WO2023136800A1 - A two-layer cooling system - Google Patents

A two-layer cooling system Download PDF

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Publication number
WO2023136800A1
WO2023136800A1 PCT/TR2023/050027 TR2023050027W WO2023136800A1 WO 2023136800 A1 WO2023136800 A1 WO 2023136800A1 TR 2023050027 W TR2023050027 W TR 2023050027W WO 2023136800 A1 WO2023136800 A1 WO 2023136800A1
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WO
WIPO (PCT)
Prior art keywords
fluid
heat sink
cooling
degree
heat
Prior art date
Application number
PCT/TR2023/050027
Other languages
French (fr)
Inventor
Murat Parlak
Ergun ÖRS
Vedat YAĞCI
Original Assignee
Aselsan Elektroni̇k Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TR2022/000473 external-priority patent/TR2022000473A1/en
Application filed by Aselsan Elektroni̇k Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ filed Critical Aselsan Elektroni̇k Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇
Publication of WO2023136800A1 publication Critical patent/WO2023136800A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Definitions

  • the invention relates to a two-layer cooling system providing use of return fluid for both cooling purpose and without requiring need for an area needed to be spared on the plate for fluid return.
  • Heat sinks are very frequently used in electronics field for effective cooling electronics or a subsystem functioning in affiliation to it in electronics field. In heat sinks, hydrodynamic effects should be considered as well as thermal efficiency. Keeping the electronics in the operating temperature range is very effective in terms of life and performance of those components. Heat sinks contain many geometric options within themselves.
  • Cold plate plays an essential role in distribution of fluids to heat sinks in multiple heat sources and re-collection and inclusion of fluids into close cycle. Use of cold plate can be in various ways in itself. Cold plates in prior art are classified as serial and parallel cooling mostly.
  • Serial cooling can be defined as the flow of the fluid entering the cold plate from an interface, cooling each heat source and leaving the plate by the fluid coming to the outlet.
  • Figure 1 shows an illustrative view of a cold plate. In said embodiments fluid is heated up after each heat source. A movement of return to at least Y distance is needed.
  • serial cooling In a serial cooled system, the fluid is heated up a little more and enters the next heat source hotter. Thus, there can be a very serious temperature difference between the first heat source and the last heat source depending on the thermal load. In addition, there is a temperature difference in the flow direction within the heat source itself, and this difference causes thermal expansion, shortening the life of sensitive electronics. Upon adding at similar pressures, it causes occurrence of working at too high pressures. As shown in figure 1 , serial cooling can be described with following equations.
  • Another prior art is to cool the fluid by distributing it parallel to the heat sources.
  • an equal temperature distribution can be achieved by distributing the fluid equally or very close to each heat source.
  • the biggest disadvantage of the parallel structure is the possibility of not equal supply of the fluid equally to the heat sources.
  • this distribution ratio changes depending on the flow rate change.
  • some manoeuvring space is needed on the cold plate for turning. Said manoeuvres correspond to the x and y distances shown in Figure 2. Distances x and at least 1 y are needed for the turning manoeuvre.
  • the temperature and pressure relationship in parallel cooling can be expressed with the following equations.
  • application numbered CN209882442U is found.
  • the application relates to a double-layer cooling system applied to the heat radiation of the module.
  • a cooler with a cold bottom and top plate body and water channels used for heat distribution in its upper layer are mentioned.
  • flaps for effective cooling does not disclose any information on the use of the multi-layer structures to reduce the space and volume required for manoeuvrings.
  • the invention inspired from existing situations aims to solve the disadvantages described above.
  • Primary object of the invention is to disclose a two-layer cooling system with enhanced performance by providing use of return fluid for both cooling purpose and without requiring need for an area needed to be spared on the plate for fluid return.
  • Object of the invention is to provide effective cooling by cooling heat sink in upper layer by help of heat source in the lower (second degree) layer and cooling heat source by heat sink in upper layer (first degree).
  • Object of the invention is to adjust the flow resistance of the cold plates and to provide the pressure drop required for the even distribution of liquids by extending the way with the cooler channels located at the lower and upper part, instead of micro channels.
  • Figure 1 is an illustrative view of serial cooling cold plate of the prior art.
  • Figure 2 is an illustrative view of parallel cooling cold plate of the prior art.
  • Figure 3 is a detailed section view of two-layer cooling system of the invention.
  • Figure 4 is a side view of two-layer cooling system of the invention.
  • Figure 5 is a detailed view of two-layer cooling system placed in order onto layered heat sink and cold plate of the invention.
  • Figure 6 is a top view of two-layer cooling system.
  • Figure 7 is an illustrative comparison of invention to the prior art analytically.
  • T ⁇ -x Maximum temperature obtained with double layer heat sink Average temperature Inlet pressure value
  • the invention relates to a two-layer cooling system comprising a layered heat sink containing 1 st degree heat sink (8) and 2nd degree heat sink (9) and a cold plate (1 ).
  • 1 st degree heat sink (8) and 2nd degree heat sink (9) are used for effective cooling and for reducing area and volume required for manoeuvring in the cold plate (1 ).
  • the system comprises 1 st degree heat sink (8) located between fluid channels (3) containing fluid inlet (6), fluid outlet (7) and providing fluid to pass through the plate (1 ) and fluid channels (3) to ensure equal distribution, cooling heat source (2) to prevent high differences between temperature distribution occurring on heat source (2), 2nd degree heat sink (9) located between fluid channels (3) parallel to 1 st degree heat sink (8) and providing decrease in total temperature by cooling 1 st degree heat sink (8).
  • border point (a) is the point where the temperature is the highest, complex flowing arising from returning bringing the heat transfer coefficient h (W/m 2 K) value from the value inside the fluid channel (3) to very high values and thus enables a more effective cooling.
  • 2nd degree heat sink (9) cools 1 st degree heat sink (8), when cooling is no enough, there can be various patterns organizing return line and meanwhile cooling of an amount.
  • Figure 5 shows total eight heat sources (2) and placement thereof on cold plate (1 ) and parallel distribution line in an illustrative view.
  • Fluid inlet (6) and fluid outlet (7) are both located onto cold plate (1 ). Fluid enters from fluid inlet (6) and is distributed equally into heat sources (2) inside the plate (1 ).
  • One of the most important requirements for equal distribution is that the pressure drop in the heat sinks (8, 9) must be much higher than the pressure drop in the distribution manifold (4). Thickness of the cold plate (1) increases a little in the area where heat source (2) is. However, as the increase is much less on the plate (1) than the thickness of electronics, it does not bring an additional load for the plate (1 ). While flow is towards heat sources (2) in distribution manifold (4), flow is from heat source (2) towards collection manifold (5) in the lower layer.
  • Figure 7 is a comparison of the system of the invention to the prior art.
  • heat change occurs monotonously along heat source, it is changed by the double layered cooling system of the invention.
  • Monotonous increase breaks at a point and temperature values start to decrease.
  • maximum temperature values of average temperature values is lower when compared to single layer heat sink.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a two-layer cooling system providing use of return fluid for both cooling purpose and without requiring need for an area needed to be spared on the plate for fluid return. The system, having fluid inlet (6), fluid outlet (7), providing equal distribution of fluid to heat sources (2) by passing through plate (1) into fluid channels (3), and comprises 1st degree heat sink (8), located between the fluid channels (3), cooling the heat source to prevent high heat distribution differences occurring on the heat source (2), 2nd degree heat sink (9), located between the fluid channels (3) and parallel to 1st degree heat sink (8), and providing decrease in total temperature by cooling 1st degree heat sink (8).

Description

A TWO-LAYER COOLING SYSTEM
Technical Field
The invention relates to a two-layer cooling system providing use of return fluid for both cooling purpose and without requiring need for an area needed to be spared on the plate for fluid return.
Background of the Invention
Heat sinks are very frequently used in electronics field for effective cooling electronics or a subsystem functioning in affiliation to it in electronics field. In heat sinks, hydrodynamic effects should be considered as well as thermal efficiency. Keeping the electronics in the operating temperature range is very effective in terms of life and performance of those components. Heat sinks contain many geometric options within themselves.
Cold plate plays an essential role in distribution of fluids to heat sinks in multiple heat sources and re-collection and inclusion of fluids into close cycle. Use of cold plate can be in various ways in itself. Cold plates in prior art are classified as serial and parallel cooling mostly.
Serial cooling can be defined as the flow of the fluid entering the cold plate from an interface, cooling each heat source and leaving the plate by the fluid coming to the outlet. Figure 1 shows an illustrative view of a cold plate. In said embodiments fluid is heated up after each heat source. A movement of return to at least Y distance is needed.
In a serial cooled system, the fluid is heated up a little more and enters the next heat source hotter. Thus, there can be a very serious temperature difference between the first heat source and the last heat source depending on the thermal load. In addition, there is a temperature difference in the flow direction within the heat source itself, and this difference causes thermal expansion, shortening the life of sensitive electronics. Upon adding at similar pressures, it causes occurrence of working at too high pressures. As shown in figure 1 , serial cooling can be described with following equations.
Figure imgf000003_0001
In addition, methods such as increasing the flow rate of the fluid can be used to provide equal temperature distribution in serial cooling. However, this increase in flow can reach very high values due to the accumulation of pressures along the flow.
Another prior art is to cool the fluid by distributing it parallel to the heat sources. In the parallel flow cooling technique, an equal temperature distribution can be achieved by distributing the fluid equally or very close to each heat source. The biggest disadvantage of the parallel structure is the possibility of not equal supply of the fluid equally to the heat sources. In addition, this distribution ratio changes depending on the flow rate change. Moreover, some manoeuvring space is needed on the cold plate for turning. Said manoeuvres correspond to the x and y distances shown in Figure 2. Distances x and at least 1 y are needed for the turning manoeuvre. The temperature and pressure relationship in parallel cooling can be expressed with the following equations.
P *tet=APs API
Afe ATI ~ te
Many problems can be experienced due to the area-volume problem, especially in the collection line of the fluid to the compact cold plates.
During search of the related art, application numbered CN209882442U is found. The application relates to a double-layer cooling system applied to the heat radiation of the module. In the application, a cooler with a cold bottom and top plate body and water channels used for heat distribution in its upper layer are mentioned. However, application does not disclose flaps for effective cooling. Additionally, it does not disclose any information on the use of the multi-layer structures to reduce the space and volume required for manoeuvrings.
As a result, due to above-described disadvantages and inadequacy of existing solutions it has been necessary to make development in the related art.
Object of the Invention
The invention inspired from existing situations aims to solve the disadvantages described above.
Primary object of the invention is to disclose a two-layer cooling system with enhanced performance by providing use of return fluid for both cooling purpose and without requiring need for an area needed to be spared on the plate for fluid return.
Object of the invention is to provide effective cooling by cooling heat sink in upper layer by help of heat source in the lower (second degree) layer and cooling heat source by heat sink in upper layer (first degree).
Object of the invention is to adjust the flow resistance of the cold plates and to provide the pressure drop required for the even distribution of liquids by extending the way with the cooler channels located at the lower and upper part, instead of micro channels.
The structural and characteristic features and all advantages of the invention will be understood better in the figures given below and the detailed description by reference to the figures. Therefore, the assessment should be made based on the figures and taking into account the detailed descriptions.
Description of Figures
Figure 1 is an illustrative view of serial cooling cold plate of the prior art.
Figure 2 is an illustrative view of parallel cooling cold plate of the prior art.
Figure 3 is a detailed section view of two-layer cooling system of the invention.
Figure 4 is a side view of two-layer cooling system of the invention. Figure 5 is a detailed view of two-layer cooling system placed in order onto layered heat sink and cold plate of the invention.
Figure 6 is a top view of two-layer cooling system.
Figure 7 is an illustrative comparison of invention to the prior art analytically.
Description of Part References
1 . Plate a. Border spot
2. Heat source
3. Fluid channel
4. Distribution manifold
5. Accumulation manifold
6. Fluid inlet
7. Fluid outlet
8. 1 st degree heat sink
9. 2nd degree heat sink x, y: Distance between heat source (2) and cold plate (1) ending
T^;_L : Temperature at heat source (2) end l3 : Temperature at heat source (2) start
T^-x : Maximum temperature obtained with double layer heat sink Average temperature Inlet pressure value
Outlet pressure value
Tiri : Inlet temperature value
TSISt : Outlet temperature value
Detailed Description of the Invention
In this detailed description, the preferred embodiments of the invention have been described in a manner not forming any restrictive effect and only for purpose of better understanding of the matter. The invention relates to a two-layer cooling system comprising a layered heat sink containing 1 st degree heat sink (8) and 2nd degree heat sink (9) and a cold plate (1 ). 1 st degree heat sink (8) and 2nd degree heat sink (9) are used for effective cooling and for reducing area and volume required for manoeuvring in the cold plate (1 ).
The system comprises 1 st degree heat sink (8) located between fluid channels (3) containing fluid inlet (6), fluid outlet (7) and providing fluid to pass through the plate (1 ) and fluid channels (3) to ensure equal distribution, cooling heat source (2) to prevent high differences between temperature distribution occurring on heat source (2), 2nd degree heat sink (9) located between fluid channels (3) parallel to 1 st degree heat sink (8) and providing decrease in total temperature by cooling 1 st degree heat sink (8).
While border point (a) is the point where the temperature is the highest, complex flowing arising from returning bringing the heat transfer coefficient h (W/m2K) value from the value inside the fluid channel (3) to very high values and thus enables a more effective cooling.
High differences in temperature distribution occurring on heat source (2) enables the return fluid to cool 1 st degree heat sink (8) and to have uniform distribution of temperature. While 1 st degree heat sink (8) cools heat source (2) in layer heat sink, 2nd degree heat sink (9) cools 1 st degree heat sink (8) and reduces total heating. In addition, 2nd degree heat sink (9) provides decrease in additional pressure required for more regular performance of fluid distribution needed for parallel cooling.
In a preferred embodiment of the invention, since 2nd degree heat sink (9) cools 1 st degree heat sink (8), when cooling is no enough, there can be various patterns organizing return line and meanwhile cooling of an amount.
Figure 5 shows total eight heat sources (2) and placement thereof on cold plate (1 ) and parallel distribution line in an illustrative view. Fluid inlet (6) and fluid outlet (7) are both located onto cold plate (1 ). Fluid enters from fluid inlet (6) and is distributed equally into heat sources (2) inside the plate (1 ). One of the most important requirements for equal distribution is that the pressure drop in the heat sinks (8, 9) must be much higher than the pressure drop in the distribution manifold (4). Thickness of the cold plate (1) increases a little in the area where heat source (2) is. However, as the increase is much less on the plate (1) than the thickness of electronics, it does not bring an additional load for the plate (1 ). While flow is towards heat sources (2) in distribution manifold (4), flow is from heat source (2) towards collection manifold (5) in the lower layer.
Figure 7 is a comparison of the system of the invention to the prior art. In single layer heat sink solutions, while heat change occurs monotonously along heat source, it is changed by the double layered cooling system of the invention. Monotonous increase breaks at a point and temperature values start to decrease. In addition, because of having 1 st degree heat sink (8) and 2nd degree heat sink (9) and fluid cools down both heat sinks (8, 9), maximum temperature values of average temperature values is lower when compared to single layer heat sink.
With the cooling system of the invention, x distance which is the distance between heat source (2) and the cold plate (1) is completely terminated. Thus, the problem of having heat source (2) at the endmost point and difficulty in returning is eliminated.

Claims

7
CLAIMS A two-layer cooling system, having fluid inlet (6), fluid outlet (7), providing equal distribution of fluid to heat sources (2) by passing through plate (1) into fluid channels (3), characterized by comprising:
• 1st degree heat sink (8), located between the fluid channels (3), cooling the heat source to prevent high heat distribution differences occurring on the heat source (2),
• 2nd degree heat sink (9), located between the fluid channels (3) and parallel to 1 st degree heat sink (8), and providing decrease in total temperature by cooling 1 st degree heat sink (8).
PCT/TR2023/050027 2022-01-14 2023-01-13 A two-layer cooling system WO2023136800A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR2022000473 2022-01-14
TR2022/000473 TR2022000473A1 (en) 2022-01-14 A TWO-LAYER COOLING SYSTEM

Publications (1)

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WO2023136800A1 true WO2023136800A1 (en) 2023-07-20

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6173758B1 (en) * 1999-08-02 2001-01-16 General Motors Corporation Pin fin heat sink and pin fin arrangement therein
US20020079087A1 (en) * 1999-08-06 2002-06-27 Kambiz Vafai Two-layered micro channel heat sink, devices and systems incorporating same
WO2014092655A1 (en) * 2012-12-10 2014-06-19 Sieva, Podjetje Za Razvoj In Trženje V Avtomobilski Industriji, D.O.O. Advanced heat exchanger with integrated coolant fluid flow deflector
US20170181333A1 (en) * 2015-12-17 2017-06-22 Denso Corporation Power conversion apparatus
CN209882442U (en) * 2019-03-08 2019-12-31 毫厘机电(苏州)有限公司 Double-layer water-cooling radiator applied to heat dissipation of PET detector module
CN213424981U (en) * 2020-10-15 2021-06-11 哈尔滨理工大学 Double-layer complex staggered structure micro-channel heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6173758B1 (en) * 1999-08-02 2001-01-16 General Motors Corporation Pin fin heat sink and pin fin arrangement therein
US20020079087A1 (en) * 1999-08-06 2002-06-27 Kambiz Vafai Two-layered micro channel heat sink, devices and systems incorporating same
WO2014092655A1 (en) * 2012-12-10 2014-06-19 Sieva, Podjetje Za Razvoj In Trženje V Avtomobilski Industriji, D.O.O. Advanced heat exchanger with integrated coolant fluid flow deflector
US20170181333A1 (en) * 2015-12-17 2017-06-22 Denso Corporation Power conversion apparatus
CN209882442U (en) * 2019-03-08 2019-12-31 毫厘机电(苏州)有限公司 Double-layer water-cooling radiator applied to heat dissipation of PET detector module
CN213424981U (en) * 2020-10-15 2021-06-11 哈尔滨理工大学 Double-layer complex staggered structure micro-channel heat sink

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