WO2023178725A1 - 显示面板的制备方法及显示面板 - Google Patents

显示面板的制备方法及显示面板 Download PDF

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Publication number
WO2023178725A1
WO2023178725A1 PCT/CN2022/084714 CN2022084714W WO2023178725A1 WO 2023178725 A1 WO2023178725 A1 WO 2023178725A1 CN 2022084714 W CN2022084714 W CN 2022084714W WO 2023178725 A1 WO2023178725 A1 WO 2023178725A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
metal pad
protective member
opening
conductive layer
Prior art date
Application number
PCT/CN2022/084714
Other languages
English (en)
French (fr)
Inventor
黄秀洪
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US17/925,705 priority Critical patent/US20240219782A1/en
Publication of WO2023178725A1 publication Critical patent/WO2023178725A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements

Definitions

  • the present application relates to the field of display technology, and specifically to a preparation method of a display panel and a display panel.
  • the outer pin bonding area of the display panel is usually removed, and then a side bonding process is used to realize the bonding connection between the metal pad and the chip-on-chip film.
  • a conductive film layer is usually used to realize the electrical connection between the metal pad and the chip-on-chip film.
  • conductive materials such as silver paste on the side of the display panel
  • the exposed metal pads are prone to corrosion, resulting in poor conduction between the conductive film layer and the metal pads. , thereby reducing the manufacturing yield of side-bound products.
  • This application provides a preparation method of a display panel and a display panel to solve the technical problem of poor conduction between the conductive film layer and the metal pad caused by corrosion of the metal pad in the side bonding process, and improve the side bonding process.
  • Product manufacturing yield
  • This application provides a method for preparing a display panel, which includes the following steps:
  • a display panel body having at least one metal pad located in the outer pin bonding area, the side of the at least one metal pad being exposed to the outside;
  • a chip-on-chip film is formed on a surface of the conductive layer facing away from the at least one metal pad.
  • the protective member includes an adhesive layer and a protective film, and the adhesive layer is fitted between the display panel body and the protective film.
  • the material of the protective film includes one of polyethylene terephthalate, polystyrene, polycarbonate, polyvinyl chloride and o-phthalaldehyde. or more.
  • the step of forming a protective member covering the at least one metal pad on the side of the display panel body includes: using a coating process to form an adhesive Protective piece, the material of the protective piece is strippable paint.
  • the peelable coating includes one or more of acrylic resin, polyurethane and epoxy resin.
  • an opening is formed on the protective member to expose the at least one metal pad;
  • the step of forming a conductive layer on the exposed surface of the at least one metal pad includes:
  • the conductive material is cured to form a conductive layer, and the thickness of the conductive layer is less than or equal to the thickness of the protective member.
  • the display panel body includes an array substrate and a color filter substrate arranged opposite each other, and a sealant disposed between the array substrate and the color filter substrate.
  • the sealant is located between the at least one metal pad and the color filter substrate, and the sealant, part of the array substrate, and part of the color filter substrate are exposed from the opening.
  • the opening length of the opening is one quarter to one half of the length of the protective member.
  • the conductive material is silver paste.
  • the at least one metal pad is a copper pad.
  • the preparation method further includes : Clean the exposed at least one metal pad.
  • the preparation method further includes: removing the protective member after the patterning process.
  • the step of patterning the protective member includes:
  • the protective member is patterned using a laser cutting process to form an opening exposing the at least one metal pad on the protective member.
  • the opening area of the opening is larger than the area of the exposed surface of the at least one metal pad.
  • the display panel body includes an array substrate and a color filter substrate arranged opposite each other, and a sealant disposed between the array substrate and the color filter substrate.
  • the sealant is located between the at least one metal pad and the color filter substrate;
  • the opening width of the opening is equal to the width of the at least one metal pad; in the direction from the array substrate toward the color filter substrate, the opening length of the opening is greater than The length of the at least one metal pad.
  • the step of forming a chip-on-chip film on the surface of the conductive layer facing away from the at least one metal pad includes:
  • the chip-on-chip film is bonded and bound to the surface of the anisotropic conductive adhesive layer.
  • An embodiment of the present application provides a display panel.
  • the preparation method of the display panel includes the following steps:
  • a display panel body having at least one metal pad located in the outer pin bonding area, the side of the at least one metal pad being exposed to the outside;
  • a chip-on-chip film is formed on a surface of the conductive layer facing away from the at least one metal pad.
  • a protective member covering the metal pad is formed on the side of the display panel body, wherein the formation of the protective member can protect the metal pad from external water and oxygen. Erosion, which in turn prevents corrosion of the metal pads. Therefore, after the protective member is patterned to expose the metal pad and a conductive layer is formed on the exposed surface of the metal pad, since the metal pad is not corroded, the gap between the metal pad and the conductive layer can be guaranteed Good conductivity to achieve a stable connection between the metal pad and the chip-on-chip film, thereby improving the manufacturing yield of side-bonded products.
  • FIG. 1 is a schematic flow chart of a method for manufacturing a display panel provided by this application.
  • FIG. 2 is a schematic flowchart of a method for manufacturing a display panel according to the first embodiment of the present application.
  • 3A to 3F are schematic cross-sectional structural diagrams of each step obtained in sequence in the preparation method of the display panel shown in FIG. 2 .
  • Figures 4A to 4E are schematic side structural views corresponding to Figures 3A to 3E.
  • FIG. 5 is a schematic flowchart of a method for manufacturing a display panel according to the second embodiment of the present application.
  • 6A to 6F are schematic cross-sectional structural diagrams of each step in the manufacturing method of the display panel shown in FIG. 5 .
  • Figures 7A to 7E are schematic side structural views corresponding to Figures 6A to 6E.
  • Figure 8 is a schematic cross-sectional structural diagram of a display panel provided by this application.
  • the side bonding process route of the display panel includes: the first step, after the preparation process of the display panel body is completed, the side of the display panel body is ground through a side grinding process to expose the metal pad;
  • the second step is to use a laser cutting process to clean the exposed surface of the metal pad to remove the foreign matter remaining on the exposed surface of the metal pad after grinding the side of the display panel.
  • the foreign matter may include adhesive organic matter;
  • third is to print a conductive material such as silver paste on the exposed surface of the metal pad to form a conductive film layer;
  • the fourth step is to use a laser cutting process to pattern the conductive film layer to engrave the conductive film layer into a shape consistent with the metal pad.
  • the fifth step is to bind the chip-on-chip film to the side of the display panel body and complete the electrical connection between the chip-on-chip film and the metal pad.
  • the long metal pad such as a copper pad
  • the long metal pad is susceptible to corrosion due to the intrusion of external water and oxygen when exposed for a long time. Due to the corrosion, the The metal pad cannot be cleaned through the laser cutting process, which will lead to poor conduction between the conductive film layer and the metal pad, thus greatly reducing the manufacturing yield of side-bonded products.
  • the array substrate and the color filter substrate in the display panel are usually sealed by a sealant, and the sealant is located on the side of the metal pad close to the color filter substrate.
  • the use of two laser cutting processes will intensify the damage to the frame glue and not only reduce the sealing between the array substrate and the color filter substrate , also increases the probability of misalignment between the array substrate and the color filter substrate, thereby further reducing the manufacturing yield of side-bonded products.
  • this application provides a preparation method of a display panel and a display panel. Each is explained in detail below.
  • this application provides a method for preparing a display panel, which includes the following steps:
  • a display panel body having at least one metal pad located in the outer pin bonding area, the side of the at least one metal pad being exposed on the outside;
  • a protective member covering at least one metal pad is first formed on the side of the display panel body, wherein the formation of the protective member can protect at least one metal pad.
  • the pad is not corroded by external water and oxygen, thereby preventing corrosion of at least one metal pad. Therefore, after the protective member is patterned to expose at least one metal pad, and a conductive layer is formed on the exposed surface of at least one metal pad, since at least one metal pad is not corroded, it is possible to ensure that at least one Good conductivity between the metal pad and the conductive layer to achieve a stable connection between at least one metal pad and the chip-on-chip film, thereby improving the manufacturing yield of side-bonded products.
  • the display panel in this application can be a liquid crystal display panel or an organic light-emitting diode display panel.
  • the following embodiments of this application only take the structure when the display panel is a liquid crystal display panel as an example, but are not limited thereto. .
  • the preparation method of the display panel 100 provided by the first embodiment of the present application includes the following steps:
  • a display panel body 10 which has at least one metal pad 20 located in the outer pin bonding area 10A, and the side of the at least one metal pad 20 is exposed to the outside, as shown in Figures 3A and 4A.
  • the display panel body 10 includes an array substrate 11 and a color filter substrate 12 arranged opposite each other, and a sealant 13 arranged between the array substrate 11 and the color filter substrate 12 .
  • the sealant 13 is located between at least one metal pad 20 and the color filter substrate 12 .
  • the side surface of at least one metal pad 20 can be exposed through the side grinding process.
  • At least one metal pad 20 is a copper pad.
  • the display panel body 10 in this application also includes a liquid crystal layer (not shown in the figure) disposed between the array substrate 11 and the color filter substrate 12.
  • a liquid crystal layer (not shown in the figure) disposed between the array substrate 11 and the color filter substrate 12.
  • the 202 Form a protective member 30 covering at least one metal pad 20 on the side of the display panel body 10.
  • the protective member 30 includes an adhesive layer 31 and a protective film 32.
  • the adhesive layer 31 is attached to the display panel body 10 and the protective film 32. between, as shown in Figure 3B and Figure 4B.
  • the formation of the protective member 30 can protect at least one metal pad 20 from erosion by external water and oxygen, thereby preventing at least one metal pad 20 from being corroded.
  • the existing process route needs to strictly control the interval between the side grinding process and the conductive material printing process.
  • the at least one metal pad 20 is protected by the protective member 30 without the need to control the side grinding process. and the conductive material printing process, thereby extending the storage time of the display panel main body 10 and thus reducing the requirements for the storage conditions of the display panel main body 10 .
  • the protective member 30 also covers the sealant 13 , part of the array substrate 11 and part of the color filter substrate 12 . It should be noted that the protective member 30 can also cover the entire side of the array substrate 11 and the entire side of the color filter substrate 12. This application does not specifically limit the coverage area of the protective member 30.
  • a release film (not shown in the figure) is attached to the side of the adhesive layer 31 away from the protective film 32 . After the release film is removed, the protective member 30 is attached to the side of the display panel body 10 , and the protective film 32 is bonded to the display panel body 10 through the adhesive layer 31 .
  • the protective film 32 in this embodiment is made in advance, the protective film 32 has a relatively high film thickness uniformity. Therefore, when the protective film 32 is attached to the side of the display panel body 10 , the distance between the protective film 32 and the display panel body 10 can be improved. The connection stability between the panel bodies 10 is displayed.
  • the material of the protective film 32 may include one or more of polyethylene terephthalate, polystyrene, polycarbonate, polyvinyl chloride, and o-phthalaldehyde.
  • the protective film 32 made of the above materials has good dimensional stability, so that the protective film 32 can form different patterns under laser irradiation to meet the use requirements in different application scenarios.
  • the material of the adhesive layer 31 may be pressure-sensitive adhesive or other adhesive materials with an adhesive function.
  • the material of the adhesive layer 31 is not specifically limited in this application.
  • a laser cutting process is used to pattern the protective member 30 to form an opening 301 exposing at least one metal pad 20 on the protective member 30 .
  • the opening 301 penetrates the adhesive layer 31 and the protective film 32 .
  • the sealant 13 , part of the array substrate 11 and part of the color filter substrate 12 are also exposed from the opening 301 .
  • the opening area of the opening 301 is greater than or equal to the area of the exposed surface of at least one metal pad 20 .
  • the opening width of the opening 301 is equal to the width of at least one metal pad 20 ; in the direction from the array substrate 11 toward the color filter substrate 12 , the opening length m of the opening 301 Greater than the length of at least one metal pad 20 .
  • the opening length m of the opening 301 is one quarter to one half of the length n of the protective member 30 .
  • the opening length m of the opening 301 is one-quarter, one-third, or one-half of the length n of the protective member 30 .
  • the length n of the protective member 30 is equal to the length of the protective film 32 .
  • the opening length m of the opening 301 is half of the length n of the protective member 30 .
  • this embodiment sets the opening length m of the opening 301 to protect Half of the length n of the component 30 can increase the contact area between at least one metal pad 20 and the conductive layer 40 to improve the conductivity between the two.
  • the preparation method of the display panel further includes: cleaning the exposed at least one metal pad 20 to remove the exposed surface of the at least one metal pad 20. Adhering organic matter.
  • conductive material is filled in the opening 301 .
  • the conductive material is cured to form the conductive layer 40 .
  • the thickness of the conductive layer 40 is less than or equal to the depth of the opening 301 , that is, the thickness of the conductive layer 40 is less than or equal to the thickness of the protection member 30 .
  • the conductive layer 40 is completely filled in the opening 301 , and the thickness of the conductive layer 40 is equal to the thickness of the protective member 30 .
  • the conductive material may be silver paste. Since there is a step difference between the exposed at least one metal pad 20 , the frame glue 13 , the array substrate 11 and the color filter substrate 12 and the patterned protective member 30 , the silver paste can be printed to Therefore, the silver paste can be completely filled into the opening 301 .
  • this embodiment does not require the development of new printing fixtures, thereby saving process manufacturing equipment and helping to reduce process costs.
  • this embodiment can achieve control of the film thickness and accuracy of the conductive layer 40 by forming the pattern of the conductive layer 40 in advance.
  • the patterned protective film 32 and the adhesive layer 31 are removed together to prevent the protective member 30 from affecting the connection between the conductive layer 40 and the chip-on-chip film 50 .
  • an anisotropic conductive adhesive layer 60 is formed on the side of the conductive layer 40 away from at least one metal pad 20 , and then the chip-on-chip film 50 is bonded and bound to the surface of the anisotropic conductive adhesive layer 60 to conduct electricity through the anisotropy.
  • the adhesive layer 60 is used to realize the bonding connection between the chip-on-chip film 50 and at least one metal pad 20 .
  • the protective film 32 is attached to the side of the display panel body 10 to protect at least one metal pad 20 , thereby solving the problem.
  • the problem that at least one metal pad 20 is prone to corrosion when left exposed for a long time improves the conductivity between at least one metal pad 20 and the conductive layer 40 and improves the manufacturing yield of side-bonded products.
  • the preparation method of the display panel 100 provided by the second embodiment of the present application includes the following steps:
  • a display panel body 10 which has at least one metal pad 20 located in the outer pin bonding area 10A, and the side of the at least one metal pad 20 is exposed to the outside, as shown in Figures 6A and 7A.
  • the display panel body 10 includes an array substrate 11 and a color filter substrate 12 arranged opposite each other, and a sealant 13 arranged between the array substrate 11 and the color filter substrate 12 .
  • the sealant 13 is located between at least one metal pad 20 and the color filter substrate 12 .
  • the side surface of at least one metal pad 20 can be exposed through the side grinding process.
  • At least one metal pad 20 is a copper pad.
  • the display panel body 10 in this application also includes a liquid crystal layer (not shown in the figure) disposed between the array substrate 11 and the color filter substrate 12.
  • a liquid crystal layer (not shown in the figure) disposed between the array substrate 11 and the color filter substrate 12.
  • a coating process is used to form an adhesive protective member 30.
  • the material of the protective member 30 is peelable paint, as shown in Figures 6B and 7B.
  • the formation of the protective member 30 can protect at least one metal pad 20 from erosion by external water and oxygen, thereby preventing at least one metal pad 20 from being corroded.
  • the protective member 30 has adhesiveness, a stable connection between the protective member 30 and the display panel body 10 can be ensured.
  • the existing process route needs to strictly control the interval between the side grinding process and the conductive material printing process.
  • the at least one metal pad 20 is protected by the protective member 30 without the need to control the side grinding process. and the conductive material printing process, thereby extending the storage time of the display panel main body 10 and thus reducing the requirements for the storage conditions of the display panel main body 10 .
  • the protective member 30 also covers the sealant 13 , part of the array substrate 11 and part of the color filter substrate 12 . It should be noted that the protective member 30 can also cover the entire side of the array substrate 11 and the entire side of the color filter substrate 12. This application does not specifically limit the coverage area of the protective member 30.
  • the protective member 30 is a protective coating
  • the peelable material can be applied to the exposed surface of at least one metal pad 20 through a coating process.
  • the peelable coating includes one or more of acrylic resin, polyurethane and epoxy resin.
  • the protective coating can be formed by spray coating, spin coating or blade coating process.
  • a laser cutting process is used to pattern the protective member 30 to form an opening 301 exposing at least one metal pad 20 on the protective member 30 .
  • the sealant 13 , part of the array substrate 11 and part of the color filter substrate 12 are also exposed from the opening 301 .
  • the opening area of the opening 301 is greater than or equal to the area of the exposed surface of at least one metal pad 20 .
  • the opening width of the opening 301 is equal to the width of at least one metal pad 20 ; in the direction from the array substrate 11 toward the color filter substrate 12 , the opening length m of the opening 301 Greater than the length of at least one metal pad 20 .
  • the opening length m of the opening 301 is one quarter to one half of the length n of the protective member 30 in the direction from the array substrate 11 toward the color filter substrate 12 .
  • the opening length m of the opening 301 is one-quarter, one-third, or one-half of the length n of the protective member 30 .
  • the opening length m of the opening 301 is half of the length n of the protective member 30 .
  • this embodiment sets the opening length m of the opening 301 to protect Half of the length n of the component 30 can increase the contact area between at least one metal pad 20 and the conductive layer 40 to improve the conductivity between the two.
  • the preparation method of the display panel further includes: cleaning the exposed at least one metal pad 20 to remove the exposed surface of the at least one metal pad 20. Adhering organic matter.
  • conductive material is filled in the opening 301 .
  • the conductive material is cured to form the conductive layer 40 .
  • the thickness of the conductive layer 40 is less than or equal to the depth of the opening 301 , that is, the thickness of the conductive layer 40 is less than or equal to the thickness of the protection member 30 .
  • the conductive layer 40 is completely filled in the opening 301 , and the thickness of the conductive layer 40 is equal to the thickness of the protective member 30 .
  • the conductive material may be silver paste. Since there is a step difference between the exposed at least one metal pad 20 , the frame glue 13 , the array substrate 11 and the color filter substrate 12 and the patterned protective member 30 , the silver paste can be printed to Therefore, the silver paste can be completely filled into the opening 301 .
  • this embodiment does not require the development of new printing fixtures, thereby saving process manufacturing equipment and helping to reduce process costs.
  • this embodiment can achieve control of the film thickness and accuracy of the conductive layer 40 by forming the pattern of the conductive layer 40 in advance.
  • the protective member 30 is made of peelable paint, the protective member 30 can be easily separated from the display panel body 10 , and the patterned protective member 30 can be removed by tearing it off to prevent the protective member 30 from affecting the conductive layer 40 connection with the chip-on-chip film 50 .
  • an anisotropic conductive adhesive layer 60 is formed on the side of the conductive layer 40 away from at least one metal pad 20 , and then the chip-on-chip film 50 is bonded and bound to the surface of the anisotropic conductive adhesive layer 60 to conduct electricity through the anisotropy.
  • the adhesive layer 60 is used to realize the bonding connection between the chip-on-chip film 50 and at least one metal pad 20 .
  • At least one metal pad 20 is protected by coating the protective member 30 on the side of the display panel body 10 , thereby solving the problem.
  • the problem that at least one metal pad 20 is prone to corrosion when left exposed for a long time improves the conductivity between at least one metal pad 20 and the conductive layer 40 and improves the manufacturing yield of side-bonded products.
  • the display panel 200 includes a display panel body 10 , a conductive layer 40 , a chip-on-chip film 50 and an anisotropic conductive adhesive layer 60 .
  • the display panel body 10 has at least one metal pad 20 located in the outer pin bonding area 10A.
  • the conductive layer 40 is disposed on the side of the display panel body 10 and connected to at least one metal pad 20 .
  • the anisotropic conductive adhesive layer 60 is disposed on the side of the chip-on-chip film 50 close to the conductive layer 40 .
  • the chip-on-chip film 50 is connected to the conductive layer 40 through the anisotropic conductive adhesive layer 60 to achieve a connection with at least one metal pad 20 electrical connection.
  • the display panel body 10 further includes an array substrate 11 and a color filter substrate 12 arranged opposite each other, and a sealant 13 arranged between the array substrate 11 and the color filter substrate 12 .
  • the sealant 13 is located between at least one metal pad 20 and the color filter substrate 12 .
  • the display panel 200 can be manufactured by using the manufacturing method of the display panel 100 provided in the first embodiment or the second embodiment.
  • the specific manufacturing method reference can be made to the description of the previous embodiment, which will not be described again here.
  • the display device can be any product or component with a display function such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.
  • the display device includes a display panel
  • the display panel may be the display panel 200 described in the previous embodiment.
  • the specific structure of the display panel 200 may refer to the description of the previous embodiment, and will not be described again here.

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Abstract

一种显示面板（100）的制备方法及显示面板（100），显示面板（100）的制备方法包括以下步骤：提供显示面板主体（10），显示面板主体（10）具有位于外引脚接合区（10A）并裸露在外侧的至少一个金属焊盘（20）；在显示面板主体（10）的侧面形成覆盖至少一个金属焊盘（20）的保护件（30）；对保护件（30）进行图案化处理以裸露出至少一个金属焊盘（20）；在至少一个金属焊盘（20）的裸露面形成导电层（40）；在导电层（40）背离至少一个金属焊盘（20）的表面形成覆晶薄膜（50）。

Description

显示面板的制备方法及显示面板 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板的制备方法及显示面板。
 背景技术
在显示技术领域，为了获得极致的窄边框效果，通常去除显示面板的外引脚贴合区域，然后采用侧面绑定工艺来实现金属焊盘和覆晶薄膜的绑定连接。
在现有的侧面绑定工艺路线中，通常会采用导电膜层来实现金属焊盘和覆晶薄膜的电连接。然而，在显示面板的侧面印刷导电材料如银浆之前，由于金属焊盘处于裸露状态，因此，裸露出的金属焊盘易发生腐蚀，导致导电膜层和金属焊盘之间出现导通不良现象，从而降低了侧面绑定产品的制造良率。
 技术问题
本申请提供一种显示面板的制备方法及显示面板，以解决侧面绑定工艺中因金属焊盘腐蚀而导致的导电膜层与金属焊盘之间导通不良的技术问题，提高了侧面绑定产品的制造良率。
 技术解决方案
本申请提供一种显示面板的制备方法，其包括以下步骤：
提供显示面板主体，所述显示面板主体具有位于外引脚接合区的至少一个金属焊盘，所述至少一个金属焊盘的侧面裸露在外侧；
在所述显示面板主体的侧面形成覆盖所述至少一个金属焊盘的保护件；
对所述保护件进行图案化处理，以裸露出所述至少一个金属焊盘；
在所述至少一个金属焊盘的裸露面形成导电层；
在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜。
可选的，在本申请的一些实施例中，所述保护件包括粘结层和保护膜，所述粘结层贴合于所述显示面板主体和所述保护膜之间。
可选的，在本申请的一些实施例中，所述保护膜的材料包括聚对苯二甲酸乙二醇酯、聚苯乙烯、聚碳酸酯、聚氯乙烯以及邻苯二甲醛中的一种或多种。
可选的，在本申请的一些实施例中，所述在所述显示面板主体的侧面形成覆盖所述至少一个金属焊盘的保护件的步骤，包括：采用涂覆工艺形成具有粘附性的保护件，所述保护件的材料为可剥离涂料。
可选的，在本申请的一些实施例中，所述可剥离涂料包括丙烯酸树脂、聚氨酯以及环氧树脂中的一种或多种。
可选的，在本申请的一些实施例中，所述对所述保护件进行图案化处理的步骤之后，所述保护件上形成有裸露出所述至少一个金属焊盘的开口；所述在所述至少一个金属焊盘的裸露面形成导电层的步骤，包括：
将导电材料填充于所述开口；
对所述导电材料进行固化，以形成导电层，所述导电层的厚度小于或等于所述保护件的厚度。
可选的，在本申请的一些实施例中，所述显示面板主体包括相对设置的阵列基板和彩膜基板，以及设置在所述阵列基板和所述彩膜基板之间的框胶，所述框胶位于所述至少一个金属焊盘和所述彩膜基板之间，所述框胶、所述阵列基板的部分以及所述彩膜基板的部分从所述开口中裸露出来。
可选的，在本申请的一些实施例中，自所述阵列基板朝向所述彩膜基板的方向，所述开口的开口长度为所述保护件的长度的四分之一至二分之一。
可选的，在本申请的一些实施例中，所述导电材料为银浆。
可选的，在本申请的一些实施例中，所述至少一个金属焊盘为铜焊盘。
可选的，在本申请的一些实施例中，所述对所述保护件进行图案化处理的步骤之后，在所述至少一个金属焊盘的裸露面形成导电层之前，所述制备方法还包括：对裸露出的所述至少一个金属焊盘进行清洗。
可选的，在本申请的一些实施例中，所述在所述至少一个金属焊盘的裸露面形成导电层的步骤之后，在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜之前，所述制备方法还包括：移除所述图案化处理后的所述保护件。
可选的，在本申请的一些实施例中，所述对所述保护件进行图案化处理的步骤，包括：
采用激光切割工艺对所述保护件进行图案化处理，以在所述保护件上形成裸露出所述至少一个金属焊盘的开口。
可选的，在本申请的一些实施例中，所述开口的开口面积大于所述至少一个金属焊盘的裸露面的面积。
可选的，在本申请的一些实施例中，所述显示面板主体包括相对设置的阵列基板和彩膜基板，以及设置在所述阵列基板和所述彩膜基板之间的框胶，所述框胶位于所述至少一个金属焊盘和所述彩膜基板之间；
在平行于所述阵列基板所在平面的方向，所述开口的开口宽度等于所述至少一个金属焊盘的宽度；自所述阵列基板朝向所述彩膜基板的方向，所述开口的开口长度大于所述至少一个金属焊盘的长度。
可选的，在本申请的一些实施例中，在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜的步骤，包括：
在所述导电层背离所述至少一个金属焊盘的侧面形成异方性导电胶层；
将覆晶薄膜粘结并绑定至所述异方性导电胶层的表面。
本申请实施例提供一种显示面板，所述的显示面板的制备方法包括以下步骤：
提供显示面板主体，所述显示面板主体具有位于外引脚接合区的至少一个金属焊盘，所述至少一个金属焊盘的侧面裸露在外侧；
在所述显示面板主体的侧面形成覆盖所述至少一个金属焊盘的保护件；
对所述保护件进行图案化处理，以裸露出所述至少一个金属焊盘；
在所述至少一个金属焊盘的裸露面形成导电层；
在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜。
 有益效果
在本申请的显示面板的制备方法中，在形成导电层之前，首先在显示面板主体的侧面形成覆盖金属焊盘的保护件，其中，保护件的形成能够保护金属焊盘不受外界水氧的侵蚀，进而可以避免金属焊盘发生腐蚀。因此，在对保护件进行图案化处理来使金属焊盘裸露出来，并在金属焊盘的裸露面形成导电层之后，由于金属焊盘没有被腐蚀，因而可以保证金属焊盘与导电层之间的良好导通性，以实现金属焊盘和覆晶薄膜之间的稳定连接，从而能够提高侧面绑定产品的制造良率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请提供的显示面板的制备方法的流程示意图。
图2是本申请第一实施例提供的显示面板的制备方法的流程示意图。
图3A至图3F是图2所示的显示面板的制备方法中各步骤依次得到的截面结构示意图。
图4A至图4E依次为图3A至图3E对应的侧面结构示意图。
图5是本申请第二实施例提供的显示面板的制备方法的流程示意图。
图6A至图6F是图5所示的显示面板的制备方法中各步骤依次得到的截面结构示意图。
图7A至图7E依次为图6A至图6E对应的侧面结构示意图。
图8是本申请提供的显示面板的截面结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
在现有技术中，显示面板的侧面绑定工艺路线包括：第一步、在显示面板主体的制备工艺完成后，通过侧面研磨工艺对显示面板主体的侧面进行研磨，以裸露出金属焊盘；第二步、采用激光切割工艺对金属焊盘的裸露面进行清洗，以除去显示面板侧面研磨后在金属焊盘的裸露面残留的异物，其中，异物可以包括具有粘附性的有机物；第三步、在金属焊盘的裸露面印刷导电材料如银浆，以形成导电膜层；第四步、采用激光切割工艺对导电膜层进行图案化处理，以将导电膜层雕刻成与金属焊盘一一对应的导电部；第五步、在显示面板主体的侧面绑定覆晶薄膜，并完成覆晶薄膜与金属焊盘的电性连接。
然而，在上述工艺路线中，在金属焊盘的裸露面印刷导电材料之前，金属焊盘长如铜焊盘在长时间的裸露状态下易受外界水氧的入侵而发生腐蚀，由于腐蚀后的金属焊盘无法通过激光切割工艺清洗干净，进而会导致导电膜层与金属焊盘之间出现导通不良现象，由此大大降低了侧面绑定产品的制造良率。
进一步的，显示面板中的阵列基板和彩膜基板之间通常通过框胶密封，且框胶位于金属焊盘靠近彩膜基板的一侧。在上述工艺路线中，由于第二步和第四步均需要使用激光切割工艺，两次激光切割工艺的使用会加剧对框胶的损伤，不仅降低了阵列基板和彩膜基板之间的密封性，还增加了阵列基板和彩膜基板之间的错位几率，从而进一步降低了侧面绑定产品的制造良率。
基于现有显示面板的侧面绑定工艺路线中存在的技术问题，本申请提供一种显示面板的制备方法及显示面板。以下分别进行详细说明。
请参照图1，本申请提供一种显示面板的制备方法，其包括以下步骤：
101：提供显示面板主体，所述显示面板主体具有位于外引脚接合区的至少一个金属焊盘，所述至少一个金属焊盘的侧面裸露在外侧；
102：在所述显示面板主体的侧面形成覆盖所述至少一个金属焊盘的保护件；
103：对所述保护件进行图案化处理，以裸露出所述至少一个金属焊盘；
104：在所述至少一个金属焊盘的裸露面形成导电层；以及
105：在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜。
由此，在本申请的显示面板的制备方法中，在形成导电层之前，首先在显示面板主体的侧面形成覆盖至少一个金属焊盘的保护件，其中，保护件的形成能够保护至少一个金属焊盘不受外界水氧的侵蚀，进而可以避免至少一个金属焊盘发生腐蚀。因此，在对保护件进行图案化处理来使至少一个金属焊盘裸露出来，并在至少一个金属焊盘的裸露面形成导电层之后，由于至少一个金属焊盘没有被腐蚀，因而可以保证至少一个金属焊盘与导电层之间的良好导通性，以实现至少一个金属焊盘和覆晶薄膜之间的稳定连接，从而能够提高侧面绑定产品的制造良率。
下面通过具体实施例对本申请提供的显示面板的制备方法进行详细的阐述。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
需要说明的是，本申请中的显示面板可以为液晶显示面板或有机发光二极管显示面板，本申请以下各实施例仅以显示面板为液晶显示面板时的结构为例进行说明，但并不限于此。
请一并参照图2、图3A至图3F以及图4A至图4E，本申请第一实施例提供的显示面板100的制备方法包括以下步骤：
201：提供显示面板主体10，显示面板主体10具有位于外引脚接合区10A的至少一个金属焊盘20，至少一个金属焊盘20的侧面裸露在外侧，如图3A和图4A所示。
具体的，显示面板主体10包括相对设置的阵列基板11和彩膜基板12，以及设置在阵列基板11和彩膜基板12之间的框胶13。框胶13位于至少一个金属焊盘20和彩膜基板12之间。其中，通过侧面研磨工艺可以使至少一个金属焊盘20的侧面裸露出来。
在本实施例中，至少一个金属焊盘20为铜焊盘。
需要说明的是，本申请中的显示面板主体10还包括设置在阵列基板11和彩膜基板12之间的液晶层（图中未示出），相关技术均为现有技术，在此不再赘述。
202：在显示面板主体10的侧面形成覆盖至少一个金属焊盘20的保护件30，保护件30包括粘结层31和保护膜32，粘结层31贴合于显示面板主体10和保护膜32之间，如图3B和图4B所示。
其中，保护件30的形成能够保护至少一个金属焊盘20不受外界水氧的侵蚀，进而可以避免至少一个金属焊盘20发生腐蚀。
在现有显示面板的工艺路线中，在侧面研磨工艺之后，由于金属焊盘处于裸露状态，在长时间放置下易出现金属焊盘的腐蚀问题，并且直至印刷导电材料后，金属焊盘的裸露面才有导电膜层覆盖，因此，现有工艺路线中需要严格卡控侧面研磨工艺和导电材料印刷工艺的间隔时间。然而，在本实施例中，在侧面研磨工艺之后，由于至少一个金属焊盘20的侧面覆盖有保护件30，至少一个金属焊盘20处于保护件30的保护下而不需要卡控侧面研磨工艺和导电材料印刷工艺的间隔时间，从而可以延长显示面板主体10的保存时间，进而降低了对显示面板主体10的保存条件的要求。
在本实施例中，保护件30还覆盖框胶13、阵列基板11的部分以及彩膜基板12的部分。需要说明的是，保护件30还可以覆盖阵列基板11的整个侧面以及彩膜基板12的整个侧面，本申请对保护件30的覆盖面积不作具体限定。
具体的，在形成保护件30之前，粘结层31远离保护膜32的一侧贴附有一离型膜（图中未示出）。在撕除离型膜之后，再将保护件30贴合至显示面板主体10的侧面，并通过粘结层31实现保护膜32与显示面板主体10的粘结。
由于本实施例中的保护膜32预先制得，故保护膜32具有较高的膜厚均一性，因此，当将保护膜32贴合至显示面板主体10的侧面时，能够提高保护膜32与显示面板主体10之间的连接稳定性。
在本实施例中，保护膜32的材料可以包括聚对苯二甲酸乙二醇酯、聚苯乙烯、聚碳酸酯、聚氯乙烯以及邻苯二甲醛中的一种或多种。使用上述材料制得的保护膜32具有良好的尺寸稳定性，使得保护膜32能够在激光照射下形成不同的图案，以满足不同应用场景下的使用需求。
需要说明的是，粘结层31的材料可以为压敏胶或其他具有粘结作用的胶材，本申请对粘结层31的材料不作具体限定。
203：对保护件30进行图案化处理，以裸露出至少一个金属焊盘20，如图3C和图4C所示。
具体的，采用激光切割工艺对保护件30进行图案化处理，以在保护件30上形成裸露出至少一个金属焊盘20的开口301。其中，开口301贯穿粘结层31和保护膜32。在本实施例中，除至少一个金属焊盘20外，框胶13、阵列基板11的部分以及彩膜基板12的部分也从开口301中裸露出来。
进一步的，开口301的开口面积大于或等于至少一个金属焊盘20的裸露面的面积。在本实施例中，在平行于阵列基板11所在平面的方向，开口301的开口宽度等于至少一个金属焊盘20的宽度；自阵列基板11朝向彩膜基板12的方向，开口301的开口长度m大于至少一个金属焊盘20的长度。其中，自阵列基板11朝向彩膜基板12的方向，开口301的开口长度m为保护件30的长度n的四分之一至二分之一。在一些具体实施方式中，开口301的开口长度m为保护件30的长度n的四分之一、三分之一或二分之一。具体的，保护件30的长度n等于保护膜32的长度。
在本实施例中，开口301的开口长度m为保护件30的长度n的二分之一。当开口301的开口宽度等于至少一个金属焊盘20的宽度时，由于开口301的开口长度m等于后续步骤中形成的导电层40的长度，本实施例通过将开口301的开口长度m设置为保护件30的长度n的二分之一，能够提高至少一个金属焊盘20与导电层40之间的接触面积，以提高两者之间的导通性。
在本实施例中，对保护件30进行图案化处理的步骤之后，显示面板的制备方法还包括：对裸露出的至少一个金属焊盘20进行清洗，以除去至少一个金属焊盘20的裸露面粘附的有机物。
204：在至少一个金属焊盘20的裸露面形成导电层40，如图3D和图4D所示。
具体的，首先，将导电材料填充于开口301。其次，对导电材料进行固化，以形成导电层40。其中，导电层40的厚度小于或等于开口301的深度，即，导电层40的厚度小于或等于保护件30的厚度。在本实施例中，导电层40完全填充于开口301，导电层40的厚度等于保护件30的厚度。
在本实施例中，导电材料可以为银浆。由于裸露出的至少一个金属焊盘20、框胶13、阵列基板11的部分以及彩膜基板12的部分与图案化后的保护件30之间存在段差，通过印刷工艺即可将银浆印刷至段差所在区域，从而可以将银浆完全填充至开口301内。
相较于传统的钢网印刷工艺和移印工艺，本实施例不需开发新的印刷治具，从而能够节省工艺制造设备，有利于降低工艺成本。另外，由于导电层40的图案与开口301的图案相同，因此，本实施例通过预先形成导电层40的图案，能够实现对导电层40的膜厚及精度的控制。
205：移除图案化处理后的保护件30，如图3E和图4E所示。
具体的，将图案化处理后的保护膜32和粘结层31一并移除，以避免保护件30影响到导电层40与覆晶薄膜50之间的连接。
206：在导电层40背离至少一个金属焊盘20的表面形成覆晶薄膜50，如图3F所示。
首先在导电层40背离至少一个金属焊盘20的侧面形成异方性导电胶层60，然后将覆晶薄膜50粘结并绑定至异方性导电胶层60的表面，通过异方性导电胶层60来实现覆晶薄膜50与至少一个金属焊盘20的绑定连接。
综上，在本申请第一实施例提供的显示面板100的制备方法中，在侧面研磨工艺之后，通过在显示面板主体10侧面贴合保护膜32来保护至少一个金属焊盘20，从而解决了至少一个金属焊盘20在长时间的裸露状态下易腐蚀的问题，进而提高了至少一个金属焊盘20与导电层40之间的导通性，提高了侧面绑定产品的制造良率。
请一并参照图5、图6A至图6F以及图7A至图7E，本申请第二实施例提供的显示面板100的制备方法包括以下步骤：
301：提供显示面板主体10，显示面板主体10具有位于外引脚接合区10A的至少一个金属焊盘20，至少一个金属焊盘20的侧面裸露在外侧，如图6A和图7A所示。
具体的，显示面板主体10包括相对设置的阵列基板11和彩膜基板12，以及设置在阵列基板11和彩膜基板12之间的框胶13。框胶13位于至少一个金属焊盘20和彩膜基板12之间。其中，通过侧面研磨工艺可以使至少一个金属焊盘20的侧面裸露出来。
在本实施例中，至少一个金属焊盘20为铜焊盘。
需要说明的是，本申请中的显示面板主体10还包括设置在阵列基板11和彩膜基板12之间的液晶层（图中未示出），相关技术均为现有技术，在此不再赘述。
302：采用涂覆工艺形成具有粘附性的保护件30，保护件30的材料为可剥离涂料，如图6B和图7B所示。
其中，保护件30的形成能够保护至少一个金属焊盘20不受外界水氧的侵蚀，进而可以避免至少一个金属焊盘20发生腐蚀。另外，由于保护件30具有粘附性，因此可以保证保护件30与显示面板主体10之间的稳定连接。
在现有显示面板的工艺路线中，在侧面研磨工艺之后，由于金属焊盘处于裸露状态，在长时间放置下易出现金属焊盘的腐蚀问题，并且直至印刷导电材料后，金属焊盘的裸露面才有导电膜层覆盖，因此，现有工艺路线中需要严格卡控侧面研磨工艺和导电材料印刷工艺的间隔时间。然而，在本实施例中，在侧面研磨工艺之后，由于至少一个金属焊盘20的侧面覆盖有保护件30，至少一个金属焊盘20处于保护件30的保护下而不需要卡控侧面研磨工艺和导电材料印刷工艺的间隔时间，从而可以延长显示面板主体10的保存时间，进而降低了对显示面板主体10的保存条件的要求。
在本实施例中，保护件30还覆盖框胶13、阵列基板11的部分以及彩膜基板12的部分。需要说明的是，保护件30还可以覆盖阵列基板11的整个侧面以及彩膜基板12的整个侧面，本申请对保护件30的覆盖面积不作具体限定。
进一步的，保护件30为保护涂层，通过涂覆工艺能够将可剥离材料涂覆至至少一个金属焊盘20的裸露面。具体的，可剥离涂料包括丙烯酸树脂、聚氨酯以及环氧树脂中的一种或多种。其中，可以通过喷涂、旋涂或者刮涂工艺形成所述保护涂层。
303：对保护件30进行图案化处理，以裸露出至少一个金属焊盘20，如图6C和图7C所示。
具体的，采用激光切割工艺对保护件30进行图案化处理，以在保护件30上形成裸露出至少一个金属焊盘20的开口301。在本实施例中，除至少一个金属焊盘20外，框胶13、阵列基板11的部分以及彩膜基板12的部分也从开口301中裸露出来。
进一步的，开口301的开口面积大于或等于至少一个金属焊盘20的裸露面的面积。在本实施例中，在平行于阵列基板11所在平面的方向，开口301的开口宽度等于至少一个金属焊盘20的宽度；自阵列基板11朝向彩膜基板12的方向，开口301的开口长度m大于至少一个金属焊盘20的长度。其中，自阵列基板11朝向彩膜基板12的方向，开口301的开口长度m为保护件30的长度n的四分之一至二分之一。在一些具体实施方式中，开口301的开口长度m为保护件30的长度n的四分之一、三分之一或二分之一。
在本实施例中，开口301的开口长度m为保护件30的长度n的二分之一。当开口301的开口宽度等于至少一个金属焊盘20的宽度时，由于开口301的开口长度m等于后续步骤中形成的导电层40的长度，本实施例通过将开口301的开口长度m设置为保护件30的长度n的二分之一，能够提高至少一个金属焊盘20与导电层40之间的接触面积，以提高两者之间的导通性。
在本实施例中，对保护件30进行图案化处理的步骤之后，显示面板的制备方法还包括：对裸露出的至少一个金属焊盘20进行清洗，以除去至少一个金属焊盘20的裸露面粘附的有机物。
304：在至少一个金属焊盘20的裸露面形成导电层40，如图6D和图7D所示。
具体的，首先，将导电材料填充于开口301。其次，对导电材料进行固化，以形成导电层40。其中，导电层40的厚度小于或等于开口301的深度，即，导电层40的厚度小于或等于保护件30的厚度。在本实施例中，导电层40完全填充于开口301，导电层40的厚度等于保护件30的厚度。
在本实施例中，导电材料可以为银浆。由于裸露出的至少一个金属焊盘20、框胶13、阵列基板11的部分以及彩膜基板12的部分与图案化后的保护件30之间存在段差，通过印刷工艺即可将银浆印刷至段差所在区域，从而可以将银浆完全填充至开口301内。
相较于传统的钢网印刷工艺和移印工艺，本实施例不需开发新的印刷治具，从而能够节省工艺制造设备，有利于降低工艺成本。另外，由于导电层40的图案与开口301的图案相同，因此，本实施例通过预先形成导电层40的图案，能够实现对导电层40的膜厚及精度的控制。
305：移除图案化处理后的保护件30，如图6E和图7E所示。
由于保护件30的材料为可剥离涂料，因此，保护件30易于与显示面板主体10脱离，通过撕除方式即可除去图案化处理后的保护件30，以避免保护件30影响到导电层40与覆晶薄膜50之间的连接。
306：在导电层40背离至少一个金属焊盘20的表面形成覆晶薄膜50，如图6F所示。
首先在导电层40背离至少一个金属焊盘20的侧面形成异方性导电胶层60，然后将覆晶薄膜50粘结并绑定至异方性导电胶层60的表面，通过异方性导电胶层60来实现覆晶薄膜50与至少一个金属焊盘20的绑定连接。
综上，在本申请第二实施例提供的显示面板100的制备方法中，在侧面研磨工艺之后，通过在显示面板主体10侧面涂覆保护件30来保护至少一个金属焊盘20，从而解决了至少一个金属焊盘20在长时间的裸露状态下易腐蚀的问题，进而提高了至少一个金属焊盘20与导电层40之间的导通性，提高了侧面绑定产品的制造良率。
请参照图8，本申请提供一种显示面板200。显示面板200包括显示面板主体10、导电层40、覆晶薄膜50以及异方性导电胶层60。其中，显示面板主体10具有位于外引脚接合区10A的至少一个金属焊盘20。导电层40设置在显示面板主体10的侧面，并与至少一个金属焊盘20连接。异方性导电胶层60设置在覆晶薄膜50靠近导电层40的一侧，覆晶薄膜50通过异方性导电胶层60与导电层40连接，以实现与至少一个金属焊盘20之间的电连接。
其中，显示面板主体10还包括相对设置的阵列基板11和彩膜基板12，以及设置在阵列基板11和彩膜基板12之间的框胶13。框胶13位于至少一个金属焊盘20和彩膜基板12之间。
需要说明的是，显示面板200可以采用如前述第一实施例或第二实施例提供的显示面板100的制备方法制备得到，具体制备方法可以参照前述实施例的描述，在此不再赘述。
本申请还提供一种显示装置。其中，所述显示装置可以为电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
具体的，所述显示装置包括显示面板，所述显示面板可以为前述实施例所述的显示面板200，显示面板200的具体结构可以参照前述实施例的描述，在此不再赘述。
以上对本申请实施例所提供的一种显示面板的制备方法及显示面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (17)

  1. 一种显示面板的制备方法，其包括以下步骤：
    提供显示面板主体，所述显示面板主体具有位于外引脚接合区的至少一个金属焊盘，所述至少一个金属焊盘的侧面裸露在外侧；
    在所述显示面板主体的侧面形成覆盖所述至少一个金属焊盘的保护件；
    对所述保护件进行图案化处理，以裸露出所述至少一个金属焊盘；
    在所述至少一个金属焊盘的裸露面形成导电层；以及
    在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜。
  2. 根据权利要求1所述的显示面板的制备方法，其中，所述保护件包括粘结层和保护膜，所述粘结层贴合于所述显示面板主体和所述保护膜之间。
  3. 根据权利要求2所述的显示面板的制备方法，其中，所述保护膜的材料包括聚对苯二甲酸乙二醇酯、聚苯乙烯、聚碳酸酯、聚氯乙烯以及邻苯二甲醛中的一种或多种。
  4. 根据权利要求1所述的显示面板的制备方法，其中，所述在所述显示面板主体的侧面形成覆盖所述至少一个金属焊盘的保护件的步骤，包括：采用涂覆工艺形成具有粘附性的保护件，所述保护件的材料为可剥离涂料。
  5. 根据权利要求4所述的显示面板的制备方法，其中，所述可剥离涂料包括丙烯酸树脂、聚氨酯以及环氧树脂中的一种或多种。
  6. 根据权利要求1所述的显示面板的制备方法，其中，所述对所述保护件进行图案化处理的步骤之后，所述保护件上形成有裸露出所述至少一个金属焊盘的开口；所述在所述至少一个金属焊盘的裸露面形成导电层的步骤，包括：
    将导电材料填充于所述开口；
    对所述导电材料进行固化，以形成导电层，所述导电层的厚度小于或等于所述保护件的厚度。
  7. 根据权利要求6所述的显示面板的制备方法，其中，所述显示面板主体包括相对设置的阵列基板和彩膜基板，以及设置在所述阵列基板和所述彩膜基板之间的框胶，所述框胶位于所述至少一个金属焊盘和所述彩膜基板之间，所述框胶、所述阵列基板的部分以及所述彩膜基板的部分从所述开口中裸露出来。
  8. 根据权利要求7所述的显示面板的制备方法，其中，自所述阵列基板朝向所述彩膜基板的方向，所述开口的开口长度为所述保护件的长度的四分之一至二分之一。
  9. 根据权利要求6所述的显示面板的制备方法，其中，所述导电材料为银浆。
  10. 根据权利要求9所述的显示面板的制备方法，其中，所述至少一个金属焊盘为铜焊盘。
  11. 根据权利要求1所述的显示面板的制备方法，其中，所述对所述保护件进行图案化处理的步骤之后，在所述至少一个金属焊盘的裸露面形成导电层之前，所述制备方法还包括：对裸露出的所述至少一个金属焊盘进行清洗。
  12. 根据权利要求1所述的显示面板的制备方法，其中，所述在所述至少一个金属焊盘的裸露面形成导电层的步骤之后，在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜之前，所述制备方法还包括：移除所述图案化处理后的所述保护件。
  13. 根据权利要求1所述的显示面板的制备方法，其中，所述对所述保护件进行图案化处理的步骤，包括：采用激光切割工艺对所述保护件进行图案化处理，以在所述保护件上形成裸露出所述至少一个金属焊盘的开口。
  14. 根据权利要求13所述的显示面板的制备方法，其中，所述开口的开口面积大于所述至少一个金属焊盘的裸露面的面积。
  15. 根据权利要求14所述的显示面板的制备方法，其中，所述显示面板主体包括相对设置的阵列基板和彩膜基板，以及设置在所述阵列基板和所述彩膜基板之间的框胶，所述框胶位于所述至少一个金属焊盘和所述彩膜基板之间；
    在平行于所述阵列基板所在平面的方向，所述开口的开口宽度等于所述至少一个金属焊盘的宽度；自所述阵列基板朝向所述彩膜基板的方向，所述开口的开口长度大于所述至少一个金属焊盘的长度。
  16. 根据权利要求1所述的显示面板的制备方法，其中，在所述导电层背离所述至少一个金属焊盘的表面形成覆晶薄膜的步骤，包括：
    在所述导电层背离所述至少一个金属焊盘的侧面形成异方性导电胶层；
    将覆晶薄膜粘结并绑定至所述异方性导电胶层的表面。
  17. 一种显示面板，其中，所述显示面板采用如权利要求1所述的显示面板的制备方法制备得到。
PCT/CN2022/084714 2022-03-21 2022-04-01 显示面板的制备方法及显示面板 WO2023178725A1 (zh)

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