the specific track, improving the displacement accuracy and anti-shake stroke through the multi-degree-of-freedom movable method, and making full use of the space inside the motor.
  • the guide groove 41 may also be a circular groove, wherein the diameter of the circular groove is larger than the diameter of the ball 42 .
  • the base 50 is provided with a ball seat 52 and a second guide groove 521.
  • the ball seat 52 integrally protrudes upward from the four corners of the base 50.
  • the second guide groove 521 is opened in In the ball seat 52, the ball seat 52 protrudes from the soft board bottom 341 of the circuit board 34, the OIS coil 32 is not higher than the ball seat 52, and the OIS carrier 22 is provided with a first guide groove. 226.
  • the first guide groove 226 and the second guide groove 521 are arranged correspondingly. Balls 42 are accommodated in the first guide groove 226 and the second guide groove 521.
  • the ball seat 52 is provided with a positioning Post 54
  • the side 42 of the soft plate is provided with a positioning hole 3421
  • the positioning post 54 extends from one side of the ball seat 52 to the positioning hole 3421
  • the positioning post 54 is adapted to the positioning hole 3421 It is configured so that the positioning post 54 fixes the side 42 of the soft board to ensure the accuracy of installation of the FPC soft board 34 and facilitate subsequent accurate welding of the motor. That is to say, the ball 42 on the bottom surface of the OIS carrier 22 can assist the movement of the OIS carrier 22. Under the driving action of the magnet 33 and the OIS coil 32, the OIS carrier 22 moves along the direction relative to the base 50. Move in the X/Y direction, thereby driving the lens assembly 1 to move to achieve shake correction.
  • the base 50 is provided with a base through hole 51 for light to pass through in the optical lens 1
  • the OIS coil 32 is located on four sides of the base 50 around the base through hole 51
  • the second guide groove 521 and the base 50 are integrally injection molded
  • the ball seat 52 protrudes from the side surface of the base 50 to a certain height, which can not only make the second guide groove 521 and the first
  • the guide grooves 226 cooperate with each other to form a receiving space for the ball 42, and also reserve an installation space for the OIS coil 32, so that the OIS coil 32 is accommodated in the spaces formed by the ball seats 52 on both sides, making full use of
  • the internal space of the motor ensures the accuracy of movement of the OIS carrier 22.
  • first guide groove 226 and the second guide groove 521 may not only have a square groove structure, but may also have a semi-rectangular groove structure inside.
  • the ball 42 can move along different degrees of freedom in the internal space formed by the first guide groove 226 and the second guide groove 521 .
  • the specific moving direction is limited by the OIS carrier 22 The direction of the force exerted.
  • the number of the yoke pieces 60 is four, the number of the OIS coil 32 , the magnet 33 and the yoke piece 60 are consistent, and the magnet 33 is along the OIS carrier 22 of four side settings.
  • each yoke piece 60 obliquely connects the first portion 61 and the second portion 62 , and the width of the connecting portion 63 is smaller than the first portion 61 and the second portion 62 .
  • Part 62 the yoke pieces 60 are arranged along the four corners of the base 50 , and each of the yoke pieces 60 corresponds to two adjacent magnets 33 , which not only effectively avoids the magnets 33 provided on the base 50
  • the first sensing mechanism 71 and the yoke piece 60 can also form a magnetic attraction force with the magnet 33 to restrict the ball 42 in the guide groove 41.
  • the width 60 is smaller than the width of the yoke piece 60 corresponding to the magnet 33. This ensures that the magnetic attraction between the yoke piece 60 and the magnet 33 stabilizes the operation of the ball 34 and at the same time reduces the size of the yoke piece.
  • the resistance caused by 60 to the movement of the OIS carrier 22 facilitates the OIS carrier 22 to quickly return to the initial position after work, reducing the requirements for the overall module driving force design, as shown in Figure 14.
  • each of the yoke pieces 60 further includes an extension portion 64 extending outward from the connecting portions 63 at the four corners of the base 50 , and the outer end of each of the extension portions 64 has an enlarged
  • the width of the extended portion 64 is smaller than that of the first portion 61 and the second portion 62 , which helps to simplify the injection molding process through which the yoke piece 60 is built into the base 50 .
  • the width of the yoke piece 60 is smaller than the width of the magnet 33.
  • the size and installation position of the yoke piece 60 need to be determined according to the overall design structure. Simulation software can be used to calculate the OIS carrier 22 and The force required to make the base 50 relatively stable determines the size of the yoke piece 60 .
  • the embedded circuit 215 is electrically connected to the AF coil 31 and the second sensing mechanism 72 .
  • One end of the side elastic piece 233 is fixed to the base 50 .
  • the other end is fixed to the OIS carrier 22 so that the OIS carrier 22 can be reset by moving along the plane orthogonal to the optical axis.
  • the side elastic piece 233 includes a line lead-out piece 2332, a line introduction piece 2331 and a connecting line 2333.
  • the line lead-in piece 2331 is electrically connected to the circuit board 34
  • the line lead-out piece 2332 is electrically connected to the upper elastic piece 231 or the lower elastic piece 232
  • the connecting line 2333 is electrically connected to the line lead-out piece 2332 and all
  • the connecting line 2333 includes a straight portion 2334 and a bending portion 2337.
  • the bending portion 2337 is a multi-section bending structure.
  • the straight portion 2334 is electrically connected to the line introduction piece 2331 and the bending portion.
  • the bent portion 2337 is electrically connected to the straight portion 2334 and the line lead-out piece 2332.
  • the side elastic piece 233 achieves electrical conduction. At the same time, it can also function as a retaining member.
  • the side elastic piece 23 can play a certain reset role, as shown in Figure 6 .
  • the linear part 2334 also includes a horizontal part 2335 and a vertical part 2336.
  • the horizontal part 2335 and the vertical part 2336 are connected to form a conductive line.
  • the bent part 2337 may have an S-shaped structure.
  • the OIS carrier 22 provides a margin of movement when moving, that is, reserving the travel of the OIS carrier 22 along the X/Y direction. While ensuring the normal movement of the movable carrier 20, its own elasticity can be used to provide all the necessary movement.
  • the restoring force of the OIS carrier 22 is shown in Figure 8a and Figure 8b.
  • the base 50 is provided with a plurality of positioning protrusions 55 that protrude outward from the side of the ball seat 52 and are attached to the ball seat. 52 and fixed to the positioning protrusion 55, the line lead-out piece 2332 Attached to the side of the OIS carrier 22, the elastic support 23 is provided with two sets of side elastic pieces 233. Each group of the side elastic pieces 233 is located at both sides of the OIS carrier 22, one of which is at the side corner. The side elastic piece 233 of the other side corner is electrically connected to the circuit board 34 and the upper elastic piece 231 , and the side elastic piece 233 of the other side corner is electrically connected to the circuit board 34 and the lower elastic piece 232 .
  • the AF carrier 21 The embedded circuit 215 is injection molded in the AF carrier 21, as shown in Figure 5.
  • the reserved welding points 346 on the side 342 of the FPC soft board 34 can be connected to the external power supply, and the bottom surface 341 of the FPC soft board 34 can conduct the connection between the OIS coil 32 and the first Sensing mechanism 71, each of the four corners of the soft board bottom surface 341 is provided with three conduction points 343, namely the OIS coil access point, the OIS coil access point and the side elastic sheet conduction point.
  • the FPC soft board 34 can conduct the OIS coil 32 and the side elastic piece 233, and can conduct the upper elastic piece 231 and the lower elastic piece 232 through the side elastic piece 233, and then through the AF carrier 21.
  • the embedded circuit 215 conducts the AF coil 31 and the second sensing mechanism 72 .
  • the embedded circuit 215 in the AF carrier 21 includes an IC interface, a position sensor interface, an upper elastic piece interface, a lower elastic piece interface and the interfaces of the two AF coils.
  • the AF structure IC controller 721 can control the current in the AF coil 31 according to the information fed back by the AF position sensor 722 to achieve real-time position adjustment of the AF carrier 21 to ensure that the AF carrier 21 drives the optical lens accurately. Focusing, in which the embedded circuit 215 is injection molded on one side of the AF carrier 21.
  • the circuit design inside the motor can be simplified, further realizing the overall Miniaturization of structure.
  • only one pair of the side elastic pieces 233 may have a conductive function, and the other pair may be used to enhance reset.
  • the AF carrier 21 is maintained in the center by the elastic support 23 while realizing movement in the Z-axis direction.
  • the OIS carrier 22 cooperates with the ball 42 to realize movement in the X/Y direction.
  • a camera module includes:
  • the lens driving device 2 as described above;
  • Lens assembly equipped with at least one lens
  • a photosensitive component, the base is disposed between the photosensitive component and the lens component, and the photosensitive component is capable of photosensitive imaging.
  • the camera module may also be a chip anti-shake camera module.
  • the base 50 is further provided with bottom corner bumps 56.
  • the bottom corner bumps 56 are disposed at the four corners of the lower surface of the base 50 and are in contact with the bottom corner bumps 56.
  • the base 50 is formed in one piece, and the bottom corner bump 56 is provided with a sensing magnet mounting hole.
  • Corresponding sensing elements are embedded in the sensing magnet mounting hole for sensing the position of the photosensitive chip and placing the photosensitive chip. The position information is fed back to the control center so that the motor and photosensitive chip can cooperate with each other to quickly adjust the position of the two components to improve the imaging efficiency of the camera module.
  • the photosensitive chip and the optical lens can cooperate with each other to achieve anti-shake of a larger stroke, solving the problem of increased driving force requirements due to the increase in the size of the photosensitive chip and the increase in the quality of the optical lens, while ensuring the accuracy of the movement of the motor-driven optical lens. At the same time, it also solves the problem of the movement of the photosensitive chip and the optical lens in cooperation with each other.

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Abstract

本发明公开了一种透镜驱动装置及其摄像模组，其包括活动载体、底座、驱动机构以及多个磁轭片，活动载体用于容置镜头组件，底座和活动载体沿光轴方向间隔地对应设置，驱动机构包括至少一组线圈和至少一组磁石，至少一组线圈和至少一组磁石对应设置，使得驱动机构用于驱动活动载体相对底座沿光轴的正交面方向移动，磁轭片安装于底座，各个磁轭片包括第一部分、第二部分以及连接部分，第一部分和第二部分分别从连接部分的两端一体地向底座的两边延伸，连接部分位于底座的四角处，第一部分和第二部分分别面向至少一组磁石，从而使得本发明透镜驱动装置在结构更加简单，得以保证摄像模组小型化的同时，还能够实现镜头组件在光轴方向的AF功能和光轴正交面的OIS功能。

Description

透镜驱动装置及摄像模组 技术领域
本发明涉及摄像模组技术领域，尤其涉及透镜驱动装置及摄像模组。
背景技术
随着移动终端轻薄化的发展趋势，其上配置的摄像模组的结构也需要实现小型化，但同时又要求摄像模组的成像质量提升，而摄像模组成像质量的提升，不仅需要增大其感光器件和与其适配的元件的尺寸，驱动结构的驱动力也需要增大。
马达是构成高像素摄像模组不可或缺的元件，在摄像模组工作的过程中，马达可驱动镜头进行多方位移动，以实现拍摄过程中的光学自动对焦功能(以下简称AF功能，Auto Focus，自动对焦)和光学防抖功能(以下简称OIS功能：Optical Image Stabilization，光学图像稳定)，AF功能是指通过马达使具有透镜的托架在光轴方向上线性运动，对被摄体进行聚焦，以在位于透镜后部的图像传感器(CMOS、CCD等)处产生清晰图像的功能。OIS功能是指由于颤动使透镜抖动时，通过马达使具有透镜的托架沿补偿该抖动方向自适应地运动，而提高图像清晰度的功能。而增大马达的驱动力势必会使得整体摄像模组的体积增加，故提升模组的成像质量和整体结构的小型化之间存在矛盾。
当前电子设备(如手机)对摄像模组的体积有较大的限制，马达的占用体积随着镜头的增大而相应的增加。换句话说，在镜头向更大体积、更大重量发展的趋势下，马达所能提供的驱动力却难以相应地增加。如为了提升摄像模组的成像质量，将光学镜头中的塑料镜片替换为玻璃镜片，使得光学镜头的质量增加，同时为了驱动光学镜头移动，马达的驱动力也需要增加，而在驱动力受限的前提下，镜头越重，马达能驱动镜头移动的行程越短，影响对焦和防抖能力，但是为了实现更好效果的光线对焦功能和光学防抖功能，通常需要更大行程的移动。
另一方面，由于镜头重量的增加，马达驱动镜头移动的速度变慢，镜头到达预定的补偿位置时间越长，将会直接影响对焦和防抖效果，导致图像不清晰。若要增加马达的驱动力，则需要增加马达的体积，造成马达机构复杂，零件数量增加，并且马达主体的厚度趋于增加。虽然也可在感光芯片端设置相应的驱动结构，即芯片防抖结构，使得感光芯片和光学镜头配合移动，在解决马达驱动力不足的同时还可以有效的保证驱动行程，但是如何使得马达端的镜头移动和感光芯片端的移动进行配合，目前也没有可行的技术方案。
发明内容
本发明的一个目的在于提供一种透镜驱动装置及摄像模组，其结构简单，得以保证摄像模组小型化的同时，实现镜头组件在光轴方向的AF功能和光轴正交面的OIS功能。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过磁轭片和磁石之间产生的磁吸力，便于保持活动载体在摄像模组中的稳定性，回复置中的效果。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过磁轭片在底座中内嵌注塑成型的方式，利用两个侧边相邻并连接来设置磁轭片，在简化磁轭片制造工艺的同时，有效减小活动载体回复的阻力。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过使用无方向限制的导向槽设计，在导向槽中支承机构可实现多自由度方向的移动，简化OIS载体的结构，实现活动载体的多自由度移动。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过在支承机构相应位置设置磁轭片，得以通过磁轭片和磁石之间的磁吸力，有效地将支承机构限制在导向槽中，同时减小磁轭片对OIS载体移动造成的阻力，使得OIS载体快速回复至初始位置，降低对整体模组驱动力设计的要求。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过在底座的四角设置凸起的滚珠座，使得滚珠座高出底座的侧边一定高度，预留出OIS线圈的安装空间，充分利用马达内部的空间。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过凸出的承靠部和AF线圈在AF载体安装设计，合理利用AF载体和OIS载体的有效空间，实现整体结构的小型化。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过使用FPC软板作为线路板，便于将对外焊接点上移，同时，在滚珠座的侧边设置相应的定位柱，有效保证FPC软板焊接的精度。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过侧面弹片部分弯折的方式，在实现线路导通的同时，有效地为OIS载体预留水平方向移动的行程，也有助于OIS载体的回复，实现导通和连接的双重作用。
本发明的另一个目的在于提供一种透镜驱动装置及摄像模组，其通过内部注塑的线路和外部的外置线路相配合，高度集成电子元器件和充分利用马达内部的空间，在满足马达大行程运动的同时实现整体结构的稳定性，提升马达的工作效率。
为达到以上目的，本发明采用的技术方案为：
根据本发明的一个方面，一种透镜驱动装置包括：
活动载体，所述活动载体用于容置镜头组件；
底座，所述底座和所述活动载体沿光轴方向间隔地对应设置；
驱动机构，所述驱动机构包括至少一组线圈和至少一组磁石，所述至少一组线圈和所述至少一组磁石对应设置，使得所述驱动机构用于驱动所述活动载体相对所述底座沿光轴的正交面方向移动；
多个磁轭片，所述磁轭片安装于所述底座，各个所述磁轭片包括第一部分、第二部分以及连接部分，所述第一部分和所述第二部分分别从所述连接部分的两端一体地向所述底座的两边延伸，所述连接部分位于所述底座的四角处，所述第一部分和所述第二部分分别面向所述至少一组磁石。
在一个实施方式中，各个所述磁轭片的连接部分倾斜连接所述第一部分和所述第二部分，所述连接部分的宽度小于所述第一部分和所述第二部分。
在一个实施方式中，各个所述磁轭片进一步包括延伸部分，所述延伸部分从所述底座四角处的连接部分向外延伸，各个所述延伸部分的外端具有扩大部，所述延伸部分地宽度小于所述第一部分和所述第二部分。
在一个实施方式中，其进一步设有多个导向槽和多个支承机构，所述导向槽分别内凹地开设于所述活动载体和所述底座的相对面，各个所述支承机构容纳于所述导向槽中，所述磁轭片从所述导向槽的对应位置延伸向所述磁石的对应位置，所述支承机构可滚动地支撑所述活动载体沿光轴的正交面方向位移。
在一个实施方式中，所述导向槽为平面方形槽结构，所述支承机构为滚珠，得以使所述支承机构多自由度地沿着所述导向槽内的表面移动，所述底座上的导向槽高出于所述底座的侧边，得以在所述底座的侧边容纳所述至少一组线圈，使得所述至少一组线圈不高于所述底座的导向槽。
在一个实施方式中，所述磁轭片通过注塑成型工艺内置于所述底座中。
在一个实施方式中，所述驱动机构包括至少一OIS线圈和线路板，所述线路板贴附于所述底座上，所述活动载体包括OIS载体，所述磁石固定于所述OIS载体的侧边，所述OIS线圈贴附于所述线路板的侧边并与所述磁石沿光轴方向对应设置，所述OIS线圈和所述磁石形成第一磁场回路，得以驱动所述OIS载体相对所述底座沿光轴的正交面方向移动，进行抖动修正。
在一个实施方式中，其进一步包括第一感测机构，所述第一感测机构安装于所述线路板的背面，并与所述磁石对应设置，得以检测所述磁石和所述OIS载体的位置，所述底座设有第一感测器安装孔，所述第一感测器安装孔位于相邻的所述磁轭片中间，所述第一感测机构容纳于所述底座的第一感测器安装孔中。
在一个实施方式中，所述第一感测器安装孔包括X方向安装孔以及Y方向安装孔，所述第一感测机构分别安装于所述X方向安装孔和所述Y方向安装孔中，得以检测所述OIS载体的X方向位移和Y方向位移，所述第一感测机构包括OIS结构IC控制器和OIS位置感测器，所述OIS位置感测器得以感测所述OIS载体相对于所述底座沿光轴正交面移动的位置，所述OIS结构IC控制器得以控制所述OIS载体的运动方向和行程。
在一个实施方式中，所述线路板为FPC软板，所述线路板包括软板底面和软板侧面，所述软板底面贴附于所述底座的上表面，所述OIS线圈贴附于所述软板底面的侧边，所述软板侧面一体地从所述软板底面向所述OIS载体方向弯折延伸，所述软板侧面和所述OIS载体相对径向设置，所述软板侧面的上部设有多个焊接点。
在一个实施方式中，所述底座设有滚珠座和第二导向槽，所述滚珠座从所述底座的四角位置一体地向上凸出，所述第二导向槽开设于所述滚珠座中，所述滚珠座突出于所述线路板的软板底面，所述OIS线圈不高于所述滚珠座，所述OIS载体设有第一导向槽，所述第一导向槽和所述第二导向槽对应设置，在所述第一导向槽和所述第二导向槽中容纳有滚珠，所述滚珠座设有定位柱，所述软板侧面设有定位孔，所述定位柱从所述滚珠座的一侧向所述定位孔延伸，所述定位柱和所述定位孔相适配，使得所述定位柱固定所述软板侧面。
在一个实施方式中，所述活动载体进一步包括AF载体，所述AF载体可活动地安置于所述OIS载体中，镜头组件安装于所述AF载体中，所述驱动机构进一步包括AF线圈，所述AF线圈设置于所述AF载体的外周，所述AF线圈和所述磁石相对径向设置，所述AF线圈和所述磁石形成第二磁场回路，得以驱动所述AF载体沿光轴方向移动，进行自动对焦。
在一个实施方式中，所述AF载体设有承靠部、安装部以及相连部，所述相连部一体连接所述承靠部和所述安装部，所述承靠部径向向外突出并承靠于所述磁石上，所述AF线圈设置于所述安装部的外周，所述安装部的位置低于所述相连部，使得所述AF线圈保持于所述安装部和所述相连部之间。
在一个实施方式中，其进一步包括第二感测机构，所述第二感测机构包括AF结构IC控制器、AF位置感测器以及AF感测磁铁，所述AF感测磁铁安装于所述OIS载体中，所述AF位置感测器和所述AF结构IC控制器安装于所述AF载体中，所述AF感测磁铁和所述AF位置感测器径向相对设置，所述AF位置感测器得以感测所述AF载体相对于所述AF感测磁铁沿光轴方向移动的位置，所述AF结构IC控制器得以控制所述AF载体的运动方向和行程。
在一个实施方式中，所述OIS载体设有第一容置腔、第二容置腔以及承靠容纳位，所述第一容置腔开设于所述OIS载体的对角处，所述AF感测磁铁容纳于所述第一容置腔中，所述第二容置腔得以容纳所述磁石，所述承靠容纳位容纳所述AF载体的承靠部。
在一个实施方式中，所述活动载体进一步包括弹性支撑件，所述弹性支撑件连接所述AF载体和所述OIS载体，所述弹性支撑件得以保持所述AF载体在所述OIS载体的置中状态，所述弹性支撑件包括上弹片、下弹片以及多个侧面弹片，所述上弹片可活动地连接所述AF载体和所述OIS载体的上表面，所述下弹片可活动地连接所述AF载体和所述OIS载体的下表面，所述侧面弹片电连接所述线路板和所述上弹片或所述下弹片，得以电导通所述AF载体中的内嵌线路，使得所述内嵌线路电连接所述AF线圈和所述第二感测机构。
在一个实施方式中，所述侧面弹片的一端固接于所述底座，所述侧面弹片的另一端固接于所述OIS载体，得以使所述OIS载体沿光轴正交面移动的复位，所述侧面弹片包括线路导出片、线路导入片以及连通线路，所述线路导入片电连接于所述线路板，所述线路导出片电连接于所述上弹片或所述下弹片，所述连通线路得以电连接所述线路导出片和所述线路导入片，所述连通线路包括直线部以及弯折部，所述弯折部为多段弯曲结构，所述直线部电连接所述线路导入片和所述弯折部，所述弯折部电连接所述直线部和所述线路导出片。
在一个实施方式中，所述底座设有多个定位凸起，所述定位凸起从所述滚珠座的侧面向外突出，所述定位凸起贴附于所述滚珠座的侧面并固接于所述定位凸起，所述线路导出片贴附于所述OIS载体的侧面，所述弹性支撑件设有两组所述侧面弹片，各组所述侧面弹片分别位于所述OIS载体的两侧角，其中一个侧角的所述侧面弹片电连接所述线路板和所述上弹片，其中另一个侧角的所述侧面弹片电连接所述线路板和所述下弹片，所述AF载体的内嵌线路注塑于所述AF载体中。
在一个实施方式中，所述磁轭片的数量为4个，所述OIS线圈、所述磁石和所述磁轭片的数量相一致，所述磁石沿所述OIS载体的四个侧边设置。
根据本发明的另一个方面，一种透镜驱动装置包括：
活动载体，所述活动载体包括AF载体和OIS载体，所述AF载体容置镜头组件，所述OIS载体容置所述AF载体；
底座，所述底座和所述OIS载体沿光轴方向间隔地对应设置；
驱动机构，所述驱动机构包括AF线圈、OIS线圈以及一组磁石，所述AF线圈设置于所述AF载体的外周，所述AF线圈和所述磁石相对径向设置，所述OIS线圈设置于所述底座上方，所述OIS线圈和所述磁石相对轴向设置；
导向槽，所述导向槽分别内凹地开设于所述OIS载体和所述底座的相对面，所述底座上的导向槽高出于所述底座的侧边，得以在所述底座的侧边容纳所述OIS线圈；
支承机构，各个所述支承机构容纳于所述导向槽中，所述支承机构多自由度地沿着所述导向槽内的表面移动。
根据本发明的第二个方面，一种摄像模组包括：
如上所述的透镜驱动装置；
镜头组件，安装有至少一透镜；
感光组件，所述底座设置于所述感光组件和镜头组件之间，所述感光组件得以感光成像。
在一个实施方式中，所述底座进一步设有底角凸块，所述底角凸块设置于所述底座下表面的四角位置，所述底角凸块内设有感测元件，得以感测所述感光芯片的位置，并将所述感光芯片的位置信息反馈到控制中心，所述感光芯片连接防抖马达。
附图说明
图1是根据本发明的优选实施例的透镜驱动装置的结构立体图；
图2是根据本发明的上述实施例的透镜驱动装置的***图；
图3是根据本发明的上述实施例的透镜驱动装置的内部结构立体图；
图4是根据本发明的上述实施例的摄像模组的剖面示意图；
图5是根据本发明的上述实施例的透镜驱动装置的内部结构侧视图；
图6是根据本发明的上述实施例的马达线路的示意图；
图7是根据本发明的上述实施例的AF载体中的内嵌线路的示意图；
图8a和图8b是根据本发明的上述实施例的侧面弹片的结构示意图；
图9是根据本发明的上述实施例的AF载体的结构示意图；
图10是根据本发明的上述实施例的OIS载体的结构示意图；
图11是根据本发明的上述实施例的OIS载体的仰视图；
图12是根据本发明的上述实施例的透镜驱动装置的仰视图；
图13是根据本发明的上述实施例的底座和线路板的结构立体图；
图14是根据本发明的上述实施例的磁轭片和导向槽的平面示意图。
图中：1、镜头组件；2、透镜驱动装置；10、外壳；11、通光孔；12、避让孔；20、活动载体；21、AF载体；211、AF通孔；212、承靠部；213、安装部；214、相连部；215、内嵌线路；22、OIS载体；221、OIS通孔；222、第一容置腔；223、第二容置腔；224、承靠容纳位；225、凸块；226、第二导向槽；30、驱动机构；31、AF线圈；32、OIS线圈；33、磁石；34、线路板；341、软板底面；342、软板侧面；343、导通点；3421、定位孔；346、焊接点；23、弹性支撑件；231、上弹片；232、下弹片；233、侧面弹片；2331、线路导入片；2332、线路导出片；2333、连通线路；2334、直线部；2335、水平部；2336、竖直部；2337、弯折部；50、底座；51、底座通孔；52、滚珠座；521、第二导向槽；53、感测器安装孔；531、X方向安装孔；532、Y方向安装孔；54、定位柱；55、定位凸起；56、底面凸块；60、磁轭片；61、第一部分；62、第二部分；63、连接部分；64、延伸部分；65、扩大部；71、第一感测机构；711、OIS结构IC控制器；712、OIS位置感测器；72、第二感测机构；721、AF结构IC控制器；722、AF位置感测器；723、AF感测磁铁；724、配重块。
具体实施方式
下面，结合具体实施方式，对本发明做进一步描述，需要说明的是，在不相冲突的前提下，以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
在本发明的描述中，需要说明的是，对于方位词，如有术语“中心”、“横向”、“纵向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示方位和位置关系为基于附图所示的方位或位置关系，仅是为了便于叙述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定方位构造和操作，不能理解为限制本发明的具体保护范围。
需要说明的是，本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
本申请的说明书和权利要求书中的术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、***、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
在本发明的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以是接触连接或通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体 含义。
根据本申请的第一个方面，提供一种透镜驱动装置2，如图1至图4所示，所述透镜驱动装置2包括活动载体20、底座50、驱动机构30、多个磁轭片60、多个导向槽41和多个支承机构42，所述活动载体20用于容置镜头组件1，所述底座50和所述活动载体20沿光轴方向间隔地对应设置，所述驱动机构30包括至少一组线圈和至少一组磁石33，所述至少一组线圈和所述至少一组磁石33对应设置，使得所述驱动机构30用于驱动所述活动载体20相对所述底座50沿光轴的正交面方向移动，所述磁轭片60安装于所述底座50，各个所述磁轭片60包括第一部分61、第二部分62以及连接部分63，所述第一部分61和所述第二部分62分别从所述连接部分63的两端一体地向所述底座50的两边延伸，所述连接部分63位于所述底座50的四角处，所述第一部分61和所述第二部分62分别面向所述至少一组磁石33，所述导向槽41分别内凹地开设于所述活动载体20和所述底座50的相对面，各个所述支承机构42容纳于所述导向槽41中，所述磁轭片60从所述导向槽41的对应位置延伸向所述磁石33的对应位置，所述支承机构42可滚动地支撑所述活动载体20沿光轴的正交面方向位移。从而，通过磁轭片60和磁石之间产生的磁吸力，便于保持活动载体20在摄像模组中的稳定性，回复置中的效果，有效防止所述活动载体20随着摄像模组的晃动或倒置而产生脱落。同时，所述支承机构42得以在所述导向槽41中支承所述底座50和所述活动载体20之间的相对移动。
在本实施方式中，使用正交坐标系(X，Y，Z)进行说明，Z方向是光轴方向，为前后方向，将与Z轴正交的X方向和Y方向作为光轴正交方向，X方向为上下方向(或左右方向)，Y方向为左右方向(或上下方向)，沿光轴正交的平面是X方向和Y方向形成的平面，“径向”是与Z轴正交的方向，“轴向”是指两个Z轴正交面之间的对应设置，不仅包括与Z轴平行的方向，也包括接近Z轴平行的方向，如图1所示。
其中，所述活动载体20包括AF载体21和OIS载体22，所述AF载体21容置镜头组件1，所述OIS载体22容置所述AF载体21，所述底座50和所述OIS载体22沿光轴方向间隔地对应设置，所述驱动机构30包括AF线圈31、OIS线圈32以及一组磁石33，所述AF线圈31设置于所述AF载体21的外周，所述AF线圈31和所述磁石33相对径向设置，所述OIS线圈32设置于所述底座50上方，所述OIS线圈32和所述磁石33相对轴向设置，所述导向槽41分别内凹地开设于所述OIS载体32和所述底座50的相对面，所述底座50上的导向槽41高出于所述底座50的侧边，得以在所述底座50的侧边容纳所述OIS线圈32，各个所述支承机构42容纳于所述导向槽41中，所述支承机构42多自由度地沿着所述导向槽41内的平面移动。从而，所述OIS线圈32和所述磁石33形成第一磁场回路，得以驱动所述OIS载体22相对所述底座50沿光轴的正交面方向移动(即X/Y方向移动)，以补偿拍摄过程中的抖动，实现抖动修正，所述AF线圈31和所述磁石33形成第二磁场回路，得以驱动所述AF载体21沿光轴方向移动(即Z轴方向，后续以Z轴方向表示为光轴方向)以清晰的对焦，实现自动对焦，通过所述导向槽41的平面结构，所述支承机构42支撑所述OIS载体22多自由度地沿光轴正交面移动。
在一些实施例中，所述驱动机构30进一步包括线路板34，所述线路板34贴附于所述底座50上，所述磁石33固定于所述OIS载体22的侧边，所述OIS线圈32贴附于所述线路板34的侧边并与所述磁石33沿光轴方向对应设置，其中，所述OIS线圈32和所述磁石33对应设置，所述OIS线圈32和所述磁石 33可以沿光轴方向完全对准，对应设置也可以不是完全沿光轴方向对准，所述OIS线圈32和所述磁石33之间可以存在偏心设置，但所述磁石33所在的平面和所述OIS线圈32或所述磁轭片60所在的平面始终保持平行。其中，所述底座50上表面贴附所述线路板34，所述OIS线圈32需要与所述底座50上的所述线路板34导通，由于所述底座50侧边的线路板34粘接所述OIS线圈32的空间有限，所述磁石33的位置又受限于所述OIS载体22，造成两个部件的可用空间不同，使得所述OIS线圈32和磁石33的中心不一致。
在一些实施例中，所述线路板34为FPC软板34，所述线路板34包括软板底面341和软板侧面342，所述软板底面341贴附于所述底座50的上表面，所述OIS线圈32贴附于所述软板底面341的侧边，所述软板侧面342一体地从所述软板底面341向所述OIS载体22方向弯折延伸，所述软板侧面342和所述OIS载体22相对径向设置，所述软板侧面342的上部设有多个焊接点346，如图13所示。
在一些实施例中，所述透镜驱动装置2进一步包括外壳10，所述外壳10包覆所述活动载体20和所述底座50，所述外壳10设置于所述透镜驱动装置2的外部，将所述透镜驱动装置2内部的其他元件容纳在其内部空间中，以保护所述透镜驱动装置2内部的元件，并保证整体结构的稳定性，所述外壳10上设有通光孔11以及避让孔12，所述通光孔11用于容纳光学镜头结构，以使得外部的光线进入，马达焊接点位于所述外壳侧面并靠近所述通光孔11的一侧，所述FPC软板34的软板侧面342从所述软板底面341弯折后延伸至马达侧面的焊接点346，所述避让孔12设置于所述外壳10和所述软板侧面342的对应位置，得以避让所述FPC软板34的弯折，使得弯折后的FPC软板34从所述避让孔12中穿过，使得所述软板侧面342上的焊接点346连接到马达侧面的焊接点上，并与外部的供电装置连通，从而提供马达工作所需的电流。
在一些实施例中，所述磁石33为两用磁石，即所述OIS线圈32和所述AF线圈31共用磁石33，所述AF载体21设有承靠部212、安装部213以及相连部214，所述相连部214一体连接所述承靠部212和所述安装部213，所述承靠部212径向向外突出并承靠于所述磁石33上，所述AF线圈31设置于所述安装部213的外周，所述安装部213的位置低于所述相连部214，使得所述AF线圈31保持于所述安装部213和所述相连部214之间。也就是说，所述AF载体21具有用于安装镜头组件的AF通孔211，以允许外部的光线通过光学镜头进入，所述相连部214位于所述承靠部212和所述安装部213之间，所述承靠部212和所述相连部214逐级向外突出，使得所述相连部214和所述安装部213之间形成容纳空间，得以将所述AF线圈31缠绕于所述安装部213，同时，所述承靠部212和所述相连部214之间形成容纳空间，得以将所述承靠部212承靠于所述磁石33的上方，所述AF线圈31位于所述AF载体21的下侧，所述磁石33和所述AF线圈31径向对应设置，所述AF线圈31缠绕后与所述AF载体21侧面的表面齐平，充分利用所述AF载体21和所述OIS载体22的相对可安装空间，在保证AF载体21稳定性的同时，减小AF载体21整体的质量，以降低对AF载体21驱动力的要求，如图9所示。
在一些实施例中，所述活动载体20进一步包括弹性支撑件23，所述弹性支撑件23连接所述AF载体21和所述OIS载体22，所述弹性支撑件23得以保持所述AF载体21在所述OIS载体22的置中状态，所述弹性支撑件23包括上弹片231、下弹片232以及多个侧面弹片233，所述上弹片231可活动地连接所述AF载体21和所述OIS载体22的上表面，所述下弹片232可活动地连接所述AF载体21和所述OIS载体22的下表面，所述侧面弹片233电连接所述线路板34和所述上弹片231或所述下弹片232，得以电导通所述AF载体21中的内嵌线路215。
在一些实施例中，所述透镜驱动装置2进一步包括第一感测机构71和第二感测机构72，所述第一感测机构71安装于所述线路板34的背面，并与所述磁石33对应设置，得以检测所述磁石33和所述OIS载体22的位置，所述底座50设有感测器安装孔53，所述感测器安装孔53位于相邻的所述磁轭片60中间，所述第一感测机构71容纳于所述底座50的感测器安装孔53中。其中，所述第二感测机构72包括AF结构IC控制器721、AF位置感测器722以及AF感测磁铁723，所述AF感测磁铁723安装于所述OIS载体22中，所述AF位置感测器722和所述AF结构IC控制器721安装于所述AF载体21中，所述AF感测磁铁723和所述AF位置感测器722径向相对设置，所述AF位置感测器722得以感测所述AF载体21相对于所述AF感测磁铁723沿光轴方向移动的位置，以实现更为准确对焦，所述AF结构IC控制器721根据所述AF位置感测器722反馈的磁变化量数据来控制所述AF线圈31的电流，得以控制所述AF载体21的运动方向和行程。
也就是说，所述AF位置感测器722位于所述AF载体21的其中一个侧边上，相应地，与其径向对应的OIS载体22的内侧，设有所述AF感测磁铁723，通过所述AF感测磁铁723和所述AF位置感测器722的配合，得以感测所述AF载体21的位置。同时，为保证所述OIS载体22的平衡，所述OIS载体22进一步设有配重块724，所述配重块724和所述AF感测磁铁723分别位于所述OIS载体22的对角上，以保证所述OIS载体22在移动过程中的平衡。其中，所述配重块724可以为磁铁，也可以为其他的金属材料，只要使得所述OIS载体22保持平衡即可，如图11所示。
在一些实施例中，所述感测器安装孔53包括X方向安装孔531以及Y方向安装孔532，所述第一感测机构71分别安装于所述X方向安装孔531和所述Y方向安装孔532中，得以检测所述OIS载体22的X方向位移和Y方向位移，所述第一感测机构71包括OIS结构IC控制器711和OIS位置感测器712，所述OIS位置感测器712得以感测所述OIS载体22相对于所述底座50沿光轴正交面移动的位置，所述OIS结构IC控制器711根据所述OIS位置感测器712反馈的磁变化量来控制所述OIS线圈32的电流，进而控制所述OIS载体22的运动方向和行程，如图12所示。
在一些实施例中，所述AF位置感测器722和所述OIS位置感测器712为霍尔传感器。
也就是说，所述底座50上的所述OIS线圈32驱动所述OIS载体22中的光学镜头1实现多个自由度方向的移动，得以实现X轴方向和Y轴方向的移动，X轴方向的所述OIS位置感测器712和OIS结构IC控制器711相互配合，以实现OIS载体22在X轴方向更为准确的移动，Y轴方向的所述OIS位置感测器712和OIS结构IC控制器711相互配合，以实现OIS载体22在Y轴方向更为准确的移动。同时，所述第一感测机构71分别通过所述底座50上的X方向安装孔531和所述Y方向安装孔532，得以与所述底座50的下表面齐平，所述第一感测机构71分别位于所述磁石33的正下方，用于准确感测所述OIS载体22的移动方向，所述第一感测机构71电连接于所述FPC软板34的软板底面341。
在一些实施例中，所述OIS载体22设有第一容置腔222、第二容置腔223以及承靠容纳位224，所述第一容置腔222开设于所述OIS载体22的对角处，所述AF感测磁铁723和所述配重块724对称地容纳于所述第一容置腔222中，所述第二容置腔223位于所述OIS载体22的侧面，所述第二容置腔223得以容纳所述磁石33，所述磁石33沿着所述OIS载体22的四个侧面均匀分布，所述承靠容纳位224容纳所述AF载体21的承靠部212。也就是说，所述OIS载体22上具有用于容纳有AF载体21的OIS通孔221，所述AF载体21通过其侧边的承靠部212与所述OIS载体22连接，在所述OIS载体22的上表面与所述承靠部 212对应的位置，设置所述承靠容纳位224，通过承靠容纳位224的设置，使得所述AF载体21的底面与马达的底部预留出一定的空间，方便所述OIS线圈32的安装，有效避让所述底座50上的所述OIS线圈32，同时，也为所述AF载体21活动提供空间，使得所述AF载体21始终在所述磁石33的上方移动，不会使其碰撞到所述OIS线圈32，也有利于所述下弹片在所述AF载体下表面的安装。如图10所述。
在一些实施例中，所述OIS载体22进一步设有凸块225，所述凸块225从所述OIS载体22的上表面的四个角向上突出，所述凸块225突出于所述OIS载体22上表面一定高度，得以为所述AF载体21沿着光轴方向的移动预留一定的运动空间。
其中，所述AF线圈31位于所述AF载体21的下侧，有助于将所述AF线圈31的中心与所述磁石33的中心保持一致，提供最大的AF驱动力，若将所述AF线圈31位于所述AF载体21的中间侧面，不仅会增大所述AF载体21的体积，还会导致所述AF线圈31位于所述磁石33的上部位置，当沿着Z轴方向移动一定距离后，所述AF线圈31上升到所述磁石33的上方，拉大所述AF线圈31和所述磁石33的距离，导致提供的AF驱动力不足，影响调整的精度。
在一些实施例中，所述导向槽41为平面方形槽结构，所述支承机构42为滚珠，得以使所述支承机构42多自由度地沿着所述导向槽41内的平面移动，所述底座50上的导向槽41高出于所述底座50的侧边，得以在所述底座50的侧边容纳所述OIS线圈32，使得所述OIS线圈32不高于所述底座50的导向槽41。也就是说，所述导向槽41不是特定X轴方向或Y轴方向的轨道，所述导向槽41的平面方形槽结构得以为所述OIS载体32提供无方向限制的支撑，使得滚珠42沿着X/Y两个方向移动集成在同一对所述导向槽41中，有利于降低特定轨道的摩擦力限制，通过多自由度可移动的方式提高位移精度和防抖行程，充分利用马达内部的空间。另外，所述导向槽41也可以为圆形槽，其中，所述圆形槽的直径大于所述滚珠42的直径。
在一些实施例中，所述底座50设有滚珠座52和第二导向槽521，所述滚珠座52从所述底座50的四角位置一体地向上凸出，所述第二导向槽521开设于所述滚珠座52中，所述滚珠座52突出于所述线路板34的软板底面341，所述OIS线圈32不高于所述滚珠座52，所述OIS载体22设有第一导向槽226，所述第一导向槽226和所述第二导向槽521对应设置，在所述第一导向槽226和所述第二导向槽521中容纳有滚珠42，所述滚珠座52设有定位柱54，所述软板侧面42设有定位孔3421，所述定位柱54从所述滚珠座52的一侧向所述定位孔3421延伸，所述定位柱54和所述定位孔3421相适配，使得所述定位柱54固定所述软板侧面42，以保证所述FPC软板34安装的准确性，同时利于后续的马达准确焊接。也就是说，所述OIS载体22底面的滚珠42可辅助所述OIS载体22的运动，在所述磁石33和所述OIS线圈32的驱动作用下，所述OIS载体22相对所述底座50沿着X/Y方向移动，从而带动镜头组件1移动，以实现抖动矫正。
在一些实施例中，所述底座50设有底座通孔51，以用于光学镜头1中的光线通过，所述OIS线圈32围绕所述底座通孔51位于所述底座50的四个侧边，所述第二导向槽521和所述底座50一体注塑成型，所述滚珠座52突出于所述底座50侧边表面一定的高度，不仅可以使得所述第二导向槽521和所述第一导向槽226相互配合形成所述滚珠42的容纳空间，同时也为所述OIS线圈32预留安装空间，使得所述OIS线圈32容纳于两侧的所述滚珠座52形成的空位中，充分利用马达的内部空间，保证所述OIS载体22移动的准确度。其中，所述第一导向槽226和所述第二导向槽521不仅可以是方形槽结构，其内部也可以是半 球形结构，所述滚珠42可以在所述第一导向槽226和所述第二导向槽521形成的内部空间沿着不同的自由度方向移动，具体的移动方向，受限于所述OIS载体22所受到的力的方向。
在一些实施例中，所述磁轭片60的数量为4个，所述OIS线圈32、所述磁石33和所述磁轭片60的数量相一致，所述磁石33沿所述OIS载体22的四个侧边设置。
在一些实施例中，各个所述磁轭片60的连接部分63倾斜连接所述第一部分61和所述第二部分62，所述连接部分63的宽度小于所述第一部分61和所述第二部分62。也就是说，所述磁轭片60沿着所述底座50的四角设置，每个所述磁轭片60对应于两个相邻的所述磁石33，不仅有效避让所述底座50上设置的所述第一感测机构71，所述磁轭片60还可以与所述磁石33形成磁吸力，将所述滚珠42限制在所述导向槽41内，由于所述滚珠42对应的磁轭片60宽度小于所述磁石33对应的磁轭片60宽度，在保证所述磁轭片60和所述磁石33之间的磁吸力稳定所述滚珠34运行的同时，得以减小所述磁轭片60对所述OIS载体22移动造成的阻力，便于所述OIS载体22在工作后快速回复到初始位置，降低对整体模组驱动力设计的要求，如图14所示。
在一些实施例中，各个所述磁轭片60进一步包括延伸部分64，所述延伸部分64从所述底座50四角处的连接部分63向外延伸，各个所述延伸部分64的外端具有扩大部65，所述延伸部分64地宽度小于所述第一部分61和所述第二部分62，有助于简化注塑工艺，所述磁轭片60通过注塑成型工艺内置于所述底座50中。所述磁轭片60的宽度小于所述磁石33的宽度，同时，所述磁轭片60的尺寸和安装位置，需根据整体的设计结构确定，可利用仿真软件，计算所述OIS载体22和所述底座50相对稳定需要的力，再确定所述磁轭片60的尺寸。
在一些实施例中，所述内嵌线路215电连接所述AF线圈31和所述第二感测机构72，所述侧面弹片233的一端固接于所述底座50，所述侧面弹片233的另一端固接于所述OIS载体22，得以使所述OIS载体22沿光轴正交面移动的复位，所述侧面弹片233包括线路导出片2332、线路导入片2331以及连通线路2333，所述线路导入片2331电连接于所述线路板34，所述线路导出片2332电连接于所述上弹片231或所述下弹片232，所述连通线路2333得以电连接所述线路导出片2332和所述线路导入片2331，所述连通线路2333包括直线部2334以及弯折部2337，所述弯折部2337为多段弯曲结构，所述直线部2334电连接所述线路导入片2331和所述弯折部2337，所述弯折部2337电连接所述直线部2334和所述线路导出片2332，通过所述直线部2334和所述侧面弹片233的线路结构，所述侧面弹片233在实现电导通的同时，还能起到保持件的作用，当所述OIS载体22带动光学镜头1沿着X/Y方向移动时，所述侧面弹片23可起到一定的复位作用，如图6所示。
其中，所述直线部2334还包括水平部2335和竖直部2336，所述水平部2335和所述竖直部2336连接形成导通线路，所述弯折部2337可以为S型结构，为所述OIS载体22提供移动时的活动余量，即预留所述OIS载体22沿着X/Y方向移动的行程，在保证所述活动载体20正常移动的同时，可以利用其本身的弹性提供所述OIS载体22的回复力，如图8a和图8b所示。
在一个实施方式中，所述底座50设有多个定位凸起55，所述定位凸起55从所述滚珠座52的侧面向外突出，所述定位凸起55贴附于所述滚珠座52的侧面并固接于所述定位凸起55，所述线路导出片2332 贴附于所述OIS载体22的侧面，所述弹性支撑件23设有两组所述侧面弹片233，各组所述侧面弹片233分别位于所述OIS载体22的两侧角，其中一个侧角的所述侧面弹片233电连接所述线路板34和所述上弹片231，其中另一个侧角的所述侧面弹片233电连接所述线路板34和所述下弹片232，所述AF载体21的内嵌线路215注塑于所述AF载体21中，如图5所示。
其中，所述FPC软板34的软板侧面342上预留的焊接点346得以接入外部电源，所述FPC软板34的软板底面341得以导通所述OIS线圈32和所述第一感测机构71，所述软板底面341的四个角上每个设有3个导通点343，即所述OIS线圈接入点、OIS线圈接出点以及侧面弹片导通点，通过所述FPC软板34得以导通所述OIS线圈32和所述侧面弹片233，通过所述侧面弹片233得以导通所述上弹片231和所述下弹片232，进而通过所述AF载体21中的内嵌线路215导通所述AF线圈31和所述第二感测机构72。
其中，所述AF载体21中的内嵌线路215包括IC接口、位置感测器接口、上弹片接口、下弹片接口以及两个所述AF线圈的接口，通过形成AF的导通线路，使得所述AF结构IC控制器721可根据所述AF位置感测器722反馈的信息，控制所述AF线圈31中的电流以实现实时的AF载体21位置调整，保证所述AF载体21驱动光学镜头精准对焦，其中，所述内嵌线路215注塑在所述AF载体21的一个侧边，通过各种线路的配合，在保证OIS马达正常工作的同时，可以简化马达内部的线路设计，进一步的实现整体结构的小型化。
在一些实施例中，所述侧面弹片233也可以只有一对具有导电功能，另一对用于增强复位。
其中，所述AF载体21通过所述弹性支撑件23保持置中的同时实现Z轴方向的移动，所述OIS载体22配合所述滚珠来42实现X/Y方向的移动，在驱动镜头移动的同时，使得元件高度紧凑，实现整体结构的小型化。
根据本发明的第二个方面，一种摄像模组包括：
如上所述的透镜驱动装置2；
镜头组件1，安装有至少一透镜；
感光组件，所述底座设置于所述感光组件和镜头组件之间，所述感光组件得以感光成像。
所述摄像模组也可以是芯片防抖摄像模组，所述底座50进一步设有底角凸块56，所述底角凸块56设置于所述底座50下表面的四角位置，与所述底座50一体成型，所述底角凸块56中设有感测磁石安装孔，感测磁石安装孔中嵌入相应的感测元件，以用于感测感光芯片所处的位置，并将感光芯片的位置信息反馈到控制中心，以使得马达和感光芯片相互配合，快速的调整两个元件所处的位置，以提升摄像模组的成像效率。同时，感光芯片和光学镜头可相互配合，以实现更大行程的防抖，解决了感光芯片尺寸增大和光学镜头质量增大对驱动力要求增加的问题，同时在保证马达驱动光学镜头移动的准确性的同时，解决感光芯片和光学镜头相互配合的运动的问题。
以上描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是本发明的原理，在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明的范围内。本发明要求的 保护范围由所附的权利要求书及其等同物界定。

Claims (38)

  1. 一种透镜驱动装置，其特征在于，包括：
    活动载体，所述活动载体用于容置镜头组件；
    底座，所述底座和所述活动载体沿光轴方向间隔地对应设置；
    驱动机构，所述驱动机构包括至少一组线圈和至少一组磁石，所述至少一组线圈和所述至少一组磁石对应设置，使得所述驱动机构用于驱动所述活动载体相对所述底座沿光轴的正交面方向移动；
    多个磁轭片，所述磁轭片安装于所述底座，各个所述磁轭片包括第一部分、第二部分以及连接部分，所述第一部分和所述第二部分分别从所述连接部分的两端一体地向所述底座的两边延伸，所述连接部分位于所述底座的四角处，所述第一部分和所述第二部分分别面向所述至少一组磁石。
  2. 根据权利要求1所述的透镜驱动装置，其特征在于，各个所述磁轭片的连接部分倾斜连接所述第一部分和所述第二部分，所述连接部分的宽度小于所述第一部分和所述第二部分。
  3. 根据权利要求2所述的透镜驱动装置，其特征在于，各个所述磁轭片进一步包括延伸部分，所述延伸部分从所述底座四角处的连接部分向外延伸，各个所述延伸部分的外端具有扩大部，所述延伸部分地宽度小于所述第一部分和所述第二部分。
  4. 根据权利要求1所述的透镜驱动装置，其特征在于，其进一步设有多个导向槽和多个支承机构，所述导向槽分别内凹地开设于所述活动载体和所述底座的相对面，各个所述支承机构容纳于所述导向槽中，所述磁轭片从所述导向槽的对应位置延伸向所述磁石的对应位置，所述支承机构可滚动地支撑所述活动载体沿光轴的正交面方向位移。
  5. 根据权利要求4所述的透镜驱动装置，其特征在于，所述导向槽为平面方形槽结构，所述支承机构为滚珠，得以使所述支承机构多自由度地沿着所述导向槽内的表面移动，所述底座上的导向槽高出于所述底座的侧边，得以在所述底座的侧边容纳所述至少一组线圈，使得所述至少一组线圈不高于所述底座的导向槽。
  6. 根据权利要求1所述的透镜驱动装置，其特征在于，所述磁轭片通过注塑成型工艺内置于所述底座中。
  7. 根据权利要求1～6中任一所述的透镜驱动装置，其特征在于，所述驱动机构包括至少一OIS线圈和线路板，所述线路板贴附于所述底座上，所述活动载体包括OIS载体，所述磁石固定于所述OIS载体的侧边，所述OIS线圈贴附于所述线路板的侧边并与所述磁石沿光轴方向对应设置，所述OIS线圈和所述磁石形成第一磁场回路，得以驱动所述OIS载体相对所述底座沿光轴的正交面方向移动，进行抖动修正。
  8. 根据权利要求7所述的透镜驱动装置，其特征在于，其进一步包括第一感测机构，所述第一感测机构安装于所述线路板的背面，并与所述磁石对应设置，得以检测所述磁石和所述OIS载体的位置，所述底座设有第一感测器安装孔，所述第一感测器安装孔位于相邻的所述磁轭片中间，所述第一感测机构容纳于所述底座的第一感测器安装孔中。
  9. 根据权利要求8所述的透镜驱动装置，其特征在于，所述第一感测器安装孔包括X 方向安装孔以及Y方向安装孔，所述第一感测机构分别安装于所述X方向安装孔和所述Y方向安装孔中，得以检测所述OIS载体的X方向位移和Y方向位移，所述第一感测机构包括OIS结构IC控制器和OIS位置感测器，所述OIS位置感测器得以感测所述OIS载体相对于所述底座沿光轴正交面移动的位置，所述OIS结构IC控制器得以控制所述OIS载体的运动方向和行程。
  10. 根据权利要求7所述的透镜驱动装置，其特征在于，所述线路板为FPC软板，所述线路板包括软板底面和软板侧面，所述软板底面贴附于所述底座的上表面，所述OIS线圈贴附于所述软板底面的侧边，所述软板侧面一体地从所述软板底面向所述OIS载体方向弯折延伸，所述软板侧面和所述OIS载体相对径向设置，所述软板侧面的上部设有多个焊接点。
  11. 根据权利要求10所述的透镜驱动装置，其特征在于，所述底座设有滚珠座和第二导向槽，所述滚珠座从所述底座的四角位置一体地向上凸出，所述第二导向槽开设于所述滚珠座中，所述滚珠座突出于所述线路板的软板底面，所述OIS线圈不高于所述滚珠座，所述OIS载体设有第一导向槽，所述第一导向槽和所述第二导向槽对应设置，在所述第一导向槽和所述第二导向槽中容纳有滚珠，所述滚珠座设有定位柱，所述软板侧面设有定位孔，所述定位柱从所述滚珠座的一侧向所述定位孔延伸，所述定位柱和所述定位孔相适配，使得所述定位柱固定所述软板侧面。
  12. 根据权利要求11所述的透镜驱动装置，其特征在于，所述活动载体进一步包括AF载体，所述AF载体可活动地安置于所述OIS载体中，镜头组件安装于所述AF载体中，所述驱动机构进一步包括AF线圈，所述AF线圈设置于所述AF载体的外周，所述AF线圈和所述磁石相对径向设置，所述AF线圈和所述磁石形成第二磁场回路，得以驱动所述AF载体沿光轴方向移动，进行自动对焦。
  13. 根据权利要求12所述的透镜驱动装置，其特征在于，所述AF载体设有承靠部、安装部以及相连部，所述相连部一体连接所述承靠部和所述安装部，所述承靠部径向向外突出并承靠于所述磁石上，所述AF线圈设置于所述安装部的外周，所述安装部的位置低于所述相连部，使得所述AF线圈保持于所述安装部和所述相连部之间。
  14. 根据权利要求13所述的透镜驱动装置，其特征在于，其进一步包括第二感测机构，所述第二感测机构包括AF结构IC控制器、AF位置感测器以及AF感测磁铁，所述AF感测磁铁安装于所述OIS载体中，所述AF位置感测器和所述AF结构IC控制器安装于所述AF载体中，所述AF感测磁铁和所述AF位置感测器径向相对设置，所述AF位置感测器得以感测所述AF载体相对于所述AF感测磁铁沿光轴方向移动的位置，所述AF结构IC控制器得以控制所述AF载体的运动方向和行程。
  15. 根据权利要求14所述的透镜驱动装置，其特征在于，所述OIS载体设有第一容置腔、第二容置腔以及承靠容纳位，所述第一容置腔开设于所述OIS载体的对角处，所述AF感测磁铁容纳于所述第一容置腔中，所述第二容置腔得以容纳所述磁石，所述承靠容纳位容纳所述AF载体的承靠部。
  16. 根据权利要求12所述的透镜驱动装置，其特征在于，所述活动载体进一步包括弹 性支撑件，所述弹性支撑件连接所述AF载体和所述OIS载体，所述弹性支撑件得以保持所述AF载体在所述OIS载体的置中状态，所述弹性支撑件包括上弹片、下弹片以及多个侧面弹片，所述上弹片可活动地连接所述AF载体和所述OIS载体的上表面，所述下弹片可活动地连接所述AF载体和所述OIS载体的下表面，所述侧面弹片电连接所述线路板和所述上弹片或所述下弹片，得以电导通所述AF载体中的内嵌线路，使得所述内嵌线路电连接所述AF线圈和所述第二感测机构。
  17. 根据权利要求16所述的透镜驱动装置，其特征在于，所述侧面弹片的一端固接于所述底座，所述侧面弹片的另一端固接于所述OIS载体，得以使所述OIS载体沿光轴正交面移动的复位，所述侧面弹片包括线路导出片、线路导入片以及连通线路，所述线路导入片电连接于所述线路板，所述线路导出片电连接于所述上弹片或所述下弹片，所述连通线路得以电连接所述线路导出片和所述线路导入片，所述连通线路包括直线部以及弯折部，所述弯折部为多段弯曲结构，所述直线部电连接所述线路导入片和所述弯折部，所述弯折部电连接所述直线部和所述线路导出片。
  18. 根据权利要求17所述的透镜驱动装置，其特征在于，所述底座设有多个定位凸起，所述定位凸起从所述滚珠座的侧面向外突出，所述定位凸起贴附于所述滚珠座的侧面并固接于所述定位凸起，所述线路导出片贴附于所述OIS载体的侧面，所述弹性支撑件设有两组所述侧面弹片，各组所述侧面弹片分别位于所述OIS载体的两侧角，其中一个侧角的所述侧面弹片电连接所述线路板和所述上弹片，其中另一个侧角的所述侧面弹片电连接所述线路板和所述下弹片，所述AF载体的内嵌线路注塑于所述AF载体中。
  19. 根据权利要求7所述的透镜驱动装置，其特征在于，所述磁轭片的数量为4个，所述OIS线圈、所述磁石和所述磁轭片的数量相一致，所述磁石沿所述OIS载体的四个侧边设置。
  20. 一种摄像模组，其特征在于，包括：
    权利要求1～19中任一所述的透镜驱动装置；
    镜头组件，安装有至少一透镜；
    感光组件，所述底座设置于所述感光组件和镜头组件之间，所述感光组件得以感光成像。
  21. 根据权利要求20所述的摄像模组，其特征在于，所述底座进一步设有底角凸块，所述底角凸块设置于所述底座下表面的四角位置，所述底角凸块内设有感测元件，得以感测所述感光芯片的位置，并将所述感光芯片的位置信息反馈到控制中心，所述感光芯片连接防抖马达。
  22. 一种透镜驱动装置，其特征在于，包括：
    活动载体，所述活动载体包括AF载体和OIS载体，所述AF载体容置镜头组件，所述OIS载体容置所述AF载体；
    底座，所述底座和所述OIS载体沿光轴方向间隔地对应设置；
    驱动机构，所述驱动机构包括AF线圈、OIS线圈以及一组磁石，所述AF线圈设置于所 述AF载体的外周，所述AF线圈和所述磁石相对径向设置，所述OIS线圈设置于所述底座上方，所述OIS线圈和所述磁石相对轴向设置；
    导向槽，所述导向槽分别内凹地开设于所述OIS载体和所述底座的相对面，所述底座上的导向槽高出于所述底座的侧边，得以在所述底座的侧边容纳所述OIS线圈；
    支承机构，各个所述支承机构容纳于所述导向槽中，所述支承机构多自由度地沿着所述导向槽内的表面移动。
  23. 根据权利要求22所述的透镜驱动装置，其特征在于，所述导向槽为平面方形槽结构，所述支承机构为滚珠，所述支承机构可滚动地支撑所述活动载体沿光轴的正交面方向位移。
  24. 根据权利要求22所述的透镜驱动装置，其特征在于，所述驱动机构进一步包括线路板，所述线路板贴附于所述底座上，所述磁石固定于所述OIS载体的侧边，所述OIS线圈贴附于所述线路板的侧边并与所述磁石沿光轴方向对应设置，所述OIS线圈和所述磁石形成第一磁场回路，得以驱动所述OIS载体相对所述底座沿光轴的正交面方向移动，进行抖动修正，所述AF线圈和所述磁石形成第二磁场回路，得以驱动所述AF载体沿光轴方向移动，进行自动对焦。
  25. 根据权利要求24所述的透镜驱动装置，其特征在于，所述AF载体设有承靠部、安装部以及相连部，所述相连部一体连接所述承靠部和所述安装部，所述承靠部径向向外突出并承靠于所述磁石上，所述AF线圈设置于所述安装部的外周，所述安装部的位置低于所述相连部，使得所述AF线圈保持于所述安装部和所述相连部之间。
  26. 根据权利要求25所述的透镜驱动装置，其特征在于，其进一步包括第二感测机构，所述第二感测机构包括AF结构IC控制器、AF位置感测器以及AF感测磁铁，所述AF感测磁铁安装于所述OIS载体中，所述AF位置感测器和所述AF结构IC控制器安装于所述AF载体中，所述AF感测磁铁和所述AF位置感测器径向相对设置，所述AF位置感测器得以感测所述AF载体相对于所述AF感测磁铁沿光轴方向移动的位置，所述AF结构IC控制器得以控制所述AF载体的运动方向和行程。
  27. 根据权利要求26所述的透镜驱动装置，其特征在于，所述OIS载体设有第一容置腔、第二容置腔以及承靠容纳位，所述第一容置腔开设于所述OIS载体的对角处，所述AF感测磁铁容纳于所述第一容置腔中，所述第二容置腔得以容纳所述磁石，所述承靠容纳位容纳所述AF载体的承靠部。
  28. 根据权利要求27所述的透镜驱动装置，其特征在于，所述活动载体进一步包括弹性支撑件，所述弹性支撑件连接所述AF载体和所述OIS载体，所述弹性支撑件得以保持所述AF载体在所述OIS载体的置中状态，所述弹性支撑件包括上弹片、下弹片以及多个侧面弹片，所述上弹片可活动地连接所述AF载体和所述OIS载体的上表面，所述下弹片可活动地连接所述AF载体和所述OIS载体的下表面，所述侧面弹片电连接所述线路板和所述上弹片或所述下弹片，得以电导通所述AF载体中的内嵌线路，使得所述内嵌线路电连接所述AF线圈和所述第二感测机构。
  29. 根据权利要求28所述的透镜驱动装置，其特征在于，所述侧面弹片的一端固接于所述底座，所述侧面弹片的另一端固接于所述OIS载体，得以使所述OIS载体沿光轴正交面移动的复位，所述侧面弹片包括线路导出片、线路导入片以及连通线路，所述线路导入片电连接于所述线路板，所述线路导出片电连接于所述上弹片或所述下弹片，所述连通线路得以电连接所述线路导出片和所述线路导入片，所述连通线路包括直线部以及弯折部，所述弯折部为多段弯曲结构，所述直线部电连接所述线路导入片和所述弯折部，所述弯折部电连接所述直线部和所述线路导出片。
  30. 根据权利要求29所述的透镜驱动装置，其特征在于，所述线路板为FPC软板，所述线
    路板包括软板底面和软板侧面，所述软板底面贴附于所述底座的上表面，所述OIS线圈贴附于所述软板底面的侧边，所述软板侧面一体地从所述软板底面向所述OIS载体方向弯折延伸，所述软板侧面和所述OIS载体相对径向设置，所述软板侧面的上部设有多个焊接点。
  31. 根据权利要求30所述的透镜驱动装置，其特征在于，所述底座设有滚珠座和第二滚
    珠槽，所述滚珠座从所述底座的四角位置一体地向上凸出，所述第二导向槽开设于所述滚珠座中，所述滚珠座突出于所述线路板的软板底面，所述OIS线圈不高于所述滚珠座，所述OIS载体设有第一导向槽，所述第一导向槽和所述第二导向槽对应设置，在所述第一导向槽和所述第二导向槽中容纳有滚珠，所述滚珠座设有定位柱，所述软板侧面设有定位孔，所述定位柱从所述滚珠座的一侧向所述定位孔延伸，所述定位柱和所述定位孔相适配，使得所述定位柱固定所述软板侧面。
  32. 根据权利要求31所述的透镜驱动装置，其特征在于，所述底座设有多个定位凸起，
    所述定位凸起从所述滚珠座的侧面向外突出，所述定位凸起贴附于所述滚珠座的侧面并固接于所述定位凸起，所述线路导出片贴附于所述OIS载体的侧面，所述弹性支撑件设有两组所述侧面弹片，各组所述侧面弹片分别位于所述所述OIS载体的两侧角，其中一个侧角的所述侧面弹片电连接所述线路板和所述上弹片，其中另一个侧角的所述侧面弹片电连接所述线路板和所述下弹片，所述AF载体的内嵌线路注塑于所述AF载体中。
  33. 根据权利要求22～32中任一所述的透镜驱动装置，其特征在于，其进一步包括多个磁
    轭片，所述磁轭片安装于所述底座，各个所述磁轭片包括第一部分、第二部分以及连接部分，所述第一部分和所述第二部分分别从所述连接部分的两端一体地向所述底座的两边延伸，所述连接部分位于所述底座的四角处，所述第一部分和所述第二部分分别面向所述磁石。
  34. 根据权利要求33所述的透镜驱动装置，其特征在于，各个所述连接部分倾斜连接所
    述第一部分和所述第二部分，所述连接部分的宽度小于所述第一部分和所述第二部分，所述磁轭片从所述导向槽的对应位置延伸向所述磁石的对应位置。
  35. 根据权利要求34所述的透镜驱动装置，其特征在于，各个所述磁轭片进一步包括延
    伸部分，所述延伸部分从所述底座四角处的连接部分向外延伸，各个所述延伸部分的外端具有扩大部，所述延伸部分地宽度小于所述第一部分和所述第二部分。
  36. 根据权利要求35所述的透镜驱动装置，其特征在于，其进一步包括第一感测机构，
    所述第一感测机构安装于所述线路板的背面，并与所述磁石对应设置，得以检测所述磁石和所述OIS载体的位置，所述底座设有第一感测器安装孔，所述第一感测器安装孔位于相邻的所述磁轭片中间，所述第一感测机构容纳于所述底座的第一感测器安装孔中。
  37. 根据权利要求36所述的透镜驱动装置，其特征在于，所述第一感测器安装孔包括X方向安装孔以及Y方向安装孔，所述第一感测机构分别安装于所述X方向安装孔和所述Y方向安装孔中，得以检测所述OIS载体的X方向位移和Y方向位移，所述第一感测机构包括OIS结构IC控制器和OIS位置感测器，所述OIS位置感测器得以感测所述OIS载体相对于所述底座沿光轴正交面移动的位置，所述OIS结构IC控制器得以控制所述OIS载体的运动方向和行程。
  38. 根据权利要求35所述的透镜驱动装置，其特征在于，所述磁轭片的数量为4个，所述OIS线圈、所述磁石和所述磁轭片的数量相一致，所述磁石沿所述OIS载体的四个侧边设置。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007178914A (ja) * 2005-12-28 2007-07-12 Chinontec Kk 振れ補正装置及びレンズ装置
JP2008191266A (ja) * 2007-02-01 2008-08-21 Sony Corp 像ぶれ補正装置、レンズ鏡筒及び撮像装置
CN103033947A (zh) * 2011-10-06 2013-04-10 索尼公司 模糊校正装置和摄像装置
TW201523031A (zh) * 2013-10-25 2015-06-16 Jahwa Electronics Co Ltd 相機鏡頭模組
US20170115501A1 (en) * 2015-10-23 2017-04-27 Samsung Electronics Co., Ltd Camera lens module
CN111665607A (zh) * 2019-03-07 2020-09-15 新思考电机有限公司 光学部件支撑装置、驱动装置、照相装置及电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007178914A (ja) * 2005-12-28 2007-07-12 Chinontec Kk 振れ補正装置及びレンズ装置
JP2008191266A (ja) * 2007-02-01 2008-08-21 Sony Corp 像ぶれ補正装置、レンズ鏡筒及び撮像装置
CN103033947A (zh) * 2011-10-06 2013-04-10 索尼公司 模糊校正装置和摄像装置
TW201523031A (zh) * 2013-10-25 2015-06-16 Jahwa Electronics Co Ltd 相機鏡頭模組
US20170115501A1 (en) * 2015-10-23 2017-04-27 Samsung Electronics Co., Ltd Camera lens module
CN111665607A (zh) * 2019-03-07 2020-09-15 新思考电机有限公司 光学部件支撑装置、驱动装置、照相装置及电子设备

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