WO2023165212A1 - Backlight module and direct-lit backlight device - Google Patents
Backlight module and direct-lit backlight device Download PDFInfo
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- WO2023165212A1 WO2023165212A1 PCT/CN2022/138427 CN2022138427W WO2023165212A1 WO 2023165212 A1 WO2023165212 A1 WO 2023165212A1 CN 2022138427 W CN2022138427 W CN 2022138427W WO 2023165212 A1 WO2023165212 A1 WO 2023165212A1
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- transparent substrate
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Definitions
- the present application relates to the field of backlight technology, in particular to a backlight module and a direct-lit backlight device.
- the direct-lit mini LED backlight module has the advantages of good display effect and partition control, and gradually occupies most of the market share in the high-end market. But straight-down Mini
- the LED backlight module uses a large number of LEDs, which increases the cost; and reducing the number of LEDs will increase the light mixing distance (commonly known as OD, which refers to the distance required for the light emitted by the LED to cover the diffuser plate evenly), thereby increasing The overall thickness reduces the appearance taste of the product.
- Embodiments of the present application provide a backlight module and a direct-lit backlight device to reduce the thickness of the backlight module at the same light mixing distance and reduce the number of light sources at the same thickness.
- the present application provides a backlight module, which includes a plurality of light sources, a transparent substrate, and a diffusion plate for diffusing the light emitted by the plurality of light sources, the diffusion plate is arranged opposite to the transparent substrate, A plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is a side of the transparent substrate facing away from the diffusion plate.
- the light source is an LED front-mount chip
- a transparent ITO circuit layer is arranged on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.
- the LED front-mount chip is a mini LED front-mount chip.
- the light source is an LED flip chip
- a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip chip are electrically connected to the circuit layer through wires.
- the LED flip chip is a mini LED flip chip.
- the transparent substrate is a glass substrate or a PET substrate.
- the front side of the transparent substrate is printed with a light refraction pattern, the refractive index of the light refraction pattern is greater than the refractive index of the transparent substrate, and the front side of the transparent substrate faces the direction of the transparent substrate. one side of the diffuser plate.
- the thickness of the light refraction pattern is 12 ⁇ m-24 ⁇ m.
- the refractive index of the light refraction pattern is 1.54-1.72.
- the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the inner side of the encapsulation shell A reflective layer is provided on the wall.
- the reflective layer is a reflective coating or a reflective coating layer.
- the inner wall surface of the package shell is an arc-shaped surface.
- the backlight module further includes encapsulation glue, the light source is encapsulated in the encapsulation glue, and the encapsulation glue is bonded to the back of the transparent substrate.
- the present application also provides a direct-type backlight device, wherein the direct-type backlight device includes a backlight module, and the backlight module includes a plurality of light sources, a transparent substrate, and a device for emitting light from the plurality of light sources.
- a diffusion plate for diffusing the light the diffusion plate is arranged opposite to the transparent substrate, a plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is that the transparent substrate faces away from the diffusion side of the board.
- the light source is an LED front-mount chip
- a transparent ITO circuit layer is provided on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.
- the LED front-mount chip is a mini LED front-mount chip.
- the light source is an LED flip chip
- a circuit layer is provided on the back of the transparent substrate
- pins of the LED flip chip are electrically connected to the circuit layer through wires.
- the LED flip chip is a mini LED flip chip.
- a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is the transparent substrate The side facing the diffuser plate.
- the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back side of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the encapsulation shell A reflective layer is provided on the inner wall surface.
- the beneficial effects of the present application are: by arranging the diffuser plate opposite to the transparent substrate, multiple light sources are arranged on the side of the transparent substrate away from the diffuser plate, so that the thickness of the transparent substrate can be converted into a part of the light mixing distance to achieve the same light mixing
- the reduction of the thickness of the backlight module under the distance and the reduction of the number of light sources under the same thickness of the backlight module are conducive to the thinning of the product, and the reduction of the number of light sources under the same overall thickness of the backlight module is conducive to saving costs.
- FIG. 1 is a schematic diagram of a first structure of a backlight module provided by an embodiment of the present application.
- FIG. 2 is a schematic diagram of the second structure of the backlight module provided by the embodiment of the present application.
- FIG. 3 is a schematic diagram of a third structure of the backlight module provided by the embodiment of the present application.
- FIG. 4 is a schematic diagram of the first connection between the transparent substrate and the light source provided by the embodiment of the present application.
- FIG. 5 is a schematic diagram of a second connection between the transparent substrate and the light source provided by the embodiment of the present application.
- the embodiment of the present application provides a backlight module. As shown in FIGS. Diffusion plate 30 for diffusion.
- the diffusion plate 30 is set opposite to the transparent substrate 20 .
- the backlight module provided in the embodiment of the present application can convert the thickness of the transparent substrate 20 into a light mixing distance by arranging the diffuser plate 30 opposite to the transparent substrate 20 and setting the light source 10 on the side of the transparent substrate 20 away from the diffuser plate 30
- a part of D realizes the reduction of the thickness of the backlight module under the same light mixing distance D (that is, the same number of light sources 10 ) and the reduction of the number of light sources 10 under the same overall thickness of the backlight module.
- the reduction of the overall thickness of the backlight module under the same light mixing distance D is beneficial to the thinning of the product, and the reduction of the number of light sources 10 under the same overall thickness of the backlight module is beneficial to cost saving.
- the backlight module converts the thickness of the transparent substrate 20 into a part of the light mixing distance D, under the premise of achieving the same backlight effect, the overall thickness of the backlight module can be reduced when the light mixing distance D is the same , making the product thinner, and reducing the overall thickness of the backlight module without increasing the number of light sources 10; and when the overall thickness of the backlight module is the same, the light mixing distance D can be increased, so that two adjacent light sources 10 The distance D between them increases, so the number of light sources 10 can be reduced and the cost can be reduced.
- a plurality of light sources 10 are arranged at intervals on the back of the transparent substrate 20 .
- the light source 10 is an LED front-mount chip, and the light-emitting surface and two pins of the LED front-mount chip are all facing the transparent substrate 20.
- a transparent ITO circuit layer 41 is provided, and the two pins of the LED front-mounted chip are welded to the ITO circuit layer 41 to realize the electrical connection between the LED front-mounted chip and the ITO circuit layer 41 .
- the LED formal chip can be a mini LED formal chip.
- the light source 10 can also be an LED flip chip.
- the light-emitting surface of the LED flip chip faces the transparent substrate 20, and the LED flip chip The two pins are away from the transparent substrate 20 , and a circuit layer is arranged on the back of the transparent substrate 20 , and the pins of the LED flip chip are electrically connected to the circuit layer through wires 42 .
- the LED flip chip can be a mini LED flip chip.
- the transparent substrate 20 may be a glass substrate or a PET (Polyethylene terephthalate, polyethylene terephthalate) substrate.
- Both glass and PET have high refractive index characteristics. Among them, the refractive index of glass is 1.51, and the refractive index of PET is 1.71. Therefore, the use of glass substrates and PET substrates can increase the light output at a large angle, further expand the light angle, and reduce the light emitted by the light source 10. The light is scattered, so that the backlight module can emit more uniform light with the same number of light sources 10, and can reduce the number of light sources 10 and reduce the cost when the same light output effect is achieved.
- the high-refractive-index silica gel the refractive index of high-refractive-index silica gel is 1.51
- the cost can be reduced by using glass substrates and PET substrates.
- a light refraction pattern 50 is printed on the front side of the transparent substrate 20, the refractive index of the light refraction pattern 50 is greater than that of the transparent substrate 20, and the front side of the transparent substrate 20 is a transparent substrate 20 faces the side of the diffusion plate 30 , that is, the light-emitting surface of the transparent substrate 20 .
- the light refraction pattern 50 needs to have a certain thickness and a certain refractive index.
- the thickness of the light refraction pattern 50 is 12 ⁇ m-24 ⁇ m, and the refractive index is 1.54-1.72.
- the light output angle can be further increased, the light mixing effect can be increased, and the brightness uniformity of the backlight module can be improved.
- the light refraction pattern 50 can be printed on the front side of the transparent substrate 20 by using high refractive index glue.
- the backlight module further includes an encapsulation glue 60
- the light source 10 is packaged in the encapsulation glue 60
- the encapsulation glue 60 is bonded on the back of the transparent substrate 20, that is, The light source 10 is encapsulated and fixed on the transparent substrate 20 through the encapsulation glue 60 .
- the encapsulation glue 60 may be transparent silicone or epoxy resin.
- the backlight module further includes an encapsulation shell 70, the encapsulation shell 70 is arranged on the back side of the transparent substrate 20, and the light source 10 is encapsulated in the encapsulation shell 70 A reflective layer having a reflective effect is provided on the inner wall surface of the packaging case 70 .
- the reflective layer can reflect the incident light toward the light-emitting side of the backlight module (that is, the diffuser plate 30 ), and the reflective layer can be a reflective coating formed by coating the inner wall surface of the package shell 70 with a reflective material, or the reflective layer It may also be a reflective coating formed by coating the inner wall surface of the package case 70 with a material having a reflective effect.
- the light source 10 is packaged in the package case 70 by providing a package case 70 with a reflective layer on the inner side wall surface on the back of the transparent substrate 20, so that the light emitted from the side of the light source 10 can be reflected by the reflective layer, increasing the utilization rate of the side light, Improve light effect.
- the inner side wall surface of the packaging case 70 may be a plane or an arc surface, preferably an arc surface.
- the arc surface has a better effect of collecting light emitted from the side of the light source 10 and can further improve light efficiency.
- the embodiment of the present application also provides a direct-type backlight device.
- the direct-type backlight device provided in the embodiment of the present application includes the backlight module in any one of the above embodiments.
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Abstract
The present application provides a backlight module and a direct-lit backlight device. The backlight module comprises a plurality of light sources, a transparent substrate and a diffusion plate for diffusing light emitted by the plurality of light sources; the diffusion plate and the transparent substrate are arranged opposite to each other; the plurality of light sources are provided on a back surface of the transparent substrate; the back surface of the transparent substrate is the surface of the transparent substrate away from the diffusion plate. According to the present application, the thickness of the transparent substrate can be converted into a part of a light mixing distance, so that thinning of a product is facilitated.
Description
本申请涉及背光技术领域,尤其涉及一种背光模组及直下式背光装置。The present application relates to the field of backlight technology, in particular to a backlight module and a direct-lit backlight device.
直下式mini LED背光模组具有显示效果好、可分区控制等优势,逐步在高端市场占据大部分市场份额。但直下式Mini
LED背光模组使用的LED数量较多,带来成本增加;而减少LED数量又会增大混光距离(俗称OD,是指LED发出的光线均匀覆盖到扩散板所需的距离),从而增加整体厚度,降低产品的外观品味。The direct-lit mini LED backlight module has the advantages of good display effect and partition control, and gradually occupies most of the market share in the high-end market. But straight-down Mini
The LED backlight module uses a large number of LEDs, which increases the cost; and reducing the number of LEDs will increase the light mixing distance (commonly known as OD, which refers to the distance required for the light emitted by the LED to cover the diffuser plate evenly), thereby increasing The overall thickness reduces the appearance taste of the product.
本申请实施例提供一种背光模组及直下式背光装置,以达到相同混光距离下背光模组厚度减小以及相同厚度下光源数量减少的目的。Embodiments of the present application provide a backlight module and a direct-lit backlight device to reduce the thickness of the backlight module at the same light mixing distance and reduce the number of light sources at the same thickness.
一方面,本申请提供一种背光模组,其包括多个光源、透明基板和用于对多个所述光源发出的光进行扩散的扩散板,所述扩散板与所述透明基板相对设置,多个所述光源设置在所述透明基板的背面上,所述透明基板的背面为所述透明基板背离所述扩散板的一面。In one aspect, the present application provides a backlight module, which includes a plurality of light sources, a transparent substrate, and a diffusion plate for diffusing the light emitted by the plurality of light sources, the diffusion plate is arranged opposite to the transparent substrate, A plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is a side of the transparent substrate facing away from the diffusion plate.
在所述的背光模组中,所述光源为LED正装芯片,所述透明基板的背面上设有透明的ITO电路层,所述LED正装芯片的引脚与所述ITO电路层焊接。In the backlight module, the light source is an LED front-mount chip, a transparent ITO circuit layer is arranged on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.
在所述的背光模组中,所述LED正装芯片为mini LED正装芯片。In the backlight module, the LED front-mount chip is a mini LED front-mount chip.
在所述的背光模组中,所述光源为LED倒装芯片,所述透明基板的背面上设有电路层,所述LED倒装芯片的引脚通过导线与所述电路层电连接。In the backlight module, the light source is an LED flip chip, a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip chip are electrically connected to the circuit layer through wires.
在所述的背光模组中,所述LED倒装芯片为mini LED倒装芯片。In the backlight module, the LED flip chip is a mini LED flip chip.
在所述的背光模组中,所述透明基板为玻璃基板或者PET基板。In the backlight module, the transparent substrate is a glass substrate or a PET substrate.
在所述的背光模组中,所述透明基板的正面印刷有光折射图形,所述光折射图形的折射率大于所述透明基板的折射率,所述透明基板的正面为所述透明基板朝向所述扩散板的一面。In the backlight module, the front side of the transparent substrate is printed with a light refraction pattern, the refractive index of the light refraction pattern is greater than the refractive index of the transparent substrate, and the front side of the transparent substrate faces the direction of the transparent substrate. one side of the diffuser plate.
在所述的背光模组中,所述光折射图形的厚度为12μm-24μm。In the backlight module, the thickness of the light refraction pattern is 12 μm-24 μm.
在所述的背光模组中,所述光折射图形的折射率为1.54-1.72。In the backlight module, the refractive index of the light refraction pattern is 1.54-1.72.
在所述的背光模组中,所述背光模组还包括封装壳,所述封装壳设置在所述透明基板的背面上,所述光源封装在所述封装壳内,所述封装壳的内侧壁面上设有反射层。In the backlight module, the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the inner side of the encapsulation shell A reflective layer is provided on the wall.
在所述的背光模组中,所述反射层为反射涂层或反射镀膜层。In the backlight module, the reflective layer is a reflective coating or a reflective coating layer.
在所述的背光模组中,所述封装壳的内侧壁面为弧形面。 In the backlight module described above, the inner wall surface of the package shell is an arc-shaped surface.
在所述的背光模组中,所述背光模组还包括封装胶,所述光源封装在所述封装胶内,所述封装胶粘接所述在所述透明基板的背面上。In the backlight module, the backlight module further includes encapsulation glue, the light source is encapsulated in the encapsulation glue, and the encapsulation glue is bonded to the back of the transparent substrate.
另一方面,本申请还提供一种直下式背光装置,其中,所述直下式背光装置包括背光模组,所述背光模组包括多个光源、透明基板和用于对多个所述光源发出的光进行扩散的扩散板,所述扩散板与所述透明基板相对设置,多个所述光源设置在所述透明基板的背面上,所述透明基板的背面为所述透明基板背离所述扩散板的一面。On the other hand, the present application also provides a direct-type backlight device, wherein the direct-type backlight device includes a backlight module, and the backlight module includes a plurality of light sources, a transparent substrate, and a device for emitting light from the plurality of light sources. A diffusion plate for diffusing the light, the diffusion plate is arranged opposite to the transparent substrate, a plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is that the transparent substrate faces away from the diffusion side of the board.
在所述的直下式背光装置中,所述光源为LED正装芯片,所述透明基板的背面上设有透明的ITO电路层,所述LED正装芯片的引脚与所述ITO电路层焊接。In the direct type backlight device, the light source is an LED front-mount chip, a transparent ITO circuit layer is provided on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.
在所述的直下式背光装置中,所述LED正装芯片为mini LED正装芯片。In the direct-lit backlight device, the LED front-mount chip is a mini LED front-mount chip.
在所述的直下式背光装置中,所述光源为LED倒装芯片,所述透明基板的背面上设有电路层,所述LED倒装芯片的引脚通过导线与所述电路层电连接。In the direct-lit backlight device, the light source is an LED flip chip, a circuit layer is provided on the back of the transparent substrate, and pins of the LED flip chip are electrically connected to the circuit layer through wires.
在所述的直下式背光装置中,所述LED倒装芯片为mini LED倒装芯片。In the direct-lit backlight device, the LED flip chip is a mini LED flip chip.
在所述的直下式背光装置中,所述透明基板的正面印刷有光折射图形,所述光折射图形的折射率大于所述透明基板的折射率,所述透明基板的正面为所述透明基板朝向所述扩散板的一面。In the direct type backlight device, a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is the transparent substrate The side facing the diffuser plate.
在所述的直下式背光装置中,所述背光模组还包括封装壳,所述封装壳设置在所述透明基板的背面上,所述光源封装在所述封装壳内,所述封装壳的内侧壁面上设有反射层。In the direct type backlight device, the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back side of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the encapsulation shell A reflective layer is provided on the inner wall surface.
本申请的有益效果为:通过将扩散板与透明基板相对设置,将多个光源设置在透明基板背离扩散板的一面,从而可以将透明基板的厚度转化为混光距离的一部分,实现相同混光距离下背光模组厚度的减小以及相同背光模组厚度下光源数量的减少。其中,相同混光距离下背光模组整体厚度的减小有利于产品的薄型化,相同背光模组整体厚度下光源数量的减少有利于节省成本。The beneficial effects of the present application are: by arranging the diffuser plate opposite to the transparent substrate, multiple light sources are arranged on the side of the transparent substrate away from the diffuser plate, so that the thickness of the transparent substrate can be converted into a part of the light mixing distance to achieve the same light mixing The reduction of the thickness of the backlight module under the distance and the reduction of the number of light sources under the same thickness of the backlight module. Among them, the reduction of the overall thickness of the backlight module under the same light mixing distance is conducive to the thinning of the product, and the reduction of the number of light sources under the same overall thickness of the backlight module is conducive to saving costs.
下面结合附图,通过对本申请的具体实施方式详细描述,将使本申请的技术方案及其它有益效果显而易见。The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application below in conjunction with the accompanying drawings.
图1为本申请实施例提供的背光模组的第一种结构示意图。FIG. 1 is a schematic diagram of a first structure of a backlight module provided by an embodiment of the present application.
图2为本申请实施例提供的背光模组的第二种结构示意图。FIG. 2 is a schematic diagram of the second structure of the backlight module provided by the embodiment of the present application.
图3为本申请实施例提供的背光模组的第三种结构示意图。FIG. 3 is a schematic diagram of a third structure of the backlight module provided by the embodiment of the present application.
图4为本申请实施例提供的透明基板与光源的第一种连接示意图。FIG. 4 is a schematic diagram of the first connection between the transparent substrate and the light source provided by the embodiment of the present application.
图5为本申请实施例提供的透明基板与光源的第二种连接示意图。FIG. 5 is a schematic diagram of a second connection between the transparent substrate and the light source provided by the embodiment of the present application.
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.
本申请实施例提供了一种背光模组,如图1-图5所示,本申请实施例提供的背光模组包括多个光源10、透明基板20和用于对多个光源10发出的光进行扩散的扩散板30,扩散板30与透明基板20相对设置,多个光源10设置在透明基板20的背面上,透明基板20的背面为透明基板20背离扩散板30的一面。The embodiment of the present application provides a backlight module. As shown in FIGS. Diffusion plate 30 for diffusion. The diffusion plate 30 is set opposite to the transparent substrate 20 .
本申请实施例提供的背光模组,通过将扩散板30与透明基板20相对设置,将光源10设置在透明基板20背离扩散板30的一面,从而可以将透明基板20的厚度转化为混光距离D的一部分,实现相同混光距离D(即光源10数量相同)下背光模组厚度的减小以及相同背光模组整体厚度下光源10数量的减少。其中,相同混光距离D下背光模组整体厚度的减小有利于产品的薄型化,相同背光模组整体厚度下光源10数量的减少有利于节省成本。The backlight module provided in the embodiment of the present application can convert the thickness of the transparent substrate 20 into a light mixing distance by arranging the diffuser plate 30 opposite to the transparent substrate 20 and setting the light source 10 on the side of the transparent substrate 20 away from the diffuser plate 30 A part of D realizes the reduction of the thickness of the backlight module under the same light mixing distance D (that is, the same number of light sources 10 ) and the reduction of the number of light sources 10 under the same overall thickness of the backlight module. Wherein, the reduction of the overall thickness of the backlight module under the same light mixing distance D is beneficial to the thinning of the product, and the reduction of the number of light sources 10 under the same overall thickness of the backlight module is beneficial to cost saving.
应当理解的是,在达到相同背光效果的前提下,光源10数量减少时需要增大混光距离D,导致背光模组厚度增大;而光源10数量增加时可减小混光距离D,从而减小背光模组的整体厚度,但会增加成本。由于本申请实施例提供的背光模组将透明基板20的厚度转化为混光距离D的一部分,因此在达到相同背光效果的前提下,混光距离D相同时可以减小背光模组的整体厚度,使产品的薄型化,且减小背光模组整体厚度的同时无需增加光源10数量;而在背光模组的整体厚度相同时,可以使混光距离D增大,从而相邻两个光源10之间的距离D增大,因此可以减少光源10的数量,降低成本。It should be understood that, under the premise of achieving the same backlight effect, when the number of light sources 10 decreases, it is necessary to increase the light mixing distance D, resulting in an increase in the thickness of the backlight module; and when the number of light sources 10 increases, the light mixing distance D can be reduced, so that Reducing the overall thickness of the backlight module will increase the cost. Since the backlight module provided by the embodiment of the present application converts the thickness of the transparent substrate 20 into a part of the light mixing distance D, under the premise of achieving the same backlight effect, the overall thickness of the backlight module can be reduced when the light mixing distance D is the same , making the product thinner, and reducing the overall thickness of the backlight module without increasing the number of light sources 10; and when the overall thickness of the backlight module is the same, the light mixing distance D can be increased, so that two adjacent light sources 10 The distance D between them increases, so the number of light sources 10 can be reduced and the cost can be reduced.
具体的,多个光源10间隔布置在透明基板20的背面。如图4所示,在本申请的一些实施例中,光源10为LED正装芯片,LED正装芯片的发光面和两个引脚均朝向透明基板20,如图所示,透明基板20的背面上设有透明的ITO电路层41,LED正装芯片的两个引脚与ITO电路层41焊接,实现LED正装芯片与ITO电路层41的电连接。可选的,LED正装芯片可以为mini LED正装芯片。Specifically, a plurality of light sources 10 are arranged at intervals on the back of the transparent substrate 20 . As shown in FIG. 4, in some embodiments of the present application, the light source 10 is an LED front-mount chip, and the light-emitting surface and two pins of the LED front-mount chip are all facing the transparent substrate 20. As shown in the figure, on the back of the transparent substrate 20 A transparent ITO circuit layer 41 is provided, and the two pins of the LED front-mounted chip are welded to the ITO circuit layer 41 to realize the electrical connection between the LED front-mounted chip and the ITO circuit layer 41 . Optionally, the LED formal chip can be a mini LED formal chip.
或者,如图5所示,在本申请的另一些实施例中,光源10也可以为LED倒装芯片,如图所示,LED倒装芯片的发光面朝向透明基板20,LED倒装芯片的两个引脚背离透明基板20,在透明基板20的背面上设有电路层,LED倒装芯片的引脚通过导线42与电路层电连接。可选的,LED倒装芯片可以为mini LED倒装芯片。Or, as shown in FIG. 5, in other embodiments of the present application, the light source 10 can also be an LED flip chip. As shown in the figure, the light-emitting surface of the LED flip chip faces the transparent substrate 20, and the LED flip chip The two pins are away from the transparent substrate 20 , and a circuit layer is arranged on the back of the transparent substrate 20 , and the pins of the LED flip chip are electrically connected to the circuit layer through wires 42 . Optionally, the LED flip chip can be a mini LED flip chip.
可选的,透明基板20可以为玻璃基板或者PET(Polyethylene terephthalate,聚对苯二甲酸乙二醇酯)基板。玻璃和PET均具有高折射率特性,其中,玻璃的折射率为1.51,PET的折射率为1.71,因此采用玻璃基板和PET基板可以增加大角度出光,进一步扩大光线张角,将光源10发出的光线打散,从而实现相同光源10数量下背光模组出光更均匀,以及在达到相同出光效果的情况下可以减少光源10数量,降低成本。此外,相对于采用封装胶水成本高的高折射率硅胶(高折射率硅胶的折射率为1.51),采用玻璃基板和PET基板可以降低成本。Optionally, the transparent substrate 20 may be a glass substrate or a PET (Polyethylene terephthalate, polyethylene terephthalate) substrate. Both glass and PET have high refractive index characteristics. Among them, the refractive index of glass is 1.51, and the refractive index of PET is 1.71. Therefore, the use of glass substrates and PET substrates can increase the light output at a large angle, further expand the light angle, and reduce the light emitted by the light source 10. The light is scattered, so that the backlight module can emit more uniform light with the same number of light sources 10, and can reduce the number of light sources 10 and reduce the cost when the same light output effect is achieved. In addition, compared with the high-refractive-index silica gel (the refractive index of high-refractive-index silica gel is 1.51), which is expensive for packaging glue, the cost can be reduced by using glass substrates and PET substrates.
如图2所示,在本申请的一些实施例中,透明基板20的正面印刷有光折射图形50,光折射图形50的折射率大于透明基板20的折射率,透明基板20的正面为透明基板20朝向扩散板30的一面,即透明基板20的出光面。光折射图形50需要具有一定的厚度和一定的折射率,可选的,光折射图形50的厚度为12μm-24μm,折射率为1.54-1.72。通过在透明基板20的正面印刷光折射图形50,可以实现进一步增大出光角度,增加混光效果,使背光模组的亮度一致性更好。可选的,光折射图形50可以通过采用高折射率胶水在透明基板20的正面印刷而成。As shown in Figure 2, in some embodiments of the present application, a light refraction pattern 50 is printed on the front side of the transparent substrate 20, the refractive index of the light refraction pattern 50 is greater than that of the transparent substrate 20, and the front side of the transparent substrate 20 is a transparent substrate 20 faces the side of the diffusion plate 30 , that is, the light-emitting surface of the transparent substrate 20 . The light refraction pattern 50 needs to have a certain thickness and a certain refractive index. Optionally, the thickness of the light refraction pattern 50 is 12 μm-24 μm, and the refractive index is 1.54-1.72. By printing the light refraction pattern 50 on the front side of the transparent substrate 20, the light output angle can be further increased, the light mixing effect can be increased, and the brightness uniformity of the backlight module can be improved. Optionally, the light refraction pattern 50 can be printed on the front side of the transparent substrate 20 by using high refractive index glue.
如图1所示,在本申请的一些实施例中,背光模组还包括封装胶60,光源10封装在封装胶60内,封装胶60粘接在透明基板20的背面上,也就是说,光源10通过封装胶60水封装并固定在透明基板20上。可选的,封装胶60可以为透明硅树脂或者环氧树脂。As shown in FIG. 1 , in some embodiments of the present application, the backlight module further includes an encapsulation glue 60, the light source 10 is packaged in the encapsulation glue 60, and the encapsulation glue 60 is bonded on the back of the transparent substrate 20, that is, The light source 10 is encapsulated and fixed on the transparent substrate 20 through the encapsulation glue 60 . Optionally, the encapsulation glue 60 may be transparent silicone or epoxy resin.
或者,如图2和图3所示,在本申请的另一些实施例中,背光模组还包括封装壳70,封装壳70设置在透明基板20的背面上,光源10封装在封装壳70内,封装壳70的内侧壁面上设有具有反射效果的反射层。其中,反射层能够向背光模组的出光侧(即扩散板30)反射入射的光线,反射层可以是具有反射效果的材料涂覆在封装壳70内侧壁面上形成的反射涂层,或者反射层也可以是具有反射效果的材料镀在封装壳70内侧壁面上形成的反射镀膜。通过在透明基板20的背面上设置内侧壁面具有反射层的封装壳70,将光源10封装在封装壳70内,从而光源10侧面发出的光线可通过反射层进行反射,增加侧面出光的利用率,提升光效。Or, as shown in FIG. 2 and FIG. 3 , in other embodiments of the present application, the backlight module further includes an encapsulation shell 70, the encapsulation shell 70 is arranged on the back side of the transparent substrate 20, and the light source 10 is encapsulated in the encapsulation shell 70 A reflective layer having a reflective effect is provided on the inner wall surface of the packaging case 70 . Wherein, the reflective layer can reflect the incident light toward the light-emitting side of the backlight module (that is, the diffuser plate 30 ), and the reflective layer can be a reflective coating formed by coating the inner wall surface of the package shell 70 with a reflective material, or the reflective layer It may also be a reflective coating formed by coating the inner wall surface of the package case 70 with a material having a reflective effect. The light source 10 is packaged in the package case 70 by providing a package case 70 with a reflective layer on the inner side wall surface on the back of the transparent substrate 20, so that the light emitted from the side of the light source 10 can be reflected by the reflective layer, increasing the utilization rate of the side light, Improve light effect.
可选的,封装壳70的内侧壁面可以为平面或者弧形面,优选为弧形面,弧形面收集光源10侧面出光的效果更好,可以进一步提升光效。Optionally, the inner side wall surface of the packaging case 70 may be a plane or an arc surface, preferably an arc surface. The arc surface has a better effect of collecting light emitted from the side of the light source 10 and can further improve light efficiency.
本申请实施例还提供了一种直下式背光装置,本申请实施例提供的直下式背光装置包括如上任一实施例中的背光模组。The embodiment of the present application also provides a direct-type backlight device. The direct-type backlight device provided in the embodiment of the present application includes the backlight module in any one of the above embodiments.
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.
以上对本申请实施例所提供的背光模组和直下式背光装置进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上,本说明书内容不应理解为对本申请的限制。The backlight module and the direct-lit backlight device provided by the embodiment of the present application have been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present application. The description of the above embodiment is only used to help understand the present application. The method of application and its core idea; at the same time, for those skilled in the art, according to the idea of this application, there will be changes in the specific implementation and application scope. limits.
Claims (20)
- 一种背光模组,其包括多个光源、透明基板和用于对多个所述光源发出的光进行扩散的扩散板,所述扩散板与所述透明基板相对设置,多个所述光源设置在所述透明基板的背面上,所述透明基板的背面为所述透明基板背离所述扩散板的一面。A backlight module, which includes a plurality of light sources, a transparent substrate and a diffusion plate for diffusing the light emitted by the plurality of light sources, the diffusion plate is arranged opposite to the transparent substrate, and the plurality of light sources are arranged On the back side of the transparent substrate, the back side of the transparent substrate is a side of the transparent substrate facing away from the diffusion plate.
- 根据权利要求1所述的背光模组,其中,所述光源为LED正装芯片,所述透明基板的背面上设有透明的ITO电路层,所述LED正装芯片的引脚与所述ITO电路层焊接。The backlight module according to claim 1, wherein the light source is an LED front-mount chip, a transparent ITO circuit layer is provided on the back of the transparent substrate, and the pins of the LED front-mount chip are connected to the ITO circuit layer. welding.
- 根据权利要求2所述的背光模组,其中,所述LED正装芯片为mini LED正装芯片。The backlight module according to claim 2, wherein the LED front-mount chip is a mini LED front-mount chip.
- 根据权利要求1所述的背光模组,其中,所述光源为LED倒装芯片,所述透明基板的背面上设有电路层,所述LED倒装芯片的引脚通过导线与所述电路层电连接。The backlight module according to claim 1, wherein the light source is an LED flip chip, a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip chip are connected to the circuit layer through wires. electrical connection.
- 根据权利要求4所述的背光模组,其中,所述LED倒装芯片为mini LED倒装芯片。The backlight module according to claim 4, wherein the LED flip chip is a mini LED flip chip.
- 根据权利要求1所述的背光模组,其中,所述透明基板为玻璃基板或者PET基板。The backlight module according to claim 1, wherein the transparent substrate is a glass substrate or a PET substrate.
- 根据权利要求1所述的背光模组,其中,所述透明基板的正面印刷有光折射图形,所述光折射图形的折射率大于所述透明基板的折射率,所述透明基板的正面为所述透明基板朝向所述扩散板的一面。The backlight module according to claim 1, wherein a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is the The side of the transparent substrate facing the diffusion plate.
- 根据权利要求7所述的背光模组,其中,所述光折射图形的厚度为12μm-24μm。The backlight module according to claim 7, wherein the thickness of the light refraction pattern is 12 μm-24 μm.
- 根据权利要求7所述的背光模组,其中,所述光折射图形的折射率为1.54-1.72。The backlight module according to claim 7, wherein the refractive index of the light refraction pattern is 1.54-1.72.
- 根据权利要求1所述的背光模组,其中,所述背光模组还包括封装壳,所述封装壳设置在所述透明基板的背面上,所述光源封装在所述封装壳内,所述封装壳的内侧壁面上设有反射层。The backlight module according to claim 1, wherein the backlight module further comprises an encapsulation, the encapsulation is arranged on the back of the transparent substrate, the light source is encapsulated in the encapsulation, the A reflective layer is provided on the inner wall surface of the packaging shell.
- 根据权利要求10所述的背光模组,其中,所述反射层为反射涂层或反射镀膜层。The backlight module according to claim 10, wherein the reflective layer is a reflective coating or a reflective coating layer.
- 根据权利要求10所述的背光模组,其中,所述封装壳的内侧壁面为弧形面。The backlight module according to claim 10, wherein the inner wall surface of the packaging case is an arc-shaped surface.
- 根据权利要求1所述的背光模组,其中,所述背光模组还包括封装胶,所述光源封装在所述封装胶内,所述封装胶粘接所述在所述透明基板的背面上。The backlight module according to claim 1, wherein the backlight module further comprises encapsulation glue, the light source is packaged in the encapsulation glue, and the encapsulation glue sticks the .
- 一种直下式背光装置,其中,所述直下式背光装置包括背光模组;A direct-type backlight device, wherein the direct-type backlight device includes a backlight module;所述背光模组包括多个光源、透明基板和用于对多个所述光源发出的光进行扩散的扩散板,所述扩散板与所述透明基板相对设置,多个所述光源设置在所述透明基板的背面上,所述透明基板的背面为所述透明基板背离所述扩散板的一面。The backlight module includes a plurality of light sources, a transparent substrate, and a diffusion plate for diffusing the light emitted by the plurality of light sources. The diffusion plate is arranged opposite to the transparent substrate, and the plurality of light sources are arranged on the On the back of the transparent substrate, the back of the transparent substrate is the side of the transparent substrate facing away from the diffusion plate.
- 根据权利要求14所述的直下式背光装置,其中,所述光源为LED正装芯片,所述透明基板的背面上设有透明的ITO电路层,所述LED正装芯片的引脚与所述ITO电路层焊接。The direct-lit backlight device according to claim 14, wherein the light source is an LED front-mount chip, a transparent ITO circuit layer is arranged on the back side of the transparent substrate, and the pins of the LED front-mount chip are connected to the ITO circuit layer. layer welding.
- 根据权利要求15所述的直下式背光装置,其中,所述LED正装芯片为mini LED正装芯片。The direct-lit backlight device according to claim 15, wherein the LED front-mount chip is a mini LED front-mount chip.
- 根据权利要求14所述的直下式背光装置,其中,所述光源为LED倒装芯片,所述透明基板的背面上设有电路层,所述LED倒装芯片的引脚通过导线与所述电路层电连接。The direct-lit backlight device according to claim 14, wherein the light source is an LED flip-chip, a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip-chip are connected to the circuit through wires. layer electrical connection.
- 根据权利要求17所述的直下式背光装置,其中,所述LED倒装芯片为mini LED倒装芯片。The direct-lit backlight device according to claim 17, wherein the LED flip chip is a mini LED flip chip.
- 根据权利要求14所述的直下式背光装置,其中,所述透明基板的正面印刷有光折射图形,所述光折射图形的折射率大于所述透明基板的折射率,所述透明基板的正面为所述透明基板朝向所述扩散板的一面。The direct-lit backlight device according to claim 14, wherein a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is A side of the transparent substrate facing the diffusion plate.
- 根据权利要求14所述的直下式背光装置,其中,所述背光模组还包括封装壳,所述封装壳设置在所述透明基板的背面上,所述光源封装在所述封装壳内,所述封装壳的内侧壁面上设有反射层。The direct-lit backlight device according to claim 14, wherein the backlight module further comprises an encapsulation shell, the encapsulation shell is arranged on the back surface of the transparent substrate, the light source is encapsulated in the encapsulation shell, the A reflective layer is provided on the inner wall surface of the packaging shell.
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2022
- 2022-03-01 CN CN202220441936.8U patent/CN217061299U/en active Active
- 2022-12-12 WO PCT/CN2022/138427 patent/WO2023165212A1/en unknown
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CN202419335U (en) * | 2011-10-28 | 2012-09-05 | Tcl光电科技(惠州)有限公司 | Liquid crystal display and direct light-emitting diode (LED) backlight module |
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CN209325530U (en) * | 2018-09-14 | 2019-08-30 | 海迪科(南通)光电科技有限公司 | A kind of Novel panel lamp |
CN111913320A (en) * | 2019-05-09 | 2020-11-10 | 北京易美新创科技有限公司 | Backlight module and display device |
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CN214067532U (en) * | 2020-09-17 | 2021-08-27 | 易美芯光(北京)科技有限公司 | Direct type backlight module and display |
CN217061299U (en) * | 2022-03-01 | 2022-07-26 | 惠州视维新技术有限公司 | Backlight module and direct type backlight device |
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