WO2023116171A1 - 冷却***、机柜及数据中心 - Google Patents

冷却***、机柜及数据中心 Download PDF

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Publication number
WO2023116171A1
WO2023116171A1 PCT/CN2022/126768 CN2022126768W WO2023116171A1 WO 2023116171 A1 WO2023116171 A1 WO 2023116171A1 CN 2022126768 W CN2022126768 W CN 2022126768W WO 2023116171 A1 WO2023116171 A1 WO 2023116171A1
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WO
WIPO (PCT)
Prior art keywords
water
cabinet
cooling system
air
heat exchanger
Prior art date
Application number
PCT/CN2022/126768
Other languages
English (en)
French (fr)
Inventor
宋金良
陈伟
Original Assignee
华为数字能源技术有限公司
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Filing date
Publication date
Application filed by 华为数字能源技术有限公司 filed Critical 华为数字能源技术有限公司
Publication of WO2023116171A1 publication Critical patent/WO2023116171A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of cabinet cooling systems, in particular to a cooling system, a cabinet and a data center.
  • the present application provides a cooling system, a cabinet and a data center, which are used to save layout space and further reduce energy consumption.
  • the present application provides a cooling system, which can be applied to a cabinet, the cabinet can include a cabinet, the cabinet can be provided with an air inlet and an air outlet, the cooling system is located inside the cabinet, and the cooling system includes a water cooling system Heater, film cooler, circulation pump and water replenishment device, wherein the water-cooled heat exchanger is located at the air inlet of the cabinet body for heat exchange and cooling of the air at the air inlet, and the film cooler is located at the air outlet of the cabinet body , used for heat exchange and cooling of the air at the outlet.
  • a water cooling system Heater, film cooler, circulation pump and water replenishment device wherein the water-cooled heat exchanger is located at the air inlet of the cabinet body for heat exchange and cooling of the air at the air inlet, and the film cooler is located at the air outlet of the cabinet body , used for heat exchange and cooling of the air at the outlet.
  • the water-cooled heat exchanger is provided with a first water inlet and a first water outlet
  • the film cooler is provided with a second water inlet and a second water outlet
  • the first water inlet and the second water outlet are connected
  • the first water outlet and the second water inlet
  • the water port is connected, and the circulation pump can be arranged between the first water inlet and the second water outlet, or between the first water outlet and the second water inlet, so that the water in the first water chamber and the water in the second water chamber can be Circular flow.
  • the water replenishing device is connected with the film cooler for replenishing water for the film cooler, or the water replenishing device is connected with the water-cooled heat exchanger for replenishing water for the water-cooled heat exchanger.
  • the cooling system uses film coolers, water-cooled heat exchangers, and cabinets to form an integrated cooling system. It does not need to be equipped with a separate data center precision air conditioner, which can save layout space, and the above-mentioned cooling method can further reduce energy consumption.
  • the water-cooled heat exchanger can be a coil heat exchanger, which can effectively exchange heat with air and facilitate water circulation with the film cooler.
  • the material of the film cooler may be polyvinylidene fluoride, which has good performance of high temperature resistance and corrosion resistance.
  • the film cooler may include a plurality of thin film tubes, and the plurality of thin film tubes are connected in sequence.
  • the plurality of thin film tubes can increase the area of the film, so that the water in the film cooler can evaporate when the temperature rises. When water vapor is generated, more can be exhausted from the film cooler.
  • the material of the inner wall of the film tube may be a superhydrophobic material, so that more water vapor can be discharged from the film cooler.
  • the water replenishment device may include a water replenishment tank, and the water replenishment tank may be provided with a third water inlet, a third water outlet and an overflow, and the third water outlet is communicated with the second water cavity, so that the water replenishment tank can Supplementary water is received through the third water inlet, and water is replenished into the film cooler or the water-cooled heat exchanger through the third water outlet, so as to ensure that the film cooler and the water-cooled heat exchanger can continuously perform water circulation.
  • the present application provides a cabinet.
  • the cabinet includes a cabinet body.
  • the cabinet body may include two first side panels arranged opposite to each other.
  • the two first side panels are arranged along the first direction.
  • the cabinet also includes any one of the above-mentioned
  • one of the first side panels is provided with an air inlet
  • the other first side panel is provided with an air outlet
  • the water-cooled heat exchanger in the cooling system can be located at the air inlet
  • the film cooler can be located at the air outlet
  • the water in the film cooler can absorb heat and evaporate continuously. Part of the water vapor generated can be used to cool the high-temperature water in the film cooler, and the other part can enter the high-temperature air through the film and cool the high-temperature air, thereby improving cooling. effect, reducing energy consumption.
  • the cabinet body may further include two second side panels arranged oppositely, the two second side panels are arranged along the second direction, the second side panels are located between the two first side panels, and
  • the two first side plates are connected, the size of the water-cooled heat exchanger along the second direction can be equal to the size of the first side plate along the second direction, and the size of the film cooler along the second direction can also be the same as that of the first side plate along the second direction.
  • the dimensions of the two directions are equal, so that the cooling area of the water-cooled heat exchanger and the film cooler to the air is as large as possible, so as to achieve a better cooling effect.
  • the present application provides a data center, including the cabinet in any of the above-mentioned embodiments, an exhaust channel is provided in the data center, and the exhaust channel is provided with an air outlet, so that the exhaust channel passes through the air outlet and Connected to the outside world, the cabinets are placed inside the data center, and the air outlet of each cabinet is connected to the exhaust channel.
  • the data center also has a fresh air inlet for supplementing fresh air inside the data center.
  • the data center may further include an exhaust fan, and the exhaust fan is arranged at the air outlet of the exhaust channel for exhausting hot and humid air.
  • the fresh air inlet may include a filter permeable window arranged on the wall of the data center, and the supplementary fresh air can ensure the cleanliness of the air after passing through the filter permeable window, thereby ensuring the cooling effect of each cabinet.
  • FIG. 1 is a schematic top view of a data center provided in an embodiment of the present application
  • Fig. 2 is a kind of top structural schematic diagram of cabinet in Fig. 1;
  • Fig. 3 is a schematic cross-sectional structure diagram of the film cooler in Fig. 2;
  • Fig. 4 is another schematic cross-sectional structure diagram of the film cooler in Fig. 2;
  • FIG. 5 is another schematic top view structural diagram of the data center provided by the embodiment of the present application.
  • first”, “second”, and “third” are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as “first”, “second” and “third” may explicitly or implicitly include one or more of these features.
  • connection includes a direct connection or an indirect connection.
  • references to "one embodiment” or “some embodiments” or the like in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically stated otherwise.
  • the terms “including”, “comprising”, “having” and variations thereof mean “including but not limited to”, unless specifically stated otherwise.
  • the cooling system of small and medium-sized data centers mainly adopts air-cooling system and chilled water system.
  • the air-cooling system includes indoor unit components and outdoor unit components.
  • the indoor unit components are placed in the data center, and the refrigerant exchanges heat in the evaporator of the indoor unit components. And take away the heat generated by the cabinet, and then dissipate the heat to the outdoor air through the condenser of the outdoor unit assembly.
  • the chilled water system includes a cooling water tower at the front end, a water-cooled chiller, a water pump, a chilled water storage tank, and a chilled water air-conditioning unit at the end.
  • the prepared low-temperature cold water is sent from the liquid storage tank to the chilled water air-conditioning unit at the end, and the low-temperature water is taken away After the heat in the data center is cooled, it is cooled by the cooling water tower and the water-cooled chiller, and then returned to the liquid storage tank.
  • This reciprocating cycle can achieve continuous heat dissipation for the data center.
  • the indirect evaporative cooling system units are placed outside the data center. The hot air in the data center enters the unit of the indirect evaporative cooling system through the air duct, and is re-sent into the data center after exchanging heat with the outdoor cold air through the heat exchange core.
  • the cooling systems of the above-mentioned data centers need to occupy a large amount of space to arrange the units; , Compressors, water pumps and other power-consuming devices, the energy efficiency has gradually approached the limit, unable to meet the requirements of lower energy consumption.
  • the embodiment of the present application provides a cooling system, which can be used to dissipate heat from the cabinets in the data center.
  • the application of the cooling cabinet can save the layout space in the data center on the one hand, and reduce the data Center energy consumption.
  • the cooling system, the cabinet to which the cooling cabinet is applied, and the data center will be described in detail below in conjunction with the accompanying drawings.
  • FIG. 1 is a top view structural diagram of a data center 1 provided by an embodiment of the present application
  • FIG. 2 is a top view structural schematic diagram of the cooling system in FIG. 1
  • the data center 1 is provided with an exhaust channel 20 and a plurality of independent cabinets 10 , and one end of the exhaust channel 20 is provided with an exhaust port 21 , so that the exhaust channel 20 can communicate with the outside through the exhaust port 21 .
  • Each cabinet 10 can be provided with an independent cooling system 100, and the cooling system 100 of each cabinet 10 is used to cool the corresponding cabinet 10.
  • the cabinet 10 can include a cabinet, and the cabinet has an air inlet and an air outlet.
  • the air outlet can be It communicates with the air exhaust channel 20 , so that the air after cooling the cabinet 10 can be discharged to the outside through the air exhaust channel 20 .
  • an exhaust channel 30 can be provided at the air outlet of the cabinet 10, so that the cabinet 10 can communicate with the exhaust channel 20 through the exhaust channel 30, that is, the hot and humid air discharged from the cabinet 10 can enter the exhaust channel from the air outlet. 30, and enter the exhaust channel 20 through the exhaust channel 30, and finally be discharged from the exhaust channel 30 to the outside.
  • the arrows in the figure can be understood as the flow direction of the air, and the data center can also be provided with a fresh air inlet 40, which is used to supplement the fresh air inside the data center.
  • the air inlet enters the inside of the cabinet 10, and the inside of the cabinet 10 is exchanged and cooled through the cooling system 100.
  • the heated air enters the exhaust channel 30 through the air outlet of the cabinet 10, and finally is discharged to the outside by the exhaust channel 20, and so on. In order to achieve the effect of cooling the data center 1 .
  • a filtering permeable window 41 can be set at the fresh air inlet 40, and the filtering permeable window 41 can be installed on the wall of the data center for filtering the fresh air to remove impurities in the air, so that the fresh air can enter the data center.
  • the cleanliness of the air is maintained, so as to ensure that the working components inside the cabinet 10 will not be polluted by impurities in the air, so as to ensure the normal operation of the cabinet 10.
  • the number of filter permeable windows 41 is not limited, for example, it can be one, two, three, etc., by setting different numbers of filter permeable windows 41, the amount of fresh air entering the data center can be controlled, or, it can also be The fresh air volume is controlled by controlling the area of the filtering permeable window 41 .
  • an exhaust fan 50 may also be provided at the air outlet 21 of the exhaust channel 20 to increase the exhaust rate of the exhaust channel, thereby helping to improve the cooling effect of the cabinet.
  • the arrows in the figure can be understood as the flow direction of the air, and the cabinet 10 can be roughly in the shape of a hexahedron, including two first side panels 200 opposite to each other and two second side panels 300 opposite to each other.
  • the first side plate 200 can be arranged along the first direction
  • the two second side plates 300 can be arranged along the second direction
  • the second side plate 300 is connected between the two first side plates 200
  • the first side plate 200 and The second side panels 300 may be perpendicular to each other.
  • the air inlets and air outlets of the above-mentioned cabinets can be respectively opened on the two first side panels 200 , so that air can enter the inside of the cabinet 10 through the air inlets and be discharged out of the cabinet 10 through the air outlets.
  • the cooling system 100 may include a water-cooled heat exchanger 101, a film cooler 102, a circulation pump 104, and a water supply device (refer to reference number 103 in FIG. 2).
  • the water-cooled heat exchanger 101 can be arranged at the air inlet, and the water-cooled heat exchanger 101 can include a first water chamber filled with cooling water, and the first water chamber can be provided with a first water inlet 1011 and a first water chamber. Water outlet 1012.
  • the film cooler 102 is located at the air outlet, and the film cooler 102 can include a second water chamber, which is also filled with cooling water, and the side wall of the second water chamber is a film, which can be used to heat up the heat generated by evaporation. Water vapor escapes.
  • the second water chamber can be provided with a second water inlet 1021 and a second water outlet 1022, the first water inlet 1011 of the first water chamber and the second water outlet 1022 of the second water chamber can communicate through the first water pipe 105, the first The first water outlet 1012 of the water chamber and the second water inlet 1021 of the second water chamber can be connected through the second water pipe 106, the first water pipe 105 and the second water pipe 106 can be arranged on the same side of the cabinet 10, and the circulation pump 104 can be used for Make the water circulation in the first water chamber and the second water chamber, that is, the water in the first water chamber enters the second water chamber from the first water outlet 1012 through the second water inlet 1021, or the water in the second water chamber From the second water outlet 1022 through the first water inlet 1011 into the first water cavity.
  • the circulating pump 104 can be installed on the first water pipe 105 or on the second water pipe 106, and the installation position can be designed according to actual needs, which is not limited here.
  • the water-cooled heat exchanger 101 can be a coil heat exchanger 1013, and the cooling water can flow continuously in the coil heat exchanger 1013, and flows from the first water inlet 1011 to the first Water outlet 1012.
  • the cooling water enters the first water cavity from the first water inlet 1011, exchanges heat with the air and then flows to the first water outlet 1012, and enters the film cooler 102 through the first water outlet 1012.
  • the film cooler The water in 102 is cooled by the evaporation of water vapor and absorbs heat, and then flows back to the coil heat exchanger 1013 .
  • the structure of the coil heat exchanger 1013 can keep the water in the first water chamber at a lower temperature after exchanging heat with the air, thereby continuously exchanging heat and cooling the air at the air inlet, improving the cooling effect, and Use the working mode of water circulation to reduce energy consumption.
  • the size of the coil heat exchanger 1013 along the second direction can be the same as the size of the first side plate 200 along the second direction.
  • the coil heat exchanger can be The heat exchange area between 1013 and the air increases, and the coil heat exchanger 1013 can exchange heat with the air to a greater extent, so that the temperature of the air after heat exchange and cooling can be further reduced.
  • the size of the coil heat exchanger 1013 along the first direction may be 300mm-600mm.
  • FIG. 3 is a schematic cross-sectional structure diagram of the film cooler 102 in FIG. 2 perpendicular to the first direction
  • FIG. The schematic diagram of the cross-sectional structure in the second direction, the film cooler 102 can include a plurality of thin film tubes 1023, and the plurality of thin film tubes 1023 can be connected in turn to form a second water chamber.
  • the plurality of thin film tubes 1023 can be arranged in an array In the form of , the thin film tube 1023 may extend along the second direction.
  • the second water outlet 1022 can be arranged on the thin film tube 1023 in the lower left corner, and the second water inlet 1021 can be arranged on the thin film tube 1023 in the lower right corner. After the cooling water enters the thin film tube 1023 from the second water inlet 1021, Pass through adjacent film tubes 1023 sequentially in an "S"-shaped flow route, and finally flow out from the second water outlet 1022.
  • the water-cooled heat exchanger 101 located at the air inlet can exchange heat and cool down the air, so that the temperature of the air entering the cabinet 10 is lowered, and the air after cooling is in the cabinet 10. The heat is exchanged to raise the temperature again.
  • the water whose temperature has been raised after exchanging heat with air in the water-cooled heat exchanger 101 enters the film cooler 102 .
  • the high-temperature air in the cabinet 10 passes through the film cooler 102 before being discharged from the air outlet, and the water in the film cooler 102 is continuously evaporated due to the heat of the high-temperature air, which causes the temperature to rise, and the second water chamber is heated by the vaporization and evaporation of the water.
  • the water inside is cooled, and at the same time, the water vapor generated by evaporation can enter the high-temperature air discharged from the cabinet 10 through the film, and cool down the high-temperature exhaust air. That is to say, part of the cooling capacity generated by the evaporation and heat absorption of water in the film cooler 102 is used to cool the high-temperature water in the second water cavity, and the other part is used to cool the high-temperature air discharged from the cabinet 10 .
  • the structural form of the film cooler 102 (that is, a plurality of film tubes 1023 arranged in an array) can not only increase the amount of water in the second water chamber, thereby achieving a better cooling effect when performing heat exchange and cooling of high-temperature air,
  • the amount of humidification can be increased.
  • the circulation pump 104 can also be used to control the amount of humidification.
  • the power of the circulation pump 104 can be increased to increase the speed of the impeller inside the circulation pump 104, so that the unit The amount of cooling water entering the film cooler 102 increases during the time period. Due to the increase in the amount of water in the film cooler 102, more water vapor can be generated when exchanging heat with high-temperature air, thereby increasing the humidification amount. Similarly, when the amount of humidification needs to be reduced, it can be realized by reducing the power of the circulation pump 104 , which will not be repeated here.
  • the water in the film cooler 102 after the water in the film cooler 102 is evaporated and cooled by water vapor, it can also enter the water-cooled heat exchanger 101 (that is, the first water chamber) through the second water outlet 1022 through the first water inlet 1011, thereby realizing the circulation of cooling water .
  • the film cooler 102 can be made of polyvinylidene fluoride, which has corrosion resistance and high temperature resistance, which can ensure the stability of the structure of the film tube 1023 during use, thereby ensuring the cooling effect.
  • the thin-film tube 1023 can be designed as a light pipe, and the material of the inner wall of the thin-film tube 1023 can be designed as a super-hydrophobic material, so that when water vapor evaporates, it can penetrate more into the thin-film cooler 102 and improve the humidification effect of the data center. .
  • the size of the film cooler 102 along the second direction can be the same as the size of the second side plate 300 along the second direction.
  • the heat exchange between the film cooler 102 and the air can be achieved.
  • the larger the area the higher the heat exchange and cooling of the high-temperature air can be performed to a greater extent, so that the temperature of the air after the heat exchange and cooling can be further reduced.
  • the dimension of the film cooler 102 along the first direction may be 300mm-600mm.
  • the distance between the two first side plates 200 of the cabinet 10 may be about 1500 mm.
  • the coil heat exchanger 1013 is located at the air inlet, and the film cooler 102 is located at the air outlet.
  • the heating element is located between the coil heat exchanger 1013 and the film cooler 102 , and the dimensions of the coil heat exchanger 1013 and the film cooler 102 along the first direction are not limited here.
  • the water supply device can be communicated with the film cooler 102 to realize real-time cooling of the film cooler 102. Add cooling water.
  • the water replenishment device may include a water replenishment tank 103 corresponding to each cabinet 10 so as to replenish water to the film cooler 102 .
  • the water outlet 1032 wherein the third water outlet 1032 is in communication with the film cooler 102, and the third water inlet 1031 can be in communication with the water replenishment pipe in the data center, so as to control the amount of water replenishment.
  • the replenishing water tank 103 can also be provided with an overflow port 1033. When there is too much cooling water in the replenishing water tank 103, the cooling water can flow out from the overflow port 1033, thereby preventing excessive cooling water in the replenishing water tank 103 from causing excessive water pressure in the film cooler 102. Large and affect the cooling effect.
  • FIG. 5 is another schematic structural diagram of a top view of the data center provided by the embodiment of the present application.
  • the water supply device may also include a water supply tank 103 corresponding to a plurality of cabinets 10 in the data center.
  • the water supply tank 103 is provided with multiple The third water outlet 1032 and multiple third water outlets 1032 can be provided in one-to-one correspondence with the cabinets 10 , so that one supplementary water tank 103 can supply cooling water to multiple film coolers 102 at the same time.
  • the structure of the replenishing water tank can also adopt other forms, and examples are not given here.
  • the supplementary water tank 103 communicates with the film cooler 102.
  • the supplementary water tank 103 can also communicate with the water-cooled heat exchanger 101. Water circulation is carried out between the water-cooled heat exchanger 101 and the film cooler 102. This design method can also replenish water to the cooling system in time.
  • the structure of the replenishment tank 103 can refer to the structure in Figure 2 or Figure 5, where I won't go into details.
  • the cooling system 100 of the embodiment of the present application can effectively reduce the energy consumption.
  • the cooling system in the embodiment of the present application forms an integrated system through the water-cooled heat exchanger, film cooler and cabinet, so that the cooling system has both cooling mode and humidification mode, which not only improves the cooling effect, It can also effectively reduce the energy consumption of the cabinet.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

本申请公开了一种冷却***、机柜及数据中心，冷却***应用于机柜，包括水冷换热器、薄膜冷却器、循环泵以及补水装置，其中，水冷换热器位于机柜的进风口处，用于对进风口处的空气进行换热降温，薄膜冷却器位于机柜的出风口处，用于对出口处的空气进行换热降温。水冷换热器设有第一进水口和第一出水口，薄膜冷却器设有第二进水口和第二出水口，第一进水口和第二出水口连通，第一出水口和第二进水口连通，循环泵可使得第一水腔的水和第二水腔的水能够循环流动。补水装置与水冷换热器或薄膜冷却器连通，用于对冷却***补水。上述冷却***，不仅可节省布置空间，还可降低能耗。

Description

冷却***、机柜及数据中心
相关申请的交叉引用
本申请要求在2021年12月21日提交中国专利局、申请号为202111574595.8、申请名称为“冷却***、机柜及数据中心”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及机柜冷却***技术领域，特别涉及一种冷却***、机柜及数据中心。
背景技术
在“新基建”的浪潮中，数据中心建设呈现出快速的增长趋势，随着数据中心对节能的要求越来越高，高效节能成为了数据中心建设中的关键诉求。目前中小型数据中心常用风冷空调和冷冻水空调进行散热，大型数据中心逐渐采用利用自然冷源的间接蒸发冷却***进行散热，一方面，这些精密空调***都需要占据大量的空间布置机组，另一方面，随着数据中心能耗要求逐步趋严，传统的风冷、冷冻水以及间接蒸发冷却制冷***已经逐渐接近极限，无法满足更低能耗效率的要求。
发明内容
本申请提供了一种冷却***、机柜及数据中心，用以节省布置空间，并且还能够进一步降低能耗。
第一方面，本申请提供了一种冷却***，该冷却***可应用于机柜，机柜可包括柜体，柜体可设置有进风口和出风口，冷却***位于柜体内部，冷却***包括水冷换热器、薄膜冷却器、循环泵以及补水装置，其中，水冷换热器位于柜体的进风口处，用于对进风口处的空气进行换热降温，薄膜冷却器位于柜体的出风口处，用于对出口处的空气进行换热降温。水冷换热器设有第一进水口和第一出水口，薄膜冷却器设有第二进水口和第二出水口，第一进水口和第二出水口连通，第一出水口和第二进水口连通，循环泵可设置于第一进水口和第二出水口之间，或者设置于第一出水口和第二进水口之间，使得第一水腔的水和第二水腔的水能够循环流动。补水装置与薄膜冷却器连通，用于对薄膜冷却器补水，或者补水装置与水冷换热器连通，用于对水冷换热器补水。
相较于传统的方案，上述冷却***中，空气经过水冷换热器时，可实现换热降温，水冷换热器中温度升高的水可流动至薄膜冷却器中，空气与发热元件换热后温度升高，经过薄膜冷却器时，薄膜冷却器内的水吸收热量不断蒸发，产生的水蒸气一部分可用于冷却薄膜冷却器内的高温水，另一部分可透过薄膜进入高温空气中，并对高温空气进行降温。该冷却***利用薄膜冷却器、水冷换热器以及机柜构成一体化冷却***，无需单独配置数据中心精密空调，可节省布置空间，并且上述冷却方式还可进一步降低能耗。
在一些可能的实施方案中，水冷换热器可以为盘管式换热器，可有效对空气的换热面积，并且便于与薄膜冷却器之间进行水循环。
在一些可能的实施方案中，薄膜冷却器的材质可以是聚偏氟乙烯，具有良好的耐高温、耐腐蚀的性能。
在一些可能的实施方案中，薄膜冷却器可以包括多个薄膜管，多个薄膜管之间依次连通，多个薄膜管可增大薄膜的面积，从而可使得薄膜冷却器内的水在升温蒸发产生水蒸气时能够更多地排出薄膜冷却器。
在一些实施例中，薄膜管的内壁的材质可以是超疏水材质，以使得水蒸气能够更多地从薄膜冷却器中排出。
在一些可能的实施方案中，补水装置可以包括补水箱，该补水箱可设有第三进水口、第三出水口和溢水口，第三出水口与第二水腔连通，以便于补水箱可通过第三进水口接收补充的水，并通过第三出水口将水补充至薄膜冷却器或水冷换热器内，保证薄膜冷却器和水冷换热器能够持续进行水循环。
第二方面，本申请提供一种机柜，机柜包括柜体，柜体可包括相对设置的两个第一侧板，两个第一侧板沿第一方向排列，机柜还包括如上述任一实施方案中的冷却***，其中，一个第一侧板设有进风口，另一个第一侧板设有出风口，冷却***中的水冷换热器可位于进风口处，薄膜冷却器可位于出风口处，空气从进风口处进入机柜时，经过水冷换热器换热降温后，与机柜内的发热元件换热后可把机柜内的热量带走，高温空气经过薄膜冷却器由出风口排出时，薄膜冷却器内的水可吸收热量不断蒸发，产生的水蒸气一部分可用于冷却薄膜冷却器内的高温水，另一部分可透过薄膜进入高温空气中，并对高温空气进行降温，从而提升冷却效果，降低能耗。
在一些可能的实施方案中，柜体还可包括相对设置的两个第二侧板，两个第二侧板沿第二方向排列，第二侧板位于两个第一侧板之间，并连接两个第一侧板，水冷换热器沿第二方向的尺寸可与第一侧板沿第二方向的尺寸相等，薄膜冷却器沿第二方向的尺寸也可与第一侧板沿第二方向的尺寸相等，以使得水冷换热器和薄膜冷却器对空气的冷却面积尽可能的大，从而达到更好的冷却效果。
第三方面，本申请提供一种数据中心，包括上述任一实施方案中的机柜，数据中心内设有排风通道，排风通道设有排风口，以使得排风通道通过排风口与外界连通，机柜放置于数据中心内部，每一个机柜的出风口与排风通道连通，数据中心还设有新风入口，用于对数据中心内部补充新风。上述数据中心中，通过设置排风通道与每一个机柜的出风口连通，使得对机柜进行冷却后的空气能够从排风通道排出，从而使得数据中心能够及时得到冷却降温的效果，另外，由于薄膜冷却器在工作时能够不断渗透出水蒸气，在制冷的同时还能够对数据中心内部进行加湿。
在一些可能的实施方案中，数据中心还可包括排风机，排风机设置于排风通道的排风口处，用于将湿热空气排出。
在一些可能的实施方案中，新风入口可包括设置于数据中心的墙体上的过滤渗透窗，补充的新风经过过滤渗透窗后可保证空气的洁净度，从而保证各机柜的冷却效果。
附图说明
图1为本申请实施例提供的数据中心的一种俯视结构示意图；
图2为图1中机柜的一种俯视结构示意图；
图3为图2中薄膜冷却器的一种截面结构示意图；
图4为图2中薄膜冷却器的另一种截面结构示意图；
图5为本申请实施例提供的数据中心的又一种俯视结构示意图。
附图标记：
1-数据中心；10-机柜；20-排风通道；21-排风口；30-排气通道；40-新风入口；41-过滤渗透窗；50-排风扇；100-冷却***；101-水冷换热器；1011-水冷换热器；1011-第一进水口；1012-第一出水口；1013-盘管式换热器；102-薄膜冷却器；1021-第二进水口；1022-第二出水口；1023-薄膜管；103-补水箱；1031-第三进水口；1032-第三出水口；1033-溢水口；104-循环泵；105-第一水管；106-第二水管；200-第一侧板；300-第二侧板。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述。
在本申请实施例中，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括一个或者更多个该特征。
在本申请实施例中，“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。连接包括直接连接或间接连接。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
当前中小型数据中心冷却***主要采用风冷***以及冷冻水***，风冷***包括室内机组件和室外机组件，室内机组件放置于数据中心中，制冷剂在室内机组件的蒸发器中换热并带走机柜产生的热量，再通过室外机组件的冷凝器将热量散发至室外空气中。冷冻水***包括前端的冷却水塔、水冷冷水机组、水泵、冷冻水储液罐以及末端的冷冻水空调机组，制备好的低温冷水由储液罐送至末端的冷冻水空调机组，低温水带走数据中心内的热量后，再由冷却水塔以及水冷冷水机组进行降温处理，随后回到储液罐，如此往复循环即可实现对数据中心的持续散热。随着计算功耗的持续增长，数据中心能耗逐年增加，当前大型的数据中心逐渐采用能够利用自然冷源的间接蒸发冷却***来实现温度的控制，间接蒸发冷却***机组放置于数据中心外部，数据中心内的热空气通过风管进入间接蒸发冷却***机组内部，经过换热芯体与室外冷风进行换热后重新被送入数据中心。
而上述数据中心冷却***，一方面都需要占据大量的空间布置机组，另一方面，随着数据中心能耗要求逐步趋严，传统的风冷、冷冻水以及间接蒸发冷却制冷***由于存在大量风机、压缩机、水泵等耗电器件，能效已逐渐接近极限，无法满足更低能耗的要求。
基于此，本申请实施例提供了一种冷却***，该冷却***可用于对数据中心内的机柜进行散热，应用该冷却机柜一方面可以节省数据中心内的布置空间，另一方面还可以降低 数据中心的能耗。下面结合将附图对该冷却***以及应用该冷却机柜的机柜以及数据中心进行具体介绍。
参考图1和图2，图1为本申请实施例提供的数据中心1的一种俯视结构示意图，图2为图1中冷却***的一种俯视结构示意图。数据中心1内设有排风通道20和多个独立的机柜10，排风通道20的一端设有排风口21，以使得排风通道20可通过排风口21与外界连通。每一个机柜10可设置有独立的冷却***100，每一个机柜10的冷却***100用于对相应的机柜10进行制冷，机柜10可包括柜体，柜体具有进风口和出风口，出风口可与排风通道20连通，以使得对机柜10进行制冷后的空气能够通过排风通道20排出外部。示例性地，机柜10的出风口处可设置排气通道30，以使得机柜10可通过排气通道30与排风通道20连通，即机柜10内排出的湿热空气可从出风口进入排气通道30，并通过排气通道30进入排风通道20，最后由排气通道30排出外部。
继续参考图1，图中的箭头可理解为空气的流动方向，数据中心还可设置新风入口40，用于对数据中心内部补充的新风可通过新风入口40进入数据中心内部，新风由机柜10的进风口进入机柜10内部，并通过冷却***100对机柜10内部进行换热降温，升温后的空气经过机柜10的出风口进入排气通道30，最后由排风通道20排出外界，如此循环往复，以达到对数据中心1制冷的效果。
在一些实施例中，新风入口40处可以设置过滤渗透窗41，过滤渗透窗41可安装于数据中心的墙体上，用于对新风进行过滤，以去除空气中的杂质，从而使得新风进入数据中心1后对每一个机柜10进行制冷的过程中，保持空气的洁净度，从而保证机柜10内部的工作元件不会被空气中的杂质污染，以保证机柜10的正常运行。
过滤渗透窗41的数量不限，示例性地，可以为一个，两个，三个，等等，通过设置不同的过滤渗透窗41的数量可控制进入数据中心内的新风量，或者，也可通过控制过滤渗透窗41的面积来控制新风量。
在一些实施例中，还可在排风通道20的排风口21处设置排风扇50，以提高排风通道的排风速率，进而有助于提高对机柜的散热效果。
继续参考图2，图中的箭头可理解为空气的流动方向，机柜10可大致呈六面体形状，包括相对设置的两个第一侧板200以及相对设置的两个第二侧板300，两个第一侧板200可沿第一方向排列，两个第二侧板300可沿第二方向排列，第二侧板300连接于两个第一侧板200之间，且第一侧板200与第二侧板300可相互垂直。上述机柜的进风口和出风口可分别开设于两个第一侧板200上，使得空气能够由进风口进入机柜10内部，并由出风口排出机柜10。冷却***100可包括水冷换热器101、薄膜冷却器102、循环泵104以及补水装置(参考图2中标号103)。水冷换热器101可设置于进风口处，水冷换热器101可包括第一水腔，第一水腔内填充有冷却水，且第一水腔可设有第一进水口1011和第一出水口1012。薄膜冷却器102位于出风口处，薄膜冷却器102可包括第二水腔，第二水腔内也填充有冷却水，并且第二水腔的侧壁为薄膜，薄膜可用于将升温蒸发产生的水蒸气排出。第二水腔可设有第二进水口1021和第二出水口1022，第一水腔的第一进水口1011和第二水腔的第二出水口1022可通过第一水管105连通，第一水腔的第一出水口1012和第二水腔的第二进水口1021可通过第二水管106连通，第一水管105和第二水管106可设置于机柜10的同一侧，循环泵104可用于使得第一水腔内和第二水腔进行水循环，也即第一水腔内的水由第一出水口1012通过第二进水口1021进入第二水腔内，或者第二水腔内的 水由第二出水口1022通过第一进水口1011进入第一水腔内。需要说明的是，循环泵104可安装于第一水管105，也可安装于第二水管106，其安装位置可根据实际需要做设计，此处不做限定。
在一些实施例中，继续参考图2，水冷换热器101可以为盘管式换热器1013，冷却水在盘管式换热器1013中可不断流动，由第一进水口1011流向第一出水口1012。工作时，冷却水由第一进水口1011进入第一水腔后，与空气换热升温后流动至第一出水口1012处，并通过第一出水口1012进入薄膜冷却器102中，薄膜冷却器102中的水被水蒸气蒸发吸热进行冷却后又流回至盘管式换热器1013。盘管式换热器1013的结构可使得第一水腔内的水在对空气进行换热后保持较低的温度，从而能够持续对进风口处的空气进行换热降温，提高冷却效果，并利用水循环的工作模式降低能耗。
为提高对空气的换热效果，盘管式换热器1013沿第二方向的尺寸可与第一侧板200沿第二方向的尺寸相同，通过该结构设置，可使得盘管式换热器1013与空气的换热面积增大，盘管式换热器1013能够更大程度对空气进行换热，从而使得换热降温后的空气温度能够进一步降低。示例性地，盘管式换热器1013沿第一方向的尺寸可以为300mm-600mm。
在一些实施例中，一并参考图2、图3和图4，图3为图2中薄膜冷却器102垂直于第一方向的截面结构示意图，图4为图2中薄膜冷却器102垂直于第二方向的截面结构示意图，薄膜冷却器102可包括多个薄膜管1023，多个薄膜管1023之间可依次连通形成第二水腔，具体实施时，多个薄膜管1023可以呈阵列排布的形式，薄膜管1023可沿第二方向延伸。具体实施时，可以将第二出水口1022设置于左下角的薄膜管1023，将第二进水口1021设置于右下角的薄膜管1023，冷却水从第二进水口1021进入薄膜管1023中后，以“S”型的流动路线依次经过相邻的薄膜管1023，最后由第二出水口1022流出。
当空气由进风口进入机柜10内部时，位于进风口处的水冷换热器101可对空气进行换热降温，使得进入机柜10内的空气温度降低，降温后的空气在机柜10内部与发热元件换热而再次升温，与此同时，水冷换热器101中与空气换热后温度升高的水进入薄膜冷却器102中。机柜10内的高温空气从出风口排出前经过薄膜冷却器102，薄膜冷却器102中的水由于吸收高温空气的热量导致温度升高而不断蒸发，并通过水的气化蒸发对第二水腔内的水进行冷却，同时蒸发产生的水蒸气通过薄膜能够进入到机柜10排出的高温空气中，并对高温排风进行降温。也即薄膜冷却器102中的水蒸发吸热产生的制冷量一部分用于冷却第二水腔内的高温水，另一部分用于冷却机柜10排出的高温空气。
此外，由于薄膜冷却器102中的水在蒸发的过程中，不断地渗透出水蒸气，这部分水蒸气还可用于对数据中心1进行加湿。因此，薄膜冷却器102的结构形式(即多个阵列排布的薄膜管1023)不仅可增大第二水腔内的水量，从而在对高温空气进行换热降温时达到更好的冷却效果，另外还可增大加湿量。在一些实施方式中，还可利用循环泵104来控制加湿量，示例性地，当需要增大加湿量时，可提高循环泵104的功率，来提高循环泵104内部叶轮的转速，从而使得单位时间内进入薄膜冷却器102中的冷却水量增多，由于薄膜冷却器102中的水量增多，在对高温空气进行换热时，能够产生更多的水蒸气，从而增大加湿量。同理，当需要减小加湿量时，降低循环泵104的功率即可实现，此处不做赘述。
另外，薄膜冷却器102中的水通过水蒸气蒸发冷却后，还可由第二出水口1022通过第一进水口1011进入水冷换热器101(即第一水腔)中，从而实现冷却水的循环。
薄膜冷却器102的材质可以是聚偏氟乙烯，聚偏氟乙烯具有耐腐蚀性、耐高温的特性， 可保证在使用的过程中薄膜管1023的结构稳定，从而保证冷却效果。另外，薄膜管1023可以设计为光管形式，并将薄膜管1023内壁的材质设计为超疏水材质，从而使得水蒸气蒸发时能够更多地渗透出薄膜冷却器102，提高对数据中心的加湿效果。
为提高对空气的换热效果，薄膜冷却器102沿第二方向的尺寸可与第二侧板300沿第二方向的尺寸相同，通过该结构设置，可使得薄膜冷却器102与空气的换热面积增大，能够更大程度对高温空气进行换热降温，从而使得换热降温后的空气温度能够进一步降低。示例性地，薄膜冷却器102沿第一方向的尺寸可以为300mm-600mm。
需要说明的是，机柜10的两个第一侧板200之间的距离可为1500mm左右，在此基础上，盘管式换热器1013位于进风口处，薄膜冷却器102位于出风口处，发热元件位于盘管式换热器1013与薄膜冷却器102之间，盘管式换热器1013和薄膜冷却器102沿第一方向的尺寸此处不做限定。
由于薄膜冷却器102中的水处于不断蒸发的状态，为保证薄膜冷却器102中有足够的水能够对高温空气进行冷却，补水装置可与薄膜冷却器102连通，以实现实时对薄膜冷却器102补充冷却水。
继续参考图2，补水装置可包括与每一个机柜10一一对应的补水箱103，以便于对薄膜冷却器102进行补水，具体实施时，补水箱103可设有第三进水口1031和第三出水口1032，其中，第三出水口1032与薄膜冷却器102连通，第三进水口1031可与数据中心内的补水管连通，以便于控制补水量。此外，补水箱103还可设置溢水口1033，当补水箱103内冷却水过多时，冷却水可从溢水口1033流出，从而防止补水箱103内冷却水过多导致薄膜冷却器102中水压过大而影响冷却效果。
参考图5，图5为本申请实施例提供的数据中心的又一种俯视结构示意图，补水装置也可包括与数据中心内多个机柜10对应设置的补水箱103，补水箱103设有多个第三出水口1032，多个第三出水口1032可与机柜10一一对应设置，从而使得一个补水箱103能够同时对多个薄膜冷却器102进行补充冷却水。当然，补水箱的结构也可以采用其它形式，此处不做一一举例说明。
需要说明的是，上述实施例中，仅是对补水箱103与薄膜冷却器102连通的结构加以说明，在实际应用时，补水箱103也可与水冷换热器101连通，由于循环泵104可使得水冷换热器101与薄膜冷却器102之间进行水循环，这种设计方式也可及时对冷却***补水，具体实施时，补水箱103的结构可参考图2或图5中的结构，此处不做赘述。
需要说明的是，以机柜的功率为10kW为例，现有的采用无直通风间接蒸发冷却***100的能耗为0.156，有直通风的间接蒸发冷却***100的能耗为0.136，而本申请实施例中，由于将水冷换热器101、薄膜冷却器102以及机柜10设计成一体式结构，无需单独配置数据中心精密空调，可有效降低机柜10的能耗。示例性地，结合图1和图2，当机柜10的工作功率为10kW时，采用无排风扇50的冷却***100时，每一个机柜10的能耗可降低至0.0254，而采用设置排风扇50的冷却***100时，每一个机柜10的能耗可降低至0.0735，相比于现有的冷却***100，本申请实施例的冷却***100有效地降低了能耗。
相较于传统的冷却***，本申请实施例中的冷却***通过将水冷换热器、薄膜冷却器和机柜构成一体式***，使得冷却***同时具备制冷模式和加湿模式，不仅提高了制冷效果，还可有效降低机柜的能耗。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本 技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (11)

  1. 一种冷却***，应用于机柜，所述机柜包括柜体，所述柜体设置有进风口和出风口，其特征在于，所述冷却***设置于所述柜体内，所述冷却***包括水冷换热器、薄膜冷却器、循环泵以及补水装置，其中：
    所述水冷换热器设置于所述进风口处，所述水冷换热器设有第一进水口和第一出水口；
    所述薄膜冷却器设置于所述出风口处，所述薄膜冷却器设有第二进水口和第二出水口，所述第二进水口与所述第一出水口连通，所述第二出水口与所述第一进水口连通；
    所述循环泵用于使所述第一水腔和所述第二水腔之间进行水循环；
    所述补水装置用于对所述薄膜冷却器或所述水冷换热器补水。
  2. 根据权利要求1所述的冷却***，其特征在于，所述薄膜冷却器的材质为聚偏氟乙烯。
  3. 根据权利要求1或2所述的冷却***，其特征在于，所述薄膜冷却器包括多个薄膜管，所述多个薄膜管之间依次连通。
  4. 根据权利要求3所述的冷却***，其特征在于，所述薄膜管的内壁的材质为超疏水材质。
  5. 根据权利要求1-4任一项所述的冷却***，其特征在于，所述补水装置包括补水箱，所述补水箱设有第三进水口、第三出水口和溢水口，所述第三出水口与所述薄膜冷却器或所述水冷换热器连通。
  6. 根据权利要求1-5任一项所述的冷却***，其特征在于，所述水冷换热器为盘管式换热器。
  7. 一种机柜，其特征在于，包括柜体和如权利要求1-6任一项所述的冷却***，所述冷却***位于所述柜体内，所述柜体包括相对的两个第一侧板，所述两个第一侧板沿第一方向排列，其中一个所述第一侧板设有进风口，另一个所述第一侧板设有出风口，所述冷却***的所述水冷换热器位于所述进风口处，所述冷却***的所述薄膜冷却器位于所述出风口处。
  8. 根据权利要求7所述的机柜，其特征在于，所述柜体还包括相对的两个第二侧板，所述两个第二侧板沿第二方向排列，且所述第二侧板连接于所述两个第一侧板之间；
    所述水冷换热器沿第二方向的尺寸与所述第一侧板沿第二方向的尺寸相等，和/或，所述薄膜冷却器沿第二方向的尺寸与所述第一侧板沿第二方向的尺寸相等。
  9. 一种数据中心，其特征在于，包括多个如权利要求7或8所述的机柜，其中：
    所述数据中心内设有排风通道，所述排风通道设有排风口；
    所述机柜的出风口与所述排风通道连通；
    所述数据中心还设有新风入口，所述新风入口用于对所述数据中心内部补充新风。
  10. 根据权利要求9所述的数据中心，其特征在于，还包括设置于所述排风口处的排风机。
  11. 根据权利要求9所述的数据中心，其特征在于，所述新风入口设有过滤渗透窗，所述过滤渗透窗设置于所述数据中心的墙体上。
PCT/CN2022/126768 2021-12-21 2022-10-21 冷却***、机柜及数据中心 WO2023116171A1 (zh)

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