WO2023134415A1 - 车载网关印制电路板 - Google Patents

车载网关印制电路板 Download PDF

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Publication number
WO2023134415A1
WO2023134415A1 PCT/CN2022/140601 CN2022140601W WO2023134415A1 WO 2023134415 A1 WO2023134415 A1 WO 2023134415A1 CN 2022140601 W CN2022140601 W CN 2022140601W WO 2023134415 A1 WO2023134415 A1 WO 2023134415A1
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WO
WIPO (PCT)
Prior art keywords
chip
layer
circuit board
printed circuit
vehicle
Prior art date
Application number
PCT/CN2022/140601
Other languages
English (en)
French (fr)
Inventor
赵晓雪
赵目龙
宋金海
王祎帆
王宗罡
于继成
赵楠楠
王泽尉
Original Assignee
中国第一汽车股份有限公司
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Filing date
Publication date
Application filed by 中国第一汽车股份有限公司 filed Critical 中国第一汽车股份有限公司
Publication of WO2023134415A1 publication Critical patent/WO2023134415A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/66—Arrangements for connecting between networks having differing types of switching systems, e.g. gateways
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/16—Gateway arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces

Definitions

  • the present application relates to the technical field of printed circuit board design, for example, relates to a printed circuit board of a vehicle-mounted gateway.
  • Printed circuit boards also known as printed circuit boards, printed circuit boards, referred to as printed circuit boards (PCB) or (printed wiring boards, PWB), use insulating boards as the base material, cut to a certain size, on which at least It is attached with a conductive pattern and has holes (such as component holes, fastening holes or metallized holes, etc.), which are used to replace the chassis of electronic components installed in the past and realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called “printed" circuit boards.
  • the vehicle-mounted gateway printed circuit board in the related art not only has an unreasonable layout and requires a large printed circuit board area, but also has the technical problem of high cost in designing the vehicle-mounted gateway printed circuit board.
  • the application provides a vehicle-mounted gateway printed circuit board, which can realize a more reasonable layout of the vehicle-mounted gateway printed circuit board and has a smaller structural volume, thereby achieving the technical effect of reducing the cost of the vehicle-mounted gateway printed circuit board.
  • An embodiment of the present application provides a vehicle-mounted gateway printed circuit board, which includes: a component layer and a circuit layer, wherein the component layer is provided with a plurality of components of the vehicle-mounted gateway printed circuit board; the circuit layer The communication lines between the multiple components of the printed circuit board of the vehicle gateway are laid; the multiple components in the component layer communicate based on the communication lines in the line layer.
  • FIG. 1 is a schematic diagram of the structure of each layer of a vehicle-mounted gateway printed circuit board provided in Embodiment 1 of the present application;
  • FIG. 2 is a schematic structural diagram of a component layer of a vehicle-mounted gateway printed circuit board provided in Embodiment 2 of the present application;
  • FIG. 3A is a structural example diagram of a connector and a communication chipset in the component layer of a vehicle-mounted gateway printed circuit board provided in Embodiment 2 of the present application;
  • FIG. 3B is a structural example diagram of a connector and a communication chipset in another vehicle-mounted gateway printed circuit board component layer provided in Embodiment 2 of the present application;
  • FIG. 3C is a structural example diagram of a connector and a communication chipset in another vehicle-mounted gateway printed circuit board component layer provided in Embodiment 2 of the present application;
  • FIG. 3D is a structural example diagram of a connector and a communication chipset in another vehicle-mounted gateway printed circuit board component layer provided in Embodiment 2 of the present application;
  • Fig. 4 is a schematic structural diagram of communication between each chip of a vehicle-mounted gateway printed circuit board and a system-level chip provided by Embodiment 3 of the present application;
  • FIG. 5 is a schematic structural diagram of communication between chips of a vehicle-mounted gateway printed circuit board Switch provided in Embodiment 3 of the present application.
  • Embodiment 1 of the present application provides a vehicle-mounted gateway printed circuit board. This embodiment is applicable to the situation where the vehicle-mounted gateway printed circuit board is connected to the vehicle-mounted Ethernet.
  • the vehicle-mounted gateway printed circuit board specifically includes the following structures: a component layer and a circuit layer, wherein the component layer is provided with a plurality of components of the vehicle-mounted gateway printed circuit board; A communication line between multiple components; multiple components in the component layer communicate based on the communication line in the line layer.
  • multiple components of the printed circuit board of the vehicle gateway can be arranged on the component layer.
  • multiple components set on the component layer can be set according to actual requirements.
  • Communication lines of multiple components may be pre-laid on the line layer, wherein the communication lines laid on the line layer may include high-speed signal lines, low-speed signal lines and lines made of copper.
  • the high-speed signal lines may include differential signal lines and single-ended signal lines.
  • the positional relationship between the component layer and the circuit layer may be a superposition relationship.
  • the number of component layers can be one or two.
  • the number of circuit layers can be two or more.
  • the communication lines between multiple components of the printed circuit board of the vehicle gateway laid on the line layer are not allowed to be split across.
  • a plurality of components are preliminarily arranged on the component layer of the vehicle gateway printed circuit board, and communication lines among the multiple components of the vehicle gateway printed circuit board are laid in advance on the circuit layer. Multiple components in the component layer of the vehicle gateway printed circuit board can communicate based on the communication lines in the line layer.
  • the component layer may be at least one of the top layer and the bottom layer of the vehicle gateway printed circuit board. If the number of components is small, the component layer of the printed circuit board of the vehicle gateway can be located on the top layer 1 or the bottom layer 2 of the printed circuit board of the vehicle gateway. Referring to Figure 1, if the number of components is large, the component layers can be the top layer 1 and the bottom layer 2 of the vehicle gateway printed circuit board. In an embodiment, when the component layers are the top layer 1 and the bottom layer 2 of the printed circuit board of the vehicle gateway, components with smaller volumes can be arranged on the bottom layer 2 of the components. In an embodiment, if the component layer includes the top layer 1 and the bottom layer 2 of the printed circuit board of the vehicle gateway, the circuit layer is located at the middle layer 3 between the top layer 1 and the bottom layer 2 .
  • the line layer includes a power layer and a signal layer; wherein, the power layer is configured to lay power transmission lines to transmit the connected power to each component; the signal layer is configured to lay A signal transmission line between multiple components.
  • the line layer may include a power layer and a signal layer.
  • the power supply layer may be pre-laid with a power transmission line, wherein the power transmission line may be understood as a line made of copper.
  • the power layer may be a copper layer.
  • the number of power supply layers can be one or more layers.
  • the signal layer can pre-lay signal transmission lines between multiple components. Wherein, the signal transmission lines may include high-speed signal lines and low-speed signal lines. The number of signal layers can be one or more.
  • the benefit of the circuit layer including the power layer is that: since the power layer is laid with a whole piece of copper film, the power layer can not only serve as a plane layer support, but also provide external power through the power layer for components in the component layer. Multiple components are powered.
  • the advantage of the circuit layer including the signal layer is that the signal layer can facilitate the communication connection between multiple components because the signal transmission lines between multiple components are laid on the signal layer.
  • the advantage of the line layer including the power layer and the signal layer is to increase the transmission speed of the signal, thereby improving the communication efficiency of each component in the component layer.
  • the vehicle-mounted gateway printed circuit board may further include a ground layer, wherein the ground layer may be understood as a plane layer, and the layer may be composed of a whole piece of copper film.
  • the advantage of setting the ground layer on the printed circuit board of the vehicle gateway is that it can not only be used as an intermediate layer to provide a stable characteristic impedance for the signal, so that the characteristic impedance of the entire signal transmission line will not change with the extension of the line, but also when the ground layer and When the component layers are adjacent, the formation can also provide a complete reference plane for the component layers.
  • An embodiment of the present application provides a vehicle-mounted gateway printed circuit board.
  • the circuit board includes a component layer and a circuit layer, wherein the component layer is provided with multiple components of the vehicle-mounted gateway printed circuit board; the circuit layer is laid with a vehicle-mounted gateway printed circuit board. Controls the communication lines between multiple components of the board; each component in the component layer communicates based on the communication lines in the line layer.
  • the technical solution of the embodiment of the present application solves the problem that the vehicle-mounted gateway printed circuit board in the related art not only has an unreasonable layout and requires a large printed circuit board area, but also has a relatively high cost of designing the vehicle-mounted gateway printed circuit board. To solve the technical problems, a more reasonable layout of the printed circuit board of the vehicle gateway is realized, and the structure of the circuit board is smaller, so as to achieve the technical effect of reducing the cost of the printed circuit board of the vehicle gateway.
  • Fig. 2 is a schematic diagram of the component layer structure of a vehicle-mounted gateway printed circuit board provided in Embodiment 2 of the present application.
  • each component of the component layer of the vehicle-mounted gateway printed circuit board includes: At least two connectors 210 on the side of the component layer, a communication chipset 220 disposed on the working surface of the component layer and adjacent to the connector side, and a communication chip set 220 disposed on the working surface of the component layer and away from the side of the connector SoC 230 and memory chipset 240 .
  • each component in the component layer may include a connector 210 , a communication chipset 220 , a SoC 230 and a storage chipset 240 .
  • the number of connectors 210 can be two or more.
  • the position of each connector 210 can be set on the side of the component layer. In one embodiment, the position of each connector 210 can be set on the left side (see FIG. 3A ) and the right side (see FIG. 3B ) of the component layer. , the upper side (see Figure 3C) or the lower side (see Figure 3D).
  • the type of the connector may be a Gigabit dedicated connector or a 100M dedicated connector.
  • the position of the communication chipset 220 can be set on the working surface of the component layer and adjacent to one side of the connector.
  • the communication chipset 220 may include one or more chips for communication.
  • the SoC 230 may be a central gateway SoC.
  • the system-on-a-chip 230 may be obtained by chip packaging technology based on a PCB with a ball grid array (Ball Grid Array, BGA) structure.
  • the memory chipset 240 may include one or more memory chips. The position of the SoC 230 and the memory chipset 240 can be set on the working surface of the component layer and away from the side of the connector.
  • the fan-out mode of the SoC 230 may be fan-out to the surroundings respectively.
  • the outermost two circles of pads can choose to pull out the wires on the top layer and then drill holes.
  • each component on the working surface of the component layer may further include a plurality of power chips, a plurality of resistors and capacitors, and circuits.
  • the circuit may include a power supply protection circuit, a filter circuit and other circuits.
  • the power chip may include one or more power management chips.
  • the communication chipset 220 includes a low-speed communication chipset 221 and at least one high-speed communication chipset 222, wherein the low-speed communication chipset 221 and the high-speed communication chipset 222 are arranged vertically or horizontally. cloth.
  • the communication chipset 220 may include a low-speed communication chipset 221 and a high-speed communication chipset 222 , wherein the number of the high-speed communication chipset 222 may be one or more than one.
  • the arrangement of the low-speed communication chipset 221 and the high-speed communication chipset 222 can be arranged vertically.
  • the low-speed communication chipset 221 and the high-speed communication chipset 222 can be vertically arranged, and the low-speed communication chipset 221 is located above the high-speed communication chipset 222 .
  • FIG. 3B when the connector 210 is arranged on the right side of the component layer, the low-speed communication chipset 221 and the high-speed communication chipset 222 can be vertically arranged, and the low-speed communication chipset 221 is located below the high-speed communication chipset 222 .
  • the low-speed communication chipset 221 and the high-speed communication chipset 222 when the connector 210 is arranged on the upper side of the component layer, the low-speed communication chipset 221 and the high-speed communication chipset 222 can be arranged horizontally, and the low-speed communication chipset 221 is located on the left of the high-speed communication chipset 222.
  • 3D when the connector 210 is disposed on the lower side of the component layer, the low-speed communication chipset 221 and the high-speed communication chipset 222 can be arranged horizontally, and the low-speed communication chipset 221 is located on the right of the high-speed communication chipset 222 .
  • the low-speed communication chipset 221 includes a LIN chip 10 and the CAN chip 11
  • the high-speed communication chipset 222 includes a Switch chip 20 and two PHY chips 21, and the Switch chip and the two PHY chips are in the shape of a "pin". structure arrangement.
  • the low-speed communication chipset 211 may include a LIN chip 10 and a CAN chip 11 , wherein the number of the LIN chip 10 may be one or more, and the number of the CAN chip 11 may be more than one. Since the LIN chip 10 and the CAN chip 11 are small in size, when the component layer includes the top layer and the bottom layer of the vehicle gateway printed circuit board, the LIN chip 10 and the CAN chip 11 can be arranged on the top layer and the bottom layer according to actual needs.
  • the LIN chip 10 and the CAN chip 11 can be set according to actual needs, and are not specifically limited here.
  • the high-speed communication chipset 222 may include a Switch chip 20 and two PHY chips 21 , wherein the Switch chip 20 and the two PHY chips 21 may be arranged in a "pin” structure.
  • the structural arrangement of the character “pin” can be understood as the result of the arrangement obtained by rotating the character “pin”.
  • the high-speed communication chipset 222 is arranged on the working surface of the component layer and adjacent to the connector. side of the plug-in.
  • the memory chipset 240 may include an EMMC chip 40 , wherein the EMMC chip 40 is arranged adjacent to the LIN chip 11 .
  • the SoC 230 may be arranged adjacent to the EMMC chip 40 .
  • the storage chipset 240 may further include an LPDD4 chip 41 and a FLASH chip 42 , wherein the LPDD4 chip 41 and the FLASH chip 42 are arranged around the SoC 230 .
  • the EMMC chip 40 may be an EMMC chip packaged as FPGA-153.
  • the LPDD4 chip 41 may be an LPDD4 chip packaged as WFBGA200.
  • the LPDD4 chip 41 and the FLASH chip 42 are arranged around the system-on-chip 230, and the LPDD4 chip 41 and the FLASH chip 42 can be arranged on the left side or the top of the system-on-chip 230, or the LPDD4 chip 41 can be arranged on the system-on-a-chip.
  • the FLASH chip 42 is arranged on the top of the SoC 230, or, the LPDD4 chip 41 can be arranged on the top of the SoC 230, and the FLASH chip 42 is arranged on the left side of the SoC 230 side.
  • the EMMC chip 40 , the LPDD4 chip 41 and the FLASH chip 42 can communicate based on high-speed signal lines in the line layer.
  • each component in the component layer also includes: a power supply chip 250, a power supply circuit 260 and a power supply management chip 270; wherein, the power supply chip 250 is adjacent to the FLASH chip 42 and the CAN chip 11 respectively Arrangement: the power circuit 260 is arranged adjacent to the power chip 250 , the CAN chip 11 and the connector; the power management chip 270 is arranged adjacent to the system-on-chip 230 and the high-speed communication chipset 222 .
  • the power circuit 260 may include a power protection circuit and a filter circuit.
  • the power management chip 270 needs to be arranged adjacent to the SoC 230 and the high-speed communication chipset 222 .
  • the power chip 250 needs to supply power for the EMMC chip 40, the FLASH chip 42, the LPDD4 chip 41, the CAN chip 11, and the LIN chip 10. Therefore, it is necessary to arrange the power chip 250 adjacent to the FLASH chip 42 and the CAN chip 11 respectively. cloth.
  • each component of the component layer of the vehicle-mounted gateway printed circuit board includes at least two connectors arranged on the side of the component layer, and two connectors arranged on the working surface of the component layer and adjacent to the connector.
  • Embodiment 3 of the present application provides a vehicle-mounted gateway printed circuit board, wherein technical terms that are the same as or corresponding to those in the above embodiment will not be repeated here.
  • the vehicle-mounted gateway printed circuit board in an embodiment of the present application adopts ten-layer board stacking.
  • the first layer and the tenth layer may respectively be component layers.
  • the third layer, the fourth layer, the fifth layer, the sixth layer and the eighth layer are circuit layers, among which the third, sixth and eighth layers are signal layers, and the fourth and fifth layers are power layer .
  • the second, seventh and ninth floors are strata.
  • the first layer can be understood as the top layer
  • the tenth layer can be understood as the bottom layer.
  • the design principle of the ten-layer board stacking in the embodiment of the present application may be a symmetrical principle.
  • the symmetry of the ten-layer board stack can be embodied in that: the first layer and the tenth layer are symmetrical, and are component layers respectively.
  • the second and ninth floors are symmetrical and are respectively strata.
  • the third layer and the eighth layer are symmetrical, and are signal layers respectively.
  • the fourth layer is the power layer, and the seventh layer is the ground layer.
  • the power layer and the ground layer are respectively laid with a whole piece of copper film
  • the power layer can be a plane layer
  • the ground layer can also be a plane layer
  • the fourth layer can be symmetrical to the seventh layer.
  • the fifth layer is the power layer
  • the sixth layer is the signal layer.
  • a small amount of communication lines and a large area of copper film are laid on the signal layer of the sixth layer. Therefore, the signal layer of the sixth layer has a higher flatness , and then the fifth layer can be symmetrical to the sixth layer.
  • each component in the component layer of the vehicle gateway printed circuit board of this embodiment may include: at least two connectors 210 arranged on the right side of the component layer, arranged on the working surface of the component layer and adjacent to The communication chipset 220 on one side of the connector, the SoC 230 and the storage chipset 240 on the working surface of the component layer away from the connector.
  • the at least two connectors 210 arranged on the right side of the component layer may include a connector connected to an external power supply, that is, the connector connected to an external power supply is used as a main connector.
  • the communication chipset 220 may include a low-speed communication chipset 221 and at least one high-speed communication chipset 222, wherein the low-speed communication chipset 221 and the high-speed communication chipset 222 are vertically arranged, and the low-speed communication chipset 221 The position is above the position where the high-speed communication chipset 222 is located.
  • the high-speed communication chipset 222 can be understood as an Ethernet load.
  • the SoC 230 can be arranged on the upper left of the Ethernet load.
  • the low-speed communication chipset 211 may include a LIN chip 10 and a CAN chip 11 , wherein the LIN chip 10 and the CAN chip 11 are vertically arranged, and the LIN chip 10 is located below the CAN chip 11 .
  • the high-speed communication chipset 222 may include a Switch chip 20 and two PHY chips 21 , wherein the Switch chip 20 and the two PHY chips 21 may be arranged in an inverted "pin" shape.
  • the arrangement of multiple Switch chips 20 can be arranged vertically or horizontally. In the embodiment of the present application, as shown in FIG. 2 , the arrangement of a plurality of Switch chips 20 may be a longitudinal arrangement. Because the Switch chip 20 needs to communicate with the two PHY chips 21 corresponding to the Switch chip 20 through the simplified Gbit MII signal and the serial Gbit MII signal respectively, therefore, the Switch chip 20 and the two PHY chips 21 It can be arranged in an inverted "pin" structure.
  • RGMII Reduced Gigabit Media Independent Interface
  • the reason why the Switch chip 20 and the two PHY chips 21 can be arranged in an inverted "pin" structure in an embodiment of the present application is that the connection between the Switch chip 20 and the two PHY chips 21 .
  • the memory chipset 240 may include an EMMC chip 40 .
  • the position of the EMMC chip 40 is located on the left side of the LIN chip 10 and above the PHY chip.
  • the SoC 230 can be located on the left side of the EMMC chip 40 .
  • the storage chipset 240 may further include an LPDD4 chip 41 and a FLASH chip 42 .
  • the LPDD4 chip 41 may be located on the left of the SoC 230 .
  • the FLASH chip 42 may be located above the SoC 230 .
  • the signal transmission lines corresponding to the LPDD4 chip 41 may include address lines and signal lines, the signal transmission lines corresponding to the LPDD4 chip 41 need to be laid on the third and eighth layers of the vehicle gateway printed circuit board.
  • the signal transmission line corresponding to the EMMC chip 40 can be laid on the sixth layer of the vehicle gateway printed circuit board, and the equal-length error of the signal transmission line needs to be controlled within 25mil.
  • the SoC 230 has a large number of filter capacitors.
  • the filter capacitors of the SoC 230 can be arranged on the tenth layer of the printed circuit board of the vehicle gateway.
  • the filter capacitor of the SoC 230 may be packaged based on a preset package size. It should be noted that the preset package size is not specifically limited here, and the package size can be selected according to actual needs, and the preset package size can be 0402 package size, 0603 package size or 0805 package size.
  • the filter capacitor can be placed adjacent to the pins of each chip, and the capacitance values of the filter capacitors can be arranged around the pins of each chip in ascending order.
  • each component in the component layer of the printed circuit board of the vehicle gateway may further include a power chip 250 , a power circuit 260 and a power management chip 270 .
  • the power chip 250 may be located above the FLASH chip 42 .
  • the power circuit 260 may be located above the CAN chip 11 and on the left side of the connector 210 .
  • the power management chip 270 can be located on the left of the high-speed communication chipset 222 and below the SoC 230 .
  • each component in the component layer of the printed circuit board of the vehicle gateway may further include a crystal oscillator, which may be understood as a crystal oscillator.
  • a crystal oscillator which may be understood as a crystal oscillator.
  • the advantage of having a crystal oscillator in the component layer is that the crystal oscillator generates a highly stable signal, which can convert the voltage into a corresponding frequency signal and send it to a variety of signal processing chips on the printed circuit board of the vehicle gateway.
  • the technical solution of the embodiment of the present application solves the problem that the vehicle-mounted gateway printed circuit board in the related art not only has an unreasonable layout and requires a large printed circuit board area, but also has a relatively high cost of designing the vehicle-mounted gateway printed circuit board.
  • a more reasonable layout of the printed circuit board of the vehicle gateway is realized, and the structure of the circuit board is smaller, so as to achieve the technical effect of reducing the cost of the printed circuit board of the vehicle gateway.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

一种车载网关印制电路板，该电路板包括：组件层和线路层，其中，所述组件层设置有车载网关印制电路板的多个组件；所述线路层铺设有车载网关印制电路板的多个组件之间的通信线路；所述组件层中的多个组件基于所述线路层中的通信线路进行通信。

Description

车载网关印制电路板
本申请要求申请日为2022年1月12日、申请号为202210030464.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及印制电路板设计技术领域，例如涉及一种车载网关印制电路板。
背景技术
印制电路板，又称印刷电路板、印刷线路板，简称印制板(printed circuit boards，PCB)或(printed wiring boards,PWB)，以绝缘板为基材，切成一定尺寸，其上至少附有一个导电图形，并布有孔(如元件孔、紧固孔或金属化孔等)，用来代替以往装置电子元器件的底盘，并实现电子元器件之间的相互连接。由于这种板是采用电子印刷术制作的，故被称为“印刷”电路板。
相关技术中的车载网关印制电路板不仅存在布局不合理且需要较大的印制电路板面积，而且设计车载网关印制电路板还存在的成本较高的技术问题。
发明内容
本申请提供了一种车载网关印制电路板，能够实现车载网关印制电路板更加合理的布局且该电路板结构体积较小，从而达到降低车载网关印制电路板成本的技术效果。
本申请一实施例提供了一种车载网关印制电路板，该电路板包括：组件层和线路层，其中，所述组件层设置有车载网关印制电路板的多个组件；所述线路层铺设有车载网关印制电路板的多个组件之间的通信线路；所述组件层中的多个组件基于所述线路层中的通信线路进行通信。
附图说明
图1是本申请实施例一提供的一种车载网关印制电路板的各层结构示意图；
图2是本申请实施例二提供的一种车载网关印制电路板的组件层的结构示意图；
图3A是本申请实施例二提供的一种车载网关印制电路板的组件层中接插件和通讯芯片组的结构示例图；
图3B是本申请实施例二提供的另一种车载网关印制电路板的组件层中接插件和通讯芯片组的结构示例图；
图3C是本申请实施例二提供的又一种车载网关印制电路板的组件层中接插件和通讯芯片组的结构示例图；
图3D是本申请实施例二提供的再一种车载网关印制电路板的组件层中接插件和通讯芯片组的结构示例图；
图4是本申请实施例三提供的一种车载网关印制电路板各芯片与***级芯片通讯的结构示意图；
图5是本申请实施例三提供的一种车载网关印制电路板Switch芯片间通讯的结构示意图。
具体实施方式
实施例一
本申请实施例一提供的一种车载网关印制电路板。本实施例可适用于通过该车载网关印制电路板连接车载以太网的情况。该车载网关印制电路板具体包括以下结构：组件层和线路层，其中，所述组件层设置有车载网关印制电路板的多个组件；所述线路层铺设有车载网关印制电路板的多个组件之间的通信线路；所述组件层中的多个组件基于所述线路层中的通信线路进行通信。
其中，组件层上可以设置有车载网关印制电路板的多个组件。其中，组件层上设置的多个组件可以根据实际需求设置。线路层上可以预先铺设多个组件的通信线路，其中，线路层上所铺设的通信线路可以包括高速信号线路、低速信号线路以及以铜为材质的线路。其中，高速信号线路可以包括差分信号线路和单端信号线路。需要说明的是，组件层与线路层之间的位置关系可以是叠加关系。组件层的数量可以是一层或两层。线路层的数量可以是两层或两层以上。
在一实施例中，线路层铺设有车载网关印制电路板的多个组件之间的通信线路都不允许跨分割。
在一实施例中，预先在车载网关印制电路板的组件层设置多个组件，以及预先在线路层上铺设车载网关印制电路板的多个组件之间的通信线路。车载网关印制电路板的组件层中的多个组件可以基于线路层中的通信线路进行通信。
参见图1，组件层可以为车载网关印制电路板的顶层和底层中的至少一个。如果组件的数量较少，车载网关印制电路板的组件层可以为位于车载网关印制电路板的顶层1或底层2。参见图1，如果组件的数量较多，组件层可以为车载网关印制电路板的顶层1和底层2。在一实施例中，当组件层为车载网关印制电路板的顶层1和底层2，则可以将体积较小的组件设置在组件的底层2。在一实施例中，如果组件层包括车载网关印制电路板的顶层1和底层2，那么线路层位于顶层1和底层2之间的中间层3。
在一实施例中，所述线路层包括电源层和信号层；其中，所述电源层设置为铺设电源传输线路，以将接入的电源传输至每个组件；所述信号层，设置为铺设多个组件之间的信号传输线路。
其中，线路层可以包括电源层和信号层。电源层可以预先铺设电源传输线路，其中，电源传输线路可以理解为以铜为材质的线路。在一实施例中，电源层可以是铜层。电源层的数量可以是一层或多层。信号层可以预先铺设多个组件之间的信号传输线路。其中，信号传输线路可以包括高速信号线路和低速信号线路。信号层的数量可以是一层或多层。
在一实施例中，线路层包括电源层的好处在于：由于电源层铺设的是整片铜膜，因此电源层不仅可以作为平面层支撑，还可以将外接的电源通过电源层为组件层中的多个组件供电。线路层包括信号层的好处在于：由于多个组件之间的信号传输线路铺设在信号层，因此信号层可以便于多个组件之间的通信连接。线路层包括电源层和信号层的好处在于提高信号的传输速度，从而提升组件层中各个组件的通讯效率。
在一实施例中，车载网关印制电路板还可以包括地层，其中，地层可以理解为平面层，该层可以由整片铜膜构成。在车载网关印制电路板设置地层的好处在于不仅可以作为中间层为了给信号提供稳定的特性阻抗，让一整条信号传输线路的特性阻抗不会随着线的延伸而变化，而且当地层与组件层相邻时，地层还可以为组件层提供一个完整的参考平面。
本申请一实施例提供了一种车载网关印制电路板，该电路板包括组件层和线路层，其中，组件层设置有车载网关印制电路板的多个组件；线路层铺设有车载网关印制电路板的多个组件之间的通信线路；组件层中的每个组件基于线路层中的通信线路进行通信。本申请实施例的技术方案，解决了相关技术中的车载网关印制电路板不仅存在布局不合理且需要较大的印制电路板面积，而且 设计车载网关印制电路板还存在的成本较高的技术问题，实现了车载网关印制电路板更加合理的布局且该电路板结构体积较小，从而达到降低车载网关印制电路板成本的技术效果。
实施例二
图2是本申请的实施例二提供的一种车载网关印制电路板的组件层结构示意图，在前述实施例的基础上，该车载网关印制电路板的组件层的每一组件包括：设置于组件层侧边的至少两个接插件210、设置于组件层的工作面上且邻近接插件的一侧的通讯芯片组220、设置于组件层的工作面上且远离接插件的一侧的***级芯片230和存储芯片组240。
其中，组件层中的每一组件可以包括接插件210、通讯芯片组220、***级芯片230和存储芯片组240。接插件210的数量可以是两个或两个以上。每一接插件210的位置可以设置在组件层的侧边，在一实施例中，每一接插件210的位置可以设置于组件层的左侧(参见图3A)、右侧(参见图3B)、上侧(参见图3C)或下侧(参见图3D)。在一实施例中，接插件的类型可以是千兆专用接插件或百兆专用接插件。
其中，通讯芯片组220的位置可以设置在组件层的工作面上且邻近接插件的一侧。通讯芯片组220可以包括一个或多个用于通讯的芯片。***级芯片230可以是中央网关***级芯片。在一实施例中，***级芯片230可以是基于球栅阵列(Ball Grid Array，BGA)结构的PCB的芯片封装技术得到的。存储芯片组240可以包括一个或多个存储芯片。***级芯片230和存储芯片组240的位置可以设置在组件层的工作面上且远离接插件的一侧。
本申请一实施例中***级芯片230的扇出方式可以是分别向四周做扇出。最***的两圈焊盘可以选择在顶层把线拉出后再打过孔。
在一实施例中，组件层的工作面上的每一组件还可以包括多个电源芯片、多个电阻电容以及电路。其中，所述电路可以包括电源保护电路、滤波电路以及其他电路。其中，电源芯片可以包括一个或多个电源管理芯片。
在一实施例中，所述通讯芯片组220包括低速通讯芯片组221和至少一个高速通讯芯片组222，其中，所述低速通讯芯片组221和所述高速通讯芯片组222纵向排布或横向排布。
其中，通讯芯片组220可以包括低速通讯芯片组221和高速通讯芯片组222， 其中，高速通讯芯片组222的数量可以是一个或一个以上。低速通讯芯片组221和高速通讯芯片组222的排布可以是纵向排布。
沿用图3A，当接插件210设置于组件层左侧，低速通讯芯片组221和高速通讯芯片组222可以是纵向排布，且低速通讯芯片组221位于高速通讯芯片组222的上方。沿用图3B，当接插件210设置与组件层右侧，低速通讯芯片组221和高速通讯芯片组222可以是纵向排布，且低速通讯芯片组221位于高速通讯芯片组222的下方。
沿用图3C，当接插件210设置于组件层上侧，低速通讯芯片组221和高速通讯芯片组222可以是横向排布，且低速通讯芯片组221位于高速通讯芯片组222的左方。沿用图3D当接插件210设置于组件层下侧，低速通讯芯片组221和高速通讯芯片组222可以是横向排布，且低速通讯芯片组221位于高速通讯芯片组222的右方。
在一实施例中，低速通讯芯片组221包括LIN芯片10和CAN芯片11，高速通讯芯片组222包括一个Switch芯片20以及两个PHY芯片21，Switch芯片与两个PHY芯片呈“品”字型结构排布。
其中，低速通讯芯片组211可以包括LIN芯片10和CAN芯片11，其中，LIN芯片10的数量可以是一个或多个，CAN芯片11的数量可以是多个。由于LIN芯片10和CAN芯片11体积较小，因此，当组件层包括车载网关印制电路板的顶层和底层时，则可以将LIN芯片10和CAN芯片11根据实际需要设置在顶层和底层。
本申请一实施例中，LIN芯片10和CAN芯片11可以根据实际需求设置，在此不做具体限定。
其中，如图2所示，高速通讯芯片组222可以包括一个Switch芯片20和两个PHY芯片21，其中，Switch芯片20与两个PHY芯片21可以呈“品”字型结构排布。其中，呈“品”字型结构排布可以理解为将“品”字进行旋转得到的排布结果，如，“品”字型结构排布可以是倒“品”字型，也可以是正“品”字型等。
在一实施例中，由于高速通讯芯片组222中的Switch芯片20和PHY芯片21的输出信号需要接到接插件210，因此，将高速通讯芯片组222设置于组件层的工作面上且邻近接插件的一侧。
在一实施例中，存储芯片组240可以包括EMMC芯片40，其中，EMMC芯片40与LIN芯片11邻近排布。在一实施例中，***级芯片230可以与EMMC芯片40邻近排布。在此基础上，存储芯片组240还可以包括LPDD4芯片41和FLASH芯片42，其中， LPDD4芯片41和FLASH芯片42排布于***级芯片230周围。
其中，EMMC芯片40可以是封装为FPGA-153的EMMC芯片。LPDD4芯片41可以是封装为WFBGA200的LPDD4芯片。LPDD4芯片41和FLASH芯片42排布于***级芯片230周围，可以是LPDD4芯片41和FLASH芯片42均排布于***级芯片230的左侧或上方，或者，可以是LPDD4芯片41排布于***级芯片230的左侧，FLASH芯片42排布于***级芯片230的上方，亦或者，可以是LPDD4芯片41排布于***级芯片230的上方，FLASH芯片42排布于***级芯片230的左侧。
在一实施例中，EMMC芯片40、LPDD4芯片41和FLASH芯片42可以基于线路层中的高速信号线路进行通信的。
在一实施例中，如图2所示，组件层中的每一组件还包括：电源芯片250、电源电路260以及电源管理芯片270；其中，电源芯片250分别与FLASH芯片42和CAN芯片11邻近排布；电源电路260与电源芯片250、CAN芯片11和接插件邻近排布；电源管理芯片270分别与***级芯片230和高速通讯芯片组222邻近排布。
其中，电源电路260可以包括电源保护电路和滤波电路。
在一实施例中，由于电源芯片250需要为***级芯片230和高速通讯芯片组222中多个芯片供电，因此，电源管理芯片270需要与***级芯片230和高速通讯芯片组222邻近排布。
在一实施例中，电源芯片250需要为EMMC芯片40、FLASH芯片42、LPDD4芯片41和CAN芯片11以及LIN芯片10供电，因此，需要将电源芯片250分别与FLASH芯片42和CAN芯片11邻近排布。
本申请的实施例的技术方案中，车载网关印制电路板的组件层的每一组件包括设置于组件层侧边的至少两个接插件、设置于组件层的工作面上且邻近接插件的一侧的通讯芯片组、设置于组件层的工作面上且远离接插件的一侧的***级芯片和存储芯片组。通过将至少两个接插件设置于组件层侧边，将通讯芯片组设置于组件层的工作面上且邻近接插件的一侧以及将***级芯片和存储芯片组设置于组件层的工作面上且远离接插件的一侧，解决了相关技术中的车载网关印制电路板存在布局不合理且需要较大的印制电路板面积的技术问题，实现了车载网关印制电路板更加合理的布局且该电路板结构体积较小，从而达到降低车载网关印制电路板成本的技术效果。
实施例三
本申请的实施例三提供了一种车载网关印制电路板，其中，与上述实施例相同或者相应的技术术语在此不再赘述。
本申请一实施例中的车载网关印制电路板采用十层板叠层。其中，第一层和第十层分别可以为组件层。第三层、第四层、第五层、第六层以及第八层为线路层，其中，第三层、第六层和第八层为信号层，第四层和第五层为电源层。第二层、第七层和第九层为地层。其中，第一层可以理解为顶层，第十层可以理解为底层。
为了使车载网关印制电路板的体积减小，本申请实施例中的十层板叠层的设计原则可以是对称原则。在一实施例中，十层板叠层的对称性具体可以体现在：第一层和第十层对称，且分别为组件层。第二层和第九层对称，分别为地层。第三层和第八层对称，且分别为信号层。第四层为电源层，第七层为地层，由于电源层和地层分别铺设整片铜膜，因此电源层可以是平面层，地层也可以是平面层，进而第四层可以和第七层对称。第五层为电源层，第六层为信号层，本申请实施例中，第六层的信号层铺设少量的通信线路以及大面积的铜膜，因此，第六层的信号层平整度较高，进而第五层可以和第六层对称。
沿用图2，本实施例的车载网关印制电路板的组件层中的每一组件可以包括：设置于组件层右侧边的至少两个接插件210，设置于组件层的工作面上且邻近接插件的一侧的通讯芯片组220，设置于组件层的工作面上且远离接插件的一侧的***级芯片230和存储芯片组240。
其中，设置于组件层右侧边的至少两个接插件210可以包括一个连接外接电源的接插件，即将连接外接电源的接插件作为主接插件。
在一实施例中，通讯芯片组220可以包括低速通讯芯片组221和至少一个高速通讯芯片组222，其中，低速通讯芯片组221和高速通讯芯片组222纵向排布，且低速通讯芯片组221的位置位于高速通讯芯片组222所在位置的上方。
其中，高速通讯芯片组222可以理解为以太网负载。
在一实施例中，由于以太网负载需要和***级芯片230进行通讯(参见图4)，因此可以将***级芯片230设置在以太网负载的左上方。
在一实施例中，低速通讯芯片组211可以包括LIN芯片10和CAN芯片11，其中，LIN芯片10和CAN芯片11纵向排布，且LIN芯片10的位置位于CAN芯片11的下方。
在一实施例中，高速通讯芯片组222可以包括一个Switch芯片20和两个PHY芯片21，其中，Switch芯片20与两个PHY芯片21可以呈倒“品”字型结构排布。
在一实施例中，由于Switch芯片1和其他Switch芯片2需要通过精简吉比特介质独立接口信号(RGMII)进行通讯(参见图5)，因此，多个Switch芯片20的排布可以纵向或横向排布，本申请实施例中，如图2所示，多个Switch芯片20的排布可以是纵向排布。由于Switch芯片20需要与该Switch芯片20所对应的两个PHY芯片21分别通过精简吉比特介质独立接口信号和串行吉比特媒体独立接口信号进行通讯，因此，Switch芯片20与两个PHY芯片21可以呈倒“品”字型结构排布。
在一实施例中，本申请一实施例中Switch芯片20与两个PHY芯片21可以呈倒“品”字型结构排布的原因在于Switch芯片20分别与两个PHY芯片21之间的连线。
在一实施例中，如图2所示，存储芯片组240可以包括EMMC芯片40。其中，EMMC芯片40的位置位于LIN芯片10的左侧以及PHY芯片的上方。在此基础上，***级芯片230可以位于EMMC芯片40左侧。在此基础上，存储芯片组240还可以包括LPDD4芯片41和FLASH芯片42。其中，LPDD4芯片41可以位于***级芯片230的左方。FLASH芯片42可以位于***级芯片230的上方。
由于LPDD4芯片41所对应的信号传输线路可以包括地址线和信号线，因此需要将LPDD4芯片41所对应的信号传输线路需要铺设在车载网关印制电路板的第三层和第八层。
为了便于线路的管理，可以将EMMC芯片40所对应的信号传输线路铺设在车载网关印制电路板的第六层，且信号传输线路的等长误差需要控制在25mil以内。
在一实施例中，***级芯片230的滤波电容数量较多，为了减小电路板结构体积，可以将***级芯片230的滤波电容设置于车载网关印制电路板的第十层。在一实施例中，为了便于滤波电容的管理可以基于预设封装尺寸对***级芯片230的滤波电容进行封装处理。需要说明的是，预设封装尺寸在此不做具体限定，可以根据实际需要选择封装尺寸，预设封装尺寸可以是0402封装尺寸、0603封装尺寸或0805封装尺寸。
在一实施例中，滤波电容可以邻近在每个芯片引脚放置，且滤波电容的电容值可以按照由小到大的顺序排布在每个芯片的引脚周围。
在此基础上，车载网关印制电路板的组件层中的每一组件还可以包括电源芯片250、电源电路260以及电源管理芯片270。其中，电源芯片250可以位于FLASH芯片42的上方。电源电路260可以位于CAN芯片11的上方且位于接插件210的左侧。电源管理芯片270可以位于高速通讯芯片组222的左方且位于***级芯片230的 下方。
在一实施例中，车载网关印制电路板的组件层中的每一组件还可以包括晶振，晶振可以理解为晶体振荡器。在组件层中设置有晶振的好处在于晶振产生高度稳定的信号，可以将电压转换为相应的频率信号输送给车载网关印制电路板的多种信号处理芯片。
本申请实施例的技术方案，解决了相关技术中的车载网关印制电路板不仅存在布局不合理且需要较大的印制电路板面积，而且设计车载网关印制电路板还存在的成本较高的技术问题，实现了车载网关印制电路板更加合理的布局且该电路板结构体积较小，从而达到降低车载网关印制电路板成本的技术效果。

Claims (10)

  1. 一种车载网关印制电路板，包括：组件层和线路层，其中，
    所述组件层设置有车载网关印制电路板的多个组件；所述线路层铺设有车载网关印制电路板的多个组件之间的通信线路；所述组件层中的多个组件基于所述线路层中的通信线路进行通信。
  2. 根据权利要求1所述的车载网关印制电路板，其中，所述线路层包括电源层和信号层；其中，所述电源层，设置为铺设电源传输线路，以将接入的电源传输至各个组件；及所述信号层，设置为铺设多个组件之间的信号传输线路。
  3. 根据权利要求1所述的车载网关印制电路板，其中，所述组件层中的每一组件包括：设置于所述组件层侧边的至少两个接插件、设置于所述组件层的工作面上且邻近所述接插件的一侧的通讯芯片组、设置于所述组件层的工作面上且远离所述接插件的一侧的***级芯片和存储芯片组。
  4. 根据权利要求3所述的车载网关印制电路板，其中，所述通讯芯片组包括低速通讯芯片组和至少一个高速通讯芯片组，其中，所述低速通讯芯片组和所述高速通讯芯片组纵向或横向排布。
  5. 根据权利要求4所述的车载网关印制电路板，其中，所述低速通讯芯片组包括LIN芯片和CAN芯片，所述高速通讯芯片组包括一个Switch芯片以及两个PHY芯片，所述Switch芯片与所述两个PHY芯片呈“品”字型结构排布。
  6. 根据权利要求5所述的车载网关印制电路板，其中，所述存储芯片组包括EMMC芯片，其中，所述EMMC芯片与所述LIN芯片邻近排布。
  7. 根据权利要求6所述的车载网关印制电路板，其中，所述***级芯片与所述EMMC芯片邻近排布。
  8. 根据权利要求7所述的车载网关印制电路板，其中，所述存储芯片组还包括LPDD4芯片和FLASH芯片，其中，所述LPDD4芯片和所述FLASH芯片排布于所述***级芯片周围。
  9. 根据权利要求8所述的车载网关印制电路板，其中，所述组件层中的每一组件还包括：电源芯片、电源电路以及电源管理芯片；其中，
    所述电源芯片与所述FLASH芯片和所述CAN芯片邻近排布；
    所述电源电路与所述电源芯片、所述CAN芯片和所述接插件邻近排布；
    所述电源管理芯片与所述***级芯片和所述高速通讯芯片组邻近排布。
  10. 根据权利要求1所述的车载网关印制电路板，其中，所述组件层为车载网关印制电路板的顶层和底层中的至少一个。
PCT/CN2022/140601 2022-01-12 2022-12-21 车载网关印制电路板 WO2023134415A1 (zh)

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