WO2023176915A1 - Filter, communication device, and multilayer substrate - Google Patents

Filter, communication device, and multilayer substrate Download PDF

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Publication number
WO2023176915A1
WO2023176915A1 PCT/JP2023/010234 JP2023010234W WO2023176915A1 WO 2023176915 A1 WO2023176915 A1 WO 2023176915A1 JP 2023010234 W JP2023010234 W JP 2023010234W WO 2023176915 A1 WO2023176915 A1 WO 2023176915A1
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Prior art keywords
metal foil
filter
signal line
multilayer substrate
plan
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PCT/JP2023/010234
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French (fr)
Japanese (ja)
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幹 伊藤
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京セラ株式会社
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Publication of WO2023176915A1 publication Critical patent/WO2023176915A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Definitions

  • the present disclosure relates to filters, communication equipment, and multilayer substrates.
  • Patent Document 1 A surface acoustic wave device including a plurality of ground conductor films is disclosed in Patent Document 1.
  • a filter according to an aspect of the present disclosure includes a multilayer substrate having a first surface and a second surface located on the opposite side of the first surface, and a side of the first surface of the multilayer substrate.
  • a piezoelectric substrate mounted on a piezoelectric substrate and having a parallel resonator the multilayer substrate includes a first metal foil located closer to the first surface than the second surface;
  • the first metal foil has a signal line that is electrically connected to the parallel resonator, and in a plan view of the first surface, the first metal foil has a ground wiring that is ground-connected to the parallel resonator. They overlap, and do not substantially overlap with the signal line.
  • FIG. 2 is an equivalent circuit diagram of a filter according to the present disclosure.
  • FIG. 6 is six plan views regarding the schematic configuration of a filter according to a comparative example.
  • FIG. 6 is six plan views regarding the schematic configuration of a filter according to Embodiment 1 of the present disclosure.
  • 6A and 6B are six plan views regarding the schematic configuration of a filter according to a modification of Embodiment 1 of the present disclosure.
  • FIG. 6A and 6B are six plan views regarding the schematic configuration of a filter according to Embodiment 2 of the present disclosure.
  • FIG. FIG. 6 is six plan views regarding the schematic configuration of a filter according to a first modified example of Embodiment 2 of the present disclosure.
  • FIG. 7 is six plan views regarding the schematic configuration of a filter according to a second modified example of Embodiment 2 of the present disclosure.
  • FIG. 6 is six plan views regarding the schematic configuration of a filter according to a third modified example of Embodiment 2 of the present disclosure.
  • 6A and 6B are various graphs comparing the characteristics of the filter shown in FIG. 2 and the characteristics of the filter shown in FIG. 5.
  • FIG. 3 is a plan view showing a schematic configuration of another filter according to Embodiment 2 of the present disclosure.
  • 11 is various graphs comparing the characteristics of the filter shown in FIG. 5 and the characteristics of the filter shown in FIG. 10.
  • FIG. 3 is a block diagram showing a schematic configuration of a communication device according to Embodiment 3 of the present disclosure.
  • filter characteristics can be improved.
  • FIG. 1 is an equivalent circuit diagram of a filter 100 according to the present disclosure.
  • Filter 100 includes series resonators 1 to 4, parallel resonators 5 to 7, and wiring lines 8 and 9.
  • the filter 100 has a configuration in which series resonators 1 to 4 and parallel resonators 5 to 7 are connected in a ladder shape.
  • the wiring 8 is electrically connected to the series resonators 1 to 4 and the parallel resonators 5 to 7.
  • the wiring 8 is a general term for wiring that constitutes a signal path from the input terminal IN of the filter 100 to the output terminal OUT of the filter 100.
  • the wiring 9 is a general term for wiring that is grounded to a corresponding one of the parallel resonators 5 to 7.
  • FIG. 2 is six plan views regarding the schematic configuration of the filter 101 according to the comparative example.
  • Filter 101 is one specific configuration of filter 100.
  • the filter 101 includes a multilayer substrate 10 and a piezoelectric substrate 11.
  • the six plan views show the following (1) to (6), respectively. In these six plan views, parts other than the top surface are shown through as necessary.
  • the upper wirings 8 and 9 are provided across the multilayer substrate 10 and the piezoelectric substrate 11, respectively.
  • the wiring 8 is hatched with a solid line, and the wiring 9 is shaded, so that the wiring 8 and the wiring 9 can be distinguished from each other.
  • a portion provided on the multilayer substrate 10 is referred to as a signal line 12, and a portion provided on the piezoelectric substrate 11 is referred to as a wiring 13.
  • a portion provided on the multilayer substrate 10 is referred to as a ground wiring 14, and a portion provided on the piezoelectric substrate 11 is referred to as a wiring 15.
  • the multilayer substrate 10 has a first layer 10a, a second layer 10b, a third layer 10c, and a fourth layer 10d.
  • the first layer 10a, the second layer 10b, the third layer 10c, and the fourth layer 10d are laminated in this order.
  • the surface of the fourth layer 10d opposite to the third layer 10c is the first surface 10e
  • the surface of the first layer 10a opposite to the second layer 10b is the second surface 10f.
  • the second surface 10f is the surface on the back side of the surface shown in the upper surface of the first layer 10a (6).
  • the second surface 10f is located on the opposite side of the first surface 10e.
  • the multilayer substrate 10 has a signal line 12 and a ground wiring 14.
  • the piezoelectric substrate 11 is provided on the multilayer substrate 10, and its lower surface is mounted on the first surface 10e of the fourth layer 10d.
  • the piezoelectric substrate 11 is mounted on the first surface 10e of the multilayer substrate 10.
  • the piezoelectric substrate 11 has series resonators 1 to 4, parallel resonators 5 to 7, and wiring lines 13 and 15.
  • the signal line 12 and the wiring 13 are electrically connected to form the wiring 8.
  • a ground wiring 14 and a wiring 15 are electrically connected to form a wiring 9.
  • the signal line 12 is electrically connected to the parallel resonators 5 to 7.
  • the ground wiring 14 is grounded to the parallel resonators 5 to 7.
  • the multilayer substrate 10 has a metal foil 16 on the first surface 10e.
  • the metal foil 16 In a plan view of the first surface 10e, the metal foil 16 sufficiently overlaps both the signal line 12 and the ground wiring 14.
  • the planar view of the first surface 10e is the same viewpoint as the top surface of the fourth layer 10d (3).
  • the multilayer substrate 10 has electrodes 17 to 19 on the second surface 10f. Since the electrodes 17 to 19 are provided on the second surface 10f, they are provided on the back side of the surface shown in (6) the top surface of the first layer 10a, but for convenience of illustration, In FIG. 2, the electrodes 17 to 19 are shown transparently. An example of the material for each of the electrodes 17 to 19 is copper. The number of electrodes itself is not limited to three, and may be one or two, or four or more.
  • FIG. 3 is six plan views regarding the schematic configuration of the filter 102 according to Embodiment 1 of the present disclosure.
  • FIG. 4 is six plan views regarding the schematic configuration of the filter 103 according to a modification of Embodiment 1 of the present disclosure.
  • Each of filters 102 and 103 is one specific configuration of filter 100.
  • Each of these two sets of six plan views shows the above-mentioned (1) to (6), respectively. In each of these two sets of six plan views, parts other than the top surface are shown transparently as necessary.
  • the configuration of the filter 102 differs from the configuration of the filter 101 in the points described below, and is the same in other respects.
  • the multilayer substrate 10 does not have the metal foil 16.
  • the multilayer substrate 10 has a first metal foil 20.
  • the first metal foil 20 is located on the first surface 10e.
  • the position of the first metal foil 20 is not limited to the first surface 10e, and may be located on a surface other than the first surface 10e of the multilayer substrate 10 as long as it is located closer to the first surface 10e than the second surface 10f. It's okay.
  • An example of the material of the first metal foil 20 is tungsten.
  • various metals such as copper or silver may be used as appropriate instead of tungsten.
  • the first metal foil 20 overlaps with the wiring 9 that is ground-connected to the parallel resonators 5 to 7, and particularly overlaps with the ground wiring 14.
  • the first metal foil 20 does not substantially overlap the signal line 12.
  • a portion of the first metal foil 20 may protrude toward the signal line 12 and may slightly overlap the signal line 12 .
  • the configuration that does not substantially overlap the signal line 12 may be a configuration that satisfies at least one of the following (A) to (C).
  • the first metal foil 20 does not need to overlap the signal line 12 at all in the plan view of the first surface 10e.
  • the signal line 12 is provided in the second layer 10b and the third layer 10c. In this way, the signal line 12 may be provided in the inner layer of the multilayer substrate 10.
  • the first metal foil 20 may be connected to ground.
  • the shape of the first metal foil 20 is not limited to the rectangle shown in FIG. 2, and various shapes such as various polygons other than rectangles and round shapes may be applied.
  • the filter 103 in a plan view of the first surface 10e, the area of the first metal foil 20 is made larger than that of the filter 102, and the shape of the first metal foil 20 is such that the first metal foil 20 and the signal line 12 overlap. The position is avoided.
  • the configuration of filter 103 is the same as that of filter 102 in other respects.
  • the loss of the signal within the passband is small and the amount of attenuation of the signal outside the passband is large, that is, the filter characteristics can be improved.
  • FIG. 5 is six plan views regarding the schematic configuration of the filter 104 according to Embodiment 2 of the present disclosure.
  • FIG. 6 is six plan views regarding the schematic configuration of the filter 105 according to the first modified example of the second embodiment of the present disclosure.
  • FIG. 7 is six plan views regarding the schematic configuration of the filter 106 according to the second modified example of the second embodiment of the present disclosure.
  • FIG. 8 is six plan views regarding the schematic configuration of the filter 107 according to the third modified example of the second embodiment of the present disclosure.
  • Each of filters 104 to 107 is one specific configuration of filter 100.
  • Each of these four sets of six plan views shows the above-mentioned (1) to (6), respectively. In each of these four sets of six plan views, parts other than the top surface are shown through as necessary.
  • the configuration of the filter 104 differs from the configuration of the filter 102 in the points described below, and is the same in other respects.
  • the multilayer substrate 10 includes a second metal foil 21 in addition to the first metal foil 20.
  • the second metal foil 21 is located on the first surface 10e.
  • the position of the second metal foil 21 is not limited to the first surface 10e, and may be located on a surface other than the first surface 10e of the multilayer substrate 10 as long as it is located closer to the first surface 10e than the second surface 10f. It's okay.
  • An example of the material of the second metal foil 21 is tungsten.
  • various metals such as copper or silver may be used as appropriate instead of tungsten.
  • the first metal foil 20 and the second metal foil 21 are not electrically connected to each other.
  • the second metal foil 21 overlaps the signal line 12.
  • the area where the second metal foil 21 and the signal line 12 overlap is larger than the area where the first metal foil 20 and the signal line 12 overlap.
  • the second metal foil 21 does not overlap the ground wiring 14.
  • the configuration that does not overlap with the ground wiring 14 may be a configuration that satisfies (D) or (E) below.
  • FIG. 9 shows various graphs comparing the characteristics of the filter 101 and the characteristics of the filter 104.
  • the horizontal axis indicates frequency in MHz.
  • the vertical axis indicates the pass characteristic or the voltage standing wave ratio in dB.
  • the passband of filter 101 and the passband of filter 104 are each in a range of, for example, 4800 MHz or more and 4900 MHz or less.
  • the filter 104 has a smaller signal loss within the passband than the filter 101. According to FIG. 9, it can be seen that the filter 104 has a larger amount of attenuation of signals outside the passband, such as frequencies higher than the passband, than the filter 101.
  • filter 105 in a plan view of the first surface 10e, a portion 22 of the first metal foil 20 facing the second metal foil 21, and a portion 23 of the second metal foil 21 facing the first metal foil 20, It's curved.
  • the configuration of filter 105 is the same as that of filter 104 in other respects.
  • the second metal foil 21 does not substantially overlap the signal line 12 in a plan view of the first surface 10e.
  • the configuration of filter 106 is otherwise the same as that of filter 104.
  • the configuration of the filter 107 differs from the configuration of the filter 104 in the following points, and is the same in other respects.
  • the multilayer substrate 10 has a first metal foil 20 and a second metal foil 21.
  • the second metal foil 21 may be divided.
  • the second metal foil 21 has a third metal foil 24.
  • the third metal foil 24 is located on the first surface 10e.
  • the position of the third metal foil 24 is not limited to the first surface 10e, and may be located on a surface other than the first surface 10e of the multilayer substrate 10 as long as it is located closer to the first surface 10e than the second surface 10f. It's okay.
  • An example of the material of the third metal foil 24 is tungsten.
  • various metals such as copper or silver may be used as appropriate instead of tungsten.
  • the third metal foil 24 may have the same function as the second metal foil 21.
  • the signal line 12 may be provided between the second metal foil 21 and the third metal foil 24 at a position where they overlap in plan view.
  • each filter 105 to 107 is the same as that of filter 104.
  • the second metal foil 21 may be located in a sharply curved portion of the signal line 12 in a plan view of the first surface 10e.
  • FIG. 10 is a plan view showing a schematic configuration of a filter 108 according to Embodiment 2 of the present disclosure.
  • FIG. 10 shows the entire top surface of the filter 108 in a manner similar to (1) the top surface of the entire filter.
  • the filter 108 is a modification of the filter 104 such that the second metal foil 21 is located at the sharply curved portion 25 of the signal line 12.
  • FIG. 11 shows various graphs comparing the characteristics of the filter 104 and the characteristics of the filter 108.
  • the horizontal axis indicates frequency in MHz.
  • the vertical axis shows the pass characteristics or the voltage standing wave ratio in units of dB. According to FIG. 11, it can be seen that the filter 108 has improved local signal level drop within the passband compared to the filter 104. In other words, according to FIG. 11, it can be seen that filter 108 has improved band depression compared to filter 104.
  • Each of the filters 102 to 108 may have the following configuration.
  • At least one of the first metal foil 20 and the second metal foil 21 may be configured not to be used for connecting the multilayer substrate 10 and the piezoelectric substrate 11.
  • the total area of the first metal foil 20 and the area of the second metal foil 21 may be 30% or more of the total area of the electrodes 17 to 19, and may be 44% or more. There may be.
  • FIG. 12 is a block diagram showing a schematic configuration of a communication device 200 according to Embodiment 3 of the present disclosure.
  • Communication device 200 includes a filter 109.
  • Filter 109 is one of filters 102-108.
  • Communication equipment 200 including filter 109 is also included in the scope of the present disclosure.
  • the communication device 200 may perform wireless communication using radio waves.
  • the filter 109 may be used as a filter for a duplexer, for example.
  • the multilayer substrate 10 itself is also included in the scope of the present disclosure.
  • the multilayer substrate 10 includes a first surface 10e, a second surface 10f located on the opposite side of the first surface 10e, and a first metal surface located on a side closer to the first surface 10e than the second surface 10f.
  • the first metal foil 20 includes a foil 20 and a signal line 12 that can be electrically connected to the parallel resonators 5 to 7. In a plan view of the first surface 10e, the first metal foil 20 connects the parallel resonators 5 to 7 and the ground. It overlaps with the connectable ground wiring 14 and does not substantially overlap with the signal line 12.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

The present invention improves a filter characteristic. In a planar view of a first surface, a first metal foil substantially does not overlap with a signal line, and overlaps with a ground wiring that is ground-connected with a parallel resonator.

Description

フィルタ、通信機器、および多層基板Filters, communications equipment, and multilayer boards
　本開示は、フィルタ、通信機器、および多層基板に関する。 The present disclosure relates to filters, communication equipment, and multilayer substrates.
　複数のグランド導体膜を備えている弾性表面波装置が、特許文献１に開示されている。 A surface acoustic wave device including a plurality of ground conductor films is disclosed in Patent Document 1.
日本国公開特許公報「特開２００２－１１１４４１号公報」Japanese Patent Publication “Unexamined Japanese Patent Publication No. 2002-111441”
　本開示の一態様に係るフィルタは、第１面、および、前記第１面の反対側に位置している第２面を有している多層基板と、前記多層基板の前記第１面の側に搭載されており、並列共振子を有している圧電基板とを備えており、前記多層基板は、前記第２面より前記第１面に近い側に位置している第１金属箔と、前記並列共振子と電気的に接続されている信号線とを有しており、前記第１面の平面視において、前記第１金属箔は、前記並列共振子とグランド接続されているグランド配線と重なっており、前記信号線とほぼ重なっていない。 A filter according to an aspect of the present disclosure includes a multilayer substrate having a first surface and a second surface located on the opposite side of the first surface, and a side of the first surface of the multilayer substrate. a piezoelectric substrate mounted on a piezoelectric substrate and having a parallel resonator, the multilayer substrate includes a first metal foil located closer to the first surface than the second surface; The first metal foil has a signal line that is electrically connected to the parallel resonator, and in a plan view of the first surface, the first metal foil has a ground wiring that is ground-connected to the parallel resonator. They overlap, and do not substantially overlap with the signal line.
本開示に係るフィルタの等価回路図である。FIG. 2 is an equivalent circuit diagram of a filter according to the present disclosure. 比較例に係るフィルタの概略構成に関する、６つの平面図である。FIG. 6 is six plan views regarding the schematic configuration of a filter according to a comparative example. 本開示の実施形態１に係るフィルタの概略構成に関する、６つの平面図である。FIG. 6 is six plan views regarding the schematic configuration of a filter according to Embodiment 1 of the present disclosure. 本開示の実施形態１の変形例に係るフィルタの概略構成に関する、６つの平面図である。6A and 6B are six plan views regarding the schematic configuration of a filter according to a modification of Embodiment 1 of the present disclosure. FIG. 本開示の実施形態２に係るフィルタの概略構成に関する、６つの平面図である。6A and 6B are six plan views regarding the schematic configuration of a filter according to Embodiment 2 of the present disclosure. FIG. 本開示の実施形態２の第１変形例に係るフィルタの概略構成に関する、６つの平面図である。FIG. 6 is six plan views regarding the schematic configuration of a filter according to a first modified example of Embodiment 2 of the present disclosure. 本開示の実施形態２の第２変形例に係るフィルタの概略構成に関する、６つの平面図である。FIG. 7 is six plan views regarding the schematic configuration of a filter according to a second modified example of Embodiment 2 of the present disclosure. 本開示の実施形態２の第３変形例に係るフィルタの概略構成に関する、６つの平面図である。FIG. 6 is six plan views regarding the schematic configuration of a filter according to a third modified example of Embodiment 2 of the present disclosure. 図２に示したフィルタの特性と図５に示したフィルタの特性とを対比した各種グラフである。6A and 6B are various graphs comparing the characteristics of the filter shown in FIG. 2 and the characteristics of the filter shown in FIG. 5. 本開示の実施形態２に係る別のフィルタの概略構成を示す平面図である。FIG. 3 is a plan view showing a schematic configuration of another filter according to Embodiment 2 of the present disclosure. 図５に示したフィルタの特性と図１０に示したフィルタの特性とを対比した各種グラフである。11 is various graphs comparing the characteristics of the filter shown in FIG. 5 and the characteristics of the filter shown in FIG. 10. 本開示の実施形態３に係る通信機器の概略構成を示すブロック図である。FIG. 3 is a block diagram showing a schematic configuration of a communication device according to Embodiment 3 of the present disclosure.
　特許文献１に開示されている弾性表面波装置においては、通過帯域内における信号の損失が大きく、通過帯域外における信号の減衰量が小さい。従って、特許文献１に開示されている弾性表面波装置のフィルタ特性は良好でない。 In the surface acoustic wave device disclosed in Patent Document 1, the signal loss within the passband is large, and the amount of signal attenuation outside the passband is small. Therefore, the filter characteristics of the surface acoustic wave device disclosed in Patent Document 1 are not good.
　本開示の一態様によれば、フィルタ特性を改善できる。 According to one aspect of the present disclosure, filter characteristics can be improved.
　本開示を実施するための形態について説明する。説明の便宜上、先に説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない場合がある。 A mode for implementing the present disclosure will be described. For convenience of explanation, members having the same functions as previously described members are given the same reference numerals, and the description thereof may not be repeated.
　図１は、本開示に係るフィルタ１００の等価回路図である。フィルタ１００は、直列共振子１～４、並列共振子５～７、ならびに配線８および９を備えている。フィルタ１００は、直列共振子１～４および並列共振子５～７がラダー状に接続された構成である。配線８は、直列共振子１～４および並列共振子５～７と電気的に接続されている。配線８は、フィルタ１００の入力端子ＩＮからフィルタ１００の出力端子ＯＵＴまでの信号経路を構成する配線の総称である。配線９は、並列共振子５～７のうち対応するものとグランド接続されている配線の総称である。 FIG. 1 is an equivalent circuit diagram of a filter 100 according to the present disclosure. Filter 100 includes series resonators 1 to 4, parallel resonators 5 to 7, and wiring lines 8 and 9. The filter 100 has a configuration in which series resonators 1 to 4 and parallel resonators 5 to 7 are connected in a ladder shape. The wiring 8 is electrically connected to the series resonators 1 to 4 and the parallel resonators 5 to 7. The wiring 8 is a general term for wiring that constitutes a signal path from the input terminal IN of the filter 100 to the output terminal OUT of the filter 100. The wiring 9 is a general term for wiring that is grounded to a corresponding one of the parallel resonators 5 to 7.
　〔比較例〕
　図２は、比較例に係るフィルタ１０１の概略構成に関する、６つの平面図である。フィルタ１０１は、フィルタ１００の具体的な構成の１つである。フィルタ１０１は、多層基板１０および圧電基板１１を備えている。当該６つの平面図は、それぞれ下記（１）～（６）を示している。当該６つの平面図においては、必要に応じて、適宜上面以外を透視して示している。 [Comparative example]
FIG. 2 is six plan views regarding the schematic configuration of the filter 101 according to the comparative example. Filter 101 is one specific configuration of filter 100. The filter 101 includes a multilayer substrate 10 and a piezoelectric substrate 11. The six plan views show the following (1) to (6), respectively. In these six plan views, parts other than the top surface are shown through as necessary.
　（１）フィルタ全体の上面
　（２）圧電基板１１の上面
　（３）第４層１０ｄの上面
　（４）第３層１０ｃの上面
　（５）第２層１０ｂの上面
　（６）第１層１０ａの上面
　配線８および９それぞれは、多層基板１０および圧電基板１１に亘って設けられている。図２においては、配線８に対して実線のハッチングを付しており、配線９に対して網掛けを付しており、これらによって、配線８と配線９との区別を図っている。配線８のうち、多層基板１０に設けられた部分を信号線１２と称し、圧電基板１１に設けられた部分を配線１３と称する。配線９のうち、多層基板１０に設けられた部分をグランド配線１４と称し、圧電基板１１に設けられた部分を配線１５と称する。 (1) Top surface of the entire filter (2) Top surface of the piezoelectric substrate 11 (3) Top surface of the fourth layer 10d (4) Top surface of the third layer 10c (5) Top surface of the second layer 10b (6) Top surface of the first layer 10a The upper wirings 8 and 9 are provided across the multilayer substrate 10 and the piezoelectric substrate 11, respectively. In FIG. 2, the wiring 8 is hatched with a solid line, and the wiring 9 is shaded, so that the wiring 8 and the wiring 9 can be distinguished from each other. Of the wiring 8, a portion provided on the multilayer substrate 10 is referred to as a signal line 12, and a portion provided on the piezoelectric substrate 11 is referred to as a wiring 13. Of the wiring 9, a portion provided on the multilayer substrate 10 is referred to as a ground wiring 14, and a portion provided on the piezoelectric substrate 11 is referred to as a wiring 15.
　多層基板１０は、第１層１０ａ、第２層１０ｂ、第３層１０ｃ、および第４層１０ｄを有している。第１層１０ａ、第２層１０ｂ、第３層１０ｃ、および第４層１０ｄは、この順に積層されている。第４層１０ｄにおける第３層１０ｃと反対側の面が第１面１０ｅであり、第１層１０ａにおける第２層１０ｂと反対側の面が第２面１０ｆである。第２面１０ｆは、前記（６）第１層１０ａの上面に示された面の裏側の面である。第２面１０ｆは、第１面１０ｅの反対側に位置している。 The multilayer substrate 10 has a first layer 10a, a second layer 10b, a third layer 10c, and a fourth layer 10d. The first layer 10a, the second layer 10b, the third layer 10c, and the fourth layer 10d are laminated in this order. The surface of the fourth layer 10d opposite to the third layer 10c is the first surface 10e, and the surface of the first layer 10a opposite to the second layer 10b is the second surface 10f. The second surface 10f is the surface on the back side of the surface shown in the upper surface of the first layer 10a (6). The second surface 10f is located on the opposite side of the first surface 10e.
　第１層１０ａ、第２層１０ｂ、第３層１０ｃ、および第４層１０ｄそれぞれの材料の一例として、電気絶縁性セラミックスおよび樹脂が挙げられる。多層基板１０は、信号線１２およびグランド配線１４を有している。 Examples of materials for each of the first layer 10a, second layer 10b, third layer 10c, and fourth layer 10d include electrically insulating ceramics and resin. The multilayer substrate 10 has a signal line 12 and a ground wiring 14.
　圧電基板１１は、多層基板１０に設けられており、その下面が第４層１０ｄの第１面１０ｅに搭載されている。圧電基板１１は、多層基板１０の第１面１０ｅの側に搭載されている。圧電基板１１は、直列共振子１～４、並列共振子５～７、ならびに配線１３および１５を有している。 The piezoelectric substrate 11 is provided on the multilayer substrate 10, and its lower surface is mounted on the first surface 10e of the fourth layer 10d. The piezoelectric substrate 11 is mounted on the first surface 10e of the multilayer substrate 10. The piezoelectric substrate 11 has series resonators 1 to 4, parallel resonators 5 to 7, and wiring lines 13 and 15.
　フィルタ１０１においては、信号線１２と配線１３とが電気的に接続されて、配線８をなしている。フィルタ１０１においては、グランド配線１４と配線１５とが電気的に接続されて、配線９をなしている。信号線１２は、並列共振子５～７と電気的に接続されている。グランド配線１４は、並列共振子５～７とグランド接続されている。 In the filter 101, the signal line 12 and the wiring 13 are electrically connected to form the wiring 8. In the filter 101, a ground wiring 14 and a wiring 15 are electrically connected to form a wiring 9. The signal line 12 is electrically connected to the parallel resonators 5 to 7. The ground wiring 14 is grounded to the parallel resonators 5 to 7.
　多層基板１０は、第１面１０ｅに金属箔１６を有している。第１面１０ｅの平面視において、金属箔１６は、信号線１２およびグランド配線１４の両方と十分に重なっている。第１面１０ｅの平面視は、前記（３）第４層１０ｄの上面と同一の視点である。 The multilayer substrate 10 has a metal foil 16 on the first surface 10e. In a plan view of the first surface 10e, the metal foil 16 sufficiently overlaps both the signal line 12 and the ground wiring 14. The planar view of the first surface 10e is the same viewpoint as the top surface of the fourth layer 10d (3).
　多層基板１０は、第２面１０ｆに電極１７～１９を有している。電極１７～１９は、第２面１０ｆに設けられているため、前記（６）第１層１０ａの上面に示された面の裏側の面に設けられていることになるが、図示の便宜上、図２においては電極１７～１９を透視して示している。電極１７～１９それぞれの材料の一例として、銅が挙げられる。電極の個数自体は、３個に限定されず、１個または２個であってもよいし、４個以上であってもよい。 The multilayer substrate 10 has electrodes 17 to 19 on the second surface 10f. Since the electrodes 17 to 19 are provided on the second surface 10f, they are provided on the back side of the surface shown in (6) the top surface of the first layer 10a, but for convenience of illustration, In FIG. 2, the electrodes 17 to 19 are shown transparently. An example of the material for each of the electrodes 17 to 19 is copper. The number of electrodes itself is not limited to three, and may be one or two, or four or more.
　〔実施形態１〕
　図３は、本開示の実施形態１に係るフィルタ１０２の概略構成に関する、６つの平面図である。図４は、本開示の実施形態１の変形例に係るフィルタ１０３の概略構成に関する、６つの平面図である。フィルタ１０２および１０３それぞれは、フィルタ１００の具体的な構成の１つである。これら２セットの６つの平面図それぞれは、それぞれ前述した（１）～（６）を示している。これら２セットの６つの平面図それぞれにおいては、必要に応じて、適宜上面以外を透視して示している。 [Embodiment 1]
FIG. 3 is six plan views regarding the schematic configuration of the filter 102 according to Embodiment 1 of the present disclosure. FIG. 4 is six plan views regarding the schematic configuration of the filter 103 according to a modification of Embodiment 1 of the present disclosure. Each of filters 102 and 103 is one specific configuration of filter 100. Each of these two sets of six plan views shows the above-mentioned (1) to (6), respectively. In each of these two sets of six plan views, parts other than the top surface are shown transparently as necessary.
　フィルタ１０２の構成は、フィルタ１０１の構成と、以下に説明する点で異なっており、その他の点で同一である。 The configuration of the filter 102 differs from the configuration of the filter 101 in the points described below, and is the same in other respects.
　フィルタ１０２において、多層基板１０は金属箔１６を有していない。フィルタ１０２において、多層基板１０は第１金属箔２０を有している。第１金属箔２０は、第１面１０ｅに位置している。第１金属箔２０の位置は、第１面１０ｅに限定されず、第２面１０ｆより第１面１０ｅに近い側に位置していれば、多層基板１０における第１面１０ｅ以外の面であってもよい。第１金属箔２０の材料の一例として、タングステンが挙げられる。第１金属箔２０の材料には、タングステンの代わりに、銅又は銀等の種々の金属が適宜用いられてもよい。 In the filter 102, the multilayer substrate 10 does not have the metal foil 16. In the filter 102, the multilayer substrate 10 has a first metal foil 20. The first metal foil 20 is located on the first surface 10e. The position of the first metal foil 20 is not limited to the first surface 10e, and may be located on a surface other than the first surface 10e of the multilayer substrate 10 as long as it is located closer to the first surface 10e than the second surface 10f. It's okay. An example of the material of the first metal foil 20 is tungsten. As the material of the first metal foil 20, various metals such as copper or silver may be used as appropriate instead of tungsten.
　第１面１０ｅの平面視において、第１金属箔２０は、並列共振子５～７とグランド接続されている配線９と重なっており、特にグランド配線１４と重なっている。 In a plan view of the first surface 10e, the first metal foil 20 overlaps with the wiring 9 that is ground-connected to the parallel resonators 5 to 7, and particularly overlaps with the ground wiring 14.
　第１面１０ｅの平面視において、第１金属箔２０は、信号線１２とほぼ重なっていない。第１金属箔２０の一部が、信号線１２の側に突出し、わずかに信号線１２と重なっていてもよい。信号線１２とほぼ重なっていない構成は、下記（Ａ）～（Ｃ）のうち少なくとも１つを満足する構成であってもよい。 In a plan view of the first surface 10e, the first metal foil 20 does not substantially overlap the signal line 12. A portion of the first metal foil 20 may protrude toward the signal line 12 and may slightly overlap the signal line 12 . The configuration that does not substantially overlap the signal line 12 may be a configuration that satisfies at least one of the following (A) to (C).
　（Ａ）信号線１２と全く重なっていない
　（Ｂ）信号線１２と僅かに重なっているが、このことがフィルタ特性の変化に対して与える影響が無視できる程度に小さい
　（Ｃ）信号線１２に属する１本の線路の面積の９０％以上と重なっていない。具体例としては、当該１本の線路の面積の９９％以上と重なっていない。 (A) Does not overlap with signal line 12 at all (B) Slightly overlaps with signal line 12, but the effect this has on changes in filter characteristics is so small that it can be ignored (C) Signal line 12 It does not overlap with more than 90% of the area of one track to which it belongs. As a specific example, it does not overlap with 99% or more of the area of the one line.
　フィルタ１０２のように、また前記（Ａ）のように、第１面１０ｅの平面視において、第１金属箔２０は、信号線１２と全く重なっていなくてもよい。フィルタ１０２において、信号線１２は、第２層１０ｂおよび第３層１０ｃに設けられている。このように、信号線１２は、多層基板１０の内層に設けられていてもよい。第１金属箔２０は、グランドに接続されていてもよい。 Like the filter 102 and like (A) above, the first metal foil 20 does not need to overlap the signal line 12 at all in the plan view of the first surface 10e. In the filter 102, the signal line 12 is provided in the second layer 10b and the third layer 10c. In this way, the signal line 12 may be provided in the inner layer of the multilayer substrate 10. The first metal foil 20 may be connected to ground.
　第１面１０ｅの平面視において、第１金属箔２０の形状は、図２に示す長方形に限定されず、長方形以外の各種多角形および丸形等、種々の形状が適用され得る。 In a plan view of the first surface 10e, the shape of the first metal foil 20 is not limited to the rectangle shown in FIG. 2, and various shapes such as various polygons other than rectangles and round shapes may be applied.
　フィルタ１０３においては、第１面１０ｅの平面視において、第１金属箔２０の面積をフィルタ１０２より大きくしつつ、第１金属箔２０の形状を、第１金属箔２０と信号線１２とが重なる位置を避ける形としている。フィルタ１０３の構成は、フィルタ１０２の構成と、その他の点で同一である。 In the filter 103, in a plan view of the first surface 10e, the area of the first metal foil 20 is made larger than that of the filter 102, and the shape of the first metal foil 20 is such that the first metal foil 20 and the signal line 12 overlap. The position is avoided. The configuration of filter 103 is the same as that of filter 102 in other respects.
　各フィルタ１０２および１０３によれば、通過帯域内における信号の損失が小さく、通過帯域外における信号の減衰量が大きい、つまり、フィルタ特性を改善できる。 According to each of the filters 102 and 103, the loss of the signal within the passband is small and the amount of attenuation of the signal outside the passband is large, that is, the filter characteristics can be improved.
　〔実施形態２〕
　図５は、本開示の実施形態２に係るフィルタ１０４の概略構成に関する、６つの平面図である。図６は、本開示の実施形態２の第１変形例に係るフィルタ１０５の概略構成に関する、６つの平面図である。図７は、本開示の実施形態２の第２変形例に係るフィルタ１０６の概略構成に関する、６つの平面図である。図８は、本開示の実施形態２の第３変形例に係るフィルタ１０７の概略構成に関する、６つの平面図である。フィルタ１０４～１０７それぞれは、フィルタ１００の具体的な構成の１つである。これら４セットの６つの平面図それぞれは、それぞれ前述した（１）～（６）を示している。これら４セットの６つの平面図それぞれにおいては、必要に応じて、適宜上面以外を透視して示している。 [Embodiment 2]
FIG. 5 is six plan views regarding the schematic configuration of the filter 104 according to Embodiment 2 of the present disclosure. FIG. 6 is six plan views regarding the schematic configuration of the filter 105 according to the first modified example of the second embodiment of the present disclosure. FIG. 7 is six plan views regarding the schematic configuration of the filter 106 according to the second modified example of the second embodiment of the present disclosure. FIG. 8 is six plan views regarding the schematic configuration of the filter 107 according to the third modified example of the second embodiment of the present disclosure. Each of filters 104 to 107 is one specific configuration of filter 100. Each of these four sets of six plan views shows the above-mentioned (1) to (6), respectively. In each of these four sets of six plan views, parts other than the top surface are shown through as necessary.
　フィルタ１０４の構成は、フィルタ１０２の構成と、以下に説明する点で異なっており、その他の点で同一である。 The configuration of the filter 104 differs from the configuration of the filter 102 in the points described below, and is the same in other respects.
　フィルタ１０４において、多層基板１０は、第１金属箔２０に加え、第２金属箔２１を有している。第２金属箔２１は、第１面１０ｅに位置している。第２金属箔２１の位置は、第１面１０ｅに限定されず、第２面１０ｆより第１面１０ｅに近い側に位置していれば、多層基板１０における第１面１０ｅ以外の面であってもよい。第２金属箔２１の材料の一例として、タングステンが挙げられる。第２金属箔２１の材料には、タングステンの代わりに、銅又は銀等の種々の金属が適宜用いられてもよい。第１金属箔２０と第２金属箔２１とが互いに電気的に接続されていない。 In the filter 104, the multilayer substrate 10 includes a second metal foil 21 in addition to the first metal foil 20. The second metal foil 21 is located on the first surface 10e. The position of the second metal foil 21 is not limited to the first surface 10e, and may be located on a surface other than the first surface 10e of the multilayer substrate 10 as long as it is located closer to the first surface 10e than the second surface 10f. It's okay. An example of the material of the second metal foil 21 is tungsten. As the material of the second metal foil 21, various metals such as copper or silver may be used as appropriate instead of tungsten. The first metal foil 20 and the second metal foil 21 are not electrically connected to each other.
　第１面１０ｅの平面視において、第２金属箔２１は、信号線１２と重なっている。第１面１０ｅの平面視において、第２金属箔２１と信号線１２とが重なっている面積は、第１金属箔２０と信号線１２とが重なっている面積より大きい。 In a plan view of the first surface 10e, the second metal foil 21 overlaps the signal line 12. In plan view of the first surface 10e, the area where the second metal foil 21 and the signal line 12 overlap is larger than the area where the first metal foil 20 and the signal line 12 overlap.
　第１面１０ｅの平面視において、第２金属箔２１は、グランド配線１４と重なっていない。グランド配線１４と重なっていない構成は、下記（Ｄ）または（Ｅ）を満足する構成であってもよい。 In a plan view of the first surface 10e, the second metal foil 21 does not overlap the ground wiring 14. The configuration that does not overlap with the ground wiring 14 may be a configuration that satisfies (D) or (E) below.
　（Ｄ）グランド配線１４と全く重なっていない
　（Ｅ）グランド配線１４と僅かに重なっているが、このことがフィルタ特性の変化に対して与える影響が無視できる程度に小さい。 (D) It does not overlap with the ground wiring 14 at all. (E) It slightly overlaps with the ground wiring 14, but the influence this has on changes in filter characteristics is so small that it can be ignored.
　図９は、フィルタ１０１の特性とフィルタ１０４の特性とを対比した各種グラフである。図９において、横軸には単位ＭＨｚで周波数を示している。図９において、縦軸には単位ｄＢで通過特性を、もしくは電圧定在波比を示している。フィルタ１０１の通過帯域およびフィルタ１０４の通過帯域それぞれは、例えば４８００ＭＨｚ以上かつ４９００ＭＨｚ以下の範囲である。 FIG. 9 shows various graphs comparing the characteristics of the filter 101 and the characteristics of the filter 104. In FIG. 9, the horizontal axis indicates frequency in MHz. In FIG. 9, the vertical axis indicates the pass characteristic or the voltage standing wave ratio in dB. The passband of filter 101 and the passband of filter 104 are each in a range of, for example, 4800 MHz or more and 4900 MHz or less.
　図９によれば、フィルタ１０４は、フィルタ１０１に対して、通過帯域内における信号の損失が小さいことが分かる。図９によれば、フィルタ１０４は、フィルタ１０１に対して、通過帯域より高い周波数等の通過帯域外における信号の減衰量が大きいことが分かる。 According to FIG. 9, it can be seen that the filter 104 has a smaller signal loss within the passband than the filter 101. According to FIG. 9, it can be seen that the filter 104 has a larger amount of attenuation of signals outside the passband, such as frequencies higher than the passband, than the filter 101.
　フィルタ１０５においては、第１面１０ｅの平面視において、第１金属箔２０における第２金属箔２１と対向する部分２２、および第２金属箔２１における第１金属箔２０と対向する部分２３が、湾曲している。フィルタ１０５の構成は、フィルタ１０４の構成と、その他の点で同一である。 In the filter 105, in a plan view of the first surface 10e, a portion 22 of the first metal foil 20 facing the second metal foil 21, and a portion 23 of the second metal foil 21 facing the first metal foil 20, It's curved. The configuration of filter 105 is the same as that of filter 104 in other respects.
　フィルタ１０６においては、第１面１０ｅの平面視において、第２金属箔２１は、信号線１２とほぼ重なっていない。フィルタ１０６の構成は、フィルタ１０４の構成と、その他の点で同一である。 In the filter 106, the second metal foil 21 does not substantially overlap the signal line 12 in a plan view of the first surface 10e. The configuration of filter 106 is otherwise the same as that of filter 104.
　フィルタ１０７の構成は、フィルタ１０４の構成と、以下に説明する点で異なっており、その他の点で同一である。 The configuration of the filter 107 differs from the configuration of the filter 104 in the following points, and is the same in other respects.
　フィルタ１０７において、多層基板１０は、第１金属箔２０および第２金属箔２１を有している。第２金属箔２１は、分割されていてもよい。例えば、第２金属箔２１は、第３金属箔２４を有している。第３金属箔２４は、第１面１０ｅに位置している。第３金属箔２４の位置は、第１面１０ｅに限定されず、第２面１０ｆより第１面１０ｅに近い側に位置していれば、多層基板１０における第１面１０ｅ以外の面であってもよい。第３金属箔２４の材料の一例として、タングステンが挙げられる。第３金属箔２４の材料には、タングステンの代わりに、銅又は銀等の種々の金属が適宜用いられてもよい。第３金属箔２４は、第２金属箔２１と同じ機能を有していてもよい。第２金属箔２１と、第３金属箔２４の間に、平面視で重なる位置に、信号線１２を設けてもよい。 In the filter 107, the multilayer substrate 10 has a first metal foil 20 and a second metal foil 21. The second metal foil 21 may be divided. For example, the second metal foil 21 has a third metal foil 24. The third metal foil 24 is located on the first surface 10e. The position of the third metal foil 24 is not limited to the first surface 10e, and may be located on a surface other than the first surface 10e of the multilayer substrate 10 as long as it is located closer to the first surface 10e than the second surface 10f. It's okay. An example of the material of the third metal foil 24 is tungsten. As the material of the third metal foil 24, various metals such as copper or silver may be used as appropriate instead of tungsten. The third metal foil 24 may have the same function as the second metal foil 21. The signal line 12 may be provided between the second metal foil 21 and the third metal foil 24 at a position where they overlap in plan view.
　各フィルタ１０５～１０７の効果は、フィルタ１０４の効果と同一である。 The effect of each filter 105 to 107 is the same as that of filter 104.
　信号線１２における急カーブを描いている部分にて、電界が強くなる傾向がある。この傾向に鑑みて、第１面１０ｅの平面視において、第２金属箔２１は、信号線１２における急カーブを描いている部分に位置していてもよい。 There is a tendency for the electric field to become stronger at parts of the signal line 12 that draw sharp curves. In view of this tendency, the second metal foil 21 may be located in a sharply curved portion of the signal line 12 in a plan view of the first surface 10e.
　図１０は、本開示の実施形態２に係るフィルタ１０８の概略構成を示す平面図である。図１０には、前記（１）フィルタ全体の上面に準じた要領で、フィルタ１０８全体の上面を示している。フィルタ１０８は、第２金属箔２１が信号線１２における急カーブを描いている部分２５に位置するように、フィルタ１０４を変形したものである。 FIG. 10 is a plan view showing a schematic configuration of a filter 108 according to Embodiment 2 of the present disclosure. FIG. 10 shows the entire top surface of the filter 108 in a manner similar to (1) the top surface of the entire filter. The filter 108 is a modification of the filter 104 such that the second metal foil 21 is located at the sharply curved portion 25 of the signal line 12.
　図１１は、フィルタ１０４の特性とフィルタ１０８の特性とを対比した各種グラフである。図１１において、横軸には単位ＭＨｚで周波数を示している。図１１において、縦軸には単位ｄＢで通過特性を、もしくは電圧定在波比を示している。図１１によれば、フィルタ１０８は、フィルタ１０４に対して、通過帯域内における局所的な信号レベルの落ち込みが改善されていることが分かる。換言すれば、図１１によれば、フィルタ１０８は、フィルタ１０４に対して、帯域のくぼみが改善されていることが分かる。 FIG. 11 shows various graphs comparing the characteristics of the filter 104 and the characteristics of the filter 108. In FIG. 11, the horizontal axis indicates frequency in MHz. In FIG. 11, the vertical axis shows the pass characteristics or the voltage standing wave ratio in units of dB. According to FIG. 11, it can be seen that the filter 108 has improved local signal level drop within the passband compared to the filter 104. In other words, according to FIG. 11, it can be seen that filter 108 has improved band depression compared to filter 104.
　〔その他フィルタに関する付記事項〕
　フィルタ１０２～１０８それぞれは、以下の構成であってもよい。 [Additional notes regarding other filters]
Each of the filters 102 to 108 may have the following configuration.
　第１金属箔２０および第２金属箔２１の少なくとも１つは、多層基板１０と圧電基板１１との接続には使用していない構成であってもよい。 At least one of the first metal foil 20 and the second metal foil 21 may be configured not to be used for connecting the multilayer substrate 10 and the piezoelectric substrate 11.
　第１面１０ｅの平面視において、第１金属箔２０の面積および第２金属箔２１の面積の合計は、電極１７～１９の面積の総量の３０％以上であってもよく、４４％以上であってもよい。電極１７～１９の面積の総量に対する、第１金属箔２０の面積および第２金属箔２１の面積の合計の割合が大きい程、焼成により多層基板１０を形成したときに、多層基板１０の反りが生じ難くなる。当該割合が４４％以上であれば、多層基板１０の反りが十分生じ難くなる。 In plan view of the first surface 10e, the total area of the first metal foil 20 and the area of the second metal foil 21 may be 30% or more of the total area of the electrodes 17 to 19, and may be 44% or more. There may be. The larger the ratio of the total area of the first metal foil 20 and the area of the second metal foil 21 to the total area of the electrodes 17 to 19, the more the multilayer substrate 10 will warp when the multilayer substrate 10 is formed by firing. It becomes difficult to occur. If the ratio is 44% or more, warping of the multilayer substrate 10 becomes sufficiently difficult to occur.
　〔実施形態３〕
　図１２は、本開示の実施形態３に係る通信機器２００の概略構成を示すブロック図である。通信機器２００は、フィルタ１０９を備えている。フィルタ１０９は、フィルタ１０２～１０８のいずれかである。フィルタ１０９を備えている通信機器２００についても、本開示の範疇に含まれる。通信機器２００は、電波を利用した無線通信を行うものであってもよい。通信機器２００において、フィルタ１０９は例えば、分波器のフィルタに利用されてもよい。 [Embodiment 3]
FIG. 12 is a block diagram showing a schematic configuration of a communication device 200 according to Embodiment 3 of the present disclosure. Communication device 200 includes a filter 109. Filter 109 is one of filters 102-108. Communication equipment 200 including filter 109 is also included in the scope of the present disclosure. The communication device 200 may perform wireless communication using radio waves. In the communication device 200, the filter 109 may be used as a filter for a duplexer, for example.
　〔実施形態４〕
　多層基板１０自体も、本開示の範疇に含まれる。多層基板１０は、第１面１０ｅ、および、第１面１０ｅの反対側に位置している第２面１０ｆと、第２面１０ｆより第１面１０ｅに近い側に位置している第１金属箔２０と、並列共振子５～７と電気的に接続可能な信号線１２とを備えており、第１面１０ｅの平面視において、第１金属箔２０は、並列共振子５～７とグランド接続可能なグランド配線１４と重なっており、信号線１２とほぼ重なっていない構成である。 [Embodiment 4]
The multilayer substrate 10 itself is also included in the scope of the present disclosure. The multilayer substrate 10 includes a first surface 10e, a second surface 10f located on the opposite side of the first surface 10e, and a first metal surface located on a side closer to the first surface 10e than the second surface 10f. The first metal foil 20 includes a foil 20 and a signal line 12 that can be electrically connected to the parallel resonators 5 to 7. In a plan view of the first surface 10e, the first metal foil 20 connects the parallel resonators 5 to 7 and the ground. It overlaps with the connectable ground wiring 14 and does not substantially overlap with the signal line 12.
　本開示は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本開示の技術的範囲に含まれる。 The present disclosure is not limited to the embodiments described above, and various changes can be made within the scope of the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. are also included within the technical scope of the present disclosure.
１～４　直列共振子
５～７　並列共振子
８、９、１３、１５　配線
１２　信号線
１４　グランド配線
１０　多層基板
１０ａ　第１層
１０ｂ　第２層
１０ｃ　第３層
１０ｄ　第４層
１０ｅ　第１面
１０ｆ　第２面
１１　圧電基板
１６　金属箔
１７～１９　電極
２０　第１金属箔
２１　第２金属箔
２２　第１金属箔における第２金属箔と対向する部分
２３　第２金属箔における第１金属箔と対向する部分
２４　第３金属箔
２５　信号線における急カーブを描いている部分
１００～１０９　フィルタ
２００　通信機器 1 to 4 Series resonators 5 to 7 Parallel resonators 8, 9, 13, 15 Wiring 12 Signal line 14 Ground wiring 10 Multilayer board 10a First layer 10b Second layer 10c Third layer 10d Fourth layer 10e First surface 10f Second surface 11 Piezoelectric substrate 16 Metal foils 17 to 19 Electrodes 20 First metal foil 21 Second metal foil 22 Portion of the first metal foil facing the second metal foil 23 Opposing the first metal foil of the second metal foil Portion 24 Third metal foil 25 Signal line with sharp curves 100 to 109 Filter 200 Communication equipment

Claims (10)

  1. 　第１面、および、前記第１面の反対側に位置している第２面を有している多層基板と、
    　前記多層基板の前記第１面の側に搭載されており、並列共振子を有している圧電基板とを備えており、
    　前記多層基板は、
    　　前記第２面より前記第１面に近い側に位置している第１金属箔と、
    　　前記並列共振子と電気的に接続されている信号線とを有しており、
    　前記第１面の平面視において、前記第１金属箔は、前記並列共振子とグランド接続されているグランド配線と重なっており、前記信号線とほぼ重なっていないフィルタ。     a multilayer substrate having a first surface and a second surface located on the opposite side of the first surface;
    a piezoelectric substrate mounted on the first surface side of the multilayer substrate and having a parallel resonator;
    The multilayer substrate includes:
    a first metal foil located closer to the first surface than the second surface;
    It has a signal line electrically connected to the parallel resonator,
    In a plan view of the first surface, the first metal foil overlaps with the ground wiring that is ground-connected to the parallel resonator, and does not substantially overlap with the signal line.
  2. 　前記第１面の平面視において、前記第１金属箔は、前記信号線と全く重なっていない請求項１に記載のフィルタ。 The filter according to claim 1, wherein the first metal foil does not overlap the signal line at all in a plan view of the first surface.
  3. 　前記信号線は、前記多層基板の内層に設けられている請求項１または２に記載のフィルタ。 The filter according to claim 1 or 2, wherein the signal line is provided in an inner layer of the multilayer substrate.
  4. 　前記多層基板は、前記第２面より前記第１面に近い側に位置している第２金属箔を有しており、
    　前記第１金属箔と前記第２金属箔とが互いに電気的に接続されていない請求項１から３のいずれか１項に記載のフィルタ。     The multilayer board has a second metal foil located closer to the first surface than the second surface,
    The filter according to any one of claims 1 to 3, wherein the first metal foil and the second metal foil are not electrically connected to each other.
  5. 　前記第１面の平面視において、前記第２金属箔と前記信号線とが重なっている面積は、前記第１金属箔と前記信号線とが重なっている面積より大きい請求項４に記載のフィルタ。 5. The filter according to claim 4, wherein the area where the second metal foil and the signal line overlap in plan view of the first surface is larger than the area where the first metal foil and the signal line overlap. .
  6. 　前記第１面の平面視において、前記第２金属箔は、前記グランド配線と重なっていない請求項４または５に記載のフィルタ。 The filter according to claim 4 or 5, wherein the second metal foil does not overlap the ground wiring in a plan view of the first surface.
  7. 　前記多層基板は、前記第２面に設けられている少なくとも１つの電極を有しており、
    　前記第１面の平面視において、前記第１金属箔の面積および前記第２金属箔の面積の合計は、前記少なくとも１つの電極の面積の総量の３０％以上である請求項４から６のいずれか１項に記載のフィルタ。     The multilayer substrate has at least one electrode provided on the second surface,
    Any one of claims 4 to 6, wherein the total area of the first metal foil and the area of the second metal foil is 30% or more of the total area of the at least one electrode in a plan view of the first surface. or the filter described in item 1.
  8. 　前記第１金属箔は、グランドに接続されている請求項１から７のいずれか１項に記載のフィルタ。 The filter according to any one of claims 1 to 7, wherein the first metal foil is connected to ground.
  9. 　請求項１から８のいずれか１項に記載のフィルタを備えている通信機器。 A communication device comprising the filter according to any one of claims 1 to 8.
  10. 　第１面、および、前記第１面の反対側に位置している第２面と、
    　前記第２面より前記第１面に近い側に位置している第１金属箔と、
    　並列共振子と電気的に接続可能な信号線とを備えており、
    　前記第１面の平面視において、前記第１金属箔は、前記並列共振子とグランド接続可能なグランド配線と重なっており、前記信号線とほぼ重なっていない多層基板。     a first surface, and a second surface located on the opposite side of the first surface;
    a first metal foil located closer to the first surface than the second surface;
    Equipped with a parallel resonator and an electrically connectable signal line,
    In a plan view of the first surface, the first metal foil overlaps a ground wiring connectable to the parallel resonator and the ground, and does not substantially overlap the signal line.
PCT/JP2023/010234 2022-03-16 2023-03-16 Filter, communication device, and multilayer substrate WO2023176915A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015016203A1 (en) * 2013-08-02 2015-02-05 株式会社村田製作所 Duplexer
JP2018129630A (en) * 2017-02-07 2018-08-16 太陽誘電株式会社 Elastic wave device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015016203A1 (en) * 2013-08-02 2015-02-05 株式会社村田製作所 Duplexer
JP2018129630A (en) * 2017-02-07 2018-08-16 太陽誘電株式会社 Elastic wave device

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