WO2023185220A1 - Optical module - Google Patents

Optical module Download PDF

Info

Publication number
WO2023185220A1
WO2023185220A1 PCT/CN2023/072390 CN2023072390W WO2023185220A1 WO 2023185220 A1 WO2023185220 A1 WO 2023185220A1 CN 2023072390 W CN2023072390 W CN 2023072390W WO 2023185220 A1 WO2023185220 A1 WO 2023185220A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
optical
housing
light
laser
Prior art date
Application number
PCT/CN2023/072390
Other languages
French (fr)
Chinese (zh)
Inventor
邵乾
慕建伟
吴涛
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202220740523.XU external-priority patent/CN217543461U/en
Priority claimed from CN202220776501.9U external-priority patent/CN217085337U/en
Priority claimed from CN202210331564.8A external-priority patent/CN114675383A/en
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2023185220A1 publication Critical patent/WO2023185220A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical fiber communication, and in particular, to an optical module.
  • optical communication technology optical modules are tools for realizing mutual conversion of optical and electrical signals. They are one of the key components in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules continues to increase.
  • the present disclosure provides an optical module, including: a circuit board with a mounting through hole; a light emitting component electrically connected to the circuit board for emitting optical signals; and an optical fiber adapter connected to the light emitting component through Optical fiber array connection; wherein, the light emitting component includes: a transmitting housing, which is buckled on the front side of the circuit board and is sealingly connected to the front side of the circuit board; including an installation inner cavity, and the installation inner cavity faces the One end of the front face of the circuit board is provided with an opening, and the installation inner cavity is connected to the installation through hole through the opening; one end toward the fiber optic adapter is provided with a gap, and the gap is connected to the installation inner cavity.
  • Emitting cover plate arranged on the back side of the circuit board, covering the installation through hole, and sealingly connected with the back side of the circuit board; laser, installed in the installation cavity, through the installation A through hole is located on the back side of the circuit board and is used to generate a laser beam; an optical path translation prism is provided in the installation cavity, with one end located on the back side of the circuit board through the installation through hole, and the other end located on the back side of the circuit board.
  • the front side of the circuit board is used to reflect the laser beam located on the back side of the circuit board to the front side of the circuit board;
  • the emitting optical fiber array component has one end inserted into the installation cavity through the gap, and the other end is led out
  • the optical fiber array is connected to the optical fiber adapter; and is sealingly connected to the notch and the front surface of the circuit board respectively.
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Figure 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • Figure 5 is a schematic diagram of the assembly of a light emitting component, a light receiving component, a circuit board and an optical fiber in an optical module according to some embodiments;
  • Figure 6 is a schematic structural diagram of a circuit board in an optical module according to some embodiments.
  • Figure 7 is a partial assembly diagram of a light emitting component and a circuit board in an optical module according to some embodiments
  • Figure 8 is a schematic diagram of the flipped structure of a light emitting component in an optical module according to some embodiments.
  • Figure 9 is a partial assembly diagram of a light emitting component and a circuit board in an optical module according to some embodiments from another angle;
  • Figure 10 is a schematic structural diagram of a transmitting housing in an optical module according to some embodiments.
  • Figure 11 is a schematic structural diagram of a transmitting housing in an optical module according to some embodiments from another angle;
  • Figure 12 is a partially assembled cross-sectional view of a light emitting component and a circuit board in an optical module according to some embodiments
  • Figure 13 is another partial assembly diagram of a light emitting component and a circuit board in an optical module according to some embodiments
  • Figure 14 is a schematic diagram of the flip structure of a light receiving component in an optical module according to some embodiments.
  • Figure 15 is a schematic structural diagram of a light receiving component in an optical module according to some embodiments from another angle;
  • Figure 16 is a partially assembled cross-sectional view of a light receiving component and a circuit board in an optical module according to some embodiments
  • Figure 17 is a schematic diagram of the assembly of another light emitting component, light receiving component, circuit board and optical fiber in an optical module according to some embodiments;
  • Figure 18 is a partial assembly diagram of another light emitting component and a circuit board in an optical module according to some embodiments.
  • Figure 19 is a schematic structural diagram of another circuit board in an optical module according to some embodiments.
  • Figure 20 is a schematic structural diagram of another light emitting component in an optical module according to some embodiments.
  • Figure 21 is a schematic structural diagram of another emission housing in an optical module according to some embodiments.
  • Figure 22 is a schematic structural diagram of another emission housing in an optical module according to some embodiments from another angle;
  • Figure 23 is an exploded structural diagram of another light emitting component in an optical module according to some embodiments.
  • Figure 24 is a schematic structural diagram of another emission housing in an optical module according to some embodiments from a third angle
  • Figure 25 is a schematic structural diagram of another emission housing in an optical module according to some embodiments from a fourth angle;
  • Figure 26 is a partial structural schematic diagram of another light emitting component in an optical module provided by an embodiment of the present application.
  • Figure 27 is a cross-sectional view of another light emitting component in an optical module according to some embodiments.
  • Figure 28 is a partially assembled cross-sectional view of another light emitting component and a circuit board in an optical module according to some embodiments
  • Figure 29 is a schematic assembly diagram of a circuit board, a light emitting component and a light receiving component in an optical module according to some embodiments;
  • Figure 30 is a schematic diagram of the flip structure of the light emitting component in an optical module according to some embodiments.
  • Figure 31 is a partial schematic diagram of the light emitting component and the circuit board in an optical module from another angle according to some embodiments;
  • Figure 32 is a schematic assembly diagram of a transmitting fiber array component and an optical isolator in an optical module according to some embodiments;
  • Figure 33 is a partially exploded schematic diagram of a transmitting fiber array component and an optical isolator in an optical module according to some embodiments;
  • Figure 34 is a schematic structural diagram of a transmitting housing in an optical module according to some embodiments.
  • Figure 35 is a schematic structural diagram of the emitting housing in an optical module from another angle according to some embodiments.
  • Figure 36 is a schematic structural diagram of a transmitting housing in an optical module from a third angle according to some embodiments.
  • Figure 37 is a partial assembly cross-sectional view of the light emitting component and the circuit board in an optical module according to some embodiments.
  • Figure 38 is a schematic diagram of the flip structure of the light receiving component in an optical module according to some embodiments.
  • Figure 39 is a schematic structural diagram of a receiving housing in an optical module according to some embodiments.
  • Figure 40 is a schematic assembly diagram of another circuit board and light receiving component in an optical module according to some embodiments.
  • Figure 41 is a partial assembly diagram of an optical fiber and a housing in an optical module according to some embodiments.
  • optical communication technology light is used to carry information to be transmitted, and the optical signal carrying the information passes through optical fibers or light waves.
  • Information transmission equipment such as guides are transmitted to information processing equipment such as computers to complete the transmission of information. Since optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by computers and other information processing equipment are electrical signals. Therefore, in order to distinguish between information transmission equipment such as optical fibers or optical waveguides and computers and other information processing equipment To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • Optical modules realize the mutual conversion function of the above-mentioned optical signals and electrical signals in the field of optical fiber communication technology.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (for example, optical modem) through the electrical port.
  • the electrical connection It is mainly used to realize power supply, I2C signal transmission, data signal transmission and grounding; the optical network terminal transmits electrical signals to computers and other information processing equipment through network cables or wireless fidelity technology (Wi-Fi).
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000, local information processing equipment 2000, optical network terminal 100, optical module 200, optical fiber 101 and network cable 103;
  • the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200.
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of thousands of meters (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long-distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers, or hundreds of kilometers.
  • the local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection;
  • the electrical port is configured to be connected to the optical network terminal 100, so that the optical module 200 and the optical network terminal 100 establish a bidirectional connection. electrical signal connection.
  • the optical module 200 realizes mutual conversion between optical signals and electrical signals, thereby establishing a connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100.
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101.
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing, and an optical module interface 102 and a network cable interface 104 provided on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 Establish a two-way electrical signal connection.
  • the optical module 200 and the network cable 103 are connected through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100 serves as the host computer of the optical module 200 and can monitor the optical module 200. work.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT), etc.
  • the remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, Figure 2 only shows the structure related to the optical network terminal 100 and the optical module 200. .
  • the optical network terminal 100 also includes a printed circuit board (Printed Circuit Board, PCB) 105 provided in the casing, a cage 106 provided on the surface of the PCB 105, and electrical connections provided inside the cage 106 device.
  • the electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other protrusions that increase the heat dissipation area.
  • PCB printed circuit Board
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the cage 106 fixes the optical module 200.
  • the optical module The heat generated by 200 is conducted to cage 106 and then diffused through heat sink 107.
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100.
  • the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.
  • FIG. 3 is a structural diagram of an optical module according to some embodiments
  • FIG. 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver device;
  • the housing includes an upper housing 201 and a lower housing 202.
  • the upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205; the outer contour of the housing generally presents a square body.
  • the lower housing 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the upper housing 201 includes a cover plate, and two lower side plates located on both sides of the cover plate and perpendicular to the cover plate. The two upper side plates are combined with the two side plates to realize that the upper housing 201 is covered on the lower housing 202.
  • the direction of the connection between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at an end of the optical module 200 and the opening 205 is located at a side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger of the circuit board 300 extends from the electrical port 204 and is inserted into the host computer (such as the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101, so that The optical fiber 101 is connected to the optical transceiver device inside the optical module 200 .
  • the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, optical transceiver devices and other devices into the housing.
  • the upper housing 201 and the lower housing 202 can form package protection for these devices.
  • the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component located on the outer wall of its housing.
  • the unlocking component is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixation between the optical module 200 and the host computer. connect.
  • the unlocking component is located on the outer walls of the two lower side panels of the lower housing 202 and includes a snap component that matches the cage of the host computer (for example, the cage 106 of the optical network terminal 100).
  • the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging parts of the unlocking part.
  • the engaging parts of the unlocking part move accordingly, thereby changing the engaging parts.
  • the connection relationship with the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit wiring, electronic components and chips.
  • the electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding.
  • Electronic components may include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET).
  • the chip may include, for example, a microcontroller unit (Microcontroller Unit, MCU), a transimpedance amplifier (Transimpedance Amplifier, TIA), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP). )chip.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can smoothly carry chips; the rigid circuit board can also be inserted into an electrical connector in a host computer cage. .
  • the circuit board 300 also includes gold fingers formed on its end surface, and the gold fingers are composed of a plurality of mutually independent pins.
  • the circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by the gold finger.
  • the golden fingers can be disposed only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or they can be disposed on the upper and lower surfaces of the circuit board 300 to adapt to situations where a large number of pins are required.
  • the golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the optical transceiver device includes a light emitting component 400 and a light receiving component 500, which are respectively used to transmit and receive optical signals.
  • the light emitting component 400 generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter.
  • the front and back sides of the light emitter emit light beams respectively, and the lens is used to converge the light emitter.
  • the light beam emitted from the front makes the light beam emitted by the light transmitter become parallel light or converged light, so as to facilitate coupling to the external optical fiber through appropriate steps and methods.
  • the light receiving component 500 generally includes a receiving chip and a transimpedance amplifier.
  • the receiving chip is used to convert the received external optical signal into an electrical signal.
  • the electrical signal is amplified by the transimpedance amplifier and then transmitted to the gold finger on the circuit board 300. Through the gold finger Transmit electrical signals to the host computer.
  • the light-emitting component 400 and the light-receiving component 500 mostly adopt a non-sealed structure design, and their key optical paths are all open.
  • these key optical paths and components will also be immersed in the refrigerant liquid, causing changes in the optical mechanism and contamination of the optical surface, seriously affecting the normal operation of the optical module.
  • optical module adopts an innovative structural design to realize all airtight packaging of all optical paths inside the optical module, thereby achieving long-term and reliable operation of the optical module in a liquid cooling environment. This work greatly improves the heat dissipation effect of the light emitting component 400 and the light receiving component 500 in the optical module.
  • FIG. 5 is a schematic diagram of the assembly of a circuit board, a light emitting component, a light receiving component and an optical fiber in an optical module according to an embodiment of the present disclosure.
  • the optical module provided by the embodiment of the present disclosure includes a light transmitting component 400, a light receiving component 500 and an optical fiber 600.
  • the light transmitting component 400 adopts a bottom-up (flip-chip) light transmitter structure, so that the light transmitting component 400 The bottom surface is in contact with the upper housing 201, which greatly improves the heat dissipation of the light emitting component 400; a bundle of optical fibers 600 is connected to the light emitting component 400, and the emission beam emitted by the light emitting component 400 is transmitted through the optical fiber 600 to achieve light emission.
  • the light receiving component 500 and the light emitting component 400 can be disposed on the same side of the circuit board 300.
  • Another bundle of optical fibers 600 is connected to the light receiving component 500.
  • the external optical signal is transmitted to the light receiving component 500 through the optical fiber 600, and is processed through the light receiving component 500. Photoelectric conversion to achieve light reception.
  • the main optical path of the light emitting component 400 is located on a single plane, so the circuit board 300 needs to dig out a large area to avoid the required positions of the light emitting component 400 and the optical fiber, which results in a large hole in the circuit board 300 , and the complex shape of the holes not only greatly reduces the arrangement space of electronic components, but also makes it difficult to apply glue and seal.
  • holes are dug in the circuit board 300, the laser in the light emitting assembly 400 is placed on the back side of the circuit board 300, and an optical path translation prism is added in the light emitting direction of the laser so that the entire optical path moves to the front side of the circuit board. This can reduce the digging area on the circuit board 300 and facilitate sealing of the light emitting component 400 on the back side of the circuit board 300 .
  • FIG. 6 is a schematic structural diagram of a circuit board in an optical module provided by an embodiment of the present disclosure.
  • FIG. 7 is a partial assembly diagram of a circuit board and a light emitting component in an optical module provided by an embodiment of the present disclosure.
  • the circuit board 300 is provided with a mounting through hole 320, and the laser component of the light emitting component 400 is embedded in the mounting through hole 320 to place the laser component close to the lower surface (back surface) of the circuit board 300.
  • the light emitting component 400 is assembled to the circuit board 300 in reverse, so that the wiring surface height of the laser component is the same as the back surface of the circuit board 300 during assembly, so that the connection wiring between the back side of the circuit board 300 and the laser component is the shortest.
  • the connection wiring between the back side of the circuit board 300 and the laser component is the shortest.
  • the light emitting assembly 400 may include a first emitting housing 401 and an emitting cover 402.
  • the laser assembly is disposed in the first emitting housing 401.
  • the first emitting housing 401 is buckled on the front side of the circuit board 300 and connected with the circuit board 300.
  • the front side is sealed and connected;
  • the emission cover 402 is arranged on the back side of the circuit board 300, and is covered on the mounting through hole 320, and is sealed and connected with the back side of the circuit board 300.
  • the first launch housing 401, the circuit board 300 and the launch cover 402 form a sandwich structure.
  • FIG. 8 is a schematic diagram of the flipped structure of a light emitting component in the optical module provided by the embodiment of the present disclosure.
  • FIG. 9 is a partial assembly diagram of a circuit board and the light emitting component in the optical module provided by the embodiment of the present disclosure from another angle.
  • the light emitting component 400 may include a first emitting housing 401 and a laser 410 disposed in the first emitting housing 401 , a collimating lens 420 , a first optical path translation prism 430 , and an optical isolator. 440a and optical collimator 460.
  • the bottom surface of the first emitting housing 401 (the surface facing away from the front of the circuit board 300) faces the upper housing 201.
  • the first emitting housing 401 includes a mounting inner cavity, a laser 410, and a collimating lens. 420.
  • the straightener 460 is installed in the installation cavity in the first emission housing 401, and the installation height of the laser 410, the collimating lens 420 and the first optical path translation prism 430 is higher than the installation height of the optical isolator 440a and the optical collimator 460,
  • the laser 410, the collimating lens 420 and the first optical path translation prism 430 are located on the back side of the circuit board 300 through the mounting through hole 320 on the circuit board 300, and the optical isolator 440a and the optical collimator 460 are located on the front side of the circuit board 300. .
  • the installation cavity in the first launch housing 401 is provided with an opening at one end toward the front of the circuit board, and the installation cavity is connected to the installation through hole 320 on the circuit board 300 through the opening, so that it is provided in the installation
  • the laser 410 of the cavity can be embedded in the mounting through hole 320 through the opening, so that the wiring installation height of the laser 410 is the same as the back side of the circuit board 300 .
  • a laser beam emitted by the laser 410 is converted into a collimated beam through the collimating lens 420.
  • the collimated beam reflects the collimated beam located on the back side of the circuit board 300 to the front side of the circuit board 300 through the first optical path translation prism 430.
  • the first The laser beam reflected by the optical path translation prism 430 directly passes through the optical isolator 440a and is injected into the optical collimator 460. It is injected into the optical fiber 600 through the optical collimator 460, and then transmitted to the optical fiber adapter 700 through the optical fiber 600, thereby realizing the optical signal integration. emission.
  • the digging area of the circuit board 300 can be reduced, and it is also convenient to drill holes on the back side of the circuit board 300 Light emitting assembly 400 is sealed.
  • the optical transmitting component 400 includes 4 optical transmitters to achieve 4 optical transmitters. Emission of the transmitting beam; the light receiving component 500 includes 4 optical receivers to realize the reception of the 4 receiving beams.
  • the light emitting assembly 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, a first optical path translation prism 430, an optical combiner 440, an optical isolator 440a and an optical collimator arranged in the first emitting housing 401.
  • a plurality of lasers 410, a plurality of collimating lenses 420, a first optical path translation prism 430, an optical combiner 440, an optical isolator 440a and an optical collimator 460 are all installed in the installation cavity of the first emission housing 401 within, and the installation height of the laser 410, the collimating lens 420 and the first optical path translation prism 430 is higher than the installation height of the optical combiner 440 and the optical isolator 440a.
  • the plurality of lasers 410 and the plurality of collimating lenses 420 are located on the back side of the circuit board 300 through the mounting through holes 320.
  • One end of the first optical path translation prism 430 is located on the back side of the circuit board 300 through the mounting through holes 320, and the other end is located on the circuit board.
  • the optical multiplexer 440 , the optical isolator 440 a and the optical collimator 460 are all located on the front side of the circuit board 300 .
  • the plurality of lasers 410 respectively emit laser beams, which are parallel to the back of the circuit board 300; the plurality of collimating lenses 420 convert the laser beams emitted by the lasers 410 into collimated beams, and the plurality of collimated beams are transmitted to the first optical path for translation
  • the prism 430 and the first optical path translation prism 430 reflect the laser beam located on the back side of the circuit board 300 to the front side of the circuit board 300 .
  • the function of the first optical path translation prism 430 is to translate the multi-path light beam upward for a certain distance, so that all subsequent optical devices are located on the front side of the circuit board 300 and maintain an appropriate gap with the circuit board 300 . In this way, the positional conflict between the optical device and the circuit board 300 is avoided, thereby reducing the hole digging area of the circuit board 300 as much as possible, increasing the arrangement area of the electronic devices on the circuit board 300, and making the wiring of the circuit board 300 easier. much easier.
  • the right side of the optical multiplexer 440 may include four light entrances for incident signal light of multiple wavelengths, and each light entrance may be used for incident signal light of one wavelength; the left side of the optical multiplexer 440 may include one for incident signal light.
  • the light exit port for emitting light. Taking the four wavelengths of ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4 incident on the optical multiplexer 440 as an example, the ⁇ 1 signal light enters the optical multiplexer 440 through the first light entrance, and passes through six different positions in the optical multiplexer 440 for six different times.
  • the reflection reaches the light exit port; the ⁇ 2 signal light enters the optical multiplexer 440 through the second light entrance port, undergoes four different reflections at four different positions in the optical multiplexer 440 and reaches the light exit port; the ⁇ 3 signal light passes through the third entrance light The signal light enters the optical multiplexer 440, undergoes two different reflections at two different positions in the optical multiplexer 440, and reaches the light exit port; the ⁇ 4 signal light enters the optical multiplexer 440 through the fourth light entrance port, and is directly transmitted to the light exit port.
  • the optical combiner 440 realizes that signal lights of different wavelengths are input through different light inlets and output through the same light outlet, thereby achieving the combination of signal lights of different wavelengths.
  • One end of the optical collimator 460 is inserted into the installation cavity of the first emission housing 401, and the other end is sealed with the optical fiber 600. That is, one end of the optical fiber 600 is inserted into the optical collimator 460, and the optical fiber 600 is aligned with the optical fiber through glue. Sealed connection of straightener 460. In this way, the composite light beam output by the optical combiner 440 is coupled into the optical fiber 600 through the optical collimator 460 to achieve A beam of light was emitted.
  • the composite light beam output by the optical multiplexer 440 is transmitted to the light incident surface of the optical collimator 460, because the light is in different Reflection will occur when propagating at the interface of the medium.
  • the composite beam will be reflected when it is transmitted to the light incident surface of the optical collimator 460.
  • the reflected beam may return to the laser 410 along its original path, affecting the high-frequency performance of the laser 410.
  • the optical isolator 440a is provided between the optical multiplexer 440 and the optical collimator 460.
  • the optical isolator 440a 440a is used to isolate the reflected beam and prevent the reflected beam from returning to the laser 410 along the original path.
  • the optical collimator 460 may include a sleeve, a focusing lens and a single-mode optical fiber flange.
  • the sleeve is placed outside the focusing lens and the single-mode optical fiber flange.
  • the optical fiber 600 is inserted into the single-mode optical fiber flange.
  • the incident light of the focusing lens is The surface faces the optical isolator and the light exit surface faces the single-mode fiber flange.
  • the composite beam output by the optical combiner is transmitted to the focusing lens through the optical isolator.
  • the focusing lens converges the composite beam onto the optical fiber 600 in the single-mode fiber flange.
  • the focusing lens can be a cylindrical lens, and the outer diameter of the cylindrical lens and the single-mode optical fiber flange can be slightly smaller than the inner diameter of the casing to ensure the coupling between the focusing lens and the single-mode optical fiber flange.
  • the focusing lens and the single-mode fiber flange can only be moved axially.
  • the focusing lens protrudes outside the sleeve, reducing the distance between the light incident surface of the focusing lens and the light exit surface of the optical isolator 440a, making the structure more compact. compact.
  • the cylindrical lens can also be placed separately from the single-mode fiber flange.
  • the cylindrical lens will be changed to a rectangular lens to facilitate installation, and the position of the lens needs to be adjusted separately to achieve coupling purposes.
  • the light emitting assembly 400 includes 4 lasers, 4 collimating lenses and an optical path translation prism.
  • the lasers 410 and the collimating lenses 420 are arranged in one-to-one correspondence.
  • Each laser 410 emits a laser beam
  • each collimator 410 emits a laser beam.
  • the straight lens 420 converts a laser beam into a collimated beam.
  • the collimated beam emitted by each collimating lens 420 is transmitted to the first optical path translation prism 430, and the collimated beam is reflected by the first optical path translation prism 430 to change the laser beam.
  • the transmission direction and position of the beam are examples of the beam.
  • the multiple laser beams located on the back side of the circuit board 300 are reflected to the front side of the circuit board 300 through the first optical path translation prism 430, the multiple laser beams are synthesized into a composite beam through the optical combiner 440, and the composite beam passes through the optical collimator. 460.
  • the optical fiber 600 is coupled to the optical fiber adapter 700 to realize the transmission of multiple optical signals.
  • FIG. 10 is a schematic structural diagram of the first emitting housing in the optical module provided by an embodiment of the present disclosure.
  • FIG. 11 is a schematic structural diagram of the first emitting housing in the optical module provided by an embodiment of the present disclosure from another angle.
  • the first emission housing 401 in order to support the fixed laser 410, the collimating lens 420, the first optical path translation prism 430, the optical combiner 440 and the optical isolator 440a, the first emission housing 401 includes a first contact surface 4011, The first contact surface 4011 is sealingly connected to the front surface of the circuit board 300 to achieve a sealing connection between the first launch housing 401 and the front surface of the circuit board 300; an installation inner cavity is provided from the first contact surface 4011 toward the upward housing 201.
  • the installation inner cavity includes a first installation surface 4110, a second installation surface 4120, and a third installation surface 4130.
  • the third installation surface 4130 is recessed in the second installation surface 4120, and the second installation surface 4120 is recessed in the first installation surface 4110.
  • the mounting surface 4110 is recessed in the first contact surface 4011 .
  • the distance between the third mounting surface 4130 and the front of the circuit board 300 is greater than the distance between the second mounting surface 4120 and the front of the circuit board 300
  • the distance between the second mounting surface 4120 and the front of the circuit board 300 is greater than the distance between the first mounting surface 4110 and the front of the circuit board 300 distance
  • the first mounting surface 4110 does not contact the front surface of the circuit board 300, so that the first mounting surface 4110, the second mounting surface 4120, the third mounting surface 4130 and the first contact surface 4011 form a step surface.
  • the mounting cavity forming the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 is only provided with an opening at one end facing the front of the circuit board 300, and a semiconductor refrigeration device is provided on the first mounting surface 4110.
  • the semiconductor refrigerator 460a is embedded into the mounting through hole 320 on the circuit board 300 through the opening.
  • Each laser 410 is disposed on the laser substrate, each laser substrate and the collimating lens 420 are disposed on the cooling surface of the semiconductor refrigerator 460a, and the collimating lens 420 is disposed in the light emitting direction of the laser 410, so that the laser 410 is aligned with the collimator.
  • the straight lenses 420 are located on the back side of the circuit board 300 through the mounting through holes 320 .
  • the first optical path translation prism 430 is disposed on the second mounting surface 4120 recessed in the first mounting surface 4110.
  • the optical path translation prism 430 is vertically fixed on the second mounting surface 4120, that is, one end of the first optical path translation prism 430 is fixed on the second mounting surface 4120, and the other end is located on the back side of the circuit board 300, so that the first optical path translation prism 430 passes through
  • the laser beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300 .
  • the optical multiplexer 440 is disposed on the second mounting surface 4120.
  • the optical multiplexer 440 is located in the emission direction of the reflected light of the first optical path translation prism 430, so that the multiple laser beams reflected by the first optical path translation prism 430 are injected into the optical multiplexer.
  • 440 the optical multiplexer 440 is located in the emission direction of the reflected light of the first optical path translation prism 430, so that the multiple laser beams reflected by the first optical path translation prism 430 are injected into the optical multiplexer.
  • the optical isolator 440a is disposed on the third mounting surface 4130 recessed in the second mounting surface 4120.
  • the optical isolator 440a is located in the light emitting direction of the optical multiplexer 440, so that the composite light beam output by the optical multiplexer 440 passes through the optical isolator 440a. .
  • a through hole 4140 is provided at one end of the first emitting housing 401 facing away from the laser 410.
  • the through hole 4140 is connected to the installation cavity of the first emitting housing 401, so that the optical collimator 460 is inserted into the first emitting housing 410 through the through hole 4140.
  • the installation cavity of a transmitting housing 401 is such that the light incident surface of the optical collimator 460 and the light exit surface of the optical isolator 440a are arranged correspondingly, so that the composite light beam passing through the optical isolator 440a is injected into the optical collimator. 460 to emit the composite beam into the optical fiber 600.
  • the optical collimator 460 when the optical collimator 460 is inserted into the installation cavity of the first emission housing 401 through the through hole 4140, the optical collimator 460 is sealingly connected to the outer wall of the first emission housing 401, so that the light is collimated There is a sealing connection between the straightener 460 and the through hole 4140. In this way, after the first emission housing 401 is buckled on the front side of the circuit board 300, the installation cavity in the first emission housing 401 can be sealed with the help of the optical collimator 460. sex.
  • the UV curing glue and structural curing glue used for bonding and sealing are both epoxy resin glues.
  • This type of glue has good fluidity and high reliability, and can meet the requirement of stable operation in fluorinated liquids for a long time. requirements.
  • the semiconductor refrigerator, the laser 410, the collimating lens 420, the first optical path translation prism 430, and the optical multiplexer are combined through the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 arranged in steps.
  • the device 440 and the optical isolator 440a are fixed on the mounting surface of the inner cavity of the first emission housing 401 to form a space between the laser 410, the collimating lens 420, the first optical path translation prism 430, the optical multiplexer 440 and the optical isolator 440a.
  • the installation height difference is different, and the laser 410 with a relatively high installation height and the collimating lens 420 are arranged on the back side of the circuit board 300 through the installation through hole 320 on the circuit board 300, and the first optical path with a relatively low installation height is translated.
  • the prism 430, the optical combiner 440 and the optical isolator 440a are disposed on the front side of the circuit board 300, which can reduce the spatial overlap area between the light emitting component 400 and the circuit board 300.
  • the first launch housing 401 further includes a first top surface 4014 opposite to the first contact surface 4011, the first top surface 4014 facing the upper housing 201, and a directional structure is provided on the first top surface 4014.
  • a first vent hole 4013 extends from the first contact surface 4011.
  • the first vent hole 4013 is connected with the third mounting surface 4130 in the first launch housing 401, and the first vent hole 4013 is a tapered hole formed by the first The diameter of the tapered hole gradually decreases in the direction of the top surface 4014 toward the third mounting surface 4130, so that the first launch housing 401 can communicate with the outside world through the first vent hole 4013.
  • Figure 12 is a partially assembled cross-sectional view of a light emitting component and a circuit board in the optical module provided by an embodiment of the present disclosure.
  • the semiconductor refrigerator 460a is fixed on the first mounting surface 4110 of the first emission housing 401, so that the cooling surface of the semiconductor refrigerator 460a faces away from the first mounting surface 4110, and then the laser 410 is installed on the The laser substrate is placed on the cooling surface of the semiconductor refrigerator 460a, and then the collimating lens 420 is placed on the cooling surface of the semiconductor refrigerator 460a, and the collimating lens 420 is located in the light emitting direction of the laser 410; then the first optical path is translated by the prism 430 is fixed on the second mounting surface 4120, so that one end of the first optical path translation prism 430 is set in the light emitting direction of the laser 410; then the optical combiner 440 is fixed on the second mounting surface 4120, so that the first optical path translation prism 430 The reflected laser beam is injected into the optical multiplexer 440;
  • the light incident surface of the optical isolator 440a is arranged corresponding to the light output surface of the optical multiplexer 440.
  • the optical isolator The light exit surface of 440a is arranged corresponding to the light entrance surface of the light collimator 460.
  • the first emission housing 401 is turned over, and the laser 410 and collimating lens 420 on the first mounting surface 4110 and the first optical path translation prism 430 on the second mounting surface 4120 are embedded into the mounting through hole 320 on the circuit board 300 , so that the wiring surface height of the laser 410 is the same as the back surface of the circuit board 300, and then the first contact surface 4011 of the first emission housing 401 and the front surface of the circuit board 300 are bonded together, so that the second mounting surface 4120 is
  • the optical multiplexer 440 and the optical isolator 440a on the third mounting surface 4130 are located in the cavity formed by the first transmitting housing 401 and the front surface of the circuit board 300 .
  • the inner cavity of the emission cover 402 is arranged corresponding to the mounting through hole 320, and the contact surface of the emission cover 402 facing the back of the circuit board 300 is bonded to the back of the circuit board 300, so that the laser 410 located on the back of the circuit board 300, The collimating lens 420 and the first optical path translation prism 430 are placed in the cavity formed by the emission cover 402 and the back surface of the circuit board 300 .
  • the first contact surface 4011 and the front surface of the circuit board 300 are bonded together through UV curing glue and structural curing glue to realize the first contact surface 4011 of the first emission housing 401 and the front surface of the circuit board 300 sealing bonding.
  • the contact surface of the emission cover 402 facing the back of the circuit board 300 and the back of the circuit board 300 are bonded together through UV curing glue and structural curing glue to achieve sealing bonding between the emission cover 402 and the back of the circuit board 300 .
  • the first launch housing 401 is bonded to the front side of the circuit board 300
  • the launch cover 402 is bonded to the back side of the circuit board 300, thereby realizing the connection between the first launch housing 401, the circuit board 300 and the launch cover 402. Sealed assembly.
  • the first emission housing 401 is a relatively complete housing structure that can accommodate all optical and electrical components and form a complete sealing section.
  • the emission cover 402 located on the back of the circuit board 300 is designed as a simple cavity structure and also forms a complete sealing section.
  • the first launch housing 401, the circuit board 300 and the launch cover 402 form a sandwich structure, and the contact interface between the first launch housing 401 and the front of the circuit board 300 is glue-sealed, and the launch cover 402 and the circuit
  • the contact interface on the back side of the board 300 is sealed with glue, and then combined with the optical collimator 460 to form a complete sealed cavity structure.
  • the first launch housing 401, the circuit board 300 and the launch cover 402 form a sealed cavity, and after all sealing operations are completed, the first vent hole 4013 on the first launch housing 401 is closed to ensure that the first During the sealing process of the launch casing 401, the circuit board 300, and the launch cover 402, no air leakage holes will occur in all sealing areas due to air expansion.
  • the laser 410 emits a laser beam under the action of the driving current transmitted by the circuit board 300, and the laser beam is converted by the collimating lens 420 It is a collimated beam.
  • the collimated beam is reflected by the first optical path translation prism 430, so that the collimated beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300.
  • the reflected multi-channel collimated beam passes through the optical multiplexer 440. It is converted into a composite beam, and the composite beam directly passes through the optical isolator 440a and enters the optical collimator 460, and is transmitted to the optical fiber 600 through the optical collimator 460 to realize light emission.
  • a DSP chip 310 is provided on the front side of the circuit board 300.
  • the DSP chip 310 is used for high-frequency signal processing and transmits the high-frequency signal to the laser 410 to provide a signal for the laser 410 to emit a laser beam, so that Laser 410 generates signal light.
  • the front side of the circuit board 300 is provided with a high-frequency signal connection line from the DSP chip 310 to the jack end left for the light emitting component 400, so that the high-frequency signal transmitted from the golden finger end is processed by the DSP chip 310 Then it is transmitted to the light emitting component 400 via a high-frequency signal line.
  • a high-frequency signal via is provided under the Tx output pad of the DSP chip 310.
  • the high-frequency signal via penetrates the front and back of the circuit board 300.
  • the high-frequency signal via is The upper end of the via hole is electrically connected to the Tx output pad of the DSP chip 310, and the lower end of the high-frequency signal via hole is electrically connected to the high-frequency signal line laid on the back of the circuit board 300.
  • the high-frequency signal line is electrically connected to the laser 410 through wiring. connect.
  • the DSP chip 310 located on the front side of the circuit board 300 transmits the high-frequency signal on the circuit board 300 from the front side of the circuit board 300 to the back side of the circuit board 300 through the high-frequency signal line connected to its Tx output pad, so as to transmit the high-frequency signal to the back side of the circuit board 300 .
  • the signal is transmitted to the laser 410 located on the back side of the circuit board 300 to realize a high-frequency signal connection between the light emitting component 400 and the circuit board 300, so that the laser 410 emits signal light.
  • the circuit board 300 is provided with multiple high-frequency signal via holes, and the multiple high-frequency signal via holes are arranged on the right side of the mounting through hole 320 .
  • Each high-frequency signal via hole corresponds to the laser 410 one-to-one.
  • the connection is such that the high-frequency signal line connecting each high-frequency signal via hole is connected to the laser 410, and the high-frequency signal transmitted by the circuit board 300 is transmitted to the laser 410 to meet the high-frequency signal required by the light emitting component 400.
  • a DC signal line is also arranged on the back of the circuit board 300.
  • the DC signal line is electrically connected to the laser 410, and the bias current transmitted through the DC signal line drives the laser 410 to emit light.
  • the DC signal line that transmits the bias current can be led from the right side of the installation through hole 320 on the circuit board 300 by wiring.
  • the laser 410 can emit light after receiving the bias current transmitted by the DC signal line, and the high-frequency signal line After transmission to laser 410, laser 410 The high-frequency signal is modulated into the light beam, so that the laser 410 generates signal light.
  • the DC signal line that transmits the bias current can also be connected to the laser 410 from the upper and lower sides of the mounting through hole 320, that is, the DC signal line and the high frequency signal line connecting the laser 410 are located on different sides of the mounting through hole 320, so that both Interference between high-frequency signals and DC signals is avoided, and the routing of DC signals is also made shorter, thereby avoiding overcrowding of wiring in the circuit board 300 .
  • FIG. 13 is another partial assembly diagram of a light emitting component and a circuit board in the optical module provided by an embodiment of the present disclosure.
  • the first optical path translation prism 430 includes a first reflector 4310 and a second reflector 4320.
  • the first reflector 4310 is located in the light emitting direction of the laser 410, and the collimated beam output by the collimator lens 420 is emitted to the second reflector.
  • a reflector 4310 the collimated beam is reflected at the first reflector 4310 , the reflected collimated beam is reflected again at the second reflector 4320 , and the reflected collimated beam is located on the front side of the circuit board 300 .
  • the laser 410 emits a laser signal driven by the bias current and high-frequency signal transmitted by the circuit board 300.
  • a photodetector 330 is provided on the back of the circuit board 300.
  • the photodetector 330 is provided on the circuit board.
  • the left edge of the through hole 320 is installed on the board 300 , and the photosensitive surface of the photodetector 330 faces the light emitting direction of the laser 410 for collecting the forward light emitted by the laser 410 and sending the collected data to the circuit board 300
  • the photodetector 330 is located in the inner cavity of the emitting cover 402, so that the photodetector 330 is placed in the sealed cavity formed by the emitting cover 402 and the back of the circuit board 300 to ensure that the light emitting component 400 Tightness.
  • the light transmission characteristics of the reflective surface of the first reflector 4310 are used to cause a small part of the collimated light beam to leak through the first reflector 4310 and enter the photosensitive surface of the photodetector 330, so that the photodetector 330 Part of the beam can be received, thereby obtaining the emitted optical power of the laser 410 .
  • the first reflector 4310 of the first optical path translation prism 430 faces the light emitting direction of the laser 410, and is used to divide the laser beam generated by the laser 410 into two beams of light, one beam of light (usually accounting for 95% of the total power) It is reflected by the first reflector 4310 to the second reflector 4320 to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300. Another beam of light directly passes through the first reflector 4310 and enters the light detection The photosensitive surface of the laser 330 receives the laser beam emitted from the light output surface of the laser 410 through the photosensitive surface.
  • the photosensitive surface of the photodetector 330 can be flush with the inner wall of the mounting through hole 320 to facilitate positioning of the photodetector 330.
  • the central axis of the photosensitive surface of the photodetector 330 can be coincident with the central axis of the laser 410, and the photodetector 330 can be passed toward the side of the back of the circuit board 300.
  • Surface mounting technology SMT is mounted on the back of the circuit board 300 so that the light beam passing through the first reflector 4310 is incident into the photodetector 330 as much as possible.
  • each photodetector 330 is arranged corresponding to each laser 410, so that each photodetector 330 collects the laser beam emitted by each laser 410. Part of the light beam passes through the first reflecting mirror 4310, and the forward light power of the corresponding laser 410 is measured through a device electrically connected to the photodetector 330.
  • the photodetector 330 receives parallel light with a certain area, the assembly position accuracy of the photodetector 330 is low, and the assembly is easier. As long as the first optical path is translated, the light transmission range of the first reflector 4310 in the prism 430 is consistent with the light transmission range.
  • the photosensitive surfaces of the detector 330 only need to be aligned, so that the photodetector 330 can collect the laser beam that passes through the first reflecting mirror 4310 .
  • an anode is provided on the side where the photodetector 330 is connected to the back of the circuit board 300.
  • the anode can be directly welded or fixed to the ground on the circuit board 300 through conductive glue or other methods.
  • a cathode is provided on the side of the photodetector 330 facing away from the back of the circuit board 300. The cathode is electrically connected to the circuit board 300 through wiring, thereby realizing the electrical connection between the photodetector 330 and the circuit board 300.
  • the first top surface 4014 of the first emitting housing 401 in the light emitting assembly 400 is in contact with the upper housing 201; the laser 410 in the light emitting assembly 400 is passed through the high
  • the frequency signal line is connected to the DSP chip 310 signal on the front of the circuit board 300, the laser 410 transmits DC and high voltage signals on the circuit board 300.
  • a laser beam is generated under the driving of a frequency signal, so that the laser 410 will generate heat and the temperature will rise.
  • the luminous performance of the laser 410 is affected by temperature, so the laser 410 needs to work in a certain fixed temperature range, so the laser 410 needs to be placed on a semiconductor On the refrigerator 460a to ensure the operating temperature of the laser 410, the semiconductor refrigerator 460a will generate a large amount of heat during the cooling process, and this heat needs to be dissipated to ensure the cooling efficiency of the semiconductor refrigerator 460a.
  • the first emitting housing 401 can be made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the first emitting housing 401 and the area of the first top surface 4014 can be appropriately increased, so that the laser The heat generated by the operation of 410 and semiconductor refrigerator 460a can be transmitted to the upper housing 201 through the first emission housing 401, effectively improving the heat dissipation effect of the laser 410.
  • the first launch housing 401 needs to be made of tungsten copper or other metal materials with good thermal conductivity, and the mass and bottom surface area of the first launch housing 401 need to be appropriately increased, thereby increasing the size of the first launch housing 401
  • the contact area with the upper housing 201 further improves the heat dissipation efficiency of the light emitting component 400 .
  • a first thermal conductor may be provided between the first top surface 4014 of the first emission housing 401 and the inner surface of the upper housing 201. gasket, so that the heat of the first emission housing 401 is transferred to the first thermal conductive pad, and the first thermal conductive pad transmits the heat to the upper shell 201 to effectively improve the heat dissipation effect.
  • the first thermally conductive pad can be thermally conductive glue, which can not only stick the first top surface 4014 of the first emission housing 401 to the inner side of the upper housing 201 through the thermally conductive glue, but also can paste the first emitter The heat of the housing 401 is conducted to the upper housing 201 .
  • the main heat source of the optical module is the DSP chip 310.
  • the DSP chip 310 is in contact with the upper case 201 on the side facing away from the circuit board 300. In this way, the DSP chip 310 The heat generated by the operation of 310 is transferred to the upper housing 201 to transfer the heat generated by the DSP chip 310 to the outside of the optical module.
  • a second thermal pad can be provided between the DSP chip 310 and the inner side of the upper case 201, so that the heat generated by the DSP chip 310 is transferred to the second thermal pad.
  • the second thermal pad transfers heat to the upper case 201 to effectively improve the heat dissipation effect.
  • the light receiving component 500 and the light emitting component 400 can be disposed side by side on the circuit board 300 , and the light receiving component 500 and the circuit board 300 form a closed cavity structure to achieve a sealed assembly of the light receiving component 500 .
  • FIG. 14 is a schematic diagram of the flipped structure of a light receiving component in the optical module provided by an embodiment of the present disclosure.
  • FIG. 15 is a schematic structural diagram of a light receiving component in the optical module provided by an embodiment of the present disclosure from another angle.
  • the light receiving component 500 provided by the embodiment of the present disclosure includes a receiving housing 501a, which is buckled on the front side of the circuit board 300 and is sealingly connected to the front side of the circuit board 300;
  • the receiving housing 501a includes a second contact surface 5011 facing the circuit board 300 and a second top surface 5140 facing away from the circuit board 300.
  • the second contact surface 5011 is provided with a mounting groove 5120, and the mounting groove 5120 faces the front of the circuit board 300.
  • An opening is provided at one end, and the mounting groove 5120 extends from the second contact surface 5011 toward the second top surface 5140 .
  • the wavelength splitter 520, the lens array 530, the reflecting prism 540 and the receiving light collimator 550 are disposed in the mounting groove 5120 of the receiving housing 501a.
  • One end of the receiving light collimator 550 is inserted into the mounting groove 5120 of the receiving housing 501a.
  • the other end is sealedly connected to the optical fiber 600, and the other end of the optical fiber 600 is connected to the optical fiber adapter 700, so that the external optical signal is injected into the optical fiber 600 through the optical fiber adapter 700, and is transmitted to the receiving light collimator 550 through the optical fiber 600, and passes through the receiving light collimator 550 is transferred to the installation slot 5120.
  • the connection between the outer side of the receiving light collimator 550 and the outer side wall of the receiving housing 501a is sealed by sealant. , to ensure the sealed connection between the receiving light collimator 550 and the receiving housing 501a.
  • the light exit surface of the receiving light collimator 550 is arranged corresponding to the light entrance surface of the wavelength splitter 520.
  • the light-emitting surface of the wave device 520 is arranged corresponding to the light-incident surface of the lens array 530
  • the light-emitting surface of the lens array 530 is arranged corresponding to the reflecting prism 540 .
  • the received light transmitted to the receiving light collimator 550 through the optical fiber 600 is transmitted to the demultiplexer 520, and the demultiplexer 520 demultiplexes one received light into multiple split beams, and the multiple split beams are respectively emitted to the lens array 530.
  • the multiplexed beams are respectively transmitted to the reflective prism 540 through the lens array 530
  • the reflective prism 540 reflects the multiplexed beams to the receiving chip on the circuit board 300 to achieve light reception.
  • the second contact surface 5011 of the receiving housing 501a is bonded and fixed. to the front side of the circuit board 300 .
  • the second contact surface 5011 is bonded to the front of the circuit board 300 through UV curing glue and structural curing glue, thereby achieving a sealed assembly between the receiving housing 501a and the front of the circuit board 300.
  • the receiving shell 501a places the receiving chip, the transimpedance amplifier and the safe area required for wiring on the front side of the circuit board 300 into the installation slot 5120 through the opening, and makes the The receiving chip is located below the reflective prism 540, which ensures that the split light beams reflected by the reflective prism 540 are directed to the receiving chip to achieve photoelectric conversion.
  • the second top surface 5140 of the receiving housing 501a faces the upper housing 201.
  • the second top surface 5140 is provided with a second vent hole 5013 extending toward the second contact surface 5011.
  • the second vent hole 5013 It is connected with the mounting groove 5120 of the receiving housing 501a, and the second air release hole 5013 is a tapered hole. The diameter of the tapered hole gradually decreases from the second top surface 5140 to the second contact surface 5011. In this way, the receiving housing 501a can communicate with the outside world through the second vent hole 5013.
  • Figure 16 is a partially assembled cross-sectional view of a light receiving component and a circuit board in the optical module provided by an embodiment of the present disclosure. As shown in Figure 16, insert the receiving light collimator 550 into the receiving housing 501a, and then install the demultiplexer 520 into the installation groove 5120 of the receiving housing 501a, so that the light incident surface of the demultiplexer 520 is in contact with the received light.
  • the light-emitting surface of the collimator 550 is set correspondingly; and then the lens array 530 is installed into the installation groove 5120 of the receiving housing 501a, so that the light-incident surface of the lens array 530 and the light-emitting surface of the wavelength splitter 520 are set correspondingly; and then the The reflective prism 540 is installed on the light exit surface of the lens array 530; then the receiving housing 501a is installed in reverse to the front of the circuit board 300, and the second contact surface 5011 of the receiving housing 501a is bonded to the front of the circuit board 300. , so that the receiving housing 501a covers the receiving chip and TIA on the circuit board 300, and the reflecting prism 540 is located directly above the receiving chip.
  • the external optical signal transmitted by the optical fiber is transmitted to the receiving optical collimator 550, and the optical signal is injected into the splitter 520 through the receiving optical collimator 550, and one beam is demultiplexed into multiple split beams through the splitter 520.
  • the multiplexed beams are converted into multiplexed beams through the lens array 530.
  • the multiplexed beams are reflected by the reflecting prism 540.
  • the reflected multiplexed beams are respectively injected into the receiving chip on the circuit board 300, and the optical signal is transmitted through the receiving chip.
  • Converted into electrical signals the converted electrical signals are amplified by TIA, and the amplified electrical signals are transmitted to the DSP chip 310.
  • the electrical signals are processed by the DSP chip 310 and then transmitted to the host computer through the golden finger, thereby realizing light reception.
  • the method of sealing and packaging the light emitting component 400 and the light receiving component 500 is not limited to the packaging method described in the above embodiments.
  • the emitting shell of the light emitting component 400 can also be formed into an independent shell.
  • the circuit board 300 is extended into the gap of the emitting housing, so that the circuit board 300 and the light emitting component 400 together form a part of the closed housing.
  • Figure 17 is a schematic diagram of the assembly of another light emitting component, a light receiving component, a circuit board and an optical fiber in an optical module provided by an embodiment of the present disclosure.
  • Figure 18 is a schematic diagram of another light emitting component and an optical fiber in an optical module provided by an embodiment of the present disclosure. Partial assembly diagram of the circuit board.
  • the light emitting component 400 adopts a front-up (formal installation) light emitter structure, so that the front side of the light emitting component 400 is in contact with the upper housing 201; a bundle of optical fibers 600 is connected to the light emitting component 400 , the emission beam emitted by the light emitting component 400 is transmitted through the optical fiber 600 to realize light emission.
  • the light receiving component 500 and the light emitting component 400 are arranged on the same side of the circuit board 300.
  • Another bundle of optical fibers 600 is connected to the light receiving component 500.
  • the external optical signal is transmitted to the light receiving component 500 through the optical fiber 600, and photoelectricity is performed through the light receiving component 500. conversion to achieve light reception.
  • Figure 19 is a schematic structural diagram of another circuit board in an optical module provided by an embodiment of the present disclosure. As shown in Figure 19, the present disclosure digs holes in the circuit board 300, embeds the light emitting component 400 in the hole on the circuit board 300, and inserts the circuit board 300 into the hole. Extending into the notch of the light emitting component 400, the circuit board 300 and the light emitting component 400 together form a part of the closed housing.
  • the circuit board 300 is provided with a jack 340, which penetrates the circuit board 300, and is provided with an opening on one side of the jack 340 (the upper side shown in Figure 19), so that the jack 340 forms a U. hole.
  • the outer edge of the light emitting component 400 is provided with a card slot. The light emitting component 400 is inserted into the jack 340 through the card slot. That is, the left edge of the jack 340 extends into the left card slot of the light emitting component 400.
  • the jack 340 The right edge of the jack 340 extends into the right card slot of the light emitting component 400, the lower edge (shown in Figure 19) of the jack 340 extends into the front side (shown in Figure 18) of the light emitting component 400, and Viewed from the upper side of the circuit board 300 (shown in FIG. 19 ), the rear side wall (shown in FIG. 18 ) of the light emitting component 400 can be seen.
  • FIG 20 is a schematic structural diagram of another light emitting component in the optical module provided by an embodiment of the present disclosure.
  • the light emitting assembly 400 includes a second emitting housing 404.
  • the second emitting housing 404 includes a top surface 4041 facing the upper housing 201; the inner cavity of the second emitting housing 404 includes a mounting groove.
  • the top surface of is provided with an opening, and the top surface where the opening is located is the same surface as the top surface 4041 of the second launch housing 404 . That is, the top surface 4041 of the second launch housing 404 is provided with an opening, and the opening is connected with the installation groove in the inner cavity of the second launch housing 404 .
  • the second launch housing 404 also includes an upper cover plate 403 that covers the opening side of the installation groove, so that the upper cover plate 403 and the second launch housing 404 form a cavity structure.
  • UV curing glue and structural curing glue can be used to bond and seal the upper cover 403 and the second emission housing 404.
  • a card slot 406 is also provided on the outer wall of the second launch housing 404.
  • the second launch shell 404 is inserted into the jack 340 of the circuit board 300 through the card slot 406, and the upper side of the card slot 406 is located on the circuit board 300.
  • the lower side of the card slot 406 is located on the back side of the circuit board 300 .
  • the second launch housing 404 is fixed on the circuit board 300 through the slot 406 to achieve the fixation of the second launch housing 404 and the circuit board 300 .
  • the length dimension of the upper part of the card slot 406 in the left-right direction is greater than the length dimension of the lower part of the card slot 406 in the left-right direction.
  • the length dimension of the card slot 406 in the left-right direction may be equal to or smaller than the length dimension of the card slot 406 .
  • the length dimension of the lower part in the left-right direction makes the second launch housing 404 form a shape with a narrow middle part and wide side parts, so as to facilitate the insertion of the second launch housing 404 into the jack 340 .
  • the second emission housing 404 is inserted into the jack 340 of the circuit board 300 through the slot 406, and the optical device of the light emission assembly 400 is set in the installation slot in the inner cavity of the second emission housing 404, and then The upper cover 403 is covered on the integrated structure, so that the upper cover 403, the second launch housing 404 and the circuit board 300 form a complete sealed cavity.
  • the upper cover 403 is provided with a third air release hole 4031 , and the third air release hole 4031 is connected with the installation groove of the second launch housing 404 .
  • the third vent hole 4031 is closed after all sealing operations are completed to ensure that no leak holes will occur in all sealing areas due to air expansion during the sealing process.
  • the third vent hole 4031 may be a tapered hole. The diameter of the tapered hole gradually decreases from the top to the bottom of the upper cover 403, so that the second launch housing 404 can communicate with the outside world through the third vent hole 4031. Connected.
  • FIG. 21 is a schematic structural diagram of another emitting housing in an optical module provided by an embodiment of the present disclosure.
  • FIG. 22 is a schematic structural diagram of another emitting housing in an optical module provided by an embodiment of the present disclosure from another angle.
  • the outer outer wall of the lower side of the second launch housing 404 includes a first side 4051, a second side 4052, a third side 4053 and a fourth side 4054.
  • the first side 4051 and the fourth side 4054 The second side 4052 and the third side 4053 are arranged oppositely, and the first side 4051 is arranged correspondingly to the lower side of the jack 340 (the lower side shown in Figure 19), and the second side 4052 is opposite to the left side of the jack 340.
  • the circuit boards are arranged correspondingly, the third side 4053 is arranged correspondingly to the circuit board on the right side of the jack 340 , and the fourth side 4054 is arranged correspondingly to the opening of the jack 340 .
  • the slot 406 includes a first groove 4061, a second groove 4062 and a third groove 4063.
  • the first groove 4061 is provided on the first side 4051
  • the second groove 4062 is provided on the second side.
  • a third groove 4063 is provided on the third side 4053.
  • the first groove 4061, the second groove 4062 and the third groove 4063 all open toward the outside of the second launch housing 404, and one end of the first groove 4061 is connected to the second groove 4062, and the other end is connected to the third groove 4061.
  • the grooves 4063 are connected. In this way, the card slot 406 is the first groove 4061, the second groove 4062 and the third groove 4063.
  • a U-shaped groove is formed.
  • the second launch housing 404 when the second launch housing 404 is inserted into the jack 340 of the circuit board 300 through the slot 406, the three sides of the jack 340 are inserted into the first groove 4061, the second groove 4062 and the third groove respectively. 4063 to support and fix the second launch housing 404 through the circuit board 300 .
  • the light emitting assembly 400 When inserting the light emitting assembly 400 into the jack 340, first move the first side 4051 of the second emitting housing 404 toward the opening of the jack 340, and then move the second emitting housing 404 inward so that the circuit on the lower side of the jack 340
  • the board extends into the first groove 4061
  • the left circuit board of the jack 340 extends into the second groove 4062
  • the right circuit board of the jack 340 extends into the third groove 4063
  • the fourth side 4054 passes through the plug.
  • the upper side opening of hole 340 is exposed.
  • the front surface of the circuit board 300 is in contact with the first groove 4061, the second groove 4061, and the third groove 4063.
  • the upper side walls of the groove 4062 and the third groove 4063 are bonded to achieve fixation of the circuit board 300 and the second launch housing 404 .
  • the back side of the circuit board 300 is bonded to the first groove 4061, the second groove 4062.
  • the lower side walls of the third groove 4063 can be bonded together, that is, the thickness of the circuit board 300 is consistent with the dimensions of the first groove 4061, the second groove 4062, and the third groove 4063 in the up and down directions, so that The installation sealing performance of the circuit board 300 and the second launch housing 404 is ensured.
  • the installation grooves inside are not connected, which does not affect the installation sealing of the circuit board 300 and the second launch housing 404.
  • FIG. 23 is an exploded structural diagram of another light emitting component in the optical module provided by an embodiment of the present disclosure.
  • a gap 4042 is provided at one end of the installation groove in the second launch housing 404.
  • the gap 4042 faces away from the fiber optic adapter 700, and the circuit board 300 on the right side of the jack 340 (shown in Figure 19) extends into the gap. 4042, and the circuit board 300 is sealingly connected to the notch 4042, so that the circuit board 300 is electrically connected to the light emitting device in the second emitting housing 404.
  • a semiconductor refrigerator 460a is provided at one end of the installation groove with a notch 4042.
  • a laser 410 and a collimating lens 420 are provided on the cooling surface of the semiconductor refrigerator 460a.
  • the collimating lens 420 is provided in the light emitting direction of the laser 410.
  • the laser 410 is electrically connected to the circuit board 300 extending into the notch 4042 through wiring.
  • the height of the wiring surface of the laser 410 is at the same height as the front of the circuit board 300. In this way, the wiring connecting the circuit board 300 and the laser 410 is the shortest. Guarantee excellent high frequency transmission performance.
  • the light output height of the laser 410 is approximately the same as the front surface of the circuit board 300 , and the laser beam can be moved upward above the circuit board 300 through a beam translation prism to reduce the digging area on the circuit board 300 and also make the The structure of the hole is rectangular, which facilitates glue sealing at the contact position between the light emitting component 400 and the circuit board 300 .
  • a second optical path translation prism 480 is also provided in the installation groove of the second emission housing 404.
  • the second optical path translation prism 480 is arranged in the light emitting direction of the laser 410.
  • the laser beam emitted by the laser 410 is converted by the collimating lens 420. It is a collimated light beam.
  • the collimated light beam reflects the collimated light beam located on the front of the circuit board 300 to above the front of the circuit board 300 through the second optical path translation prism 480 .
  • the function of the second optical path translation prism 480 is to translate the laser beam upward by a certain distance, so that all subsequent optical devices are located on the upper side of the front of the circuit board 300 and maintain an appropriate gap with the circuit board 300 . In this way, the positional conflict between the optical device and the circuit board 300 is avoided, thereby reducing the hole digging area of the circuit board 300 as much as possible, increasing the arrangement area of the electrical devices on the circuit board 300, and making the wiring of the circuit board 300 easier. much easier.
  • the light emitting component 400 further includes a light collimator 460 , the light incident surface of the light collimator 460 is disposed corresponding to the light exit surface of the second optical path translation prism 480 .
  • One end of the optical collimator 460 is inserted into the installation groove of the second emission housing 404, and the other end is sealedly connected to the optical fiber 600.
  • the optical collimator 460 realizes the sealed connection between the optical fiber 600 and the second emission housing 404. In this way, the laser beam reflected and moved upward by the second optical path translation prism 480 is injected into the optical collimator 460 , and then coupled into the optical fiber 600 through the optical collimator 460 .
  • the light emitting component 400 further includes an optical isolator 440a.
  • the light incident surface of the optical isolator 440a is arranged corresponding to the light exit surface of the second optical path translation prism 480.
  • the light exit surface of the optical isolator 440a is aligned with the light collimator.
  • the light incident surface of the detector 460 is arranged correspondingly. In this way, the upward-moving laser beam reflected by the second optical path translation prism 480 directly passes through the optical isolator 440a.
  • the laser beam is incident into the optical collimator 460; when the reflected laser beam is reflected on the light incident surface of the optical collimator 460, the optical isolator 440a is used to isolate the reflected beam to prevent the reflected beam from returning to the laser 410 along the original path.
  • part of the installation slots in the second launch housing 404 is located on the back side of the circuit board 300, and the other part of the installation slots is located on the back side of the circuit board 300.
  • the front side of the circuit board 300 is located on the back side of the circuit board 300.
  • the light emitting component 400 may include multiple lasers 410 to achieve emission of multiple emission beams. Based on this, the light emitting assembly 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, an optical combiner 440, a second optical path translation prism 480, an optical isolator 440a and an optical collimator 460, and more A laser 410 and a plurality of collimating lenses 420 are installed in the installation groove located on the back side of the circuit board 300.
  • the optical combiner 440, the second optical path translation prism 480, and the optical isolator 440a are installed in the installation groove located on the front side of the circuit board 300. , the laser beam located on the front side of the circuit board 300 is moved upward through the second optical path translation prism 480 .
  • FIG. 24 is a schematic structural diagram of another launch housing provided by an embodiment of the present disclosure
  • FIG. 25 is a schematic structural diagram of another launch housing provided by an embodiment of the present disclosure from another angle.
  • the installation groove in the second emission housing 404 includes a fourth The mounting surface 4045, the fifth mounting surface 4044 and the sixth mounting surface 4043 are connected.
  • the fourth mounting surface 4045 is connected with the gap 4042.
  • the fourth mounting surface 4045 is recessed in the fifth mounting surface 4044, and the fifth mounting surface 4044 is recessed in the sixth mounting surface. surface 4043, so that the fourth mounting surface 4045, the fifth mounting surface 4044 and the sixth mounting surface 4043 form a step surface.
  • the fourth mounting surface 4045 is located on the back side of the circuit board 300
  • both the fifth mounting surface 4044 and the sixth mounting surface 4043 are located on the front side of the circuit board 300 .
  • the fourth mounting surface 4045 and the lower side wall of the third groove 4063 may be on the same plane, so that the opposite side walls of the third groove 4063 are both provided with gaps through which the circuit board 300 extends. into the installation groove of the second launch housing 404.
  • a through hole can be provided on the upper side wall of the third groove 4063, and the through hole is connected up and down with the notch 4042. In this way, after the circuit board 300 extends into the notch 4042, the inserted circuit board 300 can pass through the through hole.
  • the holes are exposed to facilitate the installation of electrical components, wiring, etc. on the exposed portion of the circuit board 300, so as to facilitate the wiring connection between the circuit board 300 and the laser 410.
  • the fourth mounting surface 4045 can be flush with the back of the circuit board 300.
  • the fourth mounting surface 4045 can be bonded and fixed with the back of the circuit board 300; fourth installation
  • the surface 4045 can also be recessed in the back of the circuit board 300 so that there is a gap between the back of the circuit board 300 and the fourth mounting surface 4045 .
  • a seventh mounting surface 4046 that is recessed downward is provided on the fourth mounting surface 4045.
  • the seventh mounting surface 4046 is recessed from the fourth mounting surface 4045 in the direction of the downward housing 202, and the seventh mounting surface 4046 is in the left-right direction.
  • the size is smaller than the size of the fourth mounting surface 4045 in the left-right direction, so that the seventh mounting surface 4046 is also located on the back side of the circuit board 300 .
  • the semiconductor refrigerator 460a is disposed on the seventh mounting surface 4046, and the side wall of the semiconductor refrigerator 460a facing the notch 4042 can be in contact with the connection surface between the fourth mounting surface 4045 and the seventh mounting surface 4046 to reduce the risk of The distance between the semiconductor refrigerator 460a and the circuit board 300 extending into the notch 4042.
  • the laser 410 and the collimating lens 420 are arranged on the cooling surface of the semiconductor refrigerator 460a in sequence. Since the seventh mounting surface 4046 is recessed in the fourth mounting surface 4045, the semiconductor refrigerator 460a, the laser 410 and the collimating lens 420 are arranged on After the seventh mounting surface 4046 , the height of the wiring surface of the laser 410 can be the same as that of the front surface of the circuit board 300 .
  • the optical multiplexer 440 is disposed on the fifth mounting surface 4044, and the light incident surface of the optical multiplexer 440 is disposed corresponding to the light exit surface of the collimating lens 420, so that the collimated light beam output by the collimating lens 420 can be injected into the optical multiplexer. 440, in this way, the collimated beam is combined in the optical combiner 440.
  • One end of the second optical path translation prism 480 is disposed on the fifth mounting surface 4044, and the other end protrudes from the sixth mounting surface 4043.
  • the composite light beam output by the optical combiner 440 is upward under the action of a reflector of the second optical path translation prism 480. Reflection, the reflected composite beam is reflected to the left under the action of another reflector, so that it will be flush with the front of the circuit board 300 The composite beam reflection moves upward to the front of the circuit board 300 .
  • the end of the second emission housing 404 facing away from the notch 4042 is provided with a light-transmitting hole 4047.
  • the light-incident surface of the optical collimator 460 is inserted into the second emission housing 404 through the light-transmitting hole 4047, and the light-incident surface of the optical collimator 460 is inserted into the second emission housing 404.
  • the installation height is higher than the sixth installation surface 4043.
  • the optical isolator 440a is disposed on the sixth mounting surface 4043, so that the reflected light beam output by the second optical path translation prism 480 directly passes through the optical isolator 440a and enters the optical collimator 460.
  • the optical collimator 460 is sealingly connected to the outer side wall of the second emission housing 404 to allow light to pass through.
  • the collimator 460 achieves sealing of the installation groove in the second launch housing 404 .
  • FIG. 26 is a partial structural schematic diagram of another light emitting component in an optical module provided by an embodiment of the present disclosure.
  • FIG. 27 is a cross-sectional view of another light emitting component in an optical module provided by an embodiment of the present disclosure.
  • the semiconductor refrigerator 460a is fixed on the seventh mounting surface 4046 of the second emission housing 404, and then the laser substrate mounted with the laser 410 is placed on the cooling surface of the semiconductor refrigerator 460a.
  • the detector 440 is fixed on the fifth mounting surface 4044, so that the multiple laser beams emitted by the plurality of lasers 410 are combined in the optical multiplexer 440; and then the second optical path translation prism 480 is fixed on the fifth mounting surface 4044, so that One end of the second optical path translation prism 480 is arranged in the light emitting direction of the optical multiplexer 440; and then the optical isolator 440a is installed on the sixth mounting surface 4043, so that the composite beam reflected by the other end of the second optical path translation prism 480 passes through the light.
  • the composite light beam passing through the optical isolator 440a is injected into the optical fiber 600 through the optical collimator 460; then the upper cover 403 is bonded and closed to the opening side of the top surface of the installation groove in the second launch housing 404 , so that the upper cover 403 and the second launch housing 404 together form a part of the closed housing.
  • FIG. 28 is a partial assembly cross-sectional view of another light emitting component and a circuit board in an optical module according to an embodiment of the present disclosure. As shown in Figure 28, insert the second launch housing 404 into the jack 340 of the circuit board 300 through the card slot 406, so that the circuit board on the left side of the jack 340 (shown in Figure 18) is inserted into the second launch housing 404.
  • the back of the circuit board 300 inserted into the notch 4042 can be flush with the fourth mounting surface 4045 of the second launch housing 404; the right and front sides of the jack 340 are inserted into the second groove 4062 of the card slot 406 , in the first groove 4061, so as to achieve a fixed connection between the circuit board 300 and the second launch housing 404 through the slot 406.
  • the semiconductor refrigerator 460a is fixed on the seventh mounting surface 4046, and the laser 410 and the collimating lens 420 are fixed on the cooling section of the semiconductor refrigerator 460a.
  • the optical combiner 440 and the second optical path translation prism 480 are then fixed on the fifth mounting surface 4044, and then the optical isolator 440a is fixed on the sixth mounting surface 4043.
  • the high-frequency signal transmitted from the gold finger end is processed by the DSP chip 310, and then transmitted to the laser 410 through the high-frequency signal lines and wiring laid on the front of the circuit board 300, driving multiple lasers 410 to emit multiple laser beams.
  • the laser beam is converted into multiple collimated beams through multiple collimating lenses 420; the multiple collimated beams are combined into one composite beam through the optical combiner 440, and the composite beam is reflected by the second optical path translation prism 480 and moves up to the front of the circuit board 300 On the upper side, the reflected composite light beam directly passes through the optical isolator 440a and is injected into the optical collimator 460, and then is injected into the optical fiber 600 through the optical collimator 460, thereby realizing the emission of multiple light beams through a bundle of optical fibers.
  • the DSP chip 310 is disposed on the front side of the circuit board 300 , and the wiring surface height of the laser 410 is the same as the front side of the circuit board 300 . Therefore, the DSP chip 310 to the jack 340 is arranged on the front side of the circuit board 300 . High-frequency signal connection line, the circuit design on this side is only for the high-frequency signal transmitted from the gold finger end to be processed by the DSP chip 310 and then transmitted to the laser 410 through the high-frequency signal line.
  • the light emitting assembly 400 shown in the embodiment of the present disclosure consists of a light emitter assembly, an upper cover 403, and a second emitting housing 404.
  • the upper cover 403 and the second emitting housing 404 together form a housing with a gap at one end.
  • the circuit board 300 extends into the gap in the housing, so that the circuit board 300, the upper cover 403, and the second emission housing 404 together form a part of the closed housing, and then cooperate with the optical collimator 460 to form a complete closed cavity structure. .
  • the upper cover 403 and the second launch housing 404 need to be made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the second launch housing 404 and the area of the upper cover 403 need to be appropriately increased. thereby increasing the upper cover
  • the contact area between the plate 403 and the upper housing 201 further improves the heat dissipation efficiency of the light emitting component 400 .
  • the top surface 4041 of the second emitting housing 404, the top surface of the upper cover 403 and the inside of the upper housing 201 can be A thermal pad is provided between the sides, so that the heat of the second emission housing 404 is transmitted to the thermal pad, and the thermal pad transmits the heat to the upper shell 201 to effectively improve the heat dissipation effect.
  • the light receiving component 500 and the light emitting component 400 can be disposed side by side on the same surface of the circuit board 300, that is, the light receiving component 500 is disposed on the front side of the circuit board 300, located on one side of the jack 340;
  • the component 500 and the light emitting component 400 can also be disposed on different surfaces of the circuit board 300 , that is, the light receiving component 500 is disposed on the back of the circuit board 300 .
  • Figure 29 is a schematic assembly diagram of the circuit board, light emitting component and light receiving component in the optical module provided by the embodiment of the present disclosure.
  • the optical module provided by the embodiment of the present disclosure includes a light transmitting component 400, a transmitting fiber array 810, a light receiving component 500, and a receiving fiber array 820.
  • the light transmitting component 400 adopts a bottom-up (flip-chip) light transmitter.
  • the emitting fiber array 810 is connected to the light emitting component 400, and the emitting beam emitted by the light emitting component 400 passes through the emitting fiber
  • the array 810 is transmitted to the optical fiber 600, and then transmitted out through the optical fiber 600, thereby realizing the emission of light.
  • the light receiving component 500 and the light transmitting component 400 can be disposed on the same side of the circuit board 300.
  • the receiving optical fiber array 820 is connected to the light receiving component 500.
  • the external optical signal is transmitted to the receiving optical fiber array 820 through the optical fiber 600, and then transmitted through the receiving optical fiber array 820.
  • photoelectric conversion is performed through the light receiving component 500, thereby realizing light reception.
  • the main optical path of the light emitting component 400 is located on a single plane, so the circuit board 300 needs to dig out a large area to avoid the required positions of the light emitting component 400 and the optical fiber, which results in a large hole in the circuit board 300 , and the complex shape of the holes not only greatly reduces the arrangement space of electronic components, but also makes it difficult to apply glue and seal.
  • holes are dug in the circuit board 300, the laser in the light emitting assembly 400 is placed on the back side of the circuit board 300, and an optical path translation prism is added in the light emitting direction of the laser so that the entire optical path moves to the front side of the circuit board. This can reduce the digging area on the circuit board 300 and facilitate sealing of the light emitting component 400 on the back side of the circuit board 300 .
  • FIG. 30 is a schematic diagram of the flipped structure of the light emitting component in the optical module provided by the embodiment of the present disclosure.
  • FIG. 31 is a schematic diagram of the partial assembly of the circuit board and the light emitting component in the optical module provided by the embodiment of the present disclosure from another angle.
  • the light emitting component 400 may include a first emitting housing 401 and a laser 410 disposed in the first emitting housing 401, a coupling lens 420a, a first optical path translation prism 430, and an optical isolator 440a.
  • the launch fiber array assembly 450a With the launch fiber array assembly 450a, the bottom surface of the first launch housing 401 (the surface facing away from the front of the circuit board 300) faces the upper housing 201.
  • the first launch housing 401 includes an installation inner cavity.
  • the laser 410, the coupling lens 420a, the first optical path translation prism 430, the optical isolator 440a and the launch fiber array assembly 450a are all installed in the installation cavity of the first launch housing 401.
  • the installation height of the laser 410, the coupling lens 420a and the first optical path translation prism 430 is higher than the installation height of the optical isolator 440a and the emitting fiber array assembly 450a, so that the laser 410, the coupling lens 420a and the first optical path translation prism 430 pass through the circuit board 300
  • the mounting through hole 320 is located on the back side of the circuit board 300, and the optical isolator 440a and the emitting fiber array assembly 450a are located on the front side of the circuit board 300.
  • the installation cavity in the first launch housing 401 is provided with an opening at one end toward the front of the circuit board 300, and the installation cavity is connected to the mounting through hole 320 on the circuit board 300 through the opening, so that the installation cavity is
  • the laser 410 in the inner cavity can be embedded in the mounting through hole 320 through the opening, so that the wiring installation height of the laser 410 is the same as the back surface of the circuit board 300 .
  • a laser beam emitted by the laser 410 is converted into a collimated beam through the coupling lens 420a.
  • the collimated beam reflects the collimated beam located on the back side of the circuit board 300 to the front side of the circuit board 300 through the first optical path translation prism 430.
  • the first optical path The laser beam reflected by the translation prism 430 directly enters the emission fiber array assembly 450a through the optical isolator 440a, and is transmitted to the optical fiber 600 through the emission fiber array 810 derived from the emission fiber array assembly 450a, and then transmitted to the optical fiber adapter 700 via the optical fiber 600. Realize the transmission of all the optical signals.
  • the entire optical path is moved to the electrical Above the front of the circuit board 300, the digging area of the circuit board 300 can be reduced, and it is also convenient to seal the light emitting component 400 on the back of the circuit board 300.
  • the optical transmitting component 400 includes 4 optical transmitters to achieve 4 optical transmitters. Emission of the transmitting beam; the light receiving component 500 includes 4 optical receivers to realize the reception of the 4 receiving beams.
  • the light emitting assembly 400 includes a plurality of lasers 410, a plurality of coupling lenses 420a, a first optical path translation prism 430, an optical isolator 440a and a emitting fiber array assembly 450a disposed in the first emitting housing 401.
  • the multiple lasers 410 are a plurality of lasers 410, a plurality of coupling lenses 420a, a first optical path translation prism 430, an optical isolator 440a and a emitting fiber array assembly 450a disposed in the first emitting housing 401.
  • a plurality of coupling lenses 420a, the first optical path translation prism 430, the optical isolator 440a and the transmitting fiber array assembly 450a are all installed in the installation cavity of the first transmitting housing 401, and the laser 410, the coupling lens 420a and the first
  • the installation height of the optical path translation prism 430 is higher than the installation height of the optical isolator 440a and the transmitting optical fiber array assembly 450a.
  • the plurality of lasers 410 and the plurality of coupling lenses 420a are located on the back side of the circuit board 300 through the mounting through holes 320.
  • One end of the first optical path translation prism 430 is located on the back side of the circuit board 300 through the mounting through holes 320, and the other end is located on the circuit board 300.
  • the optical isolator 440 a and the emitting fiber array assembly 450 a are both located on the front side of the circuit board 300 .
  • the plurality of lasers 410 emit multiple laser beams, and the laser beams are parallel to the back of the circuit board 300; the plurality of coupling lenses 420a convert the laser beams emitted by the lasers 410 into condensed beams, and the plurality of condensed beams are transmitted to the first optical path translation prism 430 , the first optical path translation prism 430 reflects the laser beam located on the back side of the circuit board 300 and moves it upward to the front side of the circuit board 300 .
  • the function of the first optical path translation prism 430 is to translate the multi-path light beam upward for a certain distance, so that all subsequent optical devices are located on the front side of the circuit board 300 and maintain an appropriate gap with the circuit board 300 . In this way, the positional conflict between the optical device and the circuit board 300 is avoided, thereby reducing the hole digging area of the circuit board 300 as much as possible, increasing the arrangement area of the electronic devices on the circuit board 300, and making the wiring of the circuit board 300 easier. much easier.
  • the first optical path translation prism 430 there is a gap between the first optical path translation prism 430 and the light incident surface of the emitting optical fiber array component 450a.
  • the composite beam will be reflected when it is transmitted to the light incident surface of the emitting fiber array component 450a.
  • the reflected beam may return to the laser 410 along its original path, affecting the high-frequency performance of the laser 410.
  • the optical isolator 440a is provided between the first optical path translation prism 430 and the emitting optical fiber array assembly 450a.
  • the optical isolator 440a is used to isolate the reflected beam and prevent the reflected beam from returning to the laser 410 along the original path.
  • FIG. 32 is a schematic assembly diagram of the emitting fiber array component and the optical isolator in the optical module provided by the embodiment of the present disclosure.
  • FIG. 33 is a partially exploded schematic diagram of the emitting fiber array component and the optical isolator in the optical module provided by the embodiment of the present disclosure.
  • the launch fiber array assembly 450a includes a V-groove substrate 4510, a glass cover plate 4520 and a support plate 4530.
  • the V-groove substrate 4510 is fixed in the installation cavity of the first launch housing 401, and There are multiple rows of V-shaped grooves 4540 arranged in parallel on the V-shaped groove substrate 4510.
  • Each optical fiber of the emitting optical fiber array 810 is embedded in the corresponding V-shaped groove 4540. Then the glue will naturally fill the contact surface between the V-shaped groove 4540 and the optical fiber. .
  • the glass cover 4520 is covered on the V-groove substrate 4510, so that the contact surface between the glass cover 4520 and the V-groove substrate 4510 is fixed together by glue to ensure The gluing stability of the launch fiber array 810 and the V-groove substrate 4510.
  • the end surface of the emitting optical fiber array component 450a is optically polished and coated to ensure that it meets the corresponding optical surface requirements.
  • the structure of the optical fiber V-groove can form a high-quality sealing interface for the optical fibers.
  • the light exit surface of the optical isolator 440a is arranged corresponding to the V-shaped groove 4540, so that the light is isolated through
  • the light beam of the detector 440a is injected into the emission fiber array 810 through the V-shaped groove 4540, which ensures that the reflected light beam output by the first optical path translation prism 430 can directly pass through the optical isolator 440a and be injected into the emission fiber array assembly 450a.
  • the light emitting component 400 includes 4 lasers, 4 coupling lenses 420a and a first optical path translation prism 430.
  • the lasers 410 and the coupling lenses 420a are arranged in one-to-one correspondence.
  • Each laser 410 emits a laser beam.
  • Each coupling lens 420a converts one laser beam into a condensed beam.
  • Each coupling lens 420a transmits the emitted condensed beam to the first optical path translation prism 430, and reflects the condensed beam through the first optical path translation prism 430 to change the intensity of the laser beam. Transmission direction and location.
  • the light emitting component 400 also includes 4 optical isolators 440a.
  • the V-shaped groove substrate 4510 is provided with 4 rows of V-shaped grooves 4540.
  • the transmitting optical fiber array 810 includes 4 optical fibers.
  • the first optical path translation prism 430 outputs 4 reflected light beams.
  • the light beam transmitted to the optical fiber is coupled to the optical fiber adapter 700 through the optical fiber 600, realizing The transmission of multiple optical signals.
  • FIG. 34 is a schematic structural diagram of the emitting housing in the optical module provided by the embodiment of the present disclosure.
  • FIG. 35 is a schematic structural diagram of the emitting housing in the optical module provided by the embodiment of the present disclosure from another angle.
  • the first emission housing 401 in order to support the fixed laser 410, the coupling lens 420a, the first optical path translation prism 430, the optical isolator 440a and the emission fiber array assembly 450a, the first emission housing 401 includes a first contact surface 4011, The first contact surface 4011 is a side facing the front of the circuit board 300. When the light emitting component 400 is installed on the circuit board 300 in reverse, the first contact surface 4011 is sealingly connected to the front of the circuit board 300.
  • the installation inner cavity is provided from the first contact surface 4011 toward the upward direction of the housing 201.
  • the installation inner cavity includes a first installation surface 4110, a second installation surface 4120, and a third installation surface 4130.
  • the third installation surface 4130 and the second installation surface The surface 4120 is the same mounting surface that is flush, the second mounting surface 4120 is recessed in the first mounting surface 4110, and the first mounting surface 4110 is recessed in the first contact surface 4011.
  • the first contact surface 4011 is bonded to the front surface of the circuit board 300 , the distance between the first mounting surface 4110 and the front surface of the circuit board 300 is smaller than the distance between the second mounting surface 4120 and the front surface of the circuit board 300 , and the distance between the second mounting surface 4120 and the circuit board 300
  • the distance between the front surface and the front surface of the circuit board 300 is the same as the distance between the third mounting surface 4130 and the front surface of the circuit board 300 , so that the first mounting surface 4110 , the second mounting surface 4120 , the third mounting surface 4130 and the first contact surface 4011 form a step surface.
  • the mounting cavity forming the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 has only one end open toward the front of the circuit board 300, and the semiconductor refrigerator 460a is disposed on the first mounting surface 4110.
  • each laser 410 is disposed on a laser substrate
  • each laser substrate and the coupling lens 420a are disposed on the cooling surface of the semiconductor refrigerator 460a
  • the coupling lens 420a is disposed in the light emitting direction of the laser 410.
  • the first optical path translation prism 430 is disposed on the second mounting surface 4120 recessed in the first mounting surface 4110.
  • the first optical path translation prism 430 is vertically fixed on the second mounting surface 4120, that is, one end of the first optical path translation prism 430 is fixed.
  • On the second mounting surface 4120 the other end is located on the back side of the circuit board 300, so that the laser beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300 through the first optical path translation prism 430.
  • One side of the V-shaped groove substrate 4510 in the transmitting optical fiber array assembly 450a is disposed on the third mounting surface 4130.
  • the other side of the V-shaped groove substrate 4510 is bonded and fixed to one side of the glass cover 4520.
  • the other side of the glass cover 4520 One side is bonded and fixed with one side of the support plate 4530, and the other side of the support plate 4530 is bonded and fixed with the front surface of the circuit board 300. In this way, the coupling of the transmitting optical fiber array assembly 450a with the first transmitting housing 401 and the circuit board 300 is realized. Fixed package.
  • the optical isolator 440a is fixed at one end of the V-groove substrate 4510, and the emitting fiber array 810 is fixed in the V-groove 4540 of the V-groove substrate 4510, thus ensuring that the reflected light beam passes through the optical isolator 440a Smoothly enter the launch fiber array 810 in the V-shaped groove 4540.
  • one end of the first launch housing 401 is provided with a gap, and the gap is connected to the third mounting surface 4130. In this way, after the launch fiber array assembly 450a is fixed on the third mounting surface 4130, the launch fiber array assembly 450a The led out transmitting optical fiber array 810 is connected to the optical fiber 600 .
  • the width dimension of the second mounting surface 4120 in the front and rear direction is greater than the width dimension of the third mounting surface 4130 in the front and rear direction
  • the width dimension of the third mounting surface 4130 in the front and rear direction is the same as the width dimension of the notch in the front and rear direction.
  • the semiconductor refrigerator, the laser 410, the coupling lens 420a, the first optical path translation prism 430, and the optical isolator are connected through the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 arranged in steps.
  • 440a and the emitting optical fiber array assembly 450a are fixed on the mounting surface of the inner cavity of the first emitting housing 401 to form a space between the laser 410, the coupling lens 420a, the first optical path translation prism 430, the optical isolator 440a, and the emitting optical fiber array assembly 450a.
  • the installation height difference is different, and the laser 410 with a relatively high installation height and the coupling lens 420a are arranged on the back side of the circuit board 300 through the installation through hole 320 on the circuit board 300, and the first optical path translation prism with a relatively low installation height is 430.
  • the optical isolator 440a and the emitting fiber array assembly 450a are arranged on the front side of the circuit board 300, which can reduce the spatial overlap area between the light emitting assembly 400 and the circuit board 300.
  • FIG. 36 is a schematic structural diagram of the emitting housing in the optical module provided by an embodiment of the present disclosure from a third angle.
  • the first launch housing 401 also includes a first top surface 4012 opposite to the first contact surface 4011.
  • the first top surface 4012 faces the upper housing 201.
  • the first top surface 4012 is provided with a directional A first vent hole 4013 extends from the first contact surface 4011.
  • the first vent hole 4013 is connected with the second mounting surface 4120 in the first launch housing 401, and the first vent hole 4013 is a tapered hole formed by the first The diameter of the tapered hole gradually decreases in the direction of the top surface 4012 toward the second mounting surface 4120, so that the first launch housing 401 can communicate with the outside world through the first vent hole 4013.
  • the first vent hole 4013 on the first launch housing 401 is closed after all sealing operations are completed to ensure that no leak holes will occur in all sealing areas due to air expansion during the sealing process.
  • Figure 37 is a partial assembly cross-sectional view of the light emitting component and the circuit board in the optical module provided by the embodiment of the present disclosure.
  • the semiconductor refrigerator 460a is fixed on the first mounting surface 4110 of the first emission housing 401, so that the cooling surface of the semiconductor refrigerator 460a faces away from the first mounting surface 4110, and then the laser 410 is installed on the The laser substrate is placed on the cooling surface of the semiconductor refrigerator 460a, and then the coupling lens 420a is placed on the cooling surface of the semiconductor refrigerator 460a, and the coupling lens 420a is located in the light emitting direction of the laser 410; then the first optical path translation prism 430 is fixed On the second mounting surface 4120, make one end of the first optical path translation prism 430 set in the light emitting direction of the laser 410; then fix the emitting fiber array assembly 450a on the third mounting surface 4130, and then fix the optical isolator 440a on the second mounting surface 4120.
  • One end of the emitting optical fiber array assembly 450a allows the laser beam reflected by the first optical path translation prism 430 to directly pass through the optical isolator 440a and enter the emitting optical fiber array 810 in the emitting optical fiber array assembly 450a, and then is transmitted to the optical fiber 600 via the emitting optical fiber array 810.
  • the laser beam reflected by the first optical path translation prism 430 to directly pass through the optical isolator 440a and enter the emitting optical fiber array 810 in the emitting optical fiber array assembly 450a, and then is transmitted to the optical fiber 600 via the emitting optical fiber array 810.
  • the first emission housing 401 is turned over, and the laser 410 and coupling lens 420a on the first mounting surface 4110 and the first optical path translation prism 430 on the second mounting surface 4120 are embedded into the mounting through hole 320 on the circuit board 300.
  • Make the wiring surface of the laser 410 have the same height as the back of the circuit board 300, and then bond the first contact surface 4011 of the first emission housing 401 to the front of the circuit board 300, and secure the support in the emission fiber array assembly 450a.
  • the board 4530 is bonded to the front surface of the circuit board 300, so that the inner cavity of the first launch housing 401, the launch fiber array assembly 450a, the circuit board 300 and the launch cover 402 together form a sealed cavity.
  • the inner cavity of the emission cover 402 is arranged corresponding to the mounting through hole 320, and the contact surface of the emission cover 402 facing the back of the circuit board 300 is bonded to the back of the circuit board 300, so that the laser 410 located on the back of the circuit board 300,
  • the coupling lens 420a and the first optical path translation prism 430 are placed in the cavity formed by the emission cover 402 and the back surface of the circuit board 300.
  • the first contact surface 4011 and the front surface of the circuit board 300 are bonded together through UV curing glue and structural curing glue to realize the first contact surface 4011 of the first emission housing 401 and the front surface of the circuit board 300 sealing bonding.
  • the contact surface of the emission cover 402 facing the back of the circuit board 300 and the back of the circuit board 300 are bonded together through UV curing glue and structural curing glue to achieve sealing bonding between the emission cover 402 and the back of the circuit board 300 .
  • the first launch housing 401 is bonded to the front side of the circuit board 300
  • the launch cover 402 is bonded to the back side of the circuit board 300, thereby realizing the connection between the first launch housing 401, the circuit board 300 and the launch cover 402. Sealed assembly.
  • the first emission housing 401 is a relatively complete housing structure that can accommodate all optical and electrical components and form a complete sealing section.
  • the emission cover 402 located on the back of the circuit board 300 is designed as a simple cavity structure to form a complete sealing section.
  • the first launch housing 401, the circuit board 300 and the launch cover 402 form a sandwich structure, and the contact interface between the first launch housing 401 and the front of the circuit board 300 is glue-sealed, and the launch cover 402 and the circuit
  • the contact interface on the back side of the board 300 is glued and sealed, and then combined with the emitting optical fiber array assembly 450a to form a complete sealed cavity structure.
  • the laser 410 emits a laser beam under the action of the driving current transmitted by the circuit board 300, and the laser beam is converted into The condensed light beam is reflected by the first optical path translation prism 430, so that the condensed light beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300.
  • the reflected multi-channel converged light beams are directly transmitted through the optical isolator 440a. into the transmitting optical fiber array 810 in the transmitting optical fiber array assembly 450a, and then transmitted to the optical fiber 600, thereby realizing the emission of multiple paths of light.
  • the coupling of the laser to the optical fiber is achieved through a single coupling lens, which is generally called a single lens system.
  • a dual-lens system can also be used to change the coupling lens into a collimating lens.
  • the divergent beam from the laser is converted into collimated light.
  • a coupling lens is then placed to convert the divergent beam into collimated light.
  • the collimated beam is converted into a focused beam, thereby coupling the laser into the fiber array.
  • a DSP chip 310 is provided on the front side of the circuit board 300.
  • the DSP chip 310 is used for high-frequency signal processing and transmits the high-frequency signal to the laser 410 to provide a signal for the laser 410 to emit a laser beam, so that Laser 410 generates signal light.
  • the back of the circuit board 300 is provided with a high-frequency signal connection line from the DSP chip 310 to the opening end left for the light-emitting component 400.
  • the circuit design on this side is mainly for the high-frequency signal transmitted from the gold finger end. After the signal is processed by the DSP chip 310, it is then transmitted to the light emitting component 400 via a high-frequency signal line.
  • a high-frequency signal via is provided under the Tx output pad of the DSP chip 310, and the high-frequency signal via penetrates the circuit board 300.
  • the upper end of the high-frequency signal via is electrically connected to the Tx output pad of the DSP chip 310
  • the lower end of the high-frequency signal via is electrically connected to the high-frequency signal line laid on the back of the circuit board 300 .
  • the high-frequency signal The wires are electrically connected to the laser 410 through bonding wires.
  • the DSP chip 310 located on the front of the circuit board 300 transmits the high-frequency signal on the circuit board 300 from the front of the circuit board 300 to the back of the circuit board 300 through the high-frequency signal line connected to its Tx output pad, so as to transmit the high-frequency signal.
  • the high-frequency signal is transmitted to the laser 410 located on the back side of the circuit board 300 to realize the high-frequency signal connection between the light emitting component 400 and the circuit board 300, so that the laser 410 emits signal light.
  • the circuit board 300 is provided with multiple high-frequency signal via holes, and the multiple high-frequency signal via holes are arranged on the right side of the mounting through hole 320 .
  • Each high-frequency signal via hole corresponds to the laser 410 one-to-one.
  • the connection is such that the high-frequency signal line connecting each high-frequency signal via hole is connected to the laser 410, and the high-frequency signal transmitted by the circuit board 300 is transmitted to the laser 410 to meet the high-frequency signal required by the light emitting component 400.
  • a DC signal line is also arranged on the back of the circuit board 300.
  • the DC signal line is electrically connected to the laser 410, and the bias current transmitted through the DC signal line drives the laser 410 to emit light.
  • the DC signal line that transmits the bias current can be led from the left side of the mounting through hole 320 on the circuit board 300 by wiring.
  • the laser 410 can emit light after receiving the bias current transmitted by the DC signal line, and the high-frequency signal line After being transmitted to the laser 410, the laser 410 modulates the high-frequency signal into the light beam, so that the laser 410 generates signal light.
  • the DC signal line that transmits the bias current can also be connected to the laser 410 from the upper and lower sides of the mounting through hole 320, that is, the DC signal line and the high frequency signal line connecting the laser 410 are located on different sides of the mounting through hole 320, so that both Interference between high-frequency signals and DC signals is avoided, and the routing of DC signals is also made shorter, thereby avoiding overcrowding of wiring in the circuit board 300 .
  • the first optical path translation prism 430 includes a first reflector and a second reflector.
  • the first reflector is located in the light emitting direction of the laser 410.
  • the condensed light beam output by the coupling lens 420a is directed to the first reflector and converged.
  • the beam is reflected at the first reflector, and the reflected concentrated beam is reflected again at the second reflector.
  • the spotlight is located on the front side of the circuit board 300 .
  • the laser 410 emits a laser signal driven by the bias current and high-frequency signal transmitted by the circuit board 300.
  • a photodetector is provided on the back of the circuit board 300, and the photodetector is provided on the circuit board 300.
  • the left edge of the through hole 320 is installed on the top, and the photosensitive surface of the photodetector faces the light emitting direction of the laser 410, for collecting the forward light emitted by the laser 410, and sending the collected data to the relevant circuit board 300. device to monitor the forward light power of the laser 410.
  • the photodetector is located in the inner cavity of the emitting cover 402, so that the photodetector is placed in the sealed cavity formed by the emitting cover 402 and the back of the circuit board 300 to ensure the sealing of the light emitting assembly 400. .
  • the light transmission characteristics of the reflective surface of the first reflector are used to cause a small part of the collimated light beam to leak through the first reflector and enter the photosensitive surface of the photodetector, so that the photodetector can receive part of the beam, thereby obtaining the emitted optical power of the laser 410.
  • the first reflecting mirror of the first optical path translation prism 430 faces the light emitting direction of the laser 410 and is used to divide the laser beam generated by the laser 410 into two beams of light.
  • One beam of light (usually accounting for 95% of the total power) is
  • the first reflector reflects to the second reflector to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300.
  • Another beam of light directly passes through the first reflector and enters the photosensitive surface of the photodetector. , the laser beam emitted by the light-emitting surface of the laser 410 is received through the photosensitive surface.
  • the photosensitive surface of the photodetector can be flush with the inner wall of the mounting through hole 320 to facilitate positioning of the photodetector.
  • the central axis of the photosensitive surface of the photodetector can be coincident with the central axis of the laser 410, and the photodetector can be facing the side of the back of the circuit board 300 through surface assembly technology.
  • SMT Surface Mounted Technology
  • each photodetector collects the laser beam emitted by each laser 410 and passes through the third photodetector. A part of the light beam is reflected by a mirror, and the forward light power of the corresponding laser 410 is measured through a device electrically connected to the photodetector.
  • the photodetector receives parallel light with a certain area, the assembly position accuracy of the photodetector is low, and the assembly is easier. As long as the light transmission range of the first reflector in the first optical path translation prism 430 is matched with that of the photodetector. The photosensitive surfaces only need to be aligned, so that the photodetector can collect the laser beam that passes through the first reflector.
  • an anode is provided on the side where the photodetector is connected to the back of the circuit board 300.
  • the anode can be directly welded or conductively fixed to the grounded metal on the circuit board 300 through conductive glue or other methods.
  • a cathode is provided on the side of the photodetector facing away from the back of the circuit board 300, and the cathode is electrically connected to the circuit board 300 through wiring, thereby realizing the electrical connection between the photodetector and the circuit board 300.
  • the first top surface 4012 of the first emitting housing 401 in the light emitting assembly 400 is in contact with the upper housing 201; the laser 410 in the light emitting assembly 400 is passed through the high After the frequency signal line is connected to the DSP chip 310 on the front of the circuit board 300, the laser 410 generates a laser beam driven by the DC and high-frequency signals transmitted by the circuit board 300. In this way, the laser 410 will generate heat, and the luminous performance of the laser 410 is affected by temperature.
  • the laser 410 needs to work in a certain fixed temperature range, so the laser 410 needs to be placed on the semiconductor refrigerator 460a to ensure the operating temperature of the laser 410, and the semiconductor refrigerator 460a will generate a lot of heat during the cooling process. This heat needs to be dissipated to ensure the cooling efficiency of the semiconductor refrigerator 460a.
  • the first emitting housing 401 can be made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the first emitting housing 401 and the area of the first top surface 4012 can be appropriately increased, so that the laser The heat generated by the operation of 410 and semiconductor refrigerator 460a can be transmitted to the upper housing 201 through the first emission housing 401, effectively improving the heat dissipation effect of the laser 410.
  • the first emission housing 401 needs to be made of tungsten copper or other metal materials with good thermal conductivity. And appropriately increase the mass and bottom surface area of the first emitting housing 401, thereby increasing the contact area between the first emitting housing 401 and the upper housing 201, thereby improving the heat dissipation efficiency of the light emitting component 400.
  • a first thermal conductor may be provided between the first top surface 4012 of the first emission housing 401 and the inner surface of the upper housing 201. gasket, so that the heat of the first emission housing 401 is transferred to the first thermal conductive pad, and the first thermal conductive pad transmits the heat to the upper shell 201 to effectively improve the heat dissipation effect.
  • the first thermally conductive pad can be thermally conductive glue, which can not only stick the first top surface 4012 of the first emission housing 401 to the inner side of the upper housing 201 through the thermally conductive glue, but also can paste the first emission The heat of the housing 401 is conducted to the upper housing 201 .
  • the main heat source of the optical module is the DSP chip 310.
  • the DSP chip 310 is in contact with the upper case 201 on the side facing away from the circuit board 300. In this way, the DSP chip 310 The heat generated by the operation of 310 is transferred to the upper housing 201 to transfer the heat generated by the DSP chip 310 to the outside of the optical module.
  • a second thermal pad can be provided between the DSP chip 310 and the inner side of the upper case 201, so that the heat generated by the DSP chip 310 is transferred to the second thermal pad.
  • the second thermal pad transfers heat to the upper case 201 to effectively improve the heat dissipation effect.
  • the light receiving component 500 and the light emitting component 400 can be disposed side by side on the circuit board 300, or can be disposed on different surfaces of the circuit board 300.
  • the light receiving component 500 and the circuit board 300 form a closed cavity structure. To achieve a sealed assembly of the light receiving assembly 500 .
  • Figure 38 is a schematic diagram of the flip structure of the light receiving component in the optical module provided by an embodiment of the present disclosure.
  • the light receiving component 500 provided by the embodiment of the present disclosure includes a receiving housing 501a, which is buckled on the front side of the circuit board 300 and is sealingly connected to the front side of the circuit board 300;
  • the receiving housing 501a 501a includes a second contact surface 5011 facing the circuit board 300.
  • the second contact surface 5011 is provided with a mounting groove.
  • the mounting groove is provided with an opening at one end toward the front of the circuit board 300, and the mounting groove is directed from the second contact surface 5011 to the receiving shell.
  • the body 501a extends in the direction of the top surface (the side facing away from the front of the circuit board 300).
  • a corner fiber optic array component is provided in the installation groove of the receiving housing 501a. One end of the corner fiber optic array component leads to the receiving fiber array 820. The other end of the corner fiber optic array component is placed above the detector on the circuit board 300. Through the corner fiber optic array, The component reflects and turns the received light beam transmitted by the optical fiber array 820, and the reflected light beam is injected into the detector on the circuit board 300 for photoelectric conversion.
  • the corner optical fiber array assembly includes a corner V-groove substrate 510, a cover plate 520 and a support 530. Multiple rows of V-grooves are arranged in parallel on the corner V-groove substrate 510.
  • the receiving optical fiber array 820 is placed in the V-groove and tightly sealed with glue. Bonded, its end surface is polished to an angle of nearly 45 degrees, thereby forming a reflective surface at a suitable angle.
  • the corner V-groove substrate 510 is sealingly connected to the optical fibers of the receiving optical fiber array 820 , so that the receiving light beam transmitted by the receiving optical fiber array 820 is transmitted to the V-shaped groove of the corner V-groove substrate 510 .
  • the support member 530 is disposed on the mounting surface of the receiving housing 501a, and the corner V-groove base plate 510 is disposed on the support member 530.
  • the support member 530 raises the installation height of the corner V-groove base plate 510.
  • One end of the corner V-groove substrate 510 is sealingly connected to the receiving optical fiber array 820.
  • the other end of the corner V-groove substrate is provided with a reflective surface. The reflective surface is used to reflect and steer the light beam transmitted by the receiving optical fiber array 820. The reflection after steering The beam strikes a detector on circuit board 300.
  • the opening of the V-shaped groove on the corner V-shaped groove substrate 510 faces the front side of the circuit board 300
  • the cover plate 520 covers the corner V-shaped groove substrate 510 to seal the V-shaped opening on the corner V-shaped groove substrate 510 .
  • One side of the cover plate 520 seals the V-shaped groove, and the other side can be bonded and fixed with the front surface of the circuit board 300, thus achieving a fixed connection between the corner optical fiber array assembly, the receiving housing 501a, and the circuit board 300.
  • Figure 39 is a schematic structural diagram of a receiving housing in an optical module according to an embodiment of the present disclosure.
  • the receiving housing 501a includes a second contact surface 5011, which is a side facing the front of the circuit board 300.
  • the second contact surface 5011 is The surface 5011 is sealingly connected to the front side of the circuit board 300 .
  • a mounting groove is provided from the second contact surface 5011 toward the upward housing 201.
  • the mounting groove opens toward one side of the front of the circuit board 300, so that a fourth mounting surface 5110 and a fifth mounting surface 5120 are formed in the receiving housing 501a.
  • the fourth mounting surface 5110 and the fifth mounting surface 5120 are flush with the same mounting surface.
  • the support 530 in the corner fiber array assembly is set on the fourth mounting surface 5110, and the corner V-groove base plate 510 is set on the fourth mounting surface 5110. and above the fifth mounting surface 5120 to fix the corner optical fiber array assembly on the mounting surface in the receiving housing 501a.
  • one end of the receiving housing 501a is open, and the opening is located at the same end as the fifth mounting surface 5120. In this way, after the corner fiber array assembly is fixed on the fourth mounting surface 5110, the receiving fiber array derived from the corner fiber array assembly 820 with fiber 600 connection.
  • the width dimension of the fourth mounting surface 5110 in the front-to-back direction is greater than the width dimension of the fifth mounting surface 5120 in the front-to-back direction.
  • the inner side wall of the receiving housing 501a connected with the surface 5110, the opposite side walls of the support member 530, and the opposite side walls of the corner V-groove base plate 510 are glued and fixed together, so that the opening of the receiving housing 501a is closed through the corner optical fiber array assembly.
  • the adhesive and fixation makes the corner fiber array component and the opening sealingly connected, so that the receiving housing 501a and the corner fiber array component together form a sealed cavity.
  • the receiving housing 501a also includes a top surface opposite to the second contact surface 5011.
  • the top surface faces the upper housing 201.
  • a second vent hole 5013 extending toward the second contact surface 5011 is provided on the top surface.
  • the second vent hole 5013 is disposed on the top surface.
  • 5013 is connected with the fourth mounting surface 5110 in the receiving housing 501a, and the second vent hole 5013 is a tapered hole, and the diameter of the tapered hole gradually decreases from the top to the direction of the fourth mounting surface 5110, so
  • the receiving housing 501a can communicate with the outside world through the second air release hole 5013.
  • the second vent hole 5013 on the receiving housing 501a is closed after all sealing operations are completed to ensure that no leak holes will occur in all sealing areas due to air expansion during the sealing process.
  • Figure 40 is a schematic diagram of the flipped structure of another light receiving component in the optical module provided by an embodiment of the present disclosure.
  • the light receiving assembly 500 includes a receiving housing.
  • the receiving housing is buckled on the front side of the circuit board 300 and is sealingly connected to the front side of the circuit board 300.
  • the receiving housing includes an installation cavity, and a light beam is disposed in the installation cavity.
  • the receiver assembly is provided with an opening at one end of the mounting cavity facing the front of the circuit board 300, and the light receiving device communicates with the front of the circuit board 300 through the opening. In this way, a closed cavity structure is formed by the receiving housing and the circuit board 300, and the light receiver assembly is placed within the closed cavity structure.
  • the receiving housing carries all passive optical components, including light receiving collimators, wavelength splitters, focusing mirrors, corner prisms, etc., while the receiving housing covers the detectors PD and TIA on the circuit board 300, and safe areas required for wiring.
  • the light receiver assembly is fixedly installed in the inner cavity of the receiving housing, and then the receiving housing flip cover is placed on the front side of the circuit board 300 to achieve a sealed assembly of the light receiving assembly 500 .
  • a venting hole is provided on a surface of the receiving housing facing away from the front of the circuit board 300.
  • the venting hole is connected to the inner cavity of the receiving housing.
  • the venting hole on the receiving housing is closed after all sealing operations are completed. Ensure that no leak holes will appear in all sealing areas due to air expansion during the sealing process.
  • the external optical fiber is connected to the optical module by inserting the external optical fiber adapter into the optical adapter of the optical module to realize the optical fiber docking. At this time, there is physical contact between the end face of the optical fiber flange in the adapter and the optical fiber adapter.
  • the contact surface will be contaminated by the refrigerant liquid, causing additional losses.
  • the contaminated end face cannot be cleaned, causing permanent damage.
  • Figure 41 is a partial assembly diagram of an optical fiber and a housing in an optical module according to an embodiment of the present disclosure. As shown in Figure 41, in order to prevent the refrigerant from contaminating the contact surface between the optical fiber and the optical fiber adapter when the optical module enters the refrigerant liquid, the present disclosure uses an optical fiber pigtail connection method at the optical port 205 of the optical module to directly connect the optical fiber 600 Export, so that the optical fiber 600 passes through the optical port 205.
  • an optical fiber protection member 610 is provided at the optical port 205.
  • the optical fiber protection member 610 is inserted into the optical port 205, and the optical fiber 600 is embedded in the optical fiber protection member 610, so that the optical fiber 600 and the optical fiber protection member 610 can be eradicated.
  • the risk of port contamination when the optical module is connected ensures the long-term stable operation of the optical module.
  • the optical module provided by the embodiment of the present disclosure is used in the structural design of high-speed optical communication modules, including innovative considerations in optics, structure, high-frequency signal transmission and heat dissipation.
  • the light-emitting component is designed into a completely sealed structure, thereby solving the problem of The problem of sealing of the transmitting optical path is solved;
  • the optical receiving component is designed into a completely sealed structure, thereby solving the problem of sealing of the receiving optical path;
  • the optical interface adopts pigtail mode, canceling the optical interface from the optical fiber adapter to the optical module and the contact connection of the optical adapter.
  • the epoxy system glue is used for the sealed connection between the optical component and the optical component and the circuit board, which not only plays the role of structural connection and reinforcement, but also plays a sealing role to ensure the coolant It will not penetrate into the light-emitting component and the light-receiving component;
  • the bonding interface is rationally designed to simplify the gluing and bonding process, thus solving the sealing problem at the component assembly bonding joint; the structural design is simple and suitable for mass production.
  • the present disclosure achieves a completely sealed package of the free optical path in the optical module, thereby realizing long-term and reliable operation of the optical module in a liquid cooling environment, and greatly improving the light emitting component and light receiving The heat dissipation effect of components.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

An optical module (200), comprising a circuit board (300) provided with a mounting through hole (320), and a light emitting assembly (400). The light emitting assembly (400) comprises an emitting housing (401), a laser (410), an optical path translation prism (430), an emitting optical fiber array assembly, and an emitting cover plate (402). The emitting housing (401) covers the front side of the circuit board (300), and is sealedly connected to the front surface of the circuit board (300); and the emitting cover plate (402) is disposed on the back side of the circuit board (300), covers the mounting through hole (320), and is seadedly connected to the back surface of the circuit board (300). The emitting housing (401) comprises a mounting inner cavity having an opening in one side, and the mounting inner cavity is communicated with the mounting through hole (320) by means of the opening; the laser (410) in the mounting inner cavity is located on the back side of the circuit board (300) by means of the mounting through hole (320); and one end of the optical path translation prism (430) in the mounting inner cavity is located on the back side of the circuit board (300) by means of the mounting through hole (320), and the other end of the optical path translation prism (430) is located on the front side of the circuit board (300). One end of the emitting optical fiber array assembly is inserted into the mounting inner cavity, and an optical fiber array (810) is led out from the other end of the emitting optical fiber array assembly to be connected to an optical fiber adapter (700). By means of unique structural design of a multi-fiber light emitting assembly, complete closed packaging of an optical path is achieved, and the heat dissipation effect of the optical module is greatly improved.

Description

一种光模块An optical module
相关申请的交叉引用Cross-references to related applications
本公开要求在2022年03月30日提交中国专利局、申请号为202210331564.8，在2022年03月30日提交中国专利局、申请号为202220740523.X，以及在2022年03月30日提交中国专利局、申请号为202220776501.9的专利申请的优先权，其全部内容通过引用结合在本公开中。This disclosure request is submitted to the China Patent Office on March 30, 2022, with the application number 202210331564.8, and is submitted to the China Patent Office on March 30, 2022, with the application number 202220740523.X, and the Chinese Patent Office is submitted on March 30, 2022. No. 202220776501.9, the entire contents of which are incorporated by reference into this disclosure.
技术领域Technical field
本公开涉及光纤通信技术领域，尤其涉及一种光模块。The present disclosure relates to the technical field of optical fiber communication, and in particular, to an optical module.
背景技术Background technique
随着云计算、移动互联网、视频等新型业务和应用模式发展，光通信技术的发展进步变的愈加重要。而在光通信技术中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，并且随着光通信技术发展的需求光模块的传输速率不断提高。With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing mutual conversion of optical and electrical signals. They are one of the key components in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules continues to increase.
发明内容Contents of the invention
本公开提供了一种光模块，包括：电路板，其上设置有安装通孔；光发射组件，与所述电路板电连接，用于发射光信号；光纤适配器，与所述光发射组件通过光纤阵列连接；其中，所述光发射组件包括：发射壳体，罩扣于所述电路板的正侧，与所述电路板的正面密封连接；包括安装内腔，所述安装内腔朝向所述电路板正面的一端设置有开口，所述安装内腔通过所述开口与所述安装通孔相连通；朝向所述光纤适配器的一端设置有缺口，所述缺口与所述安装内腔相连通；发射盖板，设置于所述电路板的背侧，罩设于所述安装通孔上，与所述电路板的背面密封连接；激光器，设置在所述安装内腔内，通过所述安装通孔位于所述电路板的背侧，用于产生激光光束；光路平移棱镜，设置在所述安装内腔内，其一端通过所述安装通孔位于所述电路板的背侧、另一端位于所述电路板的正侧，用于将位于电路板背侧的激光光束反射至所述电路板的正侧；发射光纤阵列组件，一端通过所述缺口***所述安装内腔内，另一端引出光纤阵列与所述光纤适配器连接；分别与所述缺口、所述电路板的正面密封连接。The present disclosure provides an optical module, including: a circuit board with a mounting through hole; a light emitting component electrically connected to the circuit board for emitting optical signals; and an optical fiber adapter connected to the light emitting component through Optical fiber array connection; wherein, the light emitting component includes: a transmitting housing, which is buckled on the front side of the circuit board and is sealingly connected to the front side of the circuit board; including an installation inner cavity, and the installation inner cavity faces the One end of the front face of the circuit board is provided with an opening, and the installation inner cavity is connected to the installation through hole through the opening; one end toward the fiber optic adapter is provided with a gap, and the gap is connected to the installation inner cavity. ; Emitting cover plate, arranged on the back side of the circuit board, covering the installation through hole, and sealingly connected with the back side of the circuit board; laser, installed in the installation cavity, through the installation A through hole is located on the back side of the circuit board and is used to generate a laser beam; an optical path translation prism is provided in the installation cavity, with one end located on the back side of the circuit board through the installation through hole, and the other end located on the back side of the circuit board. The front side of the circuit board is used to reflect the laser beam located on the back side of the circuit board to the front side of the circuit board; the emitting optical fiber array component has one end inserted into the installation cavity through the gap, and the other end is led out The optical fiber array is connected to the optical fiber adapter; and is sealingly connected to the notch and the front surface of the circuit board respectively.
附图说明Description of drawings
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。In order to explain the technical solutions in the present disclosure more clearly, the drawings required to be used in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only appendices of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of the present disclosure.
图1为根据一些实施例的一种光通信***的连接关系图；Figure 1 is a connection diagram of an optical communication system according to some embodiments;
图2为根据一些实施例的一种光网络终端的结构图；Figure 2 is a structural diagram of an optical network terminal according to some embodiments;
图3为根据一些实施例的一种光模块的结构图；Figure 3 is a structural diagram of an optical module according to some embodiments;
图4为根据一些实施例的一种光模块的分解图；Figure 4 is an exploded view of an optical module according to some embodiments;
图5为根据一些实施例的一种光模块中一种光发射组件、光接收组件、电路板与光纤的装配示意图；Figure 5 is a schematic diagram of the assembly of a light emitting component, a light receiving component, a circuit board and an optical fiber in an optical module according to some embodiments;
图6为根据一些实施例的一种光模块中一种电路板的结构示意图；Figure 6 is a schematic structural diagram of a circuit board in an optical module according to some embodiments;
图7为根据一些实施例的一种光模块中一种光发射组件与电路板的局部装配示意图；Figure 7 is a partial assembly diagram of a light emitting component and a circuit board in an optical module according to some embodiments;
图8为根据一些实施例的一种光模块中一种光发射组件的翻转结构示意图； Figure 8 is a schematic diagram of the flipped structure of a light emitting component in an optical module according to some embodiments;
图9为根据一些实施例的光模块中一种光发射组件与电路板的另一角度局部装配示意图；Figure 9 is a partial assembly diagram of a light emitting component and a circuit board in an optical module according to some embodiments from another angle;
图10为根据一些实施例的一种光模块中一种发射壳体的结构示意图；Figure 10 is a schematic structural diagram of a transmitting housing in an optical module according to some embodiments;
图11为根据一些实施例的一种光模块中一种发射壳体的另一角度结构示意图；Figure 11 is a schematic structural diagram of a transmitting housing in an optical module according to some embodiments from another angle;
图12为根据一些实施例的一种光模块中一种光发射组件与电路板的局部装配剖视图；Figure 12 is a partially assembled cross-sectional view of a light emitting component and a circuit board in an optical module according to some embodiments;
图13为根据一些实施例的一种光模块中一种光发射组件与电路板的另一局部装配示意图；Figure 13 is another partial assembly diagram of a light emitting component and a circuit board in an optical module according to some embodiments;
图14为根据一些实施例的一种光模块中一种光接收组件的翻转结构示意图；Figure 14 is a schematic diagram of the flip structure of a light receiving component in an optical module according to some embodiments;
图15为根据一些实施例的一种光模块中一种光接收组件的另一角度结构示意图；Figure 15 is a schematic structural diagram of a light receiving component in an optical module according to some embodiments from another angle;
图16为根据一些实施例的一种光模块中一种光接收组件与电路板的局部装配剖视图；Figure 16 is a partially assembled cross-sectional view of a light receiving component and a circuit board in an optical module according to some embodiments;
图17为根据一些实施例的一种光模块中另一种光发射组件、光接收组件、电路板与光纤的装配示意图；Figure 17 is a schematic diagram of the assembly of another light emitting component, light receiving component, circuit board and optical fiber in an optical module according to some embodiments;
图18为根据一些实施例的一种光模块中另一种光发射组件与电路板的局部装配示意图；Figure 18 is a partial assembly diagram of another light emitting component and a circuit board in an optical module according to some embodiments;
图19为根据一些实施例的一种光模块中另一种电路板的结构示意图；Figure 19 is a schematic structural diagram of another circuit board in an optical module according to some embodiments;
图20为根据一些实施例的一种光模块中另一种光发射组件的结构示意图；Figure 20 is a schematic structural diagram of another light emitting component in an optical module according to some embodiments;
图21为根据一些实施例的一种光模块中另一种发射壳体的结构示意图；Figure 21 is a schematic structural diagram of another emission housing in an optical module according to some embodiments;
图22为根据一些实施例的一种光模块中另一种发射壳体的另一角度结构示意图；Figure 22 is a schematic structural diagram of another emission housing in an optical module according to some embodiments from another angle;
图23为根据一些实施例的一种光模块中另一种光发射组件的分解结构示意图；Figure 23 is an exploded structural diagram of another light emitting component in an optical module according to some embodiments;
图24为根据一些实施例的一种光模块中另一种发射壳体的第三角度结构示意图；Figure 24 is a schematic structural diagram of another emission housing in an optical module according to some embodiments from a third angle;
图25为根据一些实施例的一种光模块中另一种发射壳体的第四角度结构示意图；Figure 25 is a schematic structural diagram of another emission housing in an optical module according to some embodiments from a fourth angle;
图26为本申请实施例提供的一种光模块中另一种光发射组件的局部结构示意图；Figure 26 is a partial structural schematic diagram of another light emitting component in an optical module provided by an embodiment of the present application;
图27为根据一些实施例的一种光模块中另一种光发射组件的剖视图；Figure 27 is a cross-sectional view of another light emitting component in an optical module according to some embodiments;
图28为根据一些实施例的一种光模块中另一种光发射组件与电路板的局部装配剖视图；Figure 28 is a partially assembled cross-sectional view of another light emitting component and a circuit board in an optical module according to some embodiments;
图29为根据一些实施例的一种光模块中电路板、光发射组件与光接收组件的装配示意图；Figure 29 is a schematic assembly diagram of a circuit board, a light emitting component and a light receiving component in an optical module according to some embodiments;
图30为根据一些实施例的一种光模块中光发射组件的翻转结构示意图；Figure 30 is a schematic diagram of the flip structure of the light emitting component in an optical module according to some embodiments;
图31为根据一些实施例的一种光模块中光发射组件与电路板的另一角度局部示意图；Figure 31 is a partial schematic diagram of the light emitting component and the circuit board in an optical module from another angle according to some embodiments;
图32为根据一些实施例的一种光模块中发射光纤阵列组件与光隔离器的装配示意图；Figure 32 is a schematic assembly diagram of a transmitting fiber array component and an optical isolator in an optical module according to some embodiments;
图33为根据一些实施例的一种光模块中发射光纤阵列组件与光隔离器的局部分解示意图；Figure 33 is a partially exploded schematic diagram of a transmitting fiber array component and an optical isolator in an optical module according to some embodiments;
图34为根据一些实施例的一种光模块中发射壳体的结构示意图；Figure 34 is a schematic structural diagram of a transmitting housing in an optical module according to some embodiments;
图35为根据一些实施例的一种光模块中发射壳体的另一角度结构示意图；Figure 35 is a schematic structural diagram of the emitting housing in an optical module from another angle according to some embodiments;
图36为根据一些实施例的一种光模块中发射壳体的第三角度结构示意图；Figure 36 is a schematic structural diagram of a transmitting housing in an optical module from a third angle according to some embodiments;
图37为根据一些实施例的一种光模块中光发射组件与电路板的局部装配剖视图；Figure 37 is a partial assembly cross-sectional view of the light emitting component and the circuit board in an optical module according to some embodiments;
图38为根据一些实施例的一种光模块中光接收组件的翻转结构示意图；Figure 38 is a schematic diagram of the flip structure of the light receiving component in an optical module according to some embodiments;
图39为根据一些实施例的一种光模块中接收壳体的结构示意图；Figure 39 is a schematic structural diagram of a receiving housing in an optical module according to some embodiments;
图40为根据一些实施例的一种光模块中另一种电路板与光接收组件的装配示意图；Figure 40 is a schematic assembly diagram of another circuit board and light receiving component in an optical module according to some embodiments;
图41为根据一些实施例的一种光模块中光纤与壳体的局部装配示意图。Figure 41 is a partial assembly diagram of an optical fiber and a housing in an optical module according to some embodiments.
具体实施方式Detailed ways
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by this disclosure, all other embodiments obtained by those of ordinary skill in the art fall within the scope of protection of this disclosure.
光通信技术中，使用光携带待传输的信息，并使携带有信息的光信号通过光纤或光波 导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光信号通过光纤或光波导传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。In optical communication technology, light is used to carry information to be transmitted, and the optical signal carrying the information passes through optical fibers or light waves. Information transmission equipment such as guides are transmitted to information processing equipment such as computers to complete the transmission of information. Since optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved. In addition, the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by computers and other information processing equipment are electrical signals. Therefore, in order to distinguish between information transmission equipment such as optical fibers or optical waveguides and computers and other information processing equipment To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
光模块在光纤通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要用于实现供电、I2C信号传输、数据信号传输以及接地等；光网络终端通过网线或无线保真技术(Wi-Fi)将电信号传输给计算机等信息处理设备。Optical modules realize the mutual conversion function of the above-mentioned optical signals and electrical signals in the field of optical fiber communication technology. The optical module includes an optical port and an electrical port. The optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (for example, optical modem) through the electrical port. The electrical connection It is mainly used to realize power supply, I2C signal transmission, data signal transmission and grounding; the optical network terminal transmits electrical signals to computers and other information processing equipment through network cables or wireless fidelity technology (Wi-Fi).
图1为根据一些实施例的一种光通信***的连接关系图。如图1所示，光通信***主要包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103；Figure 1 is a connection diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system mainly includes a remote server 1000, local information processing equipment 2000, optical network terminal 100, optical module 200, optical fiber 101 and network cable 103;
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现超长距离传输。因此在通常的光通信***中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of thousands of meters (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long-distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers, or hundreds of kilometers.
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平板电脑、电视机等。One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 . The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.
光模块200包括光口和电口。光口被配置为与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立连接。示例的，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。The optical module 200 includes an optical port and an electrical port. The optical port is configured to be connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection; the electrical port is configured to be connected to the optical network terminal 100, so that the optical module 200 and the optical network terminal 100 establish a bidirectional connection. electrical signal connection. The optical module 200 realizes mutual conversion between optical signals and electrical signals, thereby establishing a connection between the optical fiber 101 and the optical network terminal 100 . For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100. The electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101.
光网络终端100包括大致呈长方体的壳体(housing)，以及设置于壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。示例的，光网络终端100将来自光模块200的电信号传递给网线103，将来自网线103的信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。The optical network terminal 100 includes a substantially rectangular parallelepiped housing, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 Establish a two-way electrical signal connection. The optical module 200 and the network cable 103 are connected through the optical network terminal 100 . For example, the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100 serves as the host computer of the optical module 200 and can monitor the optical module 200. work. In addition to the optical network terminal 100, the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT), etc.
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立双向的信号传递通道。The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.
图2为根据一些实施例的一种光网络终端的结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100与光模块200相关的结构。如图2所示，光网络终端100中还包括设置于壳体内的印制电路板(Printed Circuit Board，PCB)105，设置于PCB 105的表面的笼子106，以及设置于笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。Figure 2 is a structural diagram of an optical network terminal according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, Figure 2 only shows the structure related to the optical network terminal 100 and the optical module 200. . As shown in Figure 2, the optical network terminal 100 also includes a printed circuit board (Printed Circuit Board, PCB) 105 provided in the casing, a cage 106 provided on the surface of the PCB 105, and electrical connections provided inside the cage 106 device. The electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other protrusions that increase the heat dissipation area.
光模块200***光网络终端100的笼子106中，由笼子106固定光模块200，光模块 200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200***笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而使光模块200与光纤101建立双向的电信号连接。The optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the cage 106 fixes the optical module 200. The optical module The heat generated by 200 is conducted to cage 106 and then diffused through heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.
图3为根据一些实施例的一种光模块的结构图，图4为根据一些实施例的一种光模块的分解图。如图3和图4所示，光模块200包括壳体、设置于壳体中的电路板300及光收发器件；FIG. 3 is a structural diagram of an optical module according to some embodiments, and FIG. 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver device;
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口204和205的上述壳体；壳体的外轮廓一般呈现方形体。The housing includes an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205; the outer contour of the housing generally presents a square body.
在本公开一些实施例中，下壳体202包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体201包括盖板，以及位于盖板两侧与盖板垂直设置的两个上侧板，由两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two lower side plates located on both sides of the cover plate and perpendicular to the cover plate. The two upper side plates are combined with the two side plates to realize that the upper housing 201 is covered on the lower housing 202.
两个开口204和205的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。示例地，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。其中，开口204为电口，电路板300的金手指从电口204伸出，***上位机(如光网络终端100)中；开口205为光口，配置为接入外部的光纤101，以使光纤101连接光模块200内部的光收发器件。The direction of the connection between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 . For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ). Alternatively, the opening 204 is located at an end of the optical module 200 and the opening 205 is located at a side of the optical module 200 . Among them, the opening 204 is an electrical port, and the golden finger of the circuit board 300 extends from the electrical port 204 and is inserted into the host computer (such as the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101, so that The optical fiber 101 is connected to the optical transceiver device inside the optical module 200 .
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光收发器件等器件安装到壳体中，上壳体201、下壳体202可以对这些器件形成封装保护。此外，在装配电路板300等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化的实施生产。The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, optical transceiver devices and other devices into the housing. The upper housing 201 and the lower housing 202 can form package protection for these devices. In addition, when assembling components such as the circuit board 300, it is convenient to deploy positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to automated production.
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
在一些实施例中，光模块200还包括位于其壳体外壁的解锁部件，解锁部件被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。In some embodiments, the optical module 200 further includes an unlocking component located on the outer wall of its housing. The unlocking component is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixation between the optical module 200 and the host computer. connect.
示例地，解锁部件位于下壳体202的两个下侧板的外壁，包括与上位机的笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200***上位机的笼子里，由解锁部件的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件时，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。For example, the unlocking component is located on the outer walls of the two lower side panels of the lower housing 202 and includes a snap component that matches the cage of the host computer (for example, the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging parts of the unlocking part. When the unlocking part is pulled, the engaging parts of the unlocking part move accordingly, thereby changing the engaging parts. The connection relationship with the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如可以包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如可以包括微控制单元(Microcontroller Unit，MCU)、跨阻放大器(Transimpedance Amplifier，TIA)、时钟数据恢复芯片(Clock and Data Recovery，CDR)、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。The circuit board 300 includes circuit wiring, electronic components and chips. The electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chip may include, for example, a microcontroller unit (Microcontroller Unit, MCU), a transimpedance amplifier (Transimpedance Amplifier, TIA), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP). )chip.
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；硬性电路板还可以***上位机笼子中的电连接器中。The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can smoothly carry chips; the rigid circuit board can also be inserted into an electrical connector in a host computer cage. .
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300***笼子106中，由金手指与笼子106内的电连接器导通连接。金手指可以仅设置于电路板300一侧的表面(例如图4所示的上表面)，也可以设置于电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。 The circuit board 300 also includes gold fingers formed on its end surface, and the gold fingers are composed of a plurality of mutually independent pins. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by the gold finger. The golden fingers can be disposed only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or they can be disposed on the upper and lower surfaces of the circuit board 300 to adapt to situations where a large number of pins are required. The golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
光收发器件包括光发射组件400及光接收组件500，分别用于实现光信号的发射与光信号的接收。光发射组件400一般包括光发射器、透镜与光探测器，且透镜与光探测器分别位于光发射器的不同侧，光发射器的正反两侧分别发射光束，透镜用于汇聚光发射器正面发射的光束，使得光发射器射出的光束成为平行光或汇聚光，以方便通过合适的步骤和方式耦合至外部光纤。The optical transceiver device includes a light emitting component 400 and a light receiving component 500, which are respectively used to transmit and receive optical signals. The light emitting component 400 generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter. The front and back sides of the light emitter emit light beams respectively, and the lens is used to converge the light emitter. The light beam emitted from the front makes the light beam emitted by the light transmitter become parallel light or converged light, so as to facilitate coupling to the external optical fiber through appropriate steps and methods.
光接收组件500一般包括接收芯片与跨阻放大器，接收芯片用于将接收的外部光信号转换为电信号，电信号经由跨阻放大器进行放大后传输至电路板300上的金手指，经由金手指将电信号传输至上位机。The light receiving component 500 generally includes a receiving chip and a transimpedance amplifier. The receiving chip is used to convert the received external optical signal into an electrical signal. The electrical signal is amplified by the transimpedance amplifier and then transmitted to the gold finger on the circuit board 300. Through the gold finger Transmit electrical signals to the host computer.
部署在数据中心的光模块由于低成本的要求，其光发射组件400与光接收组件500多采用非密封结构设计，其关键光路均处于开放状态。当光模块随交换机进入制冷液中时，这些关键光路和部件也会浸入制冷液中，从而造成光学机制的改变和光学表面的污染，严重影响光模块的正常工作。Due to low-cost requirements of optical modules deployed in data centers, the light-emitting component 400 and the light-receiving component 500 mostly adopt a non-sealed structure design, and their key optical paths are all open. When the optical module enters the refrigerant liquid with the switch, these key optical paths and components will also be immersed in the refrigerant liquid, causing changes in the optical mechanism and contamination of the optical surface, seriously affecting the normal operation of the optical module.
为了解决上述问题，本公开实施例提供了一种光模块，该光模块采用创新的结构设计，实现了光模块内部所有光路的全部密闭封装，进而实现了光模块在液冷环境中长期、可靠的工作，极大改善了光模块中光发射组件400、光接收组件500的散热效果。In order to solve the above problems, embodiments of the present disclosure provide an optical module. The optical module adopts an innovative structural design to realize all airtight packaging of all optical paths inside the optical module, thereby achieving long-term and reliable operation of the optical module in a liquid cooling environment. This work greatly improves the heat dissipation effect of the light emitting component 400 and the light receiving component 500 in the optical module.
图5为本公开实施例提供的光模块中一种电路板、光发射组件、光接收组件与光纤的装配示意图。如图5所示，本公开实施例提供的光模块包括光发射组件400、光接收组件500与光纤600，光发射组件400采用底面向上(倒装)的光发射器结构，使得光发射组件400的底面与上壳体201相接触，极大地改善了光发射组件400的散热；一束光纤600与光发射组件400连接，光发射组件400射出的发射光束通过光纤600传输出去，以实现光的发射。FIG. 5 is a schematic diagram of the assembly of a circuit board, a light emitting component, a light receiving component and an optical fiber in an optical module according to an embodiment of the present disclosure. As shown in Figure 5, the optical module provided by the embodiment of the present disclosure includes a light transmitting component 400, a light receiving component 500 and an optical fiber 600. The light transmitting component 400 adopts a bottom-up (flip-chip) light transmitter structure, so that the light transmitting component 400 The bottom surface is in contact with the upper housing 201, which greatly improves the heat dissipation of the light emitting component 400; a bundle of optical fibers 600 is connected to the light emitting component 400, and the emission beam emitted by the light emitting component 400 is transmitted through the optical fiber 600 to achieve light emission.
光接收组件500与光发射组件400可设置在电路板300的同一侧，另一束光纤600与光接收组件500连接，外部光信号通过光纤600传输至光接收组件500，通过光接收组件500进行光电转换，以实现光的接收。The light receiving component 500 and the light emitting component 400 can be disposed on the same side of the circuit board 300. Another bundle of optical fibers 600 is connected to the light receiving component 500. The external optical signal is transmitted to the light receiving component 500 through the optical fiber 600, and is processed through the light receiving component 500. Photoelectric conversion to achieve light reception.
在一般的设计中，光发射组件400的主光路位于单一平面，所以电路板300需要挖出很大的面积以避让光发射组件400和光纤需要的位置，这造成电路板300很大的挖孔，而且挖孔的形状复杂，不仅极大的减小了电子元器件的排布空间，也给上胶密封造成困难。In a general design, the main optical path of the light emitting component 400 is located on a single plane, so the circuit board 300 needs to dig out a large area to avoid the required positions of the light emitting component 400 and the optical fiber, which results in a large hole in the circuit board 300 , and the complex shape of the holes not only greatly reduces the arrangement space of electronic components, but also makes it difficult to apply glue and seal.
本公开在电路板300上挖孔，将光发射组件400中的激光器设置在电路板300的背侧，在激光器的出光方向上增加一个光路平移棱镜，使得整个光路移至电路板的正侧，如此能够减小电路板300上的挖孔面积，也便于在电路板300的背面对光发射组件400进行密封。In this disclosure, holes are dug in the circuit board 300, the laser in the light emitting assembly 400 is placed on the back side of the circuit board 300, and an optical path translation prism is added in the light emitting direction of the laser so that the entire optical path moves to the front side of the circuit board. This can reduce the digging area on the circuit board 300 and facilitate sealing of the light emitting component 400 on the back side of the circuit board 300 .
图6为本公开实施例提供的光模块中电路板的结构示意图，图7为本公开实施例提供的光模块中电路板与光发射组件的局部装配示意图。如图6、图7所示，电路板300上设置有安装通孔320，光发射组件400的激光器组件嵌在该安装通孔320内，以将激光器组件靠近电路板300的下表面(背面)，如此将光发射组件400反向装配至电路板300上，使得在装配时激光器组件的打线表面高度与电路板300的背面相同，从而使电路板300背面与激光器组件的连接打线最短，以保证优良的高频传输性能。FIG. 6 is a schematic structural diagram of a circuit board in an optical module provided by an embodiment of the present disclosure. FIG. 7 is a partial assembly diagram of a circuit board and a light emitting component in an optical module provided by an embodiment of the present disclosure. As shown in Figures 6 and 7, the circuit board 300 is provided with a mounting through hole 320, and the laser component of the light emitting component 400 is embedded in the mounting through hole 320 to place the laser component close to the lower surface (back surface) of the circuit board 300. , so that the light emitting component 400 is assembled to the circuit board 300 in reverse, so that the wiring surface height of the laser component is the same as the back surface of the circuit board 300 during assembly, so that the connection wiring between the back side of the circuit board 300 and the laser component is the shortest. To ensure excellent high frequency transmission performance.
光发射组件400可包括第一发射壳体401与发射盖板402，激光器组件设置在第一发射壳体401内，第一发射壳体401罩扣于电路板300的正侧，与电路板300的正面密封连接；发射盖板402设置于电路板300的背侧，罩设于安装通孔320上，与电路板300的背面密封连接。如此，第一发射壳体401、电路板300与发射盖板402形成三明治包夹结构。The light emitting assembly 400 may include a first emitting housing 401 and an emitting cover 402. The laser assembly is disposed in the first emitting housing 401. The first emitting housing 401 is buckled on the front side of the circuit board 300 and connected with the circuit board 300. The front side is sealed and connected; the emission cover 402 is arranged on the back side of the circuit board 300, and is covered on the mounting through hole 320, and is sealed and connected with the back side of the circuit board 300. In this way, the first launch housing 401, the circuit board 300 and the launch cover 402 form a sandwich structure.
图8为本公开实施例提供的光模块中一种光发射组件的翻转结构示意图，图9为本公开实施例提供的光模块中一种电路板与光发射组件的另一角度局部装配示意图。如图8、图9所示，光发射组件400可包括第一发射壳体401及设置在第一发射壳体401内的激光器410、准直透镜420、第一光路平移棱镜430、光隔离器440a与光准直器460，该第一发射壳体401的底面(背向电路板300正面的表面)朝向上壳体201，第一发射壳体401包括安装内腔，激光器410、准直透镜420、第一光路平移棱镜430、光隔离器440a与光准 直器460均安装在第一发射壳体401内的安装内腔，且激光器410、准直透镜420与第一光路平移棱镜430的安装高度高于光隔离器440a、光准直器460的安装高度，使得激光器410、准直透镜420与第一光路平移棱镜430通过电路板300上的安装通孔320位于电路板300的背侧，光隔离器440a与光准直器460位于电路板300的正侧。FIG. 8 is a schematic diagram of the flipped structure of a light emitting component in the optical module provided by the embodiment of the present disclosure. FIG. 9 is a partial assembly diagram of a circuit board and the light emitting component in the optical module provided by the embodiment of the present disclosure from another angle. As shown in FIGS. 8 and 9 , the light emitting component 400 may include a first emitting housing 401 and a laser 410 disposed in the first emitting housing 401 , a collimating lens 420 , a first optical path translation prism 430 , and an optical isolator. 440a and optical collimator 460. The bottom surface of the first emitting housing 401 (the surface facing away from the front of the circuit board 300) faces the upper housing 201. The first emitting housing 401 includes a mounting inner cavity, a laser 410, and a collimating lens. 420. The first optical path translation prism 430, the optical isolator 440a and the optical collimator The straightener 460 is installed in the installation cavity in the first emission housing 401, and the installation height of the laser 410, the collimating lens 420 and the first optical path translation prism 430 is higher than the installation height of the optical isolator 440a and the optical collimator 460, The laser 410, the collimating lens 420 and the first optical path translation prism 430 are located on the back side of the circuit board 300 through the mounting through hole 320 on the circuit board 300, and the optical isolator 440a and the optical collimator 460 are located on the front side of the circuit board 300. .
在一些实施例中，第一发射壳体401内的安装内腔朝向电路板正面的一端设置有开口，安装内腔通过开口与电路板300上的安装通孔320相连通，如此设置于安装内腔的激光器410可通过开口嵌入安装通孔320内，使得激光器410的打线安装高度与电路板300的背面相同。In some embodiments, the installation cavity in the first launch housing 401 is provided with an opening at one end toward the front of the circuit board, and the installation cavity is connected to the installation through hole 320 on the circuit board 300 through the opening, so that it is provided in the installation The laser 410 of the cavity can be embedded in the mounting through hole 320 through the opening, so that the wiring installation height of the laser 410 is the same as the back side of the circuit board 300 .
激光器410发射的一路激光光束经由准直透镜420转换为准直光束，准直光束经由第一光路平移棱镜430将位于电路板300背侧的准直光束反射至电路板300的正侧，第一光路平移棱镜430反射的激光光束直接透过光隔离器440a射入光准直器460，经由光准直器460射入光纤600内，再经由光纤600传输至光纤适配器700，实现一路光信号的发射。A laser beam emitted by the laser 410 is converted into a collimated beam through the collimating lens 420. The collimated beam reflects the collimated beam located on the back side of the circuit board 300 to the front side of the circuit board 300 through the first optical path translation prism 430. The first The laser beam reflected by the optical path translation prism 430 directly passes through the optical isolator 440a and is injected into the optical collimator 460. It is injected into the optical fiber 600 through the optical collimator 460, and then transmitted to the optical fiber adapter 700 through the optical fiber 600, thereby realizing the optical signal integration. emission.
在一些实施例中，通过在准直透镜420后方增加一光路平移棱镜，使整个光路移至电路板300的正侧，能够减小电路板300的挖孔面积，也便于在电路板300的背面对光发射组件400进行密封。In some embodiments, by adding an optical path translation prism behind the collimating lens 420 to move the entire optical path to the front side of the circuit board 300 , the digging area of the circuit board 300 can be reduced, and it is also convenient to drill holes on the back side of the circuit board 300 Light emitting assembly 400 is sealed.
对于高传输速率的光模块，如400G，为实现400G光模块的传输速率，需要集成4路光发射器和4路光接收器，因此光发射组件400包括4个光发射器，以实现4路发射光束的发射；光接收组件500包括4个光接收器，以实现4路接收光束的接收。For high transmission rate optical modules, such as 400G, in order to achieve the transmission rate of the 400G optical module, it is necessary to integrate 4 optical transmitters and 4 optical receivers. Therefore, the optical transmitting component 400 includes 4 optical transmitters to achieve 4 optical transmitters. Emission of the transmitting beam; the light receiving component 500 includes 4 optical receivers to realize the reception of the 4 receiving beams.
基于此，光发射组件400包括设置在第一发射壳体401内的多个激光器410、多个准直透镜420、第一光路平移棱镜430、光合波器440、光隔离器440a与光准直器460，多个激光器410、多个准直透镜420、第一光路平移棱镜430、光合波器440、光隔离器440a与光准直器460均安装在第一发射壳体401的安装内腔内，且激光器410、准直透镜420与第一光路平移棱镜430的安装高度高于光合波器440、光隔离器440a的安装高度。Based on this, the light emitting assembly 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, a first optical path translation prism 430, an optical combiner 440, an optical isolator 440a and an optical collimator arranged in the first emitting housing 401. 460, a plurality of lasers 410, a plurality of collimating lenses 420, a first optical path translation prism 430, an optical combiner 440, an optical isolator 440a and an optical collimator 460 are all installed in the installation cavity of the first emission housing 401 within, and the installation height of the laser 410, the collimating lens 420 and the first optical path translation prism 430 is higher than the installation height of the optical combiner 440 and the optical isolator 440a.
多个激光器410、多个准直透镜420通过安装通孔320位于电路板300的背侧，第一光路平移棱镜430的一端通过安装通孔320位于电路板300的背侧、另一端位于电路板300的正侧，光合波器440、光隔离器440a与光准直器460均位于电路板300的正侧。The plurality of lasers 410 and the plurality of collimating lenses 420 are located on the back side of the circuit board 300 through the mounting through holes 320. One end of the first optical path translation prism 430 is located on the back side of the circuit board 300 through the mounting through holes 320, and the other end is located on the circuit board. On the front side of the circuit board 300 , the optical multiplexer 440 , the optical isolator 440 a and the optical collimator 460 are all located on the front side of the circuit board 300 .
多个激光器410分别发射激光光束，该激光光束平行于电路板300的背面；多个准直透镜420将激光器410发射的激光光束转换为准直光束，多个准直光束传输至第一光路平移棱镜430，第一光路平移棱镜430将位于电路板300背侧的激光光束反射至电路板300正侧。The plurality of lasers 410 respectively emit laser beams, which are parallel to the back of the circuit board 300; the plurality of collimating lenses 420 convert the laser beams emitted by the lasers 410 into collimated beams, and the plurality of collimated beams are transmitted to the first optical path for translation The prism 430 and the first optical path translation prism 430 reflect the laser beam located on the back side of the circuit board 300 to the front side of the circuit board 300 .
第一光路平移棱镜430的作用是将多路光束向上平移一定距离，使得后续所有的光器件位置均位于电路板300的正侧，并与电路板300保持适当间隙。这样就避免了光学器件与电路板300之间的位置冲突，从而可以尽可能的减小电路板300的挖孔面积，增加了电路板300上电子器件的排布面积，使得电路板300的布线更加容易。The function of the first optical path translation prism 430 is to translate the multi-path light beam upward for a certain distance, so that all subsequent optical devices are located on the front side of the circuit board 300 and maintain an appropriate gap with the circuit board 300 . In this way, the positional conflict between the optical device and the circuit board 300 is avoided, thereby reducing the hole digging area of the circuit board 300 as much as possible, increasing the arrangement area of the electronic devices on the circuit board 300, and making the wiring of the circuit board 300 easier. much easier.
光合波器440的右侧可包括四个用于入射多种波长信号光的入光口，每一入光口用于入射一种波长的信号光；光合波器440的左侧包括一个用于出射光的出光口。以光合波器440入射λ1、λ2、λ3和λ4的4种波长为例，λ1信号光通过第一入光口进入光合波器440，经过光合波器440内六个不同位置进行了六次不同的反射到达出光口；λ2信号光通过第二入光口进入光合波器440，经过光合波器440内四个不同位置进行了四次不同的反射到达出光口；λ3信号光通过第三入光口进入光合波器440，经过光合波器440内两个不同位置进行了两次不同的反射到达出光口；λ4信号光通过第四入光口进入光合波器440，直接传输到达出光口。如此，通过光合波器440实现不同波长的信号光经不同入光口输入、经同一出光口输出，进而实现不同波长信号光的合光。The right side of the optical multiplexer 440 may include four light entrances for incident signal light of multiple wavelengths, and each light entrance may be used for incident signal light of one wavelength; the left side of the optical multiplexer 440 may include one for incident signal light. The light exit port for emitting light. Taking the four wavelengths of λ1, λ2, λ3 and λ4 incident on the optical multiplexer 440 as an example, the λ1 signal light enters the optical multiplexer 440 through the first light entrance, and passes through six different positions in the optical multiplexer 440 for six different times. The reflection reaches the light exit port; the λ2 signal light enters the optical multiplexer 440 through the second light entrance port, undergoes four different reflections at four different positions in the optical multiplexer 440 and reaches the light exit port; the λ3 signal light passes through the third entrance light The signal light enters the optical multiplexer 440, undergoes two different reflections at two different positions in the optical multiplexer 440, and reaches the light exit port; the λ4 signal light enters the optical multiplexer 440 through the fourth light entrance port, and is directly transmitted to the light exit port. In this way, the optical combiner 440 realizes that signal lights of different wavelengths are input through different light inlets and output through the same light outlet, thereby achieving the combination of signal lights of different wavelengths.
光准直器460的一端***第一发射壳体401的安装内腔内，另一端与光纤600密封连接，即光纤600的一端***光准直器460内，并通过胶水实现光纤600与光准直器460的密封连接。如此光合波器440输出的复合光束经由光准直器460耦合至光纤600内，实现 了一路光束的发射。One end of the optical collimator 460 is inserted into the installation cavity of the first emission housing 401, and the other end is sealed with the optical fiber 600. That is, one end of the optical fiber 600 is inserted into the optical collimator 460, and the optical fiber 600 is aligned with the optical fiber through glue. Sealed connection of straightener 460. In this way, the composite light beam output by the optical combiner 440 is coupled into the optical fiber 600 through the optical collimator 460 to achieve A beam of light was emitted.
在一些实施例中，光合波器440与光准直器460的入光面之间存在间隙，光合波器440输出的复合光束传输至光准直器460的入光面时，因光在不同介质的界面传播会发生反射，复合光束传输至光准直器460的入光面时发生反射，反射光束可能会按照原路返回至激光器410，影响激光器410的高频性能。In some embodiments, there is a gap between the optical multiplexer 440 and the light incident surface of the optical collimator 460. When the composite light beam output by the optical multiplexer 440 is transmitted to the light incident surface of the optical collimator 460, because the light is in different Reflection will occur when propagating at the interface of the medium. The composite beam will be reflected when it is transmitted to the light incident surface of the optical collimator 460. The reflected beam may return to the laser 410 along its original path, affecting the high-frequency performance of the laser 410.
为了避免这一问题，光隔离器440a设置在光合波器440与光准直器460之间，光合波器440射出的复合光束在光准直器460的入光面发生反射时，光隔离器440a用于将反射光束隔离出去，防止反射光束沿原路返回激光器410。In order to avoid this problem, the optical isolator 440a is provided between the optical multiplexer 440 and the optical collimator 460. When the composite light beam emitted by the optical multiplexer 440 is reflected on the light incident surface of the optical collimator 460, the optical isolator 440a 440a is used to isolate the reflected beam and prevent the reflected beam from returning to the laser 410 along the original path.
光准直器460可包括套管、聚焦透镜与单模光纤法兰，套管套在聚焦透镜与单模光纤法兰的外侧，光纤600插在单模光纤法兰内，聚焦透镜的入光面朝向光隔离器、出光面朝向单模光纤法兰，光合波器输出的复合光束经过光隔离器传输至聚焦透镜，聚焦透镜将复合光束汇聚至单模光纤法兰内的光纤600。The optical collimator 460 may include a sleeve, a focusing lens and a single-mode optical fiber flange. The sleeve is placed outside the focusing lens and the single-mode optical fiber flange. The optical fiber 600 is inserted into the single-mode optical fiber flange. The incident light of the focusing lens is The surface faces the optical isolator and the light exit surface faces the single-mode fiber flange. The composite beam output by the optical combiner is transmitted to the focusing lens through the optical isolator. The focusing lens converges the composite beam onto the optical fiber 600 in the single-mode fiber flange.
聚焦透镜可为圆柱形透镜，圆柱形透镜与单模光纤法兰的外径尺寸可略小于套管的内径尺寸，以保证聚焦透镜与单模光纤法兰的耦合度。将聚焦透镜与单模光纤法兰插在套管内时，为提高聚焦透镜与单模光纤法兰的耦合度，可只轴向移动聚焦透镜与单模光纤法兰。The focusing lens can be a cylindrical lens, and the outer diameter of the cylindrical lens and the single-mode optical fiber flange can be slightly smaller than the inner diameter of the casing to ensure the coupling between the focusing lens and the single-mode optical fiber flange. When the focusing lens and the single-mode fiber flange are inserted into the casing, in order to improve the coupling between the focusing lens and the single-mode fiber flange, the focusing lens and the single-mode fiber flange can only be moved axially.
为方便透过光隔离器440a的复合光束射入聚焦透镜内，聚焦透镜突出于套管外，减小了聚焦透镜的入光面与光隔离器440a的出光面之间的距离，使得结构更紧凑。In order to facilitate the composite light beam passing through the optical isolator 440a to be injected into the focusing lens, the focusing lens protrudes outside the sleeve, reducing the distance between the light incident surface of the focusing lens and the light exit surface of the optical isolator 440a, making the structure more compact. compact.
在另外一些实施例中，也可以将圆柱形透镜与单模光纤法兰分开放置，这时圆柱形透镜将改为矩形透镜以方便安装，而且透镜的位置需要进行单独调整以达到耦合的目的。In other embodiments, the cylindrical lens can also be placed separately from the single-mode fiber flange. In this case, the cylindrical lens will be changed to a rectangular lens to facilitate installation, and the position of the lens needs to be adjusted separately to achieve coupling purposes.
在一些实施例中，光发射组件400包括4个激光器、4个准直透镜与一个光路平移棱镜，激光器410与准直透镜420一一对应设置，每个激光器410发射一路激光光束，每个准直透镜420将一路激光光束转换为准直光束，每个准直透镜420射出的准直光束传输至第一光路平移棱镜430，通过第一光路平移棱镜430对准直光束进行反射，以改变激光光束的传输方向及位置。In some embodiments, the light emitting assembly 400 includes 4 lasers, 4 collimating lenses and an optical path translation prism. The lasers 410 and the collimating lenses 420 are arranged in one-to-one correspondence. Each laser 410 emits a laser beam, and each collimator 410 emits a laser beam. The straight lens 420 converts a laser beam into a collimated beam. The collimated beam emitted by each collimating lens 420 is transmitted to the first optical path translation prism 430, and the collimated beam is reflected by the first optical path translation prism 430 to change the laser beam. The transmission direction and position of the beam.
通过第一光路平移棱镜430将位于电路板300背侧的多束激光光束反射至电路板300的正侧后，多束激光光束通过光合波器440合成一路复合光束，复合光束通过光准直器460、光纤600耦合至光纤适配器700，实现多路光信号的发射。After the multiple laser beams located on the back side of the circuit board 300 are reflected to the front side of the circuit board 300 through the first optical path translation prism 430, the multiple laser beams are synthesized into a composite beam through the optical combiner 440, and the composite beam passes through the optical collimator. 460. The optical fiber 600 is coupled to the optical fiber adapter 700 to realize the transmission of multiple optical signals.
图10为本公开实施例提供的光模块中第一发射壳体的结构示意图，图11为本公开实施例提供的光模块中第一发射壳体的另一角度结构示意图。如图10、图11所示，为支撑固定激光器410、准直透镜420、第一光路平移棱镜430、光合波器440与光隔离器440a，第一发射壳体401包括第一接触面4011，第一接触面4011与电路板300的正面密封连接，以实现第一发射壳体401与电路板300正面的密封连接；由第一接触面4011向上壳体201的方向设置有安装内腔，该安装内腔包括第一安装面4110、第二安装面4120与第三安装面4130，第三安装面4130凹陷于第二安装面4120，第二安装面4120凹陷于第一安装面4110，第一安装面4110凹陷于第一接触面4011。即第三安装面4130与电路板300正面的距离大于第二安装面4120与电路板300正面的距离，第二安装面4120与电路板300正面的距离大于第一安装面4110与电路板300正面的距离，第一安装面4110不与电路板300的正面接触，使得第一安装面4110、第二安装面4120、第三安装面4130与第一接触面4011形成台阶面。FIG. 10 is a schematic structural diagram of the first emitting housing in the optical module provided by an embodiment of the present disclosure. FIG. 11 is a schematic structural diagram of the first emitting housing in the optical module provided by an embodiment of the present disclosure from another angle. As shown in Figures 10 and 11, in order to support the fixed laser 410, the collimating lens 420, the first optical path translation prism 430, the optical combiner 440 and the optical isolator 440a, the first emission housing 401 includes a first contact surface 4011, The first contact surface 4011 is sealingly connected to the front surface of the circuit board 300 to achieve a sealing connection between the first launch housing 401 and the front surface of the circuit board 300; an installation inner cavity is provided from the first contact surface 4011 toward the upward housing 201. The installation inner cavity includes a first installation surface 4110, a second installation surface 4120, and a third installation surface 4130. The third installation surface 4130 is recessed in the second installation surface 4120, and the second installation surface 4120 is recessed in the first installation surface 4110. The mounting surface 4110 is recessed in the first contact surface 4011 . That is, the distance between the third mounting surface 4130 and the front of the circuit board 300 is greater than the distance between the second mounting surface 4120 and the front of the circuit board 300 , and the distance between the second mounting surface 4120 and the front of the circuit board 300 is greater than the distance between the first mounting surface 4110 and the front of the circuit board 300 distance, the first mounting surface 4110 does not contact the front surface of the circuit board 300, so that the first mounting surface 4110, the second mounting surface 4120, the third mounting surface 4130 and the first contact surface 4011 form a step surface.
在一些实施例中，形成第一安装面4110、第二安装面4120与第三安装面4130的安装内腔只有朝向电路板300正面的一端设置有开口，第一安装面4110上设置有半导体制冷器460a，半导体制冷器460a通过该开口嵌入电路板300上的安装通孔320内。每个激光器410设置在激光器基板上，每个激光器基板与准直透镜420均设置在半导体制冷器460a的制冷面上，且准直透镜420设置在激光器410的出光方向上，如此激光器410与准直透镜420均通过安装通孔320位于电路板300的背侧。In some embodiments, the mounting cavity forming the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 is only provided with an opening at one end facing the front of the circuit board 300, and a semiconductor refrigeration device is provided on the first mounting surface 4110. The semiconductor refrigerator 460a is embedded into the mounting through hole 320 on the circuit board 300 through the opening. Each laser 410 is disposed on the laser substrate, each laser substrate and the collimating lens 420 are disposed on the cooling surface of the semiconductor refrigerator 460a, and the collimating lens 420 is disposed in the light emitting direction of the laser 410, so that the laser 410 is aligned with the collimator. The straight lenses 420 are located on the back side of the circuit board 300 through the mounting through holes 320 .
第一光路平移棱镜430设置在凹陷于第一安装面4110的第二安装面4120上，该第一 光路平移棱镜430垂直固定于第二安装面4120上，即第一光路平移棱镜430的一端固定在第二安装面4120上、另一端位于电路板300的背侧，如此通过第一光路平移棱镜430将位于电路板300背侧的激光光束反射至电路板300的正侧。The first optical path translation prism 430 is disposed on the second mounting surface 4120 recessed in the first mounting surface 4110. The optical path translation prism 430 is vertically fixed on the second mounting surface 4120, that is, one end of the first optical path translation prism 430 is fixed on the second mounting surface 4120, and the other end is located on the back side of the circuit board 300, so that the first optical path translation prism 430 passes through The laser beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300 .
光合波器440设置在第二安装面4120上，光合波器440位于第一光路平移棱镜430的反射光出射方向上，使得经第一光路平移棱镜430反射的多路激光光束射入光合波器440内。The optical multiplexer 440 is disposed on the second mounting surface 4120. The optical multiplexer 440 is located in the emission direction of the reflected light of the first optical path translation prism 430, so that the multiple laser beams reflected by the first optical path translation prism 430 are injected into the optical multiplexer. Within 440.
光隔离器440a设置在凹陷于第二安装面4120的第三安装面4130上，光隔离器440a位于光合波器440的出光方向上，使得光合波器440输出的复合光束透过光隔离器440a。The optical isolator 440a is disposed on the third mounting surface 4130 recessed in the second mounting surface 4120. The optical isolator 440a is located in the light emitting direction of the optical multiplexer 440, so that the composite light beam output by the optical multiplexer 440 passes through the optical isolator 440a. .
第一发射壳体401内背向激光器410的一端设置有通孔4140，该通孔4140与第一发射壳体401的安装内腔相连通，如此光准直器460通过该通孔4140***第一发射壳体401的安装内腔内，并使得光准直器460的入光面与光隔离器440a的出光面对应设置，如此透过光隔离器440a的复合光束射入光准直器460内，以将复合光束射至光纤600内。A through hole 4140 is provided at one end of the first emitting housing 401 facing away from the laser 410. The through hole 4140 is connected to the installation cavity of the first emitting housing 401, so that the optical collimator 460 is inserted into the first emitting housing 410 through the through hole 4140. The installation cavity of a transmitting housing 401 is such that the light incident surface of the optical collimator 460 and the light exit surface of the optical isolator 440a are arranged correspondingly, so that the composite light beam passing through the optical isolator 440a is injected into the optical collimator. 460 to emit the composite beam into the optical fiber 600.
在一些实施例中，将光准直器460通过通孔4140***第一发射壳体401的安装内腔时，光准直器460与第一发射壳体401的外侧壁密封连接，使得光准直器460与通孔4140之间密封连接，如此，第一发射壳体401罩扣于电路板300的正面后，配合光准直器460能够实现第一发射壳体401内安装内腔的密封性。In some embodiments, when the optical collimator 460 is inserted into the installation cavity of the first emission housing 401 through the through hole 4140, the optical collimator 460 is sealingly connected to the outer wall of the first emission housing 401, so that the light is collimated There is a sealing connection between the straightener 460 and the through hole 4140. In this way, after the first emission housing 401 is buckled on the front side of the circuit board 300, the installation cavity in the first emission housing 401 can be sealed with the help of the optical collimator 460. sex.
在一些实施例中，粘接密封使用胶水采用的UV固化胶和结构固化胶均采用环氧树脂类胶水，此类胶水具有流动性好，可靠性高，可以满足长期在氟化液中稳定工作的要求。In some embodiments, the UV curing glue and structural curing glue used for bonding and sealing are both epoxy resin glues. This type of glue has good fluidity and high reliability, and can meet the requirement of stable operation in fluorinated liquids for a long time. requirements.
在一些实施例中，通过呈台阶设置的第一安装面4110、第二安装面4120与第三安装面4130将半导体制冷器、激光器410、准直透镜420、第一光路平移棱镜430、光合波器440与光隔离器440a固定在第一发射壳体401内腔的安装面上，以形成激光器410、准直透镜420、第一光路平移棱镜430、光合波器440、光隔离器440a之间的安装高度差，并将安装高度相对较高的激光器410与准直透镜420通过电路板300上的安装通孔320设置在电路板300的背侧，将安装高度相对较低的第一光路平移棱镜430、光合波器440与光隔离器440a设置在电路板300的正侧，如此可减小光发射组件400与电路板300在空间上的重叠区域。In some embodiments, the semiconductor refrigerator, the laser 410, the collimating lens 420, the first optical path translation prism 430, and the optical multiplexer are combined through the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 arranged in steps. The device 440 and the optical isolator 440a are fixed on the mounting surface of the inner cavity of the first emission housing 401 to form a space between the laser 410, the collimating lens 420, the first optical path translation prism 430, the optical multiplexer 440 and the optical isolator 440a. The installation height difference is different, and the laser 410 with a relatively high installation height and the collimating lens 420 are arranged on the back side of the circuit board 300 through the installation through hole 320 on the circuit board 300, and the first optical path with a relatively low installation height is translated. The prism 430, the optical combiner 440 and the optical isolator 440a are disposed on the front side of the circuit board 300, which can reduce the spatial overlap area between the light emitting component 400 and the circuit board 300.
在一些实施例中，第一发射壳体401还包括与第一接触面4011相对设置的第一顶面4014，该第一顶面4014朝向上壳体201，第一顶面4014上设置有向第一接触面4011延伸的第一放气孔4013，第一放气孔4013与第一发射壳体401内的第三安装面4130相连通，且该第一放气孔4013为锥形孔，由第一顶面4014向第三安装面4130方向上，该锥形孔的直径尺寸逐渐减小，如此第一发射壳体401可通过该第一放气孔4013与外界连通。In some embodiments, the first launch housing 401 further includes a first top surface 4014 opposite to the first contact surface 4011, the first top surface 4014 facing the upper housing 201, and a directional structure is provided on the first top surface 4014. A first vent hole 4013 extends from the first contact surface 4011. The first vent hole 4013 is connected with the third mounting surface 4130 in the first launch housing 401, and the first vent hole 4013 is a tapered hole formed by the first The diameter of the tapered hole gradually decreases in the direction of the top surface 4014 toward the third mounting surface 4130, so that the first launch housing 401 can communicate with the outside world through the first vent hole 4013.
图12为本公开实施例提供的光模块中一种光发射组件与电路板的局部装配剖视图。如图12所示，将半导体制冷器460a固定在第一发射壳体401的第一安装面4110上，使得半导体制冷器460a的制冷面背向第一安装面4110，然后将安装有激光器410的激光器基板设置在半导体制冷器460a的制冷面上，然后将准直透镜420设置在半导体制冷器460a的制冷面上，且准直透镜420位于激光器410的出光方向上；然后将第一光路平移棱镜430固定在第二安装面4120上，使得第一光路平移棱镜430的一端设置在激光器410的出光方向上；然后将光合波器440固定在第二安装面4120上，使得第一光路平移棱镜430反射的激光光束射入光合波器440内；然后将光隔离器440a固定在第三安装面4130，该光隔离器440a的入光面与光合波器440的出光面对应设置，光隔离器440a的出光面与光准直器460的入光面对应设置。Figure 12 is a partially assembled cross-sectional view of a light emitting component and a circuit board in the optical module provided by an embodiment of the present disclosure. As shown in Figure 12, the semiconductor refrigerator 460a is fixed on the first mounting surface 4110 of the first emission housing 401, so that the cooling surface of the semiconductor refrigerator 460a faces away from the first mounting surface 4110, and then the laser 410 is installed on the The laser substrate is placed on the cooling surface of the semiconductor refrigerator 460a, and then the collimating lens 420 is placed on the cooling surface of the semiconductor refrigerator 460a, and the collimating lens 420 is located in the light emitting direction of the laser 410; then the first optical path is translated by the prism 430 is fixed on the second mounting surface 4120, so that one end of the first optical path translation prism 430 is set in the light emitting direction of the laser 410; then the optical combiner 440 is fixed on the second mounting surface 4120, so that the first optical path translation prism 430 The reflected laser beam is injected into the optical multiplexer 440; then the optical isolator 440a is fixed on the third mounting surface 4130. The light incident surface of the optical isolator 440a is arranged corresponding to the light output surface of the optical multiplexer 440. The optical isolator The light exit surface of 440a is arranged corresponding to the light entrance surface of the light collimator 460.
然后将第一发射壳体401翻转，将第一安装面4110上的激光器410、准直透镜420与第二安装面4120上的第一光路平移棱镜430嵌入电路板300上的安装通孔320内，使得激光器410的打线表面高度与电路板300的背面相同，然后将第一发射壳体401的第一接触面4011与电路板300的正面粘接在一些，使得第二安装面4120上的光合波器440、第三安装面4130上的光隔离器440a处于第一发射壳体401与电路板300正面形成的腔体内。 Then the first emission housing 401 is turned over, and the laser 410 and collimating lens 420 on the first mounting surface 4110 and the first optical path translation prism 430 on the second mounting surface 4120 are embedded into the mounting through hole 320 on the circuit board 300 , so that the wiring surface height of the laser 410 is the same as the back surface of the circuit board 300, and then the first contact surface 4011 of the first emission housing 401 and the front surface of the circuit board 300 are bonded together, so that the second mounting surface 4120 is The optical multiplexer 440 and the optical isolator 440a on the third mounting surface 4130 are located in the cavity formed by the first transmitting housing 401 and the front surface of the circuit board 300 .
然后将发射盖板402的内腔与安装通孔320对应设置，将发射盖板402朝向电路板300背面的接触面粘接至电路板300的背面上，使得位于电路板300背面的激光器410、准直透镜420与第一光路平移棱镜430置于发射盖板402与电路板300背面形成的腔体内。Then, the inner cavity of the emission cover 402 is arranged corresponding to the mounting through hole 320, and the contact surface of the emission cover 402 facing the back of the circuit board 300 is bonded to the back of the circuit board 300, so that the laser 410 located on the back of the circuit board 300, The collimating lens 420 and the first optical path translation prism 430 are placed in the cavity formed by the emission cover 402 and the back surface of the circuit board 300 .
在一些实施例中，将第一接触面4011与电路板300的正面通过UV固化胶和结构固化胶粘接在一起，以实现第一发射壳体401的第一接触面4011与电路板300正面的密封粘接。将发射盖板402朝向电路板300背面的接触面与电路板300的背面通过UV固化胶和结构固化胶粘接在一起，以实现发射盖板402与电路板300背面的密封粘接。如此，将第一发射壳体401粘接于电路板300的正面，将发射盖板402粘接于电路板300的背面，实现了第一发射壳体401、电路板300与发射盖板402的密封装配。In some embodiments, the first contact surface 4011 and the front surface of the circuit board 300 are bonded together through UV curing glue and structural curing glue to realize the first contact surface 4011 of the first emission housing 401 and the front surface of the circuit board 300 sealing bonding. The contact surface of the emission cover 402 facing the back of the circuit board 300 and the back of the circuit board 300 are bonded together through UV curing glue and structural curing glue to achieve sealing bonding between the emission cover 402 and the back of the circuit board 300 . In this way, the first launch housing 401 is bonded to the front side of the circuit board 300, and the launch cover 402 is bonded to the back side of the circuit board 300, thereby realizing the connection between the first launch housing 401, the circuit board 300 and the launch cover 402. Sealed assembly.
在一些实施例中，第一发射壳体401为相对完整的壳体结构，可以容纳所有光学及电学部件，并形成完整的密封截面。位于电路板300背面的发射盖板402设计为简单的空腔结构，也形成完整的密封截面。在装配时，第一发射壳体401、电路板300与发射盖板402形成三明治包夹结构，在第一发射壳体401与电路板300正面的接触界面上胶密封，发射盖板402与电路板300背面的接触界面上胶密封，再配合光准直器460形成完整的密闭腔体结构。In some embodiments, the first emission housing 401 is a relatively complete housing structure that can accommodate all optical and electrical components and form a complete sealing section. The emission cover 402 located on the back of the circuit board 300 is designed as a simple cavity structure and also forms a complete sealing section. During assembly, the first launch housing 401, the circuit board 300 and the launch cover 402 form a sandwich structure, and the contact interface between the first launch housing 401 and the front of the circuit board 300 is glue-sealed, and the launch cover 402 and the circuit The contact interface on the back side of the board 300 is sealed with glue, and then combined with the optical collimator 460 to form a complete sealed cavity structure.
将第一发射壳体401、电路板300与发射盖板402形成密封腔体，并在所有密封操作完成之后将第一发射壳体401上的第一放气孔4013进行封闭，以保证在第一发射壳体401、电路板300、发射盖板402的密封过程中所有密封区域不会由于空气膨胀导致出现漏气孔。The first launch housing 401, the circuit board 300 and the launch cover 402 form a sealed cavity, and after all sealing operations are completed, the first vent hole 4013 on the first launch housing 401 is closed to ensure that the first During the sealing process of the launch casing 401, the circuit board 300, and the launch cover 402, no air leakage holes will occur in all sealing areas due to air expansion.
将光发射组件400的第一发射壳体401、电路板300与发射盖板402密封装配好后，激光器410在电路板300传送的驱动电流作用下发射激光光束，激光光束经由准直透镜420转换为准直光束，准直光束经由第一光路平移棱镜430进行反射，使得位于电路板300背侧的准直光束反射至电路板300正侧，反射后的多路准直光束经由光合波器440转换为一路复合光束，复合光束直接透过光隔离器440a射入光准直器460，经由光准直器460传输至光纤600内，实现光的发射。After the first emission housing 401, circuit board 300 and emission cover 402 of the light emitting assembly 400 are sealed and assembled, the laser 410 emits a laser beam under the action of the driving current transmitted by the circuit board 300, and the laser beam is converted by the collimating lens 420 It is a collimated beam. The collimated beam is reflected by the first optical path translation prism 430, so that the collimated beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300. The reflected multi-channel collimated beam passes through the optical multiplexer 440. It is converted into a composite beam, and the composite beam directly passes through the optical isolator 440a and enters the optical collimator 460, and is transmitted to the optical fiber 600 through the optical collimator 460 to realize light emission.
在一些实施例中，电路板300的正面上设置有DSP芯片310，该DSP芯片310用于高频信号的处理，并将高频信号传输至激光器410，为激光器410发射激光光束提供信号，使得激光器410产生信号光。In some embodiments, a DSP chip 310 is provided on the front side of the circuit board 300. The DSP chip 310 is used for high-frequency signal processing and transmits the high-frequency signal to the laser 410 to provide a signal for the laser 410 to emit a laser beam, so that Laser 410 generates signal light.
具体地，电路板300的正面上设置有从DSP芯片310到留给光发射组件400的插孔端的高频信号连接线，如此将从金手指端传过来的高频信号，经过DSP芯片310处理后再经由高频信号线传输给光发射组件400。Specifically, the front side of the circuit board 300 is provided with a high-frequency signal connection line from the DSP chip 310 to the jack end left for the light emitting component 400, so that the high-frequency signal transmitted from the golden finger end is processed by the DSP chip 310 Then it is transmitted to the light emitting component 400 via a high-frequency signal line.
为了将DSP芯片310的高频信号传输至激光器410，在DSP芯片310的Tx输出焊盘下面设置有高频信号过孔，该高频信号过孔贯穿电路板300的正面与背面，高频信号过孔的上端与DSP芯片310的Tx输出焊盘电连接，高频信号过孔的下端与布设在电路板300背面的高频信号线电连接，该高频信号线通过打线与激光器410电连接。如此位于电路板300正面的DSP芯片310通过连接在其Tx输出焊盘的高频信号线将电路板300上的高频信号从电路板300的正面传输到电路板300的反面，以将高频信号传输至位于电路板300背侧的激光器410，以实现光发射组件400与电路板300的高频信号连接，使得激光器410发射信号光。In order to transmit the high-frequency signal of the DSP chip 310 to the laser 410, a high-frequency signal via is provided under the Tx output pad of the DSP chip 310. The high-frequency signal via penetrates the front and back of the circuit board 300. The high-frequency signal via is The upper end of the via hole is electrically connected to the Tx output pad of the DSP chip 310, and the lower end of the high-frequency signal via hole is electrically connected to the high-frequency signal line laid on the back of the circuit board 300. The high-frequency signal line is electrically connected to the laser 410 through wiring. connect. In this way, the DSP chip 310 located on the front side of the circuit board 300 transmits the high-frequency signal on the circuit board 300 from the front side of the circuit board 300 to the back side of the circuit board 300 through the high-frequency signal line connected to its Tx output pad, so as to transmit the high-frequency signal to the back side of the circuit board 300 . The signal is transmitted to the laser 410 located on the back side of the circuit board 300 to realize a high-frequency signal connection between the light emitting component 400 and the circuit board 300, so that the laser 410 emits signal light.
在一些实施例中，电路板300上设置有多个高频信号过孔，多个高频信号过孔设置在安装通孔320的右侧，每个高频信号过孔与激光器410一一对应连接，使得连接每个高频信号过孔的高频信号线与激光器410连接，将电路板300传输的高频信号传送至激光器410，以满足光发射组件400所需要的高频信号。In some embodiments, the circuit board 300 is provided with multiple high-frequency signal via holes, and the multiple high-frequency signal via holes are arranged on the right side of the mounting through hole 320 . Each high-frequency signal via hole corresponds to the laser 410 one-to-one. The connection is such that the high-frequency signal line connecting each high-frequency signal via hole is connected to the laser 410, and the high-frequency signal transmitted by the circuit board 300 is transmitted to the laser 410 to meet the high-frequency signal required by the light emitting component 400.
在一些实施例中，电路板300的背面上还布设有直流信号线，该直流信号线与激光器410电连接，以通过直流信号线传输的偏置电流驱动激光器410发光。传输偏置电流的直流信号线可从电路板300上安装通孔320的右侧通过打线的方式引过来，激光器410接收到直流信号线传输的偏置电流后能够发光，而高频信号线传输到激光器410后，激光器410 将高频信号调制至光束中，使得激光器410产生信号光。In some embodiments, a DC signal line is also arranged on the back of the circuit board 300. The DC signal line is electrically connected to the laser 410, and the bias current transmitted through the DC signal line drives the laser 410 to emit light. The DC signal line that transmits the bias current can be led from the right side of the installation through hole 320 on the circuit board 300 by wiring. The laser 410 can emit light after receiving the bias current transmitted by the DC signal line, and the high-frequency signal line After transmission to laser 410, laser 410 The high-frequency signal is modulated into the light beam, so that the laser 410 generates signal light.
传输偏置电流的直流信号线还可从安装通孔320的上侧、下侧连接至激光器410，即连接激光器410的直流信号线与高频信号线位于安装通孔320的不同侧，这样既避免了高频信号与直流信号之间的干扰，也使直流信号的走线更短，避免电路板300中布线过度拥挤。The DC signal line that transmits the bias current can also be connected to the laser 410 from the upper and lower sides of the mounting through hole 320, that is, the DC signal line and the high frequency signal line connecting the laser 410 are located on different sides of the mounting through hole 320, so that both Interference between high-frequency signals and DC signals is avoided, and the routing of DC signals is also made shorter, thereby avoiding overcrowding of wiring in the circuit board 300 .
图13为本公开实施例提供的光模块中一种光发射组件与电路板的另一局部装配示意图。如图13所示，第一光路平移棱镜430包括第一反射镜4310与第二反射镜4320，第一反射镜4310位于激光器410的出光方向上，准直透镜420输出的准直光束射至第一反射镜4310，准直光束在第一反射镜4310处进行反射，反射后的准直光束在第二反射镜4320处再次反射，再次反射后的准直光束位于电路板300的正侧。FIG. 13 is another partial assembly diagram of a light emitting component and a circuit board in the optical module provided by an embodiment of the present disclosure. As shown in Figure 13, the first optical path translation prism 430 includes a first reflector 4310 and a second reflector 4320. The first reflector 4310 is located in the light emitting direction of the laser 410, and the collimated beam output by the collimator lens 420 is emitted to the second reflector. A reflector 4310 , the collimated beam is reflected at the first reflector 4310 , the reflected collimated beam is reflected again at the second reflector 4320 , and the reflected collimated beam is located on the front side of the circuit board 300 .
激光器410在电路板300传输的偏置电流、高频信号的驱动下发射激光信号，为检测激光器410的发射光功率，电路板300的背面设置有光探测器330，光探测器330设置在电路板300上安装通孔320的左侧边缘，且该光探测器330的光敏面朝向激光器410的出光方向，用于采集激光器410发射的前向光，并将采集到的数据发送至电路板300上的相关器件，以实现对激光器410前向出光功率的监控。The laser 410 emits a laser signal driven by the bias current and high-frequency signal transmitted by the circuit board 300. In order to detect the emitted optical power of the laser 410, a photodetector 330 is provided on the back of the circuit board 300. The photodetector 330 is provided on the circuit board. The left edge of the through hole 320 is installed on the board 300 , and the photosensitive surface of the photodetector 330 faces the light emitting direction of the laser 410 for collecting the forward light emitted by the laser 410 and sending the collected data to the circuit board 300 Related devices on the laser 410 to monitor the forward light power of the laser 410.
在一些实施例中，光探测器330位于发射盖板402的内腔内，以将光探测器330置于发射盖板402与电路板300背面形成的密封腔体内，以保证光发射组件400的密封性。In some embodiments, the photodetector 330 is located in the inner cavity of the emitting cover 402, so that the photodetector 330 is placed in the sealed cavity formed by the emitting cover 402 and the back of the circuit board 300 to ensure that the light emitting component 400 Tightness.
在一些实施例中，利用第一反射镜4310反射面的透光特性，使少部分准直光束漏过第一反射镜4310，并射入光探测器330的光敏面上，使得光探测器330能够接收到部分光束，从而得到激光器410的发射光功率。In some embodiments, the light transmission characteristics of the reflective surface of the first reflector 4310 are used to cause a small part of the collimated light beam to leak through the first reflector 4310 and enter the photosensitive surface of the photodetector 330, so that the photodetector 330 Part of the beam can be received, thereby obtaining the emitted optical power of the laser 410 .
具体地，第一光路平移棱镜430的第一反射镜4310朝向激光器410的出光方向上，用于将激光器410产生的激光光束分为两束光，一束光(通常占95％的总功率)被第一反射镜4310反射至第二反射镜4320，以将激光光束由电路板300的背侧反射至电路板300的正侧，另一束光直接透过第一反射镜4310射入光探测器330的光敏面，通过该光敏面接收激光器410出光面发射的激光光束。Specifically, the first reflector 4310 of the first optical path translation prism 430 faces the light emitting direction of the laser 410, and is used to divide the laser beam generated by the laser 410 into two beams of light, one beam of light (usually accounting for 95% of the total power) It is reflected by the first reflector 4310 to the second reflector 4320 to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300. Another beam of light directly passes through the first reflector 4310 and enters the light detection The photosensitive surface of the laser 330 receives the laser beam emitted from the light output surface of the laser 410 through the photosensitive surface.
将光探测器330贴装在安装通孔320的左侧时，可将光探测器330的光敏面与安装通孔320的内侧壁相平齐，以方便对光探测器330进行定位。When the photodetector 330 is mounted on the left side of the mounting through hole 320, the photosensitive surface of the photodetector 330 can be flush with the inner wall of the mounting through hole 320 to facilitate positioning of the photodetector 330.
将光探测器330设置在电路板300的背面上时，可将光探测器330中光敏面的中心轴线与激光器410的中心轴线相重合，并将光探测器330朝向电路板300背面的侧面通过表面组装技术(SMT)安装于电路板300的背面，使得透过第一反射镜4310的光束尽可能地射入光探测器330内。When disposing the photodetector 330 on the back of the circuit board 300, the central axis of the photosensitive surface of the photodetector 330 can be coincident with the central axis of the laser 410, and the photodetector 330 can be passed toward the side of the back of the circuit board 300. Surface mounting technology (SMT) is mounted on the back of the circuit board 300 so that the light beam passing through the first reflector 4310 is incident into the photodetector 330 as much as possible.
在一些实施例中，电路板300的背面设置有4个光探测器330，每个光探测器330与每个激光器410对应设置，如此每个光探测器330采集每个激光器410发射的激光光束透过第一反射镜4310的部分光束，并通过与光探测器330电连接的器件测得相应激光器410的前向出光功率。In some embodiments, four photodetectors 330 are provided on the back of the circuit board 300, and each photodetector 330 is arranged corresponding to each laser 410, so that each photodetector 330 collects the laser beam emitted by each laser 410. Part of the light beam passes through the first reflecting mirror 4310, and the forward light power of the corresponding laser 410 is measured through a device electrically connected to the photodetector 330.
由于光探测器330接收的是有一定面积的平行光，光探测器330的装配位置精度要求低，装配更加容易，只要将第一光路平移棱镜430中第一反射镜4310的透光范围与光探测器330的光敏面相对齐即可，使得光探测器330能够采集到透过第一反射镜4310的激光光束。Since the photodetector 330 receives parallel light with a certain area, the assembly position accuracy of the photodetector 330 is low, and the assembly is easier. As long as the first optical path is translated, the light transmission range of the first reflector 4310 in the prism 430 is consistent with the light transmission range. The photosensitive surfaces of the detector 330 only need to be aligned, so that the photodetector 330 can collect the laser beam that passes through the first reflecting mirror 4310 .
将光探测器330固定在电路板300的背面上时，光探测器330与电路板300背面连接的侧面上设置有阳极，阳极可以直接焊接或者通过导电胶等方式固定在电路板300上的接地金属层上；光探测器330背向电路板300背面的侧面上设置有阴极，阴极通过打线与电路板300电连接，进而实现光探测器330与电路板300的电连接。When the photodetector 330 is fixed on the back of the circuit board 300, an anode is provided on the side where the photodetector 330 is connected to the back of the circuit board 300. The anode can be directly welded or fixed to the ground on the circuit board 300 through conductive glue or other methods. On the metal layer, a cathode is provided on the side of the photodetector 330 facing away from the back of the circuit board 300. The cathode is electrically connected to the circuit board 300 through wiring, thereby realizing the electrical connection between the photodetector 330 and the circuit board 300.
将光发射组件400反向安装至电路板300的正面后，光发射组件400中第一发射壳体401的第一顶面4014与上壳体201接触；将光发射组件400中激光器410通过高频信号线与电路板300正面的DSP芯片310信号连接后，激光器410在电路板300传输的直流和高 频信号驱动下产生激光光束，如此激光器410会产生热量从而温度升高，而激光器410的发光性能受到温度的影响，因此激光器410需工作在某一固定温度范围，所以需要将激光器410放置在半导体制冷器460a上，以保证激光器410的工作温度，而半导体制冷器460a在制冷过程中会产生大量热量，需要将这些热量传播出去，以保证半导体制冷器460a的制冷效率。After the light emitting assembly 400 is installed on the front side of the circuit board 300 in reverse, the first top surface 4014 of the first emitting housing 401 in the light emitting assembly 400 is in contact with the upper housing 201; the laser 410 in the light emitting assembly 400 is passed through the high After the frequency signal line is connected to the DSP chip 310 signal on the front of the circuit board 300, the laser 410 transmits DC and high voltage signals on the circuit board 300. A laser beam is generated under the driving of a frequency signal, so that the laser 410 will generate heat and the temperature will rise. The luminous performance of the laser 410 is affected by temperature, so the laser 410 needs to work in a certain fixed temperature range, so the laser 410 needs to be placed on a semiconductor On the refrigerator 460a to ensure the operating temperature of the laser 410, the semiconductor refrigerator 460a will generate a large amount of heat during the cooling process, and this heat needs to be dissipated to ensure the cooling efficiency of the semiconductor refrigerator 460a.
由于激光器410固定在第一发射壳体401的第一安装面4110上的半导体制冷器460a上，激光器410产生的热量会通过半导体制冷器460a传输至第一发射壳体401上，以保持激光器410的温度。为提高光模块的散热性能，第一发射壳体401可采用钨铜或其他具有良好导热性的金属材料，并适当增加第一发射壳体401的质量以及第一顶面4014的面积，如此激光器410及半导体制冷器460a工作产生的热量可通过第一发射壳体401传输至上壳体201，有效改善激光器410的散热效果。Since the laser 410 is fixed on the semiconductor refrigerator 460a on the first mounting surface 4110 of the first emission housing 401, the heat generated by the laser 410 will be transmitted to the first emission housing 401 through the semiconductor refrigerator 460a to maintain the laser 410 temperature. In order to improve the heat dissipation performance of the optical module, the first emitting housing 401 can be made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the first emitting housing 401 and the area of the first top surface 4014 can be appropriately increased, so that the laser The heat generated by the operation of 410 and semiconductor refrigerator 460a can be transmitted to the upper housing 201 through the first emission housing 401, effectively improving the heat dissipation effect of the laser 410.
在一些实施例中，第一发射壳体401需要选用钨铜或其他具有良好导热性的金属材料，并适当增加第一发射壳体401的质量及底面的面积，从而增加第一发射壳体401与上壳体201的接触面积，进而提高光发射组件400的散热效率。In some embodiments, the first launch housing 401 needs to be made of tungsten copper or other metal materials with good thermal conductivity, and the mass and bottom surface area of the first launch housing 401 need to be appropriately increased, thereby increasing the size of the first launch housing 401 The contact area with the upper housing 201 further improves the heat dissipation efficiency of the light emitting component 400 .
在一些实施例中，为方便将第一发射壳体401的热量传输至上壳体201，可在第一发射壳体401的第一顶面4014与上壳体201内侧面之间设置第一导热垫片，如此第一发射壳体401的热量传输至第一导热垫片，第一导热垫片将热量传输至上壳体201，以有效改善散热效果。In some embodiments, in order to facilitate the transfer of heat from the first emission housing 401 to the upper housing 201, a first thermal conductor may be provided between the first top surface 4014 of the first emission housing 401 and the inner surface of the upper housing 201. gasket, so that the heat of the first emission housing 401 is transferred to the first thermal conductive pad, and the first thermal conductive pad transmits the heat to the upper shell 201 to effectively improve the heat dissipation effect.
在一些实施例中，第一导热垫片可为导热胶，既能通过导热胶将第一发射壳体401的第一顶面4014粘贴于上壳体201的内侧面，又能将第一发射壳体401的热量传导至上壳体201。In some embodiments, the first thermally conductive pad can be thermally conductive glue, which can not only stick the first top surface 4014 of the first emission housing 401 to the inner side of the upper housing 201 through the thermally conductive glue, but also can paste the first emitter The heat of the housing 401 is conducted to the upper housing 201 .
在一些实施例中，光模块的最主要热源除了激光器410与半导体制冷器460a外，还有DSP芯片310，该DSP芯片310背向电路板300的侧面与上壳体201相接触，如此DSP芯片310工作产生的热量传输至上壳体201上，以将DSP芯片310产生的热量传输至光模块外侧。In some embodiments, in addition to the laser 410 and the semiconductor refrigerator 460a, the main heat source of the optical module is the DSP chip 310. The DSP chip 310 is in contact with the upper case 201 on the side facing away from the circuit board 300. In this way, the DSP chip 310 The heat generated by the operation of 310 is transferred to the upper housing 201 to transfer the heat generated by the DSP chip 310 to the outside of the optical module.
为方便将DSP芯片310的热量传输至上壳体201，可在DSP芯片310与上壳体201内侧面之间设置第二导热垫片，如此DSP芯片310产生的热量传输至第二导热垫片，第二导热垫片将热量传输至上壳体201，以有效改善散热效果。In order to facilitate the transfer of heat from the DSP chip 310 to the upper case 201, a second thermal pad can be provided between the DSP chip 310 and the inner side of the upper case 201, so that the heat generated by the DSP chip 310 is transferred to the second thermal pad. The second thermal pad transfers heat to the upper case 201 to effectively improve the heat dissipation effect.
在一些实施例中，光接收组件500与光发射组件400可并排设置在电路板300上，光接收组件500与电路板300形成封闭腔体结构，以实现光接收组件500的密封装配。In some embodiments, the light receiving component 500 and the light emitting component 400 can be disposed side by side on the circuit board 300 , and the light receiving component 500 and the circuit board 300 form a closed cavity structure to achieve a sealed assembly of the light receiving component 500 .
图14为本公开实施例提供的光模块中一种光接收组件的翻转结构示意图，图15为本公开实施例提供的光模块中一种光接收组件的另一角度结构示意图。如图14、图15所示，本公开实施例提供的光接收组件500包括接收壳体501a，该接收壳体501a罩扣于电路板300的正侧，与电路板300的正面密封连接；该接收壳体501a包括朝向电路板300的第二接触面5011与背向电路板300的第二顶面5140，第二接触面5011上设置有安装槽5120，该安装槽5120朝向电路板300正面的一端设置有开口，且安装槽5120由第二接触面5011向第二顶面5140方向延伸。FIG. 14 is a schematic diagram of the flipped structure of a light receiving component in the optical module provided by an embodiment of the present disclosure. FIG. 15 is a schematic structural diagram of a light receiving component in the optical module provided by an embodiment of the present disclosure from another angle. As shown in Figures 14 and 15, the light receiving component 500 provided by the embodiment of the present disclosure includes a receiving housing 501a, which is buckled on the front side of the circuit board 300 and is sealingly connected to the front side of the circuit board 300; The receiving housing 501a includes a second contact surface 5011 facing the circuit board 300 and a second top surface 5140 facing away from the circuit board 300. The second contact surface 5011 is provided with a mounting groove 5120, and the mounting groove 5120 faces the front of the circuit board 300. An opening is provided at one end, and the mounting groove 5120 extends from the second contact surface 5011 toward the second top surface 5140 .
接收壳体501a的安装槽5120内设置有分波器520、透镜阵列530、反射棱镜540与接收光准直器550，接收光准直器550的一端***接收壳体501a的安装槽5120内、另一端与光纤600密封连接，光纤600的另一端与光纤适配器700连接，如此外部光信号通过光纤适配器700射入光纤600，通过光纤600传输至接收光准直器550，通过接收光准直器550传输至安装槽5120内。The wavelength splitter 520, the lens array 530, the reflecting prism 540 and the receiving light collimator 550 are disposed in the mounting groove 5120 of the receiving housing 501a. One end of the receiving light collimator 550 is inserted into the mounting groove 5120 of the receiving housing 501a. The other end is sealedly connected to the optical fiber 600, and the other end of the optical fiber 600 is connected to the optical fiber adapter 700, so that the external optical signal is injected into the optical fiber 600 through the optical fiber adapter 700, and is transmitted to the receiving light collimator 550 through the optical fiber 600, and passes through the receiving light collimator 550 is transferred to the installation slot 5120.
在一些实施例中，将接收光准直器550***接收壳体501a的安装槽5120时，接收光准直器550的外侧面与接收壳体501a的外侧壁之间的连接处通过密封胶密封，以保证接收光准直器550与接收壳体501a的密封连接。In some embodiments, when the receiving light collimator 550 is inserted into the mounting groove 5120 of the receiving housing 501a, the connection between the outer side of the receiving light collimator 550 and the outer side wall of the receiving housing 501a is sealed by sealant. , to ensure the sealed connection between the receiving light collimator 550 and the receiving housing 501a.
在安装槽5120内，接收光准直器550的出光面与分波器520的入光面对应设置，分 波器520的出光面与透镜阵列530的入光面对应设置，透镜阵列530的出光面与反射棱镜540对应设置。如此经由光纤600传输至接收光准直器550的接收光传送至分波器520，通过分波器520将一路接收光解复用为多路分光束，多路分光束分别射至透镜阵列530，通过透镜阵列530分别将多路分光束传输至反射棱镜540，反射棱镜540将多路分光束反射至电路板300上的接收芯片上，以实现光的接收。In the installation groove 5120, the light exit surface of the receiving light collimator 550 is arranged corresponding to the light entrance surface of the wavelength splitter 520. The light-emitting surface of the wave device 520 is arranged corresponding to the light-incident surface of the lens array 530 , and the light-emitting surface of the lens array 530 is arranged corresponding to the reflecting prism 540 . The received light transmitted to the receiving light collimator 550 through the optical fiber 600 is transmitted to the demultiplexer 520, and the demultiplexer 520 demultiplexes one received light into multiple split beams, and the multiple split beams are respectively emitted to the lens array 530. , the multiplexed beams are respectively transmitted to the reflective prism 540 through the lens array 530, and the reflective prism 540 reflects the multiplexed beams to the receiving chip on the circuit board 300 to achieve light reception.
在一些实施例中，将分波器520、透镜阵列530、反射棱镜540与接收光准直器550分别安装至接收壳体501a内后，将接收壳体501a的第二接触面5011粘接固定至电路板300的正面上。将第二接触面5011通过UV固化胶和结构固化胶与电路板300的正面粘接在一起，实现了接收壳体501a与电路板300正面的密封装配。In some embodiments, after the wavelength splitter 520, the lens array 530, the reflecting prism 540 and the receiving light collimator 550 are respectively installed into the receiving housing 501a, the second contact surface 5011 of the receiving housing 501a is bonded and fixed. to the front side of the circuit board 300 . The second contact surface 5011 is bonded to the front of the circuit board 300 through UV curing glue and structural curing glue, thereby achieving a sealed assembly between the receiving housing 501a and the front of the circuit board 300.
在粘接第二接触面5011与电路板300时，接收壳体501a通过开口将电路板300正面上的接收芯片、跨阻放大器及打线所需安全区域均置于安装槽5120内，并使得接收芯片位于反射棱镜540的下方，如此保证了反射棱镜540反射的分光束射至接收芯片，实现光电转换。When the second contact surface 5011 and the circuit board 300 are bonded, the receiving shell 501a places the receiving chip, the transimpedance amplifier and the safe area required for wiring on the front side of the circuit board 300 into the installation slot 5120 through the opening, and makes the The receiving chip is located below the reflective prism 540, which ensures that the split light beams reflected by the reflective prism 540 are directed to the receiving chip to achieve photoelectric conversion.
在一些实施例中，接收壳体501a的第二顶面5140朝向上壳体201，第二顶面5140上设置有向第二接触面5011延伸的第二放气孔5013，该第二放气孔5013与接收壳体501a的安装槽5120相连通，且该第二放气孔5013为锥形孔，由第二顶面5140向第二接触面5011方向上，该锥形孔的直径尺寸逐渐减小，如此接收壳体501a可通过该第二放气孔5013与外界连通。In some embodiments, the second top surface 5140 of the receiving housing 501a faces the upper housing 201. The second top surface 5140 is provided with a second vent hole 5013 extending toward the second contact surface 5011. The second vent hole 5013 It is connected with the mounting groove 5120 of the receiving housing 501a, and the second air release hole 5013 is a tapered hole. The diameter of the tapered hole gradually decreases from the second top surface 5140 to the second contact surface 5011. In this way, the receiving housing 501a can communicate with the outside world through the second vent hole 5013.
图16为本公开实施例提供的光模块中一种光接收组件与电路板的局部装配剖视图。如图16所示，将接收光准直器550***接收壳体501a内，然后将分波器520安装至接收壳体501a的安装槽5120内，使得分波器520的入光面与接收光准直器550的出光面对应设置；然后将透镜阵列530安装至接收壳体501a的安装槽5120内，使得透镜阵列530的入光面与分波器520的出光面对应设置；然后将反射棱镜540安装至透镜阵列530的出光面处；然后将接收壳体501a反向安装至电路板300的正面，将接收壳体501a的第二接触面5011与电路板300的正面粘接在一起，使得接收壳体501a罩设电路板300上的接收芯片、TIA，并使得反射棱镜540位于接收芯片的正上方。Figure 16 is a partially assembled cross-sectional view of a light receiving component and a circuit board in the optical module provided by an embodiment of the present disclosure. As shown in Figure 16, insert the receiving light collimator 550 into the receiving housing 501a, and then install the demultiplexer 520 into the installation groove 5120 of the receiving housing 501a, so that the light incident surface of the demultiplexer 520 is in contact with the received light. The light-emitting surface of the collimator 550 is set correspondingly; and then the lens array 530 is installed into the installation groove 5120 of the receiving housing 501a, so that the light-incident surface of the lens array 530 and the light-emitting surface of the wavelength splitter 520 are set correspondingly; and then the The reflective prism 540 is installed on the light exit surface of the lens array 530; then the receiving housing 501a is installed in reverse to the front of the circuit board 300, and the second contact surface 5011 of the receiving housing 501a is bonded to the front of the circuit board 300. , so that the receiving housing 501a covers the receiving chip and TIA on the circuit board 300, and the reflecting prism 540 is located directly above the receiving chip.
如此，光纤传输的外部光信号传输至接收光准直器550，光信号经由接收光准直器550射入分波器520，经由分波器520将一路光束解复用为多路分光束，多路分光束经由透镜阵列530转换为多路汇聚光束，多路汇聚光束经由反射棱镜540进行反射，反射后的多路汇聚光束分别射入电路板300上的接收芯片，通过接收芯片将光信号转换为电信号，转换后的电信号经由TIA进行放大，放大后的电信号传输至DSP芯片310内，电信号经由DSP芯片310处理后通过金手指传送至上位机，实现了光的接收。In this way, the external optical signal transmitted by the optical fiber is transmitted to the receiving optical collimator 550, and the optical signal is injected into the splitter 520 through the receiving optical collimator 550, and one beam is demultiplexed into multiple split beams through the splitter 520. The multiplexed beams are converted into multiplexed beams through the lens array 530. The multiplexed beams are reflected by the reflecting prism 540. The reflected multiplexed beams are respectively injected into the receiving chip on the circuit board 300, and the optical signal is transmitted through the receiving chip. Converted into electrical signals, the converted electrical signals are amplified by TIA, and the amplified electrical signals are transmitted to the DSP chip 310. The electrical signals are processed by the DSP chip 310 and then transmitted to the host computer through the golden finger, thereby realizing light reception.
在一些实施例中，对光发射组件400与光接收组件500进行密封封装的方式并不仅限于上述实施例所述的封装方式，还可将光发射组件400的发射壳体形成独立的壳体，将电路板300伸入发射壳体的缺口中，使得电路板300与光发射组件400共同组成封闭壳体的一部分。In some embodiments, the method of sealing and packaging the light emitting component 400 and the light receiving component 500 is not limited to the packaging method described in the above embodiments. The emitting shell of the light emitting component 400 can also be formed into an independent shell. The circuit board 300 is extended into the gap of the emitting housing, so that the circuit board 300 and the light emitting component 400 together form a part of the closed housing.
图17为本公开实施例提供的光模块中另一种光发射组件、光接收组件、电路板与光纤的装配示意图，图18为本公开实施例提供的光模块中另一种光发射组件与电路板的局部装配示意图。如图17、图18所示，光发射组件400采用正面向上(正装)的光发射器结构，使得光发射组件400的正面与上壳体201相接触；一束光纤600与光发射组件400连接，光发射组件400射出的发射光束通过光纤600传输出去，以实现光的发射。Figure 17 is a schematic diagram of the assembly of another light emitting component, a light receiving component, a circuit board and an optical fiber in an optical module provided by an embodiment of the present disclosure. Figure 18 is a schematic diagram of another light emitting component and an optical fiber in an optical module provided by an embodiment of the present disclosure. Partial assembly diagram of the circuit board. As shown in Figures 17 and 18, the light emitting component 400 adopts a front-up (formal installation) light emitter structure, so that the front side of the light emitting component 400 is in contact with the upper housing 201; a bundle of optical fibers 600 is connected to the light emitting component 400 , the emission beam emitted by the light emitting component 400 is transmitted through the optical fiber 600 to realize light emission.
光接收组件500与光发射组件400设置在电路板300的同一侧，另一束光纤600与光接收组件500连接，外部光信号通过光纤600传输至光接收组件500，通过光接收组件500进行光电转换，以实现光的接收。The light receiving component 500 and the light emitting component 400 are arranged on the same side of the circuit board 300. Another bundle of optical fibers 600 is connected to the light receiving component 500. The external optical signal is transmitted to the light receiving component 500 through the optical fiber 600, and photoelectricity is performed through the light receiving component 500. conversion to achieve light reception.
图19为本公开实施例提供的光模块中另一种电路板的结构示意图。如图19所示，本公开在电路板300上挖孔，将光发射组件400嵌在电路板300上的孔内，并将电路板300 伸入光发射组件400的缺口中，电路板300与光发射组件400共同组成封闭壳体的一部分。Figure 19 is a schematic structural diagram of another circuit board in an optical module provided by an embodiment of the present disclosure. As shown in Figure 19, the present disclosure digs holes in the circuit board 300, embeds the light emitting component 400 in the hole on the circuit board 300, and inserts the circuit board 300 into the hole. Extending into the notch of the light emitting component 400, the circuit board 300 and the light emitting component 400 together form a part of the closed housing.
具体地，电路板300上设置有插孔340，该插孔340贯穿电路板300，且插孔340的一侧(图19所示的上侧)设置有开口，使得该插孔340形成一U型孔。光发射组件400的外边缘设置有卡槽，光发射组件400通过卡槽***该插孔340内，即插孔340的左侧边缘伸入光发射组件400的左侧卡槽中，插孔340的右侧边缘伸入光发射组件400的右侧卡槽中，插孔340的下侧(图19所示)边缘伸入光发射组件400的前侧(图18所示)卡槽中，且从电路板300的上侧(如图19所示)观察，能够看到光发射组件400的后侧(图18所示)侧壁。Specifically, the circuit board 300 is provided with a jack 340, which penetrates the circuit board 300, and is provided with an opening on one side of the jack 340 (the upper side shown in Figure 19), so that the jack 340 forms a U. hole. The outer edge of the light emitting component 400 is provided with a card slot. The light emitting component 400 is inserted into the jack 340 through the card slot. That is, the left edge of the jack 340 extends into the left card slot of the light emitting component 400. The jack 340 The right edge of the jack 340 extends into the right card slot of the light emitting component 400, the lower edge (shown in Figure 19) of the jack 340 extends into the front side (shown in Figure 18) of the light emitting component 400, and Viewed from the upper side of the circuit board 300 (shown in FIG. 19 ), the rear side wall (shown in FIG. 18 ) of the light emitting component 400 can be seen.
图20为本公开实施例提供的光模块中另一种光发射组件的结构示意图。如图20所示，光发射组件400包括第二发射壳体404，第二发射壳体404包括朝向上壳体201的顶面4041；第二发射壳体404的内腔包括安装槽，安装槽的顶面设置有开口，开口所在的顶面与第二发射壳体404的顶面4041为同一表面。即第二发射壳体404的顶面4041上设置有开口，该开口与第二发射壳体404内腔的安装槽相连通。Figure 20 is a schematic structural diagram of another light emitting component in the optical module provided by an embodiment of the present disclosure. As shown in Figure 20, the light emitting assembly 400 includes a second emitting housing 404. The second emitting housing 404 includes a top surface 4041 facing the upper housing 201; the inner cavity of the second emitting housing 404 includes a mounting groove. The top surface of is provided with an opening, and the top surface where the opening is located is the same surface as the top surface 4041 of the second launch housing 404 . That is, the top surface 4041 of the second launch housing 404 is provided with an opening, and the opening is connected with the installation groove in the inner cavity of the second launch housing 404 .
第二发射壳体404还包括上盖板403，该上盖板403盖合于安装槽的开口侧，使得上盖板403与第二发射壳体404形成腔体结构。在一些实施例中，该上盖板403盖合于第二发射壳体404时，可使用UV固化胶和结构固化胶将上盖板403与第二发射壳体404粘接密封。The second launch housing 404 also includes an upper cover plate 403 that covers the opening side of the installation groove, so that the upper cover plate 403 and the second launch housing 404 form a cavity structure. In some embodiments, when the upper cover 403 is covered with the second emission housing 404, UV curing glue and structural curing glue can be used to bond and seal the upper cover 403 and the second emission housing 404.
第二发射壳体404的外侧壁上还设置有卡槽406，第二发射壳体404通过该卡槽406***电路板300的插孔340内，且卡槽406的上侧位于电路板300的正侧，卡槽406的下侧位于电路板300的背侧。如此，第二发射壳体404通过卡槽406卡固于电路板300上，以实现第二发射壳体404与电路板300的固定。A card slot 406 is also provided on the outer wall of the second launch housing 404. The second launch shell 404 is inserted into the jack 340 of the circuit board 300 through the card slot 406, and the upper side of the card slot 406 is located on the circuit board 300. On the front side, the lower side of the card slot 406 is located on the back side of the circuit board 300 . In this way, the second launch housing 404 is fixed on the circuit board 300 through the slot 406 to achieve the fixation of the second launch housing 404 and the circuit board 300 .
在一些实施例中，卡槽406上侧部分在左右方向的长度尺寸大于卡槽406的下侧部分在左右方向的长度尺寸，卡槽406在左右方向的长度尺寸可等于或小于卡槽406的下侧部分在左右方向的长度尺寸，使得第二发射壳体404形成中间部分窄、两侧部分宽的形状，以方便将第二发射壳体404***插孔340。In some embodiments, the length dimension of the upper part of the card slot 406 in the left-right direction is greater than the length dimension of the lower part of the card slot 406 in the left-right direction. The length dimension of the card slot 406 in the left-right direction may be equal to or smaller than the length dimension of the card slot 406 . The length dimension of the lower part in the left-right direction makes the second launch housing 404 form a shape with a narrow middle part and wide side parts, so as to facilitate the insertion of the second launch housing 404 into the jack 340 .
在一些实施例中，将第二发射壳体404通过卡槽406***电路板300的插孔340内，在第二发射壳体404内腔的安装槽内设置光发射组件400的光学器件，然后将上盖板403盖合在一体结构上，使得上盖板403、第二发射壳体404和电路板300形成完整的密封腔体。In some embodiments, the second emission housing 404 is inserted into the jack 340 of the circuit board 300 through the slot 406, and the optical device of the light emission assembly 400 is set in the installation slot in the inner cavity of the second emission housing 404, and then The upper cover 403 is covered on the integrated structure, so that the upper cover 403, the second launch housing 404 and the circuit board 300 form a complete sealed cavity.
在一些实施例中，上盖板403上设置有第三放气孔4031，该第三放气孔4031与第二发射壳体404的安装槽相连通。第三放气孔4031的封闭是在所有密封操作完成之后再进行，以保证在密封过程中所有密封区域不会由于空气膨胀导致出现漏气孔。第三放气孔4031可为锥形孔，由上盖板403的顶面向底面方向上，锥形孔的直径尺寸逐渐减小，如此第二发射壳体404可通过该第三放气孔4031与外界连通。In some embodiments, the upper cover 403 is provided with a third air release hole 4031 , and the third air release hole 4031 is connected with the installation groove of the second launch housing 404 . The third vent hole 4031 is closed after all sealing operations are completed to ensure that no leak holes will occur in all sealing areas due to air expansion during the sealing process. The third vent hole 4031 may be a tapered hole. The diameter of the tapered hole gradually decreases from the top to the bottom of the upper cover 403, so that the second launch housing 404 can communicate with the outside world through the third vent hole 4031. Connected.
图21为本公开实施例提供的光模块中另一种发射壳体的结构示意图，图22为本公开实施例提供的光模块中另一种发射壳体的另一角度结构示意图。如图21、图22所示，第二发射壳体404下侧的外侧壁包括第一侧面4051、第二侧面4052、第三侧面4053与第四侧面4054，第一侧面4051与第四侧面4054相对设置，第二侧面4052与第三侧面4053相对设置，且第一侧面4051与插孔340的下侧(图19所示的下侧)对应设置，第二侧面4052与插孔340的左侧电路板对应设置，第三侧面4053与插孔340的右侧电路板对应设置，第四侧面4054与插孔340的开口对应设置。FIG. 21 is a schematic structural diagram of another emitting housing in an optical module provided by an embodiment of the present disclosure. FIG. 22 is a schematic structural diagram of another emitting housing in an optical module provided by an embodiment of the present disclosure from another angle. As shown in Figures 21 and 22, the outer outer wall of the lower side of the second launch housing 404 includes a first side 4051, a second side 4052, a third side 4053 and a fourth side 4054. The first side 4051 and the fourth side 4054 The second side 4052 and the third side 4053 are arranged oppositely, and the first side 4051 is arranged correspondingly to the lower side of the jack 340 (the lower side shown in Figure 19), and the second side 4052 is opposite to the left side of the jack 340. The circuit boards are arranged correspondingly, the third side 4053 is arranged correspondingly to the circuit board on the right side of the jack 340 , and the fourth side 4054 is arranged correspondingly to the opening of the jack 340 .
在一些实施例中，卡槽406包括第一凹槽4061、第二凹槽4062与第三凹槽4063，第一凹槽4061设置于第一侧面4051上，第二凹槽4062设置于第二侧面4052上，第三凹槽4063设置于第三侧面4053上。第一凹槽4061、第二凹槽4062与第三凹槽4063均朝向第二发射壳体404的外侧开口，且第一凹槽4061的一端与第二凹槽4062连通、另一端与第三凹槽4063相连通。如此，卡槽406为第一凹槽4061、第二凹槽4062与第三凹槽4063 形成的一U型凹槽。In some embodiments, the slot 406 includes a first groove 4061, a second groove 4062 and a third groove 4063. The first groove 4061 is provided on the first side 4051, and the second groove 4062 is provided on the second side. On the side 4052, a third groove 4063 is provided on the third side 4053. The first groove 4061, the second groove 4062 and the third groove 4063 all open toward the outside of the second launch housing 404, and one end of the first groove 4061 is connected to the second groove 4062, and the other end is connected to the third groove 4061. The grooves 4063 are connected. In this way, the card slot 406 is the first groove 4061, the second groove 4062 and the third groove 4063. A U-shaped groove is formed.
在一些实施例中，第二发射壳体404通过卡槽406***电路板300的插孔340时，插孔340的三侧面分别***第一凹槽4061、第二凹槽4062与第三凹槽4063内，以通过电路板300支撑固定第二发射壳体404。In some embodiments, when the second launch housing 404 is inserted into the jack 340 of the circuit board 300 through the slot 406, the three sides of the jack 340 are inserted into the first groove 4061, the second groove 4062 and the third groove respectively. 4063 to support and fix the second launch housing 404 through the circuit board 300 .
将光发射组件400***插孔340时，首先将第二发射壳体404的第一侧面4051朝向插孔340的开口，然后向内移动第二发射壳体404，使得插孔340下侧的电路板伸入第一凹槽4061内，插孔340的左侧电路板伸入第二凹槽4062内，插孔340的右侧电路板伸入第三凹槽4063内，第四侧面4054通过插孔340的上侧开口显露出来。When inserting the light emitting assembly 400 into the jack 340, first move the first side 4051 of the second emitting housing 404 toward the opening of the jack 340, and then move the second emitting housing 404 inward so that the circuit on the lower side of the jack 340 The board extends into the first groove 4061, the left circuit board of the jack 340 extends into the second groove 4062, the right circuit board of the jack 340 extends into the third groove 4063, and the fourth side 4054 passes through the plug. The upper side opening of hole 340 is exposed.
在一些实施例中，将插孔340侧边的电路板伸入第一凹槽4061、第二凹槽4062与第三凹槽4063时，电路板300的正面与第一凹槽4061、第二凹槽4062、第三凹槽4063的上侧壁粘接，以实现电路板300与第二发射壳体404的固定。In some embodiments, when the circuit board on the side of the jack 340 is extended into the first groove 4061, the second groove 4062, and the third groove 4063, the front surface of the circuit board 300 is in contact with the first groove 4061, the second groove 4061, and the third groove 4063. The upper side walls of the groove 4062 and the third groove 4063 are bonded to achieve fixation of the circuit board 300 and the second launch housing 404 .
将电路板300的正面与第一凹槽4061、第二凹槽4062、第三凹槽4063的上侧壁相粘接后，电路板300的背面与第一凹槽4061、第二凹槽4062、第三凹槽4063的下侧壁之间可粘接在一起，即电路板300的厚度与第一凹槽4061、第二凹槽4062、第三凹槽4063在上下方向的尺寸一致，以保证电路板300与第二发射壳体404的安装密封性。After the front side of the circuit board 300 is bonded to the upper side walls of the first groove 4061, the second groove 4062, and the third groove 4063, the back side of the circuit board 300 is bonded to the first groove 4061, the second groove 4062. , the lower side walls of the third groove 4063 can be bonded together, that is, the thickness of the circuit board 300 is consistent with the dimensions of the first groove 4061, the second groove 4062, and the third groove 4063 in the up and down directions, so that The installation sealing performance of the circuit board 300 and the second launch housing 404 is ensured.
在一些实施例中，电路板300的背面与第一凹槽4061、第二凹槽4062、第三凹槽4063的下侧壁之间也可存在间隙，但该间隙与第二发射壳体404内的安装槽不连通，不影响电路板300与第二发射壳体404的安装密封性。In some embodiments, there may also be a gap between the back side of the circuit board 300 and the lower side walls of the first groove 4061 , the second groove 4062 , and the third groove 4063 , but the gap is not connected with the second launch housing 404 The installation grooves inside are not connected, which does not affect the installation sealing of the circuit board 300 and the second launch housing 404.
图23为本公开实施例提供的光模块中另一种光发射组件的分解结构示意图。如图23所示，第二发射壳体404内安装槽的一端设置有缺口4042，该缺口4042背向光纤适配器700，插孔340右侧(图19所示)的电路板300伸入该缺口4042内，且电路板300与缺口4042密封连接，使得电路板300与第二发射壳体404内的光发射器件电连接。FIG. 23 is an exploded structural diagram of another light emitting component in the optical module provided by an embodiment of the present disclosure. As shown in Figure 23, a gap 4042 is provided at one end of the installation groove in the second launch housing 404. The gap 4042 faces away from the fiber optic adapter 700, and the circuit board 300 on the right side of the jack 340 (shown in Figure 19) extends into the gap. 4042, and the circuit board 300 is sealingly connected to the notch 4042, so that the circuit board 300 is electrically connected to the light emitting device in the second emitting housing 404.
具体地，安装槽内设置有缺口4042的一端设置有半导体制冷器460a，半导体制冷器460a的制冷面上设置有激光器410与准直透镜420，准直透镜420设置在激光器410的出光方向上，激光器410通过打线与伸入缺口4042的电路板300电连接，激光器410的打线表面高度与电路板300的正面处于同一高度上，如此连接电路板300与激光器410的连接打线最短，以保证优良的高频传输性能。Specifically, a semiconductor refrigerator 460a is provided at one end of the installation groove with a notch 4042. A laser 410 and a collimating lens 420 are provided on the cooling surface of the semiconductor refrigerator 460a. The collimating lens 420 is provided in the light emitting direction of the laser 410. The laser 410 is electrically connected to the circuit board 300 extending into the notch 4042 through wiring. The height of the wiring surface of the laser 410 is at the same height as the front of the circuit board 300. In this way, the wiring connecting the circuit board 300 and the laser 410 is the shortest. Guarantee excellent high frequency transmission performance.
在一些实施例中，激光器410的出光高度与电路板300的正面大致相同，可通过光束平移棱镜将激光光束上移至电路板300上方，以减小电路板300上的挖孔区域，也使挖孔的结构呈矩形，方便在光发射组件400与电路板300接触位置做上胶密封处理。In some embodiments, the light output height of the laser 410 is approximately the same as the front surface of the circuit board 300 , and the laser beam can be moved upward above the circuit board 300 through a beam translation prism to reduce the digging area on the circuit board 300 and also make the The structure of the hole is rectangular, which facilitates glue sealing at the contact position between the light emitting component 400 and the circuit board 300 .
具体地，第二发射壳体404的安装槽内还设置有第二光路平移棱镜480，第二光路平移棱镜480设置在激光器410的出光方向上，激光器410发射的激光光束经由准直透镜420转换为准直光束，准直光束经由第二光路平移棱镜480将位于电路板300正面的准直光束反射至电路板300正面的上方。Specifically, a second optical path translation prism 480 is also provided in the installation groove of the second emission housing 404. The second optical path translation prism 480 is arranged in the light emitting direction of the laser 410. The laser beam emitted by the laser 410 is converted by the collimating lens 420. It is a collimated light beam. The collimated light beam reflects the collimated light beam located on the front of the circuit board 300 to above the front of the circuit board 300 through the second optical path translation prism 480 .
第二光路平移棱镜480的作用是将激光光束向上平移一定距离，使得后续所有的光器件位置均位于电路板300正面的上侧，并与电路板300保持适当间隙。这样就避免了光学器件与电路板300之间的位置冲突，从而可以尽可能的减小电路板300的挖孔面积，增加了电路板300上电气器件的排布面积，使得电路板300的布线更加容易。The function of the second optical path translation prism 480 is to translate the laser beam upward by a certain distance, so that all subsequent optical devices are located on the upper side of the front of the circuit board 300 and maintain an appropriate gap with the circuit board 300 . In this way, the positional conflict between the optical device and the circuit board 300 is avoided, thereby reducing the hole digging area of the circuit board 300 as much as possible, increasing the arrangement area of the electrical devices on the circuit board 300, and making the wiring of the circuit board 300 easier. much easier.
在一些实施例中，光发射组件400还包括光准直器460，光准直器460的入光面与第二光路平移棱镜480的出光面对应设置。光准直器460的一端***第二发射壳体404的安装槽内、另一端与光纤600密封连接，通过光准直器460实现了光纤600与第二发射壳体404的密封连接。如此，经第二光路平移棱镜480反射上移的激光光束射入光准直器460内，再经由光准直器460耦合进入光纤600内。In some embodiments, the light emitting component 400 further includes a light collimator 460 , the light incident surface of the light collimator 460 is disposed corresponding to the light exit surface of the second optical path translation prism 480 . One end of the optical collimator 460 is inserted into the installation groove of the second emission housing 404, and the other end is sealedly connected to the optical fiber 600. The optical collimator 460 realizes the sealed connection between the optical fiber 600 and the second emission housing 404. In this way, the laser beam reflected and moved upward by the second optical path translation prism 480 is injected into the optical collimator 460 , and then coupled into the optical fiber 600 through the optical collimator 460 .
在一些实施例中，光发射组件400还包括光隔离器440a，光隔离器440a的入光面与第二光路平移棱镜480的出光面对应设置，光隔离器440a的出光面与光准直器460的入光面对应设置，如此，经第二光路平移棱镜480反射上移的激光光束直接透过光隔离器440a 射入光准直器460内；反射的激光光束在光准直器460的入光面发生反射时，光隔离器440a用于将反射光束隔离出去，防止反射光束沿原路返回激光器410。In some embodiments, the light emitting component 400 further includes an optical isolator 440a. The light incident surface of the optical isolator 440a is arranged corresponding to the light exit surface of the second optical path translation prism 480. The light exit surface of the optical isolator 440a is aligned with the light collimator. The light incident surface of the detector 460 is arranged correspondingly. In this way, the upward-moving laser beam reflected by the second optical path translation prism 480 directly passes through the optical isolator 440a. The laser beam is incident into the optical collimator 460; when the reflected laser beam is reflected on the light incident surface of the optical collimator 460, the optical isolator 440a is used to isolate the reflected beam to prevent the reflected beam from returning to the laser 410 along the original path.
在一些实施例中，第二发射壳体404通过卡槽406***电路板300的插孔340时，第二发射壳体404内的一部分安装槽位于电路板300的背侧，另一部分安装槽位于电路板300的正侧。In some embodiments, when the second launch housing 404 is inserted into the jack 340 of the circuit board 300 through the card slot 406, part of the installation slots in the second launch housing 404 is located on the back side of the circuit board 300, and the other part of the installation slots is located on the back side of the circuit board 300. The front side of the circuit board 300.
在一些实施例中，为提高光模块的传输速率，需要集成多路光发射器，因此光发射组件400可包括多个激光器410，以实现多路发射光束的发射。基于此，光发射组件400包括设置在安装槽内的多个激光器410、多个准直透镜420、光合波器440、第二光路平移棱镜480、光隔离器440a与光准直器460，多个激光器410与多个准直透镜420安装在位于电路板300背侧的安装槽内，光合波器440、第二光路平移棱镜480、光隔离器440a安装在位于电路板300正侧的安装槽内，以通过第二光路平移棱镜480将位于电路板300正面的激光光束上移。In some embodiments, in order to increase the transmission rate of the optical module, multiple optical emitters need to be integrated. Therefore, the light emitting component 400 may include multiple lasers 410 to achieve emission of multiple emission beams. Based on this, the light emitting assembly 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, an optical combiner 440, a second optical path translation prism 480, an optical isolator 440a and an optical collimator 460, and more A laser 410 and a plurality of collimating lenses 420 are installed in the installation groove located on the back side of the circuit board 300. The optical combiner 440, the second optical path translation prism 480, and the optical isolator 440a are installed in the installation groove located on the front side of the circuit board 300. , the laser beam located on the front side of the circuit board 300 is moved upward through the second optical path translation prism 480 .
图24为本公开实施例提供的另一种发射壳体的结构示意图，图25为本公开实施例提供的另一种发射壳体的另一角度结构示意图。如图24、图25所示，为支撑固定激光器410、准直透镜420、光合波器440、第二光路平移棱镜480与光隔离器440a，第二发射壳体404内的安装槽包括第四安装面4045、第五安装面4044与第六安装面4043，第四安装面4045与缺口4042相连通，第四安装面4045凹陷于第五安装面4044，第五安装面4044凹陷于第六安装面4043，使得第四安装面4045、第五安装面4044与第六安装面4043形成台阶面。FIG. 24 is a schematic structural diagram of another launch housing provided by an embodiment of the present disclosure, and FIG. 25 is a schematic structural diagram of another launch housing provided by an embodiment of the present disclosure from another angle. As shown in Figures 24 and 25, in order to support and fix the laser 410, the collimating lens 420, the optical combiner 440, the second optical path translation prism 480 and the optical isolator 440a, the installation groove in the second emission housing 404 includes a fourth The mounting surface 4045, the fifth mounting surface 4044 and the sixth mounting surface 4043 are connected. The fourth mounting surface 4045 is connected with the gap 4042. The fourth mounting surface 4045 is recessed in the fifth mounting surface 4044, and the fifth mounting surface 4044 is recessed in the sixth mounting surface. surface 4043, so that the fourth mounting surface 4045, the fifth mounting surface 4044 and the sixth mounting surface 4043 form a step surface.
在一些实施例中，第四安装面4045位于电路板300的背侧，第五安装面4044与第六安装面4043均位于电路板300的正侧。In some embodiments, the fourth mounting surface 4045 is located on the back side of the circuit board 300 , and both the fifth mounting surface 4044 and the sixth mounting surface 4043 are located on the front side of the circuit board 300 .
在一些实施例中，第四安装面4045与第三凹槽4063的下侧壁可为同一平面，使得第三凹槽4063相对的两侧壁均设置有缺口，电路板300通过该缺口伸入第二发射壳体404的安装槽内。In some embodiments, the fourth mounting surface 4045 and the lower side wall of the third groove 4063 may be on the same plane, so that the opposite side walls of the third groove 4063 are both provided with gaps through which the circuit board 300 extends. into the installation groove of the second launch housing 404.
在一些实施例中，第三凹槽4063的上侧壁上可设置有通孔，该通孔与缺口4042上下连通，如此电路板300伸入缺口4042后，伸入的电路板300可通过通孔显露出来，方便在显露部分的电路板300上设置电器件、打线等，以方便对电路板300与激光器410进行打线连接。In some embodiments, a through hole can be provided on the upper side wall of the third groove 4063, and the through hole is connected up and down with the notch 4042. In this way, after the circuit board 300 extends into the notch 4042, the inserted circuit board 300 can pass through the through hole. The holes are exposed to facilitate the installation of electrical components, wiring, etc. on the exposed portion of the circuit board 300, so as to facilitate the wiring connection between the circuit board 300 and the laser 410.
在一些实施例中，第四安装面4045可与电路板300的背面相平齐，电路板300伸入缺口4042时，第四安装面4045可与电路板300的背面粘接固定；第四安装面4045也可凹陷于电路板300的背面，使得电路板300的背面与第四安装面4045之间存在间隙。In some embodiments, the fourth mounting surface 4045 can be flush with the back of the circuit board 300. When the circuit board 300 extends into the gap 4042, the fourth mounting surface 4045 can be bonded and fixed with the back of the circuit board 300; fourth installation The surface 4045 can also be recessed in the back of the circuit board 300 so that there is a gap between the back of the circuit board 300 and the fourth mounting surface 4045 .
在第四安装面4045上设置有向下凹陷的第七安装面4046，该第七安装面4046由第四安装面4045向下壳体202的方向凹陷，且第七安装面4046在左右方向的尺寸小于第四安装面4045在左右方向的尺寸，使得第七安装面4046也位于电路板300的背侧。A seventh mounting surface 4046 that is recessed downward is provided on the fourth mounting surface 4045. The seventh mounting surface 4046 is recessed from the fourth mounting surface 4045 in the direction of the downward housing 202, and the seventh mounting surface 4046 is in the left-right direction. The size is smaller than the size of the fourth mounting surface 4045 in the left-right direction, so that the seventh mounting surface 4046 is also located on the back side of the circuit board 300 .
半导体制冷器460a设置在第七安装面4046上，且半导体制冷器460a朝向缺口4042一侧的侧壁可与第四安装面4045、第七安装面4046之间的连接面相抵接，以减小半导体制冷器460a与伸入缺口4042的电路板300之间的距离。The semiconductor refrigerator 460a is disposed on the seventh mounting surface 4046, and the side wall of the semiconductor refrigerator 460a facing the notch 4042 can be in contact with the connection surface between the fourth mounting surface 4045 and the seventh mounting surface 4046 to reduce the risk of The distance between the semiconductor refrigerator 460a and the circuit board 300 extending into the notch 4042.
将激光器410与准直透镜420依次设置在半导体制冷器460a的制冷面上，由于第七安装面4046凹陷于第四安装面4045，因此将半导体制冷器460a、激光器410与准直透镜420设于第七安装面4046后，可使得激光器410的打线表面高度与电路板300的正面相同。The laser 410 and the collimating lens 420 are arranged on the cooling surface of the semiconductor refrigerator 460a in sequence. Since the seventh mounting surface 4046 is recessed in the fourth mounting surface 4045, the semiconductor refrigerator 460a, the laser 410 and the collimating lens 420 are arranged on After the seventh mounting surface 4046 , the height of the wiring surface of the laser 410 can be the same as that of the front surface of the circuit board 300 .
光合波器440设置在第五安装面4044上，且光合波器440的入光面与准直透镜420的出光面对应设置，如此准直透镜420输出的准直光束可射入光合波器440内，如此，准直光束在光合波器440内进行合波处理。The optical multiplexer 440 is disposed on the fifth mounting surface 4044, and the light incident surface of the optical multiplexer 440 is disposed corresponding to the light exit surface of the collimating lens 420, so that the collimated light beam output by the collimating lens 420 can be injected into the optical multiplexer. 440, in this way, the collimated beam is combined in the optical combiner 440.
第二光路平移棱镜480的一端设置在第五安装面4044上、另一端突出于第六安装面4043，如此光合波器440输出的复合光束在第二光路平移棱镜480的一反射镜作用下向上反射，反射后的复合光束在另一反射镜的作用下向左反射，如此将与电路板300正面平齐 的复合光束反射上移至电路板300正面的上方。One end of the second optical path translation prism 480 is disposed on the fifth mounting surface 4044, and the other end protrudes from the sixth mounting surface 4043. In this way, the composite light beam output by the optical combiner 440 is upward under the action of a reflector of the second optical path translation prism 480. Reflection, the reflected composite beam is reflected to the left under the action of another reflector, so that it will be flush with the front of the circuit board 300 The composite beam reflection moves upward to the front of the circuit board 300 .
第二发射壳体404背向缺口4042的一端设置有透光孔4047，光准直器460的入光面通过该透光孔4047***第二发射壳体404内，且光准直器460的安装高度高于第六安装面4043。光隔离器440a设置在第六安装面4043上，如此第二光路平移棱镜480输出的反射光束直接透过光隔离器440a射入光准直器460内。The end of the second emission housing 404 facing away from the notch 4042 is provided with a light-transmitting hole 4047. The light-incident surface of the optical collimator 460 is inserted into the second emission housing 404 through the light-transmitting hole 4047, and the light-incident surface of the optical collimator 460 is inserted into the second emission housing 404. The installation height is higher than the sixth installation surface 4043. The optical isolator 440a is disposed on the sixth mounting surface 4043, so that the reflected light beam output by the second optical path translation prism 480 directly passes through the optical isolator 440a and enters the optical collimator 460.
在第一实施例中，光准直器460通过透光孔4047***第二发射壳体404的安装槽后，光准直器460与第二发射壳体404的外侧壁密封连接，以通过光准直器460实现第二发射壳体404内安装槽的密封性。In the first embodiment, after the optical collimator 460 is inserted into the installation groove of the second emission housing 404 through the light-transmitting hole 4047, the optical collimator 460 is sealingly connected to the outer side wall of the second emission housing 404 to allow light to pass through. The collimator 460 achieves sealing of the installation groove in the second launch housing 404 .
图26为本公开实施例提供的光模块中另一种光发射组件的局部结构示意图，图27为本公开实施例提供的光模块中另一种光发射组件的剖视图。如图26、图27所示，将半导体制冷器460a固定在第二发射壳体404的第七安装面4046上，然后将安装有激光器410的激光器基板设置在半导体制冷器460a的制冷面上，使得激光器410的打线表面高度与电路板300的正面相同；然后将准直透镜420设置在半导体制冷器460a的制冷面上，且准直透镜420位于激光器410的出光方向上；然后将光合波器440固定在第五安装面4044上，使得多个激光器410发射的多路激光光束在光合波器440内进行合波；然后将第二光路平移棱镜480固定在第五安装面4044上，使得第二光路平移棱镜480的一端设置在光合波器440的出光方向上；然后将光隔离器440a安装在第六安装面4043上，使得第二光路平移棱镜480另一端反射的复合光束透过光隔离器440a，透过光隔离器440a的复合光束通过光准直器460射入光纤600内；然后将上盖板403粘接盖合于第二发射壳体404内安装槽顶面的开口侧，使得上盖板403、第二发射壳体404共同组成封闭壳体的一部分。FIG. 26 is a partial structural schematic diagram of another light emitting component in an optical module provided by an embodiment of the present disclosure. FIG. 27 is a cross-sectional view of another light emitting component in an optical module provided by an embodiment of the present disclosure. As shown in Figures 26 and 27, the semiconductor refrigerator 460a is fixed on the seventh mounting surface 4046 of the second emission housing 404, and then the laser substrate mounted with the laser 410 is placed on the cooling surface of the semiconductor refrigerator 460a. Make the height of the wiring surface of the laser 410 the same as the front surface of the circuit board 300; then set the collimating lens 420 on the cooling surface of the semiconductor refrigerator 460a, and the collimating lens 420 is located in the light emitting direction of the laser 410; then combine the light The detector 440 is fixed on the fifth mounting surface 4044, so that the multiple laser beams emitted by the plurality of lasers 410 are combined in the optical multiplexer 440; and then the second optical path translation prism 480 is fixed on the fifth mounting surface 4044, so that One end of the second optical path translation prism 480 is arranged in the light emitting direction of the optical multiplexer 440; and then the optical isolator 440a is installed on the sixth mounting surface 4043, so that the composite beam reflected by the other end of the second optical path translation prism 480 passes through the light. Isolator 440a, the composite light beam passing through the optical isolator 440a is injected into the optical fiber 600 through the optical collimator 460; then the upper cover 403 is bonded and closed to the opening side of the top surface of the installation groove in the second launch housing 404 , so that the upper cover 403 and the second launch housing 404 together form a part of the closed housing.
图28为本公开实施例提供的光模块中另一种光发射组件与电路板的局部装配剖视图。如图28所示，将第二发射壳体404通过卡槽406***电路板300的插孔340内，使得插孔340的左侧电路板(如图18所示)***第二发射壳体404的缺口4042内，***缺口4042的电路板300背面可与第二发射壳体404的第四安装面4045相平齐；插孔340的右侧、前侧***卡槽406的第二凹槽4062、第一凹槽4061内，以通过卡槽406实现电路板300与第二发射壳体404的固定连接。FIG. 28 is a partial assembly cross-sectional view of another light emitting component and a circuit board in an optical module according to an embodiment of the present disclosure. As shown in Figure 28, insert the second launch housing 404 into the jack 340 of the circuit board 300 through the card slot 406, so that the circuit board on the left side of the jack 340 (shown in Figure 18) is inserted into the second launch housing 404. In the notch 4042, the back of the circuit board 300 inserted into the notch 4042 can be flush with the fourth mounting surface 4045 of the second launch housing 404; the right and front sides of the jack 340 are inserted into the second groove 4062 of the card slot 406 , in the first groove 4061, so as to achieve a fixed connection between the circuit board 300 and the second launch housing 404 through the slot 406.
将第二发射壳体404通过卡槽406与电路板300粘接固定后，将半导体制冷器460a固定在第七安装面4046上，将激光器410、准直透镜420固定在半导体制冷器460a的制冷面上，然后将光合波器440、第二光路平移棱镜480固定在第五安装面4044上，然后将光隔离器440a固定在第六安装面4043上。After the second emission housing 404 is bonded and fixed to the circuit board 300 through the slot 406, the semiconductor refrigerator 460a is fixed on the seventh mounting surface 4046, and the laser 410 and the collimating lens 420 are fixed on the cooling section of the semiconductor refrigerator 460a. On the surface, the optical combiner 440 and the second optical path translation prism 480 are then fixed on the fifth mounting surface 4044, and then the optical isolator 440a is fixed on the sixth mounting surface 4043.
如此金手指端传过来的高频信号经过DSP芯片310处理后，经由布设在电路板300正面的高频信号线、打线传送至激光器410，驱动多个激光器410发射多路激光光束，多路激光光束经由多个准直透镜420转换为多路准直光束；多路准直光束经由光合波器440复合为一路复合光束，复合光束经第二光路平移棱镜480反射上移至电路板300正面的上侧，反射后的复合光束直接透过光隔离器440a射入光准直器460，经由光准直器460射入光纤600内，实现了多路光束经一束光纤的发射。In this way, the high-frequency signal transmitted from the gold finger end is processed by the DSP chip 310, and then transmitted to the laser 410 through the high-frequency signal lines and wiring laid on the front of the circuit board 300, driving multiple lasers 410 to emit multiple laser beams. The laser beam is converted into multiple collimated beams through multiple collimating lenses 420; the multiple collimated beams are combined into one composite beam through the optical combiner 440, and the composite beam is reflected by the second optical path translation prism 480 and moves up to the front of the circuit board 300 On the upper side, the reflected composite light beam directly passes through the optical isolator 440a and is injected into the optical collimator 460, and then is injected into the optical fiber 600 through the optical collimator 460, thereby realizing the emission of multiple light beams through a bundle of optical fibers.
在一些实施例中，DSP芯片310设置在电路板300的正面，而激光器410的打线表面高度与电路板300的正面相同，因此在电路板300的正面由DSP芯片310至插孔340布设有高频信号连接线，这一面的电路设计只要是为了将从金手指端传过来的高频信号，经过DSP芯片310处理后再经由高频信号线传送给激光器410。In some embodiments, the DSP chip 310 is disposed on the front side of the circuit board 300 , and the wiring surface height of the laser 410 is the same as the front side of the circuit board 300 . Therefore, the DSP chip 310 to the jack 340 is arranged on the front side of the circuit board 300 . High-frequency signal connection line, the circuit design on this side is only for the high-frequency signal transmitted from the gold finger end to be processed by the DSP chip 310 and then transmitted to the laser 410 through the high-frequency signal line.
本公开实施例所示的光发射组件400由光发射器组件、上盖板403、第二发射壳体404组成，上盖板403、第二发射壳体404共同组成一端设有缺口的壳体，电路板300伸入壳体的缺口中，使得电路板300与上盖板403、第二发射壳体404共同组成封闭壳体的一部分，再配合光准直器460形成完整的封闭腔体结构。The light emitting assembly 400 shown in the embodiment of the present disclosure consists of a light emitter assembly, an upper cover 403, and a second emitting housing 404. The upper cover 403 and the second emitting housing 404 together form a housing with a gap at one end. , the circuit board 300 extends into the gap in the housing, so that the circuit board 300, the upper cover 403, and the second emission housing 404 together form a part of the closed housing, and then cooperate with the optical collimator 460 to form a complete closed cavity structure. .
在一些实施例中，上盖板403、第二发射壳体404需要选用钨铜或其他具有良好导热性的金属材料，并适当增加第二发射壳体404的质量及上盖板403的面积，从而增加上盖 板403与上壳体201的接触面积，进而提高光发射组件400的散热效率。In some embodiments, the upper cover 403 and the second launch housing 404 need to be made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the second launch housing 404 and the area of the upper cover 403 need to be appropriately increased. thereby increasing the upper cover The contact area between the plate 403 and the upper housing 201 further improves the heat dissipation efficiency of the light emitting component 400 .
在一些实施例中，为方便将第二发射壳体404的热量传输至上壳体201，可在第二发射壳体404的顶面4041、上盖板403的顶面与上壳体201的内侧面之间设置导热垫片，如此第二发射壳体404的热量传输至导热垫片，导热垫片将热量传输至上壳体201，以有效改善散热效果。In some embodiments, in order to facilitate the transfer of heat from the second emitting housing 404 to the upper housing 201, the top surface 4041 of the second emitting housing 404, the top surface of the upper cover 403 and the inside of the upper housing 201 can be A thermal pad is provided between the sides, so that the heat of the second emission housing 404 is transmitted to the thermal pad, and the thermal pad transmits the heat to the upper shell 201 to effectively improve the heat dissipation effect.
在一些实施例中，光接收组件500与光发射组件400可并排设置在电路板300的同一面上，即光接收组件500设置在电路板300的正面，位于插孔340的一侧；光接收组件500与光发射组件400也可设置在电路板300的不同面上，即光接收组件500设置在电路板300的背面。In some embodiments, the light receiving component 500 and the light emitting component 400 can be disposed side by side on the same surface of the circuit board 300, that is, the light receiving component 500 is disposed on the front side of the circuit board 300, located on one side of the jack 340; The component 500 and the light emitting component 400 can also be disposed on different surfaces of the circuit board 300 , that is, the light receiving component 500 is disposed on the back of the circuit board 300 .
图29为本公开实施例提供的光模块中电路板、光发射组件与光接收组件的装配示意图。如图29所示，本公开实施例提供的光模块包括光发射组件400、发射光纤阵列810、光接收组件500与接收光纤阵列820，光发射组件400采用底面向上(倒装)的光发射器结构，使得光发射组件400的底面与上壳体201相接触，极大地改善了光发射组件400的散热；发射光纤阵列810与光发射组件400连接，光发射组件400射出的发射光束通过发射光纤阵列810传输至光纤600，再通过光纤600传输出去，实现了光的发射。Figure 29 is a schematic assembly diagram of the circuit board, light emitting component and light receiving component in the optical module provided by the embodiment of the present disclosure. As shown in Figure 29, the optical module provided by the embodiment of the present disclosure includes a light transmitting component 400, a transmitting fiber array 810, a light receiving component 500, and a receiving fiber array 820. The light transmitting component 400 adopts a bottom-up (flip-chip) light transmitter. structure, so that the bottom surface of the light emitting component 400 is in contact with the upper housing 201, which greatly improves the heat dissipation of the light emitting component 400; the emitting fiber array 810 is connected to the light emitting component 400, and the emitting beam emitted by the light emitting component 400 passes through the emitting fiber The array 810 is transmitted to the optical fiber 600, and then transmitted out through the optical fiber 600, thereby realizing the emission of light.
光接收组件500与光发射组件400可设置在电路板300的同一侧，接收光纤阵列820与光接收组件500连接，外部光信号通过光纤600传输至接收光纤阵列820，再通过接收光纤阵列820传输至光接收组件500，通过光接收组件500进行光电转换，实现了光的接收。The light receiving component 500 and the light transmitting component 400 can be disposed on the same side of the circuit board 300. The receiving optical fiber array 820 is connected to the light receiving component 500. The external optical signal is transmitted to the receiving optical fiber array 820 through the optical fiber 600, and then transmitted through the receiving optical fiber array 820. To the light receiving component 500, photoelectric conversion is performed through the light receiving component 500, thereby realizing light reception.
在一般的设计中，光发射组件400的主光路位于单一平面，所以电路板300需要挖出很大的面积以避让光发射组件400和光纤需要的位置，这造成电路板300很大的挖孔，而且挖孔的形状复杂，不仅极大的减小了电子元器件的排布空间，也给上胶密封造成困难。In a general design, the main optical path of the light emitting component 400 is located on a single plane, so the circuit board 300 needs to dig out a large area to avoid the required positions of the light emitting component 400 and the optical fiber, which results in a large hole in the circuit board 300 , and the complex shape of the holes not only greatly reduces the arrangement space of electronic components, but also makes it difficult to apply glue and seal.
本公开在电路板300上挖孔，将光发射组件400中的激光器设置在电路板300的背侧，在激光器的出光方向上增加一个光路平移棱镜，使得整个光路移至电路板的正侧，如此能够减小电路板300上的挖孔面积，也便于在电路板300的背面对光发射组件400进行密封。In this disclosure, holes are dug in the circuit board 300, the laser in the light emitting assembly 400 is placed on the back side of the circuit board 300, and an optical path translation prism is added in the light emitting direction of the laser so that the entire optical path moves to the front side of the circuit board. This can reduce the digging area on the circuit board 300 and facilitate sealing of the light emitting component 400 on the back side of the circuit board 300 .
图30为本公开实施例提供的光模块中光发射组件的翻转结构示意图，图31为本公开实施例提供的光模块中电路板与光发射组件的另一角度局部装配示意图。如图30、图31所示，光发射组件400可包括第一发射壳体401及设置在第一发射壳体401内的激光器410、耦合透镜420a、第一光路平移棱镜430、光隔离器440a与发射光纤阵列组件450a，该第一发射壳体401的底面(背向电路板300正面的表面)朝向上壳体201。第一发射壳体401包括安装内腔，激光器410、耦合透镜420a、第一光路平移棱镜430、光隔离器440a与发射光纤阵列组件450a均安装在第一发射壳体401的安装内腔内，且激光器410、耦合透镜420a与第一光路平移棱镜430的安装高度高于光隔离器440a、发射光纤阵列组件450a的安装高度，使得激光器410、耦合透镜420a与第一光路平移棱镜430通过电路板300上的安装通孔320位于电路板300的背侧，光隔离器440a与发射光纤阵列组件450a位于电路板300的正侧。FIG. 30 is a schematic diagram of the flipped structure of the light emitting component in the optical module provided by the embodiment of the present disclosure. FIG. 31 is a schematic diagram of the partial assembly of the circuit board and the light emitting component in the optical module provided by the embodiment of the present disclosure from another angle. As shown in Figures 30 and 31, the light emitting component 400 may include a first emitting housing 401 and a laser 410 disposed in the first emitting housing 401, a coupling lens 420a, a first optical path translation prism 430, and an optical isolator 440a. With the launch fiber array assembly 450a, the bottom surface of the first launch housing 401 (the surface facing away from the front of the circuit board 300) faces the upper housing 201. The first launch housing 401 includes an installation inner cavity. The laser 410, the coupling lens 420a, the first optical path translation prism 430, the optical isolator 440a and the launch fiber array assembly 450a are all installed in the installation cavity of the first launch housing 401. And the installation height of the laser 410, the coupling lens 420a and the first optical path translation prism 430 is higher than the installation height of the optical isolator 440a and the emitting fiber array assembly 450a, so that the laser 410, the coupling lens 420a and the first optical path translation prism 430 pass through the circuit board 300 The mounting through hole 320 is located on the back side of the circuit board 300, and the optical isolator 440a and the emitting fiber array assembly 450a are located on the front side of the circuit board 300.
在一些实施例中，第一发射壳体401内的安装内腔朝向电路板300正面的一端设置有开口，安装内腔通过开口与电路板300上的安装通孔320相连通，如此设置于安装内腔的激光器410可通过开口嵌入安装通孔320内，使得激光器410的打线安装高度与电路板300的背面相同。In some embodiments, the installation cavity in the first launch housing 401 is provided with an opening at one end toward the front of the circuit board 300, and the installation cavity is connected to the mounting through hole 320 on the circuit board 300 through the opening, so that the installation cavity is The laser 410 in the inner cavity can be embedded in the mounting through hole 320 through the opening, so that the wiring installation height of the laser 410 is the same as the back surface of the circuit board 300 .
激光器410发射的一路激光光束经由耦合透镜420a转换为准直光束，准直光束经由第一光路平移棱镜430将位于电路板300背侧的准直光束反射至电路板300的正侧，第一光路平移棱镜430反射的激光光束直接透过光隔离器440a射入发射光纤阵列组件450a，经由发射光纤阵列组件450a引出的发射光纤阵列810传输至光纤600内，再经由光纤600传输至光纤适配器700，实现一路光信号的发射。A laser beam emitted by the laser 410 is converted into a collimated beam through the coupling lens 420a. The collimated beam reflects the collimated beam located on the back side of the circuit board 300 to the front side of the circuit board 300 through the first optical path translation prism 430. The first optical path The laser beam reflected by the translation prism 430 directly enters the emission fiber array assembly 450a through the optical isolator 440a, and is transmitted to the optical fiber 600 through the emission fiber array 810 derived from the emission fiber array assembly 450a, and then transmitted to the optical fiber adapter 700 via the optical fiber 600. Realize the transmission of all the optical signals.
在一些实施例中，通过在耦合透镜420a后方增加一光路平移棱镜，使整个光路移至电 路板300正面的上方，能够减小电路板300的挖孔面积，也便于在电路板300的背面对光发射组件400进行密封。In some embodiments, by adding an optical path translation prism behind the coupling lens 420a, the entire optical path is moved to the electrical Above the front of the circuit board 300, the digging area of the circuit board 300 can be reduced, and it is also convenient to seal the light emitting component 400 on the back of the circuit board 300.
对于高传输速率的光模块，如400G，为实现400G光模块的传输速率，需要集成4路光发射器和4路光接收器，因此光发射组件400包括4个光发射器，以实现4路发射光束的发射；光接收组件500包括4个光接收器，以实现4路接收光束的接收。For high transmission rate optical modules, such as 400G, in order to achieve the transmission rate of the 400G optical module, it is necessary to integrate 4 optical transmitters and 4 optical receivers. Therefore, the optical transmitting component 400 includes 4 optical transmitters to achieve 4 optical transmitters. Emission of the transmitting beam; the light receiving component 500 includes 4 optical receivers to realize the reception of the 4 receiving beams.
基于此，光发射组件400包括设置在第一发射壳体401内的多个激光器410、多个耦合透镜420a、第一光路平移棱镜430、光隔离器440a与发射光纤阵列组件450a，多个激光器410、多个耦合透镜420a、第一光路平移棱镜430、光隔离器440a与发射光纤阵列组件450a均安装在第一发射壳体401的安装内腔内，且激光器410、耦合透镜420a与第一光路平移棱镜430的安装高度高于光隔离器440a、发射光纤阵列组件450a的安装高度。Based on this, the light emitting assembly 400 includes a plurality of lasers 410, a plurality of coupling lenses 420a, a first optical path translation prism 430, an optical isolator 440a and a emitting fiber array assembly 450a disposed in the first emitting housing 401. The multiple lasers 410. A plurality of coupling lenses 420a, the first optical path translation prism 430, the optical isolator 440a and the transmitting fiber array assembly 450a are all installed in the installation cavity of the first transmitting housing 401, and the laser 410, the coupling lens 420a and the first The installation height of the optical path translation prism 430 is higher than the installation height of the optical isolator 440a and the transmitting optical fiber array assembly 450a.
多个激光器410、多个耦合透镜420a通过安装通孔320位于电路板300的背侧，第一光路平移棱镜430的一端通过安装通孔320位于电路板300的背侧、另一端位于电路板300的正侧，光隔离器440a与发射光纤阵列组件450a均位于电路板300的正侧。The plurality of lasers 410 and the plurality of coupling lenses 420a are located on the back side of the circuit board 300 through the mounting through holes 320. One end of the first optical path translation prism 430 is located on the back side of the circuit board 300 through the mounting through holes 320, and the other end is located on the circuit board 300. On the front side of the circuit board 300 , the optical isolator 440 a and the emitting fiber array assembly 450 a are both located on the front side of the circuit board 300 .
多个激光器410发射多路激光光束，该激光光束平行于电路板300的背面；多个耦合透镜420a将激光器410发射的激光光束转换为汇聚光束，多个汇聚光束传输至第一光路平移棱镜430，第一光路平移棱镜430将位于电路板300背侧的激光光束反射上移至电路板300正侧。The plurality of lasers 410 emit multiple laser beams, and the laser beams are parallel to the back of the circuit board 300; the plurality of coupling lenses 420a convert the laser beams emitted by the lasers 410 into condensed beams, and the plurality of condensed beams are transmitted to the first optical path translation prism 430 , the first optical path translation prism 430 reflects the laser beam located on the back side of the circuit board 300 and moves it upward to the front side of the circuit board 300 .
第一光路平移棱镜430的作用是将多路光束向上平移一定距离，使得后续所有的光器件位置均位于电路板300的正侧，并与电路板300保持适当间隙。这样就避免了光学器件与电路板300之间的位置冲突，从而可以尽可能的减小电路板300的挖孔面积，增加了电路板300上电子器件的排布面积，使得电路板300的布线更加容易。The function of the first optical path translation prism 430 is to translate the multi-path light beam upward for a certain distance, so that all subsequent optical devices are located on the front side of the circuit board 300 and maintain an appropriate gap with the circuit board 300 . In this way, the positional conflict between the optical device and the circuit board 300 is avoided, thereby reducing the hole digging area of the circuit board 300 as much as possible, increasing the arrangement area of the electronic devices on the circuit board 300, and making the wiring of the circuit board 300 easier. much easier.
在一些实施例中，第一光路平移棱镜430与发射光纤阵列组件450a的入光面之间存在间隙，第一光路平移棱镜430输出的反射光束传输至发射光纤阵列组件450a的入光面时，因光在不同介质的界面传播会发生反射，复合光束传输至发射光纤阵列组件450a的入光面时发生反射，反射光束可能会按照原路返回至激光器410，影响激光器410的高频性能。In some embodiments, there is a gap between the first optical path translation prism 430 and the light incident surface of the emitting optical fiber array component 450a. When the reflected light beam output by the first optical path translation prism 430 is transmitted to the light incident surface of the emitting optical fiber array component 450a, Since light will be reflected when propagating at the interface of different media, the composite beam will be reflected when it is transmitted to the light incident surface of the emitting fiber array component 450a. The reflected beam may return to the laser 410 along its original path, affecting the high-frequency performance of the laser 410.
为了避免这一问题，光隔离器440a设置在第一光路平移棱镜430与发射光纤阵列组件450a之间，第一光路平移棱镜430输出的反射光束在发射光纤阵列组件450a的入光面发生反射时，光隔离器440a用于将反射光束隔离出去，防止反射光束沿原路返回至激光器410。In order to avoid this problem, the optical isolator 440a is provided between the first optical path translation prism 430 and the emitting optical fiber array assembly 450a. When the reflected light beam output by the first optical path translation prism 430 is reflected by the light incident surface of the emitting optical fiber array assembly 450a , the optical isolator 440a is used to isolate the reflected beam and prevent the reflected beam from returning to the laser 410 along the original path.
图32为本公开实施例提供的光模块中发射光纤阵列组件与光隔离器的装配示意图，图33为本公开实施例提供的光模块中发射光纤阵列组件与光隔离器的局部分解示意图。如图32、图33所示，发射光纤阵列组件450a包括V型槽基板4510、玻璃盖板4520与支撑板4530，V型槽基板4510固定在第一发射壳体401的安装内腔内，且V型槽基板4510上并行设置有多排V型槽4540，发射光纤阵列810的每一根光纤均嵌在相应的V型槽4540内，之后胶水会自然充满V型槽4540与光纤的接触面。FIG. 32 is a schematic assembly diagram of the emitting fiber array component and the optical isolator in the optical module provided by the embodiment of the present disclosure. FIG. 33 is a partially exploded schematic diagram of the emitting fiber array component and the optical isolator in the optical module provided by the embodiment of the present disclosure. As shown in Figures 32 and 33, the launch fiber array assembly 450a includes a V-groove substrate 4510, a glass cover plate 4520 and a support plate 4530. The V-groove substrate 4510 is fixed in the installation cavity of the first launch housing 401, and There are multiple rows of V-shaped grooves 4540 arranged in parallel on the V-shaped groove substrate 4510. Each optical fiber of the emitting optical fiber array 810 is embedded in the corresponding V-shaped groove 4540. Then the glue will naturally fill the contact surface between the V-shaped groove 4540 and the optical fiber. .
将光纤与V型槽4540胶合连接后，将玻璃盖板4520覆盖在V型槽基板4510上，使得玻璃盖板4520与V型槽基板4510之间的接触面通过胶水胶合固定在一起，以保证发射光纤阵列810与V型槽基板4510的胶合稳固性。之后再对发射光纤阵列组件450a的端面进行光学抛光和镀膜，以保证其达到相应的光学面要求。After the optical fiber and the V-groove 4540 are glued and connected, the glass cover 4520 is covered on the V-groove substrate 4510, so that the contact surface between the glass cover 4520 and the V-groove substrate 4510 is fixed together by glue to ensure The gluing stability of the launch fiber array 810 and the V-groove substrate 4510. After that, the end surface of the emitting optical fiber array component 450a is optically polished and coated to ensure that it meets the corresponding optical surface requirements.
将支撑板4530覆盖在玻璃盖板4520上，使得支撑板4530与玻璃盖板4520之间的接触面通过胶水胶合固定在一起，如此将光发射组件400翻转固定在电路板300正面上时，支撑板4530与电路板300的正面胶合固定。Cover the support plate 4530 on the glass cover 4520 so that the contact surfaces between the support plate 4530 and the glass cover 4520 are fixed together by glue. In this way, when the light emitting assembly 400 is turned over and fixed on the front of the circuit board 300, the support The board 4530 is glued to the front side of the circuit board 300 .
在一些实施例中，V型槽结构在胶合过程中，胶水会自然充满V型槽4540与125μm光纤的接触面以及各基板之间的接触面，而且V型槽部件的纵向厚度也大大强化了胶合后密封效果。在存在多光纤的场合，光纤V型槽的结构可以形成高质量的对光纤的密封界面。In some embodiments, during the gluing process of the V-shaped groove structure, glue will naturally fill the contact surface between the V-shaped groove 4540 and the 125 μm optical fiber and the contact surface between each substrate, and the longitudinal thickness of the V-shaped groove component is also greatly strengthened. Sealing effect after gluing. In the presence of multiple optical fibers, the structure of the optical fiber V-groove can form a high-quality sealing interface for the optical fibers.
在一些实施例中，光隔离器440a的出光面与V型槽4540对应设置，如此透过光隔离 器440a的光束通过V型槽4540射入发射光纤阵列810内，保证了第一光路平移棱镜430输出的反射光束能够直接透过光隔离器440a射入发射光纤阵列组件450a内。In some embodiments, the light exit surface of the optical isolator 440a is arranged corresponding to the V-shaped groove 4540, so that the light is isolated through The light beam of the detector 440a is injected into the emission fiber array 810 through the V-shaped groove 4540, which ensures that the reflected light beam output by the first optical path translation prism 430 can directly pass through the optical isolator 440a and be injected into the emission fiber array assembly 450a.
在一些实施例中，光发射组件400包括4个激光器、4个耦合透镜420a与一个第一光路平移棱镜430，激光器410与耦合透镜420a一一对应设置，每个激光器410发射一路激光光束，每个耦合透镜420a将一路激光光束转换为汇聚光束，每个耦合透镜420a将射出的汇聚光束传输至第一光路平移棱镜430，通过第一光路平移棱镜430对汇聚光束进行反射，以改变激光光束的传输方向及位置。In some embodiments, the light emitting component 400 includes 4 lasers, 4 coupling lenses 420a and a first optical path translation prism 430. The lasers 410 and the coupling lenses 420a are arranged in one-to-one correspondence. Each laser 410 emits a laser beam. Each coupling lens 420a converts one laser beam into a condensed beam. Each coupling lens 420a transmits the emitted condensed beam to the first optical path translation prism 430, and reflects the condensed beam through the first optical path translation prism 430 to change the intensity of the laser beam. Transmission direction and location.
光发射组件400还包括4个光隔离器440a，V型槽基板4510上设置有4排V型槽4540，发射光纤阵列810包括4根光纤，如此第一光路平移棱镜430输出的4路反射光束分别通过4个光隔离器440a，每个光隔离器440a射出的光束通过对应的一排V型槽4540射入一根光纤中，传输至光纤中的光束通过光纤600耦合至光纤适配器700，实现了多路光信号的发射。The light emitting component 400 also includes 4 optical isolators 440a. The V-shaped groove substrate 4510 is provided with 4 rows of V-shaped grooves 4540. The transmitting optical fiber array 810 includes 4 optical fibers. In this way, the first optical path translation prism 430 outputs 4 reflected light beams. Pass through four optical isolators 440a respectively, and the light beam emitted by each optical isolator 440a is injected into an optical fiber through a corresponding row of V-shaped grooves 4540. The light beam transmitted to the optical fiber is coupled to the optical fiber adapter 700 through the optical fiber 600, realizing The transmission of multiple optical signals.
图34为本公开实施例提供的光模块中发射壳体的结构示意图，图35为本公开实施例提供的光模块中发射壳体的另一角度结构示意图。如图34、图35所示，为支撑固定激光器410、耦合透镜420a、第一光路平移棱镜430、光隔离器440a与发射光纤阵列组件450a，第一发射壳体401包括第一接触面4011，该第一接触面4011为朝向电路板300正面的侧面，将光发射组件400反向安装在电路板300上时，第一接触面4011与电路板300的正面密封连接。FIG. 34 is a schematic structural diagram of the emitting housing in the optical module provided by the embodiment of the present disclosure. FIG. 35 is a schematic structural diagram of the emitting housing in the optical module provided by the embodiment of the present disclosure from another angle. As shown in Figures 34 and 35, in order to support the fixed laser 410, the coupling lens 420a, the first optical path translation prism 430, the optical isolator 440a and the emission fiber array assembly 450a, the first emission housing 401 includes a first contact surface 4011, The first contact surface 4011 is a side facing the front of the circuit board 300. When the light emitting component 400 is installed on the circuit board 300 in reverse, the first contact surface 4011 is sealingly connected to the front of the circuit board 300.
由第一接触面4011向上壳体201的方向设置有安装内腔，该安装内腔包括第一安装面4110、第二安装面4120与第三安装面4130，第三安装面4130与第二安装面4120为平齐的同一安装面，第二安装面4120凹陷于第一安装面4110，第一安装面4110凹陷于第一接触面4011，如此将光发射组件400反向安装至电路板300时，第一接触面4011与电路板300的正面粘接，第一安装面4110与电路板300正面的距离小于第二安装面4120与电路板300正面的距离，第二安装面4120与电路板300正面的距离与第三安装面4130与电路板300正面的距离相同，使得第一安装面4110、第二安装面4120、第三安装面4130与第一接触面4011形成台阶面。An installation inner cavity is provided from the first contact surface 4011 toward the upward direction of the housing 201. The installation inner cavity includes a first installation surface 4110, a second installation surface 4120, and a third installation surface 4130. The third installation surface 4130 and the second installation surface The surface 4120 is the same mounting surface that is flush, the second mounting surface 4120 is recessed in the first mounting surface 4110, and the first mounting surface 4110 is recessed in the first contact surface 4011. In this way, when the light emitting component 400 is installed to the circuit board 300 in reverse , the first contact surface 4011 is bonded to the front surface of the circuit board 300 , the distance between the first mounting surface 4110 and the front surface of the circuit board 300 is smaller than the distance between the second mounting surface 4120 and the front surface of the circuit board 300 , and the distance between the second mounting surface 4120 and the circuit board 300 The distance between the front surface and the front surface of the circuit board 300 is the same as the distance between the third mounting surface 4130 and the front surface of the circuit board 300 , so that the first mounting surface 4110 , the second mounting surface 4120 , the third mounting surface 4130 and the first contact surface 4011 form a step surface.
在一些实施例中，形成第一安装面4110、第二安装面4120与第三安装面4130的安装内腔只有朝向电路板300正面的一端开口，第一安装面4110上设置有半导体制冷器460a，每个激光器410设置在一个激光器基板上，每个激光器基板与耦合透镜420a均设置在半导体制冷器460a的制冷面上，且耦合透镜420a设置在激光器410的出光方向上。In some embodiments, the mounting cavity forming the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 has only one end open toward the front of the circuit board 300, and the semiconductor refrigerator 460a is disposed on the first mounting surface 4110. , each laser 410 is disposed on a laser substrate, each laser substrate and the coupling lens 420a are disposed on the cooling surface of the semiconductor refrigerator 460a, and the coupling lens 420a is disposed in the light emitting direction of the laser 410.
第一光路平移棱镜430设置在凹陷于第一安装面4110的第二安装面4120上，该第一光路平移棱镜430垂直固定于第二安装面4120上，即第一光路平移棱镜430的一端固定在第二安装面4120上、另一端位于电路板300的背侧，如此通过第一光路平移棱镜430将位于电路板300背侧的激光光束反射至电路板300的正侧。The first optical path translation prism 430 is disposed on the second mounting surface 4120 recessed in the first mounting surface 4110. The first optical path translation prism 430 is vertically fixed on the second mounting surface 4120, that is, one end of the first optical path translation prism 430 is fixed. On the second mounting surface 4120, the other end is located on the back side of the circuit board 300, so that the laser beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300 through the first optical path translation prism 430.
发射光纤阵列组件450a中V型槽基板4510的一侧设置在第三安装面4130上，V型槽基板4510的另一侧与玻璃盖板4520的一侧粘接固定，玻璃盖板4520的另一侧与支撑板4530的一侧粘接固定，支撑板4530的另一侧与电路板300的正面粘接固定，如此实现了发射光纤阵列组件450a与第一发射壳体401、电路板300的固定封装。One side of the V-shaped groove substrate 4510 in the transmitting optical fiber array assembly 450a is disposed on the third mounting surface 4130. The other side of the V-shaped groove substrate 4510 is bonded and fixed to one side of the glass cover 4520. The other side of the glass cover 4520 One side is bonded and fixed with one side of the support plate 4530, and the other side of the support plate 4530 is bonded and fixed with the front surface of the circuit board 300. In this way, the coupling of the transmitting optical fiber array assembly 450a with the first transmitting housing 401 and the circuit board 300 is realized. Fixed package.
在一些实施例中，光隔离器440a固定在V型槽基板4510的一端，发射光纤阵列810固定在V型槽基板4510的V型槽4540中，如此保证了透过光隔离器440a的反射光束顺利进入V型槽4540内的发射光纤阵列810中。In some embodiments, the optical isolator 440a is fixed at one end of the V-groove substrate 4510, and the emitting fiber array 810 is fixed in the V-groove 4540 of the V-groove substrate 4510, thus ensuring that the reflected light beam passes through the optical isolator 440a Smoothly enter the launch fiber array 810 in the V-shaped groove 4540.
在一些实施例中，第一发射壳体401的一端设有缺口，该缺口与第三安装面4130相连通，如此将发射光纤阵列组件450a固定在第三安装面4130后，发射光纤阵列组件450a引出的发射光纤阵列810与光纤600连接。In some embodiments, one end of the first launch housing 401 is provided with a gap, and the gap is connected to the third mounting surface 4130. In this way, after the launch fiber array assembly 450a is fixed on the third mounting surface 4130, the launch fiber array assembly 450a The led out transmitting optical fiber array 810 is connected to the optical fiber 600 .
在一些实施例中，第二安装面4120在前后方向的宽度尺寸大于第三安装面4130在前后方向的宽度尺寸，第三安装面4130在前后方向的宽度尺寸与缺口在前后方向的宽度尺 寸相同，如此将发射光纤阵列组件450a固定在第三安装面4130时，将缺口的内侧壁、V型槽基板4510相对的侧壁胶合固定在一起，从而通过发射光纤阵列组件450a将第一发射壳体401的缺口粘接固定，使得发射光纤阵列组件450a与缺口之间密封连接。粘接密封使用胶水采用的UV固化胶和结构固化胶均采用环氧树脂类胶水，此类胶水具有流动性好，可靠性高，可以满足长期在氟化液中稳定工作的要求。In some embodiments, the width dimension of the second mounting surface 4120 in the front and rear direction is greater than the width dimension of the third mounting surface 4130 in the front and rear direction, and the width dimension of the third mounting surface 4130 in the front and rear direction is the same as the width dimension of the notch in the front and rear direction. When the emitting optical fiber array assembly 450a is fixed to the third mounting surface 4130, the inner side walls of the notch and the opposite side walls of the V-groove substrate 4510 are glued and fixed together, so that the first emitting optical fiber array assembly 450a is fixed to the third mounting surface 4130. The notch of the housing 401 is bonded and fixed, so that the transmitting optical fiber array assembly 450a and the notch are sealedly connected. The UV curing glue and structural curing glue used for bonding and sealing are all epoxy resin glues. This type of glue has good fluidity and high reliability, and can meet the requirements of long-term stable operation in fluorinated liquids.
在一些实施例中，通过呈台阶设置的第一安装面4110、第二安装面4120与第三安装面4130将半导体制冷器、激光器410、耦合透镜420a、第一光路平移棱镜430、光隔离器440a与发射光纤阵列组件450a固定在第一发射壳体401内腔的安装面上，以形成激光器410、耦合透镜420a、第一光路平移棱镜430、光隔离器440a、发射光纤阵列组件450a之间的安装高度差，并将安装高度相对较高的激光器410与耦合透镜420a通过电路板300上的安装通孔320设置在电路板300的背侧，将安装高度相对较低的第一光路平移棱镜430、光隔离器440a与发射光纤阵列组件450a设置在电路板300的正侧，如此可减小光发射组件400与电路板300在空间上的重叠区域。In some embodiments, the semiconductor refrigerator, the laser 410, the coupling lens 420a, the first optical path translation prism 430, and the optical isolator are connected through the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 arranged in steps. 440a and the emitting optical fiber array assembly 450a are fixed on the mounting surface of the inner cavity of the first emitting housing 401 to form a space between the laser 410, the coupling lens 420a, the first optical path translation prism 430, the optical isolator 440a, and the emitting optical fiber array assembly 450a. The installation height difference is different, and the laser 410 with a relatively high installation height and the coupling lens 420a are arranged on the back side of the circuit board 300 through the installation through hole 320 on the circuit board 300, and the first optical path translation prism with a relatively low installation height is 430. The optical isolator 440a and the emitting fiber array assembly 450a are arranged on the front side of the circuit board 300, which can reduce the spatial overlap area between the light emitting assembly 400 and the circuit board 300.
图36为本公开实施例提供的光模块中发射壳体的第三角度结构示意图。如图36所示，第一发射壳体401还包括与第一接触面4011相对设置的第一顶面4012，该第一顶面4012朝向上壳体201，第一顶面4012上设置有向第一接触面4011延伸的第一放气孔4013，第一放气孔4013与第一发射壳体401内的第二安装面4120相连通，且该第一放气孔4013为锥形孔，由第一顶面4012向第二安装面4120方向上，该锥形孔的直径尺寸逐渐减小，如此第一发射壳体401可通过该第一放气孔4013与外界连通。FIG. 36 is a schematic structural diagram of the emitting housing in the optical module provided by an embodiment of the present disclosure from a third angle. As shown in Figure 36, the first launch housing 401 also includes a first top surface 4012 opposite to the first contact surface 4011. The first top surface 4012 faces the upper housing 201. The first top surface 4012 is provided with a directional A first vent hole 4013 extends from the first contact surface 4011. The first vent hole 4013 is connected with the second mounting surface 4120 in the first launch housing 401, and the first vent hole 4013 is a tapered hole formed by the first The diameter of the tapered hole gradually decreases in the direction of the top surface 4012 toward the second mounting surface 4120, so that the first launch housing 401 can communicate with the outside world through the first vent hole 4013.
第一发射壳体401上的第一放气孔4013的封闭是在所有密封操作完成之后再进行，以保证在密封过程中所有密封区域不会由于空气膨胀导致出现漏气孔。The first vent hole 4013 on the first launch housing 401 is closed after all sealing operations are completed to ensure that no leak holes will occur in all sealing areas due to air expansion during the sealing process.
图37为本公开实施例提供的光模块中光发射组件与电路板的局部装配剖视图。如图37所示，将半导体制冷器460a固定在第一发射壳体401的第一安装面4110上，使得半导体制冷器460a的制冷面背向第一安装面4110，然后将安装有激光器410的激光器基板设置在半导体制冷器460a的制冷面上，然后将耦合透镜420a设置在半导体制冷器460a的制冷面上，且耦合透镜420a位于激光器410的出光方向上；然后将第一光路平移棱镜430固定在第二安装面4120上，使得第一光路平移棱镜430的一端设置在激光器410的出光方向上；然后将发射光纤阵列组件450a固定在第三安装面4130上，然后将光隔离器440a固定在发射光纤阵列组件450a的一端，使得第一光路平移棱镜430反射的激光光束直接透过光隔离器440a射入发射光纤阵列组件450a中的发射光纤阵列810，再经由发射光纤阵列810传输至光纤600内。Figure 37 is a partial assembly cross-sectional view of the light emitting component and the circuit board in the optical module provided by the embodiment of the present disclosure. As shown in Figure 37, the semiconductor refrigerator 460a is fixed on the first mounting surface 4110 of the first emission housing 401, so that the cooling surface of the semiconductor refrigerator 460a faces away from the first mounting surface 4110, and then the laser 410 is installed on the The laser substrate is placed on the cooling surface of the semiconductor refrigerator 460a, and then the coupling lens 420a is placed on the cooling surface of the semiconductor refrigerator 460a, and the coupling lens 420a is located in the light emitting direction of the laser 410; then the first optical path translation prism 430 is fixed On the second mounting surface 4120, make one end of the first optical path translation prism 430 set in the light emitting direction of the laser 410; then fix the emitting fiber array assembly 450a on the third mounting surface 4130, and then fix the optical isolator 440a on the second mounting surface 4120. One end of the emitting optical fiber array assembly 450a allows the laser beam reflected by the first optical path translation prism 430 to directly pass through the optical isolator 440a and enter the emitting optical fiber array 810 in the emitting optical fiber array assembly 450a, and then is transmitted to the optical fiber 600 via the emitting optical fiber array 810. Inside.
然后将第一发射壳体401翻转，将第一安装面4110上的激光器410、耦合透镜420a与第二安装面4120上的第一光路平移棱镜430嵌入电路板300上的安装通孔320内，使得激光器410的打线表面高度与电路板300的背面相同，然后将第一发射壳体401的第一接触面4011与电路板300的正面粘接在一起，将发射光纤阵列组件450a中的支撑板4530与电路板300的正面粘接在一起，使得第一发射壳体401的内腔、发射光纤阵列组件450a、电路板300与发射盖板402共同组成密闭腔体。Then the first emission housing 401 is turned over, and the laser 410 and coupling lens 420a on the first mounting surface 4110 and the first optical path translation prism 430 on the second mounting surface 4120 are embedded into the mounting through hole 320 on the circuit board 300. Make the wiring surface of the laser 410 have the same height as the back of the circuit board 300, and then bond the first contact surface 4011 of the first emission housing 401 to the front of the circuit board 300, and secure the support in the emission fiber array assembly 450a. The board 4530 is bonded to the front surface of the circuit board 300, so that the inner cavity of the first launch housing 401, the launch fiber array assembly 450a, the circuit board 300 and the launch cover 402 together form a sealed cavity.
然后将发射盖板402的内腔与安装通孔320对应设置，将发射盖板402朝向电路板300背面的接触面粘接至电路板300的背面上，使得位于电路板300背面的激光器410、耦合透镜420a与第一光路平移棱镜430置于发射盖板402与电路板300背面形成的腔体内。Then, the inner cavity of the emission cover 402 is arranged corresponding to the mounting through hole 320, and the contact surface of the emission cover 402 facing the back of the circuit board 300 is bonded to the back of the circuit board 300, so that the laser 410 located on the back of the circuit board 300, The coupling lens 420a and the first optical path translation prism 430 are placed in the cavity formed by the emission cover 402 and the back surface of the circuit board 300.
在一些实施例中，将第一接触面4011与电路板300的正面通过UV固化胶和结构固化胶粘接在一起，以实现第一发射壳体401的第一接触面4011与电路板300正面的密封粘接。将发射盖板402朝向电路板300背面的接触面与电路板300的背面通过UV固化胶和结构固化胶粘接在一起，以实现发射盖板402与电路板300背面的密封粘接。如此，将第一发射壳体401粘接于电路板300的正面，将发射盖板402粘接于电路板300的背面，实现了第一发射壳体401、电路板300与发射盖板402的密封装配。 In some embodiments, the first contact surface 4011 and the front surface of the circuit board 300 are bonded together through UV curing glue and structural curing glue to realize the first contact surface 4011 of the first emission housing 401 and the front surface of the circuit board 300 sealing bonding. The contact surface of the emission cover 402 facing the back of the circuit board 300 and the back of the circuit board 300 are bonded together through UV curing glue and structural curing glue to achieve sealing bonding between the emission cover 402 and the back of the circuit board 300 . In this way, the first launch housing 401 is bonded to the front side of the circuit board 300, and the launch cover 402 is bonded to the back side of the circuit board 300, thereby realizing the connection between the first launch housing 401, the circuit board 300 and the launch cover 402. Sealed assembly.
在一些实施例中，第一发射壳体401为相对完整的壳体结构，可以容纳所有光学及电学部件，并形成完整的密封截面。位于电路板300背面的发射盖板402设计为简单的空腔结构，以形成完整的密封截面。在装配时，第一发射壳体401、电路板300与发射盖板402形成三明治包夹结构，在第一发射壳体401与电路板300正面的接触界面上胶密封，发射盖板402与电路板300背面的接触界面上胶密封，再配合发射光纤阵列组件450a形成完整的密闭腔体结构。In some embodiments, the first emission housing 401 is a relatively complete housing structure that can accommodate all optical and electrical components and form a complete sealing section. The emission cover 402 located on the back of the circuit board 300 is designed as a simple cavity structure to form a complete sealing section. During assembly, the first launch housing 401, the circuit board 300 and the launch cover 402 form a sandwich structure, and the contact interface between the first launch housing 401 and the front of the circuit board 300 is glue-sealed, and the launch cover 402 and the circuit The contact interface on the back side of the board 300 is glued and sealed, and then combined with the emitting optical fiber array assembly 450a to form a complete sealed cavity structure.
将光发射组件400的第一发射壳体401、电路板300与发射盖板402密封装配好后，激光器410在电路板300传送的驱动电流作用下发射激光光束，激光光束经由耦合透镜420a转换为汇聚光束，汇聚光束经由第一光路平移棱镜430进行反射，使得位于电路板300背侧的汇聚光束反射至电路板300正侧，反射后的多路汇聚光束经直接透过光隔离器440a分别射入发射光纤阵列组件450a中的发射光纤阵列810，再传至光纤600内，实现了多路光的发射。After the first emission housing 401, the circuit board 300 and the emission cover 402 of the light emitting assembly 400 are sealed and assembled, the laser 410 emits a laser beam under the action of the driving current transmitted by the circuit board 300, and the laser beam is converted into The condensed light beam is reflected by the first optical path translation prism 430, so that the condensed light beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300. The reflected multi-channel converged light beams are directly transmitted through the optical isolator 440a. into the transmitting optical fiber array 810 in the transmitting optical fiber array assembly 450a, and then transmitted to the optical fiber 600, thereby realizing the emission of multiple paths of light.
在以上的实施例中，激光至光纤的耦合是通过单一的耦合透镜实现的，一般称之为单透镜***。在另一些实施例中，也可以采用双透镜***，将耦合透镜改为准直透镜，先将来自激光器的发散光束转化为准直光，在经过光束平移棱镜后，再放置一个耦合透镜，将准直光束转化为汇聚光束，从而将激光耦合进光纤阵列中。In the above embodiments, the coupling of the laser to the optical fiber is achieved through a single coupling lens, which is generally called a single lens system. In other embodiments, a dual-lens system can also be used to change the coupling lens into a collimating lens. First, the divergent beam from the laser is converted into collimated light. After passing through the beam translation prism, a coupling lens is then placed to convert the divergent beam into collimated light. The collimated beam is converted into a focused beam, thereby coupling the laser into the fiber array.
在一些实施例中，电路板300的正面上设置有DSP芯片310，该DSP芯片310用于高频信号的处理，并将高频信号传输至激光器410，为激光器410发射激光光束提供信号，使得激光器410产生信号光。In some embodiments, a DSP chip 310 is provided on the front side of the circuit board 300. The DSP chip 310 is used for high-frequency signal processing and transmits the high-frequency signal to the laser 410 to provide a signal for the laser 410 to emit a laser beam, so that Laser 410 generates signal light.
具体地，电路板300的背面上设置有从DSP芯片310到留给光发射组件400的开孔端的高频信号连接线，这一面的电路设计主要是为了将从金手指端传过来的高频信号，经过DSP芯片310处理后，再经由高频信号线传输给光发射组件400。Specifically, the back of the circuit board 300 is provided with a high-frequency signal connection line from the DSP chip 310 to the opening end left for the light-emitting component 400. The circuit design on this side is mainly for the high-frequency signal transmitted from the gold finger end. After the signal is processed by the DSP chip 310, it is then transmitted to the light emitting component 400 via a high-frequency signal line.
为了将DSP芯片310的高频信号由电路板300的正面传输到背面的激光器410，在DSP芯片310的Tx输出焊盘下面设置有高频信号过孔，该高频信号过孔贯穿电路板300的正面与背面，高频信号过孔的上端与DSP芯片310的Tx输出焊盘电连接，高频信号过孔的下端与布设在电路板300背面的高频信号线电连接，该高频信号线通过打线与激光器410电连接。如此位于电路板300正面的DSP芯片310通过连接在其Tx输出焊盘的高频信号线，将电路板300上的高频信号从电路板300的正面传输到电路板300的背面，以将高频信号传输至位于电路板300背侧的激光器410，以实现光发射组件400与电路板300的高频信号连接，使得激光器410发射信号光。In order to transmit the high-frequency signal of the DSP chip 310 from the front of the circuit board 300 to the laser 410 on the back, a high-frequency signal via is provided under the Tx output pad of the DSP chip 310, and the high-frequency signal via penetrates the circuit board 300. On the front and back of the circuit board 300 , the upper end of the high-frequency signal via is electrically connected to the Tx output pad of the DSP chip 310 , and the lower end of the high-frequency signal via is electrically connected to the high-frequency signal line laid on the back of the circuit board 300 . The high-frequency signal The wires are electrically connected to the laser 410 through bonding wires. In this way, the DSP chip 310 located on the front of the circuit board 300 transmits the high-frequency signal on the circuit board 300 from the front of the circuit board 300 to the back of the circuit board 300 through the high-frequency signal line connected to its Tx output pad, so as to transmit the high-frequency signal. The high-frequency signal is transmitted to the laser 410 located on the back side of the circuit board 300 to realize the high-frequency signal connection between the light emitting component 400 and the circuit board 300, so that the laser 410 emits signal light.
在一些实施例中，电路板300上设置有多个高频信号过孔，多个高频信号过孔设置在安装通孔320的右侧，每个高频信号过孔与激光器410一一对应连接，使得连接每个高频信号过孔的高频信号线与激光器410连接，将电路板300传输的高频信号传送至激光器410，以满足光发射组件400所需要的高频信号。In some embodiments, the circuit board 300 is provided with multiple high-frequency signal via holes, and the multiple high-frequency signal via holes are arranged on the right side of the mounting through hole 320 . Each high-frequency signal via hole corresponds to the laser 410 one-to-one. The connection is such that the high-frequency signal line connecting each high-frequency signal via hole is connected to the laser 410, and the high-frequency signal transmitted by the circuit board 300 is transmitted to the laser 410 to meet the high-frequency signal required by the light emitting component 400.
在一些实施例中，电路板300的背面上还布设有直流信号线，该直流信号线与激光器410电连接，以通过直流信号线传输的偏置电流驱动激光器410发光。传输偏置电流的直流信号线可从电路板300上安装通孔320的左侧通过打线的方式引过来，激光器410接收到直流信号线传输的偏置电流后能够发光，而高频信号线传输到激光器410后，激光器410将高频信号调制至光束中，使得激光器410产生信号光。In some embodiments, a DC signal line is also arranged on the back of the circuit board 300. The DC signal line is electrically connected to the laser 410, and the bias current transmitted through the DC signal line drives the laser 410 to emit light. The DC signal line that transmits the bias current can be led from the left side of the mounting through hole 320 on the circuit board 300 by wiring. The laser 410 can emit light after receiving the bias current transmitted by the DC signal line, and the high-frequency signal line After being transmitted to the laser 410, the laser 410 modulates the high-frequency signal into the light beam, so that the laser 410 generates signal light.
传输偏置电流的直流信号线还可从安装通孔320的上侧、下侧连接至激光器410，即连接激光器410的直流信号线与高频信号线位于安装通孔320的不同侧，这样既避免了高频信号与直流信号之间的干扰，也使直流信号的走线更短，避免电路板300中布线过度拥挤。The DC signal line that transmits the bias current can also be connected to the laser 410 from the upper and lower sides of the mounting through hole 320, that is, the DC signal line and the high frequency signal line connecting the laser 410 are located on different sides of the mounting through hole 320, so that both Interference between high-frequency signals and DC signals is avoided, and the routing of DC signals is also made shorter, thereby avoiding overcrowding of wiring in the circuit board 300 .
在一些实施例中，第一光路平移棱镜430包括第一反射镜与第二反射镜，第一反射镜位于激光器410的出光方向上，耦合透镜420a输出的汇聚光束射至第一反射镜，汇聚光束在第一反射镜处进行反射，反射后的汇聚光束在第二反射镜处再次反射，再次反射后的汇 聚光束位于电路板300的正侧。In some embodiments, the first optical path translation prism 430 includes a first reflector and a second reflector. The first reflector is located in the light emitting direction of the laser 410. The condensed light beam output by the coupling lens 420a is directed to the first reflector and converged. The beam is reflected at the first reflector, and the reflected concentrated beam is reflected again at the second reflector. The spotlight is located on the front side of the circuit board 300 .
激光器410在电路板300传输的偏置电流、高频信号的驱动下发射激光信号，为检测激光器410的发射光功率，电路板300的背面设置有光探测器，光探测器设置在电路板300上安装通孔320的左侧边缘，且该光探测器的光敏面朝向激光器410的出光方向，用于采集激光器410发射的前向光，并将采集到的数据发送至电路板300上的相关器件，以实现对激光器410前向出光功率的监控。The laser 410 emits a laser signal driven by the bias current and high-frequency signal transmitted by the circuit board 300. In order to detect the emitted optical power of the laser 410, a photodetector is provided on the back of the circuit board 300, and the photodetector is provided on the circuit board 300. The left edge of the through hole 320 is installed on the top, and the photosensitive surface of the photodetector faces the light emitting direction of the laser 410, for collecting the forward light emitted by the laser 410, and sending the collected data to the relevant circuit board 300. device to monitor the forward light power of the laser 410.
在一些实施例中，光探测器位于发射盖板402的内腔内，以将光探测器置于发射盖板402与电路板300背面形成的密封腔体内，以保证光发射组件400的密封性。In some embodiments, the photodetector is located in the inner cavity of the emitting cover 402, so that the photodetector is placed in the sealed cavity formed by the emitting cover 402 and the back of the circuit board 300 to ensure the sealing of the light emitting assembly 400. .
在一些实施例中，利用第一反射镜反射面的透光特性，使少部分准直光束漏过第一反射镜，并射入光探测器的光敏面上，使得光探测器能够接收到部分光束，从而得到激光器410的发射光功率。In some embodiments, the light transmission characteristics of the reflective surface of the first reflector are used to cause a small part of the collimated light beam to leak through the first reflector and enter the photosensitive surface of the photodetector, so that the photodetector can receive part of the beam, thereby obtaining the emitted optical power of the laser 410.
具体地，第一光路平移棱镜430的第一反射镜朝向激光器410的出光方向上，用于将激光器410产生的激光光束分为两束光，一束光(通常占95％的总功率)被第一反射镜反射至第二反射镜，以将激光光束由电路板300的背侧反射至电路板300的正侧，另一束光直接透过第一反射镜射入光探测器的光敏面，通过该光敏面接收激光器410出光面发射的激光光束。Specifically, the first reflecting mirror of the first optical path translation prism 430 faces the light emitting direction of the laser 410 and is used to divide the laser beam generated by the laser 410 into two beams of light. One beam of light (usually accounting for 95% of the total power) is The first reflector reflects to the second reflector to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300. Another beam of light directly passes through the first reflector and enters the photosensitive surface of the photodetector. , the laser beam emitted by the light-emitting surface of the laser 410 is received through the photosensitive surface.
将光探测器贴装在安装通孔320的左侧时，可将光探测器的光敏面与安装通孔320的内侧壁相平齐，以方便对光探测器进行定位。When the photodetector is mounted on the left side of the mounting through hole 320, the photosensitive surface of the photodetector can be flush with the inner wall of the mounting through hole 320 to facilitate positioning of the photodetector.
将光探测器设置在电路板300的背面上时，可将光探测器中光敏面的中心轴线与激光器410的中心轴线相重合，并将光探测器朝向电路板300背面的侧面通过表面组装技术(Surface Mounted Technology，SMT)安装于电路板300的背面，使得透过第一反射镜的光束尽可能地射入光探测器内。When disposing the photodetector on the back of the circuit board 300, the central axis of the photosensitive surface of the photodetector can be coincident with the central axis of the laser 410, and the photodetector can be facing the side of the back of the circuit board 300 through surface assembly technology. (Surface Mounted Technology, SMT) is installed on the back of the circuit board 300 so that the light beam passing through the first reflector can enter the photodetector as much as possible.
在一些实施例中，电路板300的背面设置有4个光探测器，每个光探测器与每个激光器410对应设置，如此每个光探测器采集每个激光器410发射的激光光束透过第一反射镜的部分光束，并通过与光探测器电连接的器件测得相应激光器410的前向出光功率。In some embodiments, four photodetectors are provided on the back of the circuit board 300, and each photodetector is arranged corresponding to each laser 410. In this way, each photodetector collects the laser beam emitted by each laser 410 and passes through the third photodetector. A part of the light beam is reflected by a mirror, and the forward light power of the corresponding laser 410 is measured through a device electrically connected to the photodetector.
由于光探测器接收的是有一定面积的平行光，光探测器的装配位置精度要求低，装配更加容易，只要将第一光路平移棱镜430中第一反射镜的透光范围与光探测器的光敏面相对齐即可，使得光探测器能够采集到透过第一反射镜的激光光束。Since the photodetector receives parallel light with a certain area, the assembly position accuracy of the photodetector is low, and the assembly is easier. As long as the light transmission range of the first reflector in the first optical path translation prism 430 is matched with that of the photodetector. The photosensitive surfaces only need to be aligned, so that the photodetector can collect the laser beam that passes through the first reflector.
将光探测器固定在电路板300的背面上时，光探测器与电路板300背面连接的侧面上设置有阳极，阳极可以直接焊接或者通过导电胶等方式导电固定在电路板300上的接地金属层上；光探测器背向电路板300背面的侧面上设置有阴极，阴极通过打线与电路板300电连接，进而实现光探测器与电路板300的电连接。When the photodetector is fixed on the back of the circuit board 300, an anode is provided on the side where the photodetector is connected to the back of the circuit board 300. The anode can be directly welded or conductively fixed to the grounded metal on the circuit board 300 through conductive glue or other methods. On the layer; a cathode is provided on the side of the photodetector facing away from the back of the circuit board 300, and the cathode is electrically connected to the circuit board 300 through wiring, thereby realizing the electrical connection between the photodetector and the circuit board 300.
将光发射组件400反向安装至电路板300的正面后，光发射组件400中第一发射壳体401的第一顶面4012与上壳体201接触；将光发射组件400中激光器410通过高频信号线与电路板300正面的DSP芯片310信号连接后，激光器410在电路板300传输的直流和高频信号驱动下产生激光光束，如此激光器410会产生热量，而激光器410的发光性能受到温度的影响，因此激光器410需工作在某一固定温度范围，所以需要将激光器410放置在半导体制冷器460a上，以保证激光器410的工作温度，而半导体制冷器460a在制冷过程中会产生大量热量，需要将这些热量传播出去，以保证半导体制冷器460a的制冷效率。After the light emitting assembly 400 is installed to the front of the circuit board 300 in reverse, the first top surface 4012 of the first emitting housing 401 in the light emitting assembly 400 is in contact with the upper housing 201; the laser 410 in the light emitting assembly 400 is passed through the high After the frequency signal line is connected to the DSP chip 310 on the front of the circuit board 300, the laser 410 generates a laser beam driven by the DC and high-frequency signals transmitted by the circuit board 300. In this way, the laser 410 will generate heat, and the luminous performance of the laser 410 is affected by temperature. Therefore, the laser 410 needs to work in a certain fixed temperature range, so the laser 410 needs to be placed on the semiconductor refrigerator 460a to ensure the operating temperature of the laser 410, and the semiconductor refrigerator 460a will generate a lot of heat during the cooling process. This heat needs to be dissipated to ensure the cooling efficiency of the semiconductor refrigerator 460a.
由于激光器410固定在第一发射壳体401的第一安装面4110上的半导体制冷器460a上，激光器410产生的热量会通过半导体制冷器460a传输至第一发射壳体401上，以保持激光器410的温度。为提高光模块的散热性能，第一发射壳体401可采用钨铜或其他具有良好导热性的金属材料，并适当增加第一发射壳体401的质量以及第一顶面4012的面积，如此激光器410及半导体制冷器460a工作产生的热量可通过第一发射壳体401传输至上壳体201，有效改善激光器410的散热效果。Since the laser 410 is fixed on the semiconductor refrigerator 460a on the first mounting surface 4110 of the first emission housing 401, the heat generated by the laser 410 will be transmitted to the first emission housing 401 through the semiconductor refrigerator 460a to maintain the laser 410 temperature. In order to improve the heat dissipation performance of the optical module, the first emitting housing 401 can be made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the first emitting housing 401 and the area of the first top surface 4012 can be appropriately increased, so that the laser The heat generated by the operation of 410 and semiconductor refrigerator 460a can be transmitted to the upper housing 201 through the first emission housing 401, effectively improving the heat dissipation effect of the laser 410.
在一些实施例中，第一发射壳体401需要选用钨铜或其他具有良好导热性的金属材料， 并适当增加第一发射壳体401的质量及底面的面积，从而增加第一发射壳体401与上壳体201的接触面积，进而提高光发射组件400的散热效率。In some embodiments, the first emission housing 401 needs to be made of tungsten copper or other metal materials with good thermal conductivity. And appropriately increase the mass and bottom surface area of the first emitting housing 401, thereby increasing the contact area between the first emitting housing 401 and the upper housing 201, thereby improving the heat dissipation efficiency of the light emitting component 400.
在一些实施例中，为方便将第一发射壳体401的热量传输至上壳体201，可在第一发射壳体401的第一顶面4012与上壳体201内侧面之间设置第一导热垫片，如此第一发射壳体401的热量传输至第一导热垫片，第一导热垫片将热量传输至上壳体201，以有效改善散热效果。In some embodiments, in order to facilitate the transfer of heat from the first emission housing 401 to the upper housing 201, a first thermal conductor may be provided between the first top surface 4012 of the first emission housing 401 and the inner surface of the upper housing 201. gasket, so that the heat of the first emission housing 401 is transferred to the first thermal conductive pad, and the first thermal conductive pad transmits the heat to the upper shell 201 to effectively improve the heat dissipation effect.
在一些实施例中，第一导热垫片可为导热胶，既能通过导热胶将第一发射壳体401的第一顶面4012粘贴于上壳体201的内侧面，又能将第一发射壳体401的热量传导至上壳体201。In some embodiments, the first thermally conductive pad can be thermally conductive glue, which can not only stick the first top surface 4012 of the first emission housing 401 to the inner side of the upper housing 201 through the thermally conductive glue, but also can paste the first emission The heat of the housing 401 is conducted to the upper housing 201 .
在一些实施例中，光模块的最主要热源除了激光器410与半导体制冷器460a外，还有DSP芯片310，该DSP芯片310背向电路板300的侧面与上壳体201相接触，如此DSP芯片310工作产生的热量传输至上壳体201上，以将DSP芯片310产生的热量传输至光模块外侧。In some embodiments, in addition to the laser 410 and the semiconductor refrigerator 460a, the main heat source of the optical module is the DSP chip 310. The DSP chip 310 is in contact with the upper case 201 on the side facing away from the circuit board 300. In this way, the DSP chip 310 The heat generated by the operation of 310 is transferred to the upper housing 201 to transfer the heat generated by the DSP chip 310 to the outside of the optical module.
为方便将DSP芯片310的热量传输至上壳体201，可在DSP芯片310与上壳体201内侧面之间设置第二导热垫片，如此DSP芯片310产生的热量传输至第二导热垫片，第二导热垫片将热量传输至上壳体201，以有效改善散热效果。In order to facilitate the transfer of heat from the DSP chip 310 to the upper case 201, a second thermal pad can be provided between the DSP chip 310 and the inner side of the upper case 201, so that the heat generated by the DSP chip 310 is transferred to the second thermal pad. The second thermal pad transfers heat to the upper case 201 to effectively improve the heat dissipation effect.
在一些实施例中，光接收组件500与光发射组件400可并排设置在电路板300上，也可设置在电路板300的不同面上，光接收组件500与电路板300形成封闭腔体结构，以实现光接收组件500的密封装配。In some embodiments, the light receiving component 500 and the light emitting component 400 can be disposed side by side on the circuit board 300, or can be disposed on different surfaces of the circuit board 300. The light receiving component 500 and the circuit board 300 form a closed cavity structure. To achieve a sealed assembly of the light receiving assembly 500 .
图38为本公开实施例提供的光模块中光接收组件的翻转结构示意图。如图38所示，本公开实施例提供的光接收组件500包括接收壳体501a，该接收壳体501a罩扣于电路板300的正侧，与电路板300的正面密封连接；该接收壳体501a包括朝向电路板300的第二接触面5011，第二接触面5011上设置有安装槽，该安装槽朝向电路板300正面的一端设置有开口，且安装槽由第二接触面5011向接收壳体501a的顶面(背向电路板300正面的侧面)方向延伸。Figure 38 is a schematic diagram of the flip structure of the light receiving component in the optical module provided by an embodiment of the present disclosure. As shown in Figure 38, the light receiving component 500 provided by the embodiment of the present disclosure includes a receiving housing 501a, which is buckled on the front side of the circuit board 300 and is sealingly connected to the front side of the circuit board 300; the receiving housing 501a 501a includes a second contact surface 5011 facing the circuit board 300. The second contact surface 5011 is provided with a mounting groove. The mounting groove is provided with an opening at one end toward the front of the circuit board 300, and the mounting groove is directed from the second contact surface 5011 to the receiving shell. The body 501a extends in the direction of the top surface (the side facing away from the front of the circuit board 300).
接收壳体501a的安装槽内设置有转角光纤阵列组件，该转角光纤阵列组件的一端引出接收光纤阵列820，转角光纤阵列组件的另一端置于电路板300上探测器的上方，通过转角光纤阵列组件将接收光纤阵列820传输的接收光束进行反射转向，反射后的光束射入电路板300上的探测器进行光电转换。A corner fiber optic array component is provided in the installation groove of the receiving housing 501a. One end of the corner fiber optic array component leads to the receiving fiber array 820. The other end of the corner fiber optic array component is placed above the detector on the circuit board 300. Through the corner fiber optic array, The component reflects and turns the received light beam transmitted by the optical fiber array 820, and the reflected light beam is injected into the detector on the circuit board 300 for photoelectric conversion.
转角光纤阵列组件包括转角V型槽基板510、盖板520与支撑件530，转角V型槽基板510上并行设置有多排V型槽，接收光纤阵列820放置在V型槽中，并用胶水紧密粘接，其端面抛光成近45度角，从而形成合适角度的反射面。转角V型槽基板510分别与接收光纤阵列820的光纤密封连接，如此接收光纤阵列820传输的接收光束传输至转角V型槽基板510的V型槽内。The corner optical fiber array assembly includes a corner V-groove substrate 510, a cover plate 520 and a support 530. Multiple rows of V-grooves are arranged in parallel on the corner V-groove substrate 510. The receiving optical fiber array 820 is placed in the V-groove and tightly sealed with glue. Bonded, its end surface is polished to an angle of nearly 45 degrees, thereby forming a reflective surface at a suitable angle. The corner V-groove substrate 510 is sealingly connected to the optical fibers of the receiving optical fiber array 820 , so that the receiving light beam transmitted by the receiving optical fiber array 820 is transmitted to the V-shaped groove of the corner V-groove substrate 510 .
支撑件530设置在接收壳体501a的安装面上，转角V型槽基板510设置在支撑件530上，通过支撑件530抬高了转角V型槽基板510的安装高度。转角V型槽基板510的一端与接收光纤阵列820密封连接，转角V型槽基板的另一端设置有反射面，该反射面用于对接收光纤阵列820传输的光束进行反射转向，转向后的反射光束射入电路板300上的探测器。The support member 530 is disposed on the mounting surface of the receiving housing 501a, and the corner V-groove base plate 510 is disposed on the support member 530. The support member 530 raises the installation height of the corner V-groove base plate 510. One end of the corner V-groove substrate 510 is sealingly connected to the receiving optical fiber array 820. The other end of the corner V-groove substrate is provided with a reflective surface. The reflective surface is used to reflect and steer the light beam transmitted by the receiving optical fiber array 820. The reflection after steering The beam strikes a detector on circuit board 300.
在一些实施例中，转角V型槽基板510上V型槽的开口朝向电路板300的正面，盖板520覆盖在转角V型槽基板510上，以密封转角V型槽基板510上的V型槽，保证接收光纤阵列820与V型槽的密封连接。盖板520的一侧密封V型槽、另一侧可与电路板300的正面粘接固定，如此实现了转角光纤阵列组件与接收壳体501a、电路板300的固定连接。In some embodiments, the opening of the V-shaped groove on the corner V-shaped groove substrate 510 faces the front side of the circuit board 300 , and the cover plate 520 covers the corner V-shaped groove substrate 510 to seal the V-shaped opening on the corner V-shaped groove substrate 510 . groove to ensure the sealed connection between the receiving optical fiber array 820 and the V-shaped groove. One side of the cover plate 520 seals the V-shaped groove, and the other side can be bonded and fixed with the front surface of the circuit board 300, thus achieving a fixed connection between the corner optical fiber array assembly, the receiving housing 501a, and the circuit board 300.
图39为本公开实施例提供的光模块中接收壳体的结构示意图。如图39所示，接收壳体501a包括第二接触面5011，该第二接触面5011为朝向电路板300正面的侧面，将光接收组件500反向安装在电路板300上时，第二接触面5011与电路板300的正面密封连接。 Figure 39 is a schematic structural diagram of a receiving housing in an optical module according to an embodiment of the present disclosure. As shown in Figure 39, the receiving housing 501a includes a second contact surface 5011, which is a side facing the front of the circuit board 300. When the light receiving assembly 500 is installed on the circuit board 300 in reverse, the second contact surface 5011 is The surface 5011 is sealingly connected to the front side of the circuit board 300 .
由第二接触面5011向上壳体201的方向设置有安装槽，该安装槽朝向电路板300正面的一侧开口，使得接收壳体501a内形成第四安装面5110与第五安装面5120，第四安装面5110与第五安装面5120为平齐的同一安装面，将转角光纤阵列组件中的支撑件530设置在第四安装面5110上，转角V型槽基板510设置在第四安装面5110与第五安装面5120的上方，以将转角光纤阵列组件固定在接收壳体501a内的安装面上。A mounting groove is provided from the second contact surface 5011 toward the upward housing 201. The mounting groove opens toward one side of the front of the circuit board 300, so that a fourth mounting surface 5110 and a fifth mounting surface 5120 are formed in the receiving housing 501a. The fourth mounting surface 5110 and the fifth mounting surface 5120 are flush with the same mounting surface. The support 530 in the corner fiber array assembly is set on the fourth mounting surface 5110, and the corner V-groove base plate 510 is set on the fourth mounting surface 5110. and above the fifth mounting surface 5120 to fix the corner optical fiber array assembly on the mounting surface in the receiving housing 501a.
在一些实施例中，接收壳体501a的一端开口，该开口与第五安装面5120位于同一端，如此将转角光纤阵列组件固定在第四安装面5110后，转角光纤阵列组件引出的接收光纤阵列820与光纤600连接。In some embodiments, one end of the receiving housing 501a is open, and the opening is located at the same end as the fifth mounting surface 5120. In this way, after the corner fiber array assembly is fixed on the fourth mounting surface 5110, the receiving fiber array derived from the corner fiber array assembly 820 with fiber 600 connection.
在一些实施例中，第四安装面5110在前后方向的宽度尺寸大于第五安装面5120在前后方向的宽度尺寸，如此将转角光纤阵列组件固定在第四安装面5110时，将与第四安装面5110连接的接收壳体501a的内侧壁、支撑件530相对的两侧壁、转角V型槽基板510相对的两侧壁胶合固定在一起，从而通过转角光纤阵列组件将接收壳体501a的开口粘接固定，使得转角光纤阵列组件与开口之间密封连接，如此接收壳体501a与转角光纤阵列组件共同组成密封腔体。In some embodiments, the width dimension of the fourth mounting surface 5110 in the front-to-back direction is greater than the width dimension of the fifth mounting surface 5120 in the front-to-back direction. In this way, when the corner optical fiber array assembly is fixed to the fourth mounting surface 5110, it will be inconsistent with the fourth mounting surface. The inner side wall of the receiving housing 501a connected with the surface 5110, the opposite side walls of the support member 530, and the opposite side walls of the corner V-groove base plate 510 are glued and fixed together, so that the opening of the receiving housing 501a is closed through the corner optical fiber array assembly. The adhesive and fixation makes the corner fiber array component and the opening sealingly connected, so that the receiving housing 501a and the corner fiber array component together form a sealed cavity.
接收壳体501a还包括与第二接触面5011相对设置的顶面，该顶面朝向上壳体201，顶面上设置有向第二接触面5011延伸的第二放气孔5013，第二放气孔5013与接收壳体501a内的第四安装面5110相连通，且第二放气孔5013为锥形孔，由顶面向第四安装面5110方向上，该锥形孔的直径尺寸逐渐减小，如此接收壳体501a可通过该第二放气孔5013与外界连通。The receiving housing 501a also includes a top surface opposite to the second contact surface 5011. The top surface faces the upper housing 201. A second vent hole 5013 extending toward the second contact surface 5011 is provided on the top surface. The second vent hole 5013 is disposed on the top surface. 5013 is connected with the fourth mounting surface 5110 in the receiving housing 501a, and the second vent hole 5013 is a tapered hole, and the diameter of the tapered hole gradually decreases from the top to the direction of the fourth mounting surface 5110, so The receiving housing 501a can communicate with the outside world through the second air release hole 5013.
接收壳体501a上的第二放气孔5013的封闭是在所有密封操作完成之后再进行，以保证在密封过程中所有密封区域不会由于空气膨胀导致出现漏气孔。The second vent hole 5013 on the receiving housing 501a is closed after all sealing operations are completed to ensure that no leak holes will occur in all sealing areas due to air expansion during the sealing process.
图40为本公开实施例提供的光模块中另一种光接收组件的翻转结构示意图。如图40所示，光接收组件500包括接收壳体，接收壳体罩扣于电路板300的正侧，与电路板300的正面密封连接；接收壳体内包括安装腔，安装腔内设置有光接收器组件，且安装腔朝向电路板300正面的一端设置有开口，光接收器件通过该开口与电路板300的正面连通。如此由接收壳体和电路板300形成封闭腔体结构，光接收器组件置于该封闭腔体结构内。Figure 40 is a schematic diagram of the flipped structure of another light receiving component in the optical module provided by an embodiment of the present disclosure. As shown in Figure 40, the light receiving assembly 500 includes a receiving housing. The receiving housing is buckled on the front side of the circuit board 300 and is sealingly connected to the front side of the circuit board 300. The receiving housing includes an installation cavity, and a light beam is disposed in the installation cavity. The receiver assembly is provided with an opening at one end of the mounting cavity facing the front of the circuit board 300, and the light receiving device communicates with the front of the circuit board 300 through the opening. In this way, a closed cavity structure is formed by the receiving housing and the circuit board 300, and the light receiver assembly is placed within the closed cavity structure.
在一些实施例中，接收壳体承载所有无源光学部件，包括光接收准直器、分波器、聚焦镜和转角棱镜等，同时接收壳体在电路板300上覆盖探测器PD和TIA，及打线所需安全区域。如此，将光接收器组件固定安装在接收壳体的内腔内，然后将接收壳体翻转罩设在电路板300的正面上，以实现光接收组件500的密封装配。In some embodiments, the receiving housing carries all passive optical components, including light receiving collimators, wavelength splitters, focusing mirrors, corner prisms, etc., while the receiving housing covers the detectors PD and TIA on the circuit board 300, and safe areas required for wiring. In this way, the light receiver assembly is fixedly installed in the inner cavity of the receiving housing, and then the receiving housing flip cover is placed on the front side of the circuit board 300 to achieve a sealed assembly of the light receiving assembly 500 .
接收壳体背向电路板300正面的一表面上设置有放气孔，放气孔与接收壳体的内腔相连通，接收壳体上的放气孔的封闭是在所有密封操作完成之后在进行，以保证在密封过程中所有密封区域不会由于空气膨胀导致出现漏气孔。A venting hole is provided on a surface of the receiving housing facing away from the front of the circuit board 300. The venting hole is connected to the inner cavity of the receiving housing. The venting hole on the receiving housing is closed after all sealing operations are completed. Ensure that no leak holes will appear in all sealing areas due to air expansion during the sealing process.
由于在传统光模块设计中，外部光纤与光模块的连接是通过外部光纤适配器***光模块的光适配器中实现光纤的对接，这时适配器中的光纤法兰与光纤适配器存在端面的物理接触。当光模块进入制冷液中，接触面会受到制冷液的污染，造成额外损耗。而且在这种场景中，无法对被污染的端面进行清洁，形成永久损伤。In the traditional optical module design, the external optical fiber is connected to the optical module by inserting the external optical fiber adapter into the optical adapter of the optical module to realize the optical fiber docking. At this time, there is physical contact between the end face of the optical fiber flange in the adapter and the optical fiber adapter. When the optical module enters the refrigerant liquid, the contact surface will be contaminated by the refrigerant liquid, causing additional losses. Moreover, in this scenario, the contaminated end face cannot be cleaned, causing permanent damage.
图41为本公开实施例提供的一种光模块中光纤与壳体的局部装配示意图。如图41所示，为了避免光模块进入制冷液时，制冷液对光纤与光纤适配器的接触面造成污染，本公开在光模块的光口205处采用光纤尾纤的连接方式，直接将光纤600导出，使得光纤600穿过光口205。Figure 41 is a partial assembly diagram of an optical fiber and a housing in an optical module according to an embodiment of the present disclosure. As shown in Figure 41, in order to prevent the refrigerant from contaminating the contact surface between the optical fiber and the optical fiber adapter when the optical module enters the refrigerant liquid, the present disclosure uses an optical fiber pigtail connection method at the optical port 205 of the optical module to directly connect the optical fiber 600 Export, so that the optical fiber 600 passes through the optical port 205.
在一些实施例中，为了保护光纤600，在光口205处设置有光纤保护件610，该光纤保护件610***光口205内，且光纤600嵌在光纤保护件610内，能够根除光纤600与光模块连接时的端口污染风险，保证光模块长期稳定工作。In some embodiments, in order to protect the optical fiber 600, an optical fiber protection member 610 is provided at the optical port 205. The optical fiber protection member 610 is inserted into the optical port 205, and the optical fiber 600 is embedded in the optical fiber protection member 610, so that the optical fiber 600 and the optical fiber protection member 610 can be eradicated. The risk of port contamination when the optical module is connected ensures the long-term stable operation of the optical module.
本公开实施例提供的光模块应用于高速光通信模块结构设计，包括光学，结构，高频信号传输和散热等方面的创新考虑，将光发射组件设计成一个完全密闭的结构，从而解决 了发射光路密封的问题；将光接收组件设计成完全密闭的结构，从而解决了接收光路密封的问题；光接口采用尾纤方式，取消光纤适配器至光模块的光接口、光适配器的接触连接，消除了光接口处的污染和密封问题；采用环氧体系胶水进行光组件以及光组件与电路板之间的密封连接，既起到结构连接和加固的作用，又起到密封作用，保证冷却液不会渗透进光发射组件和光接收组件内部；合理设计粘接界面，使上胶和粘接工艺简化，从而解决了部件装配粘接处的密封问题；结构设计简单，适合批量生产。The optical module provided by the embodiment of the present disclosure is used in the structural design of high-speed optical communication modules, including innovative considerations in optics, structure, high-frequency signal transmission and heat dissipation. The light-emitting component is designed into a completely sealed structure, thereby solving the problem of The problem of sealing of the transmitting optical path is solved; the optical receiving component is designed into a completely sealed structure, thereby solving the problem of sealing of the receiving optical path; the optical interface adopts pigtail mode, canceling the optical interface from the optical fiber adapter to the optical module and the contact connection of the optical adapter. The pollution and sealing problems at the optical interface are eliminated; the epoxy system glue is used for the sealed connection between the optical component and the optical component and the circuit board, which not only plays the role of structural connection and reinforcement, but also plays a sealing role to ensure the coolant It will not penetrate into the light-emitting component and the light-receiving component; the bonding interface is rationally designed to simplify the gluing and bonding process, thus solving the sealing problem at the component assembly bonding joint; the structural design is simple and suitable for mass production.
本公开通过独特的结构设计和安排，实现了对光模块中的自由光学光路的完全密闭封装，进而实现了光模块在液冷环境中长期和可靠的工作，极大改善了光发射组件和光接收组件的散热效果。Through unique structural design and arrangement, the present disclosure achieves a completely sealed package of the free optical path in the optical module, thereby realizing long-term and reliable operation of the optical module in a liquid cooling environment, and greatly improving the light emitting component and light receiving The heat dissipation effect of components.
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。 Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present disclosure, but not to limit it; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be Modifications may be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions may be made to some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims (10)

  1. 一种光模块，包括：An optical module includes:
    电路板，其上设置有安装通孔；a circuit board with mounting through holes;
    光发射组件，与所述电路板电连接，用于发射光信号；A light emitting component, electrically connected to the circuit board, for emitting light signals;
    光纤适配器，与所述光发射组件通过光纤阵列连接；An optical fiber adapter, connected to the light emitting component through an optical fiber array;
    其中，所述光发射组件包括：Wherein, the light emitting component includes:
    发射壳体，罩扣于所述电路板的正侧，与所述电路板的正面密封连接；包括安装内腔，所述安装内腔朝向所述电路板正面的一端设置有开口，所述安装内腔通过所述开口与所述安装通孔相连通；朝向所述光纤适配器的一端设置有缺口，所述缺口与所述安装内腔相连通；The launch housing is buckled on the front side of the circuit board and is sealingly connected to the front side of the circuit board; it includes an installation inner cavity, and an opening is provided at one end of the installation inner cavity toward the front side of the circuit board. The inner cavity is connected to the installation through hole through the opening; a notch is provided toward one end of the optical fiber adapter, and the notch is connected to the installation inner cavity;
    发射盖板，设置于所述电路板的背侧，罩设于所述安装通孔上，与所述电路板的背面密封连接；A launch cover is provided on the back side of the circuit board, covers the mounting through hole, and is sealingly connected to the back side of the circuit board;
    激光器，设置在所述安装内腔内，通过所述安装通孔位于所述电路板的背侧，用于产生激光光束；A laser is disposed in the mounting cavity, located on the back side of the circuit board through the mounting through hole, and is used to generate a laser beam;
    光路平移棱镜，设置在所述安装内腔内，其一端通过所述安装通孔位于所述电路板的背侧、另一端位于所述电路板的正侧，用于将位于电路板背侧的激光光束反射至所述电路板的正侧；An optical path translation prism is provided in the installation cavity, with one end located on the back side of the circuit board through the installation through hole, and the other end located on the front side of the circuit board, for moving the light path located on the back side of the circuit board. The laser beam is reflected to the front side of the circuit board;
    发射光纤阵列组件，一端通过所述缺口***所述安装内腔内，另一端引出光纤阵列与所述光纤适配器连接；分别与所述缺口、所述电路板的正面密封连接。One end of the emitting optical fiber array component is inserted into the installation cavity through the notch, and the other end leads out the optical fiber array and is connected to the optical fiber adapter; it is sealed and connected to the notch and the front surface of the circuit board respectively.
  2. 根据权利要求1所述的光模块，其中，所述发射壳体的安装内腔包括第一安装面、第二安装面与第三安装面，所述第二安装面凹陷于所述第一安装面，所述第三安装面与所述第二安装面为同一安装面；The optical module according to claim 1, wherein the mounting inner cavity of the emission housing includes a first mounting surface, a second mounting surface and a third mounting surface, and the second mounting surface is recessed in the first mounting surface. surface, the third mounting surface and the second mounting surface are the same mounting surface;
    所述激光器设置于所述第一安装面上，所述光路平移棱镜设置于所述第二安装面上，所述发射光纤阵列组件设置于所述第三安装面上。The laser is disposed on the first mounting surface, the optical path translation prism is disposed on the second mounting surface, and the emitting fiber array component is disposed on the third mounting surface.
  3. 根据权利要求2所述的光模块，其中，所述缺口与所述第三安装面相连通，所述缺口在前后方向的宽度尺寸与所述第三安装面在前后方向的宽度尺寸相同。The optical module according to claim 2, wherein the notch is connected to the third mounting surface, and the width dimension of the notch in the front-rear direction is the same as the width dimension of the third mounting surface in the front-rear direction.
  4. 根据权利要求2所述的光模块，其中，所述第二安装面在前后方向的宽度尺寸大于所述第三安装面在前后方向的宽度尺寸。The optical module according to claim 2, wherein the width dimension of the second mounting surface in the front-rear direction is greater than the width dimension of the third mounting surface in the front-rear direction.
  5. 根据权利要求2所述的光模块，其中，所述发射光纤阵列组件包括V型槽基板、玻璃盖板与支撑板，所述V型槽基板上设置有V型槽，所述光纤阵列嵌入所述V型槽内；The optical module according to claim 2, wherein the emitting optical fiber array assembly includes a V-shaped groove substrate, a glass cover plate and a support plate, the V-shaped groove substrate is provided with a V-shaped groove, and the optical fiber array is embedded in the optical module. Inside the V-shaped groove;
    所述玻璃盖板的一侧覆盖于所述V型槽基板上设有V型槽的侧面上，所述支撑板的一侧与所述玻璃盖板的另一侧粘接，所述支撑板的另一侧与所述电路板的正面粘接。One side of the glass cover plate covers the side surface of the V-shaped groove substrate with a V-shaped groove, and one side of the support plate is bonded to the other side of the glass cover plate. The support plate The other side is bonded to the front side of the circuit board.
  6. 根据权利要求5所述的光模块，其中，所述发射光纤阵列组件相对的两侧与所述缺口的侧壁相粘接。The optical module according to claim 5, wherein opposite sides of the emitting optical fiber array assembly are bonded to side walls of the notch.
  7. 根据权利要求1所述的光模块，其中，所述发射壳体背向所述电路板正面的表面上设置有第一放气孔，所述第一放气孔与所述安装内腔相连通。The optical module according to claim 1, wherein a first air release hole is provided on a surface of the emission housing facing away from the front surface of the circuit board, and the first air release hole is connected with the installation inner cavity.
  8. 根据权利要求5所述的光模块，其中，所述光发射组件还包括：The optical module according to claim 5, wherein the light emitting component further includes:
    光隔离器，设置于所述V型槽基板的一端，用于将所述光路平移棱镜输出的反射光束直接传输至所述发射光纤阵列组件。An optical isolator is provided at one end of the V-groove substrate and is used to directly transmit the reflected light beam output by the optical path translation prism to the emitting optical fiber array component.
  9. 根据权利要求1所述的光模块，其中，还包括光接收组件，所述光接收组件与所述电路板电连接，用于接收光信号；The optical module according to claim 1, further comprising a light receiving component electrically connected to the circuit board for receiving optical signals;
    其中，所述光接收组件包括：Wherein, the light receiving component includes:
    接收壳体，罩扣于所述电路板的正侧，与所述电路板的正面密封连接；包括安装槽，所述安装槽朝向所述电路板正面的一端设置有开口；朝向所述光纤适配器的一端设置有缺口，所述缺口与所述安装槽相连通；The receiving shell is buckled on the front side of the circuit board and is sealingly connected to the front side of the circuit board; it includes a mounting groove, and an opening is provided at one end of the mounting groove toward the front side of the circuit board; toward the fiber optic adapter One end is provided with a notch, and the notch is connected with the installation groove;
    转角光纤阵列组件，一端通过所述缺口***所述安装槽内，另一端引出接收光纤与所 述光纤适配器连接；分别与所述缺口、所述电路板的正面密封连接。The corner optical fiber array assembly has one end inserted into the installation groove through the gap, and the other end leads out the receiving optical fiber and the The optical fiber adapter is connected; it is sealed and connected to the notch and the front surface of the circuit board respectively.
  10. 根据权利要求9所述的光模块，其中，所述转角光纤阵列组件包括转角V型槽基板，所述转角V型槽基板背向所述光纤适配器的一端设置有反射面，所述反射面用于将所述转角光纤阵列组件传输的光束反射至所述电路板上。 The optical module according to claim 9, wherein the corner optical fiber array assembly includes a corner V-groove substrate, and an end of the corner V-groove substrate facing away from the optical fiber adapter is provided with a reflective surface, and the reflective surface is Reflecting the light beam transmitted by the corner optical fiber array component onto the circuit board.
PCT/CN2023/072390 2022-03-30 2023-01-16 Optical module WO2023185220A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN202220740523.XU CN217543461U (en) 2022-03-30 2022-03-30 Optical module
CN202220740523.X 2022-03-30
CN202210331564.8 2022-03-30
CN202220776501.9U CN217085337U (en) 2022-03-30 2022-03-30 Optical module
CN202220776501.9 2022-03-30
CN202210331564.8A CN114675383A (en) 2022-03-30 2022-03-30 Optical module

Publications (1)

Publication Number Publication Date
WO2023185220A1 true WO2023185220A1 (en) 2023-10-05

Family

ID=88199051

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/072390 WO2023185220A1 (en) 2022-03-30 2023-01-16 Optical module

Country Status (1)

Country Link
WO (1) WO2023185220A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117555089A (en) * 2024-01-10 2024-02-13 深圳市维度科技股份有限公司 Clamp for adapting optical fiber connector

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205427247U (en) * 2015-12-23 2016-08-03 福州高意通讯有限公司 A smooth subassembly of receiving and dispatching for multichannel parallel transmission
CN106164727A (en) * 2014-05-14 2016-11-23 日本航空电子工业株式会社 Optical module
CN214278498U (en) * 2021-03-31 2021-09-24 青岛海信宽带多媒体技术有限公司 Optical module
CN113721331A (en) * 2021-08-31 2021-11-30 青岛海信宽带多媒体技术有限公司 Optical module
CN114035285A (en) * 2021-11-29 2022-02-11 青岛海信宽带多媒体技术有限公司 Optical module
WO2022057621A1 (en) * 2020-09-17 2022-03-24 青岛海信宽带多媒体技术有限公司 Optical module
CN217085337U (en) * 2022-03-30 2022-07-29 青岛海信宽带多媒体技术有限公司 Optical module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106164727A (en) * 2014-05-14 2016-11-23 日本航空电子工业株式会社 Optical module
CN205427247U (en) * 2015-12-23 2016-08-03 福州高意通讯有限公司 A smooth subassembly of receiving and dispatching for multichannel parallel transmission
WO2022057621A1 (en) * 2020-09-17 2022-03-24 青岛海信宽带多媒体技术有限公司 Optical module
CN214278498U (en) * 2021-03-31 2021-09-24 青岛海信宽带多媒体技术有限公司 Optical module
CN113721331A (en) * 2021-08-31 2021-11-30 青岛海信宽带多媒体技术有限公司 Optical module
CN114035285A (en) * 2021-11-29 2022-02-11 青岛海信宽带多媒体技术有限公司 Optical module
CN217085337U (en) * 2022-03-30 2022-07-29 青岛海信宽带多媒体技术有限公司 Optical module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117555089A (en) * 2024-01-10 2024-02-13 深圳市维度科技股份有限公司 Clamp for adapting optical fiber connector
CN117555089B (en) * 2024-01-10 2024-04-12 深圳市维度科技股份有限公司 Clamp for adapting duplex fiber connector

Similar Documents

Publication Publication Date Title
CN214174689U (en) Optical module
CN215895036U (en) Optical module
CN217085337U (en) Optical module
CN114035285B (en) Optical module
CN215813458U (en) Optical module
CN113721331B (en) Optical module
CN112838897A (en) Optical module
CN114675383A (en) Optical module
WO2023185220A1 (en) Optical module
CN215895035U (en) Optical module
CN216013740U (en) Optical module
CN214228255U (en) Optical module
CN114624829B (en) Optical module
CN112929092A (en) Optical module
CN217606136U (en) Optical module
CN115016074B (en) Optical module
CN214228256U (en) Optical module
CN114895411A (en) Optical module
CN217543461U (en) Optical module
CN220543163U (en) Optical module
WO2023184906A1 (en) Optical module
CN114624828A (en) Optical module
CN115032749B (en) Optical module
CN115016073B (en) Optical module
WO2022183800A1 (en) Optical module

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23777599

Country of ref document: EP

Kind code of ref document: A1